JPH0384949A - Pasting of adhesive tape on wafer - Google Patents

Abstract

PURPOSE:To prevent a back tension from being exerted on an adhesive tape as far as possible by a method wherein the adhesive tape between a supply reel and a pasting roller is loosened, a swing roller is brought into contact with the adhesive tape in a loosened part and the tape is pasted on a water. CONSTITUTION:An adhesive tape 51 is pasted on the surface of a wafer 3 which has been fed between pasting rollers 45, 46 when the roller 46 is driven; the wafer is moved to a tape-cutting means. Under conditions that an arm 71 is turned upward and that a detector 102 acts, a supply reel 50 is driven and the adhesive tape 51 is drawn out. When the adhesive tape 51 is drawn out, the arm 71 is turned downward, a swing roller 49 is lowered and absorbed a slack of the tape 51 and keeps a tension of the tape 51 definite. When the arm 71 is lowered to a definite position, a detector 103 acts; a motor is stopped and a drawing-out operation of the tape 51 is stopped. When a tension caused at the adhesive tape between the supply reel and the pasting roller is weakened to an extent that it does not exert a back tension on the tape and that the tape is not wrinkled, a tension of more than a required magnitude is not exerted on the tape and the tension becomes definite.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention applies an adhesive tape to the top of a glue of any shape, such as a circular shape, such as a silicon wafer that serves as a substrate for an integrated circuit, and then attaches this tape to the wafer. The present invention relates to a method for bonding adhesive tapes using a wafer and adhesive tape bonding device, such as a device that cuts along the outer periphery of a wafer and then peels off the tape other than the portion bonded to the wafer.

[Conventional technology]

A conventional wafer-adhesive tape sticking device, for example, disclosed in Japanese Patent Application Laid-Open No. 64-43458, attaches a wide adhesive tape to a wafer, and then attaches the attached tape to the wafer. Cut along the periphery.

In this known technique, the adhesive tape is fed from a feed reel onto the wafer, which is fed between upper and lower bonding rollers by a transfer means, with the adhesive side facing down, thereby adhering the adhesive tape onto the wafer. Yes, the adhesive tape is pulled out from the feed reel installed above and fed between the bonding rollers, and the separator is peeled off from the adhesive tape at the separator winding roller installed in the middle and wound onto the take-up reel above. .

[Intelligence B to be Solved by the Invention] In the above-mentioned known technology, the bonding roller is driven to feed out the wafer and adhesive tape sandwiched between both bonding rollers, and the adhesive tape is pulled to release it from the feed reel. Since it is being pulled out, a lot of tension is applied to the adhesive tape.

That is, since the adhesive tape wound on the feed reel is quite heavy, the bonding roller must draw out the tape while rotating the reel with a tension that overcomes the weight of the heavy adhesive tape wound on the reel.

Therefore, there is a problem in that a large tension is applied to the adhesive tape, and a large bank tension is applied to the adhesive tape attached to the wafer, which adversely affects the wafer.

An object of the present invention is to solve the problems of the prior art as described above and to provide a method for attaching an adhesive tape in which puncture tension is not applied to the adhesive tape as much as possible.

[Means for Solving the Problems] In order to solve the above-mentioned problem 11, this invention applies the tension generated in the adhesive tape between the feed reel and the bonding roller to puncture tension in the adhesive tape attached to the wafer. A method of weakening the adhesive tape to a degree that does not cause wrinkles in the adhesive tape attached to the wafer, and a method of driving a payout reel to loosen the adhesive tape between the payout reel and the bonding roller, and weakening the adhesive tape in the loosened part. A method of maintaining a constant tension of the adhesive tape attached to the wafer by bringing a swing roller into contact with the wafer, and a method of peeling off the separator attached to the adhesive tape between the attaching roller and the feed reel while the adhesive roller is stopped. , provides a method of bringing a swing roller into contact with the peeled tape when adhering an adhesive tape by driving an adhering roller.

