JP2014108491A - Cutting apparatus and method for manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the occurrence of chipping and the occurrence of burrs when a resin sealing body is collectively cut by using a rotary blade.SOLUTION: In a state where a rotary blade 9 is rotated in one direction in which an outer circumference part of the rotary blade 9 can keep cutting from a surface (upper surface) of a substrate 2 being an uppermost layer toward the inside, a stage 8 is moved in the +X direction and the rotary blade 9 cuts the substrate 2. Subsequently, in the state where the outer circumference part of the rotary blade 9 can keep cutting from a surface (lower surface) of a sealing resin 4 being a lowermost layer toward the inside, the stage 8 is moved in the -X direction and the rotary blade 9 cuts the sealing resin 4. By these arrangements, the resin sealing body 1 having a double-layered structure comprising the substrate 2 and the sealing resin 4 is cut.

Description

  The present invention relates to a cutting apparatus and a cutting method for manufacturing an electronic component used when a plurality of electronic components are manufactured by cutting a resin sealing body having a substrate, a plurality of chip-shaped components, and a sealing resin. Is.

  When manufacturing an electronic component, it is widely practiced to singulation into a plurality of electronic components by cutting a resin sealing body using a rotary blade (blade) (for example, patents) Reference 1). The resin sealing body, which is an object to be cut, includes a substrate, a plurality of chip-like components mounted in a plurality of regions of the substrate, and a sealing plate formed in a flat plate shape so that the plurality of regions are collectively covered. A stop resin. In other words, the resin sealing body is a composite material in which a substrate on which a plurality of chip-shaped components are mounted and a sealing resin are laminated.

  The substrate includes a printed circuit board (printed wiring board) based on a lead frame made of copper, an iron-based alloy, or the like, a glass epoxy laminated board, a laminated board of a copper-clad polyimide film, or the like. Furthermore, the substrates include ceramic substrates based on alumina, silicon carbide, sapphire, etc., metal base substrates based on metals such as copper and aluminum, film base substrates based on polyimide films, etc. It is. Each chip-shaped component includes a chip-shaped semiconductor integrated circuit (abbreviated as IC), an optical semiconductor element, a transistor, a diode, a resistor, a capacitor, a thermistor, and the like. One chip-shaped component may be mounted on one area of the substrate, or a plurality of chip-shaped components may be mounted. The plurality of chip-like components mounted on one region may be the same type or different types. As the sealing resin, for example, a cured resin formed by curing a thermosetting resin such as an epoxy resin or a silicone resin is used.

JP 2003-168697 A (pages 2 to 4) JP 2003-124149 A (pages 2-7, FIGS. 3-9) Japanese Patent Laying-Open No. 2003-179004 (page 2, pages 4-6, FIG. 6)

  In recent years, substrate materials and sealing resin materials have been diversified. Due to this, when the resin sealing body is cut at once using one rotary blade, the following problems may occur. The first problem is that a flash made of a substrate (including a metal foil such as a copper foil contained in the substrate) or a sealing resin occurs on the end surface (surface to be cut) of the cut portion (for example, (See paragraphs [0011] to [0012] of Patent Document 2 and paragraph [0012] of Patent Document 3). The second problem is that chipping occurs in the vicinity of the surface to be cut (see, for example, paragraph [0090] of Patent Document 3).

  FIG. 1 is a schematic cross-sectional view showing a conventional method of cutting a resin sealing body using a rotary blade. In addition, in order to make it easy to understand, all drawings in the present application document are schematically omitted and exaggerated as appropriate. The same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  As shown in FIG. 1, the resin sealing body 1 is a cutting object to be cut and finally cut. The resin sealing body 1 is formed in a flat plate shape so that the substrate 2, a plurality of chip-like components (not shown) mounted on the plurality of regions 3 included in the substrate 2, and the plurality of regions 3 are collectively covered. And the formed sealing resin 4. The plurality of regions 3 included in the substrate 2 are divided into rectangular shapes by virtual boundary lines 5. In the example shown in FIG. 1, the substrate 2 is a lead frame made of copper. The board | substrate 2 has the electrode part 6 which functions as an external electrode for electrically connecting with respect to the exterior in the some electronic component formed by cut | disconnecting the resin sealing body 1. FIG.

The resin sealing body 1 is fixed to the upper surface of the stage 8 with an adhesive tape 7 so that the sealing resin 4 is on the lower side. The stage 8 is moved along the X direction, the Y direction, and the Z direction in the drawing by a driving mechanism (not shown). In FIG. 1, the stage 8 is moving at a moving speed (feeding speed) v in the + X direction. For example, the rotary blade 9 is attached to a rotary shaft 10 of an electric spindle (not shown). On the surface of the rotary blade 9, for example, abrasive grains made of diamond particles for cutting the object to be cut are exposed. A nozzle 11 is provided in the vicinity of a portion (contact portion) where the rotary blade 9 and the resin sealing body 1 are in contact with each other. In the process in which the rotary blade 9 cuts the resin sealing body 1, the cutting water 12 is discharged from the nozzle 11 toward the contact portion. As the cutting water 12, in addition to pure water, a liquid obtained by adding an additive to pure water, a liquid obtained by dissolving carbon dioxide (CO ₂ ) gas in pure water, or the like is used.

  The occurrence of chipping and the occurrence of flash will be described with reference to FIG. The following problem may occur in the example shown in FIG. The first problem is where the rotary blade 9 rotates from the inside of the sealing resin 4 (lowermost layer) through the surface of the sealing resin 4 (surface: the lower surface in the drawing) toward the space outside the surface. The problem is that chipping occurs. At the contact point between the rotary blade 9 and the sealing resin 4, f3 obtained by combining the tangential component force f1 and the component force f2 in the direction perpendicular to the tangent corresponds to the force acting on the contact point. The force f3 acting on the contact acts obliquely downward with respect to the surface of the sealing resin 4. Based on this, the surface of the sealing resin 4 of this contact receives an obliquely downward force f3 that is a force directed to the adhesive tape 7 with which the surface is in contact. Therefore, chipping is likely to occur on the surface of the sealing resin 4 of the contact.

