KR20090105612A - Apparatus for Sawing Semiconductor Devices - Google Patents

Abstract

PURPOSE: A sawing device for manufacturing a semiconductor package is provided to perform a sawing operation by moving a cutting blade to another sawing process part after the sawing operation is completed by the cutting blade in one sawing process part. CONSTITUTION: A sawing device for manufacturing a semiconductor package includes a first sawing process part(41), a second sawing process part(45), a cutting blade(50), and a cleaning nozzle unit(60). The first sawing process part and the second sawing process part include a first chuck table(42) and a second chuck table(46) in which a sawing process strip is fixed. The cutting blade is movably installed in an upper side of the first sawing process part and the second sawing process part. The cutting blade saws the strip on the first and second chuck tables with a semiconductor package unit. The cleaning nozzle unit is installed in the upper side of the first and second sawing process parts. The cleaning nozzle unit sprays the fluid to the first and second chuck tables.

Description

Apparatus for Sawing Semiconductor Devices

The present invention relates to a cutting device for manufacturing a semiconductor package, and more particularly, to a cutting device for manufacturing a semiconductor package for performing a singulation process for cutting the semiconductor package for each package unit on a strip during the manufacturing process of the semiconductor package.

In general, a BGA type semiconductor package is subjected to a process of attaching semiconductor chips having high-integrated circuits such as transistors and capacitors on a pad of a lead frame, molding them with resin paper on the upper surface thereof, and then reading the lower surface of the semiconductor package. After bonding the ball grid array (BGA), which acts as a solder ball (BGA), to conduct electricity with the chip (a plurality of semiconductor packages are arranged in a matrix form in a non-cut state, called a strip), and then using a cutting device. It is manufactured through a process of cutting the semiconductor packages of the individual units, that is, a singulation (Singulation) process. After the singulation process, the semiconductor package is cleaned and dried to remove foreign substances on the surface, and is transferred to the package transfer device to check for defects by the vision inspection device, and then stored in the tray at the unloading unit.

As described above, a series of processes of cutting the semiconductor packages on the strip into individual semiconductor packages and storing the individualized semiconductor packages in a tray are performed by a sawing device for manufacturing a semiconductor package.

1 of the accompanying drawings shows an example of the structure of the conventional cutting device for manufacturing a semiconductor package. As shown in FIG. 1, the on-loader unit 2 to which the cutting target strips S are supplied to one side of the main body 1 of the conventional cutting device for manufacturing a semiconductor package is configured. On one side of the on-loader portion 2 is arranged an inlet rail (3) waiting for the strip (S) withdrawn from the on-loader portion (2).

In addition, the main body 1 is composed of two cutting processing portions 4 for cutting the strip S. The cutting processing unit 4 is installed so as to move horizontally along the two chuck tables 4a and 4b on which the strip S is seated, and the X-axis guide frame 1b crossing the upper sides of the two cutting processing units 4. And a pair of cutting blades 5 for cutting the strips S on each of the chuck tables 4a and 4b. Although not shown in the figure, a vision camera for detecting an alignment state of the strips S mounted on the chuck tables 4a and 4b is installed above the two cutting parts 4. In addition, each of the cutting blades 5 includes a washing nozzle (not shown) for spraying water onto the strip S and the chuck tables 4a and 4b after the cutting process and the cutting are completed.

In addition, a strip picker which picks up the strip S from the inlet rail 3 and transfers it onto the chuck tables 4a and 4b of the two cutting parts 4 above the front part of the main body 10. 3a) and the unit picker 7a which picks up the semiconductor packages on the chuck tables 4a and 4b which have been cut and conveyed them to the cleaning unit 7 are configured to move along the X-axis guide frame 1a, respectively. .

Reference numeral 9 is a sorting unit in which a cutting operation is completed and individualized semiconductor packages are sorted and stored in a tray for each inspection result.

The conventional cutting device for manufacturing a semiconductor package configured as described above operates as follows.

When the strip S is supplied from the on-loader section 2 onto the inlet rail 3, the strip picker 3a picks up the strip S on the inlet rail 3 to form the two cutting sections 4. It is moved and seated on the chuck table 4a of any one cutting part 4 (referred to as the first cutting part for convenience of understanding).

Subsequently, a vision camera (not shown) performs vision imaging of the alignment state of the strip S on the chuck table 4a to correct the position, and moves to the lower side of the cutting blade 5. Then, the cutting operation of the strip S is performed by the cutting blade 5, so that the strip S is cut into semiconductor package units.

