TW202238795A - Processing apparatus, and manufacturing method of processed product - Google Patents

Abstract

The invention shortens the time spent in the alignment operation and includes: a cutting table 2A and a cutting table 2B, holding a sealed substrate W provided with an alignment mark AM, and rotatable; a cutting mechanism 4, cutting the sealed substrate W held on the cutting table 2A and the cutting table 2B; a reference mark M1, provided on the cutting table 2A and the cutting table 2B, wherein the relative position thereof relative to a rotating center RC of the cutting table 2A and the cutting table 2B is known; and a camera 24, capturing the reference mark M1 and the alignment mark AM. The alignment mark AM is captured while the camera 24 is moved in one direction with respect to the sealed substrate W, and, based on the captured alignment mark AM and the reference mark M1, the sealed substrate W and the cutting mechanism 4 are aligned in one direction and in a direction orthogonal to the one direction.

Description

Processing device and method for manufacturing processed product

The invention relates to a processing device and a method for manufacturing a processed product.

As a conventional cutting device, as shown in Patent Document 1, when cutting a rectangular sealed substrate, for each sealed substrate, the camera is moved along the longitudinal direction to perform an alignment operation (positioning operation). operation) and then cutting is performed, and then the sealed substrate is rotated 90 degrees, and the camera is moved in the short side direction to perform an alignment operation and then cutting is performed.

However, in the above-mentioned cutting device, the alignment operation is performed in two directions, the longitudinal direction and the short-side direction, and therefore the alignment operation takes time. As a result, the productivity of the cutting device decreases. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-128122

[Problem to be Solved by the Invention]

Therefore, the present invention is made to solve the above-mentioned problems, and its main subject is to shorten the time required for the alignment operation. [Means to solve the problem]

That is, the processing device of the present invention is characterized by comprising: a processing table capable of holding and rotating an object to be processed on which an alignment mark is provided; a processing mechanism that processes the object to be processed held on the processing table; A reference mark is arranged on the processing worktable, and its relative position to the rotation center of the processing workbench is known; and a camera is used to photograph the reference mark and the alignment mark, so that the camera is The object to be processed is photographed while the object is moving in one direction, and based on the photographed alignment mark and the reference mark, the alignment in the one direction and a direction perpendicular to the one direction is performed. Alignment of the object to be processed and the processing mechanism. [Effect of the invention]

According to the present invention thus constituted, the time required for the alignment operation can be shortened.

Next, examples of the present invention will be described in more detail. However, the present invention is not limited by the following description.

As described above, the processing apparatus of the present invention is characterized by comprising: a processing table that holds and can rotate the object to be processed on which the alignment mark is provided; Processing; fiducial marks, set on the processing workbench, and the relative position of the rotation center of the processing workbench is known; The alignment mark is photographed while the object to be processed is moving in one direction, and based on the photographed alignment mark and the reference mark, the process is carried out in the one direction and in a direction perpendicular to the one direction. The alignment of the object to be processed and the processing mechanism. The processing apparatus moves a camera in one direction relative to the object to be processed without rotating the object to be processed, and images alignment marks in one direction and based on the imaged alignment marks and fiducial marks. Alignment of the object to be processed and the processing mechanism in directions (ie, two directions) perpendicular to the one direction. Therefore, there is no need to photograph the alignment marks of the object before and after rotating the object. As a result, the number of times of imaging the alignment mark can be reduced, and the time required for the alignment operation can be shortened.

As a specific embodiment of the processing device, it is desirable that the object to be processed is in a rectangular shape, and the imaging camera is moved in one of the long-side direction and the short-side direction of the object to be processed to take pictures. The object to be processed and the processing mechanism are aligned in the longitudinal direction and the short direction based on the alignment mark and the imaged reference mark.

Preferably, the processing table includes: a holding plate for holding the object to be processed; and a holding base on which the holding plate is detachably attached, and the processing object is held using the holding plate. For an object, the reference mark is provided on the holding plate or the holding base.

In order to control the alignment well, ideally, the processing device corrects the offset of the imaging camera by photographing the reference mark with the imaging camera.

Furthermore, the alignment mark can be imaged by the imaging camera with the offset corrected, so that the object to be processed and the processing mechanism can be accurately aligned.

As a specific embodiment for obtaining the relative position between the rotation center of the processing table and the reference mark, it is preferable that a center for calculating the rotation center of the processing table is provided on the processing table. The mark for calculation calculates the center of rotation by photographing the mark for center with the imaging camera before and after rotating the processing table by a predetermined angle, and calculates the reference mark based on the calculated center of rotation relative position to the center of rotation.

Preferably, the processing device of the present invention further includes a processing moving mechanism that moves the processing mechanism in mutually orthogonal X and Y directions on a horizontal plane, and the processing moving mechanism has: a pair of X-direction guide rails, and a supporting body that moves along the pair of X-direction guide rails and supports the processing mechanism so as to be movable along the Y-direction. . According to the above structure, the processing mechanism can be moved in the X direction and Y direction which are perpendicular to each other on the horizontal plane by the processing moving mechanism, so the processing table can be moved without moving the processing table in the X direction and the Y direction. Process the object to be processed. Therefore, a moving mechanism for moving the processing table can be eliminated, and the structure of the device can be simplified and the footprint can be reduced.

In the above structure, it is desirable that the imaging camera moves along the support body in the Y direction together with the processing mechanism. According to this configuration, the imaging camera can be moved using the moving mechanism for processing.

Moreover, the manufacturing method of the processed product which manufactures a processed product using the said processing apparatus is also one aspect of this invention.

<An embodiment of the present invention> Hereinafter, an embodiment of the processing apparatus of the present invention will be described with reference to the drawings. In addition, any of the figures shown below are appropriately omitted or exaggerated and schematically drawn for easy understanding. The same symbols are assigned to the same constituent elements, and explanations are appropriately omitted.

<Overall structure of processing equipment> The processing apparatus 100 of this embodiment is a cutting apparatus which cuts the sealed substrate W which is an object to be processed, and separates it into a plurality of products P which are processed products.

Specifically, as shown in FIG. 1 , the cutting device 100 includes: two cutting tables (processing tables) 2A, 2B holding the sealed substrate W; The sealed substrate W is transported to the cutting table 2A and the cutting table 2B, and the sealed substrate W is held; the cutting mechanism (processing mechanism) 4 holds the sealed substrate W on the cutting table 2A and the cutting table 2B The substrate W is cut; the transfer table 5 moves a plurality of products P; the second holding mechanism 6 transfers a plurality of products P from the cutting table 2A and the cutting table 2B to the transfer table 5 and hold a plurality of products P; the moving mechanism 7 for conveyance has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; and the moving mechanism (moving mechanism for processing) 8 for cutting, The cutting mechanism 4 is moved relative to the sealed substrate W held on the cutting table 2A and the cutting table 2B.

