WO2022141167A1 - Automatic chip taping machine - Google Patents

Automatic chip taping machine Download PDF

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Publication number
WO2022141167A1
WO2022141167A1 PCT/CN2020/141306 CN2020141306W WO2022141167A1 WO 2022141167 A1 WO2022141167 A1 WO 2022141167A1 CN 2020141306 W CN2020141306 W CN 2020141306W WO 2022141167 A1 WO2022141167 A1 WO 2022141167A1
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WO
WIPO (PCT)
Prior art keywords
chip
tested
controller
conveying
station
Prior art date
Application number
PCT/CN2020/141306
Other languages
French (fr)
Chinese (zh)
Inventor
张宾
邱国财
陈新准
马鹏飞
何伟生
郑晓银
刘光亮
刘新雅
张运龙
奉贞丽
李宁子
傅凯强
吴瑾鹏
王明锦
傅王勇
李国宁
周海岽
吴凯萍
Original Assignee
广州奥松电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 广州奥松电子有限公司 filed Critical 广州奥松电子有限公司
Priority to PCT/CN2020/141306 priority Critical patent/WO2022141167A1/en
Publication of WO2022141167A1 publication Critical patent/WO2022141167A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/04Sorting according to size
    • B07C5/12Sorting according to size characterised by the application to particular articles, not otherwise provided for

Definitions

  • the invention relates to the technical field of automatic control, and more particularly, to an automatic chip taping machine.
  • Chip automatic taping technology has always been a popular technology, and it is an indispensable process in the process of chip testing and packaging.
  • the existing chip automatic taping machine has a complex structure, and the test accuracy is not high.
  • the present invention aims to overcome the above-mentioned defect of low testing accuracy of the chip automatic tape machine in the prior art, and provides an automatic chip tape machine for improving the detection efficiency of the chip.
  • the technical solution adopted by the present invention is to provide an automatic chip tape machine, which includes a frame and a controller arranged on the frame, the frame is provided with a detection cavity and an installation cavity located below the detection cavity , and also include, all connected with the controller: a vibrating plate, which is located in the detection chamber and used for feeding, the vibrating plate has a feeding port; a first conveying track, which is located in the detection chamber and is used for feeding.
  • a detection module which is arranged in the detection cavity and is located in the transport direction of the first conveying track, and includes a first cylinder, a plurality of rotating suction heads, a plurality of station, the first air cylinder is controlled by the controller and connected to the rotary suction head, the stations are in one-to-one correspondence with the rotary suction head, and one of the stations is connected to the first conveying head
  • the rails are docked, and the work station is provided with a detector controlled by the controller;
  • the second conveying rail is located in the detection cavity and has a braid laid thereon, and the second conveying rail has One of the said stations;
  • a braided conveying plate which is located in the installation cavity and has a braid, and is used to provide the braid to the second conveying rail, and the braided conveying plate is arranged on the second conveying track;
  • Below the material track; the packaging film conveying tray which is located in the detection cavity, has packaging film and is used to provide the packaging film to the second conveying
  • the controller acquires the second humidity value detected by the detection module, and sends the detection module to the detection module.
  • the detected second humidity value is compared with the qualified humidity interval, and when the second humidity value is within the qualified humidity interval, the chip to be tested is qualified; the rotary suction head will detect qualified chips
  • the station is placed on the second conveying rail, and the qualified chip is located on the tape on the second conveying rail. After the second conveying rail transports the tape with the chip, the The packaging film is covered on the tape on which the chip is placed, and the crimping module is crimped on the second conveying rail, so that the tape, the chip to be tested and the packaging film are bonded together to form a product.
  • the take-up carousel rotates to collect the product.
  • the first humidity value detected by the dew point sensor is used as a reference to serve as a reference for the second humidity value detected by the chip to be tested.
  • the chip automatic taping machine further includes a camera controlled by the controller, the camera is arranged on the detection module, and is used to photograph the chip to be tested on the station to monitor the to-be-tested chip The orientation of the front side of the chip.
  • the front side of the chip is monitored by the camera to ensure that the chip is placed correctly.
  • the front image of the chip is preset in the controller; when the controller acquires the image of the chip to be tested captured by the camera, the image of the chip to be tested is compared with the front image, If the similarity between the two is higher than the preset ratio, it is determined that the front side of the chip to be tested is oriented correctly; if the similarity between the two is lower than the preset ratio, it is determined that the front side of the chip to be tested is oriented incorrectly.
  • the work station includes a calibration station, and the camera is used to photograph the chip to be tested on the calibration station;
  • the chip automatic tape machine further includes a second air cylinder, a first receiving box, a first A material blowing port, the second air cylinder is controlled by the controller, the first material blowing port is respectively connected with the second air cylinder and the first material receiving box through pipes, and the first material blowing port is arranged at In the calibration station; when the front side of the chip to be tested is facing the wrong side, the first blowing port sucks the chip to be tested with the front side facing the wrong side to the first receiving box.
  • the chip to be tested is turned over by the turning mechanism to ensure that the front side of the chip to be tested is oriented correctly.
  • the chip automatic tape machine further includes a fan, and the fan is arranged on the side wall of the detection cavity.
  • the fan is ventilated to dissipate heat from the detection cavity.
  • the standard size of the chip is preset in the controller; the inner wall of the first conveying track is provided with an infrared detector connected to the controller to detect the chip to be tested;
  • the controller obtains the actual size of the chip to be tested detected by the infrared detector, then compares the actual size of the chip to be tested with the standard size, and determines if the absolute value of the two is within the preset deviation range
  • the chip to be tested is not damaged; if the absolute values of the two are not within the preset deviation range, it is determined that the chip to be tested is damaged.
  • the actual size of the chip to be tested is detected to determine whether the chip is damaged.
  • it also includes a third air cylinder, a second receiving box, and a second material blowing port, the third air cylinder is controlled by the controller, and the second material blowing port is connected to the second air cylinder,
  • the second receiving box is connected, and the second blowing port is arranged on the inner wall of the first conveying rail; when the controller determines that the chip to be tested is damaged, the second blowing port sucks and determines that it is damaged the chip to be tested to the second receiving box.
  • the receiving box collects damaged chips to be tested, so that the damaged chips to be tested can be recycled.
  • the crimping module includes a fixing seat and a pressing mechanism
  • the fixing seat is arranged on one side of the second conveying track
  • the pressing mechanism is connected with the controller and slides with the fixing seat can be slid up and down along the fixed seat; when crimping, the crimping module is crimped on the second conveying rail through the pressing mechanism.
  • the braid, the chip to be tested and the packaging film are laminated to form a product through the pressing mechanism, which is simple and convenient.
  • the fixing base is provided with a fixing mechanism, a sliding link and a third cylinder
  • the fixing mechanism is located below the third cylinder and is fixed on the fixing base
  • the pressing mechanism is located on the fixing mechanism
  • the sliding connecting rod is connected with the piston rod provided on the third cylinder, and is inserted into the fixing mechanism and connected to the pressing mechanism.
  • the crimping module further includes a return spring, one end of the return spring is connected to the pressing mechanism, and the other end is connected to the fixing mechanism.
  • the present invention is provided with a controller, a vibration plate, a first conveying track, a detection module, a second conveying track, a tape conveying plate, a packaging film conveying plate, The crimping module, the material receiving turntable, and the dew point sensor realize automatic detection, wherein the first humidity value detected by the dew point sensor is used as a reference to be used as a reference for the second humidity value detected by the chip to be tested. Whether the chip to be tested is qualified can be accurately judged, thereby improving the accuracy of chip detection.