In this way, while the cutting operation by the cutting blade 5 is in progress, the strip picker 3a picks up another strip from the inlet rail 3 and the other cutting operation of the two cutting portions 4 is not performed. It is seated on the chuck table 4b of the cutting part 4 (referred to as a second cutting part for convenience of understanding). Then, the chuck table 4b of the second cutting part 4 moves to the lower side of the vision camera (not shown) to detect the alignment state of the strip, and then waits at the cutting work position after the position is corrected.

On the other hand, while cutting the strip S by the cutting blade 5 is in progress, water is sprayed from the washing nozzle (not shown) of the cutting blade 5 to cool the heat of the cutting blade 5, and cut Scraps generated at the time of discharge are discharged immediately.

When the strip cutting process on the chuck table 4a of the first cutting unit 4 is completed, the semiconductor packages are cut on the chuck table 4a while water is sprayed from a cleaning nozzle (not shown) of the cutting blade 5. The entire wash is done. When the cleaning of the semiconductor package is completed, the chuck table 4a moves forward, and the unit picker 7a picks up the semiconductor packages on the chuck table 4a and returns them to the cleaning unit 7. Then, the chuck table 4a is moved to the lower side of the cutting blade 5 again, and water is sprayed from a washing nozzle (not shown) of the cutting blade 5 to wash the upper surface of the chuck table 4a.

When the cleaning of the chuck table 4a is completed, the cutting blade 5 moves to the second cutting part 4 to cut the new strip on the chuck table 4b.

As described above, the cutting device for manufacturing a semiconductor package according to the related art has a loading operation for mounting the strip S on the chuck tables 4a and 4b of the cutting processing portion 4, an alignment operation, and a strip cutting operation. ), PACKAGE CLEANING, unloading to separate and return the semiconductor package on the chuck tables 4a and 4b, and strip cleaning to perform chuck table cleaning. ) And singulate the semiconductor package.

However, in the cutting device for manufacturing a semiconductor package according to the related art, since all the cleaning nozzles are configured together in the cutting blade 5, the cutting operation of the cutting part 4 of the cutting processing part 4 is performed. During the process, as well as during the semiconductor package cleaning (CHAGEK CLEANING), the chuck table cleaning operation (CHUCK TABLE CLEANING), the cutting operation for the strip of the other cutting processing section 4 must wait without progress. Therefore, the work waiting time in the cutting part 4 increases, and a problem that productivity falls is generated.

The present invention is to solve the conventional problem as described above, the object of the present invention is a cutting device for manufacturing a semiconductor package having a plurality of cutting process, the cutting process of any one of the cutting process is completed, immediately after It is to provide a cutting device for manufacturing a semiconductor package that can reduce the waiting time of the strip in the cutting portion, improve the cutting operation speed to significantly improve the productivity by allowing the cutting process for the strip of the other cutting portion.

The present invention for achieving the above object, the first cutting processing unit and the second cutting processing unit having a first chuck table and a second chuck table to which the cutting target strip is seated and fixed; A cutting blade movably installed above the first cutting part and the second cutting part to cut the strips on the first and second chuck tables in semiconductor package units; Provided is a cutting device for manufacturing a semiconductor package including a washing nozzle unit which is installed on the upper side of the first and second cutting processing unit and injects fluid onto the first and second chuck tables.

According to the present invention, since the cleaning nozzle unit for cleaning the semiconductor package (PACKAGE CLEANING) and cleaning the chuck table (TABLE CLEANING) in the cutting processing unit is composed of a separate body and the cutting blade to perform the cleaning operation, After the cutting operation by the cutting blade is completed in one cutting part, the cutting blade can be immediately moved to the other cutting part to perform the cutting operation, which greatly reduces the waiting time of the strip in the cutting part, thereby increasing the working speed. It is possible to obtain an effect of improving the productivity UPH.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of a cutting device for manufacturing a semiconductor package according to the present invention in detail.

Figure 2 shows an embodiment of a cutting device for manufacturing a semiconductor package according to the present invention, the cutting device for manufacturing a semiconductor package of the present invention is the on-loader unit (S) is supplied to the cutting target strip (S) to one side of the main body 10 ( 20 is disposed, an inlet rail 30 on which one side of the on-loader part 20 withdraws the strip S drawn from the on-loader part 20 is arranged, and on one side of the inlet rail 30. The first cutting processing part 41 and the second cutting processing part 45 in which the cutting operation | work of the strip S is performed are comprised.

The gripper 25 which draws the strip S from the magazine (not shown) of the onloader part 20 and conveys it onto the inlet rail 30 between the onloader part 20 and the inlet rail 30 is X. It is installed to be able to move horizontally in the axial direction.

