TWI575587B - Substrate cutting device and substrate cutting method - Google Patents

Description

Substrate cutting device and substrate cutting method

In the present invention, a plurality of package-shaped electronic components are cut out from a substrate (hereinafter referred to as a formed substrate) in which a small number of electronic components such as a plurality of IC chips mounted on a substrate are packaged and molded by a resin material. The substrate cutting device and the substrate cutting method for cutting the formed substrate by encapsulating a small electronic component mounted on the substrate by a resin, hereinafter simply referred to as a package).

Conventionally, in order to cut out a plurality of packages from a molded substrate that is collectively cast, the formed substrate is cut by a blade. In the cutting precision of the substrate cutting process and the alignment accuracy of the package immediately after the cutting, the bending of the substrate at the time of cutting has a large influence. Therefore, conventionally, in order to eliminate this influence, the cutting process is divided into a first cutting process and a second cutting process.

The formed substrate is divided into one or a plurality of main portions (hereinafter referred to as a block region) each including a plurality of packages, and a peripheral portion (hereinafter referred to as an end material region) which is located at the periphery of the block region and does not constitute a package. In the first cutting process, the end material region is cut from the formed substrate, and further divided into one or a plurality of block regions. In the second cutting process, the package is further cut out from each of the segmented regions.

In general, the larger the substrate, the larger the amount of displacement of the end portion of the substrate due to the bending of the substrate. By dividing the package from the formed substrate into a first cutting process and a second cutting In the process, when the second cutting process of the packaged electronic component is cut out, the formed substrate is separated into each block region. Thereby, the amount of displacement of the end portion of the substrate is reduced, and the influence of the bending of the substrate during the cutting of the package is reduced as much as possible.

In the first cutting process and the second cutting process, the positioning of the formed substrate and the block region at the time of cutting is performed by the alignment mark. The alignment mark is a member that is formed on the formed substrate by printing or the like and is not required in the package as a product. Therefore, the alignment mark is formed in the peripheral region which is not the package, that is, the end material region. The alignment mark is formed before the first cutting process. The first cutting process using the alignment mark and the positioning process in the second cutting process are performed as follows.

First, the position of the alignment mark of the formed substrate disposed at a predetermined position where the cutting process is performed is detected. Hereinafter, the position information of the detected alignment mark is referred to as alignment information. The alignment information is detected, for example, by image capture and image processing. Determining the position of the formed substrate and the calculation of the cutting position in the first cutting process based on the detected alignment information, and executing the first cutting process along the calculated cutting position, thereby The forming substrate cuts the end material region and cuts out the block region. Then, based on the detected alignment information, the determination of the position of each block region and the calculation of the cutting position in the second cutting process are performed, and the second cutting process is performed along the calculated cutting position. Thereby the package is cut out from the block area.

[Advanced technical literature] [Patent Literature]

Patent Document 1: Japanese Patent Laid-Open Publication No. 2003-243331

With the recent miniaturization of electronic devices, the demand for miniaturization of packages has also increased. In order to achieve miniaturization of the package, it is necessary to further improve the cutting precision of the package. On the other hand, in the conventional cutting method, by performing the positioning process using the above-described alignment mark, the positioning accuracy of each portion at the time of the cutting process can be improved to some extent. However, in order to further improve the cutting precision of the package which is expected to be expected in the future, it is necessary to further improve the positioning accuracy of each portion during the cutting process.

Therefore, an object of the present invention is to provide a cutting method and a cutting device for a substrate which can improve the positioning accuracy of each portion during the cutting process.

In order to achieve the above object, the inventors of the present application have focused on the following cases. In other words, in the conventional cutting method, the block region can be cut out from the formed substrate by the first cutting process before the second cutting process for cutting out the package-shaped electronic component, thereby being able to some extent The bending of the substrate (block region) is alleviated, but since the alignment mark is cut together with the end material region in the first cutting process, the second cutting has to be performed based on the alignment information based on the removed alignment mark The positioning of the various parts of the block area in process. However, the bending of the substrate is alleviated by the first cutting process, whereby subtle movement and positional shift occur in each of the block regions, and the alignment information obtained before the first cutting process cannot be used in the second In the cutting process, high-precision positioning following the movement of the block region and the positional shift is performed.

Based on the findings of the conventional example described above, in the present invention, in order to achieve the above object, the configuration is as follows.

The substrate cutting method of the present invention has a plurality of packages formed thereon. a block region of the electronic component and a formed substrate disposed around the block region and having a first alignment mark end region, first by aligning the first alignment mark and cutting the formed substrate Forming the block region, and then forming a substrate cutting method for the package-shaped electronic component by cutting the block region, comprising: setting a second in a block region of the formed substrate a step of aligning the mark; a step of detecting the second alignment mark to obtain first detected position information when aligning the first alignment mark; and a block area formed by cutting the formed substrate And performing the step of detecting the second alignment mark to obtain the second detection position information; performing the comparison between the first detection position information and the second detection position information and correcting a step of setting a cut position in the block area; and a step of cutting the cut position set by the comparison and correction.

Another substrate cutting method of the present invention is a method of cutting out a formed substrate having a block region in which a plurality of package-shaped electronic components are formed and an end material region having a first alignment mark and disposed around the block region. A substrate cutting method for a package-shaped electronic component, comprising: a first alignment step of detecting a position of a first alignment mark of the formed substrate, according to the detected first pair Position information of the quasi-marking, specifying a position of the formed substrate and a position of the block area; a block area dividing step according to a position of the formed substrate specified in the first alignment step Information and information on the position of the block region, cutting the end material region from the formed substrate and cutting out the block region; a second aligning step of detecting a position of the set second alignment mark before and after the block area dicing step after the second alignment mark is preset in the block area of the formed substrate And comparing, correcting the position of the block region specified in the first alignment step according to the comparison result; and encapsulating the body-shaped electronic component dicing step according to the second alignment step Information on the position of the corrected block region, and the package-shaped electronic component is cut out from the block region.

Further, another substrate cutting method according to the present invention is a formed substrate including a block region in which a plurality of package-shaped electronic components are formed and an end material region provided around the block region, first, by cutting the substrate A substrate cutting method for forming the package region by forming a substrate, and then forming the package-shaped electronic component by cutting the block region, comprising: a substrate on the formed substrate a step of setting an alignment mark in the block area; a step of detecting the alignment mark to obtain first detection position information; and cutting the formed substrate according to the first detection position information, thereby forming the block area And detecting the alignment mark of the cut block area to obtain second detection position information; comparing and correcting the first detection position information and the second detection position information a step of setting a cutting position in the block region; and a step of cutting the cutting position set by the comparison and correction.

