JP2015050345A - Cutting device and cutting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cut while correcting the deviation amount of a cutting line immediately before cutting, even if the position of the cutting line is deviated from a pre-alignment moment in time due to thermal deformation of a sealed substrate.SOLUTION: In a cutting device 1 of a twin-cut table system, an alignment mark is captured immediately before cutting a sealed substrate 3, by means of a camera 13 for kerf checking provided integrally with a spindle camera unit 10B. Even if the sealed substrate 3 is cooled by cutting water or cooling water and contracted, a control unit CTL corrects the deviation amount from the cutting line that is set at the pre-alignment moment in time, immediately before cutting, on the basis of the position of an alignment mark thus captured. The sealed substrate 3 can be cut along a corrected cutting line.

Description

  The present invention relates to a cutting apparatus and a cutting method for manufacturing a plurality of individual electronic parts by cutting an object to be cut.

  A substrate consisting of a printed circuit board, a lead frame, etc. is virtually divided into a plurality of grid-like areas, and chip-like elements are attached to each area, and then the whole board is sealed with resin. That's it. An electronic component is obtained by cutting the sealed substrate with a cutting device using a rotary blade or the like and separating the substrate into individual regions.

  Conventionally, a predetermined region of a sealed substrate is cut by a cutting mechanism such as a rotary blade using a cutting device. For example, a BGA (Ball Grid Array Package) product is cut as follows. First, at the substrate placement position, the substrate side of the sealed substrate (ball surface) is placed on the cutting table and adsorbed. Next, alignment (positioning) is performed on the ball surface of the sealed substrate. At this time, an alignment mark provided on the ball surface is detected using an imaging mechanism. The positional relationship between the alignment mark and a virtual cutting line that divides the plurality of regions is known in advance as a design value. Therefore, the position of the virtual cutting line is set based on the positional relationship. Next, the cutting table that sucks the sealed substrate is moved to the substrate cutting position. At the substrate cutting position, the cutting water is sprayed to the cutting portion of the sealed substrate, and the cutting mechanism cuts along the cutting line set on the sealed substrate. The separated electronic component is manufactured by cutting the sealed substrate.

  When the cutting of the sealed substrate is repeated using the cutting device, there are various things such as frictional heat generated by the rotary blade attached to the cutting mechanism, cutting water sprayed to the sealed substrate, heat conduction to the cutting table, etc. Due to the factor, the sealed substrate is thermally deformed due to temperature change after alignment. Therefore, the position of the cutting line set on the sealed substrate may be shifted between the time of alignment and immediately before cutting. If the cutting is performed with the position of the cutting line shifted, the electronic component may be damaged or deteriorated.

  As a technique for measuring and correcting the positional deviation of the cutting line, “a cutting method of cutting a plate-like object using a cutting device, wherein an interval between the reference line and the blade detection unit is set to D, In a state where the alignment between the planned cutting position and the reference line is performed, and the alignment between the planned cutting position and the reference line is performed once, (omitted) the distance to the cutting blade by the blade detection unit A cutting method is proposed in which d is detected, and the position of the cutting blade is corrected by (d−D) with respect to the distance D between the reference line and the blade detecting means to cut the plate-like object. (For example, paragraph [0011] of Patent Document 1).

JP 2009-206362 A

  However, the following problems occur in the cutting method as described above. According to the above method, although the positional deviation of the cutting blade is corrected in the cutting apparatus, the thermal deformation of the plate-like object is not considered. Since the plate-like object is cooled by cutting water during cutting, the plate-like object itself is also thermally deformed (shrinks). Further, the plate-like object is thermally deformed (shrinks) by conducting heat to the cooled cutting table during alignment or movement. In the above method, after the planned cutting position is set by alignment, the deviation amount of the planned cutting position due to thermal deformation of the plate-like object is not detected. Therefore, if the amount of deviation due to thermal deformation of the plate-like object is large, the plate-like object may be cut in a state in which the position deviation of the planned cutting position has occurred.

  In addition, in recent years, electronic components have been increasingly reduced in size, and in order to increase the production efficiency of electronic components, there has been a strong demand for increasing the number of electronic components to be taken out from a single substrate by increasing the size of the substrate. ing. Along with this, the time required to cut one substrate is also increasing. In order to solve this problem, the cutting apparatus is also required to improve productivity. As one countermeasure, a so-called twin-cut table type cutting apparatus provided with two cutting tables has been widely used.

  In a twin-cut table type cutting apparatus, a waiting time may occur in the other cutting table until the cutting of the object to be cut in one cutting table is completed. During this waiting time, the workpiece is thermally deformed by heat conduction to the cutting table cooled by cutting water or the like. If the time required to cut the object to be cut in one cutting table becomes longer, the waiting time becomes longer in the other cutting table, and the amount of deviation of the cutting line of the object to be cut increases. As the substrate becomes larger and the time required to cut a single substrate increases, the amount of displacement due to thermal deformation of the object to be cut has become a big problem.

  The present invention solves the above-described problem. In the cutting apparatus, alignment is performed immediately before the workpiece is cut using the imaging mechanism provided integrally with the cutting mechanism, and the amount of deviation from the initial alignment time is determined. It is an object of the present invention to provide a cutting apparatus and a cutting method that can cut by correcting the above.

