KR20200025609A - Adsorption table - Google Patents

Abstract

The present invention relates to an adsorption table which comprises: a universal base in which a pneumatic line is formed on a lower surface to receive pneumatic pressure, and a first vacuum chamber is provided therein to accommodate the pneumatic pressure received by means of the pneumatic line; and a body which has a plurality of adsorption lines mounted on an upper portion of the universal base and communicating with the first vacuum chamber, and an adsorption hole corresponding to the adsorption lines. Moreover, one body selected among the plurality of bodies is detachably coupled to the universal base. In addition, when the size of an adsorption unit provided at the body is bigger than the size of the first vacuum chamber, a second vacuum chamber, communicating with the first vacuum chamber, is provided on the lower surface of the body such that pneumatic pressure can be applied to the entire area of the adsorption lines. Therefore, a base is integrated with the universal base, and only the body can be replaced corresponding to the size of a material to be fastened to the universal base for use. Consequently, inconvenience in replacement can be reduced, and replacement time can be shortened.

Description

Adsorption Table {ADSORPTION TABLE}

The present invention relates to an adsorption table, and more particularly, to an adsorption table in which one universal base is compatible with bodies of various sizes.

In general, a semiconductor package is subjected to a process of molding a resin on a top surface of a semiconductor substrate after attaching a semiconductor chip having a high integrated circuit such as a transistor and a capacitor formed on the semiconductor substrate. After the molding process, the lower surface of the semiconductor substrate is bonded to the solder ball, which acts as a lead frame, so as to conduct electricity with the chip. Since it is usually formed in a matrix form of a rectangular shape, this is called a semiconductor strip.

Since a plurality of semiconductor packages are connected to each other, the semiconductor strip is subjected to a singulation process of cutting into individual semiconductor package units using a cutting device. In addition, after the singulation process, cleaning and drying are performed to remove foreign substances on the surface of the semiconductor package. The semiconductor package that has undergone the drying process is transferred to the package transfer device, and the semiconductor package is inspected for defects by the vision inspection device, and then sorted and loaded into a tray.

Meanwhile, a semiconductor manufacturing apparatus that performs a series of operations of cutting a semiconductor package by individual package units on a semiconductor strip and storing the same in a tray needs to be provided to cut various types of semiconductor strips having various sizes and various arrangements. . Specifically, a cutting table for cutting semiconductor strips into semiconductor package units of a semiconductor manufacturing apparatus, a drying table for washing the cut semiconductor package, drying the cleaned semiconductor package, and loading for sorting and loading the dried semiconductor material. Tables, etc., should be replaced with adsorption tables corresponding to the size of the material so that the semiconductor strip can be handled if the size or type of semiconductor strip changes. Adsorption tables usually consist of a body and a base, where the body must be replaced to match the size of the material and the base must be replaced according to the size of the body. At this time, the body is formed with an adsorption portion for adsorbing and fixing each semiconductor strip or semiconductor package, and is called a conversion kit because it is replaceable according to the size of the semiconductor strip.

However, the conversion kit of the conventional semiconductor manufacturing apparatus has a limitation in that it must be replaced with a base having a vacuum chamber suitable for the size of the adsorption unit in order to support the kit and apply air pressure to the entire area of the adsorption unit provided in the kit. have. Accordingly, when the type or size of the semiconductor material is changed, the body and the base of each table must be separated from the semiconductor manufacturing apparatus, and then replaced with a new body and the table. Therefore, the separation and replacement work takes a long time. .

In addition, among the conversion kits, in the case of the drying table, the heating member is mounted on the lower surface of the base, and the body and the base are heated together at a high temperature. In order to cool the heated table completely, it is necessary to wait a long time, and even after the replacement, it takes a considerable time to heat the replaced base and the body for heating again, which causes an overall delay.

Patent Registration No. 10-0574584 Patent Registration No. 10-0814448

Accordingly, the present invention has been proposed to solve the problems of the prior art, and an object of the present invention is to provide an adsorption table in which one universal base is compatible with bodies of various sizes.

In addition, it is possible to reduce the hassle of replacing the suction table, and to shorten the replacement time.

An object of the present invention as described above is an adsorption table for adsorbing semiconductor material from the upper surface, a pneumatic line to which the pneumatic pressure is applied is formed on the bottom surface, and has a first vacuum chamber for accommodating the pneumatic pressure applied through the pneumatic line. Universal base to be; And a body mounted on an upper portion of the universal base, the body including a plurality of adsorption lines communicating with the first vacuum chamber and an adsorption part having adsorption holes corresponding to the adsorption lines, wherein the bodies are provided in plural numbers. Any one body selected from among the plurality of bodies is detachably coupled to the universal base according to the size of the material, and the first vacuum chamber of the universal base is formed smaller than the body having the smallest size among the bodies. It is provided to be covered by a body, the universal base is achieved by a suction table, characterized in that having a size corresponding to the body of the largest size among the body

In addition, the present invention, if the size of the adsorption portion provided in the body is larger than the size of the first vacuum chamber, the first vacuum chamber on the bottom of the body so that air pressure can be applied over the entire area of the adsorption line It is possible to provide an adsorption table having a second vacuum chamber to communicate with.