  • FIG. 1 is a perspective view of the present invention.
  • Figure 2 is a side view of the present invention.
  • FIG. 3 is a partial schematic view of the present invention.
  • Reference numerals frame, vibrating plate 100, first conveying track 200, detection module 300, first air cylinder 301, rotating suction head 302, second conveying track 400, tape conveying plate 500, packaging film conveying plate 600, crimping module 700, fixing seat 701, pressing mechanism 702, fixing mechanism 703, sliding link 704, return spring 705, receiving turntable 800, dew point sensor 900, camera 110, detection cavity 120, installation cavity 130 , a first display screen 140 , a second display screen 150 , and a lighting lamp 160 .
  • this embodiment provides an automatic chip taping machine, which includes a frame, a controller, a vibration plate 100 , a first conveying rail 200 , a detection The module 300 , the second feeding rail 400 , the tape conveying tray 500 , the packaging film conveying tray 600 , the crimping module 700 , and the receiving turntable 800 .
  • the rack includes a detection cavity 120 and an installation cavity 130 , and the detection cavity 120 is located above the installation cavity 130 .
  • the detection chamber 120 includes a vibration plate 100 , a first conveying rail 200 , a detection module 300 , a second conveying rail 400 , a packaging film conveying plate 600 , a crimping module 700 , and a receiving turntable 800 , all controlled by the controller.
  • a recycling cylinder and a waste bin are also provided on the frame, and the recycling cylinder is controlled by the controller.
  • the vibration plate 100 has a conveying track therein, and the conveying track is used for conveying the chips to be tested.
  • the vibrating plate 100 has a feeding port, and the feeding port is connected with the conveying track.
  • the inner wall of the conveying track is provided with a third material blowing port, and the third material blowing port is connected to the third receiving box and the cylinder through a pipeline.
  • the inner wall of the conveying track also has an infrared detector to detect the chip to be tested; when the controller obtains the actual size of the chip to be tested detected by the infrared detector, the actual size of the chip to be tested is determined. The size is compared with the standard size.
  • the third blowing port sucks the chip to be tested that is determined to be damaged to the third receiving box.
  • the first feeding rail 200 is butted with the feeding port, and a belt is laid on the first feeding rail 200 .
  • the detection module 300 is disposed in the detection cavity 120 and located in the transportation direction of the first conveying rail 200 .
  • the detection module 300 includes a first air cylinder 301, a plurality of rotary suction heads 302, and a plurality of workstations.
  • the first air cylinder 301 is respectively connected to the controller and the rotary suction head 302, and the workstations are connected to the
  • the rotary suction heads 302 are in one-to-one correspondence, and one of the stations is docked with the first conveying rail 200 , and a detector connected to the controller is arranged in the station.
  • the stations include a calibration station and a detection station.
  • the detection station has a recovery port, and the recovery port is respectively connected with the recovery cylinder and the waste box through pipes.
  • a braid is laid on the second material conveying rail 400 , and the second material conveying rail 400 has one of the stations.
  • the packaging film conveying tray 600 has the packaging film and is used for providing the packaging film to the second conveying rail 400
  • the packaging film conveying tray 600 is disposed above the second conveying rail 400 .
  • the crimping module 700 is located above the second conveying rail 400 .
  • the material receiving turntable 800 is located in the conveying direction of the second material conveying rail 400 .
  • the dew point sensor 900 is located in the detection chamber 120 and is used to detect the humidity in the working environment.
  • the installation cavity 130 is provided with a tape conveying plate 500 .
  • the braid conveying plate 500 is wound with the braid, and is used for providing the braid to the second conveying rail 400 , and the braid conveying plate 500 is disposed under the second conveying rail 400 .
  • the working process of the chip automatic tape machine is as follows: the controller obtains the first humidity value detected by the dew point sensor 900, and detects a preset qualified humidity interval according to the first humidity value; the vibration plate 100 After the chip to be tested is transported to the first conveying rail 200 through the feeding port, the first conveying rail 200 transports the chip to be tested to the docking station, and the rotating suction The head 302 adsorbs the chip to be tested in the station, and transports the chip to be tested to other stations for detection by the detector. The controller obtains the second humidity value detected by the detection module 300, and compares the second humidity value detected by the detection module 300 with the qualified humidity range.
  • the chip to be tested is unqualified; if the chip to be tested is detected If qualified, the rotary suction head 302 places the qualified chips on the station on the second feeding track 400, and then detects the qualified chips on the braid on the second feeding track 400, and the first After the second conveying rail 400 transports the braid with chips, the packaging film covers the braid with chips, and the crimping module 700 is crimped on the second conveying rail 400, so that the The tape, the chip to be tested and the packaging film are laminated to form a product, and the receiving turntable 800 rotates to collect the product; if the second humidity value is not within the qualified humidity range, the chip to be tested is If the test is unqualified, the recycling port sucks the unqualified chips to be tested to the waste bin.
  • the front side image of the chip is preset in the controller.
  • the controller acquires the image of the chip to be tested captured by the camera 110, it compares the image of the chip to be tested with the front image, and if the similarity between the two is higher than a preset ratio, it is determined The front side of the chip to be tested is oriented correctly; if the similarity between the two is lower than a preset ratio, it is determined that the front side of the chip to be tested is oriented incorrectly.
  • the camera is used for photographing the chip to be tested on the calibration station.
  • the chip automatic taping machine also includes a second air cylinder, a first receiving box, and a first blowing port, the second air cylinder is controlled by the controller, and the first blowing port is connected to the The second air cylinder and the first receiving box are connected, and the first blowing port is set in the calibration station; when the front side of the chip to be tested is facing wrongly, the first blowing port draws the front side facing The wrong chip to be tested is sent to the first receiving box.
  • the chip automatic tape machine further includes a fan, and the fan is disposed on the side wall of the detection cavity 120 .
  • the standard size of the chip is preset in the controller; the inner wall of the first conveying track 200 is provided with an infrared detector connected to the controller to detect the chip to be tested; when the controller Obtain the actual size of the chip to be tested detected by the infrared detector, then compare the actual size of the chip to be tested with the standard size, and if the absolute values of the two are within a preset deviation range, determine the size of the chip to be tested The chip to be tested is not damaged; if the absolute value of the two is not within the preset deviation range, it is determined that the chip to be tested is damaged.
  • the chip automatic tape machine also includes a third air cylinder, a second receiving box, and a second blowing port, the third air cylinder is controlled by the controller, and the second blowing port is connected to the The third air cylinder and the second receiving box are connected, and the second blowing port is arranged on the inner wall of the first conveying track 200; when the controller determines that the chip to be tested is damaged, the third blowing port is The material port sucks the chip to be tested that is determined to be damaged to the second receiving box.
  • the crimping module 700 includes a fixing seat 701 , a pressing mechanism 702 , and a return spring 705 , and the fixing seat 701 is disposed on one side of the second conveying rail 400 .
  • the pressing mechanism 702 is connected to the controller, and is slidably connected to the fixing base 701 , and can slide up and down along the fixing base 701 .
  • the crimping module 700 is crimped on the second conveying rail 400 through the pressing mechanism 702 .
  • the fixing base 701 is provided with a fixing mechanism 703 , a sliding link 704 , and a movable cylinder.
  • the fixing mechanism 703 is located under the movable cylinder and is fixed on the fixing base 701 , and the pressing mechanism 702 is located at the bottom of the movable cylinder.
  • the sliding connecting rod 704 is connected with the piston rod provided in the movable cylinder, and is inserted into the fixing mechanism 703 and connected to the pressing mechanism 702 .
