KR20190088785A - Sawing Apparatus of Semiconductor Materials - Google Patents

Abstract

The present invention relates to a semiconductor material cutting apparatus, which cuts a semiconductor strip into an individual semiconductor package, and specifically, to a semiconductor cutting apparatus, which is possible to mount and align semiconductor strips having various sizes without replacement of an adsorption plate of a loading unit of a semiconductor material cutting apparatus.

Description

[0001] Sawing Apparatus of Semiconductor Materials [0002]

The present invention relates to a semiconductor material cutting apparatus for cutting semiconductor strips into individual semiconductor packages.

The semiconductor material cutting device is a device for cutting packaged semiconductor strip into individual semiconductor packages.

In addition to the function of simply cutting the semiconductor strip, the semiconductor material cutting apparatus performs a cutting process, a cleaning process and a drying process of the semiconductor strip, and then checks the top and bottom surfaces of the cut semiconductor package to sort the semiconductor package Of the process.

A patent for such a semiconductor material cutting apparatus is disclosed in Korean Patent Laid-Open No. 10-2017-0026751 (hereinafter referred to as "Patent Document 1").

The semiconductor strip cutting and aligning apparatus disclosed in Patent Document 1 includes an on-loader section provided with a semiconductor strip in a state of being drawn into a magazine, an inlet rail on which the drawn semiconductor strip is placed, A chip picker for picking up the semiconductor chips, a strip picker for picking up and delivering the semiconductor chips to the chuck table, a semiconductor strip supplied by the strip picker to cut into a plurality of semiconductor packages on the chuck table, a plurality of semiconductor packages vacuum- A drying unit for drying the semiconductor package transferred by the unit picker, a vision unit for inspecting the semiconductor package, and a cleaning unit for cleaning the semiconductor package, And a sorting device for sorting and storing the semiconductor packages.

In the semiconductor material cutting apparatus such as Patent Document 1, if the type of the semiconductor strip to be processed is changed, the plates for vacuum adsorption of the semiconductor strip or the semiconductor package must be changed each time. Particularly, in order to place semiconductor strips of different sizes each time on the inlet rail, there is a problem that the adsorption plate for vacuum-adsorbing the semiconductor strip between the inlet rails must be individually replaced according to the size of the semiconductor strip.

On the other hand, when an error occurs in the position of the semiconductor strip that is seated in the inlet rail, an error may occur in cutting at the cutout portion, so the position of the semiconductor strip to be placed on the inlet rail must be set very precisely. Therefore, every time the adsorption plate is exchanged, the fixing width of the inlet rail and the replacement position of the adsorption plate must be set precisely each time, which results in a problem that the efficiency of cutting the semiconductor strip is inferior.

In addition, in the conventional semiconductor material cutting apparatus, in order to inspect semiconductor strips, a fiducial mark for photographing in one FOV together with a reference mark formed on a semiconductor strip Replacement of the formed alignment block, strip sensor, and so on. Therefore, it is inconvenient that the number of setting and assembling operations required to adjust the precision in such a replacement operation is large.

Korean Patent Publication No. 10-2017-0026751

 SUMMARY OF THE INVENTION The present invention is conceived to solve the above-described problems, and it is an object of the present invention to provide a method and apparatus for mounting and aligning semiconductor strips of various sizes without replacing a suction plate of a semiconductor material cutting apparatus, So that the inspection accuracy can be improved while accommodating the semiconductor strip regardless of the size of the semiconductor strip.

A semiconductor material cutting apparatus according to an aspect of the present invention includes: a magazine in which a plurality of semiconductor strips are stacked, respectively; A pair of inlet rails guiding the semiconductor strips drawn out from the magazine and provided so as to be respectively transportable in the Y axis direction; An adsorption plate provided on the inside of the inlet rail for receiving a semiconductor strip supplied from the magazine; A strip picker which is movable in the X axis direction by adsorbing the semiconductor strip which is seated on the adsorption plate and has a strip vision for inspecting the semiconductor strip on one side; A chuck table which is provided with a semiconductor strip that is attracted to the strip picker, is movable in the Y-axis direction and is rotatable in the? Direction; And a cutting portion for cutting the semiconductor strip transferred to the chuck table into a separate semiconductor package, wherein the adsorption plate has a first adsorption region for adsorbing the semiconductor strip at an inner upper portion of the adsorption plate, and a second adsorption region for adsorbing the semiconductor strip to the outside of the adsorption plate And a second adsorption region for adsorbing the semiconductor strip at an upper portion thereof. The pneumatic pressure applied to the first adsorption region and the second adsorption region is selectively controlled according to the size of the semiconductor strip.

According to the size of the semiconductor strip supplied to the adsorption plate, air pressure is applied only to the first adsorption region, or air pressure is applied to both the first adsorption region and the second adsorption region.

The first and second flow paths may include first and second flow paths for applying a pneumatic pressure to the first adsorption region and third and fourth flow paths for applying air pressure to the second adsorption region, , The length of the flow path is shorter than that of the fourth flow path, the first flow path and the second flow path are communicated, and the third flow path and the fourth flow path are communicated with each other.

When the distance between the third flow path and the fourth flow path is larger than the length of the semiconductor strip in the short side direction, the semiconductor strip is adsorbed by the air pressure applied by the first and second flow paths, And the fourth flow path is shorter than the length of the semiconductor strip in the short side direction, the semiconductor strip is adsorbed by the air pressure applied by the first, second, third, and fourth flow paths.

Further comprising an alignment block having a plurality of fiducial marks formed thereon for imaging with a reference mark formed on the semiconductor strip to exclude external influences when inspecting the semiconductor strip with the strip vision, The semiconductor device according to any one of claims 1 to 3, wherein the semiconductor strips are provided in the front and rear directions of the adsorption plate so as to inspect the fiducial marks provided in the alignment block in a state in which the influence of the warp page of the semiconductor strip is minimized, And is fixedly disposed in the center.

In addition, the strip picker may further include an interlock pin provided to be movable up and down, and a plurality of interlock pin holes for inserting the interlock pin according to the size of the semiconductor strip are provided on the alignment block.

In order to inspect the fiducial mark provided in the semiconductor strip and the alignment block regardless of the size of the semiconductor strip, the fiducial mark formed in the alignment block may be arranged in parallel with the longitudinal direction of the semiconductor strip, And a plurality of the guide grooves are provided.

The adsorption plate may include a suction plate body having a passage formed therein; And a suction plate cover provided at an upper portion of the suction plate body and having a suction hole for suctioning the semiconductor strip that is seated on the upper portion thereof, wherein the suction plate cover is detachably mountable from the suction plate body .

In order to prevent interference between the adsorption plate and the inlet rail when the pair of inlet rails move in the Y axis direction toward the adsorption plate, And a groove is formed.

The upper surface of the adsorption plate is provided with a plurality of softly projected adsorption pads for stably adsorbing the semiconductor strip.

When the pair of inlet rails move in the Y-axis direction toward the adsorption plate, respectively, to prevent interference between the adsorption pad provided on the adsorption plate and the inlet rail, of the escape grooves of the adsorption plate formed on the inlet rail, And an adsorption pad recess groove is further provided at a position corresponding to the adsorption pad provided on the adsorption plate.

In addition, the first flow path and the second flow path may have a " H "shape by a communication flow path, and may detect whether the semiconductor strip is seated on the adsorption plate regardless of the size of the semiconductor strip, And a semiconductor strip detection sensor provided between the first flow path and the second flow path.

In addition, a stripper may be provided at one side of the strip picker with a strip vision and a gripper for pulling out the semiconductor strip from the magazine and placing the strip on the absorption plate. The strip vision and the gripper are movable together in the Y- Wherein the plate has grooves formed between the adsorption region where the first flow path is formed and the adsorption region where the second flow path is formed, and the gripper moves through the grooves.

According to the semiconductor material cutting apparatus of the present invention as described above, the following effects can be obtained.

According to the present invention, it is possible to selectively control the pneumatic pressure applied to the adsorption region of the semiconductor strip according to the size of the semiconductor strip by separating the adsorption region so that pneumatic pressure is applied to the inner upper portion and the outer upper portion, respectively, It is effective. Therefore, the semiconductor strips of a small size are attracted to the semiconductor strip by applying air pressure only to the inner upper portion, and the semiconductor strips of a large size are stably attracted and handled by applying air pressure to both the inner and outer upper portions, It becomes possible.

In addition, since the semiconductor strip and the reference mark are photographed together with the strip vision through the alignment block on which the reference mark and the fiducial mark of the semiconductor strip are formed, it is possible to eliminate external influence such as vibration and increase the inspection reliability.

In addition, according to the present invention, a plurality of fiducial marks formed in the alignment block are formed in the forward and backward directions, so that the semiconductor strip and the fiducial mark can be inspected together within the FOV of the strip vision regardless of the size of the semiconductor strip.

Since the alignment block on which the fiducial marks are formed is fixedly arranged at the center with respect to the direction of the short side of the semiconductor strip to be seated on the adsorption plate and the semiconductor strip is always adsorbed on the inner upper side of the adsorption plate for adsorbing the semiconductor strip, It is possible to perform the vision inspection in a state of being flatly adsorbed irrespective of the warp of the image.

In addition, the semiconductor strip fixing, alignment and adsorption can be achieved corresponding to the variation of the width of the semiconductor strip in the lateral direction through the first and second adsorption regions and the first and second inlet rails, By separately controlling the adsorption of the two adsorption regions, it is possible to prevent the occurrence of vacuum leakage or to prevent unnecessary adsorption.

In addition, due to the escape grooves formed in the first and second inlet rails, the freedom of movement of the first and second inlet rails in the Y-axis direction, that is, in the left and right directions is ensured, It is possible to easily achieve the function of the inlet rail for guiding and / or aligning the semiconductor strip.