  The second problem is that a flash is generated in the electrode portion 6 at a portion where the rotary blade 9 and the electrode portion 6 of the substrate 2 (uppermost layer) made of copper are in contact with each other. As shown in FIG. 1, the rotary blade 9 and the electrode portion 6 come into contact at a short distance. Due to this, the surface temperature of the rotary blade 9 rises, so that the copper of the electrode portion 6 and the diamond particles on the surface of the rotary blade 9 are easily welded. As a result, the function of the diamond particles to cut the object to be cut is lowered, and it is considered that flashing is likely to occur in the electrode portion 6. On the other hand, in order to suppress the occurrence of flash in the electrode unit 6, it is necessary to reduce the feed speed v at which the stage 8 moves in the X direction. This causes another problem of reduced work efficiency.

  In order to solve these problems, as a first method, a method using two cutting blades corresponding to two kinds of materials mainly constituting the resin sealing body has been proposed (for example, Patent Document 2). Paragraphs [0028] to [0039] and FIGS. 3 to 5). As a second method, a method using one blade made of a plurality of materials having different characteristics corresponding to a plurality of different materials constituting the resin sealing body has been proposed (for example, Patent Document 3). Paragraphs [0037] to [0054], see FIGS.

  However, according to the first method, there are undesirable problems such as using two cutting blades, complicating the configuration of the cutting device, and complicating the control of the two cutting blades. Occur. According to the second method, the configuration of one blade is complicated, and it is necessary to prepare a plurality of types of blades corresponding to a combination of a plurality of different materials constituting the resin sealing body. This is an undesirable problem.

  In view of the above-described problems, the present invention is an electronic component that suppresses the occurrence of chipping and flash when a resin sealing body is cut at once using a single rotary blade having a simple configuration. It is an object of the present invention to provide a cutting device and a cutting method for manufacturing.

In order to solve the above-described problem, a cutting apparatus for manufacturing an electronic component according to the present invention includes a substrate having a plurality of regions, a plurality of chip-like components respectively mounted in the plurality of regions, and a sealing resin. Used when manufacturing a plurality of electronic components by cutting a resin sealing body along a boundary line of a plurality of regions, a stage on which the resin sealing body is fixed, a spindle having a rotation shaft, and a rotation shaft A cutting apparatus for manufacturing an electronic component, comprising: a fixed rotary blade; a drive mechanism that relatively moves a stage and a spindle; and a control unit that at least controls movement by the drive mechanism and rotation of a rotary shaft. A nozzle that discharges cutting water is provided at a portion where the rotary blade and the resin sealing body are in contact with each other, and the control unit performs control so that the following operation is performed.
(1) In the state where the lowermost layer consisting of one of the substrate and the sealing resin is fixed to the stage, the uppermost layer consisting of the other of the substrate and the sealing resin is cut with the rotary blade overlapping the boundary line. The stage and the spindle are moved relative to each other until the rotary blade comes to the first position where the rotation is possible.
(2) In a state where the rotary blade is in the first position, the rotary blade is rotated in one direction in which the outer peripheral portion of the rotary blade can be cut inward from the surface of the uppermost layer.
(3) The cutting water is discharged from the nozzle toward the first contact portion that can contact the uppermost layer in the rotary blade.
(4) After the operations (2) and (3), the rotary blade cuts the uppermost layer by relatively moving the stage and the spindle in the first direction.
(5) After the uppermost layer is cut, the lowermost layer can be cut with the rotary blade overlapping the boundary line, and the outer periphery of the rotary blade can be cut inward from the surface of the lowermost layer The stage and the spindle are relatively moved until the rotary blade comes to the second position.
(6) The cutting water is discharged from the nozzle toward the second contact portion that can contact the lowermost layer in the rotary blade.
(7) After the operations (5) and (6), the rotary blade cuts the lowermost layer by relatively moving the stage and the spindle in the second direction opposite to the first direction, so that the resin is removed. Cut the sealing body.

  Moreover, the cutting device for manufacturing an electronic component according to the present invention is the above-described cutting device, wherein a single nozzle is provided on one surface side of the rotary blade, and the first contact portion and the second contact portion are provided. The nozzle discharges cutting water at the same time.

  The cutting apparatus for manufacturing an electronic component according to the present invention is the above-described cutting apparatus, wherein a single nozzle is provided on one surface side of the rotary blade, and the vicinity of the first contact portion and the second contact are provided. The nozzle moves to the vicinity of the part.

  The cutting device for manufacturing an electronic component according to the present invention is the above-described cutting device, wherein a plurality of nozzles are provided on one surface side of the rotary blade, and a part of the plurality of nozzles is the first. The cutting water is discharged toward the contact portion, and the other nozzles of the plurality of nozzles discharge the cutting water toward the second contact portion.

Further, in the cutting device for manufacturing an electronic component according to the present invention, in the above-described cutting device, the resin sealing body has an intermediate layer, and the control unit executes any one of the following three operations. It is characterized by controlling so that.
(1) The rotary blade cuts the lowermost layer along the second direction after cutting the uppermost layer and the intermediate layer along the first direction.
(2) After the rotary blade cuts the uppermost layer along the first direction, the intermediate layer and the lowermost layer cut along the second direction.
(3) The rotary blade cuts the uppermost layer and the intermediate layer along the first direction, and then cuts the intermediate layer and the lowermost layer along the second direction.

