JP2023023057A - Processing apparatus and method for manufacturing processed product - Google Patents

Abstract

To provide a processing apparatus and a method for manufacturing a processed product, which simplifies a configuration and prevents scattering of working liquid while reducing footprint.SOLUTION: A processing apparatus includes processing tables 2A and 2B that hold a sealed substrate W, a first holding mechanism 3 that holds the sealed substrate to transport the sealed substrate to the processing tables, a processing mechanism, a transfer table onto which a plurality of products are transferred, a second holding mechanism that transports the plurality of products to the transfer table, a transfer movement mechanism having a common transfer shaft 71 for moving the first holding mechanism and the second holding mechanism, a processing movement mechanism for moving the processing mechanism, a working liquid supply mechanism for jetting work liquid, and a working liquid scattering prevention mechanism for preventing scattering of the working liquid.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to a processing apparatus and a method of manufacturing a processed product.

Conventionally, as shown in Patent Document 1, in a cutting system, a strip picker moves in the X-axis direction to transfer a semiconductor strip from an on-loading device to a chuck table of a cutting device, and the chuck table sucks the semiconductor strip to produce a Y-axis. Arrangements have been conceived in which the semiconductor strip is cut into semiconductor packages by a spindle after an axial movement to the rear of the system. Also, the chuck table is configured to be moved in the Y-axis direction using a ball screw (ball screw mechanism).

However, in the cutting system described above, since the ball screw is used to move the chuck table for cutting, a bellows member is provided to protect the ball screw from processing water and processing waste. A plurality of plate members must be provided on the member. As a result, the device configuration becomes complicated.

Moreover, in the cutting system described above, the semiconductor strip is not only transported in the X-axis direction, but also transported in the Y-axis direction to the rear of the system for cutting the semiconductor strip, which increases the footprint of the apparatus.

On the other hand, as shown in Patent Document 2, the cutting means is processed and fed in the X-axis direction by the processing feed means, and the position-fixed chuck table is fed in the Z-axis direction by the cutting feed means. A processing apparatus for cutting a workpiece held in a workpiece has been considered. In this machining apparatus, waterproofing means by a horizontally arranged bellows structure around the chuck table is not required for waterproofing against cutting water accompanying machining feed.

However, although this processing apparatus can eliminate the need for a waterproof means by means of a horizontally arranged bellows structure around the chuck table, there are cases in which cutting water scatters to surrounding components during cutting, resulting in a problem.

Japanese Patent Publication No. 2007-536727 JP 2008-140981 A

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-described problems, and its main object is to simplify the apparatus configuration, reduce the footprint, and prevent the machining fluid from scattering. .

That is, a processing apparatus according to the present invention includes a processing table that holds an object to be processed, a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table, and a mechanism that holds the object to be processed on the processing table. a processing mechanism for processing the processed workpiece; a transfer table to which the processed workpiece is transferred; and a processing mechanism for transferring the processed workpiece from the processing table to the transfer table. a second holding mechanism for holding the subsequent workpiece; and a common transfer that extends along the arrangement direction of the processing table and the transfer table and moves the first holding mechanism and the second holding mechanism. a conveying movement mechanism having an axis; a processing movement mechanism for moving the processing mechanism in a horizontal plane in a first direction along the transfer shaft and a second direction orthogonal to the first direction; and the processing movement mechanism. a machining liquid supply mechanism that moves together with the machining mechanism by and ejects machining fluid to the machining mechanism from the front side in the machining feed direction; and a machining table that is provided behind the machining mechanism in the machining feed direction and a machining fluid scattering prevention mechanism that covers the upper side from a position below the upper surface of the machining fluid to prevent the machining fluid from scattering.

According to the present invention configured in this manner, it is possible to simplify the device configuration, reduce the footprint, and prevent the machining liquid from scattering.

It is a figure showing typically composition of a cutting device concerning one embodiment of the present invention. It is a perspective view which shows typically the table for cutting of the same embodiment, and its peripheral structure. It is the figure (plan view) seen from the Z direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the cutting table of the same embodiment, and its peripheral structure. It is the figure (front view) seen from the Y direction which shows typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance. It is the figure (side view) which showed typically the structure of the 1st holding mechanism of the same embodiment, and the moving mechanism for conveyance seen from the X direction. It is a sectional view showing typically composition of a rack and pinion mechanism of the embodiment. It is the figure (front view) seen from the Y direction which shows typically the structure of the 2nd holding mechanism of the same embodiment, and the moving mechanism for conveyance. FIG. 4 is a cross-sectional view viewed from the X direction schematically showing the configuration of the processing moving mechanism and the cover member of the same embodiment. FIG. 4 is a cross-sectional view viewed from the Y direction schematically showing the configurations of the machining moving mechanism, the cover member, and the cutting water scattering prevention mechanism of the same embodiment. FIG. 4 is a cross-sectional view viewed from the Y direction schematically showing the configurations of the machining moving mechanism, the cover member, and the cutting water scattering prevention mechanism of the same embodiment. 4A and 4B are schematic diagrams showing (a) a raised position and (b) a lowered position of the shutter member in the cutting water splash prevention mechanism of the same embodiment; FIG. 5 is a schematic diagram showing the operation of the cutting water splash prevention mechanism of the same embodiment; FIG. 5 is a schematic diagram showing the operation of the cutting water splash prevention mechanism of the same embodiment; It is a schematic diagram which shows operation|movement of the cutting device of the same embodiment.

The invention will now be described in more detail by means of examples. However, the invention is not limited by the following description.

As described above, the processing apparatus of the present invention includes a processing table that holds an object to be processed, a first holding mechanism that holds the object to be processed in order to convey the object to be processed to the processing table, and the processing table. a processing mechanism for processing the processing object held in a table, a transfer table for transferring the processing object after processing, and a transfer table for transferring the processing object after processing from the processing table to the transfer table a second holding mechanism that holds the workpiece after machining; and a common mechanism that extends along the arrangement direction of the processing table and the transfer table and moves the first holding mechanism and the second holding mechanism. and a processing movement mechanism for moving the processing mechanism in a horizontal plane in a first direction along the transfer shaft and a second direction orthogonal to the first direction, and the processing a machining fluid supply mechanism that moves together with the machining mechanism by a moving mechanism and injects machining fluid to the machining mechanism from the front side in the machining feed direction; A machining liquid scattering prevention mechanism is provided to cover the upper side of the machining table from a position below the upper surface of the machining table to prevent the machining liquid from scattering.
In this processing apparatus, the first holding mechanism and the second holding mechanism are moved by a common transfer shaft extending along the arrangement direction of the processing table and the transfer table, and the processing movement mechanism moves the processing mechanism in the horizontal plane. Since it is moved in the first direction along the transfer axis and in the second direction orthogonal to the first direction, the workpiece can be processed without moving the processing table in the first direction and the second direction. . Therefore, the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member can be made unnecessary without moving the machining table by the ball screw mechanism. As a result, the device configuration of the processing device can be simplified. In addition, since the processing table is configured so as not to move in the first direction and the second direction on the horizontal plane, it is possible to reduce the movement space of the processing table and the wasted space therearound, thereby reducing the footprint of the processing apparatus. be able to.
In particular, in the present invention, in the configuration in which the machining liquid is sprayed from the front side in the machining feed direction to the machining mechanism, the machining that covers the upper side from the position below the upper surface of the machining table on the rear side in the machining feed direction with respect to the machining mechanism Since the liquid scattering prevention mechanism is provided, the machining liquid can be prevented from scattering.

