TWI592267B - Cutting device and cutting method - Google Patents
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- 238000005520 cutting process Methods 0.000 title claims description 424
- 238000000034 method Methods 0.000 title claims description 30
- 239000000758 substrate Substances 0.000 claims description 227
- 230000007246 mechanism Effects 0.000 claims description 69
- 238000003384 imaging method Methods 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 29
- 238000007689 inspection Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 29
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 239000000498 cooling water Substances 0.000 description 9
- 238000001816 cooling Methods 0.000 description 7
- 238000005266 casting Methods 0.000 description 6
- 230000000295 complement effect Effects 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 230000008602 contraction Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
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- 238000001035 drying Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
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- 229910000881 Cu alloy Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Description
本發明涉及一種藉由切斷被切斷物來製造經單片化的複數個電子零件的切斷裝置及切斷方法。 The present invention relates to a cutting device and a cutting method for manufacturing a plurality of singulated electronic components by cutting a object to be cut.
將由印刷基板或引線框等構成的基板虛擬地區分為格子狀的複數個區域，並且在各個區域中安裝晶片狀的元件之後，對基板整體進行樹脂封裝的基板稱作封裝基板。藉由使用旋轉刃等切斷裝置而切斷該封裝基板，並按各區域單位單片化而成為電子零件。 A substrate virtual region composed of a printed circuit board, a lead frame, or the like is divided into a plurality of lattice-shaped regions, and after the wafer-shaped components are mounted in the respective regions, the substrate on which the entire substrate is resin-sealed is referred to as a package substrate. The package substrate is cut by using a cutting device such as a rotary blade, and is singulated in each area to become an electronic component.
以往以來，使用切斷裝置並藉由旋轉刃等切斷機構而切斷封裝基板的規定區域。例如，由以下方式來切斷BGA(球柵陣列封裝，Ball Grid Array Package)產品。首先，在基板放置位置上，以使封裝基板的基板側的表面(植球面)向上的狀態將封裝基板放置在切斷用工作臺上並進行吸附。其次，將封裝基板的植球面作為對象來進行對準(定位)。此時，使用攝像機構來檢測設置在植球面上的對準標記。作為設計值，事先明確對準標記和區分複數個區域的虛擬的切斷線之間的位置關係。因此，根據此等位置關係，設定虛擬的切斷線的位置。其次，使吸附封裝基板的切斷用工作臺移動至基板切斷位置。在基板切斷位置上，向封裝基板的切斷部位噴射切削水，並且藉由切斷機構沿設定在封裝基板上的切斷線進行切斷。藉由切斷封裝基板而製造經單片化的電子零件。 Conventionally, a cutting device has been used to cut a predetermined region of a package substrate by a cutting mechanism such as a rotary blade. For example, the BGA (Ball Grid Array Package) product is cut off in the following manner. First, at the substrate placement position, the package substrate is placed on the cutting table in a state in which the surface (the ball-forming surface) on the substrate side of the package substrate is placed upward and adsorbed. Next, the spherical surface of the package substrate is aligned (positioned) as an object. At this time, an imaging mechanism is used to detect an alignment mark provided on the surface of the ball. As the design value, the positional relationship between the alignment mark and the virtual cut line of the plurality of areas is clearly defined in advance. Therefore, the position of the virtual cut line is set based on these positional relationships. Next, the cutting table for adsorbing the package substrate is moved to the substrate cutting position. At the substrate cutting position, cutting water is sprayed to the cut portion of the package substrate, and the cutting mechanism is cut along the cutting line set on the package substrate. The singulated electronic component is fabricated by cutting the package substrate.
若使用切斷裝置來重複封裝基板的切斷，則由於切斷機構上安裝的旋轉刃而產生的摩擦熱、向封裝基板噴射的切削水和對切斷用工作臺的熱傳導等種種因素而封裝基板在進行對準之後藉由溫度變化進行熱變形。因此，在已對準的時刻和即將進行切斷之前，有時設定在封裝基板上的切斷線的位置偏移。若在切斷線的位置偏移的狀態下進行切斷，則有可能引起電子零件的損壞和劣化。 When the cutting of the package substrate is repeated using the cutting device, the friction heat generated by the rotary blade attached to the cutting mechanism, the cutting water sprayed onto the package substrate, and the heat conduction to the cutting table are encapsulated. The substrate is thermally deformed by temperature changes after alignment. Therefore, the positional deviation of the cutting line on the package substrate may be set at the time of alignment and immediately before the cutting. If the cutting is performed in a state where the position of the cutting line is shifted, damage or deterioration of the electronic component may occur.
作為藉由測量切斷線的錯位來進行修正的技術，提出有如下切削方法(例如，專利文獻1的段落[0011])：一種使用切削裝置來切削板狀物的切削方法，將前述基準線和前述刀片檢測機構的間隔設定為D，實施前述切削預對準置和前述基準線的定位，在實施一次該切削預定位置與該基準線的定位元的狀態下，(略)，利用前述刀片檢測機構檢測直至前述切削刀片的距離d，相對於前述基準線與前述刀片檢測機構的間隔D，利用(d-D)修正前述切削刀片的位置並切削板狀物。 As a technique for correcting the displacement of the cutting line, a cutting method is proposed (for example, paragraph [0011] of Patent Document 1): a cutting method for cutting a plate using a cutting device, and the reference line is used The interval between the blade detecting means and the blade detecting means is set to D, and the cutting pre-alignment and the positioning of the reference line are performed, and in a state where the predetermined position of the cutting and the positioning element of the reference line are performed once, (omitted), the blade is used. The detecting means detects the distance d from the cutting insert, and corrects the position of the cutting insert by (dD) with respect to the distance D between the reference line and the blade detecting means, and cuts the plate.
[先行技術文獻] [Advanced technical literature]
[專利文獻] [Patent Literature]
[專利文獻1]特開2009-206362號公報 [Patent Document 1] JP-A-2009-206362
然而，在前述的切削方法中，產生如下問題。根據前述的方法，雖然修正切削裝置中的切削刀片的錯位，但是並沒有考慮板狀物的熱變形。由於切削時藉由切削水冷卻板狀物，因此板狀物自身也進行熱變形(進行收縮)。進一步，在進行對準期間或進行移動期間，藉由對經冷卻的 切斷用工作臺的熱傳導而板狀物進行熱變形(進行收縮)。在前述的方法中，藉由進行對準而設定切削預定位置之後，並沒有檢測由板狀物的熱變形引起的切削預定位置的偏移量。因此，若由板狀物的熱變形引起的偏移量大，則具有在產生切削預定位置的錯位的狀態下切斷板狀物的可能性。 However, in the aforementioned cutting method, the following problems occur. According to the foregoing method, although the misalignment of the cutting insert in the cutting device is corrected, thermal deformation of the plate is not considered. Since the plate is cooled by cutting water during cutting, the plate itself is also thermally deformed (contracted). Further, during the alignment or during the movement, by cooling The plate is thermally deformed (contracted) by heat conduction of the cutting table. In the aforementioned method, after the predetermined cutting position is set by the alignment, the amount of shift of the predetermined cutting position caused by the thermal deformation of the plate is not detected. Therefore, if the amount of displacement due to thermal deformation of the plate-like material is large, there is a possibility that the plate-like object is cut in a state in which the cutting-predetermined position is displaced.
此外，近年來，電子零件的小型化越漸發展，但為了提高電子零件的生產效率，使基板大型化，希望增加從一片基板中取出的電子零件的數量的要求變得強烈。伴隨此，切斷一片基板所需的時間也增大。為了解決該問題，對切斷裝置來說也要求提高生產率。作為其一個對策，廣泛使用設置兩個切斷用工作臺的所謂雙工位元臺方式的切斷裝置。 In addition, in recent years, the miniaturization of electronic components has progressed. However, in order to increase the production efficiency of electronic components and to increase the size of substrates, it has been demanded to increase the number of electronic components taken out from one substrate. Along with this, the time required to cut a single substrate also increases. In order to solve this problem, it is also required to improve productivity for the cutting device. As one of the countermeasures, a so-called duplex position type cutting device in which two cutting tables are provided is widely used.
在雙工位元臺方式的切斷裝置中，有時直到一個切斷用工作臺上完成被切斷物的切斷為止，另一個切斷用工作臺上產生等待時間。在該等待時間期間，由於對藉由切削水等冷卻的切斷用工作臺的熱傳導而在被切斷物中產生熱變形。若一個切斷用工作臺上切斷被切斷物所需的時間變長，則另一個切斷用工作臺上的等待時間變長，從而被切斷物的切斷線的偏移量變大。隨著基板大型化，切斷一片基板所需的時間增加，由被切斷物的熱變形引起的偏移量越來越成為較大的問題。 In the cutting device of the duplex position system, the waiting time is generated on the other cutting table until the cutting of the object is completed on one cutting table. During this waiting time, thermal deformation occurs in the object to be cut due to heat conduction to the cutting table cooled by cutting water or the like. When the time required to cut the object to be cut on one cutting table becomes longer, the waiting time on the other cutting table becomes longer, and the offset of the cutting line of the object to be cut becomes larger. . As the size of the substrate increases, the time required to cut one substrate increases, and the amount of offset caused by thermal deformation of the object to be cut becomes a major problem.
本發明解決前述的問題，其目的在於提供一種切斷裝置及切斷方法，該切斷裝置及方法在即將切斷被切斷物之前使用一體化地設置在切斷機構中的攝像機構來進行對準，從而能夠修正從最初的對準時刻開始的偏移量並進行切斷。 The present invention has been made in view of the above problems, and an object of the invention is to provide a cutting device and a cutting method which perform an image forming mechanism integrally provided in a cutting mechanism immediately before cutting a object to be cut. By aligning, it is possible to correct the amount of shift from the initial alignment timing and perform cutting.
