JP2009218397A - Method and device for cutting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently improve productivity of a product (a package 5) formed by cutting along a cutting line 4 of a formed substrate 1. <P>SOLUTION: By using a cutting device 9 for a substrate having two cutting tables 17 (17a, 17b), in a substrate mounting position 24, the formed substrate 1 mounted on one cutting table 17a is aligned by an alignment mechanism 27 to set the cutting line 4, and further, almost at the same time as this, at a substrate cutting position 25, first, the cutting line 4 of the formed substrate 1 mounted on the other cutting table 17b is cut by a first cutting mechanism 28 (an integrated cutting/detecting means 62) and a second cutting mechanism 29 to form a cutting groove (a kerf) 58, and further the width of the cutting groove 58 is detected (kerf check) by a kerf check mechanism 59 (an integrated cutting/detecting means 62). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate cutting method for cutting a molded substrate in which a plurality of required electronic parts such as ICs are collectively sealed with a resin material into individual packages (pieces) and an improvement of the apparatus. It is.

  Conventionally, by using a substrate cutting apparatus that employs a single table method, a required portion of a molded substrate is cut by a cutting mechanism (cutting mechanism) such as a blade (circular rotary cutting blade), so that each individual A package is formed, and this cutting is performed as follows.

That is, first, at the substrate mounting position of this apparatus, the molded substrate 1 is supplied and set on the mounting surface of a cutting table (mounting rotary table for cutting) with its ball surface 1a facing up and fixed by suction. At the same time, the ball surface (substrate surface) 1a of the molded substrate 1 is aligned [see FIG. 6 (1) for the molded substrate 1 and FIG. 6 (2) for the package 5].
At this time, the alignment mark (alignment mark) provided on the ball surface 1a of the molded substrate 1 is aligned by the detection mechanism, and the required cutting line 4 is set.
Next, the cutting table on which the molded substrate 1 is placed is moved to the substrate cutting position, and at the substrate cutting position, the cooling water is sprayed to the cutting portion, so that the cutting set on the molded substrate by the cutting mechanism The individual package 5 (1c) which becomes a cut substrate (package assembly) can be formed by cutting the line.
At this time, a cutting kerf having a required groove width (a cutting groove 58 having a required width) is formed at the position of the cutting line 4 on the substrate by the cutting mechanism.
Accordingly, the cutting table on which the cut substrate 5 (1c) is placed is moved back to the substrate mounting position, and the groove width (cutting) of the cut kerf formed on the cut substrate 5 (1c) is returned. The width of the groove 58 is kerf-checked (kerf detection) by a detection mechanism.
Conventionally, at the substrate mounting position in the substrate cutting apparatus, the alignment mark alignment and the kerf check of the width of the cutting groove 58 are combined and performed by a single detection mechanism.

JP 2003-166867 A

By the way, in recent years, in a substrate cutting apparatus, the yield of products (packages) can be improved efficiently, and the number of products (packages) produced per hour can be improved efficiently, thereby efficiently cutting formed substrates. Has become an issue.
That is, it has been demanded to efficiently improve the productivity of products (packages) cut from molded substrates.
However, as described above, in the conventional cutting apparatus, the alignment and the kerf check are performed by using one detection mechanism at the substrate mounting position. Cannot be formed, and the productivity of the product (package) cannot be improved efficiently.

  Accordingly, an object of the present invention is to provide a substrate cutting method and apparatus capable of efficiently improving the productivity of a product (package).

The present invention adopts a twin table (two cutting tables) system in order to efficiently improve the productivity of a product (package).
Further, the present invention is a substrate cutting apparatus adopting a twin table method, aligns the alignment mark of the molded substrate placed on one of the two cutting tables at the substrate placement position, and At the same time, the width of the cutting groove formed on the formed substrate placed on the other cutting table at the substrate cutting position is kerf-checked, so that alignment and kerf check are performed (roughly) at the same time. The number of products (packages) produced can be improved efficiently.
Furthermore, the present invention is configured such that a cut substrate (individual package) subjected to kerf check can be cleaned by a cleaning section provided between the substrate cutting position and the substrate mounting position.

That is, when the molded substrate is cut by one cutting table, the molded substrate can be aligned or the cut individual packages can be cleaned at the other cutting table.
Moreover, when aligning a molded substrate with one cutting table, at the same time, the molded substrate can be cut on the other table, or individual cut packages can be cleaned.
For this reason, in the two cutting tables, it is comprised so that a molded board | substrate can be cut | disconnected efficiently each separately.
Therefore, the present invention can efficiently cut a molded substrate and efficiently improve the productivity of a product (package).

Moreover, this invention is a structure which uses the integrated cutting | disconnection detection means formed by integrating the cutting | disconnection mechanism and the kerf check mechanism (calf detection mechanism).
That is, according to the present invention, at the substrate cutting position, first, the integrated cutting detection means (cutting mechanism) is moved relative to the cutting direction, and the cutting mechanism cuts one cutting line on the molded substrate. Immediately after forming one cutting groove corresponding to the line, the integrated cutting detection means (kerf check mechanism) is relatively moved in a direction (check direction) opposite to the cutting direction to determine the cutting groove. The width can be kerf-checked (in the past, at the substrate cutting position, only one cutting groove corresponding to the cutting line was formed by the cutting mechanism).
In addition, as described above, since the present invention is configured to kerf-check the width of this one cutting groove immediately after forming one cutting groove, the time for the relative movement of the cutting mechanism. Can be efficiently reduced, and the time for cutting the molded substrate can be shortened.
Therefore, as described above, the present invention reduces the time for cutting the molded substrate as described above, compared to the configuration in which all the cutting grooves are formed and then the widths of all the cutting grooves are detected as shown in the conventional example. Therefore, the productivity of the product (package) can be improved efficiently.

  In the substrate cutting method according to the present invention for solving the technical problem, a substrate cutting device is used to first place a molded substrate on a cutting table at a substrate placement position of the above-described device. The substrate cutting method of moving the substrate to the substrate cutting position of the apparatus and then cutting the molded substrate at the above-described substrate cutting position with the cutting mechanism in a state of being placed on the above-described cutting table First, in the above-described substrate mounting position, by aligning the above-described molded substrate with an alignment mechanism, a cutting line is set in the above-described molded substrate, and then, in the above-described substrate cutting position, The kerf check mechanism detects the width of the cutting groove formed by cutting the cutting line with the cutting mechanism.

  Moreover, the substrate cutting method according to the present invention for solving the technical problem described above uses a substrate cutting device to first place the molded substrate on the cutting table at the substrate mounting position of the device described above. Then, the substrate is moved to the substrate cutting position of the apparatus described above, and then the package is formed by cutting with the cutting mechanism while the molded substrate is placed on the cutting table described above at the substrate cutting position. In the above-described substrate placement position, by aligning the above-described molded substrate with an alignment mechanism, by setting a cutting line on the above-described molded substrate, and at the above-described substrate cutting position, A step of forming a cutting groove corresponding to the cutting line on the molded substrate by cutting the cutting line of the molded substrate described above with the cutting mechanism described above; In the cutting position, a step of detecting the width of the cutting groove formed in the above-described molded substrate with a kerf check mechanism is performed, and the above-described cutting mechanism is relatively moved in the cutting direction during the cutting process of the above-described cutting line. Cutting the cutting line as described above, and moving the kerf check mechanism relatively in the direction opposite to the cutting direction described above during the process of detecting the width of the cutting groove as described above. The width is detected by the kerf check mechanism described above.

  In addition, the substrate cutting method according to the present invention for solving the technical problem uses a substrate cutting apparatus having two cutting tables, and each of the above-described two cutting tables is an apparatus described above. In each of the above-described cutting tables, first, the molded substrate is placed on the above-described cutting table at the above-described substrate mounting position, and then the above-described cutting table is moved to the substrate cutting position. A substrate cutting method for forming a package by cutting with a cutting mechanism in a state where the above-described molded substrate is placed on the above-described cutting table at the substrate cutting position, and in each of the above-described cutting tables, At the above-described substrate mounting position, the above-described molded substrate is aligned by an alignment mechanism to set a cutting line on the above-described molded substrate, and then the above-described substrate cutting In the position, and it performs a process of detecting a width of the cutting grooves formed by the above-mentioned cutting mechanism in kerf check mechanism.

