KR101643502B1 - Cutting device and cutting method - Google Patents

Cutting device and cutting method Download PDF

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Publication number
KR101643502B1
KR101643502B1 KR1020150094522A KR20150094522A KR101643502B1 KR 101643502 B1 KR101643502 B1 KR 101643502B1 KR 1020150094522 A KR1020150094522 A KR 1020150094522A KR 20150094522 A KR20150094522 A KR 20150094522A KR 101643502 B1 KR101643502 B1 KR 101643502B1
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South Korea
Prior art keywords
cutting
water
flow rate
condition
cut
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KR1020150094522A
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Korean (ko)
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KR20160010309A (en
Inventor
유야 이즈미
이치로 이마이
간지 이시바시
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토와 가부시기가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies

Abstract

An object of the present invention is to stably individualize pieces in a cutting apparatus even when a product is small.
In the present invention, the sealed substrate 12 is cut along the first cutting line 32 by using the first cutting condition to form the intermediate body 36. Next, using the second cutting condition, the intermediate body 36 is cut and individually fragmented. Thus, the intermediate body 36 is individually fragmented into the product P corresponding to the region 34 surrounded by the first cutting line 32 and the second cutting line 33, respectively. The flow rate of the cutting water under the second cutting condition when the individual pieces are formed into the product (P) is made smaller than the flow rate of the cutting water under the first cutting condition when the intermediate body (36) is formed. By decreasing the flow rate of the cutting water under the second cutting condition, even if the product P is small, the product P is displaced or protruded from a predetermined position of the cutting table 11 by the water pressure of the cutting water .

Description

CUTTING DEVICE AND CUTTING METHOD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting apparatus and a cutting method for cutting a workpiece to produce a plurality of individual pieces of a product.

A substrate made of a printed board or a lead frame is virtually divided into a plurality of regions in a lattice shape, chips are mounted on each region, and the entire substrate is resin-sealed. The finished substrate is cut off by a cutting mechanism using a rotating blade or the like, and the product is individually fragmented in units of regions.

Conventionally, a predetermined region of a substrate that has been sealed is cut by a cutting mechanism such as a rotary blade by using a cutting apparatus. For example, a BGA (Ball Grid Array Package) product is cut in the following manner. First, the substrate on the side of the substrate of the sealed substrate is placed on the cutting table in a state of being uptaken. Next, the sealed substrate is aligned (aligned). By alignment, the position of a virtual cut line for dividing a plurality of regions is set. Next, the cutting table on which the sealed substrate is adsorbed and the cutting mechanism are relatively moved. The cutting water is sprayed onto the cutting position of the sealing substrate, and the sealing substrate is cut along the cutting line set on the sealing substrate by the cutting mechanism. By cutting the sealed substrate, individual fragmented products are produced.

In recent years, with the advancement of semiconductor miniaturization, products to be manufactured tend to become smaller and smaller. For example, in an analog product or a discrete product, there are many products each having a size of 2 mm or less on one side. When the reduced product is individually fragmented, there is a phenomenon that the individual pieces of the product are displaced from a predetermined position of the cutting table or the product is jumped out from the cutting table by spraying the cutting water. These phenomena are considered to occur because the water pressure applied to the product by the cutting water is higher than the attraction force for attracting the individual segmented product to a predetermined position of the cutting table. If such a phenomenon occurs, the product may be broken or cracked, and the quality of the product may be significantly deteriorated. Further, the yield of the product is greatly deteriorated. Therefore, when the sealed substrate is individually segmented, it is important to firmly fix the product so that it does not move from a predetermined position of the cutting table.

1. A dicing apparatus for efficiently cleaning a workpiece to be cut, comprising: (a) first cleaning water jetting means for jetting cleaning water toward a workpiece to be cut, and (summary) A cutting water jetting means for supplying cutting water toward an end face of the cutting blade; and a second cleaning water jetting means provided on both sides of the cutting blade, And a cooling water jetting means for supplying cooling water to the cut portion of the nozzle body is provided in the dicing head. (See, for example, paragraphs [0008] and [0011] in FIGS.

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-188974

However, in the dicing apparatus disclosed in Patent Document 1, the following problems arise. As shown in Fig. 3 of Patent Document 1, the cutting apparatus 10 of the dicing apparatus 1 includes a rotary blade 14, a cutting table 60, a fixed water curtain nozzle (first cleaning water jetting means ) 62, a sponge block (corresponding to the scrubbing means) 64, and a moving water curtain nozzle (corresponding to the second washing water jetting means) 66.

A cutting water supply nozzle (corresponding to the cutting water supply means) 76 and a cooling water supply nozzle (corresponding to the cooling water supply means) 78 are provided on the flange cover 72 (part of the apparatus main body). The cutting water supply nozzle 76 is arranged to face the rotary blade 14 and the cutting water jetted from the cutting water supply nozzle 76 is supplied to the rotary blade 14 immediately before cutting. A pair of cooling water supply nozzles 78 are provided with a rotary blade 14 therebetween so that the cooling water jetted from the cooling water supply nozzle 78 is supplied to the rotating blade 14 and the wafer W And the rotary blade 14 and the cut portion are cooled.

According to such a configuration of the apparatus, when the size of a chip formed on the wafer W becomes small, it is feared that the individual pieces of chips are liable to protrude due to the processing water jetted from the cutting water supply means and the cooling water supply means .

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a cutting apparatus capable of stably cutting individual pieces without dislocation or jumping out of a predetermined position of a cutting table, And a method of cutting the same.

In order to solve the above-described problems, a cutting apparatus according to the present invention includes:

A table on which a workpiece having a plurality of regions surrounded by a plurality of cutting lines is disposed; a cutting means for cutting the workpiece; a moving mechanism for relatively moving the table and the cutting means; And a cutting water supply mechanism that supplies cutting water to a processing point at which the workpiece is in contact with the workpiece, wherein the cutting device is used to individually produce a product corresponding to each of the areas,

And a control unit for controlling a cutting condition for cutting the workpiece,

Wherein the control section includes a first cutting condition for generating an intermediate body containing a plurality of the regions by cutting the to-be-cut body along a part of a plurality of the cut lines as the cutting condition, And at least a second cutting condition for individual fragmentation,

And the flow rate of the cutting water under the second cutting condition is smaller than the flow rate of the cutting water under the first cutting condition.

In the cutting apparatus according to the present invention,

And the relative moving speed between the table and the cutting means under the second cutting condition is smaller than the relative moving speed under the first cutting condition.