為了解決前述的問題，本發明所涉及的切斷裝置包括：切斷 機構，沿複數個切斷線切斷具有複數個對準標記的被切斷物；載物臺，供放置前述被切斷物；移動機構，使前述載物臺在基板放置位置與基板切斷位置之間進行移動；噴射機構，朝向切斷前述被切斷物的被加工點噴射切削水；及控制部，至少控制前述載物臺在前述基板放置位置與前述基板切斷位置之間的移動和由前述切斷機構進行的切斷，前述切斷裝置藉由使用前述切斷機構來切斷放在前述基板切斷位置上的前述被切斷物，前述切斷裝置的特徵在於，進一步包括：第一攝像機構，拍攝前述基板放置位置上的前述被切斷物；及第二攝像機構，拍攝前述基板切斷位置上的前述被切斷物，前述控制部利用藉由前述第一攝像機構拍攝的前述複數個對準標記中的至少一部分攝像資料，來設定前述切斷線的位置，前述控制部利用藉由前述第二攝像機構拍攝的前述複數個對準標記中的至少一部分攝像資料，來修正前述切斷線的位置，前述切斷機構沿經修正的前述切斷線切斷前述被切斷物。 In order to solve the aforementioned problems, the cutting device according to the present invention includes: cutting a mechanism for cutting a cut object having a plurality of alignment marks along a plurality of cutting lines; a stage for placing the object to be cut; and a moving mechanism to cut the stage at a substrate placement position and a substrate Moving between the positions; the injection mechanism ejecting the cutting water toward the workpiece to be cut to cut the object; and the control unit controlling at least the movement of the stage between the substrate placement position and the substrate cutting position The cutting device performs the cutting by the cutting mechanism, and the cutting device cuts the object to be cut at the cutting position of the substrate by using the cutting mechanism, and the cutting device further includes a first imaging unit that captures the object to be cut at the substrate placement position; and a second imaging unit that captures the object to be cut at the substrate cutting position, wherein the control unit uses the first imaging mechanism At least a part of the plurality of alignment marks captured, the position of the cutting line is set, and the control unit uses the image captured by the second imaging unit At least part of the imaging data in a plurality of alignment marks to correct the position of the cutting line, the cutting means along the cutting line revised cutting the object to be cut.
此外，本發明所涉及的切斷裝置的特徵在於，在前述的切斷裝置中，設置有兩個前述載物臺，兩個前述載物臺能夠分別在前述基板放置位置和前述基板切斷位置之間進行移動，在兩個前述載物臺中第一載物臺位於前述基板切斷位置的狀態下切斷前述被切斷物期間，在兩個前述載物臺中第二載物臺位於前述基板放置位置的狀態下設定前述切斷線的位置。 Further, in the cutting device according to the present invention, in the cutting device described above, two of the stages are provided, and the two stages are respectively at the substrate placement position and the substrate cutting position. Moving between the two stages in the state in which the first stage is in the state in which the substrate is cut at the cutting position of the substrate, the second stage is placed on the substrate in the two stages. The position of the aforementioned cutting line is set in the position state.
本發明所涉及的切斷裝置具有如下實施方式： 前述切斷機構具有旋轉刃，前述第二攝像機構配置成拍攝前述旋轉刃所切斷的前述切斷線，前述第二攝像機構兼做切口檢測用照相機。 The cutting device according to the present invention has the following embodiments: The cutting mechanism has a rotary blade, and the second imaging mechanism is disposed to capture the cutting line cut by the rotating blade, and the second imaging mechanism also serves as a slit detecting camera.
本發明所涉及的切斷裝置具有如下實施方式：前述切斷機構和前述第二攝像機構被構成為一體，藉由使切斷機構進行移動而使第二攝像機構進行移動。 The cutting device according to the present invention has an embodiment in which the cutting mechanism and the second imaging mechanism are integrally formed, and the second imaging mechanism is moved by moving the cutting mechanism.
此外，本發明所涉及的切斷裝置具有如下實施方式：被切斷物為封裝基板。 Further, the cutting device according to the present invention has the embodiment in which the object to be cut is a package substrate.
此外，本發明所涉及的切斷裝置具有如下實施方式：被切斷物為半導體晶圓。 Further, the cutting device according to the present invention has an embodiment in which the object to be cut is a semiconductor wafer.
為了解決前述的問題，本發明所涉及的切斷方法包括：將具有複數個對準標記的被切斷物放置在載物臺上的步驟；使前述載物臺在基板放置位置與基板切斷位置之間進行移動的步驟；朝向切斷前述被切斷物的被加工點噴射切削水的步驟；和使用切斷機構沿複數個切斷線切斷放在前述基板切斷位置上的前述被切斷物的步驟，前述切斷方法的特徵在於，進一步包括：在前述基板放置位置上，使用第一攝像機構來拍攝前述複數個對準標記中的至少一部分的第一步驟；利用前述第一步驟中拍攝的前述對準標記的攝像資料來設定前述切斷線的位置的步驟；在前述基板切斷位置上，使用第二攝像機構來拍攝前述複數個對準標記中的至少一部分的第二步驟； 利用前述第二步驟中拍攝的前述對準標記的攝像資料來修正前述切斷線的位置的步驟；和沿經修正的前述切斷線來切斷前述被切斷物的步驟。 In order to solve the aforementioned problems, the cutting method according to the present invention includes the steps of: placing a cut object having a plurality of alignment marks on a stage; and cutting the stage at a substrate placement position and a substrate. a step of moving between the positions; a step of ejecting the cutting water toward the to-be-cut point of the object to be cut; and cutting the aforementioned one placed at the cutting position of the substrate along the plurality of cutting lines using the cutting mechanism The step of cutting the object, the cutting method further comprising: a first step of capturing at least a portion of the plurality of alignment marks using the first imaging mechanism at the substrate placement position; using the first a step of setting the position of the cutting line by the image data of the alignment mark captured in the step; and capturing a second portion of the plurality of alignment marks by using the second imaging mechanism at the substrate cutting position step; a step of correcting the position of the cutting line by the imaging data of the alignment mark captured in the second step; and a step of cutting the object to be cut along the corrected cutting line.
本發明所涉及的切斷方法中具有如下實施方式：設置有兩個前述載物臺，並且進一步包括：將第一被切斷物放置在兩個前述載物臺中的第一載物臺上的步驟；使前述第一載物臺在前述基板放置位置與前述基板切斷位置之間進行移動的步驟；將第二被切斷物放置在兩個前述載物臺中的第二載物臺上的步驟；使前述第二載物臺在前述基板放置位置與前述基板切斷位置之間進行移動的步驟；使前述第一載物臺位於前述基板切斷位置並切斷前述第一被切斷物的步驟；及在使前述第一載物臺移動的步驟和切斷前述第一被切斷物的步驟中的至少一部分中，使前述第二載物臺位於前述基板放置位置上並在前述第二被切斷物上設定前述切斷線的位置的步驟。 The cutting method according to the present invention has an embodiment in which two of the aforementioned stages are provided, and further includes: placing the first object to be cut on the first stage of the two preceding stages a step of moving the first stage between the substrate placement position and the substrate cutting position; placing the second object to be cut on the second stage of the two of the stages a step of moving the second stage between the substrate placement position and the substrate cutting position; positioning the first stage at the substrate cutting position and cutting the first object to be cut And at least a part of the step of moving the first stage and the step of cutting the first object, the second stage is located at the substrate placement position and in the foregoing The step of setting the position of the cutting line on the second object to be cut.
此外，本發明所涉及的切斷方法中具有如下實施方式：前述切斷機構具有旋轉刃，並且進一步包括：藉由前述第二攝像機構拍攝前述旋轉刃所切斷的前述切斷線的步驟；進行與前述切斷線中切斷槽有關的檢查的步驟。 Further, in the cutting method according to the present invention, the cutting mechanism includes a rotating blade, and further includes a step of capturing the cutting line cut by the rotating blade by the second imaging mechanism; The step of performing an inspection relating to the cutting groove in the cutting line described above is performed.
此外，本發明所涉及的切斷方法中具有如下實施方式：前述切斷機構和前述第二攝像機構被構成為一體，並且進一步包括： 藉由使前述切斷機構進行移動而使前述第二攝像機構進行移動的步驟。 Further, the cutting method according to the present invention has an embodiment in which the cutting mechanism and the second imaging mechanism are integrally formed, and further includes: The step of moving the second imaging mechanism by moving the cutting mechanism.
此外，本發明所涉及的切斷方法中具有如下實施方式：前述被切斷物為封裝基板。 Further, the cutting method according to the present invention includes the embodiment in which the object to be cut is a package substrate.
此外，本發明所涉及的切斷方法中具有如下實施方式：前述被切斷物為半導體晶圓。 Moreover, the cutting method according to the present invention has an embodiment in which the object to be cut is a semiconductor wafer.
根據本發明，在切斷裝置中，即使在開始被切斷物的切斷之前產生等待時間，也能夠藉由檢測在對準時刻的對準標記的座標位置和在即將進行切斷之前的對準標記的座標位置，修正從對準時刻開始的切斷線的偏移量。因此，能夠在修正被切斷物的切斷線的位置後沿經修正的切斷線進行切斷。 According to the present invention, in the cutting device, even if the waiting time is generated before the cutting of the object to be cut, the coordinate position of the alignment mark at the timing of the alignment and the pair immediately before the cutting can be detected. The coordinate position of the quasi-marker corrects the offset of the cutting line from the alignment time. Therefore, it is possible to perform cutting along the corrected cutting line after correcting the position of the cutting line of the object to be cut.
