CN211275530U - Test classification equipment - Google Patents
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- CN211275530U CN211275530U CN201921884209.3U CN201921884209U CN211275530U CN 211275530 U CN211275530 U CN 211275530U CN 201921884209 U CN201921884209 U CN 201921884209U CN 211275530 U CN211275530 U CN 211275530U
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- 238000012360 testing method Methods 0.000 title claims abstract description 116
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- 239000004065 semiconductor Substances 0.000 claims abstract description 128
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- 239000000463 material Substances 0.000 claims abstract description 32
- 238000007789 sealing Methods 0.000 claims description 24
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Abstract
The application provides a test classification device, which comprises a feeding mechanism, a first rotary table, a first positioning mechanism, an image detection mechanism, a first material receiving mechanism, a rotating mechanism, a second positioning mechanism, a second rotary table, a third positioning mechanism, a test mechanism and a second material receiving mechanism; the first rotary disc is provided with a plurality of first suction nozzles along the circumferential direction, and the feeding mechanism, the first positioning mechanism, the image detection mechanism, the first material receiving mechanism, the rotating mechanism, the second positioning mechanism and the second rotary disc are distributed along the circumferential direction of the first rotary disc; a plurality of second suction nozzles are installed along the circumferential direction of the second rotary disc, and the first rotary disc, the third positioning mechanism, the testing mechanism and the second material receiving mechanism are distributed along the circumferential direction of the second rotary disc. The orientation of the semiconductor product in the test classification process can be controlled more easily, and the accuracy and efficiency of test classification are improved.
Description
Technical Field
The application belongs to the technical field of semiconductor testing, and particularly relates to a test classification device.
Background
In the production process of semiconductor products, the semiconductor products such as micro LEDs and packaged chips must be classified according to different optical parameters or electrical parameters, and classified and collected according to the classification results. The main key technology of the classification of the semiconductor products is testing of the semiconductor products, along with the structure of the semiconductor products is more and more fine, the precision testing difficulty is increased, the orientation of the miniature semiconductor products after the equipment is loaded is not easy to control, and therefore the accuracy and the efficiency of the classification of the testing are influenced.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a test sorting device to solve the technical problems that the orientation of a miniature semiconductor product after the test sorting device is loaded is not easy to control, and the accuracy and the efficiency of test sorting are influenced.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: a test sorting apparatus comprising:
a first turntable, wherein a plurality of first suction nozzles for sucking semiconductor products are arranged on the first turntable along the circumferential direction of the first turntable;
a feeding mechanism for conveying semiconductor products to the first rotary disc;
the first positioning mechanism is used for carrying out positioning correction on the semiconductor product adsorbed by the first suction nozzle;
the image detection mechanism is used for carrying out image detection on the semiconductor product adsorbed by the first suction nozzle;
the first material receiving mechanism is used for collecting defective products detected by the image detection mechanism;
a rotating mechanism for rotating the semiconductor product sucked by the first suction nozzle;
the second positioning mechanism is used for positioning and correcting the semiconductor product adsorbed by the first suction nozzle;
a second turntable, which is provided with a plurality of second suction nozzles for sucking semiconductor products along the circumferential direction;
the third positioning mechanism is used for positioning and correcting the semiconductor product adsorbed by the second suction nozzle;
the testing mechanism is used for testing the semiconductor product adsorbed by the second suction nozzle; and
the second material receiving mechanism is used for classifying and collecting the tested semiconductor products;
the feeding mechanism, the first positioning mechanism, the image detection mechanism, the first material receiving mechanism, the rotating mechanism, the second positioning mechanism and the second turntable are distributed along the circumferential direction of the first turntable;
the first rotary disc, the third positioning mechanism, the testing mechanism and the second material receiving mechanism are distributed along the circumferential direction of the second rotary disc.
Furthermore, the first positioning mechanism, the second positioning mechanism and the third positioning mechanism respectively comprise a positioning disc and a plurality of positioning claws which are respectively hinged on the positioning disc, and the surface of the positioning disc and the free ends of the plurality of positioning claws enclose to form a positioning groove matched with the shape of the semiconductor product.
