KR20040104366A - sawing and handler system for manufacturing semiconductor package - Google Patents

Abstract

PURPOSE: A cutting and handler system for semiconductor package fabrication is provided to simplify a processing flow and improve productivity by sequentially arranging components of the cutting and handler system in a strip/package processing order. CONSTITUTION: A plurality of semiconductor strips are loaded on an on-load unit(100). A cutting unit(200) cuts the semiconductor strips into individual semiconductor packages. A cleaning unit(300) cleans the semiconductor packages. A semiconductor strip picker(140) is moved between the on-load unit and the cutting unit in order to transfer the semiconductor strips from the on-load unit to the cutting unit. A package picker(240,520) is installed between the cutting unit and the cleaning unit in order to transfer the individual semiconductor packages to the cleaning unit.

Description

Cutting and handler system for semiconductor package manufacturing process

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting and handler system for a semiconductor package manufacturing process, and in particular to sequentially placing the components of the system in working order to improve the cutting and processing speed of the semiconductor strip.

In recent years, with the development of information communication and computer technologies, semiconductors have been highly integrated.In response to this trend, semiconductor packages also have solder ball type packages or MLF (micro leaded) instead of lead frames for connecting internal lines to the outside. Packages of type frame) are commonly used.

The solder ball type package or MLF type package manufactured as described above is called a strip because it forms a strip in a rectangular matrix form.

Packages manufactured in the form of strips need to be cut and individually separated by a cutting device for their use, and the individually cut packages need to be classified and loaded according to a predetermined quality standard by a handler device. .

Although the cutting device and the handler device are separate devices, they are often combined in an inline form in the flow of the process. The system combining the sawing device and the handler device is described in detail in the handler system for cutting semiconductor packages (Patent Application No. 10-2000-0079282, Publication No. 2002-0049954), filed by the applicant.

FIG. 1 is a plan view illustrating a cutting and handler system for a conventional semiconductor package manufacturing process, showing a simplified view of the pre- filed system. Hereinafter, the above-described system will be described based mainly on the contrast with the core technology of the present invention.

As shown in FIG. 1, the system is largely coupled to one side of the handler system and a handler system for supplying the semiconductor strip and cleaning, drying, inspecting and loading the semiconductor package, thereby converting the semiconductor strip into individual semiconductor packages. The cutting system consists of two parts.

The handler system includes an on-load device (10) for loading a semiconductor strip loaded in a magazine or cassette, a draw device (15) for drawing a semiconductor strip from the on-load device (10), and the draw device (15). After fixing by vacuum suction the seated semiconductor strip and the strip picker 14 for transferring to the cutting device 20 along the guide rail 25, and unloading the individual semiconductor package cut by the cutting device 20 A first package picker 24, a washing device 30 for washing the package transferred by the first package picker 24, a drying device 40 for drying the package is completed, and a dry package The second package picker 52 for conveying the chuck table 51 along the guide rail 25, the package on the chuck table 51 and the package from the chuck table 51 to determine the state of the package. Upper and lower vision inspection device (50) , It is composed of off-loading device 60 for loading the semiconductor packages sorted in accordance with the determination result of the vision inspection device 50.

The strip picker 14 and the first package picker 24 are configured to move horizontally or vertically at the same time by the strip / package picker moving member 13, and the second package picker 52 and the tray picker ( 62 is configured to move horizontally or vertically at the same time by the package / tracer moving member 53.

The cutting device 20 includes a cutting table 21 on which a strip conveyed by the first stripper 14 is placed and fixed, and which is horizontally and rotationally moved, and is seated on the cutting table 21 and transferred. A cutting blade 23 is rotatably coupled to a spindle 22 connected to a drive motor (not shown) for cutting the strip into individual semiconductor packages.

The cleaning device 30 is provided with a spray nozzle (not shown) for spraying the washing water toward the semiconductor package is cut, the drying device 40 is fixed to the base for drying the semiconductor package is complete A heater (not shown) is provided.

Hereinafter, a cutting and handler system for a semiconductor package manufacturing process configured as described above will be described.

FIG. 2 is a plan view schematically illustrating a process progress path of a semiconductor strip in the cutting and handler system shown in FIG. 1. A description with reference to FIGS. 1 and 2 is as follows.

First, the draw picker 15 draws the strip from the on-load apparatus 10 and moves it to the pick-up position. After picking up the strip, the strip picker 14 waiting at the pick-up position moves along the guide rail 25 and puts it down on the cutting table 214. The cutting table 21 moves up to the cutting blade 23 while the strip is adsorbed. At this time, the vision inspection device 50 inspects the X-axis and Y-axis alignment state of the strip adsorbed to the cutting table 21. According to the inspection result, the strip is cut into individual semiconductor packages without errors by the relative movement of the cutting blade 23 and the cutting table 21.

On the other hand, during this cutting process, the strip picker 14 moves to the on-load apparatus 10 to pick up a new strip and then moves toward the cutting table 21. When the strips are all cut into separate packages, the cutting table 21 moves under the first package picker 24. At this time, the first package picker 24 adsorbs the individual packages, and then the strip picker 14 moves to the upper part of the cutting table 21 and puts a new strip on the cutting table 21. The cutting table 21 on which the strip is placed moves toward the cutting blade 23 for cutting the strip, and the first package picker 24 which picks up the package sequentially transfers the package to the washing apparatus 30 and the drying apparatus 40. Transfer to washing and drying.

The dried semiconductor package is placed on the turntable 51 by the second package picker 52. At this time, while the upper vision inspection device 50 moves along the guide rail 54 in the Y-axis direction, the defective state of the upper surface of the semiconductor package placed on the turntable 51 is inspected. Subsequently, the turntable 51 moves along the guide rails 56 to the sort picker 55 position with the package adsorbed, and the sort picker 55 sucks the semiconductor package on the turntable 51 to check the lower vision. The device 50 is moved to inspect a bad state of the lower surface of the semiconductor package.