1‧‧‧切斷裝置 1‧‧‧cutting device
2‧‧‧前置載物臺 2‧‧‧Pre-stage
3‧‧‧封裝基板(被切斷物、第一被切斷物、第二被切斷物) 3‧‧‧Package substrate (cut object, first object to be cut, second object to be cut)
3a‧‧‧植球面 3a‧‧‧Spherical surface
3b‧‧‧基板面 3b‧‧‧Substrate surface
4A、4B‧‧‧切斷用工作臺 4A, 4B‧‧‧Working table for cutting
5A、5B‧‧‧切斷用載物臺(載物臺、第一載物臺、第二載物臺) 5A, 5B‧‧‧Slipping stage (stage, first stage, second stage)
6‧‧‧基板放置部 6‧‧‧Substrate placement
7‧‧‧基板切斷部 7‧‧‧Substrate cutting section
8‧‧‧基板清洗部 8‧‧‧Substrate Cleaning Department
9‧‧‧對準用照相機(第一攝像機構) 9‧‧‧Alignment camera (first camera)
10A、10B‧‧‧心軸單元(切斷機構) 10A, 10B‧‧‧ mandrel unit (cutting mechanism)
11A、11B‧‧‧旋轉刃 11A, 11B‧‧‧Rotary blade
12A、12B‧‧‧切削水用噴嘴(噴射機構) 12A, 12B‧‧‧ cutting nozzle for water (jetting mechanism)
13‧‧‧切口檢測用照相機(第二攝像機構) 13‧‧‧Incision detection camera (second camera mechanism)
14‧‧‧由複數個電子零件P構成的集合體 14‧‧‧A collection of multiple electronic parts P
15‧‧‧清洗機構 15‧‧‧ Cleaning institutions
16‧‧‧清洗輥 16‧‧‧cleaning roller
17‧‧‧檢查用載物臺 17‧‧‧Checking the stage
18‧‧‧檢查用照相機 18‧‧‧Check camera
19‧‧‧分度臺 19‧‧‧分台
20‧‧‧移送機構 20‧‧‧Transfer organization
21‧‧‧合格品用托盤 21‧‧‧Tray for quality products
22‧‧‧基板部 22‧‧‧Parts Department
23‧‧‧封裝樹脂部 23‧‧‧Encapsulated Resin Department
24‧‧‧對準標記 24‧‧‧ alignment mark
25、25S、25L‧‧‧切斷線 25, 25S, 25L‧‧‧ cut line
26‧‧‧區域 26‧‧‧Area
27‧‧‧封裝樹脂部 27‧‧‧Encapsulated Resin Department
A‧‧‧接收單元 A‧‧‧ receiving unit
B‧‧‧切斷單元 B‧‧‧cutting unit
C‧‧‧清洗單元 C‧‧‧cleaning unit
D‧‧‧檢查單元 D‧‧‧Check unit
E‧‧‧收容單元 E‧‧‧ containment unit
P‧‧‧電子零件 P‧‧‧Electronic parts
CTL‧‧‧控制部 CTL‧‧‧Control Department
LD‧‧‧裝載(Load) LD‧‧‧Load (Load)
PA‧‧‧預對準(Pre Alignment) PA‧‧‧Prealignment
CT‧‧‧切斷(Cut) CT‧‧‧Cut (Cut)
WD‧‧‧清洗和乾燥(Wash & Dry) WD‧‧‧Wash & Dry
UL‧‧‧卸載(Unload) UL‧‧‧Unloading (Unload)
WT‧‧‧等待(Wait) WT‧‧‧Waiting
AA‧‧‧補充對準(Additional Alignment) AA‧‧‧Additional Alignment
S‧‧‧步驟(Steps) S‧‧‧Steps (Steps)
圖1是表示本實施例所涉及的雙工位元臺方式的切斷裝置的概略俯視圖。 FIG. 1 is a schematic plan view showing a cutting device of a duplex station type according to the present embodiment.
圖2是表示封裝基板的概要的外觀圖，圖2的(a)是從基板側觀察的俯視圖，圖2的(b)是前視圖，圖2的(c)是側視圖。 2 is an external view showing an outline of a package substrate, and FIG. 2(a) is a plan view seen from the substrate side, FIG. 2(b) is a front view, and FIG. 2(c) is a side view.
圖3是在雙工位元臺方式的切斷裝置中，表示本實施例所涉及的各切斷用工作臺的動作的概略時間表。 FIG. 3 is a schematic schedule showing the operation of each cutting table according to the present embodiment in the cutting device of the duplex position system.
圖4是表示對封裝基板進行對準的狀態的概略俯視圖，圖4的(a)表示預對準時刻，圖4的(b)表示即將進行切斷之前的對準狀態。 4 is a schematic plan view showing a state in which the package substrate is aligned, wherein (a) of FIG. 4 shows a pre-alignment time, and (b) of FIG. 4 shows an alignment state immediately before the cutting.
圖5是表示封裝基板的變形例的圖，圖5的(a)是從基板側觀察的俯視圖，圖5的(b)是前視圖。 FIG. 5 is a view showing a modification of the package substrate, wherein FIG. 5( a ) is a plan view seen from the substrate side, and FIG. 5( b ) is a front view.
在雙工位元臺方式的切斷裝置中，藉由使用一體化地設置在心軸單元上的切口檢測用照相機，在切斷封裝基板之前再次檢測對準標記。由此，在封裝基板進行收縮的狀態下修正距藉由預對準設定的切斷線的偏移量，沿即將進行切斷之前的經修正的切斷線切斷封裝基板。 In the cutting device of the duplex position method, the alignment mark is detected again before the package substrate is cut by using the slit detecting camera integrally provided on the spindle unit. Thereby, the offset amount from the cutting line set by the pre-alignment is corrected in a state where the package substrate is shrunk, and the package substrate is cut along the corrected cutting line immediately before the cutting.
參照圖1至圖5，對本發明所涉及的切斷裝置的實施例進行說明。對本申請資料中的任一張圖，為了易於理解均進行適當省略或誇張以示意性地描繪。對相同的結構要素使用相同的附圖標記，並適當省略說明。 An embodiment of the cutting device according to the present invention will be described with reference to Figs. 1 to 5 . Any one of the drawings of the present application is appropriately omitted or exaggerated for easy understanding to be schematically depicted. The same reference numerals are used for the same components, and the description is omitted as appropriate.
圖1是表示本實施例所涉及的雙工位元臺方式的切斷裝置1的概略俯視圖。切斷裝置1使被切斷物單片化為複數個電子零件。切斷裝置1具有分別作為結構要素(模組)的接收單元A、切斷單元B、清洗單元C、檢查單元D和收容單元E。 FIG. 1 is a schematic plan view showing a cutting device 1 of a duplex position system according to the present embodiment. The cutting device 1 singulates the object to be cut into a plurality of electronic components. The cutting device 1 has a receiving unit A, a cutting unit B, a washing unit C, an inspection unit D, and a storage unit E as structural elements (modules), respectively.
相對於其他結構要素，各結構要素(各單元A至E)分別能夠裝卸且能夠交換，事先準備分別具有與預期的要求規格相應的不同的多種規格的各結構要素。包括各結構要素A至E來構成切斷裝置1。 With respect to other components, each component (each unit A to E) can be detached and exchanged, and each component having a plurality of different specifications corresponding to an expected specification is prepared in advance. The cutting device 1 is configured by including the respective constituent elements A to E.
在接收單元A中設置有前置載物臺2。前置載物臺2從作為前步驟的裝置的樹脂封裝裝置接收相當於被切斷物的封裝基板3。封裝基板3(例如，BGA方式的封裝基板)以基板側的表面(植球面)朝上的方式被配置在前置載物臺2上。 A front stage 2 is provided in the receiving unit A. The pre-stage 2 receives the package substrate 3 corresponding to the object to be cut from the resin package device as the device of the previous step. The package substrate 3 (for example, a BGA type package substrate) is disposed on the front stage 2 such that the surface (balloon surface) on the substrate side faces upward.
封裝基板3具有引線框或印刷基板等的電路板、安裝在電路板上的格子狀的複數個區域中且包括被動元件或主動元件的晶片和由一併成型的硬化樹脂構成的封裝樹脂。 The package substrate 3 has a circuit board such as a lead frame or a printed substrate, a wafer including a passive element or an active element mounted in a plurality of lattice-like regions on the circuit board, and an encapsulating resin composed of a hardened resin which is integrally molded.
在切斷單元B設置有兩個切斷用工作臺4A、4B。切斷裝置1為所謂雙工位元臺方式的切斷裝置。兩個切斷用工作臺4A、4B藉由移動機構(未圖示)能夠分別沿圖中Y方向移動，並且能夠沿θ方向轉動。在切斷用工作臺4A、4B上安裝有切斷用載物臺5A、5B。切斷單元B由基板放置部6、基板切斷部7和基板清洗部8構成。 Two cutting tables 4A and 4B are provided in the cutting unit B. The cutting device 1 is a so-called duplex position type cutting device. The two cutting tables 4A and 4B are movable in the Y direction in the drawing by a moving mechanism (not shown), and are rotatable in the θ direction. The cutting stages 5A and 5B are attached to the cutting tables 4A and 4B. The cutting unit B is composed of a substrate placing portion 6 , a substrate cutting portion 7 , and a substrate cleaning portion 8 .
在基板放置部6上設置有對準用照相機9。照相機9能夠在基板放置部6上獨立地沿X方向移動。封裝基板3在基板放置部6中通過照相機9檢測出形成於植球面上的對準標記，並且封裝基板3上設定有虛擬切斷線的位置。 An alignment camera 9 is provided on the substrate placing portion 6. The camera 9 is independently movable in the X direction on the substrate placing portion 6. The package substrate 3 detects the alignment mark formed on the ball-fed surface by the camera 9 in the substrate placement portion 6, and the position of the virtual cutting line is set on the package substrate 3.
在基板切斷部7設置有作為切斷機構的兩個心軸單元10A、10B。兩個心軸單元10A、10B能夠獨立地沿X方向及Z方向移動。在兩個心軸單元10A、10B分別設置有旋轉刃11A、11B。此等旋轉刃11A、11B分別在沿Y方向的面內旋轉而切斷封裝基板3。因此，在本實施例中，在基板切斷部7設置有兩個切斷機構(心軸單元10A、10B)。 The spindle cutting unit 7 is provided with two spindle units 10A and 10B as cutting mechanisms. The two spindle units 10A, 10B are independently movable in the X direction and the Z direction. Rotating blades 11A and 11B are provided in the two spindle units 10A and 10B, respectively. Each of the rotary blades 11A and 11B rotates in the plane in the Y direction to cut the package substrate 3. Therefore, in the present embodiment, two cutting mechanisms (mandrel units 10A, 10B) are provided in the substrate cutting portion 7.
