CN107210206B - Cutting device and method for manufacturing multiple products by cutting cut object - Google Patents

Cutting device and method for manufacturing multiple products by cutting cut object Download PDF

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Publication number
CN107210206B
CN107210206B CN201680008290.1A CN201680008290A CN107210206B CN 107210206 B CN107210206 B CN 107210206B CN 201680008290 A CN201680008290 A CN 201680008290A CN 107210206 B CN107210206 B CN 107210206B
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cutting
cut
jig
sealed substrate
marks
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CN107210206A (en
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传藤胜则
石桥幹司
白井克昌
望月启人
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Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)

Abstract

A cutting jig (9) on which a 1 st mark (17) is formed is attached to a cutting table (8). The 1 st mark (17) corresponds to the 2 nd mark (4) formed on the sealed substrate (1). The position (1 st coordinate position) of the 1 st mark (17) is measured in advance and stored. The sealed substrate (1) is placed on a cutting jig (9), and the position of the 2 nd mark (2 nd coordinate position) is measured. The 1 st coordinate position and the 2 nd coordinate position are compared to calculate the amount of displacement of the sealed substrate (1). The sealed substrate (1) is lifted from the cutting jig (9), the sealed substrate (1) is moved by the amount of deviation, and the sealed substrate (1) is placed on the cutting jig (9) again. Thus, the position of the cutting line of the sealed substrate (1) can be accurately aligned with the position of the cutting groove of the cutting jig (9), and the sealed substrate (1) can be cut along the cutting line located on the cutting groove.

Description

Cutting device and method for manufacturing multiple products by cutting cut object
Technical Field
The present invention relates to a cutting apparatus and a cutting method for manufacturing a plurality of products obtained by cutting an object to be cut into individual pieces.
Background
A substrate formed by virtually dividing a substrate including a printed circuit board, a lead frame, and the like into a plurality of grid-like regions, mounting 1 or more chip-like elements (e.g., semiconductor chips) in each region, and resin-sealing the entire substrate is referred to as a sealed substrate. The sealed substrate is cut by a cutting mechanism using a rotary knife or the like, and a member formed as a single piece in each area unit is a product.
Conventionally, a cutting device is used to cut a predetermined region of a sealed substrate by a cutting mechanism such as a rotary knife. The BGA (Ball Grid Array Package) product is cut in the following manner, for example. First, the sealed substrate is placed on a cutting table. Next, the sealed substrate is aligned (aligned). The positions of virtual cutting lines for dividing a plurality of regions are set by alignment. Then, the cutting mechanism and the cutting table on which the sealed substrate is placed are relatively moved. Cutting water is sprayed to the cutting portion of the sealed substrate, and the sealed substrate is cut along a cutting line set on the sealed substrate by a cutting mechanism. A product formed into a single piece by cutting the sealed substrate is manufactured.
A cutting jig corresponding to the product is attached to the cutting table. The sealed substrate is placed on and adsorbed to the cutting jig. The cutting jig includes a metal plate and a resin sheet fixed to the metal plate. The resin sheet is provided with a plurality of mesa-shaped protrusions for respectively attracting and holding a plurality of regions of the sealed substrate. The plurality of protrusions are provided with suction holes penetrating the resin sheet and the metal table from the surface of the protrusion, respectively. A plurality of cutting grooves are formed between the protruding portions, and the cutting grooves correspond to positions of a plurality of cutting lines for dividing each region of the sealed substrate. The sealed substrate is cut along a plurality of cutting lines by relatively moving the cutting table and the cutting mechanism, thereby forming individual pieces.
When cutting the sealed substrate, the cutting line of the sealed substrate is aligned with the position of the cutting groove of the cutting jig mounted on the cutting table, and the sealed substrate is cut. The sealed substrate is cut by moving the rotary knife along the cutting line. When the sealed substrate is cut in a state where the position of the cutting groove of the cutting jig is deviated from the position of the cutting line of the sealed substrate, the rotary cutter may cut off a part of the resin sheet by deviating from the position of the cutting groove. A large amount of dust is generated by cutting off the resin sheet. When the periphery of the projection is cut off and leakage occurs in the suction hole, it is difficult to suck the sealed substrate or the product formed as a single piece. Further, the life of the cutting jig is shortened, and the operating cost of the cutting apparatus increases when the cutting jig is frequently replaced. Therefore, it is important to accurately align the position of the cutting line of the sealed substrate with the position of the cutting groove of the cutting jig and perform cutting.
As a cutting device capable of performing position detection with high accuracy, there is proposed a cutting device including: a conveying mechanism for lifting the electronic circuit board from the supply part and inverting the electronic circuit board on the cutting worktable; and a cutting unit that cuts the electronic circuit board placed on the cutting table into the electronic circuits, wherein the conveying mechanism includes a positioning member that positions the electronic circuit board (see, for example, paragraph [0009], fig. 1, and fig. 2 of patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2005-353723
Disclosure of Invention
Problems to be solved by the invention
However, the cutting device 1 disclosed in patent document 1 has the following problems. As shown in fig. 1 and 2 of patent document 1, the transport mechanism 24 has a grip 25 at the tip, and includes a robot arm and an XYZ-stage. The workpiece 6 is transferred from the supply table 15 to the cutting table 28 by the gripping portion 25. The grip portion 25 includes a grip plate 25a, a suction plate 25c, a positioning pin (a part of a positioning member) 25d, a spring 25e, and the like. The positioning pin 25d is used to cause the gripping portion 25 to grip the workpiece 6 while positioning the workpiece 6. A positioning hole (a part of a positioning member) 6c is formed in the workpiece 6 at a position corresponding to the positioning pin 25 d. The positioning hole 6c is a circular hole formed to have a diameter substantially identical to that of the positioning pin 25 d.
In the conveying mechanism 24, the workpiece 6 is sucked to the holding plate 25a by air suction while positioning the positioning pins 25d provided to the holding plate 25a by being inserted into the positioning holes 6c of the workpiece 6. Thus, it is necessary to form four positioning holes 6c in the workpiece 6. Since the four positioning holes 6c are formed on all the workpieces 6 to be cut, effort and cost for forming the positioning holes 6c become enormous. The following disadvantages also arise: if the positioning pins 25d and the positioning holes 6c are not formed with high accuracy, the workpiece 6 cannot be positioned.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a cutting device and a cutting method capable of accurately aligning the position of a cutting line of a sealed substrate with the position of a cutting groove of a cutting jig in the cutting device.
Means for solving the problems
In order to solve the above problems, a cutting device of the present invention is used when a plurality of products are manufactured by cutting an object to be cut along a plurality of cutting lines, the cutting device including: a cutting jig having a plurality of 1 st marks and a plurality of cutting grooves; a cutting mechanism for cutting the object to be cut which is placed on the cutting jig and has a plurality of 2 nd marks along a plurality of cutting lines; a conveying mechanism for conveying the object to be cut; and a moving mechanism for moving the cutting jig and the cutting mechanism relative to each other, wherein the cutting device includes: an imaging means for imaging a plurality of 1 st marks and a plurality of 2 nd marks; and a control unit for aligning the cutting jig with the object to be cut placed on the cutting jig by the conveying mechanism, wherein the control unit compares 1 st position information and 2 nd position information to calculate a deviation amount indicating a positional deviation between the cutting jig and the object to be cut, the 1 st position information includes position information of a specific 1 st mark measured based on image data acquired by the imaging unit and stored in advance, the 2 nd position information includes position information of a specific 2 nd mark measured by the imaging unit, the conveying mechanism lifts the object to be cut from the cutting jig, moves the conveying mechanism and the cutting jig relative to each other based on the deviation amount to move the object to a target position corresponding to the deviation amount, and thereafter, the conveying mechanism places the object to be cut again on the cutting jig to move the object to the target position, the cutting mechanism cuts the object to be cut placed again along the plurality of cutting lines by aligning the positions of the plurality of cutting grooves with the positions of the plurality of cutting lines.
