JP3949934B2 - Method for dividing ceramic chip capacitor sheet - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a dividing method for dividing a ceramic chip capacitor sheet into individual chip capacitors.
[0002]
[Prior art]
The ceramic chip capacitor sheet is constructed by alternately laminating a ceramic layer and an electrode layer having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice pattern, and laminating the ceramic layer on the uppermost layer. Has been. As a method for producing such a ceramic chip capacitor sheet, the following method is generally performed. That is, a tape serving as a separation layer is stretched on the surface of a plate-like carrier substrate, and raw ceramics are applied thereon to form a raw ceramic layer having a thickness of about 5 μm. An electrode layer having a thickness of about 1 μm is formed on the surface of the raw ceramic layer by screen printing of an electrode metal such as palladium. About 200 layers of this raw ceramic layer and electrode layer are alternately laminated, and a ceramic layer is laminated on the uppermost layer to constitute a ceramic chip capacitor sheet.
[0003]
The ceramic chip capacitor sheet configured as described above has a ceramic layer formed on the uppermost layer, and the position of the electrode cannot be confirmed from the surface. Therefore, when dividing into individual chip capacitors, The following measures are taken to confirm the position. That is, when forming the electrode layer, an alignment mark region having an alignment mark that surrounds the electrode region and indicates the position of the electrode is formed, and a cutting blade having a V-shaped outer periphery is formed in the alignment mark region. By using this to form a V-groove, the alignment mark exposed on the wall surface of the V-groove is recognized.
[0004]
[Problems to be solved by the invention]
Thus, as described above, the method of recognizing the alignment mark by forming the V-groove with the cutting blade in the alignment mark region has the following problems.
(1) A water-soluble tape is used as a separation layer to be mounted on the surface of the carrier substrate because it is removed after being divided into individual chip capacitors. For this reason, when forming a V-groove in the alignment mark region It must be cut dry. When dry cutting is performed, ceramic dust is scattered, so that it is necessary to perform dust treatment, which causes a decrease in productivity.
(2) In order to solve the above problem (1), there is a method of wiping off the cutting water adhering to the ceramic chip capacitor sheet immediately after forming the V-groove in the alignment mark region by a wet method. Since the tape as the separation layer absorbs cutting water, there is a problem that the ceramic chip capacitor sheet is lifted from the carrier. In addition, the cutting water may enter the V-groove and the alignment mark may not be detected.
[0005]
The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is ceramics that can easily expose and reliably recognize alignment marks formed by surrounding electrode regions. The object is to provide a chip capacitor sheet dividing method.
[0006]
[Means for Solving the Problems]
In order to solve the above main technical problem, according to the present invention, a ceramic layer, an electrode region having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice shape, Electrode layers having alignment mark regions having alignment marks indicating the positions of the electrodes are alternately laminated, and ceramic chip capacitor sheets formed by laminating ceramic layers on the uppermost layer are individually divided in a lattice pattern. A dividing method for dividing into chip capacitors,
A detection hole forming step of forming an alignment mark detection hole having a conical bottom surface at a predetermined position of the alignment mark region;
An alignment step of detecting a cutting point based on the alignment mark exposed on the conical bottom surface of the alignment mark detection hole formed by the detection hole forming step;
Seen including a dividing step of dividing into individual chip capacitor by cutting the ceramic chip capacitor sheet based on cutting point detected by said alignment step, a
The dividing step is performed by a multi-cutting blade in which a plurality of cutting blades are incorporated so as to coincide with the interval of the chip capacitor. After cutting the region to be cut of the ceramic chip capacitor sheet with the multi-cutting blade, When cutting the area to be cut with a multi-cutting blade, the cutting base point is offset to perform cutting.
A method of dividing a ceramic chip capacitor sheet is provided.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of a method for dividing a ceramic chip capacitor sheet according to the present invention will be described in detail with reference to the accompanying drawings.
[0009]
FIG. 1 is a perspective view of a ceramic chip capacitor sheet divided into individual chip capacitors according to the present invention, and FIG. 2 is an enlarged sectional view taken along line AA in FIG. The ceramic chip capacitor sheet shown in FIG. 1 is shown with the uppermost ceramic layer partially broken.
