WO2023042649A1 - Dispositif de traitement de composant électronique - Google Patents

Dispositif de traitement de composant électronique Download PDF

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Publication number
WO2023042649A1
WO2023042649A1 PCT/JP2022/032473 JP2022032473W WO2023042649A1 WO 2023042649 A1 WO2023042649 A1 WO 2023042649A1 JP 2022032473 W JP2022032473 W JP 2022032473W WO 2023042649 A1 WO2023042649 A1 WO 2023042649A1
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WIPO (PCT)
Prior art keywords
unit
electronic component
section
component holding
component
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Application number
PCT/JP2022/032473
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English (en)
Japanese (ja)
Inventor
日出夫 南
Original Assignee
上野精機株式会社
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Filing date
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Application filed by 上野精機株式会社 filed Critical 上野精機株式会社
Publication of WO2023042649A1 publication Critical patent/WO2023042649A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/84—Star-shaped wheels or devices having endless travelling belts or chains, the wheels or devices being equipped with article-engaging elements
    • B65G47/841—Devices having endless travelling belts or chains equipped with article-engaging elements
    • B65G47/842—Devices having endless travelling belts or chains equipped with article-engaging elements the article-engaging elements being grippers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • the present disclosure relates to an electronic component processing apparatus.
  • the present disclosure provides an electronic component processing apparatus that is useful for improving processing efficiency.
  • An electronic component processing apparatus includes a component holding unit that holds an electronic component facing the electronic component along a predetermined first direction, and a circular orbit around a predetermined central axis. a support portion for supporting the component holding portion in a manner such as to cross the first direction, a transport drive portion for rotating the support portion around the central axis, and a first drive portion for moving the component holding portion along the first direction; and a second driving section that moves the component holding section along the second direction.
  • an electronic component processing apparatus useful for improving processing efficiency is provided.
  • FIG. 8A is a schematic diagram illustrating the state of the component holding portion during inspection.
  • FIG. 8B is a schematic diagram illustrating the state of the component holding portion during inspection.
  • FIG. 9 is a side view schematically showing an example of an electronic component processing apparatus.
  • FIG. 10 is a flow chart showing an example of a series of control processes executed by the controller.
  • the electronic component processing apparatus 1 shown in FIG. 1 is a so-called die sorter.
  • the processing apparatus 1 is an apparatus that, while transporting the electronic parts W, subjects the electronic parts W to processes such as appearance inspection, electrical property inspection, and marking, and then packs them in storage members such as carrier tapes and trays.
  • the electronic component W to be processed is, for example, a component that is separated into individual pieces by dicing or the like after being formed in a pre-process of semiconductor manufacturing.
  • the processing device 1 may be configured to process each of a plurality of types of electronic components W.
  • the type of electronic component W to be processed may be changed in units such as the number of processed parts or the number of days.
  • the processing apparatus 1 may continuously process electronic components W of one type and then continuously process electronic components W of another type.
  • a plurality of types of electronic components W that can be processed by the processing apparatus 1 may have different sizes.
  • the processing device 1 includes a transport processing unit 2 and a controller 100 .
  • the transport processing unit 2 is a unit that sequentially processes a plurality of electronic components W while transporting the plurality of electronic components W in sequence.
  • the transport processing unit 2 has a rotating transport unit 10 and a plurality of processing units 4 .
  • the support portion 12 supports the component holding portion 14 so as to be positioned on the circular orbit CR1.
  • the plurality of component holders 14 supported by the supporter 12 are positioned on the circular orbit CR1.
  • the support portion 12 is provided so as to be rotatable around the central axis Ax1 of the circular orbit CR1.
  • the circular orbit CR1 may be a horizontal circular orbit, and the central axis Ax1 may be a vertical axis (may extend along the vertical direction).
  • the support portion 12 is, for example, a turntable.
  • the plurality of component holding portions 14 are arranged at equal intervals along the circumference around the central axis Ax1 and are fixed (attached) to the support portion 12 .
  • Each of the component holding portions 14 is configured to hold an electronic component W.
  • the component holding portion 14 holds the electronic component W while facing the electronic component W along a predetermined direction.
  • the component holding section 14 may hold the electronic component W by any method. Specific examples of the method for holding the electronic component W include vacuum adsorption, electrostatic adsorption, gripping, and the like.
  • the component holding section 14 may vacuum-suck one of the main surfaces Wa and Wb from one side in a direction perpendicular to the support section 12 (upper surface of the turntable).
  • the component holding section 14 has a suction section 20, a holder 22, and an elevating section 24, as shown in FIG.
  • the suction unit 20 (component holding unit) is configured to suck either main surface Wa or Wb of the electronic component W from above.
  • the suction part 20 is, for example, a suction rod configured to extend perpendicularly to the support part 12, and sucks the main surface Wa of the electronic component W at its lower end.
  • a suction hole that applies a suction force to the electronic component W may be provided on the lower surface of the suction unit 20 .
  • the holder 22 is arranged outside the support portion 12 and holds the adsorption portion 20 . This disclosure uses the terms “inner” and "outer” with respect to the central axis.
  • the lifting section 24 supports the holder 22 and is fixed to the support section 12 so as to be movable up and down. Details of the lifting unit 24 will be described later.
  • the rotary transfer unit 10 has a plurality of advance/retreat drive units 25 and installation units 28 .
  • the plurality of forward/backward drive portions 25 are provided so as to correspond to the plurality of component holding portions 14 respectively.