Further, the rotating mechanism comprises a rotating disc, and the disc surface of the rotating disc is provided with an accommodating groove matched with the appearance of the semiconductor product.
Further, the optical fiber detection device is positioned between the first rotating disc and the third positioning mechanism.
Further, the first suction nozzle is connected with an air cylinder used for driving the first suction nozzle to move up and down relative to the first rotary disc, and a spring is connected between the air cylinder and the first suction nozzle.
Further, the second material receiving mechanism comprises a plurality of material receiving boxes arranged along the circumferential direction of the second rotating disc.
Furthermore, the testing mechanism comprises a testing plate with a mounting surface, an elastic sealing ring fixed on the mounting surface of the testing plate, a probe fixed on the mounting surface of the testing plate and a driving part used for driving the testing plate to do reciprocating linear motion so that the elastic sealing ring and the probe are close to and far away from the second suction nozzle, and the mounting surface of the testing plate is also provided with a suction hole positioned in the elastic sealing ring.
Further, the driving part is a motor, the output end of the motor is connected with a screw rod through a coupler, a slider is connected to the screw rod through threads, and the slider is fixedly connected with the test board.
Further, the testing mechanism further comprises a base, the motor is fixedly mounted on the base, the screw rod is rotatably mounted on the base, the sliding block is slidably mounted on the base, a connecting plate is fixedly mounted on the sliding block, and the testing plate is fixedly mounted on the connecting plate.
Furthermore, a groove is formed between the inner wall of the elastic sealing ring and the mounting surface of the test board, and the test end of the probe is positioned in the groove.
The beneficial effect of this application lies in: preliminarily judging the appearance and the orientation of the semiconductor product through an image detection mechanism, and removing unqualified semiconductor products; the semiconductor products are rotated in the left and right directions by the rotating mechanism in combination with the judgment result of the image detection mechanism, so that the front side surfaces of all the semiconductor products can be in forward orientation, and the testing mechanism can accurately contact the anode and the cathode of the semiconductor products during testing; the orientation of the semiconductor product can be respectively kept in proper orientation when the image detection mechanism, the rotating mechanism and the testing mechanism work, so that the orientation of the semiconductor product in the test classification process is easier to control, and the accuracy and the efficiency of the test classification are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of an embodiment of the present application;
FIG. 2 is a schematic view of the positioning pawl folded on the positioning plate in the embodiment of the present application;
FIG. 3 is a schematic view of the positioning pawl shown expanded against the positioning plate in the embodiment of the present application;
FIG. 4 is a schematic structural diagram of a rotating disk in an embodiment of the present application;
FIG. 5 is a schematic structural diagram of a testing mechanism in an embodiment of the present application;
fig. 6 is a schematic partial structure diagram of a testing mechanism in an embodiment of the present application.
Wherein, each mark in the figure is:
1. a feeding mechanism; 2. a first turntable; 3. a first positioning mechanism; 4. an image detection mechanism; 5. a first material receiving mechanism; 6. a rotation mechanism; 7. a second positioning mechanism; 8. a second turntable; 9. a third positioning mechanism; 10. a testing mechanism; 11. a second material receiving mechanism; 12. a work table; 13. positioning a plate; 14. a positioning claw; 15. positioning a groove; 16. rotating the disc; 17. accommodating grooves; 18. a fiber optic detector; 19. a test board; 20. An elastic sealing ring; 21. a probe; 22. a motor; 23. a suction hole; 24. a screw rod; 25. a slider; 26. A coupling; 27. a base; 28. a chute; 29. a connecting plate.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the patent, and the specific meanings of the above terms will be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
As shown in fig. 1 to 6, a test sorting apparatus is used for performing optical parameter or electrical parameter tests on semiconductor products such as micro LEDs and packaged chips, and performing sorting collection according to test results. The test classification equipment comprises a feeding mechanism 1, a first rotary table 2, a first positioning mechanism 3, an image detection mechanism 4, a first material receiving mechanism 5, a rotating mechanism 6, a second positioning mechanism 7, a second rotary table 8, a third positioning mechanism 9, a test mechanism 10 and a second material receiving mechanism 11. The first rotary table 2 is arranged on the table top of a workbench 12, the first rotary table 2 is provided with a plurality of first suction nozzles along the circumferential direction, and the feeding mechanism 1, the