  Further, the substrate cutting method according to the present invention for solving the technical problem described above is performed when each of the molded substrates placed on the two cutting tables is cut by the cutting mechanism. Each of the cutting tables is individually rotated at a required angle with the eccentric position of the cutting table as a center position of rotation.

  Further, a substrate cutting apparatus according to the present invention for solving the technical problem described above includes a cutting mechanism for cutting a required portion of a molded substrate, a cutting table for mounting the molded substrate, and the above-described cutting device. A substrate cutting apparatus having a reciprocating means for reciprocating a cutting table between a substrate mounting position and a substrate cutting position, wherein the cutting table is placed on the cutting table at the substrate mounting position. In addition to providing an alignment mechanism for aligning the substrate, a kerf check mechanism for detecting the width of the cutting groove formed by cutting the molded substrate with the cutting mechanism described above at the substrate cutting position is provided. And

  Further, a substrate cutting apparatus according to the present invention for solving the technical problem described above is characterized by comprising an integrated cutting detection means in which the cutting mechanism and the calf check mechanism are integrated. .

  In addition, a substrate cutting apparatus according to the present invention for solving the technical problem described above is configured by providing an integrated cutting detection means in which the cutting mechanism and the kerf check mechanism are integrated, and the above-described integration. The cutting mechanism and the kerf check mechanism in the chemical cutting detection means are arranged so as to be arranged on a cutting line cut by the cutting mechanism.

  In addition, a substrate cutting apparatus according to the present invention for solving the technical problem described above is characterized in that two cutting tables as described above are provided.

  Further, the substrate cutting apparatus according to the present invention for solving the technical problem described above is provided with a rotation mechanism that rotates the eccentric position of the cutting table at a required angle with the eccentric position of the cutting table. Features.

  Further, a substrate cutting apparatus according to the present invention for solving the above technical problem is a two-fluid mixed solution in which air and water are mixed on the surface of a package formed by cutting with the cutting mechanism described above. This is characterized in that a broken material removal mechanism for removing broken material attached to the package surface by spraying is provided.

  According to the present invention, there is an excellent effect that it is possible to provide a substrate cutting method and apparatus that can efficiently improve the productivity of a product (package).

The present invention will be described in detail with reference to the drawings.
1 and 2 show a substrate cutting apparatus according to the present invention.
FIG. 3 (1) and FIG. 3 (2) are integrated cutting detection means integrated with the cutting mechanism and the kerf check mechanism (kerf detection mechanism) according to the present invention.
FIG. 4 shows an integrated cutting detection means (calf check mechanism) according to the present invention.
5 (1), FIG. 5 (2), and FIG. 5 (3) show a cutting state and a kerf check state performed by the integrated cutting detection unit according to the present invention.
FIG. 6 (1) is a molded substrate (cut substrate) used in the present invention, and FIG. 6 (2) is a package cut by the substrate cutting apparatus according to the present invention.

(About molded substrate and package used in the present invention)
Further, as shown in FIG. 6A, the molded substrate 1 is configured such that a ball surface (substrate surface) 1a and a mold surface 1b which is the opposite surface are provided as surfaces.
Further, the molded substrate 1 is configured by being provided with a substrate 2 and a resin molded body 3 provided on the mold surface (resin surface) 1a side of the molded substrate 1 (substrate 2). A cutting line 4 is set on the ball surface (substrate surface) 1a side of the substrate 1 (substrate 2).
Further, by cutting the molded substrate 1 along the cutting line 4, a cutting groove having a required width corresponding to the cutting line 4 (a cutting kerf having a required groove width) is formed on the ball surface 1 a of the molded substrate 1. ) Is formed.
Further, as shown in FIG. 6 (2), the package 5 formed by cutting the cutting line 4 of the molded substrate 1 is separated from the ball surface 5a and the surface opposite to the ball surface 5a. And a mold surface 5b.
Further, the package 5 includes a substrate portion 6 and a resin portion 7 provided on the mold surface 5a side of the package 5 (substrate portion 6).
In addition, a ball electrode 8 may be formed on the ball surface 5a (1a) side of the substrate portion 6 (substrate 2).
Further, in FIG. 6A, an assembly of individual packages 5 (appearance is the same size as the molded substrate 1), which is a cut substrate 1c cut and separated from the molded substrate 1, is denoted by reference numeral 5 ( 1c).
Therefore, as will be described later, individual packages 5 (1c) can be formed by cutting the molded substrate 1 using the substrate cutting device (9) according to the present invention.
In FIG. 6 (1), 4a is a long-side cutting line (cut in the first direction) corresponding to the long side of the rectangular shaped substrate 1 in a parallel state, and 4b is a short side. It is a cutting line in the short side direction corresponding to the parallel state (cutting part in the second direction).
In addition, if it mentions in relation to the direction of this cutting line (cutting part), the cutting line (4) which cut | disconnects the shaping | molding board | substrate 1 is set to arbitrary directions, for example, various directions (for example, 1st Or the second direction).

(Regarding the configuration of the substrate cutting apparatus according to the present invention)
That is, as shown in FIG. 1, a substrate cutting apparatus 9 according to the present invention includes a substrate loading unit A for loading a molded substrate 1 and a molded substrate 1 transferred from the substrate loading unit A. Inspection of package cutting unit B to be cut (separated) into package 5 (cut substrate 1c), and individual package 5 cut by substrate cutting unit B to be visually inspected and classified into good products and defective products The unit C and a package accommodation unit D for accommodating the packages inspected and sorted by the package inspection unit C into good and defective products in trays.

Therefore, the molded substrate 1 loaded in the substrate loading unit A is first transferred to the substrate cutting unit B and cut into individual packages 5, and then the cut individual packages 5 are converted into package inspection units. While being inspected and selected by C, the package 5 can be separately accommodated as a good product and a defective product by the package accommodation unit D.
Further, the substrate cutting apparatus 9 according to the present invention is configured such that the units A, B, C, and D described above can be detachably connected in series in this order and installed. ing.
Moreover, in the board | substrate cutting device 9 which concerns on this invention, it is comprised so that each unit A * B * C * D can be connected detachably with the connector 10, for example.
Further, in the substrate cutting device 9 shown in FIG. 1, 9a is a front surface of the device, and 9b is a rear surface of the device.

(About the configuration of the cutting unit of the package according to the present invention)
That is, as shown in FIG. 2, the substrate cutting unit B includes a substrate alignment mechanism 11 that aligns the molded substrate 1 in a required direction and a substrate cutting mechanism 12 that cuts the molded substrate 1. It is provided and configured.
Therefore, first, the molded substrate 1 supplied from the substrate loading unit A side is aligned in a required direction by the substrate alignment mechanism unit 11 and supplied to the substrate cutting mechanism unit 12, and then the substrate cutting mechanism. The molded substrate 1 can be cut by the portion 12.
The substrate cutting device 9 (substrate cutting unit B) according to the present invention employs a twin table (two cutting tables 17) system.

(Regarding the configuration of the substrate alignment mechanism)
That is, as shown in FIG. 2, the substrate alignment mechanism unit 11 includes a substrate supply base 13 that supplies the molded substrate 1 from the substrate loading unit A, and a molded substrate 1 that is supplied to the substrate supply base 13. And a substrate rotation alignment means 14 for supplying and setting the molded substrate 1 aligned in a required direction by rotating at a required angle (for example, 90 degrees) to the substrate cutting mechanism 12 side. Is configured.
Accordingly, the molded substrate 1 is first supplied and set from the substrate loading unit A to the substrate supply table 13, and then the molded substrate 1 is engaged from the substrate supply table 13 by the substrate rotation alignment means 14. The molded substrate 1 is arranged so as to be aligned in a required direction and supplied to the substrate cutting mechanism 12 side by being lifted up and rotated at a required angle.

