WO2011139061A2

WO2011139061A2 - Method for aligning semiconductor materials

Info

Publication number: WO2011139061A2
Application number: PCT/KR2011/003268
Authority: WO
Inventors: 이경식; 고영일; 정현권
Original assignee: 한미반도체 주식회사
Priority date: 2010-05-04
Filing date: 2011-05-02
Publication date: 2011-11-10
Also published as: TWI543294B; PT2011139061W; WO2011139061A3; CN102934216A; CN102934216B; SG185017A1; TW201203439A

Abstract

The present invention relates to a method which enables the positions of semiconductor materials to be accurately aligned so as to accurately transfer the semiconductor materials to processing positions in an apparatus for manufacturing a semiconductor package. According to the present invention, a wafer-processing apparatus, such as a singulation apparatus or the like that cuts a wafer-type material, in which a plurality of semiconductor packages is arranged into a lattice, into individual semiconductor package units, achieves a novel alignment system in that the alignment relationship between the center of a dowel hole and the center of a semiconductor package is photographed by means of a vision camera, and the positions of the materials in the X-Y-è directions are accurately aligned so as to accurately transfer the materials to the processing positions. Therefore, the wafer-processing apparatus can be actively used in a novel aligning method such as wafer-level packaging or the like. Particularly, the present invention relates to a method for aligning semiconductor materials, which can avoid the influence of errors caused by the vibration of equipment, etc., and ensure accurate measurement values in order to accurately align the materials.

Description

Semiconductor Material Sorting Method

The present invention relates to a method for aligning the position of a semiconductor material, and more particularly, to a method for accurately aligning a position of a semiconductor material in order to accurately send the semiconductor material to a process position in an apparatus for manufacturing a semiconductor package.

In general, a semiconductor package attaches a plurality of semiconductor packages having high integrated circuits such as transistors and capacitors to a rectangular plate-shaped lead frame, and connects them to the pads of the lead frame through a wire bonding process, and then molding them into resin paper. Next, the semiconductor package on the lead frame is cut and individualized by a package unit through a singulation process.

Recently, as the types of semiconductor packages have been diversified, new packaging technologies have been developed for manufacturing semiconductor packages by manufacturing semiconductor packages on wafers and then singulating each semiconductor package into individual package units.

In general, in a singulation device, a material in which semiconductor packages are formed is placed on a chuck table, and then the cutting blade and the chuck table move relative to each other to cut the material into individual package units. The cutting operation is performed without passing through the chuck table while passing through the blade escape groove formed to coincide with the cutting line.

However, when the material to be cut is circular, such as a wafer level package, it is difficult to accurately match the cutting line of the material with the blade escape groove on the chuck table, which causes the singulation device to transfer the material to the cutting process position. When seated on a cutting chuck table, it is very likely that the material will not seat correctly on the chuck table.

If the material is not accurately seated on the cutting chuck table, the cutting line of the material and the blade escape groove on the chuck table do not coincide exactly. Accordingly, the cutting blade blades collide with the upper surface of the chuck table during the cutting operation. There is a problem that the cutting blade or the chuck table is damaged.

In addition, there is a problem that the semiconductor package is all poorly processed because the material is not cut along the cutting line formed in the lattice shape of the material, thereby increasing the cost and significantly lowering the productivity.

Therefore, the process of accurately aligning the position of the material prior to transferring the material such as the wafer level package to the cutting process position must be accompanied.

Accordingly, the present invention has been made in view of the above, and in the wafer processing apparatus such as a singulation device for cutting a wafer type material in which a plurality of semiconductor packages are arranged in a lattice form into individual semiconductor package units, New materials such as wafer-level packages are implemented by implementing a new alignment method that allows the alignment of the center of the dowel hole and the center of the semiconductor package to be accurately transported to the process location using a vision camera. The purpose of the present invention is to provide a semiconductor material sorting method that can be used to align the material, and in particular, to exclude the influence of the error caused by the shaking of the equipment and to ensure accurate measurement value to align the position of the material accurately.

In order to achieve the above object, a semiconductor material alignment method provided in an embodiment of the present invention comprises the steps of: seating the semiconductor material on the alignment table; By the relative motion between the vision camera and the alignment table, the vision camera photographs an arbitrary region of the semiconductor material and measures the tilted angle α of the grid pattern formed in the semiconductor material with respect to the reference coordinate. Making; Based on the measured rotation angle, the alignment table is rotated at a predetermined angle β (where β = −α + N × 90 ° or β = 90 ° −α + N × 90 °; N is an integer). step; The vision camera and the alignment table are provided such that a reference point such as a dowel hole or the like formed in the base on which the alignment table is installed and a predetermined point of the semiconductor material simultaneously enter the field of view (FOV) of the vision camera. Moving relative to detect position information between the reference point and a predetermined point of the semiconductor material; Calculating a position correction value of the semiconductor material from the detected position information; And correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the calculated position correction value.