Further, in the cutting apparatus according to the present invention,

At least the flow rate of the cutting water is controlled by the flow rate adjusting means.

Further, in the cutting apparatus according to the present invention,

And at least the flow rate of the cutting water is controlled by the switching means.

Further, in the cutting apparatus according to the present invention,

And a measuring unit for measuring a flow rate of the working water containing at least the cutting water and used for cutting the workpiece,

And the flow rate of the processed water in the first cutting condition and the second cutting condition is controlled based on the measurement value measured by the measuring unit.

Further, in the cutting apparatus according to the present invention,

And a cooling water supply mechanism for supplying cooling water from both sides of the cutting means toward the lower side of the cutting means,

The flow rate of the cooling water under the second cutting condition is smaller than the flow rate of the cooling water under the first cutting condition.

Further, in the cutting apparatus according to the present invention,

The object to be cut is a sealed substrate.

Further, in the cutting apparatus according to the present invention,

There is an aspect in which the object to be cut is a substrate in which circuit elements respectively corresponding to the plurality of regions are manufactured and inserted.

In order to solve the above-mentioned problems,

Disposing an object to be cut having a plurality of regions surrounded by a plurality of cutting lines on a table;

A step of relatively moving the table and the cutting means,

Cutting the workpiece using the cutting means by relatively moving the table and the cutting means;

And a step of supplying cutting water to the working point where the cutting means and the workpiece are in contact with each other using a cutting water supply mechanism,

Further comprising the step of controlling a cutting condition for cutting the workpiece,

The cutting step may include:

A first step of cutting an object to be cut along a part of a plurality of the cut lines to thereby produce an intermediate containing a plurality of the areas;

And a second step for individual fragmenting into said product by cutting said intermediate,

The cutting water supply mechanism is controlled so that the flow rate of the cutting water in the second step is smaller than the flow rate of the cutting water in the first step.

Further, in the cutting method according to the present invention,

In the relatively moving step, the relative moving speed between the table and the cutting means in the second step is made smaller than the relative moving speed in the first step.

Further, in the cutting method according to the present invention,

In the controlling step, there is an aspect in which the flow rate of at least the cutting water is controlled by using the flow rate adjusting means.

Further, in the cutting method according to the present invention,

In the controlling step, there is an aspect in which the flow rate of at least the cutting water is controlled by using the switching means.

Further, in the cutting method according to the present invention,

And a step of measuring a flow rate of the working water containing at least the cutting water and used for cutting the workpiece to be cut,

In the controlling step, the flow rate of the processed water in the first step and the second step is controlled based on the measured value measured in the measuring step.

Further, in the cutting method according to the present invention,

And a step of supplying cooling water to the lower side of the cutting means using a cooling water supply mechanism,

The control step controls the cooling water supply mechanism such that the flow rate of the cooling water in the second step is smaller than the flow rate of the cooling water in the first step.

Further, in the cutting method according to the present invention,

The object to be cut is a sealed substrate.

Further, in the cutting method according to the present invention,

There is an aspect in which the object to be cut is a substrate in which circuit elements respectively corresponding to the plurality of regions are manufactured and inserted.

According to the present invention, there is provided a cutting apparatus comprising: a table on which a workpiece having a plurality of regions surrounded by a plurality of cutting lines are arranged; cutting means for cutting the workpiece; A moving mechanism, a cutting water supply mechanism for supplying cutting water to a processing point where the cutting means and the workpiece are in contact with each other, and a control unit for controlling cutting conditions. According to the first cutting condition, the object to be cut is cut along a part of a plurality of cutting lines to produce an intermediate. According to the second cutting condition, the intermediate product is cut to prepare the product to be cut into individual pieces. The flow rate of the cutting water under the second cutting condition is made smaller than the flow rate of the cutting water under the first cutting condition. Accordingly, even when the product is small, it is possible to prevent the product from shifting or jumping out of the predetermined position of the table due to the water pressure of the cutting water.

1 (a) is a plan view of the periphery of a rotary blade, and Fig. 1 (b) is a schematic sectional view of a rotary blade seen from the opposite side of the spindle to be.
Fig. 2 is a schematic view showing a processing water supply mechanism for supplying processing water to each nozzle shown in Fig. 1 in Embodiment 1 of the cutting apparatus according to the present invention. Fig.
3 (a) to 3 (c) are plan views showing a cutting process of the sealing substrate according to the present invention. Fig. 3 (a) is a plan view showing a cutting line set on the sealed substrate, Fig. 3 (b) is a plan view showing a state after the sealing substrate is cut along the first cutting line, (c) is a plan view showing a state after the sealed substrate is individually fragmented.
Fig. 4 is a schematic view showing a working water supply mechanism for supplying working water to each nozzle shown in Fig. 1 in Embodiment 2 of the cutting apparatus according to the present invention. Fig.
Fig. 5 is a plan view showing the outline of a cutting apparatus in Embodiment 3 of the cutting apparatus according to the present invention. Fig.

As shown in Fig. 3, the sealed substrate 12 is first cut along the first cutting line 32 using the first cutting condition to form the intermediate body 36. Then, as shown in Fig. Next, using the second cutting condition, the intermediate body 36 is cut and individually fragmented. Thus, the intermediate body 36 is individually fragmented into the product P corresponding to the region 34 surrounded by the first cutting line 32 and the second cutting line 33, respectively. The flow rate of the cutting water under the second cutting condition at the time of individual fragmenting with the product P is made smaller than the flow rate of the cutting water under the first cutting condition when the intermediate body 36 is formed. By decreasing the flow rate of the cutting water under the second cutting condition, even if the product P is small, the product P is displaced or protruded from a predetermined position of the cutting table 11 by the water pressure of the cutting water Can be prevented.

(Example 1)

Embodiment 1 of a processing water supply mechanism of a cutting apparatus according to the present invention will be described with reference to Figs. 1 to 3. Fig. Any drawings in this application document are drawn schematically so that they are omitted or exaggerated appropriately for the sake of clarity. The same constituent elements are denoted by the same reference numerals, and the description thereof is appropriately omitted.

