JP4532317B2 - Winding device and winding method - Google Patents

Description

  The present invention relates to a film winding apparatus and a winding method that are cut into a predetermined shape and have a thin edge.

Conventionally, as this kind of film sticking apparatus, there exists a thing described in patent document 1, for example. In the apparatus of the document 1, a protective tape (T) with a separator (S) is fed out from a tape bobbin (101), and this is separated into a separator (S) and a protective tape (T) by a separator peeling mechanism (200). ing. The peeled separator (S) is wound and collected by the collecting bobbin (201), while the peeled protective tape (T) is attached to the semiconductor wafer and then cut out along the outer shape of the semiconductor wafer. The protective tape (T) is wound and recovered by a recovery bobbin (103) separate from the separator (S). Incidentally, reference numerals in the parentheses is the sign that is used in Patent Document 1. The same applies to the following.

  However, in the conventional apparatus having the above-described structure, when the protective tape (T) cut out to the outer shape of the semiconductor wafer is wound, the protective tape whose edge is narrowed by the cut-out hole C as shown in FIG. T) is wound while being pulled, so that a ridge D as shown in FIG. 5 (a) is formed on the protective tape (T), and this ridge D is next to the protective tape (T) as shown in FIG. 5 (b). The semiconductor wafer enters the part to be pasted. Moreover, there exists a malfunction that the sticking plan site | part is extended and a tension | pulling residual stress will accumulate | store inside a protective tape (T). If there is a crease D as described above, the protective tape (T) is stuck to the semiconductor wafer in a state where the crease D or bubbles are contained, and a good sticking state cannot be obtained. In particular, this type of protective tape (T) is affixed to the surface of a semiconductor wafer as a means for protecting a circuit formed on the surface of the semiconductor wafer when the back surface of the semiconductor wafer is polished (back grind). However, if the protective tape (T) is attached to the surface of the semiconductor wafer in a state where wrinkles or bubbles are contained as described above, high-precision back grinding cannot be performed. In addition, if the tensile residual stress as described above is accumulated inside the protective tape (T), the semiconductor wafer may be warped and damaged by the tensile residual stress when the semiconductor wafer becomes extremely thin due to back grinding. There is also.

  By the way, a method of winding the protective tape (T) until the wrinkle D disappears and then affixing the protective tape (T) to the next semiconductor wafer is conceivable. Moreover, although the method of preventing generation | occurrence | production of the above wrinkles D by using a wide protective tape (T) is also considered, this also increases the ratio which wastes a protective tape similarly.

Japanese Patent Laid-Open No. 7-14807

  The present invention has been made in order to solve the above-described problems, and the object of the present invention is to be able to wind up a film that has been cut into a predetermined shape and has a thin edge without any wrinkles, and is applied to, for example, a semiconductor wafer. It is an object to provide a film winding apparatus and a winding method suitable for satisfactorily sticking a film such as a protective tape to be attached to an adherend without waste.

  In order to achieve the above object, the winding device of the present invention is a device for winding a film cut into a predetermined shape and having a thin edge so that the cutout hole of the film is closed before winding the film. A mechanism for attaching a sheet is provided.

  Further, the winding device of the present invention comprises detouring means for once peeling the original film in which the band-like film is temporarily attached to the band-like release sheet to the release sheet and the film, and rejoining them. Affixing the peeled film to an adherend, cutting the attached film into a predetermined shape, and then winding the cut film and the release sheet at the same time, in the apparatus for winding the cut film and the peel A mechanism for attaching the release sheet peeled off by the bypass means is provided so as to close the cutout hole of the film before winding the sheet simultaneously.

  In the winding device of the present invention, the adherend may be a semiconductor wafer.

  In order to achieve the above object, the winding method of the present invention is a method of winding a film cut into a predetermined shape and having a thin edge so that the cutout hole of the film is closed before winding the film. A sheet is pasted.

