CN116475082A - Integrated device for releasing, sorting and packaging chip modules - Google Patents
Integrated device for releasing, sorting and packaging chip modules Download PDFInfo
- Publication number
- CN116475082A CN116475082A CN202210050690.6A CN202210050690A CN116475082A CN 116475082 A CN116475082 A CN 116475082A CN 202210050690 A CN202210050690 A CN 202210050690A CN 116475082 A CN116475082 A CN 116475082A
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- module
- chip module
- deburring
- release
- sorting
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- 238000004806 packaging method and process Methods 0.000 title description 8
- 230000002950 deficient Effects 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 50
- 238000012546 transfer Methods 0.000 claims description 26
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 6
- 239000000969 carrier Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 5
- 230000003068 static effect Effects 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 4
- 230000007723 transport mechanism Effects 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000012856 packing Methods 0.000 abstract description 7
- 239000003292 glue Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/002—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor for travelling workpieces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a full-automatic chip module release letter sorting packing integrated device, it includes, chip module release module, chip module burring module and letter sorting module. The chip module deburring module is configured on the downstream side of the chip module releasing module to deburr the released module, and the chip module after deburring is sorted based on the sorting module of duplex position to distinguish the good product and the defective product of the chip module, and the chip module is placed in the corresponding tray respectively based on the result of discernment. And the sorting precision and the sorting efficiency are improved.
Description
Technical Field
The application relates to automation equipment, in particular to a full-automatic integrated device for releasing, sorting and packaging chip modules.
Background
When the current chip module is packaged and molded, the current chip module is discharged on the carrier, the movement of the chip module is prevented, the chip module is temporarily fixed through glue, the chip module is ejected from the carrier through a special jig after molding, burrs and residual glue are easily generated on the surface of the module in the ejection process, the burrs and the residual glue are required to be cleaned, the chip module is scanned and identified after the burrs and the residual glue are cleaned, the current process is respectively arranged on a production line, the ejection-deburring-sorting efficiency is limited, and the productivity is limited.
In addition, when the manual work participates in, each station on the assembly line needs to be provided with a static electricity removing device, and periodic spot inspection is also needed to avoid the bad caused by static electricity as much as possible.
Disclosure of Invention
In order to overcome the defects, the application provides a chip module release, sorting and packaging integrated device, which realizes chip module thimble stamping, deburring and sorting and packaging and improves sorting precision and efficiency through double-station sorting.
In order to achieve the above purpose, the present application adopts the following technical scheme:
a chip module release sort package integrated device, comprising:
a chip module release module, a chip module deburring module and a sorting module,
the chip module deburring module is arranged on the downstream side of the chip module releasing module to receive the released module and perform deburring,
the sorting module is configured on the downstream side of the deburring module, receives and sorts the chip modules after deburring based on the sorting station, and places the chip modules into corresponding trays based on the recognition result. The integrated device realizes the integrated operation of chip module thimble stamping, deburring, sorting and packaging, and improves sorting precision and efficiency.
Preferably, the chip module release module includes:
the base, the configuration has on the base, feed bin presss from both sides the mechanism and includes:
a first feeding bin clamp and a second feeding bin which are symmetrically arranged along the central line of the base,
the first feed bin clamp is provided with a first lifting mechanism and a first transmission mechanism,
the second feed bin clamp is provided with a second lifting mechanism and a second transmission mechanism,
based on the first transfer mechanism for transferring the carriers transferred from the first supply bin to a predetermined position,
the carrier transported from the second supply bin clamp is transported to a predetermined position based on the second transport mechanism.
Preferably, cooling fans are disposed on the first and second feed holders, and the loading vehicle is cooled by the cooling fans.
Preferably, the second transmission mechanism includes:
the device comprises a bottom plate, wherein a guide rail is arranged on the bottom plate, a first side plate and a second side plate are arranged on the bottom plate in parallel, tracks for conveying the carrier are arranged on the first side plate and the second side plate, and a partition plate is arranged on the tracks.
Preferably, this integrative device of chip module release letter sorting packing, its characterized in that still includes: and the sensor is configured on the first side plate and/or the second side plate and is used for detecting the in and out of the carrier.
Preferably, this integrative device of chip module release letter sorting packing, its characterized in that still includes:
a transfer mechanism, which is arranged at the downstream side of the feed bin clamping mechanism and is used for transmitting the carrier to the ejection station,
the transfer mechanism comprises:
the linear driving motor is provided with a bottom plate, a pair of parallel transfer brackets are arranged on the bottom plate, and the transfer brackets are used for fixing the carrier to be transferred.