The ceramic chip capacitor sheet 2 shown in FIGS. 1 and 2 is formed on the surface of a rectangular carrier substrate 3 made of a glass plate via a tape 4 serving as a separation layer. That is, a raw ceramic is applied on the tape 4 adhered to the surface of the carrier substrate 3 to form a raw ceramic layer 21 having a thickness of about 5 μm, and an electrode metal such as barium is screened on the surface of the raw ceramic layer 21. The electrode layer 22 having a thickness of about 1 μm is formed by printing. The electrode layer 22 includes an electrode region 221 having a plurality of electrodes 221a partitioned in a lattice shape, and an alignment mark region 222 having an alignment mark 222a that surrounds the electrode region 221 and indicates the position of the electrode 221a. Yes. The green ceramic layer 21 and the electrode layer 22 formed in this way are alternately stacked several tens to hundreds of weeks, and the green ceramic layer 21 is formed as the uppermost layer.
[0010]
In order to divide the ceramic chip capacitor sheet 2 formed as described above into individual chip capacitors, first, as shown in FIG. 3, alignment mark detection holes 5 are formed at predetermined positions in the alignment mark region 222 (detection holes). Forming step). The predetermined position where the alignment mark detection hole 5 is formed is determined based on a design drawing used when the ceramic chip capacitor sheet 2 is manufactured. The alignment mark detection hole 5 is formed such that the bottom surface is a convex surface 51 having a conical shape as shown in FIG. 4 or the concave surface 52 having a bottom surface having a conical shape as shown in FIG. In order to form the alignment mark detection hole 5 so that the bottom surface is a conical convex surface 51 as shown in FIG. Further, as shown in FIG. 5, in order to form the alignment mark detection hole 5 so that the bottom surface becomes a conical concave surface 52, the drill 7 can be used for excavation.
When the alignment mark detection hole 5 formed in this way is viewed from above, the electrode 221a can be confirmed by appearing on the conical convex surface 51 or the conical concave surface 52 as shown in FIG. As described above, in the detection hole forming process, the alignment mark detection hole 5 is formed in the alignment mark region 222 of the ceramic chip capacitor sheet 2 by the end mill 6 or the drill 7, so that the specified narrow region can be excavated dry. Therefore, almost no dust is scattered, dust processing becomes easy, and productivity is improved. Further, since the detection hole forming process can be excavated by a dry method, the tape 4 serving as the separation layer does not absorb moisture, and the problem that the ceramic chip capacitor sheet 2 is lifted from the carrier substrate 3 is also solved.
[0011]
If the alignment mark detection hole 5 is formed at a predetermined position in the alignment mark region 222 as described above, the ceramic chip capacitor sheet 2 is divided into individual chip capacitors by a dicing apparatus. Here, the dicing apparatus will be described with reference to FIG.
The dicing 100 in the illustrated embodiment includes a device housing 120 having a substantially rectangular parallelepiped shape. In the apparatus housing 120, a chuck table 130 that holds a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. The chuck table 130 includes a suction chuck support base 131, a rectangular suction chuck 132 mounted on the suction chuck support base 131, and three positioning pins disposed along two sides of the suction chuck 132. 133, and an alignment mark detection hole 5 is formed at a predetermined position of the alignment mark region 222 as shown in FIG. 3 as a workpiece on the mounting surface which is the surface of the suction chuck 132. A ceramic chip capacitor sheet 2 is placed. At this time, positioning is performed by bringing the two sides of the carrier substrate 3 into contact with the three positioning pins 133. When the ceramic chip capacitor sheet 2 is positioned at a predetermined position on the suction chuck 132 of the chuck table 130, it is held by a suction means (not shown). The chuck table 130 is configured to be rotatable by a rotation mechanism (not shown).
