CN103515268A - Substrate placing method and equipment for vacuum processing system - Google Patents
Substrate placing method and equipment for vacuum processing system Download PDFInfo
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- CN103515268A CN103515268A CN201310243221.7A CN201310243221A CN103515268A CN 103515268 A CN103515268 A CN 103515268A CN 201310243221 A CN201310243221 A CN 201310243221A CN 103515268 A CN103515268 A CN 103515268A
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- substrate
- substrate holder
- vacuum process
- movable substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a method and equipment enabling a substrate to flush with a substrate holder. The substrate moves to certain position relative to the substrate holder in a first direction. The substrate holder can move to flush with the substrate through one or more motions of rotation motion and transverse motion on the second direction vertical to the first direction, so the substrate can flush with the substrate holder. Therefore, the substrate can be arranged on the substrate holder in an expected position.
Description
The cross reference of related application
The application requires the U.S. Provisional Patent Application No.61/661 submitting on June 19th, 2012,416 priority, and its whole content merges therewith by reference.
Technical field
The present invention relates to substrate holder in solar energy and semi-conductor industry and the field of substrate mechanical registeration relative to each other.
Background technology
Definition
Processing in meaning of the present invention comprises any chemistry, physics or the mechanical effect acting on substrate.
Substrate in meaning of the present invention is part, parts or workpiece pending in processing unit (plant).Substrate includes, but not limited to have rectangle, square or circular parts smooth, plate shape.In a preferred embodiment, the present invention relates to size substantially > planar substrates of 1m2, such as thin glass plate.
Vacuum processing or vacuum flush system or device at least comprise the housing for treatment substrate under the pressure of the atmospheric pressure lower than surrounding environment.
CVD chemical vapor deposition is the known technology that allows illuvium on heated substrates.The precursor material of liquids in general or gas is fed to system of processing, and wherein the thermal response of precursor causes the deposit of layer.LPCVD is the generic term of low pressure chemical vapor deposition.
DEZ diethyl zinc is for the precursor material for the production of tco layer at vacuum processing apparatus.
TCO represents transparent conductive oxide, and therefore tco layer is transparent conductive layer.
In the disclosure, term layer, coating, deposit and film are used interchangeably, and for the film of vacuum processing apparatus deposit, technique is wherein CVD, LPCVD, plasma enhanced CVD (PECVD) or PVD(physical vapor deposition).
Solar cell or photovoltaic cell (PV battery) are electric components, can light (for example, daylight) be directly converted to electric energy via photoelectric effect.
Thin-film solar cells on ordinary meaning comprises that at least one p-i-n on the supporting substrates of setting up by the thin film deposition of semiconducting compound ties, and it is clipped between two electrodes or electrode layer.
Background of invention
Fig. 1 schematically illustrates vacuum flush system 1, and it has the processing volume 2 of being surrounded by housing 3.Substrate 5(to be processed for example, wafer or glass substrate) need to be placed in accurately in substrate holder 4.This substrate holder 4 is arranged on processing source 6(heater by specific machinery, geometrical relationship conventionally, coating material, gas, ion Deng source) near.Fig. 1 further shows for example, entrance 7 and floss hole 8 for process gas (, inert gas, reacting gas, precursor etc.).The size of entrance and floss hole, number and design can change according to each application.Pump, feeder and load/unload locking and disposal system are omitted.
Processing source 6 can present the variation of effect in the plane of substrate holder 4.Fig. 1 is schematically illustrated as indicative function in the region 10 and 9 of the varying strength in substrate 5, substrate holder 4 and adjacent area Shang source 6 by this variation.Substrate 5 can cause (extra) coating of substrate holder 4 or the change of layer character (such as component, thickness, result etc.) with respect to the misalignment of processing source 6 or substrate holder.In CVD system, situation is all the more so.In this, 4 pairs of substrates of substrate holder heat and substrate holder (being also called as chuck, pedestal or electric stage) and substrate 5(for example, glass, graticle, light shield substrate, wafer etc.) between the displacement change that can cause heating pattern, and as a result of, cause the change of layer character.In addition, for example, if the edge projection of substrate is crossed substrate holder, displacement may cause the backside coating of substrate.