Also, in the present invention, when the size of the adsorption part provided in the body is larger than the size of the first vacuum chamber, the outer adsorption line which is not in communication with the first vacuum chamber among the adsorption lines formed in the adsorption part is the first A second vacuum chamber is provided to be in communication with the vacuum chamber, and an upper portion of the second vacuum chamber includes a communication hole communicating with a portion of the suction line and an outer suction line, and a lower portion of the second vacuum chamber. Some areas may provide an adsorption table in communication with the first vacuum chamber.

In addition, the adsorption unit may provide an adsorption table further including a thickness reinforcing part in which a partial region protrudes from the bottom surface.

In addition, the body is fastened to the universal base by a coupling member on the upper surface of the universal base, the coupling member is characterized in that the bolt or cicada ring, the coupling in the position corresponding to the body and the universal base Coupling means for fastening the member and the coupling member may be formed.

In addition, when the coupling member is a cicada ring, the universal base has recesses on both sides of the universal base to correspond to the width of the body to be fastened, the cicada ring is mounted to the recess of the universal base, Coupling means for fastening the cicada ring may be formed on both sides of the body.

In addition, the suction table is a cutting table for cutting the semiconductor material, the adsorption portion of the adsorption table is formed of rubber, the upper surface of the adsorption portion is the blade escape groove through which the blade for cutting the semiconductor material and the before and after cutting A plurality of adsorption grooves for adsorbing semiconductor materials are formed, respectively, and an adsorption hole for adsorbing the semiconductor material through the adsorption line may be formed in the adsorption groove.

In addition, the adsorption table is a drying table for washing the cut semiconductor material and drying the semiconductor material after the cleaning is completed, a plurality of adsorption holes for adsorbing each of the semiconductor material through the adsorption line on the upper surface of the adsorption table Is formed, the lower portion of the base may be further provided with a heating member for applying heat to the suction table.

In addition, the adsorption table is an alignment table for aligning and stacking the dried semiconductor material, the upper surface of the adsorption table has a non-loading groove and a loading groove having a guide portion for the semiconductor material is aligned and loaded The loading area includes a first alignment part and a second alignment part which are alternately formed along the X-axis and Y-axis directions, and an adsorption hole for adsorbing the semiconductor material through the adsorption line may be formed in the loading groove. Can be.

As described above, in the adsorption table according to the present invention, one universal base may be compatible with bodies of various sizes.

Therefore, even if the size of the material is different, there is no need to replace the body of the adsorption table corresponding to each material and the corresponding base, and the base is used in common but only the corresponding body is replaced according to the size of the material. By tightening, it is effective to reduce the trouble of replacement and shorten the replacement time.

In addition, the adsorption table according to the present invention is applied to a cutting table for cutting semiconductor materials in a semiconductor manufacturing apparatus, a drying table for washing and drying the cut semiconductor material, and an alignment table for aligning dried semiconductor materials. It can be used in various adsorption tables that can adsorb semiconductor materials.

In addition, when applying the adsorption table according to the present invention to the drying table, it is not necessary to cool the heat applied by the heating member formed on the lower portion of the universal base because it is not necessary to replace the base of the semiconductor material. In other words, although the body and the base could be replaced after cooling the drying table completely, the body does not need to wait for the base to cool down because only the body needs to be removed from the universal base without contacting the base. In addition, after removing the body from the universal base, even if the body corresponding to the size of the semiconductor material to be replaced, heat can be conducted from the heated base to the body, so that the base does not need to be preheated from the beginning, and the heating time is shortened. You can do it.

In addition, according to the present invention, integrating the base into the universal base, and the body can be used by mounting the pre-installed body to the body corresponding to each material size according to the size of the material, the existing bodies easily It can be used with and compatible with the pre-loaded body, there is an advantage that can minimize the labor and waste.

1 is a schematic view of a semiconductor manufacturing apparatus according to a preferred embodiment of the present invention.
FIG. 2 is an exploded perspective view of the suction table of FIG. 1. FIG.
3A and 3B are plan views showing a state of a combined first suction table of the first body and the universal base;
4A and 4B are cross-sectional views taken along line AA ′ of FIGS. 3A and 3B, respectively.
5A and 5B are plan views illustrating a state of a combined second suction table of the second body and the universal base;
6A and 6B are cross-sectional views taken along line BB ′ in FIGS. 5A and 5B, respectively.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art, although not explicitly described or illustrated herein, can embody the principles of the invention and invent various devices included in the concept and scope of the invention. In addition, all conditional terms and embodiments listed herein are in principle clearly intended to be understood only for the purpose of understanding the concept of the invention and are not to be limited to the embodiments and states specifically listed. .

The above objects, features, and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, whereby the technical spirit of the invention may be easily implemented by those skilled in the art. .

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view briefly illustrating a semiconductor manufacturing apparatus according to a preferred embodiment of the present invention.

