CN112864061A - Automatic chip carrier tape packaging equipment with multiple groups of wires - Google Patents
Automatic chip carrier tape packaging equipment with multiple groups of wires Download PDFInfo
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- CN112864061A CN112864061A CN202110290987.5A CN202110290987A CN112864061A CN 112864061 A CN112864061 A CN 112864061A CN 202110290987 A CN202110290987 A CN 202110290987A CN 112864061 A CN112864061 A CN 112864061A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Abstract
The invention discloses an automatic chip carrier tape packaging device with multiple groups of wires, which comprises: board, protection casing, letter sorting platform, a plurality of assembly lines of group, linear electric motor, get and put material module and packaging mechanism, letter sorting bench is provided with first face and sweeps camera, area source, and linear electric motor is provided with a plurality of movers, gets to put the material module and set up in on the mover, get to put the material module and include: the material taking and placing support, the plurality of Z-axis modules, the hollow shaft motor, the material sucking pipe and the suction nozzle are arranged, the Z-axis modules drive the hollow shaft motor to reciprocate up and down, and the hollow shaft motor drives the material sucking pipe to rotate. According to the invention, the image information of the chip on the tray disc is acquired through the first surface scanning camera, the orientation position of the chip is adjusted through the hollow shaft motor on the system control material taking and placing module, and then the chip is placed on the packaging mechanism for packaging, so that the orientation of the chip is ensured to be consistent while the chip is packaged, the subsequent chip is convenient to install and use, and the production work efficiency is improved.
Description
Technical Field
The invention relates to the technical field of automatic production, in particular to automatic chip carrier tape packaging equipment with multiple groups of wires.
Background
The packaging technique is a technique of packaging an integrated circuit or an electronic component with an insulating plastic or ceramic material. In order to prevent the electrical performance degradation caused by the corrosion of the chip circuit by the impurities in the air, the chip must be isolated from the outside. On the other hand, the packaged chip is more convenient to mount and transport. However, the existing packaging equipment takes the chips through a single taking head, and then the chips are placed in the carrier tape one by one, so that the efficiency is low, and the requirement on the working efficiency cannot be met under the condition of large-batch packaging. And get the stub bar and can not adjust the orientation of placing of chip, be not convenient for subsequent installation and use.
Accordingly, the prior art is deficient and needs improvement.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide automatic chip carrier tape packaging equipment with multiple groups of wires.
The technical scheme of the invention is as follows: there is provided a multi-line automatic chip carrier tape packaging apparatus, comprising: board, cover are located protection casing on the board, set up in the letter sorting platform of board one end, set up in a plurality of groups assembly line of letter sorting platform rear end, erect in linear electric motor on the assembly line, set up in linear electric motor is last a plurality of get the blowing module and set up in the packaging mechanism of assembly line side, the letter sorting bench is provided with first face and sweeps the camera, first face is swept the camera below and is provided with the area source, linear electric motor is provided with a plurality of movers, get to expect that the module sets up in on the mover, it includes to get the blowing module: the material picking and placing device comprises a material picking and placing support arranged on the rotor, a plurality of Z-axis modules arranged on the material picking and placing support, a hollow shaft motor arranged on the Z-axis modules, a material sucking pipe penetrating through the hollow shaft motor and a suction nozzle arranged on the material sucking pipe, wherein the Z-axis modules drive the hollow shaft motor to reciprocate up and down, and the hollow shaft motor drives the material sucking pipe to rotate.
Further, the sorting table comprises: the automatic sorting machine comprises a machine table, a sorting moving module, a sorting bottom plate, a sorting feeding belt and a camera support, wherein the machine table is provided with a sorting moving module, the sorting moving module is provided with the sorting bottom plate, the sorting feeding belt is arranged on the sorting bottom plate, the camera support is arranged on the sorting bottom plate, and a first scanning camera and a surface light source are arranged on the camera support.
Furthermore, a stop block cylinder is arranged on the sorting bottom plate, a stop block is arranged on the stop block cylinder, and the stop block is arranged at the rear end of the sorting and feeding belt.
