CN102934216A - Method for aligning semiconductor materials - Google Patents
Method for aligning semiconductor materials Download PDFInfo
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- CN102934216A CN102934216A CN2011800287044A CN201180028704A CN102934216A CN 102934216 A CN102934216 A CN 102934216A CN 2011800287044 A CN2011800287044 A CN 2011800287044A CN 201180028704 A CN201180028704 A CN 201180028704A CN 102934216 A CN102934216 A CN 102934216A
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- semiconductor wafer
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- alignment tool
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Abstract
OF THE DISCLOSUREMETHOD FOR ALIGNING OF SEMICONDUCTOR WAFERDisclosed herein is a method for accurately aligning the position of a semiconductor wafer to accurately transfer the semiconductor wafer to aprocessing position in an apparatus for manufacturing a semiconductor package.That is, the present invention provides a method for aligning a semiconductor wafer, implemented in a wafer treatment apparatus such as a singulation apparatus that cuts a semiconductor wafer, on which a plurality ofsemiconductor packages are arranged in a matrix form, into each semiconductor package, the method characterized in that a vision camera photographs an arrangement relationship between the center of a dowel hole and that of the semiconductor package to accurately determine the position of the wafer in the X-, Y-, and [Theta] directions, thus accurately transferring the wafer toa processing position. Therefore, the method of the present invention can be effectively applied to a method for aligning a new type of wafer such as a wafer-level package. Especially, the method of the present invention can minimize the effect of errors due to vibration of the apparatus, etc. and obtain an accurate measurement value, thus accurately aligning the position of the wafer.Fig. 10
Description
The cross reference of related application
The application is according to 35U.S.C. § 119(a) require to enjoy the rights and interests of the korean patent application No.10-2010-0041973 that submitted on May 4th, 2010 and the korean patent application No.10-2010-0048752 that submitted on May 25th, 2010, its whole content is incorporated herein by reference.
Technical field
The present invention relates to aim at the method for semiconductor wafer position, more particularly, relate to a kind of accurate aligning semiconductor wafer position semiconductor wafer accurately is sent to the method for the processing position in the equipment of making semiconductor packages.
Background technology
Usually, semiconductor packages is made as follows, a plurality of semiconductor packages with High Density Integration transistor and capacitor on it are attached to the rectangular plate shape lead frame, a plurality of semiconductor packages are electrically connected to the pad of lead frame by wire bond (wire bonding), it is molded to utilize epoxy resin that the gained semiconductor packages is carried out, and by cutting list (singulation) technique the semiconductor packages on the lead frame is cut into each semiconductor packages.
Recently, the type of semiconductor packages is variation, therefore developed make new advances semiconductor packages is cut single encapsulation technology.
Typically, cut set up standby in, the wafer that has formed a plurality of semiconductor packages on it is placed on the chuck table, cutting blade and chuck table move relative to each other, so that cutting blade cuts into each encapsulation with wafer.Here, the blade receiving slit of cutting blade by being configured to overlap with the line of cut of wafer on the chuck table do not contact with chuck table to carry out cutting technique.
But, have when round-shaped at the wafer that will experience cutting technique, wafer-class encapsulation for example, be difficult to make the line of cut of wafer and the blade receiving slit inregister on the chuck table, so, when wafer being sent to the position of the cutting technique on the chuck table in cutting single technique, wafer may accurately not be placed on the chuck table.
Like this, be not used for cutting if on chuck table, accurately place wafer, then the line of cut of wafer not with chuck table on blade receiving slit inregister, so the top surface of chuck table may be collided in the tip of cutting blade during cutting technique, to cutting blade or the chuck table injury of costliness.
In addition, will can wafer not cut into intended shape along the line of cut that forms matrix shape, thereby judge the semiconductor packages defectiveness, this has increased manufacturing cost and has significantly reduced productivity ratio.
Therefore, before wafer such as wafer-class encapsulation is sent to the position of cutting technique, must need the technique of accurate alignment wafer position.
Summary of the invention
Therefore, an object of the present invention is to provide a kind of at wafer processing apparatus such as cutting the method that is used for aiming at semiconductor wafer that sets up standby middle enforcement, cut and set up for the semiconductor wafer with a plurality of semiconductor packages of matrix arrangement on it is cut into each semiconductor packages, the method is characterized in that, the arrangement relation that vision camera is taken between pin-and-hole center and the semiconductor packages center is determined wafer in the position of X, Y and θ direction with accurate, thereby wafer accurately is sent to the processing position.Therefore, can be with method effective application of the present invention to the method for aiming at novel wafer such as wafer-class encapsulation.Especially, method of the present invention can make because the error effect that vibration equipment etc. cause minimizes, and obtains accurate measured value, thus the position of accurate alignment wafer.
On the one hand, the invention provides a kind of method of aiming at semiconductor wafer, the method comprises: (a) semiconductor wafer is placed on the alignment tool; (b) by relatively moving between vision camera and the alignment tool, make vision camera take a certain zone on the semiconductor wafer and detect the rectangular pattern that forms on the semiconductor wafer with respect to the angle of inclination of reference frame; (c) based on measured angle of inclination make described alignment tool rotation predetermined angular (β=-α+N * 90 ° or β=90 °-α+N * 90 °, wherein N is integer); (d) make described vision camera and described alignment tool move relative to each other, thereby the reference point that forms in alignment tool substrate disposed thereon and the predetermined point on the described semiconductor wafer are present in the field of view (FOV) of described vision camera simultaneously, and make described vision camera detect positional information between the predetermined point on described reference point and the semiconductor wafer; (e) based on the position correction value of the described semiconductor wafer of positional information calculation that detects; And (f) based on the position correction value of calculating by level or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
Can be respectively about the reference point that is formed on relative both sides with respect to semiconductor wafer and the predetermined point on the semiconductor wafer at least two to coming execution in step (d).
