KR20190136824A - Bonding apparatus for micro led device and bonding method for micro led device - Google Patents

Abstract

The present invention relates to a bonding apparatus for a micro LED device, which bonds a micro LED device mounted on a substrate to a PCB, and a bonding method of a micro LED device, and specifically, to a bonding apparatus for a micro LED device and a bonding method of a micro LED device, which are possible to perform a detailed bonding process by preventing alignment position errors generated when picking up a micro LED device.

Description

Bonding device for micro LED device and bonding method for micro LED device {BONDING APPARATUS FOR MICRO LED DEVICE AND BONDING METHOD FOR MICRO LED DEVICE}

The present invention relates to a micro LED device bonding apparatus and a micro LED device bonding method for bonding the micro device to the PCB by mounting the micro device mounted on the substrate to the PCB.

BACKGROUND With the trend of high functionalization of electronic devices, devices such as semiconductors and LEDs are becoming smaller and smaller, and in recent years, devices having a size of several hundred μm or less, that is, devices in micro units have been used. As the miniaturization of the device proceeds to micro units, the bonding process for attaching the micro LED device to a circuit board such as a PCB requires a very precise process.

As a patent for a conventional bonding apparatus, those described in Korean Patent Registration No. 10-1425613 (hereinafter referred to as 'Patent Document 1') are known.

The flip chip bonding apparatus of patent document 1 is a picker unit which picks up a semiconductor chip from a wafer, the bonding picker which picks up a semiconductor chip from a picker unit, and mounts on a board | substrate, and a picker unit in which a wafer is located by a separate transfer means. It comprises a wafer supply unit for supplying to the place.

In the flip chip bonding apparatus having the above configuration, the picker unit picks up the semiconductor chip on the wafer supplied by the wafer supply unit, and the bonding picker picks up the semiconductor chip and mounts it on the substrate.

If the configuration of the flip chip bonding apparatus is used as it is, the size of the semiconductor chip is several hundred micrometers or less (hereinafter referred to as a "micro LED element"), so that when the pick-up and transfer of the micro LED element by the picker unit, the bonding pick Since Kerr picks up and handles semiconductor chips one by one, there is a problem that it takes a long time to handle thousands to tens of thousands of micro LED devices one by one.

In addition, when the bonding picker handles the semiconductor chips one by one, the components of each transfer line are vibrated and generate heat by the transfer operation of the bonding pickers that are transferred in the X-axis and Y-axis directions. The precision of the transfer position of the bonding picker may be degraded by thermal expansion and vibration.

Specifically, the positional information cannot be obtained precisely by vision provided on one side of the bonding picker due to thermal expansion and vibration, and there is an error in the transfer position of the bonding picker, thereby reducing the reliability and precision of the bonding process.

Such a minute error may act as an error corresponding to a product defect when the micro LED device has a size of several hundred μm or less. In addition, when mounting the micro LED element on the substrate, it is mounted in the wrong position, causing a defect of the substrate.

In addition, Patent Document 1 does not significantly affect the positional accuracy because bonding is performed by separating semiconductor chips one by one from a fixed wafer without a change in position and then mounting them on a substrate. Because of the practical problems as described above, it is necessary to supply and handle on a wafer basis.

In other words, micro-element devices are supplied in units of several thousand to tens of thousands of substrates (wafers), and even though the substrates (wafers) are not fixed, they are supplied while the micro-elements are secured. It is necessary to separate.

As described above, in order to mount a micro LED device on a substrate, it is necessary to develop a new type of bonding device.

Korea Patent Registration No. 10-1425613

The present invention has been made to solve the above-described problem, by preventing the alignment position error generated when the pickup of the micro LED device is supplied in units of thousands to tens of thousands, for a micro LED device to improve the UPH while performing a precise bonding process An object of the present invention is to provide a bonding device and a bonding method for a micro LED device.

Bonding device for a micro LED device according to an aspect of the present invention, a micro LED device bonding device for bonding a plurality of micro LED device mounted on the carrier to the PCB, a plurality of carriers to which the plurality of micro LED device is temporarily attached Tray pallets; A carrier picker that picks up one carrier from the tray pallet and transfers the carrier to a micro LED device separator; A bonding head having a stamp pad detachably mounted at a lower portion to pick up a plurality of micro LED elements from a carrier transferred to the micro LED element separating unit and to bond the PCB to the PCB; and a micro LED provided at one side of the bonding head; A bonding picker including a bonding vision for obtaining position information of the micro LED device and position information of a region to be bonded on the PCB, the bonding picker being movable in the X-axis and Y-axis directions; A carrier recovery picker for recovering empty carriers on the micro LED device separator after the micro LED device is separated from the carrier by the bonding head; A pin uplooking vision fixed to a lower portion between the micro LED device isolation unit and the PCB stage to obtain position information of the micro LED device picked up by the bonding picker; A PCB stage to which the micro LED device is bonded according to the position information obtained by the uplooking vision and the position information on the region to be bonded to the PCB; And a cleaner unit for cleaning the stamp pad, which has been bonded, wherein the carrier picker, the micro LED device isolation unit, the bonding picker, the carrier recovery picker, the uplooking vision, the PCB stage, and the cleaner unit form a pair, and the Y-axis direction. Are provided on both sides symmetrically to each other, and the tray pallets are provided to be reciprocally transported in the X-axis direction so as to transfer the carriers accommodated in the tray pallets to the respective carrier pickers provided on both sides. In order to transfer a carrier to the micro LED device separator, the carrier picker is provided to be transportable in the Y-axis direction, and the carrier picker and the micro LED device separator are fixedly arranged at any coaxial parallel to the Y-axis direction. It is characterized by.

In addition, the PCB provided in the PCB stage is supplied in one direction and taken out in the other direction, the carrier supplied from the tray pallet is first delivered to a carrier picker provided in the Y-axis region located in the direction in which the PCB is taken out Bonding operation is performed, the bonding operation is first finished to the PCB located on the side of the direction in which the PCB is exported, characterized in that the export.

The stamp pad may have protruding adhesive protrusions corresponding to the plurality of micro LED elements, respectively, to pick up the plurality of micro LED elements mounted on the carrier at one time.

The stamp stack may include a plurality of stamp pads stacked thereon; A gripper for pushing the used stamp pad detached from the lower portion of the bonding head to the stamp stack; A stamp pusher for drawing out a new stamp pad to be replaced from the stamp stack portion; and a stamp replacement portion on which the used stamp pad or a new stamp pad to be replaced is placed, and wherein the stamp pad of the bonding head is replaced, the bonding The head may be replaced with a new stamp pad through pneumatic connection and release from the stamp replacement unit.

In addition, the bonding head includes a pneumatic supply unit for supplying pneumatic pressure; And a pneumatic flow passage connected to the pneumatic supply portion, and a plurality of slits communicating with the pneumatic flow passage are formed on a bottom surface of the bonding head such that the stamp pad is detachably attached to the lower portion of the bonding head by the pneumatic supply portion. It is characterized by.

In addition, the carrier picker and the carrier recovery picker is characterized in that the vacuum adsorption on the edge (edge) region of the non-adhesive area of the micro LED device on the carrier.

In addition, the cleaner unit, a supply roller for supplying a tape; A clean stage in which the adhesive surface of the tape supplied by the feed roller is supplied upward, and the foreign matter of the stamp pad is removed by contacting the stamp pad mounted at the lower end of the bonding head when the bonding head is lowered; And a recovery roller for recovering the tape used in the clean stage, wherein the supply roller and the recovery roller are detachably provided to be replaceable.

In the bonding system for a micro LED device according to an aspect of the present invention, a plurality of micro LED device bonding apparatuses are arranged side by side, and each micro LED device bonding apparatus bonds micro LED elements of different colors to each other. It is characterized in that the micro LED elements of different colors bonded to each bonding device on the PCB are continuously bonded.

A bonding method for a micro LED device according to an aspect of the present invention is a bonding method for a micro LED device for bonding a plurality of micro LED devices mounted on a carrier to a PCB, the plurality of carriers mounted with a plurality of micro LED devices are accommodated. Sequentially supplying the carriers accommodated in the tray pallets to the respective carrier pickers provided at both sides while the tray pallets being reciprocated in the X-axis direction; Picking up a carrier of one of the plurality of carriers by the carrier picker and transferring the carrier picker to a micro LED device separator fixedly disposed at any coaxial parallel to the carrier picker in a Y-axis direction; Bonding vision provided on one side of the bonding head is used to obtain bonding position information on the area to be bonded to the PCB, and to stamp pads mounted below the bonding head to pick up the micro LED elements from the carriers transferred to the micro LED element separator. Inspecting the location information of the formed adhesive protrusion with an uplooking vision; Inspect the alignment state of the micro LED element transmitted to the micro LED element separation unit by bonding vision, and the adhesive protrusion of the stamp pad based on the position information of the adhesive protrusion formed on the stamp pad and the alignment state of the micro LED element. Picking up each micro LED element into a furnace; Transferring the bonding head to an upper portion of an uplooking vision and inspecting a pickup state of the micro LED element picked up by the stamp pad; Transferring the micro LED element picked up by the stamp pad to an upper portion of the first PCB or the second PCB, and bonding the micro LED element to a bonding position of the first PCB or the second PCB according to the pickup state inspection result; And cleaning the stamp pad of the bonding head in which the bonding is completed in a cleaner unit, wherein the first PCB or the second PCB is supplied in one direction and taken out in the other direction, and the carrier supplied from the tray pallet is The bonding work is first performed by transferring to a carrier picker provided in the Y-axis region located on the side in which the PCB is taken out, and the bonding work is first finished and carried out on the PCB located in the direction in which the PCB is taken out.