In order to prevent the machining fluid from scattering while following the movement of the machining mechanism by the machining moving mechanism, the machining fluid scattering prevention mechanism expands and contracts along with the movement of the machining mechanism and extends perpendicularly to the machining feed direction. It is desirable to have a bellows member that covers the upper side and sides, and a shutter member that is connected to the rear end portion of the bellows member in the feed direction and covers the rear side in the feed direction.
If the shutter member moves during machining of the workpiece by the machining mechanism, it may not be possible to reliably prevent the machining fluid from scattering. In order to solve this problem, it is desirable that the processing device has a fixing portion that fixes the shutter member during processing of the object by the processing mechanism.

In order to increase the processing capacity of a single processing apparatus, the processing apparatus of the present invention preferably has a plurality of processing tables.
Here, it is preferable that the fixed portion is provided corresponding to each of the plurality of processing tables. With this configuration, the bellows member can be made to have a length corresponding to one processing table, and the size of the bellows member in a contracted state can be reduced. In addition, the shutter member can be fixed according to each processing table, and one processing table can be covered with a bellows member, so that an object to be processed before processing can be carried into the processing table that is not processed. In addition, the processing capacity can be increased, such as being able to carry out the processed object after processing.

In order to move the shutter member to a plurality of fixed portions corresponding to a plurality of processing tables, it is preferable that the working moving mechanism move the shutter member to each of the plurality of fixed portions.
With this configuration, there is no need to separately provide a moving mechanism for moving the shutter member, and the configuration for moving the shutter member can be simplified.

Since the lower end of the shutter member is provided at a position lower than the upper surface of the processing table, it is necessary to move the shutter member without interfering with the processing table. For this reason, the shutter member moves between a raised position where the lower end is located above the upper surface of the processing table and a lowered position where the lower end is located below the upper surface of the processing table. It is possible and is preferably fixed by the fixing part in the lowered position.

The working movement mechanism is a so-called gantry mechanism. Specifically, the processing moving mechanism includes an X-direction moving unit that linearly moves the processing mechanism in the X direction, which is the first direction, and a Y-direction that linearly moves the processing mechanism in the Y direction, which is the second direction. a moving part, the X-direction moving part moving along a pair of X-direction guide rails provided along the X direction with the machining table interposed therebetween; It is desirable to have a support for supporting the processing mechanism via the Y-direction moving part. In this configuration, the common transfer axis is positioned above and across the supports such that the common transfer axis and the supports are in a crosswise relationship with each other.
Since the pair of X-direction guide rails provided along the X-direction are provided so as to sandwich the processing table, the pitch (interval) between the pair of X-direction guide rails can be increased. As a result, it is possible to reduce the influence of vertical misalignment between the X-direction guide rails on machining. In other words, it is possible to reduce the deviation in orthogonality between the machining mechanism (for example, a rotary tool such as a blade) and the machining table, thereby improving the machining accuracy. Also, the X-direction guide rail can be of lower specifications than the conventional one.

In the above machining moving mechanism, the machining feeding direction is the direction facing one side along the X direction, and the machining mechanism and the machining liquid supply mechanism are provided on one side of the support along the X direction. It is desirable that the machining fluid scattering prevention mechanism is provided on the other side of the support along the X direction. With this configuration, it is possible to prevent the working liquid that has passed under the support from scattering on the other side of the support along the X direction.

In order to prevent the machining liquid from scattering on one side of the support along the X direction, a cover member for accommodating the machining mechanism and the machining liquid supply mechanism is provided on one side of the support along the X direction. It is desirable that

A method for manufacturing a processed product using the processing apparatus described above is also an aspect of the present invention.

<One embodiment of the present invention>
An embodiment of a processing apparatus according to the present invention will be described below with reference to the drawings. It should be noted that all of the drawings shown below are schematically drawn with appropriate omissions or exaggerations for the sake of clarity. The same components are given the same reference numerals, and the description thereof is omitted as appropriate.

<Overall configuration of processing equipment>
The processing apparatus 100 of the present embodiment is a cutting apparatus that separates a plurality of products P by cutting a sealed substrate W, which is an object to be processed.

Here, the sealed substrate W is a substrate to which electronic elements such as a semiconductor chip, a resistor element, a capacitor element, etc. are connected, and resin-molded so as to seal at least the electronic elements with resin. A lead frame and a printed wiring board can be used as the substrate constituting the sealed substrate W. In addition to these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, and ceramic substrates can be used. , a glass substrate, a resin substrate, or the like can be used. Further, the substrates constituting the sealed substrate W may or may not be wired.

Also, one surface of the sealed substrate W and the product P of this embodiment becomes a mounting surface to be mounted later. In the description of this embodiment, one surface to be mounted later is described as a "mounting surface", and the opposite surface is described as an "opposite surface".

Specifically, as shown in FIG. 1, the cutting apparatus 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, and the sealed substrate W on the cutting tables 2A and 2B. A first holding mechanism 3 that holds the sealed substrate W for transportation, a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, and a plurality of products P a transfer table 5 to which the are transferred, a second holding mechanism 6 for holding a plurality of products P in order to transfer the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, a first holding mechanism 3 and A transfer moving mechanism 7 having a common transfer shaft 71 for moving the second holding mechanism 6, and a cutting mechanism 4 for moving the sealed substrate W held by the cutting tables 2A and 2B. A moving mechanism (processing moving mechanism) 8 is provided. The first holding mechanism 3 and the transport moving mechanism 7 constitute a transport mechanism (loader) for transporting the sealed substrate W, and the second holding mechanism 6 and the transport moving mechanism 7 transport a plurality of products P. A transport mechanism (unloader) is configured.

In the following description, the directions orthogonal to each other in the plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are the X direction as the first direction and the Y direction as the second direction, and the X direction and the Y direction. The perpendicular direction is defined as the Z direction. Specifically, the horizontal direction in FIG. 1 is the X direction, and the vertical direction is the Y direction. As will be described later, the X direction is the direction in which the support 812 moves, and the longitudinal direction (the direction in which the beam extends) of the beam that bridges the pair of legs of the gate-shaped support 812 . (see FIGS. 2 and 3).

