JP5693376B2 - Method for dividing ceramic chip capacitor sheet - Google Patents

Description

  The present invention relates to a method for dividing a ceramic chip capacitor sheet in which a ceramic chip capacitor sheet is divided into individual chip capacitors.

  The ceramic chip capacitor sheet includes a ceramic layer, an electrode region having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice pattern, and an alignment mark region having an alignment mark surrounding the electrode region and indicating the position of the electrode And a plurality of layers (for example, about 200 layers) are alternately stacked, and a ceramic layer is stacked on the uppermost layer.

  Since the ceramic chip capacitor sheet thus configured has a ceramic layer formed on the uppermost layer, the position of the electrode cannot be confirmed from the surface. Therefore, when dividing into individual chip capacitors, some method is used. It is necessary to confirm the position of the electrode.

  Therefore, when the conventional ceramic chip capacitor sheet is divided, an alignment mark region is cut by a so-called V blade having a V-shaped tip to form a V groove, and the alignment mark exposed on the side surface of the V groove is formed. Based on this, the division position was detected (see, for example, JP-A-2004-39906).

  After the division position was detected, the division position detected by a normal cutting blade whose tip was not V-shaped was cut to divide the ceramic chip capacitor sheet into individual chip capacitors.

JP 2004-39906 A

  However, the method disclosed in the cited document 1 requires two types of cutting blades, that is, a V blade and a normal blade. After the alignment mark is exposed, it is necessary to replace the V blade with a normal blade. Therefore, there is a problem that it is very time-consuming. As an alternative, it may be possible to use an expensive dual dicer having two spindles, but there is a problem that the production cost is high.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a ceramic chip capacitor sheet that can be easily divided even with a normal cutting device having one spindle. Is to provide a division method.

  According to the present invention, an alignment mark having a ceramic layer, an electrode region having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice shape, and an alignment mark surrounding the electrode region and indicating the position of the electrode A ceramic chip capacitor sheet is formed by alternately laminating a plurality of electrode layers each having a region and laminating a ceramic chip capacitor sheet formed by laminating a ceramic layer on the uppermost layer into individual chip capacitors partitioned in a grid pattern. An alignment mark that is a dividing method, wherein the alignment mark region is cut a plurality of times with a cutting blade to form a cutting groove having a width greater than the thickness of the cutting blade, and the alignment mark is exposed at the bottom of the cutting groove. And the alignment marker expressed in the alignment mark exposing step. An alignment step for detecting a division position based on the chip, and a division step for dividing the ceramic chip capacitor sheet into individual chip capacitors by cutting the division position detected in the alignment step with the cutting blade. A method of dividing a ceramic chip capacitor sheet is provided.

  Preferably, the alignment mark exposing step includes a first cutting step of cutting the alignment mark region with the cutting blade to form a first cutting groove, and the first cutting step after performing the first cutting step. A position apart from the groove by a predetermined distance is cut with the cutting blade to form a second cutting groove parallel to the first cutting groove, and a remaining region is formed between the first cutting groove and the second cutting groove. A second cutting step to be formed; and a third cutting step of cutting and removing the remaining region with the cutting blade after the second cutting step is performed.

  In the present invention, by cutting blades used when dividing the ceramic chip capacitor sheet into individual chip capacitors, by cutting the alignment mark region multiple times to form a cutting groove having a width wider than the thickness of the cutting blade, An alignment mark is exposed at the bottom of the cutting groove to enable alignment.

  Therefore, it is possible to easily divide the ceramic chip capacitor sheet even with a normal cutting device having a single spindle.

  According to the second aspect of the present invention, since the remaining region remains between the first cutting groove and the second cutting groove in the alignment mark exposing step, the meandering of the cutting blade can be prevented.

