KR100460333B1 - Handler for inspecting semiconductor package - Google Patents

Abstract

According to the present invention, there is provided a feed station including a tray having a semiconductor package requiring inspection; A buffering station in which an empty tray is provided in a standby state after the semiconductor package is exhausted in the supply station; First to fourth sorting stations, wherein trays from the buffering station are provided for sorting the inspected semiconductor packages; And classifying a semiconductor package in the first to fourth sorting stations, wherein the second shaft is movable in the longitudinal direction of the first axis and the first axis, and is provided at a right angle with respect to the first axis. A third axis movable in the longitudinal direction and installed at a right angle with respect to the first axis and parallel to the second axis, and movable in a longitudinal direction with respect to the second axis and the third axis, respectively; Provided is a handler apparatus for semiconductor package inspection, comprising: a first robot having a first suction nozzle head and a second robot having a second suction nozzle head.

Description

Handler for inspecting semiconductor package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handler apparatus for semiconductor inspection, and more particularly, to a handler apparatus for inspecting a semiconductor and classifying and loading the semiconductor according to the state.

In general, a semiconductor manufacturing process includes a process of inspecting the assembly state of semiconductors at the final stage of semiconductor package manufacturing and classifying the semiconductors by grades according to defects. The semiconductor inspection is usually performed through an inspection apparatus, and classified into various grades according to the state of the semiconductor package determined by the inspection apparatus.

Conventionally, in the apparatus for performing semiconductor package inspection and classification, the speed of devices for adsorbing or moving the semiconductor package is relatively slow, so that a quick and accurate inspection process has not been performed. That is, the semiconductor package should be inspected at the inspection station after being heated in the heater block and classified into trays for each grade according to the inspection result, and the distance to be moved in each step is long, and to overcome such distance, Due to the slow speed of the transfer devices, there is a problem that it is difficult to perform efficient work.

The present invention has been made to solve the above problems, an object of the present invention is to provide a handler apparatus for semiconductor inspection can be performed more productive work.

Another object of the present invention is to provide a handler apparatus for semiconductor inspection that can heat a semiconductor package, perform inspection, and efficiently classify according to the inspection result.

1 is a block diagram showing the overall configuration of a handler apparatus for inspecting a semiconductor package according to the present invention.

2 is a perspective view of a first robot provided in the present invention.

3 is a plan view of the robot of FIG. 2.

4 is a front view of the robot of FIG.

5 is a perspective view of a suction nozzle head provided in the robot of FIG. 2.

FIG. 6 is a side view of the adsorption nozzle head shown in FIG. 5. FIG.

7 is a perspective view of a loading shuttle provided in the present invention.

8A is a perspective view of a rotary suction nozzle device provided in the present invention.

FIG. 8B is a plan view of links provided in the rotary suction nozzle device of FIG. 8A. FIG.

FIG. 9 is a front view of the rotary suction nozzle device of FIG. 8A. FIG.

FIG. 10 is a bottom view of the rotary adsorption nozzle device of FIG. 8A. FIG.

11 is a perspective view of an unloading shuttle provided in the present invention.

12 is a perspective view of a second robot provided in the present invention.

FIG. 13 is a bottom view of FIG. 12.

Fig. 14 is a perspective view showing a tray supplying, buffering and sorting station provided in the present invention.

It is a side view which shows the elevator apparatus provided in each said station.

16 is a perspective view of a third robot provided in the present invention.

<Brief Description of Major Codes in Drawings>

1.2.3.4. Sorting station 11. First robot

12. Supply station 13. Heater block

14. Loading Shuttle 15. Standby Stage

16. Inspection Stage 17. Unloading Shuttle

18. 2nd Robot 19. Buffering Station

In order to achieve the above object, according to the present invention, a supply station provided with a tray equipped with a semiconductor package that requires inspection; A buffering station in which an empty tray is provided in a standby state after the semiconductor package is exhausted in the supply station; A plurality of sorting stations, wherein a tray from the buffering station is provided for sorting the inspected semiconductor package; And classifying the semiconductor package in the sorting station, the second package being movable in the longitudinal direction of the first axis and the first axis, and movable in the longitudinal direction of the first axis and at a right angle with respect to the first axis. A third axis installed at right angles to the first axis and parallel to the second axis; a first adsorption nozzle head provided at the second axis and the third axis, the first adsorption nozzle being movable and movable in a longitudinal direction; And a second robot having a second adsorption nozzle head.