  • FIG. 2 shows one advance/retreat drive unit 25 out of the plurality of advance/retreat drive units 25 .
  • the advance/retreat drive section 25 (second drive section) moves the corresponding component holding section 14 along a direction (second direction) intersecting the central axis Ax1.
  • crossing includes crossing in a state of being in a twisted position (relationship) with each other, such as a so-called grade crossing.
  • the direction in which the component holding portion 14 is moved by the forward/backward driving portion 25 may be the radial direction (second direction) of the circular orbit CR1.
  • the term "radial direction” means the radial direction of the circular orbit CR1 unless otherwise specified.
  • the direction connecting the component holding portion 14 to be driven and the central axis Ax1 at the shortest distance corresponds to the radial direction.
  • the forward/backward drive unit 25 moves the component holding unit 14 in a direction away from the central axis Ax1 or in a direction closer to the central axis Ax1. Movement of the component holding portion 14 along the radial direction changes the distance between the component holding portion 14 and the central axis Ax1.
  • the lower surface of the movable portion 32 is connected to the base portion 29a of the installation portion 28 so as to be movable along the radial direction.
  • the movable portion 32 supports the base portion 31 .
  • the receiving portion 34 protrudes downward from the lower surface of the base portion 31 at the inner end portion of the base portion 31 .
  • An outward driving force from the motor 27 is applied to the receiving portion 34 .
  • the connecting portion 35 extends downward from the lower surface of the base portion 31 and is provided so as to sandwich the movable portion 32 with the receiving portion 34 in the radial direction.
  • the connecting portion 35 faces the projecting portion 29b of the installation portion 28 in the radial direction and is positioned inside the projecting portion 29b.
  • the spring 37 is provided between the projecting portion 29b and the connecting portion 35, and is configured to generate a reaction force as the advancing/retreating portion 26 moves.
  • the lifting section 24 includes a movable section 42 , extension sections 44 a and 44 b , a receiving section 46 and a spring 48 .
  • the movable portion 42 is connected to the outward facing side surface of the extending portion 38 so as to be movable along the direction in which the central axis Ax1 extends (the Z-axis direction in the drawing).
  • the extending portion 44 a is connected to the movable portion 42 so as to sandwich the movable portion 42 with the extending portion 38 .
  • the extending portion 44 a is formed to extend along the central axis Ax ⁇ b>1 and projects upward from the upper surface of the base portion 31 .
  • the spring 48 is provided between the extending portion 44b and the base portion 31, and is configured to generate a reaction force as the lifting portion 24 moves. Elevator 24 may include two springs 48 . At least one spring 48 may be covered by a receiving portion 46 when viewed from above.
  • the transport drive section 16 is configured to rotate the support section 12 around the central axis Ax1 of the circular track CR1.
  • the transport driving unit 16 uses a power source such as an electric motor to rotate the support unit 12 around the central axis Ax1 by direct driving without gears.
  • the rotation of the support portion 12 causes the plurality of component holding portions 14 to move along the circular orbit CR1.
  • the electronic component W held by the component holding section 14 is conveyed along the circular track CR1.
  • the elevation driving section 18 moves the component holding section 14 along the direction in which the component holding section 14 and the electronic component W held by the component holding section 14 face each other.
  • the direction (first direction) in which the component holding portion 14 and the electronic component W held by the component holding portion 14 face each other may be parallel to the central axis Ax.
  • the tangential direction of the circular orbit CR1 intersects the direction in which the component holding portion 14 and the electronic component W face each other.
  • the elevation driving section 18 may move the component holding section 14 along the direction in which the central axis Ax1 extends.
  • the plurality of elevation drive sections 18 are configured to individually raise and lower the plurality of component holding sections 14 .
  • illustration of the elevation driving section 18 is omitted, and in FIG. 2, one elevation driving section 18 out of the plurality of elevation driving sections 18 is shown.
  • the elevation driving unit 18 applies an external force to the component holding unit 14 arranged at the stop position SP, thereby moving the component holding unit 14 to one side in the direction perpendicular to the support unit 12 .
  • the elevation driving unit 18 moves the component holding unit 14 downward, for example, in the vertical direction.
  • the holder 52 is fixed to the outer peripheral portion of the fixed portion 11 vertically above the outer peripheral edge of the support portion 12 .
  • the outer peripheral surface of the holder 52 has a protruding portion 52a that protrudes outward from the outer side surface of the lower half of the holder 52, and a recess 52b that is recessed (recessed) inward from the side surface of the lower half of the holder 52. is provided.
  • the movable portion 53 is connected to the side surface of the lower half region of the holder 52 so as to be movable along the direction in which the central axis Ax1 extends (for example, the Z-axis direction in the drawing).
  • the lifting rod 54 is shaped like a bar extending in a direction parallel to the central axis Ax ⁇ b>1 and is supported (connected) by the movable portion 53 .
  • the receiving portion 55 is connected to the upper end portion of the lifting rod 54 and is formed to extend inward from the connecting portion with the lifting rod 54 as a starting point.
  • the receiving portion 55 is arranged so as to cover the projecting portion 52a.
  • a motor 58 applies a driving force to the receiving portion 55 for lowering the lifting rod 54 .
  • the spring 56 is provided between the receiving portion 55 and the projecting portion 52a, and is configured to generate a reaction force as the lifting rod 54 and the receiving portion 55 move.