1 is a plan view of a semiconductor material cutting apparatus according to a preferred embodiment of the present invention;
FIG. 2 is a perspective view of the loading part and the strip picker of FIG. 1; FIG.
3 is a plan view of the loading portion of Fig.
4 is a sectional view taken along the line E-E 'of the loading part of FIG. 3;
Fig. 5 is a view showing that a semiconductor strip of a large size is seated on the loading portion of Fig. 3; Fig.
Fig. 6 is a view showing first to fourth flow paths of the loading part of Fig. 3, first and second adsorption plate escape grooves, and first and second adsorption pad escape grooves.
7 (a) is a cross-sectional view showing first and second flow paths of a first adsorption region formed inside the adsorption plate by cutting the loading unit of FIG. 3 into an XY plane.
7 (b) is a sectional view taken along the line F-F 'in Fig. 7 (a).
8 (a) is a cross-sectional view showing third and fourth flow paths of a second adsorption region formed inside the adsorption plate by cutting the loading portion of FIG. 3 into an XY plane.
8 (b) is a sectional view taken along the line G-G 'in Fig. 8 (a).
9 (a) is a view showing that the first and second adsorption pads are communicated with the first and second flow paths of Fig. 7 (a), respectively. Fig.
9 (b) is a view showing that the third and fourth adsorption pads are communicated with the third and fourth flow paths of Fig. 8 (a), respectively.
Fig. 10 (a) is a view showing that the first and second inlet rails are moved toward the adsorption plate so that the medium size semiconductor strip is loaded on the loading part of Fig. 3; Fig.
10 (b) is a view showing a semiconductor strip of a medium size being seated on the loading portion of Fig. 10 (a). Fig.
11 (a) is a view showing that the first and second inlet rails move in the direction of the adsorption plate so that the medium size semiconductor strip is loaded on the loading part of Fig. 3; Fig.
11 (b) is a view showing that a semiconductor strip of a small size is seated on the loading portion of Fig. 11 (a). Fig.

The following merely illustrates the principles of the invention. Therefore, those skilled in the art will be able to devise various apparatuses which, although not explicitly described or shown herein, embody the principles of the invention and are included in the concept and scope of the invention. It is also to be understood that all conditional terms and examples recited in this specification are, in principle, explicitly intended only for the purpose of enabling the inventive concept to be understood, and not to be construed as limited to such specifically recited embodiments and conditions .

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: .

The embodiments described herein will be described with reference to cross-sectional views and / or perspective views that are ideal illustrations of the present invention. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are generated according to the manufacturing process.

Prior to the description, the following are defined.

The X axis means the direction in which the strip picker and the unit picker move, and the Y axis means the axis perpendicular to the X axis horizontal plane.

 The X axis means the same axis as the forward and backward direction, and the Y axis means the same axis as the left and right direction.

The backward direction means a direction (rightward direction) in which the semiconductor strip is drawn out from the on-loader portion on the X axis, and the forward direction means the backward direction (leftward direction).

and the &thetas; direction means a direction of rotating clockwise or counterclockwise on the X-Y plane.

Hereinafter, a semiconductor material cutting apparatus 100 according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a plan view of a semiconductor material cutting apparatus according to a preferred embodiment of the present invention, FIG. 2 is a perspective view of a loading unit and a strip picker of FIG. 1, FIG. 3 is a plan view of a loading unit of FIG. 2, FIG. 5 is a view showing that a semiconductor strip of a large size is seated on the loading part of FIG. 3, FIG. 6 is a sectional view of the loading part of the loading part of FIG. 3, FIG. 7A is a cross-sectional view showing the first and second adsorption plate recess grooves and the first and second adsorption pad recess grooves. FIG. 7A is a cross- 7 (a) is a sectional view taken along the line F-F 'in Fig. 7 (a), and Fig. 8 (a) is a cross- 8B is a cross-sectional view taken along a line G-G 'in Fig. 8A, and Fig. 9B is a cross- (a) is a view showing that the first and second adsorption pads are communicated with the first and second flow paths of Fig. 7 (a), and Fig. 9 (b) Fig. 10 (a) is a view showing that the third and fourth adsorption pads are communicated with the fourth flow paths, respectively. Fig. 10 Fig. 10B is a view showing that a medium size semiconductor strip is seated on the loading portion of Fig. 10A, Fig. FIG. 11B is a view showing that the first and second inlet rails are moved toward the adsorption plate so that the medium size semiconductor strip is loaded on the loading portion of FIG. 11A. FIG. Fig. 5 is a view showing that the semiconductor strip of Fig.

1, a semiconductor material cutting apparatus 100 according to a preferred embodiment of the present invention includes an on-loader (not shown) in which a plurality of semiconductor strips S are stacked in a magazine (not shown) (Not shown), a pair of inlet rails guiding the semiconductor strip S drawn out of the magazine and being transportable in the Y-axis direction, and a pair of inlet rollers provided on the inside of the inlet rail, A loading section 1000 including an adsorption plate 1300 on which a semiconductor strip S is placed; a loading section 1000 installed movably in the X axis direction between the loading section 1000 and the cut section 4000; The semiconductor strip S placed on the adsorption plate 1300 of the adsorption plate 1300 is transferred to the chuck table 3000 and the semiconductor strip S adsorbed on the adsorption plate 1300 is adsorbed to move in the X axis direction, Inspecting the semiconductor strip (S) A stripe picker 2000 provided with a lip vision 2300 and a semiconductor strip S which is attracted to a strip picker 2000 and is provided movably in the Y axis direction and is rotatable in the & A chuck table 3000 and a cutout 4000 for cutting the semiconductor strip S delivered to the chuck table 3000 into individual semiconductor packages wherein the adsorption plate 1300 is connected to the chuck table 3000, A first adsorption region 1310 for adsorbing the semiconductor strip S at the inner upper portion and a second adsorption region 1320 for adsorbing the semiconductor strip S at the upper outer side of the adsorption plate 1300. The first adsorption region 1310 and the second adsorption region 1320 can be controlled to selectively apply pneumatic pressure according to the size of the semiconductor strip S. [

The semiconductor material cutting apparatus 100 according to the present invention may further include a cleaning unit 5000 disposed between the chuck table 3000 and the drying unit (not shown) to remove foreign matter from the semiconductor package, A drying unit for drying the semiconductor package cleaned by the cleaning unit 5000; a drying unit for drying the semiconductor package cleaned by the cleaning unit 5000; A unit picker 6000 for picking up the cut semiconductor package and transferring the cut semiconductor package to the drying unit through the cleaning unit 5000, a vision unit for inspecting the semiconductor package, and a sorting unit As shown in FIG.

The present invention is characterized in that when a semiconductor strip S is inspected with a strip vision 2300, a plurality of fiducial marks for imaging are formed with a reference mark formed on the semiconductor strip S, As shown in FIG.

The alignment block is provided in the forward and backward directions of the adsorption plate 1300 so as to inspect the fiducial marks provided in the alignment block with the influence of the warp page (Smile type, Angry type) of the semiconductor strip S being minimized, And is fixedly disposed at the center with respect to the direction of the short side of the semiconductor strip S that is seated on the adsorption plate 1300. [

The semiconductor strip (S) is provided with a fiducial mark which is imaged by the strip vision (2300) together with the fiducial mark of the alignment block. The reference mark may be composed of a front reference mark M1 provided in front of the semiconductor strip S and a rear reference mark M2 provided behind the semiconductor strip S, The position information of the semiconductor strip S can be obtained by photographing the reference mark of the semiconductor strip S. [

On the other hand, the semiconductor strip S is provided in the on-loader portion in a state in which the semiconductor strip S is drawn in the magazine, and the gripper 2200 provided on one side of the pusher (not shown) or the strip picker 2000 provided on the on- And serves to supply the semiconductor strip S to the loading unit 1000.

The strip picker 2000 is disposed between the loading unit 1000 and the cutout unit 4000 so as to be movable in the X axis direction and transfers the semiconductor strip S, which is placed on the suction plate 1300 of the loading unit 1000, (3000). In this case, the strip picker 2000 is placed on the suction plate 1300 of the loading unit 1000 to pick up the adsorbed semiconductor strip S, and then transfers the picked up semiconductor strip S to the chuck table 3000 of the cut unit 4000 do.

The strip picker 2000 is provided with a strip vision 2300 which is capable of moving in the X axis direction by adsorbing the semiconductor strip S placed on the adsorption plate 1300 and inspecting the semiconductor strip S on one side, And a gripper 2200 which draws out the adsorbent S and places it on the adsorption plate 1300.

The stripper 2000 is provided at its lower part with a suction part 2100 for suctioning the semiconductor strip S and the suction part 2100 of the strip picker 2000 is connected to the semiconductor strip S supplied to the suction plate 1300, The semiconductor strip S can be seated on the suction plate 1300 in a state in which the upper surface of the semiconductor strip S is pushed in order to adsorb the semiconductor wafer S flat on the suction plate 1300 while the warp page of the semiconductor strip S is relaxed.

The gripper 2200 has a function of pulling out the semiconductor strip S from the magazine and mounting it on the attraction plate 1300 and being movable in the Y axis direction together with the strip vision 2300.

The adsorption plate 1300 includes a first adsorption region 1310 for adsorbing the semiconductor strip S from the upper inside of the adsorption plate 1300 and a second adsorption region 1310 for adsorbing the semiconductor strip S from the upper side of the adsorption plate 130. [ 2 adsorption region 1320. Air is supplied to the first adsorption region 1310 by the first flow channel 1311 and the second flow channel 1312 communicated with each other and the third flow channel 1321 communicated with the second adsorption region 1320, The air pressure is applied by the four-way valve 1322.

The first flow path 1311 and the second flow path 1312 are shorter in length than the third flow path 1321 and the fourth flow path 1322 and are connected to the semiconductor strips The small semiconductor strip S is adsorbed in the first adsorption region 1310 by the first and second flow paths 1311 and 1312 and the semiconductor strip S having a large size is adsorbed by the first and second adsorption regions 1310 and 1312. [ Are adsorbed in both the first adsorption region 1310 and the third adsorption region 1320 by the two flow paths 1311 and 1312 by the third and fourth flow paths 1321 and 1322.

For example, when the gap between the third flow path 1321 and the fourth flow path 1322 is greater than the length of the semiconductor strip in the short side direction, the air pressure applied by the first flow path 1311 and the second flow path 1312 When the gap between the third flow path 1321 and the fourth flow path 1322 is smaller than the length of the semiconductor strip S in the short side direction, The semiconductor strips S (1310), 1310 (1310), 1313 (1310), 1313, 1313, 1313, 1312, 1313, Can be adsorbed. At this time, the interval of each flow path may be a distance between the adsorption pads communicating with each flow path.

Therefore, the present invention can be applied to the case where the pneumatic pressure is applied only to the first adsorption region 1310 or the first adsorption region 1310 and the second adsorption region 1320 are applied to the adsorption plate 1300 according to the size of the semiconductor strip S ) Can be applied.

The adsorption plate 1300 is formed with a groove which intersects an adsorption region where the first flow path 1311 is formed and an adsorption region where the second flow path 1312 is formed and the groove has a concave depression And the gripper 2200 moves through the section.

In other words, the adsorption plate 1300 is provided with an adsorption region where the first flow path 1311 of the first adsorption region 1310 is formed and an adsorption region where the second flow path 1312 of the second adsorption region 1320 is formed And a gripper 2200 can be moved through the groove.

