CN102934216B - For the method being directed at semi-conducting material - Google Patents
For the method being directed at semi-conducting material Download PDFInfo
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- CN102934216B CN102934216B CN201180028704.4A CN201180028704A CN102934216B CN 102934216 B CN102934216 B CN 102934216B CN 201180028704 A CN201180028704 A CN 201180028704A CN 102934216 B CN102934216 B CN 102934216B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Abstract
The present invention relates to make the position of semi-conducting material to be accurately aligned it is thus possible to it to be accurately sent to the method for processing position manufacturing in the equipment of semiconductor packages.According to the present invention, a kind of wafer processing apparatus, such as the plurality of semiconductor packages trellised chip type material of layout is cut into the singulation equipment etc. of single semiconductor packages unit, have novelty to Barebone, wherein, aligned relationship between pin-and-hole center and semiconductor packages center is photographed by means of vision camera, and material is accurately aligned along the position in X, Y and θ direction thus material is accurately sent to processing position.Therefore, during wafer processing apparatus can actively be used for novel alignment methods such as wafer-class encapsulation etc..Especially, the method that the present invention relates to be directed at semi-conducting material, it is it can be avoided that the error impact that causes such as vibration equipment, it is ensured that accurate measured value thus accurate align material.
Description
Cross-Reference to Related Applications
The application is according to 35U.S.C. § 119(a) require to enjoy the rights and interests of the korean patent application No.10-2010-0048752 of the korean patent application No.10-2010-0041973 submitted on May 4th, 2010 and submission on May 25th, 2010, its entire content is incorporated herein by reference.
Technical field
The method that the present invention relates to be directed at semiconductor wafer position, more specifically it relates to a kind of accurate alignment semiconductor wafer position is with the method being accurately sent to semiconductor wafer manufacture the processing position in the equipment of semiconductor packages.
Background technology
Generally, semiconductor packages manufactures as follows, rectangular plate-like lead frame will be attached to multiple semiconductor packages of High Density Integration transistor and capacitor on it, multiple semiconductor packages are electrically connected to the pad of lead frame by wire bond (wirebonding), utilize epoxy resin that gained semiconductor packages is moulded, and by singulation (singulation) technique, the semiconductor packages on lead frame is cut into each semiconductor packages.
Recently, the type of semiconductor packages is the most diversified, therefore has been developed that the new encapsulation technology that quasiconductor is encapsulated into row singulation.
Typically, in singulation equipment, being placed in chuck table by the wafer that it defines multiple semiconductor packages, cutting blade and chuck table move relative to each other so that wafer is cut into each encapsulation by cutting blade.Here, cutting blade, by being configured to the blade receiving slit overlapped with the line of cut of the wafer in chuck table, does not contacts with chuck table to perform cutting technique.
But, when the wafer that will experience cutting technique has round-shaped, such as wafer-class encapsulation, it is difficult to the line of cut making wafer and the blade receiving slit inregister in chuck table, then, during the position of the cutting technique being sent in chuck table by wafer in singulation process, wafer may not be accurately placed in chuck table.
So, if accurately not placing wafer in chuck table to be used for cutting, then the line of cut of wafer not with the blade receiving slit inregister in chuck table, then the tip of cutting blade may collide the top surface of chuck table during cutting technique, and expensive cutting blade or chuck table are caused damage.
Additionally, wafer will not be cut into intended shape along the line of cut forming matrix shape, thus judge that semiconductor packages is defective, which increase manufacturing cost and significantly reduce productivity ratio.
Therefore, before wafer such as wafer-class encapsulation is sent to the position of cutting technique, it is necessary to the technique needing accurately to be directed at wafer position.
Summary of the invention
Therefore, it is an object of the present invention to provide a kind of in wafer processing apparatus such as singulation equipment implement for the method being directed at semiconductor wafer, singulation equipment will arrange on it that semiconductor wafer of multiple semiconductor packages cuts into each semiconductor packages in the matrix form, the method is characterized in that, arrangement relation between vision camera shooting pin-and-hole center and semiconductor packages center is accurately to determine the wafer position in X, Y and θ direction, thus wafer is accurately sent to processing position.The method that therefore, it can effectively be applied to the method for the present invention be directed at novel wafer such as wafer-class encapsulation.Especially, the method for the present invention can make the error impact caused due to vibration equipment etc. minimize, and obtains precise measurements, thus is accurately directed at the position of wafer.
In one aspect, the present invention provides a kind of method being directed at semiconductor wafer, and the method includes: semiconductor wafer is placed on alignment tool by (a)；B () by relative movement between vision camera and alignment tool, makes matrix-like pattern that a certain region on vision camera shooting semiconductor wafer detecting formed on the semiconductor wafer angle of inclination relative to reference frame；C () makes described alignment tool rotate predetermined angular (β=-α+N × 90 ° or-α+N × 90 °, β=90 °, wherein N is integer) based on measured angle of inclination；D () makes described vision camera and described alignment tool move relative to each other, thus the predetermined point on the reference point formed in the substrate that alignment tool is disposed thereon and described semiconductor wafer is concurrently present in the field of view (FOV) of described vision camera, and described vision camera is made to detect the positional information between the predetermined point on described reference point and semiconductor wafer；(e) position correction value based on semiconductor wafer described in the positional information calculation detected；And (f) by level based on the position correction value calculated or is rotatably moved described alignment tool and corrects the position of described semiconductor wafer.
Can be respectively about at least two of the predetermined point being formed at relative to semiconductor wafer on the reference point of opposite sides and semiconductor wafer to performing step (d).