In the cutting device of the present invention, at least a part of the cutting assistance member included in the cutting mechanism or at least a part of the cutting assistance member supplied from the cutting mechanism passes through the cutting groove corresponding to the cutting line being cut among the plurality of cutting lines.
The cutting apparatus of the present invention is characterized in that the conveying mechanism is configured to move the object to be cut to the target position in at least 1 of the X direction, the Y direction, and the θ direction by relatively moving the conveying mechanism and the cutting jig, and then the conveying mechanism is configured to place the object to be cut again on the cutting jig.
The cutting device of the present invention is characterized in that at least 2 specific 1 st marks are set in the 1 st direction and the 2 nd direction orthogonal to the 1 st direction in a plan view, and at least 2 specific 2 nd marks are set in the 1 st direction and the 2 nd direction orthogonal to the 1 st direction in a plan view.
The cutting apparatus of the present invention is characterized in that the object to be cut is a sealed substrate or a divided sealed substrate in addition to the above-described cutting apparatus.
In the cutting apparatus of the present invention, the object to be cut is a substrate on which functional elements are formed in a plurality of regions corresponding to the plurality of products, respectively.
In order to solve the above problems, a cutting method according to the present invention includes the steps of: preparing a cutting jig having a plurality of cutting grooves and a plurality of 1 st marks; preparing a cut object having a plurality of cutting lines and a plurality of 2 nd marks; placing the object to be cut on the cutting jig by the conveying mechanism; and cutting the object to be cut along a plurality of cutting lines by using the cutting mechanism by relatively moving the cutting jig and the cutting mechanism, characterized in that the cutting method comprises the steps of: shooting a specific 1 st mark in the 1 st marks by utilizing shooting components to acquire 1 st image data; performing image processing based on the 1 st image data to thereby acquire 1 st position information including position information of a specific 1 st mark; shooting a specific 2 nd mark in the plurality of 2 nd marks by utilizing a shooting component to obtain 2 nd image data; performing image processing based on the 2 nd image data to acquire 2 nd position information including position information of a specific 2 nd mark; comparing the 1 st position information with the 2 nd position information to calculate a deviation amount indicating a positional deviation between the cutting jig and the object to be cut; a conveying mechanism for lifting the cut object from the cutting clamp; moving the object to be cut to a target position corresponding to the deviation amount by relatively moving the conveying mechanism and the cutting jig based on the deviation amount; and a conveying mechanism for placing the object to be cut on the cutting jig again, wherein in the step of moving the object to be cut, the positions of the plurality of cutting grooves are aligned with the positions of the plurality of cutting lines by moving the object to be cut to the target position, and in the step of cutting the object to be cut, the object to be cut placed again is cut.
In the cutting method of the present invention, in the step of cutting the object to be cut, at least a part of the cutting assistance member included in the cutting mechanism or at least a part of the cutting assistance member supplied from the cutting mechanism is passed through the cutting groove corresponding to the cutting line being cut among the plurality of cutting lines.
In the cutting method of the present invention, in the step of moving the object to be cut, the conveying mechanism and the cutting jig are relatively moved, so that the object to be cut is moved to the target position in at least 1 of the X direction, the Y direction, and the θ direction.
The cutting method of the present invention is the cutting method described above, and the cutting method includes: setting at least 2 specific 1 st marks among the 1 st marks in a 1 st direction and a 2 nd direction orthogonal to the 1 st direction in a plan view; at least 2 specific 2 nd marks among the plurality of 2 nd marks are set in a 1 st direction and a 2 nd direction orthogonal to the 1 st direction in a plan view.
In the cutting method of the present invention, the object to be cut is a sealed substrate or a divided sealed substrate.
In the cutting method of the present invention, in addition to the above-described cutting method, the object to be cut is a substrate on which functional devices are formed in a plurality of regions corresponding to the plurality of products, respectively.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a cutting device includes: a cutting jig having a plurality of 1 st marks and a plurality of cutting grooves; a cutting mechanism for cutting the object to be cut which is placed on the cutting jig and has a plurality of 2 nd marks along a plurality of cutting lines; a conveying mechanism for conveying the object to be cut; a moving mechanism for relatively moving the cutting jig and the cutting mechanism; an imaging means for imaging a plurality of 1 st marks and a plurality of 2 nd marks; and a control unit for aligning the object to be cut with the cutting jig. The 1 st position information measured by the imaging means and stored in advance and the 2 nd position information measured by the imaging means are compared to calculate the amount of deviation between the cutting jig and the object to be cut. The conveying mechanism and the cutting jig are relatively moved based on the offset amount, and the object to be cut is moved to the target position. Therefore, the rotary knife arranged on the cutting mechanism can accurately cut the object along the cutting line without deviating from the position of the cutting groove of the cutting clamp.
Drawings
Fig. 1A is an overview of a sealed substrate used in example 1 of the cutting apparatus of the present invention, and is a plan view seen from the substrate side.
Fig. 1B is an overview of a sealed substrate used in example 1 of the cutting apparatus of the present invention, and is a front view seen from the substrate side.
Fig. 2A is an overview view showing a cutting jig corresponding to the sealed substrate shown in fig. 1A and 1B, and is a plan view.
Fig. 2B is an overview view showing the cutting jig corresponding to the sealed substrate shown in fig. 1A and 1B, and is a schematic cross-sectional view taken along the line a-a.
Fig. 3A is an overview of a cutting jig in example 2 of the cutting apparatus of the present invention, and is a plan view.
Fig. 3B is an overview of a cutting jig in example 2 of the cutting apparatus of the present invention, and is a schematic cross-sectional view taken along line B-B.
Fig. 4 is a plan view schematically showing a cutting apparatus in example 3 of the cutting apparatus of the present invention.
Fig. 5A is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table using the 1 st mark provided on a cutting jig.
Fig. 5B is a schematic cross-sectional view showing a process of placing the sealed substrate on the cutting table using the 1 st mark provided on the cutting jig.
Fig. 5C is a schematic cross-sectional view showing a process of placing the sealed substrate on the cutting table using the 1 st mark provided on the cutting jig.
Fig. 5D is a schematic cross-sectional view showing a process of placing the sealed substrate on the cutting table using the 1 st mark provided on the cutting jig.
Fig. 5E is a schematic cross-sectional view showing a process of placing the sealed substrate on the cutting table using the 1 st mark provided on the cutting jig.
Fig. 6A is an overview diagram showing a state in which a sealed substrate placed on a cutting table in a deviated state is corrected for the amount of deviation and placed at a normal position, and is a plan view showing a state in which the sealed substrate is deviated.
Fig. 6B is an overview diagram showing a state in which the sealed substrate placed on the cutting table in a deviated state is corrected for the deviation amount and placed at a normal position, and is a plan view showing a state in which the sealed substrate is placed at a normal position.
Fig. 7A is an overview of a large sealed substrate used in example 4 of the cutting apparatus of the present invention, and is a plan view seen from the substrate side.
Fig. 7B is an overview diagram showing a large sealed substrate used in example 4 of the cutting apparatus of the present invention, and is a plan view showing a state in which the large sealed substrate is divided into four equal parts.
Fig. 8 is a plan view showing a state in which the divided sealed substrates are placed on the cutting table.