In step (d), described vision camera can move with respect to described alignment tool, and described alignment tool can move with respect to described vision camera, or they the two can move relative to each other.
The method can also comprise: between step (c) and step (d), if described vision camera can be only mobile along an axle (for example X-axis or Y-axis), if and described alignment tool is along half less than the diameter of described semiconductor wafer of the displacement of another axle (Y-axis or X-axis) direction, then make described alignment tool rotation predetermined angular, so that at least two reference markers that are formed on the semiconductor wafer are present in the shooting area of described vision camera; Make described vision camera detect respectively each primary importance in described at least two reference markers; Make described alignment tool rotation predetermined angular; Make described vision camera detect any second place in described at least two reference markers; Position correction value based on the described semiconductor wafer of positional information calculation of the reference marker on the semiconductor wafer that detects; And based on the position correction value of calculating by level or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
The method can also comprise, in step (c) afterwards, by relatively moving between described vision camera and the described alignment tool make described vision camera be positioned at described semiconductor wafer along on the periphery of an axle (for example X-axis or Y-axis) direction, make described semiconductor wafer half-twist, and make described vision camera detect the recess that forms on the periphery of described semiconductor wafer.
The method can also comprise: between step (c) and step (d), by relatively moving between described vision camera and the described alignment tool, detect the positional information of at least two reference markers that form on the described semiconductor wafer; Position correction value based on the described semiconductor wafer of positional information calculation of at least two reference markers on the semiconductor wafer that detects; And based on the position correction value of calculating by level or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
Predetermined point on the described semiconductor wafer can be to be present in semiconductor packages among the FOV of vision camera with reference point in a plurality of semiconductor packages.
In another aspect, the invention provides a kind of method for aiming at semiconductor wafer, the method comprises: (a) place semiconductor wafer at alignment tool; (b) by relatively moving between vision camera and the alignment tool, make vision camera be positioned on the periphery of semiconductor wafer, make described semiconductor wafer rotation, and make described vision camera detect the recess that forms on the periphery of described semiconductor wafer; (c) make described vision camera and described alignment tool move relative to each other, thereby the reference point that forms in alignment tool setting substrate thereon and the predetermined point on the described semiconductor wafer are present in the field of view (FOV) of described vision camera simultaneously, and make described vision camera detect positional information between the predetermined point on described reference point and the described semiconductor wafer; (d) based on the position correction value of the described semiconductor wafer of positional information calculation that detects; And (e) based on the position correction value of calculating by level or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
The method can also comprise: between step (c) and step (d), if described vision camera can be only along an axle (for example X-axis or Y-axis) if direction moves and described alignment tool in half less than the diameter of described semiconductor wafer of the displacement of another axle (Y-axis or X-axis) direction, then make described alignment tool rotation predetermined angular, so that the reference marker that is formed on the semiconductor wafer is present in the shooting area of described vision camera; Make described vision camera detect the primary importance of described reference marker; Make described alignment tool rotation predetermined angular; Make described vision camera detect the second place of described reference marker and the position of at least one reference marker except described reference marker; Position correction value based on the described semiconductor wafer of positional information calculation of the reference marker on the semiconductor wafer that detects; And based on the position correction value of calculating by level or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
Description of drawings
With reference to some example embodiment of the present invention shown in the accompanying drawing above and other feature of the present invention is described, in the accompanying drawing:
Fig. 1 is schematic plan view, and the semiconductor wafer that the method according to aligning semiconductor wafer of the present invention that partly shows is applied to is cut and set up standby configuration;
Fig. 2 to 9 is plane graphs, and order is illustrated in the semiconductor wafer of Fig. 1 and cuts the method for aiming at according to an embodiment of the invention semiconductor wafer that sets up standby middle enforcement;
Figure 10 and 11 is plane graphs, and the semiconductor wafer that is illustrated in Fig. 1 is cut according to an embodiment of the invention semiconductor wafer aligning the second correction process afterwards that sets up standby middle enforcement; And
Figure 12 is plane graph, and order is illustrated in the semiconductor wafer of Fig. 1 and cuts the method for aiming at according to another embodiment of the present invention semiconductor wafer that sets up standby middle enforcement.
Embodiment
Describe below with reference to the accompanying drawings the preferred embodiment according to the method for aligning semiconductor wafer of the present invention in detail.
At first, as the example of the semiconductor wafer processing equipment of the method that is used for executive basis aligning semiconductor wafer of the present invention, briefly describe semiconductor wafer with reference to Fig. 1 and cut and set up standby configuration.