According to an aspect of the present invention, by adsorbing and supplying the semiconductor package of the supply station, the first axis, the second axis which is movable in the longitudinal direction of the first axis and installed at a right angle with respect to the first axis, Movable in a longitudinal direction relative to the third axis, the second axis, and the third axis, movable in the longitudinal direction of the first axis and installed perpendicular to the first axis and parallel to the second axis; A first robot having a first suction nozzle head and a second suction nozzle head respectively provided; A heater block in which the first adsorption nozzle head or the second adsorption nozzle head of the first robot lowers or picks up the semiconductor package thereon; A loading shuttle for moving the semiconductor package picked up from the heater block to a standby stage in a state where it is placed on a loading stand; And a first adsorption nozzle group and a second adsorption nozzle group having a plurality of adsorption nozzles so as to adsorb and transfer the semiconductor package from the loading shuttle to the inspection stage, wherein the first adsorption nozzle group and the second adsorption nozzle group are provided. A rotary adsorption nozzle device in which the group can be interchanged; An inspection apparatus provided to perform an inspection at the inspection stage; An unloading shuttle for moving the semiconductor package picked up by the rotary adsorption nozzle device to a loading stand after the inspection is finished; And a tray conveyer having a suction nozzle capable of attracting the tray and installed to move up and down to move the tray between the supply station, the sorting station, and the first to third sorting stations.

According to one aspect of the invention, the first adsorption nozzle head and the second adsorption nozzle head is a pair arranged up and down so as to be movable by the pulley so as to adjust the distance between each adsorption nozzle it is equipped with And a nozzle mounting portion provided with the suction nozzle in a state in which one side is connected to the belt, and a drive motor for driving the belt.

According to another feature of the present invention, the loading device and the unloading device, the belt is fixed to one side with respect to the stockpile so as to reciprocate the stockpile provided in each of the holding, the belt and the movable holding Pulleys and a drive motor for rotationally driving the pulley.

According to another feature of the invention, the rotary suction nozzle device, and the rotation drive motor; A pulley rotationally driven by the rotation drive motor; A first link centered on an axis of the pulley; A second link and a third link rotatably connected to both ends of the first link; A pair of guide rails provided at each of the second link and the third link to guide linear movement in the longitudinal direction of the second link and the third link; A pair of guide rails each provided with said pair of guide rails for guiding a forward motion in each direction perpendicular to a longitudinal direction of said second link and third links; A lift drive motor fixed to the lower portion of the second link and the third link; A ball screw that is rotated by receiving power of the lift drive motor from a pulley and a belt; And a nut coupled to the ball screw and connected to the first suction nozzle group and the second suction nozzle group, respectively.

According to another feature of the invention, the supply station, the buffering station, the first to fourth sorting station, the stack portion is mounted on the tray; A nut connected to the stack; A ball screw coupled with the nut; A drive motor for rotating the ball screw; A laminate plate capable of receiving trays stacked on the laminate; And a rodless cylinder for horizontally moving the laminate.

According to another feature of the invention, the stacking portion and the stacking portion has a shape that does not interfere with each other when viewed in a plan, when the stacking unit lowered to a lower height than the stacking plate is laminated to the stacking plate to the laminate When the stack is lowered to a lower height than the stack and then rises again, the tray stacked on the stack may be transferred to the stack.

Hereinafter, the present invention will be described in more detail with reference to an embodiment shown in the accompanying drawings.

1 is an explanatory diagram showing an overall system of a handler apparatus for semiconductor inspection according to the present invention.

Referring to the drawings, the handler device is provided with a first robot 11. The first robot 11 is provided with a pair of first and second adsorption nozzle heads capable of mutually adjusting a distance therebetween. The pair of adsorption nozzle heads can perform a biaxial movement and a lifting movement perpendicular to each other on a plane. The first adsorption nozzle head of the first robot 11 adsorbs the semiconductor from the tray supplied to the first supply station 12 to the heater block 13, and the second adsorption nozzle of the first robot 11. The head takes the semiconductor package heated to a predetermined temperature in the heater block 13 to the loading shuttle 14. The loading shuttle 13 takes the semiconductor package back to the standby stage 15 for inspection. The semiconductor package arranged in the standby stage 15 is adsorbed by the rotary adsorption nozzle apparatus (not shown), and is moved to the inspection stage 14 again. In the inspection stage 14, the inspection of the semiconductor package is performed by the inspection apparatus. This inspection is performed with the semiconductor package inserted in the socket.

After the inspection, the semiconductor package is moved from the inspection stage 16 toward the second robot 18 by the unloading shuttle 17. The semiconductor packages which have been moved from the inspection stage 16 by the unloading shuttle 17 are classified by the second robot 18 into the first to fourth sorting stations 1, 2, 3, 4, respectively. In this case, the classification criteria may be arbitrarily determined by the user of the handler device. In addition, according to the sorting criteria, the second robot 18 is moved to a tray placed on the first to fourth loading racks 6, 7, 8, and 9.

