TW201533787A - Dividing device - Google Patents

Abstract

To provide a dividing device which can divide efficiently a plate-like workpiece containing a ceramic condenser substrate without causing deterioration in the quality of chips. A dividing device to divide a plate-like workpiece into a plurality of chips, comprising: a cassette mounting region for mounting a cassette; a temporary placing means which carries out temporary placement of the workpiece before processing; a workpiece carrying means which takes the workpiece stored in the cassette before processing and carries it to the temporary placing means; a holding table which carries out suction holding of the workpiece before processing, a transportation device which moves the holding table to a carrying-in/taking-out region in which a workpiece is carried in or taken out, and a processing area; a workpiece carrying-in means which conveys the workpiece before processing already taken out to the temporary placing means to the holding table positioned in the carrying-in/taking-out region; a laser-beam irradiation means to irradiate laser beams on the workpiece before processing, which is arranged in the processing area and sucked to be held by the holding table, and to form on the workpiece the division grooves to be used as the fracture starting point for cutting into chips; a division means to apply external force to the workpiece on which division grooves used as the fracture starting point were formed, and to divide a workpiece into a plurality of chips along the division grooves; an accommodating means which accommodates a plurality of chips divided by the division means; a chip dropping means which drops the plurality of chips divided by the division means into the accommodating means.

Description

Split device Field of invention

The present invention relates to a dividing device for dividing a plate-shaped workpiece into a plurality of wafers.

Background of the invention

A ceramic capacitor substrate in which a metal foil and an insulator are laminated to each other is widely used in an electric device such as a mobile phone or a computer by a dividing device to be divided into individual chip capacitors.

As a dividing device that can divide the ceramic capacitor substrate into individual chip capacitors, a cutting device including a cutting blade is generally used (see, for example, Patent Document 1).

Further, as a method of dividing a ceramic capacitor substrate into individual wafer capacitors, it has been attempted to irradiate laser light having an absorptive wavelength to a ceramic capacitor substrate along a predetermined dividing line. A method of cutting a ceramic capacitor substrate by dividing a predetermined line.

Prior technical literature Patent literature

Patent Document 1: Japanese Patent Laid-Open Publication No. 2003-142334

Summary of invention

However, when the ceramic capacitor substrate is sintered at a predetermined temperature, it becomes hard, and when the ceramic capacitor substrate is cut by the cutter, the cutter is violently depleted and damaged, and There is also the problem of so-called poor productivity.

Further, when the ceramic capacitor substrate is irradiated with laser light and divided into individual wafer capacitors, there is a problem that a so-called melt (dross) adheres to the side surface of the wafer capacitor to lower the quality.

In addition, in order to facilitate the processing such as transport after dividing the ceramic capacitor substrate into individual wafer capacitors, the ceramic capacitor substrate is supported by a support member such as a substrate or a tape, and therefore it is necessary to attach the support member. The step of peeling off, there is a problem of so-called deterioration in productivity.

The present invention has been made in view of the above-described circumstances, and a main technical object thereof is to provide a dividing device capable of efficiently dividing a plate-shaped workpiece including a ceramic capacitor substrate without deteriorating the quality of the wafer.

In order to solve the above-mentioned main technical problems, the dividing device according to the present invention is a dividing device that divides a plate-shaped workpiece into a plurality of wafers, and is characterized in that it includes a storage box mounting region for mounting a storage box containing the processed object before processing; and a temporary means for temporarily processing the workpiece before processing; The workpiece carrying-out means transports the workpiece before processing stored in the storage box placed in the storage box mounting area to the temporary means, and the holding table is for sucking and holding the workpiece before processing And a moving means for moving the holding table to a loading/unloading area and a processing area for loading and unloading the workpiece; and the workpiece loading means transporting the workpiece before being processed to the temporary means to the processed object Positioned on the holding stage of the loading/unloading area; the laser beam irradiation means irradiates the laser beam onto the workpiece before processing which is placed in the processing area and is sucked and held by the holding stage, and is formed on the workpiece a dividing groove for dividing into a breaking starting point of the wafer; and a dividing means for applying an external force to the workpiece formed with the dividing groove which becomes the breaking starting point, and dividing the workpiece into a plurality of wafers along the dividing groove; a receiving means for accommodating a plurality of wafers divided by the dividing means; and a wafer dropping means for dropping a plurality of wafers divided by the dividing means into the receiving means