Further, the packaging mechanism includes: set up in the defeated material mechanism of carrier band of assembly line side, set up in the carrier band feed tray of the defeated material mechanism front end of carrier band, set up in hot cutter mechanism on the defeated material mechanism of carrier band, set up in putting the membrane dish of hot cutter mechanism top and set up in the receiving agencies of the defeated material mechanism rear end of carrier band, receiving agencies includes: the material collecting device comprises a pressing wheel arranged at the rear end of the material conveying mechanism of the carrier tape, a plurality of idler wheels meshed with the pressing wheel, a material collecting power mechanism connected with the pressing wheel, and a material collecting disc arranged at the rear end of the pressing wheel, wherein a second face sweeping camera is arranged above the material conveying mechanism of the carrier tape, and the second face sweeping camera is arranged at the rear end of the linear motor.
Further, the hot knife mechanism includes: the hot melting base is arranged on two sides of the carrier tape conveying mechanism, the hot melting connecting rod is hinged to the hot melting base, the ejector rod is arranged on the hot melting connecting rod, the heat insulation connecting block is arranged on the hot melting connecting rod, the heating block is arranged on the heat insulation connecting block, and the hot melting block is arranged on the heating block, and the ejector rod pushes the hot melting connecting rod to turn around the hot melting base.
Furthermore, a first optical fiber sensor and a second optical fiber sensor are arranged on the carrier tape conveying mechanism, the first optical fiber sensor is arranged at one end of the carrier tape conveying mechanism, and the second optical fiber sensor is arranged at the rear end of the first optical fiber sensor.
Furthermore, the packaging mechanism is provided with a suspicion material box beside, and the suspicion material box is correspondingly arranged below the material taking and placing module.
Further, be provided with the limiting plate on the assembly line, the front end of limiting plate is provided with support plate and transplants the mechanism, support plate transplants the mechanism and includes: the automatic conveying device comprises a transplanting moving module arranged below the assembly line, a transplanting cylinder arranged on the transplanting moving module, a support plate tray arranged on the output end of the transplanting cylinder, and a pre-pressing mechanism suspended above the support plate tray, wherein the transplanting cylinder drives the support plate tray to reciprocate up and down.
Further, the assembly line rear end is provided with and piles up a set mechanism, it is provided with down the material area to pile a set mechanism rear end, it includes to pile a set mechanism: set up in the pile dish curb plate of assembly line both sides, set up in pile dish cylinder on the pile dish curb plate, with the layering that the output of pile dish cylinder is connected, set up in a plurality of briquetting on the layering, set up in a plurality of spring holders of briquetting below, set up in the tongue piece of spring holder the inside, set up in jacking cylinder of assembly line below and set up in jacking board on the output of jacking cylinder, be provided with the spring between the inside wall of spring holder and the tongue piece, the tongue piece is the L type, tongue piece top is provided with the inclined plane, the inclined plane contact of briquetting and tongue piece, it is provided with tongue piece through-hole to fold the dish curb plate and correspond the tongue piece, tongue piece through-hole is passed to the lower part of tongue piece.
Further, the front end of the disc stacking mechanism is provided with a first blocking cylinder, a first blocking block is arranged at the output end of the first blocking cylinder, a second blocking cylinder is arranged at the rear end of the disc stacking mechanism, a second blocking block is arranged at the output end of the second blocking cylinder, and opposite sensors are arranged on disc stacking side plates on two sides.
By adopting the scheme, the image information of the chip on the tray disc is acquired through the first scanning camera, the orientation position of the chip is adjusted through the hollow shaft motor on the system control material taking and placing module, and then the chip is placed on the packaging mechanism for packaging, so that the orientation of the chip is ensured to be consistent while the chip is packaged, the subsequent chip is convenient to install and use, and the whole production work efficiency is improved.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of the material taking and placing module.
Fig. 3 is a schematic structural diagram of the sorting table.
Fig. 4 is a schematic structural view of the packaging mechanism.
Fig. 5 is an enlarged schematic view of a portion a in fig. 4.
Fig. 6 is a schematic structural diagram of a carrier plate transplanting mechanism.
FIG. 7 is a schematic diagram of the assembly line and the stacking mechanism.
Fig. 8 is a schematic structural view of a side plate of the disc stack.
Fig. 9 is a cross-sectional view at B-B in fig. 8.
Detailed Description
The invention is described in detail below with reference to the figures and the specific embodiments.
