TWI400781B - A semiconductor package with a cooling fan and a method for manufacturing the same, and a stacked structure of the package - Google Patents

Description

Semiconductor package with heat dissipation fan and manufacturing method thereof, and stacking structure of the same

The present invention relates to a semiconductor package and a method of fabricating the same, and more particularly to a semiconductor package having a heat dissipation fan and a method of fabricating the same.

For example, a motherboard such as a main board or a Mother Board is provided with a plurality of electronic components such as a central processing unit or a graphics card, and electrical circuits for electrically connecting the electronic components (Conductive Circuits). The electronic components generate heat when they are applied. If the generated heat is not removed from the electronic product in which the circuit board is mounted, the electronic components may fail due to overheating; such problems are increasing in function demand and processing speed. The faster the electronic product is more important, the increase in function and processing speed means that the electronic components or electronic devices integrated on the circuit board must be more or higher, and more electronic components or electronic devices will be produced. The heat. Therefore, the heat generated by the circuit board is effectively dissipated into a necessary design.

One of the general methods of heat dissipation used in the industry is to add a heat dissipating fan on the motherboard or the motherboard to dissipate heat generated by electronic components and/or electronic devices. Such a cooling fan has been found in, for example, 6,799,282, 7,215,548. U.S. Patent Nos. 7,286,357 and 7,568,517.

For example, the conventional cooling fan shown in FIG. 1A is mounted on a predetermined position of the circuit board, and is mainly composed of a printed circuit board 11, a housing 12, and a fan wheel 13. The housing 12 has a base 120, a shaft sleeve 122 and a stator assembly 121 ringed on the shaft sleeve 122. The fan wheel 13 has a hub 130, a magnet 131 disposed on the inner side of the hub 130, and a ring a plurality of blades 132 outside the hub 130, and a shaft 133 axially coupled to the hub 130 for axially disposed in the axle sleeve 122; and the printed circuit board 11 is provided with at least one control wafer 110 and a plurality of passive components 112. The printed circuit board 11 is disposed on the base 120 of the casing 12 to control the rotation of the fan wheel 13 by the control wafer 110 to drive the airflow by the rotation of the fan wheel 13.

The control wafer 110 used in the conventional heat dissipating fan shown in FIG. 1A is a heat source. If the generated heat cannot be dissipated, it will cause its own overheating to fail. Once the control wafer 110 fails, the control chip 110 cannot be activated. The fan wheel 13; in this way, the heat generated by the electronic components on the motherboard of the electronic product is not effectively dissipated, thereby causing the electronic product to crash and even be damaged. The control wafer 110 is located in the gap between the base 120 of the housing 12 and the hub 130 of the fan wheel 13. The narrowness of the gap often prevents the heat generated by the control wafer 110 from being effectively removed. The control wafer 110 is damaged due to overheating. A cooling fan is one of the relatively inexpensive components of an electronic product. If it is not operational, it will damage the motherboard of the core component of the electronic product, so its importance is not measurable from its price.

In addition, the arrangement of the control wafer 110 affects the gap between the hub 130 of the fan wheel 13 and the base 120 of the housing 12, and the height of the gap must be increased by controlling the thickness of the wafer 110. The overall height is reduced. Moreover, the setting of the control chip 110 increases the area required for the printed circuit board 11. The increase of the area of the printed circuit board 11 does not increase the cross-sectional area of the conventional cooling fan, and the area of the blade 132 needs to be reduced. However, the reduction of the area of the blade 132 will affect the output of the air volume, and if the output of the air volume is insufficient, it will affect the desired heat dissipation effect.

In order to solve the above problems, U.S. Patent No. 7,345,884 proposes an improved cooling fan. As shown in FIG. 1B, the structure of the heat dissipating fan of U.S. Patent No. 7,345,884 is substantially the same as that of the prior art, except that the printed circuit board 11' is formed with an outwardly extending extension portion 11a for the control wafer 110. 'Setting thereon such that the control wafer 110' is located outside or partially outside the gap between the base 120' of the housing 12' and the hub 130' of the fan wheel 13' to expose the gap, so that the fan wheel 13' The driven gas stream is capable of escaping the heat generated by the control wafer 110'.

However, the formation of the outwardly extending extension portion 11a of the printed circuit board 11' interferes with the airflow driven by the fan wheel 13' during rotation, and the airflow is disturbed to generate noise, thereby affecting the heat dissipation. The quality of the use of the fan's electronic products. At the same time, since the extending portion 11a extends outwardly, a predetermined interval between the blade 132' and the control wafer 110' is required, which is not conducive to the reduction of the overall height of the conventional cooling fan, and cannot satisfy the thin electronic product. Demand.

Moreover, the conventionally disclosed cooling fan still needs to place the printed circuit board 11' between the hub 130' of the fan wheel 13' and the base 120' of the casing 12', so that the thickness of the printed circuit board 11' still affects. The overall height of the cooling fan cannot further thin the cooling fan.

In view of the above, the present invention provides a semiconductor package with a heat dissipation fan and a method for fabricating the same, which can effectively reduce the overall thickness of the heat dissipation fan.