first positioning mechanism 3, the image detection mechanism 4, the first material receiving mechanism 5, the rotating mechanism 6, the second positioning mechanism 7 and the second rotary table 8 are arranged on the table top of the workbench 12 along the circumferential direction of the first rotary table 2 and are distributed on the outer side of the first rotary table 2; the second rotary table 8 is arranged on the table top of the workbench 12, the second rotary table 8 is provided with a plurality of second suction nozzles along the circumferential direction, and the first rotary table 2, the third positioning mechanism 9, the testing mechanism 10 and the second material receiving mechanism 11 are arranged on the table top of the workbench 12 along the circumferential direction of the second rotary table 8 and are distributed on the outer side of the second rotary table 8. In the above mechanism, the feeding mechanism 1 is used for conveying semiconductor products to a first rotary table, the first positioning mechanism 3 is used for positioning and correcting the semiconductor products adsorbed by the first suction nozzle, the image detection mechanism 4 is used for image detection of the semiconductor products adsorbed by the first suction nozzle, the first material receiving mechanism 5 is used for collecting defective products detected by the image detection mechanism, the rotating mechanism 6 is used for rotating the semiconductor products adsorbed by the first suction nozzle, the second positioning mechanism 7 is used for positioning and correcting the semiconductor products adsorbed by the first suction nozzle, the third positioning mechanism 9 is used for positioning and correcting the semiconductor products adsorbed by the second suction nozzle, the testing mechanism 10 is used for testing the semiconductor products adsorbed by the second suction nozzle, and the second material receiving mechanism 11 is used for classifying and collecting the tested semiconductor products.
In operation, the semiconductor product is conveyed to the position below one of the first suction nozzles of the first rotary table 2 through the feeding mechanism 1, and the feeding mechanism 1 can be a conveyor belt or the like. The first suction nozzle of the first rotary disc 2 sucks up the semiconductor product, the first rotary disc 2 rotates and brings the semiconductor product to the first positioning mechanism 3, the orientation of the semiconductor product is subjected to first positioning correction, the orientation of the semiconductor product is subjected to fine adjustment after the first positioning correction, and the semiconductor product is sucked up again by the first suction nozzle on the first rotary disc 2. The first rotary disc 2 continues to rotate and brings the semiconductor product to the image detection mechanism 4, and the camera of the image detection mechanism 4 acquires the image picture of the semiconductor product, compares the image picture with the picture stored in the computer and judges whether the orientation and the appearance of the semiconductor product are consistent with those of the product in the computer picture. After the semiconductor product passes through the image detection mechanism 4, the first rotary disc 2 continues to rotate to bring the semiconductor product to the first material receiving mechanism 5, if the image detection mechanism 4 judges that the orientation and the appearance of the semiconductor product are not consistent with those of the products in the computer pictures, the semiconductor product falls into the first material receiving mechanism 5, and if the image detection mechanism 4 judges that the orientation and the appearance of the semiconductor product are consistent with those of the products in the computer pictures, the semiconductor product continues to be brought to the rotating mechanism 6 by the first rotary disc 2 through the first material receiving mechanism 5. According to the judgment result of the image detection mechanism 4, the rotation mechanism 6 rotates the semiconductor products in the left and right directions, so that the front side surfaces of all the products can be in the forward direction. After passing through the rotating mechanism 6, the semiconductor product is continuously taken to the second positioning mechanism 7 for second positioning correction, and the orientation of the semiconductor product is finely adjusted again, so that the orientation of the product can be completely unified. The first rotary table 2 continuously brings the semiconductor products to the position above one second suction nozzle of the second rotary table 8, after the lower surfaces of the semiconductor products in the second suction nozzle of the second rotary table 8 suck the semiconductor products, the first suction nozzle no longer sucks the semiconductor products, then the second rotary table 8 brings the semiconductor products to the third positioning mechanism 9 for third orientation fine adjustment, the semiconductor products are brought to the testing mechanism 10 for optical parameter or electrical parameter testing, and then the second rotary table 8 continuously drives the semiconductor products to the second material receiving mechanism 11 and collects the semiconductor products in a classified mode according to the testing result of the testing mechanism 10.