Here, in the step of detecting a position between the reference point and a predetermined point of the semiconductor material, at least two pairs of reference points and opposite predetermined points of the semiconductor material formed on the basis of the semiconductor material Each may be implemented, and the vision camera may move relative to the alignment table, the alignment table may move relative to the vision camera, or both may move relative to each other.

In addition, the vision camera is movable only in one axis (X axis or Y axis) direction of the reference coordinate, and the movement distance in the other axis (Y axis or X axis) direction of the alignment table is 1 compared to the diameter of the semiconductor material. Less than / 2, between steps (c) and (d),

Rotating the alignment table at a predetermined angle, for example, 180 °, such that at least two reference marks formed on the semiconductor material are located within the imageable area of the vision camera; Detecting, by the vision camera, first positions of the at least two reference marks, respectively; Rotating the alignment table at a predetermined angle; Detecting, by the vision camera, a second position with respect to at least one reference mark of the at least two reference marks, respectively; Calculating a position correction value of the semiconductor material based on the detected positional information on the reference mark of the semiconductor material; The method may further include correcting a position of the semiconductor material by horizontally or rotating the alignment table according to the position correction value.

In addition, after the rotating of the alignment table by a predetermined angle β, the vision camera may move the semiconductor material in one axis (X-axis or Y-axis) direction of the reference coordinate by the relative motion of the vision camera and the alignment table. Located at the outer periphery, and further comprising the step of detecting the notch formed in the outer periphery of the semiconductor material by rotating the semiconductor material by 90 °, and the vision camera by the relative motion of the vision camera and the alignment table The method may further include detecting a notch formed at an outer circumferential edge of the semiconductor material in one axis (X or Y axis) direction of the reference coordinate, and rotating the semiconductor material by 90 °. .

And rotating the alignment table by a predetermined angle β and detecting positional information between the reference point and a predetermined point of the semiconductor material by the relative motion between the alignment table and the vision camera. Detecting position information of at least two reference marks formed on the substrate; Calculating a position correction value of the semiconductor material based on the positional information on at least two reference marks of the detected semiconductor material; The method may further include correcting a position of the semiconductor material by horizontally or rotating the alignment table according to the position correction value.

In addition, the predetermined point on the semiconductor material may be set to a semiconductor package that enters a field of view (FOV) of the vision camera together with the reference point among a plurality of semiconductor packages formed on the semiconductor material.

On the other hand, the semiconductor material alignment method provided in another embodiment of the present invention to achieve the above object comprises the steps of seating the semiconductor material on the alignment table; Detecting the notch formed at the outer periphery of the semiconductor material while rotating the semiconductor material after the vision camera is positioned at the outer periphery of the semiconductor material by the relative motion of the vision camera and the alignment table; The vision camera and the alignment table are moved relative to each other such that a reference point formed on the base on which the alignment table is installed and a predetermined point of the semiconductor material simultaneously enter a field of view (FOV) of the vision camera. Detecting position information between the reference point and a predetermined point of the semiconductor material; Calculating a position correction value of the semiconductor material from the detected position information; And correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the calculated position correction value.

In addition, the vision camera is movable only in one axis (X axis or Y axis) direction of the reference coordinate, and the movement distance in the other axis (Y axis or X axis) direction of the alignment table is 1 compared to the diameter of the semiconductor material. Less than / 2, between the steps (c) and (d), rotating the alignment table at a predetermined angle so that the reference mark formed on the semiconductor material is located within the imageable area of the vision camera. ; Detecting, by the vision camera, a first position with respect to the reference mark; Rotating the alignment table at a predetermined angle; Detecting, by the vision camera, a second position with respect to the reference mark and a position with respect to at least one reference mark other than the reference mark; Calculating a position correction value of the semiconductor material based on the positional information on the detected reference mark of the semiconductor material; The method may further include correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the position correction value.

The semiconductor material sorting method provided by the present invention has the following advantages.

First, the vision camera can easily detect the reference mark position of a material for a new type of material, for example, a wafer level package in which the reference mark is formed at a position off the center line of the material. It can be used to align the new type of materials by accurately detecting the seating position of the material and aligning the correct position of the material based on the detected seating position of the material.

Second, the relationship between the fixed reference point position such as the dowel hole and the center point position of the semiconductor package in the material is taken once or twice with a vision camera, and the position is corrected by measuring the alignment position value of the material with only a minimum number of shots. This allows you to more accurately align the position of the material based on accurate measurement values, such as minimizing the occurrence of errors caused by camera shake due to equipment shake (shooting position). have.

1 is a plan view schematically showing a configuration of a part of a semiconductor material singulation apparatus to which a semiconductor material alignment method according to the present invention is applied;

2 to 9 are plan views sequentially illustrating a semiconductor material sorting method according to an embodiment of the present invention implemented in the semiconductor material singulation apparatus of FIG. 1.

10 and 11 are plan views illustrating a method of performing secondary correction after semiconductor material alignment according to an embodiment of the present invention implemented in the semiconductor material singulation apparatus of FIG. 1.

12 is a plan view illustrating another example of a semiconductor material alignment method according to an embodiment of the present invention implemented in the semiconductor material singulation device of FIG. 1.