The substrate cutting device of the present invention is formed by forming a plurality of package-like electrons a substrate cutting device in which a formed substrate having a first alignment mark is disposed around the block region and the packaged electronic component is cut out, and is characterized in that: a first alignment mechanism and a second pair are provided a first alignment mechanism detects a position of the first alignment mark of the formed substrate, and a specific mechanism according to the detected position information of the first alignment mark a position of the formed substrate and a position of the block region, the cutting means cutting the end material region from the formed substrate by using the first alignment mechanism and cutting out the block region, After the block region of the formed substrate is preset with a second alignment mark, the first alignment mechanism is on the formed substrate before the block region cutting process by the cutting means Detecting a position of the second alignment mark, after the second alignment mark is preset in the block region of the formed substrate, the second alignment mechanism is opposite to the set second alignment mark Position detection, Comparing with the block region cutting process by the cutting means, the position of the block region specified by the first alignment mechanism is corrected based on the comparison result, and the cutting means further The package-shaped electronic component is cut out from the block region based on position information of the block region corrected by the second alignment mechanism.

The substrate cutting method and the cutting device of the present invention having the above configuration can obtain the following operational effects. That is, since the bending of the substrate is alleviated by the process of cutting out the block region from the formed substrate, the position of the block region after the process of cutting the end material region from the formed substrate and cutting out the block region is sometimes performed. A number of offsets occur from the location of the block area specified in the first alignment step.

In the present invention, by correcting the positional deviation by the second alignment step, it is possible to further improve the setting accuracy of the cutting position when the package-shaped electronic component is cut out from the block region.

Further, it is preferable to set an arbitrary internal structure such as a lead terminal portion or a convex portion located in the block region as a second alignment mark. Among them, for the second alignment mark, it is more preferable to set the internal structure located on the diagonal of the block region.

According to the present invention, it is possible to accurately correct the positional shift before and after the division in the block region cut out from the molded substrate, thereby solving various problems in the above-described substrate cutting, and achieving efficient operation. The excellent effect of cutting the aforementioned formed substrate is obtained.

Moreover, according to the present invention, it is possible to provide a substrate cutting method capable of efficiently cutting the molded substrate which is cast together, thereby improving the productivity of the product.

1‧‧‧formed substrate

1a‧‧‧Substrate surface

1b‧‧‧casting surface

1c‧‧‧block area

1c’‧‧‧ regional group

1d‧‧‧End material area

1e‧‧‧first alignment mark

1f‧‧‧second alignment mark

1g‧‧‧ lead terminal

2‧‧‧Substrate

3‧‧‧Resin molded body

4a‧‧‧Virtual cut line (long side direction)

4b‧‧‧Virtual cut line (short side direction)

4c‧‧‧Virtual cut line (long side direction)

4d‧‧‧Virtual cut line (short side direction)

5‧‧‧Packaged electronic parts (package)

5a‧‧‧Substrate surface

5b‧‧‧casting surface

6‧‧‧Parts Department

7‧‧‧Resin Department

9‧‧‧Substrate cutting device

10‧‧‧Links

11‧‧‧Substrate alignment mechanism

12‧‧‧Substrate cutting mechanism

13‧‧‧Substrate supply station

14‧‧‧Substrate rotation alignment

15a‧‧‧First substrate mounting means

15b‧‧‧Second substrate mounting means

16a‧‧‧First reciprocating means

16b‧‧‧Second reciprocating means

17a‧‧‧First cut-off workbench

17b‧‧‧Second cut-off workbench

18‧‧‧Rotating mechanism

19‧‧‧Workbench installation table

20‧‧‧Working table mounting surface

20a‧‧‧Working table mounting surface

20b‧‧‧Working table mounting surface

22‧‧‧rail members

23‧‧‧Sliding members

24‧‧‧Substrate placement

25‧‧‧Sheet cutting position

26a‧‧‧The moving area of the first cutting table 17a

26b‧‧‧Moving area of the second cutting table 17b

27a‧‧‧Alignment mechanism

27b‧‧‧Alignment mechanism

28‧‧‧First cut-off means

29‧‧‧Second cutting means

30‧‧‧Decoration Department

32a‧‧‧Alignment mechanism

32b‧‧‧Alignment mechanism

41‧‧‧Substrate Loading Department

42‧‧‧Exporting components

43‧‧‧Package Supply Department

44‧‧‧Package Inspection Department

45‧‧‧Check camera

46‧‧‧Package screening

47‧‧‧Quality goods tray

48‧‧‧Unqualified product tray

A‧‧‧Substrate filling means

B‧‧‧Substrate cutting means

C‧‧‧Package inspection means

D‧‧‧Package containment means

E‧‧‧Control Department

1 is a plan view showing a schematic configuration of a substrate cutting device according to an embodiment of the present invention.

2 is a plan view showing a schematic configuration of a substrate cutting device according to an embodiment of the present invention.

3 is a perspective view showing a main part of a substrate cutting device according to an embodiment of the present invention.

4 is a cross-sectional view showing a main part of a substrate cutting device according to an embodiment of the present invention.

Fig. 5 is a plan view showing a first cut state of a formed substrate during cutting.

Fig. 6 is a plan view showing a second cut state of the formed substrate during cutting.

7 is a plan view showing a third cut state of a formed substrate (block region group) during cutting.

8 is a plan view showing a fourth cut state of a formed substrate (block region group) during cutting.

Fig. 9 is a flow chart showing the steps of a method of cutting a formed substrate using the substrate cutting device of the present invention.

(1) of FIG. 10 is a perspective view showing a schematic configuration of a molded substrate which is subjected to a cutting process by the substrate cutting device according to the embodiment of the present invention, and (2) of FIG. 10 is a package which is cut out from the formed substrate. A perspective view of a schematic structure of an electronic component (package).

Fig. 11 is a plan view further showing the structure of a formed substrate.

Fig. 12 is a plan view showing a block region in which the position of the second alignment mark is shifted.

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Fig. 1 is a view showing a substrate cutting device 9 of the present invention. FIG. 2 is a view showing the substrate cutting means B provided in the substrate cutting device 9 shown in FIG. 1. 3 and 4 are views showing main parts of the substrate cutting means B shown in Fig. 2. 5, 6, 7, and 8 are views showing a state (cut state) of the formed substrate 1 during cutting. FIG. 9 is a flowchart showing a method of cutting the formed substrate 1 using the substrate cutting device 9 of the present invention. (1) of FIG. 10 is a view showing the formed substrate 1 which is subjected to cutting processing by the substrate cutting device 9. (2) of FIG. 10 is a view showing a package-shaped electronic component (hereinafter, omitted as a package) 5 formed by cutting the formed substrate 1 shown in (1) of FIG. 10 . FIG. 11 is a plan view of the formed substrate 1. In addition, since the plurality of packages 5 which are cut out from the formed substrate 1 have a minute shape as compared with the formed substrate 1, the package 5 is enlarged and shown in (2) of FIG. Figure 11 shows the positions of the first alignment mark and the second alignment mark of the formed substrate, and Figure 12 shows the amount of movement (position offset) of the second alignment mark.

As shown in (1) of FIG. 10, the formed substrate 1 has a substrate 2 and a resin molded body 3. As shown in FIG. 11, the substrate 2 is provided with a plurality of block regions 1c arranged in alignment and an end material region 1d provided around the block region 1c. In each of the block regions 1c, a plurality of package-mounted electronic components (hereinafter referred to as packages) 5 are formed. At a portion of the end material region 1d, a first alignment mark 1e is formed. The first alignment mark 1e is formed in the end material region 1d by a method such as printing or imprinting.