On the other hand, elevator apparatuses which can raise and lower trays are provided in the 1st-4th sorting stations 1, 2, 3, and 4, respectively. Such an elevator (not shown) allows the next empty tray to be stacked on it by lowering the tray once the sorted semiconductor package is filled in the tray of each station. In each sorting station (1, 2, 34), if the tray is stacked more than a predetermined number, all the trays are moved horizontally and discharged to the outside.

On the other hand, the supply station 12 is supplied with a tray carrying semiconductor packages which have not yet been classified. The semiconductor package loaded on the tray supplied to the supply station 12 is picked up by the head of the first robot 11 and supplied to the heater block 13.

When the semiconductor packages loaded in the trays are all supplied at the supply station 12 and become empty trays, such trays are moved to the buffering station 19. The buffering station 19 is a waiting place for moving the empty tray to each sorting station 1, 2, 3, 4. The supply station 12 and the buffering station 19 are also provided with an elevator device capable of lifting the tray and a device for horizontally moving the stacked trays.

A third robot 10 is provided for moving the empty tray between the supply station 12, the buffering station 19, and each sorting station 1, 2, 3, 4. The third robot 10 vacuum-adsorbs the tray through an adsorption nozzle head which performs uniaxial reciprocating motion in the horizontal direction and lifting motion in the vertical direction, and carries it between the stations. Each apparatus and apparatus described with reference to FIG. 1 will be described in more detail later.

Shown in FIG. 2 is a schematic perspective view of the first robot 11.

Referring to the drawings, the first robot 11 is installed to extend in a direction perpendicular to the first axis 21 and the first axis 21 to move in the longitudinal direction of the first axis 21. The shaft 22 and the 3rd shaft 23 are provided. The second shaft 22 and the third shaft 23 are each provided with heads (not shown) that move in the longitudinal direction thereof.

In FIG. 2, a second shaft drive motor 24 is installed on the first shaft 21 so that the second shaft 22 can move along the first shaft 21. The driving force is transmitted to the pulley 27 through the belt 26. Meanwhile, a third shaft driving motor 31 is provided to move the third shaft 23 along the first shaft 21, and the driving force of the driving motor 31 is different from a belt and a pulley (not shown). Is passed through).

In addition, a first head driving motor 28 is provided to move the first head (not shown) along the second axis 22, and the driving force of the driving motor 28 is the belt 30 and the pulley 28. Is passed through. Furthermore, a second head drive motor 25 is provided to move the second head (not shown) along the third axis 23, and the driving force of the drive motor 25 is also transmitted through the belt and the pulley mechanism. .

3 is a plan view of the first robot shown in FIG. 2, with the top cover removed.

Referring to the drawings, the rotational drive shaft of the second shaft drive motor 24 is transmitted to the pulley 27 through the belt 26, and again through the other pulley 39 coaxially with the pulley 27. Is passed to 34. The belt 34 is provided to be runable between the pulley 39 and the other pulley 39 '. Denoted by reference numeral 35 is a portion to which the second shaft 22 is fixed. Therefore, when the second shaft drive motor 24 is rotated, the belt 34 is thereby driven, so that the second shaft 22 is connected to the first shaft 21 through the second shaft fixing part 35. You can move in the length direction.

Similarly, the motion of the third shaft 23 is also enabled by transmitting the rotational driving force of the third shaft drive motor 36 through the belt 33 provided to run on the pulleys 38 and 38 '. Designated by reference numeral 36 is a portion to which the third axis 23 is fixed.

The second axis 22 and the third axis 23 are guided by the guides 32, 32 ′ in the reciprocating motion along the first axis 21. That is, the second shaft 22 and the third shaft 23 share the guides 32 and 32 'and are guided.

Shown in FIG. 4 is a front view of the first robot shown in FIG. 2.

Referring to the drawings, it can be understood that the first head 41 is provided below the second shaft 22, and the second head 42 is installed below the second shaft 23. The first head 41 can reciprocate along the longitudinal direction of the second axis 22, and the driving force necessary for such reciprocating motion is provided by the head drive motor 28. Similarly, the second head 42 can reciprocate along the longitudinal direction of the third axis 23, and the driving force necessary for such reciprocating motion is provided by the other head drive motor 25. The manner in which the head drive motors 28, 25 transmit a driving force to the first and second heads 41, 42 is described with reference to FIG. 3, the second axis drive motor 24 and the third axis. The driving motor 25 is similar to the method of transmitting the driving force to the second shaft and the third shaft (22, 23), respectively, and this transmission method is well known to those skilled in the art, further description thereof will be omitted.

5 is a perspective view of the first head and the second head shown in FIG. 4.

Referring to the drawings, the heads 41 and 42 are installed to be movable in the longitudinal direction with respect to the second shaft 22 and the third shaft 23 through the mounting portion 44. That is, the mounting portion 44 is coupled to the belt driven by the head drive motors 28 and 25 in FIG. 4 and installed to run in the second shaft 22 and the third shaft 23. The heads 41 and 42 are moved by the driving motors 28 and 25.