Preferably, this integrative device of chip module release letter sorting packing, its characterized in that still includes:
lower thimble mechanism, it includes:
a bottom plate and an air cylinder,
the output end of the air cylinder is connected with a lower top PIN component, the output end side of the air cylinder is provided with a pressure sensor for detecting the output pressure of the air cylinder,
the bottom plate is provided with brackets arranged at intervals, one side of one bracket is provided with a driving part, the output of the driving part is connected with a driving shaft, the output side of the driving shaft is connected with a driving wheel, the driving wheel is connected with a driven wheel through a conveyor belt, and the driving shaft is driven to rotate based on the driving of the driving part, so that the driving wheel is driven to rotate, and then the driven wheel is driven to rotate.
Preferably, this integrative device of chip module release letter sorting packing, its characterized in that still includes:
an upper top plate moving mechanism, comprising:
a pair of mounting brackets arranged in parallel,
wherein, one mounting bracket is provided with a linear motor, the other mounting bracket is provided with a guide rail,
the base is connected with the output end of the linear motor and is in sliding connection with the guide rail, the base is provided with a driving cylinder, the output end of the driving cylinder is connected with an upper PIN plate component, the upper PIN plate component is provided with a clamping part, the upper PIN plate component is rapidly arranged through the clamping part,
based on the driving of the linear motor, the base is driven to move,
the upper PIN plate component is driven to move downwards based on the driving cylinder, the upper PIN plate component is matched with the thimble part of the lower PIN component to clamp the chip module, and then the upper/lower assembly (the upper/lower thimble mechanism) moves upwards slowly to release the chip module on the carrier.
Preferably, the upper PIN board component is provided with a suction nozzle, and the side of the suction nozzle, which is contacted with the chip module, is encapsulated.
Preferably, the device further comprises a CCD code scanning detection module for detecting the module in the carrier transmitted to the lower thimble mechanism in real time.
Preferably, the deburring module is provided with a feeding end, a material taking module and a deburring station,
the feeding end receives the carrier ejected by the chip module release module,
the material taking module is used for taking the carrier and moving to a deburring station, the deburring station side is provided with a static electricity removing device,
the deburring station is provided with an anti-static brush which rotates to remove burrs on a chip module on the carrier, the material taking module places the carrier after deburring at a preset discharge end and moves to the sorting module through the discharge end,
the sorting module includes: a lower frame on which a transmission assembly is arranged,
the downstream side of the transmission assembly is provided with a first sorting module and a second sorting module which are used for distinguishing good products and defective products of the chip modules, and the chip modules are placed in corresponding trays based on the identification result.
Advantageous effects
Compared with the prior art, the chip module release letter sorting packing integrated device that this application provided is ejecting with the module through upper plate top part module punching press, through burring (De_burr detritus) module, then sorts the module after the burring through duplex position letter sorting module, improves letter sorting precision and efficiency. The integrated device is combined by 3 modules, so that the requirement on the field space is greatly reduced.
Drawings
FIG. 1 is a schematic perspective view of an integrated device according to an embodiment of the present application;
FIG. 2 is a schematic view of the internal structure of the integrated device of FIG. 1;
fig. 3-12 are schematic views illustrating an internal structure of the chip module release module in fig. 1;
fig. 13 is a schematic view illustrating an internal structure of the burr module of fig. 1;
fig. 14 is a schematic view illustrating an internal structure of the sorting module of fig. 1.
Detailed Description
The above-described aspects are further described below in conjunction with specific embodiments. It should be understood that these examples are illustrative of the present application and are not limiting the scope of the present application. The implementation conditions employed in the examples may be further adjusted as in the case of the specific manufacturer, and the implementation conditions not specified are typically those in routine experiments.
The embodiment of the application provides a full-automatic chip module release letter sorting packing integrative device, it includes, chip module release module, chip module burring module and letter sorting module. The chip module deburring module is configured on the downstream side of the chip module releasing module to deburr the released module, and the chip module after deburring is sorted based on the sorting module of duplex position to distinguish the good product and the defective product of the chip module, and the chip module is placed in the corresponding tray respectively based on the result of discernment. In the present embodiment, the upstream/downstream is the downstream side along the moving direction and in front of the chip with reference to the moving direction of the chip on the device, and the upstream side is the opposite.
Next, please refer to fig. 1 to 14 for a detailed description of a fully automatic chip module release sorting and packaging integrated device according to an embodiment of the present application.
Fig. 1 is a schematic structural view of a chip module release sorting and packaging integrated device according to an embodiment of the present application, fig. 2 is an internal structural view of fig. 1,
the integrated device comprises:
the chip module release module 100, the chip module deburring module 200 and the sorting module 300. The chip module deburring module 200 is disposed on the downstream side of the chip module releasing module 100 to deburr the released modules, sort the deburred chip modules to distinguish good and defective chip modules, and place the chip modules into corresponding trays based on the recognition result. In this embodiment, the sorting module 300 employs a double sorting station.