As shown in (1) of FIG. 10, the molded substrate 1 includes a substrate surface 1a and a casting surface 1b which is a surface on the opposite side of the substrate surface 1a, and the resin molded body 3 is provided on the casting surface 1b side of the substrate 2. The virtual cutting lines 4a and 4b can be set on the substrate surface 1a side of the formed substrate 1. The virtual cutting line 4a is a cutting line that is virtually set in parallel with the long side of the rectangular formed substrate 1, and the virtual cutting line 4b is a cutting line that is virtually set in parallel with the short side. As shown in (2) of FIG. 10, a plurality of packages 5 which are cut out from the formed substrate 1 have a substrate portion 6 and a resin portion 7. The package 5 includes a substrate surface 5a and a casting surface 5b which is a surface on the opposite side of the substrate surface 5a, and the resin portion 7 is provided on the casting surface 5b side of the substrate portion 6. As will be described later, the substrate 1 is cut by using the substrate cutting device 9 of the present invention, whereby the respective packages 5 are formed.

Next, the structure of the substrate cutting device 9 of the present invention will be described. As shown in FIG. 1, the substrate cutting device 9 includes a substrate loading means A for loading the formed substrate 1, and a substrate cutting means B for cutting (separating) the formed substrate 1 transferred from the substrate loading means A. The package 5 and the package inspection means C perform visual inspection on each package 5 cut by the substrate cutting means B, and perform screening according to the qualified product and the defective product; and the package storage means D will pass the package inspection means. The package 5 after the C inspection and screening is respectively accommodated in the tray according to the qualified product and the defective product; and the control unit E.

The substrate cutting device 9 is configured to be loaded with the substrate loading means A. The formed substrate 1 is transferred to the substrate cutting means B and cut into the respective packages 5, and then the packaged inspection means C is used to inspect and screen the cut packages 5, and the package is housed by the package storage means D. 5 Each of the qualified products and the defective products is stored, and further, the control unit E controls a series of processes of the means A, B, C, and D.

The substrate cutting device 9 is configured such that the above-described respective means A, B, C, and D can be detachably coupled to each other in this order. Further, the substrate cutting device 9 is configured such that the respective means A, B, C, and D can be detachably connected by the connecting device 10, for example.

Next, the substrate cutting means B will be described. As shown in FIG. 2, the substrate cutting means B has a substrate alignment mechanism portion 11 and a substrate cutting mechanism portion 12. The substrate alignment mechanism unit 11 includes a substrate supply stage 13 to which the formed substrate 1 is supplied from the substrate loading means A, and a substrate rotation alignment means 14 for locking the formed substrate 1 supplied to the substrate supply stage 13. And the formed substrate 1 which is rotated at a desired angle (for example, 90 degrees) so as to be aligned in a desired direction is supplied to the cutting mechanism portion 12 side of the substrate.

In the substrate cutting means B having the above configuration, first, the formed substrate 1 is supplied from the substrate loading means A to the substrate supply table 13, and then the formed substrate 1 is locked from the substrate supply table 13 and lifted. The substrate is rotated at a desired angle, whereby the formed substrate 1 is aligned in a desired direction and supplied to the substrate cutting mechanism portion 12 side.

Next, the configuration of the substrate cutting mechanism unit 12 will be described. The substrate cutting device 9 is a two-stage system. As shown in FIG. 2, the substrate cutting mechanism unit 12 includes two wires for performing substrate cutting (single substrate) (single-chip production line in the device). The two singulation lines are arranged in a parallel state in the Y direction, and the arrangement positions thereof are substantially the same as the movement areas 26a and 26b of the first cutting table 17a and the second cutting table 17b which will be described later. Consistent.

Further, in the example shown in Fig. 2, the moving area 26a of the first cutting table 17a is disposed on the left side when facing the drawing, and the movement of the second cutting table 17b is disposed on the right side when facing the drawing. Area 26b.

Further, in the substrate cutting mechanism unit 12, the first substrate mounting means 15a and the second substrate mounting means are provided in the moving regions 26a, 26b of the first cutting table 17a and the second cutting table 17b, respectively. 15b and a first reciprocating means 16a and a second reciprocating means 16b for guiding the first substrate placing means 15a and the second substrate placing means 15b to reciprocate in the Y direction.

Therefore, in the moving region 26a, the first substrate placing means 15a can be reciprocated by the first reciprocating means 16a, and in the moving region 26b, the second substrate placing means 15b can be reciprocated by the second reciprocating means 16b mobile. Further, regarding the structural members associated with the moving regions 26a, 26b in the substrate cutting mechanism portion 12, the first additional "a" is used as the tail and the second additional "b" is used as the tail.

The first substrate mounting means 15a and the second substrate mounting means 15b have a first cut in which the molded substrate 1 is placed such that the casting surface 1b is on the lower surface (or the substrate surface 1a is in the upper surface). The cutting table (the rotating table for cutting) 17a and the second cutting table 17b are further provided on the first cutting table 17a and the second cutting table 17b, although not shown. An adsorption mechanism including a suction hole and a vacuum suction mechanism such as a vacuum pump is provided, and the formed substrate 1 placed on the first cutting table 17a and the second cutting table 17b is adsorbed and fixed.

As shown in FIG. 3 and FIG. 4, the first cutting table 17a and the second cutting table 17b are provided on the lower end side of the first cutting table 17a and the second cutting table 17b. Rotating mechanism 18. The rotating mechanism 18 is disposed in a state of being placed on the table mounting table 19, along the Z direction, from the lower side to the upper side, with the table mounting table 19, the rotating mechanism 18, the first cutting table 17a or the second The sequential arrangement of the table 17b is cut off.

According to the rotating mechanism 18 having the above configuration, first, the formed substrate 1 aligned by the substrate rotation alignment means 14 is supplied to the table mounting surface placed on the first cutting table 17a and the second cutting table 17b. 20, the formed substrate 1 is adsorbed and fixed to the first cutting table 17a and the second cutting table 17b (the table placing surfaces 20a and 20b) by the suction surface 1b side by the suction mechanism, and then used. The rotating mechanism 18 is capable of rotating in a desired direction at a desired angle.

Further, the first reciprocating means 16a and the second reciprocating means 16b are provided with a main body (setting table) of the first reciprocating means 16a and the second reciprocating means 16b, and a first reciprocating means 16a and a second reciprocating means 16b. The two rail members 22 in the main body are disposed in the reciprocating direction (Y direction) on the side surfaces of the first substrate mounting means 15a and the second substrate mounting means 15b; the sliding member (slider) 23 is on the rail member 22 The sliding member slides up to guide the first substrate mounting means 15a and the second substrate mounting means 15b, and a reciprocating mechanism (not shown) such as a ball to reciprocate the sliding member 23 in the Y direction.

With the above configuration, the first cutting table 17a and the second cutting table 17b can be placed on the substrate by the first reciprocating means 16a and the second reciprocating means 16b in the respective moving regions 26a and 26b. The position 24 and the substrate cutting position 25 (that is, the inside of the first cutting table 17a and the second cutting table 17b in the moving regions 26a and 26b) reciprocate. In addition, it is a matter of course that the first substrate mounting device 15a and the second substrate mounting device 15b are configured such that the sliding member 23 can be separated from the first cutting table 17a and the second cutting table 17b. It slides back and forth in one piece.

