JP7190295B2 - Cutting device and package substrate processing method - Google Patents

Description

The present invention relates to a cutting apparatus and a method of processing a package substrate.

A package device mounted with an LED (Light Emitting Diode) chip is mounted on a wiring board and used in various applications such as mobile phones, digital cameras, road lighting, and large displays. Since an LED chip is a light emitting element and emits heat, a package device mounted with an LED chip is basically provided with a heat sink for cooling (see, for example, Patent Document 1).

A package device mounted with an LED chip described in Patent Document 1 includes an LED chip, a substrate made of a metal such as a copper alloy on which the LED chip is mounted, and an electrode of the chip and a wiring layer provided on the substrate. A wire for electrical connection and a resin for sealing the element mounting portion of the substrate are provided.

A cutting apparatus generally called a dicing apparatus is used to singulate the package device mounted with the LED chips disclosed in Patent Document 1 (see Patent Document 2, for example). This type of cutting device has a cutting blade having an annular layer of abrasive grains, and rotates the cutting blade to relatively move along the streets of the substrate to cut the substrate along the streets to produce individual packages. Split into devices.

However, in the cutting apparatus disclosed in Patent Document 2, when the cutting blade simultaneously cuts the resin sealing layer and the substrate composed of the metal, burrs are generated on the connection terminals, and adjacent connection terminals are short-circuited, resulting in poor quality. There is a problem of lowering reliability. For this reason, a process or the like has been proposed in which only the resin-sealed portion is cut first, and after the resin-sealed portion is processed, the substrate made of metal is cut. (See Patent Document 3, for example)

JP 2006-245032 A JP 2015-005543 A JP 2016-115867 A

In carrying out the method disclosed in Patent Document 3, it is important that the cutting blade does not cut into the metal substrate when cutting the resin sealing portion.

However, in the method disclosed in Patent Document 3, when contamination or the like adheres to the chuck table that holds the workpiece, the height of the workpiece at the position where the contamination adheres increases, and the cutting blade cuts deeply. This may cause problems such as cutting into the substrate when cutting the resin sealing portion. Further, when the cutting device performs contact setup for setting the reference position by bringing the cutting blade into contact with the chuck table, the holding surface of the chuck table is slightly cut to form a groove. A chuck table that has been in production for a long time has many scratches. In some cases, the height is also recognized. For this reason, it tends to be difficult for the cutting apparatus to cut the cutting blade into the metal substrate when cutting the resin sealing portion.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and an object of the present invention is to provide a cutting apparatus and a package substrate processing method capable of suppressing cutting blades from cutting into a metal substrate during processing of a resin sealing layer. intended to provide

In order to solve the above-described problems and achieve the object, the cutting apparatus of the present invention provides a plurality of device chips arranged in a chip region on a metal substrate on which a plurality of intersecting dividing lines are formed; A cutting apparatus for cutting a package substrate while monitoring cutting of the package substrate into the metal substrate, the cutting device comprising a conductive chuck table for holding the package substrate. and a conductive cutting blade for cutting the package substrate held by the chuck table, and by cutting the package substrate with the cutting blade , the resin sealing layer on the dividing line. cutting means for cutting a chisel, cutting feeding means for cutting and feeding the chuck table and the cutting means relatively in the X-axis direction, and indexing the cutting means in the Y-axis direction orthogonal to the X-axis direction A voltage is applied between the indexing feed means for feeding, the cutting feed means for cutting and feeding the cutting means in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction, and the chuck table and the cutting means. and a controller, wherein the controller adjusts the voltage applied between the chuck table and the cutting means by the voltage applying means, based on the amount of change in the voltage applied between the chuck table and the cutting means. a cutting detection unit that detects that the cutting blade has come into contact with the metal substrate of the substrate; and a warning command unit that, when the cutting detection unit detects contact , stops the cutting process and issues a warning on the display unit. , is characterized by including
In the cutting apparatus, the cutting means may cut the package substrate without supplying cutting fluid.

