WO2010009881A1

WO2010009881A1 - Multi-wire cutting device with a revolving workpiece mount

Info

Publication number: WO2010009881A1
Application number: PCT/EP2009/005331
Authority: WO
Inventors: John G. Beesley; Arndt Günter PUSCHMANN
Original assignee: Meyer Burger Ag
Priority date: 2008-07-23
Filing date: 2009-07-23
Publication date: 2010-01-28

Abstract

The present invention relates to a multi-wire cutting device (1) with a revolving workpiece mount (2) and a method for cutting solid substrates, for example, for use as wafers in the semiconductor, photovoltaics, optical, ceramics, electro- and magnetotechnical industry.

Description

MULTI-WIRE CUTTING DEVICE WITH A REVOLVING WORKPIECE MOUNT

Description

The present invention relates to a multi-wire cutting device (1) with a revolving workpiece mount (2) and a method for cutting solid substrates, for example, for use as wafers in the semiconductor, photovoltaics, ceramics, electrical and optical industry.

State of the art

Even though the prior art is described with reference to wire-cut crystalline silicon products for historical reasons, it is noted that the present invention is by no means limited to cutting silicon wafers but can be applied to any other solid product that enables and desirably requires slicing.

Over 80 % of the global solar cell production requires the cutting of multi- or mono- crystalline silicon blocks into wafers. For this purpose multi-wire sawing is the main slicing technique in the photovoltaic and microelectronics industry. Due to its high throughput, small kerf loss, little restriction on the size of ingots as well as its excellent wafer surface quality, this technology dominates over other techniques.

Prior to the wafer slicing procedure, multicrystalline ingots grown by directional solidification techniques reaching cross sections of more than 90 x 90 cm² and weighing over 400 kg or monocrystalline Czochralski crystals with diameters of up to 50 cm, require some pre-sizing treatment.

This pre-treatment normally involves a cropping process of cutting the conical caps off the raw single crystal, e.g. on an inner diameter saw (e.g. ID saw TS207 from Meyer- Burger AG, Steffisburg, Switzerland), after which the outer diameter can be ground. The ID saw makes use of the advantage of tensioning a very thin disk with an inner hole, resulting in a disk with a much higher stability than the equivalent outer diameter saw blade, thus reducing kerf loss. To increase the fill factor of a solar panel the monocrystalline ingots are squared. Equally, the very hard and contaminated crust must be sawn off the polysilicon ingots and workpieces, with the format of the future wafers cut out of the polysilicon casting (e.g. 156 x 156 mm). For example, this is commonly done with band saws using diamond-plated saw bands (e.g. Bandsaw BS 800, 805 and 830 from Meyer-Burger AG) enabling high cutting and feed rates.

After sizing the silicon ingot with a length of up to about one meter, it is typically glued on one side to a glass support plate (a support beam sacrificed during wire-cutting) which is in turn glued to a workpiece mount for positioning the workpiece appropriately within the multi-wire saw. This multi-wire cutting device then slices the workpiece into wafers with a thickness in the range of 70 to 2000 μm, e.g. on a DS 264 multi-wire saw from Meyer- Burger AG, CH. In this technique a single wire with a diameter of about 80 to 180 μm and a spool length of about 100 to 2500 km is fed from a supply spool through a wire tensioning system to wire guide rollers which are grooved with a constant or a compensated pitch. By winding the wires over these wire guide rollers, a wire web is formed. At the output end a take-up spool collects the consumed wire. An abrasive, slurry supplied from a nozzle system onto the wire web, is carried with the moving wire into the sawing channel to perform the cut-lapping process. The slurry consists of hard grinding particles, generally SiC, with a diameter in the range of 5 to 15 μm which are suspended in glycol, oil or blends of water with additives. By pushing the silicon workpiece against the wire web it is sliced into thousands of wafers in a single run. For a review on multi-wire technology see H. B. Mόller, Basic mechanisms and models of multi- wire sawing, Advanced Engineering Materials, 6, no. 7 (2004); Funke et al., Surface damage from multi wire sawing and mechanical properties of silicon wafers, 2CV.5.7, 20^th Photovoltaic Solar Energy Conference, Barcelona, Spain, 2005.