Next, the alignment mechanism in the substrate cutting device 9 of the present embodiment will be described. Alignment mechanisms 27a and 27b are provided on the substrate placement position 24 side of the movement areas 26a and 26b of the first cutting table 17a and the second cutting table 17b. Further, alignment mechanisms 32a and 32b are provided on the substrate cutting position 25 side of the moving regions 26a and 26b of the first cutting table 17a and the second cutting table 17b. By the alignment mechanisms 27a, 27b, 32a, 32b, the substrate faces 1a of the formed substrate 1 placed on the first cutting table 17a and the second cutting table 17b are aligned to be aligned on the substrate face 1a. Set the desired virtual cut line. The alignment mechanism 27a, 27b, 32a, 32b constitutes a first alignment mechanism and a second alignment mechanism.

Further, in the present invention, it is also possible to provide a pair of the formed substrates 1 (two sheets) respectively supplied to the two cutting tables (the first cutting table 17a and the second cutting table 17b). The structure of the quasi-organization 27.

Further, in the drawings of FIGS. 1 and 2, the alignment mechanisms 32a and 32b are attached to the first cutting means 28 and the second cutting means 29, respectively, but may be provided by the first cutting means 28 and the second. One of the cutting means 29 is provided with an alignment mechanism 32.

Next, the cutting means in the substrate cutting device 9 of the present embodiment will be described. A first cutting means 28 composed of a blade (rotation cutting blade) or the like is provided on the substrate cutting position 25 side in the moving regions 26a and 26b of the first cutting table 17a and the second cutting table 17b. And a second cutting means 29. The first cutting means 28 and the second cutting means 29 are configured to be reciprocally movable independently in the X direction or in the Y direction. Further, generally, as shown in the example, the first cutting means 28 and the second cutting means 29 are disposed in a state in which the blade side is disposed opposite to each other.

The formed substrate 1 is formed by the first cutting means 28 and the second cutting means 29 When the cutting is performed, the first cutting means 28 and the second cutting means 29 can be relatively moved with respect to the first cutting table 17a and the second cutting table 17b (formed substrate 1) to cut off The substrate 1 has been formed.

Further, in the cutting by the first cutting means 28 and the second cutting means 29 (blade), generally, the blade positions of the first cutting means 28 and the second cutting means 29 are made. The positions of the virtual cutting lines 4a, 4b, 4c, and 4d of the formed substrate 1 are aligned, and the first cutting means 28 and the second cutting means 29 (blades) are moved down to the first cutting table 17a, The second cutting table 17b (formed substrate 1) side, and the first cutting table 17a and the second cutting table 17b (formed substrate 1) are placed along the virtual cutting line of the moving direction The direction is moved to cut the formed substrate 1.

Further, in the first cutting means 28 and the second cutting means 29, processing liquid spraying means for ejecting the machining liquid to the insert to remove chips (chips) when cutting the formed substrate 1 is provided (not Graphic). Therefore, the first cutting means 28 and the second cutting means 29 are used in the state where the machining liquid is sprayed to the first cutting means (blade) 28 and the second cutting means (blade) 29, respectively. The formed substrate 1 placed on the first cutting table 17a (or the second cutting table 17b) is cut, whereby each of the packages 5 can be formed from the formed substrate 1.

In the intermediate portion between the substrate cutting position 25 and the substrate mounting position 24 in the moving regions 26a and 26b of the first cutting table 17a and the second cutting table 17b, each of the cut portions is provided The package 5 ejects the cleaning liquid to clean and dry the respective package 5 and the cleaning unit 30.

Further, a container (not shown) for accommodating the chips is provided at a position below the moving region 26a of the first cutting table 17a and the moving region 26b of the second cutting table 17b.

Therefore, the first cutting table 17a and the second cutting table 17b of each of the packages 5 that have been cut by the first cutting means 28 and the second cutting means 29 are placed at the cutting position from the substrate. When the substrate 25 is moved back to the substrate mounting position 24, the respective packages 5 can be mounted by the cleaning unit 30 in a state in which the respective packages 5 are placed on the first cutting table 17a and the second cutting table 17b. Wash and dry.

Here, the relationship between the cutting step and the alignment step in the present embodiment will be briefly described. For example, first, at the substrate mounting position 24 in the substrate cutting device 9 (substrate cutting means B), the first alignment mark 1e formed on the formed substrate 1 is aligned by the alignment mechanism 27a (27b). (Refer to FIG. 11), the cutting position on the formed substrate 1 is specified as the alignment information of the substrate. At this time, the first detection position information can be obtained by aligning the second alignment mark 1f (refer to FIG. 11) formed in the block region of the formed substrate 1 to detect the position.

Next, the formed substrate 1 is moved to the substrate cutting position 25, and the cutting position of the formed substrate 1 is cut in accordance with the alignment information of the substrate, thereby removing the end material region 1d from the formed substrate 1. The block region 1c (block region group 1c') is formed (so-called island-shaped cutting shown in Figs. 5 and 6).

Next, at the substrate cutting position 25, the alignment marks 32a, 32b are used to align the second alignment marks 1f in the block region 1c (block region group 1c') to detect the position, whereby the second detection position can be obtained. News.

Next, the first detected position information and the second detected position information are compared to correct the positional shift of the block area 1c (refer to FIG. 12), and the cut position of the block area 1c is specified as the alignment of the block area. News.

Then, according to the alignment information of the block area, the block area 1c can be The cutting position is cut to form each of the packages 5 (the formation of a so-called single piece as shown in FIGS. 7 and 8).

Further, the relationship between the cutting step and the alignment step in the above-described embodiment includes a more detailed detailed description including the configuration of the substrate cutting device 9 (substrate cutting means B) described above (refer to Figure 5 ~ Figure 8). In other words, in order to form the block region 1c (block region group 1c'), the cutting of the formed substrate 1 in the longitudinal direction (the cutting of the virtual cutting line 4a shown in Fig. 5) is performed. The cutting in the short side direction (cutting of the virtual cutting line 4b shown in Fig. 6) is performed in the following order.

For example, first, the first alignment mark 1e (and the second alignment mark 1f) of the formed substrate 1 are aligned by the alignment mechanism 27a (27b). Next, the first cutting table 17a (second cutting table 17b) on which the formed substrate 1 aligned by the alignment mechanism 27a (27b) is placed is moved from the substrate mounting position 24 to the substrate cutting. Broken position 25.

As shown in FIG. 5, at the substrate cutting position 25, according to the alignment information (first alignment mark 1e) of the alignment mechanism 27a (27b) described above, the first cutting means 28 and the second cutting means are used. 29. First, the formed substrate 1 is cut (the first cut state) by the required number of times along the virtual cutting line 4a which is set in parallel with the longitudinal direction thereof.