Detailed Description
As shown in fig. 2A and 2B, in the cutting apparatus, a cutting jig 9 corresponding to a product is attached to a cutting table 8. The resin sheet 11 of the cutting jig 9 is provided with 1 st marks 17A, 17B, … … (hereinafter collectively referred to as "1 st mark 17" as appropriate, and the same applies to other constituent elements) made up of a plurality of alignment marks. 1 st marks 17A, 17B, and … … are provided corresponding to 2 nd marks 4A, 4B, and … … formed on sealed substrate 1 and each including a plurality of alignment marks. On the cutting table 8, the coordinate position of the 1 st mark 17 formed on the resin sheet 11 is measured, and the coordinate position as a reference is stored in advance. The coordinate position of the reference is compared with the coordinate position of the 2 nd mark 4 of the sealed substrate 1 placed on the cutting table 8 and measured, and the amount of displacement of the sealed substrate 1 is calculated. By correcting the deviation amount, the position of the 2 nd mark 4 of the sealed substrate 1 can be accurately aligned with the position of the 1 st mark 17 of the cutting jig 9. Therefore, the positions of the plurality of cutting lines set on the sealed substrate 1 can be accurately aligned with the positions of the plurality of cutting grooves provided in the cutting jig 9. Thus, the sealed substrate 1 can be accurately cut along the cutting line without the rotary blade provided in the cutting mechanism deviating from the position of the cutting groove of the cutting jig 9.
Example 1
Embodiment 1 of the cutting device of the present invention will be described with reference to fig. 1A, 1B, 2A, and 2B. All the drawings in the specification of the present invention are appropriately omitted or exaggerated and schematically depicted for the convenience of understanding. The same components are denoted by the same reference numerals, and description thereof is omitted as appropriate.
As shown in fig. 1A and 1B, the sealed substrate 1 includes a substrate 2 including a printed circuit board, a lead frame, and the like, a plurality of chip-like components (not shown) mounted in a plurality of regions (described later) of the substrate 2, and a sealing resin 3 formed to collectively cover the plurality of regions. The sealed substrate 1 is a cut object that is cut into individual pieces at last.
As shown in fig. 1A, a plurality of 2 nd marks 4A, 4B, … … (marks represented by + in the drawing) are formed on the sealed substrate 1 in the longitudinal direction and the short side direction of the substrate 2. The 2 nd mark 4 is arbitrarily set according to the size and the number of the products. The 2 nd mark 4 is photographed by a camera (not shown) for alignment, and the measurement coordinate position is recognized by an image. By measuring the coordinate position, alignment of the sealed substrate 1 is performed. The alignment usually uses 2 nd mark 4 formed at 4 corners of sealed substrate 1. In fig. 1A, 8 2 nd marks 4 formed at 4 corners of the sealed substrate 1 are denoted by 4A, 4B, … …, 4G, and 4H, respectively, in the counterclockwise direction with the upper left of the sealed substrate 1 as a base point.
The 2 nd marks 4 formed to face each other in the longitudinal direction and the lateral direction of the sealed substrate 1 are connected to each other, and a plurality of 1 st cutting lines 5 extending in the lateral direction and a plurality of 2 nd cutting lines 6 extending in the longitudinal direction are virtually set. A plurality of regions 7 surrounded by the plurality of 1 st cutting lines 5 and the plurality of 2 nd cutting lines 6 correspond to products respectively obtained by being formed as a single piece. In fig. 1A, for example, 7 1 st cutting lines 5 are set in the short direction, and 4 2 nd cutting lines 6 are set in the longitudinal direction. Therefore, 3 regions 7 are formed in the short side direction, 6 regions 7 are formed in the longitudinal direction, and 18 regions 7 are formed in a lattice shape in total. The region 7 formed on the sealed substrate 1 is arbitrarily set according to the size and number of products to be singulated.
As shown in fig. 2A and 2B, the cutting table 8 is a table for cutting the sealed substrate 1 into individual pieces in a cutting device. A cutting jig 9 corresponding to a product is attached to the cutting table 8. The cutting jig 9 includes a metal plate 10 and a resin sheet 11 fixed to the metal plate. The resin sheet 11 needs to have appropriate flexibility to alleviate mechanical impact. Preferably, the resin sheet 11 is formed of, for example, a silicone resin, a vinyl fluoride resin, or the like. The cutting table 8 is shared by a plurality of products, and only the cutting jig 9 is replaced in accordance with the product.
The resin sheet 11 of the cutting jig 9 is provided with a plurality of mesa-shaped projections 12 for holding the plurality of regions 7 on the sealed substrate 1 by suction. The cutting jig 9 is provided with a plurality of suction holes 13 penetrating the resin sheet 11 and the metal plate 10 from the surfaces of the plurality of projections 12, respectively. The plurality of suction holes 13 are connected to a space 14 provided in the cutting table 8. The space 14 is connected to a suction mechanism (not shown) provided outside.
A plurality of 1 st cutting grooves 15 and a plurality of 2 nd cutting grooves 16 are provided between the protrusions 12 so as to correspond to the plurality of 1 st cutting lines 5 and the plurality of 2 nd cutting lines 6 that define the plurality of regions 7 of the sealed substrate 1 shown in fig. 1A and 1B, respectively. The 1 st cutting grooves 15 are formed along the short side direction of the resin sheet 11 (cutting jig 9), and the 2 nd cutting grooves 16 are formed along the longitudinal direction of the resin sheet 11 (cutting jig 9). The space outside the projection 12 formed on the outermost periphery of the resin sheet 11 has the same function as the cutting groove with respect to the 1 st cutting line 5 and the 2 nd cutting line 6 provided at the outermost end of the sealed substrate 1. The depth (distance from the upper surface of the protrusion 12 to the inner bottom surface of the groove) of the 1 st cutting groove 15 and the 2 nd cutting groove 16 is set to about 0.5mm to 1.0 mm.
In example 1, the cutting jig 9 was not provided with cutting grooves corresponding to the 1 st cutting line 5 and the 2 nd cutting line 6 set at the end portions of the sealed substrate 1. The present invention is not limited to this, and the cutting jig 9 may be provided with cutting grooves corresponding to the 1 st cutting line 5 and the 2 nd cutting line 6 set at the end portions. In this case, a dummy protrusion is further provided so as to surround the outer periphery of the protrusion 12.
As shown in fig. 2A, a plurality of 1 st marks 17A, 17B, … … (marks represented by + in the drawing) are formed on the resin sheet 11 in the longitudinal direction and the short-side direction, corresponding to the positions of the 2 nd mark 4 (see fig. 1A) formed on the sealed substrate 1. For example, 1 st marks 17A, 17B, … …, 17G, and 17H are formed at 4 corners of the resin sheet 11 in accordance with the coordinate positions of 2 nd marks 4A, 4B, … …, 4G, and 4H provided at 4 corners of the sealed substrate 1. In addition, the 1 st mark 17 is formed in a required number in the longitudinal direction and the short side direction corresponding to the 2 nd mark 4 formed on the sealed substrate 1. For example, in fig. 2A, 21 st marks 17 are further formed in the longitudinal direction. 21 st marks 17 are formed between the 1 st mark 17A and the 1 st mark 17H formed in the longitudinal direction, and 21 st marks 17 are formed between the 1 st mark 17D and the 1 st mark 17E.
The operation of positioning the sealed substrate 1 by placing it on the cutting jig 9 will be described with reference to fig. 1A, 1B, 2A, and 2B. On the cutting table 8, a cutting jig 9 is attached to the cutting table 8, and the sealed substrate 1 is placed on the cutting jig 9. Therefore, the positional information of the 1 st mark 17 formed on the resin sheet 11 of the cutting jig 9 and the positional information of the 2 nd mark 4 formed on the sealed substrate 1 can be measured as the positional information (coordinate position) on the cutting table 8.
First, the 1 st mark 17 formed on the resin sheet 11 is photographed by an alignment camera (not shown) in a state where the sealed substrate 1 is not placed on the cutting jig 9, and image data is acquired. Image recognition is performed based on the image data, thereby measuring the coordinate position of the 1 st mark 17. The measured coordinate position of the 1 st mark 17 is stored in advance as a reference coordinate position on the cutting table 8. For example, the coordinate positions of the 8 1 st marks 17A, 17B, … …, 17G, 17H formed at the 4 corners of the resin sheet 11 are stored in advance.