Hereinafter, an embodiment of a semiconductor material alignment method according to the present invention will be described in detail with reference to the accompanying drawings.

First, a configuration of a semiconductor material singulation apparatus will be briefly described as an example of a semiconductor material processing apparatus for performing the semiconductor material alignment method of the present invention with reference to FIG. 1.

The semiconductor material singulation device includes a loading part 10 supplied with circular semiconductor materials W having a plurality of semiconductor packages arranged in a lattice shape in a magazine M, and in the loading part 10. An alignment table 11 on which the exported semiconductor material W is seated and aligned, a transport robot 12 for conveying the semiconductor material W from the loading unit 10 onto the alignment table 11, The cutting processing unit 13 in which the semiconductor material W conveyed from the alignment table 11 is cut into individual package units, and the semiconductor material W is vacuum-adsorbed in the alignment table 11 to cut the processing unit ( 13 is a unit picker which vacuum-adsorbs the strip picker 14 and the semiconductor package on the cutting process unit 13 to the brush cleaning unit 15, the cleaning unit 16, and the vision inspection unit (not shown). 17) and the like.

The operation of each of these components is controlled by a controller (not shown) of the semiconductor material singulation device.

Above the alignment table 11, the vision camera 18 which photographs the semiconductor material W on the alignment table 11 and detects a position is provided.

Here, the vision camera 18 is fixed to one side of the strip picker 14 is configured to move with the strip picker 14, otherwise the vision camera 18 is independent of the strip picker 14 X axis It may also be configured to move along a direction.

The cutting processing unit 13 includes a chuck table 19 on which the semiconductor material W is seated, and a cutting blade 20 for cutting the semiconductor material W on the chuck table 19 while moving relative to the chuck table 19. It consists of

On the upper surface of the chuck table 19, the blade escape groove 21 so that the blade end of the cutting blade 20 can be received while being in non-contact at a position corresponding to a package cutting line formed in a lattice shape on the semiconductor material (W). ) Is formed.

Accordingly, when the cutting blade 20 cuts the semiconductor material W on the chuck table 19 along the cutting line while the cutting blade 20 and the chuck table 19 move relative to each other, the cutting blade 20 of the cutting blade 20 The semiconductor material W is cut without the blade tip contacting the chuck table 19 while passing through the blade escape groove 21.

On the other hand, the semiconductor material alignment method of the present invention is carried out on the alignment table 11, the alignment table 11 at this time is XY capable of rotation in the θ direction around the X axis and Y axis direction and the vertical axis XY-θ stage (not shown) installed on the -θ stage (not shown) to correct the position of the semiconductor material W seated on the alignment table 11, and moving the alignment table 11. ) Moves only as much as possible to fine-tune the position of the semiconductor material W within a range that does not increase the overall size of the device.

In particular, the present invention provides a method of accurately aligning the semiconductor material (W) by minimizing the influence of the error due to the vibration of the equipment.

10 and 11, when the semiconductor material W is seated on the alignment table 11, the vision camera 18 moves in the X-axis direction so that the semiconductor material W The lattice pattern formed in the semiconductor material W is confirmed on one side upper part, for example, above the center portion, and the degree of rotation of the pattern is measured.

Here, the lattice pattern formed on the semiconductor material means a cutting line through which a blade passes or a laser is irradiated to singulate the semiconductor material into individual semiconductor packages.

In addition, when the tilted angle with respect to the reference coordinate of the grid pattern formed in the semiconductor material is ± α, a predetermined angle at which the alignment table should be rotated so that the grid pattern of the semiconductor material is parallel to the reference coordinate. (β) is β = (N × 90 °) − (± α) or β = (90 °-(± α)) + (N × 90 °). Where N is an integer

Subsequently, based on the information of the semiconductor material W stored in the controller, the alignment table 11 is rotated by an angle in the θ direction to adjust the perpendicularity of the semiconductor material W.

That is, the alignment table 11 is rotated at an angle in the θ direction so that the lattice pattern of the semiconductor material W is aligned with the blade escape groove 21 of the chuck table 19.

Subsequently, the vision camera 18 is moved in the X-axis direction so that the dowel hole 22 fixedly positioned at both sides of the alignment table 11 and the edges of the semiconductor material W adjacent to the dowel hole 22 are positioned. The semiconductor package to be located is photographed to detect the location.

For example, the vision camera 18 is horizontally moved in the X-axis direction to detect the center position of the dowel hole 22 and the center position of any semiconductor package on the semiconductor material W adjacent thereto.

In this case, the semiconductor package refers to a reference semiconductor package to be detected in position, which is set in advance based on the information of the semiconductor material W stored in the controller.

The process of detecting the position of the dowel hole 22 and the position of a predetermined semiconductor package may be performed at least once, and may be performed twice when a more accurate position detection value is required, and in this case, the vision camera 18 photographs the dowel hole 22 and the preset semiconductor package adjacent thereto, and then moves horizontally in the X-axis direction, and then the other dowel hole 22 and the preset semiconductor package adjacent thereto. This can be done by photographing.

