WO2023042649A1 - Electronic component processing device - Google Patents

Electronic component processing device Download PDF

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Publication number
WO2023042649A1
WO2023042649A1 PCT/JP2022/032473 JP2022032473W WO2023042649A1 WO 2023042649 A1 WO2023042649 A1 WO 2023042649A1 JP 2022032473 W JP2022032473 W JP 2022032473W WO 2023042649 A1 WO2023042649 A1 WO 2023042649A1
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WO
WIPO (PCT)
Prior art keywords
unit
electronic component
section
component holding
component
Prior art date
Application number
PCT/JP2022/032473
Other languages
French (fr)
Japanese (ja)
Inventor
日出夫 南
Original Assignee
上野精機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式会社 filed Critical 上野精機株式会社
Publication of WO2023042649A1 publication Critical patent/WO2023042649A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/84—Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
    • B65G47/841—Devices having endless travelling belts or chains equipped with article-engaging elements
    • B65G47/842—Devices having endless travelling belts or chains equipped with article-engaging elements the article-engaging elements being grippers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • the present disclosure relates to an electronic component processing apparatus.
  • the present disclosure provides an electronic component processing apparatus that is useful for improving processing efficiency.
  • An electronic component processing apparatus includes a component holding unit that holds an electronic component facing the electronic component along a predetermined first direction, and a circular orbit around a predetermined central axis. a support portion for supporting the component holding portion in a manner such as to cross the first direction, a transport drive portion for rotating the support portion around the central axis, and a first drive portion for moving the component holding portion along the first direction; and a second driving section that moves the component holding section along the second direction.
  • an electronic component processing apparatus useful for improving processing efficiency is provided.
  • FIG. 8A is a schematic diagram illustrating the state of the component holding portion during inspection.
  • FIG. 8B is a schematic diagram illustrating the state of the component holding portion during inspection.
  • FIG. 9 is a side view schematically showing an example of an electronic component processing apparatus.
  • FIG. 10 is a flow chart showing an example of a series of control processes executed by the controller.
  • the electronic component processing apparatus 1 shown in FIG. 1 is a so-called die sorter.
  • the processing apparatus 1 is an apparatus that, while transporting the electronic parts W, subjects the electronic parts W to processes such as appearance inspection, electrical property inspection, and marking, and then packs them in storage members such as carrier tapes and trays.
  • the electronic component W to be processed is, for example, a component that is separated into individual pieces by dicing or the like after being formed in a pre-process of semiconductor manufacturing.
  • the processing device 1 may be configured to process each of a plurality of types of electronic components W.
  • the type of electronic component W to be processed may be changed in units such as the number of processed parts or the number of days.
  • the processing apparatus 1 may continuously process electronic components W of one type and then continuously process electronic components W of another type.
  • a plurality of types of electronic components W that can be processed by the processing apparatus 1 may have different sizes.
  • the processing device 1 includes a transport processing unit 2 and a controller 100 .
  • the transport processing unit 2 is a unit that sequentially processes a plurality of electronic components W while transporting the plurality of electronic components W in sequence.
  • the transport processing unit 2 has a rotating transport unit 10 and a plurality of processing units 4 .
  • the support portion 12 supports the component holding portion 14 so as to be positioned on the circular orbit CR1.
  • the plurality of component holders 14 supported by the supporter 12 are positioned on the circular orbit CR1.
  • the support portion 12 is provided so as to be rotatable around the central axis Ax1 of the circular orbit CR1.
  • the circular orbit CR1 may be a horizontal circular orbit, and the central axis Ax1 may be a vertical axis (may extend along the vertical direction).
  • the support portion 12 is, for example, a turntable.
  • the plurality of component holding portions 14 are arranged at equal intervals along the circumference around the central axis Ax1 and are fixed (attached) to the support portion 12 .
  • Each of the component holding portions 14 is configured to hold an electronic component W.
  • the component holding portion 14 holds the electronic component W while facing the electronic component W along a predetermined direction.
  • the component holding section 14 may hold the electronic component W by any method. Specific examples of the method for holding the electronic component W include vacuum adsorption, electrostatic adsorption, gripping, and the like.
  • the component holding section 14 may vacuum-suck one of the main surfaces Wa and Wb from one side in a direction perpendicular to the support section 12 (upper surface of the turntable).
  • the component holding section 14 has a suction section 20, a holder 22, and an elevating section 24, as shown in FIG.
  • the suction unit 20 (component holding unit) is configured to suck either main surface Wa or Wb of the electronic component W from above.
  • the suction part 20 is, for example, a suction rod configured to extend perpendicularly to the support part 12, and sucks the main surface Wa of the electronic component W at its lower end.
  • a suction hole that applies a suction force to the electronic component W may be provided on the lower surface of the suction unit 20 .
  • the holder 22 is arranged outside the support portion 12 and holds the adsorption portion 20 . This disclosure uses the terms “inner” and "outer” with respect to the central axis.
  • the lifting section 24 supports the holder 22 and is fixed to the support section 12 so as to be movable up and down. Details of the lifting unit 24 will be described later.
  • the rotary transfer unit 10 has a plurality of advance/retreat drive units 25 and installation units 28 .
  • the plurality of forward/backward drive portions 25 are provided so as to correspond to the plurality of component holding portions 14 respectively.
  • FIG. 2 shows one advance/retreat drive unit 25 out of the plurality of advance/retreat drive units 25 .
  • the advance/retreat drive section 25 (second drive section) moves the corresponding component holding section 14 along a direction (second direction) intersecting the central axis Ax1.
  • crossing includes crossing in a state of being in a twisted position (relationship) with each other, such as a so-called grade crossing.
  • the direction in which the component holding portion 14 is moved by the forward/backward driving portion 25 may be the radial direction (second direction) of the circular orbit CR1.
  • the term "radial direction” means the radial direction of the circular orbit CR1 unless otherwise specified.
  • the direction connecting the component holding portion 14 to be driven and the central axis Ax1 at the shortest distance corresponds to the radial direction.
  • the forward/backward drive unit 25 moves the component holding unit 14 in a direction away from the central axis Ax1 or in a direction closer to the central axis Ax1. Movement of the component holding portion 14 along the radial direction changes the distance between the component holding portion 14 and the central axis Ax1.
  • the lower surface of the movable portion 32 is connected to the base portion 29a of the installation portion 28 so as to be movable along the radial direction.
  • the movable portion 32 supports the base portion 31 .
  • the receiving portion 34 protrudes downward from the lower surface of the base portion 31 at the inner end portion of the base portion 31 .
  • An outward driving force from the motor 27 is applied to the receiving portion 34 .
  • the connecting portion 35 extends downward from the lower surface of the base portion 31 and is provided so as to sandwich the movable portion 32 with the receiving portion 34 in the radial direction.
  • the connecting portion 35 faces the projecting portion 29b of the installation portion 28 in the radial direction and is positioned inside the projecting portion 29b.
  • the spring 37 is provided between the projecting portion 29b and the connecting portion 35, and is configured to generate a reaction force as the advancing/retreating portion 26 moves.
  • the lifting section 24 includes a movable section 42 , extension sections 44 a and 44 b , a receiving section 46 and a spring 48 .
  • the movable portion 42 is connected to the outward facing side surface of the extending portion 38 so as to be movable along the direction in which the central axis Ax1 extends (the Z-axis direction in the drawing).
  • the extending portion 44 a is connected to the movable portion 42 so as to sandwich the movable portion 42 with the extending portion 38 .
  • the extending portion 44 a is formed to extend along the central axis Ax ⁇ b>1 and projects upward from the upper surface of the base portion 31 .
  • the spring 48 is provided between the extending portion 44b and the base portion 31, and is configured to generate a reaction force as the lifting portion 24 moves. Elevator 24 may include two springs 48 . At least one spring 48 may be covered by a receiving portion 46 when viewed from above.
  • the transport drive section 16 is configured to rotate the support section 12 around the central axis Ax1 of the circular track CR1.
  • the transport driving unit 16 uses a power source such as an electric motor to rotate the support unit 12 around the central axis Ax1 by direct driving without gears.
  • the rotation of the support portion 12 causes the plurality of component holding portions 14 to move along the circular orbit CR1.
  • the electronic component W held by the component holding section 14 is conveyed along the circular track CR1.
  • the elevation driving section 18 moves the component holding section 14 along the direction in which the component holding section 14 and the electronic component W held by the component holding section 14 face each other.
  • the direction (first direction) in which the component holding portion 14 and the electronic component W held by the component holding portion 14 face each other may be parallel to the central axis Ax.
  • the tangential direction of the circular orbit CR1 intersects the direction in which the component holding portion 14 and the electronic component W face each other.
  • the elevation driving section 18 may move the component holding section 14 along the direction in which the central axis Ax1 extends.
  • the plurality of elevation drive sections 18 are configured to individually raise and lower the plurality of component holding sections 14 .
  • illustration of the elevation driving section 18 is omitted, and in FIG. 2, one elevation driving section 18 out of the plurality of elevation driving sections 18 is shown.
  • the elevation driving unit 18 applies an external force to the component holding unit 14 arranged at the stop position SP, thereby moving the component holding unit 14 to one side in the direction perpendicular to the support unit 12 .
  • the elevation driving unit 18 moves the component holding unit 14 downward, for example, in the vertical direction.
  • the holder 52 is fixed to the outer peripheral portion of the fixed portion 11 vertically above the outer peripheral edge of the support portion 12 .
  • the outer peripheral surface of the holder 52 has a protruding portion 52a that protrudes outward from the outer side surface of the lower half of the holder 52, and a recess 52b that is recessed (recessed) inward from the side surface of the lower half of the holder 52. is provided.
  • the movable portion 53 is connected to the side surface of the lower half region of the holder 52 so as to be movable along the direction in which the central axis Ax1 extends (for example, the Z-axis direction in the drawing).
  • the lifting rod 54 is shaped like a bar extending in a direction parallel to the central axis Ax ⁇ b>1 and is supported (connected) by the movable portion 53 .
  • the receiving portion 55 is connected to the upper end portion of the lifting rod 54 and is formed to extend inward from the connecting portion with the lifting rod 54 as a starting point.
  • the receiving portion 55 is arranged so as to cover the projecting portion 52a.
  • a motor 58 applies a driving force to the receiving portion 55 for lowering the lifting rod 54 .
  • the spring 56 is provided between the receiving portion 55 and the projecting portion 52a, and is configured to generate a reaction force as the lifting rod 54 and the receiving portion 55 move.
  • the following operations are performed when moving the adsorption section 20 along the direction (vertical direction) in which the central axis Ax1 extends.
  • a downward force is applied to the receiving portion 55 by the motor 58 .
  • the movable portion 53 and the lifting rod 54 are lowered.
  • a downward force is applied to the receiving portion 46 of the lifting portion 24 by the descent of the lifting rod 54 .
  • the movable portion 42 and the extension portions 44a and 44b are lowered, and as a result, the adsorption portion 20 is lowered together with the holder 22.
  • an outward force is applied to the receiving portion 34 by the motor 27 of the forward/backward driving portion 25 .
  • the retractable portion 26 moves away from the central axis Ax1.
  • the movement of the advance/retreat portion 26 causes the elevating portion 24 to move outward, and as a result, the suction portion 20 moves outward together with the holder 22 .
  • a plurality of processing units 4 are provided so as to correspond to several stop positions SP, respectively, as shown in FIG. Unlike the example shown in FIG. 1, each of the stop positions SP may be provided with a processing unit 4 .
  • the processing unit 4 is configured to perform predetermined processing on the electronic component W held by the component holding section 14 arranged at the corresponding stop position SP.
  • Several processing units 4 may be arranged below the corresponding stop position SP.
  • processing performed on the electronic component W includes any action that changes the state of the electronic component W. For example, marking the electronic component W, causing the electronic component W to be held by the component holding unit 14 (handing over), and recovering the electronic component W from the component holding unit 14 (receiving) are referred to as “processing ”. Further, executing some kind of inspection on the electronic component W also corresponds to "processing" because it changes a state in which the inspection data is unknown to a state in which the inspection data is known.
  • the multiple processing units 4 include, for example, a component supply unit 6 , a component recovery unit 7 and one or more intermediate processing units 8 .
  • the component supply unit 6 is a unit that supplies electronic components W to the rotary transfer unit 10 .
  • the component supply unit 6 is arranged so as to correspond to one of the stop positions SP.
  • the component supply unit 6 moves, for example, a storage member (for example, a wafer sheet) in which a plurality of electronic components W are stored, thereby arranging each electronic component W in order vertically below the corresponding stop position SP. .
  • the component holding portion 14 placed at the corresponding stop position SP is lowered by the elevation driving portion 18 and receives the electronic component W placed vertically below the stop position SP.
  • the electronic component W is supplied from the component supply unit 6 to the rotary transfer unit 10 .
  • the supply stop position SP1 where the component supply unit 6 supplies the electronic component W is referred to as a "supply position SP1".
  • the component recovery unit 7 is a unit that recovers the electronic components W from the rotary transfer unit 10.
  • the component recovery unit 7 is arranged so as to correspond to one of the stop positions SP.
  • the component recovery unit 7 moves, for example, a storage member (for example, a carrier tape) capable of storing a plurality of electronic components W so that each storage portion included in the storage member is vertically aligned with the corresponding stop position SP. Place them in order below.
  • the component holding portion 14 arranged at the corresponding stop position SP is lowered by the elevation driving portion 18, and delivers the electronic component W to the accommodation portion arranged below the stop position SP.
  • the recovery stop position SP at which the component recovery unit 7 recovers the electronic components W will be referred to as a "recovery position SP2".
  • the intermediate processing unit 8 is arranged so as to correspond to any stop position SP other than the supply position SP1 and the recovery position SP2, and is a unit that performs predetermined processing on the electronic component W.
  • the intermediate processing unit 8 processes the electronic component W at a stop position SP located downstream of the supply position SP1 and upstream of the collection position SP2 on the circular track CR1.
  • Specific examples of processing by the intermediate processing unit 8 include electrical property inspection, optical property inspection, appearance inspection, posture or position correction, and marking (laser marking).
  • the appearance inspection unit 60 inspects the appearance of the side surface Wc, for example, by capturing an image of one side surface Wc of the electronic component W held by the component holding unit 14 arranged at the inspection position IP.
  • an image captured by the visual inspection unit 60 is used to inspect the presence or absence of a flaw, chipping, or foreign matter on the side surface Wc, which is the surface to be inspected.
  • the appearance inspection unit 60 may include a camera 62 that takes an image of the side surface Wc using visible light.
  • the camera 62 is arranged so as not to interfere with the movement of the plurality of component holders 14 by the transport drive unit 16, and its position may be fixed.
  • the imaging range of the camera 62 (hereinafter referred to as "imaging range PA") is constant.
  • the width of the imaging range PA by the camera 62 may be smaller than the width of the side surface Wc, and the vertical width of the imaging range PA by the camera 62 is equal to the vertical width of the side surface Wc. may be greater than
  • the imaging range PA (field of view) of the camera 62 may be set to be smaller than the entire side surface Wc.
  • a controller 100 controls the transport processing unit 2 .
  • the controller 100 is composed of one or more control computers.
  • the controller 100 controls the transport processing unit 2 according to a predetermined control procedure so that a plurality of electronic components W are sequentially subjected to predetermined processing.
  • the transport control unit 112 controls the transport driving unit 16 so that the support unit 12 is repeatedly rotated and stopped at the angular pitch between the component holding units 14 adjacent to each other on the circular track CR1.
  • the component holding portion 14 suction portion 20 stops at the above-described stop position SP, and the component holding portion 14 moves from the stop position SP to the next stop position SP. (Adsorption part 20) movement is repeated.
  • the elevation control section 114 controls the elevation driving section 18 corresponding to the stop position SP so as to lower the component holding section 14 (suction section 20) placed at the stop position SP.
  • the elevation control unit 114 moves the component holding unit 14 by the elevation driving unit 18. Lower and raise to original position.
  • the elevation driving section 18 moves the component holding section 14 along the central axis Ax ⁇ b>1 toward or away from the processing unit 4 .
  • the advance/retreat control section 116 controls the advance/retreat drive section 25 so as to move the component holding section 14 along the radial direction of the circular track CR1.
  • the advance/retreat control unit 116 causes the advance/retreat driving unit 25 to move the component holding unit 14 along the radial direction so as to change the radial position of the component holding unit 14 when arranged at the inspection position IP.
  • the advance/retreat control portion 116 may move the component holding portion 14 by the advance/retreat driving portion 25 so as to return to the position before movement.
  • the memory 154 temporarily stores the program loaded from the storage medium of the storage 156 and the calculation result by the processor 152 .
  • the processor 152 configures each functional module of the controller 100 by executing the program in cooperation with the memory 154 .
  • the input/output port 158 performs input/output of electrical signals with each element of the transport processing unit 2 according to instructions from the processor 152 .
  • the timer 162 measures the elapsed time by, for example, counting reference pulses of a constant cycle.
  • the circuit 150 is not necessarily limited to configuring each function by a program.
  • the circuit 150 may configure at least part of its functions by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrating this.
  • FIG. 5 is a flow chart showing a series of control procedures when one electronic component W having a large size is transported to the inspection position IP and the electronic component W is inspected.
  • the controller 100 executes step S11 in a state in which the suction unit 20 holding the electronic component W to be inspected is positioned at the stop position SP one upstream of the inspection position IP.
  • step S11 for example, the transport control unit 112 controls the transport driving unit 16 so that the suction unit 20 holding the electronic component W to be inspected is arranged at the inspection position IP.
  • step S11 as shown in FIG. Move to inspection position IP.
  • step S12 for example, the inspection control unit 118 controls the camera 62 so as to acquire a captured image of the central portion of the side surface Wc.
  • step S13 for example, the advance/retreat control unit 116 controls the advance/retreat driving unit 25 to move the suction unit 20 outward along the radial direction of the circular orbit CR1.
  • the advance/retreat control unit 116 has an imaging range PA in which a left portion (inward portion) of the side surface Wc of the electronic component W held by the suction unit 20 is located to the left of the central portion.
  • the adsorption unit 20 is moved by the advance/retreat driving unit 25 so as to be in the state.
  • step S16 the inspection control unit 118 controls the camera 62 so as to acquire a captured image of the right portion of the side surface Wc.
  • the camera 62 By executing the control processing up to step S16, the camera 62 (appearance inspection unit 60) performs a plurality of times of imaging in a state where the positions of the electronic component W in the radial direction are different from each other. Image data for the entire side surface Wc is obtained by imaging the side surface Wc a plurality of times (three times in this example).
  • step S17 for example, the advance/retreat control unit 116 controls the advance/retreat driving unit 25 to return the suction unit 20 to the position before the start of step S13.
  • step S18 for example, the inspection control unit 118 determines whether there is an abnormality in the side surface Wc based on the image data obtained in steps S12, S14, and S16.
  • step S19 the transport control unit 112 controls the transport driving unit 16 so that the suction unit 20 holding the inspected electronic component W is arranged at the stop position SP one ahead of the inspection position IP. .
  • the inspection performed on one electronic component W using the appearance inspection unit 60 is completed.
  • step S19 another suction unit 20 holding the next electronic component W to be inspected is arranged at the inspection position IP.
  • the controller 100 repeatedly executes a series of control processes from steps S12 to S19.
  • the controller 100 may execute steps S17 and S19 in parallel so that their execution timings at least partially overlap.
  • the controller 100 may execute step S13 during execution of step S11, and execute step S12 after execution of step S17.
  • One electronic component W is inspected by moving the suction unit 20 to one side along the radial direction while the component holding unit 14 is rotated (rotation of the support unit 12) by the transport driving unit 16. can shorten the time required for
  • the camera 62 may image the side surface Wc of one electronic component W twice while changing the radial position of the suction unit 20 by the forward/backward driving unit 25. , imaging may be performed four times or more. If the size of the electronic component W is small, the entire side surface Wc, which is the surface to be inspected, may be included in the imaging range PA. In this case, the controller 100 may image the side surface Wc of the electronic component W once without changing the radial position of the suction unit 20 by the forward/backward driving unit 25 .
  • the advance/retreat driving portion 25 for moving the component holding portion 14 (suction portion 20) in the radial direction is provided in the support portion 12.
  • the advance/retreat driving portion for moving the component holding portion 14 in the radial direction is , may be provided so as not to rotate together with the support portion 12 .
  • the rotary transfer unit 10A shown in FIG. 7 has a component holding section 14A instead of the component holding section 14, and a forward/backward drive section 70 instead of the forward/backward drive section 25. As shown in FIG.