As shown in Fig. 1 (a), the cutting apparatus has a spindle 1, and the spindle 1 has a rotary shaft 2. As shown in Fig. A rotary blade (3) is attached to the rotary shaft (2). The cover 4 for the rotary blades (shown by two-dot chain lines in the figure) is attached to the spindle 1. [ The rotary blade 3 is covered by the cover 4 for the rotary blade. A cutter and a nozzle for supplying working water to the rotary blade (3) are attached to the rotary blade cover (4). For example, one cutting water supply nozzle 5, two cooling water supply nozzles 6, and two cleaning water supply nozzles 7 are attached to the rotary blade cover 4. The nozzle 6 for supplying the cooling water is connected to the pipe 9 for supplying the cooling water and the nozzle 7 for supplying the cleaning water is cleaned by the cleaning water supply pipe 8, And the water supply pipe 10, respectively.

As shown in Fig. 1 (b), on the cutting table 11, the substrate 12 to be cut, which is the object to be cut, is fixed by the suction or pressure sensitive adhesive sheet. The sealed substrate 12 is a workpiece to be finally cut and individually fragmented. The sealed substrate 12 includes a substrate 13 made of a printed substrate or a lead frame, a plurality of chip-shaped components (not shown) mounted on a plurality of regions of the substrate 13, And a sealing resin 14 formed so as to be covered with the sealing resin 14. The sealed substrate 12 is fixed to the cutting table 11 with the surface of the substrate 13 side facing up.

As shown in Figs. 1 (a) and 1 (b), from the nozzle 5 for supplying cutting water, the cutting water 15 Is sprayed. The cutting water 15 has a function of reducing the friction between the rotary blade 3 and the sealed substrate 12 by preventing clogging on the side surface of the rotary blade 3. [ Two cooling water supply nozzles 6 are arranged so that the rotating blade 3 is interposed therebetween. Each of the cooling water supply nozzles 6 is disposed so as to be parallel to the side surface of the rotary blade 3 and the upper surface of the sealed substrate 12. The cooling water 16 is injected from the cooling water supply nozzle 6 toward a predetermined portion including the side surface of the rotary blade 3. [ The cooling water 16 has a function of cooling the rotary blade 3 and the sealed substrate 12. The cleaning water 17 is sprayed from the two cleaning water supply nozzles 7 toward a predetermined portion near the side surface of the rotary blade 3 on the upper surface of the sealed substrate 12. The washing water 17 has a function of removing cutting chips and the like caused by the rotary blades 3. The cutting debris includes an elongated strip formed in the case where the sealed substrate 12 is cut along the cut line at the end of the sealed substrate 12 in addition to the powdery or granular material. do.

As shown in Fig. 1 (b), the cutting table 11 reciprocally moves in the Y direction at a feeding speed V by a moving mechanism (not shown). The rotary blade 3 rotates at a high rotation speed R in the counterclockwise direction of the drawing by a motor (not shown) inserted into the spindle 1. [

As shown in Fig. 2, the water supply mechanism 18 of the factory is a water supply mechanism that supplies, for example, pure water as processing water to a plurality of devices in the factory. Since the water supply mechanism 18 supplies the process water to a plurality of devices in the factory, the pressure of the process water to be supplied tends to fluctuate depending on the operation status of the device. When the pressure of the process water supplied from the factory is lowered, a predetermined pressure is not obtained in the process water supplied to each device, and the flow rate of the process water is also decreased. Therefore, it is preferable that the number of the processing water supplied by the water supply mechanism 18 at the factory is set to about 0.3 MPa to 0.5 MPa in consideration of the pressure drop.

Process water is supplied to the cutting device from the water supply mechanism (18) of the factory. The cutting water supply pipe 8 and the cooling water supply pipe 9 and the cleaning water supply pipe 10 which are provided in the cutting apparatus are connected to the water supply pipe And is connected to the mechanism 18. The common pipe 19 is provided with a pressure regulator (regulator) 20 for adjusting the pressure of the process water. The working water supplied from the water supply mechanism 18 to the common pipe 19 is pressurized to a predetermined pressure by the pressure regulator 20. [ The working water that has been reduced to a predetermined pressure is supplied to each branch pipe at a predetermined flow rate. In Fig. 2, for example, a maximum of 12 L / min of process water is supplied to the common pipe 19 of the cutting apparatus, and a predetermined amount of process water is supplied to each branch pipe from the common pipe 19. The common pipe 19 is provided with a flow rate sensor 21 for measuring the flow rate of the process water supplied from the water supply mechanism 18.

In the cutting apparatus, a control unit 22 for controlling cutting conditions and the like for cutting the sealed substrate 12 (see Fig. 1) is provided. For example, the flow rate of each of the cutting water 15, the cooling water 16, and the washing water 17 sprayed on the sealed substrate 12, the moving speed V of the cutting table 11, The number R, and the like are controlled by the control unit 22. The control unit 22 is connected to the flow rate sensor 21 provided in the common pipe 19 via the signal line 23. [

Flow controllers 24, 25 and 26 for adjusting the flow rates of the supplied working water are respectively installed in the cutting water supply pipe 8, the cooling water supply pipe 9 and the cleaning water supply pipe 10 . Each of the flow controllers 24, 25 and 26 is connected to the control section 22 via signal lines 27, 28 and 29, respectively. The cutting water 15 injected from the nozzle 5 for cutting water supply, the cooling water 16 injected from the nozzle 6 for supplying cooling water and the washing water 17 sprayed from the nozzle 7 for supplying the washing water The flow rates are controlled by the flow controllers 24, 25, and 26, respectively. The cutting table 11 is connected to the control unit 22 through the signal line 30. [ The moving speed V of the cutting table 11 is controlled by the control unit 22. [ The spindle 1 is connected to the control section 22 via a signal line 31. [ The rotation number R of the rotary blade 3 provided on the spindle 1 is controlled by the control section 22. [

The cutting water 15 is supplied from the common pipe 19 through the cutting water supply pipe 8, the flow controller 24 and the nozzle 5 for cutting water supply (see FIG. 1) . The cooling water 16 is injected from the common pipe 19 via the cooling water supply pipe 9, the flow controller 25 and the cooling water supply nozzle 6 (see FIG. 1) do. The washing water 17 is supplied from the common pipe 19 through the washing water feed pipe 10, the flow controller 26 and the nozzle 7 for supplying washing water (see FIG. 1) . The processing water supplied from the water supply mechanism 18 of the factory to the common piping 19 of the cutting apparatus is controlled at a predetermined flow rate by the flow controllers 24, 25, and 26 installed in the respective branch pipes, The processed amount of the flow rate is injected to the sealed substrate 12.

The flow rate of the process water supplied to the common pipe 19 is measured by the flow rate sensor 21 provided in the common pipe 19 of the cutting apparatus. Based on the measured flow rate of the process water, the control unit 22 controls the flow rate of the process water to be supplied to each of the flow controllers 24, 25, and 26. Thus, even if the pressure of the process water supplied from the water supply mechanism 18 is lowered and the flow rate of the process water is reduced, the control unit 22 controls the flow controllers 24, 25, 26 ).