Then, as shown in FIG. 6, the first cutting table 17a (second cutting table 17b) is rotated at an angle of 90 degrees, for example, in a clockwise direction, and the formed substrate 1 is parallel along the short side direction thereof. The virtual cut line 4b is cut off a desired number of times. Further, if necessary, the first cutting table 17a (second cutting table 17b) is rotated at an angle of 90 degrees in the opposite direction (for example, counterclockwise direction) to return to the original position. Thus, the block region 1c (block region group 1c') (second cut state) can be formed by removing the end material region 1d from the formed substrate 1.

Then, in the cutting step and the aligning step in the above-described embodiment, in the block region 1c (block region group 1c'), the longitudinal direction thereof is similar to the above-described virtual cutting lines 4a and 4b ( The virtual cutting line 4c) shown in FIG. 7 and the short-side direction (the virtual cutting line 4d shown in FIG. 8) are cut to form the respective packages 5 (the third cutting state and the fourth cutting state). .

For example, at the substrate cutting position 25, the block region 1c (block region group 1c') placed on the first cutting table 17a (second cutting table 17b) is aligned by the alignment mechanism 32a (32b). Quasi (second alignment mark 1f). Next, the alignment information is compared with the information (second alignment mark 1f) obtained by aligning the substrate placement position 24 with the alignment mechanism 27a (27b). Correcting (compensating) the cutting position of the block region 1c according to the comparison information based on the second alignment mark 1f, and using the first cutting means 28 and the second cutting means 29, first as shown in FIG. The virtual cutting line 4c is cut, and the virtual cutting line 4d is cut as shown in FIG. 8, so that each package 5 can be formed. Thereafter, the first cutting table 17a and the second cutting table 17b can be moved from the substrate cutting position 25 to the substrate mounting position 24.

Further, in the above-described example, after the formed substrate 1 is cut along the virtual cutting lines 4a and 4c parallel to the longitudinal direction, the virtual cutting lines 4b and 4d parallel to the short-side direction are cut off. Though the substrate 1 is formed, the formed substrate 1 is cut along the virtual cutting lines 4b and 4d parallel to the short-side direction, and then cut along the virtual cutting lines 4a and 4c parallel to the longitudinal direction. The substrate 1 has been formed.

Thereafter, the first cutting table 17a and the second cutting table 17b on which the respective packages 5 after cutting are placed are moved to the substrate mounting position 24, and the respective packages 5 are carded from the substrate mounting position 24. And transfer to the subsequent package inspection means C.

In the formed substrate 1, the block region 1c may be one, or Thought it is plural.

Further, the alignment step (the first alignment step and the second alignment pre-measurement step described later) of the formed substrate 1 and the alignment step of the block region 1c described above (the second alignment post-measurement step described later) In any of the alignment mechanisms 27a, 27b, 32a, 32b, an alignment mechanism can be used.

Further, a structure may be employed in which the second alignment mark 1f is used as the alignment mark of the formed substrate 1 without using the first alignment mark 1e. In other words, in the formed substrate 1 including the block region 1c in which a plurality of package-shaped electronic components are formed and the end material region 1d provided around the block region 1c, the block region 1c has an arbitrary internal structure located in the block region 1c. The object (lead terminal portion or boss portion) is set as an alignment mark. Further, even if the block region 1c is formed by cutting the formed substrate 1 and removing the end material region 1d, the alignment mark based on the internal structure remains in the block region 1c. Among them, the internal structure located on the diagonal of the block region 1c can be set as an alignment mark.

Therefore, first, the alignment mark is set in the block region 1c of the formed substrate 1, the alignment mark is detected to obtain the first detection position information, and the formed substrate 1 is cut according to the first detection position information, thereby being formed Block area 1c. Next, the alignment mark of the cut block region 1c is detected to obtain the second detected position information. Next, the first detected position information and the second detected position information are compared and corrected, and the cut position is set in the block area 1c. Next, it is possible to cut the cutting position set by comparison and correction.

According to the present embodiment, it is possible to accurately correct the positional shift before and after the division in the block region cut out from the formed substrate 1. Therefore, the aforementioned Various problems in the cutting of the substrate, such as the influence of the bending of the molded substrate 1, achieve an excellent effect of efficiently cutting the formed substrate 1 described above. Moreover, according to the present embodiment, the molded substrate 1 that is integrally molded can be efficiently cut, and the productivity of the product can be improved.

Further, as another embodiment of the present invention, a configuration in which an alignment mark is set in the block region 1c without using the first alignment mark 1e provided in the end material region 1d is exemplified.

That is, in the formed substrate 1 including the block region 1c in which a plurality of package-shaped electronic components are formed and the end material region 1d provided around the block region 1c, an alignment mark can be set in the block region 1c. As the alignment mark, the same structure as the second alignment mark 1f (internal structure) in the above-described embodiment can be used, or printing or imprinting can be used in the same manner as the first alignment mark 1e in the above-described embodiment. The method is formed in the structure of the block region 1c.

Therefore, in the present embodiment, as in the above-described embodiment, the alignment marks 1f and 1e set in the block region 1c of the formed substrate 1 are detected to acquire the first detection position information, and the formed substrate 1 is formed. The virtual cut lines 4a and 4b (cutting positions) are cut, whereby the block area 1c (block area group 1c') can be formed. Next, the alignment marks 1f and 1e of the cut block region 1c are detected to obtain the second detected position information. Next, by comparing and correcting the first detected position information and the second detected position information, the cut positions (virtual cut lines 4c, 4d) are set in the block area 1c. By cutting the dummy cutting lines 4c and 4d obtained by the comparison and correction, the package-shaped electronic component 5 can be formed from the block region 1c (block region group 1c').

Therefore, the block region cut out from the formed substrate 1 can be accurately and accurately The positional shift before and after the segmentation generated in 1c is corrected. In addition, various problems such as the influence of the bending of the formed substrate 1 on the substrate cutting are solved, and the formed substrate 1 can be efficiently cut. Moreover, by cutting the formed substrate 1 efficiently, the productivity of the product can be improved.

Next, a cutting method of the formed substrate 1 using the substrate cutting device 9 will be described with reference to the flowchart of Fig. 9 . First, the formed substrate 1 is supplied from the substrate loading means A to the substrate alignment mechanism portion 11 (substrate supply table 13) in the substrate cutting means B, and the formed substrate 1 is placed in the desired direction by the substrate rotation alignment means 14. After the upper alignment, the aligned substrate 1 is supplied to the mounting surface 20 of the first cutting table 17a (or the second cutting table 17b) existing at the substrate mounting position 24, and is adsorbed and fixed. In addition, the first cutting table 17a and the second cutting table 17b in a state in which the formed substrate 1 is placed are moved to the substrate cutting position 25 (formed substrate receiving step S1).

In other words, at the substrate mounting position 24, the positions of the formed substrate 1 on the first cutting table 17a and the second cutting table 17b are aligned by the alignment mechanisms 27a and 27b functioning as the alignment means. The position of each block region 1c of the formed substrate 1 before cutting was measured. In the alignment process, the position of the first alignment mark 1e (refer to FIG. 11) formed in the end material region 1d of the formed substrate 1 is detected, and based on the detected position information of the first alignment mark 1e, The position of the formed substrate 1 on the first cutting table 17a, the second cutting table 17b, and the position of each block region 1c are specified (first alignment step S2). The positional information of the formed substrate 1 and the positional information of the block region 1c specified in the first alignment step S2 will hereinafter be referred to as first alignment information.

