KR100904496B1 - A System for Manufacturing Semiconductor Package and A Method for Manufacturing Semiconductor Package - Google Patents

Abstract

The present invention relates to a semiconductor package processing system and a semiconductor package processing method. The semiconductor package processing system of the present invention includes a loading and unloading unit for loading or unloading a semiconductor package; A package fixing part fixed to a jig for cutting the semiconductor package loaded by the loading unloading part; A cutting part for processing the semiconductor package fixed to the jig; A primary washing unit washing one side of an upper surface or a lower surface of the semiconductor package in which cutting is completed by the cutting unit; And, the second washing unit for cleaning the other side of the semiconductor package; is configured to include. According to the semiconductor package processing system and semiconductor package processing method according to the present invention having such a configuration, the overall process is automatically performed, the overall size of the semiconductor package processing system and semiconductor package processing method is reduced, the cost and time is reduced have.

Loading unloading part, delivery part, package fixing part, cutting part, washing and drying part

Description

A system for manufacturing semiconductor package and a method for manufacturing semiconductor package

1 is a schematic view showing a semiconductor package processing system according to the present invention.

2A to 2D are a plan view and a side view showing the configuration and operation of the tray picker of FIG.

3A and 3B are a perspective view and a cross-sectional view showing the configuration of a delivery unit picker constituting the delivery unit of FIG.

4A and 4B are a side view and a plan view showing the configuration of the fixing part picker of FIG.

Figure 5a to 5d is a side view showing the configuration and operation of the package fixing portion constituting Figure 1 in a side view.

6A and 6B are a plan view and a side view showing the configuration of the first push assembly and the second push assembly of the package fixing part of Fig. 1;

7a to 7e are plan views showing the configuration and operation of the package fixing part constituting FIG.

FIG. 8 is a perspective view illustrating a configuration of a seat block of FIG. 5. FIG.

9A and 9B are plan views illustrating an operation process of the position change device of FIG. 1.

10 is an exploded perspective view showing a temporarily fixed structure in which the jig is temporarily fixed to the position changing device of FIG. 9;

11a to 11e is a side view showing the operation of the washing unit constituting FIG.

12 is a view showing a state of looking at the transfer unit picker in the second inspection unit constituting FIG.

Figure 13 is a schematic view showing another embodiment of a semiconductor package processing system according to the present invention.

14 is a schematic view showing another embodiment of a semiconductor package processing system according to the present invention.

Figure 15 is a schematic view showing another embodiment of a semiconductor package processing system according to the present invention.

16 is a schematic view showing another embodiment of a semiconductor package processing system according to the present invention.

17 is a schematic view showing another embodiment of a semiconductor package processing system according to the present invention.

18 is a plan view showing the operation of another embodiment of the package fixing part in the semiconductor package processing system according to the present invention.

FIG. 19 is a plan view illustrating another example of a cutting unit configuring FIG. 1. FIG.

20A and 20E are a plan view and a side view showing an operation process of the position change device of FIG.

21A to 21D are side views illustrating an operation of another embodiment of the package fixing part of FIG. 1.

FIG. 22 is a plan view illustrating another embodiment of the cutting unit constituting FIG. 1. FIG.

23 and 24 are plan views showing an operation process of the drying table and the transfer unit picker of FIG.

Explanation of symbols on the main parts of the drawings

100: loading unloading unit 200: transfer unit

300: package fixing part 302: mediation table

304: intermediate table transfer line 310: jig

312: body 314: slit

319: transfer means 320: fixed part picker transfer line

322: fixed part picker 324: pickup device

326: adsorption means 328: driving means

330: linkage unit 340: correction unit

350: package fixed assembly 360: body unit

370: linkage unit 376: jig holder

390: first push assembly 400: second push assembly

500: cutting portion 502: cutting edge

504: chuck table 506: chuck table transfer line

508: cut picker 509: cut picker feed line

520: position changing device 530: jig fixing means

531: jig seating space 532: frame

534: fixed unit 536: fixed slit

537: fixing member 538: moving member

540: rotation means 542: drive member

544: linkage unit 546: rack

548: pinion 550: vehicle

552: belt 554: belt fixing member

556: pulley 600: washing and drying unit

612: washing table transfer line 620: washing table unit

700: inspection unit 710: first inspection unit

712: first inspection unit transfer line 720: second inspection unit

722: second inspection unit feed line 5200: flipper ring member

5300: jig fixing means 5310: first fixing member

5320: second fixing member 5400: rotating means

5500: cleaning unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package processing system, and more particularly, to a system and a method for processing a semiconductor package in which processing of a workpiece such as a semiconductor package is automatically performed.

Recently, semiconductor packages have been used in various ways. For example, packages such as SD cards are used for mobile phones, digital cameras, and the like. By the way, such a package must be processed into a desired shape. To this end, first, a strip formed of a plurality of packages is cut into each package, and further, each package must be processed into a predetermined shape. In this case, conventionally, the package is manufactured by a user inserting the package directly into the jig and cutting the package inserted into the jig with an arbitrary cutting machine.

However, the above-described prior art has the following problems.

Conventionally, the process of processing the semiconductor package is all made manually, the overall process time is long, there is a problem that the cost increases.

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art as described above, and to provide a semiconductor package processing system and a semiconductor package processing method having a short overall process time and a low cost since the whole process is automatic.

According to a feature of the present invention for achieving the above object, the present invention includes a loading unloading unit for loading or unloading a semiconductor package; A package fixing part fixed to a jig for cutting the semiconductor package loaded by the loading unloading part; A cutting part for processing the semiconductor package fixed to the jig; A primary washing unit washing one side of an upper surface or a lower surface of the semiconductor package in which cutting is completed by the cutting unit; In addition, it provides a semiconductor package processing system comprising; a secondary washing unit for cleaning the other side of the semiconductor package.

Here, the semiconductor package loaded by the loading and unloading unit may be configured to further include a transfer unit for delivering to the package fixing.

In addition, the first and second washing unit may further comprise a drying unit for drying the semiconductor package is complete cleaning.

The cutting unit may further include a position conversion device for converting the upper and lower surfaces of the jig.

In addition, the semiconductor package may further include an inspection unit for inspecting whether or not the semiconductor package is completed.

In addition, the present invention, the loading step of loading the semiconductor package into the processing system; A package fixing step of fixing the loaded semiconductor package to a jig; A cutting step for processing the semiconductor package fixed to the jig; And an unloading step of unloading the semiconductor package in a processing system.

Here, the cleaning and drying step for washing and drying the semiconductor package is completed; may be configured to further include.

The washing and drying step may include a first washing step of washing the upper surface of the semiconductor package; A second washing step of washing a lower surface of the semiconductor package; And a drying step of drying the semiconductor package.

The method may further include an inspection step of inspecting whether the semiconductor package, which has been processed, is defective.

The method may further include a correcting step of identifying and correcting the degree of misalignment at the correct position of the semiconductor package after the processing is completed.

According to the semiconductor package processing system and semiconductor package processing method according to the present invention having such a configuration, the overall process is automatically made, the overall size of the semiconductor package processing system and semiconductor package processing method is reduced, the cost and time is reduced have.

Hereinafter, a preferred embodiment of a semiconductor package processing system according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view showing a semiconductor package processing system according to the present invention.

With reference to FIG. 1, the overall structure of a semiconductor package processing system is demonstrated once. The semiconductor package processing system of the present invention includes a loading unloading unit 100 for loading an unprocessed semiconductor package SP into a processing system or unloading the processed semiconductor package SP, and the loading unloading unit 100. Transfer unit 200 for transferring the semiconductor package SP loaded to the predetermined position for processing, jig 310 for cutting the semiconductor package SP transported by the transfer unit 200. The package fixing part 300 fixed to the cutting part 500, the cutting part 500 for processing the semiconductor package SP fixed to the jig 310, and the semiconductor package SP processed in the cutting part 500 are washed. The cleaning and drying unit 600 and the inspection unit 700 for inspecting whether or not the processing of the semiconductor package SP is completed is configured to include. Hereinafter, each part is demonstrated concretely.

First, the loading unloading unit 100 will be described with reference to FIG. 1. The loading unloading unit 100 includes a plurality of tray magazines 106 on which the trays 102 are loaded. In addition, a moving table 103 is mounted to move the trays 102 on the upper surface, and is configured to move along the moving table transfer line 104.

The tray magazine 106 may be provided in plural, preferably four. For example, an uncut tray on which an unprocessed semiconductor package SP is stacked, a good tray on which a semiconductor package SP which has been processed and is determined to be good is loaded; An empty tray which has not yet loaded the semiconductor package SP and a rework tray on which the semiconductor package SP determined as defective may be loaded. Of course, other configurations may be made at the level of those skilled in the art.

In addition, the moving table 103 may be configured in plural for the process progress speed of the semiconductor package processing system. For example, in this invention, it can comprise three. One of the moving tables 103 may be configured to load the semiconductor package SP, which is not yet processed, and transfer the semiconductor package SP along the moving table transfer line 104.

In addition, the other one of the moving table 103 is the semiconductor package (SP) of the semiconductor package (SP) of the completed semiconductor processing process is completed by the inspection unit 700 to move the moving table transfer line 104 It can also be configured to transfer accordingly.

In addition, the other of the moving table 103 is to transfer the semiconductor package (SP) determined as defective in the inspection unit (710, 720) of the completed semiconductor package (SP) along the moving table transfer line (104). Can be configured.

Meanwhile, a tray picker transfer line 110 is provided above the move table transfer line 104 to be orthogonal to the move table transfer line 104. The tray picker transfer line 110 is provided with a tray picker 112, and the tray picker 112 picks up the tray 102 to transfer the tray magazine 106. Of course, the tray picker 112 may be provided in plurality in order to increase the speed of the semiconductor processing process.

The tray picker 112 may have any configuration as long as it can hold the tray 102. Preferably, the tray picker 112 may include a grip unit capable of holding the tray 102 and a tray picker transfer line. It may be configured as a transport means that can move along the 110.

The tray picker 112 may be configured to hold one sheet of the tray 102, or may be configured to hold two or more sheets of the tray 102. The tray picker 112 grips the tray 102 in order to increase the transport capacity of the tray picker 112.

The tray picker 112 may be provided as shown in FIG. 2A as an example of a configuration capable of holding two trays 102.

The tracker 112 as illustrated in FIG. 2A includes a body portion 114 constituting a skeleton of the tracker 112 and a pair of two pairs facing each other on one side of the body portion 114. The first gripper portion 116 for holding the tray 102 and the second gripper portion 118 for holding another tray 102 are configured in two pairs so as to face each other on one side of the body portion 114. It may be configured to include).

The size of the body portion 114 is formed to correspond to the size of the tray 102. More preferably, the body portion 114 may have a size slightly smaller than that of the tray 102. This is to allow the first gripper 116 and the second gripper 118 to easily contact the side surfaces of the tray 102.

The first gripper 116 and the second gripper 118 are formed to face each other as shown in FIG. 2B. The first grippers 116 are provided to face each other in two pairs to stably pick up from both sides of the tray 102.

Each of the grippers 116 and 118 is formed at the bent portion of the grippers 116a and 118a such that the grippers 116a and 118a bent in a-shape and the grippers 116a and 118a are rotatable. It comprises a shaft 120 and a drive member (116b, 118b) for driving the grippers (116a, 118a).