In the CVD of prior art equipment, substrate holder can be in deposition tool Nei fixed position.Conveying or disposal system can comprise mechanical part or the system based on vacuum draw or other elevate a turnable ladders and positioning element such as fork.Robot can serve substrate holder by being taken into and removing substrate.By instructing robot or its programming being realized to correct location so that substrate is placed in to correct position exactly.
The defect of prior art
On line system of processing can comprise having for by the series of process chamber of the common path of all substrates of being processed successively.Roller can be used for substrate to be transported to next workbench from a workbench.As mentioned above, also can use robot.Roller position and tip sensor can be determined the location of substrate in substrate holder.In on line instrument, this roller localization method may not be enough accurate for the arrangement of substrate.Reason be machinery in essence: the main purpose of roller is that safely conveying substrate is by for example equipment.Therefore can make roller aim at, make substrate be carried and pass through chamber reposefully.Due to the thermal expansion of manufacturing tolerance and the system of substrate, substrate holder may be aimed at the conveying track of substrate.In addition, roller may need to allow the gap (play) between roller and substrate, particularly at substrate, has specific dimensions (for example, 1m
2or larger) and need to avoid in the situation of (canting).Inclination may damage or destroy substrate or block transport path.，Gai gap can also allow substrate rotation unfortunately, causes the inaccurate arrangement of substrate in substrate holder.
Fig. 2 to 6 illustrates aforementioned circumstances under the help of diagram.Shown embodiment relates to the on line system for square or rectangular substrate, but problem and solution are not limited to substrate size, substrate shape, substrate design or baseplate material.Fig. 2 illustrates an only processing chamber 20(does not have entrance, outlet, gas and material source or loading and unloading equipment).Arrow indication on substrate 23 is carried by the direction for the treatment of system or processing chamber 20.Roller 26 allows to make substrate 23 to move in processing chamber 20.Substrate holder 21 comprises pin or elevate a turnable ladder equipment 22.Once substrate 23 with the position alignment of substrate holder 21, sell 22 surfaces from substrate holder and extend and elevate a turnable ladder substrates 23, roller 26 is emptied.Roller 26 can be retracted from substrate 23 subsequently, and pin can be placed on substrate in substrate holder 21.This description of allocation method is not restrictive, because for example have Cha robot, also can carry out this arrangement.
Fig. 4 illustrates the basic element of character of roller element 26 in more detail.Roller element can comprise column part 31, and it is configured to bearing substrate 35.The region of column part can be designed as and allows certain lateral clearance (that is, vertical with the throughput direction of arrow indication).Gasket ring (rim) 32 can prevent that substrate 35 transverse shiftings from crossing far away and can be used as cross track.Axial region 33 is connected to outer shell walls 34 and is constructed to retractible (by means of the driving of pneumatic linear actuator or hydraulic cylinder or other types) to allow substrate 35 to be positioned in substrate holder (not shown in Fig. 4).
Fig. 3 has highlighted undesirable sight of settling about substrate.Location based on roller 26 and setting, substrate 23 has been rotated and transverse shift arrives admissible degree.Impossible with suitable aligning of substrate holder 21.Fig. 5 diagram (amplifications) substrate 24 rotating with respect to substrate holder, and Fig. 6 illustrates the substrate 25 with respect to substrate holder transverse shift.At Fig. 5 and 6, omitted roller 26 in both.
Summary of the invention
As a rule, the present invention relates to a kind of method that substrate holder 27 is aimed at substrate 28.In first step, conveying system can make substrate 28 move in a first direction a certain position with respect to substrate holder 27.In second step, substrate holder 27 can for example, via (crossing, vertically) in the second direction of first direction, the movement of the in rotary moving and substrate holder 27 of substrate holder 27 in the parallel plane plane with substrate 28 (, translation) one or more in moves with substrate 28 and aims at, and substrate 28 and substrate holder 27 are aimed at.In third step, substrate 28 can be placed in substrate holder 27 by position or the setting of expectation.In optional the 4th step, substrate holder 27 can (for example move to return neutral position by the rotation in second direction and transverse shifting again, self aim at processing chamber 20), make to carry out by the calibrated position with respect to conveying system the conveying of for example, substrate 28 outside (, starting) chamber 20 below.
