KR100886403B1 - A handler system for cutting semiconductor pakage device - Google Patents

Abstract

A strip feeder for removing at least one strip from the cassette loaded with the strip and feeding the strip to a pickup position; A transfer device which receives the strip transferred from the strip feeder to the pick-up position, cuts it by using a laser, transfers it to a machining position to form a package, and then processes it, and then returns to the received position; A vision inspection device for inspecting a quality of a package cut at a machining position; A tray stacking device for loading the inspected package for each quality level; A first pick-up transfer device which picks up the strip to be processed from the strip feeder and transfers it to the transfer device, and picks up and processes the processed package from the transfer device; Disclosed is a handler system for cutting a semiconductor package device, comprising: a second pickup transfer device configured to receive a processed package from a first pickup transfer device and transfer the processed package to a tray stacking device.

Semiconductor, package, strip, cutting, laser, picker, loading

Description

Handler system for cutting semiconductor package devices

The present invention relates to a handler system for cutting a semiconductor package device, and more particularly, to a handler system for cutting a semiconductor package device for cutting a semi-finished product and strips in which a plurality of packages are aligned in a semiconductor process.

In general, since a semiconductor package is composed of a multi-layered composite layer, it is usually cut by a sawing machine or router even if the individual parts are molded separately and only the connection part is cut or the package is molded at once. Is common.

With the recent integration of products, the molding of several packages at once is the mainstream trend. In this production method, the sawing machine, which is the main means of cutting, cuts the product by rotating the diamond wheel at a high speed. In terms of production cost, the consumption of the diamond wheel is considerably large.

Due to these problems, attempts have been made to use lasers as an alternative to using diamond wheels. However, when cutting using a laser, since the product is composed of a composite layer, it is impossible to obtain a good cutting surface or only to cut a thin product. In other words, the cutting by the laser is achieved by concentrating energy at the focus of the lens. However, the concentration of energy does not occur physically only at one focal point, but a hyperbolic curve is formed around the focal point, and an area capable of cutting is generated. This is called focal depth. Generally, wavelengths of laser sources that are considered suitable for cutting semiconductor packages are 1064 nanometers, 572 nanometers, and 355 nanometers. The focal depth of the laser is formed to about 0.5 mm, but when trying to cut a thicker product, energy outside the focal depth range is used, so the energy concentration is significantly reduced. This decrease in energy concentration results in a worse state of the cut surface and a marked decrease in cutting speed during cutting. In addition, when cutting a package having a composite layer made of different materials (for example, a package made of molding compound and copper alloy), when cutting with one focal point, the cutting parameters cannot be obtained due to the difference between two different materials. Occurs. When the compound is cut by the energy for cutting copper, the compound melts, or when the compound is cut well, the copper is not cut.

In addition, when cutting using a sawing machine, additional processes and equipment for cooling the heat generated during cutting with water and discharging cutting residues are required, i.e., cleaning and drying processes. There is a problem.

The present invention has been made to solve the above problems, and provides a handler system for cutting a semiconductor package device, which is capable of cutting a semiconductor device using a laser, but the cutting process is easy and simple. There is a purpose.

The handler system for cutting a semiconductor package device of the present invention for achieving the above object comprises: a strip supply device for detaching and supplying at least one strip from a cassette loaded with a strip to a pickup position; A transfer device which receives the strip transferred from the strip feeder to the pick-up position, cuts it using a laser, transfers it to a processing position for forming a package, and then processes the strip to return to the received position; A vision inspection device for inspecting a quality of a package cut at the processing position; A tray stacking device for loading the inspected package for each quality level; A first pick-up transfer device which picks up a strip to be processed from the strip feeder and transfers it to the transfer device, and picks up and transports the processed package from the transfer device; And a second pickup transfer device configured to receive the processed package from the first pickup transfer device and transfer the processed package to the tray stacking device.

Here, the conveying apparatus may be configured to face each other so as to alternately perform an operation of simultaneously transferring the processed package to a loading or unloading position while simultaneously loading the strip to be processed to a laser cutting machining position. It is preferable to include two conveying units.

Further, each of the first and second transfer units may include a seating strip movable between a loading or unloading position where the strip to be processed is loaded and an unloaded processed package, and a processing position where the loaded package is laser processed. Table; A lifting block for supporting the strip seating table; A sliding block supporting the lifting block in a liftable manner, the sliding block reciprocating horizontally; A guide block to slidably support the sliding block; A first driving part for elevating the elevating block; And a second driving part for sliding the sliding block, and the focusing of the laser beam directed to the strip placed on the seating table at the machining position may be performed by the lifting and lowering movement of the lifting block.

