WO2006100932A1

WO2006100932A1 - Take up device and take up method

Info

Publication number: WO2006100932A1
Application number: PCT/JP2006/304692
Authority: WO
Inventors: Kenji Kobayashi; Kan Nakada; Hideaki Nonaka; Yoshiaki Sugishita
Original assignee: Lintec Corporation
Priority date: 2005-03-24
Filing date: 2006-03-10
Publication date: 2006-09-28
Also published as: JP2006264895A; JP4532317B2

Abstract

[PROBLEMS] To provide a film take up device and a film take up method by which a film, which is cut to have a prescribed shape and has a narrow end section, can be smoothly taken up without wrinkles, and which are suitable for excellently adhering a film, such as a protection tape to be adhered on a semiconductor wafer, on a body whereupon the film is to be adhered, without wasting the film. [MEANS FOR SOLVING PROBLEMS] A detouring means is provided for temporarily separating an original film (A) wherein a strip-shaped film (A2) is temporarily adhered on a strip-shaped peeling sheet (A1) into the peeling sheet (A1) and the film (A2), and for bonding them again. The film (A2) separated by the detouring means is adhered on a body (B) whereupon the film is to be adhered, and a prescribed shape is cut out from the adhered film (A2). Then, prior to taking up the cut out film (A2) and the peeling sheet (A1) at the same time, the peeling sheet (A1) peeled by the detouring means is adhered so as to cover the cut out hole of the film (A2).

Description

Specification

Winding device and winding method

Technical field

TECHNICAL FIELD [0001] The present invention relates to a film cutting apparatus and a cutting method for a film cut into a predetermined shape and having a narrow edge.

Background art

Conventionally, as this type of film sticking apparatus, for example, there is one described in Patent Document 1. In the apparatus of the same document 1, a protective tape (T) with a separator (S) is fed out from a tape bobbin (101), and this is separated with a separator (S) and a protective tape (T) by a separator peeling mechanism (200). Is peeled off. The separated separator (S) is collected and collected by the recovery bobbin (201), while the peeled protective tape (T) is attached to the semiconductor wafer and then cut out along the outline of the semiconductor wafer. The protective tape (T) is collected and collected by a recovery bobbin (103) separate from the separator (S). Note that the symbols in the above-mentioned Katsuko are the symbols used in Patent Document 1. The same applies to the following.

[0003] However, in the conventional apparatus having the above structure, when the protective tape (T) cut out on the outer shape of the semiconductor wafer is taken up, the edge is narrowed by the cutout hole C as shown in FIG. As the protective tape (T) is pulled while being wound, 皺 D as shown in Fig. 5 (a) is generated on the protective tape (T), and this 皺 D is formed as shown in Fig. 5 (b). It will enter the part to be pasted on the semiconductor wafer next to (T). In addition, there is a problem in that the planned application site is stretched and tensile residual stress is accumulated inside the protective tape (T). If there is 皺 D as described above, the protective tape (T) will stick to the semiconductor wafer with 皺 D or bubbles in it, and a good application state will not be obtained. In particular, this type of protective tape (T) is affixed to the surface of a semiconductor wafer as a means for protecting the circuit formed on the surface of the semiconductor wafer when the back surface of the semiconductor wafer is polished (back grind). Attached. However, if the protective tape (T) is attached to the surface of the semiconductor wafer in the state where wrinkles and bubbles are contained as described above, high-precision back grinding cannot be performed. In addition, if the tensile residual stress as described above is accumulated inside the protective tape (T), the semiconductor well is caused by back grinding. When the wafer becomes extremely thin, there is a possibility that the semiconductor wafer will warp and be damaged by the tensile residual stress.

[0004] By the way, it is conceivable to wind up the protective tape (T) and stick it to the next semiconductor wafer until the above 皺 D disappears, but this method has the problem of wasting the protective tape (T). Arise. In addition, a method of preventing the occurrence of the above-described 皺 D by using a wide protective tape (T) is also conceivable, but this also increases the proportion of wasteful consumption of the protective tape.

Patent Document 1: Japanese Patent Laid-Open No. 7-14807

Disclosure of the invention

Problems to be solved by the invention

[0006] The present invention has been made to solve the above-mentioned problems, and its purpose is to wind up a film having a thin edge and cut into a predetermined shape. It is an object of the present invention to provide a film trimming apparatus and a trimming method suitable for satisfactorily affixing a film such as a protective tape to be bonded to a semiconductor wafer on an adherend without waste. Means for solving the problem

[0007] In order to achieve the above object, the winding device of the present invention is provided in a device for winding a film cut out in a predetermined shape and having a thin edge, and before winding the film, A mechanism for attaching the sheet so as to close the cutout hole is provided.