Next, the sealed substrate 1 is placed on the cutting jig 9 by using a conveying mechanism (not shown). The 2 nd mark 4 formed on the sealed substrate 1 is imaged in a state where the sealed substrate 1 is placed on the cutting jig 9, and image data is acquired. Image recognition is performed based on the image data, thereby measuring the coordinate position of the 2 nd mark 4. For example, the coordinate positions of the 8 2 nd marks 4A, 4B, … …, 4G, 4H formed at the 4 corners are measured. The measured coordinate position of the 2 nd mark 4 is compared with the coordinate position of the 1 st mark 17 stored in advance. This makes it possible to calculate the amounts of displacement in the X direction, the Y direction, and the θ direction of the sealed substrate 1.
Then, the deviation amount is corrected based on the calculated deviation amount. Specifically, first, the sealed substrate 1 is lifted up from the cutting jig 9 by a conveyance mechanism (not shown), and the sealed substrate 1 is held by the conveyance mechanism. Next, in a state where the sealed substrate 1 is held by the conveyance mechanism without placing the sealed substrate 1 on the cutting jig 9, the conveyance mechanism is moved by an appropriate amount based on the deviation amount in at least 1 of the X direction, the Y direction, and the θ direction. By moving the conveying mechanism, the object to be cut is moved to a target position corresponding to the deviation amount. The target position is a position where the amount of deviation is zero or a position where the amount of deviation is reduced to approach zero compared to the position before the movement. Next, the sealed substrate 1 is placed again on the cutting jig 9 by using the transfer mechanism.
With the above steps, the position of the 2 nd mark 4 of the sealed substrate 1 can be accurately aligned with the position of the 1 st mark 17 of the cutting jig 9. In detail, the positional relationship between the 1 st mark 17 and the 2 nd mark 4 can be set to a predetermined positional relationship. Therefore, the positions of the 1 st cutting line 5 and the 2 nd cutting line 6 set in the sealed substrate 1 can be accurately aligned with the positions of the 1 st cutting groove 15 and the 2 nd cutting groove 16 provided in the cutting jig 9. Thus, the sealed substrate 1 can be accurately cut along the cutting line without the rotary blade provided in the cutting mechanism deviating from the position of the cutting groove of the cutting jig 9.
Depending on the configurations of the conveyance mechanism (not shown) and the cutting jig 9, the cutting jig 9 may be moved by an appropriate amount based on the deviation amount in at least 1 of the X direction, the Y direction, and the θ direction in a state where the conveyance mechanism lifts the sealed substrate 1 from the cutting jig 9 and holds the sealed substrate 1 on the conveyance mechanism. Subsequently, the sealed substrate 1 is placed again on the cutting jig 9 by using the transfer mechanism.
Basically, the transport mechanism and the cutting jig 9 are relatively moved in at least 1 of the X direction, the Y direction, and the θ direction by an appropriate amount based on the deviation amount in a state where the transport mechanism lifts the sealed substrate 1 from the cutting jig 9 and holds the sealed substrate 1 on the transport mechanism. As necessary, the position of the rotary knife (not shown) is aligned with the position of the 1 st cutting groove 15 (or the 2 nd cutting groove 16) provided in the cutting jig 9 using the 1 st mark 17 of the cutting jig 9 or the 2 nd mark 4 of the sealed substrate 1. The position of the rotary knife (not shown) may be aligned with the position of the 1 st cutting line 5 (or the 2 nd cutting line 6) set on the sealed substrate 1. The correction of the deviation amount described above is similarly performed in other embodiments.
The conveying mechanism is indicated as "conveying mechanism 22" in fig. 4. The accuracy of the position between the conveyance mechanism and the cutting jig 9 (the amount of deviation between the position to be originally set and the actual position) caused by the relative movement of the conveyance mechanism and the cutting jig 9 is sufficiently small enough to be ignored when compared with the amount of deviation of the sealed substrate 1. For example, the positional accuracy in the case where the conveying mechanism and the cutting jig 9 are repeatedly moved so as to have the same positional relationship is sufficiently small to the extent that the positional accuracy can be ignored in comparison with the amount of displacement of the sealed substrate 1.
In the present embodiment, the cutting jig 9 corresponding to the product is attached to the cutting table 8. The resin sheet 11 of the cutting jig 9 is provided with a plurality of 1 st marks 17 corresponding to the plurality of 2 nd marks 4 formed on the sealed substrate 1. In the cutting table 8, the coordinate position of the 1 st mark 17 formed on the resin sheet 11 is measured and stored in advance as a reference coordinate position. Next, the coordinate position of the 2 nd mark 4 of the sealed substrate 1 placed on the cutting table 8 is measured. The coordinate position of the 1 st mark 17 and the coordinate position of the 2 nd mark 4 are compared, and the amount of displacement of the sealed substrate 1 can be calculated. By correcting the deviation amount, the position of the 2 nd mark 4 of the sealed substrate 1 can be accurately aligned with the position of the 1 st mark 17 of the cutting jig 9. Therefore, the positions of the plurality of cutting lines set on the sealed substrate 1 and the positions of the plurality of cutting grooves provided in the cutting jig 9 can be accurately aligned. Thus, the sealed substrate 1 can be accurately cut along the cutting line without the rotary blade provided in the cutting mechanism deviating from the position of the cutting groove of the cutting jig 9.
In the present embodiment, the coordinate position of the 1 st mark 17 formed on the cutting jig 9 and the coordinate position of the 2 nd mark 4 formed on the sealed substrate 1 are compared to calculate the amount of displacement of the sealed substrate 1. Therefore, the amount of displacement of the sealed substrate 1 placed on the cutting jig 9 can be calculated including the case where the sealed substrate 1 expands and contracts due to the influence of dimensional variations of the sealed substrate 1 itself, warpage of the sealed substrate 1, cooling water, and the like. Therefore, regardless of the state of the sealed substrate 1, the accuracy of aligning the position of the cutting line set in the sealed substrate 1 with the position of the cutting groove provided in the cutting jig 9 can be improved.
In this embodiment, the position of the cutting line set in the sealed substrate 1 and the position of the cutting groove provided in the cutting jig 9 can be accurately aligned. Therefore, the sealed substrate 1 can be cut along the cutting line without the rotary blade provided in the cutting mechanism being displaced from the position of the cutting groove. This can prevent the resin sheet 11 from being cut by the rotary blade. Therefore, dust is not generated from the cutting jig 9, and leakage occurs in the suction hole 13 of the cutting jig 9. Since the rotary cutter does not cut the resin sheet 11, the cutting jig 9 has a long life, and the operation cost of the cutting device can be reduced.
Example 2
Embodiment 2 of the cutting apparatus of the present invention is explained with reference to fig. 3A and 3B. Embodiment 2 differs from embodiment 1 in that the positioning marks (1 st mark) of the cutting jig 9 are formed on the metal plate 10 instead of the resin sheet 11. The other structures and operations are the same as those in embodiment 1, and therefore, the description thereof is omitted.
As shown in fig. 3A, a plurality of 1 st marks 18 (marks represented by + in the drawing) are formed on the metal plate 10 in the longitudinal direction and the short side direction so as to surround the resin sheet 11 so as to correspond to the positions of the 2 nd marks 4 provided on the sealed substrate 1. For example, 1 st marks 18A, 18B, … …, 18G, and 18H are formed at 4 corners of the metal plate 10 so as to correspond to positions of 2 nd marks 4A, 4B, … …, 4G, and 4H (see fig. 1A) set at 4 corners of the sealed substrate 1. Further, the 1 st mark 18 may be formed in a required number in the longitudinal direction and the short side direction so as to correspond to the 2 nd mark 4 formed on the sealed substrate 1. Fig. 3A shows a case where the 1 st mark 18 is formed so as to correspond to all the 2 nd marks 4 (see fig. 1A) formed on the sealed substrate 1.