  Further, the winding method of the present invention comprises a detouring means for once separating the original film in which the band-shaped film is temporarily attached to the band-shaped release sheet into the release sheet and the film, and re-joining them. In the method of sticking the peeled film on an adherend, cutting the attached film into a predetermined shape, and winding the cut film and the release sheet at the same time, the cut film and the peel Before the sheet is wound up at the same time, the release sheet peeled off by the detour means is pasted so as to close the cutout hole of the film.

  In the winding method of the present invention, the adherend may be a semiconductor wafer.

  According to the present invention, since the sheet is attached so as to close the cut-out hole of the film before winding the film cut into a predetermined shape and having a thin edge, when the cut-out film is wound up Since the cut-out hole of the film is reinforced with the sheet, it is possible to effectively prevent wrinkles from occurring at the next application position of the film, and the film can be covered in a good state without wrinkles or bubbles. Can be attached to the body. In addition, since the sheet is reinforced so as to block the cutout hole of the film, valuable and expensive film is not wasted.

  In particular, the present invention employs a structure in which a sheet is attached so as to close the cutout hole of the film before winding the film cut into a predetermined shape and having a thin edge, so that the cutout hole of the film is closed. The film can be wound while being pulled together with the film, and the stretch of the newly drawn film and the residual tensile stress accumulated in the film are smaller than when the film is wound while being pulled. . Therefore, for example, when the film is used as a protective tape for protecting the surface of the semiconductor wafer during back grinding, the film is cut out along the outer shape of the semiconductor wafer with the film attached to the semiconductor wafer. The tensile residual stress inside the film adhered to the semiconductor wafer is also reduced. Therefore, even if the semiconductor wafer becomes extremely thin due to back grinding, the semiconductor wafer does not warp and break due to the tensile residual stress inside the film, which is suitable for sticking the film to the semiconductor wafer.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the accompanying drawings.

  1 is a front view of a film sticking device to which the winding device and the winding method according to the present invention are applied, FIG. 2 is a plan view of the film sticking device of FIG. 1, and FIG. 3 is a part of the film sticking device of FIG. FIG. 4 is an operation explanatory diagram of the film sticking apparatus of FIG.

  The film sticking apparatus 1 shown in FIG. 1 is provided with an original fabric support shaft 2 as an original fabric support means, and the original fabric support shaft 2 supports the original fabric A in a rolled state. As shown in FIG. 2, the original fabric support shaft 2 is connected by a round belt 35 via pulleys 34, 34, and is configured so that it can be fed out by a motor 33. As shown in the figure, the belt-like release sheet A1 is joined to the one surface of the belt-like release sheet A1 via a pressure-sensitive adhesive layer (not shown) in a state where the belt-like film A2 is temporarily attached.

  As shown in FIG. 2, the material support shaft 2 is connected by a timing belt 32 via pulleys 31, 31 and is rotated by a motor 33. A pinch roller 3 sandwiching the anti-A is provided, and the original fabric A supported by the original support shaft 2 is inserted between the feeding roller 4 and the pinch roller 3 and supplied to the peeling roller 5 positioned downstream thereof. Is done.

  The peeling roller 5 is disposed on the same horizontal plane as the feeding roller 4 and is provided as means for once peeling the original fabric A sent from the feeding roller 4 side to the peeling sheet A1 and the film A2. In the present embodiment, as an example of the peeling method in the peeling roller 5, the peeling sheet A1 constituting the original fabric A is wound around the peeling roller 5 and guided downward, whereby the original fabric A is once transferred to the peeling sheet A1 and the film A2. Adopts a peeling method.

  A press roller 6 and a receiving roller 7 are provided on the downstream side of the peeling roller 5. The receiving roller 7 is installed on the same horizontal plane as the feeding roller 4 and the peeling roller 5, and the press roller 6 is disposed above the receiving roller 7. The film A2 peeled off by the peeling roller 5 is supplied between the press roller 6 and the receiving roller 7. On the other hand, the release sheet A1 peeled off by the release roller 5 is sequentially wound around the first bypass roller 8, the second bypass roller 9, and the dancer roller 10, and then supplied between the press roller 6 and the receiving roller 7. Is done. The release sheet A1 and the film A2 that have been once peeled in this way constitute a detour means by being pressed by the press roller 6 and the receiving roller 7 and rejoined.