  • One end of the return spring 705 is connected to the pressing mechanism 702 , and the other end is connected to the fixing mechanism 703 .
  • the chip automatic taping machine further includes a first display screen 140 and a second display screen 150 .
  • the first display screen 140 is disposed on one side of the rack and connected to the controller.
  • the first display screen 140 is used to display the parameters of the chip to be tested and the first humidity value detected by the dew point sensor 900 , and the parameters of the chip to be tested include the actual size of the chip to be tested and the second humidity value.
  • the second display screen is used to display the image of the chip to be tested captured by the camera 110 .

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Abstract

An automatic chip taping machine, comprising a vibration disk (100); a first material conveying track (200); a detection module (300), which is arranged in a detection cavity (120) and located in a conveying direction of the first material conveying track, and comprises a first air cylinder (301), a plurality of rotating suction heads (302) and a plurality of stations, wherein the first air cylinder is connected to a controller and the rotating suction heads, the stations correspond to the rotating suction heads on a one-to-one basis, one station is butt-jointed with the first material conveying track, and the station is internally provided with a detector connected to the controller; a second material conveying track (400); a tape conveying disk (500); a packaging film conveying disk (600); a pressure-bonding module (700); a material receiving rotary table (800); and a dew point sensor (900). A first humidity value measured by means of the dew point sensor is taken as a reference for a second humidity value measured by a chip to be detected. By means of such a setting, whether said chip is up to standards can be accurately determined, thereby improving the accuracy of chip detection.

Description

一种芯片自动编带机A chip automatic tape machine 技术领域technical field
本发明涉及自动控制技术领域,更具体地,涉及一种芯片自动编带机。The invention relates to the technical field of automatic control, and more particularly, to an automatic chip taping machine.
背景技术Background technique
芯片自动编带技术一直是一项热门技术,它是芯片测试封装过程不可缺少的一道工序。现有的芯片自动编带机结构复杂,测试的准确性不高。Chip automatic taping technology has always been a popular technology, and it is an indispensable process in the process of chip testing and packaging. The existing chip automatic taping machine has a complex structure, and the test accuracy is not high.
技术问题technical problem
本发明旨在克服上述现有技术的芯片自动编带机测试准确性不高的缺陷,提供一种芯片自动编带机,用于提高芯片的检测效率。The present invention aims to overcome the above-mentioned defect of low testing accuracy of the chip automatic tape machine in the prior art, and provides an automatic chip tape machine for improving the detection efficiency of the chip.
技术解决方案technical solutions
本发明采取的技术方案是,提供一种芯片自动编带机,包括机架和设置于所述机架上的控制器,所述机架设有检测腔和为位于所述检测腔下方的安装腔,还包括均与所述控制器连接的:震动盘,其位于所述检测腔内并用于供料,所述震动盘具有供料口;第一输料轨道,其位于所述检测腔内并与所述供料口对接;检测模组,其设置于位于所述检测腔内并位于所述第一输料轨道的运输方向上,且其包括第一气缸、多个旋转吸头、多个工位,所述第一气缸由所述控制器控制,并与所述旋转吸头连接,所述工位与所述旋转吸头一一对应,且其中一个工位与所述第一输料轨道对接,所述工位内设有由所述控制器控制的检测器;第二输料轨道,其位于所述检测腔内且其上铺设有编带,所述第二输料轨道上具有一个所述工位;编带传送盘,其位于所述安装腔内且具有编带,并用于提供编带至所述第二输料轨道,所述编带传送盘设置于所述第二输料轨道下方;包装膜传送盘,其位于所述检测腔内,且其具有包装膜并用于提供包装膜至所述第二输料轨道,所述包装膜传送盘设置于所述第二输料轨道上方;压接模组,其位于所述第二输料轨道上方;收料转盘,其位于所述第二输料轨道的运输方向上;露点传感器,其位于所述检测腔并用于检测作业环境中的湿度;其中,所述控制器获取所述露点传感器检测出的第一湿度值,并根据所述该第一湿度值检测预设合格湿度区间; 所述震动盘通过所述供料口输送待测芯片至所述第一输料轨道后,所述第一输料轨道将所述待测芯片运输至与其对接的所述工位,所述旋转吸头吸附所述工位内的待测芯片,并将该待测芯片搬运至其它的工位内,以通过所述检测器进行检测;所述控制器获取所述检测模组检测出第二湿度值,并将所述检测模组检测出第二湿度值与所述合格湿度区间进行比较,当所述第二湿度值位于所述合格湿度区间内时,则所述待测芯片检测合格;所述旋转吸头将检测合格的芯片置于所述第二输料轨道上的工位,则检测合格的芯片位于所述第二输料轨道上的编带,所述第二输料轨道运输置有芯片的编带后,所述包装膜覆盖于置有芯片的编带上,所述压接模组压接于所述第二输料轨道上,以使所述编带、待测芯片和包装膜贴合形成产品,所述收料转盘旋转以收集产品。The technical solution adopted by the present invention is to provide an automatic chip tape machine, which includes a frame and a controller arranged on the frame, the frame is provided with a detection cavity and an installation cavity located below the detection cavity , and also include, all connected with the controller: a vibrating plate, which is located in the detection chamber and used for feeding, the vibrating plate has a feeding port; a first conveying track, which is located in the detection chamber and is used for feeding. docking with the feeding port; a detection module, which is arranged in the detection cavity and is located in the transport direction of the first conveying track, and includes a first cylinder, a plurality of rotating suction heads, a plurality of station, the first air cylinder is controlled by the controller and connected to the rotary suction head, the stations are in one-to-one correspondence with the rotary suction head, and one of the stations is connected to the first conveying head The rails are docked, and the work station is provided with a detector controlled by the controller; the second conveying rail is located in the detection cavity and has a braid laid thereon, and the second conveying rail has One of the said stations; a braided conveying plate, which is located in the installation cavity and has a braid, and is used to provide the braid to the second conveying rail, and the braided conveying plate is arranged on the second conveying track; Below the material track; the packaging film conveying tray, which is located in the detection cavity, has packaging film and is used to provide the packaging film to the second conveying rail, and the packaging film conveying tray is arranged on the second conveying material Above the rail; the crimping module, which is located above the second conveying rail; the receiving turntable, which is located in the conveying direction of the second conveying rail; the dew point sensor, which is located in the detection chamber and used for detection operations humidity in the environment; wherein, the controller obtains the first humidity value detected by the dew point sensor, and detects a preset qualified humidity interval according to the first humidity value; the vibrating plate passes through the feeding port After the chip to be tested is transported to the first conveying rail, the first conveying rail transports the chip to be tested to the docking station, and the rotating suction head absorbs the chips to be tested in the station. test the chip, and transport the chip to be tested to other workstations for detection by the detector; the controller acquires the second humidity value detected by the detection module, and sends the detection module to the detection module. The detected second humidity value is compared with the qualified humidity interval, and when the second humidity value is within the qualified humidity interval, the chip to be tested is qualified; the rotary suction head will detect qualified chips The station is placed on the second conveying rail, and the qualified chip is located on the tape on the second conveying rail. After the second conveying rail transports the tape with the chip, the The packaging film is covered on the tape on which the chip is placed, and the crimping module is crimped on the second conveying rail, so that the tape, the chip to be tested and the packaging film are bonded together to form a product. The take-up carousel rotates to collect the product.
