TWI462239B - Semiconductor package - Google Patents

Description

Semiconductor package

The present invention relates to a semiconductor package and a method of fabricating the same, and more particularly to a semiconductor package having a heat dissipating fan wheel and a method of fabricating the same.

For example, a motherboard such as a main board or a Mother Board is provided with a plurality of electronic components such as a central processing unit or a graphics card, and electrical circuits for electrically connecting the electronic components (Conductive Circuits). The electronic components generate heat when they are applied. If the generated heat is not removed from the electronic product in which the circuit board is mounted, the electronic components may fail due to overheating; such problems are increasing in function demand and processing speed. The faster the electronic product is more important, the increase in function and processing speed means that the electronic components or electronic devices integrated on the circuit board must be more or higher, and more electronic components or electronic devices will be produced. The heat. Therefore, the heat generated by the circuit board is effectively dissipated into a necessary design.

One of the general methods of heat dissipation used in the industry is to add a heat dissipating fan on the motherboard or the motherboard to dissipate heat generated by electronic components and/or electronic devices. Such a cooling fan has been found in, for example, 6,799,282, 7,215,548. U.S. Patent Nos. 7,286,357, 7, 568, 517, 7, 884, 512 and 7, 884, 523.

For example, the conventional cooling fan shown in FIG. 8A is mounted on a predetermined position of the circuit board, and is mainly composed of a printed circuit board 81, a housing 82, and a fan wheel 83. The housing 82 has a base 820, a shaft sleeve 822, and a stator assembly 821 disposed on the shaft sleeve 822. The fan wheel 83 has a hub 830, a magnet 831 disposed on the inner side of the hub 830, and a ring a plurality of blades 832 outside the hub 830 and a shaft 833 axially coupled to the hub 830 for axially disposed in the shaft sleeve 822; and the printed circuit board 81 is provided with at least one control wafer 810 and a plurality of passive components 812 The printed circuit board 81 is disposed on the base 820 of the housing 82 to control the rotation of the fan wheel 83 by the control wafer 810 to drive the air flow by the rotation of the fan wheel 83.

The control wafer 810 used in the conventional heat dissipating fan shown in FIG. 8A is a heat source. If the generated heat cannot be dissipated, it will cause its own overheating to fail. Once the control wafer 810 fails, the control chip 810 cannot be activated. The fan wheel 83; in this way, the heat generated by the electronic components on the motherboard of the electronic product is not effectively dissipated, thereby causing the electronic product to crash and even be damaged. The control chip 810 is located in the gap between the base 820 of the housing 82 and the hub 830 of the fan wheel 83. The narrowness of the gap tends to make the heat generated by the control chip 810 unable to be effectively removed. Damage to the control wafer 810 due to overheating. A cooling fan is one of the relatively inexpensive components of an electronic product. If it is not operational, it will damage the motherboard of the core component of the electronic product, so its importance is not measurable from its price.

In addition, the arrangement of the control wafer 810 affects the gap between the hub 830 of the fan wheel 83 and the base 820 of the housing 82. The height of the gap must be increased by controlling the thickness of the wafer 810. The overall height is reduced. Moreover, the setting of the control chip 810 increases the area required for the printed circuit board 81, and the increase of the area of the printed circuit board 81 does not increase the cross-sectional area of the conventional cooling fan, and the area of the blade 832 needs to be reduced. However, the reduction of the area of the blade 832 will affect the output of the air volume, and if the output of the air volume is insufficient, it will affect the desired heat dissipation effect.

In order to solve the above problems, U.S. Patent No. 7,345,884 proposes an improved cooling fan. The structure of the heat dissipating fan of U.S. Patent No. 7,345,884 is substantially the same as that of the prior art, except that the printed circuit board 81' is formed with an outwardly extending extension portion 81a for controlling the wafer 810. 'Setting thereon such that the control wafer 810' is located outside or partially outside the gap between the base 820' of the housing 82' and the hub 830' of the fan wheel 83' to expose the gap, so that the fan wheel 83' The driven gas stream is capable of escaping the heat generated by the control wafer 810'.