Here, the sealed substrate W is resin-molded so that at least the electronic components are resin-sealed with respect to the substrate to which electronic components such as semiconductor chips, resistive elements, and capacitive elements are connected. As the substrate constituting the sealed substrate W, lead frames and printed wiring boards can be used, and other than these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, and ceramic substrates can also be used. Substrates, glass substrates, resin substrates, etc. In addition, the substrate constituting the sealed substrate W may or may not be provided with wiring.

In the following description, the directions perpendicular to each other in the plane (horizontal plane) along the upper surfaces of the cutting table 2A and the cutting table 2B are respectively referred to as the X direction and the Y direction, and the X direction and the Y direction are respectively referred to as the X direction and the Y direction. The vertical direction perpendicular to the direction is defined as the Z direction. Specifically, let the left-right direction of FIG. 1 be an X direction, and let an up-down direction be a Y direction. Although it will be described later, the X direction is the moving direction of the support body 812, and is perpendicular to the longitudinal direction (direction in which the beam portion extends) of the beam portion (beam portion) on which the pair of legs of the door-shaped support body 812 is erected. direction (see Figure 2).

＜Table for cutting＞ The two cutting tables 2A and 2B are fixed and installed in the X direction, the Y direction, and the Z direction. In addition, the cutting table 2A can be rotated in the θ direction by the rotation mechanism 9A provided under the cutting table 2A. In addition, the cutting table 2B can be rotated in the θ direction by the rotation mechanism 9B provided under the cutting table 2B.

These two cutting tables 2A and 2B are installed along the X direction on a horizontal plane. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are on the same horizontal plane (at the same height position in the Z direction) (see FIG. 4 ), and the upper surfaces of these Centers (specifically, rotation centers based on the rotation mechanism 9A and the rotation mechanism 9B) are arranged so as to be located on the same straight line extending in the X direction (see FIGS. 2 and 3 ).

In addition, the two cutting tables 2A, 2B absorb and hold the sealed substrate W. As shown in FIG. . Each vacuum pump 10A, 10B is a water-sealed vacuum pump, for example.

Here, the cutting table 2A and the cutting table 2B are fixed in the XYZ direction, so the piping (not shown) connected to the cutting table 2A and the cutting table 2B from the vacuum pump 10A and the vacuum pump 10B can be shortened. As shown in the figure), the pressure loss of the piping can be reduced to prevent the reduction of the adsorption force. As a result, even an extremely small package of, for example, 1 mm square or less can be reliably adsorbed to the cutting table 2A and the cutting table 2B. In addition, since the reduction of the adsorption force due to the pressure loss of the piping can be prevented, the capacities of the vacuum pump 10A and the vacuum pump 10B can be reduced, resulting in miniaturization and cost reduction.

＜First Holding Mechanism＞ As shown in FIG. 1 , the first holding mechanism 3 holds the sealed substrate W to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B. As shown in Figures 5 and 6, the first holding mechanism 3 has: a suction head 31, provided with a plurality of suction parts 311 for suction and holding the sealed substrate W; and a vacuum pump (not shown), connected to the suction The suction part 311 of the head 31 . Then, the sealed substrate W is transported from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B by the suction head 31 being moved to a desired position by the transportation moving mechanism 7 described later.

As shown in FIG. 1 , the substrate supply mechanism 11 has: a substrate accommodating portion 111 for accommodating a plurality of sealed substrates W from the outside; A holding mechanism 3 absorbs and holds the holding position RP. The holding position RP is set so as to be parallel to the two cutting tables 2A and 2B in the X direction. In addition, the substrate supply mechanism 11 may include a heating unit 113 for heating the sealed substrate W sucked by the first holding mechanism 3 in a soft state for easy suction.

＜Cutting mechanism (processing mechanism)＞ As shown in FIGS. 1 , 2 and 3 , the cutting mechanism 4 has two rotary tools 40 including a blade 41A, a blade 41B, and two spindle portions 42A, 42B. The two spindle parts 42A and 42B are provided so that the rotation axes of these spindles are along the Y direction, and the blades 41A and 41B attached to the spindles are arranged to face each other (see FIG. 3 ). The blade 41A of the mandrel part 42A and the blade 41B of the mandrel part 42B cut the sealed substrate W held on each cutting table 2A, 2B by rotating in a plane including the X direction and the Z direction. Furthermore, in the cutting device 100 of the present embodiment, as shown in FIG. 4 , in order to suppress the frictional heat generated by the blades 41A and 41B, a liquid supply mechanism 12 is provided, and the liquid supply mechanism 12 has a jet cutting water ( machining fluid) spray nozzle 121. The spray nozzle 121 is supported by, for example, a Z-direction moving part 83 described later.

＜Transfer table＞ As shown in FIG. 1 , the transfer stage 5 of the present embodiment is a stage for moving a plurality of products P inspected by an inspection unit 13 described later. The transfer table 5 is called a so-called index table, and temporarily places a plurality of products P before sorting the plurality of products P into various trays 21 . In addition, the transfer table 5 is arranged in a row along the X direction with the two cutting tables 2A and 2B on the horizontal plane. Furthermore, the transfer table 5 can move back and forth along the Y direction, and can move to the sorting mechanism 20 . A plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (defective products, defective products, etc.) obtained by the inspection unit 13 .

Furthermore, the various trays 21 are transported to desired positions by the tray transport mechanism 22 that moves along the transfer shaft 71, and the products P sorted by the sorting mechanism 20 are placed thereon. After being sorted, various trays 21 are stored in the tray storage unit 23 by the tray transport mechanism 22 . In the present embodiment, three types of trays are stored in the tray storage unit 23, such as the tray 21 before storing the product P, the tray 21 containing the good product P, and the tray 21 containing the defective product P requiring rework.

＜Inspection Department＞ Here, the inspection unit 13 is provided between the cutting table 2A, the cutting table 2B, and the transfer table 5 as shown in FIG. 1 , and inspects a plurality of products P held by the second holding mechanism 6 . The inspection part 13 of this embodiment has the 1st inspection part 131 which inspects the sealing surface (package surface) of the product P, and the 2nd inspection part 132 which inspects the lead surface of the product P. The first inspection part 131 is a camera with an optical system for inspecting the package surface, and the second inspection part 132 is a camera with an optical system for inspection of the lead surface. Furthermore, the first inspection unit 131 and the second inspection unit 132 may be shared.