The control unit 22 is connected to each of the flow sensor 21, the flow controllers 24, 25 and 26, the cutting table 11, the spindle 1, etc. through respective signal lines. Therefore, the setting, change, and the like of the cutting condition in the cutting apparatus can be controlled by the control unit 22 in whole. The flow rate of the processing water jetted from the nozzle 5 for cutting water supply, the nozzle 6 for supplying the cooling water, and the nozzle 7 for supplying the cleaning water can be appropriately controlled by the control unit 22.

In the first embodiment, the case where the flow rate sensor 21 is provided in the common pipe 19 of the cutting apparatus has been described. The flow rate sensors 21a, 21b and 21c (not shown in the figure) are connected to the cut-off water supply pipe 8, the cooling water supply pipe 9 and the cleaning water supply pipe 10, (Indicated by a chain double-dashed line). In this case, the flow sensors 21a, 21b, and 21c are connected to the control unit 22 through signal lines (not shown), respectively. The control unit 22 controls each of the flow controllers 24, 25, and 26 so as to supply a predetermined flow rate of processed water based on the flow rate of the processed water measured by the flow sensors 21a, 21b, and 21c.

1 to 3, the constitution of the sealed substrate 12 and the step of cutting the sealed substrate 12 into individual pieces in the first embodiment will be described. 3 (a), the sealed substrate 12 has a substrate 13 and a sealing resin 14 (indicated by a thick dotted line in the figure) made of a cured resin. A plurality of first cutting lines 32 along the shorter direction and a plurality of second cutting lines 33 along the longer direction are set on the sealed substrate 12, respectively. The region 34 surrounded by the first cutting line 32 and the second cutting line 33 is individually fragmented to be a product P (see Fig. 3 (c)). In Fig. 3 (a), for example, ten first cutting lines 32 are set in the short direction and four second cutting lines 33 are set in the long direction. Therefore, three regions 34 in the short direction and nine regions 34 in the long direction are formed, and a total of 27 regions 34 are formed in a lattice shape.

First, in order to cut the sealed substrate 12, the sealed substrate 12 is fixed to the cutting table 11 by suction or by an adhesive sheet with the substrate 13 side facing up (see FIG. 1 (b)]. The regions 34 formed on the sealed substrate 12 are adsorbed by the respective suction holes 35 formed in the cutting table 11. Therefore, even in the individual fragmented state, the products P corresponding to the respective regions 34 are adsorbed by the respective adsorption holes 35.

Next, the cutting table 11 and the spindle 1 are relatively moved (see Fig. 1). The phrase " relatively move " includes the following three aspects. These aspects include an aspect in which the cutting table 11 is fixed and the spindle 1 is moved, an aspect in which the spindle 1 is fixed and the cutting table 11 is moved and the cutting table 11 and the spindle 1 1) are both moved.

In the first embodiment, as shown in Fig. 1, the spindle 1 is fixed and the cutting table 11 is moved in the Y direction at a feed speed V (mm / sec) by a moving mechanism (not shown) . First, the spindle 1 is lowered so that the lower end of the rotary blade 3 becomes deeper than the lower surface of the sealing resin 14. Next, the rotary blade 3 attached to the tip end of the spindle 1 is rotated at a high rotation speed R in the counterclockwise direction. Next, the cutting table 11 is moved in the + Y direction at the conveying speed V, and the first cutting line 32 and the second cutting line 33 set on the sealed substrate 12 ) Of the seal-finished substrate 12 is cut. The cutting water 15 is supplied from the nozzle 5 for cutting water supply, the cooling water 16 is supplied from the nozzle 6 for supplying the cooling water, the cleaning water 17 is supplied from the nozzle 7 for supplying the cleaning water, To the sealed substrate 12 and the rotary blade 3, respectively.

Next, with reference to Fig. 3, an operation of cutting the sealed substrate 12 will be described in detail. First, as shown in Fig. 3A, the sealed substrate 12 is cut along the cut line at the rightmost end of the first cut line 32 set in the shorter direction. In this case, the sealed substrate 12 is cut using the first cutting condition. As the first cutting condition, for example, the flow rate of the cutting water 15 sprayed from the nozzle 5 for supplying cutting water is set to 4 L / min, the flow rate of the cooling water 16 jetted from the two nozzles 6 for supplying cooling water The flow rate of the washing water 17 sprayed from the two cleaning water feed nozzles 7 was set to 2 L / min, the feeding speed of the cutting table 11 was set to 40 mm / (3) is set to 30,000 rpm / min (see Fig. 1).

Next, as shown in FIG. 3 (b), using the first cutting condition, the sealed substrate 12 is cut along the remaining nine of the ten first cutting lines 32 set in the short direction do. 9 intermediate pieces 36 (portions indicated by halftone dot meshing in the figure) are formed by cutting the sealed substrate 12 along a total of ten first cutting lines 32 set in a short direction. Each of the intermediate bodies 36 is separated from each other along a long direction with a gap corresponding to the eight first cutting lines 32 interposed therebetween. Each of the intermediate bodies 36 has three regions 34 along the shorter direction. Each of the intermediates 36 is adsorbed to the cutting table 11 by three adsorption holes 35 corresponding to the three regions 34 of the intermediate body 36. The left side portion of the cutting line at the farthest end in the left-right direction in FIG. 3 (a), that is, the right side portion of the cutting line at the rightmost end and the leftmost portion of the cutting line at the leftmost end is an unnecessary portion made of a thin, Water or the like (see Fig. 3 (b)).

Next, as shown in Fig. 3 (c), the cutting table 11 is rotated 90 degrees. Next, the sealed substrate 12 is cut along the four second cutting lines 33 set in the long direction. In this case, first, the first cutting condition is used and a cutting line at the end of the second cutting line 33 (for example, a cutting line corresponding to the rightmost end portion in Fig. 3 (c) The sealed substrate 12 is cut. A portion (not shown) on the right side of the cut line corresponding to the rightmost end portion in Fig. 3 (c) is an unnecessary portion made of an elongated step, and is washed down by cleansing water or the like to be removed.

