TWI795191B - Processing apparatus and producing method of processed article - Google Patents

Processing apparatus and producing method of processed article Download PDF

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TWI795191B
TWI795191B TW111103022A TW111103022A TWI795191B TW I795191 B TWI795191 B TW I795191B TW 111103022 A TW111103022 A TW 111103022A TW 111103022 A TW111103022 A TW 111103022A TW I795191 B TWI795191 B TW I795191B
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processing
holding mechanism
holding
cutting
moving
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TW111103022A
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TW202236476A (en
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深井元樹
堀聡子
坂上雄哉
山本裕子
吉岡翔
片岡昌一
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日商Ｔｏｗａ股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
    • B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/157—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis
    • B26D1/18—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a movable axis mounted on a movable carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Feeding Of Workpieces (AREA)
  • Dicing (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Threshing Machine Elements (AREA)
  • Multi-Process Working Machines And Systems (AREA)

Abstract

The present invention simplified the structure of apparatus and reduced the occupying area, which comprises: a processing table 2A and a processing table 2B hold a sealing completed substrate W; a first holding mechanism 3 holds the sealing completed substrate W to transport the sealing completed substrate W to the processing table 2A and the processing table 2B; a processing mechanism 4 processes the sealing completed substrate W which is held on the processing table 2A and the processing table 2B; a transferring table 5 moves plurality of products P; a second holding mechanism 6 holds the plurality of products P to transport the plurality of products P from the processing table 2A and the processing table 2B to the transferring table 5; a transporting used moving mechanism 7 has a shared transfer shaft 71 that extends along a aligned direction of the processing table 2A, the processing table 2B and the transferring table 5, and is used as moving the first holding mechanism 3 and the second holding mechanism 6; and a processing used moving mechanism 8 moves the processing mechanism 4 on a horizontal plane, wherein moves separately along a X-direction of the transfer shaft 71 and a Y-direction that is orthogonal to the X-direction.

Description

加工裝置及加工品的製造方法Processing device and method for manufacturing processed product

本發明是有關於一種加工裝置及加工品的製造方法。The invention relates to a processing device and a method for manufacturing a processed product.

先前，如專利文獻1所示，於切斷系統中，想到下述結構，即：條帶拾取器（strip picker）於X軸方向移動，將半導體條帶自裝載裝置移送至切斷裝置的卡盤台，卡盤台吸附半導體條帶並於Y軸方向移動至系統後方，之後，藉由心軸將半導體條帶切斷成半導體封裝體。另外，卡盤台採用使用滾珠絲桿（滾珠螺桿機構）而於Y軸方向移動的結構。Conventionally, as shown in Patent Document 1, in the cutting system, a structure in which a strip picker (strip picker) moves in the X-axis direction and transfers the semiconductor strip from the loading device to the card of the cutting device has been conceived. The disc table and the chuck table absorb the semiconductor strips and move to the rear of the system in the Y-axis direction. After that, the semiconductor strips are cut into semiconductor packages by the mandrel. In addition, the chuck table adopts a structure that moves in the Y-axis direction using a ball screw (ball screw mechanism).

然而，於所述切斷系統中，由於使用滾珠絲桿使卡盤台移動來進行切斷，因此於實際的切斷時，例如如專利文獻2所示，需要設置保護滾珠絲桿免受加工水或加工屑的蛇腹構件，進而需要為了保護蛇腹構件而於蛇腹構件上設置多個板構件。其結果，裝置結構變得複雜。However, in the above-mentioned cutting system, since the ball screw is used to move the chuck table to perform cutting, in actual cutting, as shown in Patent Document 2, for example, it is necessary to install The bellows of water or processing chips need to install a plurality of plate members on the bellows in order to protect the bellows. As a result, the device structure becomes complicated.

另外，於所述切斷系統中，不僅於X軸方向移送半導體條帶，而且為了切斷半導體條帶而於Y軸方向移送至系統後方，因此裝置的佔據面積（footprint）變大。 [現有技術文獻] [專利文獻] In addition, in the cutting system, the semiconductor strip is not only transported in the X-axis direction but also transported to the rear of the system in the Y-axis direction in order to cut the semiconductor strip, so that the footprint of the device increases. [Prior art literature] [Patent Document]

[專利文獻1]日本專利特表2007-536727號公報 [專利文獻2]日本專利特開2004-186361號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-536727 [Patent Document 2] Japanese Patent Laid-Open No. 2004-186361

[發明所欲解決之課題][Problem to be Solved by the Invention]

因此，本發明是為解決所述問題點而成，其主要課題在於使裝置結構簡化並且減少佔據面積。 [解決課題之手段] Therefore, the present invention is made to solve the above-mentioned problems, and its main subject is to simplify the structure of the device and reduce the occupied area. [Means to solve the problem]

即，本發明的加工裝置的特徵在於包括：加工台，保持加工對象物；第一保持機構，為了將所述加工對象物搬送至所述加工台而保持所述加工對象物；加工機構，對保持於所述加工台的所述加工對象物進行加工；移載台，移動加工後的所述加工對象物；第二保持機構，為了將加工後的所述加工對象物自所述加工台搬送至所述移載台而保持加工後的所述加工對象物；搬送用移動機構，具有沿著所述加工台及所述移載台的排列方向延伸且用以使所述第一保持機構及所述第二保持機構移動的共用的傳遞軸；以及加工用移動機構，使所述加工機構於水平面上於沿著所述傳遞軸的第一方向及與該第一方向正交的第二方向分別移動。 [發明的效果] That is, the processing device of the present invention is characterized in that it includes: a processing table that holds the object to be processed; a first holding mechanism that holds the object to be processed in order to transfer the object to the processing table; and a processing mechanism that holds the object to be processed. The object to be processed held on the processing table is processed; the transfer table moves the object to be processed after processing; the second holding mechanism is used to transfer the object to be processed after processing from the processing table The processed object is held on the transfer stage; the moving mechanism for conveyance has a moving mechanism extending along the direction in which the processing stage and the transfer stage are arranged and configured to make the first holding mechanism and the transfer stage a common transmission shaft that the second holding mechanism moves; and a moving mechanism for processing that makes the processing mechanism move in a first direction along the transmission shaft and a second direction orthogonal to the first direction on a horizontal plane move separately. [Effect of the invention]

根據如此構成的本發明，可使裝置結構簡化並且減少佔據面積。According to the present invention thus constituted, the structure of the device can be simplified and the occupied area can be reduced.

繼而，對本發明舉例加以更詳細說明。但是，本發明不受以下說明的限定。Next, examples of the present invention will be described in more detail. However, the present invention is not limited by the following description.

如所述般，本發明的加工裝置的特徵在於包括：加工台，保持加工對象物；第一保持機構，為了將所述加工對象物搬送至所述加工台而保持所述加工對象物；加工機構，對保持於所述加工台的所述加工對象物進行加工；移載台，移動加工後的所述加工對象物；第二保持機構，為了將加工後的所述加工對象物自所述加工台搬送至所述移載台而保持加工後的所述加工對象物；搬送用移動機構，具有沿著所述加工台及所述移載台的排列方向延伸且用以使所述第一保持機構及所述第二保持機構移動的共用的傳遞軸；以及加工用移動機構，使所述加工機構於水平面上於沿著所述傳遞軸的第一方向及與該第一方向正交的第二方向分別移動。 若為所述加工裝置，則採用藉由沿著加工台及移載台的排列方向延伸的共用的傳遞軸使第一保持機構及第二保持機構移動的結構，藉由加工用移動機構使加工機構於水平面上於沿著傳遞軸的第一方向及與該第一方向正交的第二方向分別移動，因此可不使加工台於第一方向及第二方向上移動而對加工對象物進行加工。因此，可不藉由滾珠螺桿機構使加工台移動，而無需用以保護滾珠螺桿機構的蛇腹構件及用於保護該蛇腹構件的蓋構件。其結果，可使加工裝置的裝置結構簡化。另外，由於形成為加工台不於水平面上於第一方向及第二方向移動的結構，因此可削減加工台的移動空間及其周邊的無用空間，可減少加工裝置的佔據面積。 As described above, the processing apparatus of the present invention is characterized in that it includes: a processing table that holds the object to be processed; a first holding mechanism that holds the object to be processed in order to transfer the object to the processing table; a mechanism for processing the object to be processed held on the processing table; a transfer stage for moving the object to be processed after processing; a second holding mechanism for transferring the object to be processed after processing from the The processing table is transported to the transfer table to hold the processed object; the transfer mechanism has a moving mechanism extending along the direction in which the processing table and the transfer table are arranged and configured to make the first A common transmission shaft for the movement of the holding mechanism and the second holding mechanism; and a moving mechanism for processing, which makes the processing mechanism move in a first direction along the transmission shaft and a direction orthogonal to the first direction on the horizontal plane. The second direction moves separately. In the case of the processing device, the first holding mechanism and the second holding mechanism are moved by a common transmission shaft extending along the direction in which the processing table and the transfer table are arranged, and the processing is performed by the moving mechanism for processing. The mechanism moves on the horizontal plane in the first direction along the transmission axis and in the second direction perpendicular to the first direction, so that the processing object can be processed without moving the processing table in the first direction and the second direction . Therefore, the processing table can be moved without the ball screw mechanism, and the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member are unnecessary. As a result, the device structure of the processing device can be simplified. In addition, since the processing table does not move in the first direction and the second direction on the horizontal plane, the movement space of the processing table and the useless space around it can be reduced, and the occupied area of the processing device can be reduced.

作為傳遞軸及加工用移動機構的具體配置的態樣，所述傳遞軸理想的是以於所述加工用移動機構的上方橫穿所述加工用移動機構的方式配置。 若為所述結構，則可使沿著傳遞軸移動的第一保持機構於加工用移動機構的上方移動，從而可防止第一保持機構與加工用移動機構發生物理干擾。另外，可使沿著傳遞軸移動的第二保持機構於加工用移動機構的上方移動，從而可防止第二保持機構與加工用移動機構發生物理干擾。 As an aspect of the specific arrangement of the transmission shaft and the moving mechanism for processing, it is desirable that the transmission shaft is arranged so as to traverse the moving mechanism for processing above the moving mechanism for processing. According to this configuration, the first holding mechanism that moves along the transmission shaft can be moved above the processing moving mechanism, and physical interference between the first holding mechanism and the processing moving mechanism can be prevented. In addition, the second holding mechanism that moves along the transmission shaft can be moved above the processing moving mechanism, thereby preventing physical interference between the second holding mechanism and the processing moving mechanism.

為了於一個加工裝置中提高加工對象物的處理能力，本發明的加工裝置理想的是包括多個所述加工台。 於所述結構中，理想的是，所述多個加工台及所述移載台於水平面上配置成一行。 若為所述結構，則可藉由沿著共用的傳遞軸移動的第一保持機構將加工對象物搬送至多個加工台的各個。另外，可藉由沿著共用的傳遞軸移動的第二保持機構自多個加工台的各個將加工後的加工對象物搬送至移載台。另外，於藉由其中一個加工台處理加工對象物時，可於另一個加工台進行搬送等的其他處理。 In order to increase the processing capacity of the object to be processed in one processing device, the processing device of the present invention preferably includes a plurality of the processing tables. In the above structure, preferably, the plurality of processing tables and the transfer table are arranged in a row on a horizontal plane. According to this configuration, the object to be processed can be conveyed to each of the plurality of processing tables by the first holding mechanism that moves along the common transmission shaft. In addition, the processed object can be transferred from each of the plurality of processing tables to the transfer table by the second holding mechanism that moves along the common transmission shaft. In addition, when the object to be processed is processed by one of the processing tables, other processing such as transportation can be performed on the other processing table.

當設為不使加工台於水平面上於第一方向及第二方向移動的結構、且僅藉由加工用移動機構使加工機構於第一方向及第二方向移動時，有對加工對象物的加工受到制約之虞。 為了消除所述加工的制約，理想的是，所述加工台構成為能夠於水平面上旋轉。 When the structure is set so that the processing table does not move in the first direction and the second direction on the horizontal plane, and the processing mechanism is moved in the first direction and the second direction only by the moving mechanism for processing, there is There is a risk that processing will be restricted. In order to eliminate constraints on the processing, it is desirable that the processing table is configured to be rotatable on a horizontal plane.

為了進一步簡化裝置結構並且進一步減少佔據面積，理想的是所述第一保持機構、所述第二保持機構、所述加工台及所述移載台於平面視時相對於所述傳遞軸而設置於同側。另外，由於第一保持機構、第二保持機構、加工台及移載台設置於同側，因此亦可使維護性提高。In order to further simplify the structure of the device and further reduce the occupied area, it is ideal that the first holding mechanism, the second holding mechanism, the processing table and the transfer table are arranged relative to the transmission shaft in plan view on the same side. In addition, since the first holding mechanism, the second holding mechanism, the processing table, and the transfer table are installed on the same side, maintainability can also be improved.

