KR102089098B1 - Cutting device and cutting method - Google Patents

Abstract

The cutting jig 9 on which the first mark 17 is formed is attached to the cutting table 8. The first mark 17 corresponds to the second mark 4 formed on the sealed substrate 1. The position (first coordinate position) of the first mark 17 is measured and stored in advance. The sealed substrate 1 is placed on the cutting jig 9, and the position of the second mark (second coordinate position) is measured. The displacement of the sealed substrate 1 is calculated by comparing the first coordinate position with the second coordinate position. The sealed substrate 1 is lifted from the cutting jig 9 and moved in response to the amount of displacement, and placed on the cutting jig 9 again. Thereby, since the position of the cutting line of the sealed substrate 1 can be precisely aligned with the position of the cutting groove of the cutting jig 9, the sealed substrate 1 is cut along the cutting line located above the cutting groove. can do.

Description

Cutting device and cutting method

The present invention relates to a cutting device and a cutting method for producing a plurality of individualized products by cutting an object to be cut.

A substrate made of a printed substrate or a lead frame is virtually divided into a plurality of lattice-shaped regions, and after mounting one or a plurality of chip-shaped elements (for example, semiconductor chips) in each region, the entire substrate Is a resin-sealed substrate. It is a product that a sealed substrate is cut by a cutting mechanism using a rotating blade or the like and individualized into individual area units.

Conventionally, a predetermined area of the sealed substrate is cut by a cutting mechanism such as a rotating blade using a cutting device. For example, a BGA (Ball Grid Array Package) product is cut as follows. First, the sealed substrate is placed on the cutting table. Next, the sealed substrate is aligned (positioned). By alignment, the positions of the virtual cutting lines that partition the plurality of regions are set. Next, the cutting table and the cutting mechanism on which the sealed substrate is placed are relatively moved. While cutting water is sprayed to the cut location of the sealed substrate, the sealed substrate is cut along the cutting line set in the sealed substrate by a cutting mechanism. The individualized product is manufactured by cutting the sealed substrate.

A jig for cutting corresponding to the product is attached to the table for cutting. The sealed substrate is placed on the jig for cutting and adsorbed. The cutting jig has a metal plate and a resin sheet fixed on the metal plate. The resin sheet is provided with a plurality of earth-like projections that respectively adsorb and hold a plurality of regions of the sealed substrate. In the plurality of protrusions, suction holes penetrating the resin sheet and the metal table from the surface of the protrusion are respectively provided. Between the protrusions, a plurality of cutting grooves corresponding to positions of a plurality of cutting lines that divide each region of the sealed substrate is provided. As the cutting table and the cutting mechanism are relatively moved, the sealed substrate is cut along the plurality of cutting lines to be separated.

In the case of cutting the sealed substrate, the cutting line of the sealed substrate is aligned with the cutting groove of the cutting jig attached to the cutting table and cut. The sealed substrate is cut by moving the rotating blade along the cutting line. When the sealed substrate is cut in a state where the cutting groove position of the cutting jig and the cutting line position of the sealed substrate are misaligned, the rotating blade may shift from the cutting groove position to cut a portion of the resin sheet. . When the resin sheet is scraped, a large amount of dust is generated. When a leak occurs in the adsorption hole due to the cutting of the periphery of the protrusion, it becomes difficult to adsorb the sealed substrate or the individualized product. Furthermore, the life of the cutting jig is shortened, and frequent replacement of the cutting jig increases the operating cost of the cutting device. Therefore, it is important to precisely cut the position of the cutting line of the sealed substrate to the position of the cutting groove of the cutting jig.

As a cutting device capable of high-precision position detection, "(omitted), a transport mechanism for lifting an electronic circuit board from a supply section and displacing it on a cutting table, and an electronic circuit board placed on the cutting table. A cutting device has been proposed as a cutting device having a cutting portion for cutting an electronic circuit into individual electronic circuits, wherein the conveying mechanism has positioning means for positioning the electronic circuit board (for example, paragraph 1 of Patent Document 1 [ 0009], see FIGS. 1 and 2).