The invention provides a semiconductor package with a heat dissipation fan, comprising: a substrate having first and second surfaces, the first surface has a fan placement area, and the fan placement area of the substrate is formed with an opening penetrating the substrate And an venting hole; an electronic component disposed on the first surface around the fan placement area and electrically connected to the substrate; an encapsulant formed on the first surface of the electronic component and the substrate, and the encapsulant has an external exposed a package colloid opening of the fan placement area; and a fan unit disposed in the encapsulation opening and electrically connected to the substrate.

In order to obtain the foregoing semiconductor package, the present invention provides a method for fabricating a semiconductor package having a heat dissipation fan, comprising: providing a substrate having first and second surfaces, wherein the first surface has a fan placement area; and the fan is placed Forming an opening and a venting hole through the substrate; disposing an electronic component on the first surface around the fan placement area, and electrically connecting the electronic component to the substrate; forming an encapsulant on the first surface of the substrate, The electronic component is coated, and the encapsulant has an encapsulation opening exposing the fan placement area; and the fan unit is disposed in the encapsulation opening, and the fan unit is electrically connected to the substrate.

In the foregoing manufacturing method and semiconductor package, the fan unit includes a fan wheel rotatably coupled to the first surface of the substrate and rotatably coupled to the opening, and is connected and electrically connected to the substrate a stator assembly of a coil; the fan wheel has a hub, a magnet disposed inside the hub, a plurality of blades disposed outside the hub, and a shaft column pivotally coupled to the hub, and the stator ring is disposed outside the shaft .

The fan unit is also a fan module of another type, and is not limited to the above structure. The difference between the fan unit of the present invention and the conventional cooling fan is that the fan unit is not directly electrically provided with electronic components, and the system will be required. The electronic component is integrated on the package substrate to which the fan unit is coupled, and the control wafer in the electronic component transmits a control signal to the stator unit of the fan unit through the substrate to control the operation of the fan unit.

In another aspect, the electronic component can include a functional chip disposed on the substrate and embedded in the encapsulant, whereby the semiconductor package having the functional chip is in addition to a package well known in the industry. In addition, it also has active heat dissipation. In addition, in a preferred embodiment, the first and second surfaces of the substrate are formed with a heat dissipation pad; and the heat dissipation column penetrating the substrate and connecting the two heat dissipation pads, and the functional chip is first disposed on the substrate The heat dissipation pad on the surface transmits heat generated by the functional wafer through the heat dissipation pad and the heat dissipation column to the air flow channel under the substrate.

In another aspect, the substrate of the semiconductor package may have a tool hole disposed outside the encapsulant and penetrating the first and second surfaces of the substrate; or the substrate and the encapsulant may have a connecting tool The holes extend through the first and second surfaces of the encapsulant and the substrate.

Moreover, if the semiconductor package of the present invention is to be electrically connected to other electrical devices such as a motherboard or another package, the substrate may be multiplexed with a conductive connection member.

Since the plurality of electronic components including the control chip and the passive component are disposed on the substrate outside the fan placement area, when the semiconductor package of the present invention is placed on the motherboard or other electronic components, under normal operation of the fan unit, The heat generated by the control chip or the electronic components under the semiconductor package can be effectively dissipated through the airflow path under the substrate of the semiconductor package without causing damage due to overheating. And the electronic component such as the control chip is disposed on the substrate outside the fan placement area of the semiconductor package, and does not interfere with the blade area of the fan wheel, so that the blade area of the fan wheel is larger in a certain space range. The extension margin increases the output of the air volume. At the same time, since the housing is not required, the electronic component is not required to be disposed between the base of the housing and the hub of the fan wheel, and the overall thickness of the fan unit can be reduced, which can meet the requirements for thinning of electronic products. Moreover, the control wafer is disposed at a predetermined position on the substrate without interfering with the airflow generated by the fan unit in the operating state, so that there is no problem of noise or vibration.

In another aspect, the present invention provides a semiconductor package stack structure having a heat dissipation fan, comprising: a semiconductor package with a heat dissipation fan of the present invention; and a bottom electrical device comprising a carrier and a carrier The electronic component on the device; and the conductive adhesive material is disposed between the semiconductor package and the bottom electrical device, and the substrate of the semiconductor package is placed on the conductive adhesive material to make the semiconductor package and the semiconductor package An air flow path is formed between the bottom electrical devices to cause the fan unit to dissipate the hot air generated by the bottom electrical device through the air flow path.

In another aspect, the present invention provides a semiconductor package with a heat dissipation fan for laminating other electrical devices, comprising: a substrate having first and second surfaces, the first surface having a fan placement area And an opening and a venting hole formed in the fan placement area of the substrate; the electronic component is disposed on the first surface around the fan placement area, and is electrically connected to the substrate; the encapsulant is formed On the first surface of the electronic component and the substrate, and having an encapsulation opening exposing the fan placement area; the conductive post is disposed on the first surface around the fan placement area and penetrates the encapsulant, and the conductive The column is electrically connected to the substrate; and the fan unit is disposed in the encapsulation opening, and the fan unit is electrically connected to the substrate. In addition, the semiconductor package with a heat dissipating fan for splicing other electrical devices may include a conductive adhesive material disposed on the conductive post for other electrical devices to be attached to the conductive adhesive material; or the conductive The material is then disposed on the second surface of the substrate to be spliced to other electrical devices. In this way, a plurality of semiconductor package structures can be made to have a heat dissipation effect by a fan unit. Alternatively, a plurality of semiconductor packages with heat dissipating fans for splicing other electrical devices may be stacked to provide a larger air volume and enhance heat dissipation performance.