所述加工用移動機構被稱為所謂的龍門架機構。具體而言，所述加工用移動機構理想的是包括：使所述加工機構於所述第一方向直線移動的第一方向移動部、以及使所述加工機構於所述第二方向直線移動的第二方向移動部，且所述第一方向移動部具有：一對第一方向導軌，沿著所述第一方向夾持所述加工台而設置；以及支持體，沿著該一對第一方向導軌移動，並且經由所述第二方向移動部支持所述加工機構。於所述結構中，共用的傳遞軸以於支持體的上方橫穿該支持體的方式配置，共用的傳遞軸及支持體處於相互交叉的位置關係。 如此沿著第一方向設置的一對第一方向導軌夾持加工台而設置，因此可增大一對第一方向導軌的間距（間隔）。其結果，可減小第一方向導軌彼此的上下方向的位置偏移對加工的影響。即，可減小加工機構（例如刀片等旋轉工具）與加工台的正交度的偏移，可提高加工精度。另外，第一方向導軌可使用規格較先前低的導軌。 The moving mechanism for processing is called a so-called gantry mechanism. Specifically, the moving mechanism for processing preferably includes: a first-direction moving part for linearly moving the processing mechanism in the first direction; and a moving part for linearly moving the processing mechanism in the second direction. The moving part in the second direction, and the moving part in the first direction has: a pair of guide rails in the first direction, arranged to clamp the processing table along the first direction; and a support body, along the pair of first direction guide rails. The direction rail moves and supports the machining mechanism via the second direction moving part. In the above structure, the common transmission shaft is arranged above the support body so as to cross the support body, and the common transmission shaft and the support body are in a positional relationship of crossing each other. Since the pair of first-direction rails provided along the first direction is provided so as to sandwich the processing table, the distance (interval) between the pair of first-direction rails can be increased. As a result, the influence of the positional displacement in the vertical direction of the guide rails in the first direction on the machining can be reduced. That is, the deviation of the orthogonality between the machining mechanism (for example, a rotary tool such as a blade) and the machining table can be reduced, and the machining accuracy can be improved. In addition, the first direction guide rail can use a guide rail with a lower specification than before.

為了清洗保持於加工台的加工後的加工對象物，本發明的加工裝置理想的是更包括將保持於所述加工台的加工後的所述加工對象物的上表面側進行清潔的第一清潔機構。 於所述結構中，為了設為使用共用的傳遞軸以使第一清潔機構移動的結構而簡化裝置結構，理想的是，所述第一清潔機構以能夠與所述第一保持機構一起沿著所述傳遞軸移動的方式構成。 In order to clean the processed object held on the processing table, the processing device of the present invention preferably further includes a first cleaning method for cleaning the upper surface side of the processed object held on the processing table. mechanism. In the above configuration, in order to simplify the structure of the device by using a common transmission shaft to move the first cleaning mechanism, it is desirable that the first cleaning mechanism can move along with the first holding mechanism. The way in which the transmission shaft moves is constituted.

另外，為了將無法藉由第一清潔機構進行清潔的加工後的加工對象物的下表面側進行清潔，本發明的加工裝置理想的是更包括將保持於所述第二保持機構的加工後的所述加工對象物的下表面側進行清潔的第二清潔機構。In addition, in order to clean the lower surface side of the processed object that cannot be cleaned by the first cleaning mechanism, the processing device of the present invention preferably further includes a processed object held by the second holding mechanism. A second cleaning mechanism for cleaning the lower surface side of the object to be processed.

為了進行加工後的加工對象物的兩面檢查，本發明的加工裝置理想的是更包括：檢查部，檢查保持於所述第二保持機構的加工後的所述加工對象物；以及反轉機構，為了能夠藉由所述檢查部檢查加工後的所述加工對象物的兩面而使加工後的所述加工對象物反轉。In order to inspect both sides of the processed object, the processing device of the present invention preferably further includes: an inspection unit for inspecting the processed object held by the second holding mechanism; and a reversing mechanism, The processed object is reversed so that both sides of the processed object can be inspected by the inspection unit.

作為用以使搬送用移動機構的結構簡化的具體實施態樣，所述搬送用移動機構理想的是具有：共用的導軌，設置於所述傳遞軸上、且導引所述第一保持機構及所述第二保持機構；以及齒條與小齒輪機構，使所述第一保持機構及所述第二保持機構沿著所述導軌移動。 於所述結構中，所述齒條與小齒輪機構理想的是具有：凸輪齒條，為所述第一保持機構及所述第二保持機構所共用；以及小齒輪，分別設置於所述第一保持機構及所述第二保持機構，由致動器旋轉。 若為所述結構，藉由變更共用的凸輪齒條的長度，可任意地設定第一保持機構及第二保持機構的移動範圍。 As a specific implementation aspect for simplifying the structure of the moving mechanism for conveying, it is desirable that the moving mechanism for conveying has: a common guide rail, which is arranged on the transmission shaft and guides the first holding mechanism and the second holding mechanism; and a rack and pinion mechanism for moving the first holding mechanism and the second holding mechanism along the rail. In the above structure, the rack and pinion mechanism preferably has: a cam rack shared by the first holding mechanism and the second holding mechanism; and a pinion respectively provided on the second holding mechanism. A holding mechanism and said second holding mechanism are rotated by an actuator. According to the above structure, by changing the length of the common cam rack, the moving ranges of the first holding mechanism and the second holding mechanism can be arbitrarily set.

所述搬送用移動機構理想的是更包括：升降移動機構，介於所述傳遞軸與所述第一保持機構之間而設置，且使所述第一保持機構相對於所述傳遞軸升降移動；以及水平移動機構，介於所述傳遞軸與所述第一保持機構之間而設置，且使所述第一保持機構相對於所述傳遞軸沿著所述第二方向移動。 此處，升降移動機構不僅於藉由第一保持機構交接加工對象物時進行升降移動，而且為了使第一保持機構不與加工用移動機構發生物理干擾而進行升降移動。另外，可藉由水平移動機構，於藉由第一保持機構將加工對象物載置於加工台時將加工對象物相對於加工台沿著第二方向進行位置調整。 Preferably, the moving mechanism for conveyance further includes: an elevating movement mechanism provided between the transmission shaft and the first holding mechanism, and moves the first holding mechanism up and down relative to the transmission shaft. and a horizontal movement mechanism provided between the transmission shaft and the first holding mechanism, and moves the first holding mechanism relative to the transmission shaft along the second direction. Here, the elevating movement mechanism not only performs elevating movement when the object to be processed is delivered by the first holding mechanism, but also performs elevating movement so that the first holding mechanism does not physically interfere with the moving mechanism for processing. In addition, when the object to be processed is placed on the processing table by the first holding mechanism, the position of the object to be processed can be adjusted in the second direction relative to the processing table by the horizontal movement mechanism.

為了簡化水平移動機構的結構，所述水平移動機構理想的是具有：水平導軌，沿著所述第二方向設置且導引所述第一保持機構；彈性體，對所述第一保持機構向所述第一導引部的其中一側賦予力；以及凸輪機構，使所述第一保持機構向所述第一導引部的另一側移動。In order to simplify the structure of the horizontal movement mechanism, the horizontal movement mechanism ideally has: a horizontal guide rail arranged along the second direction and guiding the first holding mechanism; One side of the first guide part imparts force; and a cam mechanism moves the first holding mechanism to the other side of the first guide part.

本發明的加工裝置中，藉由加工用移動機構相對於在第一方向及第二方向被固定的加工台而移動的加工機構對加工對象物進行加工，因此不需要使加工台於第一方向或第二方向移動的移動機構。因此，本發明的加工裝置理想的是更包括加工屑收容部，所述加工屑收容部設置於所述加工台的下方、且收容由所述加工機構進行的加工而產生的加工屑。如此於加工台的下方設置加工屑收容部，藉此可提高加工屑的回收率。In the processing device of the present invention, the processing object is processed by the processing mechanism that moves relative to the processing table fixed in the first direction and the second direction by the processing moving mechanism, so it is not necessary to move the processing table in the first direction. Or a moving mechanism that moves in the second direction. Therefore, the machining device of the present invention preferably further includes a machining waste storage unit provided below the machining table and storing machining waste generated by the machining performed by the machining mechanism. In this way, the processing chip storage part is provided under the processing table, thereby improving the recovery rate of processing chips.

作為加工屑收容部的具體實施態樣，所述加工屑收容部理想的是具有：導引滑槽（guide chute），具有於平面視時包圍所述加工台的上部開口；以及回收容器，將由所述導引滑槽所導引的加工屑回收。 若為所述結構，由於導引滑槽具有包圍加工台的上部開口，因此不易將自加工台飛散或落下的加工屑漏掉，可進一步提高加工屑的回收率。 As a specific implementation aspect of the processing waste storage unit, the processing waste storage unit preferably has: a guide chute having an upper opening surrounding the processing table in plan view; The processing chips guided by the guide chute are recovered. According to the above structure, since the guide chute has an upper opening surrounding the processing table, it is difficult to miss the processing chips flying or falling from the processing table, and the recovery rate of the processing chips can be further improved.

於所述加工機構藉由刀片將所述加工對象物切斷而進行單片化的情況下，特別重要的是基於刀片的切斷方向與基於加工用移動機構的第一方向一致（即，刀片的旋轉軸方向與基於加工用移動機構的第一方向正交）。於本發明中，只要相對於第一方向移動部的支持體來定位刀片即可，與如先前般相對於與刀片分開移動的加工台來定位刀片的旋轉軸方向的情況相比，該些的定位變得容易。In the case where the processing mechanism cuts the object to be processed by a blade to separate it into pieces, it is particularly important that the cutting direction by the blade coincides with the first direction by the moving mechanism for processing (that is, the blade The direction of the rotation axis is perpendicular to the first direction based on the moving mechanism for processing). In the present invention, it is only necessary to position the blade with respect to the support of the moving portion in the first direction. Compared with the conventional case where the rotation axis direction of the blade is positioned with respect to the processing table which moves separately from the blade, these Orientation made easy.

作為本發明的加工裝置的具體實施態樣，理想的是，所述加工對象物是經樹脂密封的密封完畢基板，所述加工機構藉由利用刀片將所述密封完畢基板切斷，從而單片化為多個製品。As a specific implementation aspect of the processing device of the present invention, it is desirable that the object to be processed is a resin-sealed sealed substrate, and that the processing mechanism cuts the sealed substrate with a blade to form a single piece of substrate. into multiple products.

另外，使用所述加工裝置來製造加工品的、加工品的製造方法亦為本發明的一態樣。Moreover, the manufacturing method of the processed product which manufactures a processed product using the said processing apparatus is also one aspect of this invention.

＜本發明的一實施形態＞ 以下，參照圖式對本發明的加工裝置的一實施形態加以說明。再者，關於以下所示的任一圖，均為了容易理解而適當省略或誇張地示意性地描畫。對相同的構成要素標註相同符號，適當省略說明。 <An embodiment of the present invention> Hereinafter, an embodiment of the processing apparatus of the present invention will be described with reference to the drawings. In addition, any of the figures shown below are appropriately omitted or exaggerated and schematically drawn for easy understanding. The same symbols are assigned to the same constituent elements, and explanations are appropriately omitted.

＜加工裝置的總體結構＞ 本實施形態的加工裝置100為切斷裝置，藉由將作為加工對象物的密封完畢基板W切斷，從而單片化為多個製品P。 <Overall structure of processing equipment> The processing apparatus 100 of this embodiment is a cutting apparatus, and cuts the sealed substrate W which is a processing object, and separates it into several products P. As shown in FIG.

具體而言，如圖1所示，切斷裝置100包括：兩個切斷用台（加工台）2A、2B，保持密封完畢基板W；第一保持機構3，為了將密封完畢基板W搬送至切斷用台2A、切斷用台2B而保持密封完畢基板W；切斷機構（加工機構）4，將保持於切斷用台2A、切斷用台2B的密封完畢基板W切斷；移載台5，移動多個製品P；第二保持機構6，為了將多個製品P自切斷用台2A、切斷用台2B搬送至移載台5而保持多個製品P；搬送用移動機構7，具有用以使第一保持機構3及第二保持機構6移動的共用的傳遞軸71；以及切斷用移動機構（加工用移動機構）8，使切斷機構4相對於保持於切斷用台2A、切斷用台2B的密封完畢基板W移動。Specifically, as shown in FIG. 1 , the cutting device 100 includes: two cutting tables (processing tables) 2A and 2B holding the sealed substrate W; and a first holding mechanism 3 for transporting the sealed substrate W to The cutting platform 2A and the cutting platform 2B hold the sealed substrate W; the cutting mechanism (processing mechanism) 4 cuts the sealed substrate W held on the cutting platform 2A and the cutting platform 2B; The stage 5 moves a plurality of products P; the second holding mechanism 6 holds a plurality of products P in order to transfer the plurality of products P from the cutting platform 2A and the cutting platform 2B to the transfer platform 5; Mechanism 7 has a common transmission shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6; The sealed substrate W of the cutting table 2A and the cutting table 2B moves.