For example, by the transducer of for example optical pickocff (, optical tip transducer) or camera system, can observe and control Alignment Process.Analysis can be completed by computer and corresponding software.First step may not have enough accurately positioning baseplate successfully to finish with permission second step.In this case, before second step starts or finishes, be necessary for example to make substrate again in a first direction backward or move forward.
Accompanying drawing explanation
Be merged in specification and form its a part of accompanying drawing and illustrate one or more embodiment, and together with describing, these embodiment have been described.Accompanying drawing is not necessarily drawn to scale.Illustrated any value size object for illustrating only in appended curve and diagram, and can represent or can not represent actual or preferred value or size.In appropriate circumstances, some or all of feature may not be illustrated to assist the description of low-level image feature.In the accompanying drawings:
Fig. 1 illustrates the vacuum flush system according to background technology.
Fig. 2 illustrates according to the substrate orientation system based on roller in the processing chamber of background technology.
Fig. 3 illustrates undesirable situation of settling about substrate.
Fig. 4 illustrates according to the basic element of character of the roller element of background technology.
Fig. 5 illustrates the substrate with respect to substrate holder rotation.
Fig. 6 illustrates the substrate with respect to substrate holder transverse shift.
Fig. 7 illustrates according to the block diagram of substrate arrangement of the present invention and alignment methods and equipment.
Fig. 8 illustrates the example of shift unit according to an embodiment of the invention.
Embodiment
The description of below setting forth is by reference to the accompanying drawings intended to as the description of various embodiment of the present invention and is not necessarily intended to only represent wherein can put into practice embodiments of the invention.In some instances, for the object that the understanding of the present invention is provided, describe and comprise detail.Yet obvious for those skilled in the art, the present invention can not put into practice in the situation that there is no these details.In some instances, some structures and parts can illustrate to avoid with the form of block diagram the concept of fuzzy disclosed subject content.
In addition, note, unless other situation clearly pointed out in context, otherwise comprise plural referent as the singulative using in specification and claims " (a, an) " and " being somebody's turn to do ".In other words, unless clearly indicate other situations, otherwise as used herein vocabulary " one (a and an) " etc. with the implication of " one or more ".In addition, the present invention and embodiment are intended to contain modification and distortion.For example, to understand, here may use such as " left side ", " right side ", " top ", " end ", 'fornt', 'back' ,“ side ", " highly ", " length ", " width ", " on ", the term of D score, " inside ", " outside ", " interior ", " outward " etc. only described reference point, do not limit the invention to any specific orientation or configuration.In addition, such as " first ", " second ", " the 3'sth " etc. term, only identify as one in many parts, parts, step and/or reference points disclosed herein, similarly do not limit the invention to any specific configuration, orientation, number or order.
For the inventive concept that substrate is aimed at substrate holder, comprise the movement of substrate holder.Substrate is carried and can be configured to reposefully and dispose respectively safely also conveying substrate and pass through equipment or system.Explanation under the help of Fig. 7 is aimed to self.
For example, by means of conveying system (, based on roller), substrate 28 can be transported to the primary importance with respect to movable substrate holder 27 according to the present invention.Subsequently, substrate holder 27 can be aimed at the orientation of substrate 28 according to the orientation of the substrate 28 being taken into as conveying system.It is inaccurate that therefore movable substrate holder 27 can compensate for example vertical with the throughput direction of substrate 28 arrangement, and substrate 28 is with respect to the rotation of throughput direction (with the central point adjacent arrow of the exemplary transverse shifting of form with vertical movement in Fig. 7 indicated, and indicates the rotating shaft of the substrate holder vertical with its surface).Technically, the movement of this substrate holder can realize in the following way, the Substrate table of substrate holder 27 is for example arranged on slidingly lead, on roller or guide rail, this cunning is led, roller or guide rail can allow the movement with respect to throughput direction, for example vertical movement of substrate holder 27.Rotatability can pass through whirligig or winding machine, such as the rotating disk for example with ball bearing and corresponding driving mechanism.