  • the component holding portion 14A (the suction portion 20 of the component holding portion 14A) is moved along the direction in which the central axis Ax1 extends by the elevation driving portion 18, and is moved in the radial direction of the circular orbit CR1 around the central axis Ax1 by the forward/backward driving portion 70. move along.
  • the component holding section 14A has an elevating section 24 and an advancing/retracting section 82 .
  • the elevating section 24 of the component holding section 14A is configured in the same manner as the elevating section 24 of the component holding section 14 except that it is connected to the advance/retreat section 82 .
  • the advance/retreat portion 82 is provided on the support portion 12 so as to be movable along the radial direction, and holds the movable portion 42 of the elevation portion 24 so as to be able to move up and down.
  • the retractable portion 82 has, for example, a movable portion 84 , an extending portion 88 and a receiving portion 86 .
  • the movable portion 84 is provided on the outer peripheral portion of the support portion 12 so as to be movable along the radial direction. One end of the movable portion 84 protrudes outward from the outer peripheral edge of the support portion 12 .
  • An extending portion 88 extending downward from the tip is connected to the tip of the outer peripheral side of the movable portion 84 .
  • the movable portion 42 of the elevating portion 24 is connected to the side surface of the extending portion 88 facing outward.
  • the receiving portion 86 is connected to the lower surface of the movable portion 84 and extends downward from the connecting portion.
  • the receiving portion 86 extends below the lower surface of the supporting portion 12 , and the supporting portion 12 has a shape that does not hinder the radial movement of the receiving portion 86 .
  • the advance/retreat drive section 70 (second drive section) moves the component holding section 14 (suction section 20) along the radial direction.
  • the advance/retreat drive portion 70 is provided so as not to move with the rotation of the support portion 12 .
  • the processing apparatus 1 may include a base portion 79 on which the transport driving portion 16 and the like are installed.
  • the advance/retreat drive section 70 may be provided on the base section 79 .
  • the forward/backward drive unit 70 moves the component holding unit 14 (suction unit 20) arranged at the inspection position IP along the radial direction. While the forward/backward drive unit 25 moves the corresponding component holding unit 14, the forward/backward drive unit 70 moves one of the component holders 14 arranged at the inspection position IP.
  • the rotary transport unit 10A has an advance/retreat drive unit 70 at a position corresponding to a stop position SP (for example, an inspection position IP) that moves the component holding unit 14 in the radial direction, and a stop position that does not move the component holding unit 14 in the radial direction.
  • the position SP may not have a forward/backward drive unit.
  • the advancing/retreating drive unit 70 has, for example, a holder 72, an advancing/retreating rod 74, and a motor 76.
  • the holder 72 is provided on the base portion 79 . Therefore, the holder 72 does not move even when the support portion 12 rotates.
  • the advance/retreat rod 74 is provided on the holder 72 so as to be movable with respect to the holder 72 .
  • the advance/retreat rod 74 is formed in a rod shape so as to extend along the radial direction of the circular track CR1, and is held by the holder 72 so as to be movable along the radial direction.
  • the advance/retreat rod 74 is arranged inside the receiving portion 86 .
  • a motor 76 applies a driving force to the advancing/retreating rod 74 to move it outward.
  • the driving force of the motor 76 causes the advancing/retreating rod 74 to move outward along the radial direction.
  • An external force is applied from the advance/retreat rod 74 to the receiving portion 86 by the outward movement of the advance/retreat rod 74 .
  • the movable portion 84 and the lifting portion 24 move outward along the radial direction.
  • the suction portion 20 held by the holder 22 moves outward along the radial direction.
  • the adsorption portion 20 returns to the position before it moved.
  • the series of control processes shown in FIG. 5 may also be executed in the processing apparatus 1 including the rotary transfer unit 10A.
  • the rotary transfer unit 10 may have a rotary drive section 19 .
  • the rotation drive unit 19 is a drive unit that rotates the suction unit 20 (component holding unit) around the central axis Ax2.
  • the central axis Ax2 is an axis parallel to the central axis Ax1.
  • the central axis Ax2 may be set so as to pass through the center of the lower surface of the adsorption section 20 .
  • the rotary drive unit 19 is fixed to the holder 22 and may move as the holder 22 moves up and down or advances and retreats along the radial direction.
  • the rotary transfer unit 10 may have a plurality of rotary drive sections 19 corresponding to the plurality of suction sections 20 respectively.
  • the rotation drive unit 19 rotates the suction unit 20 holding the electronic component W around the central axis Ax2, thereby changing the posture of the electronic component W around the central axis Ax2.
  • the controller 100 may have an attitude control section 122 as a functional module, as shown in FIG.
  • the attitude control section 122 controls the rotation driving section 19 so as to change the attitude of the electronic component W held by the suction section 20 about the central axis Ax2.
  • the rotation drive unit 19 not only one side surface Wc but also one or more other side surfaces Wc may be imaged by the camera 62 of the visual inspection unit 60.
  • the camera 62 may sequentially capture images of the four side surfaces Wc.
  • the camera 62 may take multiple images of the other side surface Wc while changing the position of the suction unit 20 in the radial direction.
  • the posture control unit 122 may control the rotation drive unit 19 to rotate the adsorption unit 20 by 90° around the central axis Ax2. good.
  • the other side Wc faces the camera 62 .
  • the controller 100 may execute a series of control procedures of steps S12 to S17 for the other side surface Wc.
  • the attitude control unit 122 may change the attitude of the electronic component W around the central axis Ax2 by using the rotation driving unit 19.
  • the electronic component W may be inspected using light (for example, near-infrared rays) that passes through the electronic component W.
  • FIG. The rotary transfer unit 10 has, for example, a visual inspection unit 60A instead of the visual inspection unit 60.
  • the visual inspection unit 60A has an irradiation section 64 and an imaging section 66, as shown in FIG. 8(a).
  • the irradiation unit 64 and the imaging unit 66 may be arranged so as to sandwich the electronic component W to be inspected.
  • the irradiation unit 64 and the imaging unit 66 are arranged so as not to interfere with movement of the component holding unit 14 by the transport driving unit 16 .
  • the processing apparatus 1 may include another rotary transfer section that supplies electronic components W to the rotary transfer unit 10 .
  • the component supply unit 6 has a rotating transport section 90 and a position adjusting section 98, as shown in FIG.
  • the rotary transfer unit 90 is a so-called rotary pickup, receives the electronic component W from the supply unit 99, moves it along the circular track CR3, and delivers the electronic component W to the component holding unit 14 (suction unit 20).
  • the rotary transfer section 90 has a rotor 91 , a plurality of component holding sections 92 and a transfer drive section 96 .
  • the rotor 91 is provided below the stop position SP (supply position SP1 described above) corresponding to the component supply unit 6 so as to be rotatable around the horizontal central axis Ax3.
  • the plurality of component holding portions 92 are arranged at equal intervals along the circumference around the central axis Ax3 and are fixed to the rotor 91 .
  • the component holding portion 92 has a suction portion 94 configured to suck the electronic component W toward the outside of the circular track CR3 at the radial end portion of the circular track CR3.
  • the position adjusting section 98 adjusts the position of the component holding section 92 with respect to the component holding section 14 arranged at the supply position SP1.
  • the position adjusting section 98 illustrated in FIG. 9 moves the rotor 91 so as to adjust the position of the component holding section 14 in the direction along the central axis Ax3 when it is arranged at the uppermost stop position SP3.
  • the processing device 1 may further include a detection unit 68 as an example of a processing unit that processes the electronic component W held by the component holding section 92 .
  • the detection unit 68 detects the state of the electronic component W held by the component holding section 92 at a stop position SP3 located upstream of the uppermost stop position SP3.
  • the detection unit 68 detects, for example, the displacement of the electronic component W with respect to the component holding portion 92 and the inclination with respect to the component holding portion 92 at the stop position SP3. That is, the detection unit 68 detects positional deviation and inclination of the electronic component W with respect to the component holding portion 92 before the electronic component W moves from the component holding portion 92 to the component holding portion 14 .
  • the positional displacement of the electronic component W with respect to the component holding portion 14 after moving to the component holding portion 14 is smaller than the positional displacement of the electronic component W with respect to the component holding portion 92 before moving to the component holding portion 14.
  • the forward/backward driving unit 25 and the position adjusting unit 98 are controlled so that The controller 100 controls the rotation driving section 19 so that the inclination of the electronic component W (inclination relative to the ideal state) becomes smaller after moving to the component holding section 14 .
  • step S32 for example, the processing control unit 124 causes the transport drive unit 96 to move the rotor so that the component holding unit 92 (suction unit 94) that holds the electronic component W to be supplied is positioned at the uppermost stop position SP3. Rotate 91.
  • step S33 the transport control unit 112 causes the transport driving unit 16 to rotate the supporting unit 12 so that the suction unit 20, which is to receive the electronic component W to be supplied, is arranged at the supply position SP1.
  • step S34 for example, the advance/retreat control unit 116 and the processing control unit 124 advance/retreat so as to adjust the relative position of the suction unit 20 with respect to the electronic component W held by the component holding unit 92 arranged at the uppermost stop position SP3. It controls the driving section 25 and the position adjusting section 98 respectively.
  • the advance/retreat control unit 116 and the processing control unit 124 adjust the positional deviation (for example, , the difference between the centers) is reduced.
  • step S ⁇ b>36 for example, the transfer control unit 126 controls the rotary transfer unit 10 so as to release the suction of the electronic component W by the suction unit 94 after starting the suction of the electronic component W by the lowered suction unit 20 .
  • step S ⁇ b>37 for example, the elevation control unit 114 raises the adsorption unit 20 by the elevation drive unit 18 so that the adsorption unit 20 that has received the electronic component W is returned to its original height.
  • step S38 for example, the advance/retreat control unit 116 controls the advance/retreat drive unit 25 to return the suction unit 20 to the position before execution of step S34, and the process control unit 124 returns the rotor to the position before execution of step S34.
  • the position adjuster 98 is controlled so that the 91 is returned.
  • step S39 for example, the posture control unit 122 causes the rotation driving unit 19 to reduce the inclination of the electronic component W with respect to the ideal state, according to the inclination of the electronic component W with respect to the component holding unit 92 obtained in step S31.
  • the adsorption portion 20 is rotated around the central axis Ax2.
  • the controller 100 may repeat the series of control processes of steps S31 to S39 for each of the subsequent electronic components W.
  • the electronic component W is sandwiched between the suction unit 20 and the suction unit 94 of the component holding unit 92 (the state in which both the suction units are in contact with the main surfaces Wa and Wb of the electronic component W). ), the delivery of the electronic component W may be performed.
  • the transfer is performed while both of the adsorption portions are in contact with each other will be described in detail, including the configuration of the apparatus.
  • the rotary transfer unit 10 has a suction section 101 that generates a suction force for sucking the electronic component W in the suction section 20 .
  • the suction unit 101 includes, for example, a suction path 102 and a valve 103 .
  • the suction path 102 connects the suction hole of the suction section 20 and a suction pump (for example, a vacuum pump).
  • a valve 103 is provided in the suction path 102 .
  • the valve 103 switches between open and closed states of the flow path in the suction path 102 according to the input of the control signal.
  • the rotary transfer unit 10 may have a load detection section 108 (load sensor) capable of detecting the load applied to the electronic component W when the adsorption section 20 is lowered.
  • the load detection unit 108 may be provided in the elevation driving unit 18 (elevating rod 54). After the suction portion 94 of the component holding portion 92 holds the electronic component W and the suction portion 20 descends to contact the electronic component W, the reaction force from the electronic component W is applied to the suction portion 20 .
  • the load detector 108 may detect the load applied to the electronic component W by detecting the reaction force.
  • the lifting drive section 18 may have a load adjustment section 109 that adjusts the load applied to the electronic component W. As shown in FIG.
  • the load adjuster 109 is, for example, a voice coil motor.
  • step S35 the elevation control section 114 causes the elevation drive section 18 to lower the adsorption section 20 to a predetermined target position.
  • the target position is set to such an extent that the suction unit 20 and the main surface Wa of the electronic component W are in contact with each other without providing a clearance between the lower surface of the suction unit 20 and the electronic component W.
  • the lift control unit 114 controls the lift drive unit 18 to decelerate the suction unit 20 after the suction unit 20 reaches a predetermined deceleration start position before the suction unit 20 reaches the target position. You may
  • the delivery control unit 126 controls the load (the value detected by the load detection unit 108) applied to the electronic component W from the adsorption unit 20 after the adsorption unit 20 contacts the electronic component W to be equal to or less than a preset allowable load. You may control the load adjustment part 109 at time.
  • the delivery control unit 126 may cause the valve 103 of the suction unit 101 to transition from the closed state to the open state so that the lowered suction unit 20 starts sucking the electronic component W.
  • the delivery control unit 126 may cause the valve 107 of the suction unit 105 to transition from the open state to the closed state so as to release the suction of the electronic component W by the suction unit 94 .
  • the two suction portions are in contact with the main surfaces Wa and Wb facing opposite to each other, and the electronic component W is sucked by the two suction portions.
  • the electronic component W is handed over to the suction unit.
  • troubles such as dropping of the electronic component W during delivery can be suppressed.
  • the suction portion 94 may move upward when the electronic component W is transferred.
  • the position of the electronic component W is corrected when the electronic component W is supplied, and the posture of the electronic component W is corrected while the electronic component W is held by the suction unit 20 . Therefore, at the stop position SP downstream of the supply position SP1, it is necessary to arrange an alignment unit configured to receive the electronic component W from the component holding unit 14, correct the position and orientation, and then return it to the component holding unit 14. do not have. In this case, since the number of times the electronic parts W are transferred in the processing apparatus 1 is reduced, troubles such as dropping of the electronic parts W are suppressed, and the processing efficiency can be improved.
  • the forward/backward driving unit that moves the component holding unit 14 along the radial direction of the circular orbit CR1 25, 70 are provided.
  • the rotary transfer units 10 and 10A move the component holding section 14 along a direction (second direction) that is different from the radial direction of the circular track CR1 and intersects the central axis Ax1.
  • a drive section that moves the component holding section 14 along one of the directions intersecting the central axis Ax1 may be provided in the support section 12 corresponding to each component holding section 14 .
  • the controller 100 (advance/retreat control section 116) causes the corresponding component holding section 14 to move along one of the above directions by the drive section while the support section 12 is being rotated by the transport drive section 16. You may let
  • the rotary transfer unit 10, 10A has, for example, in addition to the elevation drive section 18, a horizontal drive section (second drive section) that moves the component holding section 14 along the tangential direction (second direction) of the circular track CR1.
  • the horizontal driving section may be provided on the support section 12 corresponding to each component holding section 14, and may be provided on the base section 79 so as to move any one of the component holding sections 14 arranged at the inspection position IP.
  • the advance/retreat control section 116 controls the horizontal drive section while the support section 12 is being rotated by the transport drive section 16 .
  • the component holding portion 14 may be moved along the tangential direction.
  • the tangential direction in which the component holding section 14 is moved by the horizontal driving section is perpendicular to the line connecting the suction section 20 (stop position SP) and the central axis Ax1 on the plane including the circular orbit CR1, and 20 is the direction along the line.
  • the appearance inspection units 60 and 60A capture images of the surface to be inspected (for example, the side surface Wc) of the electronic component W a plurality of times while the positions in the tangential direction of the suction unit 20 holding the electronic component W to be inspected are different from each other. may be executed.
  • the rotary transfer units 10 and 10A may have advance/retreat drive sections 25 and 70 and a horizontal drive section that moves the suction section 20 along the tangential direction of the circular track CR1.
  • the controller 100 may control the advance/retreat drive units 25 and 70 and the horizontal drive unit.
  • the component supply unit 6 may not have the position adjusting section 98 for adjusting the position of the rotor 91 .
  • the horizontal drive portion may be provided on the support portion 12 in correspondence with each component holding portion 14 together with the forward/backward drive portion 25 .
  • the advance/retreat control section 116 causes the corresponding component holding section 14 to move radially and tangentially by the advance/retreat drive section 25 and the horizontal drive section. You can move along.
  • the direction in which the component holding portion 14 holds the electronic component W (the direction in which the component holding portion 14 and the electronic component W face each other) is set to extend along the central axis Ax1.
  • the processing apparatus 1 may include a component holding portion (suction portion) that holds the electronic component W facing the outside of the circular track CR1.
  • the direction in which the component holding portion and the electronic component W held by the component holding portion face each other is set to extend along the radial direction of the circular track CR1.
  • the processing device 1 includes: , another driving portion (second driving portion) for moving the component holding portion along a direction (second direction) intersecting with the radial direction thereof.
  • the separate drive section may be provided on the support section 12 corresponding to each component holding section 14 .
  • the advance/retreat control section 116 moves the corresponding component holding section 14 along the direction crossing the radial direction by the other drive section.
  • the separate drive section (second drive section) may move the component holder along the tangential direction (second direction) of the circular orbit CR1, and move the component holder in the direction in which the central axis Ax1 extends (second direction). direction).
  • the driving section may move the component holding section along the direction in which the electronic component W is held, other than when the electronic component W is transferred to and from another processing unit. For example, when an electronic component W is inspected by an inspection unit that inspects electrical characteristics and the like, the electronic component W is inspected by the inspection unit while the component holding portion is moved in the direction in which the electronic component W is held. may be broken. When transferring the electronic component W to another rotary transfer unit, the drive section may move the component holding section along the direction in which the electronic component W is held.
  • the visual inspection units 60 and 60A may inspect at least one of the main surface Wa and the main surface Wb instead of or in addition to the side surface Wc.
  • the imaging range of the camera that images electronic components W it is necessary to reduce the imaging range of the camera that images electronic components W to some extent and increase the resolution.
  • the size of the electronic component W may be large, and the portion to be inspected may not fit within the imaging range of the camera. If the size of the electronic component W to be processed is changed to that of a larger size, and the camera for appearance inspection is changed according to the size of the electronic component W, it takes a long time to change the camera.
  • the first direction may be the direction in which the central axis Ax1 extends.
  • the second direction may be the radial direction or the tangential direction of the circular orbit CR1.
  • the electronic component W while moving the electronic component W along the central axis Ax1, the electronic component W can also be moved on a plane including the circular orbit CR1.
  • the portion of the electronic component W that can be imaged can be expanded in the radial direction or the tangential direction of the circular orbit CR1. Therefore, it is useful for achieving both inspection accuracy and simplification of the camera for appearance inspection.
  • SYMBOLS 1 Processing apparatus of an electronic component 12... Support part 14... Component holding part 20... Sucking part 16... Conveyance drive part 18... Elevation drive part 25, 70... Retraction drive part CR1... Circular orbit Ax1 ...the central axis.

Abstract

This electronic component processing device is provided with: a component holding part that holds an electronic component in a state of facing the electronic component along a prescribed first direction; a support part that supports the component holding part so as to position the component holding part on a circular orbit about a prescribed central axis; a conveyance drive part for causing the support part to rotate about the central axis; a first drive part for causing the component holding part to move along the first direction; and a second drive part for causing the component holding part to move along a second direction intersecting the first direction.

Description

電子部品の処理装置electronic component processing equipment
　本開示は、電子部品の処理装置に関する。 The present disclosure relates to an electronic component processing apparatus.
　特許文献１には、パッケージに極小部品を接着して実装する際に好適な搬送装置が開示されている。この搬送装置は、ノズルを中心軸線方向に沿って案内する案内機構と、ノズルと共に中心軸線方向に沿って案内される被係合部と、被係合部と係合して付勢することによりノズルを中心軸線方向に駆動する駆動手段とを備える。 Patent Document 1 discloses a conveying device that is suitable for bonding and mounting extremely small parts on a package. This conveying device includes a guide mechanism that guides the nozzle along the central axis direction, an engaged portion that is guided along the central axis direction together with the nozzle, and an engaging portion that engages and biases the engaged portion. a drive means for driving the nozzle in the direction of the central axis.
日本国特開２０１６－９２３９１号公報Japanese Patent Application Laid-Open No. 2016-92391
　本開示は、処理効率の向上に有用な電子部品の処理装置を提供する。 The present disclosure provides an electronic component processing apparatus that is useful for improving processing efficiency.