Patent Document 1: Japanese Patent Application Publication No. 2005-353723

However, in the cutting device 1 disclosed in Patent Document 1, the following problems occur. As shown in FIGS. 1 and 2 of Patent Document 1, the transport mechanism 24 is configured by a robot arm and an XYZ moving stage with a gripping portion 25 at the tip. The workpiece 6 is gripped by the gripping portion 25 and moved from the supply table 15 to the cutting table 28. The gripping portion 25 includes a gripping plate 25a, an adsorbing plate 25c, a positioning pin (part of the positioning means) 25d, a spring 25e, and the like. The positioning pin 25d is for gripping the gripping portion 25 while positioning the work 6. On the work 6, a positioning hole (part of the positioning means) 6c is formed at a position corresponding to the positioning pin 25d. The positioning hole 6c is a round hole formed so that the diameter roughly coincides with the positioning pin 25d.

In this conveying mechanism 24, while the positioning pin 25d provided on the gripping plate 25a is inserted into the positioning hole 6c of the work 6 and positioned, the work 6 is absorbed by air adsorption. It is adsorbed on the gripping plate 25a. Therefore, four positioning holes 6c must be formed in the work 6. Since four positioning holes 6c are formed in all the workpieces 6 to be cut, the effort and cost of forming the positioning holes 6c is enormous. If the positioning pins 25d and the positioning holes 6c are not formed with high precision, it may occur that the work 6 cannot be positioned.

An object of the present invention is to provide a cutting device and a cutting method capable of accurately aligning the position of a cutting line of a sealed substrate to a position of a cutting groove of a cutting jig in a cutting device.

In order to solve the above problems, the cutting device according to the present invention includes a plurality of first marks and a cutting jig having a plurality of cutting grooves, and a blood having a plurality of second marks placed on the cutting jig. A cutting mechanism for cutting the cut along a plurality of cutting lines, a transport mechanism for transporting the cut object, and a moving mechanism for relatively moving the jig for cutting and the cutting mechanism, and cutting the cut object by a plurality of cutting lines A cutting device used when manufacturing a plurality of products by cutting in accordance with, the imaging means for imaging a plurality of first marks and a plurality of second marks, and blood placed on the jig for cutting by a transport mechanism A first position comprising control means for positioning the cutting object and the jig for cutting, and consisting of position information of a specific first mark measured and stored in advance based on the image data acquired by the imaging means. By comparing the second positional information consisting of the positional information of the specific second mark measured by the imaging means with the control means, the amount of misalignment indicating the positional misalignment between the jig for cutting and the object to be cut is calculated. , After the conveying mechanism lifts the object to be cut from the jig for cutting, and moves the object to be moved to a target position corresponding to the amount of displacement by moving the conveying mechanism and the jig for cutting relative to the amount of misalignment. The position of the plurality of cutting grooves and the positions of the plurality of cutting lines are repositioned by the mechanism again placing the object to be cut on the jig for cutting, and the object to be moved to the target position, thereby cutting the placed object to be cut again. It is characterized by cutting along a plurality of cutting lines.

In the cutting device according to the present invention, in the above-described cutting device, at least a portion of the means contributing to cutting included in the cutting mechanism, or at least a portion of the means contributing to cutting supplied from the cutting mechanism, includes a plurality of cutting lines. It characterized in that it passes through the cutting groove corresponding to the cut line of the middle.

The cutting device according to the present invention is to be cut at a target position in at least one of the X direction, the Y direction, and the θ direction by relatively moving the conveying mechanism and the cutting jig in the above-described cutting device. After moving the water, the conveying mechanism is characterized by placing the object to be cut on the jig for cutting again.

In the cutting device according to the present invention, in the above-described cutting device, at least two specific first marks are arranged in plan view along a first direction and a second direction orthogonal to the first direction. It is characterized in that at least two of the specific second marks are set according to the first direction and the second direction orthogonal to the first direction in plan view.

The cutting device according to the present invention is characterized in that in the above-described cutting device, the object to be cut is a sealed substrate or a divided sealed substrate.

The cutting device according to the present invention is characterized in that, in the cutting device described above, the object to be cut is a substrate on which functional elements are made in a plurality of regions respectively corresponding to a plurality of products.

