CN115156078A - High-speed testing and sorting machine for semiconductor chips - Google Patents
High-speed testing and sorting machine for semiconductor chips Download PDFInfo
- Publication number
- CN115156078A CN115156078A CN202210920155.1A CN202210920155A CN115156078A CN 115156078 A CN115156078 A CN 115156078A CN 202210920155 A CN202210920155 A CN 202210920155A CN 115156078 A CN115156078 A CN 115156078A
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- tray
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- vertical plate
- chips
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- 238000012360 testing method Methods 0.000 title claims abstract description 38
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 230000007246 mechanism Effects 0.000 claims abstract description 74
- 238000007599 discharging Methods 0.000 claims abstract description 12
- 238000009954 braiding Methods 0.000 claims description 25
- 230000001360 synchronised effect Effects 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000007723 transport mechanism Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model relates to a semiconductor chip high speed test sorter, belong to chip test sorting technology field, feeding mechanism and tray feeding and discharging mechanism through setting up, feeding and discharging mechanism can go on unloading to the chip of placing in the chip tray with the cooperation of transport mechanism on the tray, and the chip of not putting into in the chip tray then directly pours into the feed portion among the feeding mechanism, the chip is arranged in the hopper of feed portion, the vibrations through flexible electromagnetic shaker make the chip in the hopper get into the charging tray, rethread transport mechanism can carry the chip in the charging tray, make this application can test and put into the chip in the chip tray, also can test the chip of not putting into in the chip tray and select separately, do benefit to the use.
Description
Technical Field
The invention relates to a high-speed testing and sorting machine for semiconductor chips, belonging to the technical field of chip testing and sorting.
Background
The chip is mainly referred to as an integrated circuit, also called as a micro circuit or a microchip, and the chip is an indispensable object nowadays, the essence of the chip is semiconductor and integrated circuit, the chip is a miniaturized circuit manufactured on a semiconductor wafer and has a special function, and as the chip is in an electronic product, the chip has small volume and does not occupy space, the electronic product can realize light and thin feeling and can also play high performance and function, so that the chip is just like a heart or a brain of an electronic device, and not only can carry out logic control, but also has arithmetic capability;
semiconductor chip need test in the production course of working and sorting, the chip processing technology of different grade type also has difference, some chips put into the chip tray in other technologies before the test, the chip is put neatly in the chip tray, carry out the transport of chip through unloading mechanism and the cooperation of handling mechanism on the tray, some chips do not need the chip tray in other technologies, the chip is not put in the chip tray before the test, lead to need the manual work to put into the chip tray with the chip again before the test, be unfavorable for the use. Therefore, we improve this and propose a semiconductor chip high-speed test handler.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: some chips are not placed in the chip tray before testing, so that the chips need to be manually placed in the chip tray before testing, and the use is not facilitated.
(II) technical scheme
In order to achieve the purpose, the invention provides a high-speed testing and sorting machine for semiconductor chips, which comprises a supporting table and a protective cover arranged at the top of the supporting table, wherein a tray feeding and discharging mechanism, a braiding machine positioned on one side of the tray feeding and discharging mechanism and a feeding mechanism positioned on one side of the braiding machine far away from the tray feeding and discharging mechanism are arranged at the top of the supporting table;
the carrying mechanism comprises a driving part arranged at the top of the supporting table, a carrying part is arranged on the driving part, and the feeding mechanism comprises a feeding part arranged at the top of the supporting table and a detecting part positioned on one side of the feeding part.
The carrying mechanism comprises an electric sliding table arranged at the top of the supporting table, and a sliding seat moving along the electric sliding table is arranged on the electric sliding table.
The carrying part comprises a vertical plate arranged on one side of the sliding seat, and a plurality of carrying pieces are arranged on the vertical plate.