Next, please refer to fig. 3 to 12 for a detailed description of the chip module release module 100 according to the present application, which is used for ejecting the chip module for facilitating the suction of the next station.
The chip module release module 100 includes:
the base 110, the base 110 is configured with a feed bin clamping mechanism 120, and the feed bin clamping mechanism 120 includes:
a first supply bin clamp 121 and a second supply 122,
the first feed bin clamp 121 is provided with a first lifting mechanism 121a and a first conveying mechanism 121b,
the second feed bin clamp 122 is provided with a second elevating mechanism 122a and a second conveying mechanism 122b.
The first supply bin clamp 121 and the second supply bin clamp 122 are symmetrically arranged along a center line (a module moving direction) of the base 110. Cooling fans are disposed on the first feed bin clamp 121 and the second feed bin 122, and the carriers are cooled by the cooling fans.
In this embodiment, the first feed bin clamp 121 and the second feed bin clamp 122 have the same structure, and the second feed bin clamp 122 will be described as an example. The second magazine clamp 122 is configured with a second transfer mechanism 122b in a mating relationship, the second transfer mechanism 122b being configured to transfer the carriers 10 transferred from the second magazine clamp 122 to a predetermined location for transfer to the ejection station by the transfer mechanism 130. The carrier 10 is provided with a plurality of holes 101 for receiving chip modules (not shown) to be ejected.
The second transfer mechanism 122b includes:
the bottom plate 124, the bottom plate 124 is configured with a guide rail 124a, the bottom plate 124 is parallel configured with a side plate 125 a/side plate 125b, wherein the side plate 125b is movably fixed on the guide rail 124a through a sliding block, so that the interval between the side plate 125a and the side plate 125b can be adjusted to correspond to carriers with different sizes. The second conveying mechanism 122b is provided with a partition 123, which is disposed on the carrier conveying track, and the partition 123 is disposed to facilitate cleaning of chips generated during the carrier conveying process. The end of the side plate 125b is provided with a sensor 126 for detecting the ingress and egress of the carrier 10. In other embodiments, the first supply bin clamp 121 and the second supply 122 may be configured differently.
A transfer mechanism 130 disposed downstream of the feed hopper mechanism 120, the transfer mechanism 130 being configured to transfer the carrier 10 to the lower ejector mechanism 140,
the transfer mechanism 130 includes:
the linear driving motor 131 is provided with a bottom plate 132, the bottom plate 132 is arranged on a parallel transfer bracket, one side of the bracket is provided with a driving part 136, the bottom plate 132 is provided with a limiting part 135, and the limiting part 135 is used for ensuring that a carrier (not shown) is in a track during the transmission process. One side of the support is provided with a sensor 133/134, and the sensor 133/134 is used for detecting the in-out of the carrier. After the carrier on the transfer mechanism 130 is transferred to the predetermined position by the driving of the driving part 136, the carrier enters the track of the lower ejector mechanism 140 and then moves to the predetermined position of the lower ejector mechanism 140.
The lower ejector mechanism 140 is in press fit with the upper plate moving mechanism 150 to release the chip module. In particular, the method comprises the steps of,
the lower ejector mechanism 140 includes:
a base plate 142, an electric cylinder 141, an output 141a of the electric cylinder 141 being connected to a lower top PIN member 147,
the base plate 142 is provided with brackets 143 arranged at intervals, one side of one bracket 143 is provided with a driving part 144, the output of the driving part 144 is connected with a driving shaft 145, the output side of the driving shaft 145 is connected with a driving wheel 145a, the driving wheel 145a is connected with a driven wheel 146 through a conveyor belt, and the driving wheel 145 is driven to rotate based on the driving of the driving part 144, so that the driving wheel 145a is driven to rotate, and the driven wheel 146 is driven to rotate. In the present embodiment, a pressure sensor is disposed on the output port 141a side to detect the output pressure of the electric cylinder 141. The lower top PIN member 147 is configured to be removable. The lower PIN member 147 is provided with a plurality of PIN members 147a arranged in a row.