As such, when the vision inspection is completed, the sort picker 55 classifies the semiconductor package as good or defective according to the vision inspection result and mounts the semiconductor package on the tray 61. When loading of the package on the tray 61 is completed, the tray feeder 62 on which the tray 61 is mounted moves to the upper portion of the tray loading part. At this time, when the waiting tray picker 62 picks up the tray 61, the tray feeder 62 moves to the rear (Y-axis direction), and then the tray 61 picked up by the tray picker 62 is moved. Lower it to the stack. After that, the tray picker 62 moves to the tray supply part 63, picks up a new tray 61, and then moves to the tray feeder 62. At the same time, the tray feeder 62 moves back to the tray loading part 63 to mount a new tray 61 and then moves toward the sort picker 55.

As described above, in the conventional semiconductor strip cutting and handler system, the semiconductor strip brought into the system by the on-loading device 10 goes through the inherent working direction of the handler device and the drying device 40 and the cleaning device ( 30 is passed back to the turntable 21 for cutting located at a far distance, the cutting process should be performed. This can be said to be a structural problem caused by the combination of the cutting device and the handler device constituting the conventional semiconductor strip cutting and handler system after they are produced separately.

This made it difficult to arrange each component in the processing sequence of strips / packages, and the workflow for processing the strips / packages was not smooth. Therefore, it takes a long time for the semiconductor strip to be transferred from the on-load device 10 to the turntable 21, thereby degrading the unit per hour (UPH) of the entire system. In addition, due to such a structural problem, it was not possible to arrange each component efficiently, the on-load device 10 is located in front of the washing device 30 and the drying device 40 so that the system forward (Y-axis direction) There was also a problem that can not use the workspace efficiently, such as protruding.

In addition, in the conventional semiconductor package cutting handler system, since the strip picker 14 and the first package picker 24 are simultaneously moved by one strip / package picker moving member 13, the first package picker ( 24) was not able to move to the washing apparatus 30 immediately in the state of picking up the individual package whose cutting process was completed from the turntable 21. As shown in FIG. That is, the movement of the first package picker 24 to the cleaning device 30 is delayed until the strip picker 14 mounts a new semiconductor strip on the turntable 21. Therefore, the individual semiconductor package after the cutting process is transferred to the cleaning device 30 later, causing a problem that a package processing speed (UPH) of the system is lowered. In addition, in recent years, a cutting device having two spindles has been proposed to improve a package processing speed. However, in the conventional cutting and handler device, the strip picker 14 and the first package picker 24 are connected to each other. Since it is moved by the moving member 13 at the same time, there is a limit to improve the unit per hour (UPH) of the entire system even when applying a cutting device having such two spindles.

In addition, the cleaning device 30 is a nozzle (not shown) package adsorbed to the first package picker 24 while reciprocating horizontally in the chamber (not shown) along the longitudinal direction of the strip separated into each package Since it was configured in such a way as to inject air and water toward the nozzle, it was necessary to reciprocate the nozzle several times in order to sufficiently clean the package. Therefore, the package cleaning process takes a lot of time. In addition, since the drying apparatus 40 dried the package on which the cleaning was completed while being fixed to the base (not shown), the package drying process took a lot of time.

Accordingly, the present invention has been proposed to solve the conventional problems as described above, and an object of the present invention is to cut and handler a semiconductor package manufacturing process for improving the working speed and installation efficiency of the cutting and handler system for a semiconductor package manufacturing process. The purpose is to provide a system.

1 is a plan view schematically showing a cutting and handler system for a conventional semiconductor package manufacturing process.

FIG. 2 is a plan view schematically illustrating a process progress path of a semiconductor strip in the cutting and handler system shown in FIG. 1; FIG.

Figure 3 is a plan view schematically showing a cutting and handler system for a semiconductor package manufacturing process according to a first embodiment of the present invention.

Figure 4 is a perspective view showing in detail the on-road device, cutting device and cleaning device shown in FIG.

5 is a perspective view showing the configuration of a cutting table of the cutting device shown in FIG.

Figure 6 is an exploded perspective view of the washing apparatus shown in FIG.

Figure 7 is an exploded perspective view of the drying apparatus shown in FIG.

8A and 8B are reference diagrams for explaining the configuration and operation of the draw picker shown in FIG.

9 is a plan view schematically showing a process progress path of a semiconductor strip in the cutting and handler system shown in FIG.

10A to 10G are reference views sequentially illustrating a process of loading a semiconductor strip loaded on an on-loading device into a cutting device in the cutting and handler system shown in FIG.

11A to 11E are reference views sequentially illustrating a process of unloading a semiconductor package having been cut in the cutting and handler system shown in FIG. 3 and transferring the unloaded semiconductor package to a cleaning device, a drying device, and a vision inspection device.

12 is a plan view schematically illustrating a cutting area of a cutting and handler system for a semiconductor package manufacturing process according to a second exemplary embodiment of the present invention.

FIG. 13 is a perspective view showing the configuration of a cutting table provided in the cutting area shown in FIG. 12; FIG.

* Description of the symbols for the main parts of the drawings *

100: on-load device 110: magazine

130: pusher 140: strip picker

150: draw picker 152: draw picker body

154: pneumatic cylinder 156: upper gripper

157: lower gripper 160: inlet rail

200: cutting device 210: turntable

212: turntable base 214: cutting table

216: cutting plate 218: seating portion

220: spindle 222: cutting blade

240: first package picker 250, 260: guide rail

300: cleaning device 310: chamber

312: opening 314: rotating hole

320: nozzle support 322: washing water nozzle

324: air nozzle 332: the first rotary cylinder

333: drive gear 334: driven gear

336: power transmission belt 338: casing

400: drying apparatus 410: moving frame

412: package seating portion 414: guide member

420: heater 430: horizontal movement means

500: vision inspection device 510: vision inspection turntable

520: second package picker 530: guide rail

540: upper vision inspector 550: lower vision inspector

600: off-road device 610: tray

620: Tracer S: strip

P: Package

The cutting and handler system for a semiconductor package manufacturing process according to the present invention includes an on-load device for receiving a plurality of semiconductor strips, a cutting device for cutting the semiconductor strip transferred from the on-load device into a separate semiconductor package, and the cutting device A washing apparatus for washing the semiconductor package cut in the apparatus, a drying apparatus for drying the semiconductor package washed by the washing apparatus, a vision inspection apparatus for inspecting whether the semiconductor package dried in the drying apparatus is defective, and the vision inspection apparatus. And an offload device for sorting and loading the semiconductor package according to the vision inspection result.