　本開示の一側面に係る電子部品の処理装置は、所定の第１方向に沿って電子部品と対向した状態で電子部品を保持する部品保持部と、所定の中心軸まわりの円軌道に位置するように部品保持部を支持する支持部と、中心軸まわりに支持部を回転させる搬送駆動部と、第１方向に沿って部品保持部を移動させる第１駆動部と、第１方向に交差する第２方向に沿って部品保持部を移動させる第２駆動部と、を備える。 An electronic component processing apparatus according to one aspect of the present disclosure includes a component holding unit that holds an electronic component facing the electronic component along a predetermined first direction, and a circular orbit around a predetermined central axis. a support portion for supporting the component holding portion in a manner such as to cross the first direction, a transport drive portion for rotating the support portion around the central axis, and a first drive portion for moving the component holding portion along the first direction; and a second driving section that moves the component holding section along the second direction.
　本開示によれば、処理効率の向上に有用な電子部品の処理装置が提供される。 According to the present disclosure, an electronic component processing apparatus useful for improving processing efficiency is provided.
図１は、電子部品の処理装置の一例を模式的に示す平面図である。FIG. 1 is a plan view schematically showing an example of an electronic component processing apparatus. 図２は、電子部品の処理装置の一例を模式的に示す側面図である。FIG. 2 is a side view schematically showing an example of an electronic component processing apparatus. 図３は、コントローラの機能構成の一例を示すブロック図である。FIG. 3 is a block diagram showing an example of the functional configuration of the controller. 図４は、コントローラのハードウェア構成の一例を示すブロック図である。FIG. 4 is a block diagram showing an example of the hardware configuration of the controller. 図５は、コントローラが実行する一連の制御処理の一例を示すフローチャートである。FIG. 5 is a flow chart showing an example of a series of control processes executed by the controller. 図６（ａ）は、検査時の部品保持部の様子を例示する模式図である。図６（ｂ）は、検査時の部品保持部の様子を例示する模式図である。図６（ｃ）は、検査時の部品保持部の様子を例示する模式図である。FIG. 6A is a schematic diagram illustrating the state of the component holding portion during inspection. FIG. 6B is a schematic diagram illustrating the state of the component holding portion during inspection. FIG. 6C is a schematic diagram illustrating the state of the component holding portion during inspection. 図７は、電子部品の処理装置の一例を模式的に示す側面図である。FIG. 7 is a side view schematically showing an example of an electronic component processing apparatus. 図８（ａ）は、検査時の部品保持部の様子を例示する模式図である。図８（ｂ）は、検査時の部品保持部の様子を例示する模式図である。FIG. 8A is a schematic diagram illustrating the state of the component holding portion during inspection. FIG. 8B is a schematic diagram illustrating the state of the component holding portion during inspection. 図９は、電子部品の処理装置の一例を模式的に示す側面図である。FIG. 9 is a side view schematically showing an example of an electronic component processing apparatus. 図１０は、コントローラが実行する一連の制御処理の一例を示すフローチャートである。FIG. 10 is a flow chart showing an example of a series of control processes executed by the controller.
　以下、図面を参照して一実施形態について説明する。説明において、同一要素又は同一機能を有する要素には同一の符号を付し、重複する説明を省略する。図面には必要に応じてＸＹＺ直交座標系が示される。例えば、Ｘ軸及びＹ軸が水平方向であり、Ｚ軸が鉛直方向である。 An embodiment will be described below with reference to the drawings. In the explanation, the same reference numerals are given to the same elements or elements having the same function, and duplicate explanations are omitted. An XYZ orthogonal coordinate system is shown in the drawings as needed. For example, the X and Y axes are horizontal and the Z axis is vertical.
　図１に示される電子部品の処理装置１は、所謂ダイソータである。処理装置１は、電子部品Ｗを搬送しながら、外観検査、電気特性検査、及びマーキング等の処理を施したうえでキャリアテープ及びトレイ等の収容部材に梱包する装置である。処理対象の電子部品Ｗは、例えば、半導体製造の前工程で形成された後にダイシング等によって個片化された部品である。 The electronic component processing apparatus 1 shown in FIG. 1 is a so-called die sorter. The processing apparatus 1 is an apparatus that, while transporting the electronic parts W, subjects the electronic parts W to processes such as appearance inspection, electrical property inspection, and marking, and then packs them in storage members such as carrier tapes and trays. The electronic component W to be processed is, for example, a component that is separated into individual pieces by dicing or the like after being formed in a pre-process of semiconductor manufacturing.
　処理装置１は、複数種類の電子部品Ｗそれぞれに対する処理を行うように構成されていてもよい。処理個数又は日数等の単位で、処理対象の電子部品Ｗの種類が入れ替えられてもよい。処理装置１は、１つの種類の電子部品Ｗに対する処理を連続して行った後に、他の種類の電子部品Ｗに対する処理を連続して行ってもよい。処理装置１によって処理可能な複数種類の電子部品Ｗの大きさが、互いに異なっていてもよい。 The processing device 1 may be configured to process each of a plurality of types of electronic components W. The type of electronic component W to be processed may be changed in units such as the number of processed parts or the number of days. The processing apparatus 1 may continuously process electronic components W of one type and then continuously process electronic components W of another type. A plurality of types of electronic components W that can be processed by the processing apparatus 1 may have different sizes.
　処理装置１は、搬送処理ユニット２と、コントローラ１００とを備える。搬送処理ユニット２は、複数の電子部品Ｗを順に搬送しながら、複数の電子部品Ｗに対して順に処理を施すユニットである。搬送処理ユニット２は、回転搬送ユニット１０と、複数の処理ユニット４とを有する。 The processing device 1 includes a transport processing unit 2 and a controller 100 . The transport processing unit 2 is a unit that sequentially processes a plurality of electronic components W while transporting the plurality of electronic components W in sequence. The transport processing unit 2 has a rotating transport unit 10 and a plurality of processing units 4 .
（回転搬送ユニット）
　回転搬送ユニット１０は、所定の中心軸Ａｘ１まわりの円軌道ＣＲ１に沿って電子部品Ｗを搬送する。搬送対象の電子部品Ｗは、図２に示されるように、直方体状に形成されていてもよい。図２に例示される電子部品Ｗは、互いに平行な（互いに逆向きの）主面Ｗａ，Ｗｂと、主面Ｗａ及び主面Ｗｂを接続する４つの側面Ｗｃとを有する。回転搬送ユニット１０は、例えば、支持部１２と、複数の部品保持部１４と、搬送駆動部１６と、複数の昇降駆動部１８とを有する（図１も参照）。 (rotary transfer unit)
The rotary conveying unit 10 conveys the electronic component W along a circular track CR1 around a predetermined central axis Ax1. The electronic component W to be conveyed may be formed in a rectangular parallelepiped shape as shown in FIG. The electronic component W illustrated in FIG. 2 has main surfaces Wa and Wb parallel to each other (opposite to each other) and four side surfaces Wc connecting the main surfaces Wa and Wb. The rotary transport unit 10 has, for example, a support section 12, a plurality of component holding sections 14, a transport drive section 16, and a plurality of elevation drive sections 18 (see also FIG. 1).
　支持部１２は、円軌道ＣＲ１に位置するように部品保持部１４を支持する。支持部１２によって支持された状態の複数の部品保持部１４は、円軌道ＣＲ１に位置する。支持部１２は、円軌道ＣＲ１の中心軸Ａｘ１まわりに回転可能となるように設けられている。円軌道ＣＲ１は、水平な円軌道であってもよく、中心軸Ａｘ１は鉛直な軸線であってもよい（鉛直方向に沿って延びていてもよい）。支持部１２は、例えば、ターンテーブルである。 The support portion 12 supports the component holding portion 14 so as to be positioned on the circular orbit CR1. The plurality of component holders 14 supported by the supporter 12 are positioned on the circular orbit CR1. The support portion 12 is provided so as to be rotatable around the central axis Ax1 of the circular orbit CR1. The circular orbit CR1 may be a horizontal circular orbit, and the central axis Ax1 may be a vertical axis (may extend along the vertical direction). The support portion 12 is, for example, a turntable.
　複数の部品保持部１４は、中心軸Ａｘ１を中心とする円周に沿って等間隔に配置されており、支持部１２に固定されている（取り付けられている）。本開示において、１つの部材が他の部材に固定されているとは、１つの部材が他の部材に直接接続されている場合に加えて、これら以外の部材を介して接続されている場合も含む。複数の部品保持部１４それぞれは、電子部品Ｗを保持するように構成されている。部品保持部１４は、所定の方向に沿って電子部品Ｗと対向した状態で、その電子部品Ｗを保持する。部品保持部１４は、いかなる方式で電子部品Ｗを保持してもよい。電子部品Ｗを保持する方式の具体例としては、真空吸着、静電気式の吸着、及び把持等が挙げられる。部品保持部１４は、支持部１２（ターンテーブルの上面）に垂直な方向の一方側から、主面Ｗａ，Ｗｂのいずれかを真空吸着してもよい。 The plurality of component holding portions 14 are arranged at equal intervals along the circumference around the central axis Ax1 and are fixed (attached) to the support portion 12 . In the present disclosure, when one member is fixed to another member, in addition to the case where one member is directly connected to another member, the case where one member is connected via a member other than these include. Each of the component holding portions 14 is configured to hold an electronic component W. As shown in FIG. The component holding portion 14 holds the electronic component W while facing the electronic component W along a predetermined direction. The component holding section 14 may hold the electronic component W by any method. Specific examples of the method for holding the electronic component W include vacuum adsorption, electrostatic adsorption, gripping, and the like. The component holding section 14 may vacuum-suck one of the main surfaces Wa and Wb from one side in a direction perpendicular to the support section 12 (upper surface of the turntable).
　一例では、部品保持部１４は、図２に示されるように、吸着部２０と、ホルダ２２と、昇降部２４とを有する。吸着部２０（部品保持部）は、電子部品Ｗの主面Ｗａ，Ｗｂのいずれかを上方から吸着するように構成されている。吸着部２０は、例えば、支持部１２に対して垂直に延びるように構成された吸着ロッドであり、その下端部において電子部品Ｗの主面Ｗａを吸着する。吸着部２０の下面には、電子部品Ｗに対して吸引力を加える吸引孔が設けられてもよい。ホルダ２２は、支持部１２よりも外方に配置されており、吸着部２０を保持する。本開示では、中心軸を基準に「内」及び「外」の用語を使用する。昇降部２４は、ホルダ２２を支持しており、支持部１２に対して昇降可能に固定されている。昇降部２４の詳細については、後述する。 In one example, the component holding section 14 has a suction section 20, a holder 22, and an elevating section 24, as shown in FIG. The suction unit 20 (component holding unit) is configured to suck either main surface Wa or Wb of the electronic component W from above. The suction part 20 is, for example, a suction rod configured to extend perpendicularly to the support part 12, and sucks the main surface Wa of the electronic component W at its lower end. A suction hole that applies a suction force to the electronic component W may be provided on the lower surface of the suction unit 20 . The holder 22 is arranged outside the support portion 12 and holds the adsorption portion 20 . This disclosure uses the terms "inner" and "outer" with respect to the central axis. The lifting section 24 supports the holder 22 and is fixed to the support section 12 so as to be movable up and down. Details of the lifting unit 24 will be described later.
　回転搬送ユニット１０は、複数の進退駆動部２５と設置部２８とを有する。複数の進退駆動部２５は、複数の部品保持部１４にそれぞれ対応するように設けられている。図２では、複数の進退駆動部２５のうちの１つの進退駆動部２５が示されている。進退駆動部２５（第２駆動部）は、中心軸Ａｘ１に交差する方向（第２方向）に沿って、対応する部品保持部１４を移動させる。本開示において、交差は、所謂立体交差のように互いにねじれの位置（関係）にある状態での交差を含む。進退駆動部２５による部品保持部１４の移動軸（部品保持部１４の移動軌跡の延長線）は、中心軸Ａｘ１に交点を有するように交差してもよく、中心軸Ａｘ１に交点を有さないように交差してもよい。所定の方向に沿って移動させるとは、部品保持部１４がその方向に沿って直進することを意味する。すなわち、進退駆動部２５が部品保持部１４を所定の方向に沿って移動させた場合には、部品保持部１４の移動軌跡が、その方向に沿って延びることになる。 The rotary transfer unit 10 has a plurality of advance/retreat drive units 25 and installation units 28 . The plurality of forward/backward drive portions 25 are provided so as to correspond to the plurality of component holding portions 14 respectively. FIG. 2 shows one advance/retreat drive unit 25 out of the plurality of advance/retreat drive units 25 . The advance/retreat drive section 25 (second drive section) moves the corresponding component holding section 14 along a direction (second direction) intersecting the central axis Ax1. In the present disclosure, crossing includes crossing in a state of being in a twisted position (relationship) with each other, such as a so-called grade crossing. The axis of movement of the component holding unit 14 by the advance/retreat drive unit 25 (an extension of the locus of movement of the component holding unit 14) may intersect the central axis Ax1 so as to have an intersection point, or not have an intersection point with the central axis Ax1. may cross each other. Moving along a predetermined direction means that the component holding portion 14 moves straight along that direction. That is, when the forward/backward drive unit 25 moves the component holding unit 14 along a predetermined direction, the movement locus of the component holding unit 14 extends along that direction.
　進退駆動部２５によって部品保持部１４が移動する方向は、円軌道ＣＲ１の径方向（第２方向）であってもよい。以下では、特に説明がない限り、単に「径方向」と表記した場合には、円軌道ＣＲ１の径方向を意味する。駆動対象の部品保持部１４と中心軸Ａｘ１とを最短の距離で結ぶ方向が、径方向に相当する。進退駆動部２５は、中心軸Ａｘ１から離れる方向、又は中心軸Ａｘ１に近づく方向に部品保持部１４を移動させる。径方向に沿った部品保持部１４の移動により、部品保持部１４と中心軸Ａｘ１との間の距離が変化する。 The direction in which the component holding portion 14 is moved by the forward/backward driving portion 25 may be the radial direction (second direction) of the circular orbit CR1. In the following description, the term "radial direction" means the radial direction of the circular orbit CR1 unless otherwise specified. The direction connecting the component holding portion 14 to be driven and the central axis Ax1 at the shortest distance corresponds to the radial direction. The forward/backward drive unit 25 moves the component holding unit 14 in a direction away from the central axis Ax1 or in a direction closer to the central axis Ax1. Movement of the component holding portion 14 along the radial direction changes the distance between the component holding portion 14 and the central axis Ax1.
　進退駆動部２５は、部品保持部１４の昇降部２４を円軌道ＣＲ１の径方向に沿って移動させてもよい。進退駆動部２５は、例えば、進退部２６と、モータ２７とを有する。進退部２６は、円軌道ＣＲ１の径方向に沿って移動可能となるように支持部１２に固定されている。モータ２７は、進退部２６を移動させるための駆動力を発生させる。進退部２６の詳細については後述する。 The advance/retreat drive section 25 may move the elevation section 24 of the component holding section 14 along the radial direction of the circular track CR1. The forward/backward drive unit 25 has, for example, a forward/backward unit 26 and a motor 27 . The advance/retreat portion 26 is fixed to the support portion 12 so as to be movable along the radial direction of the circular track CR1. The motor 27 generates driving force for moving the advancing/retreating portion 26 . The details of the advance/retreat portion 26 will be described later.
　設置部２８は、進退駆動部２５が設置される部材である。設置部２８は、支持部１２の上面の外周部に設けられている。設置部２８は、基部２９ａと、突出部２９ｂとを含む。基部２９ａは、支持部１２の上面及び上記径方向に沿って延びるように板状に形成されている。突出部２９ｂは、基部２９ａの中心軸Ａｘ１から遠い方（外周側）の端部に設けられ、基部２９ａの上面から突出する。突出部２９ｂは、支持部１２の外周縁に位置していてもよい。 The installation section 28 is a member on which the forward/backward drive section 25 is installed. The installation portion 28 is provided on the outer peripheral portion of the upper surface of the support portion 12 . The installation portion 28 includes a base portion 29a and a projecting portion 29b. The base portion 29a is formed in a plate shape so as to extend along the upper surface of the support portion 12 and the radial direction. The protruding portion 29b is provided at an end portion of the base portion 29a farther (peripheral side) from the central axis Ax1, and protrudes from the upper surface of the base portion 29a. The protruding portion 29 b may be positioned at the outer peripheral edge of the support portion 12 .
　ここで、進退部２６及び昇降部２４の一例について、その詳細を説明する。進退部２６は、基部３１と、可動部３２と、受け部３４と、接続部３５と、スプリング３７と、延出部３８とを含む。基部３１は、設置部２８の上方において設置部２８を覆うように配置され、支持部１２の上面及び径方向に沿って延びるように形成されている。基部３１は、その一部が支持部１２の外周縁よりも外に張り出すように配置されている。 Here, the details of an example of the advance/retreat portion 26 and the lifting/lowering portion 24 will be described. The advance/retreat portion 26 includes a base portion 31 , a movable portion 32 , a receiving portion 34 , a connection portion 35 , a spring 37 and an extension portion 38 . The base portion 31 is arranged above the installation portion 28 so as to cover the installation portion 28 and is formed to extend along the upper surface of the support portion 12 and the radial direction. The base portion 31 is arranged so that a portion of the base portion 31 protrudes outside the outer peripheral edge of the support portion 12 .
　可動部３２は、径方向に沿って移動可能となるように、その下面が設置部２８の基部２９ａに接続されている。可動部３２は、基部３１を支持している。受け部３４は、基部３１の内側の端部において、基部３１の下面から下方に向けて突出している。受け部３４には、モータ２７からの外向きの駆動力が付与される。接続部３５は、基部３１の下面から下方に延びており、径方向において、受け部３４との間に可動部３２を挟むように設けられる。接続部３５は、設置部２８の突出部２９ｂと径方向において対向しており、突出部２９ｂの内側に位置する。スプリング３７は、突出部２９ｂと接続部３５との間に設けられており、進退部２６の移動に伴って反力を発生させるように構成されている。 The lower surface of the movable portion 32 is connected to the base portion 29a of the installation portion 28 so as to be movable along the radial direction. The movable portion 32 supports the base portion 31 . The receiving portion 34 protrudes downward from the lower surface of the base portion 31 at the inner end portion of the base portion 31 . An outward driving force from the motor 27 is applied to the receiving portion 34 . The connecting portion 35 extends downward from the lower surface of the base portion 31 and is provided so as to sandwich the movable portion 32 with the receiving portion 34 in the radial direction. The connecting portion 35 faces the projecting portion 29b of the installation portion 28 in the radial direction and is positioned inside the projecting portion 29b. The spring 37 is provided between the projecting portion 29b and the connecting portion 35, and is configured to generate a reaction force as the advancing/retreating portion 26 moves.
　延出部３８は、基部３１の外側の端部において、基部３１の下面から下方に向けて延びるように形成されている。延出部３８の延在方向の長さは、接続部３５の長さ及び受け部３４の長さよりも長くてもよい。延出部３８は、突出部２９ｂ及び支持部１２の外周縁よりも外に位置しており、径方向において延出部３８と突出部２９ｂとが互いに対向している。延出部３８の外方を向く側面には、上述の昇降部２４が昇降可能に設けられている。 The extending portion 38 is formed at the outer end portion of the base portion 31 so as to extend downward from the lower surface of the base portion 31 . The length of the extending portion 38 in the extending direction may be longer than the length of the connecting portion 35 and the length of the receiving portion 34 . The extending portion 38 is located outside the outer peripheral edge of the projecting portion 29b and the supporting portion 12, and the extending portion 38 and the projecting portion 29b face each other in the radial direction. The elevating section 24 described above is provided on the side surface of the extending section 38 facing outward so as to be able to ascend and descend.
　昇降部２４は、可動部４２と、延出部４４ａ，４４ｂと、受け部４６と、スプリング４８とを含む。可動部４２は、中心軸Ａｘ１が延びる方向（図示のＺ軸方向）に沿って移動可能となるように、延出部３８の外方を向く側面に接続されている。延出部４４ａは、延出部３８との間に可動部４２を挟むように、可動部４２に接続されている。延出部４４ａは、中心軸Ａｘ１に沿って延びるように形成されており、基部３１の上面よりも上方に張り出している。 The lifting section 24 includes a movable section 42 , extension sections 44 a and 44 b , a receiving section 46 and a spring 48 . The movable portion 42 is connected to the outward facing side surface of the extending portion 38 so as to be movable along the direction in which the central axis Ax1 extends (the Z-axis direction in the drawing). The extending portion 44 a is connected to the movable portion 42 so as to sandwich the movable portion 42 with the extending portion 38 . The extending portion 44 a is formed to extend along the central axis Ax<b>1 and projects upward from the upper surface of the base portion 31 .