(Regarding the configuration of the substrate cutting mechanism)
That is, as shown in FIG. 2, the substrate cutting mechanism unit 12 has an individualization line that is a production line in the cutting apparatus 9 (substrate cutting unit B) for substrate cutting (substrate individualization). Are arranged in two sets (two lines).
Further, these two sets of individualized lines are arranged in parallel with the Y direction, and the arrangement positions thereof substantially coincide with a moving area 26 of the cutting table 17 described later.
In the example shown in FIG. 2, with respect to two sets of individualized lines (movement area 26 of the cutting table 17), the first individualized line (movement of the first cutting table 17 a) is on the left side. A set of areas 26a) is arranged, and a set of second singulated lines (moving area 26b of the second cutting table 17b) is arranged on the right side.
Further, the substrate cutting mechanism 12 includes the substrate mounting means 15 and the substrate mounting means 15 in each of the first and second singulation lines (the moving area 26 of the cutting table 17). Reciprocating means 16 for reciprocating and guiding in the Y direction is provided.
Further, the substrate cutting mechanism 12 is provided with a substrate mounting position 24 and a substrate cutting position 25, and the reciprocating means 16 moves the substrate mounting means 15 (cutting table 17) to Y. It is configured to be able to reciprocate in the direction.
Accordingly, in the first singulation line 26a, the first substrate mounting means 15a (first cutting table 17a) is moved between the substrate mounting position 24 and the substrate cutting position 25 by the first reciprocating movement means 16a. It is comprised so that can be reciprocated.
Further, in the second singulation line 26b, the second substrate placing means 15b (second cutting table 17b) is moved between the substrate placing position 24 and the substrate cutting position 25 by the second reciprocating means 16b. It is comprised so that can be reciprocated.
Regarding the constituent members related to the singulation line (moving region 26) in the substrate cutting mechanism 12, the subscript “a” is attached to the first and the subscript “b” is attached to the second. Is.

(About cutting table)
That is, as shown in FIG. 2, the substrate placing means 15 (the first substrate placing means 15a and the second substrate placing means 15b) has the molded substrate 1 with the mold surface 1a on the lower surface. Alternatively, a cutting table (mounting rotary table for cutting) 17 (17a, 17b) to be placed is provided with the substrate surface 1b being the upper surface.
Further, as shown in FIG. 4, the molded substrate 1 placed on the cutting table 17 (17a, 17b) is sucked and fixed to the cutting table 17 (first cutting table 17a, second cutting table 17b). A suction hole 51 (first suction hole 51a, second suction hole 51b) and a vacuuming mechanism 52 (first vacuuming mechanism 52a, second vacuuming mechanism 52b) such as a vacuum pump are provided. Has been.
Further, as shown in FIG. 4, the cutting table mounting surface 20 (first table mounting surface 20a, second table mounting surface 20b) has a cutting mechanism such as a blade (rotary cutting blade) described later. Table grooves 53 (first table grooves 53a and second table grooves 53b) corresponding to the first cutting mechanism 28 and the second cutting mechanism 29 are provided.
Moreover, as shown in FIG. 4, the mounting surface of the cutting table is located at the position of the cutting line 4 (4a, 4b) set on the molded substrate 1 supplied and set to the table mounting surface 20 (20a, 20b). 20 (first table placement surface 20a, second table placement surface 20b) are configured so that the positions of the table grooves 53 (53a, 53b) coincide with each other.
Therefore, first, the molded substrate 1 aligned by the rotary alignment means 14 on the table mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) is cut into the cutting line 4 (4a) of this molded substrate 1. 4b) is supplied and set in a state where it matches the position of the table groove 53 (53a, 53b), and then air is forced from the suction holes 51 (51a, 51b) by the vacuuming mechanism 52 (52a, 52b). Thus, the molded substrate 1 can be adsorbed and fixed on the table mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b) on the mold surface 1a side by suction and discharge. It is configured.

(Eccentric rotation of cutting table)
Further, on the lower end side of the cutting table 17 (17a, 17b), the cutting table 17 (17a, 17b) is an eccentric position set on the mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b). Rotation mechanism that rotates (eccentric rotation) the cutting table 17 (17a, 17b) at a required angle (for example, at an angle of 90 degrees) with 21 (21a, 21b) as the center of rotation (Not shown) is provided.
Accordingly, the eccentric position 21 (21a, 21b) is set to the center position of rotation by the rotation mechanism in a state where the molded substrate 1 is sucked and fixed to the table mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b). In this way (as an axial center position of the rotating shaft), it can be rotated (eccentrically rotated) in a required direction at a required angle.

(About the eccentric position of the cutting table)
As described above, in the present invention, the eccentric position 21 (21a, 21b) on the mounting surface 20 (20a, 20b) of the cutting table 17 is set as the rotation center position.
The eccentric position 21 (21a, 21b) of the cutting table 17 (17a, 17b) is a position excluding the central position on the mounting surface 20 (20a, 20b) of the cutting table 17 (17a, 17b).
In addition, for example, with respect to the eccentric position 21 (21a, 21b) of the rectangular cutting table 17 (17a, 17b), a rectangular mounting surface composed of long sides and short sides in the cutting table 17 (molded substrate 1). 20 (20a, 20b) can be set on a perpendicular formed by connecting the positions of the intermediate points of the short sides and parallel to the long sides (except for the center position of the table mounting surface).

(Regarding the proximity state of the first and second cutting tables)
Further, for example, the first cutting table 17a and the second cutting table 17b are configured such that their long side directions are parallel to the Y direction.
Further, for example, the molded substrate 1 placed on the first cutting table 17a and the molded substrate 1 placed on the second cutting table 17b are in a state in which the long side direction is parallel to the Y direction. It is comprised so that it may become.
Accordingly, the first cutting table 17a and the second cutting table 17b are adjacent to each other, and are configured to have a minimum distance 33 between adjacent positions.
In this state, the first cutting table 17a and the second cutting table 17b can reciprocate between the substrate placement position 24 and the substrate cutting position 25 without colliding (interfering) with each other. It is configured as follows.
Therefore, the 1st cutting table 17a and the 2nd cutting table 17b are provided in the position which cannot be arrange | positioned in close proximity any more than this, and is comprised.
Note that the first cutting table 17a and the second cutting table 17b are configured to be adjacent to each other and at the same time so as not to rotate with the eccentric position as the rotation center position, and the cutting tables 17 (17a and 17b) Is configured to be able to rotate so as not to collide (interfere).
In addition, the first cutting table 17a (second cutting table 17b) is in a single state at the substrate cutting position 25, and further in a state where the second cutting table 17b is not adjacent (for example, the second cutting table 17b). In the presence of the substrate mounting position 24), the eccentric position 21a can be rotated at a required angle around the center of rotation.
Therefore, as described above, since the first cutting table 17a and the second cutting table 17b are arranged close to each other and at the minimum interval 33 of the proximity position, (for example, at the center position of the cutting table). Compared with a device having a center position of rotation, the overall size of the substrate cutting device can be reduced efficiently.

(About bellows member and cleaning part)
Further, on both sides of the substrate mounting means 15 (15a, 15b) in the reciprocating direction, the substrate is reciprocated from cutting waste generated when the molded substrate 1 placed on the cutting table 17 (17a, 17b) is cut. A vertical wall-shaped bellows member 31 (31a, 31b) that protects the means 16 (16a, 16b) is provided to be extendable and contractible.
In addition, between the substrate placement position 24 and the substrate cutting position 25 in the moving area 26 (26a, 26b) of the cutting table 17 (17a, 17b), each package 5 (1c) cut at the substrate cutting position 25 is provided. A cleaning unit 30 is provided for cleaning and drying.
That is, in the moving area 26 (26a, 26b) of the cutting table, the molded substrate 1 (or individual package 5) is placed in a state where the vertical wall-shaped bellows member 31 (31a, 31b) is expanded or contracted. The cut table 17 (17a, 17b) can be reciprocated, and the individual package 5 (1c) cut at the substrate cutting position 25 can be cleaned and dried in the cleaning unit 30.
Therefore, the reciprocating means 16 (16a, 16b) can be protected by the longitudinal wall-shaped bellows member 31 (31a, 31b) that expands or contracts.