It is a perspective view of the cutting device suitable for implementing the division | segmentation method of this invention. It is a partially broken perspective view of a ceramic chip capacitor sheet. It is the sectional view on the AA line of FIG. It is a top view explaining an alignment mark expression step. It is sectional drawing explaining the alignment mark exposure step of 1st Embodiment. It is sectional drawing explaining the alignment mark exposure step of 2nd Embodiment. It is sectional drawing explaining the alignment mark exposure step of 3rd Embodiment. It is a top view explaining an alignment step. It is a top view explaining a division step.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows the external appearance of a cutting device 2 that can cut a ceramic chip capacitor sheet and divide it into individual chip capacitors.

  On the front side of the cutting apparatus 2, an operation panel 4 is provided for an operator to input instructions to the apparatus such as machining conditions. In the upper part of the apparatus, there is provided a display means 6 such as a CRT for displaying a guidance screen for an operator and an image taken by an imaging means described later.

  As shown in FIG. 2, a ceramic chip capacitor sheet 11 that is a dicing target (cutting target) of the present invention is mounted on a surface of a rectangular carrier substrate 40 made of a glass plate via a tape 42 that becomes a separation layer. Yes.

  A plurality of ceramic chip capacitor sheets 11 mounted on the carrier substrate 40 are accommodated in the cassette 8. The cassette 8 is placed on a cassette elevator 9 that can move up and down.

  A ceramic chip capacitor sheet 11 before cutting is unloaded from the cassette 8 and a loading / unloading means 10 for loading the ceramic chip capacitor sheet 11 after cutting into the cassette 8 is disposed behind the cassette 8.

  Between the cassette 8 and the loading / unloading means 10, a temporary placement area 12, which is an area on which the ceramic chip capacitor sheet 11 to be loaded / unloaded is temporarily placed, is provided. Positioning means 14 for positioning the ceramic chip capacitor sheet 11 mounted on the carrier substrate 40 at a certain position is provided.

  In the vicinity of the temporary placement area 12, a transport means 16 having a turning arm that sucks and transports the ceramic chip capacitor sheet 11 mounted on the carrier substrate 40 is disposed, and is transported to the temporary placement area 12. The ceramic chip capacitor sheet 11 is adsorbed by the conveying means 16 and conveyed onto the chuck table 18.

  The chuck table 18 includes a support base 20, a rectangular suction chuck 22 mounted on the support base 20, and three positioning pins 24 arranged along two sides of the suction chuck 22. The ceramic chip capacitor sheet 11 mounted on the carrier substrate 40 is placed on the holding surface which is the surface of the suction chuck 22.

  At this time, the carrier substrate 40 is positioned by bringing two sides of the carrier substrate 40 into contact with the three positioning pins 24, and the ceramic chip capacitor sheet 11 is chucked via the carrier substrate 40 by applying a suction means (not shown). It is sucked and held by the suction chuck 22 of the table 18.

  The chuck table 18 is configured to be rotatable and reciprocally movable in the X-axis direction, and an alignment for detecting a position to be cut of the ceramic chip capacitor sheet 11 above the movement path of the chuck table 18 in the X-axis direction. Means 26 are provided.

  The alignment means 26 includes an image pickup camera 28 that picks up an image of the surface of the ceramic chip capacitor sheet 11 and an image pickup means 28 having a microscope, and detects a position to be cut by image processing such as pattern matching based on an image acquired by image pickup. can do. The image acquired by the imaging unit 28 is displayed on the display unit 6.

  On the left side of the alignment means 26, a cutting means 30 for cutting the ceramic chip capacitor sheet 18 held on the chuck table 18 is disposed. The cutting means 30 is integrally formed with the alignment means 26, and both move in conjunction with each other in the Y-axis direction and the Z-axis direction.

  The cutting means 30 is configured by attaching a cutting blade 34 to the tip of a rotatable spindle 32 and is movable in the Y-axis direction and the Z-axis direction. The cutting blade 34 is located on an extension line of the imaging means 28 in the X-axis direction.

  The ceramic chip capacitor sheet 11 that has been subjected to the cutting process is transported to the spinner cleaning unit 38 by the transport means 36, spin-cleaned by the spinner cleaning unit 38, and then spin-dried.