The stamp pad of the bonding head may be detachably attached to the lower portion of the bonding head by pneumatic pressure, and the stamp pad of the bonding head may include picking up a micro LED device, bonding, and cleaning the stamp. If it reaches a predetermined number of times it is characterized in that it further comprises the step of replacing with a new stamp pad.

According to the bonding apparatus for a micro LED device of the present invention as described above has the following effects.

As the bonding device for the micro LED device includes the first and the second bonding process units, the pick-up and the bonding process are performed, so that the bonding of the micro LED device can be more efficiently achieved.

As the position of the micro LED element separator is fixed, and the carrier is transferred to the micro LED element separator and transferred, the micro LED element is separated from the carrier at the micro LED element separator and transferred to the PCB, thereby reducing the occurrence of error in position alignment. You can.

The control unit bonds the alignment state data of the micro LED element obtained through the bonding vision and / or the protrusion of the stamp pad mounted on the lower portion of the bonding head obtained through the uplooking vision, and the alignment state data of the micro LED element picked up by the bonding head. By correcting the pick-up or bonding position of the picker, the bonding picker can bond the micro LED element to the correct position.

The bonding head of the bonding picker vacuum-adsorbs the stamp pad by pneumatic pressure, so that the stamp pad can be easily detached and replaced. Therefore, it can be easily replaced even if wear or breakage occurs in the device adhesive protrusion of the stamp pad according to the long-term use, thereby maintaining the adsorptive force of the stamp pad to prevent the occurrence of the defect area of the micro LED device on the PCB. can do.

As the cleaner part is provided, foreign matters of the stamp pad can be easily removed, and thus, the adsorption force of the stamp pad can be maintained high.

As the carrier picker picks up the carrier by adsorbing the non-bonded region of the edge of the carrier, it is possible to prevent the micro LED element from being broken or the alignment of the micro LED element is disturbed.

The carrier picker movable in the Y-axis direction and the micro LED device separator are disposed coaxially in the Y-axis direction so that the carrier picker repeatedly delivers the carrier to the same position of the micro LED device separator, thereby ensuring accuracy.

In addition, since the tray pallet which accommodates the plurality of carriers to which the plurality of micro LED elements are temporarily bonded is reciprocated in the X-axis direction, each carrier is transferred to a pair of carrier pickers, thereby improving UPH without delay in carrier supply.

In addition, the present invention is a pair of carrier picker, micro LED device separation unit, bonding picker, carrier recovery picker, up-looking vision, PCB stage, cleaner unit pairs, are provided on both sides symmetrically in the Y-axis direction to each picker In addition to performing independent bonding to the PCB, the bonding process was first terminated and exported to improve the efficiency of the bonding process.

In addition, according to the present invention, two types of pickers, a bonding picker and a carrier picker, are separated from each other so that a continuous process can be performed independently from each other. In other words, while the picking picker picks up and bonds the micro LED elements, the new carriers can be picked up by the carrier picker from the tray pallet and supplied to the micro LED element isolator, enabling continuous operation without process delay and improving the UPH. have.

Uplooking vision can improve the positional accuracy of the bonding picker as the bonding picker inspects the state of the stamp pad and / or device adhesion projection before picking up the micro LED element, and the controller controls the bonding picker according to the result. have.

1 is a plan view of a bonding device for a micro LED device according to a preferred embodiment of the present invention.
2A and 2B are side views illustrating that the first carrier picker of FIG. 1 picks up a carrier from a pallet and delivers the carrier to a first micro LED device separator;
3A and 3B are perspective views of FIGS. 2A and 2B, respectively.
4 is a side view of the first bonding picker of FIG.
FIG. 5A is a cross-sectional view illustrating the inside of a bonding picker head of the first and second bonding pickers of FIG. 4; FIG.
FIG. 5B is a bottom view of the bottom of the bonding picker head of the first and second bonding pickers of FIG. 4; FIG.
6 is a plan view of a micro LED device bonding system in which the bonding device for a micro LED device according to an embodiment of the present invention sequentially arranged.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art may implement the principles of the invention and invent various devices included in the concept and scope of the invention, although not explicitly described or illustrated herein. In addition, all conditional terms and embodiments listed herein are in principle clearly intended to be understood only for the purpose of understanding the concept of the invention and are not to be limited to the specifically listed embodiments and states. .

The above objects, features, and advantages will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, and thus, it will be possible to easily implement the technical idea of self-invention having ordinary skill in the art. .

Embodiments described herein will be described with reference to cross-sectional and / or perspective views, which are ideal exemplary views of the invention. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in forms generated according to manufacturing processes.

Before entering the description, the following items are defined.

In the accompanying drawings, the X-axis direction means the left and right directions of the micro LED device bonding apparatus 1, and the Y-axis direction means the front and rear directions of the micro LED device bonding apparatus 1, and the Z axis Direction means the up and down direction of the bonding device 1 for micro LED elements.

Hereinafter, a bonding apparatus 10 for a micro LED device according to a preferred embodiment of the present invention will be described with reference to FIGS. 1 to 5 (b).

1 is a plan view of a bonding device for a micro LED device according to a preferred embodiment of the present invention, Figures 2a and 2b is a first carrier picker of Figure 1 picks up a carrier from the pallet to the first micro LED device separation unit carrier 3A and 3B are perspective views of FIGS. 2A and 2B, FIG. 4 is a side view of the first bonding picker of FIG. 1, and FIG. 5A is a first view of FIG. 4. 5 is a cross-sectional view illustrating the inside of the bonding head of the two-bonding picker, and FIG. 5B is a bottom view of the bottom surface of the bonding head of the first and second bonding pickers of FIG. 4.

As shown in FIG. 1, the bonding device 10 for a micro LED device according to an exemplary embodiment of the present invention is a bonding device 10 for a micro LED device for bonding a plurality of micro LED devices mounted on a carrier to a PCB. A tray pallet T receiving a plurality of carriers S to which a plurality of micro LED elements M are temporarily bonded; A carrier picker (300) for picking up one carrier (S) from the tray pallet (T) and transferring it to the micro LED device separating unit (400); It is provided with a stamp pad 550 detachably mounted on the bottom to pick up a plurality of micro LED device (M) from the carrier (S) transferred to the micro LED device separation unit 400 and to bond to the PCB (P). The bonding head 540 and the position information of the micro LED element M, which is provided at one side of the bonding head 540 and transferred to the micro LED element separating unit 400, and the area to be bonded to the PCB P, are provided. A bonding picker 500 including a bonding vision 560 for acquiring position information, the bonding picker 500 being movable in the X-axis and Y-axis directions; A carrier recovery picker (700) for recovering the empty carrier (S) on the micro LED device isolation unit (400) after the micro LED device (M) is separated from the carrier (S) by the bonding head (540); Up-looking vision 600 which is fixedly disposed between the micro LED device isolation unit 400 and the PCB stage 200 to acquire position information of the micro LED device M picked up by the bonding picker 500. ); A PCB stage 200 to which the micro LED device M is bonded according to the position information acquired by the uplooking vision 600 and the position information on the region to be bonded of the PCB P; And a cleaner 800 for cleaning the stamp pad 550 where the bonding is completed.

In this case, the carrier picker 300, the micro LED device isolation unit 400, the bonding picker 500, the carrier recovery picker 700, the uplooking vision 600, the PCB stage 200, and the cleaner unit 800 are paired. The tray pallet (T) is provided on both sides symmetrically in the Y-axis direction, in order to transfer the carrier (S) accommodated in the tray pallet (T) to each carrier picker (300) provided on both sides. The carrier picker 300 is provided in the Y-axis direction so as to be reciprocally transported in the X-axis direction, and to transfer the carrier S received from the tray pallet T to the micro LED device isolation unit 400. It is provided to be transportable, and the carrier picker 300 and the micro LED device separating unit 400 is characterized in that it is fixedly arranged on any coaxial parallel to the Y-axis direction.

Hereinafter, the carrier S and the micro LED element M will be described.

A plurality of carriers S are stacked on a tray pallet T, and a plurality of micro LED elements M is attached to an upper surface of the carrier S.

The carrier S may be a growth substrate for growing / processing the micro LED device M by lamination, etching, or the like, and may be a temporary substrate temporarily moved by moving the micro LED device M from the growth substrate. It may be.

When the carrier S is a growth substrate, the material of the carrier S may be a silicon material, and when the carrier S is a temporary substrate, the material of the substrate may be glass or resin.

The micro LED device M is a device having a size of several hundred micrometers or less, and includes an LED or a semiconductor chip. These micro LED elements (M) are attached to the upper surface of one carrier (S) thousands to tens of thousands of rows and columns arranged at regular intervals, and on the tray pallet (T) thousands to tens of thousands of micro LED elements (M). ) Is supplied in a state where a plurality of carriers (S) are accommodated.

In order for the micro LED element M to be fixedly mounted on the upper surface of the carrier S, the micro LED element M is temporarily attached to, or temporarily attached to, the upper surface of the carrier S by an adhesive material or an adhesive film. It may be provided as.