Referring to FIG. 1, a semiconductor manufacturing apparatus 1 according to an exemplary embodiment of the present invention refers to a system for cutting a semiconductor strip into respective semiconductor packages and performing cleaning, drying, inspection, and loading processes of the semiconductor packages. do. The semiconductor manufacturing apparatus 1 includes an on-loader unit (not shown) provided with a plurality of semiconductor strips S stacked in a magazine (not shown), respectively, and a semiconductor strip S drawn from the magazine. An inlet rail (not shown), a cutting table 30 to which the semiconductor strip S is transmitted and rotatably provided, a cutting portion 310 for cutting the semiconductor strip S into individual semiconductor packages, and a cutting A cleaning unit 40 for cleaning the semiconductor package, a drying table 50 for drying the cleaned semiconductor package, an alignment table 60 for arranging the dried semiconductor package at a predetermined position, and a semiconductor package It includes a sorting device 70. In this case, the cutting table 30, the drying table 50, and the alignment table 60 may include a replaceable body 80 (see FIG. 2) and a universal base 90 (see FIG. 2) according to the size of the semiconductor strip S. to provide.

Specifically, the semiconductor manufacturing apparatus 1 is provided with the semiconductor strip S inserted in a magazine. The semiconductor strip S in the magazine may be drawn out through a pusher (not shown) or the like and then mounted on the inlet rail.

The semiconductor strip S seated on the inlet rail is transferred to the cutting table 30 through the strip picker 210 and cut into individual semiconductor packages at the cutting portion 310. At this time, the cutting table 30 is provided with a body 80 having an adsorption unit for adsorbing individual semiconductor packages.

The suction part adsorbing the semiconductor strip and the cut semiconductor package before cutting in the cutting table is formed of rubber, and the upper surface of the suction part includes a blade escape groove through which a blade for cutting the semiconductor strip passes, the semiconductor strip before cutting and the cut semiconductor package, respectively. A plurality of adsorption grooves for adsorption are formed. An adsorption hole may be formed inside the adsorption groove to adsorb the semiconductor strip or the semiconductor package through the adsorption line.

Meanwhile, the strip picker 210 may be provided to be movable along the guide rail 220, and the unit picker 230 to be described below may also be provided to be movable along the guide rail 220.

The semiconductor package cut by the cutting unit 310 is transferred to the drying table 50 through the cleaning unit 40 through the unit picker 230. In this case, since the upper surface of the semiconductor package is provided by being washed with the washing water in the cutting unit 310, the lower surface of the semiconductor package is cleaned in the washing unit 40 while being adsorbed by the unit picker 230.

The cleaned semiconductor package is delivered to the drying table 50 by the unit picker 230. The drying table 50 is to dry the washed semiconductor package, and may be rotatably provided. The drying table is provided with a heating member to accelerate the drying of the semiconductor package by applying heat to the table. At this time, the heating member is mounted to the lower portion of the base. In addition, the drying table 50 is provided with a body 80 in which an adsorption hole for adsorbing individual semiconductor packages through an adsorption line is formed thereon.

The dried semiconductor package is picked up by the turntable picker, loaded on the alignment table 60, and inspected through the vision unit 610. In addition, according to the inspection result of the vision unit 610, the semiconductor package is classified as good or defective in the classification device 70. At this time, in the upper portion of the body of the alignment table 60, a loading groove having a guide portion for arranging the stacked semiconductor packages to be stacked and a non-loading region in which semiconductor materials are not loaded are alternately formed along the X and Y axis directions. And a first alignment portion and a second alignment portion. In this case, the first alignment unit and the second alignment unit may be provided as respective tables to be movable independently of each other in the X-axis direction, or the first alignment unit and the second alignment unit may be provided together on one table. . An adsorption hole is formed in the loading groove of the alignment table to adsorb the semiconductor package through the adsorption line.

FIG. 2 is an exploded perspective view of the body and the universal base as the suction table of FIG. 1. FIG. The adsorption table of the present invention may be a cutting table, a drying table, an alignment table, or the like.

Referring to FIG. 2, in the present invention, the adsorption table 100 for adsorbing the semiconductor package may be interchangeably provided according to the size of the semiconductor strip. In the present invention, although the semiconductor strip is representatively classified into a first body 810 having a relatively small size and a second body 820 having a relatively large size of the semiconductor strip according to the size of the semiconductor strip, various sizes of bodies are described. Can handle

Meanwhile, the suction table 100 of the present invention may be applied to all kinds of tables such as the cutting table 30, the drying table 50, and the alignment table 60. However, in the present embodiment, the suction table 100 may be a cutting table. (30) is shown as an example.

Adsorption table 100 of the present invention is a table for adsorbing the semiconductor material from the upper surface, the semiconductor material may mean both the semiconductor strip before cutting, the semiconductor package is completed cutting. That is, the cutting table 30 adsorbs the semiconductor strip and the cut semiconductor package before cutting, and the drying table 50 and the loading table 60 adsorb the semiconductor package after the cutting is completed.