The technical contents and embodiments of the present invention are described in detail below by way of specific embodiments, and those skilled in the art can readily understand the advantages and functions of the present invention from the disclosure of the present disclosure. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. At the same time, the terms "upper, lower", "inside, outside", "front, back", "one" and "bottom" as used in this specification are also for convenience of description, not for The scope of the invention can be implemented, and the relative changes or adjustments of the invention are considered to be within the scope of the invention.

First specific embodiment

2A to 2E are cross-sectional views showing a method of fabricating a semiconductor package having a heat dissipation fan of the present invention.

As shown in FIG. 2A, first, a substrate 20 having a first surface 20a and a second surface 20b is provided, and the first surface 20a of the substrate 20 has a fan placement area K; and then formed on the fan placement area K. The opening 200 and the vent hole 201 of the substrate 20 are penetrated. As shown in Fig. 2A', in the present embodiment, four vent holes 201 are surrounded around the opening 200. Of course, the present invention does not limit the number and shape of the vent holes, and may have only two or more vent holes, and the vent holes may also be, for example, a honeycomb.

As shown in FIG. 2B, a plurality of electronic components 21 are disposed on the first surface 20a around the fan placement area K, and the electronic component 21 is electrically connected to the substrate 20; the electronic component 21 includes at least a control chip 21a and The passive component 21b, such as a resistor and a capacitor, is used to transmit a control signal to the substrate 20.

Examples of the electronic component 21 include a south bridge wafer, a north bridge wafer, or other functional wafers such as a graphics wafer, a display wafer, etc., which are applicable to those skilled in the art and will not be further described herein.

As shown in FIG. 2C, the encapsulant 22 is formed on the first surface 20a of the electronic component 21 and the substrate 20 to cover the electronic component 21, and the encapsulant 22 has an encapsulation opening exposing the fan placement area K. 221, a portion of the first surface 20a, the opening 200, and the vent 201 are exposed.

As shown in FIG. 2D, the fan unit 23 is disposed in the encapsulant opening 221, and the fan unit 23 is electrically connected to the substrate 20 for the control chip 21a to transmit a control signal to the substrate 20 to be transferred to the The fan unit 23 controls the operation of the fan unit 23; the fan unit 23 is coupled to the substrate 20 in a detachable or non-removable manner.

In the embodiment, the fan unit 23 includes a fan wheel 230 that is rotatably coupled to the opening 200 of the first surface 20a of the substrate 20, and is connected and electrically connected to the fan wheel 230. A stator set 231 on the first surface 20a of the substrate 20.

In detail, the fan wheel 230 has a hub 2300, a magnet 2301 disposed inside the hub 2300, a plurality of blades 2302 disposed outside the hub 2300, and a shaft post 2303 axially coupled to the hub 2300, and the stator set 231 is The ring is disposed outside the shaft column 2303. The magnetic field generated by the magnet 2301 and the stator group 231 is magnetically repulsive to drive the rotation of the fan wheel 230. Since the driving principle of the fan wheel 230 is the same as that of the conventional one, it will not be described again.

Preferably, the fan unit 23 further includes a shaft sleeve 232 disposed in the opening 200 to axially connect the shaft post 2303 to the shaft sleeve 232 in a rotatable manner.

Next, as shown in FIG. 2E, the encapsulant 22 is cut along the imaginary line S (as shown in FIG. 2D) to obtain the semiconductor package 2.

In another embodiment shown in FIG. 2E', the encapsulant 22 does not cover an area other than the fan placement area K on the substrate 20, so that the substrate 20 has a space to be provided with a tool hole 25. In order to fix the semiconductor package 2 of the present invention to other electrical devices, such as a motherboard or another semiconductor package of the present invention, or even other semiconductor packages, the tool holes 25 are provided in the encapsulant 22 The first surface 20a and the second surface 20b of the substrate 20 are externally and penetrated for screwing or clamping the semiconductor package 2 of the present invention. Of course, in the present embodiment, when the singulation operation is performed, only the substrate 20 needs to be cut.

In addition, in another embodiment, as shown in FIG. 2E, the semiconductor package 2 of the present invention may further comprise a first through the encapsulant 22 and the substrate 20 on the substrate 20 after the encapsulant 22 is formed. The tool holes 25 of the surface 20a and the second surface 20b are used to fix the semiconductor package 2 of the present invention to other electrical devices.

In another embodiment shown in FIGS. 2F and 2F', the substrate 20 is multiplexed with a conductive connecting member 26 such as a wire or a conductive connecting member 26' of a solder ball for use with other electrical devices. Electrical connection.