As in the case shown in fig. 2A and 2B, the positional information of the 1 st mark 18 formed on the metal plate 10 of the cutting jig 9 and the positional information of the 2 nd mark 4 formed on the sealed substrate 1 are measured as the positional information on the cutting table 8. The coordinate position of the 1 st mark 18 formed on the metal plate 10 is measured and stored in advance as a reference coordinate position on the cutting table 8. The coordinate position of the reference is compared with the coordinate position of the 2 nd mark 4 of the sealed substrate 1 placed on the cutting table 8 and measured, and the amount of displacement of the sealed substrate 1 is calculated. By correcting these deviations, the position of the 2 nd mark 4 of the sealed substrate 1 can be aligned in accordance with the position of the 1 st mark 18 formed in the X direction and the Y direction of the cutting jig 9. Therefore, the positions of the plurality of cutting lines set on the sealed substrate 1 and the positions of the plurality of cutting grooves provided in the cutting jig 9 can be accurately aligned. Thus, the sealed substrate 1 can be accurately cut along the cutting line without the rotary blade provided in the cutting mechanism deviating from the position of the cutting groove of the cutting jig 9.
In example 2, the 1 st mark 18 is formed on the metal plate 10 of the cutting jig 9. The metal plate 10 is easier to process as indicated by the 1 st mark than the resin sheet 11, and the shape of the processed surface is sharp. Thus, the outline of the 1 st mark 18 formed on the metal plate 10 is clearer than the outline of the 1 st mark 17 formed on the resin sheet 11. Thereby, the contrast of the 1 st mark 18 obtained by the image recognition becomes clear. Therefore, the measurement accuracy of the coordinate position of the 1 st mark 18 of the cutting jig 9 is improved, and the alignment accuracy is also improved. Except for this, since the same effects as those of embodiment 1 are obtained, the description thereof is omitted.
Example 3
Embodiment 3 of the cutting apparatus of the present invention will be described with reference to fig. 4 to 6B. As shown in fig. 4, the cutting device 19 is a device that forms the cut pieces into a plurality of products in a single piece. The cutting device 19 includes a substrate supply unit a, a substrate cutting unit B, and an inspection unit C as components. Each of the components (the modules a to C) is detachable from and replaceable with respect to the other components.
The substrate supply unit a includes a substrate supply mechanism 20 for supplying the sealed substrate 1 corresponding to the object to be cut, a substrate placing unit 21 for delivering and receiving the sealed substrate 1, and a transport mechanism 22 for transporting the sealed substrate 1. The conveyance mechanism 22 is movable in the X direction, the Y direction, and the Z direction, and is rotatable in the θ direction. After the sealed substrate 1 is positioned on the substrate mounting portion 21, it is conveyed to the substrate cutting unit B by the conveying mechanism 22.
The cutting device 19 shown in fig. 4 is a single-header type cutting device. Therefore, 1 cutting table 8 is provided in the substrate cutting module B. The cutting table 8 is movable in the Y direction of the drawing by a moving mechanism 23 and is rotatable in the θ direction by a rotating mechanism 24. A cutting jig 9 (see fig. 2A, 2B, 3A, and 3B) is attached to the cutting table 8, and the sealed substrate 1 is placed on and adsorbed by the cutting jig 9.
The substrate cutting module B is provided with an alignment camera 25. The camera 25 can be independently moved in the X direction. The coordinate position of the 2 nd mark 4 (see fig. 1A) formed on the sealed substrate 1 is measured by moving the camera 25 in the X direction and moving the cutting table 8 in the Y direction. Thereby, a plurality of 1 st cutting lines 5 extending in the short direction and a plurality of 2 nd cutting lines 6 extending in the longitudinal direction of the sealed substrate 1 are virtually set (see fig. 1A).
The substrate cutting module B is provided with a spindle 26 as a cutting mechanism. Cutting device 19 is a single-shaft cutting device provided with 1 main shaft 26. The main shaft 26 can move independently in the X direction and the Z direction. A rotary knife 27 is attached to the main shaft 26. The main shaft 26 is provided with a cutting water nozzle (not shown) for spraying cutting water to suppress frictional heat generated by the rotating blade 27 rotating at high speed. The sealed substrate 1 is cut by relatively moving the cutting table 8 and the spindle 26. The rotary knife 27 rotates in a plane including the Y direction and the Z direction, thereby cutting the sealed substrate 1.
The inspection module C is provided with an inspection table 28. On the inspection stage 28, a cut substrate 29, which is an aggregate of a plurality of products P formed by cutting the sealed substrate 1 into individual pieces, is placed. The plurality of products P are inspected by an inspection camera (not shown) to screen out non-defective products and non-defective products. The non-defective products are stored in the tray 30.
In the present embodiment, the substrate supply unit a is provided with a control unit CTL for performing operations and controls such as operation of the cutting device 19, conveyance of the sealed substrate 1, alignment of the sealed substrate 1, cutting of the sealed substrate 1, and inspection of the cut substrate 29. The present invention is not limited to this, and the control unit CTL may be provided in another unit.
In this embodiment, the cutting apparatus 19 of a single-cutting-table type and a single-shaft structure is described. The present invention is not limited to this, and the cutting table 8 of the present invention can be applied to a cutting device of a single-cutting-table type and a double-spindle structure, a cutting device of a double-cutting-table type and a double-spindle structure, and the like.
The operation of placing the sealed substrate 1 on the cutting jig 9 attached to the cutting table 8 and positioning the sealed substrate will be described with reference to fig. 4 to 6B. In example 3, a case where the 1 st mark 18 is formed on the metal plate 10 of the cutting jig 9 of the cutting table 8 will be described.
As shown in fig. 5A, the cutting table 8 is disposed so that the longitudinal direction extends in the X direction. Therefore, the short side direction is arranged so as to extend in the Y direction (from the back side to the front side of the paper surface in fig. 5A). Hereinafter, a case where the cutting table 8 is disposed so that the longitudinal direction thereof extends in the X direction will be described.
A cutting jig 9 is attached to the cutting table 8. The 1 st marks 18A, 18B, … …, 18G, and 18H are formed at 4 corners of the metal plate 10 of the cutting jig 9 (see fig. 3A). Fig. 5A shows the 1 st marks 18D and 18E.
Next, the cutting table 8 is moved to a predetermined position in the Y direction by the moving mechanism 23 (see fig. 4), and the alignment camera 25 is moved in the X direction, so that the camera 25 is stopped on the specific 1 st mark 18D on the cutting jig 9. The 1 st mark 18D is photographed by the camera 25, and image data (1 st image data) is acquired. Image recognition is performed based on the image data, whereby the coordinate position (1 st position information) of the 1 st mark 18D is measured and stored. Further, the camera 25 is moved in the + X direction, and the coordinate position of the 1 st mark 18E is also measured and stored. By moving the cutting table 8 in the Y direction and moving the camera 25 in the X direction in this way, the coordinate position of the 1 st mark 18 formed on the metal plate 10 of the cutting jig 9 can be measured and stored. The coordinate positions of the 1 st mark 18 of the required number are measured and stored in advance as necessary. These coordinate positions (1 st position information) are set as coordinate positions of the reference for the positioning on the cutting table 8. In this case, for example, the coordinate positions of the 21 st marks 18D, 18E in the X direction and the coordinate positions of the 21 st marks 18B, 18C (refer to fig. 3A) in the Y direction are measured. The data of the measured coordinate positions of the 1 st marks 18D, 18E, 18B, and 18C are transmitted to the control unit CTL (see fig. 4) of the cutting device 19 and stored in advance.
Next, as shown in fig. 5B, the sealed substrate 1 is placed on the cutting jig 9 by using the conveying mechanism 22 (see fig. 4). At this time, the sealed substrate 1 may be placed at a position deviated from the predetermined position of the cutting jig 9.