  • the following operations are performed when moving the adsorption section 20 along the direction (vertical direction) in which the central axis Ax1 extends.
  • a downward force is applied to the receiving portion 55 by the motor 58 .
  • the movable portion 53 and the lifting rod 54 are lowered.
  • a downward force is applied to the receiving portion 46 of the lifting portion 24 by the descent of the lifting rod 54 .
  • the movable portion 42 and the extension portions 44a and 44b are lowered, and as a result, the adsorption portion 20 is lowered together with the holder 22.
  • an outward force is applied to the receiving portion 34 by the motor 27 of the forward/backward driving portion 25 .
  • the retractable portion 26 moves away from the central axis Ax1.
  • the movement of the advance/retreat portion 26 causes the elevating portion 24 to move outward, and as a result, the suction portion 20 moves outward together with the holder 22 .
  • a plurality of processing units 4 are provided so as to correspond to several stop positions SP, respectively, as shown in FIG. Unlike the example shown in FIG. 1, each of the stop positions SP may be provided with a processing unit 4 .
  • the processing unit 4 is configured to perform predetermined processing on the electronic component W held by the component holding section 14 arranged at the corresponding stop position SP.
  • Several processing units 4 may be arranged below the corresponding stop position SP.
  • processing performed on the electronic component W includes any action that changes the state of the electronic component W. For example, marking the electronic component W, causing the electronic component W to be held by the component holding unit 14 (handing over), and recovering the electronic component W from the component holding unit 14 (receiving) are referred to as “processing ”. Further, executing some kind of inspection on the electronic component W also corresponds to "processing" because it changes a state in which the inspection data is unknown to a state in which the inspection data is known.
  • the multiple processing units 4 include, for example, a component supply unit 6 , a component recovery unit 7 and one or more intermediate processing units 8 .
  • the component supply unit 6 is a unit that supplies electronic components W to the rotary transfer unit 10 .
  • the component supply unit 6 is arranged so as to correspond to one of the stop positions SP.
  • the component supply unit 6 moves, for example, a storage member (for example, a wafer sheet) in which a plurality of electronic components W are stored, thereby arranging each electronic component W in order vertically below the corresponding stop position SP. .
  • the component holding portion 14 placed at the corresponding stop position SP is lowered by the elevation driving portion 18 and receives the electronic component W placed vertically below the stop position SP.
  • the electronic component W is supplied from the component supply unit 6 to the rotary transfer unit 10 .
  • the supply stop position SP1 where the component supply unit 6 supplies the electronic component W is referred to as a "supply position SP1".
  • the component recovery unit 7 is a unit that recovers the electronic components W from the rotary transfer unit 10.
  • the component recovery unit 7 is arranged so as to correspond to one of the stop positions SP.
  • the component recovery unit 7 moves, for example, a storage member (for example, a carrier tape) capable of storing a plurality of electronic components W so that each storage portion included in the storage member is vertically aligned with the corresponding stop position SP. Place them in order below.
  • the component holding portion 14 arranged at the corresponding stop position SP is lowered by the elevation driving portion 18, and delivers the electronic component W to the accommodation portion arranged below the stop position SP.
  • the recovery stop position SP at which the component recovery unit 7 recovers the electronic components W will be referred to as a "recovery position SP2".
  • the intermediate processing unit 8 is arranged so as to correspond to any stop position SP other than the supply position SP1 and the recovery position SP2, and is a unit that performs predetermined processing on the electronic component W.
  • the intermediate processing unit 8 processes the electronic component W at a stop position SP located downstream of the supply position SP1 and upstream of the collection position SP2 on the circular track CR1.
  • Specific examples of processing by the intermediate processing unit 8 include electrical property inspection, optical property inspection, appearance inspection, posture or position correction, and marking (laser marking).
  • the appearance inspection unit 60 inspects the appearance of the side surface Wc, for example, by capturing an image of one side surface Wc of the electronic component W held by the component holding unit 14 arranged at the inspection position IP.
  • an image captured by the visual inspection unit 60 is used to inspect the presence or absence of a flaw, chipping, or foreign matter on the side surface Wc, which is the surface to be inspected.
  • the appearance inspection unit 60 may include a camera 62 that takes an image of the side surface Wc using visible light.
  • the camera 62 is arranged so as not to interfere with the movement of the plurality of component holders 14 by the transport drive unit 16, and its position may be fixed.
  • the imaging range of the camera 62 (hereinafter referred to as "imaging range PA") is constant.
  • the width of the imaging range PA by the camera 62 may be smaller than the width of the side surface Wc, and the vertical width of the imaging range PA by the camera 62 is equal to the vertical width of the side surface Wc. may be greater than
  • the imaging range PA (field of view) of the camera 62 may be set to be smaller than the entire side surface Wc.
  • a controller 100 controls the transport processing unit 2 .
  • the controller 100 is composed of one or more control computers.
  • the controller 100 controls the transport processing unit 2 according to a predetermined control procedure so that a plurality of electronic components W are sequentially subjected to predetermined processing.
  • the transport control unit 112 controls the transport driving unit 16 so that the support unit 12 is repeatedly rotated and stopped at the angular pitch between the component holding units 14 adjacent to each other on the circular track CR1.
  • the component holding portion 14 suction portion 20 stops at the above-described stop position SP, and the component holding portion 14 moves from the stop position SP to the next stop position SP. (Adsorption part 20) movement is repeated.