  In order to solve the above-described problems, a cutting apparatus according to the present invention includes a cutting mechanism that cuts a workpiece having a plurality of alignment marks along a plurality of cutting lines, and a stage on which the workpiece is placed. A moving mechanism for moving the stage between the substrate mounting position and the substrate cutting position, and a controller for controlling at least the movement between the substrate mounting position and the substrate cutting position and the cutting by the cutting mechanism, A cutting device for cutting an object to be cut placed at a substrate cutting position by using a cutting mechanism, an injection means for injecting cutting water toward a processing point at which the object to be cut is cut, and substrate mounting A first imaging unit that images the object to be cut at a position, and a second image capturing unit that images the object to be cut at a substrate cutting position, and a small number of alignment marks captured by the first imaging unit. Using at least a part, the control unit sets the position of the cutting line, and using at least a part of the plurality of alignment marks imaged by the second imaging means, the control unit uses the position of the cutting line. The cutting mechanism cuts the workpiece along the corrected cutting line.

  Further, the cutting apparatus according to the present invention is the above-described cutting apparatus, wherein two stages are provided, and the two stages can move between a substrate placement position and a substrate cutting position, respectively. The position of the cutting line when the second stage of the two stages is positioned at the substrate mounting position while the workpiece is cut while the first stage of the stages is positioned at the substrate cutting position. Is set.

  Further, the cutting device according to the present invention is the above-described cutting device, wherein the cutting mechanism has a rotary blade, and the second imaging means is arranged to image a cutting line cut by the rotary blade, and the second imaging unit. The means also serves as a kerf check camera.

  Further, the cutting device according to the present invention is characterized in that, in the above-described cutting device, the cutting mechanism and the second imaging means are integrally configured, and the second imaging means moves by moving the cutting mechanism. And

  The cutting apparatus according to the present invention is characterized in that, in the above-described cutting apparatus, the object to be cut is a sealed substrate.

  The cutting apparatus according to the present invention is characterized in that, in the above-described cutting apparatus, the object to be cut is a semiconductor wafer.

  In order to solve the above-described problems, a cutting method according to the present invention includes a step of placing a workpiece having a plurality of alignment marks on a stage, and moving the stage between a substrate placement position and a substrate cutting position. A cutting method comprising: a step of cutting the workpiece placed at the substrate cutting position along a plurality of cutting lines using a cutting mechanism, wherein A first step of imaging at least a part of the plurality of alignment marks using the imaging means, a step of setting the position of the cutting line using the alignment marks imaged in the first step, and substrate cutting A second step of imaging at least a part of the plurality of alignment marks using the second imaging means at the position, and an alignment mark imaged in the second step A step of correcting the position of the cutting line, a step of jetting cutting water toward a processing point where the workpiece is cut, and a step of cutting the workpiece along the corrected cutting line. It is characterized by that.

  Further, the cutting method according to the present invention is the above-described cutting method, wherein two stages are provided, a step of placing the first workpiece on the first stage of the two stages, A step of moving the stage between the substrate placement position and the substrate cutting position, a step of placing the second object to be cut on the second stage of the two stages, and a step of placing the second stage on the substrate A step of moving between the placement position and the substrate cutting position, a step of positioning the first stage at the substrate cutting position and cutting the first workpiece, a step of moving the first stage, and a first step And at least part of the step of cutting the workpiece, the second stage is positioned at the substrate mounting position and the step of setting the position of the cutting line in the second workpiece is performed. To do.

  Further, the cutting method according to the present invention relates to the above-described cutting method, wherein the cutting mechanism includes a rotary blade, the step of imaging the cutting line cut by the rotary blade by the second imaging unit, and the cutting groove in the cutting line. And a step of performing an inspection.

  The cutting method according to the present invention includes the step of moving the second imaging means by moving the cutting mechanism, wherein the cutting mechanism and the second imaging means are integrally configured in the above-described cutting method. It is characterized by that.

  The cutting method according to the present invention is characterized in that, in the above-described cutting method, the object to be cut is a sealed substrate.

  The cutting method according to the present invention is characterized in that, in the above-described cutting method, the object to be cut is a semiconductor wafer.

  According to the present invention, in the cutting apparatus, even if a waiting time occurs before starting to cut the workpiece, the coordinate position of the alignment mark at the time of alignment and the coordinate position of the alignment mark immediately before cutting are detected. By doing so, the amount of deviation of the cutting line from the time of alignment can be corrected. Therefore, it becomes possible to correct | amend the position of the cutting line of a to-be-cut object, and to cut | disconnect along the corrected cutting line.

It is a schematic plan view which shows the twin-cut table type cutting device which concerns on a present Example. It is an external view which shows the outline | summary of the sealed substrate, FIG.2 (a) is the top view seen from the board | substrate side, FIG.2 (b) is a front view, FIG.2 (c) is a side view. 6 is a schematic time table showing the operation of each cutting table according to the present embodiment in a twin-cut table type cutting apparatus. FIG. 4A is a schematic plan view showing a state of aligning a sealed substrate, FIG. 4A shows a pre-alignment time point, and FIG. 4B shows an alignment state immediately before cutting. It is a figure which shows the modification of a sealed substrate, Fig.5 (a) is the top view seen from the board | substrate side, FIG.5 (b) is a front view.