The sealed substrate W and product P of this embodiment have a structure in which one side of the substrate is molded with resin. In this structure, the resin-molded surface is the surface where the electronic components connected to the substrate are sealed with resin, and is called "sealing surface" or "package surface". On the other hand, the non-resin-molded surface on the opposite side to the resin-molded surface exposes the leads that usually function as external connection electrodes of the product, so it is called a lead surface. When the said lead is a protruding electrode used in electronic components, such as a ball grid array (BGA), it may also be called a "spherical surface." Furthermore, the non-resin-molded surface on the opposite side to the resin-molded surface may also have no leads formed thereon, so it may also be referred to as a "substrate surface". In the description of this embodiment, the resin-molded surface is described as a "sealing surface" or "package surface", and the resin-molded surface opposite to the resin-molded surface is described as a "lead surface".

In addition, in order to be able to inspect both sides of the plurality of products P by the inspection unit 13 , an inversion mechanism 14 (see FIG. 1 ) for inverting the plurality of products P is provided. The reversing mechanism 14 has a holding table 141 for holding a plurality of products P, and a reversing unit 142 such as a motor for reversing the holding table 141 so that its front and back are reversed.

When the second holding mechanism 6 holds a plurality of products P from the cutting table 2A and the cutting table 2B, the packaging surface of the products P faces downward. In this state, while the plurality of products P are being conveyed from the cutting table 2A and the cutting table 2B to the reversing mechanism 14 , the sealing surfaces of the products P are inspected by the first inspection unit 131 . Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 . In this state, the lead surface of the product P faces downward, and the reversing mechanism 14 is moved to the second inspection part 132 , thereby inspecting the lead surface of the product P.

＜Second Holding Mechanism＞ As shown in FIG. 1 , the second holding mechanism 6 holds a plurality of products P for transferring the plurality of products P from the cutting table 2A and the cutting table 2B to the transfer table 5 . As shown in FIG. 8 , the second holding mechanism 6 has: an adsorption head 61 provided with a plurality of adsorption parts 611 for adsorbing and holding a plurality of products P; and a vacuum pump (not shown) connected to the suction head 61 Adsorption part 611. Then, by moving the suction head 61 to a desired position by the transport moving mechanism 7 described later, a plurality of products P are transported from the cutting table 2A and the cutting table 2B to the holding table 141 or Transfer workbench 5.

＜Movement Mechanism for Transport＞ As shown in FIG. 1 , the moving mechanism 7 for conveyance moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting table 2A and the cutting table 2B, and moves the second holding mechanism 6 at least below the substrate supply mechanism 11 . It moves between the table 2A for cutting, the table 2B for cutting, and the holding table 141 .

Moreover, as shown in FIG. 1 , the transfer mechanism 7 has a common transmission shaft 71 extending linearly along the direction (X direction) in which the two cutting tables 2A, 2B and the transfer table 5 are arranged, It is used to move the first holding mechanism 3 and the second holding mechanism 6 .

The transmission shaft 71 is set in the following range, that is: the first holding mechanism 3 can move to the top of the substrate supply part 112 of the substrate supply mechanism 11, and the second holding mechanism 6 can move to the top of the transfer table 5 ( Refer to Figure 1). In addition, with respect to the transmission shaft 71, the first holding mechanism 3, the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the transfer table 5 are arranged on the same side in plan view ( near the front). In addition, the inspection unit 13, the reversing mechanism 14, various trays 21, the tray transport mechanism 22, the tray storage unit 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described later, and the recovery container 172 are also installed on the transmission shaft 71. On the same side (near the front side).

Furthermore, as shown in Fig. 5, Fig. 6 and Fig. 8, the moving mechanism 7 for conveyance has: a main moving mechanism 72, which moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transmission shaft 71; The mechanism 73 makes the first holding mechanism 3 and the second holding mechanism 6 move up and down in the Z direction relative to the transmission shaft 71; and the horizontal movement mechanism 74 makes the first holding mechanism 3 and the second holding mechanism 6 move relative to the transmission shaft 71 Move horizontally in the Y direction.

As shown in FIGS. 5-8 , the main moving mechanism 72 has: a common guide rail 721, which is arranged on the transmission shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, The first holding mechanism 3 and the second holding mechanism 6 are moved along the guide rail 721 .

The guide rail 721 extends linearly in the X direction along the transmission shaft 71, and is provided in the same range as the transmission shaft 71 so that the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11 and the second holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11. The second holding mechanism 6 can move to the top of the transfer table 5 . The guide rail 721 is slidably provided with a slide member 723 provided with the first holding mechanism 3 and the second holding mechanism 6 via the elevating movement mechanism 73 and the horizontal movement mechanism 74 . Here, the guide rail 721 is shared by the first holding mechanism 3 and the second holding mechanism 6, but the elevating movement mechanism 73, the horizontal moving mechanism 74 and the sliding member 723 are for the first holding mechanism 3 and the second holding mechanism 6 respectively. set up.

The rack and pinion mechanism 722 has: a cam rack 722a, shared by the first holding mechanism 3 and the second holding mechanism 6; and a pinion 722b, respectively arranged on the first holding mechanism 3 and the second holding mechanism 6, by An actuator (not shown) rotates. The cam rack 722a is provided on the common transmission shaft 71, and can be changed to various lengths by connecting a plurality of cam rack elements. In addition, the pinion 722b is provided on the sliding member 723, and is called a so-called roller pinion (roller pinion), as shown in FIG. A plurality of roller pins 722b2 are provided at equal intervals in the circumferential direction between the pair of roller bodies 722b1 and are provided so as to be able to roll with respect to the roller bodies 722b1. The rack and pinion mechanism 722 of this embodiment uses the above-mentioned roller pinion, so two or more roller pins 722b2 contact the cam rack 722a, and there is no backlash in the forward and reverse directions. When the first holding mechanism 3 and the second holding mechanism 6 move in the X direction, the positioning accuracy becomes better.

As shown in FIGS. 5 and 8 , the elevating movement mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 , respectively. As shown in Fig. 5 and Fig. 6, the elevating and moving mechanism 73 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and has: a Z-direction guide rail 73a, which is provided along the Z direction; and the actuator part 73b, which moves the first holding mechanism 3 along the Z direction guide rail 73a. In addition, as the actuator part 73b, for example, a ball screw mechanism may be used, an air cylinder may be used, and a linear motor may be used. In addition, as shown in FIG. 8 , the structure of the vertical movement mechanism 73 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3 .