In step (d), described vision camera can move relative to described alignment tool, and described alignment tool can move relative to described vision camera, or both of which can move relative to each other.
The method can also include: between step (c) and step (d), if described vision camera can be only mobile along an axle (such as X-axis or Y-axis), if and described alignment tool along the displacement in another axle (Y-axis or X-axis) direction less than the half of diameter of described semiconductor wafer, described alignment tool is then made to rotate predetermined angular so that at least two reference marker being formed on semiconductor wafer is present in the shooting area of described vision camera；Described vision camera is made to detect the primary importance of each in described at least two reference marker respectively；Described alignment tool is made to rotate predetermined angular；Described vision camera is made to detect the second position of any one in described at least two reference marker；The position correction value of semiconductor wafer described in positional information calculation based on the reference marker on the semiconductor wafer detected；And by level based on the position correction value calculated or move described alignment tool rotatably and correct the position of described semiconductor wafer.
The method can also include, after step (c), described vision camera is made to be positioned on the periphery along axle (such as X-axis or Y-axis) direction of described semiconductor wafer by the relative movement between described vision camera and described alignment tool, make described semiconductor wafer half-twist, and make described vision camera detect the recess formed on the periphery of described semiconductor wafer.
The method can also include: between step (c) and step (d), by the relative movement between described vision camera and described alignment tool, detects the positional information of at least two reference marker formed on described semiconductor wafer；Based on the position correction value of semiconductor wafer described in the positional information calculation of at least two reference marker on the semiconductor wafer detected；And by level based on the position correction value calculated or move described alignment tool rotatably and correct the position of described semiconductor wafer.
Predetermined point on described semiconductor wafer can be the semiconductor packages being present in together with reference point in the FOV of vision camera in multiple semiconductor packages.
In another aspect, the present invention provides a kind of method for being directed at semiconductor wafer, and the method includes: (a) places semiconductor wafer on alignment tool；B (), by the relative movement between vision camera and alignment tool, makes vision camera be positioned on the periphery of semiconductor wafer, makes described semiconductor wafer rotate, and make described vision camera detect the recess formed on the periphery of described semiconductor wafer；C () makes described vision camera and described alignment tool move relative to each other, thus the predetermined point on the reference point formed in the substrate that alignment tool is arranged on and described semiconductor wafer is concurrently present in the field of view (FOV) of described vision camera, and described vision camera is made to detect the positional information between the predetermined point on described reference point and described semiconductor wafer；(d) position correction value based on semiconductor wafer described in the positional information calculation detected；And (e) by level based on the position correction value calculated or moves described alignment tool rotatably and corrects the position of described semiconductor wafer.
The method can also include: between step (c) and step (d), if described vision camera can be only along an axle (such as X-axis or Y-axis) if direction is moved and the described alignment tool displacement in another axle (Y-axis or X-axis) direction is less than the half of diameter of described semiconductor wafer, described alignment tool is then made to rotate predetermined angular so that the reference marker being formed on semiconductor wafer is present in the shooting area of described vision camera；Described vision camera is made to detect the primary importance of described reference marker；Described alignment tool is made to rotate predetermined angular；Described vision camera is made to detect the second position of described reference marker and the position of at least one reference marker in addition to described reference marker；The position correction value of semiconductor wafer described in positional information calculation based on the reference marker on the semiconductor wafer detected；And by level based on the position correction value calculated or move described alignment tool rotatably and correct the position of described semiconductor wafer.
Accompanying drawing explanation
Some one exemplary embodiment of the present invention with reference to shown in accompanying drawing is described the above and other feature of the present invention, in accompanying drawing:
Fig. 1 is schematic plan view, partially illustrates the configuration of the semiconductor wafer singulation equipment that the method being directed at semiconductor wafer according to the present invention is applied to；
Fig. 2 to 9 is plane graph, and order is shown in the semiconductor wafer singulation equipment of Fig. 1 the method being directed at semiconductor wafer according to an embodiment of the invention implemented；
Figure 10 and 11 is plane graph, it is shown that the second correction process after the alignment of semiconductor wafer according to an embodiment of the invention implemented in the semiconductor wafer singulation equipment of Fig. 1；And
Figure 12 is plane graph, and order is shown in the semiconductor wafer singulation equipment of Fig. 1 the method being directed at semiconductor wafer according to another embodiment of the present invention implemented.
Detailed description of the invention
Describe the preferred embodiment of the method being directed at semiconductor wafer according to the present invention below with reference to the accompanying drawings in detail.
First, as the example of the semiconductor wafer processing equipment of the method for performing the alignment semiconductor wafer according to the present invention, the configuration of semiconductor wafer singulation equipment will be briefly described with reference to Fig. 1.
Semiconductor wafer singulation equipment includes: loading unit 10, loads circular semiconductor wafers W thereon, and each wafer W includes the multiple semiconductor packages being arranged to matrix form and is loaded in box M；Alignment tool 11, it is placed and is directed at the semiconductor wafer W taken out from loading unit 10；Transfer robot 12, for being sent to alignment tool 11 by semiconductor wafer W from loading unit 10；Cutter unit 13, for cutting into each semiconductor packages by the semiconductor wafer W transmitted from alignment tool 11；Bar pick-up 14, semiconductor wafer W on vac sorb alignment tool 11 also sends it to cutter unit 13；And unit pick-up 17, semiconductor packages on vac sorb cutter unit 13 also sends it to brush cleaning unit 15, cleaning unit 16 and visual inspection unit (not shown).
