HK1098251A1 - Sawing and handler system for manufacturing semiconductor package - Google Patents

Sawing and handler system for manufacturing semiconductor package

Info

Publication number
HK1098251A1
HK1098251A1 HK07105545.2A HK07105545A HK1098251A1 HK 1098251 A1 HK1098251 A1 HK 1098251A1 HK 07105545 A HK07105545 A HK 07105545A HK 1098251 A1 HK1098251 A1 HK 1098251A1
Authority
HK
Hong Kong
Prior art keywords
sawing
semiconductor package
manufacturing semiconductor
handler system
handler
Prior art date
Application number
HK07105545.2A
Original Assignee
Hanmi Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020040032326A external-priority patent/KR100574584B1/en
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Publication of HK1098251A1 publication Critical patent/HK1098251A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
HK07105545.2A 2004-05-07 2007-05-28 Sawing and handler system for manufacturing semiconductor package HK1098251A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040032326A KR100574584B1 (en) 2003-05-31 2004-05-07 sawing and handler system for manufacturing semiconductor package
PCT/KR2004/003127 WO2005109492A1 (en) 2004-05-07 2004-11-30 Sawing and handler system for manufacturing semiconductor package

Publications (1)

Publication Number Publication Date
HK1098251A1 true HK1098251A1 (en) 2007-07-13

Family

ID=35320473

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07105545.2A HK1098251A1 (en) 2004-05-07 2007-05-28 Sawing and handler system for manufacturing semiconductor package

Country Status (5)

Country Link
EP (1) EP1743368A4 (en)
JP (1) JP2007536727A (en)
CN (1) CN100470758C (en)
HK (1) HK1098251A1 (en)
WO (1) WO2005109492A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101969038B (en) 2004-08-23 2012-02-15 洛克系统有限公司 Supporting arrangement for a group of integrated circuit units
JP4944711B2 (en) * 2006-08-28 2012-06-06 ハンミ セミコンダクター カンパニー リミテッド Semiconductor package fixing assembly
JP4869184B2 (en) * 2006-08-28 2012-02-08 ハンミ セミコンダクター カンパニー リミテッド Jig assembly for fixing packages
JP2010539583A (en) * 2007-09-14 2010-12-16 ハンミ セミコンダクター カンパニー リミテッド Memory card processing equipment
NL2001790C2 (en) * 2008-07-11 2010-01-12 Fico Bv Device and method for cutting electronic components.
WO2010009881A1 (en) * 2008-07-23 2010-01-28 Meyer Burger Ag Multi-wire cutting device with a revolving workpiece mount
SG183593A1 (en) * 2011-03-02 2012-09-27 Rokko Systems Pte Ltd Improved system for substrate processing
KR101414690B1 (en) * 2013-04-22 2014-07-08 한미반도체 주식회사 Semiconductor Strip Sawing Apparatus
KR102267946B1 (en) * 2014-11-04 2021-06-22 세메스 주식회사 Apparatus for transferring semiconductor packages and semiconductor strip
KR101828381B1 (en) * 2016-08-31 2018-02-12 (주)임펙 엔터프라이즈 Substrate cutting apparatus comprising complex transfer tool and method of transferring substrate using the same
KR101863139B1 (en) * 2017-10-23 2018-05-31 (주)임펙 엔터프라이즈 Substrate cutting apparatus of which scrap collector is installed under unloading area
KR102019377B1 (en) * 2017-11-24 2019-09-06 한미반도체 주식회사 Sawing Apparatus of Semiconductor Materials
CN110370468B (en) * 2019-09-06 2020-07-24 浙江利恩工程设计咨询有限公司 Diversified marble cutting device
JP7377092B2 (en) * 2019-12-16 2023-11-09 Ｔｏｗａ株式会社 Statistical data generation method, cutting device and system
KR102617780B1 (en) * 2020-11-19 2023-12-26 세메스 주식회사 Apparatus for blowing air in semiconductor strip sawing and sorting equipment
KR20220072935A (en) * 2020-11-25 2022-06-03 세메스 주식회사 Apparatus for drying package in semiconductor strip sawing and sorting equipment
JP7496328B2 (en) 2021-03-24 2024-06-06 Ｔｏｗａ株式会社 Processing device and manufacturing method of processed products
JP7430154B2 (en) * 2021-03-29 2024-02-09 Ｔｏｗａ株式会社 Processing equipment and method for manufacturing processed products
JP2023022562A (en) * 2021-08-03 2023-02-15 Ｔｏｗａ株式会社 Processing apparatus and method for manufacturing processed product
JP2023023057A (en) * 2021-08-04 2023-02-16 Ｔｏｗａ株式会社 Processing apparatus and method for manufacturing processed product
CN116727361A (en) * 2023-08-16 2023-09-12 长园半导体设备(珠海)有限公司 Decontamination plant and sorting facilities

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3232575B2 (en) * 1990-10-16 2001-11-26 ソニー株式会社 Semiconductor processing equipment
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
JP2917262B2 (en) * 1993-01-11 1999-07-12 株式会社東京精密 Semiconductor wafer cleaning / drying equipment
JP3116619B2 (en) * 1993-01-11 2000-12-11 株式会社東京精密 Semiconductor wafer manufacturing system
JPH07171754A (en) * 1993-12-20 1995-07-11 Disco Abrasive Syst Ltd Dicing device with visual inspecting function
JPH07240453A (en) * 1994-02-28 1995-09-12 Seiko Seiki Co Ltd Processing machine for semiconductor wafer
JPH07240452A (en) * 1994-02-28 1995-09-12 Seiko Seiki Co Ltd Processing machine for semiconductor wafer
JPH0831785A (en) * 1994-07-12 1996-02-02 Sony Corp Cleaning method and apparatus for wafer
JP4339452B2 (en) * 1999-07-09 2009-10-07 株式会社ディスコ CSP substrate splitting device
JP2000232080A (en) * 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd Workpiece to be processed dividing system, and pellet- shifting apparatus
GB2370411B (en) * 2000-12-20 2003-08-13 Hanmi Co Ltd Handler system for cutting a semiconductor package device
JP3765265B2 (en) * 2001-11-28 2006-04-12 株式会社東京精密 Dicing machine
JP2003318137A (en) * 2002-04-24 2003-11-07 Korea Semiconductor System Co Ltd Method for splitting semiconductor package
JP4315788B2 (en) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 Semiconductor device manufacturing method and manufacturing apparatus

Also Published As

Publication number Publication date
WO2005109492A1 (en) 2005-11-17
EP1743368A1 (en) 2007-01-17
CN1954423A (en) 2007-04-25
CN100470758C (en) 2009-03-18
JP2007536727A (en) 2007-12-13
EP1743368A4 (en) 2009-01-28

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