[0008] In addition, the scraping device of the present invention includes detour means for once peeling the raw material in which the belt-like film is temporarily attached to the belt-like release sheet to the release sheet and the film, and rejoining them. The film peeled off by the detour means was attached to an adherend, and the attached film was cut into a predetermined shape, and then the cut-out film and the release sheet were wound up at the same time in an apparatus for winding the cut-out film. A mechanism for attaching the release sheet peeled by the detour means is provided so as to close the cutout hole of the film before winding the film and the release sheet at the same time.

[0009] In the scraping device of the present invention, the adherend may be a semiconductor wafer.

[0010] In the scraping device of the present invention, the sticking means may include a sticking roller. Yes.

[0011] In order to achieve the above object, the winding method of the present invention is a method of winding a film cut out in a predetermined shape and having a thin edge, and before winding the film, The sheet is pasted so as to close the cutout hole.

[0012] In addition, the scraping method of the present invention includes detour means for once peeling the raw material in which the belt-like film is temporarily attached to the belt-like release sheet into the release sheet and the film, and rejoining them. In the method in which the film peeled off by the detour means is attached to an adherend, the attached film is cut into a predetermined shape, and then the cut film and the release sheet are wound up at the same time. Before simultaneously winding the film and the release sheet, the release sheet peeled off by the detour means is attached so as to close the cutout hole of the film.

[0013] In the scraping method of the present invention, the adherend may be a semiconductor wafer.

[0014] In the scraping method of the present invention, the sticking means may include a sticking roller.

The invention's effect

[0015] According to the present invention, since the sheet is attached so as to close the cut-out hole of the film before winding the film cut into a predetermined shape and having a thin edge, the cut-out film is wound. When the film is removed, the cutout holes in the film are reinforced with a sheet, so it is possible to effectively prevent wrinkles from occurring at the next position where the film is to be applied. In this state, the film can be attached to the adherend. In addition, the sheet is reinforced by sticking it so as to block the cutout hole of the film, so that valuable and expensive film is not wasted.

[0016] In particular, the present invention employs a configuration in which a sheet is attached so as to close the cutout hole of the film before winding the film cut into a predetermined shape and having a thin edge. The film can be wound while being pulled together with the closed sheet, and compared to the case where the film is wound while being pulled alone, the stretch of the newly drawn film and the tension accumulated inside the film are pulled. Small residual stress Become. Therefore, for example, when the film is used as a protective tape that protects the surface of the semiconductor wafer during back grinding, the film is cut out along the outline of the semiconductor wafer while the film is affixed to the semiconductor wafer. The tensile residual stress inside the film that is pulled out and stuck to the semiconductor wafer is also reduced. Therefore, even when the semiconductor wafer becomes extremely thin due to knock grind, the semiconductor wafer does not warp and break due to the tensile residual stress inside the film, which is suitable for sticking the film to the semiconductor wafer.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the accompanying drawings.

[0018] FIG. 1 is a front view of a film sticking apparatus and a film sticking apparatus according to the present invention, FIG. 2 is a plan view of the film sticking apparatus of FIG. 1, and FIG. 3 is a diagram of the film sticking apparatus of FIG. Part of the oblique view, Fig. 4 is an operation explanatory diagram of the film sticking device of Fig. 1.

The film sticking apparatus 1 shown in FIG. 1 is provided with an original fabric support shaft 2 as an original fabric support means, and the original fabric support shaft 2 supports the original fabric A in a rolled state. As shown in FIG. 2, the original fabric support shaft 2 is connected by a round beret 35 via pulleys 34 and 34, and is configured to be able to be fed out by a motor 33. As shown in Fig. 3, the strip-shaped release sheet A1 is bonded to one surface of the strip-shaped release sheet A1 via a pressure-sensitive adhesive layer (not shown) in a state where the strip-shaped film A2 is temporarily attached. .