The strip picker 2000 is installed on the guide rail 2001 and is movable along the guide rail 2001 in the X-axis direction.

The strip picker 2000 is provided with a Z axis driving part 2500 and the suction part 2100 of the strip picker 2000 moves in the Z axis direction by driving the Z axis driving part 2500, Descendable.

The strip vision driving unit 2400 provided in the strip picker 200 functions to move the strip vision unit 2300 and the gripper unit 2200 in the Y axis direction so that the strip vision unit 2300 is moved in the Y- The position of the second reference mark 1332 and the front reference mark M1 and the positions of the second fiducial mark 1342 and the rear reference mark M2 can be easily checked.

The strip picker 2000 is provided with a Z axis driving part 2500 and the suction part 2100 of the strip picker 2000 moves in the Z axis direction by driving the Z axis driving part 2500, Descendable.

The strip picker 2000 may be configured to include an interlock pin 2600 that can be raised and lowered. The interlock pin 2600 is inserted into the interlock pinhole of the alignment block to align the position of the alignment block and the strip picker 2000.

The interlock pinholes may be provided in plurality so that the interlock pin 2600 can be easily inserted according to the size of the semiconductor strip S. [

The interlock pinholes may include a first interlock pinhole 1333 provided at the upper portion of the first alignment block 1330 and a second interlock pin 1343 provided at the upper portion of the second alignment block 1330 .

The semiconductor strip S transferred through the strip picker 2000 is attracted to the chuck table 3000. The chuck table 3000 is movable in the Y-axis direction and is rotatable in the? Direction.

The chuck table 3000 is movable in the Y-axis direction and rotatably in the? Direction, so that the semiconductor strip S can be moved to the cutting position of the cut portion 4000 and cut.

The chuck table 3000 is movable in the Y-axis direction and rotatably in the θ-direction, so that the function of correcting the Y-axis direction and the θ-direction of the semiconductor strip S or semiconductor package placed on the chuck table 3000 can do.

The chuck table 3000 is provided with a plurality of chuck table suction holes 3100 through which the semiconductor strips S transferred through the strip picker 2000 are sucked and a plurality of chuck table suction holes 3110 formed to protect the chuck table 3000 from the cut portions 4000 A cutting escape groove 3200 is provided.

The chuck table suction holes 3100 have the same number as the number of the semiconductor packages so that each of the semiconductor packages cut at the cut portion 4000 is adsorbed to each of the chuck table suction holes 3100, Can be easily adsorbed. The cutting escapement groove 3200 is provided between the chuck table suction holes 3100 so that the chuck table 3000 can be prevented from being broken when the cut portion 4000 cuts the semiconductor strip S have.

The unit picker 6000 is installed between the cut portion 4000 and the drying portion so as to be movable in the X axis direction and sucks the semiconductor package cut by the cut portion 4000 on the chuck table 3000, To the drying section.

The unit picker 6000 is provided on the guide rail 2001 so that the unit picker 6000 moves along the guide rail 2001 and can easily move in the X axis direction.

Hereinafter, the loading unit 1000 will be described.

The loading section 1000 functions to provide a space in which the semiconductor strip S is seated and to align the semiconductor strip S and includes an alignment table 1100, A suction plate 1300 on which the semiconductor strips S supplied from the loader section disposed at the center of the table 11 is seated and a semiconductor strip S which is drawn out from the magazine and which can be transported in the Y- And a pair of inlet rails.

A pair of inlet rails are installed on the alignment table 1100 so as to be disposed on the left side of the deposition plate 1300 and include a first inlet rail 1500 movable left and right (or Y axis) in the alignment table 1100, And a second inlet rail 1600 installed on the alignment table 1100 so as to be disposed on the right side of the alignment table 1300 and movable left and right (or Y axis) in the alignment table.

An opening 1110 is formed at the center of the alignment table 1100 and an adsorption plate 1300 is disposed in the opening 1110. In this case, a transfer robot 1301, which is capable of moving in the Y-axis direction and rotatable in the? Direction, is provided in the lower part of the adsorption plate 1300 and is inspected by the strip vision 2300, When the position of the strip S is not in the correct position, the position of the semiconductor strip S is aligned to the correct position by correcting the Y-axis and the? -Axis distortion.

A first guide groove 1120 is formed on the left side of the opening 1110 of the alignment table 1100, that is, on the left side of the suction plate 1300. A first inlet rail 1500 is provided in the first guide groove 1120, Y axis direction, that is, left and right directions.

A second guide groove 1130 is formed on the right side of the opening 1110 of the alignment table 1100 and on the right side of the suction plate 1300 and a second inlet rail 1600 is formed in the second guide groove 1130 Y axis direction, that is, left and right directions.

An upward vision (not shown) for the upper imaging inspection may be additionally provided in front of the alignment table 1100 and an upward vision may be used to check whether the semiconductor strip S to be supplied is inverted have.

The adsorption plate 1300 is provided inside the pair of inlet rails to seat the semiconductor strip S supplied from the magazine.

The adsorption plate 1300 serves to adsorb and fix the semiconductor strip S. The adsorption plate 1300 is fixed on the inner upper side of the adsorption plate 1300 as shown in FIGS. 2 to 4, 6, 7 to 9, A second adsorption region 1320 for adsorbing the semiconductor strip S to the first adsorption region 1310 and the semiconductor strip S seated on the outside upper side of the adsorption plate 1300, An alignment block in which a plurality of fiducial marks for photographing together with a fiducial mark formed on the semiconductor strip S is formed in order to exclude external influences when inspecting the semiconductor strip S, A semiconductor strip sensing sensor 1350 installed on the adsorption plate 1300 so as to be positioned between the flow path 1311 and the second flow path 1312 and a semiconductor strip sensing unit 1350 for sensing whether the semiconductor strip S has reached a predetermined position. And a detection sensor 1360.

Here, the first adsorption region 1310 is pneumatically applied by the first flow path 1311 and the second flow path 1312, and the second adsorption region 1320 is connected to the third flow path 1321 and the fourth flow path 1322 The length of the first flow path 1311 and the second flow path 1312 are formed to be shorter than the lengths of the third flow path 1321 and the fourth flow path 1322. [

The alignment block is provided in each of the front and rear directions of the adsorption plate 1300 so as to inspect the fiducial marks provided in the alignment block in a state in which the warpage effect of the semiconductor strip S is minimized, The semiconductor strip S is fixed to the center with respect to the direction of the short side of the semiconductor strip S. In this case, the alignment block may include a first alignment block 1330 disposed in front of the first adsorption area 1310 and a second alignment block 1340 disposed behind the first adsorption area 1310 The first and second alignment blocks 1330 and 1340 are also fixed to the center with respect to the direction of the short side of the semiconductor strip S which is seated on the attracting plate 1300. [

The fiducial mark provided on the alignment block is performed by a strip vision 2300 provided on one side of the strip picker 2000. The fiducial mark provided on the alignment block is formed by a strip vision 2300, The positional information and alignment state of the semiconductor strip S can be obtained. At this time, vision inspection is possible in both the semiconductor strip S having a small size and the semiconductor strip S having a large size, which are provided at the center of the attracting plate 1300 so that the semiconductor strip S can be inspected regardless of the size thereof .

Particularly, in the present invention, in order to inspect the fiducial mark provided in the semiconductor strip S and the alignment block regardless of the size of the semiconductor strip S, the fiducial mark formed in the alignment block is formed in the semiconductor strip S, the fiducial mark and the reference mark formed on the semiconductor strip S can be photographed together regardless of the size of the semiconductor strip S.

The fiducial mark includes a first fiducial mark 1332 corresponding to the front reference mark M1 of the semiconductor strip S on the upper surface of the first alignment block 1330 and a second fiducial mark 1332 And a second fiducial mark 1342 corresponding to the rear reference mark M2 of the semiconductor strip S on the upper surface.

A plurality of first fiducial marks 1332 may be provided on the upper surface of the first alignment block 1330 in the forward and backward directions and a second fiducial mark 1342 may be provided on the upper surface of the second alignment block 1340 in the forward and backward directions May be provided.

The semiconductor strip detection sensor 1350 detects the presence or absence of the semiconductor strip S adhered to the adsorption plate 1300 regardless of the size of the semiconductor strip S by using the first flow path 1311 and the second flow path 1320. [ 1312. When the semiconductor strip sensing sensor 1350 is provided at the outer periphery of the attracting plate 1300, a large semiconductor strip S can be sensed but a small semiconductor strip S can not be sensed. That is, the space between the first flow path 1311 and the second flow path 1312, with respect to the direction of the short side of the semiconductor strip S that is seated on the absorption plate 1300.

Here, the semiconductor strip arrival sensor 1360 can check whether or not the semiconductor strip S held by the gripper 2200 has slipped by detecting the presence or absence of the semiconductor strip S. More specifically, the gripper 2200 moves by a predetermined distance so that the semiconductor strip S can be detected by the semiconductor strip arrival sensor 1360, and when the movement is normally completed, the semiconductor strip arrival sensor 1360 Detects the arrival of the semiconductor strip (S). However, when the semiconductor strip S slips from the gripper 2200, it may be impossible to detect the arrival of the semiconductor strip S by the semiconductor strip arrival sensor 1360 even if the predetermined distance is shifted. In this case, the gripper 2200 further moves backward so that the semiconductor strip arrival sensor 1360 can sense the semiconductor strip S. [

The semiconductor strip arrival sensor 1360 can determine whether the semiconductor strip S reaches a predetermined position and obtain positional information of the semiconductor strip S. Using the positional information, The center of the alignment table 1100 may be aligned. Specifically, for example, when the semiconductor strip S detection sensor 1360 detects the semiconductor strip S, the semiconductor strip S is moved forward by a predetermined amount, ) In the center.

After the semiconductor strip S is positioned at the center of the alignment table 1100 by using the semiconductor strip arrival sensor 1360, the semiconductor strip S is transferred to the semiconductor strip S via the strip vision 2300 provided in the strip picker 2000 The first and second fiducial marks 1332 and 1342 provided on the front and rear reference marks M1 and M2 and the first and second alignment blocks 1330 and 1340, Can be corrected.

That is, the present invention can examine the alignment state of the semiconductor strip S by taking a reference mark of the semiconductor strip S and a fiducial mark of the alignment block together in the view angle (FOV) of the strip vision 2300, If there is no reference mark on the semiconductor strip S, it may be possible to replace the reference mark with a specific package such as a package located at the outermost place so that the specific package and the fiducial mark of the semiconductor strip S are checked together.