  In order to solve the above-described problems, a cutting method for manufacturing an electronic component according to the present invention includes a substrate having a plurality of regions, a plurality of chip-like components mounted on the plurality of regions, and a sealing resin. A cutting method for manufacturing an electronic component in which a resin sealing body is cut along a boundary line of a plurality of regions to manufacture a plurality of electronic components, wherein a lowermost layer made of one of a substrate and a sealing resin is staged The stage and the spindle until the rotary blade comes to the first position where the rotary blade overlaps the boundary line and cuts the uppermost layer made of the other of the substrate and the sealing resin. And rotating the rotary blade in one direction in which the outer peripheral portion of the rotary blade can be cut inward from the surface of the uppermost layer in a state where the rotary blade is in the first position, In contact with the top layer of the rotary blade A step of discharging cutting water toward the first contact portion that can be performed, a step of moving the stage and the spindle relative to each other in the first direction and the rotary blade cutting the uppermost layer, and the uppermost layer After cutting, the rotary blade is moved to the second position where the rotary blade can be cut with the rotary blade overlapping the boundary line, and the outer periphery of the rotary blade can be cut inward from the surface of the lowest layer The stage and the spindle are moved relative to each other, the cutting water is discharged toward the second contact portion that can contact the lowermost layer of the rotary blade, and the stage and the spindle are And a step of cutting the resin sealing body by moving the lower blade relative to the second direction opposite to the first direction and cutting the lowermost layer by the rotary blade.

  Moreover, the cutting method for manufacturing an electronic component according to the present invention is the above-described cutting method, in the step of discharging cutting water, from a single nozzle fixedly provided on one surface side of the rotary blade. It is characterized by discharging cutting water.

  Moreover, the cutting method for manufacturing an electronic component according to the present invention is the above-described cutting method, in the step of discharging cutting water, from a single nozzle provided movably on one surface side of the rotary blade. A step of discharging cutting water and moving a single nozzle is provided.

  Moreover, the cutting method for manufacturing an electronic component according to the present invention is provided on the one surface side of the rotary blade in the above-described cutting method, in the step of discharging cutting water toward the first contact portion. Among the plurality of nozzles, a part of the nozzles discharges cutting water, and in the step of discharging cutting water toward the second contact portion, the other nozzles of the plurality of nozzles discharge cutting water. And

  Further, in the cutting method for manufacturing an electronic component according to the present invention, in the cutting method described above, the resin sealing body has an intermediate layer, and the intermediate layer is cut in the step of cutting the uppermost layer, or the resin sealing is performed. In the step of cutting the stationary body, at least one of cutting the intermediate layer is performed.

  According to the present invention, when the rotary blade is rotated in one direction in which the outer peripheral portion of the rotary blade can be cut inward from the surface of the uppermost layer, the stage and the spindle are relatively moved in the first direction. Move the rotary blade to cut the top layer. Subsequently, in a state in which the outer peripheral portion of the rotary blade advances inward from the surface of the lowermost layer, the rotary blade is moved by relatively moving the stage and the spindle in the second direction opposite to the first direction. The resin sealing body is cut by cutting the bottom layer. Therefore, it is possible to suppress the occurrence of chipping due to the rotating blade penetrating from the inner side of the lowermost layer through the surface of the lowermost layer and rotating toward the outer side of the surface.

  According to the present invention, the distance between the rotary blade and the substrate can be increased as compared with the prior art. Therefore, it is possible to suppress the occurrence of flash caused by the contact between the rotary blade and the substrate at a short distance.

It is a schematic sectional drawing which shows the conventional method of cut | disconnecting a resin sealing body using a rotary blade. It is a schematic sectional drawing which shows the method of cut | disconnecting the resin sealing body in Example 1 of this invention. It is a schematic sectional drawing which shows the method of cut | disconnecting the resin sealing body in Example 2 of this invention. It is a schematic sectional drawing which shows the method of cut | disconnecting the resin sealing body in Example 3 of this invention.

  When the rotary blade is rotated in one direction in which the outer peripheral portion of the rotary blade can be cut inward from the surface of the uppermost layer, the rotary blade is moved relative to the first direction by moving the stage and the spindle relative to each other. Cut the top layer. Subsequently, in a state in which the outer peripheral portion of the rotary blade advances inward from the surface of the lowermost layer, the rotary blade is moved by relatively moving the stage and the spindle in the second direction opposite to the first direction. Cut the bottom layer. The resin sealing body is cut by these.

[Example 1]
With reference to FIG. 2, the cutting method for electronic component manufacture which concerns on Example 1 of this invention is demonstrated. According to the present embodiment, the resin sealing body 1 which is an object to be cut and has a two-layer structure is cut in two stages. The control unit CTL is a control unit that controls at least the rotational direction and the rotational speed of the rotary blade 9 and the relative moving direction and moving speed of the stage and the spindle.

  As shown in FIG. 2A, in the present embodiment, the substrate 2 (the uppermost layer in the present embodiment) of the resin sealing body 1 is cut as the first stage. The term “cutting” means both “cutting a part in the thickness direction” and “cutting all thicknesses” (the same applies hereinafter). The case of “cutting the entire thickness of the substrate 2” includes the following two modes. The first aspect is an aspect in which a thin portion remaining on the substrate 2 without being completely cut in the thickness direction is present on the sealing resin 4 in the already cut portion. The second mode is a mode in which a shallow groove formed by cutting the sealing resin 4 is present in the upper part of the sealing resin 4 in the already cut portion. These aspects occur due to variations in the position of the rotating shaft 10 in the Z direction.

  First, the resin sealing body 1 is fixed to the upper surface of the stage 8 with the adhesive tape 7 so that the sealing resin 4 is on the lower side of the resin sealing body 1. Thereby, the resin sealing body 1 is fixed to the upper surface of the stage 8 so that the sealing resin 4 is on the lower side and the substrate 2 is on the upper side.

  Next, the stage 8 is moved and stopped along the X direction so that the spindle is located on the right side away from the resin sealing body 1. The rotary blade 9 is rotated at a predetermined rotation speed (for example, 15000 to 30000 rpm) in a predetermined rotation direction (counterclockwise direction in the drawing). Here, the rotational speed is set to 20000 rpm.