<Cutting tables 2A and 2B>
The two cutting tables 2A, 2B are fixed in the X, Y and Z directions. The cutting table 2A can be rotated in the .theta. direction by a rotating mechanism 9A provided below the cutting table 2A. Further, the cutting table 2B can be rotated in the .theta. direction by a rotating mechanism 9B provided under the cutting table 2B.

These two cutting tables 2A and 2B are provided along the X direction on the horizontal plane. Specifically, the two cutting tables 2A and 2B are arranged such that their upper surfaces are positioned on the same horizontal plane (located at the same height in the Z direction) (see FIG. 4), and their The centers of the upper surfaces (specifically, the centers of rotation of the rotation mechanisms 9A and 9B) are arranged on the same straight line extending in the X direction (see FIGS. 2 and 3).

The two cutting tables 2A and 2B suck and hold the sealed substrate W, and as shown in FIG. Two vacuum pumps 10A, 10B are arranged. Each vacuum pump 10A, 10B is, for example, a water ring vacuum pump.

Here, since the cutting tables 2A and 2B are fixed in the XYZ directions, the pipes (not shown) connected from the vacuum pumps 10A and 10B to the cutting tables 2A and 2B can be shortened, and the pipe pressure It is possible to reduce the loss and prevent the deterioration of the adsorption force. As a result, even a very small package of, for example, 1 mm square or less can be reliably attracted to the cutting tables 2A and 2B. In addition, since it is possible to prevent a decrease in adsorption force due to pressure loss in the piping, the capacities of the vacuum pumps 10A and 10B can be reduced, leading to miniaturization and cost reduction.

<First holding mechanism 3>
The first holding mechanism 3, as shown in FIG. 1, holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in FIGS. 5 and 6, the first holding mechanism 3 includes a suction head 31 provided with a plurality of suction portions 311 for sucking and holding the sealed substrate W, and a suction portion of the suction head 31. 311 and a vacuum pump (not shown). Then, the suction head 31 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.

As shown in FIG. 1, the substrate supply mechanism 11 includes a substrate accommodation portion 111 that accommodates a plurality of sealed substrates W from the outside, and a first holding portion for the sealed substrates W accommodated in the substrate accommodation portion 111 . and a substrate supply unit 112 for moving to a holding position RP where the mechanism 3 sucks and holds the substrate. This holding position RP is set so as to be aligned with the two cutting tables 2A and 2B in the X direction. Note that the substrate supply mechanism 11 may have a heating unit 113 that heats the sealed substrate W to be attracted by the first holding mechanism 3 so as to make it flexible and facilitate the attraction.

<Cutting mechanism 4>
As shown in FIGS. 1, 2 and 3, the cutting mechanism 4, which is a working mechanism, has two rotary tools 40 consisting of blades 41A and 41B and two spindles 42A and 42B. The two spindles 42A, 42B are provided with their rotation axes along the Y direction, and the blades 41A, 41B attached thereto are arranged so as to face each other (see FIG. 3). The blade 41A of the spindle 42A and the blade 41B of the spindle 42B cut the sealed substrate W held on the cutting tables 2A and 2B by rotating in a plane including the X direction and the Z direction. As shown in FIG. 4, the cutting apparatus 100 of the present embodiment includes a cutting water supply mechanism (working fluid supply mechanism) that injects cutting water, which is a working fluid, in order to suppress frictional heat generated by the blades 41A and 41B. ) 12 are provided. The cutting water supply mechanism 12 will be described later.

<Transfer table 5>
The transfer table 5 of the present embodiment, as shown in FIG. 1, is a table to which a plurality of products P inspected by an inspection unit 13, which will be described later, are transferred. This transfer table 5 is a so-called index table, and a plurality of products P are temporarily placed thereon before sorting the plurality of products P onto various trays 21 . Also, the transfer table 5 and the two cutting tables 2A and 2B are arranged in a line along the X direction on the horizontal plane. A plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .

Various trays 21 are transported to desired positions by a tray transport mechanism 22 that moves along a transfer shaft 71, and products P sorted by the sorting mechanism 20 are placed thereon. After being sorted, the various trays 21 are accommodated in the tray accommodating section 23 by the tray conveying mechanism 22 .

<Inspection unit 13>
Here, as shown in FIG. 1, the inspection unit 13 is provided between the cutting tables 2A and 2B and the transfer table 5, and inspects the plurality of products P held by the second holding mechanism 6. is. The inspection unit 13 of this embodiment has a first inspection unit 131 that inspects the opposite surface of the product P and a second inspection unit 132 that inspects the mounting surface of the product P. As shown in FIG. The first inspection unit 131 is an imaging camera having an optical system for inspecting the opposite surface, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the mounting surface. Note that the first inspection unit 131 and the second inspection unit 132 may be shared.

In addition, a reversing mechanism 14 for reversing the plurality of products P is provided so that both sides of the plurality of products P can be inspected by the inspection unit 13 (see FIG. 1). The reversing mechanism 14 has a holding table 141 that holds a plurality of products P, and a reversing unit 142 such as a motor that turns the holding table 141 upside down.

When the second holding mechanism 6 holds a plurality of products P from the processing tables 2A and 2B, the opposite surfaces of the products P face downward. In this state, the opposite surface of the product P is inspected by the first inspection unit 131 while the plurality of products P are being transported from the processing tables 2A and 2B to the reversing mechanism 14 . After that, the multiple products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 , and then the reversing mechanism 14 moves to the position of the transfer table 5 . During this movement, the mounting surface of the product P facing downward is inspected by the second inspection unit 132 . After that, the product P is delivered to the transfer table 5 .

<Second holding mechanism 6>
The second holding mechanism 6 holds a plurality of products P in order to convey the plurality of products P from the cutting tables 2A and 2B to the reversing mechanism 14, as shown in FIG. As shown in FIG. 8 , the second holding mechanism 6 is connected to a suction head 61 provided with a plurality of suction portions 611 for sucking and holding a plurality of products P, and the suction portions 611 of the suction head 61 . and a vacuum pump (not shown). Then, the suction head 61 is moved to a desired position by a transfer mechanism 7 or the like, which will be described later, to transfer the plurality of products P from the cutting tables 2A and 2B to the holding table 141 .

<Conveyance moving mechanism 7>
As shown in FIG. 1, the transportation moving mechanism 7 moves the first holding mechanism 3 between at least the substrate supply mechanism 11 and the cutting tables 2A and 2B, and moves the second holding mechanism 6 between at least the cutting tables. It is moved between 2A, 2B and the holding table 141 .

As shown in FIG. 1, the transportation moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A and 2B and the transfer table 5, and the first holding mechanism 3 and the second 2 has a common transfer shaft 71 for moving the holding mechanism 6 .