(About alignment mechanism)
Further, an alignment mark (alignment mark) provided on the molded substrate 1 (ball surface 1a) placed on the cutting table 17 (17a, 17b) is detected at the substrate placement position 24 in the substrate cutting mechanism section 12. Thus, (one) alignment mechanism 27 for setting (imaginarily) the cutting line 4 (4a, 4b) is provided.
Further, the substrate cutting mechanism 12 is provided with an alignment reciprocating mechanism 54 that reciprocates the alignment mechanism 27 in the X direction, Y direction, and Z direction (vertical direction) in the apparatus 9 (substrate cutting unit B). It is configured.
That is, since the alignment mechanism 27 is moved by the alignment reciprocating mechanism 54 and scanned, the molded substrates 1 placed on the two cutting tables 17 (17a, 17b) can be aligned individually. The cutting line 4 (cutting part) can be set separately on the molded substrate 1.
Therefore, the molded substrate 1 placed on the first cutting table 17a and the molded substrate 1 placed on the second cutting table 17b are aligned separately to form the cutting lines 4 (4a, 4b). Can be set.

(About cutting mechanism)
Further, as shown in FIGS. 2 and 3 (1), the cutting line 4 of the molded substrate 1 placed on the cutting table 17 (17 a, 17 b) is placed at the substrate cutting position 25 in the substrate cutting mechanism 12. Two cutting mechanisms (cutting mechanisms) having cutting blades (circular rotary cutting blades) or the like, that is, a first cutting mechanism 28 and a second cutting mechanism 29 are provided as cutting means for the molded substrate 1. Is configured.
That is, the first cutting mechanism 28 is configured with the first blade 63, and the second cutting mechanism 29 is configured with the second blade 64.
Further, the first cutting mechanism 28 and the second cutting mechanism 29 are provided with the first blade 63 and the second blade 64 facing each other at a predetermined interval (the blade surfaces are in parallel). Is configured.
Further, the axial direction of the spindle shaft that rotates these blades 63 and 64 separately is configured to be parallel to each other in the X direction.
Further, the first cutting mechanism 28 and the second cutting mechanism 29 are separated by reciprocating them both in the X direction, (relatively) in the Y direction, and in the Z direction (up and down direction). A mechanism reciprocating mechanism 55 is provided.
The first cutting mechanism 28 is configured with a first sliding connection member 60, and the second cutting mechanism 29 is configured with a second sliding connection member 61. Yes.
Therefore, the reciprocating mechanism 55 of the cutting mechanism moves the sliding connecting member 60 provided with the first cutting mechanism 28 having the first blade 63, that is, the first cutting mechanism 28 in the X direction (relative In addition, it is configured to be able to reciprocate in the Y direction and in the Z direction (vertical direction).
Further, the second sliding connecting member 61 provided with the second cutting mechanism 29 having the second blade 64 by the reciprocating mechanism 55 of the cutting mechanism, that is, the second cutting mechanism 29 in the X direction, It is configured such that it can be reciprocated in the Y direction (relatively) in the Z direction (up and down direction).

Also, the first blade 63 and the second blade 64 are moved by moving the first cutting mechanism 28 and the second cutting mechanism 29 separately in the X direction by the reciprocating mechanism 55 of the cutting mechanism. It is comprised so that it can set suitably at a required space | interval.
Therefore, for example, when the two cutting lines 4 in the molded substrate 1 placed on the first cutting table 17a are cut by the first cutting mechanism 28 and the second cutting mechanism 29, the two blades 63 are used. , 64 in a parallel state, the molded substrate 1 can be cut along the Y direction.
Similarly, the molded substrate 1 placed on the second cutting table 17b can be cut along the Y direction with the cutting directions of the two blades 63 and 64 in parallel. It is configured to be able to.

The first cutting mechanism 28 (or the second cutting mechanism 29) is provided with a cooling water injection mechanism 67 that injects cooling water onto the blade 63 (64).
In the example shown in FIG. 3 (2), the cooling water injection mechanism 67 is configured by providing a circular cooling pipe 68 at a side position of the blade 63, and on the peripheral side surface of the circular cooling pipe 68. A required number of injection holes (not shown) are formed.
Therefore, when the cutting line 4 of the molded substrate 1 is cut, the cooling water is sprayed from the injection holes of the cooling pipe 68 in the cooling water injection mechanism 67 to the blade 63 (circular side surface) to cool the blade 63. It is configured to be able to.

The first cutting mechanism 28 (or the second cutting mechanism 29) is provided with a cutting water injection mechanism 69 that injects cutting water onto the blade 63 (64).
In the example shown in FIG. 3B, a cutting water injection mechanism 69 is provided on the device front surface 9a side of the blade 63 (along the cutting direction of the blade 63).
Therefore, when cutting the cutting line 4 of the molded substrate 1, the cutting water spray mechanism 69 can spray the cutting water onto the blade 63 (the cutting edge).

Further, when the molded substrate 1 is cut by the cutting mechanism 28 and the cutting mechanism 29 (blades 63 and 64), foreign matters such as broken materials (cutting chips) are generated on the molded substrate 1 (package 5).
This broken material (foreign matter) tends to adhere and remain on the surface of the package 5 (for example, the ball surface 5a), and the broken material may remain attached to the surface of the package 5 even after washing with cleaning water.
Therefore, it is required to efficiently remove the broken material from the surface (5a) of the package 5 after cleaning the package 5.
That is, the first cutting mechanism 28 (or the second cutting mechanism 29) is generated when the cutting line 4 of the molded substrate 1 is cut by the blade 63 (64) and is applied to the surface (5a) of the package 5. A debris removal mechanism (debris blowing mechanism) 70 that efficiently removes the remaining debris by blowing it off with a gas-liquid two-fluid mixture (water containing a large number of air bubbles) that is a mixture of air and water. It is provided and configured.
In the example shown in FIG. 3 (2), the broken material removal mechanism 70 is provided on the apparatus front surface 9 a side of the blade 63, and the broken material removal mechanism 70 is disposed between the blade 63 and the cutting water injection mechanism 69. It is provided and sandwiched between the two.
That is, the cutting water injection mechanism 69 and the broken material removal mechanism 70 are provided in this order from the blade 63 side along the cutting direction of the blade 63 (in the Y direction).
Therefore, the broken material (foreign matter) generated when the cutting line 4 of the molded substrate 1 is cut with the blade 63 can be removed by being blown off by the broken material removing mechanism 70.

(About cutting grooves)
That is, as shown in FIG. 4, the cutting line 4 set on the molded substrate 1 placed on the cutting table 17 (17a, 17b) is changed by the first cutting mechanism 28 (first blade 63) or first. When cutting by the two cutting mechanisms 29 (second blade), a cutting groove (kerf) 58 having a required width 57 corresponding to the cutting line 4 in the Y direction can be formed on the molded substrate 1. it can.
In this case, since the cutting line 4 is cut in full cut, the blades 63 and 64 are placed in the table grooves 53 (53a and 53b) of the cutting table 17 (17a and 17b) corresponding to the position of the cutting line 4. The cutting edge can be entered.
Therefore, by cutting the cutting line 4 using the first cutting mechanism 28 and the second cutting mechanism 29, a cutting groove 58 (cutting groove) having a required width 57 corresponding to the cutting line 4 is formed. be able to.
In addition, when the cutting groove 58 having a required width 57 formed on the ball surface 1a in the molded substrate 1 (cut substrate 1c) is viewed in a plane, it is a single line in the Y direction.