  In the twin-cut table type cutting apparatus, an alignment mark is detected again immediately before cutting the sealed substrate by using a kerf check camera integrated with the spindle unit. Thus, the deviation amount from the cutting line set by the pre-alignment is corrected in a state where the sealed substrate is contracted, and the sealed substrate is cut along the corrected cutting line immediately before cutting.

  As an embodiment, a cutting apparatus according to the present invention will be described with reference to FIGS. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

  FIG. 1 is a schematic plan view showing a twin-cut table type cutting apparatus 1 according to this embodiment. The cutting device 1 divides a workpiece into a plurality of electronic components. The cutting device 1 includes a receiving unit A, a cutting unit B, a cleaning unit C, an inspection unit D, and a storage unit E as components (modules).

  Each component (each unit A to E) is detachable and replaceable with respect to other components, and each component is prepared in advance so as to have a plurality of different specifications according to expected specifications. The The cutting device 1 is configured including the components A to E.

  The receiving unit A is provided with a prestage 2. A sealed substrate 3 corresponding to an object to be cut is received by the prestage 2 from a resin sealing device which is a device in the previous process. The sealed substrate 3 (for example, a BGA sealed substrate) is disposed on the prestage 2 with the substrate side surface (ball surface) facing up.

  The sealed substrate 3 is made of a circuit board such as a lead frame or a printed board, a chip including passive elements or active elements mounted in a plurality of grid-like regions on the circuit board, and a cured resin formed in a lump. And a sealing resin.

  The cutting unit B is provided with two cutting tables 4A and 4B. The cutting device 1 is a so-called twin-cut table type cutting device. The two cutting tables 4A and 4B can be moved in the Y direction in the drawing and can be rotated in the θ direction by a moving mechanism (not shown). Cutting stages 5A and 5B are mounted on the cutting tables 4A and 4B. The cutting unit B includes a substrate placement unit 6, a substrate cutting unit 7, and a substrate cleaning unit 8.

  The substrate platform 6 is provided with an alignment camera 9. The camera 9 can move independently in the X direction in the substrate platform 6. In the sealed substrate 3, the alignment mark formed on the ball surface is detected by the camera 9 in the substrate platform 6, and the position of the virtual cutting line is set.

  The substrate cutting unit 7 is provided with two spindle units 10A and 10B as a cutting mechanism. The two spindle units 10A and 10B are independently movable in the X direction and the Z direction. Two spindle units 10A and 10B are provided with rotary blades 11A and 11B, respectively. These rotary blades 11A and 11B each cut in the sealed substrate 3 by rotating in a plane along the Y direction. Therefore, in this embodiment, two cutting mechanisms (spindle units 10A and 10B) are provided in the substrate cutting unit 7.

  Each spindle unit 10A, 10B is provided with cutting water nozzles 12A, 12B for injecting cutting water to suppress frictional heat generated by the rotating blades 11A, 11B rotating at high speed. The cutting water is sprayed toward the processing point where the rotary blades 11 </ b> A and 11 </ b> B cut the sealed substrate 3. Further, a kerf checking camera 13 for inspecting the position, width, chipping (chipping), etc. of the cutting groove (kerf) cut by the rotary blade 11B is provided integrally on the spindle unit 10B side. . The camera 13 is provided so as to capture an image on a cutting line that the rotary blade 11B cuts. In this embodiment, the camera 13 is provided on the spindle unit 10B side. However, the camera 13 may be provided on the spindle unit 10A side. Alternatively, the cameras 13 may be provided in both of the two spindle units 10A and 10B.

  The substrate cleaning unit 8 is provided with a cleaning mechanism (not shown) for cleaning the ball surface of the assembly 14 composed of a plurality of electronic components P cut into pieces by cutting the sealed substrate 3.

  The cleaning unit C is provided with a cleaning mechanism 15 that cleans the resin-side surface (mold surface) of each electronic component P that has been separated into pieces. The cleaning mechanism 15 is provided with a cleaning roller 16 so as to be rotatable about the Y direction. An assembly 14 including a plurality of electronic components P is disposed above the cleaning mechanism 15 that cleans the mold surface. The assembly 14 is fixed by adsorbing the ball surface side by a transport mechanism (not shown). That is, the mold surface is fixed to the transport mechanism. The transport mechanism is movable in the X direction and the Z direction. As the transport mechanism descends and reciprocates in the X direction, the mold surface of the assembly 14 is cleaned by the cleaning roller 16.

  The inspection unit D is provided with an inspection stage 17. The assembly 14 composed of a plurality of electronic parts P cut into pieces by cutting the sealed substrate 3 is collectively transferred to the inspection stage 17. The inspection stage 17 is configured to be movable in the X direction and to be rotatable about the Y direction. The assembly 14 composed of a plurality of individual electronic parts P (for example, BGA products) is inspected by the inspection camera 18 on the resin side surface (mold surface) and the substrate side surface (ball surface). Sorted into non-defective and defective products. The assembly 14 composed of the inspected electronic components P is transferred to the index table 19 in a checkered pattern (checker flag pattern) or a lattice. The inspection unit D is provided with a plurality of transfer mechanisms 20 for transferring the electronic components P arranged on the index table 19 to the tray.

  The storage unit E is provided with a non-defective product tray 21 for storing non-defective products and a defective product tray (not shown) for storing defective products. The electronic parts P sorted into non-defective products and defective products by the transfer mechanism 20 are accommodated in each tray. Although only one good product tray 21 is shown in the figure, a plurality of good product trays 21 are provided in the storage unit E.