However, the formation of the extending portion 81a of the printed circuit board 81' extending outwardly causes the airflow driven by the fan wheel 83' to be disturbed during the rotation, and the airflow is disturbed to generate noise, thereby affecting the heat dissipation. The quality of the use of the fan's electronic products. At the same time, since the extending portion 81a extends outwardly, a predetermined interval between the blade 832' and the control wafer 810' is required, which is not conducive to the reduction of the overall height of the conventional cooling fan, and cannot satisfy the thin electronic product. Demand.

Moreover, the conventionally disclosed cooling fan still needs to place the printed circuit board 81' between the hub 830' of the fan wheel 83' and the base 820' of the housing 82', resulting in the thickness of the printed circuit board 81' still affecting. The overall height of the cooling fan cannot further thin the cooling fan.

In view of the above, the present invention provides a semiconductor package, comprising: a substrate having opposite first and second surfaces and a through hole communicating with the first surface and the second surface; and disposed on the first surface of the substrate And at least one electronic component electrically connected to the substrate; a stator set disposed on the substrate; the shaft is disposed in the through hole of the substrate, and partially protrudes from the shaft sleeve on the first surface of the substrate An encapsulant formed on the first surface of the substrate to cover the electronic component and the portion of the sleeve protruding from the first surface of the substrate; and the second surface of the substrate is coupled to the shaft sleeve Fan wheel.

In the foregoing semiconductor package, the shaft sleeve can be located at an eccentric position of the semiconductor package.

In the semiconductor package of the present invention, the stator assembly may be disposed and electrically connected to the second surface of the substrate, or disposed and electrically connected to the first surface of the substrate, and covered by the encapsulant. Wherein, when the stator assembly is disposed on the first surface of the substrate, the thickness of the substrate is less than or equal to 0.1 mm.

In one embodiment, the semiconductor package further includes a venting hole integrally formed through the encapsulant and the substrate.

In another embodiment, the semiconductor package further includes a flow guiding cover fixed on the side of the encapsulant and the substrate to enhance airflow and reduce noise. The flow guide cover has an upper opening to provide axial flow blowing, and may be designed to have a first flow guiding port parallel to the axial direction of the shaft sleeve and a second flow guiding axis perpendicular to the axial direction of the shaft sleeve. Mouth to provide side-by-side blowing.

In a further embodiment, the semiconductor package further includes a conductive component and an external component. The conductive component is formed on the first surface of the substrate and is covered by the encapsulant. The top surface of the encapsulant is exposed. The conductive component; the external component is disposed and electrically connected to the conductive component. In a variant, the semiconductor package further comprises an external component disposed on and electrically connected to the second surface of the substrate. In an embodiment with an external component, the design of the venting opening and/or the flow guiding cover can be combined to enhance the dissipation of heat from the external component.

In order to obtain the semiconductor package of the present invention, the present invention provides a method for manufacturing the semiconductor package, comprising: providing a substrate having an electronic component, a stator assembly and a shaft sleeve on a surface thereof, the substrate having a first surface and a second surface, wherein the first surface of the substrate is formed with the encapsulant covering the electronic component and a portion of the sleeve; the encapsulant and the substrate are cut; and the fan wheel is axially coupled to the shaft from the second surface of the substrate casing.

In a specific embodiment of the foregoing method, the substrate has a through hole connecting the first surface and the second surface, and a part of the shaft sleeve shaft is disposed in the through hole before the formation of the encapsulant, so that A portion of the shaft sleeve projects from the first surface of the substrate.

In another method of fabricating a semiconductor package, the shaft sleeve can be disposed in a plurality of manners, one of which may form a through hole penetrating the substrate from the second surface of the substrate before cutting the package body and the substrate. The fan wheel is coupled to the shaft sleeve from the second surface of the substrate via the through hole.