As shown in FIG. 2B, the grippers 116a and 118a are provided with mounting grooves 116c and 118c in a direction facing each other at one end. The seating grooves 116c and 118c serve to be easily and stably picked up when the tray 102 is picked up by the grippers 116a and 118a.

In addition, at the edges of the seating grooves 116c and 118c, more preferably at the leading edges of the grippers 116a and 118a, the grippers 116a and 118a formed in the pair protrude in a direction facing each other. 116d and 118d are provided. The locking jaws 116d and 118d are supported from below when the tray 102 is seated in the seating grooves 116c and 118c to be picked up more stably.

An elastic member 122 is provided at the other end of the gripper 116a and 118a where the mounting grooves 116c and 118c are formed. The elastic member 122 is provided between the body portion 114 and the grippers 116a and 118a to serve to elastically support the grippers 116a and 118a to rotate in a predetermined direction. That is, the elastic member 122 moves in a direction facing the mounting grooves 116c and 118c of the other grippers 116a and 118a in which the mounting grooves 116c and 118c of the grippers 116a and 118a are paired. It is desirable to provide elastic force.

In addition, the driving members 116b and 118b provided in the respective gripper parts 116 and 118 may be provided in the respective gripper parts 116 and 118 so as to drive the respective grippers 116a and 118a. The drive member may be configured as one, and an interlocking member (not shown) may be further provided to simultaneously drive the grippers 116 and 118 that operate in the pair.

In addition, the driving members 116b and 118b may be provided at one side of the body portion 114 and may be configured to push a portion where the mounting grooves 116c and 118c are formed in the grippers 116a and 118a. That is, the driving members 116b and 118b serve to provide a driving force so that the elastic member 122 provides an elastic force to rotate in a direction opposite to the direction in which the grippers 116a and 118a rotate.

The gripper parts 116 and 118 may include a first gripper part 116 and a second gripper part 118. As shown in FIG. 2A, the first gripper portion 116 serves to pick up the first tray 102a close to the body portion 114, and the second gripper portion 118 serves as the first tray. It serves to pick up the second tray 102b seated below the 102a.

The first gripper 116a of the first gripper portion 116 and the second gripper 118a of the second gripper portion 118 protrude downward from the body portion 114. The thickness of the tray 102 may be different. However, the seating groove 118c of the second gripper 118a is seated on the first tray 102a seated in the seating groove 116c of the first gripper 116a and the second gripper 118a. It may be configured to accommodate the second tray 102b at the same time.

In addition, the body portion 114 is provided with a plurality of guide bars 124 on the side. As illustrated in FIG. 2C, the guide bar 124 may be easily picked up by the gripper parts 116 and 118 to the lower part of the body part 114. Guides and fixes).

In addition, three tray pickers 112 may be provided, and may be configured as one tray picker assembly. This is because the moving table 103 is composed of three, to increase the process speed during loading and unloading by the tracker 112. In other words, the tray picker 112 can pick up all of the trays 102 loaded on the three moving tables 103 at once, thereby increasing the processing speed. For example, one of the tray pickers 112 may be in a workable state and the other two may be in a pick-up state.

This is especially the case where the tray picker 112 can pick up only one tray 102 and two tray pickers 112 when the moving table 103 comes under the tray picker 112 at the same time. ), The tray picker 112 is provided so as to correspond to the number of the movable tables 102. However, in the present invention, the tray picker 112 is provided to correspond to the number of the movable tables 102. It is not necessary to determine whether to pick up the tray 102 seated on the moving table 103, so that the process speed is higher.

On the other hand, the loading unloading unit 100 is frozen again in the moving table 103 when the semiconductor package (SP), which has been processed in accordance with the entire process of the semiconductor package processing system is conveyed back along the transfer unit 200 It also serves to load.

Next, a transfer unit 200 for moving the unprocessed semiconductor package SP, which is loaded and moved on the movement table 103 in the loading and unloading unit 100, to the package fixing unit 300 is provided. Of course, the semiconductor package SP may be directly transferred to the package fixing part 300 without passing through the transfer part 200 in the loading unloading part 100.

The transfer unit 200 is provided with a transfer unit picker transfer line 202 which is orthogonal to the moving table transfer line 104 and provided upward. That is, the transfer unit picker transfer line 202 may be configured in parallel with the tray picker transfer line 110.

The transfer unit picker transfer line 202 is provided with a transfer unit picker 204 which is installed to be movable along the transfer unit picker transfer line 202. The transfer unit picker 204 picks up the semiconductor package SP seated on the tray 106 and transfers it to the package fixing unit 300. Can be configured.

However, unlike the tray picker 112, the transfer part picker 204 is for picking up each semiconductor package SP, and the adsorption means should be configured to pick up the individual semiconductor packages SP. will be.

The delivery unit picker 204 may be configured as a picker assembly 206 as illustrated in FIGS. 3A and 3B. The picker assembly 206 includes adsorption means 208 for picking up the semiconductor package SP, vertical movement means 210 for allowing the adsorption means 208 to move vertically, and the adsorption means 208. It may be composed of a rotation moving means 220 to allow the rotation movement.

First, the adsorption means 208 allows the semiconductor package SP to be adsorbed by vacuum, and a nozzle 209 is provided at the tip. The adsorption means 208 may be arranged in a number according to the needs of the user, in the embodiment of the present invention is composed of eight as shown in Figure 3b.

In addition, the adsorption means 208 is provided with a vertical movement means 210, the vertical movement means 210 is a first driving means 212 for generating power by receiving power and the first driving means ( It may be configured to include a first interlocking means 214 for transmitting power to receive the power generated in 212 to move the adsorption means 208.

The first driving means 212 may employ any one of those skilled in the art as long as it is a means capable of generating power by receiving power. In one embodiment of the first driving means 212 may be configured as a motor.

In addition, a first interlocking means 214 is provided to transmit the power generated by the first driving means 212 to the adsorption means 208, the first interlocking means 214 is the first driving means ( Anything may be employed as long as it can be configured to convert the power generated at 212 so that the adsorption means 208 can move vertically.

In the present invention, as shown in FIG. 3A as an example of the first interlocking means 214, the pinion 216 and the suction means 208 is provided on the rotating shaft of the motor and rotates together with the motor. It may be configured as a rack gear 218 meshed with 216 to convert the rotational force of the pinion 216 into a linear reciprocating motion.

In addition, the picker assembly 206 is further provided with a rotation means 220 for rotating the adsorption means 208. The rotation moving means 220 may be the second driving means 222 for generating power by receiving power and the adsorption means 208 may be rotated by receiving power generated by the second driving means 222. It may be configured to include a second interlocking means 224.

Like the first driving means 212, any of the second driving means 222 may be adopted as long as it is a means capable of generating power by receiving power at the level of those skilled in the art. Can be.

In addition, the second interlocking means 224 may adopt any means as long as the second interlocking means 224 receives the power generated by the second driving means 222 so that the adsorption means 208 can rotate.

The transfer unit picker 204 may include a plurality of picker assemblies 206. This is to reduce the time of the entire process by increasing the speed of the process in the process of delivering the semiconductor package (SP).

In the present invention, as shown in Figure 3b, the delivery unit picker 204 is provided with eight picker assembly (206). Of course, the delivery unit picker 204 may vary the number of picker assemblies 206 according to a user's needs.

The picker assembly 206 of the transfer unit picker 204 may be inserted into the jig 310 according to the cutting edge 502 and the direction of the cutting unit 500 to be described below. The semiconductor package SP picked up by the transfer unit picker 204 should be disposed in the intermediate table 302 as shown in FIG. 1.

The picker assembly 206 may be configured to rotate the suction nozzles 208 of several picker assemblies 206 regularly so that they are arranged in the intermediate table 302 as shown in FIG. 1. Of course, the rotary moving means 220 for rotating the adsorption nozzle 208 of the picker assembly 206 may be provided separately to each other to be rotated separately.

However, in the present invention, in order to reduce the number of parts of the rotation moving means 220, respectively provided may be provided in the configuration as shown in Figure 3b. That is, the adsorption means 208 that must rotate together in pairs among the adsorption means 208 of the picker assembly 206 are second driving means 222 for generating power by receiving power and the second driving means ( It may be composed of a second interlocking means 224 to rotate the adsorption means 208 by receiving the power of the 222.

For example, as shown in FIG. 3B, the semiconductor package SP picked up by the first and third adsorption means 208a and 208c of the picker assembly 206 should be located in the same direction. The first motor 222a is provided to simultaneously drive the first adsorption means 208a and the third adsorption means 208c, and the rotational force of the first motor 222a is controlled by the first adsorption means 208a and the first adsorption means 208a. The belt 226 may be provided to be transferred to the third suction means 208c. Of course, the pulley 228 may be mediated so that the rotational force is stably transmitted to the first and third adsorption means 208a and 208c.

In the above-described configuration, since the semiconductor package SP picked up by the second adsorption means 208b and the fourth adsorption means 208d of the picker assembly 206 should be positioned in the same direction, the second The adsorption means 208b and the fourth adsorption means 208d may also be configured to be rotatable together. Of course, the fifth adsorption means 208e and the seventh adsorption means 208g may be configured to be rotatable together, and the sixth adsorption means 208f and the eighth adsorption means 208h may be configured to be rotatable together.

On the other hand, a configuration in which the first suction means 208a and the third suction means 208c of the pickup assembly 206 are rotatable together is provided with a pinion (not shown) in the motor 222a, and the first By providing a rack gear (not shown) that is engaged at the same time with the rotation shaft of the suction means 208a and the third suction means 208c, the first suction means 208a and the third suction means 208c simultaneously rotate in pairs. Can be configured to do this.

In addition, the first adsorption means 208a, the third adsorption means 208c, the fifth adsorption means 208e, and the seventh adsorption means 208g of the pickup assembly 206 may be configured to rotate together. The semiconductor package picked up by the first adsorption means 208a, the third adsorption means 208c, the fifth adsorption means 208e, and the seventh adsorption means 208g and seated on the intermediate table 302 ( SP) is intended to be located all in the same direction. Of course, the second adsorption means 208b, the fourth adsorption means 208d, the sixth adsorption means 208f, and the eighth adsorption means 208h may also be configured to rotate together.

In addition, the transfer unit picker 204 may be movable along the transfer unit picker transfer line 202 as well as orthogonal to the transfer unit picker transfer line 202. That is, it can be configured to move in the Y-axis direction in the semiconductor package processing system.

In addition, the transfer unit picker transfer line 202 to which the transfer unit picker 204 may move may be configured in plural, and in the present invention, the transfer unit picker 204 may be composed of two, respectively, for the process efficiency of the semiconductor package processing system. The secondary picker transfer line 202a and the second transfer unit picker transfer line 202b.

The first transfer part picker transfer line 202a and the second transfer part picker transfer line 202b are provided with a first transfer part picker 204a and a second transfer part picker 204b, respectively. Each of the transfer unit pickers 204 grips the semiconductor package SP loaded on the tray 102 of the transfer table 103, which is transferred along the transfer table transfer line 104. Along the picker transfer line 202, a predetermined position, that is, transfers to the intermediary tray 302 of the package fixing part 300.

Of course, the transfer part picker 204 picks up the semiconductor package SP which has been processed in the intermediary table 302 again, and moves the tray 106 of the transfer table 102 along the transfer part picker transfer line 202. ) Can be transported on.

Next, a package fixing part 300 for inserting the semiconductor package SP into a jig 310 for fixing the semiconductor package SP when cutting the semiconductor package SP received from the transfer part 302. ) Is provided.