The lifting drive motor mounting part 45 extends below the mounting part 44. The lift drive motor installation unit 45 is provided with a lift drive motor, which will be described later, and its rotation drive force drives the pulley 47 to rotate. The pulley 47 is installed at the end of the ball screw (not shown). The ball screw (not shown) is coupled to a nut (not shown) connected to the plate 46, so that the plate 46 can be elevated by the rotation of the ball screw. The lifting mechanism of the plate 46 will be described in more detail later.

First to fourth adsorption nozzles 54a, 54b, 54c, and 54d are provided on the front surface of the plate 46 so as to be movable in the horizontal direction. The suction nozzles are respectively mounted to the nozzle mounting portion 55, and each nozzle mounting portion 55 is guided in the horizontal direction along the horizontal moving guide rail 57 through the guide 58.

On the other hand, the front surface of the plate 46, the first belt 51 and the second belt 53 is installed to be divided up and down. The first belt 51 is rotatably installed through the pulleys 50a and 50b rotatably installed on the front surface of the plate 46, and the second belt 53 is also movable through the pulleys 52a and 52b. Is installed. The first belt 51 and the second belt 53 are driven by the driving force by the driving motor 48 provided on the rear surface of the plate 46. That is, the driving force of the drive motor 48 is transmitted by connecting the drive pulley (not shown) of the drive motor and the pulley 49 provided on the back of the plate 46 with a belt, and again coaxial with the pulley 49. The first belt 51 is transferred through the connected pulley 50a. Similarly, the driving force of the drive motor 48 can rotate the second belt 53 via the pulley 52a.

The nozzle mounting portion 55 is guided along the guide rail 57, while its upper portion is connected to the first belt 51 or the second belt 53, respectively. That is, as can be seen in the figure, the upper end of the mounting portion 55 of the first adsorption nozzle 54a is connected to the lower portion of the first belt 51 through the connecting portion 56. In addition, the second suction nozzle 54b is under the second belt 53, the third suction nozzle 54c is at the top of the first belt 51, and the fourth suction nozzle 54d is the second belt 53. Is connected to the top of the

Using the mechanism described with reference to FIG. 5, the distance between the first to fourth adsorption nozzles 54a, 54b, 54c, 54d can be adjusted by the rotation of the drive motor 48. For example, in FIG. 5, when the first belt 51 rotates counterclockwise, the first adsorption nozzle 54a will move to the right and the third adsorption nozzle 54c will move to the left. In addition, when the second belt 53 rotates in the counterclockwise direction, the second suction nozzle 54b will move to the right, and the fourth suction nozzle 54d will move to the left. Thus, the spacing between the suction nozzles will be narrowed overall. In this way, the gap can be adjusted such as to narrow or widen the gap between the suction nozzles.

6 shows a right side view of FIG. 5. 6 can understand the lifting structure of the suction nozzle.

Referring to the drawings, the lift drive motor 61 is installed in the mounting portion 45, the pulley 62 installed on the rotation shaft of the lift drive motor 61 is a pulley 47 provided at the end of the ball screw 64. And belt 63 are connected. The ball screw 64 is supported by a bearing 66 fixed to the front surface of the motor mounting portion 45 and coupled to a nut (not shown) installed on the plate 46. In addition, the plate 46 is subjected to the guide action by the lifting guide rail (65).

When the lift drive motor 61 is driven to rotate, the ball screw 64 is rotated through the pulley 62, the belt 63, and the other pulley 47. Rotation of the ball screw 64 causes a nut (not shown) fixed to the plate 46 to rise or fall in the longitudinal direction of the ball screw 64, so that the plate 46 can be raised and lowered. Therefore, the lifting of the first to fourth adsorption nozzles 54a, 54b, 54c, and 54d installed on the front surface of the plate 46 may be performed.

What is described with reference to FIGS. 2 to 6 relates to the main configuration of the first robot 11 of FIG. 1. In actual operation, the first head 41 of the first robot 11 picks up the semiconductor package in the supply station 12 and lowers it onto the heater block 13, thereby removing the first robot 11. The two heads 42 pick up the heated semiconductor package on the heater block 13 and place it on the loading portion 78 of the loading shuttle 14 which will be described later.

Shown in FIG. 7 is a schematic perspective view of the loading shuttle 14 described with reference to FIG. 1.

Referring to the figure, the loading shuttle 14 has a loading part 78 which reciprocates by the drive of the drive motor 71. The rotational driving force of the drive motor 71 is transmitted to the other belt 74 through the belt 72 and the pulley 73. One side of the other belt 74 is installed to be run by the pulley (75). The connecting frame 77 extending from the loading portion 78 is connected to the belt 74 through the belt connecting portion 76. The guide 79b is fixed to the lower portion of the connecting frame 77 and is installed to be guided along the guide rail 79a.