In order to solve the above problems, the cutting method according to the present invention includes a step of preparing a jig for cutting having a plurality of cutting grooves and a plurality of first marks, and a plurality of cutting lines and a plurality of second marks. The process of preparing an object to be cut, the process of placing the object to be cut on the jig for cutting by the conveying mechanism, and the cutting tool and the cutting device are moved relatively so that a plurality of cutting lines can be used. A cutting method comprising a step of cutting an object to be cut accordingly, comprising: capturing a specific first mark among a plurality of first marks by means of imaging means to obtain first image data; and first image data The process of acquiring the first positional information consisting of the positional information of the specific first mark by image processing based on the image processing, and imaging the specific second mark among the plurality of second marks by the imaging means The process of acquiring the 2nd image data, and the process of acquiring the 2nd position information which consists of specific 2nd mark position information by image processing based on 2nd image data, and the 1st position information By comparing the 2nd position information, the process of calculating the amount of shift which shows the position shift between a cutting jig and a to-be-cut object, the process by which a conveyance mechanism lifts a to-be-cut object from a cutting jig, and the amount of shift A process of moving the object to be moved to a target position corresponding to the amount of displacement by relatively moving the conveying mechanism and the jig for cutting, and a step of transferring the object to the jig for cutting again by the conveying mechanism. In the step of moving, in the step of aligning the positions of the plurality of cutting grooves and the positions of the plurality of cutting lines by moving the object to be moved to the target position, And a car mounted the blood characterized in that the cutting water cutting.

In the cutting method according to the present invention, in the cutting method described above, in the cutting step, at least a portion of the means contributing to cutting included in the cutting mechanism, or at least a portion of the means contributing to cutting supplied from the cutting mechanism is used. , Passing through the cutting groove corresponding to the cut line among the plurality of cutting lines.

In the cutting method according to the present invention, in the above-described cutting method, in the step of moving the object to be cut, at least one of the X direction, the Y direction, and the θ direction is caused by relatively moving the conveying mechanism and the jig for cutting. Characterized in that the moving object to the target position according to the direction of the.

The cutting method according to the present invention is a specific product comprising at least two of the plurality of first marks according to the first direction and the second direction orthogonal to the first direction in plan view in the above-described cutting method. A specific second mark consisting of at least two of the plurality of second marks is set according to a process of setting a mark of 1 and a second direction perpendicular to the first direction and the first direction in plan view It is characterized in that it comprises a process.

The cutting method according to the present invention is characterized in that in the above-described cutting method, the object to be cut is a sealed substrate or a divided sealed substrate.

The cutting method according to the present invention is characterized in that, in the cutting method described above, the object to be cut is a substrate on which functional elements are made in a plurality of regions respectively corresponding to a plurality of products.

According to the present invention, in a cutting device, a plurality of first cutting marks having a plurality of first marks and a plurality of cutting grooves, and a plurality of cutting lines placed on the cutting jigs to be cut with a plurality of second marks The image picks up the cutting mechanism which cuts along, the conveying mechanism which conveys a to-be-cut object, the moving mechanism which relatively moves a jig for cutting and a cutting mechanism, and a some 1st mark and some 2nd mark. It is equipped with a means and a control means for positioning the object to be cut and the jig for cutting. By comparing the first position information measured by the imaging means and stored in advance with the second position information measured by the imaging means, the amount of displacement between the cutting jig and the object to be cut is calculated. The object to be moved is moved to the target position by moving the conveying mechanism and the cutting jig relatively based on the amount of displacement. Thereby, the to-be-cut object can be accurately cut along a cutting line, without the rotation blade provided in the cutting mechanism being displaced from the position of the cutting groove of the cutting jig.