The transfer shaft 71 is provided within a range in which the first holding mechanism 3 can move above the substrate supply section 112 of the substrate supply mechanism 11 and the second holding mechanism 6 can move above the transfer table 5 ( See Figure 1). The first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (front side) of the transfer shaft 71 in plan view. In addition, the inspection section 13, the reversing mechanism 14, various trays 21, the tray conveying mechanism 22, the tray accommodating section 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described later, and the collection container 172 are the same with respect to the transfer shaft 71. provided on the side (front side).

Furthermore, as shown in FIGS. 5, 6, and 8, the transporting moving mechanism 7 includes a main moving mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71; A vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Z direction, and a vertical movement mechanism 73 for vertically moving the first holding mechanism 3 and the second holding mechanism 6 with respect to the transfer shaft 71 in the Y direction. and a horizontal movement mechanism 74 for horizontal movement.

As shown in FIGS. 5 to 8, the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 for guiding the first holding mechanism 3 and the second holding mechanism 6. and a rack-and-pinion mechanism 722 for moving the first holding mechanism 3 and the second holding mechanism 6 .

The guide rail 721 extends straight in the X direction along the transfer shaft 71, and, like the transfer shaft 71, allows the first holding mechanism 3 to move above the substrate supply portion 112 of the substrate supply mechanism 11, 2 A holding mechanism 6 is provided within a range in which it can move above the transfer table 5 . The guide rail 721 is slidably provided with a slide member 723 on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a vertical movement mechanism 73 and a horizontal movement mechanism 74 . Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the vertical movement mechanism 73, the horizontal movement mechanism 74 and the slide member 723 are common to the first holding mechanism 3 and the second holding mechanism 6. provided separately for each.

The rack and pinion mechanism 722 includes a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). and a gear 722b. The cam rack 722a is provided on the common transfer shaft 71 and can be varied in length by connecting a plurality of cam rack elements. The pinion gear 722b is provided on the slide member 723 and is called a so-called roller pinion. As shown in FIG. It has a plurality of roller pins 722b2 which are provided at equal intervals in the circumferential direction between the roller bodies 722b1 and are provided so as to be able to roll with respect to the roller body 722b1. Since the rack-and-pinion mechanism 722 of this embodiment uses the roller pinions described above, two or more roller pins 722b2 come into contact with the cam rack 722a. Positioning accuracy is improved when moving the first holding mechanism 3 and the second holding mechanism 6 in the X direction.

As shown in FIGS. 5 and 8, the lifting mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in FIGS. The lifting mechanism 73 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, as shown in FIGS. It has a Z-direction guide rail 73a provided along the Z-direction, and an actuator portion 73b for moving the first holding mechanism 3 along the Z-direction guide rail 73a. The actuator section 73b may use, for example, a ball screw mechanism, an air cylinder, or a linear motor. The configuration of the up-and-down movement mechanism 73 of the second holding mechanism 6 is the same as that of the up-and-down movement mechanism 73 of the first holding mechanism 3, as shown in FIG.

The horizontal movement mechanism 74 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6, as shown in FIGS. The horizontal movement mechanism 74 of the first holding mechanism 3 is interposed between the transfer shaft 71 (specifically, the vertical movement mechanism 73) and the first holding mechanism 3, as shown in FIGS. Y-direction guide rails 74a provided along the Y-direction, elastic bodies 74b for applying force to the first holding mechanism 3 on one side of the Y-direction guide rails 74a, and the first holding mechanism 3. and a cam mechanism 74c for moving to the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.

The configuration of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3, as shown in FIG. Further, the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 , or both the first holding mechanism 3 and the second holding mechanism 6 may be configured without the horizontal movement mechanism 74 . Further, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism or an air cylinder without using the cam mechanism 74c, like the elevation movement mechanism 73. Alternatively, a linear motor may be used.

<Moving Mechanism 8 for Cutting (Moving Mechanism for Processing)>
The cutting movement mechanism 8 linearly moves each of the two spindles 42A and 42B in the X, Y and Z directions.

Specifically, as shown in FIGS. 2 to 4 and 9 to 11, the cutting movement mechanism 8 includes an X-direction movement unit 81 that linearly moves the spindles 32A and 32B in the X direction, and a Y direction movement unit that moves the spindles 32A and 32B in the Y direction. A Y-direction moving unit 82 that linearly moves the spindles 32A and 32B in the Z-direction. In this embodiment, the processing feed direction SD of the cutting mechanism 4 by the cutting movement mechanism 8 is a direction facing one side along the X direction (a direction facing one side from the other side along the X direction (FIG. 3 etc.).

The X-direction moving part 81 is common to the two cutting tables 2A and 2B, and is provided along the X direction with the two cutting tables 2A and 2B interposed therebetween, as particularly shown in FIGS. and a support body 812 that moves along the pair of X-direction guide rails 811 and supports the spindles 32A and 32B via the Y-direction movement portion 82 and the Z-direction movement portion 83. and A pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A and 2B provided along the X-direction. Further, the support 812 is, for example, a portal type and has a shape extending in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and beams (beams) bridging the pair of legs. extending in the direction In this support 812, spindles 32A and 32B of the cutting mechanism 4 are provided on one side along the X direction (the side facing the processing feed direction SD).

The support 812 is linearly reciprocated along the X direction on the pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servomotor. In addition, the support 812 may be configured to reciprocate by another linear motion mechanism such as a linear motor.

3, the Y-direction moving part 82 includes a Y-direction guide rail 821 provided along the Y direction on the support 812, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. have. Note that the Y-direction moving portion 82 is provided on one side of the support 812 along the X direction (the side facing the processing feed direction SD). The Y-direction slider 822 is driven by, for example, a linear motor 823 and linearly reciprocates on the Y-direction guide rail 821 . In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindles 32A, 32B. This allows the two spindles 32A and 32B to move independently of each other in the Y direction. Alternatively, the Y-direction slider 822 may be configured to reciprocate by another direct acting mechanism using a ball screw mechanism.

As shown in FIGS. 9 to 11, the Z-direction moving part 83 moves along a Z-direction guide rail 831 provided along the Z-direction in each Y-direction slider 822 and moves along the Z-direction guide rail 831. and a Z-direction slider 832 that supports the spindles 32A, 32B. That is, the Z-direction moving part 83 is provided corresponding to each spindle 32A, 32B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly reciprocates on the Z-direction guide rail 831 . Alternatively, the Z-direction slider 832 may be configured to reciprocate by another direct acting mechanism such as a ball screw mechanism.

As shown in FIGS. 1 and 4, the positional relationship between the moving mechanism 8 for cutting and the transfer shaft 71 is such that the transfer shaft 71 is arranged above the moving mechanism 8 for cutting so as to cross the moving mechanism 8 for cutting. ing. Specifically, the transfer shaft 71 is arranged above the support 812 so as to cross the support 812 , and the transfer shaft 71 and the support 812 have a positional relationship of crossing each other.