In addition, the lifting block of each of the first and second transfer unit, it is preferable that the sliding block is controlled to be moved at different heights when moving horizontally.

In addition, the focus control of the laser light is preferably made by moving the position of the laser generator which is installed to be movable.

In addition, the strip supply apparatus includes an onloader device in which the strip detaches at least one strip from the cassette loaded with layers. And a delivery device for receiving the strip detached from the on-loader device and transferring the strip to a pickup position where the first pick-up and transfer device can pick up the strip.

In addition, the first pick-up transfer apparatus includes: a pair of picker heads for picking up a package supplied from the feeding device and picking up a package processed at the processing position; A support block for supporting the picker head; Up and down guide rail for guiding the support block to move up and down; It is preferable to include a; horizontal guide rail for guiding the vertical guide rail to be moved in the horizontal direction.

The second pick-up transfer apparatus may further include: a support table on which a package transferred by the first pick-up transfer apparatus is placed; A first number evaluation guide rail for horizontally conveying the support table by a predetermined distance; At least one picker head for picking up and lifting a package on a support table conveyed along the first water guide rail; And a second number evaluation guide rail for guiding the picker head to be transported along a predetermined path.

The vision inspection apparatus may further include: a first photographing apparatus for inspecting an upper portion of a package conveyed by the first pick-up transfer apparatus; And a second photographing apparatus for inspecting a lower portion of a package conveyed by the second pickup transfer apparatus.

The apparatus may further include a cleaning device for cleaning the cut package.

According to the handler system for cutting a semiconductor package device of the present invention, it is possible to adjust the height of the semiconductor package to be cut at a machining position, that is, to move it in the optical axis direction of the laser light. Therefore, by adjusting the focal depth range of the laser beam, not only can a laser cutting method such as a sawing be replaced by a laser, but also a semiconductor package having a thick product or a composite layer can be cut quickly and accurately during laser cutting. It becomes possible.

In addition, by providing a pair of first and second transfer units in the conveying apparatus, it is possible to remove debris of the cut package while cutting the package using a laser, and to supply a new cut object, that is, a package. As a result, the cutting operation can be continued without consuming time. As such, since the cutting process can be performed simply and continuously, the semiconductor package device can be efficiently produced.

Hereinafter, a handler system for cutting a semiconductor package device according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 1, a handler system for cutting a semiconductor package device according to an exemplary embodiment of the present invention includes a strip supply device 100, a transfer device 200 for loading and unloading a supplied strip to a processing position, and a cutting device. Cleaning device 300 for cleaning the processed package, Vision inspection device 400 for inspecting the package has been cleaned, Tray loading device 500 for loading the inspected package by quality level, Strip and processing to be processed And a second pick-up transfer device 600 for transferring the package, and a second pick-up transfer device 700 for transferring the package transferred from the first pick-up transfer device 600 to the tray stacking device 500.

The strip feeding device 100 is for removing at least one strip from the cassette on which the strip is loaded and feeding the strip to the pickup position. The strip supply apparatus 100 includes an onloader device 110 for detaching at least one strip from a cassette on which a strip is stacked, and the stripper detached from the onloader device 110 to receive the first pickup transport device. It is provided with a transfer device 120 for transferring to a position that can be picked up at 600.

The specific configuration of the on-loader device 110 is not a component characterizing the present invention, it will be readily understood by those skilled in the art from known techniques. Since an example of the on-loader device 110 is disclosed in detail in FIGS. 2A and 2B of Korean Patent Laid-Open Publication No. 2002-0049954, a detailed description thereof will be omitted.

The transfer device 120 includes at least one transfer belt 121, a shaft 123 connected to a rotating body supporting the transfer belt 121, and at least one drive for rotating the shaft 123. The motor 125 is provided. The strip pushed from the on-loader device 110 is placed on the transfer belt 121, the shaft 123 is rotated by the drive of the drive motor 125 to rotate the transfer belt 121, May be delivered to a pickup position where the first pick-up transfer apparatus 600 may pick up.

 The conveying apparatus 200 is cut using a loading / unloading position B which receives the strip transferred from the strip supply apparatus 100 to a pickup position by the first pick-up conveying apparatus 600, and a laser beam. Transfer between machining positions (A).