In this way, when the center position of the dowel hole 22 and the center position of a predetermined semiconductor package are both detected, the difference between the detected relative position and the target relative position value is calculated. The position correction value of W) can be calculated.

Accordingly, the controller (not shown) calculates a correction value based on the center position of the semiconductor package and the center position of the dowel hole 22 to move the alignment table 11 to the θ direction and / or the X axis direction and / or the Y axis. Direction of the semiconductor material W is corrected so as to coincide with the information on the center positional relationship between the dowel hole 22 stored in the controller and any predetermined semiconductor package.

In this way, since the semiconductor material W can be aligned on the basis of the position detection information photographed using the vision camera 18 once or twice based on the dowel hole 22 having a fixed position, The position of the semiconductor material W can be corrected accurately while minimizing the influence of errors caused by the shaking of the equipment.

On the other hand, in the present invention, prior to performing the position alignment process of the semiconductor material (W) as described above to align the position of the semiconductor material (W) based on the reference marks (F ₁ ~ F ₄ ) and the like of the semiconductor material (W). Provide a method.

Hereinafter, another embodiment of the semiconductor material alignment method according to the present invention will be described in detail with reference to FIGS. 2 to 9.

Here, when the semiconductor material W is seated on the alignment table 11 in the loading unit 10 by the transfer robot 12, the alignment table 11 moves in the X-axis direction. While not moving, the notches N (see Fig. 2) and the reference marks F ₁ to F ₄ (see Fig. 2), etc. formed on the edge of the semiconductor material W from the upper side of the alignment table 11 are photographed in a predetermined order. To detect the position of the semiconductor material W, and correct the semiconductor material W to a predetermined reference position based on the detected position so that the semiconductor material W can be picked up at the correct position of the strip picker 14. Sort it.

First, the semiconductor material W is formed in a circular shape, and the notch N serving as a reference point of the semiconductor material W is formed in a concave portion at the outer circumferential edge.

A plurality of reference marks F ₁ to F ₄ are formed at arbitrary positions spaced apart from the center line passing through the notch N of the semiconductor material W by a predetermined distance.

Information on the X-axis direction distance and the Y-axis direction distance from the center of the semiconductor material W to each of the reference marks F ₁ to F ₄ is stored in advance in the controller (not shown).

As shown in FIG. 2, when the semiconductor material W is seated on the alignment table 11, the vision camera 18 moves in the X-axis direction so that the semiconductor material W is located above the central portion of the semiconductor material W. Photograph W) to check the lattice-cutting line formed in the semiconductor material W, and measure how much the lattice form is rotated.

Then, the alignment table 11 is rotated at an angle in the θ direction based on the information of the semiconductor material W stored in the controller so that the cutting line in the form of a lattice of the semiconductor material W is the chuck table 19 ( 1 to the blade escape groove 21 (see FIG. 1).

Subsequently, the vision camera 18 moves in the X-axis direction so that the vision camera 18 is positioned above the one side edge portion (90 degrees clockwise in the drawing) of the semiconductor material W, and rotates by 90 degrees in one direction in this state. The camera 18 detects the notch N formed in one edge of the semiconductor material W. As shown in FIG.

As shown in FIG. 3, when the notch N is positioned below the vision camera 18, the alignment table 11 is rotated clockwise at an angle as shown in FIG. The position of the semiconductor material W is adjusted so that the mark F ₁ and the third reference mark F ₃ are within the photographing area of the vision camera 18, and the first reference mark F ₁ is photographed to photograph the first. The position coordinate with respect to the reference mark F ₁ is detected.

Then, as illustrated in Figure 5, the vision camera 18 is moved in the X-axis direction, the third by recording the position of the reference marks (F ₃₎ the detection of the position information for the third reference mark (F ₃₎ Next, return to the initial position.

At this time, since the vision camera 18 moves horizontally in the X-axis direction, it is known how much the semiconductor material W is distorted in the center line through the position information of the first reference mark F1 and the third reference mark F3. It becomes possible.

Furthermore, in order to further improve the precision, the above sequence may be repeated so that the semiconductor material W coincides with the center line.

That is, the value obtained by moving the vision camera 18 in the X-axis direction and photographing the first reference mark F1 and the third reference mark F3, that is, the semiconductor material W is aligned by the misaligned value in the center line. After the table 11 is rotated at a predetermined angle, the first reference mark F1 and the third reference mark F ₃ are repeatedly photographed to obtain position information, and the first reference mark F1 and After the third reference mark F3 is positioned on the center line, the next step may be performed.

As described above, when the vision camera 18 detects the positions of the _first and third reference marks F ₁ and F ₃ , the first reference mark F ₁ and the third reference mark F _{3 form a} center point. As a reference, the position of the first reference mark F ₁ is detected in order not to be symmetrical with each other or to further improve the accuracy, and then the alignment table 11 is rotated at a predetermined angle to make the third reference mark F ₃ . The next image can be taken to detect the position so that is positioned on the center line.