The adsorption table 100 includes a universal base 90 and a body 80. The universal base 90 has a pneumatic line 930 to which pneumatic pressure is applied to a bottom thereof, and a pneumatic line 930 therein. It is provided with a first vacuum chamber 920 for receiving the pneumatic pressure applied through. In addition, the body 80 has a plurality of adsorption lines 813 mounted on the universal base 90 and in communication with the first vacuum chamber 920 and adsorption holes 813a corresponding to the adsorption lines 813. Adsorption part 812 is provided.

The adsorption table 100 has a configuration in which the body 80 and the universal base 90 are coupled, but in the present invention, a plurality of bodies 80 are provided, and any one selected from the plurality of bodies 80 according to the size of the semiconductor material is provided. The body 80 is detachably coupled to the universal base 90.

In the present invention, the body 80 may be configured in various sizes according to the size of the semiconductor material, wherein the body 80 of the smallest size of the body 80 is the first vacuum chamber 920 of the universal base 90 It is formed larger so that it can be covered by the body (80). In addition, the first vacuum chamber 920 of the universal base 90 may be provided similar to the size of the suction part 812 of the body 80 having the smallest size. Of course, in this case, when the size of the first vacuum chamber 920 is smaller than the body 80 having the smallest size, efficiency in providing pneumatic pressure is reduced. In addition, when the size of the first vacuum chamber 920 is greater than or equal to the body 80 having the smallest size, the universal base 90 and the body 80 may not be fastened, as well as the universal base 90. Pneumatic leakage is caused by the clearance of the body 80.

Therefore, the size of the first vacuum chamber 920 of the universal base 90 is preferably smaller than the body 80 of the smallest size among the body 80 to be mounted. In addition, since the universal base 90 of the present invention is formed to correspond to the body 80 having the largest size among the bodies 80 to be joined, the universal base 90 is likewise required to handle a semiconductor strip of a larger size later. ) And the body 80 of the largest size can be manufactured and used largely in accordance with the size of the semiconductor material, which can be appropriately changed according to the size of the operator and the semiconductor strip to be handled.

In the present invention, the suction table 100 includes a universal base 90 and a first body 810 or a second body 820 mounted on an upper portion of the universal base 90. In the exemplary embodiment, the use of two bodies 80 is taken as an example, but in practice, various types and sizes of the bodies 80 may be used depending on the size of the material.

A pneumatic line 930 to which pneumatic pressure is applied is formed on a bottom of the universal base 90, and a first vacuum chamber 920 is provided therein to receive pneumatic pressure applied through the pneumatic line 930.

The body 80 may be provided in two or more kinds according to the size of the semiconductor material, and any one of the bodies 80 may be detachably attached to the universal base 90. The body 80 forms adsorption parts 812 and 822 on the upper surface to adsorb the semiconductor material from the upper surface, and the adsorption parts 812 and 822 communicate with the first vacuum chamber 920 of the universal base 90. It is mounted on top of the universal base 90. In addition, a plurality of adsorption lines 813 and 823 communicating with the first vacuum chamber 920 and adsorption holes 813a and 823a corresponding to the adsorption lines 813 and 823 are formed in the adsorption parts 812 and 822. .

The adsorption parts 812 and 822 are areas on which the semiconductor material such as the semiconductor strip S or the semiconductor package is adsorbed, and are provided on the upper surface of the body 80. In addition, the adsorption parts 812 and 822 communicate with the adsorption holes 813a and 823a through respective adsorption lines 813 and 823, and a plurality of adsorption parts 812 and 822 may adsorb the semiconductor strips S and individual semiconductor packages. Is provided. In this case, regions of the adsorption parts 812 and 822 may be formed to correspond to the size of the semiconductor material to be adsorbed.

Adsorption lines 813 and 823 may be provided in the form of penetrating the body in the vertical direction so as to communicate with the first vacuum chamber 920 of the universal base 90 in the suction unit (812, 822), each of the individualized A plurality of semiconductor materials may be provided along predetermined intervals so that the adsorption holes 813a and 823a may respectively adsorb the semiconductor material. At this time, the adsorption holes 813a and 823a are individualized into respective semiconductor package units in the state in which the semiconductor strips are adsorbed before cutting, and consequently, the respective semiconductor package units are absorbed.

The body 80 is provided with one or more coupling members 814, 824 or coupling means to be fastened to the universal base 90 at the top surface of the universal base 90. One of the body 80 and the universal base 90 is provided with coupling members 814 and 824, and the other is provided with coupling means 940 for coupling the coupling members 814 and 824. In this case, the coupling members 814 and 824 may be fastened to the body 80 or fastened to the universal base 90, and the corresponding coupling means 940 is fastened to the universal base 90 or the body 80. May be The coupling members 814 and 824 and the coupling means 940 defined in the present invention mean only the fastening and coupling between the body 80 and the universal base 90, but are not limited to the terms referring to the coupling members 814 and 824. In the present invention, a bolt or a cicada ring may be used as the coupling members 814 and 824 or the coupling means 940, which will be described later.

In the present invention, the body 80 is coupled so that any one body 80 selected from among the plurality of bodies 80 according to the size of the semiconductor material is detachable to the universal base 90.