1, 2, and 3, the transfer apparatus 200 includes first and second transfer units 210 and 220 provided symmetrically with respect to the Y coordinate axis. The first and second transfer units 210 and 220 may load the strip to be processed into the machining position A for laser cutting and simultaneously transport the package formed by cutting the strip to the loading / unloading position B. It is provided in pairs to perform alternately.

Each of the first and second transfer units 210 and 220 includes strip seating tables 211 and 221, lifting blocks 212 and 222, sliding blocks 213 and 223, guide blocks 214 and 224, and first driving units 215 and 225. And second driving units 216 and 226. Here, since the first and second transfer units 210 and 220 have the same configuration, it will be described in detail with the configuration of the first transfer unit 210 as a representative.

The strip seating tables 211 and 221 are installed to be arranged on the same line with respect to the Y direction. Therefore, when the seating tables 211 and 221 cross each other, as shown in FIG. 3, the seating tables 211 and 221 are moved in different postures so as not to collide with each other.

The seating table 211 is fixed to and supported by a lifting block 212.

The elevating block 212 is installed by the first driving unit 215 to be elevated in the Z-axis direction from the sliding block 213. The first driving part 215 has a drive motor 215a and a screw shaft 215b that is rotationally driven by the drive motor 215a. The nut part 212a of the elevating block 212 is coupled to the screw shaft 215b. Therefore, the lifting block 212 can move up and down in the Z-axis direction according to the rotational direction of the screw shaft 215b.

The sliding block 213 is a block body 213a on which the first driving unit 215 is supported, and a nut part coupled to the block body 213a and supported by the guide block 214 so as to be movable in the Y axis direction. 213b).

The second driving part 216 is for sliding driving the sliding block 213 in the Y-axis direction, and is driven by the driving motor 216a and the driving motor 216a and coupled to the nut part 213b. It has a screw shaft 216b. Therefore, when the driving motor 216a rotates in one direction, the screw shaft 216b rotates, and the nut part 213b moves in either direction.

Here, the rail block 217 is provided complementary to the guide block 214 and the nut part 213b of the sliding block 213 to guide the movement of the sliding block 213. The rail unit 217 may include a guide groove and a rail. The guide blocks 214 and 224 are provided in pairs parallel to each other in the Y axis direction.

According to the transfer apparatus 200 having the above configuration, since the strips 20 can be sequentially supplied alternately, the processing time can be shortened.

Further, since the seating tables 211 and 221 can be moved up and down in the Z-axis direction at the machining position A, the focus of the laser light output from the laser irradiation apparatus 10 can be accurately adjusted regardless of the thickness of the strip 20. Because of this, it is possible to further shorten the processing time, there is an advantage that can lower the machining error and machining failure rate.

That is, since the range of the focal depth of the laser light can be shifted on the Z axis, it is possible to cut and process a semiconductor package made of a composite material or a package having a different thickness more quickly and precisely. Therefore, it is possible to save time and reduce processing errors, thereby reducing defective products.

In another embodiment, the seating table only moves up and down so that the two are prevented from colliding by an air cylinder (not shown), and the laser irradiation device 10 is provided with a lifting means for precise cutting. 10) can move up and down.

The cleaning device 300 is installed adjacent to the conveying device 200, to remove dust or scrap from the package cut by the laser processing, the scrap container 310 and air for scrap An air spraying device 320 capable of spraying may be provided. In the drawings, the air injection device 320 is briefly shown mainly on the injection nozzle, but can be easily understood from a known technology.

The vision inspection apparatus 400 includes a first camera 410 and a second camera 420. The first photographing unit 410 is installed adjacent to the conveying apparatus 200, and inspects the upper part of the cleaned package after cutting. Therefore, the first camera 410 is located above the transport apparatus 200, and preferably disposed above the camera so as to photograph the package placed in the loading / unloading position (B).

In addition, the first camera 410 may check whether the direction of the material is correct when the strip is placed on the strip seating table (211, 221) before processing.

The second photographing apparatus 420 is for inspecting a lower portion of the package conveyed by the second pickup transfer apparatus 700. Therefore, the second imager 420 is disposed on the movement path of the second pickup transfer apparatus 700 and is located below it.

The quality of the package is determined according to the state of the lower and upper portions of the processed package taken by the first and second cameras 410 and 420, respectively, and can be transferred to a predetermined position of the loading apparatus 500 according to the determined quality grade. Will be.