As described above, when a position with respect to the _first and third reference marks F ₁ and F ₃ is detected, the controller (not shown) has already detected the positions of the detected _first and third reference marks F ₁ and F ₃ . The first position with respect to the center point Ow of the semiconductor material W is detected using the distance information between the inputted _first and third reference marks F ₁ and F ₃ and the center point Ow.

Next, as shown in FIG. 6, the alignment table 11 again rotates 180 degrees counterclockwise so that the third reference mark F ₃ is within the photographing area of the vision camera 18. The second position relative to the mark F ₃ is detected.

Next, also as it illustrated in 7 above, move to the non-back X-axis camera 18 direction by photographing a first reference mark (F _1), and detecting a second position of the first reference mark (F _1).

At this time, the second position coordinates of the center point O _W of the semiconductor material W are detected again by the second position coordinates of the _first and third reference marks F ₁ and F ₃ .

When the first position and the second position with respect to the center point Ow of the semiconductor material W are detected as described above, the position of the rotation center O _T of the alignment table 11 is determined by the difference between the center point O _W positions. It can be detected.

If the center point O _W of the semiconductor material W coincides with the rotation center O _T position of the alignment table 11, the position of the center point O _W is maintained even if the alignment table 11 is rotated 180 degrees. Although not changing, the alignment table 11 is 180 if the center point O _W of the semiconductor material W and the rotational center O _{T of the} alignment table 11 do not coincide and are eccentric as illustrated in FIG. 7. Rotating also changes the position of the center point (O _W ).

Therefore, when the changed center point O _W position of the semiconductor material W is known, the rotation center O _T position of the alignment table 11 can be known.

In this embodiment, in order to increase the accuracy, after the rotation of the alignment table 11 by 180 degrees, the second centers of the _first and third reference marks F ₁ and F ₃ are all detected to rotate the center of rotation O of the alignment table 11. _T ) The position is detected, but the position of the center of rotation O _T of the alignment table 11 can be detected by detecting only one position of the _first and third reference marks F ₁ and F ₃ . .

And, the rotational center (O _T) of the alignment table 11 is the center of rotation according to detecting the position of the (O _T), a jig or a pile (dummy) semiconductor materials, such as the pre-alignment table by using 11 of the After obtaining the information, the controller may store the information and calculate and correct how much the center point O _W of the semiconductor material W is eccentric.

However, since the alignment table 11 mechanically rotates by using a motor or the like, the center of rotation may be changed slightly in use.

Accordingly, as described above, the semiconductor material W is seated on the alignment table 11, the first and third reference marks F ₁ and F ₃ are photographed to detect the first position, and then rotated 180 degrees. Detecting the position of the center of rotation O _T of the alignment table 11 by detecting the second position is more accurate.

Meanwhile, as shown in FIG. 8, when the strip picker 14 vacuum-absorbs the semiconductor material W on the alignment table 11 on both outer sides of the alignment table 11, the strip picker 14. Two dowel holes 22 are fixed to guide the picked holes to the correct pick-up positions, and positioning pins (not shown) are inserted into the dowel holes 22 at both sides of the strip picker 14. It is formed to protrude downward.

Therefore, when the strip picker 14 picks up the semiconductor material W on the alignment table 11, the positioning pins (not shown) of the strip picker 14 are always inserted into the dowel holes 22. In order to pick up and transport the semiconductor material W at the position, in order for the strip picker 14 to pick up the semiconductor material W at the correct position, the center point Ow of the semiconductor material W is the dowel hole 22. What is necessary is just to match the center position in between, ie, the wafer pick-up center position.

As described above, when the center of rotation O _{T of the} alignment table 11 is detected, the center point O _W of the semiconductor material W is based on the center of rotation O _T of the alignment table 11. Since the eccentricity can be known, the substantial amount of rotation of the semiconductor material W according to the amount of rotation of the alignment table 11 can be calculated.

Accordingly, as shown in FIG. 9, the controller (not shown) corrects based on the second detected center point O _W position of the semiconductor material W and the rotation center O _T position of the alignment table 11. After calculating the value, the alignment table 11 is rotated at a predetermined angle, and then moved in the X-axis direction and / or Y-axis direction so that the center point O _W of the semiconductor material W is between the dowel holes 22. The position of the semiconductor material W is corrected to coincide with the center position.

At this time, the rotation angle of the alignment table 11 is previously stored by the controller on the basis of the eccentricity of the rotation center O _T of the alignment table 11 and the center point O _W of the wafer W. The first reference mark F ₁ and the third reference mark F ₃ are rotated to be within the photographing area of the vision camera 18 and the first reference mark F while the vision camera 18 moves in the X-axis direction. ₁ ) and the third reference mark (F ₃ ) is taken to reflect the wrong value in the center line.

As described above, according to the present invention, even if the reference marks F ₁ to F ₄ are formed at positions away from the center line passing through the notches N in the semiconductor material W, the vision camera 18 moves in one direction (X axis direction). While moving, the positions of the reference marks F ₁ to F ₄ can be detected, and the center point O _W of the semiconductor material W and the alignment table (the positions of the reference marks F ₁ to F ₄ ) can be detected. It is possible to accurately correct the position of the semiconductor material (W) by finding the position of the rotation center (O _T ) of 11).