At this time, the first vacuum chamber 920 of the universal base 90 is formed to be smaller than the body 80 of the smallest size among the plurality of bodies 80 to be covered by the body 80, the universal base The 90 may have a size corresponding to the body 80 having the largest size among the plurality of bodies 80.

 The universal base 90 is coupled to be compatible with the first body 810 and the second body 820 of different sizes, the base 910 is formed with a pneumatic line 930 is applied to the bottom surface, The base 910 includes a first vacuum chamber 920 for accommodating the pneumatic pressure applied through the pneumatic line 930 and a coupling means 940 coupled to the body 80.

The base 910 is provided to have a predetermined thickness and may further include one or more recesses 911 on one side.

When the cicada rings are used as the coupling members 814 and 824 between the body 80 and the universal base 90, the recess 911 is formed at an inner side by a predetermined distance from the outermost side of the base 910. It is formed to correspond to the number of the first coupling member 814 of the first body 810. Specifically, the base 910 may be formed to have a rectangular cross section, and two recesses 911 may be formed at predetermined distances on each of the long sides of the base 910. In particular, the recess 911 of the universal base 90 may be provided on both sides of the universal base 90 so as to correspond to the width of the body 80 to be fastened. Coupling members 814 and 824 for fastening the cicada ring may be formed at both sides of the 80.

The first vacuum chamber 920 is formed on the upper surface of the base 910. The first vacuum chamber 920 may be applied with pneumatic pressure through an external source to maintain and form a vacuum, and may be provided to communicate with the adsorption portions 812 and 822 of the body 80.

Pneumatic pressure from an external source is applied to the first vacuum chamber 920 through the pneumatic line 930. In detail, the pneumatic line 930 may be formed at the center of the lower surface of the base 910 and may be in communication with the first vacuum chamber 920. Accordingly, pneumatic pressure applied through an external source may be transmitted to the first vacuum chamber 920 through the pneumatic line 930.

The universal base 90 is coupled to each body 80 through the coupling means 940 is compatible. The coupling means 940 is provided as a first coupling means 941 coupled with the first body 810 and a second coupling means 942 coupled with the second bodies 820 and 820. Specifically, the first coupling means 941 is provided in the recess 911 of the base 910, the second coupling means 942 may be provided in the outermost of the base 910, but the size of the semiconductor material The position of the recess and the position of the coupling means may vary.

Coupling means 940 may be provided in a variety of materials. For example, the coupling means 940 may be provided as a hook clamp (see FIGS. 3 (a), 4 (a), 5 (a) and 6 (a)). The first coupling means 941 provided as a cicada ring may be combined with the first coupling member 814 of the first body 810, and the second coupling means provided on the outer side of the first coupling means 941 ( 942 may be coupled to the second coupling member 824 of the second body 820.

However, the material of the coupling means 940 is not limited thereto. For example, the coupling means 930 may be provided as a bolt or the like (FIGS. 3 (b), 4 (b), 5 (b), See FIG. 6 (b)). Specifically, the first body 910 may be coupled to the universal base 90 by a first bolt on one side of the base, and the second body 920 may be coupled to the universal base 90 by a second bolt. Can be. At this time, the second body 920 having a larger size than the first body 910 is fastened at more positions than the fastening positions of the first bolts, and the fastening positions and fastening numbers of the bolts may vary according to the type of the body. have.

Meanwhile, in the present invention, in order for the various bodies 80 to be mounted on the common universal base 90 according to the size of the semiconductor material, the sizes of the adsorption parts 812 and 822 provided in the body 80 may be set to the universal base 90. When larger than the size of the first vacuum chamber 920 formed in the 90, so that the pneumatic pressure can be applied over the entire area of the adsorption lines 813, 823 of the adsorption parts 812, 822 provided in the body 80 The bottom surface of the body 80 is further provided with a second vacuum chamber 826 for communicating with the first vacuum chamber 920.

That is, the second vacuum chamber 826 is the suction formed in the suction unit 812, 822 when the size of the suction unit 812, 822 provided in the body 80 is larger than the size of the first vacuum chamber 920. An outer suction line (that absorbs the outer region of the semiconductor strip) that is not in communication with the first vacuum chamber 920 is provided in the lines 813 and 823 so as to be in communication with the first vacuum chamber 920.

At this time, the upper part of the second vacuum chamber 826 has a communication hole communicating with some adsorption lines 813 and 823 of the adsorption parts 812 and 822 and the outer adsorption lines 813 and 823, and the second vacuum chamber ( A portion of the lower portion of 826 may communicate with the first vacuum chamber 920.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings.

3A and 3B are plan views illustrating a combined state of the first body and the universal base of FIG. 2, and FIGS. 4A and 4B are cross-sectional views taken along line AA ′ of FIGS. 3A and 3B, respectively. 3A and 4A illustrate a state in which the first body 810 and the universal base 90 are coupled through the cicada ring, and FIGS. 3B and 4B illustrate the first body 810 and the universal body through the bolt. The figure shows that the base 90 is coupled.