在各心軸單元10A、10B設置有噴射用於抑制因高速旋轉的旋轉刃11A、11B而產生的摩擦熱的切削水的切削水用噴嘴12A、12B。朝向旋轉刃11A、11B切斷封裝基板3的被加工點噴射切削水。進一步，在心軸單元10B側一體化地設置有用於檢測藉由旋轉刃11B切斷的切斷槽(切口)的位置、寬度、有無缺損(剝離)等的切口檢測用照相機13。以拍攝 旋轉刃11B所切斷的切斷線上的方式設置照相機13。在本實施例中，顯示了在心軸單元10B側設置照相機13的情況，但還可以設置在心軸10A側。或者，還可以在兩個心軸10A、10B的兩側設置照相機13。 The respective mandrel units 10A and 10B are provided with cutting water nozzles 12A and 12B that spray cutting water for suppressing frictional heat generated by the rotating blades 11A and 11B that rotate at high speed. The cutting water is sprayed toward the machined point of the package substrate 3 toward the rotary blades 11A and 11B. Further, the incision detecting camera 13 for detecting the position, the width, and the presence or absence of the defect (peeling) of the cutting groove (notch) cut by the rotary blade 11B is integrally provided on the mandrel unit 10B side. To shoot The camera 13 is provided in such a manner as to cut off the cutting line by the rotary blade 11B. In the present embodiment, the case where the camera 13 is disposed on the mandrel unit 10B side is shown, but it may be provided on the mandrel 10A side. Alternatively, the camera 13 may be provided on both sides of the two mandrels 10A, 10B.
在基板清洗部8設置有清洗機構(未圖示)，該機構清洗藉由切斷封裝基板3來單片化的複數個電子零件P構成的集合體14的植球面。 The substrate cleaning unit 8 is provided with a cleaning mechanism (not shown) that cleans the ball-forming surface of the assembly 14 composed of a plurality of electronic components P that are diced by cutting the package substrate 3.
在清洗單元C設置有清洗經單片化的各電子零件P的樹脂側表面(澆鑄面)的清洗機構15。在清洗機構15設置有能夠以Y方向為軸旋轉的清洗輥16。在清洗澆鑄面的清洗機構15的上方配置有由複數個電子零件P構成的集合體14。藉由運送機構(未圖示)吸附植球面側來固定集合體14。亦即，使澆鑄面朝下地將集合體14固定在運送機構上。運送機構能夠沿X方向及Z方向移動。藉由該運送機構下降並沿X方向往復移動，從而藉由清洗輥16清洗集合體14的澆鑄面。 The cleaning unit C is provided with a cleaning mechanism 15 that cleans the resin-side surface (casting surface) of each of the singulated electronic parts P. The cleaning mechanism 15 is provided with a cleaning roller 16 that is rotatable about the Y direction. An assembly 14 composed of a plurality of electronic components P is disposed above the cleaning mechanism 15 for cleaning the casting surface. The aggregate 14 is fixed by a transport mechanism (not shown) that adsorbs the surface of the ball. That is, the assembly 14 is fixed to the transport mechanism with the casting surface facing downward. The transport mechanism is movable in the X direction and the Z direction. The casting surface of the assembly 14 is cleaned by the cleaning roller 16 by the conveying mechanism descending and reciprocating in the X direction.
在檢查單元D設置有檢查用載物臺17。由切斷封裝基板3來經單片化的複數個電子零件P構成的集合體14一併移載在檢查用載物臺17上。檢查用載物臺17被構成為能夠沿X方向移動，並且能夠以Y方向為軸旋轉。由經單片化的複數個電子零件P(例如，BAG產品)構成的集合體14藉由檢查用照相機18來檢查樹脂側的表面(澆鑄面)及基板側的表面(植球面)，並且被篩選為合格品和次品。由已檢查的電子零件P構成的集合體14以格子旗圖案狀(checker flag pattern狀)或格子狀移載在分度臺19上。在檢查單元D設置有用於向托盤移送被配置在分度元臺19上的電子零件P的複數個移送機構20。 The inspection stage 17 is provided in the inspection unit D. The assembly 14 composed of a plurality of electronic components P that are diced by cutting the package substrate 3 is collectively transferred to the inspection stage 17. The inspection stage 17 is configured to be movable in the X direction and is rotatable about the Y direction. The assembly 14 composed of a plurality of singulated electronic components P (for example, a BAG product) is inspected by the inspection camera 18 for the surface on the resin side (casting surface) and the surface on the substrate side (planting surface), and is Screened for qualified and defective products. The aggregate 14 composed of the inspected electronic components P is transferred to the indexing table 19 in a checker flag pattern or a lattice shape. The inspection unit D is provided with a plurality of transfer mechanisms 20 for transferring the electronic parts P disposed on the indexing table 19 to the tray.
在收容單元E設置有收容合格品的合格品用托盤21和收容 次品的次品用托盤(未圖示)。被篩選為合格品和次品的電子零件P藉由移送機構20被收容到各托盤中。圖中，僅表示了一個合格品用托盤21，但在收容單元21內可設置複數個合格品用托盤21。 The storage unit E is provided with a quality product tray 21 for accommodating a good product and a storage tray A tray for defective products (not shown). The electronic parts P that are selected as good and defective products are housed in the respective trays by the transfer mechanism 20. In the figure, only one quality product tray 21 is shown, but a plurality of quality goods trays 21 can be provided in the storage unit 21.
在切斷裝置1中，例如藉由設置在接收單元A內的控制部CTL來控制封裝基板3的移動、封裝基板3中的切斷線的位置的設定、使用切斷機構的封裝基板3的切斷、使用清洗機構的植球面及澆鑄面的清洗及經單片化的電子零件P的檢查和收容等所有處理。本實施例表示了藉由設置在接收單元A內的控制部CTL來控制所有處理的情況。不限定於此，還可以將控制部CTL設置在其他單元內。此外，還可以設置各自的控制部來控制從切斷至清洗的處理及從檢查至收容的處理。 In the cutting device 1, for example, the movement of the package substrate 3, the setting of the position of the cutting line in the package substrate 3, and the package substrate 3 using the cutting mechanism are controlled by the control unit CTL provided in the receiving unit A. All treatments such as cutting, cleaning of the ball-and-spray surface and the casting surface of the cleaning mechanism, and inspection and storage of the singulated electronic component P are performed. This embodiment shows a case where all processing is controlled by the control unit CTL provided in the receiving unit A. Not limited to this, the control unit CTL may be provided in another unit. Further, it is also possible to provide respective control units for controlling the process from the cutting to the cleaning and the process from the inspection to the storage.
圖2是表示封裝基板3的概要的外觀圖。分別表示為：圖2的(a)是從基板側觀察封裝基板3的俯視圖，圖2的(b)是前視圖，圖2的(c)是側視圖。封裝基板3由基板部22和封裝樹脂部23構成，其中，前述封裝樹脂部由硬化樹脂構成。封裝基板3具有基板側的表面(植球面)3a和樹脂側的表面(澆鑄面)3b。在封裝基板3的植球面3a上沿長度方向及寬度方向形成有複數個對準標記24(圖中用“+”表示的標記)。與封裝基板3的大小和經單片化的電子零件P的數量相對應地確定沿長度方向及寬度方向形成的對準標記24。 FIG. 2 is an external view showing an outline of the package substrate 3. Fig. 2(a) is a plan view of the package substrate 3 as seen from the substrate side, Fig. 2(b) is a front view, and Fig. 2(c) is a side view. The package substrate 3 is composed of a substrate portion 22 and an encapsulating resin portion 23, wherein the encapsulating resin portion is made of a cured resin. The package substrate 3 has a surface (balloon surface) 3a on the substrate side and a surface (cast surface) 3b on the resin side. A plurality of alignment marks 24 (marks indicated by "+" in the drawing) are formed on the ball-forming surface 3a of the package substrate 3 in the longitudinal direction and the width direction. The alignment marks 24 formed in the longitudinal direction and the width direction are determined in correspondence with the size of the package substrate 3 and the number of singulated electronic parts P.
藉由設置在基板放置部6上的對準用照相機9(參照圖1)檢測出複數個對準標記24的座標位置之後，利用檢測出的此等對準標記24的座標位置資料，設定虛擬的切斷線(邊界線)25的位置。切斷線25分別設定有切斷封裝基板3的寬度方向的切斷線25S和切斷長度方向的切斷線 25L。被切斷線25S和切斷線25L包圍的區域26分別對應電子零件P。可以根據產品任意確定為了設定切斷線25S、25L而檢測的對準標記24的數量。 After the coordinate position of the plurality of alignment marks 24 is detected by the alignment camera 9 (refer to FIG. 1) provided on the substrate placement portion 6, the coordinates of the coordinate positions of the alignment marks 24 are detected, and the virtual position is set. The position of the line (boundary line) 25 is cut. The cutting line 25 is provided with a cutting line 25S that cuts the width direction of the package substrate 3 and a cutting line that cuts the longitudinal direction. 25L. The region 26 surrounded by the cutting line 25S and the cutting line 25L corresponds to the electronic component P, respectively. The number of alignment marks 24 detected to set the cutting lines 25S, 25L can be arbitrarily determined according to the product.
圖3是用於說明在圖1所示的本實施例的雙工位元臺方式的切斷裝置1中，切斷單元B中的切斷用工作臺4A及4B的動作的概略時間表，用從開始起往下隨時間經過的時間表來表示。在圖3中，附圖標記LD表示裝載(Load)、PA表示預對準(Pre Alignment)、CT表示切斷(Cut)、WD表示清洗和乾燥(Wash & Dry)、UL表示卸載(Unload)、WT表示等待時間(Wait)以及AA表示即將進行切斷之前的補充對準(Additional Alignment)的各狀態。S1、S2、…、S5分別用一根向下的箭頭表示在切斷用工作臺4A、4B中，將一片封裝基板3作為對象來進行的從裝載(LD)至卸載(UL)的步驟(Steps)。 FIG. 3 is a schematic time chart for explaining the operation of the cutting tables 4A and 4B in the cutting unit B in the cutting device 1 of the duplex position system of the present embodiment shown in FIG. It is expressed in a schedule that goes through the time from the beginning. In FIG. 3, reference numeral LD denotes a load, PA denotes a pre-alignment, CT denotes a cut, WD denotes a wash and dry, and UL denotes an unload. WT indicates Wait time and AA indicates each state of Additional Alignment immediately before the cut. S1, S2, ..., S5 are respectively indicated by a downward arrow from the loading (LD) to the unloading (UL) step of the one of the cutting substrates 4A and 4B. Steps).