  • the elevation control section 114 controls the elevation driving section 18 corresponding to the stop position SP so as to lower the component holding section 14 (suction section 20) placed at the stop position SP.
  • the elevation control unit 114 moves the component holding unit 14 by the elevation driving unit 18. Lower and raise to original position.
  • the elevation driving section 18 moves the component holding section 14 along the central axis Ax ⁇ b>1 toward or away from the processing unit 4 .
  • the advance/retreat control section 116 controls the advance/retreat drive section 25 so as to move the component holding section 14 along the radial direction of the circular track CR1.
  • the advance/retreat control unit 116 causes the advance/retreat driving unit 25 to move the component holding unit 14 along the radial direction so as to change the radial position of the component holding unit 14 when arranged at the inspection position IP.
  • the advance/retreat control portion 116 may move the component holding portion 14 by the advance/retreat driving portion 25 so as to return to the position before movement.
  • the memory 154 temporarily stores the program loaded from the storage medium of the storage 156 and the calculation result by the processor 152 .
  • the processor 152 configures each functional module of the controller 100 by executing the program in cooperation with the memory 154 .
  • the input/output port 158 performs input/output of electrical signals with each element of the transport processing unit 2 according to instructions from the processor 152 .
  • the timer 162 measures the elapsed time by, for example, counting reference pulses of a constant cycle.
  • the circuit 150 is not necessarily limited to configuring each function by a program.
  • the circuit 150 may configure at least part of its functions by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrating this.
  • FIG. 5 is a flow chart showing a series of control procedures when one electronic component W having a large size is transported to the inspection position IP and the electronic component W is inspected.
  • the controller 100 executes step S11 in a state in which the suction unit 20 holding the electronic component W to be inspected is positioned at the stop position SP one upstream of the inspection position IP.
  • step S11 for example, the transport control unit 112 controls the transport driving unit 16 so that the suction unit 20 holding the electronic component W to be inspected is arranged at the inspection position IP.
  • step S11 as shown in FIG. Move to inspection position IP.
  • step S12 for example, the inspection control unit 118 controls the camera 62 so as to acquire a captured image of the central portion of the side surface Wc.
  • step S13 for example, the advance/retreat control unit 116 controls the advance/retreat driving unit 25 to move the suction unit 20 outward along the radial direction of the circular orbit CR1.
  • the advance/retreat control unit 116 has an imaging range PA in which a left portion (inward portion) of the side surface Wc of the electronic component W held by the suction unit 20 is located to the left of the central portion.
  • the adsorption unit 20 is moved by the advance/retreat driving unit 25 so as to be in the state.
  • step S16 the inspection control unit 118 controls the camera 62 so as to acquire a captured image of the right portion of the side surface Wc.
  • the camera 62 By executing the control processing up to step S16, the camera 62 (appearance inspection unit 60) performs a plurality of times of imaging in a state where the positions of the electronic component W in the radial direction are different from each other. Image data for the entire side surface Wc is obtained by imaging the side surface Wc a plurality of times (three times in this example).
  • step S17 for example, the advance/retreat control unit 116 controls the advance/retreat driving unit 25 to return the suction unit 20 to the position before the start of step S13.
  • step S18 for example, the inspection control unit 118 determines whether there is an abnormality in the side surface Wc based on the image data obtained in steps S12, S14, and S16.
  • step S19 the transport control unit 112 controls the transport driving unit 16 so that the suction unit 20 holding the inspected electronic component W is arranged at the stop position SP one ahead of the inspection position IP. .
  • the inspection performed on one electronic component W using the appearance inspection unit 60 is completed.
  • step S19 another suction unit 20 holding the next electronic component W to be inspected is arranged at the inspection position IP.
  • the controller 100 repeatedly executes a series of control processes from steps S12 to S19.
  • the controller 100 may execute steps S17 and S19 in parallel so that their execution timings at least partially overlap.
  • the controller 100 may execute step S13 during execution of step S11, and execute step S12 after execution of step S17.
  • One electronic component W is inspected by moving the suction unit 20 to one side along the radial direction while the component holding unit 14 is rotated (rotation of the support unit 12) by the transport driving unit 16. can shorten the time required for
  • the camera 62 may image the side surface Wc of one electronic component W twice while changing the radial position of the suction unit 20 by the forward/backward driving unit 25. , imaging may be performed four times or more. If the size of the electronic component W is small, the entire side surface Wc, which is the surface to be inspected, may be included in the imaging range PA. In this case, the controller 100 may image the side surface Wc of the electronic component W once without changing the radial position of the suction unit 20 by the forward/backward driving unit 25 .
  • the advance/retreat driving portion 25 for moving the component holding portion 14 (suction portion 20) in the radial direction is provided in the support portion 12.
  • the advance/retreat driving portion for moving the component holding portion 14 in the radial direction is , may be provided so as not to rotate together with the support portion 12 .
  • the rotary transfer unit 10A shown in FIG. 7 has a component holding section 14A instead of the component holding section 14, and a forward/backward drive section 70 instead of the forward/backward drive section 25. As shown in FIG.
  • the component holding portion 14A (the suction portion 20 of the component holding portion 14A) is moved along the direction in which the central axis Ax1 extends by the elevation driving portion 18, and is moved in the radial direction of the circular orbit CR1 around the central axis Ax1 by the forward/backward driving portion 70. move along.
  • the component holding section 14A has an elevating section 24 and an advancing/retracting section 82 .