At the end of the multi-wire sawing process thousands of thin wafers are still attached to the partially cut glass support plate (beam for sacrifice, now having a comb-like structure) on the workpiece mount. All wafer surfaces in contact with the wire now have abrasive slurry sticking to them which has to be removed completely prior to further processing for photovoltaic or microelectronics purposes.

The cut workpiece can be cleaned while still fixed to and/or already separated from the previously used workpiece mount. The wafers are typically separated from the partially cut glass plate or epoxy/graphite beam by cold or hot solvent compositions or a solvent vapour, most often by aqueous solutions optionally comprising chemicals or by hot water vapour. The workpiece mount and the support plate or beam are typically separated by thermal decomposition of the glue (burning) and subsequently scraping and cleaning the workpiece mount^'s gluing surface or, alternatively, by a solvent system suited for the glue employed.

The multi-wire cutting process is very time consuming as commonly one workpiece is cut at a time. Alternatively, more than one workpiece can be arranged in parallel or in line on the wire web. The down time is shortened by mounting ready-to-use preglued mount/glass support/silicon workpieces.

Furthermore, there is still a significant number of waste wafers, in particular, when cutting very thin wafers, due to the breakage caused by deflected wires of the wire web. Moreover, depending on the wire's and the slurry's composition and nature, the as cut surface can be more or less rough and uneven, a more even surface typically being highly desirable.

It is the object of the present invention to provide an improved device and method for cutting solid substrates with an increased speed and/or capacity in the number of workpieces, a reduced tooling time and resulting in less substrate breakage and/or more evenly cut surfaces.

This object is solved according to the invention by a multi-wire cutting device (1), comprising: (a) a revolving workpiece mount (2), comprising a body (3), one or two pivot mount(s) (4) positioned on one or both ends of the rotational axis (5) of body (3) and one or more workpiece holders (6) positioned either on the periphery (7) of body (3) or in front of body (3),

(b) at least one rotational drive (8) functionally connected to said revolving workpiece mount (2);

(c) a wire web (9);

(d) at least one means (10) for moving one or more workpieces (11) on the revolving workpiece mount (2) into contact with the wire web (9); wherein in operation at least one workpiece holder (6) is occupied by a work piece (11), the revolving workpiece mount (2) is rotated by rotational drive (8), said means (10) moves the rotating workpiece(s) (11) on the revolving workpiece mount (2) onto the moving wire web (9), and the rotating workpiece(s) (11) on the workpiece holder(s) (6) is (are) cut by wire web (9).

The advantage of the multi-wire cutting device (1) of the invention comprising two or more workpiece holders (6) positioned on the periphery (7) of body (3) is that more than one workpiece can be sliced at the same time, thus, reducing the cutting time substantially, reducing the tooling time substantially and reducing the cutting costs per workpiece substantially.

Moreover, for both embodiments of the multi-wire cutting device of the invention, i.e. (i) one with a revolving workpiece mount (2) comprising one or more workpiece holders (6) positioned on the periphery (7) of body (3) (see figure 1) or (ii) the other with a revolving workpiece mount (2) having one or more workpiece holders (6) positioned in front of body (3) (see figures 2A & 2B), the surface kerf structure of the resulting slices is preferably not parallel but curved providing for enhanced stability against breakage.

Furthermore, the curved slicing action provides for a unique grinding and polishing action resulting in a surface of the cut wafers differing from conventionally wire-sawn wafers. Wafers cut with a device according to the invention typically show a more even cut and smoother surface.

Another advantage of the device of the present invention is that even though more than one workpiece can be cut simultaneously, the dimension of the wire-web can be sized to accept only one workpiece at a time, because all workpiece(s) (11) on the revolving workpiece mount (2) are cut almost simultaneously (minimal delay of a partial or at most one rotation) in about the same position on the wire-web (9).