The first and second cutting parts 41 and 45 have first and second chuck tables 42 and 46 on which the strip S is seated. The first and second chuck tables 42 and 46 are rotatable at any angle about a vertical axis, and are configured to be horizontally movable in the Y-axis direction of the main body 10 by a linear movement device not shown in the drawing. It is. At the rear of the first and second cutting processing parts 41 and 45, a conveyor 80 for discharging scrap generated during cutting of the strip S to the outside of the main body 10 is installed.

In addition, a pair of cutting blades 50 for cutting the strips S on the first and second chuck tables 42 and 46 are installed above the first and second cutting parts 41 and 45. The cutting blade 50 is configured to move horizontally along the X-axis guide frame 14 by a linear motion device not shown in the drawing. Although not shown in the drawings, a vision camera is installed above the first and second cutting parts 41 and 45 to detect an alignment state of the strip S seated on the first and second chuck tables 42 and 46. . In addition, the cutting blade 50 includes a cutting nozzle (not shown) for cooling the cutting blade 50 and removing foreign matters and scraps on the strip S during the cutting process.

A washing nozzle unit 60 for spraying water toward the first and second chuck tables 42 and 46 is installed above the front part of the first and second cutting processing parts 41 and 45. The cleaning nozzle unit 60 performs a function of cleaning the cut semiconductor package on the first and second chuck tables 42 and 46 and the first and second chuck tables 42 and 46 as a whole. Here, the washing nozzle unit 60 is a second washing nozzle (60b) located immediately above the first washing nozzle (60a) and the second cutting processing portion 45 located immediately above the first cutting processing portion (41). ). In this embodiment, the first and second cleaning nozzles 60a and 60b are integrally formed on the first and second cutting processing portions 41 and 45, but are controlled separately from each other.

In addition, the first washing nozzle 60a and the second washing nozzle 60b atomize high pressure air together with water so that the water contacts the upper surface of the semiconductor package or the first and second chuck tables 42 and 46. It is desirable to (atomizing) so that even fine gaps can be cleaned cleanly.

Meanwhile, first and second chuck tables 42 and 46 of the first and second cutting parts 41 and 45 may be picked up by picking strips S from the inlet rail 30 above the front part of the main body 10. The X-axis guide frame 12 includes a strip picker 35 for conveying the image and a unit picker 75 for picking up the semiconductor packages on the chuck tables 42 and 46 having been cut and conveyed to the cleaning unit 70. It is configured to move along.

Reference numeral 90 denotes a sorting unit in which cutting operations are completed and individualized semiconductor packages are sorted and stored in trays according to inspection results.

The conventional cutting device for manufacturing a semiconductor package configured as described above operates as follows.

When the strip S to be processed is supplied from the on-loader part 20 onto the inlet rail 30 by the gripper 25, the strip picker 35 picks up the strip S on the inlet rail 30. It moves on the 1st chuck table 42 of the 1st cutting part 41, and is seated.

Subsequently, the first chuck table 42 moves to the lower side of the vision camera (not shown) so that the vision camera (not shown) vision photographs the alignment state of the strip S on the first chuck table 42. After correcting the position of the strip (S) according to the photographed position information, it moves to the lower side of the cutting blade (50). In addition, the cutting operation of the strip S is performed by the cutting blade 50 so that the strip S is cut into semiconductor package units. At this time, water is sprayed through a cutting nozzle (not shown) installed on one side of the cutting blade 50 to cool the heat of the cutting blade 50, and wash the cut strip portion to remove scraps generated in the cutting process. Eject immediately.

As such, while the strip alignment operation and the strip cutting operation are performed in the first cutting part 41, the strip picker 35 picks up another strip from the inlet rail 30 and the second cutting part 45. ) Is mounted on the second chuck table 46. Then, the second cutting processing unit 45 moves to the lower side of the vision camera (not shown) to detect the alignment state of the strip, and then waits at the cutting operation position after the position is corrected.

On the other hand, when the cutting process of the strip is completed in the first cutting portion 41, the cutting blade 50 is moved horizontally along the X-axis guide frame 14 to move to the lower side of the second chuck table 46 The cutting process of the strip seated on the two-chuck table 46 is started. At the same time, the first chuck table 42 moves forward in the Y-axis direction and is positioned below the first washing nozzle 60a of the washing nozzle unit 60. At this time, the high-pressure air is injected together with the water through the first washing nozzle 60 located above the first chuck table 42, and the overall cleaning of the semiconductor packages on the first chuck table 42 is performed.

The first chuck table 42 in which the overall cleaning of the semiconductor packages is completed continues to move forward and to the bottom of the unit picker 75. In addition, the unit picker 75 performs an unloading operation of picking up the semiconductor package on the first chuck table 42 and transporting it to the cleaning unit 70.

