KR101682468B1 - Method for alignment of wafer and aligning equipment using of it - Google Patents

Method for alignment of wafer and aligning equipment using of it Download PDF

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Publication number
KR101682468B1
KR101682468B1 KR1020150159701A KR20150159701A KR101682468B1 KR 101682468 B1 KR101682468 B1 KR 101682468B1 KR 1020150159701 A KR1020150159701 A KR 1020150159701A KR 20150159701 A KR20150159701 A KR 20150159701A KR 101682468 B1 KR101682468 B1 KR 101682468B1
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KR
South Korea
Prior art keywords
wafer
stage
image
alignment
center
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KR1020150159701A
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Korean (ko)
Inventor
이두석
김수영
정성범
문제호
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주식회사 이오테크닉스
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Priority to KR1020150159701A priority Critical patent/KR101682468B1/en
Priority to TW105112206A priority patent/TWI646622B/en
Priority to PCT/KR2016/004389 priority patent/WO2017082496A1/en
Priority to CN201680066029.7A priority patent/CN108292623A/en
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Publication of KR101682468B1 publication Critical patent/KR101682468B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a wafer alignment method and alignment equipment using the same, the method comprising the steps of: placing a wafer including a notch for alignment on a stage on which X and y axes are set; Photographing a first image of the wafer, then rotating the wafer by 180 degrees, and then photographing a second image of the wafer; Comparing the first image and the second image to move the center of the wafer on the x-axis of the stage; Capturing a third image of the wafer, then rotating the wafer by 180 degrees, and then photographing a fourth image of the wafer; Comparing the third image with the fourth image to move the center of the wafer onto the y axis of the stage to align the center of the wafer with the center of the stage; And rotating the wafer to align a centerline of the wafer passing through the notch with an alignment line of the stage.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer alignment method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer alignment method and a sorting apparatus using the same, and more particularly, to a wafer alignment method for aligning wafers on a stage by locating a notch of the wafer using a vision camera, And a sorting apparatus using the same.

Generally, a wafer is cut through a sawing machine using a blade or a laser cutter to form a plurality of semiconductor chips.

The wafer that is seated on the stage of such a sWing machine is recognized by the camera installed in the equipment, and the equipment has an alignment device for reading the image and aligning the alignment line of the stage with the centerline of the wafer.

Conventionally, conventional alignment equipment is a method in which a camera recognizes a ball, a line, or the like formed on a surface of a wafer to derive a center line of the wafer.

However, in such a conventional wafer alignment method, when a ball or a line formed on a wafer surface is deformed, a recognition error may occur and a sling may be defective, or a tape or resin layer may be formed on the surface of the wafer When applied, there is a problem that it is difficult for the camera to recognize a ball or a line on the wafer surface, and wafer alignment becomes impossible.

The present invention provides a wafer aligning method and a wafer aligning apparatus using the same, which can align the wafer to a precise position in any direction on the stage using a vision camera.

A wafer alignment method according to an embodiment of the present invention includes: placing a wafer including a notch for alignment on a stage on which the X axis and the y axis are set; Photographing a first image of the wafer, then rotating the wafer by 180 degrees, and then photographing a second image of the wafer; Comparing the first image and the second image to move the center of the wafer on the x-axis of the stage; Capturing a third image of the wafer, then rotating the wafer by 180 degrees, and then photographing a fourth image of the wafer; Comparing the third image with the fourth image to move the center of the wafer onto the y axis of the stage to align the center of the wafer with the center of the stage; And rotating the wafer to align a centerline of the wafer passing through the notch with an alignment line of the stage.

The images of the wafer can be taken by a vision camera.

The comparison of the first and second images and the comparison of the third and fourth images may be performed through an operation unit connected to the vision camera.

The movement and rotation of the wafer may be performed through an alignment device controlled by a control unit connected to the operation unit.

An error generated between the center line of the wafer and the alignment line of the stage can be calculated in the calculation unit.

And generating an alarm through an alarm device connected to the operation unit when an error generated between the center line of the wafer and the alignment line of the stage is larger than a set allowable range.

If the alarm occurs, the steps described in claim 1 may be performed again.

A wafer alignment apparatus according to an embodiment of the present invention includes: a stage on which a wafer including a notch for alignment is seated, the stage having an x-axis and a y-axis; A vision camera for photographing an image of the wafer; An alignment device for rotating and moving the wafer on the stage; And a control unit for applying a control signal to the alignment device so that the alignment line of the stage and the centerline of the wafer are aligned with each other.