此處，所謂密封完畢基板W，是針對連接有半導體晶片、電阻元件、電容元件等電子元件的基板，以至少將電子元件加以樹脂密封的方式進行樹脂成形而成。作為構成密封完畢基板W的基板，可使用引線框架（lead frame）、印刷配線板，除了該些以外，亦可使用半導體製基板（包含矽晶圓等半導體晶圓）、金屬製基板、陶瓷製基板、玻璃製基板、樹脂製基板等。另外，對於構成密封完畢基板W的基板，可實施有配線亦可未實施配線。Here, the sealed substrate W is resin-molded so that at least the electronic components are resin-sealed with respect to the substrate to which electronic components such as semiconductor chips, resistive elements, and capacitive elements are connected. As the substrate constituting the sealed substrate W, lead frames and printed wiring boards can be used, and other than these, semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, and ceramic substrates can also be used. Substrates, glass substrates, resin substrates, etc. In addition, the substrate constituting the sealed substrate W may or may not be provided with wiring.

以下的說明中，將沿著切斷用台2A、切斷用台2B的上表面的平面（水平面）內相互正交的方向分別設為X方向及Y方向，將與X方向及Y方向正交的鉛垂方向設為Z方向。具體而言，將圖1的左右方向設為X方向，將上下方向設為Y方向。雖將於後述，但X方向為支持體812的移動方向，另外，為與門型支持體812的架設一對腳部的樑部（橫樑部）的長度方向（樑部延伸的方向）正交的方向（參照圖2）。In the following description, the directions perpendicular to each other in the plane (horizontal plane) along the upper surfaces of the table 2A for cutting and the table 2B for cutting are respectively referred to as the X direction and the Y direction, and the directions perpendicular to the X direction and the Y direction are respectively referred to as the X direction and the Y direction. The vertical direction of intersection is set to the Z direction. Specifically, let the left-right direction of FIG. 1 be an X direction, and let an up-down direction be a Y direction. Although it will be described later, the X direction is the moving direction of the support body 812, and is perpendicular to the longitudinal direction (direction in which the beam portion extends) of the beam portion (beam portion) on which the pair of legs of the door-shaped support body 812 is erected. direction (see Figure 2).

＜切斷用台＞ 兩個切斷用台2A、2B於X方向、Y方向及Z方向經固定而設置。再者，切斷用台2A可由設置於切斷用台2A之下的旋轉機構9A於θ方向旋轉。另外，切斷用台2B可由設置於切斷用台2B之下的旋轉機構9B於θ方向旋轉。 ＜Table for cutting＞ The two tables 2A and 2B for cutting are fixed and installed in the X direction, the Y direction, and the Z direction. In addition, the cutting table 2A is rotatable in the θ direction by the rotation mechanism 9A provided under the cutting table 2A. In addition, the table 2B for cutting is rotatable in the θ direction by the rotation mechanism 9B provided under the table 2B for cutting.

該些兩個切斷用台2A、2B於水平面上沿著X方向設置。具體而言，兩個切斷用台2A、2B以該些的上表面位於同一水平面上（於Z方向位於相同高度位置）的方式配置（參照圖4），並且以該些上表面的中心（具體而言為基於旋轉機構9A、旋轉機構9B的旋轉中心）位於沿X方向延伸的同一直線上的方式配置（參照圖2及圖3）。These two stages 2A and 2B for cutting are installed along the X direction on a horizontal plane. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are on the same horizontal plane (at the same height position in the Z direction) (see FIG. 4 ), and the centers of these upper surfaces ( Specifically, they are arranged so that the rotation centers of the rotation mechanism 9A and the rotation mechanism 9B are located on the same straight line extending in the X direction (see FIGS. 2 and 3 ).

另外，兩個切斷用台2A、2B吸附保持密封完畢基板W，如圖1所示，與兩個切斷用台2A、2B對應地配置有用以吸附保持的兩個真空泵10A、10B。各真空泵10A、10B例如為水封式真空泵。In addition, the two cutting stages 2A, 2B absorb and hold the sealed substrate W. As shown in FIG. Each vacuum pump 10A, 10B is a water-sealed vacuum pump, for example.

此處，切斷用台2A、切斷用台2B於XYZ方向經固定，故而可縮短自真空泵10A、真空泵10B連接於切斷用台2A、切斷用台2B的配管（未圖示），可減小配管的壓力損失，防止吸附力的降低。其結果為，即便為例如1 mm見方以下的極小封裝體，亦能可靠地吸附於切斷用台2A、切斷用台2B。另外，可防止配管的壓力損失所致的、吸附力的降低，故而可減小真空泵10A、真空泵10B的容量，帶來小型化或成本降低。Here, the table 2A for cutting and the table 2B for cutting are fixed in the XYZ direction, so the piping (not shown) connecting the table 2A for cutting and the table 2B for cutting from the vacuum pump 10A, 10B can be shortened, It can reduce the pressure loss of the piping and prevent the decrease of the adsorption force. As a result, even an extremely small package of, for example, 1 mm square or less can be reliably adsorbed to the cutting table 2A and the cutting table 2B. In addition, since the decrease of the adsorption force due to the pressure loss of the piping can be prevented, the capacity of the vacuum pump 10A and the vacuum pump 10B can be reduced, leading to miniaturization and cost reduction.

＜第一保持機構＞ 如圖1所示，第一保持機構3為了將密封完畢基板W自基板供給機構11搬送至切斷用台2A、切斷用台2B而保持密封完畢基板W。如圖5及圖6所示，所述第一保持機構3具有：吸附頭31，設置有用以吸附保持密封完畢基板W的多個吸附部311；以及真空泵（未圖示），連接於該吸附頭31的吸附部311。而且，藉由吸附頭31由後述搬送用移動機構7等移動至所需位置，從而將密封完畢基板W自基板供給機構11搬送至切斷用台2A、切斷用台2B。 ＜First Holding Mechanism＞ As shown in FIG. 1 , the first holding mechanism 3 holds the sealed substrate W to transfer the sealed substrate W from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B. As shown in Figures 5 and 6, the first holding mechanism 3 has: a suction head 31, provided with a plurality of suction parts 311 for suction and holding the sealed substrate W; and a vacuum pump (not shown), connected to the suction The suction part 311 of the head 31 . Then, the sealed substrate W is transported from the substrate supply mechanism 11 to the cutting table 2A and the cutting table 2B by the adsorption head 31 being moved to a desired position by the transportation moving mechanism 7 described later.

如圖1所示，基板供給機構11具有：基板收容部111，自外部收容多個密封完畢基板W；以及基板供給部112，使收容於該基板收容部111的密封完畢基板W移動至由第一保持機構3吸附保持的保持位置RP。所述保持位置RP是以於X方向與兩個切斷用台2A、2B成為同行的方式設定。再者，基板供給機構11亦可為了使由第一保持機構3吸附的密封完畢基板W為柔軟的狀態以容易吸附，而具有進行加熱的加熱部113。As shown in FIG. 1 , the substrate supply mechanism 11 has: a substrate accommodating portion 111 for accommodating a plurality of sealed substrates W from the outside; A holding mechanism 3 absorbs and holds the holding position RP. The holding position RP is set so as to be parallel to the two stages 2A and 2B for cutting in the X direction. In addition, the substrate supply mechanism 11 may include a heating unit 113 for heating the sealed substrate W sucked by the first holding mechanism 3 in a soft state for easy suction.

＜切斷機構（加工機構）＞ 如圖1、圖2及圖3所示，切斷機構4具有包含刀片41A、刀片41B及兩個心軸42A、42B的兩個旋轉工具40。兩個心軸42A、42B以該些的旋轉軸沿著Y方向的方式設置，安裝於該些心軸的刀片41A、刀片41B以彼此相向的方式配置（參照圖3）。心軸42A的刀片41A及心軸42B的刀片41B藉由在包含X方向及Z方向的面內旋轉，從而將保持於各切斷用台2A、2B的密封完畢基板W切斷。再者，於本實施形態的切斷裝置100，如圖4所示，為了抑制由刀片41A、刀片41B產生的摩擦熱而設置有液體供給機構12，所述液體供給機構12具有噴射切削水（加工液）的噴射噴嘴121。所述噴射噴嘴121例如支持於後述的Z方向移動部83。 ＜Cutting mechanism (processing mechanism)＞ As shown in FIGS. 1 , 2 and 3 , the cutting mechanism 4 has two rotary tools 40 including a blade 41A, a blade 41B, and two spindles 42A, 42B. The two spindles 42A and 42B are arranged such that their rotation axes are along the Y direction, and the blades 41A and 41B attached to these spindles are arranged to face each other (see FIG. 3 ). The blade 41A of the mandrel 42A and the blade 41B of the mandrel 42B are rotated in a plane including the X direction and the Z direction, thereby cutting the sealed substrate W held on the respective cutting stages 2A and 2B. Furthermore, in the cutting device 100 of the present embodiment, as shown in FIG. 4 , in order to suppress the frictional heat generated by the blades 41A and 41B, a liquid supply mechanism 12 is provided, and the liquid supply mechanism 12 has a jet cutting water ( machining fluid) spray nozzle 121. The spray nozzle 121 is supported by, for example, a Z-direction moving part 83 described later.

＜移載台＞ 如圖1所示，本實施形態的移載台5為移動經後述的檢查部13進行了檢查的多個製品P的台。所述移載台5被稱為所謂索引台，於將多個製品P分類至各種托盤21之前，暫時載置多個製品P。另外，移載台5於水平面上沿著X方向與兩個切斷用台2A、2B配置成一行。載置於移載台5的多個製品P根據由檢查部13所得的檢查結果（良品、不良品等）而由分類機構20分類至各種托盤21。 ＜Transfer table＞ As shown in FIG. 1 , the transfer table 5 of the present embodiment is a table for moving a plurality of products P inspected by an inspection unit 13 described later. The transfer stage 5 is called an index stage, and temporarily places a plurality of products P before sorting the plurality of products P into various trays 21 . In addition, the transfer stage 5 is arranged in a row along the X direction with the two cutting stages 2A and 2B on the horizontal plane. The plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (defective products, defective products, etc.) obtained by the inspection unit 13 .

再者，各種托盤21由沿著傳遞軸71移動的托盤搬送機構22搬送至所需的位置，載置由分類機構20所分類的製品P。經分類後，各種托盤21由托盤搬送機構22收容於托盤收容部23。Furthermore, the various trays 21 are transported to desired positions by the tray transport mechanism 22 that moves along the transfer shaft 71 , and the products P sorted by the sorting mechanism 20 are placed thereon. After being sorted, the various trays 21 are stored in the tray storage unit 23 by the tray transport mechanism 22 .

＜檢查部＞ 此處，檢查部13如圖1所示，設置於切斷用台2A、切斷用台2B與移載台5之間，檢查保持於第二保持機構6的多個製品P。本實施形態的檢查部13具有檢查製品P的密封面（封裝面）的第一檢查部131、及檢查製品P的引線面的第二檢查部132。第一檢查部131為具有用以檢查封裝面的光學系統的攝像相機，第二檢查部132為具有用以檢查引線面的光學系統的攝像相機。再者，亦可使第一檢查部131及第二檢查部132共用。 ＜Inspection Department＞ Here, the inspection unit 13 is provided between the cutting table 2A, the cutting table 2B, and the transfer table 5 as shown in FIG. 1 , and inspects a plurality of products P held by the second holding mechanism 6 . The inspection part 13 of this embodiment has the 1st inspection part 131 which inspects the sealing surface (package surface) of the product P, and the 2nd inspection part 132 which inspects the lead surface of the product P. The first inspection part 131 is a camera with an optical system for inspecting the package surface, and the second inspection part 132 is a camera with an optical system for inspection of the lead surface. Furthermore, the first inspection unit 131 and the second inspection unit 132 may be shared.

本實施形態的密封完畢基板W及製品P為基板的一面經樹脂成形的結構。於此種結構中，經樹脂成形的面是與基板連接的電子元件經樹脂密封而成的面，被稱為「密封面」或「封裝面」。另一方面，與經樹脂成形的面相反的一側的未經樹脂成形的面露出了通常作為製品的外部連接電極發揮功能的引線，因此被稱為引線面。於所述引線為球柵陣列（Ball Grid Array，BGA）等的電子零件中使用的突起狀電極的情況下，有時亦被稱為「球面」。進而，與經樹脂成形的面相反的一側的未經樹脂成形的面亦有未形成引線的形態，因此有時亦被稱為「基板面」。於本實施形態的說明中，將經樹脂成形的面記載為「密封面」或「封裝面」，將與經樹脂成形的面相反的一側的未經樹脂成形的面記載為「引線面」。The sealed substrate W and product P of this embodiment have a structure in which one side of the substrate is molded with resin. In this structure, the resin-molded surface is the surface where the electronic components connected to the substrate are sealed with resin, and is called "sealing surface" or "package surface". On the other hand, the non-resin-molded surface on the opposite side to the resin-molded surface is called a lead surface because the leads that usually function as external connection electrodes of the product are exposed. When the said lead is a protruding electrode used in electronic components, such as a ball grid array (BGA), it may also be called a "spherical surface." Furthermore, the non-resin-molded surface on the opposite side to the resin-molded surface may also have no leads formed therein, so it may also be called a "substrate surface". In the description of this embodiment, the resin-molded surface is described as a "seal surface" or "package surface", and the surface that is not resin-molded on the opposite side to the resin-molded surface is described as a "lead surface" .