For example, by for example optical pickocff (, optical tip transducer), control and measure any installation error on throughput direction.As an alternative, camera system can be used for detecting the actual orientation of substrate 28.Can be used for based on throughput direction spotting the time of delay of detecting substrate 28 and finishing between conveying.Alternatively, do not need mechanical registeration.Therefore the infringement and/or the infringement to substrate that are associated with conveying system can be avoided, and treatment effeciency can be improved to realize for example economical advantage.
As an example, an application of this alignment system realizes in the TCO of some treatment step for the production of in thin-film solar cells application system.
Can after the first deposit, aim at by the deposit track based on staying on electric stage.By substrate holder shift unit, measure and compensate displacement.
Fig. 8 illustrates the example of this shift unit.This shift unit can for example be placed between deposition chamber and substrate supporting thing.Displacement base plate Unit 101 can be fixed on cavity bottom by the fastener such as screw 102.Substrate supporting thing can move by pin 103, sells 103 and can move by rotatable post 104.The movement of rotatable post 104 can be facilitated or realize to bar 105, and further allow shift unit to be positioned at substrate supporting thing below, is blocked herein to resist deposited gas.Alignment pin 103 position can be fixed by for example hold-down screw 106.Once determine substrate supporting Wu position, screw 106 can be screwed the position with fixing base support.Between the installation period of shift unit, can use the starting position of pillar 107 to be identified for aiming at.Alignment pin 103 can be positioned in a sight line of aiming at pillar 107Zhong hole or pin (not shown) here.This shift unit can be used on all positioning elements for substrate supporting thing.
Embodiments of the invention have now been described, for those skilled in the art should be obvious, be only illustrative and nonrestrictive above, only as example, be presented.Therefore,, although discuss and illustrate concrete configuration here, also can adopt other configurations.By the disclosure, (for example many modifications and other embodiment have been realized, combination, reset etc.), and described modification and other embodiment are in those of ordinary skills' scope, and be regarded as dropping in the scope of disclosed subject content and any equivalent thereof.The feature of the disclosed embodiments can combine within the scope of the invention, resets, omission etc. to be to produce extra embodiment.In addition, some feature can advantageously be used sometimes in the situation that correspondingly not using other features.Therefore, applicant be intended to contain in the spirit and scope of the present invention all these select, revise, be equal to and change programme.
Claims (10)
1. a device, comprising:
Vacuum process cavity;
Movable substrate holder, it is arranged in described vacuum chamber, and described movable substrate holder has at least one one-movement-freedom-degree that is selected from the following degree of freedom: substrate moves into and leave translation freedoms or the rotary freedom of the direction translation of described vacuum process cavity relatively;
Substrate conveyance system, it is couple to described vacuum process cavity, and is configured to substrate to be sent in described vacuum process cavity and by described substrate and to be placed on described movable substrate holder;
Substrate lift system, it is arranged to make the vertically translation between described substrate conveyance system and the substrate supporting surface of described movable substrate holder of described substrate; And
Substrate holder shift unit, it is couple to described movable substrate holder, and is configured to adjust movably described movable substrate holder and proofreaies and correct the misalignment between described movable substrate holder and described substrate.
2. device according to claim 1, further comprises:
Detection system, it is arranged in described vacuum process cavity to detect the described misalignment between described movable substrate holder and described substrate.
3. device according to claim 2, wherein said detection system comprises Systems for optical inspection.
4. device according to claim 2, wherein said detection system comprises optical tip transducer or camera.
5. device according to claim 2, further comprises:
Controller, it is couple to described detection system and described substrate holder shift unit, and described controller is configured to controllably adjust described movable substrate holder by described substrate holder shift unit and the data that receive from described detection system.
6. device according to claim 1, wherein said movable substrate holder is arranged on and slidingly leads, on roller or guide rail so that the described translation freedoms of the direction translation that relative substrate moved into and left described vacuum process cavity to be provided.
7. device according to claim 1, wherein said movable substrate holder is arranged on ball bearing so that described rotary freedom to be provided.