  In the cutting apparatus 1, the movement of the sealed substrate 3, the setting of the position of the cutting line in the sealed substrate 3, the cutting of the sealed substrate 3 by the cutting mechanism, the cleaning of the ball surface and the mold surface by the cleaning mechanism, and individual pieces All processes such as inspection and accommodation of the converted electronic component P are controlled by, for example, a control unit CTL provided in the receiving unit A. In the present embodiment, the case where all the processes are controlled by the control unit CTL provided in the receiving unit A is shown. Not only this but control part CTL may be provided in other units. It is also possible to control the processing from cutting to cleaning and the processing from inspection to storage by providing separate control units.

  FIG. 2 is an external view showing an outline of the sealed substrate 3. 2A is a plan view of the sealed substrate 3 viewed from the substrate side, FIG. 2B is a front view, and FIG. 2C is a side view. The sealed substrate 3 includes a substrate part 22 and a sealing resin part 23 made of a cured resin. The sealed substrate 3 has a substrate side surface (ball surface) 3a and a resin side surface (mold surface) 3b. A large number of alignment marks 24 (marks indicated by + in the drawing) are formed on the ball surface 3 a of the sealed substrate 3 along the longitudinal direction and the short direction. The number of alignment marks 24 formed along the longitudinal direction and the short direction is determined according to the size of the sealed substrate 3 and the number of electronic components P to be separated.

  The position of the virtual cutting line (boundary line) 25 is set by detecting a plurality of coordinate positions of the alignment mark 24 by the alignment camera 9 (see FIG. 1) provided on the substrate platform 6. . As the cutting line 25, a cutting line 25S for cutting the short direction of the sealed substrate 3 and a cutting line 25L for cutting the longitudinal direction are set. A region 26 surrounded by the cutting line 25S and the cutting line 25L corresponds to the electronic component P, respectively. The number of alignment marks 24 detected to set the cutting lines 25S and 25L can be arbitrarily determined according to the product.

  FIG. 3 is a schematic time table for explaining the operation of the cutting tables 4A and 4B in the cutting unit B in the twin-cut table type cutting apparatus 1 according to this embodiment shown in FIG. It is shown as a time table as time passes. In FIG. 3, symbol LD is Load, PA is Pre Alignment, CT is Cut, WD is Wash & Dry (Wash & Dry), UL is Unload, WT is Waiting Time ( “Wait” and AA indicate the states of additional alignment immediately before cutting. S1, S2,..., S5 are the steps (steps) from loading (LD) to unloading (UL) in the cutting tables 4A and 4B for one sealed substrate 3, respectively. Indicated by a single downward arrow.

  A series of steps for cutting the sealed substrate 3 in each of the cutting tables 4A and 4B will be described with reference to FIGS. First, an operation until the sealed substrate 3 is cut in the cutting table 4A and separated into a plurality of electronic components P will be described. As shown in FIG. 1, in the substrate platform 6, the sealed substrate 3 is placed on the cutting stage 5A attached to the cutting table 4A with the ball surface 3a facing up (LD1 in FIG. 3). . Next, using the alignment camera 9, the alignment mark 24 formed on the ball surface 3 a of the sealed substrate 3 is detected in the longitudinal direction and the lateral direction, and the coordinate position is measured. The number of alignment marks 24 to be detected is arbitrarily determined depending on the size of the sealed substrate 3 and the number of electronic components P. Based on the detected coordinate position of the alignment mark 24, virtual cutting lines 25S and 25L for cutting the sealed substrate 3 are set in the lateral direction and the longitudinal direction, respectively (PA1 in FIG. 3).

  Next, the cutting table 4 </ b> A is moved from the substrate placing unit 6 to the substrate cutting unit 7. In the substrate cutting part 7, the sealed substrate 3 is cut by the rotary blades 11A, 11B provided in the two spindle units 10A, 10B. First, with the longitudinal direction of the sealed substrate 3 placed parallel to the X direction (see FIG. 1), the cutting table 4A is directed toward the spindle units 10A and 10B (in the + Y direction in FIG. 1). Move. By causing the sealed substrate 3 to enter the rotary blades 11 </ b> A and 11 </ b> B, the sealed substrate 3 is cut along each cutting line 25 </ b> S (see FIG. 2) along the short direction of the sealed substrate 3. When cutting, cutting water is sprayed from the cutting water nozzle 12 to the processing point where the rotary blades 11A and 11B and the sealed substrate 3 are in contact. Next, the cutting table 4A is rotated 90 degrees, and the sealed substrate 3 is cut along each cutting line 25L (see FIG. 2) along the longitudinal direction of the sealed substrate 3. In this manner, the sealed substrate 3 placed on the cutting table 4A is cut along the cutting lines 25S and 25L to form the respective regions 26. Each of the regions 26 becomes an individual electronic component P (CT1 in FIG. 3).

  In this case, first, the sealed substrate 3 is cut along each cutting line 25S along the short direction of the sealed substrate 3, and then sealed along each cutting line 25L along the longitudinal direction. The finished substrate 3 was cut. Not limited to this, first, the sealed substrate 3 is cut along each cutting line 25L along the longitudinal direction, and then the sealed substrate 3 is cut along each cutting line 25S along the short direction. May be.