For the device of the present invention the revolving workpiece mount (2) is an essential member. Its body (3) is pivot-mounted at one or both ends of a rotational axis (5) that runs essentially parallel to that of the wire guide rollers of the wire-web. If the rotational axis of the revolving workpiece mount (2) and that of the wire guide rollers were not at least about parallel, the wire-web would obviously cut diagionally and eventually grind the surface of the rotating workpiece instead of cutting a kerf into it. Hence, it is preferred that the rotational axis of the revolving workpiece mount (2) and that of the wire guide rollers of the wire web (9) are parallel to each other to an extent that allows for the desired kerf formation. From the above it is clear that the term "the rotating workpiece(s) (11) on the workpiece holder(s) (6) is (are) cut by the wire web (9)", as used in the context of the present invention, implies the correct orientation of the revolving workpiece mount (2) and wire web (9) relative to each other.

Body (3) is preferably symmetric and more preferably weight-balanced relative to its rotational axis to avoid an unbalance during rotation. For example, it may have the shape of a cylinder, a drum, a bevelled cylinder or drum, e. g. a hexagonal, octagonal, etc. cylinder or drum. However, it may also be asymmetric, e.g. ellipsoid, to the extent that the rotational unbalance is still acceptable and all workpieces (11) can still be cut by the wire web (9). There is no particular limitation to the shape of body (3) as long as the mounted workpieces are rotated parallel with the wire guide rollers of the wire web (9) and are adequately sliced.

It is preferred that the body (3) is pivot-mounted on both ends (4) of its rotational axis (5) to provide for enhanced rotational stability.

Of course, in an embodiment of the inventive device where a single workpiece (11) and holder (6) are positioned in front of body (3), one pivot mount (4) on the side of body (3) opposite to the workpiece (11 ) is preferred.

Furthermore, body (3) preferably has one, two or more workpiece holders (6) on its periphery (7). The term "workpiece holder" is meant to be functional and is not intended to be limited to any particular structure. Its function is simply to receive and immobilize a workpiece (11) either alone or in combination with other members that might be employed, e.g. a carrier beam, clamp, fastener, etc. A workpiece holder (6) may be a separate member attached to body (3) or it may be integrally shaped into body (3). For example, it could merely consist of a planar or otherwise shaped surface for securing a workpiece by means of an adhesive or it might comprise a clamp and/or locking screws.

On the other hand, the number of workpiece holders (6) does not necessarily limit the number of workpieces (11) on body (3) of the revolving workpiece mount (2). For example, further workpieces can be attached to the workpieces already mounted on body (3), e.g. by gluing, icing, etc, and, thus, bundling and packing them. For example, zylinders can be packed like a honeycomb and spheres can be packed as ordered or random aggregates of individual workpieces. The term "periphery" (7) in the context of body (3) is meant to indicate a position that will allow access of the wire web to the workpiece (11) on the circumference (sides, in particular perimeter) to allow cutting without also cutting into body (3) itself. However, this does not exclude that body (3) comprises some member for sacrificing, e.g. a glass or plastic beam, whereon the workpiece (11) is attached, e.g. by gluing.

In another embodiment of the invention, one (see for example fig. 2A) or more workpiece holders (6) (see for example fig. 2B) and workpiece(s) (11) will be positioned in front of body (3) opposite of the pivot mount (4b). In that case the wire web should be spatially arranged to cut the workpiece (11) only and leave body (3) unharmed.

The revolving workpiece mount (2) and the wire guide rollers of the wire web (9) can either rotate in the same or opposite directions. If both rotate in the same direction, the difference in rotation speeds must be set to result in sufficient cutting speed for kerf formation.

It is preferred that revolving workpiece mount (2) and the wire guide rollers of wire web (9) rotate in opposite directions. In this case the wire speed and the speed of the revolving workpiece mount (2) can be optimized relative to each other to optimize kerf formation and still reduce the speed of each of the moving members because both its speeds are additive to the cutting speed and therefore to the cutting action.