Therefore, the semiconductor material W can be accurately conveyed to a later process position so that a predetermined process can be performed, thereby minimizing the occurrence of defects.

On the other hand, in the present invention, as another embodiment of the alignment method of the semiconductor material (W), each of the wafer material (W) using the vision camera 18 and the strip picker 14 capable of X-axis and Y-axis movement After detecting a position with respect to a reference point, the method of correct | amending the position of the semiconductor material W using the detection information at this time, etc. is provided.

To this end, as illustrated in FIG. 12, first, the vision camera 18 moves to photograph a predetermined area of the semiconductor material W, for example, a material central area, from above and in a lattice form on the semiconductor material W. FIG. After measuring the degree of rotation of the formed pattern, the alignment table 11 is rotated at an angle in the θ direction based on the measurement information at this time to adjust the perpendicularity of the semiconductor material (W).

Next, the vision camera 18 moves to the upper side of the semiconductor material W, and then detects positions of at least two reference marks among the plurality of reference marks while moving horizontally in the X-axis direction and the Y-axis direction. .

For example, while moving the vision camera 18 horizontally freely in the X-axis direction and / or the Y-axis direction, the first reference mark F ₁ is photographed to position the first reference mark F ₁ . The coordinates are detected, and the third reference mark F ₃ is photographed to detect the position coordinates with respect to the third reference mark F ₃ .

When the positions of the first and third reference marks F ₁ and F ₃ are detected as described above, the controller (not shown) is already inputted with the positions of the detected _first and third reference marks F ₁ and F ₃ . the reference marks 1, 3 (F _1, F ₃₎ and the center point in using the distance information and the like between _(W O) and detects the position of the center point of the semiconductor material _(W) (O W).

Next, the position correction value of the semiconductor material W is calculated based on the positional information on the reference marks of the semiconductor material W detected as described above, for example, the first and third reference marks F ₁ and F ₃ . A step of correcting the position of the semiconductor material is performed by horizontally or rotating the alignment table 11.

In this way, the semiconductor material (W) can be accurately conveyed to a later process position in a state in which the semiconductor material (W) is precisely aligned, and thus, a predetermined process can be performed, thereby minimizing occurrence of process defects.

Although the above-described embodiments illustrate a method of aligning the semiconductor material W in a singulation device for cutting the semiconductor material W into individual package units, the semiconductor material sorting method of the present invention may be used in various kinds in addition to the semiconductor material singulation device. Of course, the same or similar may be applied to any wafer processing apparatus that handles the wafers.

In addition, even if the alignment method according to the present invention is implemented by using a jig of a shape corresponding to the semiconductor material, it will be clear that it belongs to the technical scope of the present invention. Such a jig is formed in correspondence with the semiconductor material in size, and a lattice pattern, a reference mark and / or a notch may be formed. The jig is nothing more than a kind of dummy semiconductor material, and the jig is the same as or equivalent to the semiconductor material and is widely used in the art in the art.

(Explanation of the sign)