　延出部４４ｂは、延出部４４ａの上端に接続されており、延出部４４ａとの接続部分を起点として、径方向に沿って中心軸Ａｘ１に向かって延びている。延出部４４ｂは、基部３１の一部を覆うように配置されている。受け部４６は、延出部４４ｂの上面に設けられている。受け部４６は、昇降部２４を下降させるための駆動力を受ける部分である。受け部４６は、径方向に沿って延びるように形成されている。上方から見て、受け部４６は、四角形であってもよく、楕円形であってもよい。受け部４６は、長手方向又は長軸方向が径方向に沿うように延出部４４ｂの上面に設けられていてもよい。 The extending portion 44b is connected to the upper end of the extending portion 44a, and extends radially toward the central axis Ax1 from the connection point with the extending portion 44a. The extending portion 44b is arranged so as to partially cover the base portion 31 . The receiving portion 46 is provided on the upper surface of the extending portion 44b. The receiving portion 46 is a portion that receives a driving force for lowering the elevating portion 24 . The receiving portion 46 is formed to extend along the radial direction. When viewed from above, the receiving portion 46 may be rectangular or elliptical. The receiving portion 46 may be provided on the upper surface of the extending portion 44b so that the longitudinal direction or major axis direction is along the radial direction.
　スプリング４８は、延出部４４ｂと基部３１との間に設けられており、昇降部２４の移動に伴って反力を発生させるように構成されている。昇降部２４は、２つのスプリング４８を含んでもよい。上方から見て、少なくとも１つのスプリング４８が、受け部４６によって覆われていてもよい。 The spring 48 is provided between the extending portion 44b and the base portion 31, and is configured to generate a reaction force as the lifting portion 24 moves. Elevator 24 may include two springs 48 . At least one spring 48 may be covered by a receiving portion 46 when viewed from above.
　図１に戻り、搬送駆動部１６は、円軌道ＣＲ１の中心軸Ａｘ１まわりに支持部１２を回転させるように構成されている。搬送駆動部１６は、例えば、電動モータ等の動力源を用いて、ギヤを介さないダイレクトドライブによって中心軸Ａｘ１まわりに支持部１２を回転させる。支持部１２の回転により、円軌道ＣＲ１に沿って複数の部品保持部１４が移動する。その結果、部品保持部１４によって保持されている電子部品Ｗが、円軌道ＣＲ１に沿って搬送される。 Returning to FIG. 1, the transport drive section 16 is configured to rotate the support section 12 around the central axis Ax1 of the circular track CR1. The transport driving unit 16 uses a power source such as an electric motor to rotate the support unit 12 around the central axis Ax1 by direct driving without gears. The rotation of the support portion 12 causes the plurality of component holding portions 14 to move along the circular orbit CR1. As a result, the electronic component W held by the component holding section 14 is conveyed along the circular track CR1.
　搬送駆動部１６は、隣り合う部品保持部１４同士の角度ピッチ（中心軸Ａｘまわりの角度ピッチ）にて、支持部１２の回転と停止とを繰り返すように制御される。以下、搬送駆動部１６が支持部１２を停止させる際に複数の部品保持部１４（より詳細には、複数の吸着部２０）それぞれが配置される複数の位置を「複数の停止位置ＳＰ」という。 The transport driving unit 16 is controlled so that the supporting unit 12 is repeatedly rotated and stopped at the angular pitch (angular pitch around the central axis Ax) between the adjacent component holding units 14 . Hereinafter, the plurality of positions at which the plurality of component holding portions 14 (more specifically, the plurality of suction portions 20) are arranged when the transport drive portion 16 stops the support portion 12 will be referred to as “a plurality of stop positions SP”. .
　昇降駆動部１８（第１駆動部）は、部品保持部１４と、その部品保持部１４によって保持されている電子部品Ｗとが対向する方向に沿って、部品保持部１４を移動させる。部品保持部１４と、その部品保持部１４によって保持されている電子部品Ｗとが互いに対向する方向（第１方向）は、中心軸Ａｘと平行であってもよい。上記円軌道ＣＲ１の接線方向は、部品保持部１４と電子部品Ｗとが互いに対向する上記方向に交差する。部品保持部１４が上方から電子部品Ｗの主面Ｗａを吸着保持する場合には、主面Ｗａに垂直な方向において、部品保持部１４と電子部品Ｗとが互いに対向している（並んでいる）。昇降駆動部１８は、中心軸Ａｘ１が延びる方向に沿って部品保持部１４を移動させてもよい。 The elevation driving section 18 (first driving section) moves the component holding section 14 along the direction in which the component holding section 14 and the electronic component W held by the component holding section 14 face each other. The direction (first direction) in which the component holding portion 14 and the electronic component W held by the component holding portion 14 face each other may be parallel to the central axis Ax. The tangential direction of the circular orbit CR1 intersects the direction in which the component holding portion 14 and the electronic component W face each other. When the component holding portion 14 sucks and holds the main surface Wa of the electronic component W from above, the component holding portion 14 and the electronic component W face each other in a direction perpendicular to the main surface Wa. ). The elevation driving section 18 may move the component holding section 14 along the direction in which the central axis Ax1 extends.
　複数の昇降駆動部１８は、複数の部品保持部１４を個別に昇降させるように構成されている。図１では、昇降駆動部１８の図示は省略されており、図２では、複数の昇降駆動部１８のうちの１つの昇降駆動部１８が示されている。昇降駆動部１８は、停止位置ＳＰに配置された部品保持部１４に外力を加えることで、その部品保持部１４を支持部１２に垂直な方向の一方側に移動させる。昇降駆動部１８は、例えば、鉛直方向において部品保持部１４を下方に移動させる。 The plurality of elevation drive sections 18 are configured to individually raise and lower the plurality of component holding sections 14 . In FIG. 1, illustration of the elevation driving section 18 is omitted, and in FIG. 2, one elevation driving section 18 out of the plurality of elevation driving sections 18 is shown. The elevation driving unit 18 applies an external force to the component holding unit 14 arranged at the stop position SP, thereby moving the component holding unit 14 to one side in the direction perpendicular to the support unit 12 . The elevation driving unit 18 moves the component holding unit 14 downward, for example, in the vertical direction.
　複数の昇降駆動部１８は、複数の停止位置ＳＰにそれぞれ対応するように設けられてもよい。部品保持部１４を昇降させる必要がない停止位置ＳＰには、昇降駆動部１８が設けられていなくてもよい。昇降駆動部１８は、平面視（上方から見ること）において、対応する停止位置ＳＰ又はその近傍に配置されている。昇降駆動部１８は、対応する停止位置ＳＰに配置されている部品保持部１４の上方に位置する。昇降駆動部１８は、対応する停止位置ＳＰに順次配置されてくる部品保持部１４を下方に移動させる。 A plurality of elevation drive units 18 may be provided so as to respectively correspond to a plurality of stop positions SP. The lift drive section 18 may not be provided at the stop position SP where the component holding section 14 does not need to be lifted or lowered. The elevation drive unit 18 is arranged at or near the corresponding stop position SP in plan view (seen from above). The elevation driving section 18 is positioned above the component holding section 14 arranged at the corresponding stop position SP. The up-and-down drive unit 18 moves downward the component holding units 14 that are successively arranged at the corresponding stop positions SP.
　回転搬送ユニット１０は、図２に示されるように、複数の昇降駆動部１８を固定する（支持する）固定部１１を有してもよい。固定部１１は、例えば、板状の部材であり、支持部１２の上方に配置されている。固定部１１は、支持部１２の回転と共に回転しないように設けられている。そのため、支持部１２が回転しても、複数の昇降駆動部１８は移動しない。昇降駆動部１８は、例えば、ホルダ５２と、可動部５３と、昇降ロッド５４と、モータ５８と、スプリング５６とを有する。 The rotary transfer unit 10 may have a fixing section 11 that fixes (supports) a plurality of elevation drive sections 18, as shown in FIG. The fixed portion 11 is, for example, a plate-like member and is arranged above the support portion 12 . The fixed portion 11 is provided so as not to rotate together with the rotation of the support portion 12 . Therefore, even if the support portion 12 rotates, the plurality of elevation driving portions 18 do not move. The elevation driving section 18 has, for example, a holder 52 , a movable section 53 , an elevation rod 54 , a motor 58 and a spring 56 .
　ホルダ５２は、支持部１２の外周縁の鉛直上方において、固定部１１の外周部に固定されている。ホルダ５２の外周面には、ホルダ５２の下半分における外方を向く側面よりも外に突出する突出部５２ａと、ホルダ５２の下半分の上記側面よりも内側に窪む（凹む）窪み５２ｂとが設けられている。可動部５３は、中心軸Ａｘ１が延びる方向（例えば、図示のＺ軸方向）に沿って移動可能となるように、ホルダ５２の下半分の領域における上記側面に接続されている。昇降ロッド５４は、中心軸Ａｘ１と平行な方向に沿って延びるように棒状に形成されており、可動部５３によって支持（接続）されている。 The holder 52 is fixed to the outer peripheral portion of the fixed portion 11 vertically above the outer peripheral edge of the support portion 12 . The outer peripheral surface of the holder 52 has a protruding portion 52a that protrudes outward from the outer side surface of the lower half of the holder 52, and a recess 52b that is recessed (recessed) inward from the side surface of the lower half of the holder 52. is provided. The movable portion 53 is connected to the side surface of the lower half region of the holder 52 so as to be movable along the direction in which the central axis Ax1 extends (for example, the Z-axis direction in the drawing). The lifting rod 54 is shaped like a bar extending in a direction parallel to the central axis Ax<b>1 and is supported (connected) by the movable portion 53 .
　受け部５５は、昇降ロッド５４の上端部に接続されており、昇降ロッド５４との接続部分を起点として、内側に延びるように形成されている。受け部５５は、突出部５２ａを覆うように配置されている。モータ５８は、昇降ロッド５４を下降させるための駆動力を受け部５５に付与する。スプリング５６は、受け部５５と突出部５２ａとの間に設けられており、昇降ロッド５４及び受け部５５の移動に伴って反力を発生させるように構成されている。 The receiving portion 55 is connected to the upper end portion of the lifting rod 54 and is formed to extend inward from the connecting portion with the lifting rod 54 as a starting point. The receiving portion 55 is arranged so as to cover the projecting portion 52a. A motor 58 applies a driving force to the receiving portion 55 for lowering the lifting rod 54 . The spring 56 is provided between the receiving portion 55 and the projecting portion 52a, and is configured to generate a reaction force as the lifting rod 54 and the receiving portion 55 move.
　図２に例示される回転搬送ユニット１０において、中心軸Ａｘ１が延びる方向（鉛直方向）に沿って吸着部２０を移動させる際には、以下の動作が行われる。まず、モータ５８によって、受け部５５に対して下向きの力が付与される。受け部５５への下向きの力の付与によって、可動部５３及び昇降ロッド５４が下降する。そして、昇降ロッド５４の下降によって、昇降部２４の受け部４６に対して下向きの力が付与される。受け部４６への下向きの力の付与によって、可動部４２及び延出部４４ａ，４４ｂが下降し、その結果、ホルダ２２と共に吸着部２０が下降する。 In the rotary transfer unit 10 illustrated in FIG. 2, the following operations are performed when moving the adsorption section 20 along the direction (vertical direction) in which the central axis Ax1 extends. First, a downward force is applied to the receiving portion 55 by the motor 58 . By applying a downward force to the receiving portion 55, the movable portion 53 and the lifting rod 54 are lowered. A downward force is applied to the receiving portion 46 of the lifting portion 24 by the descent of the lifting rod 54 . By applying a downward force to the receiving portion 46, the movable portion 42 and the extension portions 44a and 44b are lowered, and as a result, the adsorption portion 20 is lowered together with the holder 22.
　吸着部２０を元の位置（下降前の高さ位置）に戻す際には、以下の動作が行われる。モータ５８からの受け部５５への下向きの力が解除されると、スプリング５６の反力によって、昇降ロッド５４が上昇する。昇降ロッド５４の上昇により、昇降ロッド５４からの受け部４６への下向きの力が解除され、スプリング４８の反力によって、昇降部２４、ホルダ２２、及び吸着部２０が元の位置まで上昇する。 When returning the suction unit 20 to its original position (height position before lowering), the following operations are performed. When the downward force applied to the receiving portion 55 from the motor 58 is released, the reaction force of the spring 56 causes the lift rod 54 to rise. As the lifting rod 54 rises, the downward force from the lifting rod 54 to the receiving portion 46 is released, and the reaction force of the spring 48 lifts the lifting portion 24, the holder 22, and the suction portion 20 to their original positions.
　吸着部２０を円軌道ＣＲ１の径方向に沿って移動させる際には、以下の動作が行われる。まず、進退駆動部２５のモータ２７によって、受け部３４に対して外向きの力が付与される。受け部３４への外向きの力の付与によって、進退部２６が、中心軸Ａｘ１から遠ざかるように移動する。進退部２６の移動によって、昇降部２４が外方に向かって移動し、その結果、ホルダ２２と共に吸着部２０が外方に向かって移動する。 When moving the suction part 20 along the radial direction of the circular orbit CR1, the following operations are performed. First, an outward force is applied to the receiving portion 34 by the motor 27 of the forward/backward driving portion 25 . By applying an outward force to the receiving portion 34, the retractable portion 26 moves away from the central axis Ax1. The movement of the advance/retreat portion 26 causes the elevating portion 24 to move outward, and as a result, the suction portion 20 moves outward together with the holder 22 .
　吸着部２０を元の位置（移動前の位置）に戻す際には、以下の動作が行われる。モータ２７からの受け部３４への外向きの力が解除されると、スプリング３７の反力によって、進退部２６が、中心軸Ａｘ１に近づくように移動する。進退部２６の移動によって、昇降部２４が内側に向かって移動し、その結果、ホルダ２２と共に吸着部２０が内側に向かって移動する。 When returning the suction unit 20 to its original position (position before movement), the following operations are performed. When the outward force from the motor 27 to the receiving portion 34 is released, the reaction force of the spring 37 causes the advancing/retreating portion 26 to move closer to the central axis Ax1. The movement of the advancing/retracting portion 26 causes the lifting portion 24 to move inward, and as a result, the suction portion 20 moves inward together with the holder 22 .
（処理ユニット）
　複数の処理ユニット４は、図１に示されるように、いくつかの停止位置ＳＰにそれぞれ対応するように設けられている。図１に示される例とは異なり、全ての停止位置ＳＰそれぞれに処理ユニット４が設けられてもよい。処理ユニット４は、対応する停止位置ＳＰに配置された部品保持部１４が保持する電子部品Ｗに対して、予め定められた処理を施すように構成されている。いくつかの処理ユニット４は、対応する停止位置ＳＰの下方に配置されてもよい。 (processing unit)
A plurality of processing units 4 are provided so as to correspond to several stop positions SP, respectively, as shown in FIG. Unlike the example shown in FIG. 1, each of the stop positions SP may be provided with a processing unit 4 . The processing unit 4 is configured to perform predetermined processing on the electronic component W held by the component holding section 14 arranged at the corresponding stop position SP. Several processing units 4 may be arranged below the corresponding stop position SP.
　本開示において、電子部品Ｗに対して行う「処理」は、電子部品Ｗの状態を変化させるあらゆる行為を含む。例えば、電子部品Ｗにマーキング等を施すこと、電子部品Ｗを部品保持部１４に保持させること（引き渡すこと）、及び部品保持部１４から電子部品Ｗを回収すること（受け取ること）は、「処理」に該当する。また、電子部品Ｗに対する何らかの検査を実行することも、検査データが未知の状態を検査データが既知の状態に変化させるので「処理」に該当する。複数の処理ユニット４は、例えば、部品供給ユニット６と、部品回収ユニット７と、１つ又は複数の中間処理ユニット８とを含む。 In the present disclosure, "processing" performed on the electronic component W includes any action that changes the state of the electronic component W. For example, marking the electronic component W, causing the electronic component W to be held by the component holding unit 14 (handing over), and recovering the electronic component W from the component holding unit 14 (receiving) are referred to as “processing ”. Further, executing some kind of inspection on the electronic component W also corresponds to "processing" because it changes a state in which the inspection data is unknown to a state in which the inspection data is known. The multiple processing units 4 include, for example, a component supply unit 6 , a component recovery unit 7 and one or more intermediate processing units 8 .
　部品供給ユニット６は、回転搬送ユニット１０に対して電子部品Ｗを供給するユニットである。部品供給ユニット６は、いずれかの停止位置ＳＰに対応するように配置されている。部品供給ユニット６は、例えば、複数の電子部品Ｗが収容された状態の収容部材（例えば、ウェハシート）を移動させることで、各電子部品Ｗを順に対応する停止位置ＳＰの鉛直下方に配置する。対応する停止位置ＳＰに配置された部品保持部１４が、昇降駆動部１８により下降しつつ、その停止位置ＳＰの鉛直下方に配置された電子部品Ｗを受け取る。これにより、部品供給ユニット６から回転搬送ユニット１０に電子部品Ｗが供給される。以下、部品供給ユニット６が電子部品Ｗを供給する供給用の停止位置ＳＰを「供給位置ＳＰ１」と称する。 The component supply unit 6 is a unit that supplies electronic components W to the rotary transfer unit 10 . The component supply unit 6 is arranged so as to correspond to one of the stop positions SP. The component supply unit 6 moves, for example, a storage member (for example, a wafer sheet) in which a plurality of electronic components W are stored, thereby arranging each electronic component W in order vertically below the corresponding stop position SP. . The component holding portion 14 placed at the corresponding stop position SP is lowered by the elevation driving portion 18 and receives the electronic component W placed vertically below the stop position SP. As a result, the electronic component W is supplied from the component supply unit 6 to the rotary transfer unit 10 . Hereinafter, the supply stop position SP where the component supply unit 6 supplies the electronic component W is referred to as a "supply position SP1".
　部品回収ユニット７は、回転搬送ユニット１０から電子部品Ｗを回収するユニットである。部品回収ユニット７は、いずれかの停止位置ＳＰに対応するように配置されている。部品回収ユニット７は、例えば、複数の電子部品Ｗを収容することが可能な収容部材（例えば、キャリアテープ）を移動させることで、収容部材に含まれる各収容部を対応する停止位置ＳＰの鉛直下方に順に配置する。対応する停止位置ＳＰに配置された部品保持部１４が、昇降駆動部１８により下降しつつ、その停止位置ＳＰの下方に配置された収容部に電子部品Ｗを引き渡す。これにより、回転搬送ユニット１０から部品回収ユニット７に電子部品Ｗが回収される。以下、部品回収ユニット７が電子部品Ｗを回収する回収用の停止位置ＳＰを「回収位置ＳＰ２」と称する。 The component recovery unit 7 is a unit that recovers the electronic components W from the rotary transfer unit 10. The component recovery unit 7 is arranged so as to correspond to one of the stop positions SP. The component recovery unit 7 moves, for example, a storage member (for example, a carrier tape) capable of storing a plurality of electronic components W so that each storage portion included in the storage member is vertically aligned with the corresponding stop position SP. Place them in order below. The component holding portion 14 arranged at the corresponding stop position SP is lowered by the elevation driving portion 18, and delivers the electronic component W to the accommodation portion arranged below the stop position SP. As a result, the electronic component W is recovered from the rotary transfer unit 10 to the component recovery unit 7 . Hereinafter, the recovery stop position SP at which the component recovery unit 7 recovers the electronic components W will be referred to as a "recovery position SP2".
　中間処理ユニット８は、供給位置ＳＰ１及び回収位置ＳＰ２以外のいずれかの停止位置ＳＰに対応するように配置されており、電子部品Ｗに対して所定の処理を施すユニットである。中間処理ユニット８は、円軌道ＣＲ１において供給位置ＳＰ１よりも下流且つ回収位置ＳＰ２よりも上流に位置する停止位置ＳＰにおいて、電子部品Ｗに対して処理を行う。中間処理ユニット８による処理の具体例としては、電気特性検査、光学特性検査、外観検査、姿勢又は位置の補正、及びマーキング（レーザマーキング）等が挙げられる。 The intermediate processing unit 8 is arranged so as to correspond to any stop position SP other than the supply position SP1 and the recovery position SP2, and is a unit that performs predetermined processing on the electronic component W. The intermediate processing unit 8 processes the electronic component W at a stop position SP located downstream of the supply position SP1 and upstream of the collection position SP2 on the circular track CR1. Specific examples of processing by the intermediate processing unit 8 include electrical property inspection, optical property inspection, appearance inspection, posture or position correction, and marking (laser marking).