The upper top plate moving mechanism 150 includes:
a pair of mounting brackets 151 arranged in parallel, wherein one bracket 151 is provided with a linear motor 152, the other bracket 151 is provided with a guide rail 152a,
the base 153 is connected to the output end of the linear motor 152, and is slidably connected to the guide rail 152a,
a driving cylinder 154 is mounted on the base 153, and an output end 154a of the driving cylinder 154 is connected to an upper PIN plate member 155, a clamping portion 155a is provided on the upper PIN plate member 155, and the upper PIN plate member 155 is quickly mounted by the clamping portion 155 a. The base 153 is further provided with a guide member 154b. Thus, the base 153 is driven to move by the drive of the linear motor 152. The upper PIN plate member 155 is driven to move down based on the driving cylinder 154 and is pressed in match with the ejector PIN portion 147a of the lower PIN member 147 to release the chip module on the carrier. The upper PIN plate member 155 is provided with a suction nozzle 155b, and an end portion of the suction nozzle 155b is covered with a cap 155b1 (top cap of the contact surface with the module) so as to avoid scratching the module.
The CCD scan code detection module 160 is used for detecting the module in the carrier 10 transmitted to the lower ejector mechanism 140 in real time.
The deburring module 200 includes a feed end 210, the feed end 210 receiving the chip modules ejected by the chip module release module 100, and the feed end 210 is generally configured with a tray for temporarily holding the ejected chip modules,
the tray is transferred to a predetermined position by the first transfer assembly 220, taken by the material taking module 230 and moved to the deburring station 240, deburring (deburring and surface-removing residual glue) is performed by the deburring station 240 under the action of the rotating brush 241, and the static electricity removing device 242 is disposed on one side of the brush 241. The material taking module 230 places the chip module after deburring at the discharge end and transmits the chip module to the sorting module 300 through the discharge end. In this embodiment, the rotation speed of the brush 241 is adjustable (according to different rotation speeds of different types of chip modules and temporary fixing adhesives, which are usually preset when the deburring module is in operation). The deburring module is provided with a human-computer interface, and the deburring module can normally operate by inputting a control instruction through the human-computer interface.
Sorting module 300, comprising:
a lower chassis 310 on which a substrate 311 is disposed, a second transfer assembly 320 is disposed on the substrate 311, a sorting module 330 (first sorting module 330 a/second sorting module 330 b) of a duplex position is disposed at a downstream side of the second transfer assembly 320,
the first storage bin 340a is placed in good products sorted by the sorting heads of the first sorting module 330a, and the storage boxes 351 are placed in defective products.
The good products sorted by the sorting heads of the second sorting module 330b are placed in the second storage bin 340b, and the defective products are placed in the storage box 352. In this embodiment, the sorting heads of the first sorting module 330a and the sorting heads of the second sorting module 330b are disposed on the first Y-rail beam 370, and the Y-rail beam 370 is disposed perpendicular or substantially perpendicular to the second conveying assembly 320. The lower frame 310 is further provided with a second Y rail beam 360, the second Y rail beam 360 is arranged in parallel with the first Y rail beam 370, and is positioned at the downstream side of the first Y rail beam 370, and the second Y rail beam 360 is provided with a transplanting portion 361 for empty disc feeding.
Thus, when the integrated device operates, the integrated device is ejected out through the chip module release module 100 and then is subjected to deburring through the deburring module 200 and sorting through the duplex-position sorting module 300, efficient sorting of the chip modules is performed, the requirement on site space is greatly reduced, and the degree of manual participation in the whole process is low.
The foregoing embodiments are provided to illustrate the technical concept and features of the present application and are intended to enable those skilled in the art to understand the contents of the present application and implement the same according to the contents, and are not intended to limit the scope of the present application. All such equivalent changes and modifications as come within the spirit of the disclosure are desired to be protected.
Claims (10)
1. A chip module release sort package integrated device, comprising:
a chip module release module, a chip module deburring module and a sorting module,
the chip module deburring module is arranged on the downstream side of the chip module releasing module to receive the released module and perform deburring,
the sorting module is configured on the downstream side of the deburring module, receives and sorts the chip modules after deburring based on the sorting station, and places the chip modules into corresponding trays based on the recognition result.
2. The integrated chip module release sort package device of claim 1, wherein,
the chip module release module includes:
the base, the configuration has on the base, feed bin presss from both sides the mechanism and includes:
a first feeding bin clamp and a second feeding bin which are symmetrically arranged along the central line of the base,
the first feed bin clamp is provided with a first lifting mechanism and a first transmission mechanism,
the second feed bin clamp is provided with a second lifting mechanism and a second transmission mechanism,
based on the first transfer mechanism for transferring the carriers transferred from the first supply bin to a predetermined position,
the carrier transported from the second supply bin clamp is transported to a predetermined position based on the second transport mechanism.
3. The integrated chip module release sort package device of claim 2, wherein,
and cooling fans are arranged on the first feed bin clamp and the second feed clamp, and the first feed bin clamp and the second feed bin clamp are used for cooling and loading the carrier.