Semiconductor wafer is cut and is set up standby comprising: loading unit 10, load circular semiconductor wafers W thereon, and each wafer W comprises a plurality of semiconductor packages that are arranged to matrix form and is loaded among the box M; The semiconductor wafer W of taking out from loading unit 10 is placed and aimed to alignment tool 11 on it; Transfer robot 12 is used for semiconductor wafer W is sent to alignment tool 11 from loading unit 10; Cutter unit 13 is used for and will cuts into each semiconductor packages from the semiconductor wafer W that alignment tool 11 transmits; Bar pick-up 14 is used for the semiconductor wafer W on the vacuum suction alignment tool 11 and sends it to cutter unit 13; And unit pick-up 17, be used for the semiconductor packages on the vacuum suction cutter unit 13 and send it to brush cleaning unit 15, cleaning unit 16 and visual inspection unit (not shown).
Each is cut by semiconductor wafer with the operation of upper-part and sets up standby controller (not shown) control.
Vision camera 18 is provided above alignment tool 11, is used for the semiconductor wafer W on the alignment tool 11 is taken pictures to detect its position.
Upper surface in chuck table 19 forms blade receiving slit 21, wherein receives the tip of cutting blade 20 with cordless, and blade receiving slit 21 is corresponding to the encapsulation line of cut that forms matrix shape on the semiconductor wafer W.
Therefore, when the semiconductor wafer W of the cutting blade 20 that relatively moves with respect to chuck table 19 on the line of cut cutting chuck table 19, the tip of cutting blade 20 does not contact chuck table 19 through blade receiving slit 21 and cutting semiconductor chip W.
Simultaneously, the method for executive basis aligning semiconductor wafer of the present invention on alignment tool 11.Here, can be along X-direction, along the X-Y-θ platform (not shown) of θ direction rotation alignment tool 11 is set along Y direction with about vertical axis, place the position of the semiconductor wafer W on the alignment tool 11 with correction.The X-Y-θ platform of mobile alignment tool 11 is mobile in a distance, with the position of meticulous adjusting semiconductor wafer W within the scope that does not increase the outfit of equipment size.
Especially, the invention provides and minimize by the error effect that vibration equipment etc. is caused and accurately aim at the method for semiconductor wafer W.
For this purpose, as shown in FIG. 10 and 11, when semiconductor wafer W being placed on the alignment tool 11, vision camera 18 is at the mobile rectangular pattern that forms on the top (for example semiconductor wafer W center top) of a side of semiconductor wafer W with detection of X-direction, thereby how many judgement patterns tilted.
Here, the rectangular pattern that semiconductor wafer W forms represent blade through or laser beam irradiation to it on semiconductor wafer W is cut into the line of cut of each semiconductor packages.
If the rectangular pattern that forms in semiconductor wafer W is ± α with respect to the angle of inclination of reference frame, then should the rotary alignment platform so that rectangular pattern be parallel to the angle beta of reference frame=(N * 90 °)-± α or β=(90 °-± α)+(N * 90 °), wherein N is integer.
Next, based on the information of the semiconductor wafer W of storing in the controller, with alignment tool 11 along θ direction rotation predetermined angular, with perpendicular to semiconductor wafer W.
That is to say, along the θ direction with alignment tool 11 rotation predetermined angulars, so that the rectangular pattern of semiconductor wafer W overlaps with the blade receiving slit 21 of chuck table 19.
Then, at moving-vision video camera 18 on the X-direction so that the pin-and-hole 22 that is fixed positioned in alignment tool 11 both sides and near be positioned at the edge of the semiconductor wafer W adjacent with pin-and-hole 22 semiconductor packages are taken pictures, thereby detect its position.
For example, move horizontally vision camera 18 with the center of a certain semiconductor packages on the center of detecting pin-and-hole 22 and the semiconductor wafer W that is adjacent along X-direction.
Here, the semiconductor packages reference semiconductor packages of its position of indicating to detect based on the information of the semiconductor wafer W of storing in the controller.
Can with determining the position of pin-and-hole 22 and carrying out once at least with reference to the process of the position of semiconductor packages, if need more accurate position probing value, this process can be carried out twice so.At this moment, after the pin-and-hole 22 of a side was taken pictures with the reference semiconductor packages that is adjacent, vision camera 18 can move horizontally that the pin-and-hole 22 of opposite side and the reference semiconductor packages that is adjacent are taken pictures along X-direction.
Like this, during in the center of the pin-and-hole 22 that detects both sides with reference to the position of semiconductor packages, calculate the relative position that detects and the difference between the target relative position, thereby can calculate the position correction value of semiconductor wafer W.
Therefore, the center of controller (not shown) based semiconductor encapsulation and the center calculated correction value of pin-and-hole 22, and move alignment tool 11 along θ direction and/or X-direction and/or Y direction, thus the position of calibrating semiconductor wafer W with controller in store about pin-and-hole 22 and consistent with reference to the information of position relationship between the semiconductor packages.
Like this, the positional information of the pin-and-hole 22 fixing with respect to the position that can detect based on vision camera 18 with the position correction of semiconductor wafer W once or twice, thereby the position of calibrating semiconductor wafer W accurately, the error effect that make simultaneously because vibration equipment etc. causes minimizes.
Simultaneously, by before carrying out the method for the position of aiming at semiconductor wafer W with upper type, the invention provides a kind of reference marker F with respect to semiconductor wafer W
1To F
4Aim at the method for the position of semiconductor wafer W.
With reference to figs. 2 to 9, the method for aiming at semiconductor wafer according to another embodiment of the present invention will be described hereinafter.