[0012]
The dicing apparatus 100 in the illustrated embodiment includes two spindle units 140 and 150 as cutting means. The spindle units 140 and 150 are mounted on a moving base (not shown) and are adjusted to move in a direction indicated by an arrow Y as an indexing direction and a direction indicated by an arrow Z as a cutting direction, and the spindle housing 141 , 151 are rotatably supported by a rotary drive mechanism (not shown) and are rotated by a rotary drive mechanism (not shown), and cutting blades 143 and 153 mounted on the rotary spindles 142 and 152. One of the cutting blades 143 is a multi-cutting blade in which a plurality of cutting blades are incorporated so as to coincide with the distance between the chip capacitors as shown in FIG. Cut along. Further, as shown in FIG. 9, the other cutting blade 153 is composed of a multi-cutting blade in which a plurality of cutting blades are incorporated so as to coincide with the interval between the chip capacitors, and is along the Y-axis street of the ceramic chip capacitor sheet 2. And cut.
[0013]
The dicing apparatus 100 in the illustrated embodiment includes an alignment mark detection hole formed in the alignment mark region 222 of the ceramic chip capacitor sheet 2 that is a workpiece held on the surface of the suction chuck 132 constituting the chuck table 130. 5 and an imaging mechanism 160 for detecting an area to be cut by the cutting blades 143 and 153. The imaging mechanism 160 is composed of optical means such as a microscope and a CCD camera. In addition, the dicing apparatus 100 includes a display unit 170 that displays an image picked up by the image pickup mechanism 160.
[0014]
The dicing apparatus 100 in the illustrated embodiment includes a cassette 181 that stocks the ceramic chip capacitor sheet 2 that is a workpiece, and a workpiece that carries the workpiece accommodated in the cassette 181 to the workpiece placement region 182. A workpiece unloading means 183, a workpiece conveying means 184 for conveying the workpiece unloaded by the workpiece unloading means 183 onto the chuck table 130, and a workpiece cut by the chuck table 130. A cleaning unit 185 for cleaning and spin-drying and a cleaning / conveying unit 186 for transporting the workpiece cut by the chuck table 130 to the cleaning unit 185 are provided. The dicing apparatus 100 controls the chuck table 130, the spindle units 140 and 150, the lifting / lowering means of the cassette 181, the workpiece unloading means 183, the workpiece conveying means 184, the cleaning means 185, the cleaning conveying means 186, and the like. Control means 188 is provided. The control means 188 includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores a control program, and a readable / writable random access memory (RAM) that stores arithmetic results. It has. The control unit 188 temporarily stores alignment information (area to be cut by the cutting blades 143 and 153) imaged by the imaging mechanism 160 in a random access memory (RAM), and the spindle unit is based on the alignment information. A control signal is output to 140 and 150.
[0015]
Next, the cutting process of the ceramic chip capacitor sheet 2 in which the alignment mark detection hole 5 is formed in the alignment mark region 222 by the detection hole forming process will be described using the dicing apparatus 10 described above.
First, the ceramic chip capacitor sheet 2 (the state provided on the carrier substrate 3) in which the alignment mark detection hole 5 is formed in the alignment mark region 222 is accommodated in the cassette 181. The ceramic chip capacitor sheet 2 accommodated in a predetermined position of the cassette 7 is positioned at the carry-out position by being moved up and down by an elevating means (not shown). Next, the workpiece unloading means 183 moves forward and backward to unload the ceramic chip capacitor sheet 2 positioned at the unloading position to the workpiece placement region 182. The ceramic chip capacitor sheet 2 carried out to the workpiece placement region 182 is conveyed to the placement surface of the suction chuck 132 constituting the chuck table 130 by the turning operation of the workpiece conveyance means 184, and as described above. After being positioned by contacting the two sides of the carrier substrate 3 with the three positioning pins 133, the carrier substrate 3 is sucked and held by the suction chuck 132. Thus, the chuck table 130 that sucks and holds the ceramic chip capacitor sheet 2 is moved to a position directly below the imaging mechanism 160.