As shown in FIGS. 5 , 6 and 8 , the horizontal movement mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 , respectively. As shown in Figures 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, and has: Y direction The guide rail 74a is arranged along the Y direction; the elastic body 74b imparts force to the first holding mechanism 3 toward one side of the Y direction guide rail 74a; and the cam mechanism 74c makes the first holding mechanism 3 move toward the other side of the Y direction guide rail 74a. Move sideways. Here, the cam mechanism 74c uses an eccentric cam, and by rotating the eccentric cam with an actuator such as a motor, the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted.

Furthermore, as shown in FIG. 8 , the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3 . In addition, a configuration in which the horizontal movement mechanism 74 is not provided to the second holding mechanism 6 may be employed, or a configuration in which the horizontal movement mechanism 74 is not provided to both the first holding mechanism 3 and the second holding mechanism 6 may be employed. Furthermore, similarly to the vertical movement mechanism 73, the horizontal movement mechanism 74 may use a ball screw mechanism instead of the cam mechanism 74c, may use an air cylinder, and may use a linear motor.

<Movement Mechanism for Cutting (Movement Mechanism for Processing)> The moving mechanism 8 for cutting linearly moves each of the two spindle parts 42A and 42B independently in the X direction, the Y direction, and the Z direction.

Specifically, as shown in Fig. 2, Fig. 3 and Fig. 9, the moving mechanism 8 for cutting includes: an X direction moving part 81, which moves the mandrel part 42A and the mandrel part 42B linearly in the X direction; the Y direction moving part 82 , to linearly move the spindle part 42A and the spindle part 42B in the Y direction; and a Z-direction moving part 83 to linearly move the spindle part 42A and the spindle part 42B in the Z direction.

The X-direction moving part 81 is shared by the two cutting tables 2A, 2B, especially as shown in FIG. 2 and FIG. A pair of X-direction rails 811 ; and a support body 812 that moves along the pair of X-direction rails 811 and supports the mandrel part 42A and the mandrel part 42B via the Y-direction moving part 82 and the Z-direction moving part 83 . A pair of X direction guide rail 811 is provided in the side of two cutting tables 2A, 2B provided along the X direction. In addition, the support body 812 is, for example, a gate shape and has a shape extending in the Y direction. Specifically, the support body 812 has a pair of leg portions extending upward from the pair of X-direction rails 811 , and a beam portion (beam portion) spanning the pair of leg portions, and the beam portion extends in the Y direction.

Moreover, the support body 812 linearly reciprocates along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending along the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. In addition, the supporting body 812 may also be configured to move back and forth by other linear motion mechanisms such as linear motors.

Especially as shown in FIG. 3 , the Y-direction moving part 82 has: a Y-direction rail 821 disposed in the support body 812 along the Y-direction; and a Y-direction slider 822 that moves along the Y-direction rail 821 . The Y-direction slider 822 is driven by, for example, a linear motor 823 , and linearly moves back and forth on the Y-direction guide rail 821 . In this embodiment, two Y direction sliders 822 are provided corresponding to the two spindle parts 42A and 42B. Thereby, the two spindle parts 42A, 42B can move independently of each other in a Y direction. In addition, the Y-direction slider 822 may also be configured to move back and forth by other linear motion mechanisms using a ball screw mechanism.

As shown in FIGS. 2 to 4 , the Z direction moving part 83 has: a Z direction guide rail 831 arranged along the Z direction in each Y direction slider 822 ; and a Z direction slider 832 arranged along the Z direction guide rail 831 The mandrel part 42A, the mandrel part 42B are moved and supported. That is, the Z direction moving part 83 is provided corresponding to each spindle part 42A, 42B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly moves back and forth on the Z-direction guide rail 831 . In addition, the Z-direction slider 832 may also be configured to move back and forth by other linear motion mechanisms such as a ball screw mechanism.

Regarding the positional relationship between the moving mechanism 8 for cutting and the transmission shaft 71, as shown in FIG. 1 and FIG. . Specifically, the transmission shaft 71 is disposed above the support body 812 so as to cross the support body 812 , and the transmission shaft 71 and the support body 812 are in a positional relationship of intersecting each other.

＜Swarf Storage Unit＞ In addition, as shown in FIG. 1 , the cutting device 100 of the present embodiment further includes a machining waste storage unit 17 for storing machining waste S such as end materials generated by cutting the sealed substrate W. As shown in FIG.

As shown in FIGS. 2 to 4 , the machining waste storage unit 17 is arranged below the cutting table 2A and the cutting table 2B, and has: a guide chute 171 that surrounds the cutting machine in plan view. The machining chips S guided by the guide chute 171 are recovered by using the upper opening 171X of the table 2A and the table 2B for cutting, and the recovery container 172 . The recovery rate of the machining waste S can be improved by providing the machining waste storage unit 17 below the cutting table 2A and the cutting table 2B.

The guide chute 171 guides the machining chips S scattered or dropped from the cutting table 2A and the cutting table 2B to the recovery container 172 . In this embodiment, the upper opening 171X of the guide chute 171 surrounds the table 2A for cutting and the table 2B for cutting (refer to FIG. 3 ), so it is difficult to miss the machining chips S, and further improvement can be achieved. The recovery rate of machining chips S. In addition, the guide chute 171 is provided in a manner to surround the rotation mechanism 9A and the rotation mechanism 9B provided under the cutting table 2A and the cutting table 2B (see FIG. 4 ), so as to protect the rotation mechanism 9A and the rotation mechanism. The mechanism 9B is constructed so as to avoid machining chips S and cutting water.

In the present embodiment, the chip storage unit 17 is shared by the two cutting tables 2A and 2B, but may be provided correspondingly to the cutting table 2A and the cutting table 2B, respectively.

The recovery container 172 recovers the machining chips S passing through the guide chute 171 by its own weight, and in this embodiment, as shown in FIG. Furthermore, the two recovery containers 172 are disposed on the near side of the transmission shaft, and are configured to be independently detachable from the near side of the cutting device 100 . With such a configuration, maintainability such as disposal of machining waste S can be improved. In addition, one recovery container 172 may be installed under all cutting tables in consideration of the size of the sealed substrate W, the size and amount of the processing waste S, and workability, or may be divided into three or more.

In addition, as shown in FIG. 4 and the like, the chip storage unit 17 has a separating portion 173 for separating cutting water and chips. As a structure of the separation unit 173 , for example, a filter such as a perforated plate through which the cutting water passes is provided on the bottom surface of the recovery container 172 . The machining chips S can be recovered by the separation unit 173 without accumulating cutting water in the recovery container 172 .

＜First Cleaning Organization＞ In addition, as shown in FIGS. 1 and 5 , the cutting device 100 of the present invention further includes: a first cleaning mechanism 18 that cleans the plurality of products P held on the cutting table 2A and the cutting table 2B. The surface side (lead side) is clean. The first cleaning mechanism 18 uses spray nozzles 18a (refer to FIG. ), to clean the upper surface side of the product P.