另外，為了能夠藉由檢查部13來檢查多個製品P的兩面，設置有使多個製品P反轉的反轉機構14（參照圖1）。所述反轉機構14具有保持多個製品P的保持台141、以及使該保持台141以成為表背相反的方式反轉的馬達等反轉部142。In addition, in order to be able to inspect both sides of the plurality of products P by the inspection unit 13 , an inversion mechanism 14 (see FIG. 1 ) for inverting the plurality of products P is provided. The reversing mechanism 14 has a holding table 141 holding a plurality of products P, and a reversing unit 142 such as a motor for reversing the holding table 141 so that the front and the back are reversed.

於第二保持機構6自加工台2A、加工台2B保持多個製品P時，製品P的封裝面朝向下側。於此狀態下，於自加工台2A、加工台2B向反轉機構14搬送多個製品P的中途，藉由第一檢查部131來檢查製品P的封裝面。其後，保持於第二保持機構6的多個製品P由反轉機構14反轉，再次，藉由第二保持機構6保持。於此狀態下，製品P的引線面朝向下側，使第二保持機構6移動至第二檢查部132，藉此檢查製品P的引線面。When the second holding mechanism 6 holds a plurality of products P from the processing table 2A and the processing table 2B, the packaging surface of the product P faces downward. In this state, while the plurality of products P are being conveyed from the processing tables 2A and 2B to the reversing mechanism 14 , the sealing surfaces of the products P are inspected by the first inspection unit 131 . Thereafter, the plurality of products P held by the second holding mechanism 6 are reversed by the reversing mechanism 14 and held by the second holding mechanism 6 again. In this state, the lead surface of the product P faces downward, and the second holding mechanism 6 is moved to the second inspection part 132 , thereby inspecting the lead surface of the product P.

＜第二保持機構＞ 如圖1所示，第二保持機構6為了將多個製品P自切斷用台2A、切斷用台2B搬送至移載台5而保持多個製品P。如圖8所示，所述第二保持機構6具有：吸附頭61，設置有用以吸附保持多個製品P的多個吸附部611；以及真空泵（未圖示），連接於該吸附頭61的吸附部611。繼而，藉由吸附頭61由後述的搬送用移動機構7等移動至所需的位置，從而將多個製品P自切斷用台2A、切斷用台2B搬送至保持台141或移載台5。 ＜Second Holding Mechanism＞ As shown in FIG. 1 , the second holding mechanism 6 holds a plurality of products P for transferring the plurality of products P from the cutting table 2A and the cutting table 2B to the transfer table 5 . As shown in FIG. 8 , the second holding mechanism 6 has: an adsorption head 61 provided with a plurality of adsorption parts 611 for adsorbing and holding a plurality of products P; and a vacuum pump (not shown) connected to the suction head 61 Adsorption part 611. Then, by moving the suction head 61 to a desired position by the transport moving mechanism 7 described later, a plurality of products P are transported from the cutting table 2A and the cutting table 2B to the holding table 141 or the transfer table. 5.

＜搬送用移動機構＞ 如圖1所示，搬送用移動機構7使第一保持機構3至少於基板供給機構11與切斷用台2A、切斷用台2B之間移動，並且使第二保持機構6至少於切斷用台2A、切斷用台2B與保持台141之間移動。 ＜Movement Mechanism for Transport＞ As shown in FIG. 1 , the transporting moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting table 2A and the cutting table 2B, and moves the second holding mechanism 6 at least below the cutting table. The table 2A for cutting, the table 2B for cutting, and the holding table 141 are moved.

而且，如圖1所示，搬送用移動機構7具有：共用的傳遞軸71，沿著兩個切斷用台2A、2B及移載台5的排列方向（X方向）一直線地延伸，用以使第一保持機構3及第二保持機構6移動。Moreover, as shown in FIG. 1 , the conveying moving mechanism 7 has: a common transmission shaft 71 extending linearly along the arrangement direction (X direction) of the two cutting stages 2A, 2B and the transfer stage 5 for The first holding mechanism 3 and the second holding mechanism 6 are moved.

所述傳遞軸71設於下述範圍，即：第一保持機構3可移動至基板供給機構11的基板供給部112的上方，並且第二保持機構6可移動至移載台5的上方（參照圖1）。另外，相對於所述傳遞軸71，第一保持機構3、第二保持機構6、切斷用台2A、切斷用台2B及移載台5於平面視時設置於同側（近前側）。此外，檢查部13、反轉機構14、各種托盤21、托盤搬送機構22、托盤收容部23、後述的第一清潔機構18及第二清潔機構19、回收容器172亦相對於傳遞軸71而設置於同側（近前側）。The transmission shaft 71 is set in the following range, that is: the first holding mechanism 3 can move to the top of the substrate supply part 112 of the substrate supply mechanism 11, and the second holding mechanism 6 can move to the top of the transfer stage 5 (refer to figure 1). In addition, with respect to the transmission shaft 71, the first holding mechanism 3, the second holding mechanism 6, the cutting table 2A, the cutting table 2B, and the transfer table 5 are arranged on the same side (near side) in plan view. . In addition, the inspection unit 13, the reversing mechanism 14, various trays 21, the tray transport mechanism 22, the tray storage unit 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 described later, and the recovery container 172 are also installed on the transmission shaft 71. On the same side (near the front side).

進而，如圖5、圖6及圖8所示，搬送用移動機構7具有：主移動機構72，使第一保持機構3及第二保持機構6沿著傳遞軸71於X方向移動；升降移動機構73，使第一保持機構3及第二保持機構6相對於傳遞軸71於Z方向升降移動；以及水平移動機構74，使第一保持機構3及第二保持機構6相對於傳遞軸71於Y方向水平移動。Furthermore, as shown in Fig. 5, Fig. 6 and Fig. 8, the moving mechanism 7 for conveyance has: a main moving mechanism 72, which moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transmission shaft 71; The mechanism 73 makes the first holding mechanism 3 and the second holding mechanism 6 move up and down in the Z direction relative to the transmission shaft 71; and the horizontal movement mechanism 74 makes the first holding mechanism 3 and the second holding mechanism 6 move relative to the transmission shaft 71 Move horizontally in the Y direction.

如圖5～圖8所示，主移動機構72具有：共用的導軌721，設置於傳遞軸71、且導引第一保持機構3及第二保持機構6；以及齒條與小齒輪機構722，使第一保持機構3及第二保持機構6沿著該導軌721移動。As shown in FIGS. 5-8 , the main moving mechanism 72 has: a common guide rail 721, which is arranged on the transmission shaft 71 and guides the first holding mechanism 3 and the second holding mechanism 6; and a rack and pinion mechanism 722, The first holding mechanism 3 and the second holding mechanism 6 are moved along the guide rail 721 .

導軌721沿著傳遞軸71於X方向一直線地延伸，與傳遞軸71同樣地設於下述範圍，即：第一保持機構3可移動至基板供給機構11的基板供給部112的上方，並且第二保持機構6可移動至移載台5的上方。於所述導軌721，能夠滑動地設置有滑動構件723，所述滑動構件723經由升降移動機構73及水平移動機構74而設置有第一保持機構3及第二保持機構6。此處，導軌721為第一保持機構3及第二保持機構6所共用，但升降移動機構73、水平移動機構74及滑動構件723是針對第一保持機構3及第二保持機構6各自而分別設置。The guide rail 721 extends linearly in the X direction along the transmission shaft 71, and is provided in the same range as the transmission shaft 71 so that the first holding mechanism 3 can move above the substrate supply part 112 of the substrate supply mechanism 11, and the second The second holding mechanism 6 can move to the top of the transfer platform 5 . The guide rail 721 is slidably provided with a slide member 723 provided with the first holding mechanism 3 and the second holding mechanism 6 via the elevating movement mechanism 73 and the horizontal movement mechanism 74 . Here, the guide rail 721 is shared by the first holding mechanism 3 and the second holding mechanism 6, but the elevating movement mechanism 73, the horizontal moving mechanism 74 and the sliding member 723 are for the first holding mechanism 3 and the second holding mechanism 6 respectively. set up.

齒條與小齒輪機構722具有：凸輪齒條722a，為第一保持機構3及第二保持機構6所共用；以及小齒輪722b，分別設置於第一保持機構3及第二保持機構6，由致動器（未圖示）旋轉。凸輪齒條722a設置於共用的傳遞軸71，可藉由將多個凸輪齒條要素連結從而變更為各種長度。另外，小齒輪722b設置於滑動構件723，被稱為所謂滾子小齒輪（roller pinion），如圖7所示，具有：與馬達的旋轉軸一起旋轉的一對滾子本體722b1，以及於該一對滾子本體722b1之間於圓周方向等間隔地設置、且以相對於滾子本體722b1能夠滾動的方式設置的多個滾子銷722b2。本實施形態的齒條與小齒輪機構722使用所述滾子小齒輪，故而兩個以上的滾子銷722b2與凸輪齒條722a接觸，於正反方向不產生背隙（backlash），於使第一保持機構3及第二保持機構6於X方向移動時定位精度變良好。The rack and pinion mechanism 722 has: a cam rack 722a, shared by the first holding mechanism 3 and the second holding mechanism 6; and a pinion 722b, respectively arranged on the first holding mechanism 3 and the second holding mechanism 6, by An actuator (not shown) rotates. The cam rack 722a is provided on the common transmission shaft 71, and can be changed to various lengths by connecting a plurality of cam rack elements. In addition, the pinion 722b is provided on the sliding member 723 and is called a so-called roller pinion. As shown in FIG. A plurality of roller pins 722b2 are provided at equal intervals in the circumferential direction between the pair of roller bodies 722b1 and are provided so as to be able to roll with respect to the roller bodies 722b1. The rack and pinion mechanism 722 of this embodiment uses the above-mentioned roller pinion, so two or more roller pins 722b2 contact the cam rack 722a, and there is no backlash in the forward and reverse directions. When the first holding mechanism 3 and the second holding mechanism 6 move in the X direction, the positioning accuracy becomes better.

如圖5及圖8所示，升降移動機構73是與第一保持機構3及第二保持機構6分別對應地設置。如圖5及圖6所示，第一保持機構3的升降移動機構73介於傳遞軸71（具體而言為主移動機構72）與第一保持機構3之間而設置，具有：Z方向導軌73a，沿著Z方向設置；以及致動器部73b，使第一保持機構3沿著該Z方向導軌73a移動。再者，致動器部73b例如可使用滾珠螺桿機構，亦可使用氣缸，亦可使用直線馬達。再者，如圖8所示，第二保持機構6的升降移動機構73的結構與第一保持機構3的升降移動機構73同樣。As shown in FIGS. 5 and 8 , the elevating movement mechanism 73 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 , respectively. As shown in Fig. 5 and Fig. 6, the elevating and moving mechanism 73 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and has: a Z-direction guide rail 73a, which is provided along the Z direction; and the actuator part 73b, which moves the first holding mechanism 3 along the Z direction guide rail 73a. In addition, as the actuator part 73b, for example, a ball screw mechanism may be used, an air cylinder may be used, and a linear motor may be used. In addition, as shown in FIG. 8 , the structure of the vertical movement mechanism 73 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3 .

如圖5及圖8所示，水平移動機構74是與第一保持機構3及第二保持機構6分別對應地設置。如圖5及圖6所示，第一保持機構3的水平移動機構74是介於傳遞軸71（具體而言為升降移動機構73）與第一保持機構3之間而設置，具有：Y方向導軌74a，沿著Y方向設置；彈性體74b，對第一保持機構3向Y方向導軌74a的其中一側賦予力；以及凸輪機構74c，使第一保持機構3向Y方向導軌74a的另一側移動。此處，凸輪機構74c使用偏心凸輪，藉由利用馬達等致動器使該偏心凸輪旋轉，從而可調整第一保持機構3於Y方向的移動量。As shown in FIGS. 5 and 8 , the horizontal movement mechanism 74 is provided corresponding to the first holding mechanism 3 and the second holding mechanism 6 , respectively. As shown in Figures 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transmission shaft 71 (specifically, the lifting movement mechanism 73) and the first holding mechanism 3, and has: Y direction The guide rail 74a is arranged along the Y direction; the elastic body 74b imparts force to the first holding mechanism 3 toward one side of the Y direction guide rail 74a; and the cam mechanism 74c makes the first holding mechanism 3 move toward the other side of the Y direction guide rail 74a. Move sideways. Here, the cam mechanism 74c uses an eccentric cam, and by rotating the eccentric cam with an actuator such as a motor, the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted.