The first body 810 is formed in a relatively smaller size than the universal base 90. That is, the first body 810 may handle the semiconductor strip S and the semiconductor package of a small size. The first body 810 is mounted on the universal base 90 while covering the first vacuum chamber 920 of the universal base 90. That is, since the size of the first vacuum chamber 920 of the universal base 90 is not smaller than the size of the adsorption portions 812 and 822 of the first body 810, the first vacuum chamber 920 of the universal base 90 is not. Pneumatic pressure is applied to the entire adsorption lines (813, 823) of the first body 810 can absorb the semiconductor material over the entire area of the first body (810).

3 (a) and 4 (a), it can be seen that the first body 810 and the universal base 90 are mounted by a cicada ring, which is the first coupling means 941. 3 (b) and 4 (b) are fastened by bolts (not shown) instead of cicada rings. In this case, since the first body 810 has a relatively small size, the first body 810 may be stably bolted to the universal base 90 by a total of four locations at the top of the body 80. In FIG. 3 (a), since bolt coupling grooves are illustrated in four outer regions of the adsorption unit, cicada ring coupling or bolt coupling may be appropriately selected and used as necessary.

When using the cicada ring as the first coupling means 941, the universal base 90 has recesses 911 on both sides of the universal base 90 so as to correspond to the width of the first body 810 to be fastened. The first coupling unit 941 is provided in the recess 911. The first coupling means 941 may be provided inside the base 910 by a predetermined distance from the second coupling means 942, and may be fastened to the first body 810 through the first coupling means 941. . When the first body 810 and the universal base 90 are coupled, pneumatic pressure is applied from the first vacuum chamber 920 to the first adsorption region 812 through the adsorption line 813. In this case, since the size of the first adsorption region is not larger than the size of the first vacuum chamber, the semiconductor package may be adsorbed on the entire first adsorption region 812 through the first vacuum chamber 920.

When the universal base 90 of the present invention is used, the universal base 90 can be used by applying the first body 810 that has already been delivered and is being used. The universal base 90 does not need to manufacture an additional body 80. The first body 810 can be used interchangeably.

5A and 5B are plan views illustrating a combined state of the second body and the universal base of FIG. 2, and FIGS. 6A and 6B are cross-sectional views taken along line BB ′ of FIGS. 5A and 5B, respectively. 5A and 6A illustrate a state in which the second body 820 and the universal base 90 are coupled through the cicada ring, and FIGS. 5B and 6B illustrate the second body 820 and 820 through bolts. ) And the universal base 90 is shown.

5 and 6, the second body 820 and the universal base 90 are coupled through the second coupling means 942. For convenience, FIGS. 5 (b) and 6 (b) show a state in which the bolt is coupled by a bolt, and the cicada ring may be omitted.

The second body 820 is for handling a large area strip in which adsorption portions 812 and 822 are formed larger than the first vacuum chamber 920 of the universal base 90. When mounting and fastening the body 80 having a large adsorption portion to the universal base 90 as in the first body 810, the first adsorption lines 813 and 823 connected to the first vacuum chamber 920 may be used. Although pneumatic pressure is communicated from the vacuum chamber 920, the pneumatic pressure from the first vacuum chamber 920 may not be transmitted to the outer suction lines 813 and 823 that are not connected to the first vacuum chamber 920.

Accordingly, the size of the adsorption parts 812 and 822 is the same as that of the second body 820 so that the air pressure may be applied to the adsorption parts 812 and 822 of the second body 820 over the entire area. If larger than the size of 920, a second vacuum chamber 826 for communicating with the first vacuum chamber 920 is provided on the bottom surface of the second body 820.

That is, the second body 820 further includes a support surface 825 which is in direct contact with the universal base 90, and a second vacuum chamber 826 provided inside the support surface 825. The second vacuum chamber 826 is for transmitting the pneumatic pressure applied through the first vacuum chamber 920 of the universal base 90 to the adsorption parts 812 and 822, and the outer bottom or body 80 of the body 80. It may be formed on the entire bottom surface of the adsorption portion (812, 822).

The second vacuum chamber 826 is configured to apply suction to the outer region of the semiconductor material when the size of the suction units 812 and 822 of the body 80 is larger than that of the first vacuum chamber 920. Outer adsorption lines 813 and 823 which are not in communication with the first vacuum chamber 920 among the adsorption lines 813 and 823 formed in the sections 812 and 822 are provided to be connected to the first vacuum chamber 920. The upper part of the second vacuum chamber 826 has a communication hole in which some adsorption lines 813 and 823 of the adsorption units 812 and 822 communicate with the outer adsorption lines 813 and 823, and a second vacuum chamber ( A lower portion of 826 is formed such that some region is in communication with the first vacuum chamber 920.

Referring to FIG. 6 (a), in the state where only the first vacuum chamber 920 is formed without the second vacuum chamber 826, the pneumatic pressure applied from the first vacuum chamber 920 is applied to both outer suction lines 813 and 823. ), The outer suction holes 813a and 823a communicating with the outer suction lines 813 and 823 do not absorb the semiconductor material. Accordingly, both sides of the body 80 may be supplied with pneumatic pressure to a region where the outer suction lines 813 and 823 are formed in order to give the suction force to the outer suction holes 813a and 823a through the outer suction lines 813 and 823. All the suction lines 812 and 822 of the suction parts 812 and 822 are formed even if the area of the replaced suction parts 812 and 822 becomes larger than the first vacuum chamber 920 by making a recess formed in the bottom to form the second vacuum chamber 826. It is possible to give the adsorption force over 813 and 823.