[0016]
If the chuck table 130 is positioned immediately below the image pickup mechanism 160, the image pickup mechanism 160 takes an image of the alignment mark detection hole 5 formed in the alignment mark region 222 of the ceramic chip capacitor sheet 2 and cuts it (X-axis street). Further, the chuck table 130 is rotated 90 degrees, and the imaging mark 160 is used to image the alignment mark detection hole 5 to detect a cutting point (Y-axis street) (alignment process). The alignment information detected in this way is temporarily stored in a random access memory (RAM) of the control means 188. Next, the chuck table 130 is turned back by 90 degrees, and one spindle unit 140 is moved and adjusted in the direction of the arrow Y, which is the indexing direction, so that the cutting blade 143 and the cutting point (X-axis street) as shown in FIG. And precise positioning work. Thereafter, while rotating the cutting blade 143 in a predetermined direction, the chuck table 130 that sucks and holds the ceramic chip capacitor sheet 2 is moved in a direction indicated by an arrow X that is a cutting feed direction (a direction orthogonal to the rotation axis of the cutting blade 143). By moving, the ceramic chip capacitor sheet 2 held on the chuck table 130 is cut along the X-axis street (division step). That is, the cutting blade 143 is mounted on the spindle unit 140 that is moved and adjusted in the direction indicated by the arrow Y that is the indexing direction and the direction indicated by the arrow Z that is the cutting direction, and is rotationally driven. Is moved in the cutting feed direction along the lower side of the cutting blade 143, so that the ceramic chip capacitor sheet 2 held on the chuck table 130 is cut along the predetermined X-axis street by the cutting blade 143.
[0017]
As described above, when all the X-axis streets are cut, the chuck table 130 is rotated 90 degrees. An arrow indicating the direction in which the other spindle unit 150 is indexed based on the alignment information stored by detecting the cutting position (Y-axis street) of the ceramic chip capacitor sheet 2 by performing the alignment process in advance as described above. By adjusting the movement in the Y direction, as shown in FIG. 9, a precise alignment operation between the cutting blade 153 and the cutting point (Y-axis street) is performed. Thereafter, while the cutting blade 153 is rotated in a predetermined direction, the chuck table 130 holding the ceramic chip capacitor sheet 2 by suction is moved in the direction indicated by the arrow X which is the cutting feed direction, thereby being held on the chuck table 130. The ceramic chip capacitor sheet 2 is cut along the Y-axis street (division process).
[0018]
As described above, the ceramic chip capacitor sheet 2 is divided into individual chip capacitors by cutting along the X-axis street and the Y-axis street. The divided individual chip capacitors are not separated by the action of the tape 4, and the state of the ceramic chip capacitor sheet 2 supported by the carrier substrate 3 is maintained. After the cutting of the ceramic chip capacitor sheet 2 is completed in this way, the chuck table 130 holding the ceramic chip capacitor sheet 2 is first returned to the position where the ceramic chip capacitor sheet 2 is sucked and held. The suction holding of the sheet 2 is released. Next, the ceramic chip capacitor sheet 2 is transported to the cleaning means 185 by the cleaning transport means 186, where it is cleaned and dried. The ceramic chip capacitor sheet 2 cleaned in this way is carried out to the workpiece placement region 182 by the workpiece conveying means 184. Then, the ceramic chip capacitor sheet 2 is stored in a predetermined position of the cassette 181 by the workpiece unloading means 183.
[0019]
In the ceramic chip capacitor sheet dividing method described above, since the ceramic chip capacitor sheets 2 manufactured in the same lot have substantially the same chip array distortion, the alignment information detected first is randomly accessed by the control means 188. By temporarily storing in a memory (RAM) and performing the above-described dividing process of other ceramic chip capacitor sheets 2 manufactured in the same lot based on this alignment information, alignment work can be greatly shortened. it can. In addition, by using a multi-cutting blade as shown in FIG. 8 and FIG. 9 as a cutting blade and performing the dividing step, the cutting time is shortened, and a tape that becomes a separation layer even if wet cutting is performed. The dividing step can be completed before 4 absorbs moisture. In addition, when the dividing process is performed using a multi-cutting blade, the cutting group can be distinguished by offsetting the cutting base point as shown in FIG. 10, and the position of the region where the defective product is generated, that is, what number It is easy to grasp for each lot that a defective product is generated between the first and second cutting grooves, and quality control is facilitated.
[0020]
【The invention's effect】
According to the method for dividing a ceramic chip capacitor sheet according to the present invention, the alignment mark detection hole having a conical bottom surface is formed at a predetermined position in the alignment mark region of the ceramic chip capacitor sheet, and the alignment mark detection hole is exposed on the conical bottom surface. Since the cut portion is detected based on the alignment mark that has been extracted, the specified narrow area can be excavated dry, so that dust hardly scatters, dust processing is facilitated, and productivity is improved. In addition, since the detection hole forming process can be excavated by a dry method, when the ceramic chip capacitor sheet is disposed on the carrier substrate through the tape serving as the separation layer, the tape does not absorb moisture, and the ceramic The problem that the chip capacitor sheet floats from the carrier substrate is also eliminated.