In the package fixing part 300, a jig 310 which is a frame for fixing the semiconductor package SP and a package fixing device for inserting and fixing the semiconductor package SP in the jig 310. 350 is provided. In addition, the package fixing part 300 may further include a fixing part picker 322 which is a transfer means that is responsible for transferring the semiconductor package SP in the package fixing part 300.

First, the jig 310 will be described in detail. The jig 310 is formed in a rectangular parallelepiped shape, and a plurality of perforated slits 314 are formed at an inner side of the jig 310. The slit 314 is for inserting and fixing the semiconductor package SP for processing.

In addition, the slits 314 are formed to penetrate the jig 310, so that both sides of the semiconductor package SP inserted into the slits 314 may be processed. In other words, the semiconductor package SP before the processing is cut into the slit 314 of the jig 310 and cut in the lower cutting part 500.

As shown in FIG. 1, the package fixing unit 300 is provided with an intermediary table 302 that receives the semiconductor package SP first from the transfer unit 200. The mediation table 302 is installed to be movable along the mediation table transport line 304 orthogonal to the delivery unit picker transport line 202.

Individual adsorption means of the delivery unit picker 204 are installed to rotate and seat the semiconductor package SP on the upper surface of the mediation table 302 in an arrangement as shown in FIG. 1. That is, the arrangement of the semiconductor package SP on the intermediate table 302 is in a state as shown in FIG. 1.

In the arrangement of the semiconductor package SP, cutting edges 502 of the cutting unit 500 to be described below are configured differently, so that one of the slits 314 of the slits 314 arranged in two lines on the jig 310. The semiconductor package SP seated in a row of is to allow the upper surface to be processed on the lower surface of the semiconductor package SP seated in a row of another slit 314. That is, if the cutting edge 502 of the cutting unit 500 is configured in the same manner, the above-described configuration may not be necessary.

Here, the mediation table 302 and the mediation table transfer line 304 may be composed of a plurality, in the present invention is composed of two. The intermediate table 302 and the intermediate table transfer line 304 is provided with two or more for the efficiency of the work process.

Along the fixed part picker transfer line 320 orthogonal to the intermediate table transfer line 304 and the fixed part picker transfer line 320, one end of the intermediate table transfer line 304 is used as the transfer means. A movable stationary picker 322 is provided.

The fixed part picker 322 grips the raw semiconductor package SP loaded on the intermediary table 302, loads it onto the seat block 392 of the package fixing device 350, and finishes the sheet block 392. ) Serves to transfer the semiconductor package SP loaded on the washing table 616 to the washing table 616.

As shown in FIGS. 4A and 4B, the fixing unit picker 322 is provided with a pick-up device 324. The pick-up device 324 includes suction means 326 for picking up the semiconductor package SP. The driving means 328 generates power so that the adsorption means 326 can move, and the interlocking unit 330 transfers the power generated from the driving means 328 to the adsorption means 326.

First, the adsorption means 326 allows the semiconductor package SP to be adsorbed by vacuum, and an adsorption nozzle 327 is provided at the tip. The suction nozzle 327 may be formed in a number of lines according to the user's needs, it is preferable that the suction nozzle 327 is arranged to correspond to the shape of the seat block 392, as shown in Figure 4b, In the present invention, it is preferable that the suction nozzles 327 consist of two rows of two.

In addition, the adsorption device 327 is provided with a drive means 328, the drive means 328 can be employed as a number of power sources, in the present invention is composed of a motor.

In addition, an interlocking unit 330 is provided to transfer the power generated by the driving means 328 to the adsorption means 326. In the present invention, the driving means 328 is constituted by a motor. Preferably, the rotational motion generated at 328 may be converted into a linear motion of the adsorption means 326.

The interlocking unit 330 is connected to one side of the support bar 332 supporting the adsorption means 326 and the support bar 332 so that the adsorption means 326 is movable to the adsorption device 326. The guide bar 334 is supported on, the rack gear 336 formed on the guide bar 334, the pinion 338 is provided on the rotating shaft of the drive means 328 and engaged with the rack gear 336.

The structure of the interlocking unit 330 and the adsorption means 326 will be described in more detail. The two adsorption nozzles 327 pass through the support bar 332 so that the tip of the adsorption nozzle 327 faces downward. To be installed. In addition, the guide bar 334 is provided with a rack gear 336, meshing with the pinion 338 of the drive means 328 is to convert the rotational movement of the drive means 328 to a vertical reciprocating motion. Of course, any configuration may be employed as long as the rack gear 336 and the pinion 338 can convert the rotational motion into a vertical reciprocating motion.

The adsorption device 327 is provided with a correction unit 340. The correction unit 340 is fixed to one side of the support bar 332, the correction bar 342 disposed in parallel with the guide bar 334, the elastic member 344 to elastically support the correction bar 342 It consists of

When the rack gear 336 and the pinion 338 are rotated when the rack unit 336 is engaged, the correction unit 340 generates a difference in motion transfer due to play between the gears, for example, a position error (backlash) occurs. To prevent this from happening.

Next, a semiconductor package fixing device 350 is provided to fix the semiconductor package SP transferred by the fixing picker 322 to the jig 310.

The semiconductor package fixing device 350 will be described with reference to FIG. 5A. The semiconductor package fixing device 350 may include a body unit 360 having a jig holder 376 fixing the jig 310, and a first push assembly inserting the semiconductor package SP into the jig 310. 390, the second push assembly 400 for removing the semiconductor package SP from the jig 310, and the jig holder 376 such that the semiconductor package SP is easily inserted into or fixed to the jig 310. It consists of a linkage unit 370 to move.

First, the body unit 360 of the semiconductor package fixing device 350 is composed of a horizontal member 362 constituting the bottom and a vertical member 364 orthogonal to the horizontal member 362. An interlocking unit 370 is provided between the horizontal member 362 and the vertical member 364.

The interlocking unit 370 includes horizontal interlocking means 372 slidable along the horizontal member 362 and vertical interlocking means 374 slidable along the vertical member 364. In addition, a jig holder 376 is provided between the horizontal interlocking means 372 and the vertical interlocking means 374. The jig holder 376 serves to fix the jig 310.

One end of the jig holder 376 is coupled to the upper end of the vertical interlocking means 374 by a hinge, and the jig holder 376 is rotatable about the upper end of the vertical interlocking means 374. In addition, the jig holder 376 is provided with a guide groove 378 along its side.

In addition, both sides of the horizontal interlocking means 372 are formed with both side walls 373 so as to support the jig holder 376, and a rotation shaft 380 is formed at an upper end of both side walls 373 in the inward direction. It is arranged to face each other. The rotation shaft 380 of the horizontal interlocking means 372 can operate as shown in FIGS. 5A to 5D along the guide groove 378 of the jig holder 376. In addition, the rotation shaft 380 may be further provided with a roller to facilitate the guide groove 378 and the drive.

In addition, any structure can be applied as long as the structure is slidable between the horizontal member 362 and the horizontal interlocking means 372, the vertical member 364 and the vertical interlocking means 374, for example, on one side of the guide. The groove is formed, the other side may be provided with a guide protrusion. Of course, the first motor and the second motor are separately provided in the horizontal interlocking means 372 and the vertical interlocking means 374, respectively, so that they can be slidably driven separately.

In addition, as illustrated in FIG. 5C, when the jig holder 376 is erected vertically, a jig holder fixing unit 384 may be provided to fix the jig holder 376 so as not to flow.

The jig holder fixing unit 384 is provided relatively downward from the vertical interlocking means 374. The jig holder fixing unit 384 is provided with an elastic member 387, for example, a spring inside the groove 386 recessed downward from the body 385 protruding perpendicular to the vertical interlocking means 374, The tip 388 of the spring 387 is provided with a protrusion 388 sliding along the groove 386 to expose the tip to the outside. That is, the protrusion 388 is elastically supported by the spring 387 so that the tip of the protrusion 388 is exposed to the outside.

On the other hand, when the jig holder 376 is erected vertically as shown in Figure 5c, the locking groove 389 is provided to correspond to the jig holder fixing unit 384 below. The locking groove 389 may be preferably engaged with the tip of the protrusion 388 of the jig holder fixing unit 384. This is to prevent the jig holder 376 from flowing because the locking groove 389 is engaged with the protrusion 388.

As shown in FIG. 7A, a jig seating hole 382 is provided in the jig holder 376. The jig seating hole 382 is formed to correspond to the outer shape of the jig 310, and is formed to suck the jig 310 by vacuum, jig 310 can be fixed to the jig seating hole 382 It is configured to be. The jig 310 hangs on the jig seating hole 382 may be configured in various ways at the level of those skilled in the art.

As described above, the package fixing device 350 is provided with a first push assembly 390. The first push assembly 390 is installed on the horizontal member 362 so as to be slidable separately from the horizontal interlocking means 372. The first push assembly 390 may be configured to move along an X axis and a Y axis along a base 391 installed in parallel to the horizontal member 362.

The first push assembly 390 may include a body portion 393 forming a body, a seat block 392 provided at a front end of the body portion 393, and the semiconductor package SP seated on an upper surface thereof. And a first push unit 395 movable horizontally to the same height as the seat block 392.

As shown in FIG. 8, the seat block 392 seats the semiconductor package SP to guide the sheet block 392 to be easily inserted into the slit 314 of the jig 310 by the first push 397. Do it.

The sheet block 392 is for guiding the semiconductor package SP to be stably inserted into the slit 314 of the jig 310, and the semiconductor package SP to the slit 314 of the jig 310. ) Can be stably guided, the seat block 392 may not be configured separately.

A recessed seating portion 394 is provided on an upper surface of the seat block 392. The seating portion 394 guides the semiconductor package SP to be positioned on an upper surface of the mounting portion 394 and to be accurately inserted into the slit 314.

In addition, as shown in FIG. 8, the seat block 392 is formed to be stepped, that is, the upper surface is formed in a two-layer structure. Each of the first seating portion 394a and the second seating portion 394b is preferably formed so that two semiconductor packages SP can be simultaneously inserted into the slit 314 of the jig 310. . Of course, the seat block 392 may be formed in a single layer or in multiple layers according to a user's needs.

In addition, an air hole 396 is provided in each of the first seating portion 394a and the second seating portion 394b. Air is adsorbed from the vacuum source to the air hole 396 so that the semiconductor package SP seated on the first seating portion 394a and the second seating portion 394b is accurately and stably positioned.

The first push unit 395 is provided on one side of the seat block 392, that is, in a direction opposite to the position where the jig holder 376 is installed. The first push unit 395 is configured to slide horizontally along an upper surface of the body portion 393.

The first push unit 395 is provided with a first push 397 slidable in a direction approaching or spaced apart from the seat block 392 in parallel with the seat block 392. The tip of the first push 397 is formed in two layers, as shown in FIG. 6A. The front end of the first push 397 formed of the two layers is the semiconductor package loaded on each of the first seating portion 394a and the second seating portion 394b of the seat block 392 stepped into the two layers. SP can be simultaneously inserted into the slit 314 of the jig 310.

In addition, the first push unit 395 is further provided with a drive unit, the first push 397 may be configured to slide along the upper surface of the body portion 393, the drive unit, shown in Figure 6a As shown, a motor (not shown) generating power by being supplied with power to one side, a first pulley 398a rotating in connection with a rotating shaft of the motor, and a predetermined distance from the first pulley 398a. And a belt 398c rotatable along the spaced second pulley 398b and the first pulley 398a and the second pulley 398b.