Subsequently, using the second cutting condition, the sealed substrate 12 is cut along the remaining three of the four second cutting lines 33 set in the long direction. By cutting each of the three second cutting lines, the product P corresponding to the individual fragmented region 34 is completed. Each product P is sucked to the cutting table 11 by the suction holes 35 corresponding to the respective regions 34. [

The second cutting condition is used when the product P corresponding to the individual fragmented region 34 is completed by cutting one of the cutting lines. As the second cutting condition, for example, the flow rate of the cutting water 15 sprayed from the nozzle 5 for supplying cutting water is set to 2 L / min, the flow rate of the cooling water 16 jetted from the two nozzles 6 for supplying cooling water The flow rate of the washing water 17 sprayed from the two cleaning water feed nozzles 7 was set to 2 L / min, the feeding speed of the cutting table 11 was set to 20 mm / (3) is set to 30,000 rpm / min (see Fig. 1). In this case, the flow rate of the cutting water 15 is 1/2, the flow rate of the cooling water 16 is 1/2, and the feed rate of the cutting table 11 is changed to 1/2 with respect to the first cutting condition , And a second cutting condition was set.

As described above, the first cutting condition is used in a case other than the case where the product P is completed by cutting one of the cutting lines. The second cutting condition is used when the product P corresponding to the individual fragmented region 34 is completed by cutting one of the cutting lines. The sealed substrate 12 is cut by using these cutting conditions so that the sealed substrate 12 is individually divided into regions 34 surrounded by the first cutting line 32 and the second cutting line 33, do. Each of the individually segmented regions 34 corresponds to the product P. Each product P is sucked to the cutting table 11 by the suction holes 35 corresponding to the respective regions 34. [ The sealed substrate 12 is cut along the first cutting line 32 and the second cutting line 33 and individual pieces are formed to complete the plurality of products P. [

In the present embodiment, as the second cutting condition, the flow rate of the cutting water 15 and the flow rate of the cooling water 16 are reduced to 1/2, and the feed speed of the cutting table 11 is reduced to 1/2 , And the seal-completed substrate 12 were individually fragmented. The flow rate of the cutting water 15 is reduced to 1/2 and the feed rate of the cutting table 11 is reduced to 1/2 as the second cutting condition so that the temperature of the sealed substrate 12 ) Can be individually fragmented. In addition, as the second cutting condition, only the flow rate of the cutting water 15 is reduced to 1/2, and the sealed substrate 12 can be individually segmented.

For example, the flow rate of the cutting water 15 at the second cutting condition is made smaller than the flow rate of the cutting water 15 at the first cutting condition. This leads to the following effects. The first effect is that the position of the product P is prevented from being displaced due to the impact of the cutting water 15 on these products P. [ The second effect is to suppress the phenomenon that the product P comes off from a predetermined position of the cutting table 11 and flows out due to the impact of the cutting water 15 on these products P. [ These effects are remarkable when one side (short side) of the product P is 3 mm or less. These effects are even more remarkable when one side (short side) of the product P is 2 mm or less.

According to the present embodiment, compared with the first cutting condition used in the step (including the step of forming the intermediate body 36) which is not equivalent to the step of individually fragmenting the product P, The second cutting condition at the time of fragmentation is optimized. For example, the flow rate of the cutting water under the second cutting condition is made smaller than the flow rate of the cutting water under the first cutting condition. This makes it possible to prevent the product P from shifting or jumping out of the predetermined position of the cutting table 11 due to the water pressure of the cutting water 15 even when the product P is small.

The second cutting condition can be set corresponding to the size of the product P so that the individual pieces of the product P are not shifted or protruded from the predetermined position of the cutting table 11. [ Concretely, in addition to the flow rate of the cutting water 15 described above, the flow rate of the cooling water 16, the flow rate of the washing water 17, the feeding speed of the cutting table 11, The second cutting condition can be set. In the second cutting condition, the flow rate of the cooling water 16 is decreased, the feed speed of the cutting table 11 is decreased, and the like, in addition to reducing the flow rate of the cutting water 15, Is prevented from being displaced or jutted from a predetermined position of the cutting table 11.

According to the present embodiment, in the second cutting condition, the flow rate of the cutting water 15 to be jetted and the cooling water 16 is reduced to 1/2 of the first cutting condition. Accordingly, it is possible to save the amount of the processing water used when individual pieces are formed into the product (P).

According to the present embodiment, as the first cutting condition and the second cutting condition, the flow rate of the cutting water 15, the flow rate of the cooling water 16, the flow rate of the washing water 17, The speed and the number of revolutions of the rotary blade 3 are set. By using the control section 22 provided in the cutting apparatus, these cutting conditions can be set and controlled. Therefore, depending on the size of the product P, the cutting condition can be easily set or changed using the control unit 22. [

Further, according to the present embodiment, the flow rate of the process water supplied to the cutting device is measured by the flow rate sensor 21. Even if the pressure of the processing water supplied from the water supply mechanism 18 of the factory to the cutting device is lowered and the flow rate is decreased, the control unit 22 controls the flow rate And controls the controllers 24, 25, and 26. Therefore, a predetermined flow rate of processing water can be jetted from the respective nozzles onto the sealing substrate 12.

(Example 2)

Referring to Fig. 4, the processing water supply mechanism in the second embodiment of the cutting apparatus according to the present invention will be described. The same constituent elements as those of the processing water supply mechanism described in Embodiment 1 are denoted by the same reference numerals and the description thereof is omitted.

The working water supplied from the water supply mechanism 18 of the factory to the cutting device is lowered to a predetermined pressure by the pressure regulator 20 and processed water of a predetermined flow rate is supplied to each branch pipe. In Fig. 4, for example, a maximum of 16 L / min of processed water is supplied to the common pipe 19, and a predetermined amount of process water is supplied to each branch pipe from the common pipe 19.

The three branch pipes 37, 38 and 39 of the cutting apparatus are respectively provided with flow rate adjusting throttles 40, 41 and 42 for adjusting the flow rate of the process water supplied from the common pipe 19. For example, the flow rate adjusting throttle 40 supplies 8 L / min of process water to the branch pipe 37. The flow rate adjusting throttle 41 supplies 4 L / min of process water to the branch pipe 38. The flow rate adjusting throttle 42 supplies 2 L / min of process water to the branch pipe 39.

The branch pipe 37 is further branched to a branch pipe 37A connected to the nozzle 5 for supplying cutting water and a branch pipe 37B connected to the nozzle 6 for supplying the cooling water. The branch pipe 38 branches to a branch pipe 38A connected to the nozzle 6 for supplying cooling water and a branch pipe 38B connected to the nozzle 5 for feeding the cutting water. The branch pipe 39 is connected to the nozzle 7 for supplying the washing water.