<Cover member 15>
As shown in FIGS. 3, 4, and 9 to 11, the support 812 in the moving mechanism 8 for cutting is provided with a cover member 15 for accommodating the two spindles 32A and 32B. Note that the cover member 15 is omitted in FIG. The cover member 15 is provided on one side of the support body 812 along the X direction (the side facing the processing feed direction SD), and is provided in the cutting mechanism so that cutting water jetted from the jet nozzle 121 does not scatter around. 4, the two spindles 32A, 32B as well as the injection nozzle 121 of the cutting water supply mechanism 12 are accommodated.

Specifically, as shown in FIGS. 9 to 11, the cover member 15 is formed with openings 15a for exposing the blades 41A and 41B on its lower surface. An opening 15b is formed in the upper surface of the cover member 15 so as not to interfere with the movement of the spindles 42A and 42B and the moving mechanism 8 for cutting. The opening 15b on the upper surface is closed by a bellows member 16, which is configured to expand and contract as the spindles 42A and 42B move. The cover member 15 and the bellows member 16 cover one side of the support 812 along the X direction (the side facing the processing feed direction SD) on both sides of the spindles 42A and 42B in the X direction, both sides in the Y direction, and the upper side. As a result, the range over which the cutting water jetted from the jet nozzle 121 scatters is limited. Further, a window 151 through which the inside of the cover member 15 can be viewed is formed in the side wall on the front side of the cover member 15 (the side opposite to the support 812) (see FIGS. 10 and 11). Furthermore, by evacuating the inside of the cover member 15 with an exhaust mechanism (not shown), droplets (mist) can be effectively discharged to the outside.

<Processing waste container 17>
The cutting apparatus 100 of the present embodiment further includes a processing waste storage section 17 that stores processing waste S such as offcuts generated by cutting the sealed substrate W, as shown in FIG.

As shown in FIGS. 2 to 4, the processing waste container 17 is provided below the cutting tables 2A and 2B, and is a guide chute having an upper opening 171X surrounding the cutting tables 2A and 2B in plan view. 171 and a collection container 172 for collecting the processing waste S guided by the guide shooter 171 . By providing the processing waste container 17 below the cutting tables 2A and 2B, the recovery rate of the processing waste S can be improved.

The guide shooter 171 guides the processing waste S scattered or dropped from the cutting tables 2A and 2B to the collection container 172. As shown in FIG. In this embodiment, since the upper opening 171X of the guide shooter 171 surrounds the cutting tables 2A and 2B (see FIG. 3), it is difficult to remove the processing waste S, and the collection rate of the processing waste S is further improved. can be improved. Further, the guide shooter 171 is provided so as to surround the rotating mechanisms 9A and 9B provided under the cutting tables 2A and 2B (see FIG. 4). is configured to protect

In the present embodiment, the processing waste container 17 is shared by the two cutting tables 2A and 2B, but may be provided for each of the cutting tables 2A and 2B.

The collection container 172 is for collecting the processing waste S that has passed through the guide shooter 171 by its own weight. In this embodiment, as shown in FIG. It is The two collection containers 172 are arranged on the front side of the transfer shaft, and configured to be independently removable from the front side of the cutting device 100 . With this configuration, it is possible to improve maintainability such as disposal of the processing waste S. Considering the size of the sealed substrate W, the size and amount of the processing waste S, the workability, etc., one collection container 172 may be provided under the entire cutting table, or three collection containers may be provided. The above may be set.

Moreover, as shown in FIG. 4 and the like, the machining waste container 17 has a separating part 173 for separating cutting water and machining waste. As for the configuration of the separation unit 173, for example, a filter such as a perforated plate that allows cutting water to pass through the bottom surface of the collection container 172 may be provided. The separation unit 173 allows the processing waste S to be collected without accumulating cutting water in the collection container 172 .

<First Cleaning Mechanism 18>
As shown in FIGS. 1 and 5, the cutting apparatus 100 of the present invention includes a first cleaning mechanism 18 that cleans the upper surface side (mounting surface) of the plurality of products P held on the cutting tables 2A and 2B. I have more. The first cleaning mechanism 18 cleans the upper surfaces of the products P by means of injection nozzles 18a (see FIG. 5) that inject cleaning liquid and/or compressed air onto the upper surfaces of the plurality of products P held on the cutting tables 2A and 2B. It is for cleaning.

The first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3, as shown in FIG. Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71 . Here, between the first cleaning mechanism 18 and the slide member 723, there is provided an elevation movement mechanism 181 for vertically moving the first cleaning mechanism 18 in the Z direction. The lifting mechanism 181 may be, for example, one using a rack and pinion mechanism, one using a ball screw mechanism, or one using an air cylinder.

<Second Cleaning Mechanism 19>
Furthermore, the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the lower surface side (opposite surface) of the plurality of products P held by the second holding mechanism 6, as shown in FIG. . The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection section 13, and sprays cleaning liquid and/or compressed air onto the lower surfaces of the plurality of products P held by the second holding mechanism 6. By doing so, the lower surface side of the product P is cleaned. That is, the second cleaning mechanism 19 cleans the lower surface side of the product P while the second holding mechanism 6 is being moved along the transfer shaft 71 .

<Machining Fluid Supply Mechanism 12 (Cutting Water Supply Mechanism) and Machining Fluid Splash Prevention Mechanism 24 (Cutting Water Splash Prevention Mechanism)>
In the present embodiment, as described above, the processing feed direction SD of the cutting mechanism 4 is directed in one direction along the X direction (in FIG. from the left)).

3, 4, 10 and 11, the cutting device 100 of this embodiment includes a cutting water supply mechanism 12 that moves together with the cutting mechanism 4 by the cutting movement mechanism 8, and a cutting water scattering mechanism. and a cutting water scattering prevention mechanism 24 for preventing the cutting water from scattering.

Here, the cutting mechanism 4 and the cutting water supply mechanism 12 are provided on one side of the support 812 along the X direction (the side facing the processing feed direction SD), and the other side of the support 812 along the X direction. A cutting water scattering prevention mechanism 24 is provided (on the side opposite to the machining feed direction SD).

10 and 11, the cutting water supply mechanism 12 has an injection nozzle 121 for injecting cutting water from the front side in the processing feed direction SD to the blades 41A and 41B of the cutting mechanism 4. This injection nozzle 121 is supported by, for example, the Z-direction moving part 83 . Specifically, the jet nozzle 121 jets cutting water toward the blades 41A and 41B of the cutting mechanism 4 from the opposite side of the support 812 to the blades 41A and 41B of the cutting mechanism 4 .

The cutting water splash prevention mechanism 24 is provided on the rear side of the cutting mechanism 4 in the processing feed direction SD, and has a structure that covers the cutting tables 2A and 2B from a position below the upper surfaces of the cutting tables 2A and 2B. .