In addition, a fixing guide 398d may be provided between the belt 398c and the first push 397 to move the belt 398c and the first push 397 together. Of course, the configuration in which the first push 397 is slid along the upper surface of the body 393 may be variously employed at the level of those skilled in the art.

On the other hand, as shown in Figure 6a, the first push unit 395 is composed of a pair may be divided into a 1-1 push unit 395a and 1-2 push unit (395b). That is, the above-described sliding configuration is configured in the first-1 push unit 395a and the 1-2 push unit 395b to operate separately.

In addition, as shown in FIGS. 7A to 7E, the first-1 push unit 395a and the 1-2 push unit 395b include the slit 314 of the jig 310 as the semiconductor package SP. The sensing unit 399 is provided to prevent the first push unit 395 from malfunctioning due to interference between the edge of the slit 314 and the semiconductor package SP when inserted into or separated from the slit 314.

As shown in FIG. 6A, the first push 397 may include a push blade 397a contacting the semiconductor package SP at a distal end thereof and a push blade 397a movably supporting the push blade 397a downward. Push blade guide (397b), and the support guide (397c) for supporting from the back of the push blade (397a).

The sensing unit 399 may be provided between the push blade 397a and the support guide 397c. The sensing unit 399 includes an elastic member 399a for elastically supporting the push blade 397a, and a sensor 399b provided on either side of the push blade 397a or the support guide 397c. Can be configured. Of course, the guide bar 399c may be further provided to prevent the elastic member 399a from being separated between the push blade 397a and the support guide 397c.

For example, the elastic member 399a may be configured as a spring, and the sensor 399b may be configured as a contact sensor. That is, when the tip of the push blade (397a) hit the edge of the jig 310 and the push blade (397a) is not inserted into the slit 314 of the jig 310, the back of the push blade (397a) The sensor 399b operates by contacting the guide bar 399c to transmit a malfunction signal of the push blade 397a to a controller (not shown).

On the other hand, the second push assembly 400 is provided opposite the first push assembly 390 to correspond to the first push assembly 390. As shown in FIG. 6B, the second push assembly 400 may be configured in the same manner as the first push assembly 390.

For example, the second push assembly 400 may be composed of a 2-1 push unit 401a and a 2-2 push unit 401b, and each of the push units 401a and 401b may be pushed. 402, the driving unit 403 and the sensing unit 404 may be provided. In addition, the push 402 may be provided with a push blade 402a, a push blade guide 402b and a support guide 402c, the drive unit 403 is a first pulley (403a), a second pulley ( 403b), a belt 403c, and a fixing guide 403d may be provided. In addition, the sensing unit 404 may include an elastic member 404a and a sensor 404b.

 However, the second push assembly 400 moves from the right side to the left side in the drawing and seats the semiconductor package SP loaded in the slit 314 of the jig 310. 394).

Therefore, the tip of the push blade 402a of the second push 402 is different in length from the tip of the push blade 397a of the first push 397, as shown in FIG. 6B. . The length of the tip end of the push blade 402a of the second push 402 is to compensate for the distance difference between the first seating portion 394a and the second seating portion 394b of the seat block 392. . Preferably, the difference by the size of the first seating portion 394a should be compensated for.

In addition, referring to FIG. 5D, when the semiconductor package SP is inserted into the slit 314 of the jig 310 by the first push 397, the first push 397 may include the slit ( The vertical interlocking means 374, which is separated from the 314 and is responsible for the vertical movement of the jig holder 376, is moved upwards or downwards so that the slit 314, which is empty on the movement path of the first push 398, is positioned. Will be moved. Of course, the above operation is reversed when the semiconductor package SP is removed from the slit 314 by the second push 402.

Next, as shown in FIG. 1, the cutting part 500 for cutting the semiconductor package SP inserted into and fixed to the jig 310 in the package fixing part 300 will be described.

The cutting part 500 has a cutting edge 502 for cutting, a chuck table 504 configured to be rotatable by mounting the jig 310, and the chuck table 504 includes the cutting edge 502. It is configured to include a position change device 520 for changing the upper and lower surfaces by rotating the chuck table transfer line 506 and the jig 310 to be transferred to).

The cutting part 500 is provided with a cutting part picker 508 and a cutting part picker transfer line 509, and the cutting part picker 508 picks up a jig 310 loaded with the semiconductor package SP. , While moving along the cutting unit picker transfer line 509, it serves to transfer to the chuck table 504.

The chuck table 504 is provided below the moving path of the cutting part picker 508. The chuck table 504 is rotatable about a vertical axis, and is installed to be movable to the cutting edge 530 along the chuck table feed line 506 parallel to the cut picker feed line 504.

In addition, a jig 310 in which the semiconductor package SP is fixed is seated on an upper portion of the chuck table 504. After cutting one side of the jig 310, that is, the top surface of the jig 310, It is necessary to cut the lower surface. At this time, the position changing device 520 is fixed to the jig 310 to rotate about the horizontal axis to change the position of the lower surface and the upper surface.

Hereinafter, with reference to FIGS. 9A and 9B, the position changing device 520 includes a jig fixing means 530 for fixing a jig 310 into which a semiconductor package SP is inserted, and a jig fixing means 530. Rotating means 540 for rotating is provided. Since the position changing device 520 has to cut both ends of the semiconductor package SP in the process of cutting the semiconductor package SP inserted into the jig 310, the position changing device 520 rotates the jig 310. do.

The jig fixing means 530 is provided with a frame 532 in which a predetermined space is formed, and a jig seating space 531 for fixing the jig 310 into which the semiconductor package SP is inserted is provided. . The jig seating space 531 is preferably formed in a rectangular frame to correspond to the shape of the jig 510, the frame 532 may also be formed in a square.

As shown in FIG. 10, when the jig 310 is seated on the inner surface of the frame 532, the jig 310 temporarily fixes to the jig seating space 531 of the frame 532. The temporary fixing member 533 is provided as much as possible. The temporary fixing member 533 is a predetermined space is formed inside the frame 532 is provided with a locking projection (533a) that is capable of sliding the space, the spring 533b for elastically supporting the locking projection (533a). Can be configured. In addition, a locking groove 310a through which the locking protrusion 533a of the temporary fixing member 533 may be hooked may be provided on the outer surface of the jig 310. Of course, the above-described method for temporarily fixing the jig 310 to the jig seating space 531 of the frame 532, but other methods may be applied at the level of those skilled in the art.

At both ends of the frame 532, when the jig 310 is seated in the jig seating space 531, a fixing unit 534 is fixed to prevent the jig 310 from being separated from the jig seating space 531. Prepared.

The fixing unit 534 is provided at both ends of the frame 532 to fix both ends of the jig 310 while moving along the longitudinal direction of the frame 532. A fixing member 537 is provided inside this, and a moving member 538 for moving the fixing member 537 in the longitudinal direction of the frame 532 is provided.

If the fixing member 537 can fix the jig 310 so as not to be separated from the jig seating space 531, the fixing member 537 may be configured as one, but may be configured as a pair, and may move in a direction facing each other. Can be configured. In addition, the fixing slit 536 is formed to correspond to the shape of the corner so that both ends of the jig 310, that is, each edge of the jig 310 is inserted.

On the other hand, the moving member 538 may be provided in the fixing member 537, respectively. The moving member 538 may be a member capable of moving the fixing member 537, but should be a member capable of linear reciprocating motion. In the present invention, the moving member 538 may be configured as a cylinder.

In addition, the movable member 538 is provided in pairs at both ends of the fixing member 537, which is to allow the fixing member 537 to stably move in the direction of the jig seating space 531. .

In addition, the rotation means 540 of the position changing device 520 is provided on one side of the jig fixing unit 530 and the linear motion of the drive member 542 and the drive member 542 is linear The jig fixing means 530 is composed of an interlocking unit 544 to convert to a rotational movement so as to rotate.

Referring to FIG. 9A, the driving member 542 may be provided at one side of the position change device 520 to be configured as an air cylinder to perform a linear reciprocating motion. Then, the interlocking unit 544 is provided to convert the linear movement of the driving member 542 to the rotational movement of the jig fixing means 530.

The interlocking unit 544 is coupled to the driving member 542, and the rack 546 linearly moves together when the air cylinder of the driving member 542 moves, and the rotation shaft of the jig fixing unit 530. It is composed of a pinion 548 that is coupled to and engaged with the rack 546 and rotates. That is, the linear motion of the driving member 542 is converted into the rotational motion of the jig fixing means 530 by the rack 546 and the pinion 548.

Of course, the rotation means 540 is composed of a drive member 542 and the linkage unit 544 for converting the linear motion of the drive member 542 into a rotational motion, the linear motion rotational motion at the level of those skilled in the art Any configuration can be employed as long as it can be converted to. In addition, it may be composed of a motor, a drive, a driven gear and the like without the need to convert the linear motion into a rotary motion.

In addition, the position changing device 520 may be further provided with a moving means 550 for moving the jig fixing means 530 from the position changing device 520 to the outside. As shown in FIG. 1, the movement means 550 is provided with the position change device 520 parallel to the chuck table transfer line 506, so that the jig fixing means of the position change device 520 is provided. The 530 serves to move the distance apart from the chuck table 504.

The moving unit 550 includes a drive motor (not shown) for generating power by receiving power, a belt 552 for transmitting the power of the drive motor to the jig fixing unit 530, and the belt 552. It is fixed to the) is configured to include a belt fixing member 554 to transmit the power of the belt 552 to the jig fixing means (530).

Although not shown in FIG. 9A, the driving motor is provided in the position change device 520 to generate a rotational force so that the belt 552 can be driven.

The belt 552 is provided with pulleys 556 at both ends of the position change device 520, and is configured to be rotatable about the pulley 556. In addition, the belt 552 may be configured in pairs in parallel to the longitudinal direction of the position change device 520, that is, the direction in which the jig fixing means 530 is to move.

One side of the belt 552 is provided with a belt fixing member 554. The belt fixing member 554 is coupled to the jig fixing means 530, is fixed to the belt 552, so that the power of the belt 552 can be directly transmitted to the jig fixing means 530. do.

On the other hand, the jig fixing means 530 and the rotating means 540 may be configured detachably. For example, the pinion 548 coupled to the rotation axis of the jig fixing means 530 is configured to be movable to be orthogonal to the rack 546 moving direction with respect to the rack 546 of the rotating means 540. Can be.

That is, the belt fixing member 554 is provided in the jig fixing means 530, only the jig fixing means 530 including the pinion 548 by the movement of the belt 552 the rotation means 540 It can be configured to move away from the position change device 520 by moving away from the).

Meanwhile, referring again to FIG. 1, a cutting edge 502 is provided on the chuck table transfer line 506. The cutting edge 502 serves to cut the semiconductor package SP mounted on the jig 310 into a shape desired by a user.

In addition, two cutting edges 502 are formed in parallel. This is because the cutting edge 502 is formed in two parallel forms because the semiconductor package SP is stacked in two rows on the jig 310. The cutting edges 502 are each formed in two different shapes. This is because the two sides to be cut of the semiconductor package SP have different shapes. Of course, this may be a single shape according to the needs of the user, it can be applied in various ways.

For example, the cutting edge 502 may be provided to face the upper and lower surfaces. The jig 310 is provided at the top and bottom of the moving path to simultaneously cut the top and bottom surfaces of the semiconductor package SP inserted into the slit 314 of the jig 310. Of course, the position change device 520 is not necessary at this time.