And an operation unit for comparing the images of the wafer recognized by the vision camera and calculating an error between the center line of the wafer and the alignment line of the stage.

The control unit may apply a control signal to the alignment apparatus according to a result calculated by the operation unit.

And an alarm device connected to the operation unit and generating an alarm when an error generated between the center line of the wafer and the alignment line of the stage is larger than a set allowable range.

A wafer alignment apparatus according to an embodiment of the present invention includes: a stage on which a wafer including a notch for alignment is seated, the stage having an x-axis and a y-axis; A vision camera for photographing an image of the wafer; An alignment device for rotating and moving the wafer on the stage; And a controller for applying a control signal to the aligning device so that an alignment line of the stage and a centerline of the wafer coincide with each other, wherein the vision camera photographs first to fourth images of the wafer, After the vision camera has taken the first image and the third image, rotates the wafer by 180 degrees, and the aligning device compares the first image and the second image to determine the center of the wafer to be x The aligning device compares the third image with the fourth image to move the center of the wafer on the y axis of the stage to align the center of the wafer with the center of the stage, Wherein the aligning device rotates the wafer and aligns the center line of the wafer passing through the notch with the alignment line of the stage All.

And an operation unit connected to the vision camera, for performing a comparison of the first and second images and a comparison of the third and fourth images.

The control unit may apply a control signal to the alignment device according to a result of comparison in the operation unit.

According to an embodiment of the present invention, even when a tape that is not transmitted through the photodiode sensor is stuck on the wafer, the wafer can be aligned to the correct position.

In addition, even if the surface of the wafer is uneven, the wafer can be aligned at the correct position.

In addition, the wafer can be aligned in a precise position even in the case of a wafer whose material is difficult to be detected by a photodiode sensor such as glass or sapphire.

Fig. 1 shows a tape coated on a wafer for protecting the surface of the wafer in a wafer including a notch that is seated on a stage for processing. Fig.
2 is a schematic illustration of a wafer alignment apparatus according to an embodiment of the present invention.
3 is a flow chart illustrating a wafer alignment method in accordance with an embodiment of the present invention.
Figures 4A-4F illustrate a wafer alignment method in accordance with an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "electrically connected" with another part in between . Also, when an element is referred to as "comprising ", it means that it can include other elements as well, without departing from the other elements unless specifically stated otherwise.

1 shows a state in which a tape T for protecting the surface of the wafer W is applied on the wafer W in a wafer W including a notch that is seated on a stage for processing, It is.

Referring to FIG. 1, a wafer W placed on a stage is formed with a notch N in a portion of the wafer W for alignment. A tape T for protecting the surface of the wafer W may be coated on the wafer W. [ The position of the notch N can be used to precisely align the wafer W on the stage.

Conventionally, a light source is positioned above or below a wafer W to illuminate the light, and then a light is transmitted through a photodiode located on the opposite side of the light source. The method of detecting the notch N through the transmission of light has a problem in that a tape T or the like for protecting the surface of the wafer W is coated on the wafer W. When the tape T does not transmit light emitted from the light source or causes light refraction, the photodiode may not be able to detect light emitted from the light source. In addition, the surface of the wafer W to be sensed may be uneven or the light may not be sensed by the photodiode due to reflection and interference of light depending on the material of the wafer W.

2 is a schematic illustration of a wafer alignment apparatus according to an embodiment of the present invention.

2, a wafer sorting apparatus 100 according to an embodiment of the present invention includes a stage S on which a wafer W is placed, a vision camera VC, an alignment apparatus 10, a control unit 20, An arithmetic unit 30 and an alarm device 40.

The wafer W may be placed on the stage S. The stage S is capable of all stages of equipment requiring wafer alignment, but preferably a wafer chuck stage of a sowing facility can be applied.

The vision camera VC is for recognizing the image of the wafer W and is capable of recognizing the image of the wafer W and the notch N placed on the stage S, The alignment state of the wafer W can be determined.

The aligning apparatus 10 is an apparatus for aligning the wafer W on the stage S in a predetermined direction and includes various types of robots capable of rotating or moving the wafer W such as various robot arms, Alignment devices can be applied.

The control unit 20 may be a circuit or a program for aligning the wafer W by applying a control signal to the alignment device 10 so that the alignment line of the stage S and the center line of the wafer W are aligned.