Referring to fig. 1 and 2, the present invention provides an automatic chip carrier tape packaging apparatus with multiple lines, including: the machine table 1, the cover is located protection casing on the machine table 1, set up in the letter sorting platform 2 of machine table 1 one end, set up in a plurality of groups assembly line 3 of letter sorting platform 2 rear end, erect in linear electric motor 4 on the assembly line 3, set up in a plurality of blowing modules 5 of getting on linear electric motor 4 and set up in the packaging mechanism 6 of assembly line 3 side. The sorting table 2 is provided with a first scanning camera 21, and a surface light source 22 is arranged below the first scanning camera 21. The linear motor 4 is provided with a plurality of rotors 41, and the material taking and placing module 5 is arranged on the rotors 41. Get blowing module 5 includes: the rotor comprises a material taking and placing support 51 arranged on the rotor 41, a plurality of Z-axis modules 52 arranged on the material taking and placing support 51, a hollow shaft motor 53 arranged on the Z-axis modules 52, a material sucking pipe 54 penetrating through the hollow shaft motor 53, and a suction nozzle arranged on the material sucking pipe 54. The Z-axis module 52 drives the hollow shaft motor 53 to reciprocate up and down, and the hollow shaft motor 53 drives the material suction pipe 54 to rotate.
In operation, the tray disk loaded with chips is transported to the sorting table 2 by upstream equipment or manual work, and the first scanning camera 21 is started to acquire image information of the chips placed on the tray disk. Specifically, the first scanning camera 21 acquires the placement orientation, the front and back sides, and the two-dimensional code information on the chip of the chip, and sends the acquired information to the system. Then the sorting table 2 sequentially conveys the tray disc to the assembly line 3 corresponding to the material taking and placing module 5 which is not in the working state, and simultaneously, the system sends the image information collected by the first scanning camera 21 to the corresponding material taking and placing module 5. The Tray disc moves forwards on the assembly line 3, meanwhile, the taking and placing module 5 moves to the position above the Tray disc under the driving of the rotor 41 of the linear motor 4, the Z-axis module 52 drives the hollow shaft motor 53 to descend, the chips on the Tray disc are picked up in an adsorption mode through the suction nozzle, and then the taking and placing module 5 moves to the position above the packaging mechanism 6 through the rotor 41 of the linear motor 4. The material taking and placing module 5 adjusts the direction of the chips through the hollow shaft motor 53 according to the image information acquired by the first scanning camera 21, and then the chips are placed on the packaging mechanism 6 one by one, so that the chips are packaged in the carrier tape through the packaging mechanism 6.
Referring to fig. 3, the sorting table 2 includes: the automatic sorting machine comprises a sorting moving module 23 arranged on the machine table 1, a sorting bottom plate 24 arranged on the sorting moving module 23, a sorting feeding belt 25 arranged on the sorting bottom plate 24, and a camera support 26 arranged on the sorting bottom plate 24. The first scanning camera 21 and the surface light source 22 are disposed on the camera support 26. The upstream equipment or the human hand transports the tray loaded with the chips onto the sorting feed belt 25 of the sorting table 2, and the first scanning camera 21 acquires image information of the chips on the tray in the case where the surface light source 22 provides the illumination condition, and sends the image information into the system. After the system receives the image information, the material taking and placing module 5 which is not in the working state is detected, then the image information collected by the first scanning camera 21 is sent to the material taking and placing module 5, and the sorting moving module 23 is driven to move the sorting feeding belt 25 to the corresponding assembly line 3. After the tray is moved in place, the tray disc is moved to the assembly line 3 by the sorting and feeding belt 25, and sorting and feeding are achieved.
A stop block cylinder 27 is arranged on the sorting bottom plate 24, a stop block 28 is arranged on the stop block cylinder 27, and the stop block 28 is arranged at the rear end of the sorting and feeding belt 25. In the initial state, the stopper cylinder 27 is actuated so that the stopper 28 is extended to provide a limit for the tray disk. When the sorting moving module 23 moves the sorting feeding belt 25 to the corresponding position of the production line 3, the stop block cylinder 27 retracts to drive the stop block 28 to descend, so that the tray moves onto the production line 3 under the conveying of the sorting feeding belt 25.