  Next, the stage 8 is moved in the + Z direction, and when the lower end of the outer periphery of the rotary blade 9 reaches a predetermined position (Z direction), the movement in the + Z direction is stopped. As the predetermined position, the boundary position between the substrate 2 and the sealing resin 4 in the resin sealing body 1 is targeted.

  Next, the cutting water 12 is discharged from the nozzle 11 toward the portion of the rotary blade 9 that comes into contact with the resin sealing body 1. In this state, the stage 8 is moved at the moving speed (feeding speed) v in the + X direction to bring the rotary blade 9 and the substrate 2 into contact with each other. Subsequently, the rotary blade 9 cuts the substrate 2 by moving the stage 8. This cutting corresponds to the first stage in the cutting process. Hereinafter, a portion where the rotary blade 9 and the resin sealing body 1 are in contact in the first stage will be referred to as a first contact portion. The nozzle 11 is provided on the other side of the rotary blade 9 in addition to the nozzle 11 on the near side of the rotary blade 9 shown in FIG.

  As shown in FIG. 2A, in the process of cutting the substrate 2, the outer peripheral portion of the rotary blade 9 advances from the surface of the substrate 2 (surface: upper surface in the drawing) toward the inside of the substrate 2, and the substrate 2 To form grooves. The outer peripheral portion of the rotary blade 9 obtained by cutting the substrate 2 passes through a groove portion formed in the substrate 2 and continues to rotate upward from a position in the Z direction corresponding to the surface of the substrate 2.

  From the state shown in FIG. 2A, the stage 8 is subsequently moved in the + X direction. Accordingly, the rotary blade 9 is relatively moved to the left position away from the resin sealing body 1. Through the steps so far, a groove is formed from the right end to the left end of the substrate 2 so as to overlap with one boundary line (not shown) along the X direction of the drawing in the substrate 2.

  Next, the stage 8 is moved in the + Z direction by a distance obtained by adding a slight dimension to the thickness of the sealing resin 4. Thus, the positional relationship in the Z direction is set so that the position of the lower end of the rotary blade 9 is the same as the position lowered by a slight dimension from the upper surface of the adhesive tape 7 (see FIG. 2 (2)). The rotation speed of the rotary blade 9 is maintained at 20000 rpm.

  Next, as a second stage of this embodiment, the sealing resin 4 (the lowermost layer in this embodiment) included in the resin sealing body 1 is cut. As illustrated in FIG. 2B, the rotary blade 9 is brought into contact with the adhesive tape 7 and the sealing resin 4 by moving the stage 8 at a moving speed (feeding speed) v in the −X direction. Subsequently, the rotary blade 9 cuts the adhesive tape 7 and the sealing resin 4 by moving the stage 8. Hereinafter, a portion where the rotary blade 9 and the resin sealing body 1 are in contact in the second stage is referred to as a second contact portion. Since the present invention relates to a technique for cutting the resin sealing body 1, in the following description, description regarding cutting the adhesive tape 7 is omitted as appropriate.

  As shown in FIG. 2 (2), in the process of cutting the sealing resin 4, the outer peripheral portion of the rotary blade 9 is from the surface (surface: the lower surface in the figure) of the sealing resin 4 to the inside of the sealing resin 4. Then, the sealing resin 4 is cut to form a groove. The outer peripheral portion of the rotary blade 9 from which the sealing resin 4 has been cut sequentially passes through the groove portion formed in the sealing resin 4 and the groove portion formed in the substrate 2 and corresponds to the surface of the substrate 2. Continue to rotate upward from the position where you do.

  From the state shown in FIG. 2B, the stage 8 is subsequently moved in the −X direction. As a result, the rotary blade 9 is relatively moved to the right position away from the resin sealing body 1. Through the steps so far, an opening that overlaps one boundary line (not shown) along the X direction in the figure in the resin sealing body 1 is formed from the left end to the right end of the resin sealing body 1. Therefore, the resin sealing body 1 can be cut.

  According to the present embodiment, the following two effects can be obtained. The first effect is that the occurrence of chipping is suppressed. This effect is obtained as follows. As shown in FIG. 2 (2), at the contact point between the rotary blade 9 and the sealing resin 4, a force F3 obtained by combining the component force F1 in the tangential direction and the component force F2 in the direction perpendicular to the tangent is applied to the contact point. Corresponds to the acting force. According to the conventional technique, the force f3 acting on the contact acts obliquely downward with respect to the surface of the sealing resin 4 (see FIG. 1). On the other hand, according to the present embodiment, the force F3 acting on the contact acts substantially parallel to the surface of the sealing resin 4 (see FIG. 2 (2)). Therefore, the occurrence of chipping in the contact sealing resin 4 is suppressed.

  The second effect is that the occurrence of flash in the electrode portion 6 of the substrate 2 made of copper is suppressed. This effect is presumed to be obtained as follows. According to the present embodiment, the rotary blade 9 and the electrode portion 6 are in contact with each other at a long distance. In other words, in FIG. 2 (1), the distance between the outer periphery of the rotary blade 9 and the substrate 2 (left side) is shown as the distance between the outer periphery of the rotary blade 9 and the substrate 2 in FIG. Obviously longer than the distance on the left). This makes it difficult for the surface temperature of the rotary blade 9 to rise, so that welding of the copper of the electrode portion 6 and the diamond particles on the surface of the rotary blade 9 is suppressed. Accordingly, the function of cutting the object to be cut by the diamond particles is maintained, so that the occurrence of flash in the electrode portion 6 is suppressed.

[Example 2]
With reference to FIG. 3, the cutting method for electronic component manufacture which concerns on Example 1 of this invention is demonstrated. According to the present embodiment, the resin sealing body 1 which is an object to be cut and has a two-layer structure is cut in two stages. The difference between the present embodiment and the first embodiment is that the manner in which the resin sealing body 1 is fixed to the upper surface of the stage 8 is reversed in the Z direction.