FIG. 6A illustrates a structure in which a second vacuum chamber 826 is provided in a portion of the bottom surfaces of both sides of the second body 820, and the second vacuum chamber 9826 in FIG. 6B is an adsorption part 812. , The second vacuum chamber 826 is formed with a groove formed in the entire bottom of the 822. This allows the second body 820 as shown in FIGS. 6 (a) and 6 (b) to transfer the pneumatic pressure applied from the first vacuum chamber 920 across the adsorption lines 813 and 823. The semiconductor material can be adsorbed on the entire adsorption portion 812, 822.

Meanwhile, FIG. 6A may further include a thickness reinforcement 827 in which a partial region protrudes to the bottom of the adsorption units 812 and 822. When the semiconductor material increases, the body 80 also becomes larger and larger in accordance with the semiconductor material. In the case of a larger body (second body, 820) than a small body (first body, 810), the body (repetitive use and load) Since warpage or warpage of 80 may easily occur, a thickness reinforcing part 827 protruding to the bottom of the adsorption part 812 and 822 may be additionally formed in order to prevent this.

Like the first body 810, the second body 820 is fastened to the universal base 90 by coupling members 814 and 824 such as bolts and cicada rings on the upper surface of the universal base 90. In the case of using a bolt, as shown in FIGS. 5A and 5B, the second body 820 can be stably fastened to the universal base 90 through eight bolt coupling holes. It may be fastened to the universal base 90 through the cicada ring shown.

The second body 820 is formed in a size corresponding to the universal base 90, the second coupling member 824 formed in the base 910 when fastened through the cicada ring as shown in Figure 5 (a) When the second coupling means 942 formed on the outer side of the universal base 90 is coupled, the support surface 826 is in contact with one side of the upper surface of the base 910. In this case, the first vacuum chamber 920 may communicate with the second adsorption unit 822 through the second vacuum chamber 826. Therefore, even if the first vacuum chamber 920 is formed smaller than the second adsorption unit 822, the second vacuum chamber 826 is formed to communicate with the outer suction lines 813 and 823 so that the second adsorption unit 822 is formed. The pneumatic pressure of the first vacuum chamber 920 is applied to the whole.

Hereinafter, the operation and effect of the adsorption table 80 of the semiconductor manufacturing apparatus according to an embodiment of the present invention having the configuration as described above will be described.

First, the suction table 80 is provided to the first body 810 and the second body 820 having different sizes, and is compatible with the universal base 90. In this case, the first body 810 is provided in a smaller size than the second body 820. In the above embodiment, the two bodies 80 are used as an example, but in addition, a body having various sizes larger than the size of the first body 810 and smaller than the size of the second body 820 may be used. The present invention merely illustrates the smallest body and the largest body as examples.

The first coupling member 814 of the first body 810 is coupled to the first coupling means 941 of the universal base 90. In this case, the first coupling unit 941 is provided inside the predetermined distance at the outermost side of the universal base 90.

When the first body 810 and the universal base 90 are coupled through the first coupling unit 941, the pneumatic pressure inside the first vacuum chamber 920 may be first adsorbed through the plurality of first adsorption lines 813. May be applied to the unit 812. As a result, the semiconductor package can be adsorbed by the first adsorption unit 812.

When the size of the semiconductor material is changed and the second body 820 is to be used, the worker may detach the first body 810 from the universal base 90. In addition, the second body 820 may be coupled to the universal base 90 from which the first body 810 is separated. Specifically, the second body 820 is coupled to the second coupling means 942 provided near the outer side of the first coupling means 941, not the first coupling means 941 to which the first body 810 is coupled. . That is, one universal base 90 may provide an adsorption table 100 that can handle various sizes simply by differently engaging positions with the body 80 suitable for the size of the material among the various bodies 80. have.

When the second body 820 and the universal base 90 are coupled to each other through the second coupling means 942, a second vacuum in which the air pressure inside the first vacuum chamber 920 is formed outside the first vacuum chamber 920 is provided. It may be applied to the second adsorption unit 822 through the chamber 826 and the plurality of second adsorption lines 823. Thereby, the semiconductor package adsorption by the 2nd adsorption part 822 is attained.

As such, since the first body 810 and the second body 820 having different sizes are compatible with the single universal base 80, the semiconductor manufacturing apparatus 1 may change the replacement time of the adsorption table 80. It can have an effect that can shorten. In the present embodiment, it is described and illustrated that the body 80 of two sizes is provided as an example, but the spirit of the present invention is not limited thereto. For example, a kit having a medium size between the first body 810 and the second body 820 may be further provided. Accordingly, the universal base 90 may be provided with a fastening means 940 in more various positions. have.