1A is an overview view showing a sealed substrate used in Example 1 of a cutting device according to the present invention, and is a plan view seen from the substrate side.
1B is an overview view showing a sealed substrate used in Example 1 of a cutting device according to the present invention, and is a front view when viewed from the substrate side.
2A is an overview view showing a jig for cutting corresponding to the sealed substrate shown in FIGS. 1A and 1B, and is a plan view.
2B is an overview view showing a jig for cutting corresponding to the sealed substrate shown in FIGS. 1A and 1B, and is a schematic cross-sectional view taken along line AA.
3A is an overview view showing a jig for cutting in Example 2 of a cutting device according to the present invention, and is a plan view.
3B is an outline view showing a jig for cutting in Example 2 of a cutting device according to the present invention, and is a schematic cross-sectional view taken along line BB.
4 is a plan view showing an outline of a cutting device in Example 3 of the cutting device according to the present invention.
5A is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table using a first mark provided on a cutting jig.
5B is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table using a first mark provided on a cutting jig.
5C is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table using a first mark provided on a cutting jig.
Fig. 5D is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table using a first mark provided on a cutting jig.
Fig. 5E is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table using a first mark provided on a cutting jig.
Fig. 6A is an overview view showing a state in which the sealed substrate mounted on the cutting table is placed in a normal position by correcting the amount of displacement, and is a plan view showing a state in which the sealed substrate is displaced.
Fig. 6B is an overview view showing a state in which the sealed substrate mounted on the cutting table is placed in a normal position by correcting the amount of displacement, and is a plan view showing the state placed in a normal position.
7A is an overview view showing a large-sized sealed substrate used in Example 4 of the cutting device according to the present invention, and is a plan view seen from the substrate side.
7B is an overview view showing a large-sized sealed substrate used in Example 4 of the cutting device according to the present invention, and is a plan view showing a state in which a large-sized sealed substrate is divided into four.
8 is a plan view showing a state of a divided substrate on which a divided sealed substrate is placed on a cutting table.

2A and 2B, in the cutting device, the cutting jig 9 corresponding to the product is attached to the cutting table 8. To the resin sheet 11 of the cutting jig 9, the first marks 17A, 17B, ... made of a plurality of alignment marks (hereinafter, referred to as the first marks 17 as appropriate, are also collectively referred to as other components). Same.) The first marks 17A, 17B, ... are provided in correspondence with the second marks 4A, 4B, ... made of a plurality of alignment marks formed on the sealed substrate 1. In the cutting table 8, the coordinate position of the first mark 17 formed on the resin sheet 11 is measured and stored in advance as a reference coordinate position. By comparing the coordinate position of the reference and the coordinate position of the second mark 4 of the sealed substrate 1 measured on the cutting table 8, the displacement amount of the sealed substrate 1 is calculated. do. By correcting this amount of displacement, the position of the second mark 4 of the sealed substrate 1 can be precisely aligned with the position of the first mark 17 of the cutting jig 9. Therefore, the positions of the plurality of cutting lines set in the sealed substrate 1 can be precisely matched to the positions of the plurality of cutting grooves provided in the cutting jig 9. Thereby, the sealing-completed board | substrate 1 can be accurately cut along a cutting line, without the rotation blade provided in the cutting mechanism shifting from the position of the cutting groove of the cutting jig 9.

Example 1

The first embodiment of the cutting device according to the present invention will be described with reference to Figs. 1A, 1B, 2A, and 2B. Any drawings in the present application document are schematically drawn by omission or exaggeration as appropriate for the sake of clarity. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably.

1A and 1B, the sealed substrate 1 includes a plurality of substrates 2 made of a printed substrate, a lead frame, or the like, and a plurality of regions (described later) included in the substrate 2. It has a chip-shaped component (not shown) and a sealing resin 3 formed so that a plurality of areas are collectively covered. The sealed substrate 1 is an object to be cut which is finally cut into pieces.

As shown in Fig. 1A, the sealed substrate 1 has a plurality of second marks 4A, 4B, ... along the long and short sides of the substrate 2 (marks indicated by + in the figure) Is formed. The second mark 4 is arbitrarily set by the size and number of products. The second mark 4 is picked up by an alignment camera (not shown), and the coordinate position is measured by image recognition. By measuring the coordinate position, the alignment of the sealed substrate 1 is performed. For alignment, a second mark 4 formed on four corners of the sealed substrate 1 is usually used. In Fig. 1A, eight second marks 4 formed on four corners of the sealed substrate 1, 4A, 4B, respectively, in the counterclockwise direction, starting from the upper left of the sealed substrate 1, respectively, … , 4G, 4H.