〔Example〕

An apparatus for bonding a wafer and a tape will be described below as an example of an apparatus for carrying out the method of the present invention.

1 in FIG. 1 is a loading section and has a pair of left and right stands 14 on which cassettes 2 containing wafers 3 are placed. A large number of wafers 3 are stacked at appropriate intervals in the cassettes 2 on the left and right stands 14, with the element forming side facing down, and an endless conveyor belt 4.5.6
The lowest wafer 3 in the cassette 2 is fed onto the guide table 7. The guide stand 7 is divided into a plurality of parts as shown in FIG. 1, between which the belt 6 and an endless conveyor belt 8 extending perpendicularly to the belt 6 are arranged, and a plurality of guide bars 9 are fixed.

As shown in FIG. 2, the belt 8 is bent by a plurality of pulleys to prevent it from interfering with the belt 6. The belt 6 feeds the wafer 3 onto the table 7, the belt 6 stops, and the belt 8 is connected to the motor 10 and the second from the transmission belt 11
When driven in the direction of the arrow in the figure, the wafer 3 is fed into the next wafer alignment means 15.

The platform 14 is raised and lowered by a lifting means (not shown), and every time one wafer 3 is taken out, the cassette 2
is lowered and the next wafer 3 is placed on the belt 4.

The cassette 2 on one of the stands 14 is provided with stands 14 on the left and right sides.
When the cassette 2 becomes empty, the wafer 3 in the other cassette 2 is taken out and the operation continues, and during this time the empty cassette 2 is transferred to the wafer 3
This is to increase the operating rate of the device by replacing it with the cassette 2 containing the .

In the case of a device in which only one cassette is set in the load section, only one stand 14 is required, and that position is located at the belt 8.
It may be placed at any position on the upper facing portion.

The wafer alignment means 15 is provided with a guide bar 17 on the outer upper part of the left and right pedestals 16, and a pair of left and right endless conveyor belts 18 are arranged between both the pedestals 16.

The conveyor belt 18 is a transmission belt 2 as shown in FIG.
0.21, the belt 18 runs in synchronism with the conveyor belt 8. The belt 18 is provided on an elevating frame 23 on a machine stand 22, and this frame 23 is raised and lowered by an air cylinder 19.

Although various types of wafer alignment means 15 can be used, in the illustrated example, three rotating rods 31, 32, and 33 are provided on the lifting table 25 as shown in FIG.
2.33 is driven so that the left and right rods 31 and 33 rotate in opposite directions, and the center rod 32 rotates in the same direction as the rod 33, with the center rotation rod 32 being moved slightly forward.

Further, the elevating table 25 can be raised and lowered by an air cylinder 35.

36 in FIG. 2 seems to swing around the horizontal axis 24.

A lever 36 is attached to the frame 23, and a stopper 37 is attached to this lever 36.

This stopper 37 is for precisely positioning the straight edge of the wafer 3, that is, the orientation flat 12.

Further, the lever 36 mentioned above is swung up and down by an air cylinder 38.

In the above alignment means 15, initially, as shown in FIG.
7 protrudes above the conveyance surface of the belt 18. Therefore, the outer circumference of the wafer 3 conveyed by the belt 18 is the bar 31.
．． It touches the outer periphery of 33. In the case of an arcuate edge of wafer 3, all bars 31, 32, 33 touch wafer 3, but wafer 3
are two adjacent rods 32.33 rotating in the same direction
It is rotated by friction.

In this way, the wafer 3 rotates, and its orientation flat 12 is moved to the rod 31.
32. When you come to the 33 part, the rod 32 in the center is the orientation flat 12
Since the rods 31 and 33 rotating in opposite directions come into contact with the orientation flat 12, the wafer 3 stops with the orientation flat 12 facing forward.