Since the dividing device according to the present invention is configured as described above, the laser beam is irradiated to the workpiece by the laser light irradiation means to form a dividing groove which can be broken into a starting point of the wafer, so that there is no In the same manner as the conventional cutting method in which the cutting is performed by the cutter, the productivity is deteriorated due to the wear and tear of the cutting blade.

Further, since the laser processing by the laser light irradiation means forms a dividing groove which can be divided into the breaking starting point of the wafer, the molten material (slag) does not adhere to the wafer. This is the case on the side wall.

In addition, since the workpiece to be divided into the dividing grooves which should be divided into the breaking starting points of the wafer is formed into the individual wafers by the dividing means, the processed objects are accommodated in the housing means, so that it is not necessary to process the workpiece. In the case of being supported on a support member such as a substrate or a tape, the step of attaching and peeling off the support member is not required, and productivity can be improved.

10‧‧‧Ceramic capacitor substrate

10a‧‧‧ surface

101‧‧‧1st dividing line

102‧‧‧2nd dividing line

103‧‧‧Wafer capacitance

104‧‧‧dividing trench

11‧‧‧ Segmentation

111‧‧‧Worked objects mounting members

112‧‧‧Pressure roller

113‧‧‧Roller housing

12‧‧‧Transportation means

13‧‧‧Batch means

131‧‧‧ wafer drop member

131a‧‧‧ openings

132‧‧‧ wafer storage container

133‧‧‧Drawers

14‧‧‧ wafer drop-in means

141‧‧‧The wafer falls into the eraser

2‧‧‧ device housing

20‧‧‧Control means

201‧‧‧Central Processing Unit (CPU)

202‧‧‧Reading Memory (ROM)

203‧‧‧ Random Access Memory (RAM)

204‧‧‧Input interface

205‧‧‧Output interface

3‧‧‧Processed object retention mechanism

31‧‧‧ Keeping the table

311‧‧‧Adsorption chuck

32‧‧‧Maintenance support means

4‧‧‧Laser light irradiation

41‧‧‧ concentrator

5‧‧‧ storage box

5a‧‧‧ Storage box mounting area

50‧‧‧ storage box

6‧‧‧ temporary means

7‧‧‧Removal of processed objects

8‧‧‧Processing and moving means

81, 121‧‧‧ attraction holding mat

82, 122‧‧ ‧ cylinder mechanism

83, 123, 142‧‧‧

9‧‧‧Photography

P‧‧‧ spotlight

X, Y, Z‧‧ Direction

X1‧‧‧ direction

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a dividing device constructed by the present invention.

Fig. 2 is a perspective view of a wafer dropping member and a wafer housing container constituting a bulk housing means mounted on the dividing device shown in Fig. 1.

Fig. 3 is a block diagram showing the control means of the dividing device shown in Fig. 1.

4(a)-(c) are explanatory views of a laser processing step performed by the dividing device shown in Fig. 1.

Fig. 5 is a perspective view of a ceramic capacitor substrate as a plate-like workpiece.

Form for implementing the invention

Hereinafter, a suitable embodiment of the dividing device constructed in accordance with the present invention will be described in further detail with reference to the additional drawings.