In addition, the first adsorption region 1310 of the adsorption plate 1300 may be formed with grooves in the longitudinal direction to prevent interference when the gripper 2200 moves. The longitudinal grooves are formed because the gripper 2200 moves to a lower height than the upper surface of the attracting plate 1300 so that when the heavy semiconductor strip S or the thin semiconductor strip S is transferred to the gripper 2200, An excessive bending moment may be applied to the semiconductor strip S to damage the semiconductor strip S so that a part of the semiconductor strip S can contact the protrusion of the inlet rail or the upper surface of the suction plate 1300 in order to disperse the load. A part of the height of the gripper 220 falls below the height of the top surface of the adsorption plate 1300.

A transfer robot 1301 is provided below the attraction plate 1300 and the attraction plate 1300 can be moved in the Y axis by the transfer robot 1301. In addition, the transfer robot 1301 is configured to be rotatable, whereby the attracting plate 1300 can rotate in the &thetas; direction.

In addition, although the adsorption plate 1300 may be integrally formed, the upper and lower portions of the adsorption plate 1300 may be configured to be separated and replaceable for maintenance of the adsorption plate 1300. The adsorption plate 1300 includes an adsorption plate body 1300b connected to the upper portion of the transfer robot 1301 and having first, second, third and fourth flow paths 1311, 1312, 1321 and 1322 formed therein, And is disposed on the upper part of the adsorption plate body 1300b and is coupled to the adsorption plate body 1300b for adsorbing the semiconductor strip S which is seated on the upper part, Third, and fourth communication holes 1311a, 1312a, 1321a, and 1322a in which the first, second, third, and fourth flow paths 1311, 1312, 1321, ≪ / RTI >

In addition, the suction plate body 1300b and the suction plate cover 1300a can be detachably coupled by the fastening means 1370. The fastening means 1370 can use, for example, a cicada ring, The adsorption plate cover 1300a can be easily separated from the adsorption plate body 1300b and is replaceable. That is, the adsorption plate cover 1300a may be detachably provided from the adsorption plate body 1300b.

The adsorption plate cover 1300a is provided with an adsorption hole for adsorbing the semiconductor strip S to be seated on the upper portion and a soft protruding adsorption A plurality of pads may be provided.

The adsorption pad includes a plurality of first adsorption pads 1314 provided on a first flow path 1311 to communicate with the first flow path 1311 and a plurality of second adsorption pads 1314 provided on the second flow path 1312, A plurality of third adsorption pads 1315 provided on the third flow path 1321 and communicating with the third flow path 1321 and a plurality of third adsorption pads 1315 communicating with the fourth flow path 1322 And a plurality of fourth adsorption pads 1325 which are provided on the first channel 1322 and communicate with the fourth channel 1322.

3 and 9, the first adsorption region 1310 and the second adsorption region 1320 are formed in the same direction as the semiconductor strip S S) on the lower surface.

In the semiconductor material cutting apparatus 100 according to the preferred embodiment of the present invention, the adsorption force generated in the first adsorption region 1310 and the second adsorption region 1320 is an adsorption force by vacuum, for example. Thus, the attraction force may be achieved through other means such as electrostatic force.

The second adsorption region 1320 is formed to be disposed around the first adsorption region 1310. In this case, the first adsorption region 1310 and the second adsorption region 1320 are formed on the upper surface of the adsorption plate 1300, and the first adsorption region 1310 and the second adsorption region 1320 do not overlap each other .

The second adsorption region 1320 is disposed in the periphery of the first adsorption region 1310 and the width in the front-back direction and the width in the left-right direction of the second adsorption region 1320 are equal to the front- And is formed larger than the lateral width. Therefore, the first adsorption region 1310 is located inside the second adsorption region 1320 in the front-back direction and the left-right direction.

The adsorption of the first adsorption region 1310 and the second adsorption region 1320 is separately controllable. Since the adsorption of the first adsorption region 1310 and the second adsorption region 1320 can be individually controlled as described above, the first adsorption region 1310 and the second adsorption region 1320 correspond to the size of the semiconductor strip S. Accordingly, 1320 can be selectively adsorbed.

In other words, the pneumatic pressure applied to the first adsorption region 1310 and the second adsorption region 1320 can be selectively controlled according to the size of the semiconductor strip S. Therefore, depending on the size of the semiconductor strip S supplied to the adsorption plate 1300, pneumatic pressure may be applied only to the first adsorption region 1310, or both the first adsorption region 1310 and the second adsorption region 1320 Air pressure can be applied.

Hereinafter, the first adsorption region 1310 and the second adsorption region 1320 will be described in more detail.

First, the first adsorption region 1310 will be described.

The first adsorption region 1310 is provided in the adsorption plate 1300 so as to function to adsorb the semiconductor strip S on the inner upper side of the adsorption plate 1300.

The first adsorption region 1310 includes a first flow channel 1311 formed in the front and back direction on the left side of the center line C of the adsorption plate 1300, A first adsorption pad 1314 disposed on the first flow path 1311 and adapted to adsorb the semiconductor strip S in contact with the lower surface of the semiconductor strip S and a second adsorption pad 1314 disposed on the right side of the center line C of the adsorption plate 1300 A second flow path 1312 formed in the front and rear direction in the first flow path 1312 and communicating with the first flow path 1311 and a second flow path 1312 disposed on the second flow path 1312 and contacting the bottom surface of the semiconductor strip S, And a second adsorption pad 1315 for adsorbing the adsorbed water.

The first and second flow paths 1311 and 1312 function to apply a pneumatic pressure to the first adsorption region 1310.

The first flow path 1311 and the second flow path 1312 are communicated with each other by a first connection portion 1313.

The first connection portion 1313 is formed between the first flow path 1311 and the second flow path 1312 so that the first and second flow paths 1311 and 1312 and the first connection portion 1313 are connected to the " Shape.

In other words, the first flow path 1311 and the second flow path 1312 have the "H" shape by the first connection portion 1313, that is, the communication flow path.

The first flow path 1311 is spaced apart from the left side of the center line C of the suction plate 1300 and is formed long in the front-back direction.

A first communication hole 1311a opened upward is formed in the first flow path 1311 and a first hole 1314a of the first adsorption pad 1314 is communicated with the first communication hole 1311a.

The first adsorption pad 1314 contacts the lower surface of the semiconductor strip S and adsorbs the semiconductor strip S. The first adsorption pad 1314 is disposed on the left side of the center line C of the adsorption plate 1300, And is formed to protrude upward in the upper surface.

A first hole 1314a communicating with the first communication hole 1311a is formed in the center of the first absorption pad 1314. When the semiconductor strip S is mounted on the absorption plate 1300, The upper surface of the pad 1314 abuts the lower surface of the semiconductor strip S.

A plurality of first communication holes 1311a may be provided in the front-rear direction of the first flow path 1311. The first adsorption pad 1314 may be formed in the same manner as the first communication holes 1311a, A plurality of the flow paths 1311 may be provided on the first flow path 1311 in the front-rear direction of the flow path 1311.

The second flow path 1312 is spaced apart from the right side of the center line C of the suction plate 1300 and is elongated in the front-back direction.

A second communication hole 1312a opened upward is formed in the second flow path 1312 and a second hole 1315a of the second adsorption pad 1315 is communicated with the second communication hole 1312a.

The first and second flow paths 1311 and 1312 described above have a shorter flow path length than the third and fourth flow paths 1321 and 1322 described later. By configuring the length of the flow path differently in the first adsorption region 1310 and the second adsorption region 1320, it is possible to stably adsorb the semiconductor strip S without vacuum leakage or leakage during the adsorption of the small semiconductor strip S , And even in the case of the large semiconductor strip (S), the large area can be adsorbed evenly without being shifted to a specific area.

The second adsorption pad 1315 contacts the lower surface of the semiconductor strip S and adsorbs the semiconductor strip S. The second adsorption pad 1315 is disposed on the right side of the center line C of the adsorption plate 1300, And is formed to protrude upward in the upper surface.

A second hole 1315a communicating with the second communication hole 1312a is formed at the center of the second adsorption pad 1315. When the semiconductor strip S is seated on the adsorption plate 1300, The upper surface of the pad 1315 contacts the lower surface of the semiconductor strip S.

A plurality of the second communication holes 1312a may be provided in the front and rear direction of the second flow path 1312. The second adsorption pad 1315 may be formed in the same manner as the second communication holes 1312a, A plurality of the flow paths 1312 may be provided on the second flow path 1312 in the front-back direction of the flow path 1312.

The first and second adsorption pads 1314 and 1315 are preferably made of a soft material such as rubber. Since the first and second adsorption pads 1314 and 1315 are made of a soft material, the lower surfaces of the first and second adsorption pads 1314 and 1315 and the semiconductor strip S can be more closely contacted, The adsorption force of the first and second adsorption pads 1314 and 1315 can be maximized. In particular, when the adsorption plate 1300 is made of a metal material, the adsorption force for adsorbing the semiconductor strip S may be deteriorated. As described above, the first and second adsorption pads 1314 and 1315 are made of a soft material As such, this problem can be solved easily.

The first connection portion 1313 is formed with a first suction port 1313a, and the first suction port 1313a is in communication with a first suction portion (not shown) for sucking air.

After the semiconductor strip S is seated on the suction plate 1300, when the first suction portion is actuated and the suction force acts, air in the first and second flow paths 1311 and 1312 is sucked into the first suction portion, A suction force acts on the first and second adsorption pads 1314 and 1315 which are in communication with the first and second flow paths 1311 and 1312, respectively. Therefore, the first and second holes of the first and second adsorption pads 1314 and 1315 adsorb the lower surface of the semiconductor strip S, through which the semiconductor strip S is adsorbed in vacuum on the adsorption plate . In other words, adsorption is performed in the first adsorption region 1310 by applying pneumatic pressure through the first suction portion and the first and second flow paths 1311 and 1312.

The first adsorption region 1310 having the above-described structure adsorbs the inner region of the lower surface of the semiconductor strip S. Therefore, the inner region of the lower surface of the semiconductor strip S of the large size of FIG. 5 or the semiconductor strip S of the medium size of FIG. 10 (b) or the semiconductor strip S of the small size of FIG. can do.

Hereinafter, the second adsorption region 1320 will be described.

The second adsorption region 1320 is provided in the adsorption plate 1300 so as to function to adsorb the semiconductor strip S on the outer side of the adsorption plate 1300.

6, 8, and 9 (b), the second adsorption region 1320 includes a third flow path 1321 formed in the front-rear direction on the left side of the first flow path 1311, A third adsorption pad 1324 which is arranged on the lower surface of the semiconductor strip S and adsorbs the semiconductor strip S in contact with the lower surface of the semiconductor strip S, The fourth adsorption pad 1325 is disposed on the fourth flow path 1322 and is in contact with the lower surface of the semiconductor strip S to adsorb the semiconductor strip S. The fourth adsorption pad 1325 is disposed on the fourth flow path 1322, ).