As described above, it is detected that the wafer 3 is at the position of the alignment means 15, and the rotating rods 31, 32, 33 are rotated, and the alignment of the orientation flat of the wafer 3 is completed, that is, the orientation flat 12 is in contact with the rotating rod 31, 33. Detecting this, the rotation of the rotating rods 31, 32, 33 is stopped, and at the same time the cylinder 35 is stopped.
The elevating table 25 is lowered.

At this time, the wafer 3 moves forward on the belt 18, and the orientation flat 12 at the front thereof is moved to the stopper 37 as shown by the chain line in FIG.
Here, it is positioned even more precisely.

When a photoelectric detector or the like detects that the wafer 3 has reached this point, the air cylinder 19 moves to lower the belt 18 together with the frame 23, and the wafer 3 on the belt 18 is transferred onto the moving stage 40. After the wafer is confirmed on the stage 40, The air cylinder 38 is activated to lower the stopper 37 below the conveying surface of the belt 18.

The moving stage 40 has left and right belts 1 as shown in FIG.
It is a hollow vacuum suction type having a large number of vacuum suction holes on the upper surface, and is attached to the tip of an arm 42 that moves forward and backward by forward and reverse rotation of a feed screw 41.

Further, the feed screw 41 is supported by a bearing on the base 22 and is driven by a forward/reverse motor 43 .

Therefore, under the condition that the belt 18 is lowered and the wafer 3 is moved onto the moving stage 40, vacuum suction is performed, and the stopper 37 is lowered as described above, the screw 41 is rotated forward by the motor 43, and the arm 42 is rotated to the left as seen in FIG. The wafer 3 is then moved between the bonding rollers 45 and 46.

The bonding rollers 45 and 46 are made of a flexible elastic body such as rubber, and the upper roller 45 is provided with an appropriate reduction blade by a balance weight mechanism (not shown).
The lower roller 46 is connected to a drive control unit 47 including a motor.
drive or brake.

That is, the drive shaft of the roller 46 has a shaft 1 (not shown).
A tW1 clutch and a torque damper are provided so that a brake is applied to the roller 46 when the clutch is engaged, and intermittent driving is also possible by installing the clutch and motor.

Furthermore, as shown in FIG.
2, the tape 51 fed out from the reel 50 passes through the swing roller 49 and guide roller 53, passes between the upper and lower rollers 45 and 46 with the adhesive side facing down, and passes through the lower bead of the tape peeling means 54, which will be described later. It passes between the ring roller 55 and the upper and lower pair of beading rollers 56, passes through a guide roller 57, guide rollers 58, 59 provided in the machine box 48, and swing rollers 60, 61, and is wound onto the take-up reel 52.

Further, the separator 62 passes through a swing roller 63, a guide roller 64, a separator winding roller 65, and a pinch roller 67, is guided to a guide roller 66, and is wound up by a winding wheel 68.

The swing roller 49 is rotatably attached to the tip of an arm 71 that is swingably attached to the machine box 48 with a shaft 70, and the swing roller 63 is rotatably attached to the tip of an arm 73 that is swingably attached to the machine box 48 with a shaft 72. Attach it so that it can rotate freely.

In addition, a tension run adjustment weight 77 is screwed to the port 6S fixed to the arm 71, and the arm 71 is attached to the machine box 48.
Detectors 102 and 103 are provided to detect the upper and lower limits of and control the driving motor of the reel 50.

The separator winding roller 65 is operated by a motor (
(not shown), and the pinch roller 67 is driven by the machine box 48.
The arm 75 is rotatably attached to the upper end of the arm 75, which is pivotably attached to the shaft 74, and the pinch roller 67 is pressed against the hoisting roller 65 by a pressurizing device 76 which can be freely moved with 311 joints.
A detector 104 is provided to detect the upper limit of the arm 73 and stop the drive motor of the roller 65.

The swing rollers 60, 61 are rotatably mounted on the outer ends of arms 80, 81 which are swingably mounted on the machine box 48 by shafts 78, 79, respectively.