  • the elevating section 24 of the component holding section 14A is configured in the same manner as the elevating section 24 of the component holding section 14 except that it is connected to the advance/retreat section 82 .
  • the advance/retreat portion 82 is provided on the support portion 12 so as to be movable along the radial direction, and holds the movable portion 42 of the elevation portion 24 so as to be able to move up and down.
  • the retractable portion 82 has, for example, a movable portion 84 , an extending portion 88 and a receiving portion 86 .
  • the movable portion 84 is provided on the outer peripheral portion of the support portion 12 so as to be movable along the radial direction. One end of the movable portion 84 protrudes outward from the outer peripheral edge of the support portion 12 .
  • An extending portion 88 extending downward from the tip is connected to the tip of the outer peripheral side of the movable portion 84 .
  • the movable portion 42 of the elevating portion 24 is connected to the side surface of the extending portion 88 facing outward.
  • the receiving portion 86 is connected to the lower surface of the movable portion 84 and extends downward from the connecting portion.
  • the receiving portion 86 extends below the lower surface of the supporting portion 12 , and the supporting portion 12 has a shape that does not hinder the radial movement of the receiving portion 86 .
  • the advance/retreat drive section 70 (second drive section) moves the component holding section 14 (suction section 20) along the radial direction.
  • the advance/retreat drive portion 70 is provided so as not to move with the rotation of the support portion 12 .
  • the processing apparatus 1 may include a base portion 79 on which the transport driving portion 16 and the like are installed.
  • the advance/retreat drive section 70 may be provided on the base section 79 .
  • the forward/backward drive unit 70 moves the component holding unit 14 (suction unit 20) arranged at the inspection position IP along the radial direction. While the forward/backward drive unit 25 moves the corresponding component holding unit 14, the forward/backward drive unit 70 moves one of the component holders 14 arranged at the inspection position IP.
  • the rotary transport unit 10A has an advance/retreat drive unit 70 at a position corresponding to a stop position SP (for example, an inspection position IP) that moves the component holding unit 14 in the radial direction, and a stop position that does not move the component holding unit 14 in the radial direction.
  • the position SP may not have a forward/backward drive unit.
  • the advancing/retreating drive unit 70 has, for example, a holder 72, an advancing/retreating rod 74, and a motor 76.
  • the holder 72 is provided on the base portion 79 . Therefore, the holder 72 does not move even when the support portion 12 rotates.
  • the advance/retreat rod 74 is provided on the holder 72 so as to be movable with respect to the holder 72 .
  • the advance/retreat rod 74 is formed in a rod shape so as to extend along the radial direction of the circular track CR1, and is held by the holder 72 so as to be movable along the radial direction.
  • the advance/retreat rod 74 is arranged inside the receiving portion 86 .
  • a motor 76 applies a driving force to the advancing/retreating rod 74 to move it outward.
  • the driving force of the motor 76 causes the advancing/retreating rod 74 to move outward along the radial direction.
  • An external force is applied from the advance/retreat rod 74 to the receiving portion 86 by the outward movement of the advance/retreat rod 74 .
  • the movable portion 84 and the lifting portion 24 move outward along the radial direction.
  • the suction portion 20 held by the holder 22 moves outward along the radial direction.
  • the adsorption portion 20 returns to the position before it moved.
  • the series of control processes shown in FIG. 5 may also be executed in the processing apparatus 1 including the rotary transfer unit 10A.
  • the rotary transfer unit 10 may have a rotary drive section 19 .
  • the rotation drive unit 19 is a drive unit that rotates the suction unit 20 (component holding unit) around the central axis Ax2.
  • the central axis Ax2 is an axis parallel to the central axis Ax1.
  • the central axis Ax2 may be set so as to pass through the center of the lower surface of the adsorption section 20 .
  • the rotary drive unit 19 is fixed to the holder 22 and may move as the holder 22 moves up and down or advances and retreats along the radial direction.
  • the rotary transfer unit 10 may have a plurality of rotary drive sections 19 corresponding to the plurality of suction sections 20 respectively.
  • the rotation drive unit 19 rotates the suction unit 20 holding the electronic component W around the central axis Ax2, thereby changing the posture of the electronic component W around the central axis Ax2.
  • the controller 100 may have an attitude control section 122 as a functional module, as shown in FIG.
  • the attitude control section 122 controls the rotation driving section 19 so as to change the attitude of the electronic component W held by the suction section 20 about the central axis Ax2.
  • the rotation drive unit 19 not only one side surface Wc but also one or more other side surfaces Wc may be imaged by the camera 62 of the visual inspection unit 60.
  • the camera 62 may sequentially capture images of the four side surfaces Wc.
  • the camera 62 may take multiple images of the other side surface Wc while changing the position of the suction unit 20 in the radial direction.
  • the posture control unit 122 may control the rotation drive unit 19 to rotate the adsorption unit 20 by 90° around the central axis Ax2. good.
  • the other side Wc faces the camera 62 .
  • the controller 100 may execute a series of control procedures of steps S12 to S17 for the other side surface Wc.
  • the attitude control unit 122 may change the attitude of the electronic component W around the central axis Ax2 by using the rotation driving unit 19.
  • the electronic component W may be inspected using light (for example, near-infrared rays) that passes through the electronic component W.
  • FIG. The rotary transfer unit 10 has, for example, a visual inspection unit 60A instead of the visual inspection unit 60.
  • the visual inspection unit 60A has an irradiation section 64 and an imaging section 66, as shown in FIG. 8(a).