The operation unit 30 may calculate movement values for comparing and analyzing the images of the wafer W obtained from the vision camera VC so that the center of the wafer W is located at the center of the stage S. [ The control unit 20 applies a control signal to the aligning apparatus 10 so that the alignment line of the stage S and the center line of the wafer W coincide with each other to align the wafer W, An error between the center line of the wafer W can be calculated. When the error calculated above exceeds the allowable range, the operation unit 30 can apply a signal to the alarm device 40 so that the alarm device 40 generates an alarm.

The alarm device 40 is connected to the arithmetic unit 30 and can generate an alarm when the error between the alignment line of the stage S calculated by the arithmetic unit 30 and the center line of the wafer W exceeds an allowable range . When an alarm occurs in the alarm device 40, the process for aligning the wafer W on the stage S can be performed again.

FIG. 3 is a flow chart illustrating a wafer alignment method according to one embodiment of the present invention, and FIGS. 4A to 4F show a stepwise manner of a wafer alignment method according to an embodiment of the present invention.

Referring to FIGS. 3 and 4A, the wafer W is first placed on the stage S (S1). The x-axis and the y-axis of the stage S may be set, and the y-axis may be the alignment line 60 of the stage S. When the center of the stage S coincides with the center O of the wafer and the alignment line 60 of the stage S coincides with the center line 50 passing through the notch N of the wafer W, W can be said to be aligned on the stage S. [

The wafers W randomly placed on the stage S are placed in an unaligned state in which the center O of the wafer does not coincide with the center of the stage S and the alignment line 60 and the center line 50 also do not coincide Lt; / RTI >

Next, in a state where the wafer W is randomly placed on the stage S, the first image of the wafer W is photographed using the vision camera VC (S2). In the first image, the center O of the wafer and the center of the stage S may not coincide with each other.

3 and 4B, after the wafer W is rotated 180 degrees with respect to the center of the stage S, a second image of the wafer W is captured (S3). The second image can be photographed by the vision camera VC.

Next, referring to FIGS. 3 and 4C, the first image and the second image are compared to move the center O of the wafer on the x-axis of the stage S (S4). The y-axis coordinates of the center O of the wafer in the first image and the y-axis coordinates of the center O of the wafer in the second image may have the same absolute value and the opposite sign. Thus, the middle value of the y-axis coordinates of the center O of the wafer in the first image and the center O of the wafer in the second image can be placed on the x-axis of the stage S. [ The comparison between the first image and the second image may be performed through the operation unit 30 connected to the vision camera VC. The operation unit 30 calculates a movement value for moving the center O of the wafer on the x-axis of the stage S through comparison between the first image and the second image, The controller 20 can move the wafer W by the calculated movement value.

After the center O of the wafer is moved on the x-axis of the stage S, a third image of the wafer W is captured (S5). The third image can be photographed by the vision camera VC.

3 and 4D, the wafer W moved on the x-axis of the stage S is rotated 180 degrees with respect to the center of the stage S by the center O of the wafer , And the fourth image of the wafer W is photographed (S6). The fourth image can be photographed by the vision camera VC.

Next, referring to FIGS. 3 and 4E, the third image and the fourth image are compared to move the center O of the wafer onto the y-axis of the stage S (S7). The x-axis coordinate of the center O of the wafer in the third image and the x-axis coordinate of the center O of the wafer in the fourth image may have the same absolute value and the opposite sign. Thus, the middle value of the x-axis coordinate of the center O of the wafer in the third image and the center O of the wafer in the fourth image can be placed on the y-axis of the stage S. [ The comparison of the third image and the fourth image as described above may be performed through the operation unit 30 connected to the vision camera VC. The operation unit 30 calculates the movement value for moving the center O of the wafer onto the y-axis of the stage S through comparison between the third image and the fourth image, The controller 20 can move the wafer W by the calculated movement value.

After the steps S1 to S7 are performed, the center O of the wafer may be located at the center of the stage S.

3 and 4F, the center line 50 of the wafer W and the alignment line 60 of the stage S are aligned with the center of the stage S in a state where the center O of the wafer coincides with the center of the stage S. [ The wafer W is rotated (S8). Here, the notch N of the wafer W can be rotated so that the stage S is positioned in the positive direction of the y-axis. Through the above process, the alignment of the wafer W on the stage S can be completed.

Next, referring to FIG. 3, it is determined whether the error between the center line 50 of the wafer W and the alignment line 60 of the stage S is within an allowable range (S9). The error between the center line 50 of the wafer W and the alignment line 60 of the stage S can be calculated by the arithmetic unit 30. [ The permissible range value may be varied within a range in which the performance of the wafer W is not affected.