Each operation with upper-part is controlled by the controller (not shown) of semiconductor wafer singulation equipment.
Vision camera 18 is provided, for taking pictures to detect its position to the semiconductor wafer W on alignment tool 11 above alignment tool 11.
Vision camera 18 is fixed to the side of bar pick-up 14, to move together with bar pick-up 14, or, vision camera 18 may be configured to move along X-direction independent of bar pick-up 14.
Cutter unit 13 includes the chuck table 19 placing semiconductor wafer W on it and moves and cut the cutting blade 20 of semiconductor wafer W in chuck table 19 relative to chuck table 19.
Forming blade receiving slit 21 on the upper surface of chuck table 19, receive the tip of cutting blade 20 the most in a non contact fashion, blade receiving slit 21 is corresponding to being formed as the encapsulation line of cut of matrix shape in semiconductor wafer W.
Therefore, when cutting the semiconductor wafer W in chuck table 19 relative to the cutting blade 20 of chuck table 19 relative movement along line of cut, the tip of cutting blade 20 does not contact chuck table 19 through blade receiving slit 21 and cutting semiconductor chip W.
Meanwhile, alignment tool 11 performs the method being directed at semiconductor wafer according to the present invention.Here, can along X-direction, alignment tool 11 is set in Y direction and the X-Y-θ platform (not shown) that rotates along θ direction about vertical axis, with the position of the semiconductor wafer W that correction is placed on alignment tool 11.The X-Y-θ platform of mobile alignment tool 11 moves, not increase the position that semiconductor wafer W is fine-tuned within the scope of outfit of equipment size in a distance.
Especially, the invention provides the error by making vibration equipment etc. cause and affect the method minimized and be accurately aligned with semiconductor wafer W.
For this purpose, as shown in FIG. 10 and 11, when semiconductor wafer W is placed on alignment tool 11, vision camera 18 moves the matrix-like pattern formed on the top (such as semiconductor wafer W center top) of the side of semiconductor wafer W with detection in the X-axis direction, thus judges pattern has tilted how many.
Here, the matrix-like pattern formed in semiconductor wafer W represent blade through or laser beam irradiation on it semiconductor wafer W to be cut into the line of cut of each semiconductor packages.
If the matrix-like pattern formed in semiconductor wafer W is ± α relative to the angle of inclination of reference frame, then matrix-like pattern should be made to be parallel to angle beta=(N × 90 °)-± α or β=(90 °-± α)+(N × 90 °) of reference frame by rotary alignment platform, wherein N is integer.
It follows that based on the information of the semiconductor wafer W of storage in controller, alignment tool 11 is rotated predetermined angular along θ direction, to be perpendicular to semiconductor wafer W.
It is to say, alignment tool 11 is rotated predetermined angular along θ direction so that the matrix-like pattern of semiconductor wafer W overlaps with the blade receiving slit 21 of chuck table 19.
Then, moving-vision video camera 18 is taken pictures with the semiconductor packages to the pin-and-hole 22 with the adjacent edges being positioned at the semiconductor wafer W adjacent with pin-and-hole 22 being fixed positioned in alignment tool 11 both sides in the X-axis direction, thus detects its position.
Such as, the center of the vision camera 18 center with detection pin-and-hole 22 and a certain semiconductor packages in the semiconductor wafer W being adjacent is moved horizontally along X-direction.
Here, represent will be based on the reference semiconductor packages of its position of infomation detection of the semiconductor wafer W of storage in controller for semiconductor packages.
The process determining the position of pin-and-hole 22 and the position of reference semiconductor packages at least can be performed once, if needing more accurate position detected value, then this process can be performed twice.Now, after taking pictures the pin-and-hole 22 of side and reference the semiconductor packages that is adjacent, vision camera 18 can move horizontally along X-direction and take pictures with the reference semiconductor packages being adjacent with the pin-and-hole 22 to opposite side.
So, when the position of the center of pin-and-hole 22 of both sides and reference semiconductor packages being detected, calculate the relative position and target detected relative to the difference between position such that it is able to calculate the position correction value of semiconductor wafer W.
Therefore, the center of controller (not shown) center based on semiconductor packages and pin-and-hole 22 calculates corrected value, and move alignment tool 11 along θ direction and/or X-direction and/or Y direction, thus the position of calibrating semiconductor wafer W with in controller storage about pin-and-hole 22 and consistent with reference to the information of position relationship between semiconductor packages.
So, can with the positional information of the pin-and-hole 22 fixing relative to position of view-based access control model video camera 18 detection by the position correction of semiconductor wafer W once or twice, it is thus possible to the position of accurately calibrating semiconductor wafer W, make the error impact caused due to vibration equipment etc. minimize simultaneously.
Meanwhile, before performing the method for position of alignment semiconductor wafer W as above, the present invention provides a kind of reference marker F relative to semiconductor wafer W1To F4The method of the position of alignment semiconductor wafer W.
With reference to figs. 2 to 9, method according to another embodiment of the present invention alignment semiconductor wafer is described below.
Here, when semiconductor wafer W being placed on alignment tool 11 from loading unit 10 by transfer robot 12, vision camera 18 moves, according to predesigned order, the recess N(formed on quasiconductor wafer W edge is seen Fig. 2 along X-direction above alignment tool) and reference marker F1To F4(seeing Fig. 2) takes pictures, so that it is determined that the position that semiconductor wafer W is on alignment tool 11.Then, based on determined by position, by the position correction of semiconductor wafer W to preset reference position, thus semiconductor wafer W is placed on the exact position of bar pick-up 14, to be picked up by bar pick-up 14.