  As shown in FIG. 3 (1), in this embodiment, as the first stage, the entire thickness of the sealing resin 4 (the uppermost layer in this embodiment) in the resin sealing body 1 is cut. The phrase “cuts the entire thickness of the sealing resin 4” includes the following two cases. The first case is a case where there is a thin portion on the substrate 2 where the sealing resin 4 is not completely cut in the thickness direction in the already cut portion. The second case is a case where a shallow groove formed by slightly cutting the substrate 2 exists in the upper portion of the substrate 2 in the already cut portion. These cases occur due to variations in the position of the rotating shaft 10 in the Z direction.

  In the present embodiment, first, the resin sealing body 1 is fixed to the upper surface of the stage 8 with the adhesive tape 7 so that the substrate 2 of the resin sealing body 1 is on the lower side. Thereby, the resin sealing body 1 is fixed to the upper surface of the stage 8 so that the substrate 2 is on the lower side and the sealing resin 4 is on the upper side.

  Next, the stage 8 is moved and stopped along the X direction so that the spindle is located on the right side away from the resin sealing body 1. The rotary blade 9 is rotated at a predetermined rotation speed (for example, 15000 to 30000 rpm) in a predetermined rotation direction (counterclockwise direction in the drawing). Here, the rotational speed is set to 20000 rpm.

  Next, the stage 8 is moved in the + Z direction, and when the lower end of the outer periphery of the rotary blade 9 reaches a predetermined position (Z direction), the movement in the + Z direction is stopped. As the predetermined position, the position of the boundary between the sealing resin 4 and the substrate 2 in the resin sealing body 1 is targeted.

  Next, the stage 8 is moved at a moving speed (feeding speed) v in the + X direction, and the rotary blade 9 and the sealing resin 4 are brought into contact with each other. Subsequently, the rotary blade 9 cuts the sealing resin 4 by moving the stage 8.

  As shown in FIG. 3 (1), in the process of cutting the sealing resin 4, the outer peripheral portion of the rotary blade 9 extends from the surface (surface: upper surface in the figure) of the sealing resin 4 to the inside of the sealing resin 4. The groove is formed by cutting the sealing resin 4 and cutting the sealing resin 4. The outer peripheral portion of the rotary blade 9 obtained by cutting the sealing resin 4 passes through the groove formed in the sealing resin 4 and continues upward from the position in the Z direction corresponding to the surface of the sealing resin 4. Rotate and proceed.

  Subsequently, the stage 8 is moved in the + X direction from the state shown in FIG. Accordingly, the rotary blade 9 is relatively moved to the left position away from the resin sealing body 1. Through the steps so far, a groove is formed from the right end to the left end of the sealing resin 4 so as to overlap one boundary line (not shown) along the X direction in the drawing in the sealing resin 4.

  Next, the stage 8 is moved in the + Z direction by a distance obtained by adding a slight dimension to the thickness of the substrate 2. Thus, the positional relationship in the Z direction is set so that the position of the lower end of the rotary blade 9 is the same as the position lowered by a slight dimension from the upper surface of the adhesive tape 7. The rotation speed of the rotary blade 9 is maintained at 20000 rpm.

  Next, as a second stage of the present embodiment, the substrate 2 (the lowermost layer in the present embodiment) included in the resin sealing body 1 is cut. As shown in FIG. 3 (2), the rotary blade 9 is brought into contact with the adhesive tape 7 and the substrate 2 by moving the stage 8 at a moving speed (feeding speed) v in the −X direction. Subsequently, the rotary blade 9 cuts the adhesive tape 7 and the substrate 2 by moving the stage 8.

  As shown in FIG. 3B, in the process of cutting the substrate 2, the outer peripheral portion of the rotary blade 9 cuts from the surface (surface: the lower surface in the figure) of the substrate 2 toward the inside of the substrate 2, 2 is cut to form a groove. The outer peripheral portion of the rotary blade 9 obtained by cutting the substrate 2 sequentially passes through the groove portion formed in the substrate 2 and the groove portion formed in the sealing resin 4 and corresponds to the surface of the sealing resin 4. Continue to rotate upward from the position where you do.

  Subsequently, the stage 8 is moved in the −X direction from the state shown in FIG. As a result, the rotary blade 9 is relatively moved to the right position away from the resin sealing body 1. Through the steps so far, an opening that overlaps one boundary line (not shown) along the X direction in the figure in the resin sealing body 1 is formed from the left end to the right end of the resin sealing body 1. Therefore, the resin sealing body 1 can be cut.

  According to the present embodiment, the following two effects can be obtained. The first effect is that the occurrence of chipping is suppressed. As a first effect, occurrence of chipping on the surface of the sealing resin 4 is suppressed. This effect is obtained by the fact that the force f3 acting obliquely downward shown in FIG. 1 is not generated on the surface of the sealing resin 4.

  In addition, as another aspect of the first effect, when the substrate 2 is made of a hard and brittle material (for example, a ceramic substrate), the occurrence of chipping on the surface of the substrate 2 is suppressed. This effect is obtained as follows. As shown in FIG. 3B, a force F3 obtained by combining a tangential component force F1 and a component force F2 perpendicular to the tangent at the contact point between the rotary blade 9 and the substrate 2 acts on the contact point. It corresponds to power. According to the prior art, the force acting on the contact (see f3 in FIG. 1) acts obliquely downward with respect to the surface of the substrate 2 (this means that the resin sealing body 1 shown in FIG. If you think about the reversed state, it is obvious.) On the other hand, according to the present embodiment, the force F3 acting on the contact acts substantially parallel to the surface of the substrate 2 (see FIG. 3B). Therefore, the occurrence of chipping in the contact substrate 2 is suppressed.