By connecting the second marks 4 formed opposite to the long side direction and the short side direction of the sealed substrate 1 respectively, a plurality of first cutting lines 5 along the short side direction and along the long side direction The plurality of second cutting lines 6 are virtually set, respectively. The plurality of regions 7 surrounded by the plurality of first cutting lines 5 and the plurality of second cutting lines 6 correspond to products manufactured by reorganization. In Fig. 1A, for example, seven first cutting lines 5 are set in the short side direction, and four second cutting lines 6 are set in the long side direction. Therefore, three regions in the short side direction and six regions 7 in the long side direction are formed, and a total of 18 regions 7 are formed in a lattice shape. The region 7 formed on the sealed substrate 1 is arbitrarily set by the size and number of individualized products.

2A and 2B, the cutting table 8 is a table for cutting and separating the sealed substrate 1 in a cutting device. A cutting jig 9 corresponding to the product is attached to the cutting table 8. The cutting jig 9 includes a metal plate 10 and a resin sheet 11 fixed on the metal plate. The resin sheet 11 needs moderate flexibility to alleviate mechanical impact. The resin sheet 11 is preferably formed of, for example, silicone-based resin, fluorine-based resin, or the like. The cutting table 8 is common to a plurality of products, and only the cutting jig 9 is exchanged corresponding to the product.

The resin sheet 11 of the cutting jig 9 is provided with a plurality of earth-like projections 12 that adsorb and hold a plurality of regions 7 on the sealed substrate 1, respectively. do. The cutting jig 9 is provided with a plurality of adsorption holes 13 penetrating the resin sheet 11 and the metal plate 10 from the surfaces of the plurality of protrusions 12, respectively. The plurality of suction holes 13 are respectively connected to the space 14 provided in the cutting table 8. The space 14 is connected to a suction mechanism (not shown) provided outside.

Protrusions corresponding to a plurality of first cutting lines 5 and a plurality of second cutting lines 6 that partition the plurality of regions 7 of the sealed substrate 1 shown in FIGS. 1A and 1B. (12) A plurality of first cutting grooves 15 and a plurality of second cutting grooves 16 are respectively provided between each other. The plurality of first cutting grooves 15 is along the short side direction of the resin sheet 11 (cutting tool 9), and the plurality of second cutting grooves 16 is the resin sheet 11 (for cutting According to the long side direction of the jig 9), each is formed. About the first cutting line 5 and the second cutting line 6 set at the outermost end of the sealed substrate 1, the outer side of the projection 12 formed on the outermost circumference of the resin sheet 11 The space of has the same role as the cutting groove. The depth of the plurality of first cutting grooves 15 and the plurality of second cutting grooves 16 (distance from the upper surface of the projection 12 to the inner bottom surface of the groove) is about 0.5 mm to 1.0 mm. Is set.

Further, in Example 1, cutting grooves corresponding to the first cutting line 5 and the second cutting line 6 set at the extreme ends of the sealed substrate 1 are not formed in the cutting jig 9. Does not. Without being limited to this, the cutting grooves corresponding to the first cutting line 5 and the second cutting line 6 set at the extreme ends may be formed in the cutting jig 9. In this case, the outer periphery of the projections 12 is enclosed, and a dummy projection is provided.

As shown in Fig. 2A, in correspondence with the position of the second mark 4 (see Fig. 1A) formed on the sealed substrate 1, a plurality of first marks 17A along the long and short sides , 17B, ...) (marks indicated by + in the drawing) are formed on the resin sheet 11. For example, corresponding to the coordinate positions of the second marks 4A, 4B, ..., 4G, 4H provided on the four corners of the sealed substrate 1, the first marks on the four corners of the resin sheet 11 (17A, 17B, ..., 17G, 17H) are formed. Further, corresponding to the second mark 4 formed on the sealed substrate 1, the required number of first marks 17 are formed along the long side direction and the short side direction. For example, in Fig. 2A, two first marks 17 are also formed along the long side. Two first marks 17 are formed between the first marks 17A and 17H formed along the long side direction, and two first marks 17 are formed between the first marks 17D and 17E.

1A, 1B, 2A, and 2B, the operation of positioning the sealed substrate 1 on the jig 9 for cutting will be described. In the cutting table 8, the cutting jig 9 is attached to the cutting table 8, and the sealed substrate 1 is placed on the cutting jig 9. Accordingly, the positional information of the first mark 17 formed on the resin sheet 11 of the cutting jig 9 and the positional information of the second mark 4 formed on the sealed substrate 1 are for cutting. It can measure as position information (coordinate position) in the table 8.