It can be seen that the manufacturing method of the semiconductor package with the heat dissipation fan of the present invention mainly combines and integrates the fan unit 23 and the electronic component 21 that controls the fan unit 23 to the substrate 20, that is, controls the operation of the fan unit 23. The electronic component 21 is integrated on the substrate 20 and is not disposed in the structure of the fan unit 23, so as to effectively solve the problems in the operation and design of the conventional fan module.

Specifically, the electronic component 21 such as the control wafer 21a is not disposed in the gap between the hub and the casing as in the prior art, and the heat generated by the control wafer cannot be effectively removed, resulting in damage to the wafer. In contrast, the present invention utilizes semiconductor packaging technology to dispose the electronic component 21 such as the control wafer 21a outside the fan placement area K, and is protected by the encapsulant 22, and when the semiconductor package 2 of the present invention is disposed on other electronic components or In the case of the circuit board, the fan unit 23 can dissipate the heat generated by the electronic components by the air flow path below the substrate 20 of the semiconductor package 2.

Moreover, the present invention utilizes a semiconductor packaging technology to horizontally integrate the electronic component 21 and the fan unit 23 on the substrate 20, without using the housing as in the prior art, which not only reduces the space, but also facilitates the overall height of the fan unit. Reduced, and can meet the needs of the thinning of electronic products.

Moreover, the electronic component 21 is located on the substrate 20 outside the fan placement area K, so that the area of the blade 2302 can be effectively increased without being affected by the electronic component 21. The area of the blade 2302 can expand the fan according to requirements. The increase in the K range of the placement area contributes to an increase in air volume and heat dissipation efficiency.

Since the fan unit 23 of the present invention is directly integrated on the substrate 20, it is not necessary to additionally use a printed circuit board as in the prior art, so that the overall height of the fan unit 23 can be reduced to meet the demand for thinning of electronic products. It also has the effect of reducing costs and saving assembly time and process.

The present invention further provides a semiconductor package having a heat dissipation fan, comprising: a substrate 20 having first and second surfaces 20a, 20b, the first surface 20a having a fan placement area K, and a fan placement area of the substrate 20. The K is formed in the opening 200 and the venting opening 201 of the substrate 20; the electronic component 21 is disposed on the first surface 20a around the fan placement area K, and is electrically connected to the substrate 20; the encapsulant 22 is Forming on the first surface 20a of the electronic component 21 and the substrate 20, and having a portion of the first surface 20a, the opening 200 and the venting opening 201 exposed outside the encapsulating opening 221 of the fan placement area K; and a fan The unit 23 is disposed in the encapsulant opening 221, and the fan unit 23 is electrically connected to the substrate 20.

The ventilation hole 201 is located around the opening 200. Of course, the present invention does not limit the number and shape of the ventilation holes, and may have only two or more ventilation holes, and the ventilation holes may also be like a honeycomb. The electronic component 21 includes at least a control chip 21a and a passive component 21b for transmitting control signals to the substrate 20 and the fan unit 23 to control the operation of the fan unit 23; The 23 series is bonded to the substrate 20 in a detachable or non-removable manner.

In detail, the fan unit 23 includes a fan wheel 230 that is rotatably coupled to the first surface 20a of the substrate 20 and rotatably coupled to the opening 200, and a stator that is connected and electrically connected to the substrate 20. Group 231. The fan wheel 230 has a hub 2300, a magnet 2301 disposed inside the hub 2300, a plurality of blades 2302 disposed outside the hub 2300, and a shaft post 2303 axially coupled to the hub 2300, and the stator set 231 is looped The outer side of the shaft column 2303. In addition, the fan unit 23 may include a shaft sleeve 232 disposed in the opening 200 to rotatably couple the shaft post 2303 into the shaft sleeve 232.

In another embodiment shown in FIG. 2E', the encapsulant 22 does not cover an area other than the fan placement area K on the substrate 20, so that the substrate 20 has a space to be provided with a tool hole 25. In order to fix the semiconductor package 2 of the present invention to other electrical devices, such as a motherboard or another semiconductor package of the present invention, or even other semiconductor packages, the tool holes 25 are provided in the encapsulant 22 The first surface 20a and the second surface 20b of the substrate 20 are externally and penetrated for screwing or clamping the semiconductor package 2 of the present invention.

In addition, in another embodiment, as shown in FIG. 2E, the substrate 20 and the encapsulant 22 have a tool hole 25 communicating therethrough, and the first surface 20a and the second surface 20b of the encapsulant 22 and the substrate 20 are penetrated. In order to fix the semiconductor package 2 of the present invention to other electrical devices.

In another embodiment shown in FIGS. 2F and 2F', the substrate 20 is multiplexed with a conductive connecting member 26 such as a wire or a conductive connecting member 26' of a solder ball for use with other electrical devices. The electrical connection can also eliminate the traditional fixing method such as snapping or locking when using the solder ball as the conductive connecting component, and the semiconductor package with the cooling fan is mounted on the heating element in a consistent SMT process.