參照圖1至圖3，對於在各切斷用工作臺4A、4B中切斷封裝基板3的一系列的步驟進行說明。最初，對於在各切斷用工作臺4A、4B中切斷封裝基板3直至單片化為複數個電子零件P的動作進行說明。如圖1所示，在基板放置部6中，在安裝於切斷用工作臺4A的切斷用載物臺5A上使植球面3a朝上地放置有封裝基板3(圖3的LD1)。其次，使用對準用照相機9，沿長度方向及寬度方向檢測出形成在封裝基板3的植球面3a上的對準標記24來測定座標位置。可以根據封裝基板3的大小及電子零件P的數量來任意確定檢測對準標記24的個數。根據該檢測出的對準標記24的座標位置的資料，分別沿寬度方向及長度方向設定切斷封裝基板3的虛擬的切斷線25S及25L(圖3的PA1)。 A series of steps for cutting the package substrate 3 in each of the cutting tables 4A and 4B will be described with reference to Figs. 1 to 3 . First, the operation of cutting the package substrate 3 in each of the cutting tables 4A and 4B until the individual pieces are formed into a plurality of electronic parts P will be described. As shown in Fig. 1, in the substrate placing portion 6, the package substrate 3 (LD1 of Fig. 3) is placed on the cutting stage 5A attached to the cutting table 4A with the ball-forming surface 3a facing upward. Next, using the alignment camera 9, the alignment marks 24 formed on the ball-forming surface 3a of the package substrate 3 are detected in the longitudinal direction and the width direction to measure the coordinate position. The number of detection alignment marks 24 can be arbitrarily determined according to the size of the package substrate 3 and the number of electronic parts P. The virtual cutting lines 25S and 25L (PA1 of FIG. 3) for cutting the package substrate 3 are set in the width direction and the longitudinal direction, respectively, based on the data of the coordinate position of the detected alignment mark 24.
其次，使切斷用工作臺4A從基板放置部6向基板切斷部7 移動。在基板切斷部7中，藉由兩個設置在心軸單元10A、10B上的旋轉刃11A、11B切斷封裝基板3。首先，在使封裝基板3的長度方向平行於X方向(參照圖1)的方式放置的狀態下，使切斷用工作臺4A朝向心軸單元10A、10B(圖1的+Y方向)移動。藉由使封裝基板3進入到旋轉刃11A、11B，順著沿封裝基板3的寬度方向的各切斷線25S(參照圖2)切斷封裝基板3。在進行切斷時，從切削水用噴嘴12A、12B向旋轉刃11A、11B和封裝基板3所接觸的被加工點噴射切削水。其次，使切斷用工作臺4A旋轉90度，順著沿封裝基板3的長度方向的各切斷線25L(參照圖2)切斷封裝基板3。如此，在切斷用工作臺4A上放置的封裝基板3沿切斷線25S及切斷線25L被切斷，從而形成各區域26。該區域26為分別經單片化的電子零件P(圖3的CT1)。 Next, the cutting table 4A is moved from the substrate placing portion 6 to the substrate cutting portion 7 mobile. In the substrate cutting portion 7, the package substrate 3 is cut by the two rotary blades 11A, 11B provided on the spindle units 10A, 10B. First, the cutting table 4A is moved toward the spindle units 10A and 10B (the +Y direction in FIG. 1) in a state in which the longitudinal direction of the package substrate 3 is parallel to the X direction (see FIG. 1). By inserting the package substrate 3 into the rotary blades 11A and 11B, the package substrate 3 is cut along the respective cutting lines 25S (see FIG. 2) in the width direction of the package substrate 3. At the time of cutting, the cutting water is sprayed from the cutting water nozzles 12A and 12B to the machining points where the rotary blades 11A and 11B and the package substrate 3 are in contact with each other. Then, the cutting table 4A is rotated by 90 degrees, and the package substrate 3 is cut along the respective cutting lines 25L (see FIG. 2) along the longitudinal direction of the package substrate 3. In this way, the package substrate 3 placed on the cutting table 4A is cut along the cutting line 25S and the cutting line 25L, thereby forming the respective regions 26. This region 26 is a singulated electronic component P (CT1 of FIG. 3).
此時，首先順著沿封裝基板3的寬度方向的各切斷線25S切斷封裝基板3，其次順著沿長度方向的各切斷線25L切斷封裝基板3。不限於此，還可以首先順著沿長度方向的各切斷線25L切斷封裝基板3，其次順著沿寬度方向的各切斷線25S切斷封裝基板3。 At this time, first, the package substrate 3 is cut along the respective cutting lines 25S in the width direction of the package substrate 3, and then the package substrate 3 is cut along the respective cutting lines 25L in the longitudinal direction. The present invention is not limited thereto, and the package substrate 3 may be first cut along the respective cutting lines 25L in the longitudinal direction, and then the package substrate 3 may be cut along the respective cutting lines 25S in the width direction.
其次，在保持一併吸附由經單片化的複數個電子零件P構成的集合體14的狀態下，使切斷用工作臺4A從基板切斷部7向基板清洗部8移動。在基板清洗部8中，清洗電子零件P的植球面3a並使其乾燥(圖3的WD1)。結束清洗及乾燥的電子零件P的集合體14藉由運送機構(未圖示)被一併吸附值球面3a，並且被運送至清洗單元C(圖3的UL1)。 Then, the cutting table 4A is moved from the substrate cutting unit 7 to the substrate cleaning unit 8 while the assembly 14 composed of the plurality of electronic components P that are singulated is adsorbed. In the substrate cleaning unit 8, the ball-forming surface 3a of the electronic component P is cleaned and dried (WD1 of FIG. 3). The assembly 14 of the electronic component P that has been cleaned and dried is collectively adsorbed by the transport mechanism (not shown) and transported to the cleaning unit C (UL1 of FIG. 3).
如圖3的S1所示，在此一直進行說明的動作表示對放置在切斷用工作臺4A上的最初的封裝基板3進行單片化後運送至清洗步驟為止 的一系列的步驟。亦即，通過進行裝載(LD1)→預對準(PA1)→切斷(CT1)→清洗和乾燥(WD1)至卸載(UL1)的步驟，封裝基板3被單片化為由複數個電子零件P構成的集合體14，並被一併運送至下面的清洗單元C。 As shown in S1 of FIG. 3, the operation described above is performed until the first package substrate 3 placed on the cutting table 4A is singulated and transported to the cleaning step. A series of steps. That is, by performing the steps of loading (LD1) → pre-alignment (PA1) → cutting (CT1) → cleaning and drying (WD1) to unloading (UL1), the package substrate 3 is singulated into a plurality of electronic parts. The assembly 14 of P is transported together to the cleaning unit C below.
在完成切斷用工作臺4A的裝載(LD1)之後，在切斷用工作臺4B中，同樣開始進行裝載(LD2)→預對準(PA2)→切斷(CT2)→清洗和乾燥(WD2)至卸載(UL2)的一系列步驟。然而，切斷用工作臺4B不能進入該步驟直至完成切斷用工作臺4A的各步驟中的處理。因此，對圖3的S2的動作來說，在完成切斷用工作臺4B中的預對準(PA2)之後，產生等待時間(WT2)直至完成切斷用工作臺4A中的切斷(CT1)為止。換言之，在完成切斷用工作臺4A的切斷(CT1)之後，在切斷用工作臺4B中開始切斷(CT2)。如此，直至一側的切斷用工作臺中完成切斷(CT)為止，另一側的切斷用工作臺中產生等待時間(WT)。 After the loading (LD1) of the cutting table 4A is completed, loading (LD2) → pre-alignment (PA2) → cutting (CT2) → washing and drying (WD2) is also started in the cutting table 4B. ) to a series of steps to uninstall (UL2). However, the cutting table 4B cannot enter this step until the processing in each step of the cutting table 4A is completed. Therefore, in the operation of S2 of Fig. 3, after the pre-alignment (PA2) in the cutting table 4B is completed, the waiting time (WT2) is generated until the cutting in the cutting table 4A is completed (CT1). )until. In other words, after the cutting (CT1) of the cutting table 4A is completed, the cutting is started in the cutting table 4B (CT2). In this manner, until the cutting (CT) is completed in the cutting table on one side, the waiting time (WT) is generated in the other cutting table.
若在切斷用工作臺4A、4B中，繼續進行切斷，則在開始切斷之前的等待時間(WT)期間，封裝基板3因受到切削水等的影響而進行熱變形(進行收縮)。因此，有可能相對於預對準(PA)時刻中設定的切斷線25S、25L，在即將進行切斷之前的切斷線25S、25L上產生錯位。若在產生錯位的狀態下進行切斷，則有可能引起電子零件P的損壞和劣化。 When the cutting is continued in the cutting tables 4A and 4B, the package substrate 3 is thermally deformed (contracted) by the influence of cutting water or the like during the waiting time (WT) before the cutting is started. Therefore, there is a possibility that a misalignment occurs in the cutting lines 25S and 25L immediately before the cutting, with respect to the cutting lines 25S and 25L set in the pre-alignment (PA) time. If the cutting is performed in a state in which the misalignment occurs, the electronic component P may be damaged or deteriorated.