本方案通过所述露点传感器检测出的第一湿度值作为基准,以作为待测芯片检测出的第二湿度值的参照,如此设置,能够准确地判断待测芯片是否合格,从而提高芯片检测的准确性。In this solution, the first humidity value detected by the dew point sensor is used as a reference to serve as a reference for the second humidity value detected by the chip to be tested. With this setting, it is possible to accurately determine whether the chip to be tested is qualified, thereby improving the detection accuracy of the chip. accuracy.
优选地,所述芯片自动编带机还包括由所述控制器控制的相机,所述相机设于所述检测模组上,并用于拍摄工位上的待测芯片,以监控所述待测芯片正面的朝向。本方案通过所述相机对芯片的正面进行监测,以确保芯片摆放正确。Preferably, the chip automatic taping machine further includes a camera controlled by the controller, the camera is arranged on the detection module, and is used to photograph the chip to be tested on the station to monitor the to-be-tested chip The orientation of the front side of the chip. In this solution, the front side of the chip is monitored by the camera to ensure that the chip is placed correctly.
优选地,在所述控制器内预设芯片的正面图像;当所述控制器获取所述相机拍摄到的待测芯片的图像,则将该待测芯片的图像与所述正面图像进行比较,若两者相似度高于预先设定的比例,则判定该待测芯片的正面朝向正确;若两者相似度低于预先设定的比例,则判定该待测芯片的正面朝向错误。Preferably, the front image of the chip is preset in the controller; when the controller acquires the image of the chip to be tested captured by the camera, the image of the chip to be tested is compared with the front image, If the similarity between the two is higher than the preset ratio, it is determined that the front side of the chip to be tested is oriented correctly; if the similarity between the two is lower than the preset ratio, it is determined that the front side of the chip to be tested is oriented incorrectly.
优选地,所述工位包括校正工位,所述相机用于拍摄所述校正工位上的待测芯片;所述芯片自动编带机还包括第二气缸、第一收料箱、第一吹料口,所述第二气缸由所述控制器控制,所述第一吹料口通过管道分别与所述第二气缸、第一收料箱连接,且所述第一吹料口设置于所述校正工位内;当所述待测芯片的正面朝向错误时,所述第一吹料口吸取正面朝向错误的待测芯片至所述第一收料箱。本方案通过所述翻转机构将所述待测芯片进行翻转,确保所述待测芯片的正面朝向正确。Preferably, the work station includes a calibration station, and the camera is used to photograph the chip to be tested on the calibration station; the chip automatic tape machine further includes a second air cylinder, a first receiving box, a first A material blowing port, the second air cylinder is controlled by the controller, the first material blowing port is respectively connected with the second air cylinder and the first material receiving box through pipes, and the first material blowing port is arranged at In the calibration station; when the front side of the chip to be tested is facing the wrong side, the first blowing port sucks the chip to be tested with the front side facing the wrong side to the first receiving box. In this solution, the chip to be tested is turned over by the turning mechanism to ensure that the front side of the chip to be tested is oriented correctly.
优选地,所述芯片自动编带机还包括风扇,所述风扇设置于所述检测腔侧壁。本方案中,所述风扇通风,以对所述检测腔进行散热。Preferably, the chip automatic tape machine further includes a fan, and the fan is arranged on the side wall of the detection cavity. In this solution, the fan is ventilated to dissipate heat from the detection cavity.
优选地,在所述控制器内预设芯片的标准尺寸;所述第一输料轨道内壁设有与所述控制器连接的红外检测器,以对所述待测芯片进行检测;当所述控制器获取所述红外检测器检测出的待测芯片的实际尺寸,则将该待测芯片的实际尺寸与所述标准尺寸进行比较,若两者的绝对值在预设偏差范围内,则判定该待测芯片无损;若两者的绝对值不在预设偏差范围内,则判定该待测芯片损坏。本方案对所述待测芯片的实际尺寸进行检测,以判定所述芯片是否损坏。Preferably, the standard size of the chip is preset in the controller; the inner wall of the first conveying track is provided with an infrared detector connected to the controller to detect the chip to be tested; The controller obtains the actual size of the chip to be tested detected by the infrared detector, then compares the actual size of the chip to be tested with the standard size, and determines if the absolute value of the two is within the preset deviation range The chip to be tested is not damaged; if the absolute values of the two are not within the preset deviation range, it is determined that the chip to be tested is damaged. In this solution, the actual size of the chip to be tested is detected to determine whether the chip is damaged.
优选地,还包括第三气缸、第二收料箱、第二吹料口,所述第三气缸由所述控制器控制,所述第二吹料口通过管道分别与所述第二气缸、第二收料箱连接,且所述第二吹料口设置于所述第一输料轨道内壁;当所述控制器判定所述待测芯片损坏时,所述第二吹料口吸取判定损坏的待测芯片至所述第二收料箱。本方案中,所述收料箱收取损坏的待测芯片,以便损坏的待测芯片回收利用。Preferably, it also includes a third air cylinder, a second receiving box, and a second material blowing port, the third air cylinder is controlled by the controller, and the second material blowing port is connected to the second air cylinder, The second receiving box is connected, and the second blowing port is arranged on the inner wall of the first conveying rail; when the controller determines that the chip to be tested is damaged, the second blowing port sucks and determines that it is damaged the chip to be tested to the second receiving box. In this solution, the receiving box collects damaged chips to be tested, so that the damaged chips to be tested can be recycled.
优选地,所述压接模组包括固定座和压紧机构,所述固定座设置于所述第二输料轨道一侧;所述压紧机构与控制器连接,并与所述固定座滑动连接,能够沿所述固定座上下滑动;压接时,所述压接模组通过所述压紧机构压接于所述第二输料轨道上。本方案中通过所述压紧机构将所述编带、待测芯片和包装膜贴合形成产品,简单方便。Preferably, the crimping module includes a fixing seat and a pressing mechanism, the fixing seat is arranged on one side of the second conveying track; the pressing mechanism is connected with the controller and slides with the fixing seat can be slid up and down along the fixed seat; when crimping, the crimping module is crimped on the second conveying rail through the pressing mechanism. In this solution, the braid, the chip to be tested and the packaging film are laminated to form a product through the pressing mechanism, which is simple and convenient.
优选地,所述固定座设有固定机构、滑动连杆、第三气缸,所述固定机构位于所述第三气缸下方并固定与所述固定座上,所述压紧机构位于所述固定机构下方,所述滑动连杆与所述第三气缸设有的活塞杆连接,并插装于所述固定机构内并连接至所述压紧机构。Preferably, the fixing base is provided with a fixing mechanism, a sliding link and a third cylinder, the fixing mechanism is located below the third cylinder and is fixed on the fixing base, and the pressing mechanism is located on the fixing mechanism Below, the sliding connecting rod is connected with the piston rod provided on the third cylinder, and is inserted into the fixing mechanism and connected to the pressing mechanism.
优选地,所述压接模组还包括回位弹簧,所述回位弹簧一端连接所述压紧机构,另一端连接所述固定机构。Preferably, the crimping module further includes a return spring, one end of the return spring is connected to the pressing mechanism, and the other end is connected to the fixing mechanism.
有益效果beneficial effect
与现有技术相比,本发明的有益效果为:本发明设置了控制器、震动盘、第一输料轨道、检测模组、第二输料轨道、编带传送盘、包装膜传送盘、压接模组、收料转盘、露点传感器实现自动检测,其中,通过所述露点传感器检测出的第一湿度值作为基准,以作为待测芯片检测出的第二湿度值的参照,如此设置,能够准确地判断待测芯片是否合格,从而提高芯片检测的准确性。Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention is provided with a controller, a vibration plate, a first conveying track, a detection module, a second conveying track, a tape conveying plate, a packaging film conveying plate, The crimping module, the material receiving turntable, and the dew point sensor realize automatic detection, wherein the first humidity value detected by the dew point sensor is used as a reference to be used as a reference for the second humidity value detected by the chip to be tested. Whether the chip to be tested is qualified can be accurately judged, thereby improving the accuracy of chip detection.