In the cutting and handler system for the semiconductor package manufacturing process, an onload device, a cutting device, a cleaning device, a drying device, a vision inspection device, and an offload device are sequentially disposed, and the semiconductor strip is withdrawn from the onload device and cut. The device, the cleaning device, and the drying device are sequentially transferred along the process progress direction, and cut, washed, and dried into individual semiconductor packages, and then loaded on the off-road device according to the vision inspection result.

Between the on-loading device and the cutting device, a strip picker for extracting and transferring the semiconductor strips loaded on the on-loading device to the cutting device is movable, and between the cutting device, the cleaning device and the drying device in the cutting device. A first package picker for transferring the cut individual semiconductor packages to the cleaning device and the drying device is installed to be movable independently of the strip picker.

The strip picker includes a draw picker for extracting the semiconductor strip from the on-load device, and an inlet rail for guiding and aligning the semiconductor strip drawn by the draw picker is installed between the on-load device and the cutting device. It features.

The draw picker includes a draw picker body, a gripper driving means installed on the draw picker body, an upper gripper coupled to the gripper driving means and vertically moved by the operation of the gripper driving means, and a lower portion of the draw picker body. And a lower gripper fixed to face the upper gripper, wherein the semiconductor strip is drawn out by relative movement of the upper gripper and the lower gripper.

The draw picker is coupled to the strip picker relatively movable up and down.

The package picker includes a picker head for absorbing the cut semiconductor package, and the picker head is installed to be eccentric from the package picker body toward the drying apparatus.

The washing apparatus includes a chamber, a nozzle support rotatably installed in the chamber, a plurality of washing water nozzles for spraying washing water toward the semiconductor package transferred from the cutting device while reciprocally rotating at a predetermined spray angle to the nozzle support portion. It is installed on one side of the chamber, characterized in that it comprises a nozzle driving means for providing a rotational force to the nozzle support.

The nozzle support is characterized in that a plurality of air nozzles for injecting dry air toward the semiconductor package transferred from the cutting device is further installed.

The drying apparatus is characterized by drying the semiconductor package while being moved by the horizontal moving means.

The drying apparatus is installed to be movable along one direction axis, and includes a moving frame for moving a semiconductor package seated on a seating portion formed at an upper portion thereof, and a lower portion of the seating portion, for drying the semiconductor package seated on the seating portion. It is characterized in that it comprises a heater and a horizontal moving means coupled to the moving frame, the horizontal moving the moving frame.

The horizontal moving means may include a rotary cylinder installed in the moving frame, a pinion rotatably coupled to the rotary cylinder, extending in a moving direction of the moving frame, and engaged with the pinion. .

Between the drying apparatus and the vision inspection apparatus, a second package picker which absorbs the dried semiconductor package in the drying apparatus and delivers the dried semiconductor package to the transfer table installed in the vision inspection apparatus is movable, and the vision of the off-road apparatus is provided. According to the vision inspection result of the inspection device, a tray picker for loading a new tray while unloading a tray loaded with a semiconductor package classified as good or defective is installed to be movable independently of the second package picker. It is done.

The cutting device includes a cutting table installed to be movable in a horizontal direction along the guide rail, a pair of cutting plates rotatably installed on an upper portion of the cutting table, and alternately loaded with a semiconductor strip on an upper surface thereof, and connected to a driving motor. And a cutting blade rotatably coupled to an end portion of the spindle, the cutting blade for cutting a semiconductor strip loaded on the cutting plate into individual semiconductor packages by a relative movement with the cutting table. It characterized in that the cutting device comprising a.

Hereinafter, a first embodiment according to the spirit of the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view schematically illustrating a cutting and handler system for a semiconductor package manufacturing process according to a first exemplary embodiment of the present invention, and FIG. 4 specifically illustrates an on-loading device, a cutting device, and a cleaning device shown in FIG. 3. One perspective view.

As shown in FIGS. 3 and 4, the semiconductor strip cutting and handler system according to the first embodiment of the present invention has a large on-load apparatus 100, a cutting apparatus 200, a cleaning apparatus 300, and a drying apparatus ( 400), the vision inspection apparatus 500 and the off-road apparatus 600. In addition, the strip picker 140 is movable between the on-loader 100 and the cutting device 200, and a draw picker 150 is provided at one side of the strip picker 140 ( See FIG. 4). In addition, a first package picker 240 is movable between the cutting device 200 and the cleaning device 300.

First, the on-load device 100 is a portion for receiving a plurality of semiconductor strips to be cut in the cutting device 200. The on-load apparatus 100 may include one of a magazine (not shown) having a plurality of strips, a magazine moving means for moving the magazine (not shown), and a plurality of strips loaded in the magazine (not shown). The pusher 130 is supplied to the inlet rail 160. Here, the magazine moving means is composed of a conveyor belt 124 for horizontally moving the magazine (not shown) by driving the pulley 122, and an elevator 126 for lifting the magazine 11, which is horizontally moved. Since the configuration and operation of the on-load device 100 is disclosed in detail in Korean Patent Publication No. 2002-0049954 described in the prior art of the present application, a detailed description thereof will be omitted.

Here, since the on-load device 100 is disposed on one side of the cutting device 200, the semiconductor strip is drawn out from the on-load device 100 and cut compared to that disposed on the front of the cleaning device 300 as in the related art. The time taken to deliver to the device 200 is significantly saved, and the structural arrangement of the system is simplified.