When the drive motor 71 rotates, the belt 72 and the other belt 74 run. Accordingly, the connecting frame 77 and the loading portion 78 connected to the other belt 74 through the belt connecting portion 76 may move along the guide rail 79a.

The storage portion 78 is a semiconductor package is mounted thereon. Reference numeral 80 denotes a position where the semiconductor package is seated. As described above, the adsorption nozzles provided in the second head 42 of the first robot 11 pick up the semiconductor package from the heater block 13, thereby placing it on the loading portion 78 of the loading shuttle 14. Will be put down. When the semiconductor package is placed on the storage unit 78, the storage unit 78 travels along the guide rail 79 to overcome the distance difference, and reaches the standby stage 15 illustrated in FIG. 1.

Shown in FIG. 8A is a schematic perspective view of a rotary suction nozzle device. The rotary suction nozzle device has a function of adsorbing the semiconductor package placed on the loading portion 78 of the loading shuttle 14 to move to the inspection stage 16 shown in FIG. In the inspection stage 16, inspection of the semiconductor package by the apparatus is performed.

Referring to the drawings, the rotary adsorption nozzle apparatus 81 includes a first adsorption nozzle group 92 and a second adsorption nozzle group 93, wherein the adsorption nozzle groups 92 and 93 each have four adsorption nozzles. Equipped. The first suction nozzle group 92 and the second suction nozzle group 93 can change mutual positions, and such position change is made by the rotational force provided from the rotation drive motor 89. In addition, each suction nozzle group 92 and 93 can be lifted up and down by the 1st and 2nd lifting motors 94 and 94 'provided in each.

The drive pulley 85 provided on the drive shaft of the rotation drive motor 89 provides a rotational drive force to another pulley (not shown) provided between the upper plate 82 and the lower plate 86 through the belt 87. The rotation axis of the pulley (not shown) provided between the upper and lower plates 82 and 86 extends through the bottom of the lower plate 86 as shown in FIG. 9, and has a first link installed at the bottom of the lower plate 86. It is connected to the center of 90. The second link 91 and the third link 98 (FIGS. 8B and 9) are rotatably connected to both ends of the first link 90.

The first to third links 90, 91 and 98 are shown in schematic plan view in FIG. 8B.

Referring to the drawings, the first link 90 is extended, and the second link 91 and the third link 98 are rotatably connected to both ends of the first link 90. A rotating shaft of a pulley (not shown) rotatably installed in the inner space defined by the upper and lower plates 82 and 86 is fixed to the rotating shaft fixing part 83 formed at the center of the first link 90. Accordingly, the rotational force of the rotation drive motor 89 rotates the first link 90 through the belt 87 and the pulley, whereby the second link 91 and the third link 98 also have a predetermined action. Will receive.

9 shows a front view of the rotary suction nozzle device shown in FIG. 8A.

Referring to the drawings, the motor mounting portion 96 is fixed to the lower portion of the second link 91 described with reference to FIGS. 8A and 8B, and the motor mounting portion 96 ′ is fixed to the lower portion of the third link 98. ) Is fixed. The second link 91 may reciprocate along the guide rail 97 fixed to the bottom of the plate 105. Similarly, the third link 98 can also reciprocate along the guide rail 97 'fixed to the lower portion of the plate 105'.

Meanwhile, each plate 105, 105 ′ is fixed to each block 95, 95 ′, and the blocks 95, 95 ′ are movable relative to the lower plate 86 through respective guide rails 89, 89 ′. Is installed. The extending direction of the guide rails 97 and 97 'mentioned previously and the guide rails 89 and 89' are perpendicular to each other.

By the above-described configuration, a mechanism in which the first suction nozzle group 92 and the second suction nozzle group 93 can be replaced with each other is achieved. That is, when the drive motor 89 rotates, such rotational force rotates the rotation shaft 88 of the pulley via the belt 87. Since the rotating shaft 88 is fixed to the first link 90 shown in FIG. 8B, the first link 90 rotates. The rotation of the first link 90 exerts a force on the second link 91 and the third link 98, respectively, such that the second link 91 in the first direction along the guide rail 97. At the same time, the mounting portion 105 of the guide rail 97 is moved along the other guide rails 89 in a second direction perpendicular to the first direction.

Similarly, the force applied to the third link 93 causes the third link 98 to move along the guide rail 97 'and at the same time the mounting portion 105' of the guide rail 97 'is different. It is made to move in the direction perpendicular to the guide rail 89 '. The first adsorption nozzle group 92 and the second adsorption nozzle group 93 are replaced with each other by the movement along the guide rails 97, 89; 97 ', 89' extending at right angles as described above. .