  A drive roller 11 and a pinch roller 12 are provided on the downstream side of the press roller 6 and the receiving roller 7, and a winding roller 13 as a winding means is provided on the downstream side of the rollers 11 and 12. Yes. The release sheet A1 and the film A2 rejoined by the press roller 6 as described above are inserted between the drive roller 11 and the pinch roller 12 and finally wound by the take-up roller 13 at the same time. Yes. Note that the drive roller 11 and the take-up roller 13 are driven in the same manner as the feed roller 4 and the original fabric support shaft 2, and thus the same reference numerals are given and description thereof is omitted.

  In the present embodiment, the receiving roller 7 is configured to be slidable in the X-axis direction via the single-axis robot 14. The press roller 6 is configured to be slidable in two directions, that is, in the X-axis direction and in the Z-axis direction via the biaxial robot 15. The positions of the first and second bypass rollers 8 and 9 are fixed, and the dancer roller 10 is configured to be slidable along a slot 16 provided in the Z-axis direction.

  Between the receiving roller 7 and the peeling roller 5, a film sticking stage S1 is provided as a sticking means for sticking the film A2 peeled off by the peeling roller 5 to the adherend B, and a sticking table 18 is provided on the film sticking stage S1. Will be set. The affixing table 18 is disposed immediately below the adhesive surface (lower surface) of the film A2, and the upper surface of the affixing table 18 is structured such that the semiconductor wafer B1 is detachably positioned as the adherend B. .

The sticking table 18 is configured to be able to move up and down in the Z-axis direction shown in FIG. 1 and slide in the Y-axis direction shown in FIG. In the present embodiment, a configuration is adopted in which the setting position of the sticking table 18 on the film sticking stage S1 is adjusted by sliding the sticking table 18 in the Y-axis direction and vertical movement in the Z-axis direction. In the present embodiment, the pasting table 18 is disposed on a slider 20 that slides along the slide rail 19, and the pasting table 18 is moved in the Y-axis direction by driving the motor M via the ball screw 21 and the ball screw receiver 21-1. A configuration that allows sliding is adopted. In addition, the sticking table 18 can be moved in the Z-axis direction by a cylinder 22 provided on the lower surface of the sticking table 18, and a configuration in which this vertical movement is supported by the supporter 23 is adopted.

  In the film pasting stage S1 having the above structure, the film A2 is pasted on the circuit forming surface (upper surface) of the semiconductor wafer B1 positioned and fixed on the pasting table 18. At this time, the semiconductor wafer B1 is fixed on the sticking table 18 by a fixing means such as a vacuum suction means (not shown).

  The sticking operation of the film A2 to the semiconductor wafer B1 as described above is performed by the press roller 6. In the present embodiment, the press roller 6 can slide in the X-axis direction as described above, and the slide causes the press roller 6 to move from the first position P1 to the second position P2 shown in FIG. At this time, the press roller 6 runs on the surface of the film A2 while rotating. Thereby, the film A2 sandwiched between the press roller 6 and the semiconductor wafer B1 is pressed by the press roller 6 and attached to the semiconductor wafer B1. Then, the press roller 6 moved to the second position P2 is controlled to return to the first position P1 when the film A2 is stuck on the semiconductor wafer B1. In the film sticking apparatus 1 of this embodiment, since the film A2 once peeled as described above is stuck to the semiconductor wafer B1 by the press roller 6, the press roller 6 functions as a sticking roller.