In a preferred alternative embodiment, the revolving workpiece mount (2) can rotate the workpiece(s) (11) alternately in the same and opposite/counter direction relative to the direction of rotation of the wire web (9). By doing this the wire material can be reused to save costs. In a preferred embodiment, the alternating rotations and counter rotations can be incomplete rotations, e.g. rotations of less than 360 degrees. Alternating incomplete (partial) rotations can also be designated as a "rocking motion".

For the embodiment having workpiece(s) (11) positioned on the periphery (7) of body (3) it is preferred that at least two, preferably all workpiece holders (6) are each positioned at about the same distance from the rotational axis (5) of body (3) of the revolving workpiece mount (2). At least for similarly shaped workpieces of similar composition this ensures that a rotational imbalance in mount (2) is minimized and that the workpieces (11) are all cut at a similar rate. In a more preferred embodiment the multi-wire cutting device (1) according to the invention is one, wherein at least two, preferably all workpiece holders (6) can be adapted so that at least two, preferably all workpieces (11) have about the same distance from the rotational axis (5) of body (3) of the revolving workpiece mount (2). This allows for better processing non-uniform workpieces.

In a preferred embodiment of the device of the present invention the wire web (9) is one for transporting abrasive slurry from a slurry source. Slurry abrasives for wire web cutting devices are well known in the art. For example, silicon carbide, boron carbide, diamond powder, etc., which is suspended in a carrier such as oil, polyethylene glycol, water or blends thereof. Diamond based grits can consist of poly- or monocrystalline as well as natural diamond particles. In another preferred embodiment, the wire web (9) is a fixed abrasive wire web, preferably a diamond wire.

The term "at least one means (10) for moving one or more workpieces (11) on the revolving workpiece mount (2) into contact with the wire web (9)", as it is used in the context of the wire-cutting device (1) of the present invention, is not limited by its physical structure but merely by its functional result. Preferred embodiments of means (10) comprise a guide rail and a drive mechanism, for example a motor spindle drive or lifting cylinder.

The workpieces for being cut by the device of the present invention can feature many different shapes, e.g. cylinders, for example monocrytalline silicon ingots, bricks, for example precut polycrystalline silicon bricks, irregular shapes, for example natural or synthetic sapphires, glass blocks or panes, materials for the optics industry, e.g. crystal rods for harmonic generation, lasers, etc.

In some cases, the workpieces can be produced uniformly or be sized to attain uniformity. In such a case, it is preferred that the two or more workpiece holders (6) of the multi-wire cutting device (1) according to the invention are adapted and/or shaped to match the workpiece and/or the beam or some type of carrier holding the workpiece in place.

In a more preferred embodiment of the present invention, body (3) is cylinder-shaped, drum-shaped, shaped like a bevelled drum, preferably shaped as a penta-, hexa- or octagonal cylinder or drum or contains a clamping system for (a) work piece holder(s). Bevelled surfaces are particularly suited for attaching workpieces with at least one planar surface.

In another more preferred embodiment the multi-wire cutting device (1) according to the invention is one, wherein body (3) is shaped on its periphery to adapt to a round, preferably cylindrical or drum-shaped or angular workpiece (11).

The multi-wire cutting device (1) according to the invention is very efficient in simultaneously processing 2 and or more workpieces. It is of course understood that the device can also be furnished with one workpiece only. For example, one workpiece can either be positioned on the periphery (7) of body (3) (see for example fig. 1) or in front of body (3) (see for example figs. 2A & 2B). The number of workpieces on the periphery (7) of body (3) that can be processed (cut) at the same time depends on a number of parameters such as, e.g. the size and physical composition of the workpieces used, the wire web's physical capacity, etc. There is basically no limitation to the number of workpieces that can be processed as long as a suitable revolving workpiece mount (2) and a correspondingly adapted wire web (9) are feasible. In a preferred embodiment the revolving workpiece mount (2) may comprise at least 1 or 2, preferably at least 3, more preferably at least 4 to 12, e.g. 4 to 8, most preferably 4 to 6 workpiece holders (6).