(Calf check mechanism)
As shown in FIGS. 3A and 3B, the substrate cutting mechanism 12 has a groove width 57 of a cutting groove 58 formed by cutting the cutting line 4 of the molded substrate 1. A kerf check mechanism (kerf detection mechanism) 59 for detection is provided.
That is, the groove width 57 of the cutting groove 58 that forms one groove line in the Y direction formed on the ball surface 1a of the molded substrate 1 can be scanned and detected (inspected) using the kerf check mechanism 59. It is configured to be able to.
Therefore, it is possible to efficiently and accurately set the size (length and width) of the individual package 5 formed by cutting the molded substrate 1 to a required length, thereby forming each package. it can.
The kerf check mechanism 59 can detect (inspect) the groove width 57 of the cutting groove 58 and can detect the shape of the cutting groove (kerf) 58, for example, the chipping state of the cutting groove 58. It can be done.
Accordingly, the kerf check mechanism 59 can efficiently prevent chipping and the like from occurring in the shape of the cutting groove 58 (that is, in the shape of the package 5), and can provide a high quality and high reliability product (individual package). ) Can be obtained.

Further, the kerf check mechanism 59 has a foreign substance such as dust attached to the surface of each package 5 by pumping compressed air to the surface of the cut substrate 1C (individual package 5) to be inspected by the kerf check mechanism 59. An air blow mechanism 71 that blows off the air is provided.
That is, in the example shown in FIG. 3B, the air blow mechanism 71 is provided on the apparatus front surface 9a side of the kerf check mechanism 59.
Accordingly, the compressed air is pumped to the surface of the cut substrate 1c (5) by the air blow mechanism 71, so that foreign matters such as dust adhering to the surface of the package 5 (for example, the ball surface 5a) are ejected and removed. Can do.

(About integrated cutting detection means)
As shown in FIGS. 3A and 3B, in the first cutting mechanism 28, the cleaning unit 30 side of the first blade 63 (the reciprocating mechanism 55 side of the cutting mechanism or the device) A kerf check mechanism 59 is provided via a sliding connecting member 60 at a position on the front surface 9a side.
The kerf check mechanism 59 is installed on the cutting groove 58 (cutting line 4) formed by cutting the cutting line 4 of the molded substrate 1 with the first blade 63 (on the line in the Y direction). To be configured.
Accordingly, the first cutting mechanism 28 and the kerf check mechanism 59 are integrated and integrated by the sliding connection member 60 in a state where the first cutting mechanism 28 and the kerf check mechanism 59 are arranged on the cutting line 4 (cutting groove 58) of the molded substrate 1. As shown in FIG. 3B, the rotation direction of the first blade 63 of the first cutting mechanism 28 is clockwise.

Similarly to the first cutting mechanism 28, the integrated cutting detection means 62 is operated by the reciprocating mechanism 55 of the cutting mechanism in the X direction, the Y direction (the cutting table 17 side reciprocates), and the Z direction (vertical direction). ) Can be reciprocated.
Therefore, the first cutting mechanism 28 in the integrated cutting detection means 62 cuts the cutting line 4 formed on the molded substrate 1 to form a cutting groove 58 having a required width 57 corresponding to the cutting line 4. It is comprised so that it can form.

(About the arrangement of the cutting mechanism and kerf check mechanism in the integrated cutting detection means)
Further, as described above, the positions of the first cutting mechanism 28 and the kerf check mechanism 59 in the integrated cutting detection means 62 are, for example, as shown in FIG. It can be arranged on the cutting line 4 (cutting groove 58) of the molded substrate 1 cut by 28 (blade 63) (on the Y direction).
Therefore, when the cutting table 17 on which the molded substrate 1 is placed is reciprocated in the Y direction (on the cutting line 4), the first cutting mechanism 28 and the kerf check mechanism 59 are on the same line (cutting). It will reciprocate relatively on the line 4 or the cutting groove 58).
The relative movement of the molded substrate 1 (cutting table 17) and the cutting mechanisms 28 and 29 (calf check mechanism 59) will be described in detail later.
That is, first, by moving the integrated cutting detection means 62 relatively from the apparatus back surface 9b side to the apparatus front surface 9a side (by moving it relatively in the forward direction), the first in the integrated cutting detection means 62 is changed. The cutting line 4 can be cut in the Y direction which is the cutting direction 65 by the cutting mechanism 28 (blade 63).
Next, by moving the integrated cutting detection means 62 relatively from the device front surface 9a side to the device back surface 9b side (by moving relatively to the return direction opposite to the forward direction), The kerf check mechanism 59 in the integrated cutting detection means 62 is configured to detect the cutting groove 58 corresponding to the cutting line 4.
Accordingly, the kerf check mechanism 59 in the integrated cutting detection means 62 is configured to detect (kerf check) the width 57 of the cutting groove 58 formed corresponding to the cutting line 4.
In addition, as described above, since the present invention can efficiently perform the cutting of the single cutting line 4 and the kerf check, the integrated cutting detection means 62 (the first cutting mechanism 28 and the kerf check) can be performed. The time for the mechanism 59) to move relatively can be efficiently reduced, and the time for cutting the molded substrate 1 can be shortened.
For this reason, since the molded substrate 1 can be efficiently cut into individual packages 5, the number of products produced per hour can be improved efficiently.

(Relative movement of cutting mechanism, etc.)
Here, in relation to the cutting of the cutting line 4 and the detection of the width 57 of the cutting groove 58, the cutting table 17 (17a, 17a) for the integrated cutting detecting means 62, the cutting mechanisms 28, 29 and the kerf check mechanism 59 is described. (Refer to FIG. 5 (1), FIG. 5 (2), and FIG. 5 (3)).
That is, as described above, the cutting table 17 (17a, 17a) is configured to reciprocate in the Y direction by the reciprocating means 16 (16a, 16b).
For example, the front of the apparatus in which the first cutting mechanism 28 (including the kerf check mechanism 59) and the second cutting mechanism 29 are not moved in the Y direction, and the cutting table 17 (17a, 17b) is in the Y direction. The first cutting mechanism 28 and the second cutting mechanism 29 are moved separately from each other in the cutting direction 65, that is, in the direction from the apparatus back surface 9b side to the apparatus front surface 9a side. It can be set to the state moved automatically.
Further, for example, the first cutting mechanism 28 (including the kerf check mechanism 59) and the second cutting mechanism 29 are not moved in the Y direction, and the cutting table 17 (17a, 17b) is moved in the Y direction. The first cutting mechanism 28 (calf check mechanism 59) and the second cutting mechanism 29 are moved in a direction 66 opposite to the cutting direction 65, respectively, by moving from the apparatus rear surface 9b side to the apparatus front surface 9a side. That is, it can be set to a state in which it is relatively moved in the direction from the device front surface 9a side to the device back surface 9b side.
The cutting table 17 (17a, 17b) substantially reciprocates in the Y direction, so that the integrated cutting detecting means 62 performs cutting and detection.

(About cutting and detection by the integrated cutting detection means)
That is, by moving the integrated cutting detection means 62 relatively in the cutting direction 65 along the Y direction, the cutting line 4 in the molded substrate 1 is cut by the first cutting mechanism 28 (first blade 63). can do.
Further, the kerf check mechanism 59 corresponds to the cutting line 4 by moving the integrated cutting detection means 62 relatively in a direction 66 (check direction) opposite to the cutting direction along the Y direction. The width 57 of the formed cutting groove 58 can be detected.
Therefore, first, the integrated cutting detecting means 62 is moved in the cutting direction 65 relative to the integrated cutting detecting means 62 as a forward path (advanced state), so that the integrated cutting detecting means 62 makes one cutting line 4. Next, as the return path (reverse state) of the integrated cutting detection means 62, the integrated cutting detection means 62 is moved in a direction 66 that is relatively opposite to the cutting direction. Thus, the width 57 of one cutting groove 58 can be detected.

Next, cutting and detection by the integrated cutting detection means 62 according to the present invention will be described in detail with reference to FIGS. 5 (1), 5 (2), and 5 (3).
FIG. 5A shows a state before the substrate is cut by the integrated cutting detection unit 62, and FIG. 5B shows a state when the substrate is cut by the integrated cutting detection unit 62 (first cutting mechanism 28). FIG. 5 (3) shows the state when the substrate is detected by the integrated cutting detection means 62.
In this case, the cutting table 17 (17a, 17b) reciprocates in the Y direction, but the integrated cutting detecting means 62 does not move in the Y direction.