The conveying piece comprises a driving motor arranged on the back face of the vertical plate, an output shaft of the driving motor penetrates through the vertical plate and extends to the front face of the vertical plate, synchronizing wheels are arranged on the output shaft of the driving motor and the front face of the vertical plate, and a synchronous belt is connected between the two synchronizing wheels in a transmission mode.
The front of the vertical plate is provided with a guide rail positioned on one side of the synchronous belt, the guide rail is connected with a supporting sliding seat in a sliding manner, and the supporting sliding seat is provided with a hollow shaft motor.
The vacuum suction device comprises a hollow shaft motor, a connecting pipe and a vacuum suction nozzle, wherein the output shaft of the hollow shaft motor is a hollow output shaft, the top of the output shaft of the hollow shaft motor is connected with the connecting pipe, and the bottom end of the output shaft of the hollow shaft motor is connected with the vacuum suction nozzle.
And a tension spring is connected between the top of the supporting sliding seat and the vertical plate.
The feeding part comprises a flexible vibrator installed at the top of the supporting table, a hopper and a material tray are installed at the top of the flexible vibrator, the hopper is provided with a discharge port, and the discharge port extends to the top of the material tray.
The detection part comprises a first support frame arranged at the top of the support table, a first CCD camera is arranged on the first support frame, and the first CCD camera is positioned right above the material tray.
The braider is provided with a second support frame, and the second support frame is provided with a third CCD camera.
(III) advantageous effects
The semiconductor chip high-speed testing sorter provided by the invention has the beneficial effects that:
1. through the feeding mechanism and the tray feeding and discharging mechanism, the tray feeding and discharging mechanism can be matched with the carrying mechanism to feed and discharge chips placed in the chip tray, the chips which are not placed in the chip tray are directly poured into the feeding part in the feeding mechanism, the chips are located in the hopper in the feeding part, the chips in the hopper enter the material tray through the vibration of the flexible vibrator, and then the chips in the material tray can be carried through the carrying mechanism, so that the chips which are placed in the chip tray and the chip tray can be tested, the chips which are not placed in the chip tray can also be tested and sorted, and the use is facilitated;
2. through the arranged carrying mechanism, the carrying part in the carrying mechanism can carry the chip, and the hollow shaft motor in the carrying part can drive the vacuum suction nozzle to rotate, so that the position of the chip can be adjusted after the chip is adsorbed by the vacuum suction nozzle, the position of the chip when the chip is braided in the braiding machine is ensured, and the use is facilitated;
3. through the transport mechanism who sets up, extension spring among the transport mechanism can pull the support slide, and when the hold-in range fracture, the effort of extension spring can drive the support slide and rise, avoids the support slide to fall and collides with other parts, reduces the loss.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor chip high-speed test handler provided in the present application;
fig. 2 is a schematic structural diagram of a handling mechanism of the semiconductor chip high-speed test handler provided in the present application;
FIG. 3 is a schematic top view of a tray loading and unloading mechanism of the semiconductor chip high speed test handler provided in the present application;
fig. 4 is a schematic top view of a conveying mechanism of a semiconductor chip high-speed test handler according to the present application;
fig. 5 is a schematic structural diagram of a taping machine of the semiconductor chip high-speed test handler provided in the present application;
fig. 6 is an enlarged schematic structural view of a portion a in fig. 5 of the semiconductor chip high-speed test handler provided in the present application;
fig. 7 is an enlarged schematic structural view of a semiconductor chip high-speed test handler provided in the present application, at B in fig. 5;
fig. 8 is an enlarged schematic structural diagram of a semiconductor chip high-speed test handler provided in the present application at C in fig. 5.
1. A support table;
2. a protective cover;
3. a carrying mechanism; 301. an electric sliding table; 302. a sliding seat; 303. a vertical plate; 304. a drive motor; 305. a synchronizing wheel; 306. a synchronous belt; 307. a support slide; 308. a hollow shaft motor; 309. a vacuum nozzle; 310. a connecting pipe; 311. a tension spring;
4. a feeding mechanism; 401. a flexible vibrator; 402. a hopper; 403. a material tray; 404. a first support frame; 405. a first CCD camera;
5. a tray loading and unloading mechanism;
6. a second CCD camera;
7. a braider;
8. a third CCD camera;
9. a second support frame.