  The second effect is that the occurrence of flash in the electrode portion 6 of the substrate 2 made of copper is suppressed. This effect is presumed to be obtained as follows. According to the present embodiment, the rotary blade 9 and the electrode portion 6 are in contact with each other at a long distance. In other words, in FIG. 3B, the distance between the outer periphery of the rotary blade 9 and the substrate 2 (the right side) is shown as the distance between the outer periphery of the rotary blade 9 and the substrate 2 in FIG. Obviously longer than the distance on the left). This makes it difficult for the surface temperature of the rotary blade 9 to rise, so that welding of the copper of the electrode portion 6 and the diamond particles on the surface of the rotary blade 9 is suppressed. Accordingly, the function of cutting the object to be cut by the diamond particles is maintained, so that the occurrence of flash in the electrode portion 6 is suppressed.

[Example 3]
With reference to FIG. 4, the cutting method for electronic component manufacture which concerns on Example 3 of this invention is demonstrated. According to the present embodiment, the resin sealing body 13 that is the object to be cut is cut in three stages. The difference between the present embodiment and the first embodiment is that the resin sealing body 13 has a three-layer structure. As shown in FIG. 4, the resin sealing body 13 includes a substrate 2 (the lowermost layer in this embodiment), a reflection member 14 (an intermediate layer in this embodiment), and a sealing resin 4 (in this embodiment). A top layer).

  As shown in FIG. 4, the reflecting member 14 is formed with a recess 15 for each region 5 as a unit. In each recess 15, the upper surface of the substrate 2 is exposed. A die bonding pad 16 and a wire bonding pad 17 are formed on the exposed upper surface. The die bonding pad 16 is connected to an external terminal 19 formed on the lower surface of the substrate 2 by a through wiring 18. The wire bonding pad 17 is connected to an external terminal 21 formed on the lower surface of the substrate 2 by a through wiring 20. For example, a light emitting element 22 made of an LED chip or a laser diode chip is mounted on the die bonding pad 16. A pad (not shown) formed on the upper surface of the light emitting element 22 and the wire bonding pad 17 are connected by a wire 23 made of a gold wire or the like. The sealing resin 4 includes a lens part 24 that is formed in each region and functions as a convex lens, and a plate-like communication part 25 that communicates the lens parts 23 with each other.

  In this embodiment, the resin sealing body 13 is cut as follows. First, as a first step, the entire thickness of the communication portion 25 in the sealing resin 4 in the resin sealing body 13 is cut. In the first stage, the target is that the position (Z direction) of the lower end of the outer periphery of the rotary blade 9 shown in FIG. 3 (1) is the position A shown in FIG. In the process of cutting the sealing resin 4, the outer peripheral portion of the rotary blade 9 advances from the surface of the sealing resin 4 (surface: upper surface in the drawing) toward the inside of the sealing resin 4, and the sealing resin 4 is cut. To form a groove. The outer peripheral portion of the rotary blade 9 obtained by cutting the sealing resin 4 passes through the groove formed in the sealing resin 4 and continues upward from the position in the Z direction corresponding to the surface of the sealing resin 4. It proceeds by rotating (see FIG. 3 (1)). At this stage, a stage (not shown) is moved at a movement speed (feed speed) v in the + X direction. Therefore, the resin sealing body 13 moves at the moving speed v in the + X direction.

  Next, as a second stage, the substrate 2 and the reflecting member 14 of the resin sealing body 13 are cut. In the second stage, the target is that the lower end position (Z direction) of the outer periphery of the rotary blade 9 shown in FIG. 3 (1) is slightly lower than the position C shown in FIG. To do. At this stage, a stage (not shown) is moved at a moving speed v in the -X direction. Therefore, the resin sealing body 13 moves at the moving speed v in the −X direction.

  In the process of cutting the substrate 2 and the reflection member 14, the outer peripheral portion of the rotary blade 9 advances from the surface (surface: the lower surface in the figure) of the substrate 2 toward the inside of the substrate 2, and the substrate 2 and the reflection member 14 are reflected. The member 14 is cut. The outer peripheral portion of the rotary blade 9 obtained by cutting the substrate 2 and the reflecting member 14 passes through a groove portion formed in the sealing resin 4. Finally, the outer peripheral portion of the rotary blade 9 obtained by cutting the substrate 2 continues to rotate upward from a position corresponding to the surface of the sealing resin 4.

  According to the present embodiment, as in the first and second embodiments, first, occurrence of chipping in the substrate 2 is suppressed. Second, the occurrence of flash in the die bonding pad 16, the wire bonding pad 17, the through wires 18 and 20, and the external terminals 19 and 21 corresponding to the electrode portion 6 shown in FIG. 1 is suppressed.

  In this example, the pad (not shown) formed on the upper surface of the light emitting element 22 and the wire bonding pad 17 were connected by wire bonding using the wire 23. Instead of wire bonding, flip chip bonding may be used.

  As a modification of the present embodiment, the sealing resin 4 and the reflecting member 14 are cut out of the resin sealing body 13 as the first stage, and the substrate 2 of the resin sealing body 13 is cut as the second stage. May be cut. In the first stage, the target is that the position (Z direction) of the lower end of the outer periphery of the rotary blade 9 shown in FIG. 3 (1) is the position B shown in FIG.

  As another modification, the sealing resin 4 and a part of the reflecting member 14 are cut as a first stage, and the remaining part of the reflecting member 14 and the substrate 2 are cut as a second stage. Also good. In this case, in the second stage, the rotary blade 9 advances inward from the surface of the reflecting member 14 (surface: the upper surface of the remaining portion of the reflecting member 14), and the substrate 2 is completely cut. After that, the surface of the reflecting member 14 penetrates from the inside of the reflecting member 14 and rotates toward the space outside the surface. In this modification, the reflective member 14 has better machinability than the sealing resin 4 (in other words, the reflective member 14 is less likely to cause chipping or flashing than the sealing resin 4). To be effective.

  As another modification, a part of the sealing resin 4 is cut as the first stage, and the remaining part of the sealing resin 4, the reflecting member 14 and the substrate 2 are cut as the second stage. Good. This modification is effective when the sealing resin 4 has better machinability than the reflecting member 14.