再者，如圖8所示，第二保持機構6的水平移動機構74的結構與第一保持機構3的升降移動機構73同樣。另外，可設為未對第二保持機構6設置有水平移動機構74的結構，亦可設為未對第一保持機構3及第二保持機構6兩者設置有水平移動機構74的結構。進而，水平移動機構74與升降移動機構73同樣地，亦可不使用凸輪機構74c而使用例如滾珠螺桿機構，亦可使用氣缸，亦可使用直線馬達。Furthermore, as shown in FIG. 8 , the structure of the horizontal movement mechanism 74 of the second holding mechanism 6 is the same as that of the vertical movement mechanism 73 of the first holding mechanism 3 . In addition, a configuration in which the horizontal movement mechanism 74 is not provided to the second holding mechanism 6 may be employed, or a configuration in which the horizontal movement mechanism 74 is not provided to both the first holding mechanism 3 and the second holding mechanism 6 may be employed. Furthermore, similarly to the vertical movement mechanism 73, the horizontal movement mechanism 74 may use, for example, a ball screw mechanism instead of the cam mechanism 74c, may use an air cylinder, or may use a linear motor.

＜切斷用移動機構（加工用移動機構）＞ 切斷用移動機構8使兩個心軸42A、42B的各個於X方向、Y方向及Z方向分別獨立地直線移動。 <Movement Mechanism for Cutting (Movement Mechanism for Processing)> The moving mechanism 8 for cutting linearly moves each of the two spindles 42A, 42B independently in the X direction, the Y direction, and the Z direction.

具體而言，如圖2、圖3、圖9及圖10所示，切斷用移動機構8包括：X方向移動部81，使心軸42A、心軸42B於X方向直線移動；Y方向移動部82，使心軸42A、心軸42B於Y方向直線移動；以及Z方向移動部83，使心軸42A、心軸42B於Z方向直線移動。Specifically, as shown in Fig. 2, Fig. 3, Fig. 9 and Fig. 10, the moving mechanism 8 for cutting includes: an X direction moving part 81, which moves the mandrel 42A and the mandrel 42B linearly in the X direction; The part 82 linearly moves the spindle 42A and the spindle 42B in the Y direction; and the Z direction moving part 83 linearly moves the spindle 42A and the spindle 42B in the Z direction.

X方向移動部81為兩個切斷用台2A、2B所共用，尤其如圖2及圖3所示，具有：沿著X方向夾持兩個切斷用台2A、2B而設置的一對X方向導軌811；以及支持體812，沿著該一對X方向導軌811移動並且經由Y方向移動部82及Z方向移動部83支持心軸42A、心軸42B。一對X方向導軌811設置於沿著X方向設置的兩個切斷用台2A、2B的側方。另外，支持體812例如為門型，具有沿Y方向延伸的形狀。具體而言，支持體812具有自一對X方向導軌811向上方延伸的一對腳部、以及架設於該一對腳部的樑部（橫樑部），該樑部沿Y方向延伸。The X-direction moving part 81 is shared by the two cutting tables 2A, 2B, especially as shown in FIGS. The X-direction rail 811 and the support body 812 move along the pair of X-direction rails 811 and support the mandrel 42A and the mandrel 42B via the Y-direction moving part 82 and the Z-direction moving part 83 . A pair of X direction guide rail 811 is provided in the side of two cutting tables 2A, 2B provided along the X direction. In addition, the support body 812 is, for example, a gate shape and has a shape extending in the Y direction. Specifically, the support body 812 has a pair of leg portions extending upward from the pair of X-direction rails 811 , and a beam portion (beam portion) spanning the pair of leg portions, and the beam portion extends in the Y direction.

而且，支持體812例如藉由沿X方向延伸的滾珠螺桿機構813而於一對X方向導軌811上沿著X方向直線往返移動。所述滾珠螺桿機構813由伺服馬達等驅動源（未圖示）驅動。除此以外，支持體812亦可以藉由直線馬達等其他直動機構而往返移動的方式構成。Moreover, the support body 812 linearly reciprocates along the X direction on a pair of X direction guide rails 811 by, for example, a ball screw mechanism 813 extending along the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. In addition, the supporting body 812 may also be configured to move back and forth by other linear motion mechanisms such as a linear motor.

尤其如圖3所示，Y方向移動部82具有：Y方向導軌821，於支持體812中沿著Y方向設置；以及Y方向滑塊822，沿著該Y方向導軌821移動。Y方向滑塊822例如由直線馬達823驅動，於Y方向導軌821上直線往返移動。本實施形態中，與兩個心軸42A、42B對應地設置有兩個Y方向滑塊822。藉此，兩個心軸42A、42B能夠相互獨立地於Y方向移動。除此以外，Y方向滑塊822亦可以藉由使用滾珠螺桿機構的其他直動機構而往返移動的方式構成。Especially as shown in FIG. 3 , the Y-direction moving part 82 has: a Y-direction rail 821 disposed in the support body 812 along the Y-direction; and a Y-direction slider 822 that moves along the Y-direction rail 821 . The Y-direction slider 822 is driven by, for example, a linear motor 823 , and linearly moves back and forth on the Y-direction guide rail 821 . In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindles 42A and 42B. Thereby, the two spindles 42A, 42B can move in the Y direction independently of each other. In addition, the Y-direction slider 822 may also be configured to move back and forth by using other linear motion mechanisms such as ball screw mechanisms.

如圖9及圖10所示，Z方向移動部83具有：Z方向導軌831，於各Y方向滑塊822中沿著Z方向設置；以及Z方向滑塊832，沿著所述Z方向導軌831移動並且支持心軸42A、心軸42B。即，Z方向移動部83是與各心軸42A、42B對應地設置。Z方向滑塊832例如由偏心凸輪機構（未圖示）驅動，於Z方向導軌831上直線往返移動。除此以外，Z方向滑塊832亦可以藉由滾珠螺桿機構等其他直動機構而往返移動的方式構成。As shown in FIGS. 9 and 10 , the Z direction moving part 83 has: a Z direction guide rail 831 disposed along the Z direction in each Y direction slider 822 ; and a Z direction slider 832 arranged along the Z direction guide rail 831 Move and support mandrel 42A, mandrel 42B. That is, the Z direction moving part 83 is provided corresponding to each spindle 42A, 42B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and linearly moves back and forth on the Z-direction guide rail 831 . In addition, the Z-direction slider 832 may also be configured to move back and forth by other linear motion mechanisms such as a ball screw mechanism.

關於所述切斷用移動機構8與傳遞軸71的位置關係，如圖1及圖4所示，以傳遞軸71於切斷用移動機構8的上方橫穿切斷用移動機構8的方式配置。具體而言，傳遞軸71以於支持體812的上方橫穿該支持體812的方式配置，傳遞軸71及支持體812成為相互交叉的位置關係。Regarding the positional relationship between the moving mechanism 8 for cutting and the transmission shaft 71, as shown in FIG. 1 and FIG. . Specifically, the transmission shaft 71 is disposed above the support body 812 so as to cross the support body 812 , and the transmission shaft 71 and the support body 812 are in a positional relationship of intersecting each other.

＜蓋構件＞ 如圖3、圖9及圖10所示，於所述切斷用移動機構8中，於支持體812設置有收容兩個心軸42A、42B的蓋構件15。再者，於圖2中省略了蓋構件15。所述蓋構件15不僅收容兩個心軸42A、42B，而且收容噴射噴嘴121，以使自噴射噴嘴121噴射的切削水不會向周圍飛濺。 ＜Cover member＞ As shown in FIG. 3 , FIG. 9 , and FIG. 10 , in the moving mechanism 8 for cutting, a cover member 15 for accommodating two spindles 42A, 42B is provided on a support body 812 . In addition, the cover member 15 is omitted in FIG. 2 . The cover member 15 houses not only the two spindles 42A, 42B but also the spray nozzle 121 so that the cutting water sprayed from the spray nozzle 121 does not splash around.

具體而言，如圖9及圖10所示，蓋構件15於下表面形成有用以使刀片41A、刀片41B露出的開口部15a。另外，於蓋構件15的上表面形成有開口部15b，以不妨礙心軸42A、42B或切斷用移動機構8的移動。所述上表面的開口部15b被蛇腹構件16封閉，構成為蛇腹構件16隨著心軸42A、心軸42B的移動而伸縮。形成心軸42A、心軸42B的X方向的兩側、Y方向的兩側及上側被該些蓋構件15及蛇腹構件16覆蓋的結構，自噴射噴嘴121噴射的切削水飛濺的範圍受到限制。另外，於蓋構件15的近前側（與支持體812相反的一側）的側壁形成有能夠看見蓋構件15的內部的窗151（參照圖10）。進而，藉由利用排氣機構（未圖示）對所述蓋構件15的周圍進行排氣，可有效地將液滴（霧）排出至外部。Specifically, as shown in FIGS. 9 and 10 , the cover member 15 has an opening 15 a on the lower surface for exposing the blade 41A and the blade 41B. Moreover, the opening part 15b is formed in the upper surface of the cover member 15 so that the movement of the spindle 42A, 42B or the movement mechanism 8 for cutting may not be obstructed. The opening 15b on the upper surface is closed by the accordion member 16, and the accordion member 16 is configured to expand and contract as the mandrel 42A and the mandrel 42B move. The cover member 15 and the bellows member 16 cover the mandrel 42A and the mandrel 42B on both sides in the X direction, both sides and the upper side in the Y direction, so that the range in which the cutting water sprayed from the spray nozzle 121 is limited is limited. In addition, a window 151 through which the inside of the cover member 15 can be seen is formed on the side wall of the cover member 15 on the near side (the side opposite to the support body 812 ) (see FIG. 10 ). Furthermore, by exhausting the periphery of the cover member 15 using an exhaust mechanism (not shown), liquid droplets (mist) can be efficiently exhausted to the outside.

＜加工屑收容部＞ 另外，如圖1所示，本實施形態的切斷裝置100更包括：加工屑收容部17，收容因密封完畢基板W的切斷而產生的端材等加工屑S。 ＜Swarf Storage Unit＞ In addition, as shown in FIG. 1 , the cutting device 100 of the present embodiment further includes a machining waste storage unit 17 for storing machining waste S such as end materials generated by cutting the sealed substrate W. As shown in FIG.

如圖2～圖4所示，所述加工屑收容部17設置於切斷用台2A、切斷用台2B的下方，具有：導引滑槽171，具有於平面視時包圍切斷用台2A、切斷用台2B的上部開口171X；以及回收容器172，將由該導引滑槽171所導引的加工屑S回收。藉由將加工屑收容部17設置於切斷用台2A、切斷用台2B的下方，從而可提高加工屑S的回收率。As shown in FIGS. 2 to 4 , the chip storage unit 17 is disposed below the cutting table 2A and the cutting table 2B, and has a guide chute 171 that surrounds the cutting table in plan view. 2A, an upper opening 171X of the table 2B for cutting, and a recovery container 172 for recovering the machining chips S guided by the guide chute 171 . The recovery rate of the machining waste S can be improved by providing the machining waste storage unit 17 below the cutting table 2A and the cutting table 2B.

導引滑槽171將自切斷用台2A、切斷用台2B飛散或掉落的加工屑S導引至回收容器172。本實施形態中，以導引滑槽171的上部開口171X包圍切斷用台2A、切斷用台2B的方式構成（參照圖3），故而不易漏掉加工屑S，可進一步提高加工屑S的回收率。另外，導引滑槽171以包圍設置於切斷用台2A、切斷用台2B之下的旋轉機構9A、旋轉機構9B的方式設置（參照圖4），以保護旋轉機構9A、旋轉機構9B免受加工屑S及切削水的方式構成。The guide chute 171 guides the machining chips S scattered or dropped from the table 2A for cutting and the table 2B for cutting to the recovery container 172 . In this embodiment, the upper opening 171X of the guide chute 171 surrounds the table 2A for cutting and the table 2B for cutting (see FIG. 3 ), so it is difficult to miss the machining chips S, and the machining waste S can be further increased. recovery rate. In addition, the guide chute 171 is provided so as to surround the rotation mechanism 9A and the rotation mechanism 9B provided under the table 2A for cutting and the table 2B for cutting (see FIG. 4 ), so as to protect the rotation mechanism 9A and the rotation mechanism 9B. Constructed to avoid machining chips S and cutting water.

本實施形態中，加工屑收容部17為兩個切斷用台2A、2B所共用，但亦可與切斷用台2A、切斷用台2B分別對應地設置。In the present embodiment, the chip storage unit 17 is shared by the two tables 2A and 2B for cutting, but it may be provided correspondingly to the table 2A for cutting and the table 2B for cutting, respectively.