As an example, a general semiconductor product is a square block (hexahedral structure) and has an upper surface, a lower surface, a left side surface, a right side surface, a front side surface, and a rear side surface, and after the first alignment correction, the overall direction and orientation of the semiconductor can be uniform, but not all semiconductor products have the front side surface facing forward, and there may be cases where the left side surface, the right side surface, or the rear side surface faces forward. The computer stores pictures of four orientations of the semiconductor product, wherein the four orientations are respectively that the front side faces forwards, the back side faces forwards, the left side faces forwards and the right side faces forwards, and if the appearances of the semiconductor product are different from the appearances of the four orientations, the semiconductor product is judged to be a defective product or other mixed products and is collected by the first material collecting mechanism 5. When passing through the rotating mechanism 6, the semiconductor product is rotated in the left-right direction, if the original semiconductor product is the front side, the front side is rotated 90 degrees to the left, if the original semiconductor product is the front side, the front side is rotated 90 degrees to the right, if the original semiconductor product is the rear side, the front side is rotated 180 degrees to the left or right, and the front side is rotated forward, and all the semiconductor products can be oriented with the front side facing forward through the rotating mechanism 6. And the orientation of the semiconductor product is finely adjusted through the second positioning correction, so that the orientation of the product can be completely unified.
The appearance and the orientation of the semiconductor product are initially judged by the image detection mechanism 4, and unqualified semiconductor products are removed; the semiconductor products are rotated in the left and right directions by the rotating mechanism 6 in combination with the judgment result of the image detection mechanism 4, so that the front side surfaces of all the semiconductor products can be in forward directions, and the testing mechanism 10 can accurately contact the anode and the cathode of the semiconductor products during testing; the orientation of the semiconductor product can be respectively kept in a proper orientation when the image detection mechanism 4, the rotating mechanism 6 and the testing mechanism 10 work through the micro adjustment of the orientation of the first positioning mechanism 3, the second positioning mechanism 7 and the third positioning mechanism 9 among the image detection, the rotation and the testing of the semiconductor product, so that the orientation of the semiconductor product in the testing and classifying process is easier to control, and the accuracy and the efficiency of the testing and classifying are improved.
Further, as shown in fig. 2 and 3, the first positioning mechanism 3 includes a positioning plate 13 and a plurality of positioning pawls 14 respectively hinged on the positioning plate 13, and a surface of the positioning plate 13 and free ends of the plurality of positioning pawls 14 enclose to form a positioning groove 15 matching with the outer shape of the semiconductor product. During the first positioning correction, the semiconductor product is brought above the positioning plate 13, at the moment, the four positioning claws 14 are in an open state on the positioning plate 13, the first suction nozzle places the product on the positioning plate 13, then the four positioning claws 14 rotate towards the center of the positioning plate 13 and are folded, so that the semiconductor product is limited in the positioning groove 15, and then the first suction nozzle sucks up the semiconductor product to realize the fine adjustment of the orientation of the semiconductor product.
Further, the second positioning mechanism 7 and the third positioning mechanism 9 are respectively identical in structure to the first positioning mechanism 3. Namely, the second positioning mechanism 7 and the third positioning mechanism 9 respectively comprise a positioning plate 13 and a plurality of positioning claws 14 hinged on the positioning plate 13, and the surface of the positioning plate 13 and the free ends of the plurality of positioning claws 14 enclose to form a positioning groove 15 matched with the shape of the semiconductor product.
Further, as shown in fig. 4, the rotating mechanism 6 includes a rotating disk 16, and a disk surface of the rotating disk 16 is provided with a receiving groove 17 that matches the outer shape of the semiconductor product. Because the first positioning correction of first positioning mechanism 3 has passed through, the semiconductor product gets into rotary mechanism 6 department, and first suction nozzle can be put the product in holding tank 17 of rolling disc 16, then rolling disc 16 is according to the judged result of image detection mechanism 4, and the direction is rotatory about carrying out the semiconductor product, makes the leading flank of semiconductor product can be forward orientation, then first suction nozzle is again with the semiconductor product inspiration and take to next station.