Fig. 5 is a perspective view showing a ceramic capacitor substrate as a plate-like workpiece. The ceramic capacitor substrate 10 shown in FIG. 5 has a thickness of 500 A plurality of first divided planned lines 101 extending in a predetermined direction on the surface 10a, and a plurality of second divided planned lines 102 extending in a direction perpendicular to the first divided planned line 101 are formed on the surface 10a. Formed in a lattice shape. A wafer capacitor 103 is formed in a plurality of regions divided by the first division planned line 101 and the second division planned line 102. The ceramic capacitor substrate 10 thus formed is a wafer capacitor 103 that is divided into individual pieces along the first dividing line 101 and the second dividing line 102.

FIG. 1 is a perspective view showing a dividing device according to the present invention for dividing the ceramic capacitor substrate 10 along the first dividing line 101 and the second dividing line 102.

The dividing device shown in Fig. 1 is provided with a device casing 2. A workpiece holding mechanism 3 for holding a workpiece and a laser beam that irradiates the workpiece to be held on the workpiece holding mechanism 3 with laser light are disposed at a central portion of the apparatus casing 2. Irradiation means 4. The workpiece holding mechanism 3 includes a holding table 31 for sucking and holding the ceramic capacitor substrate 10 as a plate-shaped workpiece, and a holding table supporting means 32 for supporting the holding table 31. The holding table 31 is provided with an adsorption chuck 311 formed of porous ceramics, which is formed in a rectangular shape as shown in FIG. 1 and which is used to attract and hold the ceramic capacitor substrate 10 on the central portion of the surface. Further, the adsorption chuck 311 is connected to a suction means not shown. Therefore, the ceramic capacitor substrate 10 can be attracted and held by the chuck 13 by placing the ceramic capacitor substrate 10 on the chuck 311 and moving the suction means (not shown).

The holding table support means 32 constituting the workpiece holding mechanism 3 is provided so that the holding table 31 is wound around a circumference perpendicular to the holding surface as the upper surface. The rotary driving diagram is not shown. The holding table support means 32 configured as described above is configured to move the holding table 31 to the loading/unloading area in which the workpiece is carried in and out as shown in FIG. 1 and the processing area formed by the laser beam irradiation means 4, and It is moved in the machining conveyance direction (X-axis direction) indicated by the arrow X by means of an X-axis direction moving means not shown.

The laser light irradiation means 4 that irradiates the ceramic capacitor substrate 10 on the holding stage 31 of the workpiece holding mechanism 3 with the laser light, and the laser light emitting means (not shown) capable of emitting pulsed laser light, and The concentrator 41 that collects the laser light emitted by the laser light emitting means can be disposed, and the concentrator 41 can be disposed in the processing area.

A storage box mounting area on which the storage case of the ceramic capacitor substrate 10 as a plate-shaped workpiece before the processing is stored is provided on one side of the Y-axis direction of the workpiece holding mechanism 3 In the storage box mounting area 5a, the storage cassette 50 that can be moved in the vertical direction (Z-axis direction) indicated by the arrow Z by the lifting means (not shown) is disposed. The storage case 5 of the above-described ceramic capacitor substrate 10 in which a plurality of sheets are stored as workpieces is placed on the storage cassette stage 50. The ceramic capacitor substrate 10 accommodated in the storage case 5 is temporarily placed on the front side of the storage case mounting area 5a, and the positional means 6 for position alignment and the ceramic capacitor substrate housed in the storage case 5 are disposed. 10 The workpiece carrying-out means 7 of the temporary means 6 is carried out.

The workpiece loading means 8 is disposed between the temporary placement means 6 and the loading/unloading area, and the workpiece loading means 8 can be processed as a plate shape before being processed out of the temporary means 6 and subjected to the positional alignment. Object The ceramic capacitor substrate 10 is transported to a holding surface on the upper surface of the holding table 31 which is positioned in the loading/unloading area and which constitutes the workpiece holding mechanism 3. This workpiece loading means 8 is a suction holding pad 81 that can hold and hold the upper surface of the ceramic capacitor substrate 10, can support the suction holding pad 81, and moves the suction holding pad 81 in the vertical direction (Z-axis direction). The cylinder mechanism 82, the actuator arm 83 that can support the cylinder mechanism 82, and the moving means that can move the actuator arm 83 in the Y-axis direction are not shown. The suction holding pad 81 of the workpiece carrying device 8 thus constructed is connected to a suction means not shown.