That is, first, as shown in FIG. 5 (1), before the substrate is cut, the molded substrate 1 placed on the cutting table 17 (17a, 17b) is moved from the apparatus front surface 9a side (cleaning unit 30 side) to the apparatus. It is moved along the Y direction toward the back surface 9b.
Next, as shown in FIG. 5 (2), when the substrate is cut, first, the integrated cutting detection means 62 is moved downward, and the integrated cutting detection means 62 is moved in the X direction. Thus, the cutting direction 65 that is the Y direction of the first blade 63 is matched with the (single) cutting line 4 in the Y direction set on the ball surface 1a of the molded substrate 1, The molded substrate 1 (cutting table 17) is moved from the apparatus front surface 9a side to the apparatus back surface 9b side along the Y direction (unmoved in the Y direction) so that the integrated cutting detection means 62 is relatively moved in the cutting direction 65. By moving, the cutting line 4 of the molded substrate 1 is relatively cut by the first blade 63 (first cutting mechanism 28) in the cutting direction 65 to correspond to the cutting line 4 (one). A cutting groove 58 having a required width 57 can be formed.
In this case, after the cutting line 4 is cut by the first blade 63, the integrated cutting detecting means 62 is moved up.
Next, as shown in FIG. 5 (3), when the substrate is detected, the molded substrate 1 (cutting table 17) is moved from the device back surface 9b side to the device front surface 9a side along the Y direction ( By moving the integrated cutting detection means 62 (which is immovable in the Y direction) in a direction 66 (check direction) that is relatively opposite to the cutting direction, the integrated cutting detection means 62 (kerf check mechanism 59) cuts the cutting line. The width 57 of the (one) cutting groove 58 corresponding to 4 can be detected.

  In addition, regarding the detection of the width 57 of the cutting groove 58 formed by cutting the cutting line 4 of the molded substrate 1 with the second cutting mechanism 29 (second blade 64), the second cutting mechanism 29 (second The width of the cutting groove 58 by the blade 64) can be detected by scanning in the Y direction with the integrated cutting detecting means 62 (kerf check mechanism 59).

(About substrate cutting method)
First, the molded substrate 1 is supplied and set from the substrate loading unit A to the substrate alignment mechanism unit 11 (substrate supply table 13) in the substrate cutting unit B, and the molded substrate 1 is set by the rotary alignment means 14 as required. Aligned in the direction and supplied to the mounting surface 20a (20b) of the first cutting table 17a (or the second cutting table 17b) present at the substrate mounting position 24.
At this time, the molded substrate 1 can be mounted on the table mounting surface 20a (20b) by suction and fixation.
Next, the first cutting table 17 a can be moved to the substrate cutting position 25 with the molded substrate 1 placed thereon.
At this time, the vertical wall-shaped bellows members 31a separately provided on both sides of the first cutting table 17a extend one of the first cutting table 17a as the first cutting table 17a moves, and reduce the other. become.
Next, the first cutting table 17a is rotated at a required angle (for example, an angle of 90 degrees) with the eccentric position 21a on the mounting surface 20a of the first cutting table 17a as the rotation center position.
At this time, the cutting line 4 (4b) in the short side direction in the molded substrate 1 can be cut using the first cutting mechanism 28 (integrated cutting detecting means 62) and the second cutting mechanism 29.
At this time, the kerf check mechanism 59 of the integrated cutting detection means 62 can detect the width 57 of the cutting groove 58 corresponding to the cutting line 4 (4b).
Next, the first cutting table 17a on which the molded substrate 1 cut along all of the cutting lines 4b in the short side direction is placed at a required angle in the opposite direction with the eccentric position 21a as the rotation center position. Rotate to return to the original position.
At this time, the cutting line 4 (4a) in the long side direction in the molded substrate 1 can be cut using the first cutting mechanism 28 (integrated cutting detecting means 62) and the second cutting mechanism 29.
At this time, the kerf check mechanism 59 of the integrated cutting detection means 62 can detect the width 57 of the cutting groove 58 corresponding to the cutting line 4 (4a).
Accordingly, individual packages 5 (cut substrates 1c) can be formed on the mounting surface 20a of the first cutting table 17a.
The molded substrate 1 placed on the placement surface 20b of the second cutting table 17b is the same as the case of the first cutting table 17a.

(Detection of groove width of cutting groove in substrate cutting method)
That is, at the substrate cutting position 25, as shown in FIG. 5 (1), the molded substrate 1 placed on the cutting table 17 (17a, 17b) is moved forward from the apparatus front surface 9a side to the apparatus rear surface 9b side. ) By moving, the integrated cutting detection means 62 (or the second cutting mechanism 29) provided with the first cutting mechanism 28 is relatively moved in the cutting direction 65.
Next, as shown in FIG. 5 (2), the integrated cutting detection means 62 (or the second cutting mechanism 29) provided with the first cutting mechanism 28 is moved down, and the first cutting mechanism 28 is moved downward. By moving the integrated cutting detecting means 62 (or the second cutting mechanism 29) provided with the cutting mechanism 28 relatively in the cutting direction 65, the first blade 63 (or the second blade 64) is used. The cutting line 4 (4a, 4b) of the molded substrate 1 can be cut to form a cutting groove 58 having a required width 57 corresponding to the cutting line 4 (4a, 4b).
Therefore, next, as shown in FIG. 5 (3), a molded groove having a cutting groove 58 placed on the cutting table 17 (17a, 17b) and formed by cutting the cutting line 4 (4a, 4b). By moving the substrate 1 from the apparatus rear surface 9b side to the apparatus front surface 9a side (reverse), the integrated cutting detection means 62 provided with the calf check mechanism 59 is moved in a direction 66 (check) that is relatively opposite to the cutting direction. Direction).
At this time, the width 57 of the cutting groove 58 can be detected (kerf check) by the kerf check mechanism 59 provided in the integrated cutting detection means 62.

In the embodiment described above, the integrated cutting detection means 62 is provided with a cutting groove 58 formed by cutting the cutting line 4 (4a, 4b) provided on the molded substrate 1 by the second cutting mechanism 29. It can be detected by the kerf check mechanism 59.
Further, in the above-described embodiment, at the substrate mounting position 24, the molded substrate 1 placed on the first cutting table 17a is aligned by the alignment mechanism 27 to set the cutting lines 4 (4a, 4b), and (Substantially) At the same time, at the substrate cutting position 25, the cutting line 4 (4a, 4b) of the molded substrate 1 placed on the second cutting table 17b is connected to the first cutting mechanism 28 (integrated cutting detecting means 62). The cutting groove 58 is formed by cutting with the second cutting mechanism 29, and the width 57 of the cutting groove 58 formed on the molded substrate 1 is detected (inspected) by the kerf check mechanism 59 (integrated cutting detecting means 62). can do.
For this reason, the alignment using the single table method of the conventional example and the kerf check including cutting are individually performed with the alignment using the twin table method of the present invention and the kerf check including cutting. According to the configuration provided in, the number of products (packages) produced per hour can be improved efficiently.

(About the effect)
In other words, the present invention is a substrate cutting device 9 adopting a twin table system (two cutting tables 17), and aligns the molded substrate 1 on the second cutting table 17a at the substrate mounting position 24. And (substantially) simultaneously, at the substrate cutting position 25, the cutting line 4 (4a, 4b) of the molded substrate 1 on the second cutting table 17b is cut to form the width 57 of the cutting groove 58. The width of the cutting groove 58 formed in the molded substrate 1 can be detected (inspected).
Accordingly, by adopting the twin table method (two cutting tables 17), the substrate mounting position 24 is aligned with the molded substrate 1 on one of the two cutting tables 17 at the substrate mounting position 24. Then, the cutting line 4 is set, and at the same time (substantially), at the substrate cutting position 25, the molded substrate 1 on the other cutting table 17 can be cut and detected.
In other words, by adopting the configuration of the twin table method (two cutting tables 17) and the configuration of performing (almost) simultaneous “alignment” and “detection including cutting”, the single table method shown in the conventional example is adopted. Compared to a configuration in which “alignment” and “detection” are combined with a single detection mechanism, “alignment” and “detection” are separately formed in the present invention. ) Can be efficiently cut and the molded substrate 1 can be cut efficiently.
Therefore, the productivity of the product (package) can be improved efficiently.