Detailed Description
The following detailed description of the embodiments of the present invention is made with reference to the drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
Example 1:
as shown in fig. 1, 2, 3, 4 and 5, the embodiment provides a semiconductor chip high-speed test sorting machine, which comprises a supporting table 1 and a protective cover 2 arranged on the top of the supporting table 1, wherein a tray loading and unloading mechanism 5, a braiding machine 7 arranged on one side of the tray loading and unloading mechanism 5, and a feeding mechanism 4 arranged on one side, far away from the tray loading and unloading mechanism 5, of the braiding machine 7 are arranged on the top of the supporting table 1, a conveying mechanism 3 arranged behind the tray loading and unloading mechanism 5, the braiding machine 7 and the feeding mechanism 4 is further arranged on the top of the supporting table 1, a second CCD camera 6 arranged between the feeding mechanism 4 and the braiding machine 7 is arranged on the top of the supporting table 1, the tray loading and unloading mechanism 5 and the feeding mechanism 4 are both used for providing chips for the braiding machine 7, the conveying mechanism 3 is used for conveying the chips in the tray loading and unloading mechanism 5 and the feeding mechanism 4 into the braiding machine 7, and the braiding machine 7 is used for braiding the chips;
the conveying mechanism 3 comprises a driving part arranged on the top of the supporting table 1, a conveying part is arranged on the driving part, and the feeding mechanism 4 comprises a feeding part arranged on the top of the supporting table 1 and a detecting part positioned on one side of the feeding part.
Example 2:
the scheme of example 1 is further described below in conjunction with specific working modes, which are described in detail below:
as shown in fig. 1, 2, 3, 4 and 5, the embodiment provides a semiconductor chip high-speed test sorting machine, which comprises a supporting table 1 and a protective cover 2 arranged on the top of the supporting table 1, wherein the top of the supporting table 1 is provided with a tray loading and unloading mechanism 5, a braiding machine 7 positioned on one side of the tray loading and unloading mechanism 5, and a feeding mechanism 4 positioned on one side of the braiding machine 7 far away from the tray loading and unloading mechanism 5, the top of the supporting table 1 is also provided with a carrying mechanism 3 positioned behind the tray loading and unloading mechanism 5, the braiding machine 7 and the feeding mechanism 4, and the top of the supporting table 1 is provided with a second CCD camera 6 positioned between the feeding mechanism 4 and the braiding machine 7;
the conveying mechanism 3 comprises a driving part arranged on the top of the supporting table 1, a conveying part is arranged on the driving part, and the feeding mechanism 4 comprises a feeding part arranged on the top of the supporting table 1 and a detecting part positioned on one side of the feeding part.
As shown in fig. 2, 3, 4 and 5, in addition to the above-mentioned embodiment, the carrying mechanism 3 further includes an electric slide table 301 mounted on the top of the support table 1, a slide base 302 moving along the electric slide table 301 is provided on the electric slide table 301, and the slide base 302 can be moved by the electric slide table 301.
As shown in fig. 2, 3, 4, 5 and 6, in addition to the above-described embodiment, the conveying unit further includes an upright plate 303 attached to the side of the slide base 302, and a plurality of conveying members are provided on the upright plate 303, so that a plurality of chips can be conveyed at a time by the plurality of conveying members, thereby improving work efficiency.