After the unloading of the semiconductor package by the unit picker 75 is completed, the first chuck table 42 moves back to pass through the lower side of the first washing nozzle 60a. At this time, water and air are injected from the first washing nozzle 60a to wash the upper surface of the first chuck table 42.

Subsequently, when the cleaning of the first chuck table 42 is completed, the first chuck table 42 moves forward again, and the strip picker 35 moves on a new strip S on the first chuck table 42. Seat.

In addition, the first chuck table 42 moves to the lower side of the vision camera (not shown) in the same manner as described above to perform the alignment operation of the strip S, and cutting may be performed by the cutting blade 50. After moving to the position, it is waited until the cutting process for the strip S on the second chuck table 46 is finished.

When the cutting process for the strip S on the second chuck table 46 is completed, the second chuck table 46 moves out of the cutting process position like the first chuck table 42 and the package cleaning operation (PACKAGE CLEANING) is performed. ), Unloading operation (UNLOADING), chuck table cleaning operation (CHUCK TABLE CLEANING), strip loading operation (LOADING), strip alignment operation (ALIGNING) and then strip (S) on the first chuck table 42 Wait for the cutting operation to complete.

The cutting device for a semiconductor package of the present invention performs the above process repeatedly to cut the strip (S) by a semiconductor package unit.

Cutting device for a semiconductor package according to the present invention as described above, the cleaning nozzle unit 60 for performing the overall cleaning operation (PACKAGE CLEANING) and the cleaning operation (CHUCK TABLE CLEANING) of the chuck table cutting blade (50) And is composed of a separate object to perform the washing operation independently, immediately after the cutting operation by the cutting blade 50 in any one of the cutting portion (41 or 45), the cutting blade 50 is immediately cut the other cutting portion (45 or Go to 41) to perform the cutting operation. Therefore, the waiting time of the strip S in the first and second cutting parts 41 and 45 is greatly reduced, and thus, the work speed is improved, and thus the productivity UPH can be obtained.

On the other hand, the embodiment of the operation of the cutting device for a semiconductor package described above illustrates that the overall cleaning operation for the semiconductor package on the chuck table after the cutting process of the strip and the cleaning operation for the chuck table after the unloading operation are all performed. Alternatively, however, only one of the overall cleaning operation and the chuck table cleaning operation of the semiconductor package may be selectively performed.

1 is a plan view schematically showing the configuration of a conventional cutting device for manufacturing a semiconductor package

Figure 2 is a plan view schematically showing the configuration of a cutting device for manufacturing a semiconductor package according to an embodiment of the present invention

Explanation of symbols on the main parts of the drawings

10: main body 20: on loader unit

30: inlet rail 35: strip picker

41: First Cutting Machining Part 42: First Chuck Table

45: second cutting processing part 46: second chuck table

50: cutting blade 60: cleaning nozzle unit

70 washing unit 75 unit picker

S: strip

Claims (4)

A first cutting part and a second cutting part, each having a first chuck table and a second chuck table on which the strip to be cut is fixed; A cutting blade movably installed above the first cutting part and the second cutting part to cut the strips on the first and second chuck tables in semiconductor package units; Cutting device for manufacturing a semiconductor package comprising a cleaning nozzle unit is installed on the upper side of the first and second cutting processing unit for injecting a fluid onto the first and second chuck table. The cutting nozzle of claim 1, wherein a cutting nozzle is installed at one side of the cutting blade to cool the heat of the cutting blade generated in the cutting process and remove foreign substances by spraying a fluid during the cutting process of the strip by the cutting blade; The cleaning nozzle unit is a cutting device for manufacturing a semiconductor package, characterized in that to perform the entire cleaning operation of the semiconductor packages on the first and second chuck table or the first and second chuck table after the strip cutting operation. The cleaning nozzle unit of claim 1 or 2, wherein the cleaning nozzle unit comprises a first washing nozzle positioned above the first cutting processing unit and injecting a fluid toward the first chuck table, and positioned above the second cutting processing unit. A second washing nozzle for injecting fluid toward the two chuck tables; Cutting fluid for the semiconductor package manufacturing, characterized in that the fluid injection through the first cleaning nozzle and the second injection nozzle is controlled separately. The cutting blade of claim 1 or 2, wherein the cutting blade is applied to the strip on the second chuck table while the entire semiconductor package cleaning operation on the first chuck table or the first chuck table cleaning operation is performed by the cleaning nozzle unit. Cutting device for manufacturing a semiconductor package, characterized in that controlled to perform a cutting operation.

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