回收容器172將因自重而通過導引滑槽171的加工屑S回收，本實施形態中，如圖4等所示，與兩個切斷用台2A、2B分別對應地設置。而且，兩個回收容器172配置於傳遞軸的近前側，以可分別獨立地自切斷裝置100的近前側卸除的方式構成。藉由所述結構，可提高加工屑S的廢棄等的維護性。再者，回收容器172可考慮密封完畢基板W的尺寸或加工屑S的尺寸及量、作業性等而於所有切斷用台之下總體設置一個，亦可設置三個以上。The recovery container 172 recovers the machining chips S passed through the guide chute 171 by its own weight, and in this embodiment, as shown in FIG. Furthermore, the two recovery containers 172 are disposed on the near side of the transmission shaft, and are configured to be independently detachable from the near side of the cutting device 100 . With such a configuration, maintainability such as disposal of machining waste S can be improved. In addition, one collection container 172 may be installed under all the cutting tables in total, or three or more may be installed in consideration of the size of the sealed substrate W, the size and amount of the processing waste S, and workability.

另外，如圖4等所示，加工屑收容部17具有將切削水與加工屑分離的分離部173。作為所述分離部173的結構，例如可想到於回收容器172的底面設置使切削水通過的多孔板等過濾器。藉由所述分離部173，可不於回收容器172蓄積切削水而將加工屑S回收。In addition, as shown in FIG. 4 and the like, the chip storage unit 17 has a separating portion 173 for separating cutting water and chips. As a structure of the separation unit 173 , for example, a filter such as a perforated plate through which the cutting water passes is provided on the bottom surface of the recovery container 172 . The machining chips S can be recovered by the separation unit 173 without accumulating cutting water in the recovery container 172 .

＜第一清潔機構＞ 另外，如圖1及圖5所示，本發明的切斷裝置100更包括：第一清潔機構18，將保持於切斷用台2A、切斷用台2B的多個製品P的上表面側（引線面）清潔。所述第一清潔機構18藉由對保持於切斷用台2A、切斷用台2B的多個製品P的上表面噴射洗淨液及/或壓縮空氣的噴射噴嘴18a（參照圖5），來清潔製品P的上表面側。 ＜First Cleaning Organization＞ In addition, as shown in FIGS. 1 and 5 , the cutting device 100 of the present invention further includes: a first cleaning mechanism 18 that cleans the upper surfaces of the plurality of products P held on the cutting table 2A and the cutting table 2B. (lead side) clean. The first cleaning mechanism 18 uses spray nozzles 18a (see FIG. 5 ) that spray cleaning liquid and/or compressed air to the upper surfaces of the plurality of products P held on the cutting table 2A and the cutting table 2B, to clean the upper surface side of the product P.

如圖5所示，所述第一清潔機構18以能夠與第一保持機構3一起沿著傳遞軸71移動的方式構成。此處，第一清潔機構18設置於滑動構件723，所述滑動構件723在設置於傳遞軸71的導軌721上滑動。此處，於第一清潔機構18及滑動構件723之間，設置有用以使第一清潔機構18於Z方向升降移動的升降移動機構181。關於所述升降移動機構181，例如可想到使用齒條與小齒輪機構，使用滾珠螺桿機構，或使用氣缸等。As shown in FIG. 5 , the first cleaning mechanism 18 is configured to be movable along the transmission shaft 71 together with the first holding mechanism 3 . Here, the first cleaning mechanism 18 is provided on a sliding member 723 that slides on a guide rail 721 provided on the transmission shaft 71 . Here, between the first cleaning mechanism 18 and the sliding member 723, a lifting mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction is provided. For the above-mentioned elevating movement mechanism 181, it is conceivable to use a rack and pinion mechanism, a ball screw mechanism, or an air cylinder, for example.

＜第二清潔機構＞ 進而，如圖1所示，本發明的切斷裝置100更包括：第二清潔機構19，將保持於第二保持機構6的多個製品P的下表面側（封裝面）清潔。所述第二清潔機構19設置於切斷用台2B與檢查部13之間，藉由向保持於第二保持機構6的多個製品P的下表面噴射洗淨液及/或壓縮空氣，從而清潔製品P的下表面側。即，於第二保持機構6沿著傳遞軸71移動的中途，第二清潔機構19將製品P的下表面側清潔。 ＜Second Cleaning Organization＞ Furthermore, as shown in FIG. 1 , the cutting device 100 of the present invention further includes a second cleaning mechanism 19 for cleaning the lower surface side (packaging surface) of the plurality of products P held by the second holding mechanism 6 . The second cleaning mechanism 19 is provided between the cutting table 2B and the inspection unit 13, and sprays cleaning liquid and/or compressed air to the lower surfaces of the plurality of products P held by the second holding mechanism 6, thereby The lower surface side of the article P is cleaned. That is, the second cleaning mechanism 19 cleans the lower surface side of the product P while the second holding mechanism 6 is moving along the transmission shaft 71 .

＜切斷裝置的動作的一例＞ 繼而，對切斷裝置100的動作的一例加以說明。圖11中，表示切斷裝置10的動作中的第一保持機構3的移動路徑、及第二保持機構6的移動路徑。再者，本實施形態中，切斷裝置100的動作、例如密封完畢基板W的搬送、密封完畢基板W的切斷、製品P的檢查等所有動作或控制是由控制部CTL（參照圖1）進行。 <An example of the operation of the cutting device> Next, an example of the operation of the cutting device 100 will be described. FIG. 11 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 during the operation of the cutting device 10 . Furthermore, in the present embodiment, all operations or controls of the cutting device 100, such as conveyance of the sealed substrate W, cutting of the sealed substrate W, and inspection of the product P, are performed by the control unit CTL (see FIG. 1 ). conduct.

基板供給機構11的基板供給部112使收容於基板收容部111的密封完畢基板W向由第一保持機構3保持的保持位置RP移動。The substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W stored in the substrate storage unit 111 to the holding position RP held by the first holding mechanism 3 .

繼而，搬送用移動機構7使第一保持機構3移動至保持位置RP，第一保持機構3吸附保持密封完畢基板W。其後，搬送用移動機構7使保持有密封完畢基板W的第一保持機構3移動至切斷用台2A、切斷用台2B，第一保持機構3解除吸附保持，將密封完畢基板W載置於切斷用台2A、切斷用台2B。此時，藉由主移動機構72來調整密封完畢基板W的X方向的位置，藉由水平移動機構74來調整密封完畢基板W的Y方向的位置。而且，切斷用台2A、切斷用台2B吸附保持密封完畢基板W。Next, the transport moving mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 absorbs and holds the sealed substrate W. Thereafter, the conveyance moving mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting table 2A and the cutting table 2B, and the first holding mechanism 3 releases the adsorption and holding, and the sealed substrate W is placed on the substrate W. Placed on table 2A for cutting and table 2B for cutting. At this time, the position of the sealed substrate W in the X direction is adjusted by the main moving mechanism 72 , and the position of the sealed substrate W in the Y direction is adjusted by the horizontal movement mechanism 74 . Then, the cutting table 2A and the cutting table 2B suck and hold the sealed substrate W.

此處，於使保持有密封完畢基板W的第一保持機構3移動至切斷用台2B的情況下，升降移動機構73使第一保持機構3上升至不與切斷用移動機構8（支持體812）發生物理干擾的位置為止。再者，於使保持有密封完畢基板W的第一保持機構3移動至切斷用台2B時，於使支持體812自切斷用台2B向移載台5側退避的情況下，無需如所述般使第一保持機構3升降。Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the table 2B for cutting, the elevating movement mechanism 73 raises the first holding mechanism 3 so that it is not in contact with the moving mechanism 8 (supporting for cutting). body 812) until the location where physical interference occurs. Furthermore, when the first holding mechanism 3 holding the sealed substrate W is moved to the table 2B for cutting, when the support body 812 is retracted from the table 2B for cutting to the transfer stage 5 side, it is not necessary to As described above, the first holding mechanism 3 is raised and lowered.

於此狀態下，切斷用移動機構8使兩個心軸42A、42B於X方向及Y方向依序移動，並且切斷用台2A、2B旋轉，藉此將密封完畢基板W切斷為格子狀而單片化。In this state, the moving mechanism 8 for cutting moves the two mandrels 42A, 42B sequentially in the X direction and the Y direction, and the stages 2A, 2B for cutting are rotated, thereby cutting the sealed substrate W into grids. Shaped and monolithic.

於切斷後，搬送用移動機構7使第一清潔機構18移動，將保持於切斷用台2A、切斷用台2B的多個製品P的上表面側（引線面）清潔。所述清潔之後，搬送用移動機構7使第一保持機構3及第一清潔機構18退避至既定位置。After cutting, the transport moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surface side (lead surface) of the plurality of products P held on the cutting table 2A and the cutting table 2B. After the cleaning, the transport moving mechanism 7 retracts the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.

繼而，搬送用移動機構7使第二保持機構6移動至切斷後的切斷用台2A、切斷用台2B，第二保持機構6吸附保持多個製品P。其後，搬送用移動機構7使保持有多個製品P的第二保持機構6移動至第二清潔機構19。藉此，第二清潔機構19將保持於第二保持機構6的多個製品P的下表面側（封裝面）清潔。Next, the conveyance moving mechanism 7 moves the second holding mechanism 6 to the cutting table 2A and the cutting table 2B after cutting, and the second holding mechanism 6 sucks and holds a plurality of products P. Thereafter, the conveyance moving mechanism 7 moves the second holding mechanism 6 holding a plurality of products P to the second cleaning mechanism 19 . Thereby, the second cleaning mechanism 19 cleans the lower surface side (seal surface) of the plurality of products P held by the second holding mechanism 6 .

於清潔之後，保持於第二保持機構6的多個製品P藉由檢查部13及反轉機構14進行兩面檢查。其後，搬送用移動機構7使第二保持機構6移動至移載台5，第二保持機構6解除吸附保持，將多個製品P載置於移載台5。載置於移載台5的多個製品P根據由檢查部13所得的檢查結果（良品、不良品等）而由分類機構20分類至各種托盤21。After cleaning, a plurality of products P held by the second holding mechanism 6 are inspected on both sides by the inspection unit 13 and the reversing mechanism 14 . Thereafter, the transport moving mechanism 7 moves the second holding mechanism 6 to the transfer stage 5 , and the second holding mechanism 6 releases suction and holding, and places a plurality of products P on the transfer stage 5 . The plurality of products P placed on the transfer table 5 are sorted into various trays 21 by the sorting mechanism 20 according to the inspection results (defective products, defective products, etc.) obtained by the inspection unit 13 .

再者，關於兩面檢查，例如，首先於由第二保持機構6吸附保持的狀態下檢查製品P的其中一個面。接著，自第二保持機構6將製品P移載至反轉機構14的保持台141，於由反轉後的保持台141吸附保持的狀態下檢查製品P的另一面，藉此可執行兩面檢查。而且，之後的自反轉台14向移載台5的製品P的搬送可藉由自保持台141移載至第二保持機構6來進行。另外，將保持台141設為能夠於X方向移動的結構，將保持台141或移載台5的至少其中一者設為能夠於Z方向移動的結構，使保持台141移動至移載台5的上方，藉此亦可將製品P搬送至移載台5並進行移載。In addition, regarding the double-sided inspection, for example, first, one of the surfaces of the product P is inspected in a state of being sucked and held by the second holding mechanism 6 . Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the reversing mechanism 14, and the other side of the product P is inspected while being sucked and held by the reversed holding table 141, whereby double-sided inspection can be performed. . Further, the subsequent conveyance of the product P from the reversing table 14 to the transfer table 5 can be performed by transferring from the holding table 141 to the second holding mechanism 6 . In addition, the holding table 141 is configured to be movable in the X direction, at least one of the holding table 141 or the transfer table 5 is configured to be movable in the Z direction, and the holding table 141 is moved to the transfer table 5. In this way, the product P can also be transferred to the transfer table 5 and transferred.

＜本實施形態的效果＞ 根據本實施形態的切斷裝置100，設為藉由沿著切斷用台2A、切斷用台2B及移載台5的排列方向延伸的共用的傳遞軸71來使第一保持機構3及第二保持機構6的結構，藉由切斷用移動機構8使切斷機構4於水平面上於沿著傳遞軸71的X方向及與X方向正交的Y方向分別移動，因此可不使切斷用台2A、切斷用台2B於X方向及Y方向移動而對密封完畢基板W進行加工。因此，可不藉由滾珠螺桿機構使切斷用台2A、切斷用台2B移動，而無需用以保護滾珠螺桿機構的蛇腹構件及用以保護該蛇腹構件的蓋構件。其結果為，可使切斷裝置100的裝置結構簡化。另外，可設為不使切斷用台2A、切斷用台2B於X方向及Y方向移動的結構，可減小切斷裝置100的佔據面積。 <Effects of this embodiment> According to the cutting device 100 of the present embodiment, the first holding mechanism 3 and the first holding mechanism 3 are connected by the common transmission shaft 71 extending along the direction in which the cutting table 2A, the cutting table 2B, and the transfer table 5 are arranged. The structure of the second holding mechanism 6 is to move the cutting mechanism 4 on the horizontal plane in the X direction along the transmission shaft 71 and the Y direction orthogonal to the X direction by the cutting moving mechanism 8, so that the cutting can be avoided. The sealed substrate W is processed by moving the table 2A and the cutting table 2B in the X direction and the Y direction. Therefore, the cutting table 2A and the cutting table 2B can be moved without the ball screw mechanism, and the bellows member for protecting the ball screw mechanism and the cover member for protecting the bellows member are unnecessary. As a result, the device structure of the cutting device 100 can be simplified. Moreover, it can be set as the structure which does not move the table 2A for cutting, and the table 2B for cutting in the X direction and the Y direction, and the occupation area of the cutting apparatus 100 can be made small.