Although not shown in the drawing, the third and fourth flow paths 1321 and 1322 may communicate with each other by a second connection portion. In this case, the second connection portion may include a third flow path 1321 and a fourth flow path 1322, respectively.

A second suction port is formed in the second connection portion, and the second suction port is in communication with a second suction portion (not shown) for sucking air.

The third and fourth flow paths 1321 and 1322 function to apply a pneumatic pressure to the second adsorption region 1320.

The third flow path 1321 is spaced apart from the left side of the first flow path 1311 and is formed long in the front-rear direction.

A third communication hole 1321a opened upward is formed in the third flow path 1321 and a third hole 1324a of the third adsorption pad 1324 is communicated with the third communication hole 1321a.

The third adsorption pad 1324 contacts the bottom surface of the semiconductor strip S and adsorbs the semiconductor strip S. The first adsorption pad 1314 is disposed so as to be located on the left side of the center line C of the adsorption plate 1300 And is formed to protrude upward from the upper surface of the adsorption plate 1300 while being spaced apart from the adsorption plate 1300.

A third hole 1324a communicating with the third communication hole 1321a is formed at the center of the third adsorption pad 1324. When the semiconductor strip S is seated on the adsorption plate 1300, The upper surface of the pad 1324 contacts the lower surface of the semiconductor strip S.

A plurality of third communicating holes 1321a may be provided in the front-rear direction of the third flow path 1321. The third adsorption pad 1324 may be formed in the same manner as the third communicating holes 1321a, A plurality of the flow paths may be provided on the third flow path 1321 in the front-rear direction of the flow path 1321.

The fourth flow path 1322 is spaced apart from the right side of the second flow path 1312, and is formed long in the front-back direction.

A fourth communication hole 1322a opened upward is formed in the fourth flow path 1322 and a fourth hole 1325a of the fourth absorption pad 1325 is communicated with the fourth communication hole 1322a.

The fourth adsorption pad 1325 functions to adsorb the semiconductor strip S in contact with the bottom surface of the semiconductor strip S. The second adsorption pad 1315 is disposed to the right of the center line C of the adsorption plate 1300, And the third adsorption pad 1324 while being spaced apart from the third adsorption pad 1324 and protruding upward from the upper surface of the adsorption plate 1300.

A fourth hole 1325a communicating with the fourth communication hole 1322a is formed at the center of the fourth absorption pad 1325. When the semiconductor strip S is seated on the absorption plate 1300, The upper surface of the pad 1325 contacts the lower surface of the semiconductor strip S.

A plurality of fourth communication holes 1322a may be provided in the forward and backward directions of the fourth flow path 1322. The fourth adsorption pad 1325 may be formed in the same manner as the fourth communication holes 1322a, A plurality of valves may be provided on the fourth flow path 1322 in the front-rear direction of the flow path 1322.

The third and fourth adsorption pads 1324 and 1325 are preferably made of a soft material such as rubber. Since the third and fourth adsorption pads 1324 and 1325 are made of a soft material, the lower surfaces of the third and fourth adsorption pads 1324 and 1325 and the semiconductor strip S can be made more closely contacted. The adsorption force of the third and fourth adsorption pads 1324 and 1325 can be maximized. Particularly, when the adsorption plate 1300 is made of a metal material, the adsorption force for adsorbing the semiconductor strip S may be deteriorated. As described above, the third and fourth adsorption pads 1324 and 1325 are made of a soft material As such, this problem can be solved easily.

When the first and second inlet rails 1500 and 1600 move in the direction of the adsorption plate 1300, the third and fourth adsorption pads 1324 and 1325 are separated from the first and second adsorption pad escape grooves 1511, 1611, thereby being covered by the first and second inlet rails 1500, 1600.

The second connection portion is in communication with a second suction portion (not shown) for sucking air.

After the semiconductor strip S is seated on the suction plate 1300, when the second suction portion is actuated and a suction force is applied, the air of the third and fourth flow paths 1321 and 1322 is sucked into the second suction portion, A suction force acts on the third and fourth adsorption pads 1324 and 1325, which are in communication with the third and fourth flow paths 1321 and 1322, respectively. The third and fourth holes of the third and fourth adsorption pads 1324 and 1325 adsorb the lower surface of the semiconductor strip S through which the semiconductor strip S is adsorbed in vacuum on the adsorption plate . In other words, adsorption is performed in the second adsorption region 1320 by applying pneumatic pressure through the second suction portion, the third and fourth flow paths 1321 and 1322, and the like.

The second adsorption region 1320 having the above-described configuration adsorbs the outer region of the lower surface of the semiconductor strip S. Therefore, the outer region of the lower surface of the large-sized semiconductor strip S in Fig. 5 can be adsorbed. However, the second adsorption region 1320 is located outside the semiconductor strip S of the medium size in Fig. 10 (b) and the semiconductor strip S of the small size in Fig. 11 (b) The lower surface of the semiconductor strip S having a small size can not be absorbed.

In other words, the above-described first adsorption region 1310 can adsorb both the small size semiconductor strip S, the medium size semiconductor strip S and the large size semiconductor strip S, The region 1320 is capable of adsorbing a semiconductor strip S of a large size.

Hereinafter, the first alignment block 1330 and the second alignment block 1340 will be described.

The first sorting block 1330 is installed at the front center of the adsorption plate 1300 so as to be disposed in front of the first adsorption region 1310.

A first protrusion 1331 protruding upward is formed on both sides of the first alignment block 1330, that is, on the left and right sides of the first alignment block 1330. Accordingly, the first projections 1331 are spaced apart from each other on the left and right sides with respect to the center line of the attracting plate 1300.

A plurality of first fiducial marks 1332 corresponding to the forward reference mark M1 of the semiconductor strip S are provided on the upper surface of the first projection 1331 in the front-rear direction.

A plurality of first fiducial marks 1332 are provided in the front-rear direction on the upper surface of the first alignment block 1330, that is, on the upper surface of the first projection 1331, A plurality of first fiducial marks 1332 are arranged in two rows in the front-rear direction on the left and right sides with respect to the center line.

The second alignment block 1340 is installed at the rear center of the adsorption plate 1300 so as to be disposed behind the first adsorption area 1310.

A second protrusion 1341 protruding upward is formed on both sides of the second alignment block 1340, that is, on the left and right sides of the second alignment block 1340. Thus, the second projecting portions 1341 are located on the left and right sides of the center of the suction plate 1300, respectively.

A plurality of second fiducial marks 1342 corresponding to the rear reference mark M2 of the semiconductor strip S are provided on the upper surface of the second projection 1341 in the forward and backward directions.

A plurality of second fiducial marks 1342 are provided in the front and rear direction on the upper surface of the second alignment block 1340, that is, on the upper surface of the second projection 1341, A plurality of second fiducial marks 1342 are arranged in two rows in the front-rear direction on the left and right sides with respect to the center line.

The first and second fiducial marks 1332 and 1342 are formed in the strip picker 1300 together with the front fiducial mark M1 and the rear fiducial mark M2 when the semiconductor strip S is attracted to and adhered to the adsorption plate 1300 2000 is a reference point for inspecting the alignment state of the semiconductor strip S by the strip vision 2300 of FIG.

The projection length of the first and second projections 1331 and 1341 is formed to be lower than the height of the upper surface of the attraction plate 1300. Therefore, the upper surfaces of the first and second projections 1331 and 1341 are positioned lower than the upper surface of the attracting plate 1300. [ The first and second protrusions 1331 and 1341 do not contact the bottom surface of the semiconductor strip S due to the difference in height between the upper surface of the first and second protrusions 1331 and 1341 and the upper surface of the absorption plate 1300 Through which the semiconductor strip S can be easily adsorbed and seated on the adsorption plate 1300.

The first fiducial mark 1332 located at the foremost position among the plurality of first fiducial marks 1332 is positioned in front of the adsorption plate 1300 than the second adsorption region 1320. In other words, the first fiducial mark 1332 positioned at the foremost position among the plurality of first fiducial marks 1332 is a portion of the plurality of third and fourth adsorption pads 1324 and 1325 of the second adsorption region 1320 And is positioned forward of the adsorption pad located at the frontmost position.

The second fiducial mark 1342 located at the rear of the second fiducial marks 1342 is positioned behind the adsorption plate 1300 rather than the second adsorption region 1320. [ The second fiducial mark 1342 located at the rear of the plurality of second fiducial marks 1342 is positioned at a position corresponding to the third and fourth adsorption pads 1324 and 1325 of the second adsorption region 1320, Of the adsorbing pad.

Due to the arrangement of the first and second fiducial marks 1332 and 1342 located at the foremost and the last fiducials as described above, the size of the semiconductor strip S varies, and thus the first fiducial mark 1332 and the forward reference The distance between the mark M1 and the distance between the second fiducial mark 1342 and the rear reference mark M2 is increased so that the alignment state of the semiconductor strip S is easily checked through the strip vision 2300 Can be prevented.

The strip vision 2300 of the strip picker 2000 is positioned between the first fiducial mark 1332 and the forward reference mark M1, And the second fiducial mark 1342 and the rear fiducial mark M2 to inspect the alignment state of the semiconductor strip S. If the position of the semiconductor strip S is not in the correct position, 1300 corrects the Y-axis direction and the? Direction to align the position of the semiconductor strip S to the correct position.

The front reference mark M1 and the rear fiducial mark M2 of the semiconductor strip S are formed in front of and behind the semiconductor strip S so that when the size of the semiconductor strip S is changed, The position of the mark M1 and the position of the rear fiducial mark M2 are also changed.

The distance between the first fiducial mark 1332 and the front reference mark M1 or the distance between the first fiducial mark 1332 and the front fiducial mark M1 can be changed according to the position of the front reference mark M1 and the rear fiducial mark M2, The imaging accuracy of the strip vision 2300 is deteriorated and a position error may be caused thereby.

For example, the strip vision 2300 includes a first alignment mark 1332 formed on a left alignment block, that is, a first alignment mark 1332 formed on a first alignment block 1330, and a second alignment mark 1332 formed on a semiconductor strip S A field of view (FOV) is set so that the first fiducial mark 1332 and the forward reference mark M1 can come together in the field of the strip vision 2300 to simultaneously photograph the forward reference mark M1. The simultaneous photographing is performed to prevent the precision of the strip vision 2300 from being lowered due to external vibration or other external environment when the semiconductor strip S is photographed. The coordinates of the reference mark of the semiconductor strip S can be determined to capture the position of the semiconductor strip S with high accuracy even when an external force or the like acts.