Specifically, as shown in FIGS. 3, 4, 10 and 11, the cutting water splash prevention mechanism 24 includes a bellows member 241 that expands and contracts along with the movement of the cutting mechanism 4, and a bellows member 241 that extends in the processing feed direction SD. and a shutter member 242 to which the rear end portion of the shutter member 242 is connected.

The bellows member 241 covers the top and sides perpendicular to the feed direction SD. Specifically, the bellows member 241 has a pair of side wall portions that cover the sides, and an upper wall portion that is provided continuously from the upper ends of the pair of side wall portions and covers the upper side. In addition, the front end portion of the bellows member 241 in the processing feed direction SD is connected to the side surface of the support 812 (the surface opposite to the processing feed direction SD). Also, the shutter member 242 covers the rear side in the processing feed direction SD. By these bellows member 241 and shutter member 242, the particles pass below the support 812 (specifically, below the beam portion of the support 812) and scatter on the side opposite to the processing feed direction SD with respect to the support 812. The cutting water is confined in the space surrounded by the bellows member 241 and the shutter member 242 . Here, droplets (mist) can be effectively discharged to the outside by exhausting the inside of the guide shooter 171 of the processing waste container 17 by means of an exhaust mechanism (not shown).

3, 4, 10 and 11, the cutting water scattering prevention mechanism 24 moves the shutter member 242 to the cutting tables 2A and 2B when the sealed substrate W is cut by the cutting mechanism 4. As shown in FIGS. It has fixing portions 243A and 243B that are fixed with respect to. Since this embodiment has two cutting tables 2A and 2B, the fixing portions 243A and 243B are provided corresponding to the two cutting tables 2A and 2B, respectively. Specifically, the fixed portions 243A and 243B are provided on the rear side of the cutting tables 2A and 2B in the processing feed direction SD. Two fixing portions 243A and 243B are provided along the Y direction to fix both ends of the shutter member 242 in the Y direction (see FIG. 3).

Then, the shutter member 242 is moved by the X-direction moving part 81 of the moving mechanism 8 for cutting to the fixing parts 243A and 243B respectively provided corresponding to the two cutting tables 2A and 2B.

Here, the lower end of the shutter member 242 is positioned lower than the upper surfaces of the cutting tables 2A and 2B when the sealed substrate W is cut by the cutting mechanism 4 . Therefore, as shown in FIGS. 10, 11 and 12, the shutter member 242 of the present embodiment is positioned at a raised position U (FIGS. 10, 12A, and 12B) in which the lower end portion is located above the upper surfaces of the cutting tables 2A and 2B. 12(a)) and a lowered position D (see FIGS. 11 and 12(b)) where the lower end is located below the upper surfaces of the cutting tables 2A and 2B. ing. The lower ends of the pair of side walls of the bellows member 241 may be positioned lower than the upper surfaces of the cutting tables 2A and 2B.

11 and 12(b), the shutter member 242 is fixed at the lowered position D by fixing portions 243A and 243B. Specifically, the shutter member 242 is fixed at the lowered position D by fitting the first projecting portion 242a provided on the side surface of the shutter member 242 into the concave portions of the fixing portions 243A and 243B.

Further, the shutter member 242 is connected to the rear end portion of the bellows member 241 so as to be able to move up and down. It is moved up and down by the up-and-down movement mechanism 244 provided.

10 to 12, the vertical movement mechanism 244 includes a shutter holding portion 244a that holds the shutter member 242 and a guide that guides the shutter holding portion 244a in the vertical direction (Z direction) with respect to the support 812. It has a rail 244b and a driving part 244c such as an air cylinder for moving the shutter holding part 244a along the guide rail 244b. In this embodiment, the shutter holding portion 244a has a recess that fits into the second projecting portion 242b provided on the side surface of the shutter member 242. As shown in FIG.

By raising the shutter holding portion 244a by the driving portion 244c, the concave portion of the shutter holding portion 244a is fitted to the second projecting portion 242b, the shutter holding portion 244a lifts the shutter member 242, and the shutter member 242 reaches the raised position U. Move (see FIGS. 10 and 12(a)). At the raised position U, the shutter holding portion 244a holds the shutter member 242, and the fixing of the shutter member 242 by the fixing portions 243A and 243B is released.

<Operation of cutting water scattering prevention mechanism 24 accompanying cutting>
Next, considering the case where the sealed substrate W is cut by the cutting table 2A on the left side of FIG. 4, the operation of the cutting water splash prevention mechanism 24 will be described with reference to FIGS.

First, the shutter holding portion 244a of the elevation movement mechanism 244 is raised to fit the shutter holding portion 244a into the second projecting portion 242b of the shutter member 242, thereby raising the shutter member 242 to the raised position U (see FIG. 10, 12(a) and 13(a)). Further, the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2A by the transfer moving mechanism 7, and the sealed substrate W is placed on the cutting table 2A (Fig. 13A). )reference). In this state, the support 812 of the cutting movement mechanism 8 is moved to one side along the X direction, and the shutter member 242 is moved above the fixed portion 243A corresponding to the left cutting table 2A. At this position, when the shutter holding portion 244a of the elevation movement mechanism 244 is lowered, the shutter member 242 is lowered to the lowered position D and is fitted and fixed to the fixing portion 243A (FIGS. 12(b) and 13). (b)). When the shutter member 242 is moved to the lowered position D, the shutter member 242 is released from being held by the shutter holding portion 242a.

After the shutter member 242 is fixed by the fixing portion 243A, cutting water is sprayed from the spray nozzle 121 of the cutting water supply mechanism 12, and the cutting mechanism 4 is moved in the processing feed direction SD by the cutting movement mechanism 8. The finished substrate W is cut (see FIGS. 11 and 13(c)). During this cutting operation, the bellows member 241 expands and contracts while the rear end portion of the bellows member 241 is fixed to the shutter member 242 as the cutting mechanism 4 and the support 812 move. As a result, the cutting water that has passed below the support 812 and is scattered is blocked by the bellows member 241 and the shutter member 242, thereby preventing the cutting water from scattering to the right cutting table 2B and the like.

When the cutting of the sealed substrate W is completed, the supporting body 812 of the moving mechanism 8 for cutting is moved to the vicinity of the fixed portion 243A, and the shutter holding portion 244a is brought to a position where the second projecting portion 242b of the shutter member 242 can be fitted. move. In this state, the shutter holding portion 244a of the elevation movement mechanism 244 is raised to fit the shutter holding portion 244a into the second projecting portion 242b, and the shutter member 242 is moved to the raised position U (FIG. 12A). , see FIG. 14(d)). As a result, the fixing of the shutter member 242 by the fixing portion 243A is released. Then, the support 812 of the moving mechanism 8 for cutting is moved to a position where the transportation of the plurality of products P is not hindered. In this state, the transfer mechanism 7 moves the second holding mechanism 6 to the cutting table 2A after cutting, the second holding mechanism 6 holds the plurality of products P by suction, and the plurality of products P are placed on the cutting table 2A. It is conveyed from table 2A (see FIG. 14(e)).