In addition, as described above, the present invention is a substrate cutting device 9 adopting a twin table system (two cutting tables 17), and is formed on the second cutting table 17a at the substrate mounting position 24. The finished substrate 1 is aligned, and (substantially) simultaneously, at the substrate cutting position 25, the cutting line 4 (4a, 4b) of the molded substrate 1 on the second cutting table 17b is cut to obtain the width of the cutting groove 58. 57 and the width of the cutting groove 58 formed in the molded substrate 1 can be detected (inspected).
For example, when the molded substrate 1 placed on one of the cutting tables 17a is cut (including the kerf check) at the substrate cutting position 25, the molded substrate 1 is supplied to the other cutting table 17b by the rotational alignment means 14. It can be set, placed and aligned.
For example, when the molded substrate 1 placed on one of the cutting tables 17a is cut (including the kerf check) at the substrate cutting position 25, first, the cut substrate 1c placed on the other cutting table 17b ( The package 5) is cleaned by the cleaning unit 30, and then, at the substrate mounting position 24, the individual packages mounted on the other cutting table 17b can be transferred to the inspection unit C side.
Further, for example, when the molded substrate 1 placed on one of the cutting tables 17a is aligned at the substrate placement position 24, the cleaned substrate 1c (package 5) placed on the other cutting table 17b is cleaned by the cleaning unit 30. Can be washed with.
For this reason, in the present invention, the number of products (packages) produced per hour by the substrate cutting device 9 provided with the two cutting tables 17 (17a and 17b), the alignment mechanism 27, and the kerf check mechanism 59. Since the molded substrate 1 can be cut efficiently, the productivity of the product (package) can be improved efficiently.

In the present invention, the integrated cutting detection means 62 can be formed by integrating the first cutting mechanism 28 and the kerf check mechanism 59.
Further, at the substrate cutting position 25, the cutting table 17 is moved forward from the apparatus front surface 9a side to the apparatus rear surface 9b side, so that the integrated cutting detection means 62 (first cutting mechanism 28) is moved relative to the cutting direction 65. The cutting table 17 is moved backward from the apparatus rear surface 9b side to the apparatus front surface 9a side immediately after the cutting line 4 is cut by the first cutting mechanism 28 to form the cutting groove 58. By moving the integrated cutting detection means 62 (kerf check mechanism 59) relative to the direction 66 opposite to the cutting direction, the width 57 of the cutting groove 58 can be detected.
That is, as shown in the conventional example, in the present invention, compared with the configuration in which the width of the cutting groove is detected after cutting the alignment and all cutting lines at the substrate mounting position, in the present invention, at the substrate cutting position 25. Since the width 57 of the cutting groove 58 corresponding to the single cutting line 4 can be detected immediately after cutting the single cutting line 4, the time for cutting the molded substrate 1 is shortened. And the productivity of the product (package) can be improved efficiently.

  In the above-described embodiment, the rotation center position of the cutting table 17 on which the molded substrate 1 is placed is set to the eccentric position 21 on the placement surface 20 of the cutting table 17, and two pieces are cut. Since the table 17 (17a, 17b) is provided in the proximity position (interval 33) so that it can be moved in parallel and moved in parallel, the overall size of the substrate cutting apparatus can be reduced efficiently. Can do.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.

(About the second integrated cutting detection means)
In the above-described embodiment, a configuration in which the kerf check mechanism 59 is attached to the first cutting mechanism 28 to form and use the (first) integrated cutting detection means 62 has been exemplified. A configuration may be adopted in which a kerf check mechanism 59 is attached to 29 to form a second integrated cutting detection means.
In this case, two integrated cutting detection means (62) are used to cut the cutting line of the substrate and detect the width of the cutting groove.
Therefore, in the present invention, it is possible to adopt a configuration using a plurality of required integral cutting detection means (62).

(Independent cutting mechanism and independent kerf check mechanism)
In the above-described embodiment, the configuration using the integrated cutting detection means 62 in which the cutting mechanism (28, 29) and the kerf check mechanism (59) are integrated has been exemplified. However, the required number of cutting mechanisms (28, 29) are exemplified. ) And the required number of kerf check mechanisms (59) can be provided independently of each other.
For example, it is possible to employ a configuration in which two cutting mechanisms and two kerf check mechanisms are provided independently of each other.
In this case, one cutting mechanism and one kerf check mechanism are independently provided exclusively for the cutting table 17a (molded substrate 1), and the cutting table 17b (molded substrate 1). One cutting mechanism and one kerf check mechanism can be provided independently and exclusively.

(About multiple alignment mechanisms)
In the above-described embodiment, the configuration using the single alignment mechanism 27 is illustrated, but a configuration using a plurality of required alignment mechanisms can be adopted.
In this case, for example, two alignment mechanisms can be employed, and the two cutting tables 17 (17a and 17b) can be provided separately and exclusively.

(About half-cut)
In the above-described embodiment, the configuration in which the cutting groove 58 is formed by full-cutting the cutting line 4 of the molded substrate 1 is illustrated. However, the groove depth (distance) of the cutting groove 58 is set to a required groove depth. Can be set.
For example, the cutting line 4 of the molded substrate 1 can be half cut to form a cutting groove having a required groove depth (for example, a half groove depth at the time of full cutting).

(About placement of molded substrates)
In the above-described embodiment, the configuration is shown in which the molded substrate 1 is supplied and set on the cutting table 17 with the ball surface 1a as the upper surface, but the molded substrate 1 is disposed on the cutting table 17 and the resin surface 1b is the upper surface. A configuration in which the cutting line is set by aligning and setting the resin surface 1b can be employed.

(About the configuration of other units)
That is, the substrate loading unit A includes a substrate loading unit 41 that loads the molded substrate 1 and an extrusion member 42 that pushes the molded substrate 1 from the substrate loading unit 41.
Therefore, the molded substrate 1 can be supplied to the substrate alignment mechanism unit 11 (substrate supply table 13) in the substrate cutting unit B by extruding the molded substrate 1 from the substrate loading unit 41 by the pushing member 42. It is configured as follows.
The package inspection unit C includes a package supply unit 43 that supplies individual packages 5 (cut substrates 1c) cut by the substrate cutting unit B, and individual packages 5 (1c) from the package supply unit 43. ) To inspect the individual packages 5 by the package inspection unit 44, and the packages 5 inspected by the package inspection units 44 and 45 are classified into good products and defective products. Package sorting means 46 for transferring to the package accommodation unit D is provided.
Accordingly, in the package inspection unit C, each package 5 (1c) supplied from the substrate cutting unit B to the package supply unit 43 is inspected by the camera 45 by the package inspection unit 44, whereby the package selection unit 46 is inspected. Thus, it can be sorted into non-defective products and defective products and transferred to the package accommodation unit D.
The package housing unit D includes a non-defective product tray 47 that stores non-defective products and a defective product tray 48 that stores defective products.
Therefore, in the package housing unit D, the package 5 inspected as a non-defective product by the package inspection unit C is stored in the non-defective product tray 47 by the package sorting means 46, and the package 5 inspected as a defective product is stored in the package sorting means 46. Can be accommodated in the defective product tray 48.

As described above, the package inspection unit C is a unit that inspects the package 5 cut from the molded substrate 1 with an inspection camera (inspection mechanism).
That is, in the inspection unit C, the ball surface 5a (including the package size) of the package 5 can be inspected first, and then the resin surface 5b of the package 5 can be inspected.
Furthermore, in the inspection unit C, the ball surface 5a of each package 5 (1c) is placed on the first plate with the ball surface 5a as the upper surface, and is reversed in this state, and is individually viewed by the inspection camera from the lower position. The ball surface 5a of the package 5 (1c) is inspected, and then the package 5 (1c) is placed on the second plate with the resin surface 5b of the package 5 (1c) as the upper surface, and this package 5 ( The resin surface 5b of 1c) can be inspected with an inspection camera.