  • the irradiation unit 64 and the imaging unit 66 may be arranged so as to sandwich the electronic component W to be inspected.
  • the irradiation unit 64 and the imaging unit 66 are arranged so as not to interfere with movement of the component holding unit 14 by the transport driving unit 16 .
  • the processing apparatus 1 may include another rotary transfer section that supplies electronic components W to the rotary transfer unit 10 .
  • the component supply unit 6 has a rotating transport section 90 and a position adjusting section 98, as shown in FIG.
  • the rotary transfer unit 90 is a so-called rotary pickup, receives the electronic component W from the supply unit 99, moves it along the circular track CR3, and delivers the electronic component W to the component holding unit 14 (suction unit 20).
  • the rotary transfer section 90 has a rotor 91 , a plurality of component holding sections 92 and a transfer drive section 96 .
  • the rotor 91 is provided below the stop position SP (supply position SP1 described above) corresponding to the component supply unit 6 so as to be rotatable around the horizontal central axis Ax3.
  • the plurality of component holding portions 92 are arranged at equal intervals along the circumference around the central axis Ax3 and are fixed to the rotor 91 .
  • the component holding portion 92 has a suction portion 94 configured to suck the electronic component W toward the outside of the circular track CR3 at the radial end portion of the circular track CR3.
  • the position adjusting section 98 adjusts the position of the component holding section 92 with respect to the component holding section 14 arranged at the supply position SP1.
  • the position adjusting section 98 illustrated in FIG. 9 moves the rotor 91 so as to adjust the position of the component holding section 14 in the direction along the central axis Ax3 when it is arranged at the uppermost stop position SP3.
  • the processing device 1 may further include a detection unit 68 as an example of a processing unit that processes the electronic component W held by the component holding section 92 .
  • the detection unit 68 detects the state of the electronic component W held by the component holding section 92 at a stop position SP3 located upstream of the uppermost stop position SP3.
  • the detection unit 68 detects, for example, the displacement of the electronic component W with respect to the component holding portion 92 and the inclination with respect to the component holding portion 92 at the stop position SP3. That is, the detection unit 68 detects positional deviation and inclination of the electronic component W with respect to the component holding portion 92 before the electronic component W moves from the component holding portion 92 to the component holding portion 14 .
  • the positional displacement of the electronic component W with respect to the component holding portion 14 after moving to the component holding portion 14 is smaller than the positional displacement of the electronic component W with respect to the component holding portion 92 before moving to the component holding portion 14.
  • the forward/backward driving unit 25 and the position adjusting unit 98 are controlled so that The controller 100 controls the rotation driving section 19 so that the inclination of the electronic component W (inclination relative to the ideal state) becomes smaller after moving to the component holding section 14 .
  • step S32 for example, the processing control unit 124 causes the transport drive unit 96 to move the rotor so that the component holding unit 92 (suction unit 94) that holds the electronic component W to be supplied is positioned at the uppermost stop position SP3. Rotate 91.
  • step S33 the transport control unit 112 causes the transport driving unit 16 to rotate the supporting unit 12 so that the suction unit 20, which is to receive the electronic component W to be supplied, is arranged at the supply position SP1.
  • step S34 for example, the advance/retreat control unit 116 and the processing control unit 124 advance/retreat so as to adjust the relative position of the suction unit 20 with respect to the electronic component W held by the component holding unit 92 arranged at the uppermost stop position SP3. It controls the driving section 25 and the position adjusting section 98 respectively.
  • the advance/retreat control unit 116 and the processing control unit 124 adjust the positional deviation (for example, , the difference between the centers) is reduced.
  • step S ⁇ b>36 for example, the transfer control unit 126 controls the rotary transfer unit 10 so as to release the suction of the electronic component W by the suction unit 94 after starting the suction of the electronic component W by the lowered suction unit 20 .
  • step S ⁇ b>37 for example, the elevation control unit 114 raises the adsorption unit 20 by the elevation drive unit 18 so that the adsorption unit 20 that has received the electronic component W is returned to its original height.
  • step S38 for example, the advance/retreat control unit 116 controls the advance/retreat drive unit 25 to return the suction unit 20 to the position before execution of step S34, and the process control unit 124 returns the rotor to the position before execution of step S34.
  • the position adjuster 98 is controlled so that the 91 is returned.
  • step S39 for example, the posture control unit 122 causes the rotation driving unit 19 to reduce the inclination of the electronic component W with respect to the ideal state, according to the inclination of the electronic component W with respect to the component holding unit 92 obtained in step S31.
  • the adsorption portion 20 is rotated around the central axis Ax2.
  • the controller 100 may repeat the series of control processes of steps S31 to S39 for each of the subsequent electronic components W.
  • the electronic component W is sandwiched between the suction unit 20 and the suction unit 94 of the component holding unit 92 (the state in which both the suction units are in contact with the main surfaces Wa and Wb of the electronic component W). ), the delivery of the electronic component W may be performed.
  • the transfer is performed while both of the adsorption portions are in contact with each other will be described in detail, including the configuration of the apparatus.
  • the rotary transfer unit 10 has a suction section 101 that generates a suction force for sucking the electronic component W in the suction section 20 .
  • the suction unit 101 includes, for example, a suction path 102 and a valve 103 .
  • the suction path 102 connects the suction hole of the suction section 20 and a suction pump (for example, a vacuum pump).
  • a valve 103 is provided in the suction path 102 .