  Next, the cutting table 4 </ b> A is moved from the substrate cutting unit 7 to the substrate cleaning unit 8 while the collective assembly 14 including the plurality of separated electronic components P is collectively sucked. In the substrate cleaning unit 8, the ball surface 3a of the electronic component P is cleaned and dried (WD1 in FIG. 3). The assembly 14 of the electronic parts P that has been cleaned and dried has its ball surface 3a sucked together by a transport mechanism (not shown) and transported to the cleaning unit C (UL1 in FIG. 3).

  The operation described so far shows a series of steps until the first sealed substrate 3 placed on the cutting table 4A is singulated and sent to the cleaning step as shown in S1 of FIG. That is, the sealed substrate 3 is made up of a plurality of electronic components P by performing the steps of loading (LD1) → pre-alignment (PA1) → cutting (CT1) → cleaning & drying (WD1) → unloading (UL1). The assembly 14 is divided into individual pieces and conveyed to the next cleaning unit C at a time.

  After the loading (LD1) of the cutting table 4A is completed, the loading (LD2) → pre-alignment (PA2) → cutting (CT2) → cleaning & drying (WD2) → unloading is similarly performed in the cutting table 4B. A series of steps up to UL2) is started. However, the cutting table 4B cannot proceed to the process until the processing in each process of the cutting table 4A is completed. Therefore, in the operation of S2 in FIG. 3, after the pre-alignment (PA2) in the cutting table 4B is completed, there is a waiting time (WT2) until the cutting (CT1) in S1 of the cutting table 4A is completed. Occur. In other words, after the cutting (CT1) of the cutting table 4A is completed, the cutting (CT2) is started in the cutting table 4B. Thus, a waiting time (WT) occurs in the other cutting table until the cutting (CT) is completed in one cutting table.

  If cutting is continued in the cutting tables 4A and 4B, the sealed substrate 3 is thermally deformed by the influence of cutting water or the like during the waiting time (WT) until the cutting (CT) starts. Do (shrink). Therefore, there is a possibility that a positional deviation occurs in the cutting lines 25S and 25L immediately before cutting with respect to the cutting lines 25S and 25L set at the pre-alignment (PA) time. If the cutting is performed in a state where the positional deviation has occurred, the electronic component P may be damaged or deteriorated.

  As shown in FIG. 1, in the substrate platform 6, the sealed substrate 3 is pre-aligned in an atmosphere at room temperature (20 to 25 ° C.). On the other hand, in the substrate cutting part 7, cutting water is sprayed from the cutting water nozzles 12 </ b> A and 12 </ b> B to the sealed substrate 3 in order to suppress frictional heat of the rotary blades 11 </ b> A and 11 </ b> B. Although it changes with conditions to cut | disconnect, cutting water may be cooled to 10 to 15 degreeC lower than atmospheric temperature. In order to enhance the cooling effect, the cutting water may be cooled to an even lower temperature.

  In order to enhance the cooling effect, a cooling nozzle (not shown) for injecting cooling water from both sides of the rotary blades 11A and 11B to the work point may be provided in addition to the cutting water nozzle 12. The cooling effect may be further enhanced by providing not only one cooling nozzle on both sides of the rotary blades 11A and 11B but also a plurality thereof. The cooling water is cooled to 10 ° C. to 15 ° C. similarly to the cutting water.

  The sealed substrate 3, the cutting tables 4A and 4B, and the cutting stages 5A and 5B are cooled by the cutting water and the cooling water. The sealed substrate 3, the cutting tables 4 </ b> A and 4 </ b> B, and the cutting stages 5 </ b> A and 5 </ b> B are contracted from the normal temperature state according to the materials constituting them when cooled.

  After the cutting (CT1) is completed, the cutting table 4A moves from the substrate cutting unit 7 to the substrate cleaning unit 8, cleans and dries (WD1) the ball surface 3a, and then returns to the substrate mounting unit 6. The cutting table 4A and the cutting stage 5A that have returned to the substrate platform 6 are maintained at substantially the same temperature as when cooled by the cutting water and the cooling water, respectively. As shown by S3 in FIG. 3, a new sealed substrate 3 is placed on the cutting table 4A in the substrate platform 6 (LD3). The sealed substrate 3 placed on the cutting table 4A is subjected to pre-alignment (PA3) in an ambient temperature. However, since the other cutting table 4B is being cut (CT2), the cutting table 4A waits for cutting (CT3) until this cutting (CT2) is completed (WT3).

  According to the prior art, during this waiting time (WT3), the sealed substrate 3 is cooled and contracted by heat conduction to the cutting table 4A and the cutting stage 5A in the cooled state at the time of cutting (CT1). To do. By contracting, the actual cutting lines 25S and 25L are displaced from the cutting lines 25S and 25L set at the time of pre-alignment (PA3). The amount of deviation of the cutting lines 25S and 25L becomes larger as the waiting time (WT3) becomes longer.

  According to the prior art, for example, in the embodiment of FIG. 3, the load (LD) is 10 seconds, the pre-alignment (PA) is 30 seconds, the cutting (CT) is 120 seconds, and the cleaning and drying (WD) is 30 seconds. Second, unload (UL) takes 10 seconds, and additional alignment (AA) takes 10 seconds. Then, in the process of S3, the waiting time (WT3) is 50 seconds, and the sealed substrate 3 is cooled and contracts during this time. In recent years, since the size of the sealed substrate 3 is increased, the number of electronic components P is increased, and the length of the entire cutting line is increased, the waiting time (WT) tends to be longer. Therefore, the contraction amount by which the sealed substrate 3 contracts increases, and the shift amount of the cutting lines 25S and 25L also increases.