As shown in FIG. 5 , the first cleaning mechanism 18 is configured to be movable along the transmission shaft 71 together with the first holding mechanism 3 . Here, the first cleaning mechanism 18 is disposed on the sliding member 723 , and the sliding member 723 slides on the guide rail 721 disposed on the transmission shaft 71 . Here, between the first cleaning mechanism 18 and the sliding member 723, a lifting mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction is provided. For the above-mentioned elevating movement mechanism 181, it is conceivable to use a rack and pinion mechanism, a ball screw mechanism, or an air cylinder, for example.

＜Second Cleaning Organization＞ Furthermore, as shown in FIG. 1 , the cutting device 100 of the present invention further includes a second cleaning mechanism 19 for cleaning the lower surface side (packaging surface) of the plurality of products P held by the second holding mechanism 6 . The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection unit 13, and sprays cleaning liquid and/or compressed air to the lower surfaces of the plurality of products P held by the second holding mechanism 6, The lower surface side of the article P is thereby cleaned. That is, the second cleaning mechanism 19 cleans the lower surface side of the product P while the second holding mechanism 6 is moving along the transmission shaft 71 .

<An example of the operation of the cutting device> Next, an example of the operation of the cutting device 100 will be described. FIG. 9 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 during the operation of the cutting device 100 . Furthermore, in the present embodiment, all operations or control of the operation of the cutting device 100, such as conveyance of the sealed substrate W, cutting of the sealed substrate W, inspection of the product P, etc., are performed or controlled by the control unit CTL (see FIG. 1 )conduct.

The substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W stored in the substrate storage unit 111 to the holding position RP held by the first holding mechanism 3 .

Next, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 absorbs and holds the sealed substrate W. Thereafter, the conveyance moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting table 2A and the cutting table 2B, and the first holding mechanism 3 releases the adsorption and holding, and the sealed substrate W is removed. W is placed on the cutting table 2A and the cutting table 2B. At this time, the position of the sealed substrate W in the X direction is adjusted by the main moving mechanism 72 , and the position of the sealed substrate W in the Y direction is adjusted by the horizontal movement mechanism 74 . Then, the cutting table 2A and the cutting table 2B suck and hold the sealed substrate W.

Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the table 2B for cutting, the elevating movement mechanism 73 raises the first holding mechanism 3 so that it does not touch the moving mechanism 8 for cutting ( support 812) to the point where physical interference occurs. Furthermore, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, when the support body 812 is retracted from the cutting table 2B to the transfer table 5 side , it is not necessary to lift and lower the first holding mechanism 3 as described.

In this state, the moving mechanism 8 for cutting moves the two mandrel parts 42A, 42B sequentially in the X direction and the Y direction, and the tables 2A, 2B for cutting are rotated, whereby the sealed substrate W is cut. Singularized for a grid pattern.

After cutting, the conveyance moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (lead surfaces) of the plurality of products P held on the cutting tables 2A and 2B. After the cleaning, the transport moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.

Next, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting table 2A and cutting table 2B after cutting, and the second holding mechanism 6 adsorbs and holds a plurality of products P. Thereafter, the conveyance moving mechanism 7 moves the second holding mechanism 6 holding a plurality of products P to the second cleaning mechanism 19 . Thereby, the second cleaning mechanism 19 cleans the lower surface side (seal surface) of the plurality of products P held by the second holding mechanism 6 .

After cleaning, a plurality of products P held by the second holding mechanism 6 are inspected on both sides by the inspection unit 13 and the reversing mechanism 14 . Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 to the transfer table 5 , and the second holding mechanism 6 releases suction and holding, and places a plurality of products P on the transfer table 5 . A plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (defective products, defective products, etc.) obtained by the inspection unit 13 .

In addition, regarding the double-sided inspection, for example, first, one of the surfaces of the product P is inspected in a state of being sucked and held by the second holding mechanism 6 . Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while being sucked and held by the reversed holding table 141, thereby performing Check both sides. Further, the subsequent conveyance of the product P from the reversing table 14 to the transfer table 5 can be performed by transferring from the holding table 141 to the second holding mechanism 6 . In addition, the holding table 141 is configured to be movable in the X direction, at least one of the holding table 141 or the transfer table 5 is configured to be movable in the Z direction, and the holding table 141 is moved to Above the transfer table 5, the product P can also be transferred to the transfer table 5 and transferred.

<Alignment function of cutting device> The cutting device 100 of the present embodiment has an alignment function of holding the cutting table 2A and the cutting table 2B (sealed substrate W) without rotating the cutting table 2A. , The sealed substrate W of the table 2B for cutting is aligned with the blade 41A and the blade 41B of the cutting mechanism 4 in two directions of the X direction and the Y direction.

Specifically, as shown in FIG. 10, the cutting device 100 includes: a reference mark M1, which is provided on the cutting table 2A and the cutting table 2B, and is connected to the cutting table 2A and the cutting table. The relative position of the rotation center RC of 2B is known; and the imaging camera 24 photographs the reference mark M1 and the alignment mark AM.

Here, as shown in FIG. 10 and FIG. 11 , the cutting table 2A and the cutting table 2B of the present embodiment have: a replaceable holding plate 201; Using the plate 201 , the sealed substrate W is held using the holding plate 201 . Furthermore, the holding plate 201 is a jig for holding the sealed substrate W. As shown in FIG.

The reference mark M1 is provided on the upper surface of the holding plate 201 of the cutting table 2A and the cutting table 2B. The holding plate 201 holds the sealed substrate W having a rectangular shape, and two reference marks M1 are provided at positions corresponding to short sides of the sealed substrate W. As shown in FIG. Furthermore, there may be one reference mark M1, or three or more reference marks.

In addition, on the upper surface of the holding base 202 of the table 2A for cutting and the table 2B for cutting, a center calculation device for obtaining the center of rotation RC of the table 2A for cutting and the table 2B for cutting is provided. Mark M2. The center calculation mark M2 is provided at a position where it can be imaged by the imaging camera 24 in a state where the holding plate 201 is attached to the holding base 202 . The mark M2 for center calculation of the present embodiment is located in the X direction with respect to the rotation center RC in a state where the long side direction of the sealed substrate W coincides with the Y direction by the cutting table 2A and the cutting table 2B. Set on the same straight line (refer to Figure 10).