如圖1所示，在基板放置部6中，封裝基板3在常溫(20~25℃)氣氛下進行對準。另一方面，在基板切斷部7中，為了抑制旋轉刃11A、11B的摩擦熱，從切削水用噴嘴12A、12B向封裝基板3噴射切削水。雖然根據切斷的條件有所不同，有時切削水冷卻至與氣氛溫度相比低溫的10℃~15℃。為了提高冷卻效果，切削水有時還會冷卻至更低的溫度。 As shown in FIG. 1, in the substrate placement portion 6, the package substrate 3 is aligned in a normal temperature (20 to 25 ° C) atmosphere. On the other hand, in the substrate cutting portion 7, in order to suppress the frictional heat of the rotary blades 11A and 11B, the cutting water is sprayed from the cutting water nozzles 12A and 12B to the package substrate 3. Although the cutting conditions vary depending on the cutting conditions, the cutting water may be cooled to a temperature of 10 ° C to 15 ° C which is lower than the atmospheric temperature. In order to improve the cooling effect, the cutting water is sometimes cooled to a lower temperature.
為了提高冷卻效果，有時還會設置與切削水用噴嘴12A、12B不同地從旋轉刃11A、11B的兩側向被加工點噴射冷卻水的冷卻用噴嘴(未圖示)。還可以藉由在旋轉刃11A、11B的兩側設置複數個該冷卻用噴嘴而非設置一個，從而進一步提高冷卻效果。與切削水相同，冷卻水也被冷卻至10℃~15℃。 In order to improve the cooling effect, a cooling nozzle (not shown) that sprays cooling water from the both sides of the rotary blades 11A and 11B to the workpiece to be processed is provided in addition to the cutting water nozzles 12A and 12B. It is also possible to further improve the cooling effect by providing a plurality of the cooling nozzles on both sides of the rotary blades 11A, 11B instead of one. As with the cutting water, the cooling water is also cooled to 10 ° C ~ 15 ° C.
藉由這種切削水及冷卻水來冷卻封裝基板3、切斷用工作臺4A、4B和切斷用載物臺5A、5B。藉由分別冷卻封裝基板3、切斷用工作臺4A、4B和切斷用載物臺5A、5B，從而按照構成此等的材料從常溫狀態進行收縮。 The package substrate 3, the cutting stages 4A and 4B, and the cutting stages 5A and 5B are cooled by the cutting water and the cooling water. By cooling the package substrate 3, the cutting stages 4A and 4B, and the cutting stages 5A and 5B, respectively, the material is configured to shrink from a normal temperature state.
切斷用工作臺4A在完成切斷(CT1)之後，從基板切斷部7向基板清洗部8移動，並且對植球面3a進行清洗和乾燥(WD1)之後，返回到基板放置部6。返回到基板放置部6的切斷用工作臺4A及切斷用載物臺5A分別保持與被切削水及冷卻水冷卻的狀態幾乎相同的溫度。如圖3的S3所示，在基板放置部6中新的封裝基板3被放置在切斷用工作臺4A上(LD3)。在常溫氣氛下對切斷用工作臺4A上放置的封裝基板3進行預對準(PA3)。然而，由於另一個切斷用工作臺4B處於切斷(CT2)中，因此切斷用工作臺4A等待(WT3)切斷(CT3)直至完成該切斷(CT2)。 After the cutting (CT1) is completed, the cutting table 4A moves from the substrate cutting unit 7 to the substrate cleaning unit 8, and the ball surface 3a is washed and dried (WD1), and then returned to the substrate placing unit 6. The cutting table 4A and the cutting stage 5A which are returned to the substrate placing portion 6 are maintained at substantially the same temperature as the state in which the cutting water and the cooling water are cooled. As shown in S3 of Fig. 3, a new package substrate 3 is placed on the cutting table 4A in the substrate placing portion 6 (LD3). The package substrate 3 placed on the cutting table 4A is pre-aligned (PA3) in a normal temperature atmosphere. However, since the other cutting table 4B is in the cutting (CT2), the cutting table 4A waits (WT3) to cut (CT3) until the cutting (CT2) is completed.
根據現有技術，發生如下的不良情況。亦即，由於切斷用工作臺4A及切斷用載物臺5A在切斷(CT1)時被冷卻，因此在等待(WT3)期間，對於經冷卻的狀態的切斷用工作臺4A及切斷用載物臺5A從封裝基板3產生熱傳導，其結果，封裝基板3經冷卻而收縮。藉由進行收縮，相對於在預對準(PA3)時刻中設定的切斷線25S及25L，在實際的切斷線25S 及25L的位置上產生偏移。若等待時間(WT3)變長，則該切斷線25S及25L的偏移量進一步變大。 According to the prior art, the following problems occur. In other words, since the cutting table 4A and the cutting stage 5A are cooled at the time of cutting (CT1), the cutting table 4A and the cutting state in the cooled state are waited for (WT3). The breakage stage 5A generates heat conduction from the package substrate 3, and as a result, the package substrate 3 is cooled and contracted. By performing the contraction, with respect to the cutting lines 25S and 25L set in the pre-alignment (PA3) time, the actual cutting line 25S An offset occurs at the position of 25L. When the waiting time (WT3) becomes long, the offset amounts of the cutting lines 25S and 25L are further increased.
根據現有技術，例如在圖3的實施例中，裝載(LD)需要10秒時間，預對準(PA)需要30秒時間，切斷(CT)需要120秒時間，清洗和乾燥(WD)需要30秒時間，卸載(UL)需要10秒時間，補充對準(AA)需要10秒時間。如此一來，在S3步驟中，等待時間(WT3)為50秒，在這個期間封裝基板3經冷卻而收縮。近年來，由於封裝基板3大型化，電子零件P的生產量增加，從而切斷線的總體長度增加，因此具有該等待時間(WT)變長的傾向。因此，封裝基板3收縮的收縮量也變大，從而切斷線25S、25L的偏移量也變大。 According to the prior art, for example in the embodiment of Fig. 3, loading (LD) takes 10 seconds, pre-alignment (PA) takes 30 seconds, and cutting (CT) takes 120 seconds, cleaning and drying (WD) is required. In 30 seconds, unloading (UL) takes 10 seconds, and supplemental alignment (AA) takes 10 seconds. As a result, in the step S3, the waiting time (WT3) is 50 seconds, during which the package substrate 3 is cooled and contracted. In recent years, as the size of the package substrate 3 has increased, the production amount of the electronic component P has increased, and the overall length of the cutting wire has increased. Therefore, the waiting time (WT) tends to be long. Therefore, the amount of contraction of the package substrate 3 by contraction also increases, and the amount of shift of the cut lines 25S and 25L also increases.
另一方面，根據本發明，為了修正S3步驟中等待時間(WT3)期間所產生的偏移量，在切斷(CT3)之前進行補充對準(AA3)。換言之，在切斷用工作臺4B中完成切斷(CT2)之後，緊接著在切斷用工作臺4A中進行補充對準(AA3)。使用一體化地設置在心軸單元10B(參照圖1)上的切口檢測用照相機13進行補充對準(AA3)。通過將該切口檢測用照相機13用於補充對準(AA3)中，在即將進行切斷(CT3)之前修正切斷線25S及25L的偏移量。 On the other hand, according to the present invention, in order to correct the offset generated during the waiting time (WT3) in the step S3, the supplementary alignment (AA3) is performed before the cut (CT3). In other words, after the cutting (CT2) is completed in the cutting table 4B, the supplementary alignment (AA3) is performed in the cutting table 4A. The complementary alignment (AA3) is performed using the slit detecting camera 13 integrally provided on the spindle unit 10B (refer to FIG. 1). By using the slit detecting camera 13 for the complementary alignment (AA3), the offset amount of the cutting lines 25S and 25L is corrected immediately before the cutting (CT3).
藉由進行補充對準(AA3)，能夠檢測出在即將進行切斷(CT3)之前的對準標記24的座標位置，並利用該座標位置資料來修正從預對準(PA3)時刻開始的偏移量。因此，即使因切削水和冷卻水的影響而封裝基板3處於收縮的狀態，也能夠根據藉由預對準(PA3)設定的切斷線25S、25L，在即將切斷封裝基板3之前修正切斷線25S、25L的偏移量。等 待時間(WT3)越長，本發明的效果越顯著。 By performing the complementary alignment (AA3), it is possible to detect the coordinate position of the alignment mark 24 immediately before the cutting (CT3), and use the coordinate position data to correct the deviation from the pre-alignment (PA3) time. Transfer amount. Therefore, even if the package substrate 3 is in a contracted state due to the influence of the cutting water and the cooling water, the cutting lines 25S and 25L set by the pre-alignment (PA3) can be corrected before the package substrate 3 is cut. The offset of the broken line 25S, 25L. Wait The longer the waiting time (WT3), the more remarkable the effect of the present invention.
如此，在切斷用工作臺4A、4B中即將切斷封裝基板3之前，進行補充對準(AA)，從而修正收縮的封裝基板3的切斷線25S、25L的位置之後，能夠沿修正的切斷線25S、25L進行切斷。 In this manner, the complementary alignment (AA) is performed immediately before the cutting of the package substrate 3 in the cutting stages 4A and 4B, and the positions of the cut lines 25S and 25L of the shrinkable package substrate 3 are corrected. The cutting lines 25S and 25L are cut.
圖4表示預對準時刻及即將進行切斷之前的補充對準時刻的對準狀態。圖4的(a)是從基板側觀察預對準時刻的封裝基板3的俯視圖，圖4的(b)是從基板側觀察即將進行切斷之前的補充對準時刻的封裝基板3的俯視圖。即將進行切斷之前的封裝基板3因均沿長度方向和寬度方向進行收縮而變小。在圖4中，對切斷用工作臺4A上放置的封裝基板3的寬度方向上的切斷線25S進行設定及修正的情況進行說明。 Fig. 4 shows the alignment state at the pre-alignment timing and the replenishment alignment timing immediately before the cutting. (a) of FIG. 4 is a plan view of the package substrate 3 when the pre-alignment timing is observed from the substrate side, and (b) of FIG. 4 is a plan view of the package substrate 3 when the complementary alignment timing immediately before the cutting is observed from the substrate side. The package substrate 3 immediately before the cutting is reduced by shrinking in both the longitudinal direction and the width direction. In FIG. 4, a case where the cutting line 25S in the width direction of the package substrate 3 placed on the cutting table 4A is set and corrected will be described.