Returning to the overall process of the semiconductor package processing system illustrated in FIG. 1, the cutting part 500 provided with the position change device 520 may be used to determine the semiconductor package SP mounted on the jig 310. When the processing is completed, the package fixing portion 300 is moved to each of the processed semiconductor package SP in the jig 310 is separated to the seat block 392, the fixed portion picker 322 is cleaned It is transferred to the drying unit 600.

The washing and drying unit 600 may be a process following the cutting operation, but in the present invention, it is preferable to be positioned perpendicular to the transfer unit picker transfer line 202.

As shown in FIGS. 11A to 11D, the cleaning and drying unit 600 includes a first washing unit 610 for washing the upper surface of the semiconductor package SP and a lower surface of the semiconductor package SP. It may be configured to include a second washing unit 650 for washing. Of course, the first washing unit 610 and the second washing unit 650 may be configured as one.

As an example, as shown in FIG. 11A, the first washing unit 610 includes a cleaning case 612 having a cleaning space 614 therein, and a semiconductor package in which the processing is completed. A washing table 616 on which the SP is seated, and a washing table transfer unit 618 which moves the washing table 616 along the washing space 614.

One side of the cleaning case 612, the nozzle 327 of the fixed part picker 322 is opened to enter and exit the cleaning space 614, and the other side unit picker 660 to be described below Is opened to enter and exit the cleaning space 614. The cleaning table 616 has a flat top surface, and allows the semiconductor package SP to be seated on the top surface.

The washing table transfer unit 618 may employ any one of those skilled in the art as long as the washing table transfer unit 618 is configured to transfer the washing table 616 along the washing space 614. In one embodiment it may be configured as shown in Figure 11a.

The washing table transfer unit 618 may include a motor 620 that receives power and generates power, a first pulley 622 interlocking with the motor 620, and the first pulley 622. And a second pulley 624 spaced apart from each other, and a belt 626 movably wound along the first pulley 622 and the second pulley 624. Of course, the washing table 616 is fixed to one side of the belt 626 so that the washing table 616 with the belt 626 is movable.

Various devices for cleaning the semiconductor package SP may be configured in the cleaning and drying space 650. An embodiment of the configuration for cleaning the semiconductor package SP may be provided as shown in FIG. 11A.

A first nozzle 628 is provided upward along the movement path of the washing table 616. The first nozzle 628 is configured to allow a liquid containing a surfactant for cleaning the semiconductor package SP to be sprayed toward the semiconductor package, thereby chemically cleaning the semiconductor package SP. . Of course, in addition to the surfactant, a degreasing agent may be further added to the first nozzle 628, and various other samples may be added according to the needs of the user.

The brush 630 is provided after the first nozzle 628. The tip of the brush 630 should be provided to be in contact with the semiconductor package SP located on the cleaning table 616 when the cleaning table 616 is positioned below the brush 630. Do. The brush 630 serves to physically clean the upper surface of the semiconductor package SP.

The second nozzle 632 is provided after the brush 630. The second nozzle 632 is configured to be sprayed toward the washing table 616. The second nozzle 632 serves to spray a liquid such as water to wash the semiconductor package SP.

The third nozzle 634 is provided after the second nozzle 632. The third nozzle 634 is also configured to be sprayed toward the washing table 616. The third nozzle 634 sprays air or the like to clean the semiconductor package SP.

In addition, a second washing unit 650 is provided at one end of the first washing unit 610. The second washing unit 650 is provided after the first washing unit 610, and the semiconductor package SP passing through the first washing unit 610 is transferred to the second washing unit 650. Any configuration may be employed.

In the present invention, as shown in Figure 1, the second washing unit 650 is provided to be orthogonal to the first washing unit 610. The second washing unit 650 serves to clean the bottom surface of the semiconductor package SP, which has been cleaned in the first washing unit 610.

Like the first washing unit 610, the second washing unit 650 may include a plurality of nozzles 652 and a brush 654. The nozzle 652 may be configured of a nozzle for injecting a liquid containing a sample for cleaning, a nozzle for injecting liquid and air, and the like.

In addition, the cleaning unit 600 may be further configured with various other means for cleaning the semiconductor package (SP). For example, a cleaning function using ultrasonic waves may be added.

Meanwhile, a unit picker 660 for transferring the semiconductor package SP from the first washing unit 610 to the second washing unit 650 and a unit picker transfer line 662 to which the unit picker 660 is moved. ) Is provided. The unit picker 660 serves to individually pick up the semiconductor package SP seated on the washing table 616 of the first washing unit 610 and seat it on the drying table 670 to be described below. do.

The unit picker 660 may be provided with as many adsorption means as the number of semiconductor packages SP to pick up the individual semiconductor packages SP. The adsorption means may be applied in a variety of configurations at the level of those skilled in the art, for example, a vacuum adsorption means may be configured. And, the suction means is required as many as the number of the semiconductor package (SP).

The unit picker 660 picks up the semiconductor package SP seated on the washing table 616 and passes through the second washing unit 650 to clean the bottom surface of the semiconductor package SP.

A drying table 670 is provided below one side of the moving path of the unit picker 660. A heater (not shown) is built in the drying table 670 so that the semiconductor package SP seated on the drying table 670 is completely removed while passing through the cleaning unit 600 and dried. It plays a role.

The drying table 670 is configured to be movable along the drying table transfer line 672. In the present invention, the drying table transfer line 672 is positioned perpendicular to the transfer unit picker transfer line 202. Further, more preferably, the drying table transfer line 672 may be configured to be adjacent to the intermediate table transfer line 304 in parallel. This is to prevent the size of the semiconductor package processing system from growing.

In addition, the semiconductor package SP, which has been cleaned in the washing and drying unit 600, is transferred to the loading unloading unit 100 by the transfer unit 200 again through the inspection unit 700.

As illustrated in FIG. 1, the inspection unit 700 may include a pair of inspection units 710 and 720, and may be configured to inspect the semiconductor package SP up and down. In addition, the inspection units 710 and 720 may be configured in plural.

The inspection units 710 and 720 may be configured as shown in FIG. 1 as an example. As shown in FIG. 1, a first inspection unit 710 moving along the unit peak transfer line 662 is provided. The first inspection unit 710 serves to determine whether the upper surface of the completed semiconductor package SP seated on the drying table 670 is defective.

Of course, the first inspection unit 710 grasps the position information of the semiconductor package SP seated on the drying table 670, and transfers the position information to the control unit, so that the transfer unit picker 204 is configured to perform the transfer. When the semiconductor package SP is picked up, the semiconductor package SP may be corrected to be positioned at the correct position. In particular, in the case of a semiconductor package of a ball grid array (BGA) type among the semiconductor packages SP, the correction operation is further required.

In addition, the first inspection unit 710 moves along the unit picker transfer line 662 and is mounted on the tray 102 on the move table 103 moving along the move table transfer line 104. It can also be determined whether the package SP is displaced or flipped over. The position information grasped by the first inspection unit 710 is input to a control unit of the semiconductor package processing system. Of course, even in this case, the transfer unit picker 204 is transferred to the intermediate table 302, so that the semiconductor package SP is corrected in position.

On the other hand, a second inspection unit 720 is provided below the movement path of the transfer unit picker 204 moving along the transfer unit picker transfer line 202. The second inspection unit 720 inspects a lower surface of the semiconductor package SP picked up and moved by the transfer unit picker 204 and determines whether the semiconductor package SP is defective.

In addition, the second inspection unit 720 also plays a role in determining the degree of the semiconductor package SP picked up by the transfer unit picker 204 from the home position, like the first inspection unit 710. .

In the configuration in which the second inspection unit 720 detects the position information of the semiconductor package SP picked up by the transfer unit picker 204, a pad unit (not shown at the tip of the nozzle of the transfer unit picker 204). 722 may be further provided. The pad part 722 is a reference point at which the second inspection unit 720 determines the correct position of the semiconductor package SP when the semiconductor package SP is picked up by the nozzle of the adsorption means 208. Play a role.

In more detail, the pad part 722 may be formed in a quadrangular shape. The pad part 722 is formed in a quadrangular shape so that the shape of the semiconductor package is formed in a polygonal shape so that the X-axis, the Y-axis, and θ can be easily identified based on each vertex.

That is, when the second inspection unit 720 looks at the semiconductor package SP from below, the second inspection unit 720 is shown as shown in FIG. 12, so that the position of the semiconductor package SP can be accurately determined.

The position information of the semiconductor package SP captured by the second inspection unit 720 is stored in the control unit of the semiconductor package processing system. Even if the pad portion 722 of the transfer unit picker 204 is worn or replaced, and the reference point for determining the position of the semiconductor package is changed, the degree of departure of the pad portion 722 is determined based on the information accumulated in the controller. Inversely, the reference point of the semiconductor package SP may be reset.

On the other hand, the position information of the semiconductor package SP identified by the first inspection unit 710 and the second inspection unit 720 is input to the control unit of the semiconductor package processing system, X, Y and θ are Is corrected. For example, the X-axis correction of the semiconductor package SP may be corrected while the transfer part picker 204 picks up the semiconductor package SP and moves along the transfer part picker transfer line 202.

In addition, the Y-axis correction of the semiconductor package SP may be performed by the drying table 670 along the drying table transfer line 672 while the transfer part picker 204 is picking up the semiconductor package SP. The degree of deviation of the semiconductor package from the Y-axis direction is corrected by moving in the axial direction. In addition, the movement table 103 is moved along the movement table transfer line 104 in the Y-axis direction to correct deviation of the semiconductor package SP in the Y-axis direction.

In the θ-direction correction of the semiconductor package SP, the transfer part picker 204 picks up and rotates the semiconductor package SP, thereby correcting the degree to which the semiconductor package SP deviates in the θ direction.

The inspection unit 700 may be configured as shown in FIG. 1 as described above, but may be configured in a greater number and other positions as shown in FIGS. 13 to 16.

First, in the configuration shown in FIG. 13, a third inspection unit 730 is further provided, and the third inspection unit 730 is configured to move along the tray picker transfer line 110. The third inspection unit 730 serves to inspect whether the semiconductor package SP is correctly positioned or, for example, turned upside down, on the tray 102 seated on the moving table 103.

Next, in the configuration shown in FIG. 14, a third inspection unit 730 in FIG. 13 is further provided, and may be configured to be movable along the unit picker transfer line 662. That is, the same line as the first inspection unit 710 is configured to be movable.

The third inspection unit 730 moves along the moving table transfer line 104 positioned below the unit picker transfer line 662 while moving along the unit picker transfer line 662. The semiconductor package SP mounted on the tray 102 of the table 103 is inspected whether it is correctly positioned.

In the configuration illustrated in FIG. 15, the fourth inspection unit 740 is further provided in the configuration illustrated in FIG. 14. Of course, the fourth inspection unit 740 may be configured to be movable along the unit picker transfer line 662. However, in the configuration of FIG. 15, the third inspection unit 730 has the semiconductor package SP seated on the tray 102 of the movement table 103 at the far left of the three movement tables 103. It is installed to check only whether it is present.

The fourth inspection unit 740 is a semiconductor package SP mounted on the trays 102 of the two movement tables 103 except for the movement table 103 inspected by the third inspection unit 730. ) May be configured to check whether it is correctly positioned.