The dividing device in the illustrated embodiment includes the imaging device 9 and is a cylinder mechanism 82 that is attached to the workpiece loading device 8 and can detect a processing region of the ceramic capacitor substrate 10 as a plate-shaped workpiece. Further, the ceramic capacitor substrate 10 is held by the holding table 31 positioned in the loading/unloading area. The imaging means 9 is formed by an optical means such as a microscope or a CCD camera, and can transmit the captured image signal to a control means to be described later.

The other side of the workpiece holding mechanism 3 in the Y-axis direction is disposed so that the ceramic capacitor substrate 10 as a plate-shaped workpiece processed by laser processing in the processing region is divided into individual pieces. The dividing means of the chip capacitance is 11. The dividing means 11 includes a workpiece placing member 111 disposed on the other of the Y-axis directions of the workpiece holding mechanism 3, and a laser that can be placed on the workpiece loading member 111. The processed ceramic capacitor substrate 10 as a plate-like workpiece 10 is provided with a roller 112 for external force, and the pressure roller 112 is accommodated to be accessible. The roller houses the housing 113. The workpiece mounting member 111 is formed in a rectangular shape by a flexible member such as rubber. The pressure roller 112 is configured to be rotatable in the X-axis direction while pressurizing the upper surface of the ceramic capacitor substrate 10 placed on the workpiece mounting member 111.

In the division device of the embodiment, the workpiece transfer means 12 is provided, and the ceramic capacitor substrate 10 which is a plate-shaped workpiece which has been subjected to laser processing can be transported to the workpiece mounting member 111 which constitutes the division means 11 In addition, the ceramic capacitor substrate 10 is placed on the holding table 31 of the workpiece holding mechanism 3 that is positioned in the loading/unloading area. The workpiece conveyance means 12 is constituted by a member capable of sucking and holding the upper surface of the ceramic capacitor substrate 10 which is a laser-processed plate-shaped workpiece placed on the holding table 31. a pad 121, a cylinder mechanism 122 that can support the suction holding pad 121 and move the suction holding pad 121 in the up and down direction (Z-axis direction), an actuator arm 123 that can support the cylinder mechanism 122, and the actuator arm 123 on the Y-axis The figure moving in the direction is not shown as a moving means. The suction holding pad 121 of the workpiece conveying means 12 thus constituted is connected to a suction means not shown.

The dividing device according to the embodiment of the present invention includes a batch storage means 13 which is disposed adjacent to the workpiece mounting member 111 constituting the dividing means 11 and can accommodate a plurality of wafer capacitors divided into a plurality of wafer capacitors. The bulk storage means 13 includes a wafer dropping member 131 provided with an opening portion 131a that is formed adjacent to the workpiece mounting member 111 to form an opening. As shown in FIG. 2, this wafer dropping member 131 is formed in a funnel shape from the opening 131a toward the lower side. The wafer dropping member 131 thus constructed A wafer storage container 132 is disposed on the lower side. As shown in FIG. 1, on the front wall of the apparatus casing 2 in which the mass storage means 13 formed by the wafer dropping member 131 and the wafer storage container 132 are disposed, a drawer for inserting and receiving the wafer storage container 132 is provided. 133.

With reference to Fig. 1, the dividing device in the illustrated embodiment includes a wafer dropping means 14 for ceramics to be placed on the workpiece mounting member 111 constituting the dividing means 11. The plurality of wafer capacitors divided by the capacitor substrate 10 fall into the opening portion 131a of the wafer drop member 131 constituting the batch storage means 13. The wafer drop-in means 14 is such that the wafer falls into the wiper 141, the support wafer falls into the actuator arm 142 of the wiper 141, and the actuator arm 142 is moved in the Y-axis direction. Formed by moving means.