The inlet rail 160 guides and arranges the semiconductor strip drawn by the draw picker 150, and is installed between the on-load device 100 and the cutting device 200. The inlet rail 160 is composed of a pair of rails to guide both sides of the strip. The inlet rail 160 is controlled to adjust the width of the rail by a servo motor (not shown) according to preset strip information so as to guide strips of various widths.

Hereinafter, the cutting device 200 will be described with reference to the accompanying drawings.

As shown in FIG. 3, the cutting device 200 cuts the semiconductor strip transferred from the on-load device 100 into individual semiconductor packages. The cutting device 200 is largely composed of a chuck table 210, a spindle 220 and a cutting blade 222.

5 shows a chuck table 210 of a cutting device according to this embodiment. As shown in FIG. 5, the chuck table 210 includes a cutting table 214 installed to be movable in a horizontal direction along a guide rail 260 extending in the Y-axis direction, and the cutting table 214 of the cutting table 214. It is composed of a cutting plate 216 rotatably installed on the upper portion and the semiconductor strip is loaded on the upper surface. The upper surface of the cutting plate 216 is provided with a seating portion 218 for mounting the strip and the package by vacuum suction. The cutting table 214 is moved in the Y-axis direction by the mutual movement of the ball screw 262 coupled to the servo motor (not shown) and the nut member (not shown) screwed to the ball screw 262, The cutting plate 216 is designed to be rotated clockwise or counterclockwise by a servomotor (not shown) installed in the cutting table 214.

The spindle 220 is connected to the drive motor 222 to impart a rotational force to the cutting blade 222, in this embodiment is composed of two spindles 220 opposedly installed to improve the cutting speed. The spindle 220 is designed to be raised or lowered by a combination of a known servomotor, a ball screw, a nut, and the like, as well as to be approached or retracted from the cutting table 214.

The cutting blade 222 cuts the strip into individual packages and is rotatably installed at an end of the spindle 220.

Hereinafter, a cutting process made in the cutting device 200 configured as described above will be described.

First, when the semiconductor strip is loaded on the seating portion 218 of the cutting plate 216, the cutting table 214 is rotated by 90 ° and then along the guide rail 260 installed in the Y-axis direction to the turntable base 212. It moves back to the spindle 220. Then, after extracting the alignment information of the strip by a predetermined vision inspection device (not shown), by adjusting the rotation angle of the cutting table 214 to correct the alignment error, when the strip is cut in the width direction or Make sure to cut precisely from the width direction to the length direction. Then, the cutting blade 222 installed on the spindle 220 rotates at high speed and moves in the X-axis direction at appropriate intervals, and the cutting table 214 moves back and forth in the Y-axis direction to separate the strips. Cut with When the strip is cut completely, the cutting table 214 moves forward toward the unloading position to complete the cutting process.

Hereinafter, the washing apparatus 300 will be described with reference to the accompanying drawings.

6 is an exploded perspective view of the washing apparatus according to the present invention. As shown in FIG. 6, the cleaning device 300 is for cleaning the semiconductor package cut by the cutting device 200, the chamber 310, the nozzle support 320, the washing water nozzle 322, The air nozzle 324 and the nozzle driving means 330 are configured.

The upper surface of the chamber 310 is formed with an opening 312 extending in the longitudinal direction, the rotating hole 314 is formed through both sides. In addition, the lower portion of the chamber 310 is provided with a strainer 316 to filter the chip pieces attached to the package in the cutting process, the lower portion of the strainer 316 is a conventional drain (not shown) Formed.

The nozzle support part 320 extends in the longitudinal direction to correspond to the opening part 312, and is disposed below the opening part 312. Rotating shafts 326 inserted into and supported by the rotating holes 314 are formed on both side surfaces of the nozzle support 320.

A plurality of washing water nozzles 322 and air nozzles 324 are installed on the upper surface of the nozzle support 320. The washing water nozzle 322 is a nozzle for spraying the washing water toward the package, the air nozzle 324 is a nozzle for spraying air toward the package. The washing water nozzle 322 and the air nozzle 324 are controlled to selectively spray washing water or air toward the package while reciprocating rotation at a predetermined spray angle in the chamber 310.

The nozzle driving means 330 is fixed to the chamber 310 to provide power to the first rotary cylinder 332, the drive gear 333 is installed on the rotating shaft of the first rotary cylinder 332, and It is coupled to the driven gear 334 installed on the rotating shaft 326 of the nozzle support 320, the drive gear 333 and the driven gear 334 to transfer the power of the drive gear 333 to the driven gear 334. And a casing 338 covering the power transmission belt 336.

However, the washing water nozzle 322 and the air nozzle 324 is configured to reciprocate at a predetermined angle by the rotation of the nozzle support 320 connected to the nozzle driving means 330, but is not limited to this and various rotation mechanisms Can be rotated by. For example, the rotation mechanism may be configured to directly rotate the wash water nozzle 322 or the air nozzle 324. In addition, the nozzle driving means 330, as well as gear and power transmission belt combination, various rotating mechanisms such as sprocket wheel and chain combination, pulley and belt combination can be applied.

On the other hand, in order to increase the cleaning efficiency, a brush (not shown) for brushing (brushing) the package adsorbed by the first package picker 240 may be further provided separately from the washing water spray. Such a brush is preferably installed between the chuck table 210 and the cleaning device (300). In addition, a brush driving device (not shown) may be installed to move the brush in a horizontal direction. The brush driving device may include a ball screw (not shown) and a moving nut (not shown) connected to a known pneumatic cylinder or a thermo motor. It may be made of. In addition, the brush may be provided with a nozzle for spraying water to increase the efficiency of the brush.

As such, the washing device 300 may quickly wash the semiconductor package because the washing water nozzle 322 reciprocates at a predetermined angle, thereby quickly cleaning the semiconductor package, and separately separating the air nozzle 324 from the washing water nozzle 322. It is equipped with a strong air can be injected into the semiconductor package alternately with the wash water to increase the cleaning and drying efficiency.

Hereinafter, a drying apparatus 400 will be described with reference to the accompanying drawings.