4. A chip module release sort package integrated device as claimed in claim 2 or 3, wherein,
the second transfer mechanism includes:
the device comprises a bottom plate, wherein a guide rail is arranged on the bottom plate, a first side plate and a second side plate are arranged on the bottom plate in parallel, tracks for conveying the carrier are arranged on the first side plate and the second side plate, and a partition plate is arranged on the tracks.
5. The integrated chip module release sort package device of claim 4, further comprising:
the sensor is configured on the first side plate and/or the second side plate and used for detecting the in and out of the carrier.
6. The die set release sort package integrated device of claim 2, further comprising:
a transfer mechanism, which is arranged at the downstream side of the feed bin clamping mechanism and is used for transmitting the carrier to the ejection station,
the transfer mechanism comprises:
the linear driving motor is provided with a bottom plate, a pair of parallel transfer brackets are arranged on the bottom plate, and the transfer brackets are used for fixing the carrier to be transferred.
7. The die set release sort package integrated device of claim 2, further comprising:
lower thimble mechanism, it includes:
a bottom plate and an electric cylinder,
the output end of the electric cylinder is connected with a lower top PIN component, the output end side of the electric cylinder is provided with a pressure sensor for detecting the output pressure of the electric cylinder,
the bottom plate is provided with brackets arranged at intervals, one side of one bracket is provided with a driving part, the output of the driving part is connected with a driving shaft, the output side of the driving shaft is connected with a driving wheel, the driving wheel is connected with a driven wheel through a conveyor belt, and the driving shaft is driven to rotate based on the driving of the driving part, so that the driving wheel is driven to rotate, and then the driven wheel is driven to rotate.
8. The die set release sort package integrated device of claim 7, further comprising:
an upper top plate moving mechanism, comprising:
a pair of mounting brackets arranged in parallel,
wherein, one mounting bracket is provided with a linear motor, the other mounting bracket is provided with a guide rail,
the base is connected with the output end of the linear motor and is in sliding connection with the guide rail, the base is provided with a driving electric cylinder, the output end of the driving electric cylinder is connected with an upper PIN plate component, the upper PIN plate component is provided with a clamping part, the upper PIN plate component is rapidly arranged through the clamping part,
based on the driving of the linear motor, the base is driven to move,
the upper PIN plate component is driven to move downwards based on the driving cylinder, and the upper PIN plate component is matched with the thimble part of the lower PIN component to clamp the chip module, and then the upper PIN plate component moves upwards slowly to release the chip module on the carrier.
9. The integrated chip module release sort package device of claim 8, wherein,
and a suction nozzle is arranged on the upper PIN plate component, and an encapsulation is arranged on the side, contacted with the chip module, of the suction nozzle.
10. The integrated chip module release sort package device of claim 1, wherein,
the deburring module is provided with a feeding end, a material taking module and a deburring station,
the feeding end receives the carrier ejected by the chip module release module,
the material taking module is used for taking the carrier and moving to a deburring station, the deburring station side is provided with a static electricity removing device,
the deburring station is provided with an anti-static brush which rotates to remove burrs on a chip module on the carrier, the material taking module places the carrier after deburring at a preset discharge end and moves to the sorting module through the discharge end,
the sorting module includes: a lower frame on which a transmission assembly is arranged,
the downstream side of the transmission assembly is provided with a first sorting module and a second sorting module which are respectively used for distinguishing good products and defective products of the chip modules, and the chip modules are placed in corresponding trays based on the identification result.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210050690.6A CN116475082A (en) | 2022-01-17 | 2022-01-17 | Integrated device for releasing, sorting and packaging chip modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210050690.6A CN116475082A (en) | 2022-01-17 | 2022-01-17 | Integrated device for releasing, sorting and packaging chip modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116475082A true CN116475082A (en) | 2023-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210050690.6A Pending CN116475082A (en) | 2022-01-17 | 2022-01-17 | Integrated device for releasing, sorting and packaging chip modules |
Country Status (1)
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| CN (1) | CN116475082A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524933A (en) * | 2023-11-08 | 2024-02-06 | 沈阳和研科技股份有限公司 | Chip sorting method, device and storage medium |
-
2022
- 2022-01-17 CN CN202210050690.6A patent/CN116475082A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524933A (en) * | 2023-11-08 | 2024-02-06 | 沈阳和研科技股份有限公司 | Chip sorting method, device and storage medium |
| CN117524933B (en) * | 2023-11-08 | 2024-09-20 | 沈阳和研科技股份有限公司 | Chip sorting method, device and storage medium |
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