That is, the inspection unit of any one of the third inspection unit 730 or the fourth inspection unit 740 is to check whether the semiconductor package (SP) loaded into the semiconductor package processing system is correctly positioned, The remaining inspection unit may be configured to determine whether the semiconductor package SP, which is processed and unloaded in the semiconductor package processing system, is correctly seated on the tray 102 of the moving table 103.

As another embodiment of the inspection unit 700, as illustrated in FIG. 16, the third inspection unit 730 may be provided below the moving path of the fixing unit picker 322. The third inspection unit 730 can inspect below whether the semiconductor package SP, which is picked up and transported by the fixed part picker 322, is correctly positioned.

In addition, the loading unloading unit 100, the delivery unit 200, the package fixing part 300, the cutting unit 500, the washing and drying unit 600, and the inspection unit 700 are all controlled by a controller (not shown). It is in electrical communication and controlled.

Hereinafter, the operation of the semiconductor package processing system of the present invention having the configuration as described above will be described in detail.

First, as shown in FIG. 1, any one of the trays stacked on the tray magazine 106 in which the plurality of trays 102 in which the semiconductor package SP in which the module process is completed is aligned is stacked. Is moved on the moving table.

When the tray picker 112 picks up the tray 102 from the tray magazine 106 in detail, the tray picker 112 does not pick up the tray 102 as shown in FIG. 2B. Indicates the state of.

When the control unit of the semiconductor package processing system sends a pickup signal of the tray 103 seated on the tray magazine 106, the tray picker 112 descends to the upper side of the tray magazine 106. If the tray picker 112 continues to descend, the inner surface of the guide bar 124 of the tray picker 112 surrounds the outer surface of the tray 102 seated on the tray magazine 106.

As the guide bar 124 surrounds the outer surface of the tray 102, the driving members 116b and 118b of the tray picker 112 are driven so that the pair of grippers 116a and 118a Move in a direction away from each other.

When the bottom surface of the body portion 114 of the tray picker 112 comes into contact with the tray 102, the driving member 116b of the first gripper portion 116 of the gripper portions 116 and 118 may In operation, the first gripper portion 116 grips both sides of the first tray 102a.

When the first gripper portion 116 grips both sides of the first tray 102a, the edge of the first tray 102a is inserted into the seating groove 116c of the first gripper 116a. The locking jaw 116d of the first gripper 116a supports the lower side of the first tray 102a.

The tray picker 112 may pick up another second tray 102b. That is, the tray picker 112 moves back to the tray magazine 106 and descends to pick up the second tray 102b.

When the tray picker 112 descends and the second tray 102b comes into contact with the bottom surface of the body portion 114 of the tray picker 112, the driving member 118b of the second gripper part 118 is moved. In operation, the second gripper 118a grips both sides of the second tray 102b.

When the second gripper 118a grips both sides of the second tray 102b, the edge of the second tray 102b is inserted into the seating groove 118c of the second gripper 118a, and the second The locking jaw 118d of the gripper 118a supports the lower side of the second tray 102b.

Therefore, the tray picker 112 picks up one tray 102a and 102b to the first gripper 116 and the second gripper 118 and transfers the two trays 102a and 102b at the same time. The overall process speed can be increased.

In addition, the first tray 102a may be generally configured as an empty tray, and the second tray 102b may be configured as a tray in which the semiconductor package SP is loaded. In this case, the first tray 102a acts as an insulator to prevent static electricity, sticking, etc. by interposing the semiconductor packages SP mounted on the second tray 102b to the tray picker 112. .

On the other hand, the first tray 102a may be configured as a colored tray. By configuring the first tray 102a in red, yellow or blue, for example, the trays stacked on the tray magazine 106 can be partitioned.

The tray 102 picked up by the tray picker 112 is seated on the moving table 103 or on the tray magazine 106 in the reverse order of the process.

When the tray 102 is loaded on the moving table 103, the moving table 103 moves downward along the moving table transfer line 104 under the transfer unit picker transfer line 202. When the moving table moves along the moving table transfer line 104, the transfer part picker 204 grips the semiconductor package SP on the tray 102 by a predetermined number so that the transfer part picker transfer line ( It moves along 202 and loads on the mediation table 302.

In the present invention, the transfer unit picker 204 is gripped and transported by eight. Of course, the transfer unit picker 204 may be held by adding various conditions to the control unit according to the needs of the user.

In addition, the direction in which the semiconductor package SP mounted on the intermediate table 302 is loaded becomes important, and this direction later depends on the shape of the cutting edge 502 of the cutting part 500.

That is, when the cutting edges 502 have the same shape, the semiconductor package SP inserted into the slit 314 of the jig 310 may be located in the same direction, but the cutting edges 502 may have different shapes. One is inserted into the slit 314 of the jig 310 to fit the cutting edge 502 when one is configured to cut the upper surface of the semiconductor package (SP) and the other is to cut the lower surface of the semiconductor package (SP) The direction of the semiconductor package SP should be modified as shown in FIG. 1.

In this case, since the semiconductor package SP inserted into the slit 314 of the jig 310 should be arranged in the opposite direction, the suction unit 208 of the transfer part picker 204 is formed by the slit 314. Rotate to match the direction. As shown in FIG. 3B, when the first driving means 222a rotates, the first and third suction means 208a and 208c rotate. Then, when the third driving means 222c rotates, the fifth and seventh suction means 208e and 208g rotate.

When the first, third, fifth and seventh adsorption means 208a, 208c, 208e, and 208g rotate, the semiconductor package SP picked up by the delivery picker 204 is as shown in FIG. Are arranged in position. In addition, the transfer unit picker 204 may place the semiconductor packages SP on the upper surface of the mediation table 302.

When the stacking of the semiconductor package SP is completed on the intermediate table 302, the intermediate table 302 is gripped in two rows by the fixed part picker 322 so that the fixed part picker transfer line 320 is fixed. It moves along and is loaded on the seating portion 394 of the upper surface of the seat block 392.

The driving means 328, which adjusts the height of each row of the fixed part picker 322, is operated to support the suction nozzle 327 to be loaded on the first seating portion 394a. The semiconductor package SP is mounted on the seating portion 374 of the upper surface of the seat block 372 by moving the support bar 332b supporting the adsorption nozzle 327 mounted on the seating portion 394b relatively downward. Each will be seated.

At this time, the semiconductor package SP is accurately vacuumed and adsorbed on the upper surface of each seating part 372 through an air hole 376. When the controller determines that the semiconductor package SP is correctly positioned through the air hole 376, the motor for driving the horizontal interlocking means 372 and the vertical interlocking means 374 is driven.

That is, the horizontal interlocking means 372 moves in the direction of the vertical member 364, and the vertical interlocking means 374 moves upward, and grips the jig 310 as shown in FIGS. 5A to 5D. Make sure the jig holder 376 is standing vertically.

In more detail, the rotating shaft 380 of the horizontal interlocking means 372 is slid while rotating along the guide groove 378 of the jig holder 310, and the vertical interlocking means 374 is rotated. The tip end of the hinged jig holder 376 rotates to operate as shown in FIG. 5C.

After the jig holder 376 is completely vertical, the controller drives a motor to operate the first push assembly 390 so that the first push assembly 390 approaches the front of the jig holder 376. By sliding until the operation as shown in Figure 5d.

When the first push assembly 390 is close to the front surface of the jig holder 376, the controller drives a motor for operating the first push unit 398, so that the first push 398 is The semiconductor package SP mounted on the seat block 392 is pushed and pushed until it is completely inserted into the slit 314 of the jig 310.

When the insertion of the semiconductor package SP is completed, the motor for operating the first push unit 398 is driven in reverse again so that the first push unit 398 is completely removed from the seat block 392. At this time, the vertical interlocking means 374 for adjusting the vertical movement of the jig holder 376 moves upward or downward to move the empty slot 314 of the jig 310 to the movement direction of the first push unit 398. To be located at

After the first push unit 398 is separated from the seat block 392, the fixing part picker 322 again grips the semiconductor package SP on the intermediary table 304 in two rows, each of which is two sheets. It loads into the seating part 394 of the block 392.

When the semiconductor package SP is loaded on the seat block 392 again, the above-described operation is repeated, so that the empty slot 314 of the jig 310 is filled with the semiconductor package SP.

Meanwhile, as illustrated in FIG. 6A, the first push unit 395 may be configured separately, and a sensing unit 399 is provided. When the first push unit 395 inserts the semiconductor package SP into the slit 314 of the jig 310, the first push unit 395 hits an edge of the slit 314 of the jig 310, thereby causing a malfunction.

For example, the push blade 397a of the first-first push unit 395a moves the semiconductor package SP in the seating portion 394 of the seat block 392 to the slit 314 of the jig 310. Pushed into the inside, the push blade (397b) of the 1-2 push unit (395b), the semiconductor package (SP) of the seat block 392 is caught on the edge of the slit (314) of the jig (310) When the slit 314 is not inserted into the slit 314, the first-first push unit 395a is moved into the slit 314 without being caught, whereas the 1-2 push unit 395b does not move smoothly. The push blades 397a of the 1-2 push unit 395b overcome the elastic force of the elastic member 399a, while the push blades 397a of the 1-2 push unit 395b support the support guide 398a. Pushed in the direction.

The push blade 397a of the 1-2 push unit 395b is pushed toward the support guide 398a, so that the rear surface of the push blade 397a and the sensor 399b of the support guide 398a come into contact with each other. The sensor 399b operates to transmit a malfunction signal of the first and second push units 395b to the control unit of the semiconductor package processing system.

The control unit receiving the malfunction signal moves the first push assembly 390 in a direction orthogonal to the horizontal direction with respect to the direction in which the jig 310 is moved forward and backward along the base 391. After the first push assembly 390 is moved, the controller drives the motor to move the first push unit 395 in the direction of the slit 314 of the jig 310.

Then, the semiconductor package SP, which is not inserted into the edge of the slit 314 of the jig 310, is pushed by the operation of the first push unit 395 to be pushed into the slit 314 of the jig 310. It will be inserted stably.

In the above-described method, when the semiconductor package SP is completely filled in the slot 314 of the jig 310, the horizontal interlocking means 372 moves to the left in the drawing. It moves downward so that the jig holder 376 is positioned horizontally to operate as shown in FIG. 5A.

When the jig holder 376 is positioned horizontally, the controller drives the cutting unit picker 508 to grip the jig 310 and to transfer the jig 310 above the chuck table 504. When the jig 310 is positioned on the chuck table 504, the chuck table 504 is rotated by 90 degrees and moves along the chuck table transfer line 506, where the cutting edge 503 is rotated. .

Accordingly, the semiconductor package SP loaded on the jig 310 is cut along the cutting edge 502 while moving along the chuck table transfer line 506.

When the machining of one side of the semiconductor package SP of the jig 310 on the chuck table 504 is completed, the chuck table 504 is returned to its original position along the chuck table transfer line 506. The cutting part picker 508 picks up the jig 310 again. This is to rotate the jig 310 for processing of the other side of the semiconductor package SP fixed to the jig 310.

When the cutting part picker 508 picks up the jig 310 and ascends, the jig fixing means 530 of the position changing device 520 slides into a space between the jig 310 and the chuck table 504. Is inserted. That is, the moving means 550 of the position changing device 520 is driven to move the jig fixing means 530, as shown in FIG. 8B.

In more detail, when the drive motor of the moving means 550 is driven, the belt 552 received power from the drive motor along the pulleys 556 provided at both ends of the position change device 520. By rotating, the belt fixing member 554 is moved.