7 is an exploded perspective view of the drying apparatus according to the first embodiment. As shown in FIG. 7, the drying apparatus 400 is for drying a semiconductor package which has been cleaned, and includes a moving frame 410, a heater 420, and horizontal moving means.

The moving frame 410 has a package seating portion 412 is formed in the upper portion for loading the package, the seating portion 412 is provided with a vacuum suction hole (not shown) for adsorbing the seated package. A guide member 414 coupled to the guide rail 442 installed on the support frame 440 is formed at the lower end of the movable frame 410. In addition, the moving frame 410 may be provided with a vacuum passage 420 for generating a high pressure vacuum in the package to absorb the remaining moisture.

The heater 420 is a part for dissipating heat for drying the semiconductor package, and the number, structure, and heat generation amount of a heating wire (not shown) may be variously selected according to design conditions.

The horizontal moving means is simply composed of a second rotary cylinder 432, pinion 433 and the rack 434. Here, the second rotary cylinder 432 is to provide a rotational force to the pinion 433, it is installed under the moving frame 410. The pinion 433 is installed on the rotation shaft of the second rotary cylinder 432, and the rack 434 is installed on the support frame 440 to be engaged with the pinion 433. Therefore, when the second rotary cylinder 432 is driven while the pinion 433 and the rack 434 are engaged with each other, the movable frame 410 may move horizontally along the guide rail 442.

On the other hand, the horizontal movement means may be selected as long as any known horizontal movement mechanism, it is not limited to the structure shown in FIG. For example, the horizontal movement means is installed on a side of the support frame 440, the screw shaft (not shown) connected to a predetermined drive motor in parallel with the guide rail, the screw on one side of the moving frame 410 It may be configured by installing a nut member (not shown) fastened to the shaft.

Thus, since the drying apparatus 400 dries the package while moving to the vision inspection apparatus 500 in a state where the package is mounted, the drying apparatus 400 shortens the transfer time to the vision inspection apparatus 500 and significantly improves the working speed of the system. You can.

Hereinafter, the strip picker 140 and the first package picker 240 will be described.

As shown in FIGS. 3 and 4, the strip picker 140 adsorbs a semiconductor strip and seats the strip picker body 142 and the strip on the chuck table 210 installed in the cutting device 200. The strip picker head 144 which adsorb | sucks in a vacuum is comprised. One side of the strip picker 140 is provided with a draw picker 150 for extracting a strip from the on-load device 100, the draw picker driving means 146 for lifting the draw picker 150 up and down is provided It is. Meanwhile, the first package picker 240 absorbs individual semiconductor packages cut by the cutting device 200 and delivers the semiconductor packages to the cleaning device 300 and the drying device 400, and the first package picker body ( 242 and a first package picker head 244 for vacuum suction of the package.

The strip picker 140 is installed to be movable along the guide rail 150 installed between the on-load device 100 and the cutting device 200, and the first package picker 240 is the cutting device. The guide rail 150 installed between the 200, the washing apparatus 300, and the drying apparatus 400 is installed to be movable. In addition, the strip picker 140 and the first package picker 240 are each designed to be vertically movable.

Since the strip picker 140 and the first package picker 240 are driven independently by separate picker driving members, the strip picker 140 can be efficiently loaded into the cutting device 200, and the package is cut from the cutting device 200. It can be effectively delivered to the washing apparatus 300 and the drying apparatus 400. As these picker driving members, known horizontal movement mechanisms such as ball screw and nut combinations or belt and pulley combinations can be selected according to design conditions.

In other words, when the strip picker 140 and the first package picker 240 are provided separately and move independently, the strip picker 140 is responsible for loading the strip into the chuck table 210. The first package picker 240 may perform a dedicated role of picking up individual packages from the chuck table 210 and then loading them into the drying apparatus 400 via the washing apparatus 300. Therefore, as soon as the first package picker 240 picks up individual packages, the first picker picker 240 may transfer the cleaning device 300 to the washing apparatus 300 so that the first picker picker 240 may perform the washing. There is no need to wait until loading, which significantly increases the process efficiency of the system.

Here, the first package picker head 244 of the first package picker 240 is preferably configured to protrude toward the drying device 400 with respect to the first package picker body 242. This is because the guide rail 250 for guiding the first package picker 240 and the guide rail 530 for guiding the second package picker 520 installed in the vision inspection area are separately installed. In order to easily transfer the package having been cleaned to the drying apparatus 400. However, this configuration would be unnecessary if the guide rail 250 installed in the cutting area is slightly extended to the vision inspection area.

Meanwhile, an air nozzle (not shown) may be installed in the first package picker head 244 of the first package picker 240. The air spraying device may be referred to as an auxiliary drying device provided to dry the package, which has been cleaned, together with the drying heat provided by the drying device 400 more quickly.

Hereinafter, the draw picker 150 will be described with reference to the accompanying drawings.

8A and 8B are reference diagrams for describing the configuration and operation of the draw picker 150.

As shown in FIGS. 8A and 8B, the draw picker 150 serves to withdraw the strip from the on-load apparatus 100. The draw picker 150 includes a draw picker body 152, a gripper driving means, an upper gripper 156, and a lower gripper 157. In this embodiment, a pneumatic cylinder 154 is provided as the gripper driving means.

The upper gripper 156 is fixed to the rod end of the pneumatic cylinder 154, the lower gripper 157 is fixed to the lower end of the draw pick body 152 to face the upper gripper 156. . Accordingly, the operation of the pneumatic cylinder 154 allows the upper gripper 156 to pick up the strip while moving relative to the lower gripper 157.

However, according to design conditions, the lower gripper 157 may be designed to grip the strip while moving relative to the upper gripper 156.

On the other hand, although the grip member 158 is attached to the bottom of the upper gripper 156 to prevent slipping when the strip is gripped, the friction coefficients of the upper and lower grippers 156 and 157 are both large. The grip member 158 formed as may be attached.