If the size of the semiconductor strip S is changed, the FOV of the strip vision 2300 may be changed. However, if the FOV is increased, the imaging accuracy may be lowered. A plurality of fiducial marks may be provided parallel to the longitudinal direction of the semiconductor strip S so that the fiducial marks and the reference marks of the semiconductor strip S may be simultaneously You can shoot.

Therefore, as described above, by providing a plurality of the first fiducial marks 1332 and the second fiducial marks 1342 in the front-rear direction, it is possible to cope with various sizes of the semiconductor strips S, It is possible to solve the problem that the accuracy of image pickup by the image pickup device 2300 is low.

In particular, the position of the first fiducial mark 1332 located at the foremost position among the plurality of first fiducial marks 1332 is positioned forward of the second adsorption region 1320, and the positions of the plurality of second fiducial marks 1342 Of the large-sized semiconductor strip S (S) having a larger front-rear width than that of the second adsorption region 1320, by locating the position of the second fiducial mark 1342 located in the rear- The first fiducial mark 1332 and the second fiducial mark 1342 can be made to correspond to the front reference mark M1 and the rear reference mark M2 of the front fiducial mark M1.

Also, the first and second alignment blocks 1330 and 1340 may be disposed on the center line C of the adsorption plate 1300. The semiconductor strip S primarily picks up the front and rear reference marks M1 and M2 at a point where warpage occurs in the width direction and the semiconductor strip S is adsorbed and the warp effect is minimized, It is possible to improve the imaging accuracy of the image sensor 2300.

At least one first and second interlock pinholes 1333 and 1343 in which the interlock pins 2600 of the strip picker 2000 are inserted are provided on the upper portions of the first and second alignment blocks 1330 and 1340.

The semiconductor strip detection sensor 1350 is installed in front of the center of the adsorption plate 1300 so as to be positioned between the first and second flow paths 1311 and 1312 of the first adsorption region 1310. The semiconductor strip detection sensor 1350 detects whether or not the semiconductor strip S is seated on the adsorption plate 1300.

Even if the semiconductor strips S of various sizes are adsorbed on and adhered to the adsorption plate 1300 as the semiconductor strip detection sensor 1350 is positioned between the first and second flow paths 1311 and 1312, 1350 are always located at the bottom of the semiconductor strip S. Therefore, it is possible to easily detect whether or not the semiconductor strip S is seated regardless of the size of the semiconductor strip S.

The semiconductor strip arrival sensor 1360 is installed at the center rear of the alignment table 1100. The semiconductor strip arrival sensor 1360 detects whether or not the semiconductor strip S reaches a predetermined position in the backward direction of the adsorption plate 1300 when the semiconductor strip S is supplied from the on-loader section.

Hereinafter, the first inlet rail 1500 and the second inlet rail 1600 will be described.

The first inlet rail 1500 and the second inlet rail 1600 are a pair of inlet rails that guide the semiconductor strip S drawn out from the magazine and are respectively transportable in the Y axis direction.

The first inlet rail 1500 is installed on the alignment table 1100 so as to be movable leftward and rightward in the alignment table 1100 so as to be disposed on the left side of the suction plate 1300. The second inlet rail 1600 is mounted on the suction plate The first inlet rail 1500 and the second inlet rail 1600 are provided on the left and right sides of the alignment table 1100 so as to be disposed on the right side of the semiconductor strip S, Thereby aligning and / or aligning the semiconductor strip S.

The first inlet rail 1500 is installed in the first guide groove 1120 formed on the alignment table 1100 in the front and rear direction on the left side with respect to the center line C of the suction plate 1300. Accordingly, the first inlet rail 1500 moves along the first guide groove 1120, and thus it is possible to move left and right in the alignment table 1100, i.e., in the Y-axis direction.

The second inlet rail 1600 is installed in the second guide groove 1130 formed on the alignment table 1100 in the front and rear direction on the right side with respect to the center line C of the suction plate 1300. Accordingly, the second inlet rail 1600 moves along the second guide groove 1130 to move left and right in the alignment table 1100, i.e., in the Y-axis direction.

Each of the first inlet rail 1500 and the second inlet rail 1600 extends along the first guide groove 1120 and the second guide groove 1130 in the direction of the attraction plate 1300, The semiconductor strip S of a small size can be guided.

Each of the first inlet rail 1500 and the second inlet rail 1600 is disposed in a direction opposite to the adsorption plate 1300 along the first guide groove 1120 and the second guide groove 1130, The semiconductor strips S of medium or large size can be fixed.

In other words, the first and second inlet rails 1500 and 1600 move in the direction of the adsorption plate 1300 or the opposite direction of the adsorption plate 1300, The distance between the rails 1500 and 1600 can be adjusted.

The upper surfaces of the first inlet rail 1500 and the second inlet rail 1600 are positioned higher than the upper surface of the adsorption plate 1300. When the first inlet rail 1500 and the second inlet rail 1600 are moved in the direction of the adsorption plate 1300, the first inlet rail 1500 and the second inlet rail 1600 are connected to the inlet plate 1300 Thereby covering the upper surface.

In order to prevent interference between the adsorption plate 1300 and the inlet rail when the pair of inlet rails, that is, the first and second inlet rails 1500 and 1600, respectively, move in the Y axis direction toward the adsorption plate, The suction plate escape groove can be formed so that the suction plate 1300 can be escaped from the lower surface of the suction plate 1300.

The suction plate escape groove has a first suction plate recess groove 1511 formed in the lower surface of the first inlet rail 1500 and a second suction plate recess groove 1611 formed in the lower surface of the second inlet rail 1600 Lt; / RTI >

The first and second inlet rails 1500 and 1600 are respectively provided with the first and second adsorption plates 1500 and 1600 so that the first and second inlet rails 1500 and 1600 can be easily moved toward the adsorption plate 1300. [ The escape grooves 1510 and 1610 and the first and second adsorption pad recess grooves 1511 and 1611 are provided.

When the pair of inlet rails move in the Y-axis direction toward the adsorption plate, the adsorption plate 1300 of the adsorption plate escape grooves formed on the inlet rail, to prevent interference between the adsorption pad provided on the adsorption plate 1300 and the inlet rail, The adsorption pad may be provided at a position corresponding to the adsorption pad provided in the adsorption pad.

The adsorption pad escape groove includes a first adsorption pad escape groove 1511 formed in the first adsorption plate escape groove 1510 and a second adsorption pad escape groove 1511 formed in the second adsorption plate escape groove 1610, (1611).

The first adsorption pad recess groove 1511 prevents interference between the third adsorption pad 1324 and the first inlet rail 1500 and the second adsorption pad escape groove 1611 prevents interference between the fourth adsorption pad 1325 and the first adsorption pad Thereby preventing the interference of the two inlet rails 1600.

A first suction plate recess groove 1510 is formed on the lower right side of the first inlet rail 1500. The first suction plate recess groove 1510 is recessed upward in the right lower surface of the first inlet rail 1500.

The first suction plate recess groove 1510 is formed such that when the first inlet rail 1500 moves toward the adsorption plate 1300, that is, to the right, a portion of the upper left side of the adsorption plate 1300 is inserted, And prevents the first inlet rail 1500 from interfering with the movement of the first inlet rail 1500 toward the adsorption plate 1300, that is, the right side. In other words, the first adsorption plate recess groove 1510 allows the first inlet rail 1500 to smoothly move toward the adsorption plate 1300, that is, the right side, by the interference of the adsorption plate 1300.

In the first adsorption plate recess groove 1510, a first adsorption pad recess groove 1511 formed to be recessed upward is formed.

The first adsorption pad recess groove 1511 is inserted into the third adsorption pad 1324 when the first inlet rail 1500 moves toward the adsorption plate 1300, And prevents the first inlet rail 1500 from interfering with the movement of the first inlet rail 1500 toward the adsorption plate 1300, that is, the right side. In other words, the first adsorption pad recess groove 1511 allows smooth movement of the first inlet rail 1500 toward the adsorption plate 1300, that is, the right side, by interference of the third adsorption pad 1324 .

A plurality of first adsorption pad recesses 1511 may be formed in a number equal to the number of the plurality of third adsorption pads 1324. The arrangement of the first adsorption pad recesses 1511 may be the same as that of the plurality of third adsorption pads 1324 A plurality of adsorption plates can be arranged in the back-and-forth direction within the adsorption plate recess groove 1510.

A second suction plate recess groove 1611 is formed on the lower left side of the second inlet rail 1600. The second suction plate recess groove 1611 is recessed in the upper direction from the lower left side of the second inlet rail 1600.

The second suction plate recess groove 1611 is inserted into the upper right portion of the suction plate 1300 when the second inlet rail 1600 moves toward the suction plate 1300, And prevents the second inlet rail 1600 from interfering with the suction plate 1300 when it is moved to the left side. In other words, the second suction plate recess groove 1611 allows smooth movement of the second inlet rail 1600 toward the suction plate 1300, that is, the left side, by the interference of the suction plate 1300.

In the second adsorption plate recess groove 1611, a second adsorption pad recess groove 1611 formed to be recessed in the upward direction is formed.

The second adsorption pad escape groove 1611 is inserted into the fourth adsorption pad 1325 when the second inlet rail 1600 moves toward the adsorption plate 1300, And prevents the second inlet rail 1600 from interfering with the suction plate 1300 when it is moved to the left side. In other words, the second adsorption pad escape groove 1611 allows the second inlet rail 1600 to smoothly move toward the adsorption plate 1300, that is, the left side, by the interference of the fourth adsorption pad 1325 .

A plurality of second adsorption pad escape grooves 1611 may be formed in the same number as the plurality of fourth adsorption pads 1325 and the arrangement thereof may be the same as that of the plurality of fourth adsorption pads 1325 A plurality of adsorption plates can be arranged in the back-and-forth direction in the adsorption plate recess grooves 1611.

As described above, the first and second adsorption plate recess grooves 1510 and 1610 and the first and second adsorption pad recess grooves 1511 and 1611 are formed in the first and second inlet rails 1500 and 1600 The upper surface of the first and second inlet rails 1500 and 1600 and the upper surface of the adsorption plate 1500 are removed to remove the warp of the loaded semiconductor strip S or smoothly adsorb the aligned semiconductor strip S to the strip picker 2000. [ To optimize the height difference of the top surface of the wafer 1300.