A solenoid valve 43 is installed in the branch piping 37, an electromagnetic valve 44 is installed in the branch piping 38, and an electromagnetic valve 45 is provided in the branch piping 39, respectively. The electromagnetic valve 43 is connected to the control section 22 through the signal line 46. The solenoid valve 44 is connected to the control unit 22 through a signal line 47. The electromagnetic valve 45 is connected to the control section 22 through a signal line 48. The solenoid valves 43, 44, and 45 are controlled to open and close by the control unit 22, respectively. By opening the electromagnetic valves 43, 44 and 45, the machining water is supplied to each nozzle.

The cutting table 11 is connected to the control unit 22 through the signal line 30. [ The moving speed V of the cutting table 11 is controlled by the control unit 22. The spindle 1 is connected to the control section 22 through a signal line 31. [ The rotation number of the rotary blade 3 provided on the spindle 1 is controlled by the control section 22. [

3 and 4, a step of cutting the sealed substrate 12 to separate pieces in the second embodiment will be described. For example, the number of processed water to be supplied to the branch pipe 37 is adjusted to 8 L / min by the flow rate adjusting throttle 40. The number of processing water to be supplied to the branch piping 38 is adjusted to 4 L / min by the flow rate adjusting throttle 41. The processing water to be supplied to the branch piping 39 is adjusted to 2 L / min by the flow rate adjusting throttle 42.

The flow rate of the cutting water 15 sprayed from the nozzle 5 for supplying cutting water is set to 4 L / min, and the flow rate of the cooling water discharged from the two nozzles 6 for cooling water 16, the flow rate of the washing water 17 spraying from the two cleaning water supplying nozzles 7 is 2 L / min, the feeding speed of the cutting table 11 is 40 mm / And the number of revolutions of the rotary blade 3 are set at 30,000 rpm / min.

The flow rate of the cutting water 15 sprayed from the cutting water supply nozzle 5 is set to 2 L / min, and the flow rate of the cutting water 15 to be sprayed from the cutting water supply nozzle 5 is set to 2 L / min as the second cutting condition used when the intermediate body 36 shown in FIG. 3 (b) The flow rate of the cooling water 16 sprayed from the two cooling water supply nozzles 6 was set to 2 L / min, the flow rate of the washing water 17 sprayed from the two cleaning water supply nozzles 7 was set to 2 L / The feeding speed of the cutting table 11 is set to 20 mm / sec, and the number of revolutions of the rotary blade 3 is set to 30,000 rpm / min.

4, the controller 22 controls the solenoid valve 43 and the branch pipe 39 of the branch pipe 37 to cut the sealed substrate 12 using the first cutting condition, The electromagnetic valve 45 of the branch pipe 38 is opened and the electromagnetic valve 44 of the branch pipe 38 is closed. As a result, 4 L / min of processed water is supplied from the branch pipe 37 to the cutting water supply nozzle 5 via the branch pipe 37A. The processing water of 4 L / min is supplied from the branch pipe 37 to the cooling water supply nozzle 6 via the branch pipe 37B. And the processing water of 2 L / min is supplied to the cleaning water supply nozzle 7 from the branch pipe 39. The sealed substrate 12 is cut using the first cutting condition to form the intermediate body 36, similarly to the first embodiment.

4, the control section 22 controls the electromagnetic valve 44 of the branch pipe 38 and the branch pipe 39 of the branch pipe 39 to cut the intermediate product 36 using the second cutting condition, The solenoid valve 45 is opened and the solenoid valve 43 of the branch pipe 37 is closed. Thereby, the processing water of 2 L / min is supplied from the branch pipe 38 to the cooling water supply nozzle 6 via the branch pipe 38A. The processing water is supplied at a rate of 2 L / min to the nozzle 5 for supplying cutting water from the branch pipe 38 via the branch pipe 38B. And the processing water of 2 L / min is supplied to the cleaning water supply nozzle 7 from the branch pipe 39. As in Example 1, the intermediate 36 is cut using the second cutting condition and individually fragmented. The sealed substrate 12 is cut by using the first cutting condition and the second cutting condition to manufacture a plurality of products P individually.

According to the present embodiment, the first cutting condition is set by first opening the electromagnetic valve 43 of the branch pipe 37 and closing the solenoid valve 44 of the branch pipe 38. Using the first cutting condition, the encapsulated substrate 12 is cut to form the intermediate body 36. Next, the second cutting condition is set by opening the solenoid valve 44 of the branch pipe 38 and closing the solenoid valve 43 of the branch pipe 37. Using the second cutting condition, the intermediate body 36 is cut and individual pieces are formed into the product P. The second cutting condition is optimized in comparison with the first cutting condition, and the sealed substrate 12 is individually fragmented into the product P. This makes it possible to prevent the product P from shifting or jumping out of the predetermined position of the cutting table 11 due to the water pressure of the processing water even when the product P is small.

According to the present embodiment, in the second cutting condition, the flow rate of the cutting water 15 to be jetted and the cooling water 16 is reduced to 1/2 with respect to the first cutting condition. Accordingly, it is possible to save the amount of the processing water used when individual pieces are formed into the product (P).

(Example 3)

Referring to Fig. 5, a third embodiment of a cutting apparatus according to the present invention will be described. The cutting device 49 shown in Fig. 5 individually cuts the material to be cut into a plurality of products P, respectively. The cutting device 49 has the acceptance unit A, the cutting unit B, the cleaning unit C, the inspection unit D and the accommodation unit E as constituent elements (modules).

Each of the components (each of the units A to E) is detachable and exchangeable with respect to each of the other components, and is prepared in advance so as to have a plurality of different specifications according to the anticipated requirement specifications. A cutting device 49 is constructed including each of the components A to E. [

The acquisition unit A is provided with a pre-stage 50. [ The pre-stage 50 receives the sealed substrate 12 corresponding to the object to be cut from the resin-sealing apparatus, which is a device of the previous process. The sealed substrate 12 (e.g., a BGA-type sealed substrate) is placed on the pre-stage 50 with the substrate 13 side facing up.

The cutting device 49 is a twin cut table type cutting device. Therefore, the cutting unit B is provided with two cutting stages 51A and 51B. The two cutting stages 51A and 51B are movable in the Y direction in the figure by a moving mechanism (not shown) and are rotatably movable in the [theta] direction. Cutting tables 11A and 11B are attached on the cutting stages 51A and 51B. The cutting unit B is constituted by a substrate arranging portion 52, a substrate cutting portion 53, and a substrate cleaning portion 54.