As shown in FIG. 1, the loading device 500 may be divided into a plurality of first and second loading devices 510 and 520. As an example, the first loading device 510 may be classified as a place for loading a package of good quality, and the second loading device 520 may be classified as a place for loading a package of low quality. The first and second loading apparatuses 510 and 520 may include stacking trays 511 and 521, guide rails 512 and 522 for guiding the stacking trays 511 and 521 to be moved to a moving section of the second pick-up transfer apparatus 700, and a stacking tray ( As a driving unit for moving the 511 and 521, a driving shaft 513 and 523 and a driving motor (not shown) are provided. According to the above configuration, the stacking trays 511 and 521 move in the axial direction of the drive shafts 513 and 523 and are positioned at predetermined positions when the drive shafts 513 and 523 are driven to rotate, thereby causing the second pick-up transfer apparatus 700 to move. The package moved by it can be delivered.

In addition, a separate container 800 for collecting defective products from the package transported by the second pick-up transporter 700 separately from the loading device 500 may be provided on the transport path of the second pick-up transporter 700. Can be.

The first pick-up transfer device 600 picks up the strip supplied from the strip supply device 100 to the pick-up position and moves it to the seating table at the loading / unloading position (B), after cutting and loading / unloading again. After picking up the package moved to the position (B) to be transported to the cleaning device 300 to be cleaned, and then transferred to the second pick-up transfer device (700).

As shown in FIGS. 1 and 4, the first pick-up transfer apparatus 600 includes a pair of picker heads 610 and 620, a support block 630, a vertical guide rail 640, and a horizontal guide rail. 650 is provided.

The pair of picker heads 610 and 62 are disposed adjacent to each other side by side. As described above, a pair of picker heads 610 and 620 may be provided, and a strip to be processed may be picked up by one of the picker heads 610, and the processed package may be sucked and supported by another picker head 620. . Therefore, it is possible to more easily and quickly perform the operation of supplying the strip to be processed and transferring the package by processing the strip. The picker heads 610 and 620 are provided with suction power generated in an air pump (not shown) to the suction portion of the tip of the picker heads 610 and 620, and the suction force can be transported by the strip and the package. Since the configuration of the picker heads 610 and 620 can be understood from the known art, a detailed description thereof will be omitted.

The support block 630 is installed to be elevated in the Z-axis direction along the upper and lower guide rails 640 while supporting the picker heads 610 and 62. To this end, the nut block 631 is provided on the support block 630, and the screw shaft 641 is provided on the upper and lower guide rails 640. The screw shaft 641 may be bidirectionally rotated by a driving motor (not shown).

The upper and lower guide rails 640 are slidably supported in the X-axis direction by the horizontal guide rails 650. Therefore, the picker heads 610 and 62 are movable in the vertical direction and the X axis direction.

1 and 5, the second pickup transfer device 700 includes a support table 710, a horizontal transfer unit 720 for transferring the support table 710 a predetermined distance to the Y axis, and the horizontal transfer unit 720. Picker head 730 for picking up a package on the support table 710 transported along the sending part 720, a support block 740 for supporting the picker head 730, and a support block 740 for lifting and lowering. And a horizontal guide rail 760 for guiding the horizontal movable block 750 and the horizontal movable block 750 to be moved in the horizontal direction, and a driving unit 770 for elevating the supporting block 740.

The support table 710 is installed to be reciprocated by the horizontal moving part 720 in the Y axis direction. The horizontal moving part 720 is a guide rail 721 placed on the Y-axis, the drive motor 722, the screw shaft 723 for moving the support table 710 while being driven by the drive motor 722 is rotated It can be provided.

Since the picker head 730 has the same configuration and operation as the above-described picker heads 610 and 620, a detailed description thereof will be omitted.

The support block 740 supports the picker head 730 and has a nut part 741. The support block 740 is connected to the horizontal movable block 750 to slide up and down.

The horizontal guide rails 760 are arranged side by side in the X-axis direction. The picker head 730, the support block 740, and the horizontal moving block 750 are formed as one assembly on each horizontal guide rail 760 to be driven independently.

The drive unit 770 includes a drive motor 771 and a screw shaft 772. The drive motor 771 is supported by the horizontal moving block 750 to selectively rotate the screw shaft 772 in both directions. As the nut part 741 is raised or lowered by the rotation of the screw shaft 772, the package placed on the support table 710 is picked up and transported, and then loaded on the loading apparatus 500.