Or forming a package colloid covering the sleeve of the substrate on the first surface of the substrate without pre-drilling the substrate; and forming an opening through the substrate and at least a portion of the encapsulant from the second surface of the substrate; The shaft sleeve shaft is then placed in the opening.

The invention does not need to use the housing, so the electronic component does not need to be disposed between the base of the housing and the hub of the fan wheel, so as to prevent the heat generated by the electronic component from being effectively removed, and the thickness of the encapsulation colloid can be controlled, and the bearing fan wheel can be reduced. The overall thickness of the package is more suitable for the thinning of electronic products. Moreover, the control wafer is disposed at a predetermined position on the substrate, does not interfere with the airflow generated by the fan wheel in the operating state, and therefore has no problem of noise or vibration, and the substrate can be pre-formed with a vent hole or formed into a package. After the colloid, a through-hole is formed, and the heat generated by the electronic component is dissipated by the airflow path under the substrate of the semiconductor package. In addition, since the fan wheel and the electronic component are located on opposite surfaces, it is not necessary to consider the problem of the shaft sleeve being exposed during the packaging, thereby making the packaging process easy.

The technical contents and embodiments of the present invention are described in detail below by way of specific embodiments, and those skilled in the art can readily understand the advantages and functions of the present invention from the disclosure of the present disclosure. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. In the meantime, the terms "upper", "top", "bottom" and "one" are used in the description, and are not intended to limit the scope of the invention. Changes or adjustments to a relationship are considered to be within the scope of the invention, without departing from the scope of the invention.

First specific embodiment

1A to 1F are cross-sectional views showing a method of fabricating a semiconductor package of the present invention.

As shown in FIG. 1A, first, a substrate 10 having a first surface 10a and a second surface 10b is prepared, and the substrate 10 is planned with a plurality of package units P. In this embodiment, the substrate 10 has a through hole 101 extending through the first surface 10a and the second surface 10b. The through hole 101 can be formed in the center of the package unit P of the substrate. The hole 101 is formed in the package unit P of the substrate 10 in an eccentric manner, so that more space can be left on the first surface 10a for providing electronic components, especially functional wafers.

As shown in FIG. 1B, the shaft sleeve 14 is axially disposed in the central or eccentrically disposed through hole 101; and at least one electronic component 12 is disposed and electrically connected to the first surface 10a of the substrate 10. The aforementioned shaft sleeve 14 protrudes from the first surface 10a of the substrate 10, and partially covers the port of the through hole 101 at the first surface 10a of the substrate 10. In addition, the aforementioned electronic component 12 includes at least a control chip for transmitting a control signal to the substrate 10 and a subsequently disposed stator set to drive the operation of the subsequently disposed fan wheel. Of course, as shown in FIG. 1B', the electronic component may include a functional wafer 12' such as a drawing wafer and a display wafer, and is disposed on the first surface 10a of the substrate 10.

As shown in FIG. 1C, an encapsulant 15 is formed on the first surface 10a of the substrate 10 to cover the electronic component 12 and the portion of the first sleeve 10a of the substrate 10 protruding from the shaft sleeve 14. After the encapsulant 15 is formed, on the second surface 10b of the substrate, the ring set sub-group 13 is on the outer side of the through hole 101. Further, as shown in Fig. 1C', a magnet piece 18 is disposed at the upper end of the stator set 13 to facilitate magnetic flux of the stator group 13 and the magnet of the subsequently disposed fan wheel.

Thereafter, as shown in FIG. 1D, the encapsulant 15 and the substrate 10 are diced to obtain a semiconductor package 1.