Second specific embodiment

In another method of fabricating a semiconductor package having a heat dissipating fan according to the present invention, as shown in FIGS. 3A and 3B, an electronic component 21 is disposed on the first surface 20a around the fan placement area K, and the functional chip 21c is further included. It is disposed on the substrate 20 and embedded in the encapsulant 22 after being formed therein. In addition, in the preferred embodiment, the first surface 20a and the second surface 20b of the substrate 20 are formed with a heat dissipation pad 27; and the heat dissipation post 28 extending through the substrate 20 and connecting the two heat dissipation pads 27, and the function The wafer 21c is disposed on the heat dissipation pad 27 of the first surface 20a of the substrate 20. In addition, the thermal pad 27 on the second surface 20b may also be connected with a conductive connecting member 26' such as a solder ball to transfer thermal energy to the underside of the substrate 20 and/or to other electrical devices.

Third specific embodiment

As shown in FIGS. 4A to 4C, the structure of the second package is continued. The present invention provides a semiconductor package stack structure 3 having a heat dissipation fan, comprising: a semiconductor package 2 having a heat dissipation fan according to the present invention; The electrical device 4 includes a carrier 41 and an electronic component 43 disposed on the carrier 41; and a conductive adhesive material 31 such as a solder ball is disposed between the semiconductor package 2 and the bottom electrical device 4 The substrate 20 of the semiconductor package 2 is connected to the conductive adhesive material 31 to form an air flow path W between the semiconductor package 2 and the bottom electrical device 4, so that the fan unit 23 can pass through. The airflow path W dissipates the hot air generated by the bottom electrical device 4.

As shown in FIG. 4A, the carrier member 41 included in the bottom electrical device 4 can be a motherboard, and the electronic component 43 is mounted on the packaged electronic component on the motherboard, thereby dissipating the electronic component. 43 generated heat.

As shown in FIG. 4B, the bottom electrical device 4 can be a ball grid array semiconductor package, such that the carrier 41 is a substrate, and the electronic component 43 is electrically connected to the substrate through the bonding wire 46. The bottom electrical device 4 further includes an insulating material 44 formed on the substrate and covering the electronic component 43.

As shown in FIG. 4B', the bottom electrical device 4 can be a flip-chip ball grid array semiconductor package, such that the carrier 41 is a substrate, and the electronic component 43 is electrically connected through the solder ball 47. The substrate. As shown in Figs. 4B and 4B', the bottom surface of the carrier member 41 is provided with a plurality of solder balls 47'.

In another aspect shown in FIG. 4C, unlike the fourth and fourth embodiments, the bottom electrical device 4 of the semiconductor package stack 3 includes a conductive pillar formed on the carrier 41. And an insulating material 44 formed on the carrier 41 and covering the electronic component 43 and the conductive pillar 45, wherein the conductive adhesive material 31 is disposed on the conductive pillar 45 penetrating the insulating material 44. The bottom electrical device 4 shown in FIG. 4C is not used to limit the arrangement of components. In other words, the electronic component 43 of the chip can also be placed on a carrier such as a package substrate or a lead frame by flip chip or other means. 41.

Fourth specific embodiment

As shown in FIG. 5A, the present invention provides a semiconductor package 5 with a heat dissipating fan for laminating other electrical devices, comprising: a substrate 20 having first and second surfaces 20a, 20b, the first The surface 20a has a fan placement area K, and the fan placement area K of the substrate 20 is formed with an opening 200 and a vent hole 201 extending through the substrate 20; the electronic component 21 is disposed first around the fan placement area K. The surface 20a is electrically connected to the substrate 20; the encapsulant 22 is formed on the first surface 20a of the electronic component 21 and the substrate 20, and has an exposed portion outside the encapsulation opening 221 of the fan placement area K. The first surface 20a, the opening 200 and the venting hole 201; the conductive post 45 is disposed on the first surface 20a around the fan placement area K and penetrates the encapsulant 22, and the conductive post 45 is electrically connected to the The substrate 20 and the fan unit 23 are disposed in the encapsulant opening 221 , and the fan unit 23 is electrically connected to the substrate 20 .

In addition, the semiconductor package 5 with a heat dissipating fan for splicing other electrical devices may include a conductive adhesive material 31 such as a solder ball, and is disposed on the conductive post 45 for other electrical devices to be attached to the The conductive bonding material 31 is disposed on the second surface 20b of the substrate 20 to laminate the semiconductor package 5 to other electrical devices. In this embodiment, through the arrangement of the conductive pillars 45, the upper and lower positions of the semiconductor package 5 with the heat dissipation fan for stacking other electrical devices can be stacked and electrically connected to other electrical devices. As shown in FIG. 5A, another semiconductor package 5 can be stacked on the semiconductor package 5 with a heat dissipating fan for laminating other electrical devices, and a bottom electrical device 6 can be stacked underneath, for example, Electronic components or other semiconductor packages on the motherboard, such as ball grid array semiconductor packages.

Furthermore, in the fourth embodiment of the present invention, the semiconductor package 5 with a heat dissipating fan for laminating other electrical devices can be generally fabricated as in the first and second embodiments. Specifically, as shown in Fig. 2A', four vent holes 201 may be surrounded by the periphery of the opening 200. Of course, the embodiment does not limit the number and shape of the vent holes, and may have only two or more vent holes, and the vent holes may also be, for example, a honeycomb.