First, quasiconductor has round-shaped, can include the recess N that is hollowly formed on the periphery reference point as semiconductor wafer W.
Additionally, multiple reference marker F1To F4Be formed at through in the centreline space precalculated position spaced apart by a predetermined distance of the recess N of semiconductor wafer W.
Controller (not shown) prestores from semiconductor wafer W centrally along X-direction with along Y direction to each reference marker F1To F4Range information.
As shown in Figure 2, when semiconductor wafer W is placed on alignment tool 11, vision camera 18 moves and from the top shooting semiconductor wafer W at the center of semiconductor wafer W along X-direction, to detect the line of cut being formed as matrix shape in semiconductor wafer W, thereby determines that pattern inclination is how many.
Then, based on the information of the semiconductor wafer W of storage in controller, along θ direction, alignment tool 11 is rotated predetermined angular so that the line of cut of semiconductor wafer W overlaps (seeing Fig. 1) with the blade receiving slit 21 of chuck table 19.
It follows that vision camera 18 moves to be positioned at the edge top (in figure clockwise 90 °) of semiconductor wafer W side along X-direction.In such state, vision camera 18 is along a direction half-twist, to detect the recess N formed in the edge of semiconductor wafer W side.
When recess N is positioned at bottom vision camera 18 as shown in Figure 3, alignment tool 11 is rotated in a clockwise direction predetermined angular, as shown in Figure 4, to regulate the position of semiconductor wafer W so that the first reference marker F1With the 3rd reference marker F3It is present in the shooting area of vision camera 18.Then, vision camera 18 is to the first reference marker F1Take pictures to detect the first reference marker F1Position coordinates.
It follows that as it is shown in figure 5, vision camera 18 moves along X-direction, to the 3rd reference marker F3Take pictures, to determine the 3rd reference marker F3Positional information, and return to initial position.
Here, owing to vision camera 18 moves horizontally along X-direction, it is possible to based on first and the 3rd reference marker F1And F3Positional information determine that semiconductor wafer W disalignment is how many.
Additionally, in order to improve degree of accuracy further, above operation can be repeated so that semiconductor wafer W overlaps with centrage.
That is, alignment tool 11 rotates predetermined angular, (this predetermined angular corresponds to the pass vision camera 18 and moves along X-direction and to first and the 3rd reference marker F1And F3Take pictures obtained value, that is, corresponding to the degree of semiconductor wafer W disalignment) and by acquisition first and the 3rd reference marker F of taking pictures1And F3The process of positional information be repeatedly executed so that first and the 3rd reference marker F1And F3After being centrally located on line, following technique can be performed.
So, first and the 3rd reference marker F detected in vision camera 181And F3Position asymmetrical relative to one another relative to centrage time, or in order to improve degree of accuracy further, vision camera 18 can be allowed to detect the first reference marker F1Position, it is allowed to alignment tool 11 is rotated predetermined angular so that the 3rd reference marker F3It is centrally positioned on line, then allows vision camera 18 by detection the 3rd reference marker F that takes pictures3Position.
As it has been described above, when detection first and the 3rd reference marker F1And F3Position time, controller (not shown) is based on first detected and the 3rd reference marker F1And F3Position and about first and the 3rd reference marker F1And F3With central point OWBetween distance pre-stored information detection semiconductor wafer W central point OWPrimary importance.
Then, as shown in Figure 6, alignment tool 11 rotates 180 ° in the counterclockwise direction so that the 3rd reference marker F3It is present in the shooting area of vision camera 18, thus shoots the 3rd reference marker F3The second position.
It follows that as it is shown in fig. 7, vision camera 18 moves along Y direction again, to shoot the first reference marker F1, thus detect the first reference marker F1The second position.
Here, by first detected and the 3rd reference marker F1And F3Second position coordinate determine the central point O of semiconductor wafer WWSecond position coordinate.
So, as the central point O of semiconductor wafer WWThe first and second positions when being determined, central point O can be passed throughWThe first and second positions between difference detect the center of rotation O of alignment tool 11TPosition.
If the central point O of semiconductor wafer WWCenter of rotation O with alignment tool 11TPosition overlap, then even if alignment tool 11 rotates 180 °, central point OWPosition do not change.But, if as it is shown in fig. 7, the central point O of semiconductor wafer WWNot with the center of rotation O of alignment tool 11TPosition overlap, then when alignment tool 11 rotates 180 °, central point OWPosition change.
Therefore, at the central point O of semiconductor wafer WWPosition known time, it is possible to determine the center of rotation O of alignment tool 11TPosition.
In this embodiment, in order to improve degree of accuracy, by detection first and the 3rd reference marker F1And F3Both the first and second positions determine the center of rotation O of alignment tool 11TPosition.But, the first reference marker F can be determined by1Position or the 3rd reference marker F3Position determine the center of rotation O of alignment tool 11TPosition.
Determining the center of rotation O of alignment tool 11TPosition time, it may be determined that the central point O of semiconductor wafer WWThe center of rotation O of deviation alignment tool 11THow much, center of rotation OTFixture or illusory semiconductor wafer is utilized to obtain and are then stored in controller in advance.
But, owing to alignment tool 11 is rotated by such as motor machinery, so center of rotation may have slight change during use.
Therefore, by semiconductor wafer W being placed on the center of rotation O determining alignment tool 11 on alignment tool 11TPosition, detect first and the 3rd reference marker F by taking pictures1And F3Primary importance, alignment tool 11 is rotated 180 °, and detection first and the 3rd reference marker F1And F3The above-mentioned technique of the second position be more accurate.