Since the draw picker 150 is directly installed on the strip supply direction side of the strip picker 140, the draw picker 150 moves the strip inlet rail 160 according to the movement of the strip picker 140 without a separate driving source. ) Can be withdrawn.

In addition, the draw picker 150 may be moved up and down relative to the strip picker 140 by the operation of the draw picker driving means 146 installed in the strip picker 140. The draw picker 150 is moved up and down with respect to the strip picker 140 is to prevent the bottom picker strip 140 from interfering with the inlet rail 160 when the draw picker 150 picks up the strip. To do that.

However, depending on design conditions, the draw picker 150 may be fixed without being raised or lowered with respect to the strip picker 140. That is, since the space is formed in the center of the inlet rail 160, if the draw picker 150 is installed slightly below the bottom of the strip picker 140 corresponding to the space, the strip picker 140 is inlet rail 160 When the strip is picked up from), there is no interference between the inlet rail 160 and the strip picker 140.

Since the draw picker 150 configured as described above can be moved together with the strip picker 140, it is not necessary to separately provide a horizontal moving means of the draw picker 150 to draw out the strip, thereby simplifying the configuration of the equipment. have.

The vision inspection apparatus 500 serves to inspect whether the semiconductor package dried in the drying apparatus 400 is defective, and an upper vision inspector 540 inspecting the upper surface of the package and a lower surface inspecting the lower surface of the package. It is composed of a vision inspector (550). The offload device 600 sorts and unloads the semiconductor package into good or bad according to the vision inspection results of the upper and lower vision inspectors 540 and 550. Since this configuration is similar to the conventional technical configuration, a detailed description thereof will be omitted.

However, in the present embodiment, the second package picker 520 dedicated to delivering the dried package from the drying apparatus 400 to the turntable 510 for vision inspection and the tray 610 on which the vision-completed package is mounted are provided. A tray picker 620 dedicated to unloading or loading a new tray 610 is configured to move horizontally and vertically independently by a separate picker driving member. Therefore, while the second package picker 520 loads the dried semiconductor packages from the drying apparatus 400 to the vision inspection turntable 530, the tracer picker 620 performs the second package picker. In addition to the operation of 520, it is possible to perform a task assigned to the self, thereby significantly improving the processing speed.

As described above, in the first embodiment, the on-load apparatus 100, the inlet rail 160, the strip picker 140, and the first package picker (which were installed on the handler apparatus side in the conventional cutting and handler apparatus) 240 and the cleaning device 300 is disposed on the cutting device 200 side. That is, the strip picker 140 having the on-loading device 100, the inlet rail 160, and the draw picker 150, which is a device related to the storage of the strip and the on-loading to the cutting device 200, is a cutting device ( As it is disposed to move toward the inlet side of the 200, and the first package picker 240 and the cleaning device 300 is disposed to move to the outlet side of the cutting device 200, in the reverse order of the process progress direction of the strip / package in the conventional system Components are arranged naturally in the process direction of the strip / package. Thus, the structure of the handler device side is simplified, and the components can be efficiently placed, thereby significantly increasing the unit per hour (UPH) of the system.

Hereinafter, an operation of a cutting and handler system for a semiconductor package manufacturing process according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings.

9 is a plan view schematically showing a process progress path of a semiconductor strip in a cutting and handler system according to a first embodiment of the present invention. Looking at the overall process progress path of the strip (S) / package (P) with reference to Figure 9 as follows.

The semiconductor strip S loaded on the on-load device 100 is transferred to the cutting device 200 via the inlet rail 160 and cut into individual semiconductor packages P. The semiconductor packages P cut individually are washed in the washing apparatus 300 and dried in the drying apparatus 400, and then transferred to the vision inspection apparatus 500. The semiconductor package P having the vision inspection completed in the vision inspection apparatus 500 is classified as good or defective according to the vision inspection result, and transferred to the offload apparatus 600 to complete the entire process.

Hereinafter, a process in which the semiconductor strip S loaded in the on-load device 100 is loaded into the cutting device 200 will be described. 10A to 10G are reference views sequentially illustrating a process of loading the semiconductor strip S loaded on the on-load apparatus 100 into the cutting apparatus 200 in the cutting and handler system according to the present embodiment.

First, when a magazine (not shown) loaded with a plurality of semiconductor strips S is horizontally moved along a rail, it is lifted by the elevator 126 to reach a height at which the inlet rail 160 is installed. In this state, the pusher 130 of the on-load apparatus 100 pushes one of the plurality of strips loaded in the magazine (not shown) toward the inlet rail 160. At the same time, the draw picker 150 mounted on the strip picker 140 descends and stands by (see FIGS. 5A and 5B).

When the strip S is supplied to the inlet rail 160, the draw picker 150 that is waiting moves to the strip S side to grip one side of the strip S. At this time, since the draw picker 150 is directly installed on the side of the strip picker 140, the strip picker 140 is horizontally moved as the horizontal picker 140 moves horizontally. As such, the draw picker 150 transfers the strip picker 140 to an area where the strip picker S can pick up the strip S in a state where the draw picker S grips the strip S, and then puts it down on the inlet rail 160. (See FIGS. 5C and 5D).

When the draw picker 140 is raised to an appropriate position, the strip picker 140 moves directly above the strip S, and then the strip picker head 144 is lowered to suck the strip S in a vacuum. . After lifting the strip picker head 144 to pick up the strip S, the strip picker 140 moves horizontally along the guide rail 250 to the upper side of the chuck table 210 of the cutting device 200. . Next, the strip picker head 144 is lowered to the upper surface of the chuck table 210, and then the vacuum applied to the strip S is released to release the strip S to the seating portion of the chuck table 210. Load (see FIGS. 5E, 5F and 5G).

On the other hand, when the strip S is loaded on the chuck table 210, the chuck table 210 is moved horizontally toward the cutting blade 222 after rotating 90 °, and then the strip (not shown) by a vision inspection device (not shown) The alignment of S) is checked. After correcting the alignment error of the strip (S) according to the vision inspection result, the strip (S) is cut in the width direction and the longitudinal direction by the relative movement of the spindle 220 and the chuck table 210, Are separated into packages.