  As yet another modification, the sealing resin 4, the reflecting member 14, and a part of the substrate 2 may be cut as the first stage, and the remaining part of the substrate 2 may be cut as the second stage. . This modification is effective when the substrate 2 has better machinability than the reflecting member 14.

  In relation to each modification described so far, cutting a part of the substrate 2 as a first stage, and cutting a part of the substrate 2 and the sealing resin 4 as a first stage, It can be applied to the embodiment shown in FIG.

  Further, in relation to the respective modifications described so far, a part of the sealing resin 4 is cut as the first stage, and a part of the sealing resin 4 and the substrate 2 is cut as the first stage. This can be applied to the embodiment shown in FIG.

  In addition, in each Example demonstrated so far, the case where the resin sealing body 1 which is a cutting object has a 2 layer structure or a 3 layer structure was demonstrated. The present invention is not limited to this, and the present invention can be applied when the resin sealing body 1 has a structure of four or more layers. In these cases, the control unit CTL controls the rotation speed and rotation direction of the rotary blade 9 and the relative movement direction of the stage and the spindle as follows. First, in the stage of cutting the uppermost layer or a plurality of layers including the uppermost layer, the outer peripheral portion of the rotary blade cuts inward from the surface of the uppermost layer. Secondly, in the stage of cutting the lowermost layer or a plurality of layers including the lowermost layer, the outer peripheral portion of the rotary blade advances toward the inside from the surface of the lowermost layer.

  Further, the stage 8 was moved along the X direction, the Y direction, and the Z direction in the figure. Instead, the spindle (not shown) to which the rotary blade 9 is attached may be moved along the X direction, the Y direction, and the Z direction in the figure. Further, both the stage 8 and the spindle may be moved along the X direction, the Y direction, and the Z direction in the drawing. According to these aspects, the stage 8 and the spindle may be relatively moved along the X direction, the Y direction, and the Z direction.

  In addition, the rotational speed of the rotary blade 9 is the same when the substrate 2 is cut and when the sealing resin 4 is cut. Instead of this, when the uppermost layer is cut and when the lowermost layer is cut according to the combination of the materials constituting the resin sealing bodies 1 and 13 (in addition, if there is an intermediate layer, the intermediate layer Different rotational speeds may be employed in the case of cutting the layer).

  As an example, the case where the resin sealing body 1 shown in FIG. 2 is cut will be described. In the case of the resin sealing body 1 in which a printed board using a glass epoxy laminate as a base material is used as the substrate 2 and an epoxy resin is used as the sealing resin 4, the first stage and the second stage are used. The same number of revolutions can be employed.

  As another example, a case where one example of the resin sealing body 13 shown in FIG. 4 is cut will be described. In the resin sealing body 13, a ceramic substrate having hard and brittle physical properties is used as the substrate 2. As the reflecting member 14, a polyamide resin, a polyester resin, an epoxy resin, or the like is used. As the sealing resin 4, a silicone resin that is softer and more viscous than the reflecting member 14 is used. In this case, if the sealing resin 4 is cut by increasing the rotational speed of the rotary blade, the sealing resin 4 may be deformed or peeled off. Further, when the substrate 2 is cut by increasing the number of rotations of the rotary blade, the chipping of the substrate 2 may occur. Therefore, in this case, for example, it is preferable to increase the rotational speed of the rotary blade in the order of cutting the sealing resin 4, cutting the substrate 2, and cutting the reflecting member 14.

  Moreover, the speed at which the stage 8 and the spindle are relatively moved along the X direction, the Y direction, and the Z direction can be changed according to the combination of the materials constituting the resin sealing bodies 1 and 13.

  The overall shape of the resin sealing body 1 is typically a plate shape (flat plate shape) in the case of manufacturing an IC, a surface mount transistor, a surface mount capacitor, or the like (see FIGS. 2 and 3). Not only this but the whole shape of the resin sealing body 1 may be a shape having a plurality of protrusions functioning as convex lenses in the case of manufacturing an optical semiconductor element (see FIG. 4).

  Moreover, as an aspect of the nozzle 11, a configuration in which two tubular nozzles corresponding to the first contact portion and the second contact portion are provided may be employed. Further, a configuration in which one tubular nozzle is provided and the nozzle can be moved to positions corresponding to the first contact portion and the second contact portion may be employed. According to these configurations, when cutting the resin sealing body 1 having a large thickness, an effect of reducing the consumption of the cutting water by supplying the cutting water to an optimum place can be obtained. Because the first contact portion and the second contact portion are separated when cutting the resin sealing body 1 having a large thickness, it is not necessary when the configuration of FIGS. 2 and 3 is adopted. This is because the cutting water is supplied to a certain point. The resin sealing body 1 having a large thickness includes power control semiconductor elements (IC, transistors, etc.), internal combustion engine control, motor control, and braking system control ICs for transportation equipment. Etc.

  Further, as a method of fixing the resin sealing body 1 to the stage 8, the resin sealing body 1 may be adsorbed without using an adhesive tape (see paragraph [0015] of Patent Document 1). In this case, a groove that accommodates the outer peripheral portion of the rotary blade 9 is formed on the upper surface of the stage 8 so as to overlap each boundary line 5 that is a cut portion in plan view.

  Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. Is.