The thickness of the first and second inlet rails 1500 and 1600 located above the adsorption plate 1300 increases and the upper surface of the first and second inlet rails 1500 and 1600 and the upper surface of the adsorption plate 1300 It is difficult to completely remove the warpage by the first and second inlet rails 1500 and 1600 when the warp of the semiconductor strip S is removed using the strip picker 2000 when the height difference is large, The adsorption force may not be transferred to the semiconductor strip S and the first and second adsorption plate recess grooves 1510 and 1610 and the first and second adsorption pad recess grooves 1511 and 1611 may be connected to the first and second inlet rails (1500, 1600).

When the upper surface of the adsorption plate 1300 is positioned lower than the lower surface of the first and second inlet rails 1500 and 1600 (i.e., the height of the adsorption plate 1300 is lower than the lower surface of the first and second inlet rails 1500 and 1600) The height of the first and second attracting plate escape grooves 1510 and 1610 may be less than the height of the rails 1500 and 1600). In this case, however, the third and fourth adsorption pads 1324 and 1325 can interfere with the movement of the first and second inlet rails 1500 and 1600 in the Y axis direction, that is, in the lateral direction, 2 absorption pad recesses 1511 and 1611 may be formed in the first and second inlet rails 1500 and 1600, respectively.

In this case, the first adsorption pad recess groove 1511 is recessed upward in the right lower surface of the first inlet rail 1500 so that when the first inlet rail 1500 moves in the direction of the adsorption plate 1300, And functions to insert the adsorption pad 1324. [ The second adsorption pad recess groove 1611 is recessed upward in the left lower surface of the second inlet rail 1600 so that when the second inlet rail 1600 is moved toward the adsorption plate 1300, 1325). Of course, even in the above case, the first and second adsorption pad escape grooves 1511 and 1611 are formed in the third and fourth adsorption pads 1324 and 1325 at positions corresponding to the third and fourth adsorption pads 1324 and 1325, And four adsorption pads 1324 and 1325 are provided.

Hereinafter, the operation of the loading unit 1000 when the semiconductor strip S having various sizes is loaded using the loading unit 1000 having the above-described configuration will be described.

For ease of explanation, the semiconductor strip S is divided into a small size, a medium size and a large size according to its size.

As shown in Figs. 11 (a) and 11 (b), the small-sized semiconductor strip S has a width in the lateral direction outside the first and second adsorption pads 1314 and 1315 of the first adsorption region 1310 And is smaller than the distance between the inside of the third and fourth adsorption pads 1324 and 1325 of the second adsorption region 1320. [

The semiconductor strip S of a medium size is formed so that the width of the semiconductor strip S is smaller than that of the third and fourth adsorption pads 1324 and 1325 of the second adsorption region 1320 as shown in Figures 10 (a) and 10 (b) Means a semiconductor strip S which is larger than the distance between the inside and the outside of the third and fourth adsorption pads 1324 and 1325.

The semiconductor strip S of a large size is electrically connected to the semiconductor strip S (S) larger than the distance between the outside of the third and fourth adsorption pads 1324 and 1325 of the second adsorption region 1320, as shown in Figs. 3 and 5 ).

First, a loading unit 1000 for mounting a semiconductor strip S of a large size will be described.

3 and 5, when the semiconductor strip S of a large size is placed on the loading section 1000, the first inlet rail 1500 is formed such that its inner surface is connected to the third adsorption pad 1324 And the second inlet rail 1600 is moved to the right so that its inner side is located outside the fourth adsorption pad 1325. [ Accordingly, the first and second inlet rails 1500 and 1600 are moved and set in a position where they open without covering the first and second adsorption regions 1310 and 1320. In this case, the distance between the inner surfaces of the first and second inlet rails 1500 and 1600 is set such that each of the inner surfaces of the first and second inlet rails 1500 and 1600 is located on the left and right sides And is set so as to support each of them.

The semiconductor strip S covers both the first adsorption region 1310 and the second adsorption region 1320 when the semiconductor strip S of a large size is placed on the adsorption plate 1300. [

As described above, as the semiconductor strip S covers both the first adsorption region 1310 and the second adsorption region 1320, the adsorption of the first adsorption region 1310 and the second adsorption region 1320 both operate .

In other words, the first suction portion communicated with the first connection portion 1313 of the first suction region 1310 operates to adsorb the inner region of the semiconductor strip S through the first and second absorption pads 1314 and 1315 The second suction portion communicating with the second connection portion of the second suction region 1320 operates and the outer region of the semiconductor strip S is adsorbed through the third and fourth absorption pads 1324 and 1325.

As described above, since the first adsorption region 1310 and the second adsorption region 1320 are all involved in the adsorption of the semiconductor strips S, the semiconductor strips S of a large size are easily adhered to the adsorption plate 1300 . In the case of the semiconductor strip S of a large size, the width of the semiconductor strip S may be longer than that of the small semiconductor strip S, and the semiconductor strip S, which is expanded by the pressure of the strip picker 2000, A restoring force may be generated in a direction opposite to the suction force of the adsorption plate 1300 and may not be in close contact with the adsorption plate 1300. Therefore, the first adsorption region 1310 and the second adsorption region 1320 may be all used to form a large size It is possible to prevent the deviation of the positions of the front reference mark M1 and the rear reference mark M2 due to the fact that the semiconductor strip S is not tightly adhered thereto It is possible to prevent the occurrence of an error in the alignment of the semiconductor strip S.

The front reference mark M1 of the semiconductor strip S is aligned with the first plurality of fiducial marks 1330 of the first alignment block 1330 when the large size semiconductor strip S is seated on the attracting plate 1300, The rear fiducial mark M2 of the semiconductor strip S is positioned behind the first fiducial mark 1332 located at the foremost position among the plurality of second fiducial marks 1342 of the second alignment block 1340, The second fiducial mark 1342 located at the rear end of the first fiducial mark 1342 is positioned at the front side.

The strip vision 2300 can easily pick up the first fiducial mark 1332 and the front reference mark M1 and the second fiducial mark 1342 and the rear reference mark M2, It is possible to check whether or not it is located at the correct position.

Hereinafter, the loading unit 1000 for mounting the semiconductor strip S having a medium size will be described.

As shown in Figs. 10 (a) and 10 (b), when the medium size semiconductor strip S is placed on the loading section 1000, The second inlet rail 1600 is moved to the right so as to be located inside the fourth adsorption pad 1325. The second inlet rail 1600 is moved to the left so as to be positioned inside the adsorption pad 1324, Accordingly, the first and second inlet rails 1500 and 1600 are moved to a position where the first and second inlet rails 1500 and 1600 cover a part of the second adsorption region 1320 and open without covering the first adsorption region 1310. [ In this case, the distance between the inner surfaces of the first and second inlet rails 1500 and 1600 is set such that each of the inner surfaces of the first and second inlet rails 1500 and 1600 is located on the left and right sides of the medium- And is set so as to support each of them.

As described above, when the first and second inlet rails 1500 and 1600 move inward of the adsorption plate 1300, each of the upper left side partial surface and the upper right partial surface of the adsorption plate 1300 is connected to the first inlet rail And a part of the third and fourth adsorption pads 1324 and 1325 are inserted into the first and second adsorption plate escape grooves 1510 and 1610 of the first and second adsorption plate epitaxial layers 1500 and 1500, So that the first and second inlet rails 1500 and 1600 can be easily moved toward the adsorption plate 1300.

The semiconductor strip S covers all of the first adsorption region 1310 but covers only a part of the second adsorption region 1320. In this case,

As described above, as the semiconductor strip S covers all of the first adsorption region 1310, only the part of the second adsorption region 1320 is covered, so that only the adsorption of the first adsorption region 1310 is activated.

In other words, the first suction portion communicated with the first connection portion 1313 of the first suction region 1310 operates to adsorb the inner region of the semiconductor strip S through the first and second absorption pads 1314 and 1315 And the second suction portion communicating with the second connection portion of the second suction region 1320 does not operate.

As described above, since only the first adsorption region 1310 is involved in the adsorption of the semiconductor strip S, it is possible to prevent a vacuum leak generated outside the medium size semiconductor strip S. In addition,

When the adsorption of the second adsorption region 1320 is performed, only a part of the semiconductor strip S of the medium size is adsorbed to the third and fourth adsorption pads 1324 and 1325 of the second adsorption region 1320. Specifically, So that vacuum leakage occurs in the third and fourth adsorption pads 1324 and 1325. Such vacuum leakage may interfere with the adhesion between the semiconductor strip S and the adsorption plate 1300, which may cause the positional deviation of the semiconductor strip S to be larger. In order to solve such a problem, in the case of the semiconductor strip S of a medium size, only the first adsorption region 1310 capable of adsorbing the entire bottom surface of the semiconductor strip S is adsorbed to the semiconductor strip S It is involved. This can be easily implemented because the adsorption of the first adsorption region 1310 and the second adsorption region 1320 is performed separately as described above.

Further, when a medium size semiconductor strip S is seated on the attracting plate 1300, the forward reference mark M1 of the semiconductor strip S is aligned with a plurality of first fiducial marks (not shown) of the first alignment block 1330 The rear fiducial mark M2 of the semiconductor strip S is positioned behind the first fiducial mark 1332 located at the foremost position among the plurality of second fiducial marks 1342 of the second alignment block 1340, The second fiducial mark 1342 located at the rear end of the first fiducial mark 1342 is positioned at the front side.

The strip vision 2300 can easily pick up the first fiducial mark 1332 and the front reference mark M1 and the second fiducial mark 1342 and the rear reference mark M2, It is possible to check whether or not it is located at the correct position.

Hereinafter, the loading unit 1000 for mounting the semiconductor strip S having a small size will be described.

11 (a) and 11 (b), when the medium size semiconductor strip S is placed on the loading section 1000, the first inlet rail 1500 has its inner surface, The second inlet rail 1600 is moved to the right so as to be positioned on the outer side of the adsorption pad 1314 and the inner side of the second inlet rail 1600 is located on the outside of the second adsorption pad 1315. Therefore, the first and second inlet rails 1500 and 1600 are moved and set to a position covering the entire second adsorption region 1320 and opening without covering the first adsorption region 1310. [ In this case, the distance between the inner surfaces of the first and second inlet rails 1500 and 1600 is set such that each of the inner surfaces of the first and second inlet rails 1500 and 1600 is located on the left and right sides And is set so as to support each of them.

As described above, when the first and second inlet rails 1500 and 1600 move inward of the adsorption plate 1300, each of the upper left side partial surface and the upper right partial surface of the adsorption plate 1300 is connected to the first inlet rail And the entirety of the third and fourth adsorption pads 1324 and 1325 is inserted into the first adsorption plate recess groove 1510 and the second adsorption plate recess groove 1610 of the first adsorption plate So that the first and second inlet rails 1500 and 1600 can be easily moved toward the adsorption plate 1300.