While the strip S is cut into individual packages P by the cutting device 200 through the above process, a new strip S is drawn out from the on-load device 100, as shown in Fig. 10F. As shown, it is in a standby state for loading into the chuck table 210 of the cutting device 200.

Hereinafter, a process of washing, drying, and vision inspection by unloading the semiconductor package P in which the cutting is completed will be described. 11A through 11E are reference views sequentially illustrating a process of unloading a semiconductor package having been cut in the cutting and handler system shown in FIG. 3 and transferring the unloaded semiconductor package to a cleaning apparatus, a drying apparatus, and a vision inspection apparatus.

When the strip S is cut into individual packages P, the chuck table 210 moves horizontally to the package P unloading position (strip S loading position). When the chuck table 210 is moved to the unloading position as described above, the first package picker 240 moves to the upper portion of the chuck table 210 to adsorb the package P, and then to the washing apparatus 300. Transfer. Here, unlike when receiving the strip (S) from the strip picker 140, the chuck table 210 is unpacked by the first package picker 240 in the state rotated 90 degrees from the first relative (P) It is preferable to load. This allows the cleaning device 300 and the drying device 400, in which the cut-off package P is cleaned and dried, to be disposed long in the front-rear direction (Y-axis direction) on the drawing, thereby compacting the system in the X-axis direction. It is a configuration to make it.

When the package P is transferred to the cleaning device 300 by the first package picker 240, the package P is lowered and then closely inserted into the opening of the chamber. Thereafter, the washing water nozzle 322 installed in the washing apparatus 300 washes the package P while reciprocating at a predetermined spray angle. Thereafter, air is injected through the air nozzle 324 to preliminarily remove water contained in the package P. In this embodiment, by selecting the spray angle of the washing water nozzle 322 and the air nozzle 324 in various ways, because the washing water and the air can be sprayed at various angles on the lower surface of the package (P) package (P) in a relatively short time ) Can remove cutting chips or foreign matter.

Of course, the washing water and the air nozzle 324 can be controlled to be sprayed at the same time and the washing water and the air, the washing water and the air through the nozzle 324 and the air nozzle 324 alternately at regular intervals May be controlled to be injected into (see FIGS. 11A and 11B).

When the washing is completed, the first package picker 240 moves to the drying apparatus 400 and then mounts the package P on the seating part of the drying apparatus 400. At this time, since the first package picker head 244 is installed to be eccentric from the first package picker body 242 toward the drying apparatus 400, the package P can be effectively mounted by the drying apparatus 400. (See FIG. 11C).

On the other hand, when the package P is seated on the seating portion of the drying apparatus 400, the drying apparatus 400 is moved toward the vision inspection turntable 510 by the above-described horizontal moving means to dry the package (P). . When the package P is dried during the movement of the drying apparatus 400 as described above, the second package picker 520 absorbs the package P from the drying apparatus 400 and delivers the package P to the vision inspection turntable 510. (See FIGS. 11D and 11E)

Thereafter, the package P is classified as good or defective according to the vision inspection result by the vision inspection apparatus 500, and the entire process is completed through the process of being loaded into the offload apparatus 600. Since this process can be understood from the above description, a detailed description is omitted.

Hereinafter, a semiconductor package cutting and handler system according to a second embodiment of the present invention will be described in detail with reference to the accompanying drawings.

12 is a plan view schematically illustrating a cutting and handler system for a semiconductor package manufacturing process according to a second exemplary embodiment of the present invention, and FIG. 13 is a perspective view illustrating a cutting table of the cutting device illustrated in FIG. 12.

The cutting and handler system for the semiconductor package manufacturing process according to the second embodiment is also largely the on-load device 100, the cutting device 200, the washing device 300, and the drying device 400 as in the embodiment shown in FIG. 3. , The vision inspection device 500 and the off-road device 600.

Here, in the cutting and handler system for the semiconductor package manufacturing process according to the second embodiment, a pair of seating portions 218 are provided on the cutting plate 216 of the chuck table 210 provided in the cutting device 200, The strip picker 140 and the first package picker 240 are not installed to be movable on the same straight line, but are installed to be movable in parallel along the extension lines of the pair of seating portions 218. Therefore, the installation structure of the strip picker 140 and the first package picker 240 is distinguished from that of the first embodiment, and the process of loading the strip S into the chuck table 210 of the cutting device 200. The process of cutting in the cutting device 200 and the process of unloading the individually cut package P are distinguished from those of the first embodiment. On the other hand, the rest of the configuration and operation except for this part is the same, so will be described below with respect to this part.

12 and 13, the chuck table 210, the cutting table 214 is installed to be movable in the horizontal direction along the guide rail 260, and rotates on the cutting table 214 It consists of a cutting plate 216 which is possibly installed and loaded with a semiconductor strip on its top surface. The upper surface of the cutting plate 216 is provided with a pair of seating portions 218 on which the strip and the package are seated by vacuum suction.

In addition, the first package picker 240 is configured to be positioned in front of the system as compared to the strip picker 140 in plan view. On the other hand, after extending the ceiling member of the system to the front of the system in front of the guide rail 250 is installed under the ceiling member, the strip picker 140 and the first package picker 240 is a pair of seating portion 218 It may be installed to be movable on each of the extension line.

Meanwhile, in this embodiment, since the movement path of the strip picker 140 and the movement path of the first package picker 240 are different from each other, the rotation angle and rotation direction of the cutting plate 216 of the cutting device 200 must be properly controlled. do. That is, the position of the cutting plate 216 when unloading the package P after the cutting process is to be controlled to be rotated 180 degrees from the initial position when loading the strip (S). Thus, the strip S loading operation of the strip picker 140 and the package P unloading operation of the first package picker 240 may be simultaneously performed.

In the semiconductor package cutting and handler system according to the second embodiment, the loading operation of the strip S by the strip picker 140 and the unloading operation of the package P by the first package picker 240 are performed at the same time. Compared to the first embodiment of the present invention, the overall speed of the system can be greatly improved.