1, 13 Resin encapsulant 2 Substrate (top layer, bottom layer)
3 area 4 sealing resin (lowermost layer, uppermost layer)
DESCRIPTION OF SYMBOLS 5 Boundary line 6 Electrode part 7 Adhesive tape 8 Stage 9 Rotating blade 10 Rotating shaft 11 Nozzle 12 Cutting water 14 Reflecting member (intermediate layer)
DESCRIPTION OF SYMBOLS 15 Recess 16 Die bonding pad 17 Wire bonding pad 18, 20 Through wiring 19, 21 External terminal 22 Light emitting element 23 Wire 24 Lens part 25 Communication part A, B, C Position CTL control part v Feeding speed

Claims (10)

A plurality of electronic components obtained by cutting a resin sealing body having a substrate having a plurality of regions, a plurality of chip-like components respectively mounted on the plurality of regions, and a sealing resin along a boundary line of the plurality of regions Used to manufacture the resin sealing body, a spindle having a rotation shaft, a rotary blade fixed to the rotation shaft, and the stage and the spindle are relatively moved. A cutting device for manufacturing an electronic component comprising: a drive mechanism; and a control unit that controls at least the movement of the drive mechanism and the rotation of the rotating shaft,
A nozzle that discharges cutting water at a portion where the rotary blade and the resin sealing body are in contact with each other;
A cutting apparatus for manufacturing an electronic component, wherein the control unit performs control so that the following operation is performed.
(1) In the state where the lowermost layer consisting of one of the substrate and the sealing resin is fixed to the stage, the rotary blade has the uppermost layer consisting of the other of the substrate and the sealing resin as the boundary. The stage and the spindle are moved relative to each other until the rotary blade comes to a first position where it can be cut by overlapping the line.
(2) In a state where the rotary blade is in the first position, the rotary blade is rotated in one direction in which the outer peripheral portion of the rotary blade can cut inward from the surface of the uppermost layer.
(3) The cutting water is discharged from the nozzle toward the first contact portion that can contact the uppermost layer in the rotary blade.
(4) After the operations (2) and (3), the stage and the spindle are relatively moved in the first direction so that the rotary blade cuts at least the uppermost layer.
(5) After at least the uppermost layer is cut, the lowermost layer can be cut with the rotary blade overlapping the boundary line, and the outer peripheral portion of the rotary blade is inward from the surface of the lowermost layer. The stage and the spindle are moved relative to each other until the rotary blade comes to a second position where it can be cut forward.
(6) The cutting water is discharged from the nozzle toward the second contact portion that can contact the lowermost layer in the rotary blade.
(7) After the operations (5) and (6), the stage and the spindle are relatively moved in a second direction opposite to the first direction so that the rotary blade is at least the lowermost layer. The resin sealing body is cut by cutting. In the cutting device for electronic component manufacture described in Claim 1,
A single nozzle is provided on one side of the rotary blade,
The cutting device for manufacturing an electronic component, wherein the nozzle simultaneously discharges the cutting water toward the first contact portion and the second contact portion. In the cutting device for electronic component manufacture described in Claim 1,
A single nozzle is provided on one side of the rotary blade,
A cutting apparatus for manufacturing an electronic component, wherein the nozzle moves between the vicinity of the first contact portion and the vicinity of the second contact portion. In the cutting device for electronic component manufacture described in Claim 1,
A plurality of the nozzles are provided on one surface side of the rotary blade,
A part of the plurality of nozzles discharges the cutting water toward the first contact portion,
The other nozzle among the plurality of nozzles discharges the cutting water toward the second contact portion. In the cutting device for electronic component manufacture described in any one of Claims 1-4,
The resin sealing body has an intermediate layer,
The said control part is controlled so that any one operation | movement is performed among the following three operation | movement, The cutting device for electronic component manufacture characterized by the above-mentioned.
(1) The rotary blade cuts the lowermost layer along the second direction after cutting the uppermost layer and the intermediate layer along the first direction.
(2) The rotary blade cuts the intermediate layer and the lowermost layer along the second direction after cutting the uppermost layer along the first direction.
(3) The rotary blade cuts the intermediate layer and the lowermost layer along the second direction after cutting the uppermost layer and the intermediate layer along the first direction. A plurality of electronic components obtained by cutting a resin sealing body having a substrate having a plurality of regions, a plurality of chip-like components respectively mounted on the plurality of regions, and a sealing resin along a boundary line of the plurality of regions A cutting method for manufacturing electronic parts,
Fixing the lowermost layer consisting of one of the substrate and the sealing resin to the stage;
The stage and the spindle are placed until the rotary blade comes to a first position where the rotary blade can be cut by overlapping the boundary line between the substrate and the sealing resin. A relatively moving step;
In a state in which the rotary blade is in the first position, rotating the rotary blade in one direction in which the outer peripheral portion of the rotary blade can be cut inward from the surface of the uppermost layer;
Discharging the cutting water toward the first contact portion that can contact the uppermost layer in the rotary blade;
Moving the stage and the spindle relative to each other in a first direction so that the rotary blade cuts at least the uppermost layer;
After cutting at least the uppermost layer, the lowermost layer can be cut with the rotary blade overlapping the boundary line, and the outer peripheral portion of the rotary blade advances inward from the surface of the lowermost layer Relatively moving the stage and the spindle until the rotary blade is in a second position capable of:
Discharging the cutting water toward a second contact portion capable of contacting the lowermost layer in the rotary blade;
A step of cutting the resin sealing body by relatively moving the stage and the spindle in a second direction opposite to the first direction so that the rotary blade cuts at least the lowermost layer; A cutting method for manufacturing an electronic component. In the cutting method for electronic component manufacture described in Claim 6,
In the step of discharging the cutting water, a cutting method for manufacturing an electronic component is characterized in that the cutting water is discharged from a single nozzle fixedly provided on one surface side of the rotary blade. In the cutting method for electronic component manufacture described in Claim 6,
In the step of discharging the cutting water, the cutting water is discharged from a single nozzle movably provided on one surface side of the rotary blade,
A cutting method for manufacturing an electronic component, comprising the step of moving the single nozzle. In the cutting method for electronic component manufacture described in Claim 6,
In the step of discharging the cutting water toward the first contact portion, a part of the plurality of nozzles provided on one surface side of the rotary blade discharges the cutting water,
In the step of discharging the cutting water toward the second contact portion, another nozzle out of the plurality of nozzles discharges the cutting water. In the cutting method for electronic component manufacture described in any one of Claims 6-9,
The resin sealing body has an intermediate layer,
At least one of cutting the intermediate layer in the step of cutting the uppermost layer or cutting the intermediate layer in the step of cutting the resin sealing body is performed. Cutting method for manufacturing electronic components.

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