Meanwhile, the first adsorption nozzle group 92 and the second adsorption nozzle group 93 may be elevated respectively. This elevating action is provided from the first elevating motor 94 and the second elevating motor 94 'installed in the elevating motor mounting unit 96 at the lower portion of the second link 91 and the third link 98. By power.

The installed belt 106 of the driving pulley 107 coupled to the rotation shaft of the first lifting motor 94 is connected to the pulley 99 installed at the upper end of the ball screw 100. The ball screw 100 is coupled to a nut 101 fixed to the nozzle mounting portion 102. The nozzles 103 are installed under the nozzle mounting unit 102 to form the first suction nozzle group 92.

When the first lift motor 94 'is rotated, such rotational force rotates the ball screw 100 through the belt 107. Accordingly, the nut 101 coupled to the ball screw 100 may be elevated, and the nozzle mount 102 connected to the nut 101 and the nozzles 103 installed thereon may be elevated together. In the same manner, the second lift motor 94 'can lift the second suction nozzle group 93.

The bottom view of FIG. 9 is shown in FIG. 10, and from FIG. 10, the direction in which the first link 90 is extended and the extension direction of the guide rails 89 and 89 ′ can be seen.

Shown in FIG. 11 is a schematic perspective view of the unloading shuttle 17 of FIG. 1. The unloading shuttle 17 receives the semiconductor package after the predetermined inspection at the inspection stage 16 is transferred to the rotary adsorption nozzle apparatus and moves to a range in which the adsorption nozzle head of the second robot 18 can operate. Device.

Referring to the drawings, the unloading shuttle 17 includes a driving motor 111 and a storage unit 118 reciprocated by the driving force of the driving motor 111. The driving force of the driving motor 111 rotates the pulley 113 through the belt 112, and also drives the other belt 114 installed in the pulley 113. The other belt 114 is held to be runable by the pulley 117. The belt 114 is connected to the connecting frame 115 through the connecting portion 115a. Therefore, the driving of the belt 114 may reciprocate the connecting frame 115 and the placing portion 118 fixed to one side of the connecting frame 115 together. The reciprocating motion of the loading part 118 is guided by the guide rail 116.

Shown in FIG. 12 is a schematic perspective view of the second robot 18 of FIG. 1. The second robot 18 picks up the semiconductor package placed in the loading portion 118 of the unloading shuttle 17 described with reference to FIG. 11 to the adsorption nozzle head, so that the first to fourth sorting stations 1, 2, 3, 4) or classify the first to the fourth loading racks (6, 7, 8, 9).

Referring to the drawings, the basic configuration of the second robot 18 is similar to that of the first robot 11 described with reference to FIGS. 2 to 4. That is, the first shaft 121, the second shaft 122 is installed so as to extend at a right angle with respect to the first shaft 121 and can be reciprocated along the longitudinal direction of the first shaft 121, and It has a third axis 123. The second axis 122 and the third axis 123 extend parallel to each other and are driven independently. In FIG. 12, the second shaft drive motor 124, the pulley 128, and a belt (not shown) enable movement of the second shaft 122 in the direction of the first shaft 121. Similarly, the third shaft drive motor 125, a pulley (not shown), and a belt allow movement of the third shaft 123 in the direction of the first shaft 121.

On the other hand, the first suction nozzle head 131 is installed in the lower portion of the second shaft 122 to be movable along the longitudinal direction of the second shaft 122. The first suction nozzle head 131 may be reciprocated by the head driving motor 126 and the pulley 127 installed on the second shaft 122 and a belt (not shown). Similarly, a second suction nozzle head (not shown) is shown below the third shaft 123, which includes a head drive motor 129, a pulley 130, and a belt (not shown) installed on the upper portion of the third shaft 123. Can be moved by).

The first adsorption nozzle head 131 and the second adsorption nozzle head (not shown) may be elevated, and the structure enabling such a lifting movement is the same as the mechanism described with reference to FIG. 5. On the other hand, the first adsorption nozzle head 131 and the second adsorption nozzle head (not shown) provided in the second robot 18 are provided with two adsorption nozzles, respectively, which are fixed to each other, the distance between which can not be adjusted It is preferable that it is a structure. That is, the gap adjusting mechanism between the suction nozzles described with reference to FIG. 5 is lacking.

FIG. 13 illustrates the bottom of the second robot 18 illustrated in FIG. 12, in which the first adsorption nozzle head 131 is positioned below the second shaft 122, and the third shaft 123 is disposed on the bottom surface of the third shaft 123. It can be seen that the second adsorption nozzle head 132 is installed at the lower portion.