Here, when semiconductor wafer W being placed on the alignment tool 11 by transfer robot 12 from loading unit 10, vision camera 18 moves with the recess N(that the semiconductor wafer W edge formed according to predesigned order referring to Fig. 2 along X-direction above alignment tool) and reference marker F
1To F
4(referring to Fig. 2) takes pictures, thereby determines the position of semiconductor wafer W on alignment tool 11.Then, based on determined position, preset reference position is arrived in the position correction of semiconductor wafer W, thereby semiconductor wafer W is placed on the exact position of bar pick-up 14, to be picked up by bar pick-up 14.
At first, semiconductor has round-shaped, can comprise that canyon topography is formed in recess N on the periphery as the reference point of semiconductor wafer W.
In addition, a plurality of reference marker F
1To F
4Be formed in the centreline space precalculated position spaced apart by a predetermined distance with the recess N that passes semiconductor wafer W.
Pre-stored center from semiconductor wafer W is along X-direction with along Y direction to each reference marker F in the controller (not shown)
1To F
4Range information.
As shown in Figure 2, when semiconductor wafer W being placed on the alignment tool 11, vision camera 18 moves and takes semiconductor wafer W from the top at the center of semiconductor wafer W along X-direction, to detect the line of cut that forms matrix shape on the semiconductor wafer W, determines thus how many patterns tilts.
Then, based on the information of the semiconductor wafer W of storing in the controller, along the θ direction with alignment tool 11 rotation predetermined angulars, so that the line of cut of semiconductor wafer W overlaps (referring to Fig. 1) with the blade receiving slit 21 of chuck table 19.
Next, vision camera 18 moves to be positioned at the edge top (among the figure clockwise 90 °) of semiconductor wafer W one side along X-direction.In this state, vision camera 18 is along 90 ° of direction rotations, with the recess N that forms in the edge that detects semiconductor wafer W one side.
When recess N was positioned at vision camera 18 bottom as shown in Figure 3, alignment tool 11 was rotated in a clockwise direction predetermined angular, as shown in Figure 4, and to regulate the position of semiconductor wafer W, so that the first reference marker F
1With the 3rd reference marker F
3Be present in the shooting area of vision camera 18.Then, 18 couples of the first reference marker F of vision camera
1Take pictures to detect the first reference marker F
1Position coordinates.
Next, as shown in Figure 5, vision camera 18 moves along X-direction, to the 3rd reference marker F
3Take pictures, to determine the 3rd reference marker F
3Positional information, and turn back to initial position.
Here, because vision camera 18 moves horizontally along X-direction, so can be based on the first and the 3rd reference marker F
1And F
3Positional information determine the semiconductor wafer W disalignment what.
In addition, in order further to improve accuracy, can repeat above operation, so that semiconductor wafer W and central lines.
That is, in that (this predetermined angular is corresponding to moving and to the first and the 3rd reference marker F along X-direction by vision camera 18 with alignment tool 11 rotation predetermined angulars
1And F
3The value of taking pictures and obtaining, that is, corresponding to the degree of semiconductor wafer W disalignment) and by acquisition the first and the 3rd reference marker F that takes pictures
1And F
3The process of positional information be repeated to carry out so that the first and the 3rd reference marker F
1And F
3After being positioned on the center line, can carry out following technique.
Like this, the first and the 3rd reference marker F that detects in vision camera 18
1And F
3Position when asymmetrical relative to one another with respect to center line, perhaps in order further to improve accuracy, can allow vision camera 18 to detect the first reference marker F
1The position, allow with alignment tool 11 rotation predetermined angulars, so that the 3rd reference marker F
3Be positioned on the center line, then allow vision camera 18 to detect the 3rd reference marker F by taking pictures
3The position.
As mentioned above, when detecting the first and the 3rd reference marker F
1And F
3The position time, the controller (not shown) is based on the first and the 3rd reference marker F that detects
1And F
3The position and about the first and the 3rd reference marker F
1And F
3With central point O
WBetween the pre-stored information of distance detect the central point O of semiconductor wafer W
WPrimary importance.
Then, as shown in Figure 6, alignment tool 11 is Rotate 180 ° in the counterclockwise direction, so that the 3rd reference marker F
3Be present in the shooting area of vision camera 18, thereby take the 3rd reference marker F
3The second place.
Next, as shown in Figure 7, vision camera 18 moves along Y direction again, to take the first reference marker F
1Thereby, detect the first reference marker F
1The second place.
Here, by the first and the 3rd reference marker F that detects
1And F
3Second place coordinate determine the central point O of semiconductor wafer W
WSecond place coordinate.
Like this, as the central point O of semiconductor wafer W
WThe first and second positions when being determined, can pass through central point O
WThe first and second positions between difference detect the pivot O of alignment tool 11
TThe position.
If the central point O of semiconductor wafer W
WPivot O with alignment tool 11
TThe position overlap, even alignment tool 11 Rotate 180s ° so, central point O
WThe position do not change yet.But, as shown in Figure 7, if the central point O of semiconductor wafer W
WNot with the pivot O of alignment tool 11
TThe position overlap, so when alignment tool 11 Rotate 180s °, central point O
WThe position change.
Therefore, at the central point O of semiconductor wafer W
WLocation aware the time, can determine the pivot O of alignment tool 11
TThe position.