A method of processing a package substrate according to the present invention includes a conductive chuck table for holding the package substrate, cutting means including a conductive cutting blade for cutting the package substrate held by the chuck table, and the chuck table. and the cutting means in the X-axis direction, indexing and feeding means for indexing and feeding the cutting means in the Y-axis direction orthogonal to the X-axis direction, and moving the cutting means to the X-axis direction. Using a cutting device comprising a cutting feed means for cutting and feeding in the axial direction and the Z-axis direction orthogonal to the Y-axis direction, and a voltage applying means for applying a voltage between the chuck table and the cutting means, A processing method for cutting a package substrate having a plurality of device chips arranged in a chip region on a metal substrate on which a plurality of intersecting dividing lines are formed, and a resin sealing layer covering the device chips. a placing step of placing the package substrate on the chuck table; a positioning step of positioning the cutting means at a predetermined depth of the package substrate by the cutting feeding means; and the chuck table and the cutting means. The chuck table and the cutting means are moved relative to each other while applying a voltage to cut the resin sealing layer only on the dividing line by cutting the cutting blade into the package substrate. and, in the cutting step, when the cutting edge of the cutting blade contacts the metal substrate, the contact is detected by electrical conduction between the chuck table and the cutting means, and the cutting is performed. It is characterized by stopping processing .

In the method for processing a package substrate, the cutting step does not need to supply a cutting fluid.

ADVANTAGE OF THE INVENTION This invention is effective in the ability to suppress the cutting into the board|substrate comprised by the metal of a cutting blade during processing of a resin sealing layer.

FIG. 1 is a plan view showing a package substrate to be processed by a cutting apparatus and a package substrate processing method according to a first embodiment. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 3 is a perspective view showing a configuration example of a cutting device according to Embodiment 1. FIG. FIG. 4 is a diagram showing the configuration of voltage application means and the like of the cutting apparatus shown in FIG. FIG. 5 is a flow chart showing the flow of the method for processing the package substrate according to the first embodiment.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A cutting apparatus and a method for processing a package substrate according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a package substrate to be processed by a cutting apparatus and a package substrate processing method according to a first embodiment. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 3 is a perspective view showing a configuration example of a cutting device according to Embodiment 1. FIG. FIG. 4 is a diagram showing the configuration of voltage application means and the like of the cutting apparatus shown in FIG. FIG. 5 is a flow chart showing the flow of the method for processing the package substrate according to the first embodiment.

A cutting apparatus and a package substrate processing method according to the first embodiment are an apparatus and a processing method for cutting the package substrate 100 shown in FIG. As shown in FIG. 1, a plurality of intersecting (perpendicular in Embodiment 1) dividing lines 101 are formed on a package substrate 100 to be processed by the cutting apparatus and the method for processing a package substrate according to the first embodiment. A metal substrate 102 is provided. The metal substrate 102 has a rectangular planar shape and is made of a metal containing copper. A chip region 103 is formed on the metal substrate 102 .

2, the package substrate 100 has a plurality of device chips 104 arranged in a chip area 103 on the metal substrate 102, and a resin sealing layer 105 covering the device chips 104. As shown in FIG. The device chips 104 are arranged at equal intervals on the chip area 103 on the surface of the package substrate 100, and the dividing line 101 is formed between the device chips 104 adjacent to each other. In Embodiment 1, the device chip 104 is an LED (Light Emitting Diode) chip that emits light when a voltage is applied, but the present invention is not limited to an LED chip.

The package substrate 100 also includes a wiring layer (not shown) provided between the metal substrate 102 and the device chip 104 with an insulating layer (not shown) interposed therebetween, and wires electrically connecting the wiring layer and the device chip 104 . Prepare.

The resin sealing layer 105 is made of an insulating synthetic resin, and covers the wiring layer and wires in addition to the device chip 104 on the metal substrate 102 . The metal substrate 102 dissipates heat generated by the device chip 104 to the outside.

The package substrate 100 shown in FIGS. 1 and 2 is cut by cutting only the resin sealing layer 105 on the dividing line 101 without sticking the adhesive tape to the metal substrate 102 by the cutting apparatus 1 shown in FIG. is cut, adhesive tape is adhered to the metal substrate 102 and the like, and the metal substrate 102 on the dividing line 101 is cut and divided into individual device chips 104 .

The cutting device 1 according to the first embodiment is a device that cuts only the resin sealing layer 105 on the dividing line 101 while monitoring the cutting of the cutting blade 21 into the metal substrate 2 . As shown in FIG. 3, the cutting apparatus 1 includes a chuck table 10, a cutting unit 20 as cutting means, a cutting feed unit 30 as cutting feed means, an indexing feed unit 40 as indexing feed means, and a cutting feed. It has at least a cutting feed unit 50 as means and a control unit 60 as a control section.