  A cutting means 24 is provided above the film application stage S1. The cutting means 24 is means for cutting out the film A2 attached to the semiconductor wafer B1 along the outer shape of the semiconductor wafer B1. As a specific configuration of this cutting means, in this embodiment, the cutter blade 25 descends in the Z-axis direction from the standby position P3 above the film application stage S1 toward the film application stage S1, and the lowered cutter blade 25 is A structure is adopted in which the film A2 attached to the semiconductor wafer B1 is cut out along the outer shape of the semiconductor wafer B1 by making one rotation around the central axis of the semiconductor wafer B1 on the attaching table 18.

  The cutter blade 25 is attached to the output shaft of the cutter rotation motor 27 via the cutter support member 26 and is driven to rotate by the cutter rotation motor 27. A rotation mechanism including the cutter support member 26 and the cutter rotation motor 27 is attached to the arm 29 of the cutter up / down robot 28. The cutter up / down robot 28 moves the cutter blade 25 and the entire rotation mechanism in the Z-axis direction.

  As can be seen from the above description, the film sticking apparatus 1 is peeled off by the release sheet A1, which is sent from the dancer roller 10, between the press roller 6 and the receiving roller 7 located at the first position P1, that is, by the release roller 5. The peeled release sheet A1 and the film A2 cut out by the cutting means 24 are supplied, and the cut out film A2 and the peeled release sheet A1 are rejoined by the pressing force of the press roller 6 and the receiving roller 7. Finally, it is configured to be simultaneously wound by the winding roller 13. In addition to this configuration, the film sticking apparatus 1 is a mechanism for sticking the peeled sheet A1 once peeled to the cutout hole C of the film A2 before the simultaneous winding by the winding roller 13 as described above. Also adopted.

  The affixing mechanism of the release sheet A1 to the cutout hole C of the film A2 includes a press roller 6 and a receiving roller 7. That is, in the case of this embodiment, the press roller 6 and the receiving roller 7 can slide in the X-axis direction as described above, and by this sliding, the press roller 6 and the receiving roller 7 are simultaneously in the first position. Slide from P1 toward the second position P2 (see FIGS. 3 and 4). At this time, the drive roller 11 is locked, and the release sheet A1 once peeled by the receiving roller 7 sliding toward the second position P2 pulls the dancer roller 10 along the slot 16 in the Z-axis direction. Then, it is affixed to the adhesive surface of the cut-out film A2 and rejoined. The press roller 6 and the receiving roller 7 that have moved to the second position P2 are controlled to move back to the first position P1 in synchronization with the driving of the driving roller 11 and the take-up roller 13 after the completion of the pasting.

  In the present embodiment, a folding point roller 30 is provided between the first position P1 of the receiving roller 7 and the maximum rising point of the dancer roller 10, and the folding point roller 30 is used for the pulling of the release sheet A1. By folding the release sheet A1 in the traveling direction of the receiving roller 7, the release sheet A 1 is configured to be pulled up vertically between the folding point roller 30 and the dancer roller 10.

  Next, the overall operation of the film sticking apparatus 1 configured as described above will be described.

  First, the original fabric A wound in a roll shape is mounted on the original fabric support shaft 2 and sandwiched between the feeding roller 4 and the pinch roller 3. Then, the original fabric A is separated into a release sheet A1 and a film A2 with the release roller 5 as a boundary, and the release sheet A1 is wound around the first and second detour rollers 8 and 9 and the dancer roller 10, and the press roller 6 Then, it is guided between the receiving rollers 7. The film A2 is set so that the release sheet A1 and the film A2 are re-joined by being guided directly from the release roller 5 to between the press roller 6 and the receiving roller 7.

  Thereafter, the re-bonded release sheet A1 and film A2 pass between the drive roller 11 and the pinch roller 12 and are wound around the take-up roller 13.