In this embodiment, in order to improve accuracy, by detecting the first and the 3rd reference marker F
1And F
3The first and second positions the two determine the pivot O of alignment tool 11
TThe position.But, can be by determining the first reference marker F
1Position or the 3rd reference marker F
3The position determine the pivot O of alignment tool 11
TThe position.
At the pivot O that determines alignment tool 11
TThe position time, can determine the central point O of semiconductor wafer W
WThe pivot O that departs from alignment tool 11
TWhat, pivot O
TUtilize in advance anchor clamps or illusory semiconductor wafer to obtain also then to be stored in the controller.
But, because alignment tool 11 is by for example electrical machinery rotation, so pivot may have slight variation during use.
Therefore, by semiconductor wafer W being placed on the pivot O that determines alignment tool 11 on the alignment tool 11
TThe position, by taking pictures to detect the first and the 3rd reference marker F
1And F
3Primary importance, with alignment tool 11 Rotate 180s °, and detect the first and the 3rd reference marker F
1And F
3The above-mentioned technique of the second place be more accurate.
Simultaneously, as shown in Figure 8, provide regularly a pair of pin-and-hole 22 in alignment tool 11 both sides, bar pick-up 14 is directed to the exact position when allowing the semiconductor wafer W on bar pick-up 14 vacuum suction alignment tools 11.Form outstanding a pair of location positioning pin (pin) (not shown) downwards in bar pick-up 14 both sides, to insert in each pin-and-hole 22.
Therefore, when bar pick-up 14 picks up semiconductor wafer W on the alignment tool 11, the location positioning pin of bar pick-up 14 is inserted in the pin-and-hole 22, so that bar pick-up 14 is at constant position picking up semi-conductor crystal sheet W.Therefore, if the central point O of semiconductor wafer W
WOverlap with the center (being the center of wafer pickup position) between the pin-and-hole 22, bar pick-up 14 can be from exact position picking up semi-conductor crystal sheet W so.
As mentioned above, as the central point O that detects semiconductor wafer W
WThe position time, can determine the central point O of semiconductor wafer W
WPivot O with alignment tool 11
TDeviation, thereby the roughly rotation that can calculate according to the rotation of alignment tool 11 semiconductor wafer W.
Therefore, as shown in Figure 9, the central point O of controller (not shown) based semiconductor wafer W
WThe second place and the pivot O of alignment tool 11
TThe position calculation corrected value, with alignment tool 11 rotation predetermined angulars, then move alignment tool 11 along X-direction and/or Y direction, so that the central point O of semiconductor wafer W
WOverlap with the center between the pin-and-hole 22, thus the position of calibrating semiconductor wafer W.
Here, based on the pivot O of alignment tool 11
TCentral point O with semiconductor wafer W
WBetween deviation, take the first and the 3rd reference marker F in the vision camera 18 that is moving along X-direction
1And F
3The time, by reflection rotation the first and the 3rd reference marker F
1And F
3With the value of the value in the shooting area that is present in vision camera 18 and semiconductor wafer W disalignment, determine the anglec of rotation of alignment tool 11.
Like this, according to the present invention, even the reference marker F on the semiconductor wafer W
1And F
3Depart from the center line through recess N, vision camera 18 also can be determined reference marker F when mobile along a direction (namely along X-direction)
1To F
4The position.As a result, can be based on reference marker F
1To F
4The central point O of location positioning semiconductor wafer W
WThe position and the pivot O of alignment tool 11
TThe position, the position of accurate correction semiconductor wafer W thus.
Therefore, semiconductor wafer W accurately can be sent to next and process the position and stand next technique, thereby the appearance of defective is minimized.
Simultaneously, as another example of the method for aiming at semiconductor wafer W, the invention provides and a kind ofly can detect each reference marker with respect to the position of semiconductor wafer W and by utilizing detection information to come the method for the position of calibrating semiconductor wafer W along the vision camera 18 that X and Y direction move by utilizing.
For this reason, as shown in figure 12, vision camera 18 is at first mobile to take the presumptive area of semiconductor wafer W, i.e. the middle section of semiconductor wafer W, thus measure the inclined degree of the rectangular pattern that forms on the semiconductor wafer W.Then, based on metrical information along the θ direction with alignment tool 11 rotation predetermined angulars with perpendicular to semiconductor wafer W.
Next, vision camera 18 moves to the top of semiconductor wafer W and moves horizontally to detect the position of at least two reference markers in a plurality of reference markers along X and Y direction.
For example, vision camera 18 moves freely in X-direction and/or Y direction, takes the first reference marker F
1Detecting its position coordinates, and take the 3rd reference marker F
3To detect its position coordinates.
Like this, at the first and the 3rd reference marker F
1And F
3Position when detected, the controller (not shown) is based on the first and the 3rd reference marker F that detects
1And F
3The position and in advance storage about the first and the 3rd reference marker F
1And F
3With central point O
WBetween the information of distance, detect the central point O of semiconductor wafer W
WThe position.
Then, based on reference marker such as the first and the 3rd reference marker F
1And F
3The position correction value of positional information calculation semiconductor wafer W, then level or rotatably mobile alignment tool 11, thereby the position of calibrating semiconductor wafer W.
Like this, the semiconductor wafer W of accurately aiming at accurately can be sent to next and process the position and experience next technique, thereby the appearance of defective is minimized.