As shown in FIG. 2B, a plurality of electronic components 21 are disposed on the first surface 20a around the fan placement area K, and the electronic component 21 is electrically connected to the substrate 20; the electronic component 21 includes at least a control chip 21a and The passive component 21b, such as a resistor and a capacitor, is used to transmit a control signal to the substrate 20.

Examples of the electronic component 21 include a south bridge wafer, a north bridge wafer, or other functional wafers such as a graphics wafer, a display wafer, etc., which are applicable to those skilled in the art and will not be further described herein.

Since the semiconductor package of the present embodiment has the conductive pillars 45, the conductive pillars 45 electrically connected to the substrate 20 can be formed before or after the step of disposing the electronic component 21 as shown in FIG. 5B.

As shown in FIG. 2C, the encapsulant 22 is formed on the first surface 20a of the electronic component 21 and the substrate 20 to cover the electronic component 21 and the conductive pillar 45, and the encapsulant 22 has the fan exposure area exposed. The encapsulating colloid opening 221 of K exposes a portion of the first surface 20a, the opening 200, and the venting opening 201. Since the conductive pillar 45 shown in FIG. 5A penetrates and exposes the encapsulant 22, the top surface of the encapsulant 22 can be planarized by, for example, a CMP process after the encapsulant 22 is formed.

As shown in FIG. 5C, different from the manner of forming the conductive pillar 45, after the encapsulant 22 is formed, the encapsulation colloid 22 is formed on the first surface 20a of the substrate 20 by means of laser perforation. A hole 48 is then formed in the opening 48 to form a conductive post 45 as shown in FIG. 5A, such as by electroplating.

Referring to FIG. 2D, the fan unit 23 is disposed in the encapsulant opening 221, and the fan unit 23 is electrically connected to the substrate 20 for the control chip 21a to transmit a control signal to the substrate 20 to be transmitted to the substrate 20. The fan unit 23 controls the operation of the fan unit 23; the fan unit 23 is coupled to the substrate 20 in a detachable or non-removable manner.

In the embodiment, the fan unit 23 includes a fan wheel 230 that is rotatably coupled to the opening 200 of the first surface 20a of the substrate 20, and is connected and electrically connected to the fan wheel 230. A stator set 231 on the first surface 20a of the substrate 20.

In detail, the fan wheel 230 has a hub 2300, a magnet 2301 disposed inside the hub 2300, a plurality of blades 2302 disposed outside the hub 2300, and a shaft post 2303 axially coupled to the hub 2300, and the stator set 231 is The ring is disposed outside the shaft column 2303. The magnetic field generated by the magnet 2301 and the stator group 231 is magnetically repulsive to drive the rotation of the fan wheel 230. Since the driving principle of the fan wheel 230 is the same as that of the conventional one, it will not be described again.

Preferably, the fan unit 23 further includes a shaft sleeve 232 disposed in the opening 200 to axially connect the shaft post 2303 to the shaft sleeve 232 in a rotatable manner.

Next, as shown in FIG. 2E, the encapsulant 22 is cut along the imaginary line S (as shown in FIG. 2D) to obtain the semiconductor package 2.

In another embodiment shown in FIG. 2E', the encapsulant 22 does not cover an area other than the fan placement area K on the substrate 20, so that the substrate 20 has a space to be provided with a tool hole 25. In order to fix the semiconductor package 2 of the present invention to other electrical devices, such as a motherboard or another semiconductor package of the present invention, or even other semiconductor packages, the tool holes 25 are provided in the encapsulant 22 The first surface 20a and the second surface 20b of the substrate 20 are externally and penetrated for screwing or clamping the semiconductor package 2 of the present invention. Of course, in the present embodiment, when the singulation operation is performed, only the substrate 20 needs to be cut.

In addition, in another embodiment, as shown in FIG. 2E, the semiconductor package 2 of the present invention may further comprise a first through the encapsulant 22 and the substrate 20 on the substrate 20 after the encapsulant 22 is formed. The tool holes 25 of the surface 20a and the second surface 20b are used to fix the semiconductor package 2 of the present invention to other electrical devices.

In another embodiment shown in FIGS. 2F and 2F', the substrate 20 is multiplexed with a conductive connecting member 26 such as a wire or a conductive connecting member 26' of a solder ball for use with other electrical devices. Electrical connection.

In addition, the functional wafer 21c may be disposed on the first surface 20a around the fan placement area K as in the second embodiment, and in this aspect, the substrate 20 may be as shown in FIG. 3B. A heat dissipation pad 27 is formed on the first surface 20a and the second surface 20b of the substrate 20; and a heat dissipation post 28 extending through the substrate 20 and connecting the two heat dissipation pads 27.

In the fourth embodiment of the present invention, the conductive pillars 45 are formed in a semiconductor package having a thin and short heat dissipation fan, so that the upper and lower surfaces of the semiconductor package can be stacked and electrically connected to other electrical properties. The active heat-dissipating semiconductor package of the device is used to improve the heat dissipation performance when necessary without affecting the size of the electronic product. Moreover, the stacked structure provided by the semiconductor package 5 with the heat-dissipating fan for stacking other electrical devices is not provided. It will interfere with the flow of the cooling air, so it will not cause noise.