In this case, the adhesive force of the adhesive material or the adhesive film is preferably smaller than the pickup force (or adsorption force) of the bonding picker 500. This is because when the adhesive force of the adhesive material or the adhesive film is larger than the pickup force of the bonding picker 500, the pickup of the micro LED device M may not be performed properly.

The PCB P provides a space in which the micro LED device M is mounted and bonded. The PCB P is provided with circuit wiring, and the like, and the micro LED elements M bonded to the PCB P and the PCB P are electrically connected by the circuit wiring.

The bonding surface of the PCB (P), that is, the upper surface of the PCB (P) may be provided with an adhesive applied, through this adhesive, the micro LED element (M) can be bonded to the upper surface of the PCB (P). have.

In this case, the adhesive force of the adhesive is greater than the adhesive force by the bonding picker 500, and thus, the micro LED element M adsorbed on the bonding picker 500 may be easily bonded to the PCB P.

In detail, the relationship between the adhesive force of the adhesive material or the adhesive film formed on the upper surface of the carrier (S), the bonding force of the adhesive applied to the upper surface of the PCB (P), and the adhesive force of the bonding picker 500 Has a relationship of 'adhesive force <adhesion force <bonding force'.

According to the magnitude of the force as described above, the micro LED element (M) can be easily picked up from the carrier (S) by the bonding picker 500, the micro LED element (M) is stamped on the bonding picker (500) It can be easily separated from the pad 550 and easily bonded to the PCB (P).

The pallet 100 functions to load and receive the carrier S, and a pallet loading unit in which a plurality of pallets 100 containing carriers are stacked, and an empty pallet 100 in which carriers are transferred by a carrier picker are stacked. The pallet unloading part may be further provided. In addition, the pallet 100 may be mounted by a separate feeder to be reciprocally transported in the X-axis direction, and may transfer one carrier S accommodated in the pallet 100 to each carrier picker 300.

In more detail, as illustrated in FIGS. 1 to 3B, the pallet 100 may be supplied with a plurality of tray pallets T on which a plurality of carriers S are stacked.

A plurality of carriers S may be loaded on each tray pallet T, and in the embodiment of the present invention, six carriers S are loaded on one tray pallet T. In addition, each of the six carriers S is supplied with thousands to tens of thousands of micro LED elements temporarily attached.

The pallet 100 may be installed to be movable in the first guide frame 21 formed in the X-axis direction, or may transfer one carrier S to each of the carriers provided at both sides by a feeder that is movable in the X-axis direction.

The pallet (T) loading unit is provided to be capable of lifting and lowering with reference to FIG. 1 and a stopper interposed between the tray pallet (T) located at the bottom of the plurality of pallets stacked in the cassette type and the tray pallet (T) located thereon; The tray pallets T stacked by the cylinders can be supplied one by one. When the tray pallet T located at the bottom is placed on the feeder, the feeder transfers the carrier S one by one to the first carrier picker 300a and the second carrier picker 300b by feeding in the X-axis direction. After all of the carriers S of the tray pallet T are picked up, the empty tray pallet T is recovered to the pallet unloading unit, and the feeder moves back to the pallet loading unit to receive a new tray pallet T for work. This can be repeated.

The PCB stage 200 is a region in which the bonding operation of the micro LED device M is performed in the bonding region of the PCB P, and the PCB provided in the PCB stage 200 is supplied from one side and is carried out in the other direction. That is, the PCB (P) is supplied in a stacked state in the PCB magazine, respectively, is drawn out one by a pusher or a gripper and configured to be movable in the X-axis direction by the belt (22). Based on the PCB stage 200 of FIG. 1, it is supplied from the left region of the PCB stage 200 and then carried out to the right region of the PCB stage 200.

The PCB stage 200 is installed to be movable on the belt 22 formed in the X-axis direction. Through this, when the PCB P reaches the PCB stage 200, the belt 22 is down to the PCB stage 200. PCB (P) is placed on the (). In addition, when the bonding is completed and the PCB (P) is required to transport the PCB (P) or the PCB (P) to be supplied, the belt 22 may be moved up to move the PCB (P) in the X-axis direction. .

In the PCB stage 200, a first PCB 200a and a second PCB 200b on which a bonding operation is to be performed are respectively placed on top of each stage, and the first and second PCBs 200a and 200b are attached to the belt 22. It is installed to be movable in the X axis direction.

PCB (P) is supplied in one direction and mounted on the first and second PCB stages (200a, 200b), the micro-LED device (M) separated from the micro-LED device separation unit 500 is bonded to the PCB (P). When the micro LED device M is bonded, the PCB P may be carried out in the other direction.

The PCB supply unit may be disposed on the left side of the PCB stage with reference to FIG. 1, and the PCB export unit may be disposed on the right side of the PCB stage.

Meanwhile, in the first and second micro LED device isolation units 400a and 400b, the carrier S received from the tray pallet T by the carrier picker 300 is placed, and the stamp pad 550 of the bonding head 540 is disposed. When the micro LED element M is picked up from the carrier S by the carrier recovery picker 700 which recovers the empty carrier S remaining on the micro LED element separator 400, the carrier S The LED device isolation unit 400 may be removed.

Carrier picker 300 has a function of picking up one carrier (S) from the plurality of carriers (S) accommodated in the tray pallet (T) transported in the X-axis direction and delivers it to the micro LED device separation unit (400), The first carrier picker 300a and the second carrier picker 300b may be configured to independently drive each other. The carrier picker 300 is provided to be transported in the Y-axis direction, respectively, in order to transfer the carrier S received from the tray pallet T to the micro LED device separating unit 400, and the carrier picker 300 and the micro LED are provided. The device isolation unit 400 is fixedly disposed on any coaxial parallel to the Y-axis direction, so that the carrier S can be delivered to the fixed position of the micro LED device isolation unit 400 at all times, which is advantageous in securing accuracy.

When the pallet 100 is located in front of the first micro LED device isolation unit 400a, the first carrier picker 300a picks up the carrier S on which the micro LED device M is loaded from the pallet 100. To be mounted on the first micro LED device isolation unit 400a.

The second carrier picker 300b picks up the carrier S on which the micro LED element M is loaded from the pallet 100 when the pallet 100 is located in front of the second micro LED element separating unit 400b. To be mounted on the second micro LED device isolation unit 400b.

At this time, the carrier S supplied from the tray pallet T is first delivered to the carrier picker 300 provided in the Y-axis region located on the side in which the PCB P is carried out, that is, the second carrier picker 300b. It is preferable to be. The carrier S is transferred to the second micro LED device isolation unit 400b by the second carrier picker 300b and bonded to the second PCB stage 200b by the second bonding head 500b. . In other words, the first PCB can be normally taken out only when the bonding operation of the second PCB is finished and taken out first.

Meanwhile, as shown in FIGS. 2A to 3B, each of the first and second carrier pickers 300a and 300b is connected to the carrier picker body 310 and the carrier picker body 310 in the Y-axis direction and the Z-axis. The carrier picker moving part 320 is installed to be movable in the direction, and the carrier picker head 340 is connected to the end 330 of the carrier picker moving part 320.

The carrier picker moving part 320 is installed on the carrier picker body 310 so as to be movable in the Y axis direction, and through this, the carrier picker head 340 of the first and second carrier pickers 300a and 300b is in the Y axis direction. Can be moved to Therefore, it can be seen that each of the first and second carrier pickers 300a and 300b is installed to be movable in the Y-axis direction. In addition, the carrier picker moving part 320 is installed on the carrier picker body 310 so as to be movable in the Z-axis direction, and through this, the carrier picker head 340 can move up and down.

A lower surface of the carrier picker head 340 is provided with a plurality of substrate adsorption protrusions 341 protruding downward.

The plurality of substrate adsorption protrusions 341 are disposed at an edge of a bottom surface of the carrier picker head 340. The arrangement of the plurality of substrate adsorption protrusions 341 corresponds to the non-adhesive area at the edge of the carrier S. FIG.

When the carrier S is picked up by the first and second carrier pickers 300a and 300b, the substrate adsorption protrusion 341 of the carrier picker head 340 has a micro LED element M at the center of the carrier S. The carrier S is picked up by vacuum suction of an edge region, which is a non-bonded region of the edge of the carrier S, rather than the bonded adhesive region.

As described above, as the carrier picker head 340 of the first and second carrier pickers 300a and 300b picks up the carrier S by absorbing the non-adhesive region at the edge of the carrier S, the micro LED element M Can be damaged or the alignment of the micro LED element M can be prevented from being disturbed.

The micro LED device separating unit 400 functions to provide a place where the carrier S picked up by the carrier picker 300 is delivered, and the carrier S picked up by the first carrier picker 300a is loaded. The first micro LED device separating unit 400a and the second micro LED device separating unit 400b loaded with the carrier S picked up by the second carrier picker 300b may be formed.

The first micro LED device isolation unit 400a is disposed on the left side of the first and second calibration stages 920 and 930, and the second micro LED device isolation unit 400b is the first and second calibration stages 920 and 930. Is placed on the right side of the.

A first substrate marking unit (not shown) is provided on an upper surface of the first micro LED device isolation unit 400a, and a second substrate marking unit (not shown) is provided on an upper surface of the second micro LED device isolation unit 400b. do.

When the carrier S is picked up by the first micro LED device isolation unit 400a by the first bonding picker 500a, the first substrate marking part serves as a reference point for identifying the alignment state of the carrier S. FIG. In addition, when correcting the pickup position of the first bonding picker 500a, the first substrate marking part serves as a kind of reference point capable of confirming the alignment state of the carrier S. FIG.