An alignment camera 55 is provided in the substrate placement section 52. [ The camera 55 is movable independently in the X direction in the substrate arrangement portion 52. [ The alignment mark is detected by the camera 55 in the substrate arrangement portion 52 of the sealed substrate 12 and the hypothetical first cutting line 32 and the second cutting line 33 are set 3 (a)].

The substrate cutting portion 53 is provided with two spindles 1A and 1B. The cutting device 49 is a cutting device of a twin spindle configuration. The two spindles 1A, 1B are independently movable in the X and Z directions. The two spindles 1A and 1B are provided with rotary blades 3A and 3B as cutting means, respectively. These rotary blades 3A and 3B rotate within the plane including the Y direction and the Z direction, respectively, to cut the sealed substrate 12.

The spindles 1A and 1B are provided with cutting water supply nozzles 5A and 5B for spraying the cutting water 15 to suppress frictional heat generated by rotating blades 3A and 3B rotating at a high speed. The cutting water 15 is injected toward the processing point at which the rotary blades 3A and 3B cut the finished substrate 12. The spindle 1A or 1B is provided with a cuff check camera (not shown) for checking the position, width, and the presence or absence of chipping of the cut groove (cuff) cut by the rotary blade 3A or 3B do. The camera is provided so as to take an image of a cut line on which the rotary blade 3A or 3B cut.

In the substrate cleaning section 54, the surface on the side of the substrate 13 (see FIG. 1 (b)) of the aggregate 56 composed of a plurality of individually segmented products P by cutting the encapsulated substrate 12, A cleaning mechanism (not shown) is provided.

The cleaning unit C is provided with a cleaning mechanism 57 for cleaning the surface of each of the individually fragmented products P on the side of the sealing resin 14 (see FIG. 1B). The cleaning mechanism 57 is provided with a cleaning roller 58 so as to rotate about the Y direction. On the upper side of the cleaning roller 58 for cleaning the surface on the side of the sealing resin 14, an aggregate 56 composed of a plurality of products P is disposed. In the aggregate 56, the surface on the side of the substrate 13 is adsorbed and fixed by a transport mechanism (not shown). That is, it is fixed to the transporting mechanism with the surface on the sealing resin 14 side facing downward. The transport mechanism is movable in the X and Z directions. This transport mechanism descends and reciprocates in the X direction, so that the surface of the aggregate 56 on the sealing resin 14 side is cleaned by the cleaning roller 58.

The inspection unit (D) is provided with an inspection stage (59). The aggregate 56 composed of a plurality of individually segmented products P by cutting the encapsulated substrate 12 is collectively transported and arranged on the inspection stage 59. The inspection stage 59 is movable in the X direction and is configured to be rotatable about the Y direction as an axis. The surface of the aggregate 56 composed of a plurality of individually segmented products P (for example, a BGA product) on the side of the sealing resin 14 and the side of the substrate 13 is inspected by the inspection camera 60 , Good and defective. The aggregate 56 composed of the finished product P is transported and arranged on the index table 61. The inspection unit D is provided with a plurality of feed mechanisms 62 for feeding the products P arranged in the index table 61 to the tray.

The storage unit E is provided with a good tray 63 for storing good items and a tray for defective items (not shown) for storing defective items. And the product P sorted into the good product and the defective product is accommodated in each tray by the feed mechanism 62. In the drawing, only one good tray 63 is shown, but the good tray 63 is provided in a plurality of storage units E.

In the present embodiment, the control unit 22 that sets and controls the operation of the cutting device 49 and the cutting conditions is installed in the acceptance unit A. The present invention is not limited to this, and the control section 22 may be provided in another unit.

In the present embodiment, the cutting device 49 of the twin-cut table type and twin spindle configuration has been described. The present invention is not limited to this, and the present invention can also be applied to a single-cut table system, a twin-spindle cutting apparatus, a twin cut table system, and a single spindle cutting apparatus.

In each of the embodiments, the sealed substrate 12 is first cut along the first cutting line 32 formed in the short direction, and along the second cutting line 33 formed in the next long direction, 12) was cut. The sealing substrate 12 may be cut along the second cutting line 33 and then the sealing substrate 12 may be cut along the first cutting line 32 as a modified example .

As another modification, the sealed substrate 12 may be cut into a plurality of blocks along a part of the first cutting lines 32 of the ten first cutting lines 32 formed in the short direction. For example, the seal-completed substrate 12 is cut along the four first cutting lines 32 including both ends to generate three blocks having the same size. Subsequently, the intermediate section is cut along the first cutting line 32 and the second cutting line 33 sequentially (or in reverse order), with respect to the entire intermediate body made up of each block. First, the method of cutting the sealed substrate 12 into a plurality of blocks is effective when deformation such as warpage or undulation is large in the sealed substrate 12. In any modified example, the second cutting condition is used when the product P corresponding to the individual fragmented region 34 is completed by cutting a certain cutting line.

Further, in each of the embodiments, the case where the rotary blade 3 is used as the cutting means has been described. The present invention is not limited to this. As the cutting means, a laser beam or the like may be used in addition to the rotary blades 3, such as a wire, a band saw, a water jet, or the like. In other words, the present invention can be applied to a cutting process having a mode in which a processing liquid (processing liquid) is supplied to a processing point or its periphery when cutting a material to be cut.

Further, in each of the embodiments, the case where pure water is used as the processing water containing the cutting water 15, the cooling water 16, and the like is disclosed. As the working water including the cutting water 15, the cooling water 16 and the like, a liquid containing additives such as a surfactant and a rust inhibitor besides pure water can be used.

In each of the embodiments, a case where the sealed substrate 12 is cut as a workpiece to be cut has been described. However, the present invention is not limited to this, and the present invention can be applied to the case where the next object to be cut is cut as the object to be cut other than the sealed substrate 12 to be individually fragmented. First, a case where semiconductor wafers made of silicon and compound semiconductors are individually fragmented. Secondly, there is a case where a product such as a chip resistor, a chip capacitor, and a chip type sensor is manufactured by individually segmenting a ceramic substrate or the like into which circuit elements such as resistors, capacitors, and sensors are manufactured and inserted. In these two cases, a semiconductor wafer, a ceramics substrate, or the like corresponds to a substrate into which circuit elements corresponding to a plurality of regions are manufactured and inserted. Third, there is a case where an optical component such as a lens, an optical module, and a light guide plate is manufactured by individually molding a resin molded article. Fourth, the resin molded product is individually fragmented to produce a general molded product. In various cases including the above-described four cases, the contents described so far can be applied.