Meanwhile, as shown in Figure 8, provide a pair pin-and-hole 22 regularly in alignment tool 11 both sides, during to allow semiconductor wafer W on bar pick-up 14 vac sorb alignment tool 11, bar pick-up 14 is directed to exact position.Form downward projection of a pair position in bar pick-up 14 both sides and determine pin (pin) (not shown), to insert in each pin-and-hole 22.
Therefore, when bar pick-up 14 picks up the semiconductor wafer W on alignment tool 11, the position of bar pick-up 14 is determined, and pin inserts in pin-and-hole 22 so that bar pick-up 14 is at constant position picking up semi-conductor crystal sheet W.Therefore, if the central point O of semiconductor wafer WWOverlap with the center (i.e. the center of wafer pickup position) between pin-and-hole 22, then bar pick-up 14 can be from exact position picking up semi-conductor crystal sheet W.
As it has been described above, as the central point O of detection semiconductor wafer WWPosition time, it is possible to determine the central point O of semiconductor wafer WWCenter of rotation O with alignment tool 11TDeviation, such that it is able to according to alignment tool 11 rotate calculate semiconductor wafer W substantially rotation.
Therefore, as it is shown in figure 9, controller (not shown) central point based on semiconductor wafer W OWThe second position and the center of rotation O of alignment tool 11TPosition calculation corrected value, alignment tool 11 is rotated predetermined angular, then moves alignment tool 11 along X-direction and/or Y direction so that the central point O of semiconductor wafer WWOverlap with the center between pin-and-hole 22, thus the position of calibrating semiconductor wafer W.
Here, center of rotation O based on alignment tool 11TCentral point O with semiconductor wafer WWBetween deviation, shoot first and the 3rd reference marker F in the vision camera 18 moved along X-direction1And F3Time, by reflection rotation first and the 3rd reference marker F1And F3To be present in the value in the shooting area of vision camera 18 and the value of semiconductor wafer W disalignment, determine the anglec of rotation of alignment tool 11.
So, according to the present invention, though the reference marker F in semiconductor wafer W1And F3Deviateing the centrage through recess N, vision camera 18 also is able to when moving along a direction (i.e. along X-direction) determine reference marker F1To F4Position.As a result, it is possible to based on reference marker F1To F4Position determine the central point O of semiconductor wafer WWPosition and the center of rotation O of alignment tool 11TPosition, the thus position of accurate calibrating semiconductor wafer W.
Therefore, it can semiconductor wafer W is accurately sent to next processing position and stands next technique such that it is able to make the appearance of defect minimize.
Simultaneously, as another example of the method for alignment semiconductor wafer W, the present invention provides a kind of by utilizing and can detect each reference marker relative to the position of semiconductor wafer W the method for the position by utilizing detection information to carry out calibrating semiconductor wafer W along the vision camera 18 that X and Y direction move.
To this end, as shown in figure 12, first vision camera 18 moves to shoot the presumptive area of semiconductor wafer W, the i.e. middle section of semiconductor wafer W, thus measures the inclined degree of the matrix-like pattern formed in semiconductor wafer W.Then, along θ direction, alignment tool 11 is rotated predetermined angular to be perpendicular to semiconductor wafer W based on metrical information.
It follows that vision camera 18 moves to the top of semiconductor wafer W and moves horizontally to detect the position of at least two reference marker in multiple reference marker along X and Y direction.
Such as, vision camera 18 moves freely in X-direction and/or Y direction, shoots the first reference marker F1To detect its position coordinates, and shoot the 3rd reference marker F3To detect its position coordinates.
So, first and the 3rd reference marker F1And F3Position when being detected, controller (not shown) is based on first detected and the 3rd reference marker F1And F3Position and be previously stored about first and the 3rd reference marker F1And F3With central point OWBetween the information of distance, the central point O of detection semiconductor wafer WWPosition.
Then, based on reference marker such as first and the 3rd reference marker F1And F3The position correction value of positional information calculation semiconductor wafer W, then level or move alignment tool 11 rotatably, thus the position of calibrating semiconductor wafer W.
As such, it is possible to the semiconductor wafer W being accurately directed at accurately is sent to next processing position and experiences next technique such that it is able to make the appearance of defect minimize.
Although above-described embodiment relates to the method being directed at semiconductor wafer W in the singulation equipment that semiconductor wafer W cuts into each semiconductor packages, but by same or similar mode, the method for the alignment semiconductor wafer W according to the present invention can also be applied to any wafer processing apparatus handling various wafers in addition to semiconductor wafer singulation equipment.
In addition it will be obvious that when the fixture utilizing shape to correspond to semiconductor wafer implements the alignment methods according to the present invention, it belongs to the technical scope of the present invention.Such grip size can correspond to the size of semiconductor wafer, can include matrix-like pattern, reference marker and/or recess.Fixture is only a kind of illusory semiconductor wafer, it is apparent that fixture is identical with semiconductor wafer or its equivalent for those skilled in the art in the invention, and is widely used.
As it has been described above, have the advantage that according to the method for the alignment semiconductor wafer of the present invention
First, owing to vision camera can easily detect the reference marker position formed on wafer, even if so the wafer of correspondence is new, even in novel wafer such as wafer-class encapsulation (centrage of reference marker deviation wafer on it), it is also possible to be accurately determined the position placing wafer.Therefore, it can by based on determined by place the position correction wafer position of wafer and be accurately directed at wafer position；And
Second, the relation between the center position of the semiconductor packages on the position of the permanent datum of such as pin-and-hole and wafer is shot once or twice by vision camera, to determine the position correction value of wafer, and can correct based on the position correction value shot by minimum number and be directed at wafer position.Therefore, it is possible to make the chance of occurrence of the vision camera measurement error that vibration equipment etc. causes minimize, and obtain accurate measured value, thus be accurately aligned with wafer position.