Next, as shown in fig. 5C, the cutting table 8 is moved in the Y direction, and the camera 25 is moved in the X direction, so that the camera 25 is stopped on, for example, the specific 2 nd mark 4D formed on the sealed substrate 1. The 2 nd mark 4D is photographed by the camera 25, and image data (2 nd image data) is acquired. Image recognition is performed based on the image data, thereby measuring the coordinate position (2 nd position information) of the 2 nd mark 4D. Also, the coordinate position of the 2 nd mark 4E is measured. In this case, the coordinate positions of the 2 nd marks 4D, 4E along the X direction and the coordinate positions of the 2 nd marks 4B, 4C (refer to fig. 1A) along the Y direction are measured. The data of the measured coordinate positions (2 nd position information) of the 2 nd markers 4D, 4E, 4B, and 4C are transmitted to the control unit CTL.
The control unit CTL compares the coordinate positions of the 1 st marks 18D, 18E, 18B, and 18C of the cutting jig 9 stored in advance with the measured coordinate positions of the 2 nd marks 4D, 4E, 4B, and 4C of the sealed substrate 1. By performing data processing on the data of these coordinate positions, it is possible to calculate the X-direction deviation, the Y-direction deviation, and the θ -direction deviation, respectively.
As a result of data processing of the coordinate position of the 1 st mark of the cutting jig 9 stored in advance and the measured coordinate position of the 2 nd mark of the sealed substrate 1, when the control unit CTL determines that there is no misalignment of the sealed substrate 1, the cutting table 8 is moved in the + Y direction while holding the sealed substrate 1. The sealed substrate 1 is cut along the cutting line by using a main shaft 26 (see fig. 4).
As a result of the data processing, when the control unit CTL determines that the sealed substrate 1 is misaligned, the sealed substrate 1 is lifted from the cutting jig 9 by the conveyance mechanism 22 (see fig. 4) while maintaining the state in which the sealed substrate 1 is placed on the cutting jig 9, as shown in fig. 5D. Based on the deviation amount calculated by the control unit CTL, the transport mechanism 22 corrects the deviation amounts of the sealed substrate 1 in the X direction, the Y direction, and the θ direction, and moves the sealed substrate 1 above the predetermined position of the cutting jig 9. In detail, the conveying mechanism 22 moves by an appropriate amount based on the deviation amount in at least 1 of the X direction, the Y direction, and the θ direction.
Next, as shown in fig. 5E, the transport mechanism 22 places the sealed substrate 1 on the cutting jig 9 again at a position where the displacement amounts of the sealed substrate 1 in the X direction, the Y direction, and the θ direction are corrected. Thus, the sealed substrate 1 is accurately positioned and placed at a predetermined position of the cutting jig 9. Therefore, the position of the cutting line of the sealed substrate 1 can be accurately aligned with the position of the cutting groove provided in the cutting jig 9. The sealed substrate 1 can be cut with the cutting line of the sealed substrate 1 aligned accurately with the cutting groove of the cutting jig 9.
Fig. 6A and 6B show, in plan view, the operation of positioning the sealed substrate 1 shown in fig. 5A to 5E to a predetermined position of the cutting jig 9. As shown in fig. 6A, in a state where the sealed substrate 1 is placed on the cutting table 8, the position of the sealed substrate 1 is displaced in the X direction, the Y direction, and the θ direction. In fig. 6A, a region SUB surrounded by dotted lines is a region on which the sealed substrate 1 is placed on the cutting table 8. For example, first, the amount of deviation in the θ direction is calculated from the coordinate positions of the 2 nd marks 4D and 4E of the sealed substrate 1. The amount of deviation in the θ direction is corrected, so that the longitudinal direction and the short-side direction of the sealed substrate 1 can be arranged in parallel with the longitudinal direction and the short-side direction of the cutting table 8. By correcting the amounts of deviation in the X direction and the Y direction from this state, the sealed substrate 1 can be arranged in the predetermined region SUB of the cutting table 8 as shown in fig. 6B.
With the present embodiment, the transport mechanism 22 can be moved in the X direction, the Y direction, and the Z direction and rotated in the θ direction on the cutting device 19. Thus, even when the sealed substrate 1 is deviated from the predetermined position of the cutting jig 9, the deviation amount of the sealed substrate 1 can be corrected by the conveyance mechanism 22. The sealed substrate 1 is lifted up again by the conveyance mechanism 22 while keeping the sealed substrate 1 off the predetermined position of the cutting jig 9. From this state, the transfer mechanism 22 is moved by the amount of displacement of the sealed substrate 1, and stopped above the predetermined position of the cutting jig 9. After that, the sealed substrate 1 is placed on the cutting jig 9. Since the sealed substrate 1 can be placed at a predetermined position of the cutting jig 9, the position of the cutting line of the sealed substrate 1 and the position of the cutting groove of the cutting jig 9 can be accurately aligned. The sealed substrate 1 can be accurately positioned without adding new components and new functions to the conventional cutting device 19. The sealed substrate 1 can be accurately aligned without modifying the cutting device 19 and without incurring cost. Therefore, the cost of the cutting device 19 can be suppressed, and the accuracy and yield of cutting can be improved.
In this embodiment, the sealed substrate 1 can be cut while accurately aligning the position of the cutting line of the sealed substrate 1 with the position of the cutting groove of the cutting jig 9. Thus, the resin sheet 11 can be prevented from being cut by the rotary blade. It is possible to prevent generation of dust from the cutting jig 9 and leakage from the suction hole 13 of the cutting jig 9. Since the rotary cutter does not cut the resin sheet 11, the cutting jig 9 has a long life, and the operation cost of the cutting device 19 can be reduced. In addition, the yield of the product can be improved, and the quality of the product can be improved.
In the present embodiment, the transport mechanism 22 corrects the displacement amounts of the sealed substrate 1 in the X direction, the Y direction, and the θ direction, and moves and places the sealed substrate 1 above the predetermined position of the cutting jig 9. The present invention is not limited to this, and the sealed substrate 1 can be placed at a predetermined position of the cutting jig 9 by correcting the amount of displacement of the sealed substrate 1 in the X direction by the conveyance mechanism 22, correcting the amount of displacement in the Y direction and the θ direction by the cutting table 8. In this case, the transport mechanism 22 may be configured to be movable only in the X direction.
Example 4
Embodiment 4 of the cutting device of the present invention is explained with reference to fig. 7A, 7B and 8. In example 4, a method of cutting a large sealed substrate that cannot be mounted on the cutting table 8 of the conventional cutting device 19 described above into individual pieces will be described.
As shown in fig. 7A, for example, the large-sized sealed substrate 31 has a size of 600mm × 500 mm. A plurality of 2 nd marks 32 (marks represented by + in the drawing) are formed on the sealed substrate 31 in the longitudinal direction and the short side direction of the substrate. In fig. 7A, 8 2 nd marks 32 formed at 4 corners of the sealed substrate 31 are denoted as 32A, 32B, … …, 32G, and 32H, respectively, in a counterclockwise direction with an upper left of the sealed substrate 31 as a base point. A plurality of 2 nd marks 32 are formed in the longitudinal direction and the short side direction in the sealed substrate 31 at positions other than the 4 corners. Although not shown, a plurality of regions formed in each of the four-divided portions (the portions each of which is divided into four by a broken line and a two-dot chain line) of the sealed substrate 31 have the same size as the plurality of regions 7 shown in fig. 1A and 1B.
For example, since the size of the sealed substrate that can be mounted on the cutting table 8 of the cutting device 19 shown in fig. 4 is 320mm × 320mm at maximum, the sealed substrate 31 cannot be mounted on the cutting table 8. Therefore, if this state is maintained, the sealed substrate 31 cannot be cut by the cutting device 19. Then, the sealed substrate 31 is divided into a size that can be mounted on the cutting table 8. For example, to bisect the sealed substrate 31 into four halves, a dividing line 33 along the short side direction and a dividing line 34 along the longitudinal direction are set.