附图说明Description of drawings
图1为本发明的立体图。FIG. 1 is a perspective view of the present invention.
图2为本发明的侧视图。Figure 2 is a side view of the present invention.
图3为本发明的局部示意图。FIG. 3 is a partial schematic view of the present invention.
附图标记:机架、震动盘100、第一输料轨道200、检测模组300、第一气缸301、旋转吸头302、第二输料轨道400、编带传送盘500、包装膜传送盘600、压接模组700、固定座701、压紧机构702、固定机构703、滑动连杆704、回位弹簧705、收料转盘800、露点传感器900、相机110、检测腔120、安装腔130、第一显示屏140、第二显示屏150、照明灯160。Reference numerals: frame, vibrating plate 100, first conveying track 200, detection module 300, first air cylinder 301, rotating suction head 302, second conveying track 400, tape conveying plate 500, packaging film conveying plate 600, crimping module 700, fixing seat 701, pressing mechanism 702, fixing mechanism 703, sliding link 704, return spring 705, receiving turntable 800, dew point sensor 900, camera 110, detection cavity 120, installation cavity 130 , a first display screen 140 , a second display screen 150 , and a lighting lamp 160 .
本发明的实施方式Embodiments of the present invention
本发明附图仅用于示例性说明,不能理解为对本发明的限制。为了更好说明以下实施例,附图某些部件会有省略、放大或缩小,并不代表实际产品的尺寸;对于本领域技术人员来说,附图中某些公知结构及其说明可能省略是可以理解的。The accompanying drawings of the present invention are only used for exemplary illustration, and should not be construed as limiting the present invention. In order to better illustrate the following embodiments, some parts of the drawings may be omitted, enlarged or reduced, which do not represent the size of the actual product; for those skilled in the art, some well-known structures and their descriptions in the drawings may be omitted. understandable.
如图1、图2、图3所示,本实施例提供一种芯片自动编带机,所述芯片自动编带机包括机架、控制器、震动盘100、第一输料轨道200、检测模组300、第二输料轨道400、编带传送盘500、包装膜传送盘600、压接模组700、收料转盘800。As shown in FIG. 1 , FIG. 2 , and FIG. 3 , this embodiment provides an automatic chip taping machine, which includes a frame, a controller, a vibration plate 100 , a first conveying rail 200 , a detection The module 300 , the second feeding rail 400 , the tape conveying tray 500 , the packaging film conveying tray 600 , the crimping module 700 , and the receiving turntable 800 .
其中,所述机架包括检测腔120和安装腔130,检测腔120位于安装腔130上方。检测腔120内包括均由控制器控制的震动盘100、第一输料轨道200、检测模组300、第二输料轨道400、包装膜传送盘600、压接模组700、收料转盘800。具体地,所述机架上还设有回收气缸、废料箱,所述回收气缸由所述控制器控制。Wherein, the rack includes a detection cavity 120 and an installation cavity 130 , and the detection cavity 120 is located above the installation cavity 130 . The detection chamber 120 includes a vibration plate 100 , a first conveying rail 200 , a detection module 300 , a second conveying rail 400 , a packaging film conveying plate 600 , a crimping module 700 , and a receiving turntable 800 , all controlled by the controller. . Specifically, a recycling cylinder and a waste bin are also provided on the frame, and the recycling cylinder is controlled by the controller.
具体地,震动盘100内具有传送轨道,所述传送轨道用于输送待测芯片。震动盘100具有供料口,所述供料口与所述传送轨道连接。所述传送轨道内壁设有第三吹料口,所述第三吹料口通过管道连接至于第三收料箱和气缸。所述传送轨道内壁还具有红外检测器,以对所述待测芯片进行检测;当所述控制器获取所述红外检测器检测出的待测芯片的实际尺寸,则将该待测芯片的实际尺寸与所述标准尺寸进行比较,若两者的绝对值在预设偏差范围内,则判定该待测芯片无损;若两者的绝对值不在预设偏差范围内,则判定该待测芯片损坏。若判定该待测芯片损坏,所述第三吹料口吸取判定损坏的待测芯片至所述第三收料箱。Specifically, the vibration plate 100 has a conveying track therein, and the conveying track is used for conveying the chips to be tested. The vibrating plate 100 has a feeding port, and the feeding port is connected with the conveying track. The inner wall of the conveying track is provided with a third material blowing port, and the third material blowing port is connected to the third receiving box and the cylinder through a pipeline. The inner wall of the conveying track also has an infrared detector to detect the chip to be tested; when the controller obtains the actual size of the chip to be tested detected by the infrared detector, the actual size of the chip to be tested is determined. The size is compared with the standard size. If the absolute value of the two is within the preset deviation range, it is determined that the chip to be tested is damaged; if the absolute value of the two is not within the preset deviation range, it is determined that the chip to be tested is damaged. . If it is determined that the chip to be tested is damaged, the third blowing port sucks the chip to be tested that is determined to be damaged to the third receiving box.
具体地,第一输料轨道200与所述供料口对接且第一输料轨道200上铺设有皮带。具体地,检测模组300设置于所述检测腔120内并位于所述第一输料轨道200的运输方向上。检测模组300包括第一气缸301、多个旋转吸头302、多个工位,所述第一气缸301分别与所述控制器和所述旋转吸头302连接,所述工位与所述旋转吸头302一一对应,且其中一个工位与所述第一输料轨道200对接,所述工位内设有与所述控制器连接的检测器。具体地,旋转吸头302设有12个,但不限于12个,旋转吸头302环绕第一气缸301均匀分布。所述工位包括校正工位和检测工位。所述检测工位具有回收口,所述回收口通过管道分别与所述回收气缸、废料箱连接。Specifically, the first feeding rail 200 is butted with the feeding port, and a belt is laid on the first feeding rail 200 . Specifically, the detection module 300 is disposed in the detection cavity 120 and located in the transportation direction of the first conveying rail 200 . The detection module 300 includes a first air cylinder 301, a plurality of rotary suction heads 302, and a plurality of workstations. The first air cylinder 301 is respectively connected to the controller and the rotary suction head 302, and the workstations are connected to the The rotary suction heads 302 are in one-to-one correspondence, and one of the stations is docked with the first conveying rail 200 , and a detector connected to the controller is arranged in the station. Specifically, there are 12 rotating suction heads 302 , but not limited to 12, and the rotating suction heads 302 are evenly distributed around the first cylinder 301 . The stations include a calibration station and a detection station. The detection station has a recovery port, and the recovery port is respectively connected with the recovery cylinder and the waste box through pipes.
具体地,第二输料轨道400其上铺设有编带,所述第二输料轨道400上具有一个所述工位。具体地,包装膜传送盘600具有包装膜并用于提供包装膜至第二输料轨道400,包装膜传送盘600设置于所述第二输料轨道400上方。具体地,压接模组700位于第二输料轨道400上方。具体地,收料转盘800位于所述第二输料轨道400的运输方向上。具体地,露点传感器900位于所述检测腔120并用于检测作业环境中的湿度。Specifically, a braid is laid on the second material conveying rail 400 , and the second material conveying rail 400 has one of the stations. Specifically, the packaging film conveying tray 600 has the packaging film and is used for providing the packaging film to the second conveying rail 400 , and the packaging film conveying tray 600 is disposed above the second conveying rail 400 . Specifically, the crimping module 700 is located above the second conveying rail 400 . Specifically, the material receiving turntable 800 is located in the conveying direction of the second material conveying rail 400 . Specifically, the dew point sensor 900 is located in the detection chamber 120 and is used to detect the humidity in the working environment.