First, the image of the first mark 17 formed on the resin sheet 11 is imaged by an alignment camera (not shown) while the sealed substrate 1 is not placed on the cutting jig 9. Acquire data. The coordinate position of the first mark 17 is measured by image recognition based on image data. The measured coordinate position of the first mark 17 is stored in advance as a reference coordinate position in the cutting table 8. For example, the coordinate positions of eight first marks 17A, 17B, ..., 17G, 17H formed on four corners of the resin sheet 11 are stored in advance.

Next, the sealed substrate 1 is placed on the jig 9 for cutting using a transport mechanism (not shown). In a state where the sealed substrate 1 is placed on the cutting jig 9, the second mark 4 formed on the sealed substrate 1 is imaged to obtain image data. Coordinate position of the second mark 4 is measured by image recognition based on the image data. For example, coordinate positions of eight second marks 4A, 4B, ..., 4G, 4H formed on four corners are measured. The measured coordinate position of the second mark 4 is compared with the coordinate position of the first mark 17 memorized in advance. Thereby, the amount of displacement in the X direction, the Y direction, and the θ direction of the sealed substrate 1 can be calculated.

Next, these shift amounts are corrected based on the calculated shift amount. Specifically, first, the sealed substrate 1 is lifted from the jig 9 for cutting using a conveying mechanism (not shown), and the sealed substrate 1 is held in the conveying mechanism. Next, at least one of the X-direction, the Y-direction, and the θ-direction in a state where the sealed substrate 1 is not placed on the jig 9 for cutting and the sealed substrate 1 is held on the transport mechanism. According to the direction of the, the conveying mechanism is moved by an appropriate amount based on the amount of displacement. By moving, the object to be cut is moved to a target position corresponding to the amount of displacement. The target position is a position where the amount of shift decreases to a value close to zero compared to a position where the amount of shift is zero or a position before moving. Next, the sealed substrate 1 is placed on the jig 9 for cutting again using the transport mechanism.

By the steps up to this point, the position of the second mark 4 of the sealed substrate 1 can be precisely aligned with the position of the first mark 17 of the jig 9 for cutting. Specifically, the positional relationship between the first mark 17 and the second mark 4 can be determined as a predetermined positional relationship. Accordingly, at the positions of the plurality of first cutting grooves 15 and the plurality of second cutting grooves 16 provided in the cutting jig 9, the plurality of first cutting lines set in the sealed substrate 1 ( 5) and a plurality of second cutting lines 6 can be precisely positioned. Thereby, the sealing-completed board | substrate 1 can be accurately cut along a cutting line, without the rotation blade provided in the cutting mechanism shifting from the position of the cutting groove of the cutting jig 9.

In response to the configuration of the conveying mechanism (not shown) and the jig 9 for cutting, the conveying mechanism lifts the sealed substrate 1 from the jig 9 for cutting to hold the sealed substrate 1 in the conveying mechanism In, at least one of the X direction, the Y direction, and the θ direction, the jig 9 for cutting may be moved by an appropriate amount based on the amount of displacement. After that, the sealed substrate 1 is placed on the jig 9 for cutting again using a transport mechanism.

Essentially, at least one of the X-direction, the Y-direction, and the θ-direction, with the transport mechanism lifting the sealed substrate 1 from the cutting jig 9 and holding the sealed substrate 1 in the transport mechanism According to one direction, the conveying mechanism and the cutting jig 9 may be relatively moved by an appropriate amount based on the amount of displacement. If necessary, the first cutting groove provided in the cutting jig 9 using the first mark 17 of the cutting jig 9 or the second mark 4 of the sealed substrate 1 (15) Align the position of the (or the second cutting groove 16) with the position of the rotating blade (not shown). The position of the first cutting line 5 (or the second cutting line 6) set on the sealed substrate 1 may be aligned with the position of the rotating blade (not shown). Correction of the amount of misalignment described so far is also performed in other embodiments.