10: loading unit, 11: alignment table

12: conveying robot, 13: cutting processing part

14: strip picker, 15: brush cleaning unit

16: cleaning unit, 17: unit picker

18: vision camera, 19: chuck table

20: cutting blade, 21: blade escape groove

22: Dowel Hall

W: semiconductor material, N: notch

F ₁ to F ₄ : Reference mark, O _W : Center point of semiconductor material

O _T : Center of rotation of the alignment table

Claims

(a) seating the semiconductor material onto the alignment table;
(b) the relative angle between the vision camera and the alignment table, wherein the vision camera photographs an arbitrary region of the semiconductor material and the tilted angle of the lattice pattern formed on the semiconductor material with respect to the reference coordinate Measuring);
(c) rotating the alignment table at a predetermined angle based on the measured rotation angle;
(d) The vision camera and the alignment table are arranged so that the reference point formed on the base on which the alignment table is installed and the predetermined point of the semiconductor material simultaneously enter the field of view (FOV) of the vision camera. Moving to detect location information between the reference point and a predetermined point of the semiconductor material;
(e) calculating a position correction value of the semiconductor material from the detected position information;
(f) correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the calculated position correction value;
Semiconductor material sorting method comprising a.
The method according to claim 1,
and (d) is performed for at least two pairs of reference points formed on opposite sides of the semiconductor material and predetermined points of the semiconductor material, respectively.
The method according to claim 1,
step (d) wherein the vision camera moves relative to the alignment table, the alignment table moves relative to the vision camera, or both move relative to each other.
The method according to any one of claims 1 to 3,
The vision camera is movable only in one axis (X axis or Y axis) direction of the reference coordinate, and the movement distance in the other axis (Y axis or X axis) direction of the alignment table is 1/2 of the diameter of the semiconductor material. If less than, between the step (c) and (d),
Rotating the alignment table at a predetermined angle so that at least two reference marks formed on the semiconductor material are located within the imageable area of the vision camera;
Detecting, by the vision camera, first positions of the at least two reference marks, respectively;
Rotating the alignment table at a predetermined angle;
Detecting, by the vision camera, a second position of at least one reference mark of the at least two reference marks;
Calculating a position correction value of the semiconductor material based on the detected positional information on the reference mark of the semiconductor material; And
Correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the position correction value;
Semiconductor material sorting method further comprising.
The method according to claim 4,
And said predetermined angle is 180 degrees or 90 degrees.
The method according to any one of claims 1 to 3,
After the step (c), by the relative motion of the vision camera and the alignment table, the vision camera is located at the outer periphery of the semiconductor material in the direction of one axis (X axis or Y axis) of the reference coordinate, And detecting a notch formed in the outer periphery of the semiconductor material while rotating in degrees.
The method according to claim 4,
After the step (c), by the relative motion of the vision camera and the alignment table, the vision camera is located at the outer periphery of the semiconductor material in the direction of one axis (X axis or Y axis) of the reference coordinate, And detecting a notch formed in the outer periphery of the semiconductor material while rotating in degrees.
The method according to any one of claims 1 to 3,
Between steps (c) and (d),
Detecting position information of at least two reference marks formed on the semiconductor material by relative movement between the alignment table and the vision camera;
Calculating a position correction value of the semiconductor material based on the positional information on at least two reference marks of the detected semiconductor material; And
Correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the position correction value;
Semiconductor material sorting method further comprising.
The method according to any one of claims 1 to 3,
And the reference point is a dowel hole.
The method according to any one of claims 1 to 3,
And a predetermined point on the semiconductor material is a semiconductor package which enters a field of view (FOV) of a vision camera together with the reference point among a plurality of semiconductor packages formed on the semiconductor material.
The method according to claim 4,
And the reference point is a dowel hole.
The method according to claim 4,
And a predetermined point on the semiconductor material is a semiconductor package which enters a field of view (FOV) of a vision camera together with the reference point among a plurality of semiconductor packages formed on the semiconductor material.
The method according to claim 8,
And the reference point is a dowel hole.
The method according to claim 8,
And a predetermined point on the semiconductor material is a semiconductor package which enters a field of view (FOV) of a vision camera together with the reference point among a plurality of semiconductor packages formed on the semiconductor material.
(a) seating the semiconductor material onto the alignment table;
(b) detecting the notch formed on the outer circumferential edge of the semiconductor material while rotating the semiconductor material after the vision camera is positioned on the outer circumferential edge of the semiconductor material by the relative motion of the vision camera and the alignment table;
(c) the vision camera and the alignment table are provided such that a reference point formed on a base on which the alignment table is installed and a predetermined point of the semiconductor material simultaneously enter a field of view (FOV) of the vision camera. Moving relative to detect position information between the reference point and a predetermined point of the semiconductor material;
(d) calculating a position correction value of the semiconductor material from the detected position information;
(e) correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the calculated position correction value;
Semiconductor material sorting method comprising a.
The method according to claim 15,
and (d) is performed for at least two pairs of reference points formed on opposite sides of the semiconductor material and predetermined points of the semiconductor material, respectively.
The method according to claim 15,
step (c) wherein the vision camera moves relative to the alignment table, the alignment table moves relative to the vision camera, or both move relative to each other.
The method according to any one of claims 15 to 17,
The vision camera is movable only in one axis (X axis or Y axis) direction of the reference coordinate, and the movement distance in the other axis (Y axis or X axis) direction of the alignment table is 1/2 of the diameter of the semiconductor material. If less than, between the step (b) and (c),
Rotating the alignment table at a predetermined angle so that at least two reference marks formed on the semiconductor material are located within the imageable area of the vision camera;
Detecting, by the vision camera, first positions of the at least two reference marks, respectively;
Rotating the alignment table at a predetermined angle;
Detecting, by the vision camera, second positions with respect to the at least two reference marks, respectively;
Calculating a position correction value of the semiconductor material based on the detected positional information on the reference mark of the semiconductor material; And
Correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the position correction value;
