JP2893641B2 - Dicing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus,
In particular, the present invention relates to a dicing apparatus provided with a cutting section for cutting a wafer into semiconductor chips.

[0002]

2. Description of the Related Art A dicing apparatus rotates a cutting blade (hereinafter referred to as a cutter) to cut a wafer into semiconductor chips.
When rotating the cutter, compressed air and cooling water are required,
When cutting a wafer into semiconductor chips, nitrogen and cutting water are required. In addition, in order to cut high-quality semiconductor chips from a wafer, it is necessary to appropriately control the pressure and flow rate of compressed air, cooling water, nitrogen and cutting water, and for that purpose, compressed air, cooling water, The upper limit value and the lower limit value of the pressure and flow rate of nitrogen and cutting water are set within a certain range, respectively. And, while cutting the wafer, compressed air, cooling water,
When the pressure and flow rate of the nitrogen and the cutting water are out of the range of the upper limit value and the lower limit value, the operator is notified of the abnormality and the dicing device is stopped. However, compressed air,
The method of uniquely controlling the pressure, flow rate, and the like of the cooling water, nitrogen, and cutting water within the range of the upper limit value and the lower limit value has a problem in operating the dicing apparatus in the best condition.

On the other hand, the operating conditions and cutting conditions of the dicing apparatus corresponding to independent fluctuations in the pressure and flow rate of the compressed air, cooling water, nitrogen and cutting water, and fluctuations related to each other are determined, and these conditions are optimized. The method of controlling the fluctuations of the pressure, flow rate, etc. of the compressed air, cooling water, nitrogen and cutting water so that the pressure, flow rate, etc. of the compressed air, cooling water, nitrogen, cutting water, etc. are in the range of upper and lower limits Thus, the dicing apparatus can be operated in the best condition by the method of uniquely controlling the dicing apparatus.

[0004]

However, in order to obtain data for controlling fluctuations in pressure, flow rate, and the like of compressed air, cooling water, nitrogen, and cutting water, an operator of a dicing apparatus needs to sample each data. Therefore, there is a problem that a burden is imposed on the operator. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a dicing apparatus that can operate in the best condition without imposing a burden on an operator.

[0005]

According to the present invention, there is provided a dicing apparatus for supplying cutting water to a cutting blade and cutting the workpiece by the cutting blade. A detection unit that detects data such as the flow rate, temperature, pressure, and PH value of the cutting water, a monitoring unit that obtains cutting data during cutting of the workpiece, and detection data obtained by the detection unit. A memory unit for storing the cutting data corresponding to the detection data, and the detection data when the cutting data stored in the memory unit has an optimum value is obtained, and the obtained detection data has the same value as the obtained detection data Control means for controlling the flow rate, temperature, pressure and the like of the cutting water as described above.

The present invention also provides a dicing apparatus which supplies cooling water to a spindle of a cutting blade and cuts a workpiece by the cutting blade, wherein a flow rate, a temperature and a pressure of the cooling water during cutting the workpiece are provided. A detection unit for detecting data such as
Monitoring means for obtaining cutting data during cutting of the workpiece, detection data obtained by the detection section, a memory section for storing the cutting data corresponding to the detection data, and a memory section for storing the cutting data. Control means for controlling the flow rate, temperature, pressure, etc. of the cooling water so as to obtain the detection data when the cutting data has an optimum value and to have the same value as the obtained detection data. It is characterized by.

[0007]

According to the present invention, the detection unit detects data such as the flow rate, temperature, and pressure of cutting water and cooling water, and the number of rotations of the spindle of the cutting blade, and the monitoring CPU obtains cutting data of the workpiece. . The memory unit stores the detection data and also stores the cutting data corresponding to the timing at which the detection data was stored. Then, the control CPU obtains the detection data when the cutting data stored in the memory unit has the optimum value, and the flow rate, the temperature, and the pressure of the cutting water or the cooling water are set so as to have the same value as the obtained detection data. And the spindle rotation speed of the cutting blade and the like. In the case of cutting water, it is also possible to detect pH value data and control the pH value in the same manner as the flow rate, temperature, and pressure.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A dicing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a block diagram of a dicing apparatus according to the present invention, and FIG. 2 is a flowchart illustrating the operation thereof. As described in the section of the related art,
The dicing apparatus requires compressed air and cooling water when rotating the cutting blade, and requires nitrogen and cutting water when cutting the wafer into chips.
This is applied when monitoring the cooling water, nitrogen, and cutting water. However, in order to make the description easy to understand, only the cutting water will be described.