Semiconductor wafer W is being cut into cutting of each semiconductor packages and is setting up the method for standby middle aligning semiconductor wafer W although above-described embodiment relates to, also can by identical or similar mode will be applied to according to the method for aligning semiconductor wafer W of the present invention except semiconductor wafer cut set up for any wafer processing apparatus of the various wafers of manipulation.
Will be obvious that in addition when utilizing shape to implement according to alignment methods of the present invention corresponding to the anchor clamps of semiconductor wafer, it belongs to technical scope of the present invention.Such grip size can corresponding to the size of semiconductor wafer, can comprise rectangular pattern, reference marker and/or recess.Anchor clamps only are a kind of illusory semiconductor wafers, and clearly, anchor clamps are identical with semiconductor wafer or its equivalent, and are widely used for those skilled in the art in the invention.
As mentioned above, the method according to aligning semiconductor wafer of the present invention has the following advantages:
At first, because vision camera can easily detect the reference marker position that forms on the wafer, so even corresponding wafer is new, even on novel wafer such as wafer-class encapsulation (reference marker departs from the center line of wafer on it), also can accurately determine to place the position of wafer.Therefore, can come accurate alignment wafer position by the position correction wafer position based on determined placement wafer; And
Second, taken such as the relation between the center position of the position of the permanent datum of pin-and-hole and the semiconductor packages on the wafer once or twice by vision camera, with the position correction value of definite wafer, and can proofread and correct and the alignment wafer position based on the position correction value of taking with minimum number.Therefore, the chance of occurrence of the vision camera measurement error that vibration equipment etc. causes is minimized, and obtain accurate measured value, thus alignment wafer position accurately.
As above, described and shown the preferred embodiments of the present invention, but, the invention is not restricted to this, on the contrary, should be understood that and to make various modifications and variations and not break away from spirit of the present invention and the technical scope that defines such as claims the present invention by those skilled in the art.
(description of reference numerals)
10: loading unit 11: alignment tool
12: transfer robot 13: cutter unit
14: bar pick-up 15: the brush cleaning unit
16: cleaning unit 17: the unit pick-up
18: vision camera 19: chuck table
20: cutting blade 21: the blade receiving slit
22: pin-and-hole
W: semiconductor wafer N: recess
F
1To F
4: reference marker
O
W: the central point of semiconductor wafer
O
T: the pivot of alignment tool
Claims (37)
1. method of be used for aiming at semiconductor wafer, described method comprises:
(a) semiconductor wafer is placed on the alignment tool;
(b) by relatively moving between vision camera and the alignment tool, make vision camera take a certain zone on the described semiconductor wafer and detect the rectangular pattern that forms on the described semiconductor wafer with respect to the tilt angle alpha of reference frame;
(c) make described alignment tool rotation predetermined angular based on measured angle of inclination;
(d) make described vision camera and described alignment tool relative to each other mobile, thereby be present in simultaneously among the visual field FOV of described vision camera at reference point and the predetermined point on the described semiconductor wafer that the substrate disposed thereon of described alignment tool forms, and make described vision camera detect positional information between the predetermined point on described reference point and the described semiconductor wafer;
(e) based on the position correction value of the described semiconductor wafer of positional information calculation that detects; And
(f) by based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
2. method according to claim 1, wherein respectively about the described predetermined point on the described semiconductor wafer and the reference point that is formed on relative both sides with respect to described semiconductor wafer at least two to execution in step (d).
3. method according to claim 1, wherein in step (d), described vision camera moves with respect to described alignment tool, described alignment tool moves with respect to described vision camera, perhaps they the two all relative to each other mobile.
4. each described method in 3 according to claim 1 also comprises:
Between step (c) and step (d), if described vision camera can be only along an axle (for example X-axis or Y-axis) if the mobile and displacement of described alignment tool on another axle (Y-axis or X-axis) direction less than half of the diameter of described semiconductor wafer
Make described alignment tool rotation predetermined angular, so that at least two reference markers that are formed on the described semiconductor wafer are present in the shooting area of described vision camera;
Make described vision camera detect respectively each primary importance in described at least two reference markers;
Make described alignment tool rotation predetermined angular;
Make described vision camera detect any second place in described at least two reference markers;
Position correction value based on the described semiconductor wafer of positional information calculation of the reference marker on the semiconductor wafer that detects; And
By based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
5. method according to claim 4, wherein said predetermined angular is 180 ° or 90 °.
6. each described method in 3 according to claim 1, also comprise, in step (c) afterwards, make described vision camera be positioned on the periphery of described semiconductor wafer along an axle (X-axis or Y-axis) direction by relatively moving between described vision camera and the described alignment tool, make described semiconductor wafer half-twist, and make described vision camera detect recess on the periphery that is formed on described semiconductor wafer.
7. method according to claim 4, also comprise, in step (c) afterwards, make described vision camera be positioned on the periphery of described semiconductor wafer along an axle (X-axis or Y-axis) direction by relatively moving between described vision camera and the described alignment tool, make described semiconductor wafer half-twist, and make described vision camera detect recess on the periphery that is formed on described semiconductor wafer.
8. each described method in 3 according to claim 1 also comprises:
Between step (c) and step (d),
Detect the positional information of at least two reference markers that form on the described semiconductor wafer by relatively moving between described vision camera and the described alignment tool;
Position correction value based on the described semiconductor wafer of positional information calculation of at least two reference markers on the semiconductor wafer that detects; And
By based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
9. each described method in 3 according to claim 1, wherein said reference point is pin-and-hole.