As shown in fig. 6, as a preferred embodiment, on the basis of the above manner, further, the carrying member includes a driving motor 304 installed on the back of the vertical plate 303, an output shaft of the driving motor 304 passes through the vertical plate 303 and extends to the front of the vertical plate 303, synchronizing wheels 305 are respectively disposed on the output shaft of the driving motor 304 and the front of the vertical plate 303, a timing belt 306 is connected between the two synchronizing wheels 305 in a transmission manner, the driving motor 304 can drive the synchronizing wheels 305 and the timing belt 306 to rotate, and the supporting slide base 307 can be controlled to move up and down during the rotation of the timing belt 306.
As shown in fig. 6, as a preferred embodiment, on the basis of the above manner, further, a guide rail located on one side of the synchronous belt 306 is installed on the front surface of the vertical plate 303, a support sliding seat 307 is connected to the guide rail in a sliding manner, a hollow shaft motor 308 is installed on the support sliding seat 307, and the hollow shaft motor 308 can drive the vacuum suction nozzle 309 to rotate, so that the position of the chip can be adjusted after the chip is sucked by the vacuum suction nozzle 309, thereby ensuring the taping of the chip in the taping machine 7 and facilitating the use.
As shown in fig. 6, as a preferred embodiment, in addition to the above-mentioned embodiment, the output shaft of the hollow shaft motor 308 is a hollow output shaft, the top of the output shaft of the hollow shaft motor 308 is connected to a connecting pipe 310, the bottom of the output shaft of the hollow shaft motor 308 is connected to a vacuum suction nozzle 309, and the vacuum suction nozzle 309 can suck the chip and move the chip.
As shown in fig. 6, as a preferred embodiment, in addition to the above, a tension spring 311 is connected between the top of the support slide 307 and the vertical plate 303, the tension spring 311 can pull the support slide 307, and when the timing belt 306 is broken, the acting force of the tension spring 311 can drive the support slide 307 to rise, so as to prevent the support slide 307 from falling and colliding with other components, thereby reducing loss.
As shown in fig. 2 and 8, in addition to the above-mentioned mode, as a preferred embodiment, the feeding part includes a flexible vibrator 401 mounted on the top of the support table 1, a hopper 402 and a tray 403 are mounted on the top of the flexible vibrator 401, the hopper 402 has a discharge port extending to the top of the tray 403, chips not placed in chip trays are directly poured into the feeding part in the feeding mechanism 4, the chips are located in the hopper 402 in the feeding part, the chips in the hopper 402 are moved into the tray 403 by the vibration of the flexible vibrator 401, and the chips in the tray 403 can be transported by the transporting mechanism 3.
As shown in fig. 2 and 7, in addition to the above-described embodiment, the detection unit further includes a first support frame 404 mounted on the top of the support table 1, a first CCD camera 405 is mounted on the first support frame 404, the first CCD camera 405 is located directly above the tray 403, the first support frame 404 can support the first CCD camera 405, the first CCD camera 405 can detect the position of the chip in the tray 403, and the conveying mechanism 3 can convey the chip in the tray 403 conveniently.
As shown in fig. 6, in addition to the above-described embodiment, a preferred embodiment is one in which a second support frame 9 is attached to the braider 7, a third CCD camera 8 is provided on the second support frame 9, the third CCD camera 8 can be supported by the second support frame 9, and the chips to be braided in the braider 7 can be detected by the third CCD camera 8 to confirm the state of the chip braiding.
Specifically, the semiconductor chip high-speed test sorting machine is used when in work or use: the chip tray with chips is placed in the tray loading and unloading mechanism 5, the chips which are not placed in the chip tray are poured into the hopper 402, the chips in the hopper 402 fall into the material tray 403 due to the vibration of the flexible vibrator 401, the sliding seat 302 and the vertical plate 303 are driven to move through the electric sliding table 301, when the vacuum suction nozzle 309 reaches the position above the chips, the driving motor 304 drives the supporting sliding seat 307 to descend through the synchronous wheel 305 and the synchronous belt 306, the vacuum suction nozzle 309 is in contact with the chips and adsorbs the chips, the carrying mechanism 3 drives the chips to be above the second CCD camera 6, the chips are tested through the second CCD camera 6, and the tested chips are placed in the braiding machine 7 to be braided or placed back into the chip tray.