The chuck table 10 holds the package substrate 100 by suction on the holding surface 11, and is made of conductive metal. The chuck table 10 has a rectangular holding surface 11 larger than the planar shape of the package substrate 100 . The holding surface 11 is formed flat along both the X-axis direction parallel to the horizontal direction and the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction.

The chuck table 10 is movable in the X-axis direction by a cutting feed unit 30 and rotatable about an axis parallel to the Z-axis direction by a rotary drive source 12 . Note that the Z-axis direction is orthogonal to the X-axis direction and the Y-axis direction. A holding surface 11 of the chuck table 10 is provided with a plurality of suction holes 13 connected to a vacuum suction source (not shown). The chuck table 10 holds the package substrate 100 by suction, with the metal substrate 102 of the package substrate 100 placed on the holding surface 11 and the suction holes 13 provided in the holding surface 11 being sucked by the vacuum suction source.

The cutting unit 20 includes a cutting blade 21 that cuts the package substrate 100 held by the chuck table 10 . The cutting unit 20 comprises a spindle 22 to which a cutting blade 21 is attached and a spindle housing 23 . The cutting unit 20 is provided movably in the Y-axis direction by the index feed unit 40 and movably in the Z-axis direction by the cutting feed unit 50 with respect to the package substrate 100 held on the chuck table 10 . ing.

The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 of the chuck table 10 by the indexing feed unit 40 and the cutting feed unit 50 . The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape and is electrically conductive. The spindle 22 is made of conductive metal, and cuts the package substrate 100 by rotating the cutting blade 21 . The spindle housing 23 accommodates the spindle 22 so as to be rotatable about its axis. By attaching the cutting blade 21 to the spindle 22 , the cutting unit 20 rotatably holds the cutting blade 21 and electrically connects the cutting blade 21 and the spindle 22 . Axial centers of the spindle 22 and the cutting blade 21 of the cutting unit 20 are set parallel to the Y-axis direction.

The cutting unit 20 is indexed and fed in the Y-axis direction by the indexing and feeding unit 40 and is fed by the cutting and feeding unit 50, and the chuck table 10 is feeding and cutting in the X-axis direction by the cutting and feeding unit 30, whereby the package substrate is cut and fed. Cut 100. In the first embodiment, the cutting unit 20 cuts the resin sealing layer 105 only by causing the cutting blade 21 to cut into the package substrate 100 without supplying cutting fluid.

The cutting feed unit 30 relatively feeds the chuck table 10 and the cutting unit 20 in the X-axis direction, and in the first embodiment, moves the chuck table 10 in the X-axis direction. The index feed unit 40 index feeds (moves) the cutting unit 20 in the Y-axis direction. The cutting feed unit 50 feeds (moves) the cutting unit 20 in the Z-axis direction. The cutting feed unit 30, the indexing feed unit 40, and the cutting feed unit 50 rotate well-known ball screws 31, 41, 51 and ball screws 31, 41, 51, which are rotatably provided around their axes. Known pulse motors 32, 42, 52 and known guide rails 33, 43, 53 for supporting the chuck table 10 or cutting unit 20 so as to be movable in the X-axis direction, the Y-axis direction or the Z-axis direction are provided.

Moreover, the cutting device 1 further includes a voltage application means 70 as shown in FIG. The voltage applying means 70 applies a voltage between the chuck table 10 and the cutting blade 21 of the cutting unit 20 during cutting of the resin sealing layer 105 . The voltage application means 70 includes a DC power supply 71 that applies a voltage to the chuck table 10 and the cutting blade 21 via the spindle 22 of the cutting unit 20, a switch 72 that can be opened and closed, and a cutting power supply for the chuck table 10 and the cutting unit 20. and a voltmeter 73 for detecting a voltage value applied between the blade 21 and the blade 21 .

In the first embodiment, the DC power supply 71 has a positive pole connected to the spindle 22 of the cutting blade 21 and a negative pole connected to the chuck table 10 . The switch 72 is provided between the positive electrode of the DC power supply 71 and the spindle 22 in the first embodiment. The voltmeter 73 is provided between the switch 72 and the spindle 22 in the first embodiment. When the switch 72 of the voltage application means 70 is closed, the DC power supply 71 applies voltage between the chuck table 10 and the spindle 22 . When the cutting blade 21 contacts the metal substrate 102 of the package substrate 100 held on the chuck table 10 by suction, the voltage applying means 70 causes a current to flow between the cutting blade 21 and the chuck table 10 , and the voltmeter 73 indicates that the cutting blade A voltage value indicating that a current has flowed between 21 and chuck table 10 is detected.