As shown in FIG. 1, a dicing apparatus 10 includes a cutting unit 12, a cutting water supply unit 14, a detecting unit 16, a memory unit 18, an adjusting unit 20, a control CPU 22, and a monitoring CPU.
24. The cutting section 12 includes a cutter 26, and the cutter 26 is coaxially fixed to a shaft 28. A motor 30 is connected to the shaft 28 so as to transmit a rotational force. Therefore, when the motor 30 is driven, the cutter 26
Is rotated, the wafer 32 aligned on the cutting table (not shown) is cut into semiconductor chips by the cutter 26.

The cutting water supply means 14 includes a supply pump 34, which sucks cutting water from a tank 36 and discharges the cutting water to a pipe 38. Thereby, cutting water is supplied from the open end of the pipe 38. The detection unit 16 is provided in the pipe 38, and the detection unit 16 includes the flow sensor 16 </ b> A and the water pressure sensor 1.
6B and a temperature sensor 16C. Flow sensor 16
A detects the flow rate of cutting water flowing in the pipe 38, and the water pressure sensor 16B detects the pressure of cutting water flowing in the pipe 38. The temperature sensor 16C detects the temperature of the cutting water flowing in the pipe 38.

The adjusting section 20 has a flow adjusting valve 20A, a water pressure adjusting valve 20B, and a temperature adjusting section 20C. The flow adjusting valve 20A adjusts the flow rate of the cutting water flowing in the pipe 38, and the water pressure adjusting valve 20B The pressure of the cutting water flowing in the pipe 38 is adjusted. Further, the temperature adjusting unit 20C adjusts the temperature of the cutting water flowing in the pipe 38. The monitoring CPU 24 inputs data relating to the cutting state of the wafer 32 via the detection unit 40, and obtains the cutting state of the wafer 32 based on the input data. In addition, the memory unit 18 stores the flow sensor 16
A, each of the detection data detected by the water pressure sensor 16B and the temperature sensor 16C is stored, and the cutting state of the wafer 32 obtained by the monitoring CPU 24 is stored in accordance with the timing at which the detection data is stored.

FIGS. 2 and 3 show data stored in the memory unit 18. FIG. FIG. 2 is a graph showing the cutting state of the wafer 32 with respect to the flow rate of the cutting water. The range of the flow rates Q1 to Q2 is the best range of the cutting state of the wafer 32. FIG. 3 is a graph showing the cutting state of the wafer 32 with respect to the water temperature of the cutting water. The range of the water temperature T1 to T2 is the best range of the cutting state of the wafer 32. The control CPU 22 includes a memory unit 1
8, the control CPU 22 obtains detection data when the cutting state of the wafer 32 stored in the storage unit 8 becomes an optimum value.
Flow control valve 20A, water pressure control valve 20B, temperature control unit 20
A signal for adjusting C is output, and the flow rate, temperature, pressure, and the like of the cutting water are controlled so as to have the same value as the obtained detection data.

In the above embodiment, the flow rate, temperature,
Although the case where the pressure is controlled has been described, the cutting water is not limited to the flow rate, the temperature, and the pressure, and the pH value of the cutting water and the like can be managed by the same method. In FIG. 1, reference numeral 42 denotes a pump for supplying cooling water, and the pump 42
Cooling water is sucked in from 4 and discharged to pipe 45. Thereby, cooling water is supplied from the open end of the pipe 45 to the spindle and the like of the cutting section 12. A detection unit 46 is provided in the pipe 45, and the detection unit 46 includes a flow sensor 46A and a water pressure sensor 46.
B and a temperature sensor 46C. Flow sensor 46A
Detects the flow rate of the cooling water flowing in the pipe 45, and the water pressure sensor 46B detects the pressure of the cooling water flowing in the pipe 45. The temperature sensor 46C detects the temperature of the cooling water flowing in the pipe 45. Each detection data detected by the detection unit 46 is stored in the memory unit 18 at the same time as the detection data of the detection unit 16.

[0014] The flow rate, water pressure,
The water temperature is adjusted by a flow control valve 48A, a water pressure control valve 48B, and a temperature control unit 48C, respectively, and the flow control valve 48A, the water pressure control valve 48B, and the temperature control unit 48C constitute a control unit 48. Then, a signal for controlling the flow rate, temperature, pressure, and the like of the cooling water is sent to the monitoring CPU 24 so that the adjustment section 48 has the same value as the detection data of the cooling water when the cutting state of the wafer 32 becomes the optimum value. Output from

In the above embodiment, the cutting water and the cooling water have been described. However, the present invention is not limited to this, and if the compressed air, nitrogen, or the room temperature (environmental temperature) changes, the cutting condition of the wafer 32 is affected. In addition to cutting water and cooling water, compressed air, nitrogen, and environmental temperature can be controlled to optimally set the cutting state of the wafer 32 and the operating state of the cutting section 12. The compressed air and nitrogen are used as an air source of an air bearing for rotating the blade.