其中,安装腔130内设有编带传送盘500。编带传送盘500缠绕有编带,并用于提供编带至所述第二输料轨道400,所述编带传送盘500设置于所述第二输料轨道400下方。Wherein, the installation cavity 130 is provided with a tape conveying plate 500 . The braid conveying plate 500 is wound with the braid, and is used for providing the braid to the second conveying rail 400 , and the braid conveying plate 500 is disposed under the second conveying rail 400 .
所述芯片自动编带机的工作过程为:所述控制器获取所述露点传感器900检测出的第一湿度值,并根据所述该第一湿度值检测预设合格湿度区间;所述震动盘100通过所述供料口输送待测芯片至所述第一输料轨道200后,所述第一输料轨道200将所述待测芯片运输至与其对接的所述工位,所述旋转吸头302吸附所述工位内的待测芯片,并将该待测芯片搬运至其它的工位内,以通过所述检测器进行检测。所述控制器获取所述检测模组300检测出第二湿度值,并将所述检测模组300检测出第二湿度值与所述合格湿度区间进行比较,当所述第二湿度值位于所述合格湿度区间内时,则所述待测芯片检测合格,当所述第二湿度值不位于所述合格湿度区间内时,则所述待测芯片检测不合格;若所述待测芯片检测合格,所述旋转吸头302将检测合格的芯片置于所述第二输料轨道400上的工位,则检测合格的芯片位于所述第二输料轨道400上的编带,所述第二输料轨道400运输置有芯片的编带后,所述包装膜覆盖于置有芯片的编带上,所述压接模组700压接于所述第二输料轨道400上,以使所述编带、待测芯片和包装膜贴合形成产品,所述收料转盘800旋转以收集产品;若所述第二湿度值不位于所述合格湿度区间内时,则所述待测芯片检测不合格,则所述回收口吸取检测不合格的待测芯片至所述废料箱。The working process of the chip automatic tape machine is as follows: the controller obtains the first humidity value detected by the dew point sensor 900, and detects a preset qualified humidity interval according to the first humidity value; the vibration plate 100 After the chip to be tested is transported to the first conveying rail 200 through the feeding port, the first conveying rail 200 transports the chip to be tested to the docking station, and the rotating suction The head 302 adsorbs the chip to be tested in the station, and transports the chip to be tested to other stations for detection by the detector. The controller obtains the second humidity value detected by the detection module 300, and compares the second humidity value detected by the detection module 300 with the qualified humidity range. When the second humidity value is not within the qualified humidity interval, the chip to be tested is unqualified; if the chip to be tested is detected If qualified, the rotary suction head 302 places the qualified chips on the station on the second feeding track 400, and then detects the qualified chips on the braid on the second feeding track 400, and the first After the second conveying rail 400 transports the braid with chips, the packaging film covers the braid with chips, and the crimping module 700 is crimped on the second conveying rail 400, so that the The tape, the chip to be tested and the packaging film are laminated to form a product, and the receiving turntable 800 rotates to collect the product; if the second humidity value is not within the qualified humidity range, the chip to be tested is If the test is unqualified, the recycling port sucks the unqualified chips to be tested to the waste bin.
在所述控制器内预设芯片的正面图像。当所述控制器获取所述相机110拍摄到的待测芯片的图像,则将该待测芯片的图像与所述正面图像进行比较,若两者相似度高于预先设定的比例,则判定该待测芯片的正面朝向正确;若两者相似度低于预先设定的比例,则判定该待测芯片的正面朝向错误。The front side image of the chip is preset in the controller. When the controller acquires the image of the chip to be tested captured by the camera 110, it compares the image of the chip to be tested with the front image, and if the similarity between the two is higher than a preset ratio, it is determined The front side of the chip to be tested is oriented correctly; if the similarity between the two is lower than a preset ratio, it is determined that the front side of the chip to be tested is oriented incorrectly.
所述相机用于拍摄所述校正工位上的待测芯片。所述芯片自动编带机还包括第二气缸、第一收料箱、第一吹料口,所述第二气缸由所述控制器控制,所述第一吹料口通过管道分别与所述第二气缸、第一收料箱连接,且所述第一吹料口设置于所述校正工位内;当所述待测芯片的正面朝向错误时,所述第一吹料口吸取正面朝向错误的待测芯片至所述第一收料箱。The camera is used for photographing the chip to be tested on the calibration station. The chip automatic taping machine also includes a second air cylinder, a first receiving box, and a first blowing port, the second air cylinder is controlled by the controller, and the first blowing port is connected to the The second air cylinder and the first receiving box are connected, and the first blowing port is set in the calibration station; when the front side of the chip to be tested is facing wrongly, the first blowing port draws the front side facing The wrong chip to be tested is sent to the first receiving box.
其中,所述芯片自动编带机还包括风扇,所述风扇设置于所述检测腔120侧壁。Wherein, the chip automatic tape machine further includes a fan, and the fan is disposed on the side wall of the detection cavity 120 .
在所述控制器内预设芯片的标准尺寸;所述第一输料轨道200内壁设有与所述控制器连接的红外检测器,以对所述待测芯片进行检测;当所述控制器获取所述红外检测器检测出的待测芯片的实际尺寸,则将该待测芯片的实际尺寸与所述标准尺寸进行比较,若两者的绝对值在预设偏差范围内,则判定该待测芯片无损;若两者的绝对值不在预设偏差范围内,则判定该待测芯片损坏。The standard size of the chip is preset in the controller; the inner wall of the first conveying track 200 is provided with an infrared detector connected to the controller to detect the chip to be tested; when the controller Obtain the actual size of the chip to be tested detected by the infrared detector, then compare the actual size of the chip to be tested with the standard size, and if the absolute values of the two are within a preset deviation range, determine the size of the chip to be tested The chip to be tested is not damaged; if the absolute value of the two is not within the preset deviation range, it is determined that the chip to be tested is damaged.
所述芯片自动编带机还包括第三气缸、第二收料箱、第二吹料口,所述第三气缸由所述控制器控制,所述第二吹料口通过管道分别与所述第三气缸、第二收料箱连接,且所述第二吹料口设置于所述第一输料轨道200内壁;当所述控制器判定所述待测芯片损坏时,所述第三吹料口吸取判定损坏的待测芯片至所述第二收料箱。The chip automatic tape machine also includes a third air cylinder, a second receiving box, and a second blowing port, the third air cylinder is controlled by the controller, and the second blowing port is connected to the The third air cylinder and the second receiving box are connected, and the second blowing port is arranged on the inner wall of the first conveying track 200; when the controller determines that the chip to be tested is damaged, the third blowing port is The material port sucks the chip to be tested that is determined to be damaged to the second receiving box.