Referring to fig. 4 and 5, the packaging mechanism 6 includes: the film feeding device comprises a carrier tape conveying mechanism 61 arranged beside the assembly line 3, a carrier tape feeding disc 62 arranged at the front end of the carrier tape conveying mechanism 61, a hot cutter mechanism 63 arranged on the carrier tape conveying mechanism 61, a film placing disc 64 arranged above the hot cutter mechanism 63, and a material receiving mechanism 65 arranged at the rear end of the carrier tape conveying mechanism 61. The receiving mechanism 65 includes: the material collecting device comprises a pressing wheel 651 arranged at the rear end of the carrier tape conveying mechanism 61, a plurality of rollers 652 meshed with the pressing wheel 651, a material collecting power mechanism connected with the pressing wheel 651, and a material collecting disc 653 arranged at the rear end of the pressing wheel 651. A second area scanning camera 66 is arranged above the carrier tape conveying mechanism 61, and the second area scanning camera 66 is arranged at the rear end of the linear motor 4. The carrier tape feeding tray 62 is sleeved with a coiled empty tape, and the front end of the carrier tape extends along the carrier tape conveying mechanism 61, so that the carrier tape passes through the hot cutter mechanism 63 and the gap between the pressing wheel 651 and the roller 652 and is wound on the material receiving tray 653. The film placing disc 64 is sleeved with a coiled plastic packaging film, the front end of the plastic packaging film is attached to the upper surface of the carrier tape, and the plastic packaging film is fixed on the carrier tape through hot melting by the hot cutter mechanism 63. During operation, the material receiving power mechanism is started to drive the pressing wheel 651 to rotate, and the pressing wheel 651 and the roller 652 are meshed to rotate, so that the carrier tape is driven to move forwards. The material taking and placing module 5 is used for sequentially placing the chips on the carrier tape, then plastic packaging films on the film placing disc 64 are covered on the carrier tape, then the plastic packaging films are subjected to hot melting and pressing through the hot cutter mechanism 63, and finally the plastic packaging films are wound on the material receiving disc 653 to achieve packaging of the chips. The chips on the carrier tape are positioned and identified through the second face scanning camera 66, so that whether the chip is adjusted to a specified direction to be placed by the material taking and placing module 5 is detected, and the subsequent chip taking and installing are facilitated.
The hot cutter mechanism 63 includes: the hot melting base 631 is arranged on two sides of the carrier tape conveying mechanism 61, the hot melting connecting rod 632 is hinged to the hot melting base 631, the ejector rod 633 is arranged on the hot melting connecting rod 632, the heat insulation connecting block 634 is arranged on the hot melting connecting rod 632, the heating block 635 is arranged on the heat insulation connecting block 634, and the hot melting block 636 is arranged on the heating block 635. The post 633 pushes the hot melting connecting rod 632 to turn around the hot melting base 631. When the carrier tape covered with the plastic packaging film moves in place, the ejector pin 632 pulls the hot melt link 633, so that the hot melt link 633 turns downwards around the hinge point, thereby pressing the hot melt block 636 against the plastic packaging film. Because the heating block 635 continuously generates heat and transfers the heat to the hot melting block 636, the plastic packaging film is hot melted and pressed on the carrier tape, and the packaging of the chip is realized.
The carrier tape conveying mechanism 61 is provided with a first optical fiber sensor 671 and a second optical fiber sensor 672, the first optical fiber sensor 671 is arranged at one end of the carrier tape conveying mechanism 61, and the second optical fiber sensor 672 is arranged at the rear end of the first optical fiber sensor 671. The two sides of the carrier tape are equidistantly provided with a plurality of through holes, and the first optical fiber sensor 671 and the second optical fiber sensor 672 can detect the through holes on the carrier tape and count the through holes in the moving process of the carrier tape. If there is a deviation between the count value of the first optical fiber sensor 671 and the count value of the second optical fiber sensor 672, which indicates that the movement of the carrier tape is abnormal, the system will send out an alarm signal to remind the operator in the field to deal with the abnormal situation.
The packing mechanism 6 is provided with a suspicion material box 68 at the side, and the suspicion material box 68 is correspondingly arranged below the material taking and placing module 5. After the first scanning camera 21 acquires image information of a chip on a tray disc, the system receives the image information and identifies information such as the orientation, the front side and the back side of the chip, a two-dimensional code on the chip and the like. If the front and back surfaces or the two-dimensional code information of the chip do not meet the requirements, the chip is placed in the suspicion material box 68 after the material taking and placing module 5 takes materials, and the operator judges the suspicion chip.