於本實施方式中，設置於X方向的一對X方向導軌811夾持切斷用台2A、切斷用台2B而設置，因此可增大一對X方向導軌811的間距。其結果，可減小X方向導軌811彼此於Z方向上的位置偏移對加工的影響。進而，藉由增大一對導軌811的間距而提高X方向移動部81的直進性，其結果，刀片41A、刀片41B的刀尖的晃動變小，切斷時的切削阻力等變小，從而可提高加工精度。另外，X方向導軌811可使用規格較先前低的構件。In this embodiment, since the pair of X direction guide rails 811 provided in the X direction sandwiches the cutting table 2A and the cutting table 2B, the distance between the pair of X direction guide rails 811 can be increased. As a result, the influence of the positional displacement of the X direction guide rails 811 in the Z direction on the machining can be reduced. Furthermore, by increasing the distance between the pair of guide rails 811, the straightness of the moving part 81 in the X direction is improved. As a result, the wobbling of the cutting edge of the blade 41A and the blade 41B becomes smaller, and the cutting resistance at the time of cutting becomes smaller, thereby Machining accuracy can be improved. In addition, the X-direction guide rail 811 can use a lower specification member than before.

於本實施形態中，由於兩個以上的切斷用台2A、2B於切斷時不於Y方向移動，因此可一併調整相對於兩個以上的切斷用台2A、2B而言的移動機構8（X方向移動部81）於X方向的平行度。即，於切斷時切斷用台移動的現有裝置中設置兩個切斷用台的情況下，需要調整兩個切斷用台於X方向的平行度，進而對所述調整後的於X方向的平行度以及刀片於X方向的平行度進行調整（具體而言，需要進行兩次調整），於本實施形態中，兩個切斷用台2A、2B於切斷時不於X方向移動，因此只需要調整刀片41A、刀片41B於X方向的平行度即可（具體而言，只需要調整一次）。In this embodiment, since the two or more cutting tables 2A, 2B do not move in the Y direction during cutting, the movement relative to the two or more cutting tables 2A, 2B can be adjusted together. The parallelism of the mechanism 8 (moving part 81 in the X direction) in the X direction. That is, in the case where two cutting tables are set in an existing device in which the cutting table moves during cutting, it is necessary to adjust the parallelism of the two cutting tables in the X direction, and then to the adjusted X direction. The parallelism in the direction and the parallelism of the blade in the X direction are adjusted (specifically, two adjustments are required), and in this embodiment, the two cutting tables 2A, 2B do not move in the X direction during cutting. , so it is only necessary to adjust the parallelism of the blade 41A and the blade 41B in the X direction (specifically, it only needs to be adjusted once).

另外，由於為兩個以上的切斷用台2A、2B沿著X方向而設置並且使支持心軸42A、心軸42B的支持體812沿著X方向移動的結構，因此可於藉由其中一個切斷用台2A處理密封完畢基板W時，於另一個切斷用台2B進行搬送等的其他處理。In addition, since two or more cutting stages 2A, 2B are arranged along the X direction and the support body 812 supporting the mandrel 42A, 42B is moved along the X direction, it is possible to use one of them. When the sealed substrate W is processed on the table 2A for cutting, other processing such as transportation is performed on the other table 2B for cutting.

＜其他變形實施形態＞ 再者，本發明並不限於所述實施形態。 ＜Other modified implementation forms＞ In addition, this invention is not limited to the said embodiment.

例如，所述實施形態中，對雙切割台方式且雙心軸結構的切斷裝置進行了說明，但並不限於此，亦可為單切割台方式且單心軸結構的切斷裝置、或單切割台方式且雙心軸結構的切斷裝置等。For example, in the above-mentioned embodiments, a cutting device with a double-cutting table type and a double-mandrel structure has been described, but it is not limited to this, and a cutting device with a single-cutting table type and a single-mandrel structure may be used, or Cutting device with single cutting table and double mandrel structure, etc.

另外，所述實施形態的移載台5為於分類至各種托盤21之前暫時載置的索引台，但亦可將移載台5設為反轉機構14的保持台141。In addition, the transfer table 5 in the above-described embodiment is an index table that is temporarily placed before being sorted into various trays 21 , but the transfer table 5 may also be used as the holding table 141 of the reversing mechanism 14 .

進而，於所述實施形態中，為自移載台5分類至托盤21的結構，但亦可為將製品P搬送並貼附於框狀構件的內側所配置的黏接帶上的結構。Furthermore, in the above-described embodiment, it is a structure in which the self-transfer stage 5 is sorted to the tray 21, but it may be a structure in which the product P is conveyed and attached to the adhesive tape arranged inside the frame-shaped member.

而且，於所述實施形態的結構中，亦可設為下述結構，即：於切斷用台2A、切斷用台2B中不將密封完畢基板切斷，而是形成槽。於此情況下，例如亦可設為下述結構，即：於切斷用台2A、切斷用台2B實施了槽加工的密封完畢基板W藉由第一保持機構3及搬送用移動機構7而回到基板供給部112。另外，亦可設為下述結構，即：將回到所述基板供給部112的密封完畢基板W收容於基板收容部111。Furthermore, in the configuration of the above-mentioned embodiment, a configuration may be adopted in which grooves are formed without cutting the sealed substrate on the cutting table 2A and the cutting table 2B. In this case, for example, a structure may be adopted in which the sealed substrate W subjected to groove processing on the table 2A for cutting and the table 2B for cutting is moved by the first holding mechanism 3 and the moving mechanism 7 for conveyance. And return to the substrate supply unit 112 . In addition, a configuration may be adopted in which the sealed substrate W returned to the substrate supply unit 112 is accommodated in the substrate storage unit 111 .

另外，構成傳遞軸71的凸輪齒條要素可將多個連結而構成，因而例如可將切斷裝置（加工裝置）100設為於第二清潔機構19與檢查部13之間可分離及連結（可裝卸）的模組結構。於此情況下，例如可於第二清潔機構19側的模組、與檢查部13側的模組之間，追加進行與檢查部13中的檢查為不同種類的檢查的模組。再者，除了此處例示的結構以外，亦可將切斷裝置（加工裝置）100設為能夠於某處分離及連結（能夠裝卸）的模組結構，亦可將追加的模組設為檢查以外的各種功能的模組。In addition, since a plurality of cam rack elements constituting the transmission shaft 71 can be connected, for example, the cutting device (processing device) 100 can be detachable and connectable between the second cleaning mechanism 19 and the inspection unit 13 ( detachable) module structure. In this case, for example, a module that performs an inspection different from that in the inspection unit 13 may be added between the second cleaning mechanism 19 side module and the inspection unit 13 side module. Furthermore, in addition to the structure exemplified here, the cutting device (processing device) 100 may also have a module structure that can be separated and connected (detachable) somewhere, and an additional module may be used as an inspection Modules for various functions other than

另外，本發明的加工裝置亦可進行切斷以外的加工，例如亦可進行切削或磨削等其他機械加工。In addition, the processing device of the present invention can also perform processing other than cutting, for example, other mechanical processing such as cutting or grinding.

除此以外，本發明不限於所述實施形態，當然能夠於不偏離其主旨的範圍進行各種變形。 [產業上的可利用性] In addition, this invention is not limited to the said embodiment, Of course, various deformation|transformation is possible in the range which does not deviate from the summary. [industrial availability]

本發明可使裝置結構簡化並且減少佔據面積。The invention can simplify the device structure and reduce the occupied area.

2A、2B:切斷用台（加工台） 3:第一保持機構 4:切斷機構（加工機構） 5:移載台 6:第二保持機構 7:搬送用移動機構 8:切斷用移動機構（加工用移動機構）（移動機構） 9A、9B:旋轉機構 10A、10B:真空泵 11:基板供給機構 12:液體供給機構 13:檢查部 14:反轉機構（反轉台） 15:蓋構件 15a、15b:開口部 16:蛇腹構件 17:加工屑收容部 18:第一清潔機構 18a、121:噴射噴嘴 19:第二清潔機構 20:分類機構 21:托盤 22:托盤搬送機構 23:托盤收容部 31、61:吸附頭 40:旋轉工具 41A、41B:刀片 42A、42B:心軸 71:共用的傳遞軸 72:主移動機構 73:升降移動機構 73a:Z方向導軌 74a:水平導軌（Y方向導軌） 73b:致動器部 74:水平移動機構 74b:彈性體 74c:凸輪機構 81:X方向移動部（第一方向移動部） 82:Y方向移動部（第二方向移動部） 83:Z方向移動部 100:切斷裝置（加工裝置） 111:基板收容部 112:基板供給部 113:加熱部 131:第一檢查部 132:第二檢查部 141:保持台 142:反轉部 151:窗 171:導引滑槽 171X:上部開口 172:回收容器 173:分離部 181:升降移動機構 311、611:吸附部 721:共用的導軌 722:齒條與小齒輪機構 722a:共用的凸輪齒條 722b:小齒輪 722b1:滾子本體 722b2:滾子銷 723:滑動構件 811:一對第一方向導軌（X方向導軌）（導軌） 812:支持體 813:滾珠螺桿機構 821:Y方向導軌 822:Y方向滑塊822 823:直線馬達 831:Z方向導軌 832:Z方向滑塊 CTL:控制部 P:製品 RP:保持位置 S:加工屑 W:密封完畢基板（加工對象物） X、Y:軸方向（方向） Z、θ:方向 2A, 2B: cutting table (processing table) 3: The first holding mechanism 4: Cutting mechanism (processing mechanism) 5: Transfer platform 6: The second holding mechanism 7: Moving mechanism for conveying 8: Moving mechanism for cutting (moving mechanism for processing) (moving mechanism) 9A, 9B: rotating mechanism 10A, 10B: vacuum pump 11: Substrate supply mechanism 12: Liquid supply mechanism 13: Inspection Department 14: Reverse mechanism (reverse table) 15: cover member 15a, 15b: openings 16: Concertina 17: Processing swarf storage unit 18: The first cleaning agency 18a, 121: spray nozzle 19: The second cleaning mechanism 20: Classification agency 21: tray 22: Pallet transfer mechanism 23: Tray Storage Department 31, 61: adsorption head 40:Rotary tool 41A, 41B: Blades 42A, 42B: mandrel 71: Shared transfer shaft 72: Main moving mechanism 73: Lifting and moving mechanism 73a:Z direction guide rail 74a: Horizontal guide rail (Y direction guide rail) 73b: Actuator part 74: Horizontal movement mechanism 74b: Elastomer 74c: Cam Mechanism 81: X direction moving part (first direction moving part) 82: Y direction moving part (second direction moving part) 83: Z direction moving part 100: Cutting device (processing device) 111: Substrate storage unit 112: Substrate supply department 113: heating part 131: First Inspection Department 132:Second inspection department 141: holding table 142: Inversion Department 151: window 171: guide chute 171X: Upper opening 172: Recycling container 173: Separation Department 181: Lifting and moving mechanism 311, 611: adsorption part 721: Shared guide rail 722: Rack and Pinion Mechanism 722a: shared cam rack 722b: Pinion 722b1: Roller body 722b2: Roller pin 723: sliding components 811: A pair of first direction guide rails (X direction guide rails) (guide rails) 812: Support body 813: Ball screw mechanism 821: Y direction guide rail 822: Y direction slider 822 823:Linear motor 831:Z direction guide rail 832:Z direction slider CTL: control department P: Products RP: hold position S: processing chips W: Sealed substrate (object to be processed) X, Y: axis direction (direction) Z, θ: direction