When the semiconductor strip S of a small size is placed on the adsorption plate 1300, the semiconductor strip S covers only the first adsorption region 1310. [

As described above, the semiconductor strip S covers all of the first adsorption region 1310, while the second adsorption region 1320 is not covered at all, only the adsorption of the first adsorption region 1310 is operated.

Since the operation for adsorption of the first adsorption region 1310 has been described in the medium-sized semiconductor strip S described above, it is omitted.

The selective control of the first adsorption region 1310 and the second adsorption region 1320 can be controlled according to the following criteria.

When the distance between the third flow path 1321 and the fourth flow path 1322 in the second adsorption region 1320 is larger than the length in the short side direction of the semiconductor strip S, And adsorbs the semiconductor strip S with the air pressure applied by the two flow paths 1311 and 1312. [

When the distance between the third flow path 1321 and the fourth flow path 1322 in the second adsorption region 1320 is smaller than the length in the short side direction of the semiconductor strip S, The semiconductor strip S is adsorbed by the pneumatic pressure applied by the second and third flow paths 1311 and 1312 and the third and fourth flow paths 1321 and 1322 of the second adsorption region 1320.

As described above, the present invention selectively controls the pneumatic pressure applied to the first adsorption region 1310 and the second adsorption region 1320 according to various sizes of the semiconductor strip S, The semiconductor strip S can be effectively adsorbed.

As described above, since only the first adsorption region 1310 is involved in the adsorption of the semiconductor strip S, there is an advantage that it is possible to prevent the adsorption of the unnecessary second adsorption region 1320, Since the adsorption of the adsorption region 1310 and the second adsorption region 1320 is performed separately, it can be easily implemented.

Further, when a small sized semiconductor strip S is mounted on the attracting plate 1300, the forward reference mark M1 of the semiconductor strip S is aligned with a plurality of first fiducial marks (not shown) of the first alignment block 1330 The rear fiducial mark M2 of the semiconductor strip S is positioned adjacent to the first fiducial mark 1332 in the rear of the second fiducial mark 1332 The second fiducial mark 1342 located at the foremost position among the plurality of second fiducial marks 1342 of the second fiducial mark 1342 is positioned adjacent to the front side.

The strip vision 2300 can easily pick up the first fiducial mark 1332 and the front reference mark M1 and the second fiducial mark 1342 and the rear reference mark M2, It is possible to check whether or not it is located at the correct position.

As described above, according to the semiconductor material cutting apparatus 100 according to the preferred embodiment of the present invention, unlike the conventional semiconductor material cutting apparatus, due to the configuration of the loading unit 1000, It is possible to easily adsorb the semiconductor strip (S)

The width of the semiconductor strip S in the left and right direction can be changed through the configuration of the first and the second adsorption regions 1310 and 1320 of the adsorption plate 1300, Can be easily achieved. Particularly, by individually controlling the adsorption of the first adsorption region 1310 and the second adsorption region 1320, it is possible to prevent occurrence of vacuum leakage or prevent unnecessary adsorption.

 The width of the semiconductor strip S corresponding to the change in the longitudinal width of the semiconductor strip S through the configuration of the first and second fiducial marks 1332 and 1342 of the first and second alignment blocks 1330 and 1340 of the attracting plate 1300 Whereby the alignment inspection of the semiconductor strip S can be easily achieved. In particular, a plurality of first and second fiducial marks 1332 and 1342 are arranged in the front-rear direction and are arranged in two rows, so that the first fiducial mark 1332 is arranged in the forward direction The second fiducial mark 1342 may be located in the vicinity of the rear reference mark M2. Therefore, the position of the first fiducial mark 1332, the front reference mark M1, the second fiducial mark 1342, and the rear reference mark M2 is imaged by the conventional strip vision 2300, can do.

The freedom of movement of the first and second inlet rails 1500 and 1600 in the Y-axis direction, that is, in the left and right direction, is assured through the configuration of the first and second inlet rails 1500 and 1600 of the loading unit 1000 Whereby the first and second inlet rails 1500 and 1600 can be moved to the inside of the region of the adsorption plate 1300. Therefore, the function of the inlet rail for fixing and / or aligning the semiconductor strip S corresponding to the semiconductor strips S of various sizes can be easily achieved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the following claims Or modified.

100: Semiconductor material cutting device
1000: Loading section 1100: Alignment table
1110: opening 1120: first guide groove
1130: second guide groove 1300: adsorption plate
1300a: adsorption plate cover 1300b: adsorption plate body
1301: Transfer robot 1310: First suction area
1311: first flow path 1311a: first communication hole
1312: Second flow path 1312a: Second communication line
1313: first connection part 1313a: first intake port
1314: first adsorption pad 1314a: first hole
1315: second adsorption pad 1315a: second hole
1320: second adsorption region 1321: third channel
1321a: Third communication hole 1322: Fourth passage
1322a: Fourth communication hole 1324: Third adsorption pad
1324a: third hole 1325: fourth adsorption pad
1325a: fourth hole 1330: first alignment block
1331: first protrusion 1332: first pivotal mark
1333: first interlock pinhole 1340: second alignment block
1342: Second Pivotal Mark 1343: Second Interlock Pinhole
1350: Semiconductor strip detection sensor 1360: Semiconductor strip arrival detection sensor
1370: fastening means
1500: First inlet rail 1510: First adsorption plate Escape groove
1511: first adsorption pad escape groove 1600: second inlet rail
1610: second adsorption plate recess groove 1611: second adsorption pad escape groove
2000: strip picker 2001: guide rail
2100: suction part 2200: gripper
2300: Strip Vision 2400: Strip Vision Driver
2500: Y-axis driving part 2600: interlock pin
3000: chuck table 3100: chuck table suction hole
3200: cutting escape groove
4000: Cutting section 5000: Cleaning section
6000: Unit Picker
S: semiconductor strip M1: forward reference mark
M2: rear reference mark C: center line

Claims (13)

A magazine in which a plurality of semiconductor strips are stacked, respectively;
A pair of inlet rails guiding the semiconductor strips drawn out from the magazine and provided so as to be respectively transportable in the Y axis direction;
An adsorption plate provided on the inside of the inlet rail for receiving a semiconductor strip supplied from the magazine;
A strip picker which is movable in the X axis direction by adsorbing the semiconductor strip which is seated on the adsorption plate and has a strip vision for inspecting the semiconductor strip on one side;
A chuck table which is provided with a semiconductor strip that is attracted to the strip picker, is movable in the Y-axis direction and is rotatable in the? Direction; And
And a cutting portion for cutting the semiconductor strip transferred to the chuck table into individual semiconductor packages,
Wherein the adsorption plate has a first adsorption region for adsorbing the semiconductor strip at an inner upper portion of the adsorption plate and a second adsorption region for adsorbing the semiconductor strip at an upper side of the adsorption plate,
Wherein the pneumatic pressure applied to the first adsorption region and the second adsorption region is selectively controlled according to the size of the semiconductor strip. The method according to claim 1,
Depending on the size of the semiconductor strip supplied to the adsorption plate,
Applying air pressure only to the first adsorption region,
Wherein air pressure is applied to both the first adsorption region and the second adsorption region. The method according to claim 1,
First and second flow paths for applying a pneumatic pressure to the first adsorption region
And third and fourth flow paths for applying a pneumatic pressure to the second adsorption region,
Wherein the first and second flow paths have a shorter flow path length than the third and fourth flow paths,
Wherein the first flow path communicates with the second flow path, and the third flow path communicates with the fourth flow path. The method of claim 3,
When the distance between the third flow path and the fourth flow path is larger than the length of the semiconductor strip in the short side direction, the semiconductor strip is adsorbed by the air pressure applied by the first and second flow paths,
And when the gap between the third flow path and the fourth flow path is smaller than the length in the short side direction of the semiconductor strip, the semiconductor strip is adsorbed by the air pressure applied by the first, second, third, A semiconductor material cutting device characterized by. The method of claim 3,
Further comprising an alignment block formed with a plurality of fiducial marks for imaging together with a fiducial mark formed on the semiconductor strip to exclude external influences when inspecting the semiconductor strip with the strip vision,
Wherein the alignment block is provided in the front and rear direction of the adsorption plate so as to inspect the fiducial marks provided in the alignment block while minimizing the influence of warpage of the semiconductor strip, Wherein the semiconductor chip is fixedly disposed at a center with respect to a short side direction. 6. The method of claim 5,
The strip picker further includes an interlock pin provided to be movable up and down,
And a plurality of interlock pin holes for inserting the interlock pins according to a size of the semiconductor strip are provided on the alignment block. 6. The method of claim 5,
In order to inspect the fiducial marks provided in the semiconductor strip and the alignment block regardless of the size of the semiconductor strip, the fiducial marks formed in the alignment block are arranged in a longitudinal direction parallel to the longitudinal direction of the semiconductor strip A plurality of semiconductor material cutting devices are provided. The method according to claim 1,
Wherein the adsorption plate comprises: an adsorption plate body having a flow path formed therein; And an adsorption plate cover provided on the adsorption plate body and having an adsorption hole for adsorbing the semiconductor strip which is seated on the upper part,
Wherein the suction plate cover is detachably mounted on the suction plate body. The method according to claim 1,
In order to prevent interference between the adsorption plate and the inlet rail when the pair of inlet rails move in the Y axis direction toward the adsorption plate, the suction plate escape grooves are formed in the lower surface of the inlet rail so that the adsorption plate can be escaped Is formed on the surface of the semiconductor material. 10. The method of claim 9,
Wherein a plurality of softly projected adsorption pads for stably adsorbing the semiconductor strip are provided on the upper portion of the adsorption plate. 11. The method of claim 10,
And a pair of inlet rails disposed on the inlet plate and each of the inlet and outlet rails, respectively, to prevent interference between the inlet and outlet rails provided on the suction plate when the pair of inlet rails move in the Y- And a suction pad recess groove is additionally provided at a position corresponding to the suction pad provided on the semiconductor chip. The method of claim 3,
Wherein the first flow path and the second flow path have an "H" shape by a communication flow path,
Further comprising a semiconductor strip sensor disposed between the first flow path and the second flow path so as to detect whether the semiconductor strip is seated on the suction plate regardless of the size of the semiconductor strip. Cutting device. The method of claim 3,
And a gripper which draws the semiconductor strip from the magazine and mounts the semiconductor strip on the adsorption plate is provided at one side of the strip picker,
The strip vision and the gripper are movable together in the Y-axis direction,
Wherein the suction plate is formed with a groove crossing an adsorption region in which the first flow path is formed and an adsorption region in which the second flow path is formed, and the gripper moves through the groove.

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