Next, as shown in fig. 7B, the sealed substrate 31 is cut along the dividing lines 33 and 34 using a member capable of dividing the large sealed substrate 31. Thereby, the sealed substrate 31 is divided into four equal parts and divided into the sealed substrates 35 having a size of 300mm × 250 mm. The divided sealed substrates 35A, 35B, 35C, and 35D have a size that can be mounted on the cutting table 8 of the cutting device 19. By dividing the sealed substrate 31, warpage, internal stress, and the like originally included in the sealed substrate 31 are reduced. Therefore, the divided sealed substrates 35A, 35B, 35C, and 35D vary in warpage, size, and the like.
Next, as shown in fig. 8, for example, 1 sealed substrate 35A out of the sealed substrates divided into four is placed on the cutting table 8 by the transfer mechanism 22. A cutting jig 9 shown in fig. 3A and 3B is attached to the cutting table 8. Therefore, a plurality of 1 st marks 18 are formed on the metal plate 10 of the cutting jig 9. The sealed substrate 35A can be placed within the predetermined region SUB of the cutting table 8.
On the sealed substrate 35A, the 2 nd mark of any 1 of the 2 nd marks 32 formed in the longitudinal direction is denoted by 32I, and the 2 nd mark of any 1 of the 2 nd marks 32 formed in the short side direction is denoted by 32J.
The coordinate positions of the 2 nd marks 32A, 32I formed in the longitudinal direction of the sealed substrate 35A and the 2 nd marks 32B, 32J formed in the short side direction are measured using the camera 25 for alignment (see fig. 4). These measured coordinate positions of the 2 nd markers 32A, 32I and 32B, 32J are compared with the coordinate positions of the 1 st markers 18A, 18H and 18B, 18C stored in advance. This makes it possible to calculate the amount of displacement of the sealed substrate 35A. By correcting the deviation amount, the position of the 2 nd mark 32 of the sealed substrate 35A can be aligned so as to correspond to the position of the 1 st mark 18 of the cutting table 8. Therefore, the position of the cutting line set in the sealed substrate 35A can be accurately aligned with the position of the cutting groove provided in the cutting jig 9. Thus, the sealed substrate 35A thus divided can be accurately cut along the cutting line without the rotary knife deviating from the position of the cutting groove of the cutting jig 9. The divided sealed substrates 35B, 35C, and 35D are placed on the cutting table 8 and cut in the same manner.
In the present embodiment, by dividing the large sealed substrate 31 that cannot be mounted on the cutting table 8 of the conventional cutting device 19, the divided sealed substrate 35 can be cut by the conventional cutting device 19. This can be achieved by adopting a method of alignment in which the coordinate position is measured using the alignment camera 25, instead of the conventional method of alignment using a positioning pin. By comparing the coordinate position of the 2 nd mark 32 of the divided sealed substrate 35 with the coordinate position of the 1 st mark 18 of the cutting table 8 stored in advance, accurate positioning can be performed. Therefore, by dividing a large sealed substrate that cannot be mounted on the cutting table 8, cutting can be performed using the conventional cutting device 19.
In this embodiment, the large sealed substrate 31 can be divided and the divided sealed substrate 35 can be cut. By dividing the sealed substrate 31, the warpage and internal stress of the sealed substrate 31 are reduced, and thus the warpage, size, and the like of the divided sealed substrate 35 are changed. Even when the size of the divided sealed substrate 35 is changed, the coordinate position of the 2 nd mark 32 of the sealed substrate 35 is measured, and thus the change in size can be corrected. Therefore, the sealed substrate 35 after division can be accurately aligned with the cutting table 8.
In this embodiment, the same cutting device 19 and the same cutting table 8 can be used to cut the normal sealed substrate 1 and the divided sealed substrate 35. Therefore, the sealed substrate 1 and the sealed substrate 35 after division can be accurately aligned without adding new components and new functions to the conventional cutting device 19. The sealed substrate can be accurately positioned without improving the cutting device 19 and without causing cost. Therefore, the cost of the cutting device 19 can be suppressed, and sealed substrates having various sizes can be cut.
In each of the examples, a case where a sealed substrate having a chip-like element (semiconductor chip or the like) is cut as a cut object is described. The present invention is not limited to this, and the present invention can be applied to a case where the following cut object is cut as a cut object other than the sealed substrate to be formed into a single piece. First, a semiconductor wafer (semiconductor wafer) made of silicon or a compound semiconductor and having a circuit element, a MEMS (Micro Electro Mechanical Systems) or other functional element is formed as a single piece. Secondly, a ceramic substrate, a glass substrate, or the like, on which functional elements such as a resistor, a capacitor, a sensor, and a surface acoustic wave device are fabricated, is formed as a single piece, and products such as a chip resistor, a chip capacitor, a chip-type sensor, and a surface acoustic wave device are fabricated. In the case of 2, the semiconductor wafer, the ceramic substrate, and the like correspond to a substrate on which functional elements corresponding to the plurality of regions are formed. Third, optical components such as lenses, optical modules, and light guide plates are manufactured by forming the resin molded article into a single piece. Fourth, a resin molded product is formed into a single piece to manufacture a normal molded product. Fifth, a glass plate used as a cover of various electric appliances is manufactured. The above description can be applied to various cases including the above 5 cases.
In each of the embodiments, the case where a cut object having a rectangular shape in the longitudinal direction and the short side direction is cut as a cut object is described. The present invention is not limited to this, and the above description can be applied to the case of cutting a square object to be cut or the case of cutting an object to be cut having a substantially circular shape such as a semiconductor wafer.
In each example, the coordinate position of the 2 nd mark formed on the sealed substrate and the 1 st mark formed on the cutting jig 9 were compared, and the amount of deviation was calculated. The present invention is not limited to this, and patterns other than the 2 nd mark can be used as the plurality of alignment marks. Alignment can be performed using an actual circuit pattern formed on a semiconductor wafer, a pattern of terminals for external connection on a sealed substrate, projecting electrodes (bumps, solder balls on a BGA), and the like.
In each embodiment, a cutting jig 9 including a metal plate 10 and a resin sheet 11 fixed to the metal plate is attached to the cutting table 8. The present invention is not limited to this, and a cutting jig 9 made of 1 or more kinds of metals, in other words, a cutting jig 9 made of a metal can be used. The cutting jig 9 made of 1 or more kinds of resins, in other words, the cutting jig 9 made of a resin can be used. The main body of the cutting jig 9 may be directly moved by the moving mechanism 23 and the rotating mechanism 24 without using the cutting table 8.
In each embodiment, a rotary knife is used as the cutting mechanism. The present invention is not limited to this, and a wire saw, a band saw, a laser, a water jet, a shot-blasting machine, and the like may be used. When a wire saw or a band saw is used, a through hole serving as a space through which a blade (a wire saw or a band saw) serving as a cutting assisting member passes is provided in the cutting jig. In the case of using a laser, a hydraulic jet, or a shot-blasting machine, a through hole as a space through which the cutting-assisting member passes is provided in the cutting jig. Thus, the "cutting groove" in the present invention includes a slit-shaped through hole through which the "cutting jig" is inserted. At least a part of the cutting assisting member (a rotary knife, a wire saw, a band saw, etc.) included in the cutting mechanism passes through the "cutting groove". At least a part of the member (laser, high-pressure jet water, abrasive grains, and the like) to be cut by the cutting mechanism passes through the "cutting groove".
The present invention is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, modified, or selected as necessary without departing from the scope of the present invention.