10. each described method in 3 according to claim 1, the predetermined point on the wherein said semiconductor wafer are to be present in semiconductor packages among the FOV of described vision camera with described reference point in a plurality of semiconductor packages.
11. method according to claim 4, wherein said reference point is pin-and-hole.
12. method according to claim 4, the predetermined point on the wherein said semiconductor wafer are to be present in semiconductor packages among the FOV of described vision camera with described reference point in a plurality of semiconductor packages.
13. method according to claim 8, wherein said reference point is pin-and-hole.
14. method according to claim 8, the predetermined point on the wherein said semiconductor wafer are to be present in semiconductor packages among the FOV of described vision camera with described reference point in a plurality of semiconductor packages.
15. a method that is used for aiming at semiconductor wafer, described method comprises:
(a) semiconductor wafer is placed on the alignment tool;
(b) by relatively moving between vision camera and the alignment tool, make described vision camera be positioned on the periphery of described semiconductor wafer, make described semiconductor wafer rotation, and make described vision camera detect the recess that forms on the periphery of described semiconductor wafer;
(c) make described vision camera and described alignment tool relative to each other mobile, so that the reference point and the predetermined point on the described semiconductor wafer that form in the substrate disposed thereon of described alignment tool be present among the visual field FOV of described vision camera simultaneously, and make described vision camera detect positional information between the predetermined point on described reference point and the described semiconductor wafer;
(d) based on the position correction value of the described semiconductor wafer of positional information calculation that detects; And
(e) by based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
16. method according to claim 15, wherein respectively about the predetermined point on the described semiconductor wafer and the reference point that is formed on relative both sides with respect to described semiconductor wafer at least two to execution in step (d).
17. method according to claim 15, wherein in step (c), described vision camera moves with respect to described alignment tool, and described alignment tool moves with respect to described vision camera, or they the two all relative to each other mobile.
18. each described method in 17 according to claim 15 also comprises:
Between step (b) and step (c), if described vision camera can be only along an axle (for example X-axis or Y-axis) if direction moves and the displacement of described alignment tool on another axle (Y-axis or X-axis) direction less than half of the diameter of described semiconductor wafer
Make described alignment tool rotation predetermined angular, so that at least two reference markers that are formed on the described semiconductor wafer are present in the shooting area of described vision camera;
Make described vision camera detect respectively each primary importance in described at least two reference markers;
Make described alignment tool rotation predetermined angular;
Make described vision camera detect respectively each the second place in described at least two reference markers;
Position correction value based on the described semiconductor wafer of positional information calculation of the reference marker on the semiconductor wafer that detects; And
By based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
19. method according to claim 18, wherein said predetermined angular are 180 ° or 90 °.
20. each described method in 17 according to claim 15, wherein said reference point is pin-and-hole.
21. each described method in 17 according to claim 15, the predetermined point on the wherein said semiconductor wafer are to be present in semiconductor packages among the FOV of described vision camera with described reference point in a plurality of semiconductor packages.
22. method according to claim 18, wherein said reference point is pin-and-hole.
23. method according to claim 18, the predetermined point on the wherein said semiconductor wafer are to be present in semiconductor packages among the FOV of described vision camera with described reference point in a plurality of semiconductor packages.
24. each described method in 3 according to claim 1 also comprises:
Between step (c) and step (d), if described vision camera can be only along an axle (for example X-axis or Y-axis) if direction moves and described alignment tool in half less than the diameter of described semiconductor wafer of the displacement of another axle (Y-axis or X-axis) direction
Make described alignment tool rotation predetermined angular, so that the reference marker that is formed on the described semiconductor wafer is present in the shooting area of described vision camera;
Make described vision camera detect the primary importance of described reference marker;
Make described alignment tool rotation predetermined angular;
Make described vision camera detect the second place of described reference marker and the position of at least one reference marker except described reference marker;
Position correction value based on the described semiconductor wafer of positional information calculation of the reference marker on the semiconductor wafer that detects; And
By based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
25. method according to claim 24, wherein said predetermined angular are 180 °.
26. method according to claim 24, also comprise, in step (c) afterwards, make described vision camera be positioned on the periphery of described semiconductor wafer along an axle (for example X-axis or Y-axis) direction by relatively moving between described vision camera and the described alignment tool, make described semiconductor wafer half-twist, and make described vision camera detect the recess that forms on the periphery of described semiconductor wafer.
27. method according to claim 24, wherein said reference point is pin-and-hole.
28. method according to claim 24, the predetermined point on the wherein said semiconductor wafer are to be present in semiconductor packages among the FOV of described vision camera with described reference point in a plurality of semiconductor packages.
29. a method that is used for aiming at semiconductor wafer, described method comprises:
(a) semiconductor wafer is placed on the alignment tool;
(b) by relatively moving between vision camera and the alignment tool, make described vision camera take a certain zone on the described semiconductor wafer and detect the rectangular pattern that forms on the described semiconductor wafer with respect to the tilt angle alpha of reference frame;
(c) make described alignment tool rotation predetermined angular based on measured angle of inclination;
(d) make described alignment tool rotation predetermined angular, so that at least two reference markers that are formed on the described semiconductor wafer are present in the shooting area of described vision camera;
(e) make described vision camera detect respectively each primary importance in described at least two reference markers;
(f) make described alignment tool rotation predetermined angular;
(g) make described vision camera detect any second place in described at least two reference markers; And
(h) based on the position correction value of the described semiconductor wafer of positional information calculation of the reference marker on the described semiconductor wafer that detects, and by based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
30. method according to claim 29, wherein said predetermined angular are 180 ° or 90 °.