  • the valve 103 switches between open and closed states of the flow path in the suction path 102 according to the input of the control signal.
  • the rotary transfer unit 10 may have a load detection section 108 (load sensor) capable of detecting the load applied to the electronic component W when the adsorption section 20 is lowered.
  • the load detection unit 108 may be provided in the elevation driving unit 18 (elevating rod 54). After the suction portion 94 of the component holding portion 92 holds the electronic component W and the suction portion 20 descends to contact the electronic component W, the reaction force from the electronic component W is applied to the suction portion 20 .
  • the load detector 108 may detect the load applied to the electronic component W by detecting the reaction force.
  • the lifting drive section 18 may have a load adjustment section 109 that adjusts the load applied to the electronic component W. As shown in FIG.
  • the load adjuster 109 is, for example, a voice coil motor.
  • step S35 the elevation control section 114 causes the elevation drive section 18 to lower the adsorption section 20 to a predetermined target position.
  • the target position is set to such an extent that the suction unit 20 and the main surface Wa of the electronic component W are in contact with each other without providing a clearance between the lower surface of the suction unit 20 and the electronic component W.
  • the lift control unit 114 controls the lift drive unit 18 to decelerate the suction unit 20 after the suction unit 20 reaches a predetermined deceleration start position before the suction unit 20 reaches the target position. You may
  • the delivery control unit 126 controls the load (the value detected by the load detection unit 108) applied to the electronic component W from the adsorption unit 20 after the adsorption unit 20 contacts the electronic component W to be equal to or less than a preset allowable load. You may control the load adjustment part 109 at time.
  • the delivery control unit 126 may cause the valve 103 of the suction unit 101 to transition from the closed state to the open state so that the lowered suction unit 20 starts sucking the electronic component W.
  • the delivery control unit 126 may cause the valve 107 of the suction unit 105 to transition from the open state to the closed state so as to release the suction of the electronic component W by the suction unit 94 .
  • the two suction portions are in contact with the main surfaces Wa and Wb facing opposite to each other, and the electronic component W is sucked by the two suction portions.
  • the electronic component W is handed over to the suction unit.
  • troubles such as dropping of the electronic component W during delivery can be suppressed.
  • the suction portion 94 may move upward when the electronic component W is transferred.
  • the position of the electronic component W is corrected when the electronic component W is supplied, and the posture of the electronic component W is corrected while the electronic component W is held by the suction unit 20 . Therefore, at the stop position SP downstream of the supply position SP1, it is necessary to arrange an alignment unit configured to receive the electronic component W from the component holding unit 14, correct the position and orientation, and then return it to the component holding unit 14. do not have. In this case, since the number of times the electronic parts W are transferred in the processing apparatus 1 is reduced, troubles such as dropping of the electronic parts W are suppressed, and the processing efficiency can be improved.
  • the forward/backward driving unit that moves the component holding unit 14 along the radial direction of the circular orbit CR1 25, 70 are provided.
  • the rotary transfer units 10 and 10A move the component holding section 14 along a direction (second direction) that is different from the radial direction of the circular track CR1 and intersects the central axis Ax1.
  • a drive section that moves the component holding section 14 along one of the directions intersecting the central axis Ax1 may be provided in the support section 12 corresponding to each component holding section 14 .
  • the controller 100 (advance/retreat control section 116) causes the corresponding component holding section 14 to move along one of the above directions by the drive section while the support section 12 is being rotated by the transport drive section 16. You may let
  • the rotary transfer unit 10, 10A has, for example, in addition to the elevation drive section 18, a horizontal drive section (second drive section) that moves the component holding section 14 along the tangential direction (second direction) of the circular track CR1.
  • the horizontal driving section may be provided on the support section 12 corresponding to each component holding section 14, and may be provided on the base section 79 so as to move any one of the component holding sections 14 arranged at the inspection position IP.
  • the advance/retreat control section 116 controls the horizontal drive section while the support section 12 is being rotated by the transport drive section 16 .
  • the component holding portion 14 may be moved along the tangential direction.
  • the tangential direction in which the component holding section 14 is moved by the horizontal driving section is perpendicular to the line connecting the suction section 20 (stop position SP) and the central axis Ax1 on the plane including the circular orbit CR1, and 20 is the direction along the line.
  • the appearance inspection units 60 and 60A capture images of the surface to be inspected (for example, the side surface Wc) of the electronic component W a plurality of times while the positions in the tangential direction of the suction unit 20 holding the electronic component W to be inspected are different from each other. may be executed.
  • the rotary transfer units 10 and 10A may have advance/retreat drive sections 25 and 70 and a horizontal drive section that moves the suction section 20 along the tangential direction of the circular track CR1.
  • the controller 100 may control the advance/retreat drive units 25 and 70 and the horizontal drive unit.
  • the component supply unit 6 may not have the position adjusting section 98 for adjusting the position of the rotor 91 .
  • the horizontal drive portion may be provided on the support portion 12 in correspondence with each component holding portion 14 together with the forward/backward drive portion 25 .
  • the advance/retreat control section 116 causes the corresponding component holding section 14 to move radially and tangentially by the advance/retreat drive section 25 and the horizontal drive section. You can move along.
  • the direction in which the component holding portion 14 holds the electronic component W (the direction in which the component holding portion 14 and the electronic component W face each other) is set to extend along the central axis Ax1.