[0020] As shown in FIG. 2, an upper portion of the raw fabric support shaft 2 is connected by a timing belt 32 via pulleys 31 and 31 and is configured to be rotated by a motor 33. A pinch roller 3 sandwiching the roller 4 and the original fabric A is provided, and the original fabric A supported by the original fabric support shaft 2 is inserted between the feeding roller 4 and the pinch roller 3 and is peeled off downstream thereof. Supplied to the separation roller 5.

[0021] The peeling roller 5 is disposed on the same horizontal plane as the feeding roller 4, and is provided as a means for once peeling the original fabric A from which the feeding roller 4 side force is also sent to the peeling sheet A1 and the film A2. It has been. In this embodiment, as an example of a peeling method in the peeling roller 5, the peeling sheet A1 constituting the original fabric A is wound around the peeling roller 5 and guided downward, whereby the original fabric A is The release sheet Al and the film A2 are peeled off.

A press roller 6 and a receiving roller 7 are provided on the downstream side of the peeling roller 5. The receiving roller 7 is installed on the same horizontal plane as the feeding roller 4 and the peeling roller 5, and the press roller 6 is disposed above the receiving roller 7. Then, the film A2 peeled off by the peeling roller 5 is supplied between the press roller 6 and the receiving roller 7. On the other hand, the release sheet A1 peeled off by the peeling roller 5 is sequentially wound around the first bypass roller 8, the second bypass roller 9, and the dancer roller 10, and then between the press roller 6 and the receiving roller 7. Supplied. The release sheet A1 and the film A2 thus peeled off are pressed by the press roller 6 and the receiving roller 7 and rejoined to constitute a detour means.

A drive roller 11 and a pinch roller 12 are provided on the downstream side of the press roller 6 and the receiving roller 7, and further, a scraping roller 13 as a scraping means is disposed on the downstream side of the rollers 11 and 12. It is provided. The release sheet A1 and the film A 2 rejoined by the press roller 6 as described above are inserted between the drive roller 11 and the pinch roller 12 and finally wound by the take-up roller 13 at the same time. ing. The drive roller 11 and the take-up roller 13 are driven in the same manner as the feed roller 4 and the original fabric support shaft 2 and are therefore denoted by the same reference numerals and description thereof is omitted.

In the present embodiment, the receiving roller 7 is configured to be slidable in the X-axis direction via the single-axis robot 14. The press roller 6 is configured to be slidable in two directions, that is, in the X-axis direction and in the Z-axis direction via the two-axis robot 15. The positions of the first and second bypass rollers 8 and 9 are fixed, and the dancer roller 10 is configured to be slidable along a slot 16 provided in the Z-axis direction.

[0025] Between the receiving roller 7 and the peeling roller 5, a film sticking stage S1 is provided as a sticking means for sticking the film A2 peeled off by the peeling roller 5 to the adherend B. The film sticking stage S1 includes The affixing table 18 will be set. The affixing table 18 is arranged immediately below the adhesive surface (lower surface) of the film A2, and the upper surface of the affixing table 18 has a structure in which the semiconductor wafer B1 is detachably positioned as the adherend B. RU

[0026] The sticking table 18 is configured to be capable of vertical movement in the Z-axis direction shown in FIG. 1 and sliding in the Y-axis direction shown in FIG. In this embodiment, the sticking table 18 in the Y-axis direction A configuration is adopted in which the setting position of the sticking table 18 on the film sticking stage S 1 is adjusted by the ride and the vertical movement in the Z-axis direction. In this embodiment, the pasting table 18 is arranged on a slider 20 that slides along the slide rail 19, and the pasting table 18 is moved in the Y-axis direction by driving the motor M via the ball screw 21 and the ball screw receiver 21-1. A configuration that enables sliding is adopted. In addition, the cylinder 22 provided on the lower surface of the affixing table 18 allows the affixing table 18 to move in the Z-axis direction, and the supporter 23 supports this vertical movement.

In the film sticking stage S 1 having the above structure, the film A 2 is stuck on the circuit forming surface (upper surface) of the semiconductor wafer B 1 positioned and fixed on the sticking table 18. At this time, the semiconductor wafer B1 is fixed on the adhesive tape 18 by a fixing means such as a vacuum suction means (not shown).