Referring to fig. 6 and 7, a limiting plate 31 is disposed on the assembly line 3, and a carrier plate transplanting mechanism 7 is disposed at a front end of the limiting plate 31. The carrier plate transplanting mechanism 7 includes: the system comprises a transplanting moving module 71 arranged below the assembly line 3, a transplanting air cylinder 72 arranged on the transplanting moving module 71, a carrier plate tray 73 arranged on the output end of the transplanting air cylinder 72, and a pre-pressing mechanism suspended above the carrier plate tray 73. The transplanting cylinder 72 drives the carrier plate tray 73 to reciprocate up and down. The Tary tray moves to the position of the limiting plate 31 along with the assembly line 3, is blocked by the limiting plate 31 and cannot move forwards continuously. The transplanting air cylinder 72 is started to push out the carrier plate tray 73, and the carrier plate tray 73 is lifted up after contacting the bottom of the tray. Then the prepressing mechanism starts to prepress the tray disc, and pushes the chip on the tray disc to be flush with the tray disc, so that the material taking and placing module 5 can take materials conveniently. Then the transplanting moving module 71 drives the tray disc to move forward, and meanwhile the taking and placing module 5 takes the chips from the tray disc. After the picking and placing module 5 picks up all chips on the tray, the tray passes through the limiting plate 31 under the driving of the transplanting moving module 71, and then the transplanting cylinder 72 is reset, so that the tray falls on the assembly line 3 and is conveyed forwards through the assembly line 3. Through set up limiting plate 31 and support plate transplanting mechanism 7 on assembly line 3 to the realization is convenient for get blowing module 5 and is got the material when assembly line 3 keeps normal conveying speed, avoids appearing getting less or leaking the condition of getting the chip, does not influence the feeding speed of assembly line 3 to empty year tray dish simultaneously.
Referring to fig. 7 to 9, a tray stacking mechanism 8 is disposed at the rear end of the assembly line 3, and a discharging belt 9 is disposed at the rear end of the tray stacking mechanism 8. The disc stacking mechanism 8 includes: set up in the folding dish curb plate 81 of assembly line 3 both sides, set up in folding dish cylinder 82 on the folding dish curb plate 81, with layering 83 that the output of folding dish cylinder 82 is connected, set up in a plurality of briquetting 831 on the layering 83, set up in a plurality of spring holders 84 of briquetting 831 below, set up in tongue 841 inside the spring holder 84, set up in jacking cylinder 85 of assembly line 3 below and set up in jacking board on the output of jacking cylinder. Be provided with spring 842 between the inside wall of spring holder 84 and tongue piece 841, tongue piece 841 is the L type, tongue piece 841 top is provided with the inclined plane, briquetting 831 and tongue piece 841's inclined plane contact, it corresponds tongue piece 841 and is provided with tongue piece through-hole 811 to fold dish curb plate 81, tongue piece through-hole 811 is passed to the lower part of tongue piece 841. The unloaded tray disc moves to the position of the disc stacking mechanism 8 under the conveying of the assembly line 3, the jacking cylinder is started to push out the jacking plate at the moment, and the tray disc is jacked after the jacking plate is contacted with the tray disc. At the same time, the stack cylinder 82 is started, and the pressing block 831 is driven to press downwards through the pressing strip 83, so that the tongue block is pushed through the inclined surface on the tongue block 841, and the lower part of the tongue block 841 is retracted into the spring seat 84 from the tongue block through hole 811. As the lower portion of the tongue piece 841 is retracted, the empty tray stacked on the tongue piece 841 falls down to be stacked with the tray on the lifting plate. Then the stacking cylinder 82 is reset, the tongue piece 841 is pushed by the spring 842 to extend through the tongue piece through hole 811, and the jacking cylinder is reset, so that the stacked tray plates fall on the tongue piece, and the stacking of the empty tray plates is realized. After the stacking is finished, the tray disc group is sent out through the discharging belt 9, so that the empty tray disc can be conveniently recycled.
The front end of the disc stacking mechanism 8 is provided with a first blocking cylinder 85, the output end of the first blocking cylinder 85 is provided with a first blocking block 851, the rear end of the disc stacking mechanism 8 is provided with a second blocking cylinder 86, the output end of the second blocking cylinder 86 is provided with a second blocking block 861, and two side disc stacking side plates 81 are provided with correlation sensors 87. When the disc stacking mechanism 8 is performing stacking work, the first blocking cylinder 85 is activated, so that the first blocking block 851 extends to prevent the following empty tray from moving to a position between the jacking plate and the jacking cylinder under the transportation of the assembly line 3, thereby protecting the disc stacking mechanism and the tray from being damaged due to the falling of the jacking plate. When a tray disc is stacked to the height position where the correlation sensor 87 is located, the correlation sensor 87 detects the tray disc, and transmits a corresponding signal to the system. After the system receives the signal, the system drives the jacking cylinder to start, so that the jacking plate is lifted and is in contact with the bottom of the tray disc group, and then the disc stacking cylinder 82 starts, so that the lower part of the tongue block 841 retracts, and the tray disc group is released. Then the tray stacking cylinder 82 is reset, so that the tray set falls on the production line 3, the second blocking cylinder 86 retracts, and the second blocking block 862 descends, so that the tray set is sent to the blanking belt 9 through the production line 3 and sent out.