As shown in FIGS. 1 to 3 and 10 , the imaging camera 24 is installed on one of the two spindle parts 42A and 42B (here, the spindle part 42A), and moves together with the spindle part 42A. That is, the imaging camera 24 can move in the X direction along the X direction guide rail 811 of the moving mechanism 8 for cutting, and can move in the Y direction along the support body 812 . The imaging camera 24 of this embodiment is a camera with a wide field of view and high resolution, and can detect a plurality of marks in one shot.

Then, the cutting apparatus 100 images the alignment mark AM of the sealed substrate W while moving the imaging camera 24 in one direction (here, the longitudinal direction) relative to the sealed substrate W, and based on the imaged alignment mark AM and The reference marks M1 are used to align the sealed substrate W with the blades 41A and 41B of the cutting mechanism 4 in the longitudinal direction and the lateral direction.

Specifically, in the cutting device 100, the longitudinal direction of the sealed substrate W held on the cutting table 2A and the cutting table 2B is in the Y direction, and the imaging camera is set in this state. 24 moves in the Y direction along the support body 812 and photographs a plurality of alignment marks AM provided on the sealed substrate W, respectively.

In this embodiment, a plurality of alignment marks AM are respectively provided on two facing sides of the sealed substrate W along the longitudinal direction, as shown in FIG. 12 , one of the facing sides (in FIG. 12 A plurality of alignment marks AM on the left side) is moved along the Y direction (long side direction) and photographed at the same time, and then the support body 812 is moved in the X direction to make the other opposite side (in FIG. 12 A plurality of alignment marks AM on the right side) moves along the Y direction (long side direction) and shoots at the same time.

In the alignment operation of the sealed substrate W in FIG. 12 , the operation of imaging the reference mark M1 twice and the operation of imaging the alignment mark AM ten times, that is, a total of twelve operations are performed. That is, the imaging camera 24 is positioned at a predetermined imaging position in each imaging operation. Furthermore, twelve alignment marks AM are provided on the sealed substrate W shown in FIG. Associate Mark AM. Specifically, a point where the cutting lines indicated by two alignment marks AM intersect is arranged at the center of the image and photographed, and then the position of alignment marks AM is detected.

In addition, the cutting device 100 of the present embodiment has a function of calculating the rotation center RC of the cutting table 2A and the cutting table 2B using the center calculation marker M2. Specifically, in the state of (a) of FIG. 13 , that is, in the state where the center calculation mark M2 is on the left side, the center calculation mark M2 is photographed, and in the state of (b) of FIG. 13 , that is, the cut The center calculation mark M2 is photographed in a state in which the cutting table 2A and the cutting table 2B are rotated by a predetermined angle (180 degrees in this embodiment) and the center calculation mark M2 is located on the right side. Based on the position of the imaging camera 24 when the two captured images are taken, the coordinates of the center calculation mark M2 before rotation, and the coordinates of the center calculation mark M2 after rotation, the table 2A for cutting and the cutting table 2A are calculated. Use the coordinates of the center of rotation RC of table 2B.

In addition, before the cutting apparatus 100 of this embodiment images the alignment mark AM of the sealed substrate W, the imaging camera 24 images the reference mark M1, and calculates the displacement amount of the imaging camera 24 (especially, the deviation in the Y direction). displacement). Then, the cutting device 100 corrects the displacement amount of the imaging camera 24, and simultaneously images a plurality of alignment marks AM. By using the reference mark M1 in this way to correct the displacement of the position of the imaging camera 24, a high-precision linear scale (linear scale) is not required, for example, a rotary encoder built in a servo motor can be used.

<Details of alignment and cutting operations> Hereinafter, an alignment operation and a cutting operation of the cutting device 100 according to the present embodiment will be described with reference to FIG. 14 . In addition, the following alignment operation and cutting operation are controlled by the control part CTL.

(Step S1: determination of the center of rotation RC) First, before turning the table 2A for cutting and the table 2B for cutting by a predetermined angle (here, 180 degrees), and before rotating the table 2A for cutting, the table 2B for cutting by a predetermined angle (here, 180 degrees) 180 degrees), the center calculation mark M2 provided on the cutting table 2A and the cutting table 2B is photographed by the camera 24 (refer to FIG. 13 (a) and FIG. 13 (b)) . Then, the control unit CTL calculates the cutting operation based on the coordinates of the center calculation mark M2 before rotation obtained from the captured image before rotation and the coordinates of the center calculation mark M2 obtained from the captured image after rotation. The coordinates of the rotation center RC of the table 2A and the cutting table 2B. Furthermore, the above operation is performed on the two cutting tables 2A, 2B, respectively, and the coordinates of the respective rotation centers RC of the two cutting tables 2A, 2B are calculated.

(Step S2: Calculate the distance L1 and distance L2 between the reference mark M1 and the rotation center RC) Next, the imaging camera 24 images each of the reference marks M1 provided on the holding plate 201 . Then, the distance L1 in the longitudinal direction and the distance L2 in the lateral direction between the reference mark M1 and the center of rotation RC of the table 2A for cutting and the table 2B for cutting are calculated from the captured image (see ( a) and (b) of Figure 15). Thereby, the relative position of the reference mark M1 and the rotation center RC is determined. Furthermore, these distances L1 and L2 can also be measured using a linear scale (not shown) provided on the support body 812 .

(Step S3: Calculation of ideal cutting line) Then, the control unit CTL calculates ideal cutting lines in the longitudinal direction and the short direction of the sealed substrate W with reference to the rotation centers RC of the cutting table 2A and the cutting table 2B. In addition, the ideal cutting line is determined according to the type of the sealed substrate W, and each time the type of the sealed substrate W is changed, the steps S1 to S3 are performed.

(Step S4: Holding of the sealed substrate W) The sealed substrate W is placed on the holding plate 201 , and the sealed substrate W is held on the cutting table 2A and the cutting table 2B. At this time, the cutting table 2A and the cutting table 2B are in a state where the longitudinal direction of the held sealed substrate W coincides with the Y direction (the longitudinal direction of the support 812 ). In addition, in the following steps S5 - S8, the cutting table 2A and the cutting table 2B are fixed without being rotated.

(Step S5: Calculate the offset of the imaging camera 24) The reference mark M1 provided on the holding plate 201 is imaged by the imaging camera 24 . Then, the displacement amount of the position of the imaging camera 24 is calculated from the captured image and the position of the imaging camera 24 .

(Step S6: Shooting of Alignment Mark AM) The control unit CTL corrects the calculated displacement of the imaging camera 24 and moves the imaging camera 24 in the longitudinal direction (Y direction) of the sealed substrate W while photographing a plurality of alignments of the sealed substrate W. Mark AM (see Figure 12). The multiple alignment marks AM are photographed when the cutting table 2A and the cutting table 2B (sealed substrate W) are not rotated, that is, the longitudinal direction of the sealed substrate W is fixed in line with the Y direction. carried out in the state.