The dividing device in the illustrated embodiment is provided with the control means 20 shown in FIG. The control means 20 is constituted by a computer, and includes a central processing unit (CPU) 201 capable of performing calculation processing in accordance with a control program, a read-only memory (ROM) 202 capable of storing a control program, and the like, and a storable calculation The result is a readable and writable random access memory (RAM) 203, an input interface 204, and an output interface 205. The detection signal from the imaging means 9 or the like can be input to the input interface 204 of the control means 20 thus constructed. Further, the control signal from the output interface 205 of the control means 20 is output to the workpiece holding mechanism 3, the laser beam irradiation means 4, the workpiece carrying-out means 7, the workpiece carrying means 8, the dividing means 11, and the The workpiece transport means 12 and the like.

The dividing device in the illustrated embodiment is in the above manner The configuration will be described below with respect to its action.

The ceramic capacitor substrate 10 before processing stored in the storage case 5 placed on the storage cassette 50 placed in the storage cassette mounting area 5a is formed in the Z-axis direction by a lifting means not shown. Move up and down to be positioned to the carry-out position. Next, the control means 20 moves the workpiece carrying-out means 7 forward and backward to carry out the ceramic capacitor substrate 10 positioned at the carry-out position to the temporary means 6. The ceramic capacitor substrate 10 that has been carried out to the temporary means 6 is positionally calibrated here. Next, the control means 20 activates the workpiece loading means 8 to suck and hold the upper surface of the ceramic capacitor substrate 10 which has been positionally aligned on the temporary means 6 by the suction holding pad 81, and transports it to the object. The holding surface of the upper surface of the chuck 311 of the holding table 31 of the workpiece holding mechanism 3 is placed in the loading/unloading area. In this manner, after the ceramic capacitor substrate 10 is placed on the chuck 311 of the holding table 31, the attraction means (not shown) can be moved by the control means 20 to attract and hold the ceramic capacitor substrate 10 to the holding stage 31. The holding surface of the upper surface of the adsorption chuck 311 (the workpiece holding step).

When the ceramic capacitor substrate 10 is sucked and held on the holding surface of the upper surface of the chuck 311 of the holding table 31 as described above, the control means 20 actuates the workpiece carrying means 8 to be mounted on the cylinder mechanism 82. The imaging means 9 is positioned on the upper side of the ceramic capacitor substrate 10 held by the holding stage 31. Then, the control means 20 activates the imaging means 9 to image the first division planned line 101 and the second division planned line 102 formed on the ceramic capacitor substrate 10 held by the holding table 31, and performs the first confirmation. Whether the division planned line 101 and the second division planned line 102 are flat with the X-axis direction and the Y-axis direction Line alignment work. When the first division planned line 101 and the second division planned line 102 are not parallel to the X-axis direction and the Y-axis direction, the control means 20 controls the holding table support means 32 constituting the workpiece holding mechanism 3. In the rotation driving means (not shown), the first dividing line 101 and the second dividing line 102 formed on the ceramic capacitor substrate 10 held by the holding table 31 are adjusted so as to be in the X-axis direction and the Y-axis direction. Parallel (calibration step).

When the calibration step is performed as described above, the control means 20 moves the holding stage 31 to the processing area by moving the X-axis direction moving means not shown, and sets the predetermined first one as shown in Fig. 4(a). One end of the division planned line 101 (the left end in FIG. 4(a)) is positioned directly below the concentrator 41 of the laser light irradiation means 4. Then, the condensed spot P of the pulsed laser light irradiated from the concentrator 41 is aligned to the vicinity of the surface 10a (upper surface) of the ceramic capacitor substrate 10. Next, the control means 20 activates the laser beam irradiation means 4 to illuminate the pulsed laser light having a wavelength which is absorptive to the ceramic capacitor substrate 10 from the concentrator 41, and to move the X-axis direction moving means not shown. The holding table 31 is moved in a direction indicated by an arrow X1 in Fig. 4(a) at a predetermined processing conveyance speed. Further, when the other end of the first division planned line 101 (the right end in FIG. 4(b)) reaches directly below the concentrator 41, the irradiation of the pulsed laser light is stopped, and the movement of the holding stage 31 is stopped. As a result, as shown in FIG. 4(b) and FIG. 4(c), the ceramic capacitor substrate 10 is formed with a dividing groove 104 that can be broken along the first dividing line 101 (the laser processing step). ). Further, the dividing groove 104 is formed to have a depth of about 50 μm under the following processing conditions.