In summary, the image information of the chip on the tray disc is acquired through the first scanning camera, the orientation position of the chip is adjusted through the hollow shaft motor on the system control material taking and placing module, and then the chip is placed on the packaging mechanism for packaging, so that the orientation of the chip is ensured to be consistent while the chip is packaged, the subsequent chip is convenient to install and use, and the overall production work efficiency is improved.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides an automatic chip carrier tape packaging equipment of multiunit line which characterized in that includes: board, cover are located protection casing on the board, set up in the letter sorting platform of board one end, set up in a plurality of groups assembly line of letter sorting platform rear end, erect in linear electric motor on the assembly line, set up in linear electric motor is last a plurality of get the blowing module and set up in the packaging mechanism of assembly line side, the letter sorting bench is provided with first face and sweeps the camera, first face is swept the camera below and is provided with the area source, linear electric motor is provided with a plurality of movers, get to expect that the module sets up in on the mover, it includes to get the blowing module: the material picking and placing device comprises a material picking and placing support arranged on the rotor, a plurality of Z-axis modules arranged on the material picking and placing support, a hollow shaft motor arranged on the Z-axis modules, a material sucking pipe penetrating through the hollow shaft motor and a suction nozzle arranged on the material sucking pipe, wherein the Z-axis modules drive the hollow shaft motor to reciprocate up and down, and the hollow shaft motor drives the material sucking pipe to rotate.
2. The multi-lane automated chip carrier tape packaging apparatus of claim 1, wherein the sorting station comprises: the automatic sorting machine comprises a machine table, a sorting moving module, a sorting bottom plate, a sorting feeding belt and a camera support, wherein the machine table is provided with a sorting moving module, the sorting moving module is provided with the sorting bottom plate, the sorting feeding belt is arranged on the sorting bottom plate, the camera support is arranged on the sorting bottom plate, and a first scanning camera and a surface light source are arranged on the camera support.
3. The multi-lane automated chip carrier tape packaging apparatus of claim 2, wherein the bottom sorting plate is provided with a stopper cylinder, the stopper cylinder is provided with a stopper, and the stopper is disposed at the rear end of the sorting feeding belt.
4. The multi-lane automated chip carrier tape packaging apparatus of claim 1, wherein the packaging mechanism comprises: set up in the defeated material mechanism of carrier band of assembly line side, set up in the carrier band feed tray of the defeated material mechanism front end of carrier band, set up in hot cutter mechanism on the defeated material mechanism of carrier band, set up in putting the membrane dish of hot cutter mechanism top and set up in the receiving agencies of the defeated material mechanism rear end of carrier band, receiving agencies includes: the material collecting device comprises a pressing wheel arranged at the rear end of the material conveying mechanism of the carrier tape, a plurality of idler wheels meshed with the pressing wheel, a material collecting power mechanism connected with the pressing wheel, and a material collecting disc arranged at the rear end of the pressing wheel, wherein a second face sweeping camera is arranged above the material conveying mechanism of the carrier tape, and the second face sweeping camera is arranged at the rear end of the linear motor.
5. The multi-lane automated chip carrier tape packaging apparatus of claim 4, wherein the hot knife mechanism comprises: the hot melting base is arranged on two sides of the carrier tape conveying mechanism, the hot melting connecting rod is hinged to the hot melting base, the ejector rod is arranged on the hot melting connecting rod, the heat insulation connecting block is arranged on the hot melting connecting rod, the heating block is arranged on the heat insulation connecting block, and the hot melting block is arranged on the heating block, and the ejector rod pushes the hot melting connecting rod to turn around the hot melting base.
6. The apparatus of claim 4, wherein the tape feeder is provided with a first optical fiber sensor and a second optical fiber sensor, the first optical fiber sensor is disposed at one end of the tape feeder, and the second optical fiber sensor is disposed at a rear end of the first optical fiber sensor.