　複数の中間処理ユニット８は、外観検査ユニット６０を含む。外観検査ユニット６０は、円軌道ＣＲ１において供給位置ＳＰ１と回収位置ＳＰ２との間の経路上のいずれかの停止位置ＳＰに対応するように配置されている。外観検査ユニット６０は、対応する停止位置ＳＰに配置された部品保持部１４が保持する電子部品Ｗの外観検査を行うユニットである。以下では、外観検査ユニット６０により検査が行われる検査用の停止位置ＳＰを「検査位置ＩＰ」と称する。 A plurality of intermediate processing units 8 include visual inspection units 60 . The visual inspection unit 60 is arranged so as to correspond to any stop position SP on the route between the supply position SP1 and the collection position SP2 on the circular track CR1. The visual inspection unit 60 is a unit that performs a visual inspection of the electronic component W held by the component holding section 14 arranged at the corresponding stop position SP. Hereinafter, the inspection stop position SP where the inspection is performed by the visual inspection unit 60 is referred to as an "inspection position IP".
　外観検査ユニット６０は、例えば、検査位置ＩＰに配置された部品保持部１４が保持する電子部品Ｗの１つの側面Ｗｃを撮像することで、その側面Ｗｃにおける外観を検査する。一例では、外観検査ユニット６０による撮像画像によって、検査対象面である側面Ｗｃにおける傷、チッピング（欠け）、又は異物の有無が検査される。外観検査ユニット６０は、可視光を用いて側面Ｗｃを撮像するカメラ６２を含んでもよい。 The appearance inspection unit 60 inspects the appearance of the side surface Wc, for example, by capturing an image of one side surface Wc of the electronic component W held by the component holding unit 14 arranged at the inspection position IP. In one example, an image captured by the visual inspection unit 60 is used to inspect the presence or absence of a flaw, chipping, or foreign matter on the side surface Wc, which is the surface to be inspected. The appearance inspection unit 60 may include a camera 62 that takes an image of the side surface Wc using visible light.
　カメラ６２は、検査対象面である側面Ｗｃから出射される光を集光することで、その側面Ｗｃの撮像を行う。カメラ６２は、例えば、検査対象面である側面Ｗｃからの反射光を集光することで、当該側面Ｗｃの撮像を行う。なお、カメラ６２は、検査対象面である側面Ｗｃを透過した光を集光することで、当該側面Ｗｃの撮像を行ってもよい。カメラ６２は、検査位置ＩＰに位置する部品保持部１４が保持する電子部品Ｗのうちの、円軌道ＣＲ１の径方向に沿って延びる側面Ｗｃを撮像可能となるように配置されている。カメラ６２が撮像する側面Ｗｃは、円軌道ＣＲ１において下流を向く側面であってもよい。 The camera 62 captures an image of the side surface Wc by condensing the light emitted from the side surface Wc, which is the surface to be inspected. The camera 62 captures an image of the side surface Wc, for example, by condensing reflected light from the side surface Wc, which is the surface to be inspected. Note that the camera 62 may capture an image of the side surface Wc, which is the surface to be inspected, by condensing the light transmitted through the side surface Wc. The camera 62 is arranged so as to be able to image a side surface Wc extending along the radial direction of the circular orbit CR1 of the electronic component W held by the component holding unit 14 positioned at the inspection position IP. The side Wc captured by the camera 62 may be a side facing downstream in the circular orbit CR1.
　カメラ６２は、搬送駆動部１６による複数の部品保持部１４の移動と干渉しないように配置されており、その位置は固定されていてもよい。この場合、カメラ６２による撮像範囲（以下、「撮像範囲ＰＡ」という。）は一定である。大きいサイズの電子部品Ｗが搬送される際に、カメラ６２による撮像範囲ＰＡの横幅は、側面Ｗｃの横幅よりも小さくてもよく、カメラ６２による撮像範囲ＰＡの縦幅は、側面Ｗｃの縦幅よりも大きくてもよい。以上のように、電子部品Ｗの種類によっては、カメラ６２による撮像範囲ＰＡ（視野）が、側面Ｗｃの全体よりも小さくなるように設定されていてもよい。 The camera 62 is arranged so as not to interfere with the movement of the plurality of component holders 14 by the transport drive unit 16, and its position may be fixed. In this case, the imaging range of the camera 62 (hereinafter referred to as "imaging range PA") is constant. When a large-sized electronic component W is conveyed, the width of the imaging range PA by the camera 62 may be smaller than the width of the side surface Wc, and the vertical width of the imaging range PA by the camera 62 is equal to the vertical width of the side surface Wc. may be greater than As described above, depending on the type of the electronic component W, the imaging range PA (field of view) of the camera 62 may be set to be smaller than the entire side surface Wc.
（コントローラ）
　コントローラ１００は、搬送処理ユニット２を制御する。コントローラ１００は、１つ又は複数の制御用コンピュータによって構成される。コントローラ１００は、複数の電子部品Ｗに対して所定の処理が順に施されるように、予め定められた制御手順に従って搬送処理ユニット２を制御する。 (controller)
A controller 100 controls the transport processing unit 2 . The controller 100 is composed of one or more control computers. The controller 100 controls the transport processing unit 2 according to a predetermined control procedure so that a plurality of electronic components W are sequentially subjected to predetermined processing.
　コントローラ１００は、機能上の構成（以下、「機能モジュール」という。）として、例えば、搬送制御部１１２と、昇降制御部１１４と、進退制御部１１６と、検査制御部１１８とを有する。これらの機能モジュールが実行する処理は、コントローラ１００が実行する処理に相当する。以下、各機能モジュール（コントローラ１００）が実行する処理を、処理ユニット４による電子部品Ｗへの処理と区別するために「制御処理」と称する。 The controller 100 has, for example, a transport control unit 112, an elevation control unit 114, an advance/retreat control unit 116, and an inspection control unit 118 as functional components (hereinafter referred to as "functional modules"). Processing executed by these functional modules corresponds to processing executed by the controller 100 . Hereinafter, processing executed by each functional module (controller 100) will be referred to as “control processing” in order to distinguish it from processing of the electronic component W by the processing unit 4. FIG.
　搬送制御部１１２は、円軌道ＣＲ１において隣り合う部品保持部１４同士の角度ピッチにて、支持部１２の回転と停止とを繰り返すように搬送駆動部１６を制御する。支持部１２の回転と停止とが交互に繰り返されることで、上述の停止位置ＳＰにおける部品保持部１４（吸着部２０）の停止と、停止位置ＳＰから次の停止位置ＳＰへの部品保持部１４（吸着部２０）の移動とが繰り返される。 The transport control unit 112 controls the transport driving unit 16 so that the support unit 12 is repeatedly rotated and stopped at the angular pitch between the component holding units 14 adjacent to each other on the circular track CR1. By alternately repeating rotation and stopping of the support portion 12, the component holding portion 14 (suction portion 20) stops at the above-described stop position SP, and the component holding portion 14 moves from the stop position SP to the next stop position SP. (Adsorption part 20) movement is repeated.
　昇降制御部１１４は、停止位置ＳＰに配置された部品保持部１４（吸着部２０）を下降させるように、当該停止位置ＳＰに対応する昇降駆動部１８を制御する。昇降制御部１１４は、例えば、停止位置ＳＰの鉛直下方に配置された処理ユニット４に対して、部品保持部１４が電子部品Ｗを引き渡す又は受け取る際に、部品保持部１４を昇降駆動部１８により下降させて元の位置まで上昇させる。この場合、昇降駆動部１８は、処理ユニット４に近づけるように又は処理ユニット４から離れるように、中心軸Ａｘ１に沿って部品保持部１４を移動させる。 The elevation control section 114 controls the elevation driving section 18 corresponding to the stop position SP so as to lower the component holding section 14 (suction section 20) placed at the stop position SP. For example, when the component holding unit 14 delivers or receives the electronic component W to or from the processing unit 4 arranged vertically below the stop position SP, the elevation control unit 114 moves the component holding unit 14 by the elevation driving unit 18. Lower and raise to original position. In this case, the elevation driving section 18 moves the component holding section 14 along the central axis Ax<b>1 toward or away from the processing unit 4 .
　進退制御部１１６は、部品保持部１４を円軌道ＣＲ１の径方向に沿って移動させるように進退駆動部２５を制御する。進退制御部１１６は、検査位置ＩＰに配置される際の部品保持部１４の径方向の位置を変化させるように、進退駆動部２５により部品保持部１４を径方向に沿って移動させる。部品保持部１４を径方向に沿って移動させた後に、進退制御部１１６は、移動前の位置に戻すように進退駆動部２５により部品保持部１４を移動させてもよい。進退制御部１１６は、検査位置ＩＰに部品保持部１４が配置された状態で進退駆動部２５により部品保持部１４を移動させてもよい。進退制御部１１６は、検査位置ＩＰへの部品保持部１４の配置前又は検査位置ＩＰからの部品保持部１４の移動後において、進退駆動部２５により、その部品保持部１４を移動させてもよい。進退制御部１１６は、例えば、搬送駆動部１６により支持部１２が回転している間において、進退駆動部２５により部品保持部１４を径方向に沿って移動させてもよい。 The advance/retreat control section 116 controls the advance/retreat drive section 25 so as to move the component holding section 14 along the radial direction of the circular track CR1. The advance/retreat control unit 116 causes the advance/retreat driving unit 25 to move the component holding unit 14 along the radial direction so as to change the radial position of the component holding unit 14 when arranged at the inspection position IP. After moving the component holding portion 14 along the radial direction, the advance/retreat control portion 116 may move the component holding portion 14 by the advance/retreat driving portion 25 so as to return to the position before movement. The advance/retreat control section 116 may move the component holding section 14 by the advance/retreat driving section 25 in a state where the component holding section 14 is arranged at the inspection position IP. The advance/retreat control unit 116 may move the component holding unit 14 by the advance/retreat driving unit 25 before the component holding unit 14 is arranged at the inspection position IP or after the component holding unit 14 is moved from the inspection position IP. . For example, the advance/retreat control section 116 may cause the advance/retreat drive section 25 to move the component holding section 14 along the radial direction while the support section 12 is being rotated by the transport drive section 16 .
　検査制御部１１８は、検査位置ＩＰに配置された部品保持部１４が保持する電子部品Ｗに対する検査を実行するように、外観検査ユニット６０を制御する。検査制御部１１８は、例えば、検査位置ＩＰに位置する電子部品Ｗの検査対象となる側面Ｗｃをカメラ６２により撮像させることで、当該側面Ｗｃの撮像画像を取得する。検査制御部１１８は、側面Ｗｃ全体の検査を行うように、カメラ６２に複数回の撮像を実行させてもよい。検査制御部１１８は、側面Ｗｃの撮像画像に基づいて、その側面Ｗｃにおける異常の有無（例えば、傷の有無）を判定してもよい。 The inspection control unit 118 controls the appearance inspection unit 60 so as to inspect the electronic component W held by the component holding unit 14 placed at the inspection position IP. For example, the inspection control unit 118 causes the camera 62 to image the side surface Wc to be inspected of the electronic component W positioned at the inspection position IP, thereby acquiring the captured image of the side surface Wc. The inspection control unit 118 may cause the camera 62 to perform imaging a plurality of times so as to inspect the entire side surface Wc. The inspection control unit 118 may determine the presence or absence of an abnormality (for example, the presence or absence of a scratch) on the side surface Wc based on the captured image of the side surface Wc.
　コントローラ１００は、図４に示されるように、回路１５０を有する。回路１５０は、１つ又は複数のプロセッサ１５２と、メモリ１５４と、ストレージ１５６と、入出力ポート１５８と、タイマ１６２とを含む。ストレージ１５６は、例えば不揮発性の半導体メモリ等、コンピュータによって読み取り可能な記憶媒体を有する。ストレージ１５６は、予め設定された制御手順で搬送処理ユニット２に含まれる各要素を制御することをコントローラ１００に実行させるためのプログラムを記憶している。例えばストレージ１５６は、上述した各機能モジュールを構成するためのプログラムを記憶している。 The controller 100 has a circuit 150, as shown in FIG. Circuitry 150 includes one or more processors 152 , memory 154 , storage 156 , input/output ports 158 and timers 162 . The storage 156 has a computer-readable storage medium such as a non-volatile semiconductor memory. The storage 156 stores a program for causing the controller 100 to control each element included in the transport processing unit 2 according to preset control procedures. For example, the storage 156 stores programs for configuring each functional module described above.
　メモリ１５４は、ストレージ１５６の記憶媒体からロードしたプログラム及びプロセッサ１５２による演算結果を一時的に記憶する。プロセッサ１５２は、メモリ１５４と協働して上記プログラムを実行することで、コントローラ１００の各機能モジュールを構成する。入出力ポート１５８は、プロセッサ１５２からの指令に従って、搬送処理ユニット２の各要素との間で電気信号の入出力を行う。タイマ１６２は、例えば一定周期の基準パルスをカウントすることで経過時間を計測する。なお、回路１５０は、必ずしもプログラムにより各機能を構成するものに限られない。例えば回路１５０は、専用の論理回路又はこれを集積したＡＳＩＣ（Application　Specific　Integrated　Circuit）により少なくとも一部の機能を構成してもよい。 The memory 154 temporarily stores the program loaded from the storage medium of the storage 156 and the calculation result by the processor 152 . The processor 152 configures each functional module of the controller 100 by executing the program in cooperation with the memory 154 . The input/output port 158 performs input/output of electrical signals with each element of the transport processing unit 2 according to instructions from the processor 152 . The timer 162 measures the elapsed time by, for example, counting reference pulses of a constant cycle. Note that the circuit 150 is not necessarily limited to configuring each function by a program. For example, the circuit 150 may configure at least part of its functions by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrating this.
（制御方法）
　続いて、コントローラ１００が実行する制御手順（制御方法）の一例を説明する。図５は、サイズが大きい１つの電子部品Ｗが検査位置ＩＰに搬送され、その電子部品Ｗに対して検査を行う際の一連の制御手順を示すフローチャートである。この一連の制御手順では、検査対象の電子部品Ｗを保持する吸着部２０が、検査位置ＩＰよりも１つ上流の停止位置ＳＰに位置する状態で、コントローラ１００がステップＳ１１を実行する。 (Control method)
Next, an example of a control procedure (control method) executed by the controller 100 will be described. FIG. 5 is a flow chart showing a series of control procedures when one electronic component W having a large size is transported to the inspection position IP and the electronic component W is inspected. In this series of control procedures, the controller 100 executes step S11 in a state in which the suction unit 20 holding the electronic component W to be inspected is positioned at the stop position SP one upstream of the inspection position IP.
　ステップＳ１１では、例えば、搬送制御部１１２が、検査対象の電子部品Ｗを保持する吸着部２０が検査位置ＩＰに配置されるように搬送駆動部１６を制御する。ステップＳ１１の実行により、図６（ａ）に示されるように、吸着部２０が保持する電子部品Ｗの側面Ｗｃの中央部分がカメラ６２による撮像範囲ＰＡに含まれるように、その吸着部２０が検査位置ＩＰに移動する。 In step S11, for example, the transport control unit 112 controls the transport driving unit 16 so that the suction unit 20 holding the electronic component W to be inspected is arranged at the inspection position IP. By executing step S11, as shown in FIG. Move to inspection position IP.
　次に、コントローラ１００は、ステップＳ１２，Ｓ１３を実行する。ステップＳ１２では、例えば、検査制御部１１８が、側面Ｗｃの中央部分の撮像画像を取得するようにカメラ６２を制御する。ステップＳ１３では、例えば、進退制御部１１６が、吸着部２０を円軌道ＣＲ１の径方向に沿って外方へ移動させるように進退駆動部２５を制御する。進退制御部１１６は、図６（ｂ）に示されるように、吸着部２０が保持する電子部品Ｗの側面Ｗｃの中央部分よりも左側の部分（内側寄りの部分）が撮像範囲ＰＡに含まれる状態となるように、進退駆動部２５により吸着部２０を移動させる。 Next, the controller 100 executes steps S12 and S13. In step S12, for example, the inspection control unit 118 controls the camera 62 so as to acquire a captured image of the central portion of the side surface Wc. In step S13, for example, the advance/retreat control unit 116 controls the advance/retreat driving unit 25 to move the suction unit 20 outward along the radial direction of the circular orbit CR1. As shown in FIG. 6B, the advance/retreat control unit 116 has an imaging range PA in which a left portion (inward portion) of the side surface Wc of the electronic component W held by the suction unit 20 is located to the left of the central portion. The adsorption unit 20 is moved by the advance/retreat driving unit 25 so as to be in the state.
　次に、コントローラ１００は、ステップＳ１４，Ｓ１５を実行する。ステップＳ１４では、例えば、検査制御部１１８が、側面Ｗｃの左側部分の撮像画像を取得するようにカメラ６２を制御する。ステップＳ１５では、例えば、進退制御部１１６が、吸着部２０を径方向に沿って内側へ移動させるように進退駆動部２５を制御する。進退制御部１１６は、図６（ｃ）に示されるように、吸着部２０が保持する電子部品Ｗの側面Ｗｃの中央部分よりも右側の部分（外側寄りの部分）が撮像範囲ＰＡに含まれる状態となるように、進退駆動部２５により吸着部２０を移動させる。 Next, the controller 100 executes steps S14 and S15. In step S14, for example, the inspection control unit 118 controls the camera 62 so as to acquire a captured image of the left portion of the side surface Wc. In step S15, for example, the advance/retreat control unit 116 controls the advance/retreat driving unit 25 so as to move the suction unit 20 inward along the radial direction. As shown in FIG. 6(c), the advance/retreat control unit 116 has an imaging range PA in which a portion to the right of the central portion (outer portion) of the side surface Wc of the electronic component W held by the suction unit 20 is included. The adsorption unit 20 is moved by the advance/retreat driving unit 25 so as to be in the state.
　次に、コントローラ１００は、ステップＳ１６を実行する。ステップＳ１６では、例えば、検査制御部１１８が、側面Ｗｃの右側部分の撮像画像を取得するようにカメラ６２を制御する。以上のステップＳ１６までの制御処理の実行により、カメラ６２（外観検査ユニット６０）は、電子部品Ｗの径方向における位置が互いに異なる状態で複数回の撮像を実行する。側面Ｗｃに対する複数回の撮像（この例では、３回の撮像）により、側面Ｗｃ全体について画像データが得られる。 Next, the controller 100 executes step S16. In step S16, for example, the inspection control unit 118 controls the camera 62 so as to acquire a captured image of the right portion of the side surface Wc. By executing the control processing up to step S16, the camera 62 (appearance inspection unit 60) performs a plurality of times of imaging in a state where the positions of the electronic component W in the radial direction are different from each other. Image data for the entire side surface Wc is obtained by imaging the side surface Wc a plurality of times (three times in this example).
　次に、コントローラ１００は、ステップＳ１７，Ｓ１８を実行する。ステップＳ１７では、例えば、進退制御部１１６が、吸着部２０をステップＳ１３の開始前の位置に戻すように進退駆動部２５を制御する。ステップＳ１８では、例えば、検査制御部１１８が、ステップＳ１２，Ｓ１４，Ｓ１６それぞれで得られた画像データに基づいて、側面Ｗｃにおける異常の有無を判定する。 Next, the controller 100 executes steps S17 and S18. In step S17, for example, the advance/retreat control unit 116 controls the advance/retreat driving unit 25 to return the suction unit 20 to the position before the start of step S13. In step S18, for example, the inspection control unit 118 determines whether there is an abnormality in the side surface Wc based on the image data obtained in steps S12, S14, and S16.
　次に、コントローラ１００は、ステップＳ１９を実行する。ステップＳ１９では、例えば、搬送制御部１１２が、検査後の電子部品Ｗを保持する吸着部２０が、検査位置ＩＰの１つ先の停止位置ＳＰに配置されるように搬送駆動部１６を制御する。以上により、外観検査ユニット６０を用いて、１つの電子部品Ｗに対して行う検査が終了する。ステップＳ１９の実行により、次の検査対象の電子部品Ｗを保持する別の吸着部２０が検査位置ＩＰに配置される。以降、コントローラ１００は、ステップＳ１２～Ｓ１９の一連の制御処理を繰り返し実行する。 Next, the controller 100 executes step S19. In step S19, for example, the transport control unit 112 controls the transport driving unit 16 so that the suction unit 20 holding the inspected electronic component W is arranged at the stop position SP one ahead of the inspection position IP. . As described above, the inspection performed on one electronic component W using the appearance inspection unit 60 is completed. By executing step S19, another suction unit 20 holding the next electronic component W to be inspected is arranged at the inspection position IP. After that, the controller 100 repeatedly executes a series of control processes from steps S12 to S19.