Next, when a signal for performing automatic application is input to a control device (not shown), the feeding roller 4 and the driving roller 11 perform tension control so that a predetermined tension is applied to the film A2, and the rollers 4 and 11 are locked. Thus, the setting is completed. Then, an operation of setting the semiconductor wafer B1 on the pasting table 18 is performed. As shown in FIGS. 2 and 3, this operation is performed by sliding the pasting table 18 in the Y-axis direction to pull out the pasting table 18 from the film pasting stage S1 to the set-up stage S2, and at a fixed position on the pasting table 18. The semiconductor wafer B1 is transferred. This transfer may be performed manually or via a transfer device. When the positioning and fixing of the semiconductor wafer B1 on the pasting table 18 is completed, the pasting table 18 returns to the film pasting stage S1 and is set immediately below the film A2 peeled off by the peeling roller 5.

  When the setup operation is completed, the film sticking apparatus 1 performs the sticking operation of the film A2 on the semiconductor wafer B1. That is, first, the sticking table 18 set immediately below the film A2 as described above moves up in the Z-axis direction. As a result, the semiconductor wafer B1 on the sticking table 18 approaches the adhesive surface of the film A2 as shown in FIG. In this state, first, the press roller 6 at the first position P1 shown in FIG. 1 descends in the Z-axis direction to contact the semiconductor wafer B1 with the film A2 interposed therebetween. The press roller 6 travels to the second position P2 while pressing the surface of the film A2 in the X-axis direction. As a result, the film A2 is attached to the semiconductor wafer B1. Then, the press roller 6 is retracted upward in the Z-axis direction, folded back, and returned to the first position P1.

  When the operation of applying the film A2 to the semiconductor wafer B1 is completed, the film applying apparatus 1 performs a cutting operation. That is, the cutter blade 25 descends in the Z-axis direction from the standby position P3 toward the film application stage S1. At this time, the tip of the cutter blade 25 enters the groove 18a having substantially the same shape as the outer periphery of the semiconductor wafer B1 provided on the sticking table 18, so that the sticking table 18 and the cutter blade 25 are not damaged. Then, the blade edge of the lowered cutter blade 25 is in contact with the outer peripheral edge of the semiconductor wafer B1 obliquely, and in this state, the cutter blade 25 rotates once around the central axis of the semiconductor wafer B1. As a result, the film A2 attached to the semiconductor wafer B1 is cut out along the outer shape of the semiconductor wafer B1. Then, the cutter blade 25 returns to the original standby position P3.

  When the cutting operation is completed, the film A2 is separated. In this operation, the sticking table 18 rising as described above is lowered in the Z-axis direction. As a result, only the portion cut out by the cutter blade 25 of the entire film A2 is separated and attached to the semiconductor wafer B1 while being lowered together with the semiconductor wafer B1 and sliding in the Y-axis direction. Then, the semiconductor wafer B1 is pulled out to the setup stage S2, and the semiconductor wafer B1 is attached and detached at the setup stage S2. In the remaining film A2, a hole corresponding to the outer shape of the semiconductor wafer B1 is opened as a cutout hole C (see FIGS. 2 and 3).

  When the separation operation is completed, an operation of attaching the release sheet A1 to the cutout hole C of the film A2 is performed. That is, as shown in FIG. 4A, the press roller 6 at the first position P1 is lowered again in the Z-axis direction, and the film A2 and the peeling film A1 are sandwiched between the receiving roller 7 and FIGS. Move to the second position P2 as shown in b). As a result, the release sheet A1 hung around the dancer roller 10 is attached to the adhesive surface of the cut-out film A2 while being pulled upward, whereby the cut-out film A2 and the release sheet A1 are re-applied. The cutout hole C of the film A2 is closed with the release sheet A1.

  When the rejoining operation between the film A2 and the release sheet A1 as described above is completed, the lock of the feeding roller 4 and the driving roller 11 is released, and the original film A2 and the release sheet A1 are wound simultaneously. The operation of extending the anti-A is performed simultaneously, and the operation of returning the press roller 6 and the receiving roller 7 from the second position P2 to the first position P1 is performed in synchronization therewith. One winding amount is substantially equal to the stroke amount of the press roller 6 and the receiving roller 7, and may be a stroke amount slightly longer than the diameter of the semiconductor wafer B1.