When the carrier S is picked up by the second micro LED device isolation unit 400b by the second bonding picker 500b, the second substrate marking unit corrects the pick-up position of the second bonding picker 500b. It serves as a kind of reference point to check the alignment of (S).

Unlike the pallet 100 and the PCB stage 200, the first micro LED device isolation unit 400a and the second micro LED device isolation unit 400b do not move, and their positions are fixed. If the position of the separation unit is provided to be transportable, since a position error may occur in the moving process, it is preferable to perform in a stable fixed area in order to maintain the alignment state of the tens to tens of thousands of micro LED elements (M).

The bonding picker 500 picks up only the micro LED device M from the carrier S loaded in the micro LED device separating unit 400 and bonds the PCB P to the PCB stage 200.

The bonding picker 500 picks up the micro LED device M of the carrier S transferred to the first micro LED device separating unit 400a and bonds the first picked-out PCB to the first PCB P placed on the first PCB stage 200a. Picking up the first bonding picker 500a and the micro LED element M of the carrier S transferred to the second micro LED element separating unit 400b and placing the second PCB P on the second PCB stage 200b. It may be made of a second bonding picker (500b) to be bonded to. In this case, the first and second bonding pickers 500a and 500b are installed to be independent of each other.

Each of the first and second bonding pickers 500a and 500b is bonded picker body 510 which is installed to be movable in the Y-axis direction as illustrated in FIGS. 1, 4, 5 (a) and 5 (b). ), A first moving part 520 installed on the bonding picker body 510 so as to be movable in the X-axis direction, and a second moving part installed on the bonding picker body 510 so as to be movable in the Z-axis direction from the bottom of the first moving part 520. A portion 530 and a lower portion of the second moving part 530 are provided, and the plurality of micro LED elements M are picked up from the carrier S transferred to the micro LED element isolation unit 400 to print the PCB P. A micro LED device mounted on one side of the bonding head 540 and the bonding head 540 having a stamp pad 550 detachably mounted to the bottom to be bonded to the micro LED device (400). And a bonding vision 560 for acquiring the position information of M) and the position information for the region to be bonded of the PCB P.

In this case, the bonding head 540 includes a pneumatic supply part for supplying air pressure and a pneumatic flow path 542 connected to the pneumatic supply part, and a plurality of slits 541 communicating with the pneumatic flow path 542 at the bottom of the bonding head 540. ) Is formed so that the stamp pad 550 may be attached to and detached from the lower portion of the bonding head 540 by the pneumatic pressure of the pneumatic supply portion.

In the case of the first bonding picker 500a, the bonding picker body 510 is installed to be movable in the Y-axis direction in the third guide frame 24 formed in the Y-axis direction, and in the case of the second bonding picker 500b, The bonding picker body 510 is installed to be movable in the Y-axis direction in the fourth guide frame 25 formed in the Y-axis direction.

As described above, as each of the first and second bonding pickers 500a and 500b includes a bonding picker body 510, a first moving part 520, and a second moving part 530, the bonding head 540 is X. FIG. It is movable in the axial direction, the Y axis direction, and the Z axis direction. In other words, each of the first and second bonding pickers 500a and 500b is installed in the third and fourth guide frames 24 and 25 so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction.

As illustrated in FIGS. 5A and 5B, the bonding head 540 is installed to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction, and a stamp pad (pneumatic) is installed on the bottom of the bonding head 540. 550 is detached.

That is, the bonding head 540 is provided with a supply unit for supplying air pressure and a pneumatic flow path 542 connected to the pneumatic supply unit, the pneumatic flow path 542 is in communication with a plurality of slits 541 formed on the bottom of the bonding head.

When the suction force by the pneumatic pressure is generated in the pneumatic supply unit, the suction force is generated in the pneumatic flow path 542 and the plurality of slits 541. When the stamp pad 550 contacts the bottom surface of the bonding head 540, the upper surface of the stamp pad 550 is vacuum-adsorbed to the bottom surface of the bonding head 540 by the suction force.

Meanwhile, as illustrated in FIG. 5B, the plurality of slits 541 may have a flow path shape in which the slits 541 communicate with each other. That is, the inner slits 544 having a rectangular shape and four outer slits 545 communicating with the inner slits 544 and having a 'ㅗ' shape, respectively.

The outer edge of the outer slit 545 may have a generally disconnected quadrangular shape, and the disconnected quadrangle has a shorter side length than the quadrangle of the inner slit 544. In addition, the disconnected rectangle is preferably formed longer than the length of the side of the stamp pad 550. Accordingly, the inner slit 544 may vacuum-suck the inner region of the upper surface of the stamp pad 550, and the outer slit 545 may vacuum-suck the outer region of the upper surface of the stamp pad 550. Vacuum adsorption of the pad 550 can be achieved uniformly.

The stamp pad 550 is vacuum-adsorbed to the bottom surface of the bonding head 540 by pneumatic pressure generated in the pneumatic pores so that the stamp pad 550 is detachable from the bottom surface of the bonding head 540.

A plurality of device adhesion protrusions 551 protruding downward are formed on the bottom surface of the stamp pad 550. In this case, the device adhesive protrusions are protruding adhesive protrusions corresponding to the plurality of micro LED elements, respectively, to pick up the micro LED elements M temporarily attached to the carrier S at one time, and the adhesive protrusions protruding from the lower surface of the stamp pad 550. The protrusions correspond to the number, spacing, size and arrangement of the micro LEDs to be picked up.

The element adhesion protrusion 551 contacts the micro LED element M temporarily attached to the carrier S, thereby functioning to adsorb the micro LED element M. The adsorption force of the device adhesion protrusion 551 may be any one of electrostatic force, magnetic force, van der Waals force, and adhesive force. In the exemplary embodiment of the present invention, the stamp pad may pick up and bond the micro LED element M temporarily attached to the carrier S at one time, but may also perform bonding two or three times as necessary. .

The bonding vision 560 is provided at each side of the bonding picker 500, that is, the first and second bonding pickers 500a and 500b, and the alignment of the carriers S loaded on the micro LED device isolation unit 400 is performed. It checks the state or checks the area to be bonded to the PCB (P).

The bonding vision 560 included in the first bonding picker 500a is mounted on the first substrate marking unit and the first micro LED device isolation unit 400a provided on the upper surface of the first micro LED device isolation unit 400a. By imaging and inspecting the position of the carrier S, the alignment state of the carrier S loaded in the first micro LED element isolation unit 400a is inspected.

The bonding vision 560 included in the second bonding picker 500b is mounted on the second substrate marking part and the second micro LED device separating part 400b provided on the upper surface of the second micro LED device separating part 400b. By imaging and inspecting the position of the carrier S, the alignment state of the carrier S mounted in the 2nd micro LED element isolation | separation part 400b is examined.

In addition, the bonding vision 560 examines the bonding surface of the PCB (P) mounted on the PCB stage 200 to inspect the position where the micro LED device M is to be bonded, or the PCB loaded on the PCB stage 200 ( The bonding position of the micro LED element M bonded to P) may be checked.

The bonding vision 560 provided in the first bonding picker 500a may inspect a bonding surface of the PCB P mounted on the first PCB stage 200a to inspect a position where the micro LED device M is to be bonded, or The bonding position of the micro LED element M bonded to the PCB P loaded on the 1 PCB stage 200a is inspected.

The bonding vision 560 provided in the second bonding picker 500b may inspect a bonding surface of the PCB P mounted on the second PCB stage 200b to inspect a position at which the micro LED device M is to be bonded. The bonding position of the micro LED element M bonded to the PCB P loaded on the 2PCB stage 200b is examined.

The controller controls alignment state data of the carrier S of the micro LED device isolation unit 400 obtained through the bonding vision 560 provided in the first and second bonding pickers 500a and 500b, that is, the first and second micro LEDs. The pickup positions of the bonding pickers 500, that is, the first and second bonding pickers 500a and 500b are controlled based on the alignment state data of the carriers S of the device isolation units 400a and 400b.

The uplooking vision 600 is provided between the micro LED device isolation unit 400 and the PCB stage 200 to inspect the position of the device adhesion protrusion formed on the stamp pad mounted below the bonding head, or the bonding picker 500. The alignment state of the micro LED element M picked up is checked.

The uplooking vision 600 is provided between the first micro LED device isolation unit 400a and the first PCB stage 200a to inspect the position of the device adhesion protrusion formed on the stamp pad of the first bonding picker, or the first bonding picker. It is provided between the first up-looking vision 600a for inspecting the alignment state of the micro LED element M picked up to the 500a, and between the second micro LED element isolation unit 400b and the second PCB stage 200b. The second up-looking vision 600b may be used to examine the position of the device adhesive protrusion formed on the stamp pad of the two-bonding picker or to check the alignment state of the micro LED device M picked up by the second bonding picker 500b. have.

The controller controls the first and second bonding pickers based on the alignment state data of the micro LED elements M picked up through the first and second bonding pickers 500a and 500b obtained through the first and second up-looking visions 600a and 600b. The first and second bonding pickers 500a and 500b are controlled to correct the bonding positions of the 500a and 500b.

The uplooking vision 600 may inspect the state of the stamp pad 550 and / or the device adhesion protrusion 551 before the bonding picker 500 picks up the micro LED device M, and the control unit may check the result. According to the bonding picker 500 to move the cleaner unit 800 to remove the foreign matter of the stamp pad 550, or to move the bonding picker 500 to the stamp replacement unit 910 to replace the stamp pad 550 Can be.