FIG. 1 is a schematic plan view schematically showing a substrate cutting apparatus according to the present invention. FIG. 2 is an enlarged schematic plan view schematically showing an enlarged main part (package cutting unit) in the substrate cutting apparatus shown in FIG. FIG. 3 (1) is an enlarged schematic front view schematically showing an enlarged main part of the substrate cutting apparatus (package cutting unit) shown in FIG. 2, and FIG. 3 (2) is shown in FIG. 3 (1). It is an expansion schematic front view which expands and shows roughly the cutting mechanism (blade) and kerf check mechanism in the device principal part shown. FIG. 4 is an enlarged schematic longitudinal sectional view schematically showing an enlarged main part of the substrate cutting apparatus (package cutting unit) shown in FIG. 5 (1), FIG. 5 (2), and FIG. 5 (3) are enlarged schematic front views for explaining a method using the cutting mechanism (blade) and the kerf check mechanism shown in FIG. 3 (2). FIG. 5 (1) shows a state before the substrate is cut with the blade, FIG. 5 (2) shows a state when the substrate is cut with the blade, and FIG. 5 (3) shows a state when the kerf check mechanism is used. Yes. 6 (1) is a schematic perspective view schematically showing a molded substrate used in the present invention, and FIG. 6 (2) shows a package formed by cutting the molded substrate shown in FIG. 6 (1). It is a schematic perspective view.

Explanation of symbols

1 Molded substrate 1a Ball surface (substrate surface)
1b Mold surface (resin surface)
1c Cut substrate (package assembly)
2 Substrate 3 Resin molding 4 Cutting line 4a Longitudinal cutting line (cutting part in the first direction)
4b Transverse line (second direction cut)
5 Package 5a Ball surface 5b Mold surface 5 (1c) Package assembly (cut substrate)
DESCRIPTION OF SYMBOLS 6 Substrate part 7 Resin part 8 Ball electrode 9 Substrate cutting device 9a Device front surface 9b Device rear surface 10 Connector 11 Substrate alignment mechanism part 12 Substrate cutting mechanism part 13 Substrate supply stand 14 Substrate rotation alignment means 15 Substrate placement Means 15a First substrate placing means 15b Second substrate placing means 16 Reciprocating means 16a First reciprocating means 16b Second reciprocating means 17 Cutting table 17a First cutting table 17b Second Cutting table 20 Mounting surface (cutting table)
20a First placement surface (placement surface of the first cutting table)
20b 2nd mounting surface (mounting surface of 2nd cutting table)
21 Eccentric position (center position of rotation)
21a First eccentric position (the eccentric position of the first cutting table)
21b Second eccentric position (the eccentric position of the second cutting table)
24 Substrate placement position 25 Substrate cutting position 26 Moving area (single line)
26a First moving area (moving area of the first cutting table)
26b Second moving area (moving area of the second cutting table)
27 Alignment mechanism 28 First cutting mechanism 29 Second cutting mechanism 30 Cleaning unit 31 Bellows member 31a First bellows member 31b Second bellows member 33 Minimum interval 41 Substrate loading unit 42 Extrusion member 43 Package supply unit 44 Package Inspection unit 45 Inspection camera 46 Package selection means 47 Non-defective tray 48 Defective product tray 51 Suction hole 51a First suction hole 51b Second suction hole 52 Vacuum suction mechanism 52a First vacuum suction mechanism 52b Second vacuum suction mechanism 53 Table groove 53a First table groove 53b Second table groove 54 Alignment reciprocating mechanism 55 Reciprocating mechanism 57 of cutting mechanism Width (groove width of cutting groove)
58 Cutting groove (calf)
59 Calf check mechanism (calf detection mechanism)
60 First sliding connecting member 61 Second sliding connecting member 62 Integrated cutting detection means 63 First blade (rotary cutting blade)
64 Second blade (rotary cutting blade)
65 Cutting direction 66 Direction opposite to cutting direction (check direction)
67 Cooling water injection mechanism 68 Cooling pipe (injection hole)
69 Cutting water injection mechanism 70 Broken material removal mechanism (broken material blowing mechanism)
71 Air blow mechanism A Substrate loading unit B Substrate cutting unit C Package inspection unit D Package accommodation unit

Claims (10)

Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position. A substrate cutting method in which a package is formed by cutting with a cutting mechanism in a state where the above-described formed substrate is placed on the above-described cutting table,
First, at the above-described substrate mounting position, the above-described formed substrate is aligned by an alignment mechanism to set a cutting line on the above-described formed substrate, and then at the above-described substrate cutting position, the above-described cutting mechanism A method for cutting a substrate, wherein the width of a cutting groove formed by cutting the cutting line is detected by a kerf check mechanism. Using the substrate cutting apparatus, first, the molded substrate is placed on the cutting table at the substrate mounting position of the above-described apparatus and moved to the substrate cutting position of the above-mentioned apparatus, and then at the above-described substrate cutting position. A substrate cutting method in which a package is formed by cutting with a cutting mechanism in a state where the molded substrate is placed on the cutting table described above,
In the above-described substrate placement position, by aligning the above-described molded substrate with an alignment mechanism, setting a cutting line on the above-described molded substrate; and
Forming the cutting groove corresponding to the cutting line in the molded substrate by cutting the cutting line of the molded substrate in the above-described cutting mechanism at the above-described substrate cutting position;
In the above-described substrate cutting position, performing a step of detecting the width of the cutting groove formed in the above-described molded substrate with a kerf check mechanism,
The cutting line is cut by moving the cutting mechanism relatively in the cutting direction during the cutting step of the cutting line, and the kerf check mechanism is A substrate cutting method, wherein the width of the cutting groove is detected by the kerf check mechanism by relatively moving in a direction opposite to the cutting direction. Using the substrate cutting apparatus provided with two cutting tables, the two cutting tables described above are moved from the substrate mounting position provided in the apparatus described above to the substrate cutting position, respectively, In each case, first, the molded substrate is placed on the cutting table at the substrate mounting position, and then the molded substrate is placed on the cutting table at the substrate cutting position. A method of cutting a substrate that forms a package by cutting with a cutting mechanism,
In each of the above-described cutting tables, first, at the above-described substrate mounting position, the above-described formed substrate is aligned by an alignment mechanism to set a cutting line on the above-described formed substrate, and then the above-described substrate A method for cutting a substrate, comprising: performing a step of detecting a width of a cutting groove formed by the above-described cutting mechanism with a kerf check mechanism at a cutting position.   When the formed substrates placed on the two cutting tables are cut separately by the cutting mechanism, each of the cutting tables described above is set at the required angle with the eccentric position of the cutting table as the center of rotation. The substrate cutting method according to claim 3, wherein the substrate is rotated separately.   A cutting mechanism for cutting a required portion of the molded substrate, a cutting table for mounting the molded substrate, and a reciprocating means for reciprocating the cutting table between the substrate mounting position and the substrate cutting position; An apparatus for cutting a substrate having an alignment mechanism for aligning a molded substrate placed on the aforementioned cutting table at the aforementioned substrate placement position, and at the aforementioned substrate cutting position, A substrate cutting apparatus comprising a kerf check mechanism for detecting a width of a cutting groove formed by cutting the molded substrate.   6. The substrate cutting apparatus according to claim 5, further comprising an integrated cutting detection unit that integrates the cutting mechanism and the kerf check mechanism.   The cutting mechanism and the kerf check mechanism are integrated and provided with an integrated cutting detection means, and the cutting mechanism and the kerf check mechanism in the integrated cutting detection means are arranged on the cutting line that the cutting mechanism cuts. The substrate cutting device according to claim 5, wherein the substrate cutting device is configured as described above.   6. The substrate cutting apparatus according to claim 5, wherein two cutting tables are provided.   6. The substrate cutting apparatus according to claim 5, further comprising a rotation mechanism that rotates the cutting table at a predetermined angle with the eccentric position of the cutting table as a center position of rotation.   A debris removal mechanism that removes the debris adhering to the package surface by spraying a two-fluid mixture mixed with air and water on the surface of the package formed by cutting with the cutting mechanism is provided. The substrate cutting device according to claim 5.

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