As shown in FIG. 1E, the fan wheel 16 is rotatably coupled from the second surface 10b of the substrate 10 to the shaft sleeve 14, wherein the fan wheel 16 has a hub 1600 disposed on the hub 1600. A plate magnet 1601 on the inner side, a plurality of blades 1602 disposed outside the hub 1600, and a shaft post 1603 pivotally connected to the hub 1600. As shown in FIGS. 1E' and 1E", the substrate 10 is multiplexed with a conductive member 17 such as a wire or a conductive member 17' of a solder ball which is exposed to a colloid, thereby being electrically connected to other electrical devices. The conductive element 17' can be disposed on the first surface 10a before forming the encapsulant 15.

As shown in FIG. 1F, the stator assembly 13' of the present invention may be disposed and electrically connected to the first surface 10a of the substrate, wherein the stator assembly 13' is looped outside the shaft sleeve 14, and It is covered with an encapsulant 15 . In this example, the thickness of the substrate 10 is less than or equal to 0.1 mm to facilitate the magnetic flux generated by the stator set 13' and the magnet of the subsequently disposed fan wheel 16.

Second specific embodiment

2A to 2C are cross-sectional views showing a method of fabricating a semiconductor package according to a second embodiment of the present invention. In the present embodiment, the manufacturing method is substantially the same as that of the first embodiment, except that the substrate 10' is not provided with a through hole, but is formed after forming the encapsulant. The other steps of forming the present semiconductor package are the same as those of the first embodiment, and therefore will not be described again.

As shown in FIG. 2A, at least one electronic component 12 and the stator assembly 13 and the substrate 10' on which the encapsulant 15 is formed are disposed and electrically connected to the first surface 10a' and the second surface 10b'.

As shown in Fig. 2B, prior to dicing the encapsulant 15, an opening 201 extending through the substrate 10' and the encapsulant 15 is formed by, for example, a laser drilling technique. And as shown in Fig. 2C, the shaft sleeve 14' is axially fixed and fixed in the opening 201, and a portion of the shaft sleeve 14' projects from the first surface 10a' of the substrate 10'. Alternatively, as shown in FIG. 2C′, the opening 201 ′ does not need to completely penetrate the encapsulant 15 , and the shaft sleeve 14 ′ can be axially fixed and fixed to the opening extending through the substrate 10 ′ and at least a portion of the encapsulant 15 . 201' in. Further, as shown, the opening 201' includes a through-hole structure penetrating the substrate as in Fig. 1A. Thereafter, the fan wheel 16 is axially coupled to the shaft sleeve 14' through the opening 201' as shown in Fig. 1E of the first embodiment. Similarly, the openings 201, 201' and the subsequent axial bushings 14' can be formed eccentrically in the substrate of the semiconductor package and the encapsulant (not shown).

Third specific embodiment

The invention can also be accomplished without the substrate being pre-drilled. As shown in FIG. 3A, similar to the manufacturing method of the first embodiment, the shaft sleeve 14", the at least one electronic component 12, and the functional wafer 12' are electrically connected to the first surface 10a of the un-drilled substrate 10, The shaft sleeve 14", the electronic component 12, and the functional wafer 12' are covered with an encapsulant 15. The stator set 13 is disposed on its second surface 10b and surrounds the position of the shaft sleeve 14" relative to the second surface 10b.

Next, as shown in FIG. 3B, a through hole 301 penetrating the substrate 10 is formed by a drilling technique using, for example, a laser, and the through hole 301 is correspondingly connected and connected to the shaft sleeve 14". Thereafter, the fan wheel is axially coupled to the shaft sleeve 14" through the through hole 301 as shown in Fig. 1E of the first embodiment. Similarly, the shaft sleeve can be eccentrically fixed to the substrate of the semiconductor package and the encapsulant (not shown).

Fourth specific embodiment

In this embodiment, a method for manufacturing a semiconductor package that increases heat dissipation performance is provided. The bottom view shown in FIG. 4A can be connected to the structure of FIG. 1C, 2A or 3A. After the package body 15 is formed, the package is cut. A vent hole 400 penetrating the encapsulant 15 and the substrate 10 is formed in front of the colloid 15 and the substrate 10 by, for example, laser cutting.