  As shown in FIG. 2, the ceramic chip capacitor sheet 11 is mounted on a glass carrier substrate 40 with a tape 42 serving as a separation layer. As shown in FIG. 3 which is a cross-sectional view taken along the line AA of FIG. 2, a raw ceramic is applied on a tape 42 attached to the surface of the carrier substrate 40 to form a raw ceramic layer 13 having a thickness of about 5 μm. An electrode metal 15 such as palladium is screen-printed on the surface of the raw ceramic layer 13 to form an electrode layer 15 having a thickness of about 1 μm.

  2, the electrode layer 15 includes an electrode region 17 having a plurality of electrodes 17a partitioned in a lattice pattern, and an alignment mark 19a surrounding the electrode region 17 and indicating the position of the electrode 17a. And four alignment mark regions 19.

  The green ceramic layers 13 and the electrode layers 15 formed in this manner are alternately laminated by about 200 layers, and the green ceramic layer 13 is formed in the uppermost layer to constitute the ceramic chip capacitor sheet 11.

  When dividing the thus configured ceramic chip capacitor sheet 11 into individual chip capacitors, it is necessary to detect the position of the electrode 17a. However, since the ceramic layer 13 is formed on the uppermost layer, the electrode is formed from the surface. The position of 17a cannot be confirmed.

  Therefore, in the method for dividing the ceramic chip capacitor sheet 11 of the present invention, the alignment mark region 19 is cut a plurality of times by the cutting blade 34 to form a cutting groove having a width equal to or greater than the thickness of the cutting blade 34, and is formed at the bottom of the cutting groove. An alignment mark exposing step for exposing the alignment mark 19a is performed.

  When forming the cutting groove using the cutting blade 34, two alignment marks 21 are formed on the surface of the uppermost ceramic layer 13 at positions corresponding to both ends of the alignment mark region 19 of the electrode layer 15. The two alignment marks 21 are detected, and a straight line connecting the two alignment marks 21 is cut with a cutting blade 34.

  The provision of the alignment mark 21 on the uppermost ceramic layer 13 is not essential in the dividing method of the present invention, and the alignment mark 21 may not be formed on the uppermost ceramic layer 13. In this case, the alignment mark region 19 is cut by the cutting blade 34 based on the design value of the ceramic chip capacitor sheet 11.

  Hereinafter, a method for dividing the ceramic chip capacitor sheet 11 of the embodiment of the present invention by the cutting device 2 will be described. First, the cassette 8 containing a plurality of ceramic chip capacitor sheets 11 mounted on the carrier substrate 40 is mounted on the cassette elevator 9. Next, the ceramic chip capacitor sheet 11 to be unloaded by the vertical movement of the cassette elevator 9 is positioned at the unloading position.

  Next, the ceramic chip capacitor sheet 11 is unloaded from the cassette 8 by the loading / unloading means 10 and placed in the temporary placement region 12. After the carrier substrate 40 is aligned in the temporary placement region 12, the ceramic chip capacitor sheet 11 mounted on the carrier substrate 40 is placed on the suction chuck 22 of the chuck table 18 by the turning operation of the transport means 16, and the carrier The carrier substrate 40 is positioned by bringing the two sides of the substrate 40 into contact with the three positioning pins 24, and the carrier substrate 40 is sucked and held by the suction chuck 22.

  The chuck table 18 that sucks and holds the ceramic chip capacitor sheet 11 via the carrier substrate 40 is moved in the X-axis direction and positioned immediately below the imaging means 28. If the chuck table 18 is positioned immediately below the image pickup means 28, the image pickup means 28 picks up an image of the surface of the ceramic chip capacitor sheet 11 corresponding to one alignment mark area 19, and two pieces corresponding to the alignment mark area are obtained. The alignment mark 21 is detected, and each coordinate value is stored in the memory of the controller 2 of the cutting device 2.