[0028] The operation of attaching the film A2 to the semiconductor wafer B1 as described above is performed by the press roller 6. In the present embodiment, the press roller 6 can slide in the X-axis direction as described above, and the slide causes the press roller 6 to move from the first position P1 to the second position P2 shown in FIG. At this time, the press roller 6 runs on the surface of the film A2 while rotating. Thus, the film A2 sandwiched between the press roller 6 and the semiconductor wafer B1 is pressed by the press roller 6 and attached to the semiconductor wafer B1. Then, the press roller 6 moved to the second position P2 is controlled to return to the first position P1 when the film A2 is stuck on the semiconductor wafer B1. In the film sticking apparatus 1 of the present embodiment, since the film A2 peeled off as described above is stuck to the semiconductor wafer B1 by the press roller 6, the press roller 6 functions as a sticking roller. ing.

[0029] A cutting means 24 is provided above the film sticking stage S1. The cutting means 24 is means for cutting out the film A2 attached to the semiconductor wafer B1 along the outer shape of the semiconductor wafer B1. As a specific configuration of this cutting means, in this embodiment, the cutter blade 25 is lowered in the Z-axis direction from the standby position P3 above the film application stage S1 toward the film application stage S1, and the lowered cutter The blade 25 is attached to the semiconductor wafer B 1 by rotating once around the central axis of the semiconductor wafer B 1 on the attaching table 18. A structure is employed in which the cut film A2 is cut out along the outer shape of the semiconductor wafer Bl.

Note that the cutter blade 25 is attached to the output shaft of the cutter rotation motor 27 via the cutter support member 26 and is driven to rotate by the cutter rotation motor 27. Further, the rotating mechanism having the same force as the force cutter supporting member 26 and the cutter rotating motor 27 is attached to the arm 29 of the cutter vertical movement robot 28. Then, the cutter vertical movement robot 28 moves in the force axis direction of the force cutter blade 25 and the entire rotation mechanism.

[0031] As can be seen from the above description, the film sticking apparatus 1 has the release sheet Al sent from the dancer roller 10 between the press roller 6 and the receiving roller 7 located at the first position P1, that is, the release roller. The release sheet A1 peeled in 5 and the film A2 cut by the cutting means 24 are supplied. The cut film A2 and the delamination release sheet A1 are pressed by the pressing roller 6 and the receiving roller 7. Then, it is re-joined at the end, and finally it is scraped off simultaneously by the take-up roller 13. In addition to this configuration, the film sticking device 1 attaches the peeled release sheet A1 to the cutout hole C of the film A2 before simultaneous take-off by the take-off roller 13 as described above. The mechanism is also adopted.

[0032] The sticking mechanism of the release sheet A1 to the cutout hole C of the film A2 includes a press roller 6 and a receiving roller 7. That is, in the case of this embodiment, the press roller 6 and the receiving roller 7 can slide in the X-axis direction as described above. By this sliding, the press roller 6 and the receiving roller 7 are simultaneously in the first position. Slide from P1 to the second position P2 (see Fig. 3 and Fig. 4). At this time, the driving roller 11 is locked, and the release sheet A1 peeled off when the receiving roller 7 slides toward the second position P2 forcefully moves the dancer roller 10 along the slot 16 in the Z-axis direction. While being pulled up, it is affixed to the adhesive surface of the cut film A2 and rejoined. Then, the press roller 6 and the receiving roller 7 moved to the second position P 2 are controlled to move back to the first position P1 in synchronization with the driving of the driving roller 11 and the take-up roller 13 after the completion of the pasting. .

In the present embodiment, the folding point roller 30 is provided between the first position P1 of the receiving roller 7 and the maximum rising point of the dancer roller 10, and this folding point is set when the release sheet A1 is pulled up. Roller 30 receives the release sheet A1 in the direction of travel of receiving roller 7 The release sheet A1 is configured to be pulled up vertically between the folding point roller 30 and the dancer roller 10 by being bent in the vertical direction.

[0034] Next, the overall operation of the film sticking apparatus 1 configured as described above will be described.

First, the original fabric A wound in the form of a roll is mounted on the original fabric support shaft 2 and sandwiched between the feeding roller 4 and the pinch roller 3. Then, the original fabric A is separated into a release sheet A1 and a film A2 with the release roller 5 as a boundary, and the release sheet A1 is wound around the first and second detour rollers 8, 9 and the dancer roller 10, and the press roller 6. Guide between receiving rollers 7. The film A2 is set so that the peeling sheet A1 and the film A2 are rejoined by being guided directly from the peeling roller 5 to the press roller 6 and the receiving roller 7.

[0036] Thereafter, the re-bonded release sheet A1 and film A2 pass between the drive roller 11 and the pinch roller 12 and are wound around the take-up roller 13.