The belt fixing member 554 is fixed to the jig fixing means 530, the belt fixing member 554 is moved together with the jig fixing means 530, the jig fixing means 530 is When positioned between the cutting part picker 508 and the chuck table 504, the cutting part picker 508 mounts the jig 310 in the jig seating space 531 of the jig fixing means 530.

In addition, the movable member 538 of the fixing unit 534 is driven so that the jig 310 is more firmly fixed to the jig seating space 531, so that the fixing member 537 moves toward the jig 310. Will move. When the fixing member 537 moves in the direction of the jig 310, an edge portion of the jig 310 is inserted into the fixing slit 536 of the fixing member 537.

As the edge of the jig 310 is inserted into the fixing slit 536, the jig 310 is completely fixed to the position changing device 520. When the jig 310 is fixed to the position change device 520, the drive motor of the moving means 550 is driven in the reverse direction again, the belt 552 is rotated in the reverse direction, the belt fixing member ( The jig fixing means 530 coupled to 554 is moved back to its original position.

When the jig fixing means 530 is positioned to the original position of the position changing device 520, the driving member 542 of the rotating means 540 is driven. When the driving member 542 is driven, the jig fixing means 530 is rotated by the interlocking unit 544.

That is, the linear reciprocating motion of the drive member 542 is converted into a rotational motion by the rack 546 coupled to the drive member 542 in conjunction with the pinion 548 provided in the jig fixing means 530. The jig fixing means 530 is rotated.

When the jig fixing means 530 is rotated so that the side surface of the semiconductor package SP which has not yet been processed is positioned upward, the driving motor of the moving means 550 is driven again, and the jig fixing means ( 530 is positioned between the cut picker 508 and the chuck table 504.

At this time, the moving member 538 of the jig fixing means 530 is driven to move the fixing member 537 away from the jig 310. When the fixing member 537 moves away from the jig 310, the cutting part picker 508 may pick up the jig 310 and ascend.

When the jig 310 is removed from the jig fixing means 530, the driving motor of the movement means 550 is driven again so that the jig fixing means 530 moves to the original position of the position changing device 520. As shown in FIG. 8A.

Then, the cutting part picker 508 picking up the jig 310 descends again to seat the jig 310 on the chuck table 504. Then, the chuck table 504 is rotated 90 degrees to move to the cutting edge 502 along the chuck table transfer line 506. Therefore, the other side surface of the semiconductor package SP fixed to the jig 310 is cut.

When the cutting of the semiconductor package SP of the jig 310 is completed, the chuck table 504 is returned to its original position along the chuck table transfer line 506, and the chuck table 504 is reversed by 90 degrees. Will rotate. When the chuck table 504 is rotated, the cutting part picker 508 grips the jig 310 and moves along the cutting part picker transfer line 509 to jig-seat holes of the jig holder 376. The jig 310 is seated at 382.

When the jig 310 is fully seated and fixed to the jig holder 376, the horizontal interlocking means 372 moves to the right and the vertical interlocking means 374 moves upward, as shown in FIG. 5B. The jig holder 376 is erected vertically. When the jig holder 376 is erected and operated as shown in FIG. 5C, a motor for driving the first push unit 390 is driven to move the first push unit 390 to the front of the jig holder 376. By sliding until close, it is driven as shown in FIG. 5D.

In addition, a motor driving the second push 402 is driven so that the second push 402 penetrates the slit 314 in the rear direction of the jig 310 to be loaded into the slit 314. The semiconductor package SP is moved to a seating portion 394 of the seat block 392.

At this time, the tip of the second push 402 has a two-layer structure, and the length of the tip that is relatively upward is shorter than that of the bottom, so that the second push 402 pushes the semiconductor package SP. Even if the first seat 394a and the second seat 394b of the stepped seat block 392 is accurately seated.

When the semiconductor package SP is loaded on the seating part 394, the fixed part picker 322 moves along the fixed part picker transfer line 320 to allow the first seating part 374a and the second seating. It is located above the portion 374b, and the semiconductor package SP is held by the lowering of the driving means 328.

At this time, the support bar 332a, 332b to which the suction nozzle 327 provided in two rows is coupled to the fixed part picker 322 is driven by separate driving means 328a and 328b, respectively, The semiconductor package SP placed on the first seating portion 394a and the second seating portion 394b on the block 392 can be easily gripped.

The fixed part picker 322 holding the semiconductor package SP moves along the fixed part picker transfer line 320 to hold the semiconductor package SP and transfer the picked portion to the cleaning and drying part 600.

The fixing part picker 322 of the cleaning and drying part 600 mounts the semiconductor package SP on the cleaning table 616 of the first washing part 610. When the semiconductor package SP is seated on the washing table 616, the controller drives the motor 620 to move the washing table 616 along the belt 626.

The washing table 616 is firstly positioned below the first nozzle 628. When the washing table 616 is positioned below the first nozzle 628, the first nozzle 628 faces the semiconductor package SP of the washing table 616, and contains a surfactant or the like. Spray to ensure chemical cleaning.

While passing through the first nozzle 628, the semiconductor package SP is moved under the brush 630. The upper surface of the semiconductor package SP is physically cleaned by the brush 630. In addition, the washing table 616 passing through the brush 630 is positioned below the second nozzle 632.

When the washing table 616 is positioned below the second nozzle 632, the second nozzle 632 sprays a liquid such as water toward the semiconductor package SP. That is, the foreign matter remaining in the semiconductor package SP and the cleaning agent sprayed from the first nozzle 628 are cleanly removed by the liquid sprayed from the second nozzle 632.

The washing table 616, which has passed through the second nozzle 632, is positioned below the third nozzle 634. Then, the third nozzle 634 injects air or the like to the washing table 616. Water remaining in the semiconductor packages SP seated on the cleaning table 616 is primarily removed by the air injected from the third nozzle 634.

When the washing table 616 passes through the third nozzle 634, the washing table 616 is positioned below the unit picker 660. The unit picker 660 descends toward the washing table 616, picks up the semiconductor package SP seated on the washing table 616, and moves to the second washing unit 650.

The unit picker 660 picks up all of the semiconductor package SP of the washing table 616 at one time, and moves above the second washing unit 650 along the unit picker transfer line 662. Similar to the first washing unit 610, the second washing unit 650 may be physically and chemically cleaned on the lower surface of the semiconductor package SP due to various nozzles 652 and brushes 654.

Since there is still water in the semiconductor package SP that has passed through the second washing part 650, the unit picker 660 may remove the semiconductor packages SP to completely dry the semiconductor package SP. It is seated on the drying table 670.

A heater is built in the drying table 670 to completely dry the semiconductor packages SP mounted on the drying table 670 by heat. When the drying is completed in the drying table SP, the first inspection unit 710 moves along the unit picker transfer line 672.

That is, the first inspection unit 710 is positioned above the drying table 670 to inspect whether the top surfaces of the respective semiconductor packages SP mounted on the drying table 670 are defective. . In addition, the first inspection unit 710 transmits a result of whether the upper surfaces of the semiconductor packages SP are defective to the controller.

In addition, in the first inspection unit 710, whether the semiconductor packages SP mounted on the drying table 670 are positioned at a correct position, that is, the positions where the semiconductor packages SP are seated are shifted. Check the degree Then, the inspection result is sent to the control unit.

When the inspection is completed in the first inspection unit 710, the drying table 670 is moved below the transfer path of the transfer unit picker 204 along the drying table transfer line 672. In addition, the transfer unit picker 204 picks up the semiconductor packages SP on the drying table 670. In this case, a first correction is performed to correct the positions of the semiconductor packages SP. do.

As shown in FIG. 23, the semiconductor packages SP on the drying table 670 may have a semiconductor package SP seated in place, but many semiconductor packages SP may not exist. Therefore, the position information of the semiconductor packages SP on the drying table 670 transmitted from the first inspection unit 710 to the controller is transferred to the transfer unit picker 204, as shown in FIG. 24. By the relative movement of the transfer unit picker 204 and the drying table 670, the first correction is made.

For example, the X-axis correction of the semiconductor package SP is performed by the transfer part picker 204 moving in the X-axis direction by a predetermined range and picking up the semiconductor package SP.

The Y-axis correction of the semiconductor package SP is performed by the drying table 670 moving in the Y-axis direction by a predetermined range and picked up by the transfer part picker 204.

In addition, the θ correction of the semiconductor package SP is performed by the transfer part picker 204 picking up the semiconductor package SP and rotating it by a predetermined angle.

The semiconductor packages SP of which the first correction is completed are picked up by the transfer unit picker 204 and move upward along the transfer unit picker transfer line 202 above the second inspection unit 720.

When the transfer unit picker 204 is moved above the second inspection unit 720, the second inspection unit 720 is picked up by the transfer unit picker 204 and transferred to the semiconductor package SP. The lower surface of the test is to check whether or not.

The second inspection unit 720 inspects whether the lower surface of the semiconductor packages SP picked up by the transfer unit picker 204 is defective and transmits the result to the controller.

In addition, the second inspection unit 720 inspects the degree to which the semiconductor package SP, which is picked up by the transfer unit picker 204, is displaced at a correct position. In other words, the second inspection unit 720 is a structural and other environmental factors such as the semiconductor package (SP) first corrected by the first inspection unit 710 is transferred by the transfer unit picker 204 For example, it is checked whether the position of the semiconductor package SP is converted by the backlash between the gears and transmits the result to the controller.

Particularly, at this time, a rectangular pad portion 722 is provided at a lower end of the transfer portion picker 204, and as shown in FIG. 12, the position of the pad portion 722 and the relative position of the semiconductor package SP. That is, the degree of deviation of the semiconductor package SP is determined in consideration of the X axis and the Y axis θ.

In addition, since the deviation of the position of the semiconductor package SP inspected by the second inspection unit 720 is largely corrected by the first inspection unit 710, an error within a very small range is corrected.

Therefore, as a result of inspecting the position of the semiconductor package SP in the second inspection unit 720 compared to the pad portion 722, the results inspected by the second inspection unit 720 are accumulated. If the control unit judges that the standard error range is exceeded, it is fed back to determine that the pad unit 722 is erroneously positioned so that the user can know the result and readjust the pad unit 722. .

When the inspection is completed in the second inspection unit 720, the transfer unit picker 204 is transferred to the moving table 103 along the transfer unit picker transfer line 202. At this time, the second correction occurs.

The X-axis correction of the semiconductor package SP is corrected while the transfer picker 204 moves along the transfer picker transfer line 202, that is, the X axis. The Y-axis correction of the semiconductor package SP is corrected while the moving table 103 moves along the moving table transfer line 104, that is, along the Y-axis direction. In addition, the θ correction of the semiconductor package SP is corrected by rotating the transfer unit picker 204.

Of course, the transmitter picker 204 may move in the X-axis, Y-axis, and θ directions of the present system, so that the above-described correction is possible with the transmitter picker 204 itself.

In particular, the transfer unit picker 204 moves along the transfer unit picker transfer line 202, and is different from the error information transmitted from the control unit to the transfer unit picker 204 under the influence of a backlash. 204 may seat the semiconductor package on the movement table 103.

In this case, the control unit uses the information of each pad unit 722 of the transfer unit picker 204, the transfer unit picker 204 is centered around the CPK value (process capability index) of the transfer unit picker 204 Operation so that feedback can be minimized to minimize the occurrence of malfunctions.

When the correction is completed, the transfer unit picker 204 mounts the semiconductor packages SP on the tray 102 of the moving table 103.