  On the other hand, according to the present invention, additional alignment (AA3) is performed immediately before cutting (CT3) in order to correct the amount of deviation generated during the waiting time (WT3) in step S3. In other words, the additional alignment (AA3) is performed in the cutting table 4A immediately after the cutting (CT2) is completed in the cutting table 4B. The additional alignment (AA3) is performed using a kerf check camera 13 provided integrally with the spindle unit 10B (see FIG. 1). By using this kerf check camera 13 for additional alignment (AA3), the amount of deviation in the cutting lines 25S and 25L is corrected immediately before cutting (CT3).

  By performing the additional alignment (AA3), it is possible to detect the coordinate position of the alignment mark 24 immediately before cutting (CT3) and to correct the shift amount from the prealignment (PA3) time point. Therefore, even when the sealed substrate 3 is contracted due to the influence of cutting water or cooling water, cutting is performed immediately before cutting the sealed substrate 3 based on the cutting lines 25S and 25L set by the pre-alignment (PA3). The amount of deviation in the lines 25S and 25L can be corrected. The longer the waiting time (WT3), the more pronounced the effect of the present invention.

  Thus, by performing additional alignment (AA) immediately before cutting the sealed substrate 3 on the cutting tables 4A and 4B, the positions of the cut lines 25S and 25L of the contracted sealed substrate 3 are set. It is possible to correct and cut along the corrected cutting lines 25S and 25L.

  FIG. 4 shows the alignment state at the pre-alignment time point and the additional alignment time point immediately before cutting. 4A is a plan view of the sealed substrate 3 at the time of pre-alignment as seen from the substrate side, and FIG. 4B is a plan view of the sealed substrate 3 at the time of additional alignment immediately before cutting as seen from the substrate side. FIG. The sealed substrate 3 immediately before cutting is contracted and reduced in both the longitudinal direction and the lateral direction. In FIG. 4, the case where the cutting line 25S in the transversal direction of the sealed substrate 3 placed on the cutting table 4A is set and corrected will be described.

  FIG. 4A shows a state in which pre-alignment is performed using an alignment camera 9 provided on the substrate platform 6 (see FIG. 1). For example, a case where ten alignment marks 24 provided on the ball surface 3a of the sealed substrate 3 are detected and the coordinate positions thereof are measured will be described. As shown in FIG. 1, the alignment camera 9 is movable only in the X direction. In the Y direction, the camera 9 can be moved relatively in the Y direction by moving the cutting table 4A. Thus, by moving the camera 9 in the X direction and moving the cutting table 4A in the Y direction, the alignment mark 24 provided on the ball surface 3a of the sealed substrate 3 is detected, and the coordinates Measure the position. The camera 9 can move only in the X direction, and the X coordinate from the reference point is measured for the alignment mark 24 by using a linear scale.

  Alignment marks 24-1, 24-2, 24-3,..., 24-10 are detected in the order of 10 alignment marks, and each position (A, B, C, D, E) in the longitudinal direction is detected. The X coordinate (X1A, X1B, X1C, X1D, X1E) is measured at two points. First, the alignment camera 9 is moved in the X direction, and the X coordinate (X1A) of the alignment mark 24-1 is measured. Next, the cutting table 4A is moved in the Y direction, and the X coordinate (X1A) of the alignment mark 24-2 is measured. Next, the camera 9 is moved in the X direction, and the X coordinate (X1B) of the alignment mark 24-3 is measured. Next, the cutting table 4A is moved in the Y direction, and the X coordinate (X1B) of the alignment mark 24-4 is measured. In this way, 10 X-coordinates are measured up to the alignment mark 24-10.

  For each position (A to E) in the longitudinal direction of the sealed substrate 3, two X coordinates of the alignment mark are measured. The two measured X coordinates are averaged to obtain the X coordinate of each position (A to E). Based on the averaged X coordinate and the distance between the alignment marks 24, the position of the X coordinate of each virtual cutting line 25S to be cut along the short direction is set.

  FIG. 4B shows a state in which the contracted sealed substrate 3 just before cutting is aligned by the kerf check camera 13 provided in the spindle unit 10B in the substrate cutting unit 7 (see FIG. 1). . The camera 13 can move only in the X direction. In this case, the camera 13 is moved in the X direction, and the X coordinates (X2A, X2E) of the alignment marks 24-2 and 24-10 at the positions A and E are measured.

  The amount of contraction is calculated by comparing the X coordinate measured at the time of pre-alignment with the X coordinate measured immediately before cutting. Based on the calculated shrinkage, the X coordinate of each cutting line 25S along the short direction is corrected. By doing so, it is possible to correct correctly each cutting line 25S that cuts in the lateral direction even when the sealed substrate 3 is contracted.

  In the present embodiment, in order to set and correct the position of the cutting line 25S in the short direction, the X coordinate of the ten alignment marks 24 is measured at the pre-alignment time, and two additional alignment time points immediately before the cutting. The X coordinate of the alignment mark 24 was measured. However, the present invention is not limited to this, and if it is desired to further improve the accuracy according to the product, a larger number of alignment marks 24 may be measured to set and correct the position of the cutting line 25S in the short direction.