Furthermore, the above laser processing step is, for example, the following processing strip Pieces are carried out.

Wavelength: 355nm

Repeat frequency: 10kHz

Average output: 5W

Converging point: φ 10μm

Processing transfer speed: 50mm / sec

When the above-described laser processing steps are performed along all of the first division planned lines 101 formed on the ceramic capacitor substrate 10 in a predetermined direction, the control means 20 activates a rotation driving means not shown to hold the holding table. 31 turns 90 degrees. Further, the above-described laser processing step is performed on the holding stage 31 along all of the second division planned lines 102 formed in the direction perpendicular to the first division planned line 101. As a result, the ceramic capacitor substrate 10 held on the holding stage 31 is formed so as to be a dividing groove 104 which is a breaking starting point along all of the first dividing line 101 and the second dividing line 102.

As described above, the holding table 31 holding the ceramic capacitor substrate 10 on which the laser processing step has been performed is moved from the processing region to the loading/unloading region. Then, when the holding table 31 reaches the loading/unloading area shown in FIG. 1, the movement of the holding table 31 is stopped. Next, the suction holding of the ceramic capacitor substrate 10 held on the holding table 31 is released.

Next, the control means 20 activates the moving means of the workpiece conveying means 12, not shown, to position the suction holding pad 121 to the ceramic capacitor substrate 10 placed on the holding table 31 that has been positioned in the loading/unloading area. Directly above, the cylinder mechanism 122 is actuated simultaneously so that the suction holding surface of the lower surface of the suction holding pad 121 contacts the upper surface of the ceramic capacitor substrate 10. And borrow The ceramic capacitor substrate 10 is sucked and held by the suction holding surface of the lower surface of the suction holding pad 121 by a suction means not shown in the operation diagram.

When the ceramic capacitor substrate 10 is sucked and held by the suction holding pad 121 as described above, the control means 20 activates the moving means of the workpiece conveying means 12, not shown, to attract and hold the suction holding pad 121. The ceramic capacitor substrate 10 is positioned directly above the workpiece mounting member 111 constituting the dividing means 11, while the cylinder mechanism 122 is actuated to lower the suction holding pad 121, and the ceramic capacitor substrate 10 sucked and held by the suction holding pad 121 is held. The upper surface of the workpiece mounting member 111 constituting the dividing means 11 is positioned. Further, the suction formed by the suction holding pad 121 on the ceramic capacitor substrate 10 is released. As a result, the ceramic capacitor substrate 10 is placed on the workpiece mounting member 111 constituting the dividing means 11.

Then, the control means 20 activates the pressure roller 112 constituting the dividing means 11 to pressurize the upper surface of the ceramic capacitor substrate 10 placed on the workpiece mounting member 111 while being in the X-axis direction. Turn. As a result, the ceramic capacitor substrate 10 is formed with the division grooves 104 which can be broken along the first division planned line 101 and the second division planned line 102. Therefore, the ceramic capacitor substrate 10 can be divided along the formed. The first dividing line 101 and the second dividing line 102 of the groove 104 are broken to be divided into individual wafer capacitors 103 (dividing step).

After the above-described dividing step is performed, the control means 20 actuates the moving means of the wafer drop-in means 14 not shown, so that the wafer mounted on the operating arm 142 falls into the wiping tool 141 toward the bulk receiving means 13 The opening portion 131a of the wafer dropping member 131 moves. The result is that the workpiece is loaded The plurality of wafer capacitors 103, which are divided into individual pieces, are housed in the wafer storage container 132 through the opening 121a.