In addition, according to the method for dividing a ceramic chip capacitor sheet according to the present invention, the cutting time is shortened by performing a dividing step using a multi-cutting blade as a cutting blade, and even if cutting is performed wet. The dividing step can be completed before the tape as the separation layer absorbs moisture. When the dividing process is performed using the multi-cutting blade, the cutting group can be distinguished by offsetting the cutting base point, and the position of the area where the defective product is generated, that is, the name from the number of the cutting grooves. It is easy to grasp for each lot that a defective product is generated between the number of cutting grooves, and quality control is facilitated.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a part of a ceramic chip capacitor sheet divided by the dividing method of the present invention.
FIG. 2 is an enlarged cross-sectional view taken along line AA in FIG.
3 is a perspective view showing a state in which a detection hole forming step has been performed on the ceramic chip capacitor sheet shown in FIG. 1. FIG.
FIG. 4 is an enlarged cross-sectional view showing an embodiment of an alignment mark detection hole formed in a ceramic chip capacitor sheet by a detection hole forming step.
FIG. 5 is an enlarged cross-sectional view showing another embodiment of the alignment mark detection hole formed in the ceramic chip capacitor sheet by the detection hole forming step.
FIG. 6 is an enlarged view of the alignment mark detection hole as viewed from above.
FIG. 7 is a perspective view of a dicing apparatus for performing the method for dividing a ceramic chip capacitor sheet according to the present invention.
8 is an enlarged perspective view of a main part of a spindle unit for X-axis street cutting provided in the dicing apparatus shown in FIG.
9 is an enlarged perspective view of a main part of a spindle unit for Y-axis street cutting provided in the dicing apparatus shown in FIG.
FIG. 10 is an explanatory view showing a cutting base point in a ceramic chip capacitor sheet dividing step by the dicing apparatus shown in FIG. 7;
[Explanation of symbols]
2: Ceramic chip capacitor sheet 3: Carrier substrate 4: Tape 21: Raw ceramic layer 22: Electrode layer 221: Electrode region 221a: Electrode 222: Alignment mark region 222a: Alignment mark 5: Alignment mark detection hole 51: Conical convex surface 52: Conical concave surface 6: End mill 7: Drill 100: Dicing 120: Device housing 130: Chuck table 131: Suction chuck support 132: Suction chuck 133: Positioning pin 140: Spindle unit (for X-axis street cutting)
150: Spindle unit (for Y-axis street cutting)
160: Imaging mechanism 170: Display means 181: Cassette 182: Workpiece placement area 183: Workpiece unloading means 184: Workpiece conveyance means 185: Cleaning means 186: Cleaning conveyance means 188: Control means

Claims (1)

A ceramic layer, an electrode region having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice shape, and an alignment mark region having an alignment mark that surrounds the electrode region and indicates the position of the electrode A method of dividing the ceramic chip capacitor sheet formed by alternately laminating the electrode layers and the ceramic layer on the uppermost layer into individual chip capacitors partitioned in a grid pattern,
A detection hole forming step of forming an alignment mark detection hole having a conical bottom surface at a predetermined position of the alignment mark region;
An alignment step of detecting a cutting point based on the alignment mark exposed on the conical bottom surface of the alignment mark detection hole formed by the detection hole forming step;
Seen including a dividing step of dividing into individual chip capacitor by cutting the ceramic chip capacitor sheet based on cutting point detected by said alignment step, a
The dividing step is performed by a multi-cutting blade in which a plurality of cutting blades are incorporated so as to coincide with the interval of the chip capacitor. After cutting a region to be cut of the ceramic chip capacitor sheet with the multi-cutting blade, the next cutting is performed. When cutting the area to be cut with a multi-cutting blade, the cutting base point is offset to perform cutting.
A method for dividing a ceramic chip capacitor sheet.

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