  Next, after rotating the chuck table 18 so that the detected straight line connecting the two alignment marks 21 coincides with the X-axis direction, the straight line connecting the two alignment marks 21 on the extended line of the cutting blade 34. The cutting blade 34 is moved in the Y-axis direction so as to match.

  Next, while rotating the cutting blade 34, the chuck table 18 that sucks and holds the ceramic chip capacitor sheet 11 is cut and fed in the X-axis direction, so that the first alignment mark area 19 is moved to the first alignment mark area 19 as shown in the enlarged view of FIG. A cutting groove 23a is formed.

  Next, as shown in FIGS. 4 and 5, the second cutting groove 23b, the third cutting groove 23c, the fourth cutting groove 23d, and the fifth cutting groove 23e so that the cutting grooves formed by the cutting blade 34 partially overlap. Then, the sixth cutting groove 23f is formed, and the whole of the cutting grooves 23a to 23f is formed with the alignment mark exposing groove 23 having a width equal to or larger than the thickness of the cutting blade 34.

  By forming the alignment mark exposing groove 23 having a sufficient width as described above, the alignment mark 19 a is exposed at the bottom of the alignment mark exposing groove 23.

  By performing this alignment mark exposing step on the four alignment mark regions 19 formed surrounding the electrode region 17, the alignment mark 19 a is exposed in each alignment mark exposing groove 23.

  Referring to FIG. 6, there is shown a sectional view for explaining an alignment mark exposing step according to the second embodiment of the present invention. In the alignment mark exposing step of the present embodiment, first, as shown in FIG. 6A, the remaining portion 25 is provided between the grooves, and the alignment mark area 19 is cut by the cutting blade 34, so that the alignment mark table is entirely displayed. Cutting grooves (1) to (3) are formed to have a protruding groove width 23A '.

  Next, as shown in FIG. 6B, the remaining portion 25 is cut by the cutting blade 34 to form the cutting grooves (4) and (5), which are used as the alignment mark exposing groove 23A as a whole. According to the alignment mark exposing step of the second embodiment, the cutting blade 34 can be prevented from falling down and meandering of the formed cutting groove can be prevented.

  Referring to FIG. 7, there is shown a sectional view for explaining the alignment mark exposing step of the third embodiment of the present invention. In the alignment mark exposing step of the present embodiment, first, as shown in FIG. 7A, the alignment mark region 19 is cut by the cutting blade 34 so as not to leave a remaining portion, and the cutting grooves (1) to (3). Are formed continuously. In FIG. 3 (A), 23B ′ is the alignment mark exposing groove width.

  Next, as shown in FIG. 7B, a cutting groove (4) is formed between the cutting groove (1) and the cutting groove (2), and cutting is performed between the cutting groove (2) and the cutting groove (3). A groove (5) is formed, a cutting groove (6) is formed so as to partially overlap the cutting groove (3), and the alignment mark exposing groove 23B is formed as a whole.

  As the cutting blade 34 is cut, an R shape is formed at the tip. By cutting as in the present embodiment, meandering of the cutting blade 34 can be prevented and the bottom surface of the alignment mark exposing groove 23B can be made flatter. can do.

  After performing the alignment mark exposing step, in the dividing method of the present invention, the alignment step of detecting the dividing position based on the alignment mark 19a expressed in the alignment mark exposing step is performed.

  In this alignment step, the chuck table 28 is positioned directly below the imaging means 28. And based on the alignment mark 19a displayed on the alignment mark exposure groove | channel 23 by the alignment mark expression step mentioned above, the alignment step which sets a cutting area | region is performed.

  That is, the first alignment mark area 19 is imaged by the imaging means 28, all the alignment marks 19a in the first alignment mark area 19 are detected, and the coordinate values are stored in the memory.

  Next, the second alignment mark area 19 facing the first alignment mark area 19 is imaged by the imaging means 28 to detect all the alignment marks 19a in the second alignment mark area 19, and the coordinate values are stored in the memory. Store.