Further, in this state, the alignment machine functioning as an alignment means The structures 27a and 27b measure the position of the second alignment mark 1f placed on the formed substrate 1 before the cutting of the first cutting table 17a and the second cutting table 17b (second alignment) The preliminary measurement step S3a). As described above, the first alignment step S2 and the second alignment pre-measurement step S3a are performed by the alignment mechanisms 27a, 27b provided at the substrate mounting position 24.

As the second alignment mark 1f, as shown in FIG. 11, the lead terminal portion 1g which is an arbitrary internal structure of the block region 1c is used. The second alignment mark 1f is set in each block area 1c. Further, it is preferable to set at least two lead terminal portions 1g, 1g on the diagonal of each block region 1c as the second alignment mark 1f. Here, the lead terminal portions 1g and 1g located on the diagonal of each of the block regions 1c refer to the following configuration. That is, in each of the block regions 1c, a plurality of packages 5 before cutting are arranged in an array. When the second alignment mark 1f is set, a pair of pre-cut packages 5 opposed to each other on the diagonal line of the package column are first selected from the plurality of packages 5 before the cutting (in the drawing, A pair of packages 5 and 5) before cutting in the longitudinal direction of the package row. Then, among the plurality of lead terminal portions 1g included in the selected pair of packages 5 and 5 before cutting, the lead terminal portions 1g and 1g located on the diagonal line of the package row or closest to the diagonal line are selected. As the second alignment mark 1f. Further, as shown in Fig. 11, in the present embodiment, the lead terminal portion 1g is used as the second alignment mark 1f, and other than the above, although not shown, the convex portion of the package 5 may be used.

Next, as shown in FIG. 5, the virtual cutting line 4a along the longitudinal direction is set on the formed substrate 1, and along the set virtual cutting line 4a, the first cutting means 28 and the second are used. The cutting means 29 cuts the formed substrate 1. The virtual cut line 4a is set based on the position information (first alignment information) of the formed substrate 1 and the block region 1c specified by the alignment means (specifically, the alignment means 27a, 27b).

The first cutting table 17a and the second cutting table 17b of the formed substrate 1 cut along the virtual cutting line 4a in the longitudinal direction are rotated at a desired angle (angle of 90 degrees). In this state, as shown in FIG. 6, after the virtual cutting line 4b along the short-side direction is set on the formed substrate 1, the first cutting means is used along the set virtual cutting line 4b. 28. The second cutting means 29 further cuts the formed substrate 1. In the same manner as the virtual cut line 4a, the virtual cut line 4b is based on the position information of the formed substrate 1 and the block region 1c specified by the alignment means (specifically, the alignment mechanisms 27a and 27b). Set as soon as the information is aligned.

By the above processing, the formed substrate 1 is separated into a plurality of block regions 1c and end material regions 1d provided around the outer periphery of the block regions 1c. At this time, the plurality of block regions 1c are also cut and separated from each other. After the substrate separation is completed, the separated end material region 1d is removed from the block region 1c together with the first alignment mark 1e. Thereby, as shown in FIG. 7, the formed substrate 1 is cut and separated into a plurality of block regions 1c (block region dividing step S4). Further, in the following description, the plurality of block regions 1c are referred to as block region groups 1c' in a state of being separated from each other.

Next, it is determined whether or not the collective purge process of the formed substrate 1 is set in the cutting process of the formed substrate 1 (together the purge setting confirmation step S5). The collective purge setting confirmation step S5 is performed by the control unit E.

When it is confirmed that the purge is set in the purge setting confirmation step S5, the purge device (not shown) provided in the substrate cutting means is divided into the block region segmentation step S4. The cleaning air is ejected for the plurality of block regions 1c (block region group 1c'), thereby removing the cut waste (together step S6). Further, when it is confirmed in the one-time purge setting confirmation step S5 that the collective purge is not set, the collective purge step S6 is not performed.

Then, after performing the block region dicing step S4, by means of alignment The alignment means 32a, 32b) provided in the substrate cutting position 25 are again measured at the position of the second alignment mark 1f set in advance in each of the block regions 1c. Further, when the one-step purge step S6 is set, the second alignment mark 1f is again measured after the collective purge step S6 is performed (second alignment post-measurement step S3b). Then, the position of the second alignment mark 1f measured again is compared with the position of the second alignment mark 1f measured in the second pre-alignment measurement step S3a before performing the block region division step S4, according to comparison As a result, the position information of the block region 1c in the first alignment information specified in the first alignment step S2 is corrected (alignment correction step S3c). Since the second alignment mark 1f is set in each block area 1c, in the alignment correction step S3c, the position information of each block area 1c is corrected.

The correction of the position information of the block area 1c in the alignment correction step S3c will be described in further detail below. It is assumed that, in the arbitrary block region 1c, the movement is performed in the X-axis direction movement amount (x1), the Y-axis direction movement amount (y1), and the θ-axis direction movement amount (θ1) before and after the block region division step S4 ( The case where a positional shift occurs. In addition, in FIG. 12, it is assumed that there is no movement in the θ-axis direction, that is, movement in the rotation direction (θ 1 = 0), and is not illustrated.

When the movement amount (positional deviation) is detected based on the measurement results of the second pre-alignment measurement step S3a and the second alignment post-measurement step S3b, in the alignment correction step S3c, the amount of movement is set (positional deviation) The corrected correction amount (-x1, -y1) is used to correct (compensate) the position information (first position information) of the arbitrary block region 1c as the measurement object. According to the correction amount (-x1, -y1), the virtual cutting line of the block region group 1c' (or the block region 1c) is cut, whereby a plurality of packages 5 can be formed.

Further, when the movement (positional shift) in the θ-axis direction occurs in the block region 1c, it can be detected based on the difference in the amount of movement between the plurality of second alignment marks 1f. Movement in the θ-axis direction (rotational offset). In this case, if the second alignment mark 1f is set in advance at each of the positions facing the diagonal of the block region 1c, the movement (positional shift) in the θ-axis direction can be detected with high accuracy. In this case, the block region 1c as the measurement object is rotated by the required movement amount in the θ-axis direction by the cutting table 17a (17b) on which the block region 1c is placed, whereby the block region 1c can be The position information (first position information) is corrected. Therefore, a plurality of packages 5 can be formed by cutting the virtual cutting line of the block region 1c.

The second alignment step S3 is constituted by the second pre-alignment determination step S3a, the second alignment post-measurement step S3b, and the alignment correction step S3c. The information relating to the position of the block region 1c corrected by the second alignment step S3 will hereinafter be referred to as second alignment information.

Next, the position correction amount (Ax) of the block region 1c in the alignment correction step S3c is compared with a preset threshold value (Th), and when the position correction amount (Ax) is equal to or greater than the threshold value (Th) (Ax Th), the control section E judges that the offset exceeds the expectation and some error occurs when the block area is divided into the step S4. On the other hand, when the position correction amount (Ax) is smaller than the threshold (Th) (Ax < Th), the control unit E determines that the block region division step S4 is normally performed (error determination step S7).