圖4的(a)表示使用設置在基板放置部6(參照圖1)上的對準用照相機9來進行對準的狀態。例如，表示藉由檢測十個設置在封裝基板3的植球面3a上的對準標記24來測定其座標位置的情況。如圖1所示，對準用照相機僅能夠沿X方向移動。關於Y方向，可藉由移動切斷用工作臺4A，從而使照相機9沿Y方向相對移動。如此，藉由使照相機9沿X方向移動，並且使切斷用工作臺4A沿Y方向移動，檢測出設置在封裝基板3的植球面3a上的對準標記24，測定座標位置。照相機9僅能夠沿X方向移動，藉由使用線性尺規而測定對準標記24距基準點的X座標。以下，將十個對準標記24分別稱作對準標記24-1、24-2、24-3、…、24-10。 (a) of FIG. 4 shows a state in which alignment is performed using the alignment camera 9 provided on the substrate placement portion 6 (see FIG. 1). For example, it is indicated that the coordinate position is measured by detecting ten alignment marks 24 provided on the ball-forming surface 3a of the package substrate 3. As shown in Fig. 1, the alignment camera can only move in the X direction. Regarding the Y direction, the camera 9 can be relatively moved in the Y direction by moving the cutting table 4A. As described above, by moving the camera 9 in the X direction and moving the cutting table 4A in the Y direction, the alignment mark 24 provided on the ball-forming surface 3a of the package substrate 3 is detected, and the coordinate position is measured. The camera 9 is only movable in the X direction, and the X coordinate of the alignment mark 24 from the reference point is measured by using a linear ruler. Hereinafter, ten alignment marks 24 are referred to as alignment marks 24-1, 24-2, 24-3, ..., 24-10, respectively.
按對準標記24-1、24-2、24-3、…、24-10的順序檢測出各十個對準標記，兩點測定長度方向上的各位置A、B、C、D、E的X座標X1A、X2B、X1C、X1D、X1E。首先，使對準用照相機9沿X方向移動，測定對 準標記24-1的X座標X1A。其次，使切斷用工作臺4A沿Y方向移動，測定對準標記24-2的X座標X1A。其次，使照相機9沿X方向移動，測定對準標記24-3的X座標X1B。其次，使切斷用工作臺4A沿Y方向移動，測定對準標記24-4的X座標X1B。如此，直至對準標記24-10，測量十個點的X座標。 Each of the ten alignment marks is detected in the order of the alignment marks 24-1, 24-2, 24-3, ..., 24-10, and the two points in the longitudinal direction are measured at positions A, B, C, D, and E. The X coordinates X1A, X2B, X1C, X1D, X1E. First, the alignment camera 9 is moved in the X direction, and the pair is measured. The X coordinate X1A of the mark 24-1. Next, the cutting table 4A is moved in the Y direction, and the X coordinate X1A of the alignment mark 24-2 is measured. Next, the camera 9 is moved in the X direction, and the X coordinate X1B of the alignment mark 24-3 is measured. Next, the cutting table 4A is moved in the Y direction, and the X coordinate X1B of the alignment mark 24-4 is measured. Thus, up to the alignment mark 24-10, the X coordinate of ten points is measured.
關於封裝基板3的長度方向的各位置A~E，兩點測定對準標記24的X座標。藉由將所測定的兩點的X座標平均化來求出各位置A~E的X座標。根據平均化的X座標及各對準標記24之間距離，分別設定沿寬度方向進行切斷的虛擬的各切斷線25S的X座標的位置。 Regarding each position A to E in the longitudinal direction of the package substrate 3, the X coordinates of the alignment mark 24 are measured at two points. The X coordinate of each position A to E is obtained by averaging the measured X coordinates of the two points. The position of the X coordinate of each of the virtual cutting lines 25S that are cut in the width direction is set based on the averaged X coordinate and the distance between the alignment marks 24.
圖4的(b)表示在基板切斷部7(參照圖1)中，使用設置在心軸單元10B上的切口檢測用照相機13，對即將進行切斷之前的收縮的封裝基板3進行對準的狀態。照相機13僅能夠沿X方向移動。此時，使照相機13沿X方向移動，測定A、E位置上的對準標記24-2、24-10的X座標(X2A、X2E)。 (b) of FIG. 4 shows the use of the slit detecting camera 13 provided on the spindle unit 10B in the substrate cutting unit 7 (see FIG. 1) to align the package substrate 3 that is shrinking immediately before the cutting. status. The camera 13 is only movable in the X direction. At this time, the camera 13 is moved in the X direction, and the X coordinates (X2A, X2E) of the alignment marks 24-2 and 24-10 at the A and E positions are measured.
對於在預對準時刻中所測定的X座標和在即將進行切斷之前所測定的X座標進行比較來計算收縮的量。根據計算的收縮量，修正沿寬度方向的各切斷線25S的X座標。如此，即使在封裝基板3收縮的狀態下，也能夠準確地修正切斷寬度方向的各切斷線25S。 The amount of contraction was calculated by comparing the X coordinate measured at the pre-alignment time with the X coordinate measured immediately before the cut. The X coordinate of each cutting line 25S in the width direction is corrected based on the calculated contraction amount. In this manner, even in a state where the package substrate 3 is shrunk, each of the cutting lines 25S in the cutting width direction can be accurately corrected.
在本實施例中，為了設定及修正寬度方向上的切斷線25S的位置，在對準時刻中測定十個對準標記24-1、24-2、24-3、…、24-10的X座標，並且在即將進行切斷之前的補充對準時刻中測定兩個對準標記24-2、24-10的X座標。不限於此，在按照產品希望進一步提高精度的情況下，還 可以藉由測定更多數量的對準標記24來設定及修正寬度方向的切斷線25S的位置。 In the present embodiment, in order to set and correct the position of the cutting line 25S in the width direction, ten alignment marks 24-1, 24-2, 24-3, ..., 24-10 are measured in the alignment timing. The X coordinate, and the X coordinates of the two alignment marks 24-2, 24-10 are measured in the complementary alignment time immediately before the cutting. Not limited to this, in the case of further improvement in accuracy according to the product, The position of the cutting line 25S in the width direction can be set and corrected by measuring a larger number of alignment marks 24.
同樣，對沿長度方向切斷的各切斷線25L(參照圖2)進行修正。如此，根據本發明，能夠在即將進行切斷之前對切斷線25S、25L進行修正來切斷因切削水和冷卻水的影響而進行熱變形(進行收縮)的封裝基板3。由此，能夠防止電子零件P的損壞和劣化。 Similarly, each cutting line 25L (see FIG. 2) cut along the longitudinal direction is corrected. As described above, according to the present invention, the cutting wires 25S and 25L can be corrected immediately before the cutting, and the package substrate 3 which is thermally deformed (contracted) by the influence of the cutting water and the cooling water can be cut. Thereby, damage and deterioration of the electronic component P can be prevented.
圖5表示封裝基板3的變形例。分別表示為：圖5(a)是從基板側觀察封裝基板3的俯視圖，圖5(b)是前視圖。封裝基板3由基板部22和分割成四個塊單位的封裝樹脂部27構成。在基板部22與封裝樹脂部27的線膨脹係數之差大的情況下，藉由將封裝樹脂部27分割成四個塊單位，能夠抑制起因於硬化樹脂進行硬化時的收縮的封裝樹脂部27的彎曲。此外，在使用Cu(銅合金)作為引線框時，由於Cu的線膨脹係數大，因此將封裝樹脂部27分割成複數個塊單位是對彎曲的減少有效的。能夠藉由抑制封裝基板3的彎曲而提高對準精度。 FIG. 5 shows a modification of the package substrate 3. Fig. 5(a) is a plan view of the package substrate 3 as seen from the substrate side, and Fig. 5(b) is a front view. The package substrate 3 is composed of a substrate portion 22 and an encapsulating resin portion 27 that is divided into four block units. When the difference between the linear expansion coefficients of the substrate portion 22 and the encapsulating resin portion 27 is large, the encapsulating resin portion 27 is divided into four block units, whereby the encapsulating resin portion 27 which is caused by the shrinkage of the cured resin during curing can be suppressed. Bending. Further, when Cu (copper alloy) is used as the lead frame, since Cu has a large coefficient of linear expansion, dividing the encapsulating resin portion 27 into a plurality of block units is effective for reducing the bending. The alignment accuracy can be improved by suppressing the bending of the package substrate 3.
若在基板部22使用線膨脹係數大的材料，則因切削水和冷卻水的影響而進行熱變形的量(收縮量)變大。若收縮量變大，則封裝基板3上的切斷線25S、25L的偏移量也變大。因此，在即將進行切斷之前修正切斷線25S、25L的位置後進行切斷的方法變得更重要。根據本發明，即使使用線膨脹係數大的材料作為基板材料，也能夠在即將進行切斷之前修正切斷線25S、25L的偏移量，因此即使在收縮的狀態下也能夠沿應切斷的準確的切斷線25S、25L進行切斷。 When a material having a large coefficient of linear expansion is used in the substrate portion 22, the amount of thermal deformation (shrinkage amount) due to the influence of the cutting water and the cooling water is increased. When the amount of shrinkage increases, the amount of shift of the cutting lines 25S and 25L on the package substrate 3 also increases. Therefore, the method of correcting the position of the cutting lines 25S and 25L immediately before the cutting is performed is more important. According to the present invention, even if a material having a large coefficient of linear expansion is used as the substrate material, the amount of shift of the cutting lines 25S and 25L can be corrected immediately before the cutting, so that the cutting can be performed even in the contracted state. The cutting lines 25S and 25L are cut off accurately.
如上前述，在雙工位元臺方式的切斷裝置1中，在一個切斷 機構完成切斷之前，在另一個切斷機構中產生等待時間。在該等待時間期間，藉由對被切削水和冷卻水冷卻的切斷用工作臺4A、4B和切斷用載物臺5A、5B的熱傳導來冷卻封裝基板3。受到該影響，在等待期間封裝基板3受到熱變形而進行收縮。因此，在預對準時刻中所設定的封裝基板3的虛擬的切斷線25S、25L的位置上產生偏移。 As described above, in the cutting device 1 of the duplex position mode, in one cutoff Waiting time is generated in another shut-off mechanism before the mechanism completes the cut. During the waiting period, the package substrate 3 is cooled by heat conduction between the cutting stages 4A and 4B and the cutting stages 5A and 5B which are cooled by the water to be cut and the cooling water. Due to this influence, the package substrate 3 is thermally deformed and contracted during the waiting period. Therefore, the position of the virtual cut lines 25S and 25L of the package substrate 3 set in the pre-alignment timing is shifted.