Further, since the spindle rotation speed of the blade also affects the cutting condition of the wafer 32, the spindle rotation speed is detected in the same manner as the flow rate, temperature, and pressure of the cutting water, and the detection data of the spindle rotation speed is obtained. It is also possible to control the spindle rotation speed based on the detection data to optimally set the cutting state of the wafer 32 and the operating state of the cutting section 12. In the above-described embodiment, the case where the contamination of the wafer 32 is reduced as the cutting state of the wafer 32 is described. However, chipping (wafer chipping) at the time of cutting can be reduced by the same method. The operation of the dicing apparatus according to the present invention configured as described above in cutting water will be described with reference to the flowchart shown in FIG. First, the flow rate control valve 20A, the water pressure control valve 20B, and the temperature control unit 20C are set within the range between the upper limit value and the lower limit value. Next, the supply pump 34 is driven to suck cutting water from the tank 36 and suck the cutting water. The cutting water is supplied to the cut portion of the wafer 32 from the open end of the pipe 38 via the pipe 38. Next, the cutter 30 is rotated by driving the motor 30 of the cutting unit 12,
Wafer 3 aligned on cutting table
2 is cut into semiconductor chips.

In this state, each data of the flow rate, the water pressure and the water temperature of the cutting water is detected at intervals of 10 seconds, and the detected data is stored. The CPU 24 stores data on the cutting status of the wafer 32 obtained (step 50). next,
It is determined whether the detection data and the wafer cutting data stored in the memory unit 18 are stocked by a certain amount or more (step 52).

If the stock amount of these data does not reach a certain amount, the data is fed back to step 50,
The above steps are repeated. On the other hand, if it is determined in step 52 that the data stock amount has reached a certain amount,
The flow rate sensor 16A detects the flow rate of the cutting water (step 54), and the monitoring CPU 24 determines the cutting state of the wafer 32 based on the data transmitted from the detection unit 40, and determines whether the wafer 32 is dirty. (Step 5
6). If the wafer 32 is not very dirty, step 54
The flow rate of the cutting water detected in step 18
(Step 58).

On the other hand, if it is determined in step 56 that the wafer 32 is contaminated, the control CPU 22 determines whether or not the flow rate of the cutting water is appropriate (step 60). If it is determined in step 60 that the flow rate of the cutting water is inappropriate, a flow rate change signal is transmitted from the control CPU 22 to the flow rate control valve 20A. As a result, the flow control valve 20A operates to change the flow rate of the cutting water (step 62). Next, the changed flow rate of the cutting water is detected by the flow rate sensor 16A (step 64), and the process is fed back to the step 56 to repeat the above-described steps sequentially. If it is determined in step 60 that the flow rate of the cutting water is appropriate, the temperature of the cutting water is detected by the temperature sensor 16C (step 64).

Next, it is determined whether or not the temperature of the cutting water detected in step 64 is appropriate (step 66). If the temperature of the cutting water is determined to be inappropriate, the control CPU 22 sends the temperature to the temperature controller 20C. Transmit the change signal. As a result, the temperature control unit 20C operates to control the temperature of the cutting water (step 68). Subsequently, after the adjusted cutting water temperature is detected by the temperature sensor 16C (step 64),
The process is fed back to step 56, and the above-described steps are sequentially repeated.

On the other hand, if it is determined in step 66 that the water temperature of the cutting water is appropriate, the water pressure sensor 16B detects the water pressure of the cutting water (step 70). Next, it is determined whether or not the cutting water pressure detected in step 70 is appropriate (step 7).
2) If the water pressure of the cutting water is determined to be inappropriate, a water pressure change signal is transmitted from the control CPU 22 to the water pressure control valve 20B. As a result, the hydraulic pressure control valve 20B operates to change the hydraulic pressure of the cutting water (step 74). Next, after the changed cutting water pressure is detected by the water pressure sensor 16B (step 64), the process is fed back to step 56 and the above-described steps are sequentially repeated.

If it is determined in step 72 that the cutting water pressure is appropriate, the monitoring CPU 24 obtains the cutting state of the wafer 32 based on the data transmitted from the detection unit 40, and the wafer 32 is heavily contaminated. It is determined whether or not (step 76). If the wafer 32 is not contaminated, the data of the flow rate, water temperature, and water pressure of the cutting water detected in step 64 are stored in the memory unit 18 (step 78).