As described above, the adsorption table 100 may be applied to a table for adsorbing materials such as the cutting table 30, the drying table 50, the alignment table 60, and the like of the semiconductor manufacturing apparatus 1. In addition, in the case where the adsorption table 100 of the present invention is applied to the drying table 50 for drying the material, the lower surface of the base constituting the drying table 50 due to the structural feature of heating and heating the drying table 50. Unlike other tables, since the heating member is provided to heat the suction table, the body and the base could be separated from the semiconductor manufacturing apparatus 10 only after the heat applied to the table had completely cooled. After using the universal base 90, it is not necessary to separate the universal base 90 from the semiconductor manufacturing apparatus 1. In addition, the universal base 90 is also used to separate the body 80 from the universal base 90. It is possible to remove only the body 80 by using a bolt or the like and replace it with a new body 80 without having to contact the worker. ) And the heat of the universal base 90 that is already heated can be conducted to the body 80 without having to wait for a time to cool the universal base 90 sufficiently and to heat the body and the base from the beginning. This saves not only the replacement time but also the heating and cooling time as a whole.

Although the adsorption table used in the semiconductor manufacturing apparatus according to the embodiment of the present invention has been described as a specific embodiment, this is only an example, and the present invention is not limited thereto, and the broadest range in accordance with the basic idea disclosed herein is described. Should be interpreted as having Those skilled in the art can combine and substitute the disclosed embodiments to implement a pattern of a shape that is not indicated, but this also does not depart from the scope of the present invention. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on the present specification, it is apparent that such changes or modifications belong to the scope of the present invention.

1: semiconductor manufacturing apparatus 100: adsorption table
80: body 810: first body
820: second body 90: universal base

Claims (9)

Adsorption table for absorbing semiconductor material from the upper surface,
A universal base having a first vacuum chamber for receiving a pneumatic pressure applied through the pneumatic line, and having a pneumatic line applied to the bottom surface thereof; And
A body mounted on an upper portion of the universal base, the body including a plurality of adsorption lines communicating with the first vacuum chamber and an adsorption unit having adsorption holes corresponding to the adsorption lines,
The body is provided with a plurality of coupled to any one of the body selected from the plurality of bodies according to the size of the semiconductor material detachable to the universal base,
The first vacuum chamber of the universal base is formed to be smaller than the body of the smallest size of the body to be covered by the body,
The universal base has a suction table, characterized in that the size corresponding to the body of the largest size among the body. According to claim 1,
When the size of the adsorption part provided in the body is larger than the size of the first vacuum chamber, a material for communicating with the first vacuum chamber on the bottom of the body so that air pressure may be applied over the entire area of the adsorption line. A suction table comprising two vacuum chambers. According to claim 1,
When the size of the adsorption part provided in the body is larger than the size of the first vacuum chamber, an outer adsorption line which is not in communication with the first vacuum chamber among the adsorption lines formed in the adsorption part may communicate with the first vacuum chamber. A second vacuum chamber is provided so that
The upper portion of the second vacuum chamber has a communication hole in communication with a portion of the suction line and the outer suction line of the adsorption portion, the lower portion of the second vacuum chamber is characterized in that the partial region is in communication with the first vacuum chamber Adsorption table. The method of claim 2,
The adsorption table further comprises a thickness reinforcing part protruding a partial region to the bottom surface. According to claim 1,
The body is fastened to the universal base by a coupling member on the upper surface of the universal base,
The coupling member is characterized in that the bolt or cicada ring,
And a coupling means for coupling the coupling member and the coupling member to a position corresponding to the body and the universal base. The method of claim 5,
When the coupling member is a cicada ring,
The universal base has recesses on both sides of the universal base to correspond to the width of the body to be fastened,
The cicada ring is mounted to the recessed portion of the universal base, and the coupling means for fastening the cicada ring on both sides of the body is formed. The method according to any one of claims 1 to 6,
The suction table is a cutting table for cutting the semiconductor material,
The adsorption part of the adsorption table is formed of rubber, and the upper surface of the adsorption part is provided with a blade escape groove through which a blade for cutting the semiconductor material passes and a plurality of adsorption grooves for adsorption of the semiconductor material before and after cutting, respectively.
An adsorption table is formed in the adsorption groove, in which adsorption holes are formed to adsorb the semiconductor material through the adsorption line. The method according to any one of claims 1 to 6,
The adsorption table is a drying table for washing the cut semiconductor material and drying the semiconductor material after the cleaning is completed,
A plurality of adsorption holes are formed on the upper surface of the adsorption table to adsorb the respective semiconductor materials through the adsorption lines.
The lower portion of the base further comprises a heating member for applying heat to the suction table. The method according to any one of claims 1 to 6,
The adsorption table is an alignment table for sorting and loading the dried semiconductor material,
A first alignment part having a loading groove having a guide part for aligning and loading the semiconductor material and a non-loading area in which the semiconductor material is not loaded are alternately formed along the X-axis and Y-axis directions on an upper surface of the suction table; Having a second alignment portion,
And an adsorption hole is formed inside the loading groove to adsorb the semiconductor material through the adsorption line.

Images