The first uplooking vision 600a may include the first bonding picker 500a before the first bonding picker 500a picks up the micro LED element M of the carrier S loaded on the first micro LED element isolation unit 400a. 500a) The state of the stamp pad 550 and / or the element bonding protrusion 551 may be inspected. If the foreign matter is stuck on the stamp pad 550 of the first bonding picker 500a that is inspected through the first up-looking vision 600a, the controller may move the first bonding picker 500a to the first cleaner part 800a. Transfer to the control to remove the foreign matter on the stamp pad (550). If the device adhesive protrusion 551 of the stamp pad 550 of the first bonding picker 500a inspected through the first up-looking vision 600a is worn or damaged, the controller may control the first bonding picker 500a. Move to the stamp replacement unit 910 and controls to replace the stamp pad 550.

The second up-looking vision 600b may include a second bonding picker 500b before the second bonding picker 500b picks up the micro LED device M of the carrier S loaded on the second micro LED device isolation unit 400b. 500b) the state of the stamp pad 550 and / or the element bonding protrusion 551 may be inspected. If the foreign matter is stuck on the stamp pad 550 of the second bonding picker 500b that is inspected through the first up-looking vision 600b, the controller may control the second bonding picker 500b to the second cleaner part 800b. Transfer to the control to remove the foreign matter on the stamp pad (550). If the device adhesive protrusion 551 of the stamp pad 550 of the second bonding picker 500b inspected through the second uplooking vision 600b is worn or damaged, the controller may control the second bonding picker 500b. Move to the stamp replacement unit 910 and controls to replace the stamp pad 550.

As described above, the uplooking vision 600 inspects the state of the stamp pad 550 and / or the device adhesion protrusion 551 before the bonding picker 500 picks up the micro LED device M, and according to the result. By replacing the stamp pad of the bonding picker 500, the controller may maintain the adhesive force of the bonding picker 500 well.

Carrier recovery picker 700 X to collect all the micro LED element (M) of the carrier (S) loaded on the micro LED element isolator 400 to recover the empty carrier (S) without the micro LED element (M) It is installed to be movable in the axial direction.

The carrier recovery picker 700 includes a first carrier recovery picker 700a that recovers a carrier S from which all of the micro LED elements M are picked up among the carriers S loaded in the first micro LED element separation unit 400a. ) And a second carrier recovery picker 700b that recovers the carrier S from which all of the micro LED elements M are picked up among the carriers S loaded on the second micro LED element isolation unit 400b. .

Each of the first and second carrier pick-up pickers 700a and 700b is connected to a carrier pick-up picker body, a carrier pick-up picker moving part installed on the carrier pick-up picker body to be movable in the X-axis direction, and an end of the carrier pick-up picker moving part. And a carrier recovery picker head.

Each carrier recovery picker moving part of each of the first and second carrier recovery pickers 700a and 700b is installed on the carrier recovery picker body so as to be movable in the X-axis direction. Each of the carrier recovery picker heads is movable in the X-axis direction.

The carrier recovery picker heads of the first and second carrier recovery pickers 700a and 700b are provided with a plurality of substrate adhesion protrusions protruding downward from the bottom surface, similar to the carrier picker head 340 described above. Therefore, when the carrier recovery picker head also picks up the carrier S in which the micro LED elements M are all picked up, the carrier recovery picker head adsorbs the edge region of the edge of the carrier S in the same manner as the carrier picker.

As described above, the carrier S picked up by the first and second carrier recovery pickers 700a and 700b is transferred to a carrier recovery part (not shown) and loaded on the carrier recovery part.

The carrier recovery part includes a first carrier recovery part from which the carrier S picked up by the first carrier recovery picker 700a and a second carrier from which the carrier S picked up by the second carrier recovery picker 700b are recovered. It may be made of a carrier recovery unit.

The first carrier recovery unit may be disposed between the third guide frame 24 and the first micro LED device separation unit 400a, and the second carrier recovery unit may be the fourth guide frame 25 and the second micro LED device separation unit. It may be disposed between (400b).

Therefore, the first carrier pick-up picker 700a moves the carrier pick-up picker head in the X-axis direction, thereby picking up the carrier S from which all the micro LED elements M are picked up from the first micro LED element separating unit 400a. Thus, it can be recovered and loaded into the first carrier recovery unit.

In addition, the second carrier recovery picker 700b moves the carrier recovery picker head in the X-axis direction, so that the second carrier recovery picker 700b picks up the empty carrier S from which all the micro LED elements M are picked up by the second micro LED element separating unit 400b. It can pick up and collect | recover to a 2nd carrier collection part.

The cleaner unit 800 functions to remove foreign substances on the lower surface of the stamp pad 550 of the bonding picker 500 where the bonding of the micro LED device to the PCB is completed.

The cleaner 800 may include a first cleaner 800a for removing foreign substances on the lower surface of the stamp pad 550 of the first bonding picker 500a and a lower surface of the stamp pad 550 of the second bonding picker 500b. It may be made of a second cleaner portion (800b) for removing the foreign matter. The first and second cleaners 800a and 800b are disposed behind the second guide frame 22.

The first and second cleaner portions 800a and 800b may include a tape 810, a supply roller 820 for supplying the tape 810, a guide roller 830 for guiding the tape 810 to a clean stage, The adhesive pads of the tapes 810 supplied by the supply rollers 820 and the guide rollers 830 are supplied upward, and the stamp pads are mounted below the bonding heads 540 when the bonding heads 540 are lowered. It may be configured to include a clean stage 840 in contact with the 550 to remove the foreign matter of the stamp pad 550, and a recovery roller 850 for recovering the tape 810 used in the clean stage 840. .

In addition, the supply roller 820 and the recovery roller 850 may be detachably provided from the rotational drive motor shaft for rotating the roller so that the tape 810 can be easily replaced.

The tape 810 has an adhesive force on the upper surface to remove foreign substances on the lower surface of the stamp pad 550. One end of the tape 810 is connected to the supply roller 820 and wound around the guide roller 830 and the clean stage 840, and the other end is connected to the recovery roller 850. Accordingly, the tape 810 is placed on the upper surface of the clean stage 840 with its upper surface, that is, the adhesive surface exposed, and continuously supplied to the new tape 810 when the foreign matter removal of the stamp pad 550 is performed. The used tape 810 can be recovered.

The tape 810 is supplied to the upper surface of the clean stage 840 by the rotation of the supply roller 820, and the tape 810 which has been used by the rotation of the recovery roller 850 is recovered. In this case, the guide rollers 830 are provided on both sides of the clean stage 840, and serve to guide the tape 810 on the upper surface of the clean stage 840.

As described above, according to the rotation of the supply roller 810 and the recovery roller 850, a new tape 810 may be continuously supplied to the upper surface of the clean stage 840.

For reference, the cleaner 800 of the present invention may use a tape 810 to which a release film is adhered to protect the adhesive surface of the tape 810. In this case, in addition to the supply roller 820 and the recovery roller 850, the first and second cleaners 800a and 800b may further include a release film roller for recovering a release film protecting the adhesive surface of the tape 810. Can be.

When the stamp pad 550 of the first bonding picker 500a or the second bonding picker 500b descends to the upper surface of the clean stage 840, that is, moves in the Z-axis direction, the lower surface of the stamp pad 550 is tape ( 810 is in contact with the adhesive surface. Therefore, foreign matter on the lower surface of the stamp pad 550 may be removed by the adhesive force of the tape 810.

As described above, the foreign matter removed by the adhesive force of the tape 810 may be an adhesive applied to the bonding surface of the particle or PCB (P).

Since the adhesive is removed from the stamp pad 550 by the first and second cleaner portions 800a and 800b, when the micro LED device M is bonded to the PCB P, the PCB (at the stamp pad 550) is bonded to the PCB (P). The micro LED element M can be easily transferred onto P).

In the clean process using the first and second cleaner parts 800a and 800b, after bonding the micro LED device to the area to be bonded to the PCB, the stamp pad may be immediately moved to the cleaner part every time the bonding operation is completed. have. In addition, through the uplooking vision 600, that is, the first and second uplooking visions 600a and 600b, the stamp pad 550 may be inspected whether or not foreign matter is on the surface. In other words, when the foreign matter is deposited on the stamp pad 550 by the first and second up-looking visions 600a and 600b, the controller controls the first and second bonding pickers 500a and 500b to the first and second cleaners. By moving to the clean stage 840 of the portions 800a and 800b, foreign matter removal of the stamp pad 550 may be achieved.

As described above, when the cleaner unit 800 is provided in the bonding device 10 for the micro LED device, when a foreign matter occurs in the stamp pad 550, it can be easily removed, thereby, the adsorption force of the stamp pad 550. In addition to maintaining this high, adsorption errors caused by adhesive components remaining in the stamp pad 850 can be minimized.

Meanwhile, the stamp pad 550 of the present invention repeatedly picks up the micro LED element M, bonds the PCB P, and cleans the stamp pad 550, thereby causing the stamp pad 550 to be removed. A part of the device adhesion protrusion 551 provided in the wear or damage may be.

In this case, since the stamp pad 550 may have a problem in picking up the micro LED element M, it is necessary to replace the stamp pad 550 with a new stamp pad 550 when the use of the stamp pad 550 reaches a predetermined number of times.