Further, the cutting apparatus 1 is fixed to the cutting unit 20 so that an imaging unit 80 for capturing an image of the package substrate 100 moves integrally with the cutting unit 20 . The imaging unit 80 includes an imaging element that captures an area to be divided of the package substrate 100 before cutting held on the chuck table 10 . The imaging device is, for example, a CCD (Charge-Coupled Device) imaging device or a CMOS (Complementary MOS) imaging device. The imaging unit 80 captures an image of the package substrate 100 held on the chuck table 10, acquires an image for performing alignment for aligning the package substrate 100 and the cutting blade 21, and controls the acquired image. output to unit 60;

The control unit 60 is a computer that controls the above-described components of the cutting device 1 to cause the cutting device 1 to perform the cutting operation on the package substrate 100 . The control unit 60 includes an arithmetic processing unit having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input/output interface device. and The arithmetic processing device of the control unit 60 performs arithmetic processing according to a computer program stored in the storage device, and outputs a control signal for controlling the cutting device 1 to the above-described control signal of the cutting device 1 via the input/output interface device. output to the configured element.

The control unit 60 includes a display unit (not shown) configured by a liquid crystal display device for displaying the state of the machining operation, an image, etc., and an input unit (not shown) used when the operator registers machining content information and the like, and a display unit. It is connected with a warning unit 61 . The input unit is composed of at least one of a touch panel provided on the display unit and an external input device such as a keyboard. The warning unit 61 emits at least one of sound and light to warn the operator.

The control unit 60 also includes a cut detection section 62 and a warning command section 63, as shown in FIGS. The cut detection unit 62 detects the amount of change in the voltage value applied between the chuck table 10 and the cutting blade 21 of the cutting unit 20 by the voltage applying unit 70 , and detects the voltage applied to the package substrate 100 during cutting of the resin sealing layer 105 . It detects that the cutting blade 21 has come into contact with the metal substrate 102 of . The cut detection unit 62 detects whether or not the cutting blade 21 has come into contact with the metal substrate 102 of the package substrate 100 based on the detection result of the voltmeter 73 during cutting. Specifically, when the voltage value detected by the voltmeter 73 during cutting becomes equal to or greater than a predetermined value, the cutting detection unit 62 determines that the cutting blade 21 and the metal substrate 102 are in contact with each other, and the voltage value is less than the predetermined value. , it is determined that the cutting blade 21 and the metal substrate 102 are not in contact with each other. The predetermined value is a value determined according to the voltage value applied to chuck table 10 and spindle 22 by DC power supply 71, and is a value indicating that cutting blade 21 and metal substrate 102 are in contact with each other.

The warning command unit 63 causes the warning unit 61 to issue a warning when the cutting detection unit 62 detects that the cutting blade 21 has come into contact with the metal substrate 102 during cutting of the resin sealing layer 105 . When the cutting detection unit 62 detects that the cutting blade 21 has come into contact with the metal substrate 102 , the warning command unit 63 stops the cutting process of the cutting device 1 and causes the warning unit 61 to indicate that the cutting blade 21 has come into contact with the metal substrate 102 . Information indicating that it has been done is output, and the warning unit 61 is operated to notify the operator.

Note that the functions of the cutting detection section 62 and the warning command section 63 are realized by executing a computer program stored in a storage device by the arithmetic processing device of the control unit 60 .

Next, this specification describes a method for cutting a package substrate according to the first embodiment. The method of processing a package substrate according to the first embodiment (hereinafter simply referred to as the processing method) uses the cutting apparatus 1 shown in FIG. It is a method of processing.

The processing method includes, as shown in FIG. 5, a placement step ST1, a positioning step ST2, and a cutting step ST3. The mounting step ST<b>1 is a step of mounting the metal substrate 102 of the package substrate 100 on the holding surface 11 of the chuck table 10 . In the first embodiment, the operator places the metal substrate 102 of the package substrate 100 on the holding surface 11 in the placing step ST1. In the processing method, when the operator places the metal substrate 102 on the holding surface 11, the process proceeds to the positioning step ST2.