圖1為示意性地表示本發明的一實施形態的切斷裝置的結構的圖。 圖2為示意性地表示所述實施形態的切斷用台及其周邊結構的立體圖。 圖3為示意性地表示所述實施形態的切斷用台及其周邊結構的結構的、自Z方向觀看的圖（平面圖）。 圖4為示意性地表示所述實施形態的切斷用台及其周邊結構的結構的、自Y方向觀看的圖（正面圖）。 圖5為示意性地表示所述實施形態的第一保持機構及搬送用移動機構的結構的、自Y方向觀看的圖（正面圖）。 圖6為示意性地表示所述實施形態的第一保持機構及搬送用移動機構的結構的、自X方向觀看的圖（側面圖）。 圖7為示意性地表示所述實施形態的第二保持機構及搬送用移動機構的結構的、自Y方向觀看的圖（正面圖）。 圖8為示意性地表示所述實施形態的齒條與小齒輪（rack and pinion）機構的結構的剖面圖。 圖9為示意性地表示所述實施形態的加工用移動機構及蓋構件的結構的、自X方向觀看的剖面圖。 圖10為示意性地表示所述實施形態的加工用移動機構及蓋構件的結構的、自Y方向觀看的剖面圖。 圖11為表示所述實施形態的切斷裝置的動作的示意圖。 FIG. 1 is a diagram schematically showing the structure of a cutting device according to an embodiment of the present invention. Fig. 2 is a perspective view schematically showing the table for cutting and its peripheral structure according to the embodiment. FIG. 3 is a view (plan view) seen from the Z direction, schematically showing the structure of the table for cutting and its peripheral structures according to the embodiment. 4 is a view (front view) seen from the Y direction, schematically showing the structure of the table for cutting and its peripheral structures according to the embodiment. 5 is a view (front view) seen from the Y direction, schematically showing the configuration of the first holding mechanism and the moving mechanism for conveyance according to the embodiment. 6 is a view (side view) seen from the X direction, schematically showing the configuration of the first holding mechanism and the moving mechanism for conveyance according to the embodiment. 7 is a view (front view) seen from the Y direction, schematically showing the configuration of the second holding mechanism and the moving mechanism for conveyance according to the embodiment. FIG. 8 is a cross-sectional view schematically showing the structure of a rack and pinion mechanism according to the embodiment. Fig. 9 is a cross-sectional view schematically showing the configuration of the moving mechanism for processing and the cover member according to the embodiment, viewed from the X direction. Fig. 10 is a cross-sectional view schematically showing the configuration of the moving mechanism for processing and the cover member according to the embodiment, viewed from the Y direction. Fig. 11 is a schematic diagram showing the operation of the cutting device according to the embodiment.

2A、2B:切斷用台(加工台) 2A, 2B: Table for cutting (processing table)

3:第一保持機構 3: The first holding mechanism

4:切斷機構(加工機構) 4: Cutting mechanism (processing mechanism)

5:移載台 5: Transfer platform

6:第二保持機構 6: The second holding mechanism

7:搬送用移動機構 7: Moving mechanism for conveying

8:切斷用移動機構(加工用移動機構)(移動機構) 8: Moving mechanism for cutting (moving mechanism for processing) (moving mechanism)

9A、9B:旋轉機構 9A, 9B: rotating mechanism

10A、10B:真空泵 10A, 10B: vacuum pump

11:基板供給機構 11: Substrate supply mechanism

13:檢查部 13: Inspection Department

14:反轉機構(反轉台) 14: Reverse mechanism (reverse table)

17:加工屑收容部 17: Processing swarf storage unit

18:第一清潔機構 18: The first cleaning agency

19:第二清潔機構 19: The second cleaning mechanism

20:分類機構 20: Classification agency

21:托盤 21: tray

22:托盤搬送機構 22: Pallet transfer mechanism

23:托盤收容部 23: Tray Storage Department

40:旋轉工具 40:Rotary tool

41A、41B:刀片 41A, 41B: Blades

42A、42B:心軸 42A, 42B: mandrel

71:共用的傳遞軸 71: Shared transfer shaft

100:切斷裝置(加工裝置) 100: Cutting device (processing device)

111:基板收容部 111: Substrate storage unit

112:基板供給部 112: Substrate supply department

113:加熱部 113: heating part

131:第一檢查部 131: First Inspection Department

132:第二檢查部 132:Second inspection department

141:保持台 141: holding table

142:反轉部 142: Inversion Department

172:回收容器 172: Recycling container

812:支持體 812: Support body

CTL:控制部 CTL: control department

RP:保持位置 RP: hold position

W:密封完畢基板(加工對象物) W: Sealed substrate (object to be processed)

X、Y:軸方向(方向) X, Y: axis direction (direction)

Z、θ:方向 Z, θ: direction

Claims (16)

一種加工裝置，包括：加工台，保持加工對象物；第一保持機構，為了將所述加工對象物搬送至所述加工台而保持所述加工對象物；加工機構，對保持於所述加工台的所述加工對象物進行加工；移載台，移動加工後的所述加工對象物；第二保持機構，為了將加工後的所述加工對象物自所述加工台搬送至所述移載台而保持加工後的所述加工對象物；搬送用移動機構，具有沿著所述加工台及所述移載台的排列方向延伸且用以使所述第一保持機構及所述第二保持機構移動的共用的傳遞軸；加工用移動機構，使所述加工機構於水平面上於沿著所述傳遞軸的第一方向及與所述第一方向正交的第二方向分別移動；以及第一清潔機構，所述第一清潔機構將保持於所述加工台的加工後的所述加工對象物的上表面側進行清潔，其中所述第一清潔機構以能夠與所述第一保持機構一起沿著所述傳遞軸移動的方式構成，所述加工台於所述第一方向及所述第二方向上經固定而設置。 A processing device comprising: a processing table for holding an object to be processed; a first holding mechanism for holding the object to be processed in order to transfer the object to the processing table; a processing mechanism for holding the object on the processing table processing the object to be processed; a transfer stage for moving the object to be processed after processing; a second holding mechanism for transferring the object to be processed after processing from the processing table to the transfer stage and hold the processed object; the moving mechanism for conveyance has a moving mechanism extending along the arrangement direction of the processing table and the transfer table and used to make the first holding mechanism and the second holding mechanism A common transmission shaft for movement; a moving mechanism for processing, which moves the processing mechanism on a horizontal plane in a first direction along the transmission shaft and in a second direction orthogonal to the first direction; and a first a cleaning mechanism, the first cleaning mechanism cleans the upper surface side of the processed object held on the processing table, wherein the first cleaning mechanism can be moved along with the first holding mechanism; The processing table is configured to move along the transmission shaft, and the processing table is fixed and installed in the first direction and the second direction. 如請求項1所述的加工裝置，其中，所述傳遞軸以 於所述加工用移動機構的上方橫穿所述加工用移動機構的方式配置。 The processing device according to claim 1, wherein the transmission shaft is It is arranged above the moving mechanism for processing so as to traverse the moving mechanism for processing. 如請求項1或請求項2所述的加工裝置，包括多個所述加工台，所述多個加工台及所述移載台於水平面上配置成一行。 The processing device according to claim 1 or claim 2, comprising a plurality of processing tables, and the processing tables and the transfer table are arranged in a row on a horizontal plane. 如請求項1或請求項2所述的加工裝置，其中，所述加工台構成為能夠於水平面上旋轉。 The processing device according to claim 1 or claim 2, wherein the processing table is configured to be rotatable on a horizontal plane. 如請求項1或請求項2所述的加工裝置，其中，所述第一保持機構、所述第二保持機構、所述加工台及所述移載台於平面視時相對於所述傳遞軸而設置於同側。 The processing device according to claim 1 or claim 2, wherein the first holding mechanism, the second holding mechanism, the processing table, and the transfer table are relative to the transmission axis when viewed in a plane And set on the same side. 如請求項1或請求項2所述的加工裝置，其中，所述加工用移動機構包括：使所述加工機構於所述第一方向直線移動的第一方向移動部、以及使所述加工機構於所述第二方向直線移動的第二方向移動部，且所述第一方向移動部具有：一對第一方向導軌，沿著所述第一方向夾持所述加工台而設置；以及支持體，沿著所述一對第一方向導軌移動，並且經由所述第二方向移動部支持所述加工機構。 The processing device according to claim 1 or claim 2, wherein the moving mechanism for processing includes: a first direction moving part that linearly moves the processing mechanism in the first direction; a second-direction moving part linearly moving in the second direction, and the first-direction moving part has: a pair of first-direction guide rails arranged to hold the processing table along the first direction; and support The body moves along the pair of guide rails in the first direction, and supports the processing mechanism via the moving part in the second direction. 如請求項1或請求項2所述的加工裝置，更包括第二清潔機構，所述第二清潔機構將保持於所述第二保持機構的加工後的所述加工對象物的下表面側進行清潔。 The processing device according to claim 1 or claim 2, further comprising a second cleaning mechanism for cleaning the lower surface side of the processed object held by the second holding mechanism. clean. 如請求項1或請求項2所述的加工裝置，更包括：檢查部，檢查保持於所述第二保持機構的加工後的所述加工對象 物；以及反轉機構，為了能夠藉由所述檢查部檢查加工後的所述加工對象物的兩面而使加工後的所述加工對象物反轉。 The processing device according to claim 1 or claim 2, further comprising: an inspection unit for inspecting the processed object held by the second holding mechanism an object; and a reversing mechanism for reversing the processed object so that both sides of the processed object can be inspected by the inspection unit. 如請求項1或請求項2所述的加工裝置，其中，所述搬送用移動機構具有：共用的導軌，設置於所述傳遞軸上、且導引所述第一保持機構及所述第二保持機構；以及齒條與小齒輪機構，使所述第一保持機構及所述第二保持機構沿著所述共用的導軌移動，所述齒條與小齒輪機構具有：凸輪齒條，為所述第一保持機構及所述第二保持機構所共用；以及小齒輪，分別設置於所述第一保持機構及所述第二保持機構，由致動器旋轉。 The processing device according to claim 1 or claim 2, wherein the moving mechanism for conveyance has a common guide rail provided on the transmission shaft and guiding the first holding mechanism and the second holding mechanism. a retaining mechanism; and a rack and pinion mechanism for moving said first and second retaining mechanisms along said common rail, said rack and pinion mechanism having: a cam rack for said shared by the first holding mechanism and the second holding mechanism; and a pinion gear, respectively provided on the first holding mechanism and the second holding mechanism, and rotated by an actuator. 如請求項1或請求項2所述的加工裝置，其中，所述搬送用移動機構更包括：升降移動機構，介於所述傳遞軸與所述第一保持機構之間而設置，且使所述第一保持機構相對於所述傳遞軸升降移動；以及水平移動機構，介於所述傳遞軸與所述第一保持機構之間而設置，且使所述第一保持機構相對於所述傳遞軸沿著所述第二方向移動。 The processing device according to claim 1 or claim 2, wherein the moving mechanism for conveyance further includes: an elevating moving mechanism arranged between the transmission shaft and the first holding mechanism, and makes the The first holding mechanism moves up and down relative to the transmission shaft; and a horizontal movement mechanism is provided between the transmission shaft and the first holding mechanism, and makes the first holding mechanism relative to the transmission The shaft moves along the second direction. 如請求項10所述的加工裝置，其中，所述水平移動機構具有：水平導軌，沿著所述第二方向設置且導引所述第一保持機構；彈性體，對所述第一保持機構向所述水平導軌的其中一側賦予力；以及凸輪機構，使所述第一保持機構向所述水平 導軌的另一側移動。 The processing device according to claim 10, wherein the horizontal moving mechanism has: a horizontal guide rail arranged along the second direction and guiding the first holding mechanism; an elastic body supporting the first holding mechanism applying a force to one side of the horizontal rail; and a cam mechanism that moves the first retaining mechanism toward the horizontal The other side of the rail moves. 如請求項1或請求項2所述的加工裝置，更包括加工屑收容部，所述加工屑收容部設置於所述加工台的下方、且收容由所述加工機構進行的加工而產生的加工屑。 The processing device according to claim 1 or claim 2, further comprising a processing waste storage part, which is provided under the processing table and accommodates the processing generated by the processing performed by the processing mechanism. crumbs. 如請求項12所述的加工裝置，其中，所述加工屑收容部具有：導引滑槽，具有於平面視時包圍所述加工台的上部開口；以及回收容器，將由所述導引滑槽所導引的加工屑回收。 The processing device according to claim 12, wherein the processing chip storage part has: a guide chute having an upper opening surrounding the processing table in plan view; The guided machining chips are recovered. 如請求項1或請求項2所述的加工裝置，其中，所述加工機構是藉由刀片將所述加工對象物切斷而進行單片化的機構。 The processing device according to claim 1 or claim 2, wherein the processing mechanism is a mechanism for cutting the object to be processed with a blade to perform singulation. 如請求項1或請求項2所述的加工裝置，其中，所述加工對象物是經樹脂密封的密封完畢基板，所述加工機構藉由利用刀片將所述密封完畢基板切斷，從而單片化為多個製品。 The processing device according to claim 1 or claim 2, wherein the object to be processed is a resin-sealed sealed substrate, and the processing mechanism cuts the sealed substrate with a blade to form a single piece into multiple products. 一種加工品的製造方法，使用如請求項1至請求項15中任一項所述的加工裝置來製造加工品。A method of manufacturing a processed product, using the processing device according to any one of claim 1 to claim 15 to manufacture a processed product.
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