When it is determined that there is an error in the error determination step s7, the control unit E displays the notification processing such as the display on the display unit (not shown) of the substrate cutting device 9 to cause the operator of the substrate cutting device 9 to perform error processing. Waiting until the result of the selection of the processing by the operator who received the notification is input to the input unit (not shown) of the substrate cutting device 9 (error processing selection step S8). In the error handling selection step S8, it is selected whether or not to perform recovery.

When the control unit E confirms that the operator has selected to perform the restoration in the error processing selection step S8, the control unit E returns to the second alignment late measurement step after performing the predetermined restoration step S9. S3b continues processing. As the restoration step S9, the following processing can be cited as an example. That is, the control unit E determines that the error originates from the failure to accurately detect the second alignment mark 1f, and re-attaches the additional lead terminal portion 1g or the boss portion (for example, an adjacent additional lead terminal portion or boss portion). After the second alignment mark 1f is set again, the process returns to the second alignment late measurement step S3b to continue the process.

Further, in order to carry out the recovery step S9, in the second pre-alignment measurement step S3a, it is necessary to set the position information of the lead terminal portion 1g or the like which is expected to be set again to the second alignment mark 1f in the restoration step S9 as the second pair. Pre-recorded with the alternate information of the mark 1f.

When the control unit E confirms that the operator has not selected to perform the restoration in the error processing selection step S8, the control unit E ends the series of substrate cutting processes. In addition, when the substrate cutting process is completed, after the removal step S10 of the cut substrate 1 that has been performed by the manual operation of the operator is performed, the process ends.

On the other hand, when the control unit E determines in the error determination step S7 that there is no error, the correction amount in the position information (second alignment information) of each block region 1c specified in the second alignment step S3. After storing as a future reference material (correction amount recording step S11), the subsequent block area cutting step S12 is performed.

In the block area cutting step S12, as shown in FIG. 7, after the virtual cut line 4c along the longitudinal direction thereof is set in the block area group 1c', the virtual cut line 4c is set along the set, and the first virtual cut line 4c is used. The cutting means 28 and the second cutting means 29 cut each of the block regions 1c into a narrow rectangular shape.

Further, as shown in Fig. 8, after the virtual cutting line 4d along the short side direction of the block region group 1c' is set, the first cutting means is used along the set virtual cutting line 4d. 28. The second cutting means 29 further cuts off each of the block regions 1c. Thereby, a plurality of packages 5 are arranged in alignment on the mounting surfaces 20a and 20b of the first cutting table 17a and the second cutting table 17b. The above processing is the block area cutting step S12.

Next, the first cutting table 17a and the second cutting table 17b on which the respective packages 5 are placed are moved from the substrate cutting position 25 to the substrate mounting position 24. At this time, the package 5 placed on the first cutting table 17a and the second cutting table 17b is cleaned and dried by the cleaning unit 30 (washing step S13, drying step S14). Further, at the substrate mounting position 24, the package 5 that has been placed on the first cutting table 17a and the second cutting table 17b (cut and cleaned) is locked and transferred to the package inspection means C. (Package Transfer Step S15).

Further, in the present embodiment, a rectangular (for example, rectangular) cutting table and a rectangular (for example, rectangular) shaped substrate have been described as an example. However, in the present invention, various shapes of cutting work can be used. Table and shaped substrates of various shapes.

The substrate loading portion 41 and the push-out member 42 of the formed substrate 1 are pushed out from the substrate loading portion 41. Therefore, the molded substrate 1 is pushed out from the substrate loading portion 41 by the push-out member 42, and the formed substrate 1 can be supplied to the substrate alignment mechanism portion 11 (substrate supply table 13) in the substrate cutting device B.

Further, in the package inspection means C, a package supply unit 43 is provided, and each package 5 cut by the substrate cutting means B is supplied; and the package inspection unit 44 supplies each package from the package supply unit 43. The body 5 is inspected; the inspection camera 45 is used to inspect each package 5 in the package inspection unit 44; and the package screening means 46 is used to package the package 5 after passing through the package inspection unit 44 and the inspection camera 45. Screened according to the qualified product and the non-conforming product, and transferred to the package receiving means D. Therefore, in the package inspection means C, In the package inspection unit 44, each of the packages 5 supplied from the substrate cutting means B to the package supply unit 43 is inspected by the inspection camera 45, whereby the package selection means 46 can be used to pass the quality and fail. The product is screened and transferred to the package housing means D.

As shown in FIG. 1, the package storage means D is provided with a good product tray 47 for accommodating a good product and a defective product tray 48 for accommodating a defective product. Therefore, in the package housing means D, the package 5 which is inspected by the package inspection means C as a good product can be accommodated in the good product tray 47 by the package selection means 46, and the package selection means 46 will be checked as The package 5 of the defective product is stored in the defective product tray 48.

Since the area of each of the block regions 1c cut out from the formed substrate 1 is considerably smaller than the area of the entire substrate 1 to be formed, each block region 1c is bent as compared with the force for bending the formed substrate 1 back. The force of the return is reduced, and the gap between the first cutting table 17a, the second cutting table 17b, and the lower surface of the resin molded body 3 of the block region 1c can be made the same as that on the package substrate 1. The size is smaller than that. Therefore, the attraction force to each block region 1c can be efficiently increased as compared with the structure in which the entire formed substrate 1 is attracted. Further, when the block region 1c is adsorbed and fixed to the first cutting table 17a and the second cutting table 17b, the adsorption fixing force for each block region 1c can be efficiently increased.

In addition, since the adsorption fixing force to each of the block regions 1c can be efficiently increased, it is possible to effectively prevent the block region 1c from being cut when the first cutting device 28 and the second cutting device 29 are cut. The defective package 5 is cut off by the cutting force and flies out to the surroundings.

Further, since the dimensional accuracy of the package 5 can be improved efficiently, and the package 5 can be prevented from flying out from the cut portion when the cutting is performed, it is possible to prevent the first When the cutting means 28 and the second cutting means 29 are broken (broken blade or the like), the life is prolonged, and the productivity of the product is improved.

Further, according to the present invention, the following effects can be obtained. In other words, according to the substrate cutting method using the substrate cutting device 9, the step of cutting out the package 5 from the formed substrate 1 is divided into a block region dividing step S4 and a block region cutting step S12. Therefore, when the block region cutting step S12 of the package 5 is started, the formed substrate 1 is separated into each of the block regions 1c, whereby the cutting of the package 5 can be reduced as much as possible. The effect of substrate bending during the process.

However, in order to cope with the miniaturization of the package 5 which is accompanied by the recent miniaturization of the electronic device, it is necessary to further improve the package cutting accuracy. In the present invention, attention is paid to the minute movement (positional shift) of the block region 1c generated before and after the block region dividing step S4, and the positional offset is corrected with high precision, thereby improving the package cutting accuracy.

In order to correct the positional shift of the block area 1c, it is considered that the position of the first alignment mark 1e is measured again after the block area dividing step S4 is performed, and the position measurement result of the second first alignment mark 1e is determined based on The position measurement result of the first first alignment mark 1e specifies the position after the positional shift of each block area 1c, and the block area is based on the position information of each block area 1c after the specific positional shift 1c cuts out the package 5.