Preferably, the multi-wire cutting device (1) according to the invention is one, wherein the revolving workpiece mount (2) is kept stationary and the web wire (9) is moved by at least one means (10) towards the revolving workpiece mount (2).

In an alternative preferred embodiment, the revolving workpiece mount (2) is moved by at least one means (10) towards the stationary web wire (9).

For attaching the workpiece(s) (11) to the revolving workpiece mount (2) it (they) is (are) preferably glued to workpiece holders (6) or body (3) directly, i.e. body (3) is shaped to integrally comprise one or more workpiece holder(s), e.g. some surface to which the workpiece can be attached to, e.g. by means of an adhesive.

In a more preferred embodiment, the workpiece(s) (11) is (are) glued to a beam(s) (any carrier member(s) for the workpiece(s)) (12) held by workpiece holders (6). In a further more preferred embodiment, the workpiece(s) (11) is (are) held by the workpiece holders (6) by mechanical means.

The multi-wire cutting device (1) of the present invention is universally applicable to workpieces of all materials that can be cut by a multi-wire cutting device.

In a preferred embodiment, the workpiece(s) (11) for the multi-wire cutting device (2) of the present invention is (are) selected from workpieces selected from the group of solid metals, alloys, crystals, gemstones, polymers and glass, preferably from multicrystalline silicon, noncrystalline silicon, ceramics, glass (e.g. quartz), sapphire, silicon carbide, silicon nitride and solid-state laser optical materials.

A further aspect of the present invention relates to a method for slicing solid workpieces, comprising the following steps: a) attaching one or more workpieces (11) to the periphery (7) or in front of a revolving workpiece mount (2) having one rotational axis (5), b) rotating the loaded revolving workpiece mount (2) of step a) along its rotational axis (5), c) moving the rotating workpiece(s) (11) on the revolving workpiece mount (2) into contact with a moving wire web (9) and cutting the rotating workpiece(s) (11 ) on the revolving workpiece mount (2) into slices by the moving wire web (9).

It is of course understood by those of skill in the art that the moving wire web (9) and the revolving workpiece mount (2) having attached thereto one or more workpiece(s) (11) must be spatially arranged in such a meaningful manner that a slicing action for the workpiece(s) results when the moving wire web (9) comes into contact with the workpiece(s) (11) rotating on the revolving workpiece mount (2). The options for this arrangement are very limited and easily understood by those of skill in the art of wire sawing. For illustrative purposes the figures below are pointed out.

In a preferred embodiment of the method of the invention the revolving workpiece mount (2) is as described above for the inventive device.

Preferably, in the method of the invention said revolving workpiece mount (2) rotates the workpiece(s) (11) in the same direction relative to the direction of rotation of the wire web O)- It is also preferred that said revolving workpiece mount (2) rotates the workpiece(s) (11) in the opposite direction relative to the direction of propagation of the wire web (9).

Alternatively, said revolving workpiece mount (2) may rotate the workpiece(s) (11) alternately in the same and opposite direction relative to the direction of propagation of the wire web (9). The rotation may be complete or incomplete as discussed above for the corresponding device.

Preferably at least two, preferably all workpieces (11) are each positioned at about the same distance from the rotational axis (5) of the body (3) of the revolving workpiece mount (2).

In a preferred embodiment, the workpiece(s) (11) is (are) cut by a wire web (9) for transporting abrasive slurry from a slurry source or a fixed abrasive wire web, preferably a diamond wire.

Preferably at least 2 or 3, more preferably at least 4 to 8, most preferably 4 to 6 workpiece(s) (11) positioned on the periphery (7) of body (3) of the revolving workpiece mount (2) are cut simultaneously by wire web (9).

In the method of the invention, it is preferred that the workpiece(s) (11) is (are) glued to workpiece holder(s) (6) on the revolving workpiece mount (2).