To this end, a plurality of stamp pads 550 are stacked on the stack magazine in the stamp stack. The front side of the stamp stack portion is provided to be movable in the fifth guide frame 26 formed in the Y-axis direction. In this case, the supply of the stamp pad from the stamp stack section to the stamp replacement section 910 is performed by pushing the stamp pad 550 from the rear side to the front of the stamp pad 550. Transferred to the replacement part. On the other hand, the used stamp pad 550 releases the pneumatic pressure from the bonding head above the stamp replacement part 910 and puts it on the stamp replacement part 910 to move to the stamp stack part by the belt, and the empty stack magazine compartment by the gripper. Inject the stamp pad 550 used in the.

That is, first put the used stamp pad 550 in the stamp replacement unit 910 and put the stamp pad 550 used in the blank of the stack magazine, and then withdraw the new stamp pad 550 to be replaced from the stack magazine The stamp pad 550 of the bonding head 540 may be easily replaced by the pneumatic application and release of the bonding head 540.

The first and second calibration stages 920 and 930 check whether the first and second bonding pickers 500a and 500b move to a target position value, and then pick up the pickup position information of the first and second bonding pickers 500a and 500b. It is the initial setting and setting function.

The first calibration stage 920 is disposed between the first and second micro LED device isolation units 400a and 400b, and the second calibration stage 930 is located behind the first calibration stage 920.

In the second calibration stage 930, a plurality of physical marks are formed at an upper portion of the calibration zone for checking a position.

The calibration jig to be placed on the second calibration stage 930 is loaded on the upper surface of the first calibration stage 920. The calibration jig is made of a transparent material so as to calculate a relative position on the second calibration stage 930. Since it is a time reference, it is made of a glass material which has a strong change in the external environment and hardly deforms heat, as well as a physical mark formed on the calibration jig so that the relative position from the second calibration stage 930 can be calculated. .

The calibration method may be performed for initial setting prior to driving the equipment, or to check the position setting during the driving of the equipment. The calibration jig may be picked up by the first bonding picker 500a or the second bonding picker 500b to obtain a second calibration jig. By loading the calibration stage 930, inspecting the calibration jig on the second calibration stage 930 with the bonding vision provided in the bonding picker, modifying the position value setting of the picker, and repeating the inspection with the modified value again. The so-called calibration operation of setting the pickup position of the first bonding picker 500a or the second bonding picker 500b is performed.

Hereinafter, a process of bonding the micro LED device M to the PCB P through the micro LED device bonding apparatus 10 according to the preferred embodiment of the present invention having the above-described configuration will be described.

First, the tray pallet T on which the carrier S is loaded is moved to the X-axis direction, that is, to the right in FIG. 1 to move to the first substrate pickup position in front of the second micro LED device isolation unit 400b.

When the pallet 100 is located at the first substrate pick-up position, as shown in FIGS. 2A to 3B, the carrier picker head 340 of the second carrier picker 300b is lowered in the Z-axis direction, thereby adsorbing the substrate adsorption protrusion. 341 picks up the carrier S by adsorb | sucking the unbonded area | region of the edge of the carrier S. As shown in FIG. The picked up carrier S is loaded on the second micro LED device separating unit 400b by releasing the attraction force after the carrier picker moving unit 320 moves the carrier picker head 340 in the Y-axis direction.

When the second carrier picker 300b picks up the carrier S from the pallet 100, the pallet 100 moves in the X-axis direction, that is, to the left in FIG. 1 to the front of the first micro LED device separating unit 400a. Is moved to the second substrate pickup position.

When the pallet 100 is positioned at the second substrate pick-up position, the carrier picker head 340 of the second carrier picker 300b is lowered in the Z-axis direction so that the substrate adsorption protrusion 341 is positioned at the edge of the carrier S. FIG. The non-bonded region is adsorbed to pick up the carrier S. The picked-up carrier S is loaded on the first micro LED device separating unit 400a by releasing the attraction force after the carrier picker moving unit 320 moves the carrier picker head 340 in the Y-axis direction.

As described above, the pickup of the carrier S by the second carrier picker 300b and the pickup of the carrier S by the first carrier picker 300a may be alternately performed.

In other words, the pallet 100 reciprocates along the X-axis direction to the first substrate pick-up position and the second substrate pick-up position in order to transfer the carrier picker among the plurality of carriers S accommodated in the pallet 100. The 2, 1 carrier pickers 300b and 300a pick up the carrier S each time the pallet 100 is located at each pickup position and load the carriers S into the second and 1 micro LED element separation units 400b and 400a, respectively. .

That is, when the pallet 100 reciprocates in the X-axis direction, the second and first carrier pickers 300b and 300a pick up the carriers S loaded on the pallet 100 one by one to separate the second and one micro LED elements. It loads in each of parts 400b and 400a.

When the carrier S is transferred to each of the second and first micro LED device isolation units 400b and 400a, a bonding process by the second and first bonding pickers 500b and 500a is performed.

First, a second PCB (P) loaded with a micro LED device (M) of the carrier (S) transferred to the second micro LED device isolation unit (400b) through the second bonding picker (500b) to the second PCB stage (200b). Will be described.

The second bonding picker 500b is provided to be movable in the X-axis direction and the Y-axis direction, and the micro LED device is a second bonding vision provided in the second bonding picker while the carrier picker transfers the carrier to the micro LED device isolation unit. After obtaining the bonding position information of the PCB to be bonded, it moves to the upper portion of the second up-looking vision (600b) to inspect the position information of the projection formed on the stamp pad mounted on the bonding head lower. Thereafter, the second bonding picker is moved to the upper portion of the second micro LED device isolation unit 400b.

In the bonding vision 560 of the second bonding picker 500a, the alignment state of the carrier S loaded on the second micro LED device isolation unit 400b is determined by checking the positions of the second substrate marking unit and the carrier S. FIG. Check it.

The control unit controls to correct the pickup position of the second bonding picker 500b based on the alignment state data of the carrier S of the second micro LED device isolation unit 400b obtained through the bonding vision 560.

For example, when the carrier S loaded in the second micro LED device isolation unit 400b is stacked 5 占 퐉 to the right with respect to the second substrate marking unit, the controller controls the pickup position of the second bonding picker 500b to the right. By 5 µm correction, the stamp pad 550 of the second bonding picker 500b can pick up the micro LED element M in position.

Through the correction, the second bonding picker 500b that has picked up all of the micro LED elements M of the carrier S loaded on the second micro LED element isolation unit 400b is a PCB mounted on the second PCB stage 200b. After moving to the bonding position of (P), the bonding head 540 is lowered in the Z-axis direction, thereby bonding the micro LED element M to the PCB P mounted on the second PCB stage 200b. At this time, the second PCB stage 200b is moved to the rear position of the second micro LED device isolation unit 400b, that is, to the first bonding position.

Inspection of the bonding position and the bonding surface may be made through the bonding vision 560, as described above.

If there is an error in the position alignment of the micro LED element M adsorbed to the stamp pad 550, the control unit is based on the alignment state data of the micro LED element M obtained by the second uplooking vision 600b. The second bonding picker 500b may be controlled to correct the bonding position of the bonding picker 500b.

When all of the micro LED elements M of the carrier S loaded on the tray pallet T by the second bonding picker 500b are bonded to the PCB P, the second PCB stage 200b is in the X-axis direction, that is, By moving to the right in Figure 1, it is recovered to the PCB recovery box.

In addition, when all of the micro LED device M is picked up from the carrier S loaded in the second micro LED device separating unit 400b, the second carrier recovery picker 700b picks up the carrier S to make the first carrier. Pick up to 2 carrier collecting section to collect. Therefore, the carrier S may be continuously transferred to the second micro LED device isolation unit 400b through the second carrier picker 300b.

Hereinafter, the micro LED device M of the carrier S loaded on the second micro LED device isolation unit 400b through the second bonding picker 500b is placed on the PCB P loaded on the second PCB stage 200b. The bonding process will be described.

The second bonding picker 500b moves in the X-axis direction and the Y-axis direction, and moves to the upper portion of the second micro LED device isolation unit 400b.

In the bonding vision 560 of the second bonding picker 500b, the alignment state of the carrier S loaded on the second micro LED device isolation unit 400b is determined by checking the positions of the second substrate marking unit and the carrier S. FIG. Check it.

The controller corrects the pickup position of the second bonding picker 500b based on the alignment state data of the carrier S of the second micro LED device isolation unit 400b obtained through the bonding vision 560.

Through the correction, the second bonding picker 500b that has picked up all of the micro LED elements M of the carrier S loaded on the second micro LED element isolation unit 400b is loaded on the second PCB stage 200b. After moving to the bonding position of 2 PCB (P), the bonding head 540 is lowered in the Z-axis direction, thereby bonding the micro LED element M to the second PCB P mounted on the second PCB stage 200b. At this time, the second PCB stage 200b is moved to the rear position of the second micro LED device isolation unit 400b, that is, to the second bonding position.

Inspection of the bonding position and the bonding surface may be made through the bonding vision 560, as described above.

If there is an error in the position alignment of the micro LED element M adsorbed to the stamp pad 550, the control unit is based on the alignment state data of the micro LED element M obtained by the second uplooking vision 600b. The second bonding picker 500b may be controlled to correct the bonding position of the bonding picker 500b.

When all of the micro LED elements M of the carrier S loaded on the tray pallet T by the second bonding picker 500b are bonded to the second PCB P, the second PCB stage 200b is in the X-axis direction, That is, by moving to the right in FIG. 1, it is carried out to the PCB collection box.