At the same time that the wafer 3 held by the moving stage 40 as described above is inserted between the bonding rollers 45 and 46,
The vacuum suction of the stage 40 is released, and the motor 43 reverses to return the stage 40 to its original position.
5. The lever 36 also rises to its original position to enter the next wafer receiving state.

On the other hand, the wafer 3 fed between the bonding rollers 45 and 46 as described above is driven by the roller 46, and the adhesive tape 51 is stuck on the upper surface of the wafer 3, and the adhesive tape 51 is pasted to the tape cutting means 85.
It is positioned by a plurality of photoelectric detectors 89 provided at the tip of a retractable arm 88 and then stopped.

On the other hand, under the condition that the arm 71 is rotated upward and the detector 102 is activated, the feed-out rule 50 is driven by a motor (not shown) to feed out the adhesive tape 51.

When the adhesive tape 51 is fed out in this way, the arm 7
1 rotates downward around the shaft 70, and the swing roller 49
is lowered to absorb the slack in the tape 51 and keep the tension of the tape 51 constant. When the arm 71 descends to a certain position, the detector 103 operates to stop the motor and stop feeding out the tape 51. In other words, as shown in FIG. The length f of the tape 51 fed out from the reel 50 by one stroke of the swing roller 49 from the upper limit (a) to the lower limit (b).

absorb. This 11 is the amount by which the tape 51 is fed.

The tension when the tape 51 is pulled out is the roller 4.
It becomes X of the weight W of 9.

Therefore, the weight W of the roller 49 should be as small as possible, for example, about 5
00g, the tension applied to the tape 51 is approximately 25
It gets smaller as it reaches 0g.

Further, the tension when peeling the separator 62 from the tape 51 is determined by the device, that is, the roller 45.4.
When the roller 46 is stopped such as 6, the separator winding roller 65 is driven by braking the roller 46 to prevent the tape 51 from returning.

When the separator 62 is peeled off by a length of , the arm 73 acts on the detector 104 to stop the drive motor of the roller 65, thereby preventing tension due to the peeling of the separator 62 during adhesion.

In the above state, the wafer 3 is fed between the upper and lower bonding rollers 45 and 46, and while the roller 46 is driven and the tape 51 is stuck on the wafer 3, the unwinding operation is performed.
Since the tape 50 is stopped, the tension acting on the tape 51 is only the tension acting on the swing roller 49, and the tension acting on the separator 62 is also applied by the swing roller 63.

Further, as the tape 51 between the reel 50 and the roller 45 is fed out as described above, the arm 71 rotates upward, and when the bonding of the chi 151 is completed, the arm 71 activates the upper limit detector 102. The motor is started to drive the reel 50 again, and the tape 51 is fed out.

The tape cutting means 85 is provided on a lifting frame 87 shown in FIG. 2 which is raised and lowered by a vertical air cylinder fixed to the inner surface of the side wall of the machine box 48.

A movable table 84 that moves forward and backward in a direction perpendicular to the conveying direction of the wafer 3 is provided at the lower part of the elevating frame 87 using an air cylinder, and a vertical cylinder 82 is fixed to the movable table 84 facing downward.

Reference numeral 83 denotes a rotary support plate provided at the lower end of the cylindrical body 82, and a zero adjustment plate 86 is provided at the bottom of this support plate 83 so as to be movable in the horizontal direction along a guide. The adjusting plate 86 is moved in the horizontal direction and fixed at an arbitrary position to match the cut size.

A sliding body 90 that is moved by a feed screw is provided at the bottom of the adjustment plate 86, a frame 91 is provided on the side of this sliding body 90, a cutter 92 is provided at the lower end of this frame 91, and a vacuum suction type stage 94 is provided. The adhesive tape 51 attached to the wafer 3 is cut along the periphery of the wafer 3. The stage 94 has a large number of suction holes or suction grooves on its upper surface,
The wafer 3 that has been moved onto it is fixed by vacuum suction, and although it can be raised and lowered by an air cylinder S3 in FIG. 2, it may also be fixed.