However, since the first alignment mark 1e is formed in the end material region 1d which is removed by the block region dividing step S4, in addition to, for example, the case where the cut end material region 1d remains on the cutting table, It is impossible to measure the position of the first alignment mark 1e again after performing the block region dividing step S4. Further, the first alignment mark 1e is an unnecessary structure for the package 5 as a product, and thus it is difficult to form it other than the cut-off end material region 1d. Substrate area.

Therefore, in the present invention, after the second alignment mark 1f composed of the original internal structure such as the lead terminal portion 1g is set in each of the block regions 1c, the block region is divided into the second set before and after the step S4. The position of the alignment mark 1f is measured and the measurement result is compared, and based on the comparison result, the position information (first alignment information) of the block area 1c obtained by measuring the first alignment mark 1e is corrected. Thereby, the error between the first alignment information (position information of each block region 1c) and the position of the actual block region 1c due to the block region dividing step S4 is performed with high precision (positional deviation) After the correction is performed, the package 5 can be cut out with high precision from each of the block regions 1c.

Further, the positional shift of the block region 1c is not uniform in each of the block regions 1c, and the positional shift amount varies depending on the position of each of the block regions 1c of the formed substrate 1. On the other hand, in the present invention, since the second alignment mark 1f is set in each of the block regions 1c, it is possible to calculate the positional shift correction amount which is most suitable for each of the block regions 1c.

Further, due to the cutting method or the like, there is a case where the block region 1c not only has a positional shift of the plane but also a positional shift in the rotational direction, so that a stereoscopic positional shift occurs. In this regard, in the present invention, since a plurality of second alignment marks 1f are set in each of the block regions 1c (preferably at least a pair of second alignment marks 1f are set on the diagonal), not only the direction along the plane The positional shift is also possible, and the positional shift along the rotational direction can also be corrected with high precision. Furthermore, it is also possible to correct the positional shift of the solid.

Further, in each of the above-described embodiments, the configuration in which the molded substrate 1 is cut by using the first cutting means 28 and the second cutting means 29 (two blades) is exemplified, but the present invention uses one cut. The structure of the means (blade) can also be employed. When by means of a cut When the formed substrate 1 is cut, the above-described positional shift in the rotational direction is apt to occur in the block region 1c after the cutting. Therefore, if the present invention is implemented in this configuration, a more excellent effect can be obtained.

Further, in each of the above-described embodiments, the structure in which the resin molded body side of the formed substrate 1 is suctioned and fixed is exemplified, but the present invention is such that the substrate main body side of the formed substrate 1 faces downward. The state in which the state is adsorbed and fixed can also be employed.

The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately changed or selectively employed as needed within the scope of the gist of the invention.

Claims (13)

A substrate cutting method for forming a substrate having a block region in which a plurality of package-shaped electronic components are formed and an end material region having a first alignment mark disposed around the block region, first by aligning the substrate a first alignment mark and cutting the formed substrate to form the block region, and then forming the package-like electronic component by cutting the block region, comprising: a block region in the formed substrate a step of setting a second alignment mark; detecting the second alignment mark to obtain the first detected position information when aligning the first alignment mark; and forming a block area formed by cutting the formed substrate And performing the step of detecting the second alignment mark to obtain the second detection position information; and comparing and correcting the first detection position information and the second detection position information, thereby setting the cutting in the block area a step of breaking the position; and a step of cutting the cut position set by the comparison and correction. A substrate cutting method for cutting out a package-like electronic component from a formed substrate having a plurality of package-shaped electronic components and a formed substrate having a first alignment mark and disposed around the block region The method includes a first alignment step of detecting a position of the first alignment mark of the formed substrate, and specifying a position of the formed substrate according to the detected position information of the first alignment mark a position and a position of the block area; a block area dividing step of cutting the formed substrate from the information of the position of the formed substrate and the position of the block area specified in the first alignment step End material area and Separating the block area; a second alignment step, after the second alignment mark is preset in the block area of the formed substrate, the set of the second alignment mark is set before and after the block area dividing step Detecting and comparing the positions, correcting the position of the block region specified in the first alignment step according to the comparison result; and encapsulating the body-shaped electronic component dicing step according to the second alignment step The corrected information of the position of the block area is divided into the package-shaped electronic parts from the block area. In the substrate cutting method according to claim 1 or 2, an arbitrary internal structure located in the block region is set as the second alignment mark. The substrate cutting method according to claim 3, wherein the internal structure is a lead terminal portion or a convex portion located in the block region. The substrate cutting method according to claim 1 or 2, wherein the internal structure located on the diagonal of the block region is set as the second alignment mark. A substrate cutting device is provided with a formed substrate having an end material region having a first alignment mark disposed around a block region in which a plurality of package-shaped electronic components are formed, and the package-shaped electronic component is cut out, characterized in that Having a first alignment mechanism, a second alignment mechanism, and a cutting means for detecting a position of the first alignment mark of the formed substrate, according to the detected first alignment Marking position information, specifying a position of the formed substrate and a position of the block region, the cutting means cutting the end material region from the formed substrate by using the first alignment mechanism and cutting out the block region, After the second alignment mark is preset in the block region of the formed substrate, the first alignment mechanism is aligned to the second alignment of the formed substrate before the block region cutting process by the cutting means The position of the mark is detected, and after the second alignment mark is preset in the block area of the formed substrate, the second alignment mechanism is formed after the block area cutting process by the cutting means Re-detecting the position of the second alignment mark of the substrate, and detecting the position of the second alignment mark detected before the block area cutting process and the second pair detected after the block area cutting process Comparing the positions of the quasi-marks, correcting the position of the block area specified by the first alignment mechanism according to the comparison result, and the cutting means is further based on the block area corrected by the second alignment mechanism The location information, the packaged electronic parts are cut out from the block area. The substrate cutting device of claim 6, wherein any internal structure located in the block region is set as the second alignment mark. The substrate cutting device according to claim 7, wherein the internal structure is a lead terminal portion or a convex portion located in the block region. The substrate cutting device according to any one of claims 6 to 8, wherein the internal structure located on the diagonal of the block region is set as the second alignment mark. A substrate cutting method for forming a substrate having a block region in which a plurality of package-shaped electronic components are formed and an end material region provided around the block region, first, by cutting the formed substrate to form the block a region, and then forming the package-like electronic component by cutting the block region, comprising: a step of setting an alignment mark in the block region of the formed substrate; Detecting the alignment mark to obtain the first detected position information; cutting the formed substrate according to the first detected position information, thereby forming the block area; the alignment mark of the cut block area Performing a step of detecting the second detected position information; and comparing the first detected position information with the second detected position information and correcting, thereby setting a cut position in the block area; This is performed by comparing and correcting the set cutting position to perform cutting. According to the substrate cutting method of claim 10, any internal structure located in the block region is set as the alignment mark. The substrate cutting method according to claim 11, wherein the internal structure is a lead terminal portion or a convex portion located in the block region. The substrate cutting method according to any one of claims 10 to 12, wherein the internal structure located on the diagonal of the block region is set as the alignment mark.