Further, the test sorting apparatus further comprises a fiber detector 18 located between the first turntable 2 and the third positioning mechanism 9. The optical fiber detector 18 is arranged on the table top of the workbench 12 and used for detecting whether the second suction nozzle has a semiconductor product or not, if so, the second rotating disc 8 starts to rotate to bring the semiconductor product to the third positioning mechanism 9, and the semiconductor product is brought to the testing mechanism 10 for testing after the third positioning correction. Because the first material receiving mechanism 5 can collect partial unqualified semiconductor products in the running process of the first rotating disc 2, the optical fiber detector 18 is arranged between the first rotating disc 2 and the third positioning mechanism 9, the third positioning mechanism 9 and the testing mechanism 10 can be prevented from being always in a working state, and the working efficiency of the equipment is improved.
Further, the first suction nozzle is connected with an air cylinder for driving the first suction nozzle to move up and down relative to the first rotary disc 2, and a spring is connected between the air cylinder and the first suction nozzle. When the first suction nozzle sucks up a semiconductor product, the cylinder drives the first suction nozzle to move downwards, and the spring connected between the first suction nozzle and the cylinder can play a role in buffering, so that the semiconductor product is prevented from being crushed by the first suction nozzle before being sucked up.
Further, the second receiving mechanism 11 includes a plurality of receiving boxes arranged along the circumferential direction of the second rotating disk 8. After the testing mechanism 10 tests the optical parameters or the electrical parameters of the semiconductor products, the second turntable 8 continues to drive the semiconductor products to the second material receiving mechanism 11, and the semiconductor products are collected in the material receiving boxes in a classified manner according to the testing result of the testing mechanism 10.
Further, as shown in fig. 5 and 6, the testing mechanism 10 includes a testing board 19 having a mounting surface, an elastic sealing ring 20 fixed on the mounting surface of the testing board 19, a probe 21 fixed on the mounting surface of the testing board 19, and a driving member for driving the testing board 19 to perform a reciprocating linear motion so that the elastic sealing ring 20 and the probe 21 are close to and away from the second suction nozzle, and the mounting surface of the testing board 19 is further provided with a suction hole 23 located inside the elastic sealing ring 20. In operation, the second suction nozzle of the second turntable 8 sucks the lower surface of the semiconductor product to bring the semiconductor product to the testing mechanism 10. The driving component drives the test board 19 to move upwards to be close to the second suction nozzle continuously, the elastic sealing ring 20 on the mounting surface of the test board 19 is in contact with the lower surface of the second suction nozzle, at the moment, the driving component stops working, the mounting surface of the test board 19, the elastic sealing ring 20, the second suction nozzle and the lower surface of the semiconductor product are enclosed to form a closed space, then the suction hole 23 starts to suck air in the closed space through a vacuumizing device connected with the suction hole, then the driving component continues working, the test board 19 continues to move upwards, the test end of the probe 21 is in contact with the lower surface of the semiconductor product while the elastic sealing ring 20 is extruded, and the semiconductor product is tested through the detection device connected with the probe 21. The elastic sealing ring 20 is arranged on the surface of the test board 19 and is attached to the lower surface of the second suction nozzle to form a closed space, the suction holes 23 in the elastic sealing ring 20 suck air to reduce the pressure in the closed space, so that the semiconductor product is firmly adsorbed on the second suction nozzle, the probe 21 can detect the semiconductor product conveniently, the semiconductor product is not easy to drop in the testing process, and the production efficiency is improved.
Further, the driving part is a motor 22, the output end of the motor 22 is connected with a screw rod 24 through a coupler 26, a slider 25 is connected to the screw rod 24 in a threaded manner, and the slider 25 is fixedly connected with the test board 19. When the motor 22 works, the screw rod 24 and the slide block 25 are in threaded transmission, so that the slide block 25 can be driven to slide up and down, the mounting surface of the test board 19 can make reciprocating linear motion in the direction close to and far away from the second suction nozzle, and the test board is simple in structure and sensitive in action.