On the other hand, if it is determined in step 76 that the wafer 32 is contaminated, the control CPU 22 transmits a control signal to each of the flow rate control valve 20A, the water pressure control valve 20B, and the temperature control unit 20C, and cuts the cutting water. After controlling the flow rate control valve 20A, the water pressure control valve 20B, and the temperature control unit 20C so that the flow rate, the water temperature, and the water pressure of the water supply system become optimal values (described later) (Step 80), the process is fed back to Step 54 to perform the above-described process Is sequentially repeated. Here, the optimum value will be described. The memory unit 18 stores data of cutting water flow rate, water pressure, and water temperature, and data of the cutting state of the wafer 32 obtained by the monitoring CPU 24 in accordance with the timing at which the detection data is stored. The control CPU 22 obtains detection data when the cutting condition of the wafer 32 is the best based on these data, and the obtained detection data becomes an optimum value.

As described above, according to the dicing apparatus of the present invention, it is possible to check the relevance of each data of the cutting water flow rate, water temperature, and water pressure. Further, according to the dicing apparatus, it is possible to pick up a variation factor from among the flow rate, the water temperature, and the water pressure of the cutting water. , The water pressure can be changed to an optimum value.

In the above embodiment, the case of monitoring the flow rate, water temperature, and water pressure of the cutting water has been described. However, the present invention is not limited to this.
The pH value may be monitored in addition to the flow rate, the water temperature, and the water pressure of the cutting water, and the compressed air, the cooling water, the nitrogen, the rotation speed of the spindle, and the like may be monitored in addition to the cutting water. When monitoring the compressed air, the cooling water, the nitrogen, and the rotation speed of the spindle, it is possible to optimally set the cutting condition of the wafer 32 and the operating condition of the cutting unit 12. The operation when monitoring the compressed air, cooling water, nitrogen, the rotation speed of the spindle, and the like is substantially the same as the operation state of the cutting water shown in the flowchart of FIG.

[0026]

As described above, according to the dicing apparatus according to the present invention, the detecting unit detects and monitors data such as the flow rate, temperature, pressure, and the number of spindle rotations of the cutting blade and the cooling water. CPU obtains cutting data of the workpiece. The memory unit stores the detection data and also stores the cutting data corresponding to the timing at which the detection data was stored. Then, the control CPU obtains the detection data when the cutting data stored in the memory unit has the optimum value, and the flow rate, the temperature, and the pressure of the cutting water or the cooling water are set so as to have the same value as the obtained detection data. And the spindle rotation speed of the cutting blade and the like. Therefore, necessary data can be obtained without imposing a burden on the operator, and the dicing apparatus can be operated in the best condition based on this data.

[Brief description of the drawings]

FIG. 1 is a block diagram of a dicing apparatus according to the present invention according to the present invention.

FIG. 2 is a bluff showing data stored in a memory unit;

FIG. 3 is a bluff showing data stored in a memory unit;

FIG. 4 is a flowchart illustrating the operation of the dicing apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Dicing apparatus 14 ... Cutting water supply means 16 ... Detection part 18 ... Memory part 22 ... Control CPU 24 ... Monitoring CPU 26 ... Cutter 32 ... Wafer

Claims (2)

(57) [Claims] 1. A dicing apparatus for supplying cutting water to a cutting blade and cutting a workpiece by the cutting blade, wherein data such as a flow rate, a temperature, a pressure, and a PH value of the cutting water during cutting the workpiece. A detecting unit for detecting the cutting data while cutting the workpiece, a detecting unit obtained by the detecting unit, and a memory unit for storing the cutting data corresponding to the detecting data, Control for obtaining the detection data when the cutting data stored in the memory unit has an optimum value, and controlling the flow rate, temperature, pressure, etc. of the cutting water so as to have the same value as the obtained detection data. Means, and a dicing apparatus. 2. A dicing apparatus for supplying cooling water to a spindle of a cutting blade and cutting a workpiece by the cutting blade, wherein data such as a flow rate, a temperature, and a pressure of the cooling water during cutting of the workpiece is obtained. A detection unit for detecting, a monitoring unit for obtaining cutting data during cutting of the workpiece, a memory unit for storing the detection data obtained by the detection unit, and the cutting data corresponding to the detection data; Control means for obtaining the detection data when the cutting data stored in the memory unit has an optimum value, and controlling the flow rate, temperature, pressure, etc. of the cooling water so as to have the same value as the obtained detection data. And a dicing device comprising: