KR101793337B1 - Cutting device and cutting method - Google Patents
Cutting device and cutting method Download PDFInfo
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- KR101793337B1 KR101793337B1 KR1020150145374A KR20150145374A KR101793337B1 KR 101793337 B1 KR101793337 B1 KR 101793337B1 KR 1020150145374 A KR1020150145374 A KR 1020150145374A KR 20150145374 A KR20150145374 A KR 20150145374A KR 101793337 B1 KR101793337 B1 KR 101793337B1
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- cleaning
- cleaning mechanism
- cut
- cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/799—Apparatus for disconnecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
A problem to be solved by the present invention is to reliably remove contamination adhering to the surface of a cut-off substrate in a cutting apparatus. In the cutting apparatus, a scrubbing cleaning mechanism (12), a spray cleaning mechanism (13), and a drying mechanism (14) are provided in the cleaning mechanism (10). The scrub cleaning mechanism 12 is drivable, and a sponge member 22 is provided at the tip end of the scrub cleaning mechanism 12. The washing water is supplied to the sponge member 22. The cutting table 4 on which the cut substrate 9 is placed is linearly moved below the cleaning mechanism 10 and the scratch cleaning mechanism 12 and the jet cleaning mechanism 13 cut the substrate 9). The chip or resin residue attached to the surface of the cut-off substrate 9 is physically rubbed and removed by the sponge member 22 including the washing water. The cutting chips and the resin residue are removed by the washing water 26 sprayed from the spray cleaning mechanism 13. The cleaning by the scrub cleaning mechanism 12 and the cleaning by the jet cleaning mechanism 13 can be combined effectively.
Description
BACKGROUND OF THE
A substrate made of a printed board or a lead frame is virtually divided into a plurality of regions in a lattice shape and a chip-shaped element (for example, a semiconductor chip) is mounted on each region, This is called a sealed substrate. The sealed substrate has a surface on the substrate side and a surface on the resin side. The finished substrate is cut by a cutting mechanism using a rotary blade or the like, and is divided into individual pieces, that is, cut into individual pieces.
Conventionally, a predetermined region of a substrate that has been sealed by a cutting apparatus is cut by a cutting mechanism such as a rotary blade. First, the sealed substrate is loaded on a cutting table and adsorbed. Subsequently, the sealed substrate is aligned (aligned). By alignment, the position of a virtual cut line for dividing a plurality of regions is set. Subsequently, the cutting table on which the sealed substrate is adsorbed and the cutting mechanism are relatively moved. The cutting water is sprayed onto the cutting position of the sealing substrate and the sealing substrate is cut along the cutting line set on the sealing substrate by the cutting mechanism. By cutting the encapsulated substrate, the individualized product is produced.
As the resin sealing technique, resin molding techniques such as compression molding and transfer molding are used. When a semiconductor such as an integrated circuit (IC) is resin-sealed, for example, a resin material in which carbon particles having conductivity as a coloring agent are added to a thermosetting epoxy resin is used. Therefore, the IC is resin-sealed using a black resin material to which carbon particles are added. On the other hand, an optical semiconductor element such as a light emitting diode (LED) is resin-sealed using a transparent liquid resin that is thermosetting and light-permeable, such as silicon resin or epoxy resin. Therefore, in the LED, it is important to keep the surface of the transparent resin in a clean state free from contamination or scratches so as not to interfere with the transmission of light.
In addition, in recent years, along with the enlargement of the substrate and the thinning of the substrate, the distance for cutting the sealed substrate has become very long. As the distance for cutting becomes long, the amount of cutting chips or resin residue generated by cutting becomes large, and it is easy to attach cutting chips or resin debris along the surface or the cutting portion of the cutting completion substrate (plural pieces of the product) Loses. Therefore, it is important to remove the cone termination (contaminants) such as chips or resin residue attached to the surface of the cut-off substrate or the cut-out portion, thereby making the surface of the cut-off substrate clean.
A dicing apparatus which improves the force for removing the termination, comprising: a work table on which a workpiece is mounted and which is fed and processed in the X direction and rotated by (omitted)? And a rotary blade which is index- (Not shown) is cut by the rotary blade, wherein a jetting member for jetting the liquid mixed with the high-pressure gas in a linear shape with a width larger than the work diameter is provided, and the jetting member Quot; is arranged at a position where the liquid can be injected into the work at one end of the work transfer stroke of the work (not shown) of the work (for example, see paragraphs [0007] 5).
However, in the dicing apparatus disclosed in
According to this configuration, the cleaning water supplied from the supply pipe increases in flow velocity by the high-pressure gas supplied from the supply pipe, and the force for removing the contamination remaining on the workpiece surface increases, It becomes possible to remove the contamination that could not be removed by the conventional method. However, it is also difficult to completely remove the contamination adhering to the surface of the workpiece and the work grooves by only cleaning the liquid to which the high-pressure gas is added. Particularly, in a photosemiconductor device such as an LED, it is strongly desired to make a clean surface state free from contamination or scratches.
It is an object of the present invention to provide a cutting apparatus and a cutting method which can reliably remove contamination or foreign matter on the surface of a cut-off substrate.
In order to solve the above problems, a cutting apparatus according to the present invention is a cutting apparatus comprising a table on which a workpiece is placed, a cutting mechanism for cutting the workpiece, a first moving mechanism for relatively moving the table and the cutting mechanism, And a cleaning mechanism for cleaning at least one surface of the aggregate, the aggregate having a plurality of products formed by disposing a piece to be cut, the separation device being provided in the cleaning mechanism, A scrubbing cleaning mechanism, a scrubbing member provided under the scrubbing scrubbing mechanism, a cleansing water supplying mechanism for supplying cleansing water to the scrubbing member, and a second moving mechanism for relatively moving the table and the scrubbing mechanism, By relatively moving the table and the cleaning mechanism by bringing the cleaning tool into contact with one side by bringing the tool and the object to be cut close to each other, In the fed onto the surface can be rinsed one state is characterized in that the one surface to be cleaned.
Further, the cutting apparatus according to the present invention is characterized in that, in the above-described cutting apparatus, the cleaning member has a length of at least a width dimension of the aggregate.
Further, the cutting apparatus according to the present invention is characterized in that, in the above-described cutting apparatus, the cleaning member has a urethane sponge or a PVA sponge.
Further, the cutting apparatus according to the present invention is characterized in that, in the above-described cutting apparatus, the table and the cleaning mechanism are relatively moved plural times.
The cutting apparatus according to the present invention is characterized in that the above-described cutting apparatus is provided with a jetting cleaning mechanism which is provided in the cleaning mechanism and which cleans at least one surface by jetting at least liquid toward one surface.
The cutting apparatus according to the present invention is characterized in that, in the above-described cutting apparatus, the jet cleaning mechanism has a jet nozzle for jetting a gas and a liquid mixed with each other.
The cutting apparatus according to the present invention is characterized in that the above-described cutting apparatus is provided with a drying mechanism which is provided in a cleaning mechanism and which dries one surface by spraying a gas toward one surface of the material to be cut.
Further, the cutting apparatus according to the present invention is characterized in that, in the above-described cutting apparatus, the object to be cut is a sealed substrate.
The cutting apparatus according to the present invention is characterized in that in the above-described cutting apparatus, the object to be cut is a substrate in which functional elements are formed in a plurality of regions respectively corresponding to a plurality of products.
In order to solve the above-described problems, a cutting method according to the present invention is a cutting method comprising: a step of placing a piece to be cut on a table; a step of relatively moving a cutting mechanism and a table to cut the piece to be cut; 1. A cutting method comprising a step of forming an aggregate having a plurality of individualized products by cutting a material to be cut and a step of cleaning at least one surface of the aggregate by a cleaning mechanism provided above the table, A step of relatively moving the scrub cleaning mechanism and the table provided in the cleaning mechanism; a step of supplying cleaning water to the cleaning member provided under the scrub cleaning mechanism; and a step of supplying cleaning water to the cleaning member, A step of bringing the cleaning member and the table into contact with each other in a state in which the cleaning member is in contact with one surface, In the step of comprising the step of, and relative movement of the cleaning member and the table, and the washing water contained in the cleaning member supplied on the one side it is characterized in that washing the one surface.
The cutting method according to the present invention is characterized in that, in the above-described cutting method, the cleaning member has a length of at least a width dimension of the aggregate.
The cutting method according to the present invention is characterized in that, in the above cutting method, the cleaning member has a urethane sponge or a PVA sponge.
The cutting method according to the present invention is characterized in that, in the above-described cutting method, the cleaning mechanism and the table are relatively moved plural times in the step of relatively moving the cleaning member and the table.
The cutting method according to the present invention is characterized in that it comprises the step of cleaning at least one surface by using a liquid by jetting at least a liquid toward one surface from a jet cleaning mechanism provided in the cleaning mechanism in the above- do.
The cutting method according to the present invention is characterized in that, in the above-described cutting method, in the step of cleaning one surface by using a liquid, a gas and a liquid are mixed and jetted from one side of the jet cleaning mechanism toward one side .
The cutting method according to the present invention is characterized in that in the above-described cutting method, a step of drying one surface by spraying a gas toward one surface from a drying mechanism provided in the cleaning mechanism is provided.
The cutting method according to the present invention is characterized in that, in the above cutting method, the object to be cut is a sealed substrate.
The cutting method according to the present invention is characterized in that in the cutting method described above, the object to be cut is a substrate in which functional devices are formed in a plurality of regions corresponding to a plurality of products, respectively.
According to the present invention, there is provided a cutting apparatus comprising: a table on which a material to be cut is placed; a cutting mechanism for cutting the material to be cut; a first moving mechanism for relatively moving the table and the cutting mechanism; And a cleaning mechanism for cleaning at least one surface of the aggregate having a plurality of products formed by cutting the to-be-cut material. The cleaning mechanism includes a scrub cleaning mechanism that relatively moves back and forth with respect to the object to be cut, a cleaning member provided at the bottom of the scrub cleaning mechanism, a cleaning water supply mechanism that supplies cleaning water to the cleaning member, To the second moving mechanism. The scrub cleaning mechanism is brought close to the object to be cut and the cleaning member is brought into contact with one side to relatively move the table and the cleaning mechanism. It is possible to reliably remove contamination and foreign matter on one side by physical cleaning by the cleaning member and to make the surfaces of the plurality of separated products to be in a clean state without concomitant.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an outline of a cutting apparatus according to a first embodiment of a cutting apparatus according to the present invention. Fig.
2 (a) to 2 (c) are schematic cross-sectional views each showing the shape of a cleaning mechanism in the cutting apparatus shown in Fig.
Fig. 3 is an outline view showing a state in which the cut substrate is cleaned by the cleaning mechanism shown in Fig. 2 (a), Fig. 3 (a) is a schematic plan view, and Fig. 3 (b) is a schematic sectional view.
4A to 4D are schematic sectional views showing a process of cleaning the cut substrate along one direction using the scrub cleaning mechanism and the spray cleaning mechanism in
5 (a) to 5 (d) are schematic sectional views showing a process of cleaning a cut-off substrate along a direction opposite to one direction by using a scrub cleaning mechanism and a spray cleaning mechanism in
6 (a) to (d) illustrate a process of cleaning a cut-off substrate along a direction opposite to one direction and one direction using a scrub cleaning mechanism in Example 3 of the cutting apparatus according to the present invention Fig.
7A to 7D are schematic cross-sectional views showing a process of cleaning the cut-off substrate in the direction opposite to the one direction and the one direction using the spray cleaning mechanism according to the third embodiment.
8A to 8D are diagrams showing a cutting apparatus according to a fourth embodiment of the cutting apparatus according to the present invention in which a plurality of spray cleaning mechanisms and a scrub cleaning mechanism are used to cut along one direction and a direction opposite to the one direction, FIG. 3 is a schematic cross-sectional view showing a process of cleaning a completed substrate.
3, the
[Example 1]
As shown in Fig. 1, the
The substrate supply unit A is provided with a
The
In the substrate cutting unit B, two
Each of the
The substrate cutting unit B is provided with an assembly of a plurality of individual products P cut from the sealed
In the
The
The inspection unit (C) is provided with an inspection stage (16). The cut-off
The receiving unit D is provided with a
In the present embodiment, a control unit CTL for setting and controlling the operation of the
2 (a), the
The
The
The drying mechanism (14) is a drying mechanism fixed to the cleaning mechanism (10). The surface of the
Each of the scrub cleaning mechanism 12 (particularly, the sponge member 22), the
Fig. 2 (b) shows a modification of the
Fig. 2C shows another modification of the
As shown in Figs. 3 (a) and 3 (b), a cut-
In the
An operation of cleaning the surface (the upper surface in the drawing) of the cut-off
The cutting table 4 is moved in the -Y direction (in other words, linearly) in a state in which the
The cleaning
After cleaning the cut-off
Subsequently, the cutting table 4 is returned from the stop position S3 to the standby position S1. The washing of the one side including the cleaning by the
According to the present embodiment, in the
In addition, according to the present embodiment, it is possible to perform the cleaning by the combination of the physical cleaning by the
[Example 2]
Subsequently, as shown in Fig. 4 (b), the aggregate G1 at the left end of the cut-off
4 (c), at the cleaning position S2, the cutting table 4 is further moved linearly in the -Y direction. The surfaces of the aggregates G2, G3, and G4 are sequentially rubbed along the direction from the aggregate G1 toward the aggregate G4 by the
Then, as shown in Fig. 4 (d), the cutting table 4 is stopped at the stop position S3. The injection of the
Next, as shown in Fig. 5A, the cutting table 4 is rotated 180 degrees by using the
Then, as shown in Fig. 5 (b), the aggregate G4 at the left end of the cut-off
5 (c), at the cleaning position S2, the cutting table 4 is further moved linearly in the -Y direction. The surfaces of the aggregates G3, G2 and G1 are sequentially rubbed along the direction from the aggregate G4 toward the aggregate G1 by the
Subsequently, as shown in Fig. 5 (d), the cutting table 4 is stopped at the stop position S3. The injection of the
According to the present embodiment, in the
[Example 3]
A cutting apparatus according to a third embodiment of the present invention will be described with reference to Figs. 6A, aggregates G1, G2, G3, and G4 are arranged in order from the closest to the cleaning position S2 in the standby position S1, as in the second embodiment. First, the
Subsequently, as shown in Fig. 6 (b), the aggregate G1 at the left end of the cut-off
Subsequently, as shown in Fig. 6C, the cutting table 4 is linearly moved from the stop position S3 to the cleaning position S2 in the + Y direction. In the cleaning position S2, cleaning is performed in the order of the aggregates G4, G3, G2 and G1 by the
Subsequently, as shown in Fig. 6 (d), the cutting table 4 is further moved in the + Y direction to stop at the waiting position S1. The
7 (a), after the cleaning by the
Subsequently, as shown in Fig. 7 (b), the spraying of the
Subsequently, as shown in Fig. 7C, the cutting table 4 is moved in the + Y direction from the stop position S3 toward the cleaning position S2. In the cleaning position S2, cleaning is performed in the order of the aggregates G4, G3, G2 and G1 by the
Then, as shown in Fig. 7 (d), the cutting table 4 is moved in the + Y direction to stop at the waiting position S1. The injection of the
According to this embodiment, in the
[Example 4]
A cutting apparatus according to a fourth embodiment of the present invention will be described with reference to Fig. The difference from the first to third embodiments is that the two
Subsequently, as shown in Fig. 8B, the
Subsequently, as shown in Fig. 8 (c), the cutting table 4 is moved in the + Y direction from the stop position S3 to the cleaning position S2. 8B in the order of the
8 (d), the cutting table 4 is further moved in the + Y direction to stop at the waiting position S1. The injection of the
According to the present embodiment, in the
In each embodiment, the speed at which the cutting table 4 is moved, the number of times the cutting table 4 is passed below the
The longitudinal direction of the cutting
In each of the embodiments, the case where the
Further, in each of the embodiments, the case where the sputtering
In each of the embodiments, the
In each of the embodiments, the lowering of the
This relative movement is rotational (including less than one rotation), either in the case of moving in one direction or in the case of reciprocating. There is a possibility that the object to be cut is difficult to be cleaned in the vicinity of the center of rotation when the relative movement is adopted in a rotational configuration. As a countermeasure to this problem, a linear movement and a rotational movement may be combined as a relative movement.
The moving
Further, in each of the embodiments, the example in which the
In each of the embodiments, the example in which the
Further, in each of the embodiments, there is shown a case where the sealed
Each of the scrub cleaning mechanism 12 (particularly, the sponge member 22), the
Further, in each of the embodiments,
The present invention is not limited to the above-described embodiments, and can be appropriately combined, changed, or selected as necessary, without departing from the gist of the present invention.
1: Cutting device
2: substrate feed mechanism
3: Sealed substrate (cut material)
4: Cutting table (table)
5: Moving mechanism (first moving mechanism, second moving mechanism)
6: Rotation mechanism
7A, 7B: Spindle
8A, 8B: rotary blade (cutting means)
9: Cutting completed substrate (aggregate having a plurality of regions)
10: Cleaning device
11: Cleaning mechanism
12: Scrub cleaning device
13, 13A, 13B: jet cleaning mechanism
14: Drying apparatus
15: Cleaning roller
16: Stage for inspection
17: Camera for inspection
18: Index table
19: conveying mechanism
20: Good-quality tray
21: Trays for defective products
22: sponge member (cleaning member)
23: Cleaning water supply device
24: Washing water
25: Cleaning water supply passage
26, 26A, 26B: washing water (liquid)
27: Gas
28: sponge member (cleaning member)
29: injection hole
30: Feed hole
A:
B: substrate cutting unit
C: Inspection unit
D: receiving unit
P: Products
CTL:
G1, G2, G3, and G4:
S1: standby position
S2: Cleaning position
S3: Stop position
Claims (18)
A spray cleaning mechanism installed in the cleaning mechanism and spraying a second rinse water toward the one surface to clean the one surface,
A scrub cleaning mechanism installed in the cleaning mechanism and relatively advanced and retracted relative to the workpiece to clean the one surface;
A cleaning member provided at a lower portion of the scrub cleaning mechanism and made of a sponge member,
A cleaning water supply mechanism provided with a cleaning water supply passage for supplying the first cleaning water to the cleaning member;
And a second moving mechanism for relatively moving the table and the cleaning mechanism,
The scrub cleaning mechanism and the object to be cut are brought close to each other and the cleaning member is brought into contact with the one surface so that the table and the cleaning mechanism are relatively moved to be supplied to the cleaning member via the cleaning water supply passage, The sponge member containing the first washing water rubs the one side of the sponge member in a state in which the first washing water contained in the member is pushed out of the surface of the sponge member and fed onto the one side, And is cleaned.
Wherein the cleaning member has a length at least equal to or greater than the width dimension of the aggregate.
Characterized in that the cleaning member has a urethane sponge or a PVA sponge.
And the table and the cleaning mechanism are relatively moved a plurality of times.
Characterized in that the spray cleaning mechanism has an object nozzle for mixing a gas and a liquid and spraying the mixture.
And a drying mechanism installed in the cleaning mechanism and drying the one surface by spraying a gas toward the one surface of the material to be cut.
Wherein the object to be cut is a sealed substrate.
Characterized in that the material to be cut is a substrate in which functional devices are formed in a plurality of regions respectively corresponding to the plurality of products.
Wherein the step of cleaning the one surface comprises:
A step of cleaning the one surface with the second washing water by spraying a second washing water from the spray cleaning mechanism provided in the washing mechanism toward the one surface,
A step of relatively moving the table and the scrub cleaning mechanism provided in the cleaning mechanism,
Supplying a first rinse water to a rinse member made of a sponge member provided at a lower portion of the scrub rinse apparatus through a rinse water supply passage provided in the rinse water supply mechanism;
Bringing the cleaning member into contact with the workpiece to bring the cleaning member into contact with the one surface;
And a step of relatively moving the cleaning member and the table while the cleaning member is in contact with the one surface,
Wherein the first cleaning water contained in the sponge member is pushed from the surface of the sponge member by being supplied to the cleaning member via the cleaning water supply passage in the step of relatively moving the cleaning member and the table, Wherein the one surface is cleaned by rubbing the one surface of the sponge member containing the first cleansing water in a state that the surface is supplied on the surface.
Wherein the cleaning member has a length at least equal to or greater than the width dimension of the aggregate.
Wherein the cleaning member has a urethane sponge or a PVA sponge.
Wherein the cleaning mechanism and the table are relatively moved a plurality of times in the step of relatively moving the cleaning member and the table.
2. A cutting method according to claim 1, wherein, in the step of cleaning the one surface by using the liquid, the gas and the liquid are mixed and injected from the spray cleaning mechanism toward the one surface.
And drying the one surface by spraying a gas toward the one surface from a drying mechanism provided in the cleaning mechanism.
Wherein the object to be cut is a sealed substrate.
Wherein the object to be cut is a substrate in which functional devices are formed in a plurality of regions respectively corresponding to the plurality of products.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2014-215266 | 2014-10-22 | ||
| JP2014215266A JP2016082195A (en) | 2014-10-22 | 2014-10-22 | Cutting device and cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160047397A KR20160047397A (en) | 2016-05-02 |
| KR101793337B1 true KR101793337B1 (en) | 2017-11-20 |
Family
ID=55831103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150145374A KR101793337B1 (en) | 2014-10-22 | 2015-10-19 | Cutting device and cutting method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016082195A (en) |
| KR (1) | KR101793337B1 (en) |
| CN (1) | CN105551996B (en) |
| TW (1) | TWI593002B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018164964A (en) * | 2017-03-28 | 2018-10-25 | Ｔｏｗａ株式会社 | Resinoid wheel, method of manufacturing the same, and processing device |
| JP6866217B2 (en) * | 2017-04-21 | 2021-04-28 | 株式会社ディスコ | Cutting equipment |
| JP6973922B2 (en) * | 2017-09-08 | 2021-12-01 | 株式会社ディスコ | Wafer processing method |
| JP6990588B2 (en) * | 2018-01-05 | 2022-01-12 | 株式会社ディスコ | Cutting equipment |
| JP7161411B2 (en) * | 2019-01-15 | 2022-10-26 | 株式会社ディスコ | drying mechanism |
| JP7154195B2 (en) * | 2019-07-26 | 2022-10-17 | Ｔｏｗａ株式会社 | CUTTING DEVICE AND CUTTING PRODUCT MANUFACTURING METHOD |
| WO2021132133A1 (en) * | 2019-12-26 | 2021-07-01 | ヤマハロボティクスホールディングス株式会社 | Semiconductor chip cleaning method and semiconductor chip cleaning device |
| JP7394712B2 (en) * | 2020-06-24 | 2023-12-08 | Ｔｏｗａ株式会社 | Cutting device and method for manufacturing cut products |
| JPWO2022091451A1 (en) * | 2020-10-26 | 2022-05-05 | ||
| KR102617780B1 (en) * | 2020-11-19 | 2023-12-26 | 세메스 주식회사 | Apparatus for blowing air in semiconductor strip sawing and sorting equipment |
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| JP5325003B2 (en) * | 2009-04-16 | 2013-10-23 | 株式会社ディスコ | Grinding equipment |
| JP5866227B2 (en) * | 2012-02-23 | 2016-02-17 | 株式会社荏原製作所 | Substrate cleaning method |
| JP6265702B2 (en) * | 2012-12-06 | 2018-01-24 | 株式会社荏原製作所 | Substrate cleaning apparatus and substrate cleaning method |
| JP6172957B2 (en) * | 2013-02-04 | 2017-08-02 | 株式会社ディスコ | Cleaning device |
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2014
- 2014-10-22 JP JP2014215266A patent/JP2016082195A/en active Pending
-
2015
- 2015-08-12 TW TW104126197A patent/TWI593002B/en active
- 2015-08-21 CN CN201510516440.7A patent/CN105551996B/en not_active Expired - Fee Related
- 2015-10-19 KR KR1020150145374A patent/KR101793337B1/en active IP Right Grant
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| JP2007194367A (en) * | 2006-01-18 | 2007-08-02 | Tokyo Seimitsu Co Ltd | Washing apparatus, and dicing equipment provided therewith |
| JP2009218397A (en) * | 2008-03-11 | 2009-09-24 | Towa Corp | Method and device for cutting substrate |
| JP2009253160A (en) * | 2008-04-09 | 2009-10-29 | Towa Corp | Method and device for cutting substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105551996A (en) | 2016-05-04 |
| CN105551996B (en) | 2019-01-25 |
| KR20160047397A (en) | 2016-05-02 |
| TW201615347A (en) | 2016-05-01 |
| JP2016082195A (en) | 2016-05-16 |
| TWI593002B (en) | 2017-07-21 |
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