Further, the testing mechanism 10 further includes a base 27, the motor 22 is fixedly mounted on the base 27, the screw 24 is rotatably mounted on the base 27, and the slider 25 is slidably mounted on the base 27. In the application, the motor 22 is fixedly installed on the lower surface of the base 27, a sliding groove 28 is arranged on the side surface of the base 27, the screw rod 24 is rotatably installed in the sliding groove 28 of the base 27, and the output end of the motor 22 passes through the base 27 and then is connected with one end of the screw rod 24 through the coupling 26; the slider 25 is screwed on the screw rod 24 and is in sliding fit with the slide groove 28 of the base 27.
Further, a connecting plate 29 is fixedly mounted on the slider 25, and the test board 19 is fixedly mounted on the connecting plate 29. Survey test panel 19 through connecting plate 29 and slider 25 fixed connection, when making slider 25 slide from top to bottom in vertical direction, connecting plate 29 is vertical arrangement, and then makes survey test panel 19 be the level and arranges, surveys test panel 19's installation face and can slide from top to bottom, is close to and keeps away from the second suction nozzle.
Furthermore, the inner ring of the elastic sealing ring 20 and the mounting surface of the test board 19 are combined to form a groove, and the test end of the probe 21 is located in the groove. When the elastic sealing ring 20 is in contact with the lower surface of the second suction nozzle, the elastic sealing ring 20, the mounting surface of the test board 19 and the lower surface of the semiconductor product are enclosed to form an enclosed space, meanwhile, the test end of the probe 21 is located in the enclosed space, when the elastic sealing ring 20 adsorbs the lower surface of the second suction nozzle, the integrated circuit structure of the lower surface of the semiconductor product is located in the elastic sealing ring 20, the elastic sealing ring 20 is extruded, the test end of the probe 21 penetrates through the second suction nozzle to detect the semiconductor product, the gravity center of the semiconductor product can be ensured to be also located in the elastic sealing ring 20, and the adsorption of the semiconductor product is more stable.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A test sorting apparatus, comprising:
a first turntable, wherein a plurality of first suction nozzles for sucking semiconductor products are arranged on the first turntable along the circumferential direction of the first turntable;
a feeding mechanism for conveying semiconductor products to the first rotary disc;
the first positioning mechanism is used for carrying out positioning correction on the semiconductor product adsorbed by the first suction nozzle;
the image detection mechanism is used for carrying out image detection on the semiconductor product adsorbed by the first suction nozzle;
the first material receiving mechanism is used for collecting defective products detected by the image detection mechanism;
a rotating mechanism for rotating the semiconductor product sucked by the first suction nozzle;
the second positioning mechanism is used for positioning and correcting the semiconductor product adsorbed by the first suction nozzle;
a second turntable, which is provided with a plurality of second suction nozzles for sucking semiconductor products along the circumferential direction;
the third positioning mechanism is used for positioning and correcting the semiconductor product adsorbed by the second suction nozzle;
the testing mechanism is used for testing the semiconductor product adsorbed by the second suction nozzle; and
the second material receiving mechanism is used for classifying and collecting the tested semiconductor products;
the feeding mechanism, the first positioning mechanism, the image detection mechanism, the first material receiving mechanism, the rotating mechanism, the second positioning mechanism and the second turntable are distributed along the circumferential direction of the first turntable;
the first rotary disc, the third positioning mechanism, the testing mechanism and the second material receiving mechanism are distributed along the circumferential direction of the second rotary disc.
2. The test sorting device of claim 1, wherein the first positioning mechanism, the second positioning mechanism and the third positioning mechanism respectively comprise a positioning plate and a plurality of positioning claws respectively hinged on the positioning plate, and the surface of the positioning plate and the free ends of the plurality of positioning claws enclose to form a positioning groove matched with the shape of the semiconductor product.
3. The test sorting apparatus of claim 1, wherein the rotating mechanism comprises a rotating disk, and a disk surface of the rotating disk is provided with a receiving groove matched with the outer shape of the semiconductor product.
4. A test sorting apparatus according to claim 1, further comprising a fibre optic detector located between the first turntable and the third positioning mechanism.
5. The test sorting device of claim 1, wherein the first suction nozzle is connected with an air cylinder for driving the first suction nozzle to move up and down relative to the first rotary table, and a spring is connected between the air cylinder and the first suction nozzle.