根據本發明，藉由使用一體化地設置在心軸單元10B上的切口檢測用照相機13，在即將切斷封裝基板3之前檢測出預對準標記24並測定其座標位置。由此，確認即將進行切斷之前的封裝基板3的切斷線24S、25L的位置。亦即，在預對準時刻和在即將進行切斷之前，確認預對準標記24的座標位置。因此，即使在從預對準時刻至開始對封裝基板3進行切斷的等待時間中封裝基板3進行收縮的情況下，也能夠藉由對預對準時刻的切斷線25S、25L的位置和即將進行切斷之前的切斷線25S、25L的位置進行比較來修正從預對準時刻開始的偏移量。即使在封裝基板3因切削水和冷卻水的影響而進行收縮的狀態下，也能夠在即將進行切斷之前修正應切斷的準確的切斷線25S、25L的位置之後進行切斷，從而能夠防止電子零件P的損壞和劣化。 According to the present invention, by using the slit detecting camera 13 integrally provided on the spindle unit 10B, the pre-alignment mark 24 is detected and the coordinate position is measured immediately before the package substrate 3 is cut. Thereby, the position of the cutting lines 24S and 25L of the package substrate 3 immediately before the cutting is confirmed. That is, the coordinate position of the pre-alignment mark 24 is confirmed at the pre-alignment timing and immediately before the cutting. Therefore, even when the package substrate 3 is shrunk in the waiting time from the pre-alignment time to the start of the cutting of the package substrate 3, the position of the cutting lines 25S and 25L at the pre-alignment timing can be The positions of the cutting lines 25S and 25L immediately before the cutting are compared to correct the amount of shift from the pre-alignment time. Even in a state where the package substrate 3 is shrunk by the influence of the cutting water and the cooling water, the position of the accurate cutting lines 25S and 25L to be cut can be corrected immediately before the cutting, and then the cutting can be performed. Prevent damage and deterioration of the electronic component P.
近年來，由於封裝基板3的大型化越來越發展，從一片封裝基板3中取出的電子零件P的數量也增多，因此切斷線的總體長度也在增加。由此，特別是在雙工位元臺方式的切斷裝置中，切斷一片封裝基板3所需的時間也在增加。因此，具有等待時間也增加的傾向。對這種狀況來說，重點在於準確把握藉由從預對準時刻至即將進行切斷之前生成的熱變形而產生的切斷線的偏移量。因此，如本發明，在即將進行切斷之前進行 對準來修正切斷線25S、25L的偏移量之後切斷封裝基板3的方法為非常有效的方法。 In recent years, as the size of the package substrate 3 has increased, the number of electronic parts P taken out from one package substrate 3 has also increased, and thus the overall length of the cut line has also increased. Thus, in particular, in the cutting device of the duplex position system, the time required to cut one package substrate 3 is also increased. Therefore, there is a tendency to increase the waiting time. In this case, the focus is on accurately grasping the amount of shift of the cutting line caused by the thermal deformation generated from the pre-alignment time to the time immediately before the cutting. Therefore, as in the present invention, it is performed immediately before the cutting is performed. A method of correcting the offset amount of the cutting lines 25S and 25L and then cutting the package substrate 3 is a very effective method.
此外，在本實施例中，使用設置在心軸單元10B上的切口檢測用照相機13，在即將進行切斷之前檢測出對準標記24並測定座標位置。不限於此，還可以使用預對準時刻中所使用的對準用照相機9，在即將進行切斷之前檢測出對準標記24。 Further, in the present embodiment, the slit detecting camera 13 provided on the spindle unit 10B is used to detect the alignment mark 24 and measure the coordinate position immediately before the cutting. Not limited to this, it is also possible to use the alignment camera 9 used in the pre-alignment time to detect the alignment mark 24 immediately before the cutting.
此外，即使生成主體框架的應變等經時變化，以使切口檢測用照相機13的安裝位置變化，也能夠調節切口檢測用照相機13的拍攝位置，以便拍攝心軸單元10B的旋轉刃11B所切斷的切斷線25上。因此，能夠藉由測定對準標記24的正確的座標位置來切斷封裝基板3。 In addition, even if the strain or the like of the main body frame is changed over time, the mounting position of the slit detecting camera 13 can be adjusted, and the shooting position of the slit detecting camera 13 can be adjusted so that the rotating blade 11B of the spindle unit 10B can be cut. The cutting line 25 is on. Therefore, the package substrate 3 can be cut by measuring the correct coordinate position of the alignment mark 24.
此外，本發明並不限於具有兩個切斷用工作臺的雙工位元臺方式的切斷裝置1，還可以適用於具有一個切斷用工作臺的單工位元臺方式的切斷裝置。 Further, the present invention is not limited to the cutting device 1 of the duplex station type having two cutting tables, and is also applicable to a cutting device of a single-station system having one cutting table. .
作為被切斷物，除封裝基板3以外還可以使用半導體晶圓。由於半導體晶圓的各區域中融入有電子電路，因此相當於切斷後的各區域的部分(半導體晶片)為電子零件P。 As the object to be cut, a semiconductor wafer can be used in addition to the package substrate 3. Since the electronic circuit is incorporated in each region of the semiconductor wafer, the portion (semiconductor wafer) corresponding to each of the cut regions is the electronic component P.
根據本發明，能夠在即將進行切斷之前修正在預對準時刻的切斷線的位置。因此，本發明對成品率的提高、可靠性的提高和生產率的提高作出巨大貢獻，是工業上價值非常高的裝置。 According to the present invention, the position of the cutting line at the pre-alignment timing can be corrected immediately before the cutting. Therefore, the present invention contributes greatly to improvement in yield, improvement in reliability, and improvement in productivity, and is an industrially highly valuable device.
此外，本發明並不限於前述的實施例，在不脫離本發明的主旨範圍內，能夠按照需要，任意並且適當組合而進行變更，或選擇性地採用。 Further, the present invention is not limited to the embodiments described above, and may be modified arbitrarily or appropriately combined as needed, or may be selectively employed, without departing from the spirit and scope of the invention.
1‧‧‧切斷裝置 1‧‧‧cutting device
2‧‧‧前置載物臺 2‧‧‧Pre-stage
3‧‧‧封裝基板(被切斷物、第一被切斷物、第二被切斷物) 3‧‧‧Package substrate (cut object, first object to be cut, second object to be cut)
4A、4B‧‧‧切斷用工作臺 4A, 4B‧‧‧Working table for cutting
5A、5B‧‧‧切斷用載物臺(載物臺、第一載物臺、第二載物臺) 5A, 5B‧‧‧Slipping stage (stage, first stage, second stage)
6‧‧‧基板放置部 6‧‧‧Substrate placement
7‧‧‧基板切斷部 7‧‧‧Substrate cutting section
8‧‧‧基板清洗部 8‧‧‧Substrate Cleaning Department
9‧‧‧對準用照相機(第一攝像機構) 9‧‧‧Alignment camera (first camera)
10A、10B‧‧‧心軸單元(切斷機構) 10A, 10B‧‧‧ mandrel unit (cutting mechanism)
11A、11B‧‧‧旋轉刃 11A, 11B‧‧‧Rotary blade
12A、12B‧‧‧切削水用噴嘴(噴射機構) 12A, 12B‧‧‧ cutting nozzle for water (jetting mechanism)
13‧‧‧切口檢測用照相機(第二攝像機構) 13‧‧‧Incision detection camera (second camera mechanism)
14‧‧‧由複數個電子零件P構成的集合體 14‧‧‧A collection of multiple electronic parts P
15‧‧‧清洗機構 15‧‧‧ Cleaning institutions
16‧‧‧清洗輥 16‧‧‧cleaning roller
17‧‧‧檢查用載物臺 17‧‧‧Checking the stage
18‧‧‧檢查用照相機 18‧‧‧Check camera
19‧‧‧分度臺 19‧‧‧分台
20‧‧‧移送機構 20‧‧‧Transfer organization
21‧‧‧合格品用托盤 21‧‧‧Tray for quality products
A‧‧‧接收單元 A‧‧‧ receiving unit
B‧‧‧切斷單元 B‧‧‧cutting unit
C‧‧‧清洗單元 C‧‧‧cleaning unit
D‧‧‧檢查單元 D‧‧‧Check unit
E‧‧‧收容單元 E‧‧‧ containment unit
CTL‧‧‧控制部 CTL‧‧‧Control Department
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| JP6339514B2 (en) * | 2015-03-25 | 2018-06-06 | Ｔｏｗａ株式会社 | Cutting apparatus and cutting method |
| JP2016213240A (en) * | 2015-04-30 | 2016-12-15 | Ｔｏｗａ株式会社 | Manufacturing device and manufacturing method |
| JP2016219520A (en) * | 2015-05-18 | 2016-12-22 | Ｔｏｗａ株式会社 | Semiconductor device and manufacturing method of the same |
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| JP6598811B2 (en) * | 2017-03-23 | 2019-10-30 | Ｔｏｗａ株式会社 | Semiconductor package placement apparatus, manufacturing apparatus, semiconductor package placement method, and electronic component manufacturing method |
| KR102123477B1 (en) | 2018-02-28 | 2020-06-16 | 공주대학교 산학협력단 | Spindle Monitoring System Using Laser Sensor |
| JP7150401B2 (en) * | 2018-11-20 | 2022-10-11 | 株式会社ディスコ | Workpiece processing method |
| JP6746756B1 (en) * | 2019-05-24 | 2020-08-26 | Ｔｏｗａ株式会社 | Suction plate, cutting device and cutting method |
| JP7377092B2 (en) * | 2019-12-16 | 2023-11-09 | Ｔｏｗａ株式会社 | Statistical data generation method, cutting device and system |
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