具体地,所述压接模组700包括固定座701、压紧机构702、回位弹簧705,所述固定座701设置于所述第二输料轨道400一侧。所述压紧机构702与控制器连接,并与所述固定座701滑动连接,能够沿所述固定座701上下滑动。具体地,压接时,所述压接模组700通过所述压紧机构702压接于所述第二输料轨道400上。具体地,所述固定座701设有固定机构703、滑动连杆704、活动气缸,所述固定机构703位于所述活动气缸下方并固定于所述固定座701上,所述压紧机构702位于所述固定机构703下方,所述滑动连杆704与所述活动气缸设有的活塞杆连接,并插装于所述固定机构703内并连接至所述压紧机构702。所述回位弹簧705一端连接所述压紧机构702,另一端连接所述固定机构703。Specifically, the crimping module 700 includes a fixing seat 701 , a pressing mechanism 702 , and a return spring 705 , and the fixing seat 701 is disposed on one side of the second conveying rail 400 . The pressing mechanism 702 is connected to the controller, and is slidably connected to the fixing base 701 , and can slide up and down along the fixing base 701 . Specifically, during crimping, the crimping module 700 is crimped on the second conveying rail 400 through the pressing mechanism 702 . Specifically, the fixing base 701 is provided with a fixing mechanism 703 , a sliding link 704 , and a movable cylinder. The fixing mechanism 703 is located under the movable cylinder and is fixed on the fixing base 701 , and the pressing mechanism 702 is located at the bottom of the movable cylinder. Below the fixing mechanism 703 , the sliding connecting rod 704 is connected with the piston rod provided in the movable cylinder, and is inserted into the fixing mechanism 703 and connected to the pressing mechanism 702 . One end of the return spring 705 is connected to the pressing mechanism 702 , and the other end is connected to the fixing mechanism 703 .
所述芯片自动编带机还包括第一显示屏140、第二显示屏150。第一显示屏140设置于机架一侧,并与所述控制器连接。第一显示屏140用于显示待测芯片的参数和露点传感器900检测出的第一湿度值,待测芯片的参数包括待测芯片的实际尺寸和第二湿度值。第二显示屏用于显示相机110拍摄的待测芯片的图像。The chip automatic taping machine further includes a first display screen 140 and a second display screen 150 . The first display screen 140 is disposed on one side of the rack and connected to the controller. The first display screen 140 is used to display the parameters of the chip to be tested and the first humidity value detected by the dew point sensor 900 , and the parameters of the chip to be tested include the actual size of the chip to be tested and the second humidity value. The second display screen is used to display the image of the chip to be tested captured by the camera 110 .
显然,本发明的上述实施例仅仅是为清楚地说明本发明技术方案所作的举例,而并非是对本发明的具体实施方式的限定。凡在本发明权利要求书的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明权利要求的保护范围之内。Obviously, the above-mentioned embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the specific embodiments of the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principle of the claims of the present invention shall be included within the protection scope of the claims of the present invention.

Claims (10)

  1. 一种芯片自动编带机,包括机架和设置于所述机架上的控制器,其特征在于,所述机架设有检测腔(120)和位于所述检测腔(120)下方的安装腔(130),还包括均由所述控制器控制的:An automatic chip taping machine, comprising a frame and a controller arranged on the frame, characterized in that the frame is provided with a detection cavity (120) and an installation cavity located below the detection cavity (120) (130), further comprising: all controlled by the controller:
    震动盘(100),其位于所述检测腔(120)内并用于供料,所述震动盘(100)具有供料口;a vibration plate (100), which is located in the detection cavity (120) and used for material supply, the vibration plate (100) has a supply port;
    第一输料轨道(200),其位于所述检测腔(120)内并与所述供料口对接;a first conveying rail (200), which is located in the detection cavity (120) and is butted with the feeding port;
    检测模组(300),其设置于所述检测腔(120)内并位于所述第一输料轨道(200)的运输方向上,且其包括第一气缸(301)、多个旋转吸头(302)、多个工位,所述第一气缸(301)由所述控制器控制,并与所述旋转吸头(302)连接,所述工位与所述旋转吸头(302)一一对应,且其中一个工位与所述第一输料轨道(200)对接,所述工位内设有与所述控制器连接的检测器;A detection module (300), which is arranged in the detection cavity (120) and is located in the transport direction of the first conveying track (200), and includes a first cylinder (301), a plurality of rotating suction heads (302), a plurality of workstations, the first air cylinder (301) is controlled by the controller, and is connected with the rotary suction head (302), and the workstations are connected to the rotary suction head (302). One of them corresponds to one another, and one of the stations is docked with the first conveying rail (200), and a detector connected to the controller is arranged in the station;
    第二输料轨道(400),其位于所述检测腔(120)内且其上铺设有编带,所述第二输料轨道(400)上具有一个所述工位;A second conveying rail (400), which is located in the detection cavity (120) and has braids laid thereon, and has one of the workstations on the second conveying rail (400);
    编带传送盘(500),其位于所述安装腔(130)内且具有编带,并用于提供编带至所述第二输料轨道(400),所述编带传送盘(500)设置于所述第二输料轨道(400)下方;A tape conveying plate (500), which is located in the installation cavity (130) and has a tape, and is used for providing the tape to the second conveying rail (400), the tape conveying plate (500) is provided with below the second conveying track (400);
    包装膜传送盘(600),其位于所述检测腔(120)内,且其具有包装膜并用于提供包装膜至所述第二输料轨道(400),所述包装膜传送盘(600)设置于所述第二输料轨道(400)上方;A packaging film conveying tray (600), which is located in the detection cavity (120), has packaging films and is used for supplying the packaging films to the second conveying rail (400), the packaging film conveying tray (600) arranged above the second conveying rail (400);
    压接模组(700),其位于所述第二输料轨道(400)上方;a crimping module (700), which is located above the second conveying rail (400);
    收料转盘(800),其位于所述第二输料轨道(400)的运输方向上;a material receiving carousel (800), which is located in the transport direction of the second material conveying track (400);
    露点传感器(900),其位于所述检测腔(120)并用于检测作业环境中的湿度;a dew point sensor (900), which is located in the detection chamber (120) and used to detect the humidity in the working environment;
    其中,所述控制器获取所述露点传感器(900)检测出的第一湿度值,并根据所述该第一湿度值检测预设合格湿度区间;Wherein, the controller acquires the first humidity value detected by the dew point sensor (900), and detects a preset qualified humidity interval according to the first humidity value;
     所述震动盘(100)通过所述供料口输送待测芯片至所述第一输料轨道(200)后,所述第一输料轨道(200)将所述待测芯片运输至与其对接的所述工位,所述旋转吸头(302)吸附所述工位内的待测芯片,并将该待测芯片搬运至其它的工位内,以通过所述检测器进行检测;After the vibrating plate (100) conveys the chip to be tested to the first conveying rail (200) through the feeding port, the first conveying rail (200) transports the chip to be tested to the docking with it. the said station, the rotary suction head (302) adsorbs the chip to be tested in the station, and transports the chip to be tested to other stations, so as to be detected by the detector;
    所述控制器获取所述检测模组(300)检测出第二湿度值,并将所述检测模组(300)检测出第二湿度值与所述合格湿度区间进行比较,当所述第二湿度值位于所述合格湿度区间内时,则所述待测芯片检测合格;The controller obtains the second humidity value detected by the detection module (300), and compares the second humidity value detected by the detection module (300) with the qualified humidity interval, when the second humidity value is detected by the detection module (300) When the humidity value is within the qualified humidity range, the chip to be tested is qualified;
    所述旋转吸头(302)将检测合格的芯片置于所述第二输料轨道(400)上的工位,则检测合格的芯片位于所述第二输料轨道(400)上的编带,所述第二输料轨道(400)运输置有芯片的编带后,所述包装膜覆盖于置有芯片的编带上,所述压接模组(700)压接于所述第二输料轨道(400)上,以使所述编带、待测芯片和包装膜贴合形成产品,所述收料转盘(800)旋转以收集产品。The rotary suction head (302) places the qualified chips on the second conveying track (400) at the station, and then the qualified chips are located on the tape on the second conveying track (400). , after the second conveying rail (400) transports the braid with chips, the packaging film covers the braid with chips, and the crimping module (700) is crimped on the second On the conveying track (400), so that the braid, the chip to be tested and the packaging film are laminated to form a product, and the receiving turntable (800) rotates to collect the product.