Semiconductor material sorting method further comprising.
The method according to claim 18,
And said predetermined angle is 180 degrees or 90 degrees.
The method according to any one of claims 15 to 17,
And the reference point is a dowel hole.
The method according to any one of claims 15 to 17,
And a predetermined point on the semiconductor material is a semiconductor package which enters a field of view (FOV) of a vision camera together with the reference point among a plurality of semiconductor packages formed on the semiconductor material.
The method according to claim 18,
And the reference point is a dowel hole.
The method according to claim 18,
And a predetermined point on the semiconductor material is a semiconductor package which enters a field of view (FOV) of a vision camera together with the reference point among a plurality of semiconductor packages formed on the semiconductor material.
The method according to any one of claims 1 to 3,
The vision camera is movable only in one axis (X axis or Y axis) direction of the reference coordinate, and the movement distance in the other axis (Y axis or X axis) direction of the alignment table is 1/2 of the diameter of the semiconductor material. If less than, between the step (c) and (d),
Rotating the alignment table at a predetermined angle so that the reference mark formed on the semiconductor material is located within the imageable area of the vision camera;
Detecting, by the vision camera, a first position with respect to the reference mark;
Rotating the alignment table at a predetermined angle;
Detecting, by the vision camera, a second position with respect to the reference mark and a position with respect to at least one reference mark other than the reference mark;
Calculating a position correction value of the semiconductor material based on the detected positional information on the reference mark of the semiconductor material; And
Correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the position correction value;
Semiconductor material sorting method further comprising.
The method of claim 24,
And said predetermined angle is 180 [deg.].
The method of claim 24,
After the step (c), by the relative motion of the vision camera and the alignment table, the vision camera is located at the outer periphery of the semiconductor material in the direction of one axis (X axis or Y axis) of the reference coordinate, And detecting a notch formed in the outer periphery of the semiconductor material while rotating in degrees.
The method of claim 24,
And the reference point is a dowel hole.
The method of claim 24,
And a predetermined point on the semiconductor material is a semiconductor package which enters a field of view (FOV) of a vision camera together with the reference point among a plurality of semiconductor packages formed on the semiconductor material.
(a) seating the semiconductor material onto the alignment table;
(b) the relative angle between the vision camera and the alignment table, whereby the vision camera photographs an arbitrary region of the semiconductor material to form a tilted angle of the lattice pattern formed on the semiconductor material with respect to a reference coordinate Measuring);
(c) rotating the alignment table at a predetermined angle based on the measured rotation angle;
(d) rotating the alignment table at a predetermined angle so that at least two reference marks formed on the semiconductor material are located within the imageable area of the vision camera;
(e) detecting, by the vision camera, first positions of the at least two reference marks, respectively;
(f) rotating the alignment table at a predetermined angle;
(g) detecting, by the vision camera, a second position with respect to at least one reference mark of the at least two reference marks;
(h) calculating a position correction value of the semiconductor material based on the detected position information on the reference mark of the semiconductor material, and correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the position correction value. step;
Semiconductor material sorting method comprising a.
The method of claim 29,
And said predetermined angle is 180 degrees or 90 degrees.
The method of claim 29,
After the step (c), by the relative motion of the vision camera and the alignment table, the vision camera is located at the outer periphery of the semiconductor material in the direction of one axis (X axis or Y axis) of the reference coordinate, And detecting a notch formed in the outer periphery of the semiconductor material while rotating in degrees.
The method of claim 29,
In the step (h), the center position of the semiconductor wafer and the alignment table are detected by detecting the rotation center position of the alignment table based on the first position information and the second position information of the detected reference marks of the semiconductor wafer. A position correction value is calculated so that the position of the center point of the semiconductor wafer coincides with the pickup center position of the strip picker based on the rotational center position of the semiconductor wafer, and the position of the semiconductor wafer is corrected by horizontally or rotating the alignment table. Semiconductor Wafer Alignment Method.
The method of claim 29,
A plurality of dowel holes for determining the pick-up position of the strip picker is formed outside both sides of the alignment table, the controller is a semiconductor so that the center point of the semiconductor wafer coincides with the center position between the dowel holes in the step (h) A semiconductor wafer alignment method, characterized in that for correcting the position of the wafer.
(a) seating the semiconductor material onto the alignment table;
(b) detecting the notch formed at the outer periphery of the semiconductor material while rotating the semiconductor material after the vision camera is positioned at the outer periphery of the semiconductor material by relative motion of the vision camera and the alignment table;
(c) rotating the alignment table at a predetermined angle so that at least two reference marks formed on the semiconductor material are located within the imageable area of the vision camera;
(d) detecting, by the vision camera, first positions of the at least two reference marks, respectively;
(e) rotating the alignment table at a predetermined angle;
(f) detecting, by the vision camera, a second position with respect to at least one reference mark of the at least two reference marks;
(g) calculating a position correction value of the semiconductor material based on the detected position information on the reference mark of the semiconductor material, and correcting the position of the semiconductor material by horizontally or rotating the alignment table according to the position correction value. step;
Semiconductor material sorting method comprising a.
The method according to claim 34,
And said predetermined angle is 180 degrees or 90 degrees.
The method according to claim 34,
In the step (g), the rotation center position of the alignment table is detected based on the first position information and the second position information of the reference marks of the detected semiconductor wafer, whereby the center point position of the semiconductor wafer is aligned with the alignment table. A position correction value is calculated so that the position of the center point of the semiconductor wafer coincides with the pickup center position of the strip picker based on the rotational center position of the semiconductor wafer, and the position of the semiconductor wafer is corrected by horizontally or rotating the alignment table. Semiconductor Wafer Alignment Method.
The method of claim 34, wherein
A plurality of dowel holes for determining the pick-up position of the strip picker is formed outside the both sides of the alignment table, the controller is a semiconductor so that the center point of the semiconductor wafer coincides with the center position between the dowel holes in step (g) A semiconductor wafer alignment method, characterized in that for correcting the position of the wafer.