7. The apparatus of claim 1, wherein the packaging mechanism is provided with a suspicion magazine beside the packaging mechanism, and the suspicion magazine is correspondingly disposed below the pick-and-place module.
8. The multi-lane automatic chip carrier tape packaging apparatus according to claim 1, wherein the line is provided with a limiting plate, a carrier plate transplanting mechanism is provided at a front end of the limiting plate, and the carrier plate transplanting mechanism comprises: the automatic conveying device comprises a transplanting moving module arranged below the assembly line, a transplanting cylinder arranged on the transplanting moving module, a support plate tray arranged on the output end of the transplanting cylinder, and a pre-pressing mechanism suspended above the support plate tray, wherein the transplanting cylinder drives the support plate tray to reciprocate up and down.
9. The multi-line automatic chip carrier tape packaging device according to claim 1, wherein a tray stacking mechanism is disposed at a rear end of the assembly line, a blanking belt is disposed at a rear end of the tray stacking mechanism, and the tray stacking mechanism comprises: set up in the pile dish curb plate of assembly line both sides, set up in pile dish cylinder on the pile dish curb plate, with the layering that the output of pile dish cylinder is connected, set up in a plurality of briquetting on the layering, set up in a plurality of spring holders of briquetting below, set up in the tongue piece of spring holder the inside, set up in jacking cylinder of assembly line below and set up in jacking board on the output of jacking cylinder, be provided with the spring between the inside wall of spring holder and the tongue piece, the tongue piece is the L type, tongue piece top is provided with the inclined plane, the inclined plane contact of briquetting and tongue piece, it is provided with tongue piece through-hole to fold the dish curb plate and correspond the tongue piece, tongue piece through-hole is passed to the lower part of tongue piece.
10. The apparatus of claim 9, wherein a first blocking cylinder is disposed at the front end of the stacking mechanism, a first blocking block is disposed at the output end of the first blocking cylinder, a second blocking cylinder is disposed at the rear end of the stacking mechanism, a second blocking block is disposed at the output end of the second blocking cylinder, and a correlation sensor is disposed on the side plates of the stacking mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110290987.5A CN112864061A (en) | 2021-03-18 | 2021-03-18 | Automatic chip carrier tape packaging equipment with multiple groups of wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110290987.5A CN112864061A (en) | 2021-03-18 | 2021-03-18 | Automatic chip carrier tape packaging equipment with multiple groups of wires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112864061A true CN112864061A (en) | 2021-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110290987.5A Withdrawn CN112864061A (en) | 2021-03-18 | 2021-03-18 | Automatic chip carrier tape packaging equipment with multiple groups of wires |
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| CN (1) | CN112864061A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113460648A (en) * | 2021-07-09 | 2021-10-01 | 上海世禹精密机械有限公司 | System for transferring chip from tray to carrier |
| CN114653606A (en) * | 2022-03-25 | 2022-06-24 | 博众精工科技股份有限公司 | Efficient chip detection packaging equipment |
| CN115156078A (en) * | 2022-08-02 | 2022-10-11 | 深圳市芯岛智能装备有限公司 | High-speed testing and sorting machine for semiconductor chips |
| CN116864433A (en) * | 2023-09-04 | 2023-10-10 | 砺铸智能设备(天津)有限公司 | Automatic feeding hot-pressing packaging mechanism for chip packaging |
-
2021
- 2021-03-18 CN CN202110290987.5A patent/CN112864061A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113460648A (en) * | 2021-07-09 | 2021-10-01 | 上海世禹精密机械有限公司 | System for transferring chip from tray to carrier |
| CN114653606A (en) * | 2022-03-25 | 2022-06-24 | 博众精工科技股份有限公司 | Efficient chip detection packaging equipment |
| CN114653606B (en) * | 2022-03-25 | 2023-09-15 | 博众精工科技股份有限公司 | High-efficient chip detects encapsulation equipment |
| CN115156078A (en) * | 2022-08-02 | 2022-10-11 | 深圳市芯岛智能装备有限公司 | High-speed testing and sorting machine for semiconductor chips |
| CN116864433A (en) * | 2023-09-04 | 2023-10-10 | 砺铸智能设备(天津)有限公司 | Automatic feeding hot-pressing packaging mechanism for chip packaging |
| CN116864433B (en) * | 2023-09-04 | 2023-11-10 | 砺铸智能设备(天津)有限公司 | Automatic feeding hot-pressing packaging mechanism for chip packaging |
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Application publication date: 20210528 |
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