[0037] Next, when a signal for performing automatic application is input to a control device (not shown), the feeding roller 4 and the driving roller 11 perform tension control so that a predetermined tension is applied to the film A2. 4 and 11 are locked, and the setting is completed. Then, the operation of setting the semiconductor wafer B1 on the sticking table 18 is performed. As shown in FIGS. 2 and 3, this operation is performed by sliding the sticking table 18 in the Y-axis direction to pull the sticking table 18 from the film sticking stage S1 to the setup stage S2. Semiconductor wafer B1 is transferred. This transfer may be performed manually or via a transfer device. When the positioning and fixing of the semiconductor wafer B1 on the sticking table 18 is completed, the sticking table 18 returns to the film sticking stage S1 and is set immediately below the film A2 peeled off by the peeling roller 5.

[0038] When the setup operation is completed, the film sticking apparatus 1 performs the sticking operation of the film A2 on the semiconductor wafer B1. That is, first, the sticking table 18 set immediately below the film A2 as described above rises in the Z-axis direction. As a result, as shown in FIG. 1, the semiconductor wafer B1 on the affixing table 18 approaches the adhesive surface of the film A2. In this state, first, the press roller 6 at the first position P1 shown in FIG. 1 descends in the Z-axis direction to contact the semiconductor wafer B1 with the film A2 interposed therebetween. And press roller 6 is X Drive to the second position P2 while pressing the surface of film A2 in the axial direction. As a result, the film A2 is adhered to the semiconductor wafer B1. Then, the press roller 6 is retracted upward in the Z-axis direction, folded back and returned to the first position P1.

[0039] When the operation of attaching the film A2 to the semiconductor wafer B1 as described above is completed, the film attaching apparatus 1 performs a cutting operation. That is, the cutter blade 25 moves downward in the ¾ axis direction from the standby position P3 toward the film sticking stage S1. At this time, the tip of the cutter blade 25 enters the groove 18a having substantially the same shape as the outer periphery of the semiconductor wafer B1 provided on the sticking table 18, so that the sticking table 18 and the cutter blade 25 are not damaged. The blade edge of the lowered cutter blade 25 is in contact with the outer peripheral edge of the semiconductor wafer B1 obliquely, and in this state, the force cutter blade 25 rotates once around the central axis of the semiconductor wafer B1. As a result, the film A2 attached to the semiconductor wafer B1 is cut out along the outer shape of the semiconductor wafer B1. Then, the cutter blade 25 returns to the original standby position P3.

[0040] When the cutting operation is completed, the film A2 is separated. In this operation, as shown above, the ascending table 18 is lowered in the Z-axis direction. As a result, only the part cut out by the cutter blade 25 in the entire film A2 is separated and attached to the semiconductor wafer B1, and then lowered together with the semiconductor wafer B1 and slid in the Y-axis direction. Then, it is pulled out to the setup stage S2, and the semiconductor wafer B1 is attached / detached / replaced at the setup stage S2. In the remaining film A2, holes corresponding to the outer shape of the semiconductor wafer B1 are opened as cutout holes C (see Fig. 2 and Fig. 3).

[0041] When the separation operation is completed, the operation of attaching the release sheet A1 to the cutout hole C of the film A2 is performed. That is, as shown in FIG. 4 (a), the press roller 6 at the first position P1 descends again in the Z-axis direction, sandwiching the film A2 and the release film A1 between the receiving roller 7 and FIG. 4 Move to the second position P2 as shown in (b). As a result, the release sheet A1 hung around the dancer roller 10 is attached to the adhesive surface of the cut film A2 while being pulled upward, and thus the cut film A2 and the release sheet A1 are attached. Are rejoined, and the cutout hole C of the film A2 is closed with the release sheet A1.

[0042] When the rejoining operation between the film A2 and the release sheet A1 is completed, the feeding roller is completed. 4 and the drive roller 11 are unlocked, and the film A2 and the release sheet Al that have been cut off are simultaneously wound up and the raw material A is fed out simultaneously, and the press roller 6 and the receiving roller are simultaneously synchronized. The operation to return 7 from the second position P2 to the first position P1 is performed. The amount of cutting per stroke is slightly longer than the diameter of the semiconductor wafer B1, which is almost the same as the stroke amount of the press roller 6 and receiving roller 7!