The positioning step ST2 is a step of positioning the lower end of the cutting edge of the cutting blade 21 of the cutting unit 20 at a predetermined depth of the package substrate 100 by the cutting feed unit 50 . The predetermined depth is below the surface of the resin sealing layer 105 of the package substrate 100 , and the lower end of the cutting edge of the cutting blade 21 does not contact the metal substrate 102 . This is the position (height) in the Z-axis direction of the lower end of the cutting edge of the cutting blade 21 that can be divided by cutting.

The positioning step ST2 is started by the cutting device 1 when the operator registers the machining content information in the control unit 60 and the control unit 60 receives a machining operation start instruction from the operator. In the positioning step ST2, the cutting device 1 sucks and holds the metal substrate 102 of the package substrate 100 on the holding surface 11, and the cutting feed unit 50 moves the package substrate 100 on the holding surface 11 toward the lower side of the imaging unit 80. , the image pickup unit 80 picks up an image of the package substrate 100 and performs an alignment operation for aligning the package substrate 100 with the cutting blade 21 of the cutting unit 20 .

Specifically, in the alignment operation, the cutting device 1 causes the rotary drive source 12 to make the planned dividing line 101 to be cut first among the plurality of planned dividing lines 101 parallel to the X-axis direction, and the indexing feed unit 40 and the like. First, the dividing line 101 to be cut first and the cutting blade 21 are positioned in parallel in the X-axis direction, and the cutting feed unit 50 positions the lower end of the cutting edge of the cutting blade 21 at the above-described predetermined depth. When the cutting device 1 positions the lower end of the cutting edge of the cutting blade 21 at a predetermined depth, the processing proceeds to the cutting step ST3.

In the cutting step ST3, the chuck table 10 and the cutting unit 20 are relatively moved while the voltage applying means 70 applies voltage to the chuck table 10 and the spindle 22 of the cutting unit 20. This is the step of cutting the upper resin sealing layer 105 . In the cutting step ST3, the voltage application means 70 of the cutting device 1 applies a voltage between the chuck table 10 and the spindle 22 of the cutting unit 20, and moves the chuck table 10 to the cutting feed unit 50 along the X-axis direction. 21 to cut the resin sealing layer 105 on the line to be divided 101 over the entire length of the line to be divided 101 . In the first embodiment, in the cutting step ST3, the cutting device 1 does not supply the cutting fluid to the cutting blade 21 and the package substrate 100 during cutting.

In the cutting step ST3, the cutting apparatus 1 uses the cutting feed unit 30, the indexing feed unit 40, and the rotary drive source 12 to divide the cutting blade 21 rotating in the cutting unit 20 and the package substrate 100 into a planned dividing line based on the processing content information. 101 to cut the resin sealing layer 105 on the dividing line 101 with the cutting blade 21, and sequentially cut the resin sealing layer 105 on all the dividing lines 101. . The processing method ends when the resin sealing layer 105 on all the dividing lines 101 is cut in the cutting step ST3.

In the cutting step ST<b>3 , the control unit 60 of the cutting device 1 detects that the cutting blade 21 has come into contact with the metal substrate 102 based on the detection result of the voltmeter 73 . In the cutting step ST3, when the cutting detection section 62 detects that the cutting blade 21 has come into contact with the metal substrate 102, the control unit 60 of the cutting device 1 causes the warning command section 63 to stop cutting, and the warning unit 61 to Information indicating that the cutting blade 21 has come into contact with the metal substrate 102 is output, and the warning unit 61 is operated. In this manner, in the cutting step ST3, when the lower end of the cutting edge of the cutting blade 21 contacts the metal substrate 102, the machining method detects the contact by electrical conduction between the chuck table 10 and the cutting blade 21 of the cutting unit 20. .

In the cutting apparatus 1 according to Embodiment 1, the chuck table 10 has conductivity, the cutting blade 21 and the spindle 22 of the cutting unit 20 have conductivity, and the voltage applying means 70 connects the chuck table 10 and the spindle 22 together. Apply a voltage between In addition, the control unit 60 of the cutting device 1 detects that the metal substrate 102 and the cutting blade 21 have come into contact with each other during the cutting process of the resin sealing layer 105, and that the cut detection unit 62 has come into contact with the metal substrate 102. and a warning command unit 63 for causing the warning unit 61 to generate a warning when the is detected. As a result, the cutting device 1 can quickly recognize that the metal substrate 102 and the cutting blade 21 have come into contact with each other during the cutting process of the resin sealing layer 105. Since the cutting process is stopped when the resin sealing layer 105 is cut, cutting into the metal substrate 102 by the cutting blade 21 can be suppressed.