（変形例）
　図６（a）、図６（b）および図６（c）に示される上述の一連の制御処理は一例であり、適宜変更可能である。上記一連の制御処理において、コントローラ１００は、一のステップと次のステップとを並列に実行してもよく、上述した例とは異なる順序で各ステップを実行してもよい。コントローラ１００は、いずれかのステップを省略してもよく、いずれかのステップにおいて上述の例とは異なる処理を実行してもよい。コントローラ１００は、例えば、ステップＳ１５，Ｓ１６の実行後に、ステップＳ１３，Ｓ１４を実行してもよい。コントローラ１００は、例えば、ステップＳ１７とステップＳ１８とを、これらの実行タイミングが少なくとも部分的に重複するように並行して実行してもよい。 (Modification)
The above-described series of control processes shown in FIGS. 6(a), 6(b), and 6(c) are examples, and can be changed as appropriate. In the series of control processes described above, the controller 100 may execute one step and the next step in parallel, or may execute each step in an order different from the above example. The controller 100 may omit any of the steps, or perform processing different from the above example in any of the steps. The controller 100 may execute steps S13 and S14 after executing steps S15 and S16, for example. The controller 100 may, for example, execute steps S17 and S18 in parallel such that their execution timings at least partially overlap.
　コントローラ１００は、ステップＳ１６の実行後において、ステップＳ１７，Ｓ１９を、これらの実行タイミングが少なくとも部分的に重複するように並行して実行してもよい。コントローラ１００は、ステップＳ１１の実行中においてステップＳ１３を実行し、ステップＳ１７の実行後にステップＳ１２を実行してもよい。搬送駆動部１６による部品保持部１４の回転搬送（支持部１２の回転）を行っている間に、径方向に沿って一方側に吸着部２０を移動させることで、１つの電子部品Ｗの検査に要する時間を短縮することができる。 After executing step S16, the controller 100 may execute steps S17 and S19 in parallel so that their execution timings at least partially overlap. The controller 100 may execute step S13 during execution of step S11, and execute step S12 after execution of step S17. One electronic component W is inspected by moving the suction unit 20 to one side along the radial direction while the component holding unit 14 is rotated (rotation of the support unit 12) by the transport driving unit 16. can shorten the time required for
　電子部品Ｗのサイズによっては、カメラ６２は、１つの電子部品Ｗの側面Ｗｃに対して、進退駆動部２５によって吸着部２０の径方向における位置を変えながら、２回の撮像を行ってもよく、４回以上の撮像を行ってもよい。電子部品Ｗのサイズが小さい場合には、検査対象面である側面Ｗｃの全体が撮像範囲ＰＡに含まれる場合もある。この場合、コントローラ１００は、進退駆動部２５によって吸着部２０の径方向の位置を変えずに、電子部品Ｗの側面Ｗｃに対して１回の撮像を行ってもよい。 Depending on the size of the electronic component W, the camera 62 may image the side surface Wc of one electronic component W twice while changing the radial position of the suction unit 20 by the forward/backward driving unit 25. , imaging may be performed four times or more. If the size of the electronic component W is small, the entire side surface Wc, which is the surface to be inspected, may be included in the imaging range PA. In this case, the controller 100 may image the side surface Wc of the electronic component W once without changing the radial position of the suction unit 20 by the forward/backward driving unit 25 .
　上述の例では、部品保持部１４（吸着部２０）を径方向に移動させる進退駆動部２５が、支持部１２に設けられているが、部品保持部１４を径方向に移動させる進退駆動部が、支持部１２と共に回転しないように設けられてもよい。図７に示される回転搬送ユニット１０Ａは、部品保持部１４に代えて部品保持部１４Ａを有し、進退駆動部２５に代えて進退駆動部７０を有する。部品保持部１４Ａ（部品保持部１４Ａの吸着部２０）は、昇降駆動部１８によって中心軸Ａｘ１が延びる方向に沿って移動し、進退駆動部７０によって中心軸Ａｘ１まわりの円軌道ＣＲ１の径方向に沿って移動する。部品保持部１４Ａは、昇降部２４と、進退部８２とを有する。 In the above example, the advance/retreat driving portion 25 for moving the component holding portion 14 (suction portion 20) in the radial direction is provided in the support portion 12. However, the advance/retreat driving portion for moving the component holding portion 14 in the radial direction is , may be provided so as not to rotate together with the support portion 12 . The rotary transfer unit 10A shown in FIG. 7 has a component holding section 14A instead of the component holding section 14, and a forward/backward drive section 70 instead of the forward/backward drive section 25. As shown in FIG. The component holding portion 14A (the suction portion 20 of the component holding portion 14A) is moved along the direction in which the central axis Ax1 extends by the elevation driving portion 18, and is moved in the radial direction of the circular orbit CR1 around the central axis Ax1 by the forward/backward driving portion 70. move along. The component holding section 14A has an elevating section 24 and an advancing/retracting section 82 .
　部品保持部１４Ａの昇降部２４は、進退部８２に接続される点を除き、部品保持部１４の昇降部２４と同様に構成されている。進退部８２は、径方向に沿って移動可能となるように支持部１２に設けられており、昇降部２４の可動部４２を昇降可能に保持する。進退部８２は、例えば、可動部８４と、延出部８８と、受け部８６と、を有する。可動部８４は、径方向に沿って移動可能となるように、支持部１２の外周部に設けられている。可動部８４の一端は、支持部１２の外周縁よりも外方へ張り出している。 The elevating section 24 of the component holding section 14A is configured in the same manner as the elevating section 24 of the component holding section 14 except that it is connected to the advance/retreat section 82 . The advance/retreat portion 82 is provided on the support portion 12 so as to be movable along the radial direction, and holds the movable portion 42 of the elevation portion 24 so as to be able to move up and down. The retractable portion 82 has, for example, a movable portion 84 , an extending portion 88 and a receiving portion 86 . The movable portion 84 is provided on the outer peripheral portion of the support portion 12 so as to be movable along the radial direction. One end of the movable portion 84 protrudes outward from the outer peripheral edge of the support portion 12 .
　可動部８４の外周側の先端には、その先端から下方に延びる延出部８８が接続されている。延出部８８の外方を向く側面には、昇降部２４の可動部４２が接続されている。受け部８６は、可動部８４の下面に接続されており、その接続部分を起点として下方に延びるように形成されている。受け部８６は、支持部１２の下面よりも下まで延びており、支持部１２は、受け部８６の径方向に沿う移動を妨げない形状とされている。 An extending portion 88 extending downward from the tip is connected to the tip of the outer peripheral side of the movable portion 84 . The movable portion 42 of the elevating portion 24 is connected to the side surface of the extending portion 88 facing outward. The receiving portion 86 is connected to the lower surface of the movable portion 84 and extends downward from the connecting portion. The receiving portion 86 extends below the lower surface of the supporting portion 12 , and the supporting portion 12 has a shape that does not hinder the radial movement of the receiving portion 86 .
　進退駆動部７０（第２駆動部）は、部品保持部１４（吸着部２０）を径方向に沿って移動させる。進退駆動部７０は、支持部１２の回転と共に移動しないように設けられている。処理装置１は、搬送駆動部１６等が設置されるベース部７９を備えてもよい。進退駆動部７０は、ベース部７９に設けられていてもよい。進退駆動部７０は、検査位置ＩＰに配置された部品保持部１４（吸着部２０）を径方向に沿って移動させる。上述の進退駆動部２５が対応する部品保持部１４を移動させるのに対して、進退駆動部７０は、検査位置ＩＰに配置されるいずれかの部品保持部１４を移動させる。回転搬送ユニット１０Ａは、部品保持部１４を径方向に移動させる停止位置ＳＰ（例えば、検査位置ＩＰ）に対応する位置に進退駆動部７０を有し、部品保持部１４を径方向に移動させない停止位置ＳＰには進退駆動部を有しなくてもよい。 The advance/retreat drive section 70 (second drive section) moves the component holding section 14 (suction section 20) along the radial direction. The advance/retreat drive portion 70 is provided so as not to move with the rotation of the support portion 12 . The processing apparatus 1 may include a base portion 79 on which the transport driving portion 16 and the like are installed. The advance/retreat drive section 70 may be provided on the base section 79 . The forward/backward drive unit 70 moves the component holding unit 14 (suction unit 20) arranged at the inspection position IP along the radial direction. While the forward/backward drive unit 25 moves the corresponding component holding unit 14, the forward/backward drive unit 70 moves one of the component holders 14 arranged at the inspection position IP. The rotary transport unit 10A has an advance/retreat drive unit 70 at a position corresponding to a stop position SP (for example, an inspection position IP) that moves the component holding unit 14 in the radial direction, and a stop position that does not move the component holding unit 14 in the radial direction. The position SP may not have a forward/backward drive unit.
　進退駆動部７０は、例えば、ホルダ７２と、進退ロッド７４と、モータ７６とを有する。ホルダ７２は、ベース部７９に設けられている。そのため、ホルダ７２は、支持部１２が回転しても移動しない。進退ロッド７４は、ホルダ７２に対して移動可能となるようにホルダ７２に設けられている。進退ロッド７４は、円軌道ＣＲ１の径方向に沿って延びるように棒状に形成されており、径方向に沿って移動可能となるようにホルダ７２に保持されている。進退ロッド７４は、受け部８６よりも内側に配置されている。モータ７６は、外方に向けて移動させるための駆動力を進退ロッド７４に付与する。 The advancing/retreating drive unit 70 has, for example, a holder 72, an advancing/retreating rod 74, and a motor 76. The holder 72 is provided on the base portion 79 . Therefore, the holder 72 does not move even when the support portion 12 rotates. The advance/retreat rod 74 is provided on the holder 72 so as to be movable with respect to the holder 72 . The advance/retreat rod 74 is formed in a rod shape so as to extend along the radial direction of the circular track CR1, and is held by the holder 72 so as to be movable along the radial direction. The advance/retreat rod 74 is arranged inside the receiving portion 86 . A motor 76 applies a driving force to the advancing/retreating rod 74 to move it outward.
　回転搬送ユニット１０Ａでは、モータ７６による駆動力によって、進退ロッド７４が、径方向に沿って外方に向けて移動する。進退ロッド７４の外方への移動により、進退ロッド７４から受け部８６に対して外力が付与される。これにより、可動部８４及び昇降部２４が径方向に沿って外方に移動する。その結果、ホルダ２２に保持された吸着部２０が、径方向に沿って外方に移動する。モータ７６による進退ロッド７４への駆動力の付与を解除すると、吸着部２０が移動する前の位置に戻る。回転搬送ユニット１０Ａを備える処理装置１においても、図５に示される一連の制御処理が実行されてもよい。 In the rotary transfer unit 10A, the driving force of the motor 76 causes the advancing/retreating rod 74 to move outward along the radial direction. An external force is applied from the advance/retreat rod 74 to the receiving portion 86 by the outward movement of the advance/retreat rod 74 . As a result, the movable portion 84 and the lifting portion 24 move outward along the radial direction. As a result, the suction portion 20 held by the holder 22 moves outward along the radial direction. When the application of the driving force to the forward/backward rod 74 by the motor 76 is released, the adsorption portion 20 returns to the position before it moved. The series of control processes shown in FIG. 5 may also be executed in the processing apparatus 1 including the rotary transfer unit 10A.
　図２に示されるように、回転搬送ユニット１０は、回転駆動部１９を有してもよい。回転駆動部１９は、中心軸Ａｘ２まわりに吸着部２０（部品保持部）を回転させる駆動部である。中心軸Ａｘ２は、中心軸Ａｘ１と平行な軸線である。中心軸Ａｘ２は、吸着部２０の下面の中心を通るように設定されていてもよい。回転駆動部１９は、ホルダ２２に固定されており、ホルダ２２の昇降又は径方向に沿った進退と共に移動してもよい。回転搬送ユニット１０は、複数の吸着部２０にそれぞれ対応する複数の回転駆動部１９を有してもよい。 As shown in FIG. 2 , the rotary transfer unit 10 may have a rotary drive section 19 . The rotation drive unit 19 is a drive unit that rotates the suction unit 20 (component holding unit) around the central axis Ax2. The central axis Ax2 is an axis parallel to the central axis Ax1. The central axis Ax2 may be set so as to pass through the center of the lower surface of the adsorption section 20 . The rotary drive unit 19 is fixed to the holder 22 and may move as the holder 22 moves up and down or advances and retreats along the radial direction. The rotary transfer unit 10 may have a plurality of rotary drive sections 19 corresponding to the plurality of suction sections 20 respectively.
　回転駆動部１９が、電子部品Ｗを保持した吸着部２０を中心軸Ａｘ２まわりに回転させることで、その電子部品Ｗの中心軸Ａｘ２まわりの姿勢が変化する。中心軸Ａｘ２まわりの電子部品Ｗの姿勢を変化させることで、いずれかの停止位置ＳＰ（例えば、検査位置ＩＰ）に配置される際の電子部品Ｗの１つの側面Ｗｃの向きを変化させることができる。コントローラ１００は、図３に示されるように、機能モジュールとして、姿勢制御部１２２を有してもよい。姿勢制御部１２２は、吸着部２０によって保持された電子部品Ｗの中心軸Ａｘ２まわりの姿勢を変化させるように回転駆動部１９を制御する。 The rotation drive unit 19 rotates the suction unit 20 holding the electronic component W around the central axis Ax2, thereby changing the posture of the electronic component W around the central axis Ax2. By changing the posture of the electronic component W about the central axis Ax2, it is possible to change the orientation of one side surface Wc of the electronic component W when it is placed at one of the stop positions SP (for example, the inspection position IP). can. The controller 100 may have an attitude control section 122 as a functional module, as shown in FIG. The attitude control section 122 controls the rotation driving section 19 so as to change the attitude of the electronic component W held by the suction section 20 about the central axis Ax2.
　回転駆動部１９が設けられる場合に、１つの側面Ｗｃだけでなく、他の１つ以上の側面Ｗｃに対して、外観検査ユニット６０のカメラ６２による撮像が行われてもよい。例えば、４つの側面Ｗｃそれぞれに対して、カメラ６２による撮像が順に行われてもよい。この場合、他の側面Ｗｃに対しても、吸着部２０の径方向における位置を変化させながら、カメラ６２による複数回の撮像が実行されてもよい。 When the rotation drive unit 19 is provided, not only one side surface Wc but also one or more other side surfaces Wc may be imaged by the camera 62 of the visual inspection unit 60. For example, the camera 62 may sequentially capture images of the four side surfaces Wc. In this case, the camera 62 may take multiple images of the other side surface Wc while changing the position of the suction unit 20 in the radial direction.
　一例では、図５に示される一連の制御手順において、ステップＳ１７の実行後に、姿勢制御部１２２が、吸着部２０を中心軸Ａｘ２まわりに９０°回転させるように回転駆動部１９を制御してもよい。これにより、他の側面Ｗｃがカメラ６２に正対した状態となる。そして、コントローラ１００は、他の側面Ｗｃについて、ステップＳ１２～Ｓ１７の一連の制御手順を実行してもよい。 As an example, in the series of control procedures shown in FIG. 5, after execution of step S17, the posture control unit 122 may control the rotation drive unit 19 to rotate the adsorption unit 20 by 90° around the central axis Ax2. good. As a result, the other side Wc faces the camera 62 . Then, the controller 100 may execute a series of control procedures of steps S12 to S17 for the other side surface Wc.
　１つの側面Ｗｃに対する外観検査時に、姿勢制御部１２２は、回転駆動部１９により、中心軸Ａｘ２まわりの電子部品Ｗの姿勢を変化させてもよい。ここで、電子部品Ｗを透過する光（例えば、近赤外線）を用いて電子部品Ｗを検査する場合がある。回転搬送ユニット１０は、例えば、外観検査ユニット６０に代えて外観検査ユニット６０Ａを有する。外観検査ユニット６０Ａは、図８（ａ）に示されるように、照射部６４と撮像部６６とを有する。照射部６４と撮像部６６とは、検査対象の電子部品Ｗを間に挟むように配置されてもよい。照射部６４及び撮像部６６は、搬送駆動部１６による部品保持部１４の移動と干渉しないように配置されている。 During the appearance inspection for one side surface Wc, the attitude control unit 122 may change the attitude of the electronic component W around the central axis Ax2 by using the rotation driving unit 19. Here, the electronic component W may be inspected using light (for example, near-infrared rays) that passes through the electronic component W. FIG. The rotary transfer unit 10 has, for example, a visual inspection unit 60A instead of the visual inspection unit 60. As shown in FIG. The visual inspection unit 60A has an irradiation section 64 and an imaging section 66, as shown in FIG. 8(a). The irradiation unit 64 and the imaging unit 66 may be arranged so as to sandwich the electronic component W to be inspected. The irradiation unit 64 and the imaging unit 66 are arranged so as not to interfere with movement of the component holding unit 14 by the transport driving unit 16 .
　照射部６４は、電子部品Ｗの側面Ｗｃに向けて、電子部品Ｗの内部を透過可能な光を照射するように構成されている。撮像部６６（受光部）は、照射部６４から照射され、電子部品Ｗの内部を透過して、反対側の側面Ｗｃから出射される光（以下、「透過光」という。）を受光するように構成されている。仮に、撮像部６６に対向する側面ＷｃにクラックＣｒが生じている場合、撮像部６６が受光する透過光の一部が、そのクラックＣｒに遮られる。この場合、撮像部６６が受光した光に基づく画像データにおいて、クラックＣｒによる影が生じ、検査制御部１１８は、クラックＣｒを検出することができる。 The irradiation unit 64 is configured to irradiate the side surface Wc of the electronic component W with light that can pass through the inside of the electronic component W. The imaging unit 66 (light receiving unit) receives light emitted from the irradiation unit 64, transmitted through the inside of the electronic component W, and emitted from the opposite side surface Wc (hereinafter referred to as “transmitted light”). is configured to If a crack Cr occurs on the side surface Wc facing the imaging unit 66, part of the transmitted light received by the imaging unit 66 is blocked by the crack Cr. In this case, the crack Cr casts a shadow in the image data based on the light received by the imaging unit 66, and the inspection control unit 118 can detect the crack Cr.
　撮像部６６に対する１つの側面Ｗｃの角度が互いに異なる状態で、外観検査ユニット６０Ａは、複数回の撮像を実行してもよい。一例では、図８（ａ）に示されるように、照射部６４から撮像部６６への光路に対して、撮像部６６を向く側面Ｗｃが垂直な状態で、外観検査ユニット６０Ａは１回目の撮像を行ってもよい。そして、図８（ｂ）に示されるように、側面Ｗｃが上記光路に垂直な状態から、その側面Ｗｃを所定の角度だけ回転駆動部１９により傾けたうえで、外観検査ユニット６０Ａが２回目の撮像を行ってもよい。２回目の撮像時に傾ける上記所定の角度は、４５°よりも小さくてもよく、一例では、５°～３０°であってもよい。外観検査ユニット６０Ａは、２以上の側面Ｗｃそれぞれの検査を行ってもよい。この場合、外観検査ユニット６０Ａは、１つの側面Ｗｃごとに、側面Ｗｃの向きを変えながら複数回の撮像を行ってもよい。 The visual inspection unit 60A may perform imaging multiple times while the angles of one side surface Wc with respect to the imaging unit 66 are different from each other. In one example, as shown in FIG. 8A, the visual inspection unit 60A performs the first imaging in a state in which the side surface Wc facing the imaging unit 66 is perpendicular to the optical path from the irradiation unit 64 to the imaging unit 66. may be performed. Then, as shown in FIG. 8(b), the side surface Wc is tilted by a predetermined angle by the rotary drive unit 19 from the state in which the side surface Wc is perpendicular to the optical path, and then the visual inspection unit 60A is operated for the second time. Imaging may be performed. The predetermined angle for tilting during the second imaging may be smaller than 45°, and for example, may be 5° to 30°. The appearance inspection unit 60A may inspect each of two or more side surfaces Wc. In this case, the visual inspection unit 60A may take multiple images while changing the direction of the side surface Wc for each side surface Wc.
