JPS6251561A - Wafer protection sheet affixing device - Google Patents

Abstract

PURPOSE:To have stable operation of device by furnishing a protective sheet elongation absorbing mechanism on the path for sheet to be separated from defoliation paper and by securing a space necessary for insertion of wafer at all times between sheet and defoliation paper. CONSTITUTION:Defoliation paper 3 and protection sheet 2 supplied in the form of a roll are separated at a roller guide 6, and the sheet 2 is led to a rubber roller 1 via an intermediate roller 4. The defoliation paper 3 is led to the rubber roller 1 via a guide 7. The rubber roller 1 is mounted in the drive part to perform pressure contact of sheet 2 with a wafer 8 at the same time of feeding of the sheet 2 and defoliation paper 3. The support roller 5 is fixed, and said intermediate roller 4 situated thereabout is mounted on a shaft movable in the vertical direction so as to be sunk by a motor proportionally to elongation of the sheet 2 for absorption of it which will maintain the space for insertion of wafer 8 at all times.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to semiconductor manufacturing equipment, and particularly relates to a wafer protection sheet pasting device that inserts a wafer between a protection sheet and a release paper. After the formed wafer is cut along the scribe line, it is braked by rollers and divided into individual elements. Here, when braking is performed, the wafer surface is covered with a protective sheet.

Conventionally, the process of covering the wafer surface with a protective sheet is carried out by the method shown in FIGS. 2(α) and 2(b).

That is, the sheet 2 and the release paper 3 set as rolls are separated via the roller guide 6, the sheet 2 is drawn into the rubber roller 1, and the release paper 3 is passed through the release paper guide 7 and then separated from the rubber roller 1. be drawn into. The ember 8 is inserted into the space between the sheet 2 and the release paper 3, and is sandwiched between the release paper 3 and the sheet 2 by the rubber roller 1 and pressed together.

[Problem that the invention seeks to solve]

In the conventional wafer protection sheet pasting device described above, separation of the release paper and the sheet is performed by pulling the sheet with the rubber roller 1 with a driving function, so that the force necessary for separation is applied to the sheet 2. Become. Therefore, the extensible sheet becomes longer than the supplied length. Also Ueno 1
- Since the sheet 2 is pressed by the rubber roller 1 even during pressure bonding, the above phenomenon is promoted. Therefore, the initially set length of the sheet and the release paper supplied as one body differs between the separation point and the crimping point. Therefore, it is not possible to secure the space necessary to insert the wafer between the sheet and the release paper, so it is necessary to cut the sheet and re-set it with the space again.

In the present invention, before stacking the protective sheet and release paper together again,
The present invention provides a wafer protection sheet pasting device that absorbs the elongation of the protection sheet.

[Means for solving problems]

The wafer protection sheet pasting device of the present invention is characterized in that an elongation absorption mechanism is provided on the path of the sheet from the separation point of the protection sheet and release paper to the pressure bonding point to absorb elongation of the sheet.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 1, a roller guide 6 is provided on the unwinding side of a roll wound with an integrated protective sheet 2 and release paper 3, and two support rollers 5, 5 are placed at a constant interval in front of the roller guide 6 in the horizontal direction. At the same time, a release paper guide 7 is installed vertically below the roller guide 6, and a pair of rubber rollers 1, 1 is installed horizontally in front of the guide 7 to again press the separated protective sheet 2 and release paper 3 together. Set up.

Further, an intermediate roller 4 is installed between the two support rollers 5 and 50 so as to be movable up and down. Here, two support rollers 5,
5 and an intermediate roller 4 that moves up and down between two support rollers 5, 5 in proportion to the elongation of the sheet 2 and applies tension to the sheet 2, thereby providing an elongation absorption mechanism that absorbs elongation of the protective sheet 2. Configure.

In Figure 1, a protective sheet 2 supplied in a roll
and release paper 3 are separated via a roller guide 6, the sheet 2 is guided to the rubber roller 1 via a support roller 5 and an intermediate roller 4, and the release paper 3 is guided to the rubber roller 1 via a release paper guide 7. A rubber roller 1 is attached to a drive unit (not shown), and simultaneously feeds the sheet 2 and release paper 3 and presses the sheet onto the wafer 8. The support roller 5 is fixed, and the intermediate roller 4 placed between them is attached to a vertically movable shaft, and is lowered by a motor by an amount proportional to the amount of elongation of the sheet 2, thereby absorbing the elongation of the protective sheet 2. do.

〔Effect of the invention〕

As explained above, the present invention absorbs the elongation of the protective sheet that occurs when the protective sheet and release paper are separated and pressed together, so that the space necessary for inserting the wafer between the sheet and the release paper is always ensured. This has the effect of allowing stable operation.

[Brief explanation of the drawing]

Fig. 1 is a side view showing one embodiment of the present invention, Fig. 2 (α)
2 is a side view schematically showing the conventional method, and FIG. 2(b) is a sketch diagram schematically showing the conventional method. l...Rubber roller, 2...Sheet, 3...Release paper, 4...Intermediate roller, 5...Support roller, 6...
Roller guide, 7... Release paper guide, 8... Ueno - Figure 1 Figure 2 (a)

Claims (1)

[Claims] (1) In a device that once separates a protective sheet and a release paper that have been stacked together, inserts a wafer between the two sheets, and then stacks them together again to sandwich the wafer between the protection sheet and the release paper, A wafer protective sheet pasting device characterized in that an elongation absorption mechanism is provided in the path of the protective sheet that is separated from the pattern paper to absorb the elongation of the protective sheet that occurs when the wafer is inserted and then overlapped again.