The invention integrates the fan unit on the package substrate through the semiconductor packaging technology, and the electronic components that drive the fan unit to operate are also horizontally disposed on the substrate outside the fan placement area, thereby reducing the overall height of the fan unit, and when the present invention has When the semiconductor package of the heat dissipation fan is placed on other electronic components or circuit boards, the hot air generated by the electronic components including the semiconductor package can be effectively dissipated by the formed air flow path. In addition, the semiconductor package with the heat dissipation fan obtained by the method of the present invention can protect the electronic component by the encapsulant, because the electronic component of the control chip is disposed on the substrate outside the fan placement area, It interferes with the airflow driven by the fan unit, so it does not cause noise or affect the rotational stability of the fan unit.

The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.

11, 11’. . . A printed circuit board

11a. . . Extension

110, 110', 21a. . . Control chip

112, 21b. . . Passive component

12, 12’. . . case

120, 120’. . . Base

121, 231. . . Stator group

122, 232. . . Shaft bushing

13, 13', 230. . . Fan wheel

130, 130’, 2300. . . Wheel hub

131, 2301. . . magnet

132, 132’, 2302. . . blade

133, 2303. . . Axis column

2, 5. . . Semiconductor package

20. . . Substrate

20a. . . First surface

20b. . . Second surface

200. . . Opening

201. . . Vents

twenty one. . . Electronic component

twenty two. . . Encapsulant

twenty three. . . Fan unit

221. . . Package colloid opening

21c. . . Functional chip

25. . . Tool hole

26, 26’. . . Conductive connecting element

27. . . Cooling pad

28. . . Heat sink

3. . . Semiconductor package stack structure

31. . . Conductive bonding material

4, 6. . . Bottom electrical device

41. . . Carrier

43. . . Electronic component

44. . . Insulating material

45. . . Conductive column

46. . . Welding wire

47, 47’. . . Solder ball

48. . . Opening

K. . . Fan placement area

S. . . Cutting imaginary line

W. . . Airflow path

Figure 1A is a cross-sectional view showing a conventional cooling fan;

Figure 1B is a cross-sectional view showing a heat dissipating fan of U.S. Patent No. 7,345,884;

2A to 2F' are cross-sectional views showing a method of fabricating a semiconductor package having a heat dissipating fan, wherein the 2A' is a partial top view of the substrate of FIG. 2A, and the 2E' and 2E" drawings have tools. A cross-sectional view of a semiconductor package of a hole, and FIGS. 2F and 2F' are cross-sectional views of a semiconductor package with conductive connection elements;

3A and 3B are schematic views showing a semiconductor package including a functional wafer, wherein FIG. 3B shows a cross-sectional view taken along a broken line 3B-3B of FIG. 3A;

4A to 4C are cross-sectional views showing a stack structure of a semiconductor package having a heat dissipating fan according to the present invention, wherein FIG. 4A shows a specific embodiment of the carrier as a motherboard; and FIGS. 4B and 4B' show the bottom electric. The device is a specific embodiment of a ball grid array semiconductor package; and FIG. 4C shows that the bottom electrode device includes an insulating material and a conductive pillar penetrating the insulating material;

5A is a cross-sectional view showing a semiconductor package with a heat dissipation fan for laminating other electrical devices of the present invention;

5B and 5C are schematic views showing a method of guiding the conductive pillars of the semiconductor package shown in FIG. 5A.

2. . . Semiconductor package

20. . . Substrate

20a. . . First surface

20b. . . Second surface

200. . . Opening

201. . . Vents

21a. . . Control chip

21b. . . Passive component

twenty two. . . Encapsulant

221. . . Package colloid opening

twenty three. . . Fan unit

230. . . Fan wheel

2300. . . Wheel hub

2301. . . magnet

2302. . . blade

2303. . . Axis column

231. . . Stator group

232. . . Shaft bushing

Claims (29)