The above embodiments are merely illustrative of the present invention and are not to be construed as limiting the invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications and equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and the technical solution of the present invention is covered by the claims of the present invention.
Claims (10)
1. The semiconductor chip high-speed testing sorting machine comprises a supporting table (1) and a protective cover (2) arranged at the top of the supporting table (1), and is characterized in that a tray feeding and discharging mechanism (5), a braiding machine (7) located on one side of the tray feeding and discharging mechanism (5) and a feeding mechanism (4) located on one side, far away from the tray feeding and discharging mechanism (5), of the braiding machine (7) are arranged at the top of the supporting table (1), a carrying mechanism (3) located behind the tray feeding and discharging mechanism (5), the braiding machine (7) and the feeding mechanism (4) is further arranged at the top of the supporting table (1), a second CCD camera (6) located between the feeding mechanism (4) and the braiding machine (7) is arranged at the top of the supporting table (1), the tray feeding and discharging mechanism (5) and the feeding mechanism (4) are used for providing chips for the braiding machine (7), the carrying mechanism (3) is used for carrying the chips in the tray feeding mechanism (5) and the feeding mechanism (4) into the braiding machine (7), and the braiding machine (7) is used for braiding the chips;
the conveying mechanism (3) comprises a driving part arranged at the top of the supporting table (1), a conveying part is arranged on the driving part, and the feeding mechanism (4) comprises a feeding part arranged at the top of the supporting table (1) and a detecting part positioned on one side of the feeding part.
2. The semiconductor chip high-speed test handler according to claim 1, wherein the handling mechanism (3) comprises an electric slide table (301) mounted on top of the support table (1), and the electric slide table (301) is provided with a slide base (302) that moves along the electric slide table (301).
3. The high-speed testing and sorting machine for the semiconductor chips as claimed in claim 2, wherein the conveying part comprises a vertical plate (303) installed on one side of the sliding seat (302), and a plurality of conveying members are arranged on the vertical plate (303).
4. The high-speed test sorting machine for the semiconductor chips as claimed in claim 3, wherein the carrying member comprises a driving motor (304) mounted on the back surface of the vertical plate (303), an output shaft of the driving motor (304) penetrates through the vertical plate (303) and extends to the front surface of the vertical plate (303), synchronizing wheels (305) are arranged on the output shaft of the driving motor (304) and the front surface of the vertical plate (303), and a synchronous belt (306) is in transmission connection between the two synchronizing wheels (305).
5. The high-speed testing and sorting machine for the semiconductor chips as claimed in claim 4, wherein the front surface of the vertical plate (303) is provided with a guide rail at one side of the synchronous belt (306), the guide rail is slidably connected with a supporting slide (307), and the supporting slide (307) is provided with a hollow shaft motor (308).
6. The semiconductor chip high-speed testing and sorting machine according to claim 5, wherein the output shaft of the hollow shaft motor (308) is a hollow output shaft, the top of the output shaft of the hollow shaft motor (308) is connected with a connecting pipe (310), and the bottom end of the output shaft of the hollow shaft motor (308) is connected with a vacuum suction nozzle (309).
7. The semiconductor chip high-speed testing sorter according to claim 6, wherein a tension spring (311) is connected between the top of the support slide (307) and the vertical plate (303).
8. The semiconductor chip high speed test handler according to claim 7, wherein the feeding part comprises a flexible vibrator (401) installed on the top of the support table (1), a hopper (402) and a tray (403) are installed on the top of the flexible vibrator (401), the hopper (402) has a discharge port, and the discharge port extends to the top of the tray (403).
9. The semiconductor chip high-speed test handler according to claim 8, wherein the inspection part comprises a first support frame (404) mounted on top of the support table (1), the first support frame (404) having a first CCD camera (405) mounted thereon, the first CCD camera (405) being located directly above the tray (403).