As shown in FIG. 4B, when the semiconductor package is activated, the airflow S can be aired from above to increase heat dissipation performance.

Fifth specific embodiment

In this embodiment, the present invention provides a method of fabricating a semiconductor package that enhances airflow flow, thereby reducing noise. As shown in FIG. 5A, for example, the diced semiconductor package shown in FIG. 1E is fixed to the side of the encapsulant 15 and the substrate 10 by, for example, fixing the adhesive 51. The guide airflow flows in the radial direction of the fan wheel 16. Of course, the flow guide cover 50 can also be secured using a mechanical snap (as in Figure 5A').

As shown in the bottom and cross-sectional views of FIGS. 5B and 5B', the flow guiding cover 50' may be designed to have a first air guiding opening 500 parallel to the axial direction of the shaft sleeve 14 and an axial direction perpendicular to the shaft sleeve 14. The second air guiding port 501. Particularly, when the semiconductor package does not have the vent holes of the foregoing embodiment, the flow guiding cover 50' shown in Figs. 5B and 5B' can provide the upper side exhaust flow S guiding design.

Sixth embodiment

This embodiment provides an embodiment in which an external component is stacked on the top surface of the encapsulant. As shown in the preferred embodiment of FIG. 6A, the through hole 601 is disposed on the substrate 10 in an eccentric manner. In this embodiment, a conductive member 61 such as a solder ball or a metal post is formed before the encapsulant is formed. On the first surface 10a of the substrate 10.

As shown in FIG. 6B, the encapsulant 15 is formed to cover the conductive member 61, but the conductive member 61 is exposed on the top surface of the encapsulant 15; the external component 60 is further disposed and electrically connected, wherein the external component 60 is Packaged component or semiconductor wafer.

The method of manufacturing the conductive member 61 is performed by forming the conductive member 17' according to the first embodiment and removing the top surface of the encapsulant 15 to obtain the conductive member 61 exposed in FIGS. 6A and 6B. The composite may include a semiconductor package that is fixed to the drain cover 50 to guide the flow of the airflow S.

Seventh embodiment

This embodiment provides an embodiment in which an external component is stacked on the bottom surface of the substrate. The preferred embodiment shown in FIG. 7 is applied, for example, to the venting hole 400 of the third embodiment, and the through hole 701 is eccentrically disposed on the substrate 10 for cutting the encapsulant 15 and the substrate. 10, before the second surface 10b of the substrate 10 is disposed and electrically connected to the external component 70. Preferably, the semiconductor package is provided with a side exhaust flow S as shown in FIGS. 4B and 4B'. Guide the design of the flow guide cap 50'.

According to the foregoing method, the present invention provides a semiconductor package comprising: a substrate 10, 10' having a first surface 10a, 10a' and a second surface 10b, 10b', and a first surface 10a, 10a connected thereto And through holes 101, 301, 601, 701 of the second surface 10b, 10b'; at least one electronic component 12 disposed on the first surface 10a, 10a'; and electrically connected to the substrate 10, 10' The stator set 13, 13'; the shaft is disposed on the first surface 10a, 10a' of the through hole 101, 301, 601, 701 of the substrate 10, and partially protrudes from the shaft sleeve 14, 14 of the first surface 10a, 10a' of the substrate 10, 10' ', 14'; an encapsulant 15 formed on the first surface 10a, 10a', covering the electronic component 12 and a portion of the sleeves 14, 14', 14"; and from the substrate 10, 10' second The surface 10b, 10b' is axially coupled to the fan wheel 16 of the shaft sleeve 14, 14', 14". The shaft sleeve 14, 14', 14" may be located at an eccentric position of the semiconductor package.