After that, when cutting the sealed substrate W on the cutting table 2B on the right side, after placing the sealed substrate W on the cutting table 2B (see FIG. 14(f)), the moving mechanism 8 for cutting support member 812 is moved to the other side along the X direction, and the shutter member 242 is moved above the fixing portion 243B corresponding to the cutting table 2B on the right side. Subsequent operations are similar to the operations described above.

<Example of operation of cutting device>
Next, an example of operation of the cutting device 100 will be described. FIG. 15 shows the moving path of the first holding mechanism 3 and the moving path of the second holding mechanism 6 in the operation of the cutting device 10. As shown in FIG. In the present embodiment, all operations such as the operation of the cutting device 100, for example, the transportation of the sealed substrate W, the cutting of the sealed substrate W, the operation of the cutting water scattering prevention mechanism 24, and the inspection of the product P are performed. Control is performed by the control unit CTL (see FIG. 1).

The substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation unit 111 toward the holding position RP held by the first holding mechanism 3 .

Next, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 holds the sealed substrate W by suction. After that, the transfer moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction holding, and the sealed substrate W is released. A substrate W is placed on the cutting tables 2A and 2B. At this time, the main moving mechanism 72 adjusts the position of the sealed substrate W in the X direction, and the horizontal moving mechanism 74 adjusts the position of the sealed substrate W in the Y direction. The cutting tables 2A and 2B hold the sealed substrate W by suction.

Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the elevation movement mechanism 73 moves the first holding mechanism 3 to the cutting movement mechanism 8 (support body 812). Raise to a position where there is no physical interference. When the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the support body 812 is retracted from the cutting table 2B to the transfer table 5 side. It is not necessary to raise and lower the first holding mechanism 3 at this time.

In this state, the cutting movement mechanism 8 sequentially moves the two spindles 42A and 42B in the X direction and the Y direction, and the cutting tables 2A and 2B rotate to cut the sealed substrate W in a grid pattern. and singulate. When cutting the sealed substrate W in a grid pattern, the cutting water splash prevention mechanism 24 performs the operation described in <Operation of the cutting water splash prevention mechanism 24 associated with cutting>.

After cutting, the transfer mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (mounting surface) of the plurality of products P held on the cutting tables 2A and 2B. After this cleaning, the transfer mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.

Next, the transfer mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 holds the plurality of products P by suction. After that, the transport moving mechanism 7 moves the second holding mechanism 6 holding the plurality of products P to the second cleaning mechanism 19 . Thereby, the second cleaning mechanism 19 cleans the lower surface side (opposite surface) of the plurality of products P held by the second holding mechanism 6 .

After cleaning, the multiple products P held by the second holding mechanism 6 are double-sided inspected by the inspection unit 13 and the reversing mechanism 14 . After that, the transfer movement mechanism 7 moves the second holding mechanism 6 to the transfer table 5 , the second holding mechanism 6 releases the suction holding, and places the plurality of products P on the transfer table 5 . . A plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (good products, defective products, etc.) by the inspection unit 13 .

As for the double-sided inspection, for example, first, one side of the product P is inspected while being sucked and held by the second holding mechanism 6 . Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while being sucked and held by the holding table 141 after reversing. inspection can be performed. Subsequently, the product P can be transferred from the reversing table 14 to the transfer table 5 by transferring it from the holding table 141 to the second holding mechanism 6 . Further, the holding table 141 is configured to be movable in the X direction, and at least one of the holding table 141 and the transfer table 5 is configured to be movable in the Z direction, and the holding table 141 is moved above the transfer table 5. The product P can also be transported to the transfer table 5 and transferred.

<Effects of this embodiment>
According to the cutting apparatus 100 of this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by the common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A and 2B and the transfer table 5. , the cutting mechanism 4 is moved in the horizontal plane by the cutting movement mechanism 8 in the X direction along the transfer shaft 71 and in the Y direction orthogonal to the X direction, so that the cutting tables 2A and 2B are moved in the X direction and the Y direction. The sealed substrate W can be processed without the need to Therefore, the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member can be eliminated without moving the cutting tables 2A and 2B by the ball screw mechanism. As a result, the configuration of the cutting device 100 can be simplified. Moreover, the cutting tables 2A and 2B can be configured so as not to move in the X and Y directions, and the footprint of the cutting device 100 can be reduced.

Further, in the present embodiment, in the configuration in which cutting water is jetted to the cutting mechanism 4 from the front side in the processing feed direction SD, the cutting water is placed behind the cutting mechanism 4 in the processing feed direction SD from the upper surfaces of the cutting tables 2A and 2B. Since the cutting fluid scattering prevention mechanism 24 is provided to cover the top from the lower position, the cutting fluid can be prevented from scattering. In particular, in this embodiment, in the configuration in which the cutting mechanism 4 and the cutting water supply mechanism 12 are provided on one side of the support 812 along the X direction, the other side of the support 812 along the X direction is provided with a cutting water splash prevention device. Since the mechanism 24 is provided, it is possible to prevent cutting water that has passed under the support 812 from scattering on the other side of the support 812 along the X direction.

Furthermore, in this embodiment, since the cutting water splash prevention mechanism 24 is configured using the bellows member 241, it is possible to prevent the cutting water from splashing while following the movement of the cutting mechanism 4 by the moving mechanism 8 for cutting. can. Here, the shutter member 242 is connected to the rear end portion of the bellows member 241 in the processing feed direction SD, and the shutter member 242 is fixed by the fixing portions 243A and 243B. The surrounding space can be fixed by 241 and shutter member 242, and scattering of cutting water can be reliably prevented.

In addition, since two or more cutting tables 2A and 2B are provided along the X direction and the support 812 that supports the spindles 42A and 42B is moved along the X direction, one cutting table 2A While the sealed substrate W is being processed on the other cutting table 2B, other processing such as transfer can be performed on the other cutting table 2B. In this embodiment, since the fixing portions 243A and 243B for fixing the shutter member are provided for each of the cutting tables 2A and 2B, the bellows member 241 is made to have a length corresponding to one cutting table 2A and 2B. It is possible to reduce the dimension of the bellows member 241 in the contracted state. In addition, the shutter member 242 is fixed according to each of the cutting tables 2A and 2B, and one of the cutting tables 2A and 2B is covered with the bellows member 241. A sealed substrate W before processing can be carried in, and a plurality of products P can be carried out, thereby increasing the processing capacity.

In this embodiment, since a pair of X-direction guide rails 811 provided in the X direction are provided across the cutting tables 2A and 2B, the pitch between the pair of X-direction guide rails 811 can be increased. As a result, it is possible to reduce the influence of the Z-direction positional deviation between the X-direction guide rails 811 on machining. Furthermore, the straightness of the X-direction moving portion 81 is improved by increasing the pitch of the pair of guide rails 811, and as a result, the deflection of the cutting edges of the blades 41A and 41B is reduced, and the cutting resistance during cutting is reduced. As a result, machining accuracy can be improved. Also, the Y-direction guide rail 811 can be used with lower specifications than the conventional one.