As above, have been described above and show the preferred embodiments of the present invention, but, the invention is not restricted to this, rather, it should be appreciated that the present invention can be made the spirit and technical scope of the present invention that various modifications and variations define without deviating from such as claims by those skilled in the art.
(description of reference numerals)
10: loading unit 11: alignment tool
12: transfer robot 13: cutter unit
14: bar pick-up 15: brush cleaning unit
16: cleaning unit 17: unit pick-up
18: vision camera 19: chuck table
20: cutting blade 21: blade receiving slit
22: pin-and-hole
W: semiconductor wafer N: recess
F1To F4: reference marker
OW: the central point of semiconductor wafer
OT: the center of rotation of alignment tool
Claims (25)
1., for the method being directed at semiconductor wafer, the method utilizes a kind of semiconductor wafer processing equipment, and wherein this semiconductor wafer processing equipment includes:
Alignment tool, it is configured to move the most flatly or rotatably；
Vision camera, it shoots the circular semiconductor wafers moved horizontally on this alignment tool along a direction；
Bar pick-up, its pickup on this alignment tool alignment semiconductor wafer and then be transferred to determine position by this semiconductor wafer,
It is characterized in that, described method includes:
A semiconductor wafer is placed on alignment tool by ()；
B () by relative movement between vision camera and alignment tool, make described vision camera shoot matrix-like pattern that a certain region on described semiconductor wafer detecting formed on described semiconductor wafer is relative to the tilt angle alpha of reference frame；
C () makes described alignment tool rotate predetermined angular based on measured angle of inclination；
D () makes described alignment tool rotate predetermined angular so that at least two reference marker being formed on described semiconductor wafer is present in the shooting area of described vision camera；
E () makes described vision camera detect each primary importance in described at least two reference marker respectively；
F () makes described alignment tool rotate predetermined angular；
G () makes described vision camera detect the second position of any one in described at least two reference marker；And
The position correction value of semiconductor wafer described in (h) positional information calculation based on the reference marker on the described semiconductor wafer detected, and by based on the position correction value level calculated or move described alignment tool rotatably and correct the position of described semiconductor wafer.
Method the most according to claim 1, it is characterised in that the described predetermined angular of the described alignment tool in step (f) is 180 °.
Method the most according to claim 1, it is characterized in that, the method also includes, after step (c), described vision camera is made to be positioned on the periphery of described semiconductor wafer along a direction of principal axis by the relative movement between described vision camera and described alignment tool, make described semiconductor wafer half-twist, and make described vision camera detection recess of formation on the periphery of described semiconductor wafer.
Method the most according to claim 1, it is characterised in that step (h) including:
The first and second positional informationes based on the reference marker on the described semiconductor wafer detected detect the position of the center of rotation of described alignment tool；
The position calculation of center of rotation based on the alignment tool detected makes the position correction value of the position of the central point of described semiconductor wafer and the center superposition of the take-off location of bar pick-up；And
By based on the position correction value level calculated or move described alignment tool rotatably and correct the position of described semiconductor wafer.
Method the most according to claim 1, it is characterized in that, described alignment tool includes being formed at its both sides and determines multiple pin-and-holes of take-off location of described bar pick-up, in step (h), controller corrects the position of described semiconductor wafer so that the center superposition between central point and the plurality of pin-and-hole of described semiconductor wafer.
6., for the method being directed at semiconductor wafer, the method utilizes a kind of semiconductor wafer processing equipment, and wherein this semiconductor wafer processing equipment includes:
Alignment tool, it is configured to move the most flatly or rotatably；
Vision camera, it shoots the circular semiconductor wafers moved horizontally on this alignment tool along a direction；
Bar pick-up, its pickup on this alignment tool alignment semiconductor wafer and then be transferred to determine position by this semiconductor wafer,
It is characterized in that, described method includes:
A semiconductor wafer is placed on alignment tool by ()；
B () is by the relative movement between vision camera and alignment tool, described vision camera is made to be positioned on the periphery of described semiconductor wafer, make described semiconductor wafer rotate, and make described vision camera detection recess of formation on the periphery of described semiconductor wafer；
C () makes described alignment tool rotate predetermined angular so that at least two reference marker being formed on described semiconductor wafer is present in the shooting area of described vision camera；
D () makes described vision camera detect each primary importance in described at least two reference marker respectively；
E () makes described alignment tool rotate predetermined angular；
F () makes described vision camera detect the second position of any one in described at least two reference marker；And
The position correction value of semiconductor wafer described in (g) positional information calculation based on the reference marker on the described semiconductor wafer detected, and by based on the position correction value level calculated or move described alignment tool rotatably and correct the position of described semiconductor wafer.
Method the most according to claim 6, it is characterised in that the described predetermined angular of the described alignment tool in step (e) is 180 °.
Method the most according to claim 6, it is characterised in that step (g) including:
The first and second positional informationes based on the reference marker on the described semiconductor wafer detected detect the position of the center of rotation of described alignment tool；
The position calculation of central point based on the described alignment tool detected makes the position correction value of the position of the central point of described semiconductor wafer and the center superposition of the take-off location of bar pick-up；And
By based on the position correction value level calculated or move described alignment tool rotatably and correct the position of described semiconductor wafer.