  • the processing apparatus 1 may include a component holding portion (suction portion) that holds the electronic component W facing the outside of the circular track CR1.
  • the direction in which the component holding portion and the electronic component W held by the component holding portion face each other is set to extend along the radial direction of the circular track CR1.
  • the processing device 1 includes: , another driving portion (second driving portion) for moving the component holding portion along a direction (second direction) intersecting with the radial direction thereof.
  • the separate drive section may be provided on the support section 12 corresponding to each component holding section 14 .
  • the advance/retreat control section 116 moves the corresponding component holding section 14 along the direction crossing the radial direction by the other drive section.
  • the separate drive section (second drive section) may move the component holder along the tangential direction (second direction) of the circular orbit CR1, and move the component holder in the direction in which the central axis Ax1 extends (second direction). direction).
  • the driving section may move the component holding section along the direction in which the electronic component W is held, other than when the electronic component W is transferred to and from another processing unit. For example, when an electronic component W is inspected by an inspection unit that inspects electrical characteristics and the like, the electronic component W is inspected by the inspection unit while the component holding portion is moved in the direction in which the electronic component W is held. may be broken. When transferring the electronic component W to another rotary transfer unit, the drive section may move the component holding section along the direction in which the electronic component W is held.
  • the visual inspection units 60 and 60A may inspect at least one of the main surface Wa and the main surface Wb instead of or in addition to the side surface Wc.
  • the imaging range of the camera that images electronic components W it is necessary to reduce the imaging range of the camera that images electronic components W to some extent and increase the resolution.
  • the size of the electronic component W may be large, and the portion to be inspected may not fit within the imaging range of the camera. If the size of the electronic component W to be processed is changed to that of a larger size, and the camera for appearance inspection is changed according to the size of the electronic component W, it takes a long time to change the camera.
  • the first direction may be the direction in which the central axis Ax1 extends.
  • the second direction may be the radial direction or the tangential direction of the circular orbit CR1.
  • the electronic component W while moving the electronic component W along the central axis Ax1, the electronic component W can also be moved on a plane including the circular orbit CR1.
  • the portion of the electronic component W that can be imaged can be expanded in the radial direction or the tangential direction of the circular orbit CR1. Therefore, it is useful for achieving both inspection accuracy and simplification of the camera for appearance inspection.
  • SYMBOLS 1 Processing apparatus of an electronic component 12... Support part 14... Component holding part 20... Sucking part 16... Conveyance drive part 18... Elevation drive part 25, 70... Retraction drive part CR1... Circular orbit Ax1 ...the central axis.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Ce dispositif de traitement de composant électronique comporte : une partie de maintien de composant qui maintient un composant électronique dans un état faisant face au composant électronique le long d'une première direction prescrite ; une partie de support qui supporte la partie de maintien de composant de façon à positionner la partie de maintien de composant sur une orbite circulaire autour d'un axe central prescrit ; une partie d'entraînement de transport pour amener la partie de support à tourner autour de l'axe central ; une première partie d'entraînement pour amener la partie de maintien de composant à se déplacer le long de la première direction ; et une seconde partie d'entraînement pour amener la partie de maintien de composant à se déplacer le long d'une seconde direction croisant la première direction.
PCT/JP2022/032473 2021-09-17 2022-08-29 Dispositif de traitement de composant électronique WO2023042649A1 (fr)

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JP2021152326A JP7117041B1 (ja) 2021-09-17 2021-09-17 電子部品の処理装置
JP2021-152326 2021-09-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7446029B1 (ja) 2023-07-19 2024-03-08 上野精機株式会社 部品検査装置

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Publication number Priority date Publication date Assignee Title
JPS6285491A (ja) * 1985-10-09 1987-04-18 松下電器産業株式会社 部品装着装置
JPH08167788A (ja) * 1994-12-13 1996-06-25 Matsushita Electric Ind Co Ltd 電子部品装着装置
JPH1056297A (ja) * 1996-08-12 1998-02-24 Fuji Mach Mfg Co Ltd 電子部品保持ヘッド選択的位置決め装置および電子部品搬送装置
CN112405338A (zh) * 2020-11-10 2021-02-26 西安电子科技大学 一种铝基片研磨机自动上下料装置及上下料方法

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JP5335109B2 (ja) 2012-02-03 2013-11-06 富士機械製造株式会社 フィーダならびに電子部品装着装置および装着方法
JP6293454B2 (ja) 2013-11-06 2018-03-14 ヤマハ発動機株式会社 電子部品装着装置
DE102015013495B4 (de) 2015-10-16 2018-04-26 Mühlbauer Gmbh & Co. Kg Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser
JP6836816B1 (ja) 2020-05-28 2021-03-03 上野精機株式会社 電子部品の処理装置

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Publication number Priority date Publication date Assignee Title
JPS6285491A (ja) * 1985-10-09 1987-04-18 松下電器産業株式会社 部品装着装置
JPH08167788A (ja) * 1994-12-13 1996-06-25 Matsushita Electric Ind Co Ltd 電子部品装着装置
JPH1056297A (ja) * 1996-08-12 1998-02-24 Fuji Mach Mfg Co Ltd 電子部品保持ヘッド選択的位置決め装置および電子部品搬送装置
CN112405338A (zh) * 2020-11-10 2021-02-26 西安电子科技大学 一种铝基片研磨机自动上下料装置及上下料方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7446029B1 (ja) 2023-07-19 2024-03-08 上野精機株式会社 部品検査装置

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