(Step S7: Take pictures of all alignment marks?) When all of the some alignment mark AM of the sealed board|substrate W was imaged by said step S6, it transfers to next step S8. On the other hand, when not all of the some alignment mark AM of the sealed board|substrate W was imaged, it returns to said step S6.

(Step S8: Calculation of actually measured cutting line) The control part CTL calculates the actual measurement cutting|disconnection line of the long side direction and the short side direction of the sealed board|substrate W based on the several alignment mark AM and reference mark M1 which were imaged. That is, by imaging the alignment mark AM only in the long-side direction of the sealed substrate W without rotating the sealed substrate W, both the actually measured cutting line in the long-side direction and the actually measured cutting line in the short-side direction are calculated. By.

(Step S9: Calculation of Offset Amount of Actually Measured Cutting Line) The control unit CTL calculates the amount of deviation between the ideal cutting line obtained in the step S3 and the measured cutting line obtained in the step S8.

(Step S10: correction of offset) The control unit CTL rotates the cutting table 2A and the cutting table 2B and moves the mandrel 42A and 42B based on the misalignment calculated in step S9 to correct the misalignment.

(Step S11: cutting in the short side direction) After the offset is corrected in step S10, the mandrel 42A and 42B are moved in the X direction (cutting feeding direction) to cut the short side direction of the sealed substrate W, and the core The shaft portion 42A and the mandrel portion 42B move in the Y direction (pitch feeding direction) to cut the sealed substrate W into a plurality of pieces. In addition, at the time of cutting in the said short-side direction, the table 2A for cutting, and the table 2B for cutting are fixed.

(Step S12: rotation of substrate W after sealing) After the cutting of the sealed substrate W in the short side direction is completed in step S11, the cutting table 2A and the cutting table 2B are rotated by 90 degrees, and the sealed substrate W is rotated by 90 degrees.

(Step S13: cutting in the longitudinal direction) The mandrel part 42A, 42B is moved in the X direction (cutting feed direction) to cut the longitudinal direction of the sealed substrate W, and the mandrel part 42A, the mandrel part 42B is moved in the Y direction (pitch advance direction). direction) to cut the sealed substrate W into multiple pieces. In addition, the table 2A for cutting, and the table 2B for cutting are fixed at the time of cutting in the said longitudinal direction.

<Effects of this embodiment> According to the cutting device 100 of the present embodiment, the alignment mark AM can be imaged while the imaging camera 24 is moved in the longitudinal direction relative to the sealed substrate W without rotating the sealed substrate W, and based on the imaged The alignment mark AM and the reference mark M1 align the sealed substrate W with the blades 41A and 41B of the cutting mechanism 4 in two directions, the longitudinal direction and the lateral direction. That is, according to the cutting device 100 of the present embodiment, only the alignment operation is performed in the longitudinal direction, and therefore there is no need to photograph the alignment marks AM of the sealed substrate W before and after the sealed substrate W is rotated. As a result, the number of times of imaging the alignment mark AM can be reduced, and the time taken for the alignment operation can be shortened.

In addition, in this embodiment, it is assumed that the first holding mechanism 3 is moved by the common transmission shaft 71 extending along the arrangement direction of the cutting table 2A, the cutting table 2B, and the transfer table 5. And the structure that the second holding mechanism 6 moves, the cutting mechanism 4 is moved on the horizontal plane in the X direction along the transmission shaft 71 and the Y direction orthogonal to the X direction by the moving mechanism 8 for cutting, so it is not necessary to use The cutting table 2A and the cutting table 2B move in the X direction and the Y direction to process the sealed substrate W. Therefore, the cutting table 2A and the cutting table 2B can be moved without using the ball screw mechanism, and the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member are unnecessary. As a result, the device structure of the cutting device 100 can be simplified. In addition, the cutting table 2A and the cutting table 2B can be configured so as not to move in the X direction and the Y direction, and the occupied area of the cutting device 100 can be reduced.

＜Other modified implementation forms＞ In addition, this invention is not limited to the said embodiment.

For example, in the above-described embodiment, the alignment mark AM is imaged only in the longitudinal direction of the sealed substrate W without rotating the sealed substrate W. The movement of the alignment mark AM is photographed in the short side direction of the sealed substrate W. When performing the operation of imaging the alignment marks AM only in the short-side direction, cutting may be performed in the long-side direction first, and then performed in the short-side direction after rotating the table for cutting by 90 degrees.

In addition, although the object to be processed in the above-described embodiment is the sealed substrate W having a rectangular shape, it may be an object to be processed that has a shape other than a rectangular shape such as a circle, for example.

In the above-mentioned embodiment, the cutting device of the double cutting table type and the double mandrel structure has been described, but it is not limited to this, and the cutting device of the single cutting table type and the single mandrel structure, Or a cutting device with a single cutting table and a double mandrel structure.

In addition, the transfer table 5 in the above-mentioned embodiment is an index table placed temporarily before being sorted into various trays 21 , but the transfer table 5 may also be used as the holding table 141 of the reversing mechanism 14 .

Furthermore, in the above-mentioned embodiment, it is a structure in which it is sorted from the transfer table 5 to the tray 21, but it may be a structure in which the product P is conveyed and stuck to the adhesive tape arrange|positioned inside the frame-shaped member.

Furthermore, in the configuration of the above-described embodiment, a configuration may be adopted in which grooves are formed without cutting the sealed substrate on the cutting table 2A and the cutting table 2B. In this case, for example, a structure may be adopted in which the sealed substrate W on which the groove processing has been applied to the cutting table 2A and the cutting table 2B is moved by the first holding mechanism 3 and the conveyance. mechanism 7 and returns to the substrate supply unit 112 . In addition, a configuration may be adopted in which the sealed substrate W returned to the substrate supply unit 112 is accommodated in the substrate storage unit 111 .

In addition, since a plurality of cam rack elements constituting the transmission shaft 71 can be connected, for example, the cutting device (processing device) 100 can be separated and connected between the second cleaning mechanism 19 and the inspection unit 13 ( Can be loaded and unloaded) module structure. In this case, for example, a module that performs a different type of inspection from the inspection in the inspection unit 13 may be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Furthermore, in addition to the structure exemplified here, the cutting device (processing device) 100 may also have a module structure that can be separated and connected (detachable) somewhere, and an additional module may be used as an inspection Modules for various functions other than

In addition, the processing device of the present invention can also perform processing other than cutting, for example, other mechanical processing such as cutting or grinding.