The preferred embodiment of the present invention has been described above. The present invention may use various changes, modifications, and equivalents. It is clear that the present invention can be applied in the same manner by appropriately modifying the above embodiments. Accordingly, the above description does not limit the scope of the invention as defined by the limitations of the following claims.

As described above, in the cutting and handler system for the semiconductor package manufacturing process according to the present invention, since the components are sequentially arranged in the processing sequence of the strip / package, the workflow is simplified and the yield per unit time is increased.

In addition, by placing the on-loading device and the inlet rail on one side of the cutting device and the cleaning device on the other side of the cutting device, the overall width of the system can be greatly reduced, so that the installation space can be efficiently used.

In addition, according to the present invention, the strip picker and the first package picker may be separated and driven so that the strip loading process into the cutting device and the package unloading process from the cutting device may be processed quickly. That is, the problem that the first package picker is delayed during the loading operation of the strip picker even after picking up the package from the turntable has been solved.

In addition, the present invention is provided with a draw picker having a new structure can effectively withdraw the strips loaded on the on-load device, this draw picker is coupled to one side of the strip picker is moved horizontally without a separate drive source, simplifying the system Can be configured.

In addition, the washing apparatus of the present invention is provided with a rotating nozzle to improve the washing speed, and because the designed package is designed to dry while being moved while seated on the drying apparatus, the washing and drying time is shortened and the working speed of the system is reduced. Significantly improved.

As such, the present invention can ultimately improve the productivity of the system by the above effects, and can reduce the installation and maintenance costs of the system.

Claims (12)

On-load device for receiving a plurality of semiconductor strips, A cutting device for cutting the semiconductor strip transferred from the on-load device into individual semiconductor packages; A cleaning device for cleaning the semiconductor package cut by the cutting device; A strip picker installed to be movable between the on-loading device and the cutting device, for extracting and transferring the semiconductor strip loaded on the on-loading device to the cutting device; Is installed to be movable between the cutting device and the cleaning device, configured to include a package picker for transferring the individual semiconductor package cut in the cutting device to the cleaning device, The onload device, the cutting device, and the cleaning device are sequentially disposed, and the semiconductor strip is cut into individual semiconductor packages while being sequentially transferred along the process progress direction to the onload device, the cutting device, and the cleaning device. Semiconductor strip cutting system. The method of claim 1, The strip picker includes a draw picker for extracting the semiconductor strip from the on-load device, and an inlet rail for guiding and aligning the semiconductor strip drawn by the draw picker is installed between the on-load device and the cutting device. A semiconductor strip cutting system, characterized in that. The method of claim 2, The draw picker, Draw Pick Body, A gripper driving means installed on the draw picker body; An upper gripper coupled to the gripper driving means and vertically moved by the operation of the gripper driving means; Including a lower gripper fixed to the lower portion of the draw picker body facing the upper gripper, And the semiconductor strip is picked up by relative movement of the upper gripper and the lower gripper. The method of claim 3, And said draw picker is coupled to be movable up and down relative to said strip picker. The method of claim 1, The washing device, Chamber, A nozzle support part rotatably installed in the chamber; A plurality of washing water nozzles for spraying the washing water toward the semiconductor package transferred from the cutting device while reciprocating the nozzle support at a predetermined spray angle; It is installed on one side of the chamber, the semiconductor strip cutting system comprising a nozzle driving means for providing a rotational force to the nozzle support. The method of claim 5, The nozzle support portion, And a plurality of air nozzles for injecting dry air toward the semiconductor package transferred from the cutting device. The method according to any one of claims 1 to 6, The cutting device, Cutting table is installed to be movable in the horizontal direction along the guide rail, A pair of cutting plates rotatably installed on an upper portion of the cutting table and alternately loaded with a semiconductor strip on an upper surface thereof; A spindle connected to the drive motor to impart rotational force to the cutting blade; And a cutting blade rotatably coupled to an end of the spindle and cutting the semiconductor strip loaded into the cutting plate into individual semiconductor packages by a relative motion with the cutting table. An on-load area for receiving a plurality of semiconductor strips, A cutting region for cutting the semiconductor strip transferred from the on-load region into individual semiconductor packages; A washing region for cleaning the semiconductor package cut in the cutting region; A drying area for drying the semiconductor package washed in the cleaning area; A vision inspection region for inspecting whether the semiconductor package dried in the drying region is defective; And an offload region for sorting and loading the semiconductor package according to the vision inspection result in the vision inspection region. The onload region, the cutting region, the washing region, the drying region, the vision inspection region, and the offload region are sequentially disposed, and the semiconductor strip is withdrawn from the onload region to proceed to the cutting region, the washing region, and the drying region. The semiconductor strip cutting and handler system of claim 1, wherein the semiconductor strip is cut, washed, and dried into individual semiconductor packages while being sequentially transferred along the direction, and then loaded into the off-road region according to the vision inspection result. The method of claim 8, Between the on-road region and the cutting region, A strip picker for extracting and transferring the semiconductor strips loaded in the on-load area to the cutting area is installed to be movable. Between the cutting zone, the washing zone and the drying zone, And a first package picker for transferring the individual semiconductor packages cut in the cutting area to the cleaning area and the drying area so as to be movable independently of the strip picker. The method of claim 8, In the drying area, And a drying apparatus for drying the semiconductor package while being moved by the horizontal moving means. The method of claim 10, The drying device, A moving frame installed to be movable along one direction axis and moving the semiconductor package seated on a seating portion formed at an upper portion thereof; A heater installed at a lower portion of the seating part to dry the semiconductor package seated at the seating part; And a horizontal moving unit coupled to the moving frame and horizontally moving the moving frame. The method of claim 11, The horizontal moving means, A rotary cylinder installed at the moving frame; A pinion rotatably coupled to the rotary cylinder; And a rack extending in a moving direction of the moving frame and engaged with the pinion.