  Similarly, each cutting line 25L (see FIG. 2) cutting along the longitudinal direction is corrected. As described above, according to the present invention, the sealed substrate 3 that has been thermally deformed (shrinked) due to the influence of cutting water or cooling water can be cut by correcting the cutting lines 25S and 25L immediately before cutting. Become. This can prevent the electronic component P from being damaged or deteriorated.

  FIG. 5 shows a modification of the sealed substrate 3. FIG. 5A is a plan view of the sealed substrate 3 viewed from the substrate side, and FIG. 5B is a front view. The sealed substrate 3 includes a substrate part 22 and a sealing resin part 27 divided into four block units. When the difference in coefficient of linear expansion between the substrate portion 22 and the sealing resin portion 27 is large, the sealing resin portion 27 is divided into four block units, resulting in shrinkage when the cured resin is cured. Warpage of the sealing resin portion 27 can be suppressed. Further, when a Cu (copper) alloy is used as the lead frame material, since the linear expansion coefficient of Cu is large, dividing the sealing resin portion 27 into a plurality of block units is effective in reducing warpage. By suppressing warpage of the sealed substrate 3, the alignment accuracy can be improved.

  When a material having a large linear expansion coefficient is used for the substrate portion 22, the amount of thermal deformation (shrinkage amount) increases due to the influence of cutting water or cooling water. When the shrinkage amount increases, the shift amount of the cutting lines 25S and 25L in the sealed substrate 3 also increases. Therefore, it is more important to correct the positions of the cutting lines 25S and 25L immediately before cutting. According to the present invention, even if a material having a large linear expansion coefficient is used as the substrate material, the shift amount of the cutting lines 25S and 25L can be corrected immediately before cutting, so the correct cutting line to be cut even in a contracted state It becomes possible to cut along 25S and 25L.

  As described so far, in the twin-cut table type cutting apparatus 1, a waiting time is generated in the other cutting mechanism until one cutting mechanism completes the cutting. During this waiting time, the sealed substrate 3 is cooled by heat conduction to the cutting tables 4A, 4B and the cutting stages 5A, 5B cooled by cutting water or cooling water. Due to this influence, the sealed substrate 3 contracts due to thermal deformation during the waiting time. Therefore, a shift occurs in the positions of the virtual cutting lines 25S and 25L of the sealed substrate 3 set at the pre-alignment time.

  According to the present invention, the coordinate position is measured by detecting the alignment mark 24 immediately before cutting the sealed substrate 3 by using the kerf check camera 13 provided integrally with the spindle unit 10B. Thereby, the positions of the cutting lines 25S and 25L of the sealed substrate 3 immediately before cutting are confirmed. That is, the coordinate position of the alignment mark 24 is confirmed immediately before cutting in addition to the pre-alignment time point. Therefore, even when the sealed substrate 3 contracts during the waiting time from the pre-alignment time until the cutting of the sealed substrate 3 starts, the cutting immediately before cutting and the positions of the cutting lines 25S and 25L at the pre-alignment time. The amount of deviation from the pre-alignment time can be corrected by comparing the positions of the lines 25S and 25L. Even when the sealed substrate 3 is contracted due to the influence of cutting water or cooling water, it is possible to correct the cutting line 25S, 25L to be cut immediately before cutting and to cut the electronic component P. And deterioration can be prevented.

  In recent years, the size of the sealed substrate 3 has further increased, and the number of electronic components P to be taken out from one sealed substrate 3 has increased, so that the length of the entire cutting line has increased. In particular, in a twin-cut table type cutting device, this increases the time required to cut one sealed substrate 3. Therefore, the waiting time tends to increase. In such a situation, it is important to accurately grasp the amount of deviation of the cutting line caused by the thermal deformation that occurs from the pre-alignment time point to immediately before cutting. Therefore, as in the present invention, it is a very effective method to perform the alignment immediately before cutting and correct the shift amount of the cutting lines 25S and 25L and then cut the sealed substrate 3.

  In this embodiment, the alignment mark 24 is detected and the coordinate position is measured immediately before cutting using the kerf check camera 13 provided in the spindle unit 10B. Not limited to this, it is also possible to detect the alignment mark 24 immediately before cutting using the alignment camera 9 used at the time of pre-alignment.

  In addition, even if the time-dependent change such as distortion of the main body frame occurs and the attachment position of the kerf check camera 13 fluctuates, the kerf check camera captures an image on the cutting line cut by the rotary blade 11B of the spindle unit 10B. The thirteen imaging positions can be adjusted. Therefore, it is possible to cut the sealed substrate 3 by measuring the correct coordinate position of the alignment mark 24.

  The present invention is not limited to the twin-cut table type cutting device 1 having two cutting tables, but can be applied to a single-cut table type cutting device having one cutting table.

  As the object to be cut, a semiconductor wafer may be used in addition to the sealed substrate 3. Since an electronic circuit is built in each region of the semiconductor wafer, a portion (semiconductor chip) corresponding to each region after cutting becomes an electronic component P.