  2. 根据权利要求1所述的一种芯片自动编带机,其特征在于,还包括由控制器控制的相机(110),所述相机(110)设于所述检测模组(300)上,并用于拍摄工位上的待测芯片,以监控所述待测芯片正面的朝向。The automatic chip taping machine according to claim 1, further comprising a camera (110) controlled by a controller, the camera (110) being arranged on the detection module (300), and using The chip to be tested on the photographing station is used to monitor the orientation of the front side of the chip to be tested.
  3. 根据权利要求2所述的一种芯片自动编带机,其特征在于,在所述控制器内预设芯片的正面图像;当所述控制器获取所述相机(110)拍摄到的待测芯片的图像,则将该待测芯片的图像与所述正面图像进行比较,若两者相似度高于预先设定的比例,则判定该待测芯片的正面朝向正确;若两者相似度低于预先设定的比例,则判定该待测芯片的正面朝向错误。The automatic chip taping machine according to claim 2, characterized in that a front image of the chip is preset in the controller; when the controller acquires the chip to be tested captured by the camera (110) If the image of the chip to be tested is compared with the front image, if the similarity between the two is higher than the preset ratio, it is determined that the front of the chip to be tested is facing correctly; if the similarity is lower than If the preset ratio is used, it is determined that the front side of the chip to be tested is oriented incorrectly.
  4. 根据权利要求3所述的一种芯片自动编带机,其特征在于,所述工位包括校正工位,所述相机(110)用于拍摄所述校正工位上的待测芯片;所述芯片自动编带机还包括第二气缸、第一收料箱、第一吹料口,所述第二气缸由所述控制器控制,所述第一吹料口通过管道分别与所述第二气缸、第一收料箱连接,且所述第一吹料口设置于所述校正工位内;The automatic chip taping machine according to claim 3, characterized in that the station includes a calibration station, and the camera (110) is used to photograph the chip to be tested on the calibration station; the The chip automatic taping machine also includes a second air cylinder, a first material receiving box, and a first material blowing port, the second air cylinder is controlled by the controller, and the first material blowing port is connected to the second material blowing port respectively through pipes. The cylinder and the first receiving box are connected, and the first blowing port is arranged in the calibration station;
    当所述待测芯片的正面朝向错误时,所述第一吹料口吸取正面朝向错误的待测芯片至所述第一收料箱。When the front side of the chip to be tested is facing wrongly, the first blowing port sucks the chip to be tested with the front side facing the wrong side to the first receiving box.
  5. 根据权利要求1所述的一种芯片自动编带机,其特征在于,还包括风扇,所述风扇设置于所述检测腔(120)侧壁。The chip automatic taping machine according to claim 1, further comprising a fan, wherein the fan is arranged on the side wall of the detection cavity (120).
  6. 根据权利要求1所述的一种芯片自动编带机,其特征在于,在所述控制器内预设芯片的标准尺寸;所述第一输料轨道(200)内壁设有由控制器控制的红外检测器,以对所述待测芯片进行检测;The chip automatic tape machine according to claim 1, wherein the standard size of the chip is preset in the controller; the inner wall of the first conveying track (200) is provided with a controller controlled an infrared detector to detect the chip to be tested;
    当所述控制器获取所述红外检测器检测出的待测芯片的实际尺寸,则将该待测芯片的实际尺寸与所述标准尺寸进行比较,若两者的绝对值在预设偏差范围内,则判定该待测芯片无损;若两者的绝对值不在预设偏差范围内,则判定该待测芯片损坏。When the controller obtains the actual size of the chip to be tested detected by the infrared detector, it compares the actual size of the chip to be tested with the standard size, and if the absolute values of the two are within a preset deviation range , it is determined that the chip to be tested is damaged; if the absolute values of the two are not within the preset deviation range, it is determined that the chip to be tested is damaged.
  7. 根据权利要求6所述的一种芯片自动编带机,其特征在于,还包括第三气缸、第二收料箱、第二吹料口,所述第三气缸由所述控制器控制,所述第二吹料口通过管道分别与所述第三气缸、第二收料箱连接,且所述第二吹料口设置于所述第一输料轨道(200)内壁;The chip automatic taping machine according to claim 6, further comprising a third air cylinder, a second receiving box, and a second blowing port, wherein the third air cylinder is controlled by the controller, and the The second material blowing port is respectively connected with the third cylinder and the second receiving box through pipes, and the second material blowing port is arranged on the inner wall of the first material conveying track (200);
    当所述控制器判定所述待测芯片损坏时,所述第三吹料口吸取判定损坏的待测芯片至所述第二收料箱。When the controller determines that the chip to be tested is damaged, the third blowing port sucks the chip to be tested that is determined to be damaged to the second receiving box.
  8. 根据权利要求1所述的一种芯片自动编带机,其特征在于,所述压接模组(700)包括固定座(701)和压紧机构(702),所述固定座(701)设置于所述第二输料轨道(400)一侧;所述压紧机构(702)由控制器控制,并与所述固定座(701)滑动连接,能够沿所述固定座(701)上下滑动;The automatic chip taping machine according to claim 1, wherein the crimping module (700) comprises a fixing seat (701) and a pressing mechanism (702), and the fixing seat (701) is provided with on the side of the second feeding track (400); the pressing mechanism (702) is controlled by the controller, and is slidably connected with the fixing seat (701), and can slide up and down along the fixing seat (701). ;
    压接时,所述压接模组(700)通过所述压紧机构(702)压接于所述第二输料轨道(400)上。During crimping, the crimping module (700) is crimped on the second conveying rail (400) through the pressing mechanism (702).
  9. 根据权利要求8所述的一种芯片自动编带机,其特征在于,所述固定座(701)设有固定机构(703)、滑动连杆(704)、第三气缸(705),所述固定机构(703)位于所述活动气缸(705)下方并固定于所述固定座(701)上,所述压紧机构(702)位于所述固定机构(703)下方,所述滑动连杆(704)与所述活动气缸(705)设有的活塞杆连接,并插装于所述固定机构(703)内以连接至所述压紧机构(702)。The chip automatic taping machine according to claim 8, characterized in that, the fixing base (701) is provided with a fixing mechanism (703), a sliding link (704), and a third air cylinder (705), and the The fixing mechanism (703) is located under the movable cylinder (705) and is fixed on the fixing seat (701), the pressing mechanism (702) is located under the fixing mechanism (703), and the sliding link ( 704) is connected to the piston rod provided in the movable cylinder (705), and is inserted into the fixing mechanism (703) to be connected to the pressing mechanism (702).
  10. 根据权利要求9所述的一种芯片自动编带机,其特征在于,所述压接模组(700)还包括回位弹簧(705),所述回位弹簧(705)一端连接所述压紧机构(702),另一端连接所述固定机构(703)。The chip automatic taping machine according to claim 9, wherein the crimping module (700) further comprises a return spring (705), and one end of the return spring (705) is connected to the pressure The tightening mechanism (702) is connected to the other end of the fixing mechanism (703).
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CN210942447U (en) * 2019-11-11 2020-07-07 芯创(湖北)半导体科技有限公司 Automatic screening device of diode braider

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