31. method according to claim 29, also comprise, in step (c) afterwards, make described vision camera be positioned on the periphery of described semiconductor wafer along an axle (X-axis or Y-axis) direction by relatively moving between described vision camera and the described alignment tool, make described semiconductor wafer half-twist, and make described vision camera detect the recess that the periphery at described semiconductor wafer forms.
32. method according to claim 29, wherein step (h) comprising:
Detect the position of the pivot of described alignment tool based on the first and second positional informations of the reference marker on the described semiconductor wafer that detects;
Make the position correction value of center superposition of the take-off location of the position of central point of described semiconductor wafer and bar pick-up based on the position calculation of the pivot of the alignment tool that detects; And
By based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
33. method according to claim 29, wherein said alignment tool comprises a plurality of pin-and-holes that are formed on its both sides and determine the take-off location of described pick-up, in step (h), controller is proofreaied and correct the position of described semiconductor wafer, so that the center superposition between the central point of described semiconductor wafer and the described a plurality of pin-and-hole.
34. a method that is used for aiming at semiconductor wafer, described method comprises:
(a) semiconductor wafer is placed on the alignment tool;
(b) by relatively moving between vision camera and the alignment tool, make described vision camera be positioned on the periphery of described semiconductor wafer, make the rotation of described semiconductor wafer, and make described vision camera detect the recess that the periphery at described semiconductor wafer forms;
(c) make described alignment tool rotation predetermined angular, so that at least two reference markers that are formed on the described semiconductor wafer are present in the shooting area of described vision camera;
(d) make described vision camera detect respectively each primary importance in described at least two reference markers;
(e) make described alignment tool rotation predetermined angular;
(f) make described vision camera detect any second place in described at least two reference markers; And
(g) based on the position correction value of the described semiconductor wafer of positional information calculation of the reference marker on the described semiconductor wafer that detects, and by based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
35. method according to claim 34, wherein said predetermined angular are 180 ° or 90 °.
36. method according to claim 34, wherein step (g) comprising:
Detect the position of the pivot of described alignment tool based on the first and second positional informations of the reference marker on the described semiconductor wafer that detects;
Make the position correction value of center superposition of the take-off location of the position of central point of described semiconductor wafer and bar pick-up based on the position calculation of the pivot of the described alignment tool that detects; And
By based on the position correction value level of calculating or the mobile described alignment tool position of proofreading and correct described semiconductor wafer rotatably.
37. method according to claim 34, wherein said alignment tool comprises a plurality of pin-and-holes that are formed on its both sides and determine the take-off location of described pick-up, in step (g), controller is proofreaied and correct the position of described semiconductor wafer, so that the center superposition between the central point of described semiconductor wafer and the described a plurality of pin-and-hole.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100041973A KR101237056B1 (en) | 2010-05-04 | 2010-05-04 | Method for Aligning Semiconductor Package Aggregate |
| KR10-2010-0041973 | 2010-05-04 | ||
| KR10-2010-0048752 | 2010-05-25 | ||
| KR1020100048752A KR101275697B1 (en) | 2010-05-25 | 2010-05-25 | Method for Aligning Semiconductor Wafer |
| PCT/KR2011/003268 WO2011139061A2 (en) | 2010-05-04 | 2011-05-02 | Method for aligning semiconductor materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102934216A true CN102934216A (en) | 2013-02-13 |
| CN102934216B CN102934216B (en) | 2016-08-03 |
Family
ID=44904204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180028704.4A Active CN102934216B (en) | 2010-05-04 | 2011-05-02 | For the method being directed at semi-conducting material |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN102934216B (en) |
| PT (1) | PT2011139061W (en) |
| SG (1) | SG185017A1 (en) |
| TW (1) | TWI543294B (en) |
| WO (1) | WO2011139061A2 (en) |
Cited By (2)
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| CN104425369A (en) * | 2013-09-02 | 2015-03-18 | 东和株式会社 | Cutting device and cutting method |
| CN109841567A (en) * | 2017-11-24 | 2019-06-04 | 韩美半导体有限公司 | Cutting semiconductor materials device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6612670B2 (en) * | 2016-03-31 | 2019-11-27 | 東京応化工業株式会社 | Substrate processing apparatus and substrate processing method |
| JP2019027924A (en) * | 2017-07-31 | 2019-02-21 | セイコーエプソン株式会社 | Electronic component conveyance device, electronic component inspection device, positioning device, component conveyance device, and positioning method |
| CN112955926A (en) * | 2018-10-23 | 2021-06-11 | Asml荷兰有限公司 | Method and apparatus for adaptive alignment |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI543294B (en) | 2016-07-21 |
| SG185017A1 (en) | 2012-11-29 |
| PT2011139061W (en) | 2014-03-04 |
| WO2011139061A3 (en) | 2012-04-19 |
| CN102934216B (en) | 2016-08-03 |
| TW201203439A (en) | 2012-01-16 |
| WO2011139061A2 (en) | 2011-11-10 |
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