The conveying mechanism is shown in FIG. 4 as "the conveying mechanism 22". The precision of the position (the amount of displacement between the original position and the actual position) between the transport mechanism and the jig 9 for cutting accompanying the relative movement of the transport mechanism and the jig for cutting 9 is sealed. It is small enough to be negligible when compared to the amount of displacement of the substrate 1. For example, the accuracy of the position in the case where the transport mechanism and the cutting jig 9 are repeatedly moved to have the same positional relationship can be neglected when compared to the amount of displacement of the sealed substrate 1. Small enough.

According to this embodiment, the cutting jig 9 corresponding to the product is attached to the cutting table 8. A plurality of first marks 17 corresponding to a plurality of second marks 4 formed on the sealed substrate 1 are provided on the resin sheet 11 of the cutting jig 9. In the cutting table 8, the coordinate position of the first mark 17 formed on the resin sheet 11 is measured and stored in advance as a reference coordinate position. Next, the coordinate position of the second mark 4 of the sealed substrate 1 placed on the cutting table 8 is measured. By comparing the coordinate position of the first mark 17 and the coordinate position of the second mark 4, the amount of misalignment of the sealed substrate 1 can be calculated. By correcting this amount of displacement, the position of the second mark 4 of the sealed substrate 1 can be precisely aligned with the position of the first mark 17 of the cutting jig 9. Therefore, the positions of the plurality of cutting lines set in the sealed substrate 1 can be precisely matched to the positions of the plurality of cutting grooves provided in the cutting jig 9. Thereby, the sealing-completed board | substrate 1 can be accurately cut along a cutting line, without the rotation blade provided in the cutting mechanism shifting from the position of the cutting groove of the cutting jig 9.

According to this embodiment, sealing is completed by comparing the coordinate position of the first mark 17 formed on the jig 9 for cutting with the coordinate position of the second mark 4 formed on the sealed substrate 1. The amount of displacement of the substrate 1 is calculated. Therefore, the dimensional error of the sealed substrate 1 itself, the curvature of the sealed substrate 1, and the influence of cooling water, etc., including the case where the sealed substrate 1 is stretched, etc., are mounted on the cutting fixture 9 The amount of misalignment of the sealed substrate 1 in a state can be calculated. Therefore, even if the sealed substrate 1 is in any state, it is possible to improve the accuracy of aligning the position of the cut line set in the sealed substrate 1 to the position of the cutting groove provided in the cutting jig 9.

According to the present embodiment, the position of the cutting line provided in the sealing substrate 1 can be precisely aligned with the position of the cutting groove provided in the cutting jig 9. Therefore, the sealed substrate 1 can be cut along the cutting line without the rotational blade provided in the cutting mechanism being displaced from the position of the cutting groove. Thereby, it can prevent that the resin sheet 11 is cut off by a rotating blade. Therefore, dust is not generated from the jig 9 for cutting or leak is generated in the suction hole 13 of the jig 9 for cutting. Since the rotating blade does not cut the resin sheet 11, the life of the cutting jig 9 becomes long, and the operating cost of the cutting device can be reduced.

Example 2

The second embodiment of the cutting device according to the present invention will be described with reference to Figs. 3A and 3B. The difference from Example 1 is that the alignment mark (first mark) of the cutting jig 9 is formed on the metal plate 10 rather than on the resin sheet 11. The rest of the configuration and operation are the same as those in the first embodiment, and thus explanations are omitted.

As shown in Fig. 3A, in order to correspond to the position of the second mark 4 provided on the sealed substrate 1, the periphery of the resin sheet 11 is enclosed, along the long and short sides. A plurality of first marks 18 (marks indicated by + in the drawing) are formed on the metal plate 10. For example, the four corners of the metal plate 10 so as to correspond to the positions of the second marks 4A, 4B, ..., 4G, 4H (see FIG. 1A) provided on the four corners of the sealed substrate 1. First marks 18A, 18B, ..., 18G, 18H are formed on the. In addition, in order to correspond to the second mark 4 formed on the sealed substrate 1, the required number of first marks 18 can be formed along the long side direction and the short side direction. 3A shows a case where the first mark 18 is formed so as to correspond to all the second marks 4 (see FIG. 1A) formed on the sealed substrate 1.