Shown in FIG. 14 are the first to fourth sorting stations 1, 2, 3, 4 of FIG. 1, the supply station 12, the buffering station 19, and the first to fourth loading racks 6. , 7, 8 and 9 are perspective views.

Referring to the drawings, the stations 1-4, 12, and 19 are installed corresponding to the through portions formed in the upper layer frame 141. Also, the loading racks 6-9 are formed at predetermined positions of the upper layer frame 141. Each station has a two-layer structure formed of an upper layer frame 141 and a lower layer frame 142. In practice, all the devices shown in FIGS. 2 to 13 are preferably formed based on the upper layer frame 141. The reason why the entire system is formed in a two-layer structure is to use the space intensively and to facilitate the operation of supplying and discharging the tray on which the semiconductor package is mounted.

Each station is provided with an elevator (not shown) to overcome the height difference between the upper floor frame 141 and the lower floor frame 142. The elevator serves to assist the operation of other devices on the semiconductor package by raising or lowering the tray with the tray on it. In addition, the lower layer frame 142 is provided with a rodless cylinder 143 for each station, and serves to discharge or supply the stacked trays to the outside.

15 is a schematic configuration diagram of the elevator structure described with reference to FIG. 14.

Referring to the drawings, the elevators installed corresponding to the stations 1, 2, 3, 4, 12, and 19 are provided with a stacking unit 149 capable of stacking trays thereon, and elevating the stacking unit 149. A motor 144 and a ball screw-nut mechanism 146 are provided for driving. The rotational driving force of the motor 144 rotates the ball screw through the belt 150, and since the nut fixed to the lamination part 149 is coupled to the ball screw, the rotation of the ball screw may raise and lower the lamination part 149. Can be.

On the other hand, the rodless cylinder 143 moves the laminated plate 148 in the horizontal direction. The laminate 148 and the laminate 149 are formed so as not to interfere with each other when viewed in a plan view. For example, the laminate 148 and the laminate 149 may have the shape of rakes that are alternately disposed when viewed in a plan view. Thus, if the top surface of the stack 149 is lowered below the height of the stack 148, the trays stacked on the stack 149 may be completely transferred onto the stack 148. The tray transferred to the upper portion of the laminate 148 may be discharged to the outside from the bottom of each station by a rodless cylinder 143 which horizontally moves the laminate 148 in a state of being loaded on the laminate 148. This action can take place in the first to fourth sorting stations 1, 2, 3, 4, for example, initially the stack 149 is only one tray on it in the raised state. Next, when the tray is filled with the parts after the inspection is finished, the stacking portion 149 is slightly lowered, and the empty tray is again moved and stacked from the buffering station 19 by the tray carrier 161 (FIG. 16). . As the trays continue to accumulate in this manner, the stack 149 gradually descends and finally descends below the stack 148. Therefore, the stacked trays are transferred to the laminate 148 and discharged to the outside by the action of the rodless cylinder 143.

On the other hand, the opposite effect also holds. For example, the feed station 12 is provided with trays filled with parts, which must be loaded on the stack 149 as the parts run out. When feeding the stacked trays at first, the lamination part 149 descends below the lamination board 148. The trays mounted on the laminate 148 then move to the top of the laminate 149 under the action of the rodless cylinder 143. The next time the stack 149 is raised, the trays can be completely transferred from the stack 148 to the stack 149.

Referring back to FIG. 14, the tray carrier installation part 145 is formed in the upper layer frame 141. The tray carrier installation unit 145 is a groove formed over each of the stations, and the tray carrier protruding through the groove moves the trays in each station to another station. For example, a tray equipped with a semiconductor package for which inspection has not been completed can be moved by the first robot 11 to the heater block 13 by rising in the elevator at the supply station 12. Next, the trays in which the semiconductor package is exhausted are moved to the buffering station 19 by the tray carrier, which will be described later, and stacked on the stack 149 there. When the inspection-completed semiconductor package is loaded in the trays of the first to fourth sorting stations 1-4, the empty trays in the buffering station 19 are again returned by the tray conveyers to each sorting station 1,4. Will be moved to.

Shown in FIG. 16 is a schematic perspective view of a tray conveyer.

Referring to the drawings, the tray carrier has four adsorption nozzles 174 installed on the elevating plate 173. The elevating plate 173 is installed to be liftable with respect to the connection frame 170 and may be driven up and down by the elevating slender 172. The connection frame 170 may reciprocate in a linear direction by the drive motor 162. The pulley 163 and the other pulley 165 provided on the rotation shaft of the drive motor 163 are connected by a belt 164, and the belt 167 is installed on the pulley 164 coaxially with the pulley 164. Belt 167 is also supported by pulley 168. The belt connection part 169 extending from the connection frame 170 is fixed to the belt 167, and thus may be moved in the longitudinal direction as the belt 167 travels.