　照射部６４から撮像部６６への光路に沿って延びるようにクラックＣｒが生じていると、画像データに含まれる影が小さくなり、クラックＣｒを検出し難い場合がある。これに対して、中心軸Ａｘ２まわりの電子部品Ｗの姿勢が互いに異なる状態で、外観検査ユニット６０Ａによる複数回の撮像が行われることで、少なくとも１回の撮像では、上記光路に対してクラックＣｒが傾くことになる。その結果、クラックＣｒの検出精度を向上させることができる。 If the crack Cr occurs along the optical path from the irradiation unit 64 to the imaging unit 66, the shadow included in the image data becomes small, and it may be difficult to detect the crack Cr. On the other hand, in a state where the posture of the electronic component W around the central axis Ax2 is different from each other, the appearance inspection unit 60A performs a plurality of imaging operations. will tilt. As a result, detection accuracy of crack Cr can be improved.
　処理装置１は、回転搬送ユニット１０に対して電子部品Ｗを供給する別の回転搬送部を備えてもよい。一例では、部品供給ユニット６が、図９に示されるように、回転搬送部９０と、位置調節部９８とを有する。回転搬送部９０は、所謂ロータリーピックアップであり、供給部９９から電子部品Ｗを受け取り円軌道ＣＲ３に沿って移動させ、その電子部品Ｗを部品保持部１４（吸着部２０）に引き渡す。 The processing apparatus 1 may include another rotary transfer section that supplies electronic components W to the rotary transfer unit 10 . In one example, the component supply unit 6 has a rotating transport section 90 and a position adjusting section 98, as shown in FIG. The rotary transfer unit 90 is a so-called rotary pickup, receives the electronic component W from the supply unit 99, moves it along the circular track CR3, and delivers the electronic component W to the component holding unit 14 (suction unit 20).
　回転搬送部９０は、ロータ９１と、複数の部品保持部９２と、搬送駆動部９６とを有する。ロータ９１は、部品供給ユニット６に対応する停止位置ＳＰ（上述の供給位置ＳＰ１）の下方において、水平な中心軸Ａｘ３まわりに回転可能となるように設けられている。複数の部品保持部９２は、中心軸Ａｘ３を中心とする円周に沿って等間隔に配置されており、ロータ９１に固定されている。部品保持部９２は、円軌道ＣＲ３の径方向の端部において、円軌道ＣＲ３の外に向けて電子部品Ｗを吸着するように構成された吸着部９４を有する。 The rotary transfer section 90 has a rotor 91 , a plurality of component holding sections 92 and a transfer drive section 96 . The rotor 91 is provided below the stop position SP (supply position SP1 described above) corresponding to the component supply unit 6 so as to be rotatable around the horizontal central axis Ax3. The plurality of component holding portions 92 are arranged at equal intervals along the circumference around the central axis Ax3 and are fixed to the rotor 91 . The component holding portion 92 has a suction portion 94 configured to suck the electronic component W toward the outside of the circular track CR3 at the radial end portion of the circular track CR3.
　搬送駆動部９６は、例えば電動モータ等の動力源を含み、中心軸Ａｘ３まわりにロータ９１を回転させる。ロータ９１の回転により、中心軸Ａｘ３を中心とする鉛直な円軌道ＣＲ３に沿って、複数の部品保持部９２（吸着部９４）が移動する。搬送駆動部９６は、隣り合う部品保持部９２同士の角度ピッチ（中心軸Ａｘ３まわりの角度ピッチ）にて、ロータ９１の回転と停止とを繰り返すように制御される。以下、搬送駆動部９６がロータ９１を停止させる際に複数の部品保持部９２がそれぞれ配置される複数の位置を「複数の停止位置ＳＰ３」という。 The transport drive unit 96 includes a power source such as an electric motor, for example, and rotates the rotor 91 around the central axis Ax3. Due to the rotation of the rotor 91, the plurality of component holding portions 92 (suction portions 94) move along a vertical circular orbit CR3 centered on the central axis Ax3. The transport drive unit 96 is controlled so that the rotor 91 is repeatedly rotated and stopped at the angular pitch (angular pitch around the central axis Ax3) between the adjacent component holders 92 . Hereinafter, the plurality of positions where the plurality of component holding portions 92 are arranged when the transport driving portion 96 stops the rotor 91 will be referred to as "a plurality of stop positions SP3".
　円軌道ＣＲ３上に位置する１つの停止位置ＳＰ３は、部品保持部９２と部品保持部１４との間で電子部品Ｗの受け渡しが可能な位置に設定される。例えば、最上の停止位置ＳＰ３が、供給位置ＳＰ１の鉛直下方に配置される。部品保持部９２から部品保持部１４への電子部品Ｗの受け渡しは、供給位置ＳＰ１及び最上の停止位置ＳＰ３の近傍において、部品保持部９２及び部品保持部１４が互いに最接近した状態で行われる。 One stop position SP3 located on the circular orbit CR3 is set at a position where the electronic component W can be transferred between the component holding section 92 and the component holding section 14. For example, the uppermost stop position SP3 is arranged vertically below the supply position SP1. The delivery of the electronic component W from the component holding section 92 to the component holding section 14 is performed in the vicinity of the supply position SP1 and the uppermost stop position SP3, with the component holding section 92 and the component holding section 14 closest to each other.
　位置調節部９８は、供給位置ＳＰ１に配置された部品保持部１４に対する部品保持部９２の位置を調節する。図９に例示される位置調節部９８は、最上の停止位置ＳＰ３に配置される際の部品保持部１４の中心軸Ａｘ３に沿った方向における位置を調節するように、ロータ９１を移動させる。 The position adjusting section 98 adjusts the position of the component holding section 92 with respect to the component holding section 14 arranged at the supply position SP1. The position adjusting section 98 illustrated in FIG. 9 moves the rotor 91 so as to adjust the position of the component holding section 14 in the direction along the central axis Ax3 when it is arranged at the uppermost stop position SP3.
　処理装置１は、部品保持部９２が保持する電子部品Ｗに対して処理を施す処理ユニットの一例として、検出ユニット６８を更に備えてもよい。検出ユニット６８は、最上の停止位置ＳＰ３よりも上流に位置する停止位置ＳＰ３において、部品保持部９２が保持する電子部品Ｗの状態を検出する。検出ユニット６８は、例えば、上記停止位置ＳＰ３において、部品保持部９２に対する電子部品Ｗの位置ずれ、及び部品保持部９２に対する傾きを検出する。すなわち、検出ユニット６８は、電子部品Ｗが部品保持部９２から部品保持部１４に移る前に、部品保持部９２に対する電子部品Ｗの位置ずれ及び傾きを検出する。 The processing device 1 may further include a detection unit 68 as an example of a processing unit that processes the electronic component W held by the component holding section 92 . The detection unit 68 detects the state of the electronic component W held by the component holding section 92 at a stop position SP3 located upstream of the uppermost stop position SP3. The detection unit 68 detects, for example, the displacement of the electronic component W with respect to the component holding portion 92 and the inclination with respect to the component holding portion 92 at the stop position SP3. That is, the detection unit 68 detects positional deviation and inclination of the electronic component W with respect to the component holding portion 92 before the electronic component W moves from the component holding portion 92 to the component holding portion 14 .
　検出ユニット６８は、カメラ６９を有してもよい。カメラ６９は、例えば、対応する停止位置ＳＰ３に配置された電子部品Ｗの外を向く主面全体を含む撮像範囲を撮像する。コントローラ１００は、図３に示されるように、機能モジュールとして、処理制御部１２４と、受渡制御部１２６と、状態検出部１２８と、を有する。処理制御部１２４は、部品供給ユニット６を制御し、受渡制御部１２６は、電子部品Ｗの受け渡しを行うように回転搬送ユニット１０を制御する。状態検出部１２８は、検出ユニット６８により、部品保持部９２に対する電子部品Ｗの位置ずれ及び傾きを検出する。 The detection unit 68 may have a camera 69. The camera 69 captures an image of an imaging range including, for example, the entire principal surface facing outward of the electronic component W placed at the corresponding stop position SP3. As shown in FIG. 3, the controller 100 has a processing control section 124, a delivery control section 126, and a state detection section 128 as functional modules. The processing control section 124 controls the component supply unit 6, and the delivery control section 126 controls the rotary transport unit 10 so that the electronic component W is delivered. The state detection unit 128 detects positional deviation and inclination of the electronic component W with respect to the component holding unit 92 by the detection unit 68 .
　コントローラ１００は、部品保持部１４に移る前における電子部品Ｗの部品保持部９２に対する位置ずれに比較して、部品保持部１４に移った後における電子部品Ｗの部品保持部１４に対する位置ずれが小さくなるように、進退駆動部２５及び位置調節部９８を制御する。コントローラ１００は、部品保持部１４に移った後において、電子部品Ｗの傾き（理想状態に対する傾き）が小さくなるように、回転駆動部１９を制御する。 In the controller 100, the positional displacement of the electronic component W with respect to the component holding portion 14 after moving to the component holding portion 14 is smaller than the positional displacement of the electronic component W with respect to the component holding portion 92 before moving to the component holding portion 14. The forward/backward driving unit 25 and the position adjusting unit 98 are controlled so that The controller 100 controls the rotation driving section 19 so that the inclination of the electronic component W (inclination relative to the ideal state) becomes smaller after moving to the component holding section 14 .
　図１０は、図９に示される部品供給ユニット６から回転搬送ユニット１０に電子部品Ｗが供給される際に、コントローラ１００が実行する一連の制御処理の一例を示すフローチャートである。この一連の制御処理では、供給対象の電子部品Ｗが、検出ユニット６８に対応する停止位置ＳＰ３に配置された状態で、コントローラ１００がステップＳ３１を実行する。ステップＳ３１では、例えば、状態検出部１２８が、検出ユニット６８のカメラ６９から画像データを取得して、部品保持部９２に対する電子部品Ｗの位置ずれ及び傾きを検出する。 FIG. 10 is a flowchart showing an example of a series of control processes executed by the controller 100 when the electronic component W is supplied from the component supply unit 6 shown in FIG. 9 to the rotary transfer unit 10. FIG. In this series of control processes, the controller 100 executes step S31 while the electronic component W to be supplied is placed at the stop position SP3 corresponding to the detection unit 68 . In step S<b>31 , for example, the state detection unit 128 acquires image data from the camera 69 of the detection unit 68 and detects positional deviation and inclination of the electronic component W with respect to the component holding unit 92 .
　次に、コントローラ１００は、ステップＳ３２，Ｓ３３を実行する。ステップＳ３２では、例えば、処理制御部１２４が、供給対象の電子部品Ｗを保持する部品保持部９２（吸着部９４）が、最上の停止位置ＳＰ３に配置されるように、搬送駆動部９６によりロータ９１を回転させる。ステップＳ３３では、搬送制御部１１２が、供給対象の電子部品Ｗを受け取る予定の吸着部２０が、供給位置ＳＰ１に配置されるように搬送駆動部１６により支持部１２を回転させる。 Next, the controller 100 executes steps S32 and S33. In step S32, for example, the processing control unit 124 causes the transport drive unit 96 to move the rotor so that the component holding unit 92 (suction unit 94) that holds the electronic component W to be supplied is positioned at the uppermost stop position SP3. Rotate 91. In step S33, the transport control unit 112 causes the transport driving unit 16 to rotate the supporting unit 12 so that the suction unit 20, which is to receive the electronic component W to be supplied, is arranged at the supply position SP1.
　次に、コントローラ１００は、ステップＳ３４を実行する。ステップＳ３４では、例えば、進退制御部１１６及び処理制御部１２４が、最上の停止位置ＳＰ３に配置された部品保持部９２が保持する電子部品Ｗに対する吸着部２０の相対位置を調節するように、進退駆動部２５及び位置調節部９８をそれぞれ制御する。進退制御部１１６及び処理制御部１２４は、ステップＳ３１で得られた部品保持部９２に対する位置ずれに応じて、吸着部２０に受け渡された後の吸着部２０に対する電子部品Ｗの位置ずれ（例えば、中心同士の差）が縮小するように、進退駆動部２５及び位置調節部９８をそれぞれ制御する。 Next, the controller 100 executes step S34. In step S34, for example, the advance/retreat control unit 116 and the processing control unit 124 advance/retreat so as to adjust the relative position of the suction unit 20 with respect to the electronic component W held by the component holding unit 92 arranged at the uppermost stop position SP3. It controls the driving section 25 and the position adjusting section 98 respectively. The advance/retreat control unit 116 and the processing control unit 124 adjust the positional deviation (for example, , the difference between the centers) is reduced.
　次に、コントローラ１００は、ステップＳ３５を実行する。ステップＳ３５では、例えば、昇降制御部１１４が、供給位置ＳＰ１に配置された吸着部２０を最上の停止位置ＳＰ３に近づけるように、昇降駆動部１８により吸着部２０を下降させる。一例では、昇降制御部１１４は、吸着部２０の下面と電子部品Ｗとの間に僅かなクリアランスが設けられる程度まで、昇降駆動部１８により吸着部２０を下降させる。 Next, the controller 100 executes step S35. In step S35, for example, the elevation control section 114 causes the elevation driving section 18 to lower the adsorption section 20 so that the adsorption section 20 arranged at the supply position SP1 approaches the uppermost stop position SP3. In one example, the elevation control unit 114 lowers the adsorption unit 20 by the elevation drive unit 18 to such an extent that a slight clearance is provided between the lower surface of the adsorption unit 20 and the electronic component W.
　次に、コントローラ１００は、ステップＳ３６，Ｓ３７を実行する。ステップＳ３６では、例えば、受渡制御部１２６が、下降させた吸着部２０により電子部品Ｗの吸着を開始した後に、吸着部９４による電子部品Ｗの吸着を解除するように回転搬送ユニット１０を制御する。ステップＳ３７では、例えば、昇降制御部１１４が、電子部品Ｗを受け取った吸着部２０を元の高さに戻すように、昇降駆動部１８により当該吸着部２０を上昇させる。 Next, the controller 100 executes steps S36 and S37. In step S<b>36 , for example, the transfer control unit 126 controls the rotary transfer unit 10 so as to release the suction of the electronic component W by the suction unit 94 after starting the suction of the electronic component W by the lowered suction unit 20 . . In step S<b>37 , for example, the elevation control unit 114 raises the adsorption unit 20 by the elevation drive unit 18 so that the adsorption unit 20 that has received the electronic component W is returned to its original height.
　次に、コントローラ１００は、ステップＳ３８，Ｓ３９を実行する。ステップＳ３８では、例えば、進退制御部１１６が、ステップＳ３４の実行前の位置に吸着部２０を戻すように進退駆動部２５を制御し、処理制御部１２４が、ステップＳ３４の実行前の位置にロータ９１を戻すように位置調節部９８を制御する。ステップＳ３９では、例えば、姿勢制御部１２２が、ステップＳ３１で得られた部品保持部９２に対する電子部品Ｗの傾きに応じて、理想状態に対する電子部品Ｗの傾きが小さくなるように回転駆動部１９により中心軸Ａｘ２まわりに吸着部２０を回転させる。 Next, the controller 100 executes steps S38 and S39. In step S38, for example, the advance/retreat control unit 116 controls the advance/retreat drive unit 25 to return the suction unit 20 to the position before execution of step S34, and the process control unit 124 returns the rotor to the position before execution of step S34. The position adjuster 98 is controlled so that the 91 is returned. In step S39, for example, the posture control unit 122 causes the rotation driving unit 19 to reduce the inclination of the electronic component W with respect to the ideal state, according to the inclination of the electronic component W with respect to the component holding unit 92 obtained in step S31. The adsorption portion 20 is rotated around the central axis Ax2.
　以上により、部品供給ユニット６から１つの電子部品Ｗを回転搬送ユニット１０に供給する際の一連の制御処理が終了する。コントローラ１００は、後続の複数の電子部品Ｗそれぞれについて、ステップＳ３１～Ｓ３９の一連の制御処理を繰り返し実行してもよい。上述の一連の制御処理において、吸着部２０と部品保持部９２の吸着部９４とが、電子部品Ｗを挟み込んだ状態で（両方の吸着部が電子部品Ｗの主面Ｗａ，Ｗｂに接触した状態で）、電子部品Ｗの受け渡しが行われてもよい。以下、両方の吸着部が接触した状態で受け渡しが行われる場合の一例について、装置の構成を含めて、その詳細を説明する。 Thus, a series of control processing for supplying one electronic component W from the component supply unit 6 to the rotary transfer unit 10 is completed. The controller 100 may repeat the series of control processes of steps S31 to S39 for each of the subsequent electronic components W. In the series of control processes described above, the electronic component W is sandwiched between the suction unit 20 and the suction unit 94 of the component holding unit 92 (the state in which both the suction units are in contact with the main surfaces Wa and Wb of the electronic component W). ), the delivery of the electronic component W may be performed. In the following, an example of a case in which the transfer is performed while both of the adsorption portions are in contact with each other will be described in detail, including the configuration of the apparatus.
　図９に示されるように、回転搬送ユニット１０は、吸着部２０において電子部品Ｗを吸着する吸引力を発生させる吸引部１０１を有する。吸引部１０１は、例えば、吸引路１０２と、バルブ１０３とを含む。吸引路１０２は、吸着部２０の吸引孔と吸引ポンプ（例えば、真空ポンプ）とを接続する。バルブ１０３は、吸引路１０２に設けられている。バルブ１０３は、制御信号の入力に応じて吸引路１０２内の流路の開閉状態を切り替える。 As shown in FIG. 9 , the rotary transfer unit 10 has a suction section 101 that generates a suction force for sucking the electronic component W in the suction section 20 . The suction unit 101 includes, for example, a suction path 102 and a valve 103 . The suction path 102 connects the suction hole of the suction section 20 and a suction pump (for example, a vacuum pump). A valve 103 is provided in the suction path 102 . The valve 103 switches between open and closed states of the flow path in the suction path 102 according to the input of the control signal.
　バルブ１０３が開状態に切り替わることで、吸着部２０による吸着がオンとなり、バルブ１０３が閉状態となることで、吸着部２０の吸引孔が大気開放され、吸着部２０による吸着がオフとなる。回転搬送ユニット１０は、吸着部９４において電子部品Ｗを吸着する吸引力を発生させる吸引部１０５を有する。吸引部１０５は、例えば、吸引路１０６と、バルブ１０７とを含む。吸引路１０６は、吸引部１０１の吸引路１０２と同様の構成及び機能を有し、バルブ１０７は、吸引部１０１のバルブ１０３と同様の構成及び機能を有する。なお、図９には、一つの吸引部１０１及び一つの吸引部１０５が記載されているが、複数の吸着部それぞれに対応するように、複数の吸引部が設けられてもよい。 By switching the valve 103 to the open state, the adsorption by the adsorption unit 20 is turned on, and by closing the valve 103, the suction hole of the adsorption unit 20 is opened to the atmosphere, and the adsorption by the adsorption unit 20 is turned off. The rotary transfer unit 10 has a suction section 105 that generates a suction force for sucking the electronic component W in the suction section 94 . The suction section 105 includes, for example, a suction path 106 and a valve 107 . The suction path 106 has the same configuration and function as the suction path 102 of the suction section 101 , and the valve 107 has the same configuration and function as the valve 103 of the suction section 101 . Although one suction unit 101 and one suction unit 105 are shown in FIG. 9, a plurality of suction units may be provided so as to correspond to each of the plurality of suction units.
　回転搬送ユニット１０は、吸着部２０が下降した際に、電子部品Ｗに加わる荷重を検出可能な荷重検出部１０８（荷重センサ）を有してもよい。荷重検出部１０８は、例えば、図２に示されるように、昇降駆動部１８（昇降ロッド５４）に設けられてもよい。部品保持部９２の吸着部９４が電子部品Ｗを保持した状態で、吸着部２０が下降して電子部品Ｗに接触した後に、吸着部２０には、電子部品Ｗからの反力が加わる。荷重検出部１０８は、その反力を検出することで、電子部品Ｗに加わる荷重を検出してもよい。昇降駆動部１８は、電子部品Ｗに加わる荷重を調節する荷重調節部１０９を有してもよい。荷重調節部１０９は、例えば、ボイスコイルモータである。 The rotary transfer unit 10 may have a load detection section 108 (load sensor) capable of detecting the load applied to the electronic component W when the adsorption section 20 is lowered. For example, as shown in FIG. 2, the load detection unit 108 may be provided in the elevation driving unit 18 (elevating rod 54). After the suction portion 94 of the component holding portion 92 holds the electronic component W and the suction portion 20 descends to contact the electronic component W, the reaction force from the electronic component W is applied to the suction portion 20 . The load detector 108 may detect the load applied to the electronic component W by detecting the reaction force. The lifting drive section 18 may have a load adjustment section 109 that adjusts the load applied to the electronic component W. As shown in FIG. The load adjuster 109 is, for example, a voice coil motor.