  Then, the original fabric A supported by the original fabric support shaft 2 is fed out by the amount wound by the take-up roller 13, and a new film A2 portion without a hole is newly provided on the film application stage S1. Derived and ready to apply film to the next semiconductor wafer.

  According to the above-described embodiment, since the cut-off film A2 and the release sheet A1 are wound together before the cut-off hole C of the film A2 is closed before the cut-out film A2 and the release sheet A1 are wound up at the same time, the configuration is applied. When the film A2 and the release sheet A1 are wound up simultaneously, the cutout hole C of the film A2 is reinforced with the release sheet A1, so that the 皺 D ( 5), the film A2 can be adhered to the next semiconductor wafer B1 in a good state without wrinkles D and bubbles, and the backgrinding of the semiconductor wafer B1 in the subsequent process is performed with high accuracy. Is possible. Moreover, since it is the structure which sticks and reinforces so that the cutout hole C of film A2 may be plugged up with peeling sheet A1, valuable and expensive film A2 is not consumed wastefully. Further, by closing the cutout hole C in the release sheet A1 as described above, the elongation of the film A2 during film winding and the tensile residual stress accumulated in the film A2 are reduced. It is also possible to effectively prevent a problem that the semiconductor wafer is warped and damaged after grinding.

  In the said embodiment, although the structure which the press roller 6 autorotates the surface of film A2 is employ | adopted, about the autorotation system, there exists a system which rotates by the contact frictional force with film A2, and a system which rotates with a motor, Any method may be adopted. Further, the adherend to which the film is attached is not limited to a semiconductor wafer, but can also be used for an optical disc, a steel plate, glass and the like.

BRIEF DESCRIPTION OF THE DRAWINGS The front view of the film sticking apparatus to which the winding apparatus which concerns on this invention, and the winding method are applied. The top view of the film sticking apparatus of FIG. The perspective view of a part of the film sticking apparatus of FIG. FIG. 4 is an operation explanatory view of the film sticking apparatus of FIG. 1, in which (a) is an explanatory view when the press roller and the receiving roller are located at the first position, and (b) is a press roller and the receiving roller. It is explanatory drawing when is slid to the 2nd position. Explanatory drawing of the film state at the time of sticking a film (protective tape) with the conventional film sticking apparatus.

Explanation of symbols

1 Film sticking device 2 Material support shaft (material support means)
Reference Signs List 5 peeling roller 6 press roller 7 receiving roller 8 first bypass roller 9 second bypass roller 13 take-up roller 24 cutting means 24 cutting means 25 cutter blade A original fabric A1 release sheet A2 film B adherend B1 semiconductor wafer C cutout hole S1 Film application stage

Claims (4)

In a device that winds up a film cut into a predetermined shape and having a thin edge,
A winding device comprising a mechanism for adhering a sheet so as to close a cut-out hole of the film before winding the film. There is provided a detour means for once peeling the original film in which the band-shaped film is temporarily attached to the strip-shaped release sheet to the release sheet and the film, and re-bonding them. In the device for winding up the peeled film and the release sheet at the same time after cutting the pasted film into a predetermined shape,
A winding device provided with a mechanism for attaching the release sheet peeled off by the detour means so as to close the cut-out hole of the film before winding the cut-out film and the release sheet at the same time. . In a method of winding a film that has been cut into a predetermined shape and has a thin edge,
Before winding up the film, a sheet is attached so as to close the cut-out hole of the film. There is provided a detour means for once peeling the original film in which the band-shaped film is temporarily attached to the strip-shaped release sheet to the release sheet and the film, and re-bonding them. In the method of winding the pasted film and the release sheet at the same time after cutting the pasted film into a predetermined shape,
Before winding up the cut-out film and the release sheet at the same time, the winding-up method is characterized in that the release sheet peeled off by the detour means is attached so as to close the cut-out hole of the film.

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