Further, two grooves 95 parallel to the direction of movement of the wafer 3 are provided on the upper surface of the stage 94, and an endless conveyor belt 96 for conveying the wafer is inserted into the grooves 95, as shown in FIG. The movable frame 97 to which this conveyor belt 96 is attached is raised and lowered by an air cylinder 98, and the belt 9
The conveying surface of the stage 94 is arranged such that the conveying surface of the stage 94 appears and disappears from the upper surface of the stage 94.

However, if a conveyance method using the buoyancy of air is used, the groove 95 becomes unnecessary and the belt 96 can be short. In this case, the stage 94 may be provided with an air blowing nozzle for conveyance other than the suction hole, The suction hole and air blowing nozzle can be used together and switched by the air circuit.

Furthermore, guide stands 29 and 30 are provided around the stage 94 as shown in FIG. 1, and guide bars 34 are provided on both sides of the guide stand 30.

As shown in FIG. 1, the tape peeling means 54 includes a beading roller 55, upper and lower beading rollers 56, and a guide roller 57 provided on a movable table 100 that moves forward and backward by forward and reverse rotation of a feed screw 99. The rollers 56 are interlocked by gears to rotate in opposite directions.

Further, the feed screw 99 is driven by a forward/reverse motor 101 .

As shown in FIGS. 1 and 2, the peeling means 54 stops at the positioning stop position, and the wafer 3 is placed under the tape 51 stuck between the bonding roller 45, 46 and the beading roller 55.
is attached, and this wafer 3 is placed on the rising stage 9.4, and the belt 96 is descending and its conveying surface is below the top surface of the stage 40. The cylinder works to lower the elevating frame 87, the frame 91 rotates, and the cutter 92 cuts the tape on the wafer 3.

Under the conditions that the blade S2 completely cuts the tape 51 by the above action, raises the blade 92 together with the lifting frame 87, and at the same time returns the blade S2 to its origin and brakes the roller 46 to stop the movement of the tape 51. The feed screw 99 rotates normally and moves the peeling means 54 rightward toward FIGS. 1 and 2.

As a result, the tape 51 is peeled off leaving the tape stuck on the wafer 3.

When peeling the tape 51 as described above, the tape peeling means 5
The tension acting on the tape 51 between the tape 4 and the take-up reel 52 is appropriately adjusted by the swing roller 60.

Next, the cylinder 93 and S8 are moved down, and the stage 94 is lowered, the frame 97 is raised, and the wafer 3 is transferred from the stage 94 onto the bell 96. At the same time, the belt 96 is driven to transport the wafer 3 to the rear of the next unloading section 105.

The unloading section 105 has a function opposite to that of the loading section 1, and as shown in FIG. has.

The guide stand 107 is divided into a plurality of parts, and a pair of left and right endless conveyor belts 108 following the endless conveyor belt 96 are provided between them, and a pair of left and right endless conveyor belts 108 that are perpendicular to the belt 108 are provided between this belt 108 and each of the stands 106. Conveyor belt 1
09.110.111 are placed in sequence and wafer 3 is placed on top of it.
is fed into the cassette 12' on the stand 106.

The conveyance side of the bell No. 8 is bent by a plurality of boobs as shown in FIG. 2 so as not to interfere with the belt 109, and is driven by a motor 112 in the direction of the arrow in FIG. 2 via a transmission belt 113. . Further, the endless conveyor belt 96 is interlocked with the belt 108 by endless transmission belts 114 and 115.

Under the condition that the wafer 3 fed into the rear part of the unloading section 105 as described above is on the predetermined belt 109 on the right or left side as shown in FIGS. 1 and 2, the belt 108 stops and 109, 110, and 111 start rotating forward and feed the wafer 3 into the cassette 12' on the predetermined table 106.