More preferably, the workpiece(s) (11) is (are) glued to a beam(s) held by workpiece holders (6) on the revolving workpiece mount (2).

Alternatively, the workpiece(s) (11) is (are) held by workpiece holders (6) on the revolving workpiece mount (2) by mechanical means.

In a preferred embodiment, the workpiece(s) (11) is (are) selected from workpieces selected from the group of solid metals, alloys, crystals, gemstones, polymers and glass, preferably from multicrystalline silicon, (noncrystalline silicon, ceramics, glass, sapphire, silicon carbide, silicon nitride and solid-state laser optical materials. In a most preferred embodiment the method of the invention is practiced on a device of the present invention.

A third aspect of the present invention relates to the use of a multi-wire cutting device (1) according to the invention for practicing a method according to the invention.

In the following three specific embodiments of the inventive multi-wire cutting device are presented for illustrative purposes only and are not intended be construed as limiting the broad scope of the invention as set forth in the appended claims.

Figures

Fig. 1 is a schematic drawing of a multi-wire cutting device (1) according to the invention featuring: (i) a revolving workpiece mount (2), comprising an elongated octagonal body (3), one pivot mount (4) positioned at the right end of the rotational axis (5) of body (3) and eight workpiece holders (6) positioned on the periphery (7) of body (3); (ii) one rotational drive (8) functionally connected to said revolving workpiece mount (2) for rotating the pivot mount (4); (iii) a wire web (9) below the revolving workpiece mount (2), the white lines indicating the direction of the wire movement;

(iv) a means (10) for moving the 8 cylinder-shaped workpieces (11) on the 8 workpiece holders (mounting beams) (6) on the octagonal body (3) of the revolving workpiece mount (2) into contact with the wire web (9) until the workpieces (11) are completely sliced and part of the workpiece holders (6) are sliced too, resulting in a comb-like structure after a cut and designed to be replaced after every cutting process.

The most left part of fig. 1 is a front view of the same revolving workpiece mount (2) featuring 8 cylindrical workpieces (11) on 8 workpiece holders on the octagonal body (3).

Fig. 2A is a schematic drawing of a multi-wire cutting device (1) according to the invention as described above in Fig. 1 with the following differences: (i) the body (3) of the revolving workpiece mount (2) is a circular disk fixed to pivot mount (4) positioned at the right end of the rotational axis (5) of body (3) and there is only one central workpiece holder (6) positioned in front of body (3); (ii) the one workpiece (11) is elongated and either cylindrical or rectangular and is glued with its end surface in front of the workpiece holder (6); (ii) the wire web (9) is omitted for space-saving reasons.

In this embodiment the slicing action of the wire-web (9) is either stopped when a small but stable core rod of workpiece (11) remains to stabilize the slices or the slicing action is continued until the slices fall off. In the latter case it is preferred that the wire web (9) is appropriately adapted and angulated so that the slices fall off the open end (opposite to the pivot mount (4) end) one at a time. In the first case either a beam is glued onto the partly sliced wafers or other means (e.g. icing) of fixing the part is applied prior to finishing the cut without rotating the workpiece. The cut can be finished with or without rocking motion.

Fig. 2B is a schematic drawing of a multi-wire cutting device (1) according to the invention as described above in Fig. 2A with the following difference: there are two workpiece holders (6) fixed in front of body (3) of the revolving workpiece mount (2) each carrying one spherical workpieces (11). Again, in this embodiment the slicing action of the wire-web (9) is either stopped when a small but stable solid edge of both workpieces (11) remains to stabilize the slices or the slicing action is continued until the slices fall off. In the latter case it is preferred that the wire web (9) is appropriately adapted and angulated so that the slices fall off the open end (opposite to the pivot mount (4) end) one at a time.