8. device according to claim 1, wherein said substrate conveyance system comprises retractible the wheel or roller on the sidewall that is arranged on described vacuum process cavity.
9. device according to claim 1, wherein said substrate holder shift unit comprises:
Base plate, it can be fixedly mounted in the bottom of described vacuum process cavity;
Rotatable post, it is rotatably installed to described base plate, and described rotatable post has the pin that extends and engage described movable substrate holder from upper far-end; And
Lever arm, can be couple to regularly described rotatable post and be set to allow and manually adjust described movable substrate holder via the rotation of described rotatable post.
10. a method, comprising:
Use substrate conveyance system that substrate is sent in vacuum process cavity and by described substrate orientation on the movable substrate holder in being arranged on described vacuum process cavity;
By carrying out following operation, one of at least make described movable substrate holder be shifted to proofread and correct the misalignment between described movable substrate holder and described substrate with respect to described substrate: make described movable substrate holder along translation freedoms translation and make described movable substrate holder rotation, wherein the relative substrate of translation freedoms moves into and leave the direction translation of described vacuum process cavity; And
Use substrate lift system to make described substrate drop to the substrate supporting surface described movable substrate holder from described substrate conveyance system.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261661416P | 2012-06-19 | 2012-06-19 | |
| US61/661,416 | 2012-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103515268A true CN103515268A (en) | 2014-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310243221.7A Pending CN103515268A (en) | 2012-06-19 | 2013-06-19 | Substrate placing method and equipment for vacuum processing system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106067477A (en) * | 2016-06-27 | 2016-11-02 | 昆山国显光电有限公司 | Substrate manufacturing system and method for testing substrate |
| CN107529670A (en) * | 2016-06-24 | 2018-01-02 | 细美事有限公司 | Substrate board treatment and method |
| CN108292623A (en) * | 2015-11-13 | 2018-07-17 | Eo科技股份有限公司 | Wafer alignment method and the aligning equipment for using this method |
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| JPH0755970A (en) * | 1993-08-09 | 1995-03-03 | Hitachi Electron Eng Co Ltd | Sample position stabilizing method for a device with moving stage |
| US20030180127A1 (en) * | 2002-03-25 | 2003-09-25 | Osamu Kuroda | Substrate processing system with positioning device and substrate positioning method |
| CN1499602A (en) * | 2002-10-24 | 2004-05-26 | �յÿ���ʽ���� | Collimator |
| US20050018168A1 (en) * | 2003-07-24 | 2005-01-27 | Canon Kabushiki Kaisha | Substrate holding device, substrate processing apparatus using the same, and method for aligning and holding substrate |
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2013
- 2013-06-19 CN CN201310243221.7A patent/CN103515268A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0755970A (en) * | 1993-08-09 | 1995-03-03 | Hitachi Electron Eng Co Ltd | Sample position stabilizing method for a device with moving stage |
| US20030180127A1 (en) * | 2002-03-25 | 2003-09-25 | Osamu Kuroda | Substrate processing system with positioning device and substrate positioning method |
| CN1499602A (en) * | 2002-10-24 | 2004-05-26 | �յÿ���ʽ���� | Collimator |
| US20050018168A1 (en) * | 2003-07-24 | 2005-01-27 | Canon Kabushiki Kaisha | Substrate holding device, substrate processing apparatus using the same, and method for aligning and holding substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108292623A (en) * | 2015-11-13 | 2018-07-17 | Eo科技股份有限公司 | Wafer alignment method and the aligning equipment for using this method |
| CN107529670A (en) * | 2016-06-24 | 2018-01-02 | 细美事有限公司 | Substrate board treatment and method |
| CN107529670B (en) * | 2016-06-24 | 2020-08-25 | 细美事有限公司 | Substrate processing apparatus and method |
| CN106067477A (en) * | 2016-06-27 | 2016-11-02 | 昆山国显光电有限公司 | Substrate manufacturing system and method for testing substrate |
| CN106067477B (en) * | 2016-06-27 | 2019-10-11 | 昆山国显光电有限公司 | Substrate manufacturing system and method for testing substrate |
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Application publication date: 20140115 |