In addition, this invention is not limited to the said embodiment, Of course, a various deformation|transformation is possible in the range which does not deviate from the summary. [industrial availability]

According to the present invention, the time taken for the alignment operation can be shortened.

2A, 2B: Table for cutting (processing table) 3: The first holding mechanism 4: Cutting mechanism (processing mechanism) 5: Transfer workbench 6: The second holding mechanism 7: Moving mechanism for conveying 8: Moving mechanism for cutting (moving mechanism for processing) 9A, 9B: rotating mechanism 10A, 10B: vacuum pump 11: Substrate supply mechanism 12: Liquid supply mechanism 13: Inspection Department 14: Reverse mechanism (reverse workbench) 17: Processing swarf storage unit 18: The first cleaning agency 18a, 121: spray nozzle 19: The second cleaning mechanism 20: Classification agency 21: tray 22: Pallet transfer mechanism 23: Tray Storage Department 24: video camera 31, 61: adsorption head 40:Rotary tool 41A, 41B: Blades 42A, 42B: mandrel part 71: Transmission shaft 72: Main moving mechanism 73: Lifting and moving mechanism 73a:Z direction guide rail 73b: Actuator part 74: Horizontal movement mechanism 74a: Y direction guide rail 74b: Elastomer 74c: Cam Mechanism 81: X direction moving part 82: Y direction moving part 83: Z direction moving part 100: Cutting device (processing device) 111: Substrate storage unit 112: Substrate supply department 113: heating part 131: First Inspection Department 132:Second inspection department 141:Hold workbench 142: Inversion Department 171: guide chute 171X: Upper opening 172: Recycling container 173: Separation Department 181: Lifting and moving mechanism 201: Hold the board 202: keep the base 311, 611: adsorption part 721: guide rail 722: Rack and Pinion Mechanism 722a: Cam rack 722b: Pinion 722b1: Roller body 722b2: Roller pin 723: sliding components 811: X direction guide rail 812: Support body 813: Ball screw mechanism 821: Y direction guide rail 822: Y direction slider 823:Linear motor 831:Z direction guide rail 832:Z direction slider CTL: control department P: Products RP: hold position S: processing chips M1: fiducial mark M2: Mark for center calculation AM: Alignment Mark RC: center of rotation L1, L2: Distance W: Sealed substrate (object to be processed) X, Y, Z, θ: direction S1, S2, S3, S4, S5, S6, S7, S8, S9, S10, S11, S12, S13: steps

FIG. 1 is a diagram schematically showing the structure of a cutting device according to an embodiment of the present invention. Fig. 2 is a perspective view schematically showing the cutting table and its peripheral structures according to the embodiment. 3 is a view (plan view) seen from the Z direction, schematically showing the structure of the table for cutting and its peripheral structures according to the embodiment. 4 is a view (front view) seen from the Y direction, schematically showing the structure of the table for cutting and its peripheral structure according to the embodiment. 5 is a view (front view) seen from the Y direction, schematically showing the configuration of the first holding mechanism and the moving mechanism for conveyance according to the embodiment. 6 is a view (side view) seen from the X direction, schematically showing the configuration of the first holding mechanism and the moving mechanism for conveyance according to the embodiment. 7 is a view (front view) seen from the Y direction, schematically showing the configuration of the second holding mechanism and the moving mechanism for conveyance according to the embodiment. FIG. 8 is a cross-sectional view schematically showing the structure of a rack and pinion mechanism according to the embodiment. Fig. 9 is a schematic diagram showing the operation of the cutting device according to the embodiment. FIG. 10 is a plan view showing a state in which sealed substrates are placed on the cutting table according to the embodiment. Fig. 11 is a schematic view showing the structure of the holding plate and the holding base of the embodiment. FIG. 12 is a diagram schematically showing the operation of imaging reference marks and alignment marks in the embodiment. FIG. 13( a ) and FIG. 13( b ) are diagrams schematically showing operations for obtaining the rotation center of the cutting table in the embodiment. Fig. 14 is a flowchart of the alignment operation and the cutting operation of the embodiment. FIG. 15( a ) and FIG. 15( b ) are diagrams schematically showing a method of calculating the distance from the rotation center to the reference mark in the embodiment.

2A, 2B: Table for cutting (table for processing)

AM: Alignment Mark

M1: fiducial mark

M2: Mark for center calculation

201: Hold the board

202: keep the base

X, Y: direction

Claims (9)

A processing device comprising: The processing table holds the object to be processed with the alignment mark and is capable of rotating; a processing mechanism for processing the object to be processed held on the processing table; a fiducial mark is arranged on the processing table, and its relative position to the rotation center of the processing table is known; and a camera for photographing the fiducial mark and the alignment mark, The imaging camera is moved in one direction with respect to the object to be processed, and the alignment mark is photographed, and based on the photographed alignment mark and the reference mark, the process is carried out in the one direction and in relation to the Alignment of the object to be processed and the processing mechanism in a direction perpendicular to one direction. The processing device according to claim 1, wherein the object to be processed has a rectangular shape, imaging the alignment mark while moving the imaging camera in one of the long-side direction and the short-side direction of the object to be processed, and performing Alignment of the object to be processed and the processing mechanism in the long-side direction and the short-side direction. The processing device according to claim 1 or claim 2, wherein the processing table has: a holding plate for holding the object to be processed; and a holding base on which the holding plate is detachably mounted. , using the holding plate to hold the object to be processed, The reference mark is provided on the holding plate or the holding base. The processing device according to any one of claim 1 to claim 3, wherein the offset of the camera is corrected by taking pictures of the fiducial marks by the camera. The processing device according to claim 4, wherein the imaging camera whose offset has been corrected captures the alignment mark. The processing device according to any one of claim 1 to claim 5, wherein the processing table is provided with a center calculation mark for calculating the rotation center of the processing table, Before and after rotating the processing table by a predetermined angle, the center mark is photographed by the imaging camera to calculate the center of rotation, and the reference mark and the rotation center are calculated based on the calculated center of rotation. The relative position of the center. The processing device according to any one of claim 1 to claim 6, further comprising a moving mechanism for processing that moves the processing mechanism in mutually orthogonal X and Y directions on a horizontal plane, The moving mechanism for processing has: a pair of X-direction rails provided to sandwich the processing table along the X direction; and a support body that moves along the pair of X-direction rails and supports the processing The mechanism is supported in a movable manner along said Y direction. The processing device according to claim 7, wherein the imaging camera moves along the support body in the Y direction together with the processing mechanism. A method of manufacturing a processed product, using the processing device according to any one of claim 1 to claim 8 to manufacture a processed product.

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