Description of the reference numerals
1. A sealed substrate (cut object); 2. a substrate; 3. a sealing resin; 4. 4A, 4B, … …, 4G, 4H, marker 2; 5. a 1 st cut line (cut line); 6. a 2 nd cutting line (cutting line); 7. area (product); 8. a cutting table; 9. a cutting jig; 10. a metal plate; 11. a resin sheet; 12. a protrusion portion; 13. an adsorption hole; 14. a space; 15. the 1 st cutting groove (cutting groove); 16. the 2 nd cutting groove (cutting groove); 17. 17A, 17B, … …, 17G, 17H, label 1; 18. 18A, 18B, … …, 18G, 18H, marker 1; 19. a cutting device; 20. a substrate supply mechanism; 21. a substrate mounting section; 22. a conveying mechanism; 23. a moving mechanism; 24. a rotation mechanism; 25. a camera (imaging means) for alignment; 26. a main shaft (cutting mechanism); 27. a rotary knife; 28. a workbench for inspection; 29. the substrate has been cut; 30. a tray; 31. a large-sized sealed substrate; 32. 32A, 32B, … …, 32G, 32H, 32I, 32J, marker No. 2; 33. dividing the lines; 34. dividing the lines; 35. 35A, 35B, 35C, 35D, and the divided sealed substrates (objects to be cut); A. a substrate supply assembly; B. a substrate cutting assembly; C. inspecting the component; p, products; CTL, control section (control means); SUB, a region where the sealed substrate is placed.

Claims (12)

1. A cutting device used when a plurality of products are manufactured by cutting an object to be cut along a plurality of cutting lines, the cutting device comprising:
a cutting jig having a plurality of 1 st marks and a plurality of cutting grooves;
a cutting mechanism for cutting the object to be cut having a plurality of 2 nd marks and placed on the cutting jig along the plurality of cutting lines;
a conveying mechanism for conveying the object to be cut; and
a moving mechanism for relatively moving the cutting jig and the cutting mechanism,
it is characterized in that the preparation method is characterized in that,
the cutting device includes:
an imaging means for imaging the plurality of 1 st marks and the plurality of 2 nd marks; and
a control means for aligning the cutting jig with the object to be cut placed on the cutting jig by the conveying mechanism,
the control means compares 1 st position information with 2 nd position information to calculate a deviation amount indicating a positional deviation between the cutting jig and the object, the 1 st position information including position information of a specific 1 st mark measured based on image data acquired by the imaging means and stored in advance, the 2 nd position information including position information of a specific 2 nd mark measured by the imaging means in a state where the object is placed on and held by the cutting jig,
after releasing the suction of the object to be cut, the transport mechanism lifts the object to be cut from the cutting jig, relatively moves the transport mechanism and the cutting jig based on the amount of deviation, moves the object to be cut to a target position corresponding to the amount of deviation, and then again places and sucks the object to be cut on the cutting jig,
the positions of the plurality of cutting grooves and the positions of the plurality of cutting lines are aligned by moving the object to be cut to the target position,
the cutting mechanism cuts the object placed on and held by the cutting jig again along the plurality of cutting lines after the object is placed on and held by the cutting jig again.
2. The shut-off device of claim 1,
at least a part of the cutting assisting member included in the cutting mechanism or at least a part of the cutting assisting member supplied from the cutting mechanism passes through the cutting groove corresponding to a cutting line in which cutting is being performed among the plurality of cutting lines.
3. The cutoff device according to claim 2,
the conveying mechanism moves the object to be cut to the target position in at least 1 of the X direction, the Y direction, and the θ direction by relatively moving the conveying mechanism and the cutting jig, and then places the object to be cut on the cutting jig again.
4. The cutting device according to any one of claims 1 to 3,
at least 2 of the specific 1 st marks are set in a 1 st direction and a 2 nd direction orthogonal to the 1 st direction, respectively, in a plan view,
at least 2 of the specific 2 nd marks are set in a 1 st direction and a 2 nd direction orthogonal to the 1 st direction, respectively, in a plan view.
5. The cutting device according to any one of claims 1 to 3,
the object to be cut is a sealed substrate or a sealed substrate after division.
6. The cutting device according to any one of claims 1 to 3,
the object to be cut is a substrate on which functional elements are formed in a plurality of regions corresponding to the plurality of products, respectively.
7. A method for manufacturing a plurality of products by cutting a cut object, comprising the steps of:
preparing a cutting jig having a plurality of cutting grooves and a plurality of 1 st marks;
preparing a cut object having a plurality of cutting lines and a plurality of 2 nd marks;
placing the object to be cut on the cutting jig by a conveying mechanism; and
cutting the object along the plurality of cutting lines by the cutting mechanism by relatively moving the cutting jig and the cutting mechanism,
a plurality of products are manufactured by cutting the cut object,
it is characterized in that the preparation method is characterized in that,
the method for manufacturing a plurality of products by cutting a cut object comprises the following steps:
shooting a specific 1 st mark in the 1 st marks by utilizing shooting components to acquire 1 st image data;
performing image processing based on the 1 st image data, thereby acquiring 1 st position information including position information of the specific 1 st mark;
adsorbing the object to be cut placed on the cutting jig;
capturing an image of a specific 2 nd mark among the plurality of 2 nd marks by the imaging means in a state where the object to be cut is placed on and adsorbed by the cutting jig, and acquiring 2 nd image data;
performing image processing based on the 2 nd image data to acquire 2 nd position information including position information of the specific 2 nd mark;
comparing the 1 st position information with the 2 nd position information to calculate a deviation amount indicating a positional deviation between the cutting jig and the object to be cut;
after the suction of the object to be cut is released, the conveying mechanism lifts the object to be cut from the cutting jig;
moving the conveying mechanism and the cutting jig relative to each other based on the deviation amount to move the object to be cut to a target position corresponding to the deviation amount; and
the conveying mechanism is used for placing the object to be cut again and absorbing the object to be cut on the cutting clamp,
in the step of moving the object to be cut, the positions of the plurality of cutting grooves and the positions of the plurality of cutting lines are aligned by moving the object to be cut to the target position,
after the step of placing and sucking the object to be cut again, the step of cutting the object to be cut cuts the object to be cut placed and sucked again by the cutting jig.
8. The method of manufacturing a plurality of products by cutting a cut object according to claim 7,
in the step of cutting the object to be cut, at least a part of the cutting assisting member included in the cutting mechanism or at least a part of the cutting assisting member supplied from the cutting mechanism is caused to pass through the cutting groove corresponding to a cutting line that is cutting the object.
9. The method of manufacturing a plurality of products by cutting a cut object according to claim 8,
in the step of moving the object to be cut, the object to be cut is moved to the target position in at least 1 of an X direction, a Y direction, and a θ direction by relatively moving the conveying mechanism and the cutting jig.
10. The method of manufacturing a plurality of products by cutting a cut object according to any one of claims 7 to 9,
the method for manufacturing a plurality of products by cutting a cut object comprises the following steps:
setting at least 2 of the specific 1 st marks among the plurality of 1 st marks in a 1 st direction and a 2 nd direction orthogonal to the 1 st direction, respectively, in a plan view;
at least 2 of the specific 2 nd marks among the plurality of 2 nd marks are set in a 1 st direction and a 2 nd direction orthogonal to the 1 st direction in a plan view.
11. The method of manufacturing a plurality of products by cutting a cut object according to any one of claims 7 to 9,
the object to be cut is a sealed substrate or a sealed substrate after division.
12. The method of manufacturing a plurality of products by cutting a cut object according to any one of claims 7 to 9,
the object to be cut is a substrate on which functional elements are formed in a plurality of regions corresponding to the plurality of products, respectively.
CN201680008290.1A 2015-02-05 2016-01-06 Cutting device and method for manufacturing multiple products by cutting cut object Active CN107210206B (en)

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WO2016125518A1 (en) 2016-08-11
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