Claims

1. A multi-wire cutting device (1 ), comprising:

(a) a revolving workpiece mount (2), comprising a body (3), one or two pivot mount(s) (4) positioned on one or both ends of the rotational axis (5) of body (3) and one or more workpiece holders (6) positioned either on the periphery (7) of body (3) or in front of body (3),

(b) at least one rotational drive (8) functionally connected to said revolving workpiece mount (2); (c) a wire web (9);

(d) at least one means (10) for moving one or more workpieces (11) on the revolving workpiece mount (2) into contact with the wire web (9); wherein in operation at least one workpiece holder (6) is occupied by a work piece

(11), the revolving workpiece mount (2) is rotated by rotational drive (8), said means (10) moves the rotating workpiece(s) (11) on the revolving workpiece mount (2) onto the moving wire web (9), and the rotating workpiece(s) (11) on the workpiece holder(s) (6) is (are) cut by wire web (9).

2. The multi-wire cutting device (1) according to claim 1, wherein the wire web (9) is one for transporting abrasive slurry from a slurry source or a fixed abrasive wire web, preferably a diamond wire.

3. The multi-wire cutting device (1) according to claim 1 or 2, wherein the two or more workpiece holders (6) are adapted to match the workpiece and/or the beam holding the workpiece in place.

4. The multi-wire cutting device (1) according to any one of claims 1 to 3, wherein the body (3) is cylinder-shaped, drum-shaped, shaped like a bevelled drum, preferably shaped as a penta-, hexa- or octagonal cylinder or drum or contains a clamping system for (a) work piece holder(s).

5. The multi-wire cutting device (1) according to any one of claims 1 to 4, wherein the body (3) is shaped on its periphery to adapt to a round, preferably cylindrical or drum-shaped, or angular workpiece (11 ).

6. The multi-wire cutting device (1) according to any one of claims 1 to 5, wherein the revolving workpiece mount (2) comprises at least 1 or 2, preferably at least 3, more preferably at least 4 to 6 workpiece holders (6).

7. The multi-wire cutting device (1) according to any one of claims 1 to 6, wherein the workpiece(s) (11) is (are) glued to the workpiece holders (6).

8. The multi-wire cutting device (1) according to any one of claims 1 to 7, wherein the workpiece(s) (11) is (are) glued to a beam(s) (12) held by the workpiece holders (6).

9. The multi-wire cutting device (1) according to any one of claims 1 to 8, wherein the workpiece(s) (11) is (are) held by the workpiece holders (6) by mechanical means.

10. The multi-wire cutting device (1) according to any one of claims 1 to 9, wherein the workpiece(s) (11) is (are) selected from workpieces selected from the group of solid metals, alloys, crystals, gemstones, polymers and glass, preferably from multicrystalline silicon, noncrystalline silicon, ceramics, glass, sapphire, silicon carbide, silicon nitride and solid-state laser optical materials.

11. A method for slicing solid workpieces, comprising the following steps: a) attaching one or more workpieces (11) to the periphery (7) or in front of a revolving workpiece mount (2) having one rotational axis (5), b) rotating the loaded revolving workpiece mount (2) of step a) along its rotational axis (5), c) moving the rotating workpiece(s) (11) on the revolving workpiece mount (2) into contact with a moving wire web (9) and cutting the rotating workpiece(s) (11 ) on the revolving workpiece mount (2) into slices by the moving wire web (9).

12. The method according to claim 11 , wherein the workpiece(s) (11) is (are) cut by a wire web (9) for transporting abrasive slurry from a slurry source or a fixed abrasive wire web, preferably a diamond wire.

13. The method according to claim 11 or 12, wherein at least 2, preferably at least 3, more preferably at least 4 to 8 workpiece(s) (11) are cut simultaneously by wire web (9).

14. The method according to any one of claims 11 to 13, wherein the workpiece(s) (11) is (are) selected from workpieces selected from the group of solid metals, alloys, crystals, gemstones, polymers and glass, preferably from multicrystalline silicon, ■noncrystalline silicon, ceramics, glass, sapphire, silicon carbide, silicon nitride and solid-state laser optical materials.

15. Use of a multi-wire cutting device (1) according to any one of claims 1 to 10 for practicing a method according to any of claims 11 to 14.