In addition, when all of the micro LED device M is picked up from the carrier S loaded in the second micro LED device separating unit 400b, the second carrier recovery picker 700b picks up the carrier S to make the first carrier. 2 Carrier recovery section. Therefore, the carrier S may be continuously transferred to the second micro LED device isolation unit 400b through the second carrier picker 300b.

As described above, the micro LED device bonding apparatus 10 according to the preferred embodiment of the present invention, the micro LED device (M) through each of the pair of bonding process, that is, the first and second bonding process unit Bonding is done independently of the PCB.

The first bonding process unit may include a first carrier picker 300a, a first micro LED device isolation unit 400a, a first uplooking vision 600a, and a first PCB stage 200a. The process unit may include a second carrier picker 300b, a second micro LED device isolation unit 400b, a second uplooking vision 600b, and a second PCB stage 200b.

In the first bonding process unit, the first carrier picker 300a picks up the carrier S from the pallet 100 at the first pick-up position and transfers the carrier S to the first micro LED device separating unit 400a and the first bonding. The picker 500a picks up only the micro LED element M from the first micro LED element isolation unit 400a and bonds it to the first PCB P placed on the first PCB stage 200a at the first bonding position. Is performed. In this case, the pick-up position or the bonding position of the first bonding picker 500a may be controlled through the first up-looking vision 600a, the bonding vision 560 of the first bonding picker 500a, and the controller.

In the second bonding process unit, the second carrier picker 300b picks up the carrier S from the pallet 100 at the second pick-up position and transfers the carrier S to the second micro LED element separating unit 400b and the second bonding. The picker 500b picks up only the micro LED element M from the second micro LED element isolation unit 400b and bonds it to the second PCB P placed on the second PCB stage 200b at the second bonding position. Is performed. In this case, the pickup position or the bonding position of the second bonding picker 500b may be controlled through the second uplooking vision 600b, the bonding vision 560 of the second bonding picker 500b, and the controller.

As described above, in the bonding apparatus 10 of the micro LED device of the present invention, the second carrier picker 300b may be transported from the pallet 100 so that the bonding operation may be carried out in the second bonding process unit first. Picking up (S) and delivering it to the second micro LED device isolation unit 400b, the second bonding picker 500b is transferred to the second micro LED device isolation unit 400b from carrier S to the second micro LED. Only the element may be adsorbed and bonded to the bonding region of the second PCB.

In addition, in the embodiment of the present invention, each PCB (P) is separated from each of a plurality of second micro LED elements (M) from six carriers six times, and then performing a bonding operation, the bonding can be taken out when completed. However, the number and bonding times of the micro LED elements M bonded to one PCB P according to the type of the PCB P and the micro LED elements M may vary, and are accommodated in the pallet 100. The number of carriers S and the number of micro LED elements M accommodated in the carrier S may also vary.

As described above, as the micro LED device bonding apparatus 10 includes the first and second bonding process units, the pickup and the bonding process are independently performed, so that the micro LED device M may be more efficiently bonded. There is this.

In addition, since the positions of the micro LED device isolation unit 400, that is, the first and second micro LED device isolation units 400a and 400b are fixed, the occurrence of a position error of the micro LED device M may be significantly reduced. . To this end, the carrier picker 300 coaxially disposed in the Y-axis direction with the micro LED device isolation unit 400 is disposed to deliver the carrier S to the micro LED device isolation unit 400, and the carrier picker 300 is disposed. ) May be provided to be transported only in the Y-axis direction at a fixed position to transfer the carrier S to a fixed position of the micro LED device isolation unit 400.

In detail, when the bonding picker 500 without the micro LED device isolation unit 400 picks up the micro LED device M directly from the pallet 100 and bonds it to the PCB P, There is a risk of error in position alignment each time with movement. In addition, since the bonding areas are performed in two places, it is difficult to ensure positional stability because the pallet 100 must be reciprocated repeatedly during the bonding process in order to deliver the micro LED elements M to each bonding area. In particular, as described above, in the handling of the LED unit M in micro units, since a minute position error may act as an error corresponding to a product defect, thousands to tens of thousands of micro LED elements in one carrier S ( It is very important to secure the precision of M).

Therefore, as shown in the present invention, the micro LED device isolation unit 400 having a fixed position is provided, and after the carrier S is transferred to the micro LED device isolation unit 400, the carrier S is again in the carrier S. By picking up and transferring the micro LED device M, it is possible to reduce the occurrence of errors in the alignment of the position according to the movement of the pallet (100). That is, since the position of the micro LED device isolation unit 400 is fixed, the bonding picker 500 changes the position of the pallet 100 (the pallet 100 moves back and forth between the first pick-up position and the second pick-up position). Since the position changes continuously, it is not necessary to compensate for this.

In addition, after obtaining the position information on the bonding area of the PCB (P) to the bonding vision 560 for accurate bonding and mounting, the device adhesive projection of the stamp pad 550 to be picked up to the uplooking vision 600 ( 551 detects the position and detects the position of the micro LED element M to be picked up from the carrier S by the bonding vision 560, and the alignment state adsorbed to the stamp pad 550 by the uplooking vision 600 before bonding. By checking and mounting again, it is possible to mount the micro LED device (M) in the correct position of the PCB (P).

Therefore, the bonding device 10 for the micro LED device of the present invention can be accurately bonded to the micro LED device (M), through which, the micro LED device (M) of the bad PCB (P) bonded in the wrong position It can lower the occurrence.

Hereinafter, a process of replacing the stamp pad 550 of the first bonding picker 500a or the second bonding picker 500b through the stamp replacement unit 910 will be described.

When a new stamp pad 550 is supplied through the picker head pusher 911, the stamp pad 550 is loaded into the stamp replacement unit 910. The stamp replacement unit 910 is moved to the picker head replacement position along the Y-axis direction. In this case, the picker head replacement position may be between the clean stages 840 of the first and second cleaner parts 800a and 800b and the rear of the second guide frame 22, as shown in FIG. 1.

Since the stamp pad 550 adsorbed to the bonding head 540 is made of a consumable product, it picks up the micro LED element M, and the micro LED element M picked up by the stamp pad 550 to the PCB P. In the case of repeatedly performing the step of bonding and cleaning the bonded stamp pad 550 by contacting the tape 810, thousands of tens of thousands of element adhesive protrusions 551 formed on the lower surface of the stamp pad 550 may be worn or It can be damaged. Therefore, when the number of times of use of the stamp pad 550 reaches a predetermined number of times during each bonding operation, it is preferable to replace with a new stamp pad 550.

In addition, in addition, the device adhesive protrusion 551 of the stamp pad 550 adsorbed to the bonding head 540 of the first bonding picker 500a through the first up-looking vision 600a may be worn or damaged in accordance with long-term use. Or the device adhesive protrusion 551 of the stamp pad 550 adsorbed to the bonding head 540 of the second bonding picker 500b through the second up-looking vision 600b is worn or damaged with prolonged use. If it is checked, the first bonding picker 500a or the second bonding picker 500b releases the pneumatic pressure of the bonding head 540 to separate the stamp pad 550 vacuum-adsorbed to the lower surface of the bonding head 540. It can also be replaced.

Thereafter, the first bonding picker 500a or the second bonding picker 500b moves to the stamp replacing unit 910, and a new stamp pad supplied to the stamp replacing unit 910 through the pneumatic pressure of the bonding head 540. The stamp pad 550 is replaced by picking up 550 by vacuum suction. In this case, the micro-LED device bonding apparatus 10 may be configured to further include a recovery box (not shown) for recovering the separated stamp pad 550, one side of the stamp stack portion in which a plurality of unused stamp pads are stacked. It can also be recovered separately.

By the above method, the bonding picker 500, that is, the first and second bonding pickers 500a and 500b of the micro LED device bonding apparatus 10 can be easily replaced by the stamp pad 550 through pneumatic connection and release. It is possible. Therefore, when the stamp pad 550 wears or breaks in the device adhesive protrusion 511 of the stamp pad 550 according to a long term use, the stamp pad 550 can be easily replaced, and thus, the micro LED The adsorption force which adsorbs the element M can be kept high. As such, by maintaining the adsorption force of the stamp pad 550, it is possible to prevent the micro LED element M from being picked up properly, thereby preventing the occurrence of a defective area and a pickup error of the micro LED element M in the PCB P. .

When the micro LED element M bonded in the above-described micro LED element bonding apparatus 10 of the present invention is a micro LED, as illustrated in FIG. 6, a plurality of micro LED element bonding apparatuses 10 are sequentially connected and arranged. It is also possible to construct a bonding system 1 for one micro LED element.

That is, another micro LED device bonding system 1 of the present invention is provided with a plurality of the above-described micro LED device bonding device 10 is arranged side by side, different from each of the micro LED device bonding device (10) The micro LED element M of color can be bonded. That is, by continuously bonding LEDs of different colors bonded by respective bonding apparatuses to one PCB P, a PCB P of all pixels emitting pixels of different colors may be formed on the PCB P. .

6 is a plan view of a bonding system for a micro LED device in which a bonding device for a micro LED device according to an exemplary embodiment of the present invention is sequentially arranged.

The micro LED element M used in the bonding system 1 for the micro LED element is a carrier for bonding the micro LED element M to R, G, B, i.e., one subpixel unit on the PCB P. The micro LED element M seated in (S) may be seated to have a pitch interval of three times the existing pitch interval.