The alignment is terminated when the error between the center line 50 of the wafer W and the alignment line 60 of the stage S is within the allowable range. However, when the error between the center line 50 of the wafer W and the alignment line 60 of the stage S exceeds the permissible range, the arithmetic unit 30 applies a signal to the alarm device 40, (S10). If an alarm occurs, steps for alignment may be performed again, returning to step S2.

According to the embodiments of the present invention described above, it is possible to arrange the wafer at an accurate position even when a tape that is not transmitted through the photodiode sensor is stuck on the wafer, and even when the surface of the wafer is uneven, can do. In addition, the wafer can be aligned in a precise position even in the case of a wafer whose material is difficult to be detected by a photodiode sensor such as glass or sapphire.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and their equivalents are to be construed as being included within the scope of the present invention do.

100 ... Wafer Sorting Equipment 10 ... Alignment device
20 ... The control unit 30 ... [0040]
40 ... Alarm device 50 ... center line
60 ... Sort line N ... Notch
He ... Center of Wafer S ... stage
T ... Tape VC ... Vision camera
W ... wafer

Claims (15)

placing a wafer comprising a notch for alignment on a stage where x and y axes are set;
Capturing a first image of the wafer, then rotating the wafer by 180 degrees, and then photographing a second image of the wafer;
Comparing the first image and the second image to move the center of the wafer on the x-axis of the stage;
Capturing a third image of the wafer, then rotating the wafer by 180 degrees, and then photographing a fourth image of the wafer;
Comparing the third image with the fourth image to move the center of the wafer onto the y axis of the stage to align the center of the wafer with the center of the stage; And
And rotating the wafer to align a centerline of the wafer passing through the notch with an alignment line of the stage. The method according to claim 1,
Wherein images of the wafer are imaged by a vision camera. 3. The method of claim 2,
Wherein the comparison of the first and second images and the comparison of the third and fourth images are performed through an arithmetic unit connected to the vision camera. The method of claim 3,
Wherein movement and rotation of the wafer is performed through an alignment device controlled by a control unit connected to the operation unit. 3. The method of claim 2,
Wherein an error generated between a center line of the wafer and an alignment line of the stage is calculated in an operation unit. 6. The method of claim 5,
And generating an alarm through an alarm device connected to the operation unit when an error generated between a center line of the wafer and an alignment line of the stage is larger than a set allowable range. The method according to claim 6,
The method of claim 1, wherein if the alarm occurs, the steps of claim 1 are performed again. delete delete delete delete A stage in which a wafer including a notch for alignment is seated, the x-axis and the y-axis being set;
A vision camera for photographing an image of the wafer;
An alignment device for rotating and moving the wafer on the stage; And
And a controller for applying a control signal to the aligning device so that an alignment line of the stage and a centerline of the wafer are aligned with each other,
The vision camera captures a first image of the wafer and then the alignment device rotates the wafer by 180 degrees and then the vision camera captures a second image of the wafer,
The aligning device compares the first image and the second image to move the center of the wafer on the x-axis of the stage,
The vision camera captures a third image of the wafer and then the alignment device rotates the wafer by 180 degrees and then the vision camera captures a fourth image of the wafer,
The aligning device compares the third image and the fourth image to move the center of the wafer on the y axis of the stage so that the center of the wafer coincides with the center of the stage,
Wherein the aligning device rotates the wafer to align a centerline of the wafer passing through the notch with an alignment line of the stage. 13. The method of claim 12,
And a computing unit coupled to the vision camera for performing a comparison of the first and second images and a comparison of the third and fourth images. 14. The method of claim 13,
Wherein the control unit applies a control signal to the alignment device according to a result of comparison in the operation unit. 14. The method of claim 13,
And an alarm device connected to the operation unit and generating an alarm when an error generated between a center line of the wafer and an alignment line of the stage is larger than a set allowable range.
KR1020150159701A 2015-11-13 2015-11-13 Method for alignment of wafer and aligning equipment using of it KR101682468B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020150159701A KR101682468B1 (en) 2015-11-13 2015-11-13 Method for alignment of wafer and aligning equipment using of it
TW105112206A TWI646622B (en) 2015-11-13 2016-04-20 Method for alignment of wafer and aligning equipment using of it
PCT/KR2016/004389 WO2017082496A1 (en) 2015-11-13 2016-04-27 Wafer alignment method and alignment equipment using same
CN201680066029.7A CN108292623A (en) 2015-11-13 2016-04-27 Wafer alignment method and the aligning equipment for using this method

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CN108292623A (en) 2018-07-17
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TW201731011A (en) 2017-09-01

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