The transfer unit picker 204 receives defect information of the semiconductor package SP stored in the control unit, and the defective semiconductor packages SP rework a moving table for loading the defective semiconductor packages SP. The semiconductor packages SP, which are determined to be good, are placed in a tray and in a good tray of the moving table.

The moving table 103, in which the semiconductor package SP is loaded on the tray 102, is moved along the moving table transfer line 104 to be positioned below the tray picker transfer path, and the tray picker ( 112 picks up the tray 102, loads it into a predetermined tray magazine 106, and unloads it. In addition, the tray picker 112 is configured to pick up two trays 102 at the same time, the unloading process is made quickly.

Of course, the tray picker 112 may be configured in a plurality of side by side, and may pick up and stack the tray 102 that is loaded on the moving table 103 and moves at a time.

19 and 20A to 20E, a description will be given of the above semiconductor processing system employing a position change device as a second embodiment.

First, in the semiconductor package processing system, the position change device 5200, which is the second embodiment, is positioned on the chuck table transfer line 5060, unlike the position change device 520, which is the first embodiment, as shown in FIG. Done. That is, unlike the position change device 520 of the first embodiment, no moving means is provided.

Looking at the configuration of the position change device 5200, the position change device 5200, as well as the position change device 520 of the first embodiment described above, the jig (3100) to which the semiconductor package SP is inserted and fixed It comprises a jig fixing means 5300 and a rotating means 5400 for rotating the jig fixing means 5300, the basic configuration is the same. However, the specific configuration will be different as follows.

The jig fixing means 5300 is provided at a position facing the first fixing member 5310 and the first fixing member 5310 to fix one side of the jig 3100 to rotate the jig 3100. A second fixing member 5320 for fixing the other side of the jig 3100 and a side of the first fixing member 5310 or the second fixing member 5320 are formed on the fixing member while forming a center. 5310 and 5320 are configured to include a movable member 5330 to move in the direction of the jig 3100.

The first fixing member 5310 is rotatably fixed to the position change device 5200. In addition, the second fixing member 5320 is rotatably fixed to a portion facing the first fixing member 5310. That is, the first fixing member 5310 and the second fixing member 5320 form a rotation shaft of the position change device 5200.

A first support shaft 5312 is provided at the front end of the first fixing member 5310. The front end of the first support shaft 5312 is formed of two or more protruding shafts. The shaft is to allow the jig 3100 to rotate when the first support shaft 5312 is rotated.

A second support shaft 5322 is provided at the tip of the second fixing member 5320. The tip of the second support shaft 5322 may be formed of two or more protruding shafts similarly to the first support shaft 5312. However, when it is not necessary to transmit the rotational force of a motor or the like to the jig 3100 on the second support shaft 5322, it may be configured as one protruding shaft.

The position change device 5200 is provided with a moving member 5330. The movable member 5330 serves to provide power to the first support shaft 5312 to reciprocate in the direction of the jig 3100, that is, the direction of the second support shaft 5322.

That is, the first support shaft 5312 can move in the direction of the second support shaft 5322 so that the jig 3100 is detachably attached to the jig fixing means 5300. Of course, the movable member 5330 may be configured only at one end of the first support shaft 5312 or the second support shaft 5322, and the first support shaft 5312 and the second support shaft 5322. It may be provided at both ends of the).

In addition, the position change device 5200 is provided with a rotation means 5400. The rotating means 5400 is provided at one side of the first fixing member 5310 or the second fixing member 5320 to provide power to the jig 3100 to rotate. The rotating means 5400 may be composed of, for example, a drive motor.

In addition, the position change device 5200 is provided with a washing unit (5500). The washing unit 5500 may be provided inside the jig fixing unit 5300, and the nozzle of the washing unit 5500 is configured to face the jig 3100 fixed to the jig fixing unit 5300. Can be. In addition, the washing unit 5500 may be configured to be rotatable so that when the nozzle is not driven, the nozzle is directed in the opposite direction to the jig 3100, and when the nozzle is driven, the washing unit 5500 is directed toward the jig 3100.

The cleaning unit 5500 removes and cleans foreign substances generated when cutting the semiconductor package SP fixed to the jig 3100 when the position change device 5200 rotates while picking up the jig 3100. It plays a role.

Hereinafter, the operation of the semiconductor processing system employing the position changing device of the second embodiment in the present invention having the above-described configuration will be described in detail.

First, the cutting portion 4000 has a configuration as shown in FIG. At this time, when the chuck table 5040 of the jig 3100 on which the semiconductor package SP of one side is completed is positioned at the lower end of the cutting part picker 5080, the cutting part picker 5080 is the jig. The 3100 is picked up and raised.

Thereafter, the cut picker 5080 moves along the cut picker transfer line 5090. The cutting unit picker 5080 may be positioned above the position change device 5200. Then, the jig 3100 is seated in the jig seating space inside the jig fixing means 5300 of the position change device 5200, as shown in Figure 20a.

When the jig 3100 is seated in the jig seating space, the first fixing member 5310 moves in the direction of the jig 3100 by driving the moving member 5330. While the first fixing member 5310 moves in the direction of the jig 3100, the jig 3100 is moved in the direction of the second fixing member 5320, so that both ends of the jig 3100 are fixed to the first fixing member 5310. The member 5310 is engaged with the second fixing member 5320, as shown in FIG. 20B.

In more detail, the first support shaft 5312 of the first fixing member 5310 and the second support shaft 5322 of the second fixing member 5320 are coupled to both ends of the jig 3100. do. When the jig 3100 is fixed to the jig fixing means 5300, the rotation means 5400 is driven to rotate the jig 3100 by 180 degrees.

When the rotating means 5400 rotates the jig 3100 by 180 degrees, the top and bottom surfaces of the jig 3100 are changed. At this time, air or the like is sprayed from the washing unit 5500 provided at one side of the jig fixing unit 5300 to remove foreign matter accumulated in the jig 3100.

When the rotation of the jig 3100 is completed by the rotating means 5400, the cutting part picker 5080 moves upwardly of the jig 3100, and grips the jig 3100 and moves By the driving of the member 5330, the first fixing member 5310 and the second fixing member 5320 move in a direction away from the jig 3100, so that the first supporting shaft 5312 and the second support member 5330 move. The support shaft 5322 is separated from the jig 3100, and the cutting part picker 5080 picks up the jig 3100.

The cutting part picker 5080 picks up the jig 3100 and moves upward again along the cutting part picker transfer line 5090 to the chuck table 5040, whereby the jig (50) is disposed on an upper surface of the chuck table 5040. 3100).

The chuck table 5040 on which the jig 3100 is seated moves to the cutting edge 5020 to cut the other side of the semiconductor package SP. The jig 3100 that fixes the semiconductor package SP after the cutting is completed is performed in the same manner as described above.

The rights of the present invention are not limited to the embodiments described above, but are defined by the claims, and those skilled in the art can make various modifications and adaptations within the scope of the claims. It is self-evident.

For example, in the present invention, the first push assembly 390 is configured to slide by approaching the vertical member 364 in which the jig 310 is erected vertically. It may be configured to approach the first push assembly 390.

21A to 21D, the jig holder 376 is not hinged to the vertical interlocking means 374, and the jig holder 376 is rotatable only in the horizontal interlocking means 372. It may be provided to be slidable.

The first push 398 and the second push 402 may be formed of three layers, as shown in FIGS. 21A to 21D. Of course, when the first push 398 and the second push 402 is composed of three layers, the seat block 392 may also be composed of three layers of the seating portion 394.

And, as shown in Figure 22, the above-described position conversion device 520 'of the first embodiment may be configured to be located on the chuck table transfer line 506'. As shown, only the position conversion device 530 'is provided in the above-described configuration of the first embodiment, and the position conversion device 530' may be configured to move up and down along the guide G. In addition, there is provided a rotation means for rotating the jig fixing means (530 '), it may be composed of a motor or the like.

That is, the chuck table 504 ′ having the jig 310 mounted thereon is positioned below the position conversion device 520 ′ while being moved along the chuck table transfer line 506 ′. 520 'picks up the jig 310, ascends along the guide G, and after the rotation means 540' of the position changer 520 'rotates, the position changer 520' ) May be lowered along the guide G to allow the jig 310 to seat on the chuck table 504 ′.

As shown in FIG. 1, the direction of the semiconductor package SP inserted into the slit 314 of the jig 310 should be set according to the direction of the cutting edge 502. In the transfer part picker 204 is configured to be rotatable to secure the direction, but the direction only need to be secured until inserted into the slit 314, as shown in FIG. By configuring the picker 322 to be rotatable, the orientation of the semiconductor package SP inserted into the slit 314 of the jig 310 may be secured.

In addition, as shown in FIG. 17, the seating portion 394 of the seat block 392 may be configured to rotate. When the seating portion 394 of the seat block 392 is rotated, the semiconductor package SP, which is eventually inserted into the slit 314 of the jig 310, maintains its orientation and thus exhibits the same effect as in FIG. 1. Can be.

In addition, in FIG. 18, the mediation table 302 may be configured to rotate. After mounting the first and third semiconductor packages SP of the semiconductor package SP seated on the intermediate table 302 by the transfer unit picker 204, as shown in FIG. 18A, 180 18B, when the transfer part picker 204 seats the second and fourth semiconductor packages SP, it is placed on the intermediate table 302 as shown in FIG. 18C. The semiconductor package SP maintains directivity.

According to the semiconductor package processing system and the semiconductor package processing method according to the present invention as described in detail above, the overall process is automatically made, the overall size of the semiconductor package processing system and semiconductor package processing method is reduced, the cost and time is reduced have.

Claims (12)

A loading unloading unit configured to load or unload a semiconductor package; A package fixing part for fixing the semiconductor package to the jig by pushing the semiconductor package loaded by the loading and unloading part into a slit of a jig; A cutting part for processing side surfaces of the semiconductor package fixed to the jig; A first washing unit to wash any one surface of an upper surface or a lower surface of the semiconductor package in which cutting is completed by the cutting unit; And, And a second secondary cleaning unit for cleaning the other surface of the semiconductor package. The method of claim 1, And a transfer unit configured to transfer the semiconductor package loaded by the loading unloading unit to the package fixing unit. The method according to claim 1 or 2, The semiconductor package processing system further comprises a drying unit for drying the semiconductor package, the cleaning is completed in the first and second washing unit. The method of claim 1, The cutting unit is a semiconductor package processing system further comprises a position conversion device for converting the upper and lower surfaces of the jig. The method of claim 1, The semiconductor package processing system further comprises an inspection unit for inspecting whether the cutting of the semiconductor package is complete. Loading the semiconductor package into a processing system; A package fixing step of fixing the semiconductor package to the jig by pushing the loaded semiconductor package into a slit of a jig; Cutting a side surface of the semiconductor package fixed to the jig; And, A first washing step of washing any one surface of an upper surface or a lower surface of the semiconductor package after the cutting step is completed; A second washing step of washing the other surface of the semiconductor package; And, And an unloading step of unloading the semiconductor package in a processing system. The method of claim 6, And a drying step of drying the semiconductor package after completion of the second washing step. delete delete delete The method of claim 1, The first cleaning unit is a semiconductor package processing system, characterized in that the cleaning is formed in the transverse direction (Y direction) between the package fixing portion and the cutting portion. The method of claim 11, The second washing unit is a semiconductor package processing system, characterized in that formed in series with the first washing unit to be washed in the longitudinal direction (X direction) successively cleaning the semiconductor package is completed in the first washing unit.

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