[0043] Then, the web A supported by the web support shaft 2 is fed out by the amount wound by the take-up roller 13, and the film pasting stage S1 has a portion of a new film A2 having no holes. Is newly derived, and preparations are made for attaching a film to the next semiconductor wafer.

[0044] According to the above embodiment, a configuration is adopted in which the peeled release sheet A1 is attached so as to close the cutout hole C of the film A2 before winding the cut film A2 and the release sheet A1 simultaneously. Therefore, when the cut film A2 and the release sheet A1 are simultaneously wound up, the cutout hole C of the film A2 is reinforced with the release sheet A1, so the next semiconductor wafer is scheduled to be attached to the film A2. Film A2 can be attached to the next semiconductor wafer B1 in a good condition without 皺 D (see Fig. 5) at the position and without 気泡 D or air bubbles. Can be performed with high accuracy. In addition, since the peeling sheet A1 is attached and reinforced so as to close the cutout hole C of the film A2, the valuable and expensive film A2 is not wasted. Furthermore, by closing the cutout hole C in the release sheet A1 as described above, the elongation of the film A2 at the time of film cutting and the bow I tension residual stress accumulated inside the film A2 are reduced. Thus, it is possible to effectively prevent the problem that the semiconductor wafer warps and breaks after back grinding.

[0045] In the above embodiment, a configuration is adopted in which the press roller 6 rotates on the surface of the film A2. However, the rotation method is a method that rotates by contact friction force with the film A2, and is rotated by a motor. There are methods, and any method may be adopted. In addition, the adherend to which the film is attached is not limited to a semiconductor wafer, but can also be used for an optical disc, a steel plate, glass and the like.

Brief Description of Drawings

[0046] FIG. 1 is a front view of a film sticking apparatus to which a scoring device and a scoring method according to the present invention are applied. FIG. 2 is a plan view of the film sticking apparatus of FIG.

FIG. 3 is a perspective view of a part of the film sticking apparatus of FIG.

[Fig. 4] Fig. 4 is an operation explanatory view of the film sticking device of Fig. 1, in which (a) is an explanatory view when the press roller and the receiving roller are in the first position, and (b) is a press. It is explanatory drawing when a roller and a receiving roller slide to the 2nd position.

FIG. 5 is an explanatory diagram of a film state when a film (protective tape) is pasted with a conventional film pasting apparatus.

Explanation of symbols

1 Film sticking device

2 Material support shaft (material support means)

5 Peeling roller

6 Press roller

7 Receiving roller

8 First detour roller

9 Second detour roller

13 Towing roller

24 Cutting means

25 Katsura blade

A Original fabric

A1 Release sheet

A2 Finolem

B adherend

B1 Semiconductor wafer

C Cutout hole

S1 film application stage

Claims

The scope of the claims

[1] In an apparatus for winding a film cut into a predetermined shape and having a thin edge,

Provided a mechanism to attach the sheet so as to close the cut-out hole of the film before winding the film

A tapping device characterized by

[2] The original film on which the belt-like film is temporarily attached to the belt-like release sheet is peeled off from the release sheet and the film once, and provided with detour means for re-bonding them, and the film peeled by the detour means is In an apparatus for attaching the adherend to the adherend, cutting the attached film into a predetermined shape, and winding the cut film and the release sheet at the same time,

Provided a mechanism for attaching the release sheet peeled by the detour means so as to block the cut-out hole of the film before winding the cut-out film and the release sheet at the same time

A tapping device characterized by

3. The scraping apparatus according to claim 2, wherein the adherend is a semiconductor wafer.

4. The scraping device according to claim 2, wherein the pasting means includes a pasting roller.

[5] A method for winding a film cut into a predetermined shape and having a thin edge,

Affix the sheet so as to close the cut-out hole of the film before winding the film.

A collection method characterized by

[6] The original film in which the belt-like film is temporarily attached to the belt-like release sheet is peeled off from the release sheet and the film once, and provided with detour means for rejoining them, and the film peeled by the detour means is In a method of attaching the adherend to the adherend, cutting the attached film into a predetermined shape, and simultaneously winding the cut film and the release sheet,

Before winding up the cut-out film and the release sheet at the same time, the release sheet peeled off by the detour means is attached so as to close the cut-out hole of the film.

7. The scraping method according to claim 6, wherein the adherend is a semiconductor wafer. 8. The scraping method according to claim 6, wherein the sticking means includes a sticking roller.