A semiconductor package with a heat dissipating fan, comprising: a substrate having first and second surfaces, the first surface having a fan placement area, and the fan placement area of the substrate is formed with an opening and ventilation through the substrate The electronic component is disposed on the first surface around the fan placement area and electrically connected to the substrate; the encapsulant is formed on the first surface of the electronic component and the substrate, and has the fan exposed The encapsulation colloid opening of the region; and the fan unit are disposed in the encapsulation opening, and the fan unit is electrically connected to the substrate. The semiconductor package with a heat dissipating fan according to claim 1, wherein the venting hole is located around the opening. The semiconductor package with a heat dissipating fan according to claim 1, wherein the electronic component comprises at least a control chip and a passive component. The semiconductor package with a heat dissipation fan according to claim 3, wherein the control chip is configured to transmit a control signal to the substrate and the fan unit to control operation of the fan unit. The semiconductor package with a heat dissipating fan according to the third aspect of the invention, wherein the electronic component further comprises a functional chip disposed on the substrate and embedded in the encapsulant. The semiconductor package with a heat dissipation fan according to claim 5, wherein a heat dissipation pad is formed on the first and second surfaces of the substrate; and a heat dissipation column penetrating the substrate and connecting the two heat dissipation pads, and the heat dissipation column The functional chip is disposed on the heat dissipation pad of the first surface of the substrate. The semiconductor package with a heat dissipating fan according to claim 1, wherein the fan unit comprises a fan wheel rotatably coupled to the first surface of the substrate and rotatably coupled to the opening, and And electrically connected to the stator set on the substrate. The semiconductor package with a heat dissipating fan according to claim 7, wherein the fan wheel has a hub, a magnet disposed inside the hub, a plurality of blades disposed outside the hub, and a shaft coupled to the hub a shaft column, and the stator assembly ring is disposed outside the shaft column. The semiconductor package with a heat dissipating fan according to claim 8, wherein the fan unit further comprises a shaft sleeve disposed in the opening to rotatably connect the shaft column to the shaft In the casing. The semiconductor package with a heat dissipating fan according to claim 1, wherein the substrate has a tool hole disposed outside the encapsulant and penetrating the first and second surfaces of the substrate. The semiconductor package with a heat dissipating fan according to the first aspect of the invention, wherein the substrate and the encapsulant have a connecting tool hole extending through the first and second surfaces of the encapsulant and the substrate. The semiconductor package with a heat dissipating fan according to the first aspect of the invention, wherein the substrate is multiplexed with a conductive connecting component for electrically connecting to other electrical devices. A semiconductor package stacking structure with a heat dissipating fan, comprising: a semiconductor package with a heat dissipating fan according to claim 1; a bottom electrical device comprising a carrier and an electronic component disposed on the carrier; And a conductive adhesive material disposed between the semiconductor package and the bottom electrical device, and the substrate of the semiconductor package is placed on the conductive adhesive material. The semiconductor package stacking structure with a heat dissipating fan according to claim 13 , wherein the bottom electric device further comprises an insulating material formed on the carrier and covering the electronic component; and formed on the carrier And a conductive pillar passing through the insulating material, wherein the conductive bonding material is disposed on the conductive pillar. The semiconductor package stacking structure with a heat dissipating fan according to claim 13 , wherein the carrier of the bottom electrical device is a motherboard, and the electronic component is mounted on the motherboard . The semiconductor package stacking structure with a heat dissipating fan according to claim 13 , wherein the carrier is a substrate, and the electronic component is electrically connected to the substrate through a bonding wire, and the bottom electrical device further comprises An insulating material formed on the substrate and covering the electronic component. The semiconductor package stacking structure with a heat dissipating fan according to claim 13 , wherein the carrier is a substrate, and the electronic component is electrically connected to the substrate through a solder ball, and the bottom electrical device includes An insulating material formed on the substrate and covering the electronic component. The semiconductor package stack structure with a heat dissipation fan according to claim 13, wherein the conductive bonding material is a solder ball. A semiconductor package with a heat dissipating fan for laminating other electrical devices includes: a substrate having first and second surfaces, the first surface having a fan placement area, and a fan placement area of the substrate is formed An electronic component is disposed on the first surface around the fan placement area and electrically connected to the substrate; the encapsulant is formed on the first surface of the electronic component and the substrate And having a package colloid opening exposing the fan placement area; the conductive post is disposed on the first surface around the fan placement area and penetrates the encapsulant, and the conductive post is electrically connected to the substrate; and the fan unit And being disposed in the encapsulation opening, and the fan unit is electrically connected to the substrate. The semiconductor package with a heat dissipating fan for laminating other electrical devices according to claim 19, further comprising a conductive adhesive material disposed on the conductive post for other electrical devices to be attached to the Conductively on the material. The semiconductor package with a heat dissipating fan for laminating other electrical devices, as described in claim 19, further comprising a conductive adhesive material disposed on the second surface of the substrate to be spliced to the other Electrical device. The semiconductor package with a heat dissipating fan for laminating other electrical devices according to claim 19, wherein the venting hole is located around the opening. The semiconductor package with a heat dissipating fan for laminating other electrical devices according to claim 19, wherein the electronic component comprises at least a control chip and a passive component. The semiconductor package with a heat dissipating fan for splicing other electrical devices according to claim 23, wherein the electronic component further comprises a functional chip disposed on the substrate and embedded in the encapsulant . The semiconductor package with a heat dissipation fan for splicing other electrical devices according to claim 24, wherein a heat dissipation pad is formed on the first and second surfaces of the substrate; and the substrate is connected and connected to the second a heat dissipating post of the heat dissipating pad, and the functional chip is disposed on the heat dissipating pad of the first surface of the substrate. The semiconductor package with a heat dissipating fan for splicing other electrical devices according to claim 19, wherein the fan unit is disposed on the first surface of the substrate and rotatably coupled to the a fan wheel for opening, and a stator group connected and electrically connected to the substrate. The semiconductor package with a heat dissipating fan for laminating other electrical devices according to claim 19, wherein the substrate has a tool hole, and is disposed on the outside of the encapsulant and penetrates the first and the second of the substrate Two surfaces. The semiconductor package with a heat dissipating fan for laminating other electrical devices according to claim 19, wherein the substrate and the encapsulant have a connecting tool hole, which is the first through the encapsulant and the substrate. And the second surface. The semiconductor package with a heat dissipating fan for splicing other electrical devices, as described in claim 19, wherein the substrate is multiplexed with a conductive connecting member for electrically connecting with other electrical devices.