1 is a schematic diagram showing a handler system for cutting a semiconductor package device according to an embodiment of the present invention.

Figure 2 is a plan view showing an extract of the transfer device shown in FIG.

3 is a longitudinal sectional view of the transfer apparatus shown in FIG. 2;

4 is a schematic front view illustrating the first pickup transfer apparatus illustrated in FIG. 1.

FIG. 5 is a schematic front view for explaining the second pickup transfer apparatus shown in FIG. 1; FIG.

<Description of Symbols for Major Parts of Drawings>

10.Laser Generator 20.Strip

100. Strip feed 110. On-loader

120. Transmission 200. Conveyer

210.220. First 2nd transfer unit 300 .. Cleaning device

400. Vision inspection apparatus 410, 420 First and second camera

500. Loading device 510,520. First and second loading device

600. First pick-up transfer unit 610, 620, 730 Picker head

630,740 Support block 640 Upper and lower guide rail

650..Horizontal Guide Rail 700..2 Pickup Transfer Unit

710. Supporting table 720. Horizontal transfer unit

750 horizontal block 760 horizontal guide rail

770..Driver

Claims (10)

A strip feeder for removing at least one strip from the cassette loaded with the strip and feeding the strip to a pickup position; A transfer device which receives the strip transferred from the strip feeder to the pick-up position, cuts it using a laser, transfers it to a processing position for forming a package, and then processes the strip to return to the received position; A vision inspection device for inspecting a quality of a package cut at the processing position; A tray stacking device for loading the inspected package for each quality level; A first pick-up transfer device which picks up a strip to be processed from the strip feeder and transfers it to the transfer device, and picks up and transports the processed package from the transfer device; And a second pickup transfer device receiving the processed package from the first pickup transfer device and transferring the processed package to the tray stacking device. The method of claim 1, wherein the transfer device, And first and second transfer units disposed opposite to each other so as to alternately perform an operation of simultaneously transferring the processed package to the loading or unloading position while loading the strip to be processed to a laser cutting machining position. A handler system for cutting semiconductor package devices. The method of claim 2, wherein each of the first and second transfer unit, A strip seating table movable between a loading or unloading position for loading the strip to be processed and unloading the processed package, and a processing position for laser processing the loaded strip; A lifting block for supporting the strip seating table; A sliding block supporting the lifting block in a liftable manner, the sliding block reciprocating horizontally; A guide block to slidably support the sliding block; A first driving part for elevating the elevating block; And a second driving part for sliding the sliding block. A handler system for cutting a semiconductor package device, characterized in that the focusing of the laser beam from the machining position to the strip placed on the seating table is possible by the lifting and lowering movement of the lifting block. According to claim 3, The lifting block of each of the first and second transfer unit, The handler system for cutting a semiconductor package device, characterized in that the sliding block is controlled to move at different heights during horizontal movement. 4. The handler system for cutting a semiconductor package device according to claim 3, wherein the focusing of the laser light is performed by moving a laser generator which is installed to be movable. The strip feeding apparatus according to any one of claims 1 to 5, wherein An onloader device in which the strip detaches at least one strip from the cassette loaded with layers; And a transfer device for receiving the strip detached from the on-loader device and transferring the strip to a pick-up position for picking up from the first pick-up transfer device. According to any one of claims 1 to 5, The first pick-up transfer device, A pair of picker heads for picking up the package supplied from the feeding device and picking up the package processed at the processing position; A support block for supporting the picker head; Up and down guide rail for guiding the support block to move up and down; And a horizontal guide rail for guiding the upper and lower guide rails to move in a horizontal direction. According to any one of claims 1 to 5, The second pick-up transfer device, A support table on which a package conveyed by the first pick-up transfer apparatus is placed; A first number evaluation guide rail for horizontally conveying the support table by a predetermined distance; At least one picker head for picking up and lifting a package on a support table conveyed along the first water guide rail; And a second evaluation guide rail for guiding the picker head to be transported along a predetermined path. The vision inspection apparatus according to any one of claims 1 to 5, wherein A first photographing unit for inspecting an upper portion of a package conveyed by the first pick-up conveying apparatus; And a second photographing apparatus for inspecting a lower portion of a package conveyed by the second pick-up conveying apparatus. The method according to any one of claims 1 to 5, A handler system for cutting a semiconductor package device, further comprising a cleaning device for cleaning the cut package.

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