For example, when the distance between the existing micro LED element (M) is 10㎛, and the width of the micro LED element (M) is 100㎛, micro LED element (M) used in the bonding system (1) for micro LED element The pitch interval therebetween may be 330 µm (10 µm + 100 µm + 10 µm + 100 µm + 10 µm + 100 µm).

The micro LED element M bonded in the first micro LED element bonding apparatus 10 of FIG. 6 is 'R', that is, the red light micro LED element M, and the second micro LED element bonding apparatus 10 is bonded. The micro LED element M is 'G', that is, the green light micro LED element M, and the micro LED element M bonded in the third micro LED element bonding apparatus 10 is 'B', that is, blue light. It may be a micro LED device (M).

Only the red light micro LED element R exists in the PCB (P) where the bonding process is completed in the first micro LED element bonding apparatus 10, and the PCB (P) in which the bonding process is completed in the second micro LED element bonding apparatus 10. There is a red light micro LED device (R) and green light micro LED device (G), the PCB (P), the bonding process is completed in the bonding apparatus 10 for the third micro LED device, red light micro LED device (R), green light micro Both LED element G and blue light micro LED element B are present. Through this, all of the R, G, B in the PCB (P) can be implemented to function as a display device.

Of course, in the present invention, the bonding to the PCB in the order of R, G, B has been described as an example, the mounting order of each color LED may be different.

As described above, the bonding system 1 for the micro LED device requires one PCB (P) to go through all three bonding processes of the three micro LED device bonding apparatuses. It is preferable that the two guide frame 22 is connected to one guide frame.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art various modifications of the present invention without departing from the spirit and scope of the invention described in the claims below. Or it may be modified.

1: Bonding System for Micro LED Devices
10: bonding device for micro LED device
21: first guide frame `22: belt
24: 3rd guide frame `25: 4th guide frame
26: fifth guide frame
100: pallet
200: PCB stage 200a: first PCB stage
200b: second PCB stage
300: carrier picker 300a: first carrier picker
300b: second carrier picker 310: carrier picker body
320: carrier picker moving part 330: end
340: carrier picker head 341: substrate adhesion projection
400: micro LED device isolation unit 400a: first micro LED device isolation unit
400b: second micro LED device isolation unit
500: Bonding Picker 500a: First Bonding Picker
500b: second bonding picker 510: bonding picker body
520: first moving unit 530: second moving unit
540: bonding head 541: slit
542: pneumatic flow path 543: pneumatic hose
544: inner slit 545: outer slit
550: stamp pad 551: element bonding projection
560: bonding vision
600: Uplooking Vision 600a: First Uplooking Vision
600b: second uplooking vision
700: carrier recovery picker 700a: first carrier recovery picker
700b: second carrier recovery picker
800: cleaner portion 800a: first cleaner portion
800b: second cleaner part 810: tape
820: supply roller 830: guide roller
840 clean stage 850 recovery roller
910: stamp replacement 911: picker head pusher
920: first calibration stage 930: second calibration stage
T: Tray Pallet S: Carrier
M: micro LED element P: PCB

Claims (10)

A micro LED device bonding apparatus for bonding a plurality of micro LED device mounted on a carrier to a PCB,
A tray pallet configured to accommodate a plurality of carriers to which a plurality of micro LED elements are temporarily bonded;
A carrier picker that picks up one carrier from the tray pallet and transfers the carrier to a micro LED device separator;
A bonding head having a stamp pad detachably mounted at a lower portion to pick up a plurality of micro LED elements from a carrier transferred to the micro LED element separating unit and to bond the PCB to the PCB; and a micro LED provided at one side of the bonding head; A bonding picker including a bonding vision for obtaining position information of the micro LED device and position information of a region to be bonded on the PCB, the bonding picker being movable in the X-axis and Y-axis directions;
A carrier recovery picker for recovering empty carriers on the micro LED device separator after the micro LED device is separated from the carrier by the bonding head;
An uplooking vision fixed to a lower portion between the micro LED device isolation unit and the PCB stage and configured to acquire position information of the micro LED device picked up by the bonding picker;
A PCB stage to which the micro LED device is bonded according to the position information obtained by the uplooking vision and the position information on the region to be bonded to the PCB; And
Includes; a cleaner unit for cleaning the stamp pad is completed bonding;
The carrier picker, micro LED device separation unit, bonding picker, carrier recovery picker, up-looking vision, PCB stage, the cleaner unit pairs, are provided on both sides symmetrically in the Y-axis direction,
In order to transfer the carriers accommodated in the tray pallets to the respective carrier pickers provided at both sides, the tray pallets are provided to reciprocate in the X-axis direction,
In order to transfer the carrier received from the tray pallet to the micro LED device separator, the carrier picker is provided to be transportable in the Y-axis direction, and the carrier picker and the micro LED device separator are any parallel to the Y-axis direction. Bonding device for a micro LED device, characterized in that the coaxial fixed arrangement. The method of claim 1,
The PCB provided in the PCB stage is supplied in one direction and taken out in the other direction,
The carrier supplied from the tray pallet is first delivered to the carrier picker provided in the Y-axis region located on the side in which the PCB is taken out, and bonding is performed, and the bonding work is first finished on the PCB located in the side in which the PCB is taken out. Bonding device for a micro LED device, characterized in that carried out. The method of claim 1,
And a protruding adhesive protrusion corresponding to each of the plurality of micro LED elements in order to pick up the plurality of micro LED elements mounted on the carrier at a time on the lower surface of the stamp pad. The method of claim 1,
A stamp stack unit in which a plurality of stamp pads are stacked;
A gripper for pushing the used stamp pad detached from the lower portion of the bonding head to the stamp stack;
A stamp pusher for drawing out a new stamp pad to be replaced from the stamp stack;
The used stamp pad or a new stamp pad to be replaced is placed, and further comprises a stamp replacement portion, the stamp pad of the bonding head is replaced,
The bonding head may be replaced with a new stamp pad by pneumatic connection and release from the stamp replacement unit for micro LED device bonding device. The method of claim 1,
The bonding head includes a pneumatic supply unit for supplying pneumatic pressure; And a pneumatic flow path connected to the pneumatic supply part,
A plurality of slits communicating with the pneumatic flow path is formed on the bottom of the bonding head so that the stamp pad is attached to and detached from the lower portion of the bonding head by the pneumatic pressure of the pneumatic supply portion. The method of claim 1,
And the carrier picker and the carrier recovery picker vacuum suction an edge region, which is a non-adhesive region of the micro LED element, on the carrier. The method of claim 1,
The cleaner unit,
A feed roller for supplying a tape;
A clean stage in which the adhesive surface of the tape supplied by the feed roller is supplied upward, and the foreign matter of the stamp pad is removed by contacting the stamp pad mounted at the lower end of the bonding head when the bonding head is lowered; And
It includes a recovery roller for recovering the tape used in the clean stage,
The supply roller and the recovery roller is a micro LED device for bonding device characterized in that it is provided detachably. A plurality of micro LED device bonding apparatuses according to any one of claims 1 to 7 are arranged side by side, and each micro LED device bonding apparatus bonds micro LED elements of different colors to one PCB. Bonding system for a micro LED device, characterized in that the micro LED device of different colors bonded in each bonding device is continuously bonded. A bonding method for a micro LED device bonding a plurality of micro LED devices mounted on a carrier to a PCB,
Sequentially supplying carriers accommodated in the tray pallets to respective carrier pickers provided at both sides while the tray pallets receiving the plurality of carriers mounted with the plurality of micro LED elements are reciprocated in the X-axis direction;
Picking up a carrier of one of the plurality of carriers by the carrier picker and transferring the carrier picker to a micro LED device separator fixedly disposed at any coaxial parallel to the carrier picker in a Y-axis direction;
Bonding vision provided on one side of the bonding head is used to obtain bonding position information on the area to be bonded to the PCB, and to stamp pads mounted below the bonding head to pick up the micro LED elements from the carriers transferred to the micro LED element separator. Inspecting the location information of the formed adhesive protrusion with an uplooking vision;
Inspect the alignment state of the micro LED element transmitted to the micro LED element separation unit by bonding vision, and the adhesive protrusion of the stamp pad based on the position information of the adhesive protrusion formed on the stamp pad and the alignment state of the micro LED element. Picking up each micro LED element into a furnace;
Transferring the bonding head to an upper portion of an uplooking vision and inspecting a pickup state of the micro LED element picked up by the stamp pad;
Transferring the micro LED element picked up by the stamp pad to an upper portion of the first PCB or the second PCB, and bonding the micro LED element to a bonding position of the first PCB or the second PCB according to the pickup state inspection result; And
Cleaning the stamp pad of the bonding head in which the bonding is completed by a cleaner;
The first PCB or the second PCB is supplied in one direction and taken out in the other direction,
The carrier supplied from the tray pallet is first delivered to the carrier picker provided in the Y-axis region located on the side in which the PCB is taken out, and bonding is performed, and the bonding work is first finished on the PCB located in the side in which the PCB is taken out. Bonding method for a micro LED device, characterized in that the carried out. The method of claim 9,
The stamp pad of the bonding head is detachably provided by pneumatically under the bonding head,
The stamp pad of the bonding head further comprises the step of picking up the micro LED element, the step of bonding and the cleaning of the stamp when the predetermined number of times to replace the new stamp pad for a micro LED element Bonding method.

Images