10. The semiconductor chip high-speed testing and sorting machine according to claim 9, wherein a second support frame (9) is mounted on the braider (7), and a third CCD camera (8) is disposed on the second support frame (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210920155.1A CN115156078A (en) | 2022-08-02 | 2022-08-02 | High-speed testing and sorting machine for semiconductor chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210920155.1A CN115156078A (en) | 2022-08-02 | 2022-08-02 | High-speed testing and sorting machine for semiconductor chips |
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| Publication Number | Publication Date |
|---|---|
| CN115156078A true CN115156078A (en) | 2022-10-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210920155.1A Pending CN115156078A (en) | 2022-08-02 | 2022-08-02 | High-speed testing and sorting machine for semiconductor chips |
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| CN108483038A (en) * | 2018-03-29 | 2018-09-04 | 苏州欣华锐电子有限公司 | Burning chip machine |
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| CN111017286A (en) * | 2019-12-19 | 2020-04-17 | 浙江立讯电子有限公司 | Efficient detection packaging machine |
| CN211507580U (en) * | 2020-03-27 | 2020-09-15 | 苏州微赛智能科技有限公司 | Automatic stripping off device of semiconductor chip |
| CN213109911U (en) * | 2020-08-18 | 2021-05-04 | 天津伍嘉联创科技发展股份有限公司 | Full-automatic braider |
| CN112864061A (en) * | 2021-03-18 | 2021-05-28 | 深圳华瑞智能装备有限公司 | Automatic chip carrier tape packaging equipment with multiple groups of wires |
| CN213932603U (en) * | 2020-10-14 | 2021-08-10 | 东舟技术（深圳）有限公司 | Wafer surface macroscopic detection device |
| CN216709732U (en) * | 2021-12-21 | 2022-06-10 | 广州山锋测控技术有限公司 | Automatic test system for chip components |
| WO2022141167A1 (en) * | 2020-12-30 | 2022-07-07 | 广州奥松电子有限公司 | Automatic chip taping machine |
-
2022
- 2022-08-02 CN CN202210920155.1A patent/CN115156078A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204107868U (en) * | 2014-09-19 | 2015-01-21 | 嘉兴景焱智能装备技术有限公司 | General-purpose chip visual inspection machine |
| CN207705155U (en) * | 2017-12-10 | 2018-08-07 | 杭州长川科技股份有限公司 | Integrated circuit braid fetching device |
| CN108483038A (en) * | 2018-03-29 | 2018-09-04 | 苏州欣华锐电子有限公司 | Burning chip machine |
| CN109018498A (en) * | 2018-07-07 | 2018-12-18 | 深圳市华东兴科技有限公司 | A kind of CCD Full-automatic film sticking machine |
| CN111017286A (en) * | 2019-12-19 | 2020-04-17 | 浙江立讯电子有限公司 | Efficient detection packaging machine |
| CN211507580U (en) * | 2020-03-27 | 2020-09-15 | 苏州微赛智能科技有限公司 | Automatic stripping off device of semiconductor chip |
| CN213109911U (en) * | 2020-08-18 | 2021-05-04 | 天津伍嘉联创科技发展股份有限公司 | Full-automatic braider |
| CN213932603U (en) * | 2020-10-14 | 2021-08-10 | 东舟技术（深圳）有限公司 | Wafer surface macroscopic detection device |
| WO2022141167A1 (en) * | 2020-12-30 | 2022-07-07 | 广州奥松电子有限公司 | Automatic chip taping machine |
| CN112864061A (en) * | 2021-03-18 | 2021-05-28 | 深圳华瑞智能装备有限公司 | Automatic chip carrier tape packaging equipment with multiple groups of wires |
| CN216709732U (en) * | 2021-12-21 | 2022-06-10 | 广州山锋测控技术有限公司 | Automatic test system for chip components |
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