In the cutting step ST3, the processing method according to the first embodiment cuts the resin sealing layer 105 of the package substrate 100 while applying voltage to the chuck table 10 and the spindle 22 of the cutting unit 20 . As a result, in the processing method, contact between the metal substrate 102 and the cutting blade 21 can be quickly grasped during cutting of the resin sealing layer 105. Since the cutting process is stopped when the blade 21 comes into contact with the metal substrate 102, it is possible to prevent the cutting blade 21 from cutting into the metal substrate 102 during the cutting process.

In addition, in the machining method according to the first embodiment, since no cutting fluid is supplied in the cutting step ST3, the chuck table 10 and the cutting blade 21 are electrically connected by the cutting fluid before the cutting blade 21 contacts the metal substrate 102. can be suppressed.

It should be noted that the present invention is not limited to the above-described embodiments and the like. That is, various modifications can be made without departing from the gist of the present invention. For example, in the present invention, in the cutting step ST3, the cutting device 1 may perform cutting while supplying a cutting fluid made of pure water to the cutting blade 21 and the package substrate 100 .

1 cutting device 10 chuck table 20 cutting unit (cutting means)
21 cutting blade 30 cutting feed unit (cutting feed means)
40 indexing unit (indexing means)
50 Notch feed unit (notch feed means)
60 control unit (control unit)
61 Warning unit (display)
62 notch detection unit 63 warning command unit 70 voltage application unit 100 package substrate 101 division line 102 metal substrate 103 chip area 104 device chip 105 resin sealing layer ST1 placement step ST2 positioning step ST3 cutting step

Claims (4)

A package substrate having a plurality of device chips arranged in a chip area on a metal substrate on which a plurality of intersecting dividing lines are formed, and a resin sealing layer covering the device chips, is attached to the metal substrate. A cutting device for cutting the package substrate while monitoring the cutting,
a conductive chuck table for holding the package substrate;
a conductive cutting blade for cutting the package substrate held by the chuck table, and cutting the package substrate with the cutting blade to remove only the resin sealing layer on the dividing line; a cutting means for cutting;
cutting feed means for feeding the chuck table and the cutting means relative to each other in the X-axis direction;
indexing means for indexing and feeding the cutting means in the Y-axis direction orthogonal to the X-axis direction;
cutting feed means for cutting and feeding the cutting means in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction;
voltage applying means for applying a voltage between the chuck table and the cutting means;
a control unit;
The control unit
A notch detector for detecting contact of the cutting blade with the metal substrate of the package substrate during cutting based on the amount of change in the voltage applied between the chuck table and the cutting means by the voltage applying means. When,
a warning command unit that stops the cutting process and generates a warning on a display unit when the cutting detection unit detects contact. 2. The cutting apparatus according to claim 1, wherein said cutting means cuts said package substrate without supplying a cutting fluid . a conductive chuck table for holding the package substrate;
cutting means including a conductive cutting blade for cutting the package substrate held by the chuck table;
cutting feed means for feeding the chuck table and the cutting means relative to each other in the X-axis direction;
indexing means for indexing and feeding the cutting means in the Y-axis direction orthogonal to the X-axis direction;
cutting feed means for cutting and feeding the cutting means in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction;
using a cutting device comprising voltage applying means for applying a voltage between the chuck table and the cutting means,
A processing method for cutting a package substrate having a plurality of device chips arranged in a chip region on a metal substrate on which a plurality of intersecting dividing lines are formed, and a resin sealing layer covering the device chips. and
a placing step of placing the package substrate on the chuck table;
a positioning step of positioning the cutting means at a predetermined depth of the package substrate by the cutting feed means;
While applying voltage to the chuck table and the cutting means, the chuck table and the cutting means are moved relatively to cause the cutting blade to cut into the package substrate, thereby cutting the resin on the dividing line. a cutting step of cutting only the sealing layer ,
In the cutting step,
When the edge of the cutting blade contacts the metal substrate, the contact is detected by electrical conduction between the chuck table and the cutting means, and the cutting is stopped . processing method. 4. The method of processing a package substrate according to claim 3, wherein no cutting fluid is supplied in said cutting step.

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