Further, in each embodiment, a case has been described in which a piece to be cut having a rectangular shape having a long direction and a short direction is cut as a piece to be cut. The present invention is not limited to this. Even in the case of cutting a workpiece having a square shape or cutting a workpiece having a substantially circular shape such as a semiconductor wafer, the above-described contents can be applied.

In addition, even in the case of cutting a piece to be cut including a bent line or a broken line on the cut line, the contents described so far can be applied. In this case, the product P corresponding to each of the individual segmented areas 34 has an irregular outer shape including a bent line or a broken line like a certain type of memory card.

The present invention is not limited to the above-described embodiments, and can be appropriately combined, changed, or selected as needed within the scope of the present invention.

1, 1A, 1B: Spindle 2:
3, 3A, 3B: rotary blade (cutting means) 4: rotary blade cover
5, 5A, 5B: Cutting water supply nozzle (cutting water supply mechanism)
6: Cooling water supply nozzle (cooling water supply mechanism)
7: nozzle for supplying washing water 8: pipe for supplying cutting water
9: piping for supplying cooling water 10: piping for supplying washing water
11, 11A, 11B: Cutting table (table) 12: Sealed substrate (cut material)
13: substrate 14: sealing resin
15: Cutting water (cutting water, working water) 16: Cooling water (working water)
17: washing water (processed water) 18:
19: Common piping 20: Pressure regulator
21, 21a, 21b, 21c: Flow rate sensor (measuring section) 22:
23, 27, 28, 29, 30, 31: Signal lines
24: Flow controller (flow rate adjusting means)
25, 26: Flow controller 32: First cutting line (cutting line)
33: second cutting line (cutting line) 34: area (product)
35: suction hole 36: intermediate
37, 38, 39: branch piping 40, 41, 42: flow adjustment throttle
43: Solenoid valve (switching means) 44, 45: Solenoid valve
46, 47, 48: Signal line 49: Cutting device
50: pre-stage 51A, 51B: stage for cutting
52: substrate arranging part 53: substrate cutting part
54: Substrate cleaner 55: Alignment camera
56: an aggregate consisting of a plurality of products (P)
57: cleaning mechanism 58: cleaning roller
59: Stage for inspection 60: Camera for inspection
61: Index table 62:
63: Good-quality tray V: Feeding speed
R: Number of rotations A:
B: cutting unit C: cleaning unit
D: Inspection unit E: Receiving unit
P: Products

Claims (16)

A table on which a workpiece having a plurality of regions surrounded by a plurality of cutting lines is disposed; a cutting means for cutting the workpiece; a moving mechanism for relatively moving the table and the cutting means; And a cutting water supply mechanism that supplies cutting water to a processing point at which the workpiece is in contact with the workpiece, wherein the cutting device is used to individually produce a product corresponding to each of the areas,
And a control unit for controlling a cutting condition for cutting the workpiece,
Wherein the control section includes a first cutting condition for generating an intermediate body containing a plurality of the regions by cutting the to-be-cut body along a part of a plurality of the cut lines as the cutting condition, And at least a second cutting condition for individual fragmentation,
Wherein the flow rate of the cutting water under the second cutting condition is smaller than the flow rate of the cutting water under the first cutting condition. The cutting apparatus according to claim 1, wherein the relative moving speed between the table and the cutting means in the second cutting condition is smaller than the relative moving speed in the first cutting condition. The cutting apparatus according to claim 1 or 2, wherein at least the flow rate of the cutting water is controlled by the flow rate adjusting means. The cutting apparatus according to claim 1 or 2, wherein at least the flow rate of the cutting water is controlled by the switching means. The measuring apparatus according to claim 1 or 2, further comprising: a measuring section for measuring a flow rate of the working water containing at least the cutting water and used for cutting the workpiece,
And controls the flow rate of the processed water under the first cutting condition and the second cutting condition based on the measurement value measured by the measuring unit. The cooling device according to claim 1 or 2, further comprising a cooling water supply mechanism for supplying cooling water from both sides of the cutting means toward the lower side of the cutting means,
Wherein the flow rate of the cooling water under the second cutting condition is smaller than the flow rate of the cooling water under the first cutting condition. The cutting apparatus according to claim 1 or 2, wherein the workpiece is a sealed substrate. 3. The cutting apparatus according to claim 1 or 2, wherein the workpiece is a substrate in which a circuit element corresponding to each of the plurality of areas is manufactured and inserted. Disposing an object to be cut having a plurality of regions surrounded by a plurality of cutting lines on a table;
A step of relatively moving the table and the cutting means,
Cutting the workpiece using the cutting means by relatively moving the table and the cutting means;
A step of supplying cutting water to a working point at which the cutting means and the workpiece are in contact with each other using a cutting water supply mechanism
A cutting method comprising:
Further comprising the step of controlling a cutting condition for cutting the workpiece,
The cutting step may include:
A first step of cutting an object to be cut along a part of a plurality of the cut lines to thereby produce an intermediate containing a plurality of the areas;
And a second step for individually fragmenting into an article by cutting the intermediate,
Wherein the controlling step controls the cutting water supply mechanism such that the flow rate of the cutting water in the second step is smaller than the flow rate of the cutting water in the first step. 10. The method according to claim 9, wherein, in the relatively moving step, the relative moving speed between the table and the cutting means in the second step is made smaller than the relative moving speed in the first step Cutting method. The cutting method according to claim 9 or 10, wherein in the controlling step, the flow rate of at least the cutting water is controlled by using the flow rate adjusting means. The cutting method according to claim 9 or 10, wherein in the controlling step, the flow rate of at least the cutting water is controlled by using the switching means. The method according to claim 9 or 10, comprising a step of measuring a flow rate of the working water containing at least the cutting water and used for cutting the workpiece,
Wherein the controlling step controls the flow rate of the processed water in the first step and the second step based on the measured value measured in the measuring step. 11. The method according to claim 9 or 10, further comprising a step of supplying cooling water to the lower side of the cutting means using a cooling water supply mechanism,
Wherein the cooling water supply mechanism is controlled so that the flow rate of the cooling water in the second step is smaller than the flow rate of the cooling water in the first step. The cutting method according to claim 9 or 10, wherein the object to be cut is a sealed substrate. The cutting method according to claim 9 or 10, wherein the object to be cut is a substrate into which a circuit element corresponding to each of a plurality of the areas is manufactured and inserted.
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