The lower end of the suction nozzle 174 extends through the lifting plate 173. Therefore, the tray placed under the lifting plate 173 can be sucked by the force of vacuum. The elevating plate 173 can be moved over the trays placed in the stations 1-4, 12, 19 by the drive motor 162. It is also possible to access the tray underlying by being lifted by the operation of the lifting cylinder 172, and the suction nozzles 174 can move the tray to another station by adsorbing the surface of the tray.

The semiconductor package inspection apparatus according to the present invention has an advantage in that the semiconductor package can be quickly moved in each step in performing the inspection. In addition, since the utilization of the space is made intensive, there is an advantage that the productivity can be improved.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is only illustrative, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims (7)

A supply station provided with a tray on which a semiconductor package requiring inspection is provided; A buffering station in which an empty tray is provided in a standby state after the semiconductor package is exhausted in the supply station; A plurality of sorting stations, wherein a tray from the buffering station is provided for sorting the inspected semiconductor package; And, And classifying the semiconductor package in the sorting station, the second axis being movable in the longitudinal direction of the first axis, the second axis being installed at right angles to the first axis, and movable in the longitudinal direction of the first axis. A third axis installed at right angles to the first axis and parallel to the second axis, a first adsorption nozzle head provided at the second axis and the third axis, the first adsorption nozzle being movable and liftable in the longitudinal direction; And a second robot having a second suction nozzle head. The method of claim 1, By absorbing and supplying the semiconductor package of the supply station, it is movable in the longitudinal direction of the first axis and the first axis, and is movable in the longitudinal direction of the first axis and the second axis installed at right angles to the first axis. And first adsorbing nozzle heads each of which is movable in a longitudinal direction relative to the third axis, the second axis, and the third axis, the third axis being installed at right angles to the first axis and parallel to the second axis. And a first robot having a second adsorption nozzle head; A heater block in which the first adsorption nozzle head or the second adsorption nozzle head of the first robot lowers or picks up the semiconductor package thereon; A loading shuttle for moving the semiconductor package picked up from the heater block to a standby stage in a state where it is placed on a loading stand; And a first adsorption nozzle group and a second adsorption nozzle group having a plurality of adsorption nozzles so as to adsorb and transfer the semiconductor package from the loading shuttle to the inspection stage, wherein the first adsorption nozzle group and the second adsorption nozzle group are provided. A rotary adsorption nozzle device in which the group can be interchanged; An inspection apparatus provided to perform an inspection at the inspection stage; An unloading shuttle for moving the semiconductor package picked up by the rotary adsorption nozzle device to a loading stand after the inspection is finished; And a tray conveyer having a suction nozzle capable of adsorbing the tray and moving up and down to move the tray between the supply station, the sorting station, and the sorting station. Device. The method of claim 2, The first adsorption nozzle head and the second adsorption nozzle head are provided with a pair of belts arranged up and down so as to be movable by a pulley so as to adjust the distance between each adsorption nozzle provided therewith, And a nozzle mounting portion provided with the suction nozzle and a drive motor for driving the belt with one side connected thereto. The method of claim 2, The loading device and the unloading device may include a belt having one side fixed to the loading stand, pulleys for keeping the belt running, and the pulley to reciprocally move the loading stand provided in each of the loading device and the unloading device. A handler device for inspecting a semiconductor package, comprising: a drive motor for rotationally driving; The method of claim 2, The rotary suction nozzle device includes a rotation drive motor; A pulley rotationally driven by the rotation drive motor; A first link centered on an axis of the pulley; A second link and a third link rotatably connected to both ends of the first link; A pair of guide rails provided at each of the second link and the third link to guide linear movement in the longitudinal direction of the second link and the third link; A pair of guide rails each provided with said pair of guide rails for guiding a forward motion in each direction perpendicular to a longitudinal direction of said second link and third links; A lift drive motor fixed to the lower portion of the second link and the third link; A ball screw that is rotated by receiving power of the lift drive motor from a pulley and a belt; And a nut coupled to the ball screw and connected to the first suction nozzle group and the second suction nozzle group, respectively. The method of claim 2, The supply station, the buffering station, and the first to fourth sorting stations may include: a stack on which the tray is placed; A nut connected to the stack; A ball screw coupled with the nut; A drive motor for rotating the ball screw; A laminate plate capable of receiving trays stacked on the laminate; And a rodless cylinder configured to horizontally move the laminate. The method of claim 2, The laminate and the laminate have a shape that does not interfere with each other when viewed in a plan, so that when the laminate is lowered to a lower height than the laminate, the tray stacked on the laminate may be transferred to the laminate, and the laminate may be And a tray stacked on the laminate can be transferred to the laminate when the plate is lowered to a lower height than the laminate and then raised again.