In this embodiment, since the two or more cutting tables 2A and 2B do not move in the Y direction during cutting, the moving mechanism 8 (X direction moving unit 81) moves in the X direction with respect to the two or more cutting tables 2A and 2B. Parallelism can be adjusted at once. That is, when two cutting tables are provided in a conventional apparatus in which the cutting tables move during cutting, the parallelism in the X direction of the two cutting tables is adjusted, and the parallelism in the X direction and the blade are adjusted. Although it was necessary to adjust the parallelism in the X direction (specifically, two adjustments were required), in this embodiment, the two cutting tables 2A and 2B move in the X direction during cutting. Therefore, it is sufficient to adjust the parallelism of the blades 41A and 41B in the X direction (specifically, one adjustment is sufficient).

<Other Modified Embodiments>
It should be noted that the present invention is not limited to the above embodiments.

For example, in the above-described embodiment, a twin-cut table system and a twin-spindle configuration cutting device have been described. It may be a system, such as a cutting device with a twin spindle configuration. Moreover, the structure which has three or more cutting tables may be sufficient. Even in this case, there are three or more fixing portions corresponding to three or more cutting tables.

Further, the transfer table 5 of the above embodiment is an index table that is temporarily placed before sorting into the various trays 21 , but the transfer table 5 may be used as the holding table 141 of the reversing mechanism 14 .

Furthermore, in the above-described embodiment, the transfer table 5 is sorted into the tray 21 (also called “tray storage”). A plurality of products P may be dropped into a storage box and stored separately (also called “bulk storage”). The product P may be inserted from one end opening of the cylindrical container and accommodated (also called “tube accommodation”).

Moreover, in the configuration of the above-described embodiment, the grooves may be formed without cutting the sealed substrate on the cutting tables 2A and 2B. In this case, for example, the sealed substrate W grooved by the cutting tables 2A and 2B may be returned to the substrate supply section 112 by the first holding mechanism 3 and the transfer movement mechanism 7 . Alternatively, the sealed substrate W returned to the substrate supply section 112 may be accommodated in the substrate accommodation section 111 .

In addition, since a plurality of cam rack elements constituting the transfer shaft 71 can be connected together, for example, the cutting device (processing device) 100 can be separated and connected between the second cleaning mechanism 19 and the inspection unit 13. It can be configured as a removable (detachable) module. In this case, for example, between the module on the second cleaning mechanism 19 side and the module on the inspection section 13 side, a module that performs an inspection different from the inspection performed by the inspection section 13 can be added. In addition to the configuration illustrated here, the cutting device (processing device) 100 may have a module configuration that can be separated and connected (detachable) at any point, and the modules to be added may be modules with various functions other than inspection. .

Further, the processing apparatus of the present invention may perform processing other than cutting, and may perform other mechanical processing such as cutting and grinding.

In addition, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

100...Cutting device (processing device)
W: Sealed substrate (object to be processed)
P ... Product (object to be processed after processing)
SD: processing feed direction 2A, 2B: cutting table (processing table)
3 First holding mechanism 4 Cutting mechanism (processing mechanism)
5: Transfer table 6: Second holding mechanism 7: Transfer mechanism 71: Common transfer shaft 8: Cutting movement mechanism (processing movement mechanism)
81 X-direction moving part 811 A pair of X-direction guide rails 812 Support body 82 Y-direction moving part 12 Cutting water supply mechanism (working fluid supply mechanism)
15... Cover member 24... Cutting water scattering prevention mechanism (machining fluid scattering prevention mechanism)
241 Accordion member 242 Shutter members 243A, 243B Fixed portion U Raised position D Lowered position

Claims (10)

a processing table holding an object to be processed;
a first holding mechanism for holding the workpiece for transporting the workpiece to the processing table;
a machining mechanism for machining the workpiece held on the machining table;
a transfer table to which the processed object is transferred;
a second holding mechanism that holds the processed workpiece in order to transport the processed workpiece from the processing table to the transfer table;
a transfer movement mechanism extending along the arrangement direction of the processing table and the transfer table and having a common transfer shaft for moving the first holding mechanism and the second holding mechanism;
a machining moving mechanism for moving the machining mechanism in a horizontal plane in a first direction along the transfer axis and in a second direction orthogonal to the first direction;
a machining fluid supply mechanism that moves together with the machining mechanism by the machining movement mechanism and injects machining fluid to the machining mechanism from one side in a machining feed direction;
a machining fluid scattering prevention mechanism provided on the other side in the machining feed direction with respect to the machining mechanism and covering the machining table from a position below the upper surface of the machining table to prevent the machining fluid from scattering. , processing equipment. The machining fluid scattering prevention mechanism includes:
a bellows member that expands and contracts along with the movement of the processing mechanism and covers an upper side and a side perpendicular to the processing feeding direction;
2. The processing apparatus according to claim 1, further comprising a shutter member to which a rear end portion of said bellows member in said processing feed direction is connected and which covers a rear portion thereof in said processing feed direction. 3. The processing apparatus according to claim 2, further comprising a fixing portion for fixing said shutter member to said processing table when said processing mechanism is processing said object. A plurality of the processing tables are provided,
4. The processing apparatus according to claim 3, wherein said fixing portion is provided corresponding to each of said plurality of processing tables. 5. The processing apparatus according to claim 4, wherein said moving mechanism for processing moves said shutter member to each of said plurality of fixed portions. The shutter member is movable between a raised position where the lower end is located above the upper surface of the processing table and a lowered position where the lower end is located below the upper surface of the processing table. ,
The processing apparatus according to any one of claims 3 to 5, wherein said fixing portion fixes said lowered position. The processing moving mechanism includes an X-direction moving unit that linearly moves the processing mechanism in the X direction, which is the first direction, and a Y-direction moving unit that linearly moves the processing mechanism in the Y direction, which is the second direction. with
The X-direction moving part moves along a pair of X-direction guide rails provided along the X direction with the machining table interposed therebetween, and moves along the pair of X-direction guide rails, and moves through the Y-direction moving part. 7. The processing apparatus according to claim 1, further comprising a support for supporting said processing mechanism. A direction facing one side along the X direction is the processing feed direction,
The processing mechanism and the processing liquid supply mechanism are provided on one side of the support along the X direction,
8. The processing apparatus according to claim 7, wherein the machining fluid scattering prevention mechanism is provided on the other side of the support along the X direction. 9. The processing apparatus according to claim 8, wherein a cover member for accommodating said processing mechanism and said processing liquid supply mechanism is provided on one side of said support along the X direction. A method of manufacturing a processed product, comprising manufacturing a processed product using the processing apparatus according to any one of claims 1 to 9.

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