Method the most according to claim 6, it is characterised in that described alignment tool includes being formed at its both sides and determines multiple pin-and-holes of take-off location of described bar pick-up, step (gIn), controller corrects the position of described semiconductor wafer so that the center superposition between central point and the plurality of pin-and-hole of described semiconductor wafer.
10. according to the method described in claim 1 or 6, it is characterised in that described vision camera can only move along a direction of principal axis, and the displacement that described alignment tool is on another direction of principal axis is less than or equal to the half of the diameter of described semiconductor wafer.
11. 1 kinds are used for the method being directed at semiconductor wafer, and the method utilizes a kind of semiconductor wafer processing equipment, and wherein this semiconductor wafer processing equipment includes:
Alignment tool, it is configured to move the most flatly or rotatably；
Vision camera, it shoots the circular semiconductor wafers flatly moved on this alignment tool along a direction；
Bar pick-up, its pickup on this alignment tool alignment semiconductor wafer and then be transferred to determine position by this semiconductor wafer,
It is characterized in that, described method includes:
A semiconductor wafer is placed on alignment tool by ()；
B () by relative movement between vision camera and alignment tool, make vision camera shoot matrix-like pattern that a certain region on described semiconductor wafer detecting formed on described semiconductor wafer is relative to the tilt angle alpha of reference frame；
C () makes described alignment tool rotate predetermined angular based on measured angle of inclination；
D () makes described vision camera and described alignment tool be moved relative to, thus in the substrate that described alignment tool is disposed thereon formed reference point and described semiconductor wafer at least two reference marker in any one labelling be concurrently present in the visual field of described vision camera；
E () makes described vision camera detect the positional information between primary importance and the described reference point of described reference marker；
F () makes described vision camera move so that the primary importance of another reference marker in described at least two reference marker and another reference point are concurrently present in the visual field of described vision camera；
G () makes the positional information between described primary importance and another reference point of described vision camera detection another reference marker described；
H () makes described alignment tool rotate predetermined angular so that the second position of any one in described at least two reference marker is concurrently present in the visual field of described vision camera with any one being formed in the suprabasil described reference point that described alignment tool is disposed thereon；
I () makes described vision camera detect the described positional information between any one in the described second position of any one in described at least two reference marker and described reference point；And
J () is in step (e), (g) and (i), position correction value based on semiconductor wafer described in the positional information calculation detected, and by level based on the position correction value calculated or move described alignment tool rotatably and correct the position of described semiconductor wafer.
12. according to the method described in claim 1 or 11, it is characterised in that in step (c), and described predetermined angular is-α+N × 90 ° or 90 ° of-α+N × 90 °, and wherein N is integer.
13. methods according to claim 11, it is characterised in that in step (d), described vision camera moves relative to described alignment tool, and described alignment tool moves relative to described vision camera, or both of which is moved relative to.
14. methods according to claim 11, it is characterised in that the described predetermined angular of the described alignment tool in step (h) is 180 °.
15. methods according to claim 11, it is characterized in that, the method also includes, after step (c), described vision camera is made to be positioned on the periphery of described semiconductor wafer along a direction of principal axis by the relative movement between described vision camera and described alignment tool, make described semiconductor wafer half-twist, and make the detection of described vision camera be formed at the recess on the periphery of described semiconductor wafer.
16. methods according to claim 11, it is characterised in that described reference point is multiple pin-and-holes, the plurality of pin-and-hole is arranged on the both sides of described alignment tool to determine the take-off location of described bar pick-up.
17. methods according to claim 11, it is characterised in that the reference marker on described semiconductor wafer is to be present in the semiconductor packages in the visual field of described vision camera in multiple semiconductor packages together with described reference point.
18. methods according to claim 16, it is characterised in that in step (j), controller corrects the position of described semiconductor wafer so that the center superposition between central point and the plurality of pin-and-hole of described semiconductor wafer.
19. 1 kinds are used for the method being directed at semiconductor wafer, and the method utilizes a kind of semiconductor wafer processing equipment, and wherein this semiconductor wafer processing equipment includes:
Alignment tool, it is configured to move the most flatly or rotatably；
Vision camera, it shoots the circular semiconductor wafers flatly moved on this alignment tool along a direction；
Bar pick-up, its pickup on this alignment tool alignment semiconductor wafer and then be transferred to determine position by this semiconductor wafer,
It is characterized in that, described method includes:
A semiconductor wafer is placed on alignment tool by ()；
B () is by the relative movement between vision camera and alignment tool, described vision camera is made to be positioned on the periphery of described semiconductor wafer, make described semiconductor wafer rotate, and make described vision camera detect the recess formed on the periphery of described semiconductor wafer；
C () makes described vision camera and described alignment tool be moved relative to, any one labelling at least two reference marker on the reference point formed in the substrate that described alignment tool is disposed thereon and described semiconductor wafer is concurrently present in the visual field of described vision camera
D () makes described vision camera detect the positional information between primary importance and the described reference point of described reference marker；
E () makes described vision camera move so that the primary importance of another reference marker in described at least two reference marker and another reference point are concurrently present in the visual field of described vision camera；
F () makes the positional information between primary importance and another reference point of described vision camera detection another reference marker described；
G () makes described alignment tool rotate predetermined angular so that the second position of any one in described at least two reference marker is concurrently present in the visual field of described vision camera with any one being formed in the suprabasil described reference point that described alignment tool is arranged on；
H () makes described vision camera detect the described positional information between any one in the described second position of any one in described at least two reference marker and described reference point；And
I () is in step (d), (f) and (h), position correction value based on semiconductor wafer described in the positional information calculation detected, and by level based on the position correction value calculated or move described alignment tool rotatably and correct the position of described semiconductor wafer.