In the semiconductor package of the present invention, the stator assembly 13, 13' may be disposed and electrically connected to the second surface 10b, 10b', or be electrically connected to the first surface 10a, 10a', and The encapsulant 15 is coated, wherein the thickness of the substrate 10, 10' is less than or equal to 0.1 mm when the stator assembly 13' is disposed on the first surface 10a, 10a'.

In one embodiment, the semiconductor package can include a vent 400 extending through the encapsulant 15 and the substrate 10, 10'.

In still another embodiment, the semiconductor package may include a flow guiding cover 50, 50' fixed to the encapsulant 15 and the substrate 10, 10' to enhance airflow and reduce noise. The flow guide cover 50 has an upper opening to provide axial flow blowing, and the flow guiding cover 50' can be designed to have a first air guiding port 500 parallel to the axial sleeve 14, 14', 14" axial direction and A second diversion port 501 is formed perpendicular to the axial sleeve 14, 14', 14" axial direction to provide a side row blow.

In still another embodiment, the semiconductor package further includes a conductive element 61 and an external component 60 formed on the first surface 10a, 10a' of the substrate 10, 10', and the encapsulant is 15, the top surface of the encapsulant 15 exposes the conductive element 61; the external component 60 is disposed and electrically connected to the conductive element 61. In a variant, the semiconductor package further comprises external components 70 disposed and electrically connected to the second surfaces 10b, 10b' of the substrate 10, 10'. In an embodiment having an external component 70, the design of the venting opening 400 and/or the flow guiding cover 50' can be used to enhance the dissipation of heat from the external component.

The invention does not need to use the housing, so the electronic component does not need to be disposed between the base of the housing and the hub of the fan wheel, so as to prevent the heat generated by the electronic component from being effectively removed, and the thickness of the encapsulation colloid can be controlled, and the bearing fan wheel can be reduced. The overall thickness of the package is more suitable for the thinning of electronic products. Moreover, the control wafer is disposed at a predetermined position on the substrate, does not interfere with the airflow generated by the fan wheel in the operating state, and therefore has no problem of noise or vibration, and the substrate can be pre-formed with a vent hole or formed into a package. After the colloid, a through-hole is formed, and the heat generated by the electronic component is dissipated by the airflow path under the substrate of the semiconductor package. In addition, since the fan wheel and the electronic component are located on opposite surfaces, it is not necessary to consider the problem of the shaft sleeve being exposed during the packaging, thereby making the packaging process easy.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

1. . . Semiconductor package

10,10’. . . Substrate

10a, 10a’. . . First surface

10b, 10b’. . . Second surface

101. . . Through hole

12. . . Electronic component

12’. . . Functional chip

13,13’. . . Stator group

14,14',14"...shaft casing

15. . . Encapsulant

16. . . Fan wheel

1600. . . Wheel hub

1601. . . Chip magnet

1602. . . blade

1603. . . Axis column

17,17’. . . Conductive component

18. . . Guide magnet

201,201’. . . Opening

301. . . Through hole

400. . . Vents

50,50’. . . Diversion cover

500. . . First air inlet

501. . . Second air inlet

51. . . Viscose

601,701. . . Through hole

60,70. . . External component

61. . . Conductive component

81,81’. . . A printed circuit board

81a. . . Extension

810,810’. . . Control chip

812. . . Passive component

82,82’. . . case

83,83’. . . Fan wheel

820,820’. . . Base

821. . . Stator group

822. . . Shaft bushing

830,830’. . . Wheel hub

831. . . magnet

832,832’. . . blade

833. . . Axis column

P. . . Package unit

S. . . airflow

1A to 1F are cross-sectional views showing a method of fabricating a semiconductor package of the present invention, wherein FIG. 1B' is a schematic view showing a functional wafer 12' disposed on a first surface of the substrate, and FIG. 1C' is a view showing a stator group A schematic diagram of a magnet guide piece is provided. The 1E' figure shows that the substrate is multiplexed with a conductive element such as a wire, and the 1E" figure shows that the substrate is multiplexed with a conductive element such as a solder ball;