　ステップＳ３５において、昇降制御部１１４が、所定の目標位置まで、昇降駆動部１８により吸着部２０を下降させる。目標位置は、上述の例とは異なり、吸着部２０の下面と電子部品Ｗとの間にクリアランスが設けられずに、吸着部２０と電子部品Ｗの主面Ｗａとが接触する程度に設定されている。昇降制御部１１４は、吸着部２０が上記目標位置に到達する前において、吸着部２０が、予め定められた減速開始位置まで達した後に、吸着部２０を減速させるように昇降駆動部１８を制御してもよい。 In step S35, the elevation control section 114 causes the elevation drive section 18 to lower the adsorption section 20 to a predetermined target position. Unlike the above example, the target position is set to such an extent that the suction unit 20 and the main surface Wa of the electronic component W are in contact with each other without providing a clearance between the lower surface of the suction unit 20 and the electronic component W. ing. The lift control unit 114 controls the lift drive unit 18 to decelerate the suction unit 20 after the suction unit 20 reaches a predetermined deceleration start position before the suction unit 20 reaches the target position. You may
　受渡制御部１２６は、吸着部２０が電子部品Ｗに接触した後において、吸着部２０から電子部品Ｗに加わる荷重（荷重検出部１０８による検出値）が、予め設定された許容荷重以下となるように荷重調節部１０９を制御してもよい。ステップＳ３６において、受渡制御部１２６が、下降させた吸着部２０による電子部品Ｗの吸着を開始するように、吸引部１０１のバルブ１０３を閉状態から開状態に遷移させてもよい。吸着部２０による吸着開始後に、受渡制御部１２６は、吸着部９４による電子部品Ｗの吸着を解除するように、吸引部１０５のバルブ１０７を開状態から閉状態に遷移させてもよい。 The delivery control unit 126 controls the load (the value detected by the load detection unit 108) applied to the electronic component W from the adsorption unit 20 after the adsorption unit 20 contacts the electronic component W to be equal to or less than a preset allowable load. You may control the load adjustment part 109 at time. In step S<b>36 , the delivery control unit 126 may cause the valve 103 of the suction unit 101 to transition from the closed state to the open state so that the lowered suction unit 20 starts sucking the electronic component W. After the suction unit 20 starts suctioning, the delivery control unit 126 may cause the valve 107 of the suction unit 105 to transition from the open state to the closed state so as to release the suction of the electronic component W by the suction unit 94 .
　以上の一連の制御処理では、互いに逆向きの主面Ｗａ，Ｗｂに２つの吸着部が接触し、且つ２つの吸着部が電子部品Ｗを吸着した状態を介して、一つの吸着部から他方の吸着部に電子部品Ｗが引き渡される。これにより、受け渡しに伴う電子部品Ｗの落下等のトラブルを抑制できる。なお、電子部品Ｗの吸着を解除する際に、吸引をオフにすることに代えて、吸着部の吸引孔からブロー排気が行われてもよい。吸着部２０の下降に代えて、又は加えて、電子部品Ｗの受け渡しが行われる際に、吸着部９４が上方に移動してもよい。 In the series of control processes described above, the two suction portions are in contact with the main surfaces Wa and Wb facing opposite to each other, and the electronic component W is sucked by the two suction portions. The electronic component W is handed over to the suction unit. As a result, troubles such as dropping of the electronic component W during delivery can be suppressed. In addition, when releasing the suction of the electronic component W, instead of turning off the suction, the air may be blown out from the suction hole of the suction portion. In place of or in addition to the descent of the suction portion 20, the suction portion 94 may move upward when the electronic component W is transferred.
　以上に説明した変形例では、電子部品Ｗが供給される際に位置が補正され、吸着部２０が電子部品Ｗを保持したまま、電子部品Ｗの姿勢が補正される。そのため、供給位置ＳＰ１の下流の停止位置ＳＰにおいて、電子部品Ｗを部品保持部１４から受け取って位置及び姿勢を補正した後に、部品保持部１４に戻すように構成されたアライメントユニットを配置する必要がない。この場合、処理装置１での電子部品Ｗの受け渡し回数が減少するので、電子部品Ｗの落下等のトラブルの発生が抑制され、処理効率を向上させることができる。 In the modified example described above, the position of the electronic component W is corrected when the electronic component W is supplied, and the posture of the electronic component W is corrected while the electronic component W is held by the suction unit 20 . Therefore, at the stop position SP downstream of the supply position SP1, it is necessary to arrange an alignment unit configured to receive the electronic component W from the component holding unit 14, correct the position and orientation, and then return it to the component holding unit 14. do not have. In this case, since the number of times the electronic parts W are transferred in the processing apparatus 1 is reduced, troubles such as dropping of the electronic parts W are suppressed, and the processing efficiency can be improved.
　上述の例では、部品保持部１４（吸着部２０）を中心軸Ａｘ１に沿って移動させる昇降駆動部１８に加えて、円軌道ＣＲ１の径方向に沿って部品保持部１４を移動させる進退駆動部２５，７０が備えられる。回転搬送ユニット１０，１０Ａは、昇降駆動部１８に加えて、円軌道ＣＲ１の径方向とは異なり、且つ、中心軸Ａｘ１に交差するいずれかの方向（第２方向）に沿って部品保持部１４を移動させる駆動部（第２駆動部）を備えてもよい。中心軸Ａｘ１に交差するいずれかの方向に沿って部品保持部１４を移動させる駆動部は、各部品保持部１４に対応して支持部１２に設けられてもよい。この場合、コントローラ１００（進退制御部１１６）は、搬送駆動部１６により支持部１２が回転している間において、その駆動部により、対応する部品保持部１４を上記いずれかの方向に沿って移動させてもよい。 In the above-described example, in addition to the elevation driving unit 18 that moves the component holding unit 14 (suction unit 20) along the central axis Ax1, the forward/backward driving unit that moves the component holding unit 14 along the radial direction of the circular orbit CR1 25, 70 are provided. In addition to the elevation drive section 18, the rotary transfer units 10 and 10A move the component holding section 14 along a direction (second direction) that is different from the radial direction of the circular track CR1 and intersects the central axis Ax1. may be provided with a driving portion (second driving portion) for moving the . A drive section that moves the component holding section 14 along one of the directions intersecting the central axis Ax1 may be provided in the support section 12 corresponding to each component holding section 14 . In this case, the controller 100 (advance/retreat control section 116) causes the corresponding component holding section 14 to move along one of the above directions by the drive section while the support section 12 is being rotated by the transport drive section 16. You may let
　回転搬送ユニット１０，１０Ａは、例えば、昇降駆動部１８に加えて、円軌道ＣＲ１の接線方向（第２方向）に沿って部品保持部１４を移動させる水平駆動部（第２駆動部）を有してもよい。上記水平駆動部は、各部品保持部１４に対応して支持部１２に設けられてもよく、検査位置ＩＰに配置されるいずれかの部品保持部１４を移動させるように、ベース部７９に設けられてもよい。各部品保持部１４に対応して支持部１２に水平駆動部が設けられる場合、進退制御部１１６は、搬送駆動部１６により支持部１２が回転している間において、その水平駆動部により、対応する部品保持部１４を接線方向に沿って移動させてもよい。水平駆動部によって部品保持部１４を移動させる上記接線方向は、円軌道ＣＲ１を含む平面において、吸着部２０（停止位置ＳＰ）と中心軸Ａｘ１とを結ぶラインに対して垂直であり、且つ吸着部２０を通るラインに沿った方向である。外観検査ユニット６０，６０Ａは、検査対象の電子部品Ｗを保持した吸着部２０の上記接線方向における位置が互いに異なる状態で、電子部品Ｗの検査対象面（例えば、側面Ｗｃ）について複数回の撮像を実行してもよい。 The rotary transfer unit 10, 10A has, for example, in addition to the elevation drive section 18, a horizontal drive section (second drive section) that moves the component holding section 14 along the tangential direction (second direction) of the circular track CR1. You may The horizontal driving section may be provided on the support section 12 corresponding to each component holding section 14, and may be provided on the base section 79 so as to move any one of the component holding sections 14 arranged at the inspection position IP. may be In the case where the support section 12 is provided with a horizontal drive section corresponding to each component holding section 14 , the advance/retreat control section 116 controls the horizontal drive section while the support section 12 is being rotated by the transport drive section 16 . The component holding portion 14 may be moved along the tangential direction. The tangential direction in which the component holding section 14 is moved by the horizontal driving section is perpendicular to the line connecting the suction section 20 (stop position SP) and the central axis Ax1 on the plane including the circular orbit CR1, and 20 is the direction along the line. The appearance inspection units 60 and 60A capture images of the surface to be inspected (for example, the side surface Wc) of the electronic component W a plurality of times while the positions in the tangential direction of the suction unit 20 holding the electronic component W to be inspected are different from each other. may be executed.
　回転搬送ユニット１０，１０Ａは、昇降駆動部１８に加えて、進退駆動部２５，７０と、吸着部２０を円軌道ＣＲ１の接線方向に沿って移動させる水平駆動部とを有してもよい。図１０に示される一連の制御手順と同様に、吸着部２０が電子部品Ｗを受け取る前に、部品保持部９２に保持された電子部品Ｗの中心と、吸着部２０の中心とが略一致するように、コントローラ１００が進退駆動部２５，７０及び水平駆動部を制御してもよい。この場合、部品供給ユニット６は、ロータ９１の位置を調節する位置調節部９８を有しなくてもよい。進退駆動部２５と共に上記水平駆動部が、各部品保持部１４に対応して支持部１２に設けられてもよい。この場合、進退制御部１１６は、搬送駆動部１６により支持部１２が回転している間において、進退駆動部２５及び上記水平駆動部により、対応する部品保持部１４を径方向及び接線方向それぞれに沿って移動させてもよい。 In addition to the elevation drive section 18, the rotary transfer units 10 and 10A may have advance/ retreat drive sections 25 and 70 and a horizontal drive section that moves the suction section 20 along the tangential direction of the circular track CR1. As in the series of control procedures shown in FIG. 10, before the electronic component W is received by the suction unit 20, the center of the electronic component W held by the component holding unit 92 substantially coincides with the center of the suction unit 20. As such, the controller 100 may control the advance/ retreat drive units 25 and 70 and the horizontal drive unit. In this case, the component supply unit 6 may not have the position adjusting section 98 for adjusting the position of the rotor 91 . The horizontal drive portion may be provided on the support portion 12 in correspondence with each component holding portion 14 together with the forward/backward drive portion 25 . In this case, while the support section 12 is being rotated by the transport drive section 16, the advance/retreat control section 116 causes the corresponding component holding section 14 to move radially and tangentially by the advance/retreat drive section 25 and the horizontal drive section. You can move along.
　上述の例では、部品保持部１４が電子部品Ｗを保持する方向（部品保持部１４と電子部品Ｗとが互いに対向する方向）が、中心軸Ａｘ１に沿って延びるように設定されている。この構成に代えて、処理装置１は、電子部品Ｗを円軌道ＣＲ１の外に向けて保持する部品保持部（吸着部）を備えてもよい。この場合、部品保持部と、その部品保持部によって保持されている電子部品Ｗとが互いに対向する方向が、円軌道ＣＲ１の径方向に沿って延びるように設定される。 In the above example, the direction in which the component holding portion 14 holds the electronic component W (the direction in which the component holding portion 14 and the electronic component W face each other) is set to extend along the central axis Ax1. Instead of this configuration, the processing apparatus 1 may include a component holding portion (suction portion) that holds the electronic component W facing the outside of the circular track CR1. In this case, the direction in which the component holding portion and the electronic component W held by the component holding portion face each other is set to extend along the radial direction of the circular track CR1.
　処理装置１は、円軌道ＣＲ１の外に向けて電子部品Ｗを保持する部品保持部を円軌道ＣＲ１の径方向（第１方向）に沿って進退させる駆動部（第１駆動部）に加えて、その径方向に交差する方向（第２方向）に沿って部品保持部を移動させる別の駆動部（第２駆動部）を備えてもよい。上記別の駆動部は、各部品保持部１４に対応して支持部１２に設けられてもよい。この場合、進退制御部１１６は、搬送駆動部１６により支持部１２が回転している間において、上記別の駆動部により、対応する部品保持部１４を径方向に交差する方向に沿って移動させてもよい。上記別の駆動部（第２駆動部）は、部品保持部を円軌道ＣＲ１の接線方向（第２方向）に沿って移動させてもよく、部品保持部を中心軸Ａｘ１が延びる方向（第２方向）に沿って移動させてもよい。 In addition to a drive unit (first drive unit) that moves the component holding unit that holds the electronic component W toward the outside of the circular track CR1 forward and backward along the radial direction (first direction) of the circular track CR1, the processing device 1 includes: , another driving portion (second driving portion) for moving the component holding portion along a direction (second direction) intersecting with the radial direction thereof. The separate drive section may be provided on the support section 12 corresponding to each component holding section 14 . In this case, while the support section 12 is being rotated by the transport drive section 16, the advance/retreat control section 116 moves the corresponding component holding section 14 along the direction crossing the radial direction by the other drive section. may The separate drive section (second drive section) may move the component holder along the tangential direction (second direction) of the circular orbit CR1, and move the component holder in the direction in which the central axis Ax1 extends (second direction). direction).
　他の処理ユニットとの間で電子部品Ｗの受け渡しを行う場合以外にも、電子部品Ｗを保持する方向に沿って駆動部が部品保持部を移動させてもよい。例えば、電気特性等の検査を行う検査ユニットにおいて電子部品Ｗに対する検査を行う際に、電子部品Ｗを保持する方向に部品保持部を移動させた状態で、検査ユニットにおいて電子部品Ｗの検査が行われてもよい。電子部品Ｗを別の回転搬送ユニットに受け渡す場合に、電子部品Ｗを保持する方向に沿って駆動部が部品保持部を移動させてもよい。外観検査ユニット６０，６０Ａは、側面Ｗｃに代えて又は加えて、主面Ｗａ及び主面Ｗｂの少なくとも一方について検査を行ってもよい。 The driving section may move the component holding section along the direction in which the electronic component W is held, other than when the electronic component W is transferred to and from another processing unit. For example, when an electronic component W is inspected by an inspection unit that inspects electrical characteristics and the like, the electronic component W is inspected by the inspection unit while the component holding portion is moved in the direction in which the electronic component W is held. may be broken. When transferring the electronic component W to another rotary transfer unit, the drive section may move the component holding section along the direction in which the electronic component W is held. The visual inspection units 60 and 60A may inspect at least one of the main surface Wa and the main surface Wb instead of or in addition to the side surface Wc.
　一般に、電子部品Ｗに対する外観検査の精度を保つ又は向上させるためには、電子部品Ｗを撮像するカメラの撮像範囲をある程度小さくして解像度を上げる必要がある。電子部品Ｗの種類によっては、電子部品Ｗのサイズが大きくなり、外観検査の対象となる部分がカメラの撮像範囲に収まらない場合もある。処理対象の電子部品Ｗをサイズが大きいものに切り替える際に、そのサイズに合わせて外観検査用のカメラを入れ替えると、その入れ替えに多くの時間を要することになる。 Generally, in order to maintain or improve the accuracy of visual inspection of electronic components W, it is necessary to reduce the imaging range of the camera that images electronic components W to some extent and increase the resolution. Depending on the type of the electronic component W, the size of the electronic component W may be large, and the portion to be inspected may not fit within the imaging range of the camera. If the size of the electronic component W to be processed is changed to that of a larger size, and the camera for appearance inspection is changed according to the size of the electronic component W, it takes a long time to change the camera.
　これに対して、本開示の実施形態に係る処理装置１は、部品保持部１４と電子部品Ｗとが互いに対向する第１方向に沿って部品保持部１４を移動させる第１駆動部と、第１方向に交差する第２方向に沿って、部品保持部１４を移動させる第２駆動部とを有する。そのため、外観検査の対象となる部分がカメラの撮像範囲に収まらなくても、第２駆動部により部品保持部１４を移動させることで、外観検査の対象となる部分全体についてカメラによる撮像を行うことができる。これにより、大きいサイズの電子部品Ｗに合わせてカメラを入れ替える必要がなくなるので、電子部品Ｗの切り替えに伴う時間を短縮できる。従って、処理装置１は、処理効率の向上に有用である。 On the other hand, the processing apparatus 1 according to the embodiment of the present disclosure includes a first driving section that moves the component holding section 14 along the first direction in which the component holding section 14 and the electronic component W face each other; and a second drive section for moving the component holding section 14 along a second direction intersecting the one direction. Therefore, even if the part to be visually inspected does not fit within the imaging range of the camera, the entire part to be visually inspected can be imaged by the camera by moving the component holding section 14 by the second driving section. can be done. As a result, it is not necessary to replace the camera according to the electronic component W of a large size, so the time required for switching the electronic component W can be shortened. Therefore, the processing device 1 is useful for improving processing efficiency.
　第１方向は、中心軸Ａｘ１が延びる方向であってもよい。第２方向は、円軌道ＣＲ１の径方向又は接線方向であってもよい。この場合、電子部品Ｗを中心軸Ａｘ１に沿って移動させつつ、円軌道ＣＲ１を含む平面においても、電子部品Ｗを移動させることができる。この場合、電子部品Ｗの撮像可能な部分を円軌道ＣＲ１の径方向又は接線方向に広げることができる。従って、検査精度と外観検査用のカメラの簡素化との両立に有用である。 The first direction may be the direction in which the central axis Ax1 extends. The second direction may be the radial direction or the tangential direction of the circular orbit CR1. In this case, while moving the electronic component W along the central axis Ax1, the electronic component W can also be moved on a plane including the circular orbit CR1. In this case, the portion of the electronic component W that can be imaged can be expanded in the radial direction or the tangential direction of the circular orbit CR1. Therefore, it is useful for achieving both inspection accuracy and simplification of the camera for appearance inspection.
　本出願は、２０２１年９月１７日出願の日本特許出願（特願２０２１－１５２３２６）に基づくものであり、その内容は本出願の中に参照として援用される。 This application is based on a Japanese patent application (Japanese Patent Application No. 2021-152326) filed on September 17, 2021, the content of which is incorporated herein by reference.
　１…電子部品の処理装置、１２…支持部、１４…部品保持部、２０…吸着部、１６…搬送駆動部、１８…昇降駆動部、２５，７０…進退駆動部、ＣＲ１…円軌道、Ａｘ１…中心軸。 DESCRIPTION OF SYMBOLS 1... Processing apparatus of an electronic component 12... Support part 14... Component holding part 20... Sucking part 16... Conveyance drive part 18... Elevation drive part 25, 70... Retraction drive part CR1... Circular orbit Ax1 …the central axis.

Claims (2)

  1. 　所定の第１方向に沿って電子部品と対向した状態で前記電子部品を保持する部品保持部と、
    　所定の中心軸まわりの円軌道に位置するように前記部品保持部を支持する支持部と、
    　前記中心軸まわりに前記支持部を回転させる搬送駆動部と、
    　前記第１方向に沿って前記部品保持部を移動させる第１駆動部と、
    　前記第１方向に交差する第２方向に沿って前記部品保持部を移動させる第２駆動部と、を備える電子部品の処理装置。     a component holding unit that holds the electronic component while facing the electronic component along a predetermined first direction;
    a supporting portion that supports the component holding portion so as to be positioned in a circular orbit around a predetermined central axis;
    a transport drive unit that rotates the support unit around the central axis;
    a first driving section that moves the component holding section along the first direction;
    and a second driving section that moves the component holding section along a second direction that intersects with the first direction.
  2. 　前記第１方向は、前記中心軸が延びる方向であり、
    　前記第２方向は、前記円軌道の径方向又は前記円軌道の接線方向である、請求項１に記載の処理装置。     The first direction is a direction in which the central axis extends,
    2. The processing apparatus according to claim 1, wherein said second direction is a radial direction of said circular orbit or a tangential direction of said circular orbit.
PCT/JP2022/032473 2021-09-17 2022-08-29 Electronic component processing device WO2023042649A1 (en)

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