6. The test and sorting apparatus of claim 1, wherein the second material receiving mechanism comprises a plurality of material receiving boxes arranged along a circumferential direction of the second rotary table.
7. The test sorting device of claim 1, wherein the test mechanism comprises a test board having a mounting surface, an elastic sealing ring fixed on the mounting surface of the test board, a probe fixed on the mounting surface of the test board, and a driving member for driving the test board to perform a reciprocating linear motion so that the elastic sealing ring and the probe are close to and away from the second suction nozzle, and the mounting surface of the test board is further provided with a suction hole located inside the elastic sealing ring.
8. The test classification device according to claim 7, wherein the driving member is a motor, an output end of the motor is connected with a screw rod through a coupling, the screw rod is connected with a sliding block through a thread, and the sliding block is fixedly connected with the test board.
9. The test classification device according to claim 8, wherein the test mechanism further comprises a base, the motor is fixedly mounted on the base, the screw is rotatably mounted on the base, the slider is slidably mounted on the base, a connecting plate is fixedly mounted on the slider, and the test board is fixedly mounted on the connecting plate.
10. The test sorting device of claim 9, wherein the inner wall of the elastic sealing ring and the mounting surface of the test board form a groove, and the test end of the probe is located in the groove.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921884209.3U CN211275530U (en) | 2019-11-04 | 2019-11-04 | Test classification equipment |
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| CN201921884209.3U CN211275530U (en) | 2019-11-04 | 2019-11-04 | Test classification equipment |
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| CN211275530U true CN211275530U (en) | 2020-08-18 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113640314A (en) * | 2021-10-14 | 2021-11-12 | 深圳市赛元微电子有限公司 | A semiconductor quality detection device and method |
| CN113970658A (en) * | 2021-10-22 | 2022-01-25 | 深圳台达创新半导体有限公司 | Probe station for semiconductor detection |
| CN114130682A (en) * | 2021-11-23 | 2022-03-04 | 博众精工科技股份有限公司 | a transmission device |
| CN115327350A (en) * | 2022-09-13 | 2022-11-11 | 江苏芯安集成电路设计有限公司 | Chip testing sorter |
| CN115656759A (en) * | 2022-10-24 | 2023-01-31 | 深圳市三一联光智能设备股份有限公司 | Semiconductor test braid all-in-one |
| CN115754652A (en) * | 2022-11-14 | 2023-03-07 | 惠州深科达半导体科技有限公司 | Test equipment and material test method |
| CN116705653A (en) * | 2023-05-17 | 2023-09-05 | 中山市博测达电子科技有限公司 | Semiconductor chip sorting and testing system |
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2019
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113640314A (en) * | 2021-10-14 | 2021-11-12 | 深圳市赛元微电子有限公司 | A semiconductor quality detection device and method |
| CN113970658A (en) * | 2021-10-22 | 2022-01-25 | 深圳台达创新半导体有限公司 | Probe station for semiconductor detection |
| CN113970658B (en) * | 2021-10-22 | 2024-02-23 | 深圳台达创新半导体有限公司 | Probe station for semiconductor detection |
| CN114130682A (en) * | 2021-11-23 | 2022-03-04 | 博众精工科技股份有限公司 | a transmission device |
| CN115327350A (en) * | 2022-09-13 | 2022-11-11 | 江苏芯安集成电路设计有限公司 | Chip testing sorter |
| CN115327350B (en) * | 2022-09-13 | 2023-08-25 | 江苏芯安集成电路设计有限公司 | Chip test classifier |
| CN115656759A (en) * | 2022-10-24 | 2023-01-31 | 深圳市三一联光智能设备股份有限公司 | Semiconductor test braid all-in-one |
| CN115754652A (en) * | 2022-11-14 | 2023-03-07 | 惠州深科达半导体科技有限公司 | Test equipment and material test method |
| CN116705653A (en) * | 2023-05-17 | 2023-09-05 | 中山市博测达电子科技有限公司 | Semiconductor chip sorting and testing system |
| CN116705653B (en) * | 2023-05-17 | 2024-09-20 | 中山市博测达电子科技有限公司 | Semiconductor chip sorting test system |
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