As described above, the dividing device in the embodiment shown in the figure transmits the laser beam to the first dividing line 101 and the second dividing line 102 on the ceramic capacitor substrate 10 by the laser beam irradiation means 4. Since the light is formed to form the dividing groove 104 which can be the starting point of the breaking, there is no possibility that the productivity is lowered due to the wear and breakage of the cutting blade like the conventional dividing method which is cut by the cutting blade.

In the laser processing by the laser beam irradiation means 4, the first dividing line 101 and the second dividing line 102 on the ceramic capacitor substrate 10 form a dividing groove 104 which can be a breaking starting point. There is no such thing as a melt (slag) adhering to the sidewall of the wafer capacitor.

In addition, the ceramic capacitor substrate 10 in which the dividing groove 104 which can be broken as the starting point is formed along the first dividing line 101 and the second dividing line 102 is divided into individual wafer capacitors 103 by the dividing means 11. Then, it is accommodated in the wafer storage container 132. Therefore, in the case where the ceramic capacitor substrate 10 does not have to be supported on the support member such as the holding substrate or the tape, the bonding and peeling steps of the support member are not required, and the lifting can be performed. Productive.

In the above-described embodiment, the ceramic capacitor substrate 10 as a plate-shaped workpiece is divided into the wafer capacitors 103 along the first dividing line 101 and the second dividing line 102. According to the dividing device of the present invention, even if a glass substrate which is a plate-shaped workpiece and is not formed with a predetermined dividing line is divided into a plurality of wafers, Get the same effect.

2‧‧‧ device housing

3‧‧‧Processed object retention mechanism

31‧‧‧ Keeping the table

311‧‧‧Adsorption chuck

32‧‧‧ Maintaining support means

4‧‧‧Laser light irradiation

41‧‧‧ concentrator

5‧‧‧ storage box

5a‧‧‧ Storage box mounting area

50‧‧‧ storage box

6‧‧‧ temporary means

7‧‧‧Removal of processed objects

8‧‧‧Means of moving objects

81, 121‧‧‧ attraction holding mat

82, 122‧‧ ‧ cylinder mechanism

83, 123, 142‧‧‧

9‧‧‧Photography

11‧‧‧ Segmentation

111‧‧‧Worked objects mounting members

112‧‧‧Pressure roller

113‧‧‧Roller housing

12‧‧‧Transportation means

13‧‧‧Batch means

131‧‧‧ wafer drop member

131a‧‧‧ openings

133‧‧‧Drawers

14‧‧‧ wafer drop-in means

141‧‧‧The wafer falls into the eraser

X, Y, Z‧‧ Direction

Claims (1)

A dividing device is a dividing device that can divide a plate-shaped workpiece into a plurality of wafers, and is characterized in that it includes a storage box mounting area for placing a storage box in which a workpiece before processing is accommodated The temporary means is used for the workpiece to be processed before the temporary processing; the workpiece is carried out, and the workpiece before being processed stored in the storage box placed in the storage box mounting area is carried out to the temporary a holding means for sucking and holding a workpiece before processing; and a moving means for moving the holding table to a loading/unloading area and a processing area for loading and unloading the workpiece; and the workpiece loading means is carried out The workpiece before processing to the temporary means is transported to the holding table that has been positioned in the loading/unloading area; the laser beam irradiation means irradiates the laser beam to the processing area and is sucked and held by the holding stage In the workpiece before processing, a dividing groove is formed on the workpiece to be used as a starting point for breaking into a wafer; and the dividing means forms a segment which can be broken into a starting point. The external force given workpiece, along the dividing grooves and the object to be processed is divided into a plurality of wafers; storage means to the receiving means of the divided plurality of segmented wafer; And a wafer dropping means for dropping a plurality of wafers divided by the dividing means into the receiving means.