2A to 2C are cross-sectional views showing the method of fabricating the semiconductor package of the second embodiment of the present invention, wherein the 2C' is a schematic view showing that the opening does not completely penetrate the encapsulant;

3A and 3B are cross-sectional views showing the method of fabricating the semiconductor package of the third embodiment of the present invention;

4A and 4B are schematic views showing a semiconductor package having a vent hole, wherein the 4B is a cross-sectional view taken along line 4B-4B of FIG. 4A and an illustration of a flow direction of the airflow after the fan wheel is disposed;

5A, 5A' are schematic views showing a semiconductor package having a flow-guiding cover, and FIG. 5B is a schematic view showing a semiconductor package having a flow-through cover of an upstream-side exhaust flow, wherein the 5B' pattern is along a cross-sectional view of section line 5B'-5B' of Fig. 5B;

6A and 6B are schematic views showing a method of manufacturing a semiconductor package in which a top surface of an encapsulant is overlapped with an external component;

Figure 7 is a schematic view showing a method of manufacturing an external component stacked on the bottom surface of the substrate;

Figure 8A is a cross-sectional view showing a conventional cooling fan;

Figure 8B is a cross-sectional view of the heat sink fan of U.S. Patent No. 7,345,884.

10. . . Substrate

10a. . . First surface

10b. . . Second surface

12. . . Electronic component

12’. . . Functional chip

13. . . Stator group

14. . . Shaft bushing

15. . . Encapsulant

16. . . Fan wheel

1600. . . Wheel hub

1601. . . Chip magnet

1602. . . blade

1603. . . Axis column

Claims (13)

A semiconductor package comprising: a substrate having opposite first and second surfaces and a through hole communicating with the first surface and the second surface; at least one electronic component disposed on the first surface of the substrate And electrically connected to the substrate; the stator set is disposed and electrically connected to the substrate; the shaft sleeve is disposed on the through hole of the substrate, and the shaft sleeve protrudes from the first surface of the substrate The encapsulant is formed on the first surface of the substrate to cover the electronic component and the portion of the sleeve that exposes the first surface of the substrate; and the fan wheel is disposed on the second surface of the substrate And axially connected to the shaft sleeve. The semiconductor package of claim 1, wherein the shaft sleeve is located at an eccentric position of the semiconductor package. The semiconductor package of claim 1, wherein the fan wheel has a hub, a chip magnet disposed on a lower side of the hub, a plurality of blades disposed outside the hub, and a shaft axially coupled to the hub column. The semiconductor package of claim 1, wherein the stator assembly is disposed on the second surface of the substrate and electrically connected to the substrate. The semiconductor package of claim 1, wherein the stator assembly is disposed on the first surface of the substrate and electrically connected to the semiconductor package The substrate is coated with the encapsulant, wherein the substrate has a thickness of less than or equal to 0.1 mm. The semiconductor package of claim 1, wherein the first surface of the substrate is multiplexed with a conductive member covered by the encapsulant to electrically connect with other electrical devices. The semiconductor package of claim 1, wherein the at least one electronic component comprises at least a control wafer and a passive component. The semiconductor package of claim 7, wherein the control chip is configured to transmit a control signal to the substrate and the stator group. The semiconductor package of claim 7, wherein the electronic component comprises a functional wafer disposed on the first surface of the substrate and embedded in the encapsulant. The semiconductor package of claim 1, further comprising a venting hole extending through the encapsulant and the substrate. The semiconductor package of claim 1, further comprising an external component disposed and electrically connected to the second surface of the substrate. The semiconductor package of claim 11, wherein the external component is a packaged component or a semiconductor wafer. The semiconductor package of claim 1, further comprising a flow guiding cover fixed to the side of the encapsulant and the substrate.