20. methods according to claim 19, it is characterised in that in step (c), described vision camera moves relative to described alignment tool, and described alignment tool moves relative to described vision camera, or both of which is moved relative to.
21. methods according to claim 19, it is characterised in that the described predetermined angular of the described alignment tool in step (g) is 180 °.
22. methods according to claim 19, it is characterised in that described reference point is multiple pin-and-holes, the plurality of pin-and-hole is arranged on the both sides of described alignment tool to determine the take-off location of described bar pick-up.
23. methods according to claim 19, it is characterised in that the reference marker on described semiconductor wafer is to be present in the semiconductor packages in the visual field of described vision camera in multiple semiconductor packages together with described reference point.
24. methods according to claim 22, it is characterised in that in step (i), controller corrects the position of described semiconductor wafer so that the center superposition between central point and the plurality of pin-and-hole of described semiconductor wafer.
25. according to the method described in claim 11 or 19, it is characterised in that described vision camera can only move along a direction of principal axis, and described alignment tool is less than or equal to the half of the diameter of described semiconductor wafer along another axial displacement.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100041973A KR101237056B1 (en) | 2010-05-04 | 2010-05-04 | Method for Aligning Semiconductor Package Aggregate |
| KR10-2010-0041973 | 2010-05-04 | ||
| KR1020100048752A KR101275697B1 (en) | 2010-05-25 | 2010-05-25 | Method for Aligning Semiconductor Wafer |
| KR10-2010-0048752 | 2010-05-25 | ||
| PCT/KR2011/003268 WO2011139061A2 (en) | 2010-05-04 | 2011-05-02 | Method for aligning semiconductor materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102934216A CN102934216A (en) | 2013-02-13 |
| CN102934216B true CN102934216B (en) | 2016-08-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180028704.4A Active CN102934216B (en) | 2010-05-04 | 2011-05-02 | For the method being directed at semi-conducting material |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN102934216B (en) |
| PT (1) | PT2011139061W (en) |
| SG (1) | SG185017A1 (en) |
| TW (1) | TWI543294B (en) |
| WO (1) | WO2011139061A2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6218511B2 (en) * | 2013-09-02 | 2017-10-25 | Ｔｏｗａ株式会社 | Cutting apparatus and cutting method |
| JP6612670B2 (en) * | 2016-03-31 | 2019-11-27 | 東京応化工業株式会社 | Substrate processing apparatus and substrate processing method |
| JP2019027924A (en) * | 2017-07-31 | 2019-02-21 | セイコーエプソン株式会社 | Electronic component conveyance device, electronic component inspection device, positioning device, component conveyance device, and positioning method |
| KR102019377B1 (en) * | 2017-11-24 | 2019-09-06 | 한미반도체 주식회사 | Sawing Apparatus of Semiconductor Materials |
| WO2020083612A1 (en) | 2018-10-23 | 2020-04-30 | Asml Netherlands B.V. | Method and apparatus for adaptive alignment |
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| KR100328634B1 (en) * | 1998-12-22 | 2002-09-26 | 주식회사 다산 씨.앤드.아이 | Pre-aligner in wafer handling device of wafer probe system |
| KR20010058703A (en) * | 1999-12-30 | 2001-07-06 | 서성원 | Prealign apparatus for semiconductor wafer |
| JP4640715B2 (en) * | 2000-07-14 | 2011-03-02 | 株式会社ディスコ | Alignment method and alignment apparatus |
| US7949425B2 (en) * | 2006-12-06 | 2011-05-24 | Axcelis Technologies, Inc. | High throughput wafer notch aligner |
| KR20090130499A (en) * | 2008-06-16 | 2009-12-24 | 정진황 | Apparatus and method for aligning a substrate |
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2011
- 2011-05-02 PT PT2011003268A patent/PT2011139061W/en unknown
- 2011-05-02 SG SG2012078846A patent/SG185017A1/en unknown
- 2011-05-02 WO PCT/KR2011/003268 patent/WO2011139061A2/en active Application Filing
- 2011-05-02 CN CN201180028704.4A patent/CN102934216B/en active Active
- 2011-05-03 TW TW100115449A patent/TWI543294B/en active
Patent Citations (6)
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|---|---|---|---|---|
| EP0580895A2 (en) * | 1992-07-24 | 1994-02-02 | Fujitsu Limited | Method of mapping a tested semiconductor device |
| JPH06120322A (en) * | 1992-10-05 | 1994-04-28 | Hitachi Ltd | Method of recognizing position of semiconductor wafer, and semiconductor wafer used therefor |
| JPH07106405A (en) * | 1993-10-04 | 1995-04-21 | Disco Abrasive Syst Ltd | Aligning method |
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| WO2009066847A1 (en) * | 2007-11-20 | 2009-05-28 | Secron Co., Ltd. | Method of aligning a wafer and method of manufacturing a flip chip using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102934216A (en) | 2013-02-13 |
| WO2011139061A2 (en) | 2011-11-10 |
| TWI543294B (en) | 2016-07-21 |
| SG185017A1 (en) | 2012-11-29 |
| WO2011139061A3 (en) | 2012-04-19 |
| TW201203439A (en) | 2012-01-16 |
| PT2011139061W (en) | 2014-03-04 |
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