The platform 106 is a known device that moves up each time one wafer 3 is fed into the cassette 12'.For example, if the cassette 12' on the platform 106 on the right side of FIG.
The wafer 3 is fed into the cassette 12' on the left stand 106, while the cassette 12' on the right stand 106 is replaced with an empty cassette 12'.

Therefore, an air cylinder 116 is installed between the left and right belts 108.
Furthermore, a stopper 118 is provided on the left end guide stand 107, and a guide bar 119 is provided on the left and right guide stands 107. When feeding the wafer 3 into the left cassette 12', the stopper 118 is provided on the left end guide stand 107.
By lowering the wafer 17, the wafer 3 passes over the stopper 117 and is stopped by the stopper 118, and when feeding the wafer 3 into the right cassette 12', the stopper 117 is raised so that the wafer 3 is stopped by the stopper 117.

Similarly to the loading section 1, the unloading section 105 also has l
In the case of only a cassette, a stand 106 can be provided at one arbitrary position on the opposing portions of the belt 108.

〔Effect of the invention〕

This invention reduces the tension generated in the adhesive tape between the feed reel and the bonding roller as described above, without giving back tension to the adhesive tape attached to the wafer, and without causing wrinkles in the adhesive tape attached to the wafer. By weakening the adhesive tape to the extent that it does not cause any damage, no more tension than necessary is applied to the adhesive tape attached to the wafer, and since the tension remains constant, there is no risk of adversely affecting the wafer.

In addition, there is a method in which the adhesive tape between the feed reel and the bonding roller is loosened, and a swing roller is brought into contact with the loosened portion of the adhesive tape to maintain a constant tension on the adhesive tape that is attached to the wafer. The applied tension can be kept constant, and the separator attached to the adhesive tape between the sticking roller and the feed reel is peeled off while the sticking roller is stopped, and when the sticking roller is driven to stick the adhesive tape. The above-mentioned method of bringing a swing roller into contact with the peeled tape has the advantage that the tension acting on the adhesive tape from the separator can be kept constant.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of an apparatus for carrying out the method of the present invention, FIG. 2 is a front view of the same, and FIG. 3 is an enlarged front view of the vicinity of the adhesive tape feeding section. 1... Load section, 2.12'...
...Cassette, 3...-e-wafer, 15...Wafer alignment means, 45.46
・・・・・・Lamination roller, 49.60.61.6
3...Swing roller, 50...Feeding reel, 51...Adhesive tape, 52...Take-up reel, 54...Tape peeling Means, 62...Separator, 85...Tape cutting means, 102.103.104...Detection means.

Claims (3)

[Claims] (1) In a method of attaching an adhesive tape onto a wafer by feeding the adhesive tape from a feed reel with the adhesive side facing down onto the wafer that is fed between upper and lower bonding rollers by a transfer means, To weaken the tension generated in the adhesive tape between the feed reel and the bonding roller to an extent that does not apply back tension to the adhesive tape attached to the wafer and does not cause wrinkles in the adhesive tape attached to the wafer. A method for bonding wafers and adhesive tapes. (2) Drive the above-mentioned feed reel to loosen the adhesive tape between the feed reel and the bonding roller, and bring the swing roller into contact with the loosened portion of the adhesive tape to keep the tension of the adhesive tape attached to the wafer constant. 2. The method of bonding a wafer and an adhesive tape according to claim 1, wherein the wafer and adhesive tape are held at . (3) While the sticking roller is stopped, the separator affixed to the adhesive tape between the sticking roller and the feed reel is peeled off, and when the sticking roller is driven to stick the adhesive tape, a swing roller is applied to the peeled tape. 2. The method for bonding a wafer and an adhesive tape according to claim 1, wherein the wafer and the adhesive tape are brought into contact with each other.