  In the ceramic chip capacitor sheet 11 of the present embodiment, in order to cut between the adjacent alignment marks 19a and 19a, the alignment mark 19a in the first alignment mark area 19 and the alignment mark in the second alignment mark area 19 facing each other. If 19a is detected, a straight line connecting the first (leftmost) alignment mark 19a is drawn and aligned so that this straight line coincides with the extended line of the cutting blade 34 in the X-axis direction. A position that is ½ of the interval is set as the division position 27, and this division position 27 is stored in the memory.

  A similar operation is executed for the second alignment mark 19a to detect the division position 27 and store the division position 27 in the memory. This operation is executed for all the alignment marks 19a in the second alignment mark area 19 facing the first alignment mark area 19, and the division position 27 extending in the first direction is set.

  Next, the chuck table 18 is rotated 90 degrees, and the same operation is performed on all the alignment marks 19a in the fourth alignment mark area 19 facing the third alignment mark area 19 in the first direction. A division position 27 that extends in a second direction orthogonal to the division position 27 that extends is set. A plan view of the ceramic chip capacitor sheet 11 after completion of the alignment step is shown in FIG.

  After completion of the alignment step, all the division positions 27 extending in the first direction detected in the alignment step are cut by the cutting blade 34 to form the division grooves 29 extending in the first direction.

  Next, after the chuck table 18 is rotated 90 degrees, all the dividing positions 27 extending in the second direction are cut by the cutting blade 34 to form the dividing grooves 29 extending in the second direction. As shown in FIG. 9, the ceramic chip capacitor sheet 11 is divided into individual chip capacitors.

  In the dividing method of the embodiment of the present invention described above, the alignment mark region 19 is cut a plurality of times by the cutting blade 34 for dividing into individual chip capacitors, and the alignment mark exposing groove having a width wider than the thickness of the cutting blade 34. Since 23, 23A, and 23B are formed, the alignment mark 19a can be reliably exposed at the bottom of the alignment mark exposing grooves 23, 23A, and 23B, and alignment is performed based on these alignment marks 19a. be able to. Therefore, even with a single spindle cutting device 2 as shown in FIG. 1, the ceramic chip capacitor sheet 11 can be easily divided.

2 Cutting device 11 Ceramic chip capacitor sheet 13 Ceramic layer 15 Electrode layer 17 Electrode region 17a Electrode 18 Chuck table 19 Alignment mark region 19a Alignment mark 23, 23A, 23B Alignment mark display groove 23a-23f Cutting groove 25 Remaining portion 27 Dividing position 28 Imaging means 29 Dividing groove 34 Cutting blade

Claims (2)

A ceramic layer, an electrode region having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice shape, and an alignment mark region having an alignment mark surrounding the electrode region and indicating the position of the electrode A method of dividing a ceramic chip capacitor sheet, in which a plurality of electrode layers are alternately laminated, and a ceramic chip capacitor sheet formed by laminating ceramic layers on the uppermost layer is divided into individual chip capacitors partitioned in a grid pattern. ,
An alignment mark exposing step of cutting the alignment mark region a plurality of times with a cutting blade to form a cutting groove having a width equal to or greater than the thickness of the cutting blade, and exposing the alignment mark at the bottom of the cutting groove;
An alignment step of detecting a division position based on the alignment mark expressed in the alignment mark expressing step;
A division step of dividing the ceramic chip capacitor sheet into individual chip capacitors by cutting the division position detected in the alignment step with the cutting blade;
A method of dividing a ceramic chip capacitor sheet, comprising: The alignment mark expression step includes:
A first cutting step of cutting the alignment mark region with the cutting blade to form a first cutting groove;
After performing the first cutting step, a position separated from the first cutting groove by a predetermined distance is cut by the cutting blade to form a second cutting groove parallel to the first cutting groove, and the first cutting A second cutting step for forming a remaining region between the groove and the second cutting groove;
After performing the second cutting step, a third cutting step of cutting and removing the remaining area with the cutting blade;
The method for dividing a ceramic chip capacitor sheet according to claim 1, comprising:

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