  According to the present invention, the position of the cutting line at the time of pre-alignment can be corrected immediately before cutting. Therefore, the present invention greatly contributes to the improvement of yield, the improvement of reliability and the improvement of productivity, and is very valuable industrially.

  Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary within the scope not departing from the gist of the present invention. Is.

DESCRIPTION OF SYMBOLS 1 Cutting device 2 Prestige 3 Sealed board | substrate (to-be-cut object, 1st to-be-cut object, 2nd to-be-cut object)
3a Ball surface 3b Substrate surface 4A, 4B Cutting table 5A, 5B Cutting stage (stage, first stage, second stage)
6 Substrate Placement Section 7 Substrate Cutting Section 8 Substrate Cleaning Section 9 Alignment Camera (First Imaging Unit)
10A, 10B Spindle unit (cutting mechanism)
11A, 11B Rotating blades 12A, 12B Cutting water nozzles (jetting means)
13 Camera for kerf check (second imaging means)
14 Assembly of plural electronic parts P 15 Cleaning mechanism 16 Cleaning roller 17 Inspection stage 18 Inspection camera 19 Index table 20 Transfer mechanism 21 Non-defective product tray 22 Substrate part 23 Sealing resin part 24 Arament mark 25, 25S , 25L cutting line 26 area 27 sealing resin part A receiving unit B cutting unit C cleaning unit D inspection unit E housing unit P electronic component CTL control unit LD load (Load)
PA Pre-alignment
CT cutting
WD Wash & Dry (Wash & Dry)
UL Unload
Waiting for WT (Wait)
AA Additional Alignment
S Steps

Claims (12)

A cutting mechanism for cutting a workpiece having a plurality of alignment marks along a plurality of cutting lines, a stage on which the workpiece is placed, and the stage between a substrate placement position and a substrate cutting position A moving mechanism that moves, and a control unit that controls at least movement between the substrate placement position and the substrate cutting position and cutting by the cutting mechanism, and the object to be cut placed at the substrate cutting position A cutting device that cuts using the cutting mechanism,
An injection means for injecting cutting water toward a workpiece point where the workpiece is cut;
First imaging means for imaging the object to be cut at the substrate mounting position;
Second imaging means for imaging the object to be cut at the substrate cutting position;
Using at least a part of the plurality of alignment marks imaged by the first imaging means, the control unit sets the position of the cutting line,
Using at least part of the plurality of alignment marks imaged by the second imaging means, the control unit corrects the position of the cutting line,
The cutting device, wherein the cutting mechanism cuts the workpiece along the corrected cutting line. The cutting device according to claim 1, wherein
Two stages are provided,
Each of the two stages can move between the substrate placement position and the substrate cutting position,
While the workpiece is cut in a state where the first stage of the two stages is located at the substrate cutting position, the second stage of the two stages is placed at the substrate mounting position. A cutting apparatus, wherein the position of the cutting line is set in a positioned state. The cutting device according to claim 2, wherein
The cutting mechanism has a rotary blade,
The second imaging means is arranged to image the cutting line cut by the rotary blade;
The cutting apparatus according to claim 2, wherein the second imaging means also serves as a kerf check camera. The cutting device according to claim 3, wherein
The cutting mechanism and the second imaging means are integrally configured,
The cutting apparatus according to claim 1, wherein the second imaging means is moved by the movement of the cutting mechanism. The cutting device according to claim 4, wherein
The cutting apparatus, wherein the object to be cut is a sealed substrate. The cutting device according to claim 4, wherein
The cutting apparatus, wherein the object to be cut is a semiconductor wafer. A step of placing an object to be cut having a plurality of alignment marks on a stage; a step of moving the stage between a substrate placement position and a substrate cutting position; and the object to be cut placed at the substrate cutting position. Cutting using a cutting mechanism along a plurality of cutting lines,
A first step of imaging at least a part of the plurality of alignment marks using a first imaging means at the substrate mounting position;
Setting the position of the cutting line using the alignment mark imaged in the first step;
A second step of imaging at least some of the plurality of alignment marks using a second imaging means at the substrate cutting position;
Correcting the position of the cutting line using the alignment mark imaged in the second step;
Injecting cutting water toward a workpiece point where the workpiece is cut;
And a step of cutting the workpiece along the corrected cutting line. The cutting method according to claim 7, wherein
Two stages are provided,
Placing the first workpiece on the first stage of the two stages;
Moving the first stage between the substrate placement position and the substrate cutting position;
Placing the second object to be cut on the second stage of the two stages;
Moving the second stage between the substrate placement position and the substrate cutting position;
Cutting the first workpiece by positioning the first stage at the substrate cutting position;
In at least a part of the step of moving the first stage and the step of cutting the first workpiece, the second stage is positioned at the substrate mounting position and the second workpiece is cut. A cutting method comprising: performing a step of setting a position of the cutting line. The cutting method according to claim 8, wherein
The cutting mechanism has a rotary blade,
Imaging the cutting line cut by the rotary blade with the second imaging means;
And a step of inspecting a cutting groove in the cutting line. The cutting method according to claim 9, wherein
The cutting mechanism and the second imaging means are integrally configured,
A cutting method comprising the step of moving the second imaging means by moving the cutting mechanism. The cutting method according to claim 10, wherein
The cutting method, wherein the object to be cut is a sealed substrate. The cutting method according to claim 10, wherein
A cutting method, wherein the object to be cut is a semiconductor wafer.

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