2A and 2B, the positional information of the first mark 18 formed on the metal plate 10 of the cutting jig 9, and the second formed on the sealed substrate 1 The positional information of the mark 4 can be measured as the positional information on the cutting table 8. The coordinate position of the first mark 18 formed on the metal plate 10 is measured and stored in advance as a reference coordinate position on the cutting table 8. By comparing the coordinate position of the reference and the coordinate position of the second mark 4 of the sealed substrate 1 measured on the cutting table 8, the displacement amount of the sealed substrate 1 is calculated. do. By correcting the amount of misalignment, the second mark 4 of the sealed substrate 1 is made to correspond to the position of the first mark 18 formed along the X and Y directions of the cutting jig 9 ). Therefore, the positions of the plurality of cutting lines set in the sealed substrate 1 can be precisely matched to the positions of the plurality of cutting grooves provided in the cutting jig 9. Thereby, the sealing-completed board | substrate 1 can be accurately cut along a cutting line, without the rotation blade provided in the cutting mechanism shifting from the position of the cutting groove of the cutting jig 9.

In Example 2, the first mark 18 was formed on the metal plate 10 of the jig 9 for cutting. Compared to the resin sheet 11, the metal plate 10 is easy to process the first mark, and the shape of the processing surface is sharp. Therefore, the outline of the first mark 18 formed on the metal plate 10 is clearer than the first mark 17 formed on the resin sheet 11. Thereby, the contrast of the 1st mark 18 by image recognition becomes clear. Therefore, the measurement precision of the coordinate position of the 1st mark 18 of the cutting jig 9 improves, and the positioning precision also improves. Other than that, since the same effects as those of Example 1 are achieved, the description is omitted.

Example 3

The third embodiment of the cutting device according to the present invention will be described with reference to Figs. 4 to 6B. As shown in Fig. 4, the cutting device 19 is a device for reorganizing the object to be cut into a plurality of products. The cutting device 19 includes a substrate supply module A, a substrate cutting module B, and an inspection module C as components, respectively. Each component (each module (A-C)) is detachable and exchangeable with respect to each other component.

The substrate supply module (A) includes a substrate supply mechanism (20) for supplying a sealed substrate (1) corresponding to an object to be cut, a substrate placement unit (21) for exchanging the sealed substrate (1), and sealing completion A transport mechanism 22 for transporting the substrate 1 is provided. The conveyance mechanism 22 is movable in the X direction, the Y direction, and the Z direction, and is also rotatable in the θ direction. After the sealed substrate 1 is positioned in the substrate placing portion 21, it is conveyed to the substrate cutting module B by the conveying mechanism 22.

The cutting device 19 shown in FIG. 4 is a single-cut table type cutting device. Therefore, one cutting table 8 is provided in the substrate cutting module B. The cutting table 8 can be moved in the Y-direction of the drawing by the moving mechanism 23 and can also be rotated in the θ direction by the rotating mechanism 24. A jig 9 for cutting (see FIGS. 2A, 2B, 3A, and 3B) is attached to the table 8 for cutting, and the sealed substrate 1 is placed on the jig 9 for cutting and adsorbed. .

The substrate cutting module B is provided with an alignment camera 25. The camera 25 is independently movable in the X direction. Coordinate position of the second mark 4 (refer to FIG. 1A) formed on the sealed substrate 1 by the camera 25 moving in the X direction and the cutting table 8 moving in the Y direction. Is measured. Thereby, the plurality of first cutting lines 5 along the short side direction of the sealed substrate 1 and the plurality of second cutting lines 6 along the long side direction are virtually set (see FIG. 1A). ).

The substrate cutting module B is provided with a spindle 26 as a cutting mechanism. The cutting device 19 is a single-spindle cutting device provided with one spindle 26. The spindle 26 is independently movable in the X direction and the Z direction. A rotating blade 27 is mounted on the spindle 26. The spindle 26 is provided with a cutting water nozzle (not shown) for spraying cutting water to suppress frictional heat generated by the rotating blade 27 rotating at high speed. The sealed substrate 1 is cut by relatively moving the cutting table 8 and the spindle 26. The rotating blade 27 cuts the sealed substrate 1 by rotating in a plane including the Y direction and the Z direction.

The inspection module C is provided with an inspection table 28. On the inspection table 28, an aggregate consisting of a plurality of products P that have been cut into pieces by cutting the sealed substrate 1, that is, the cut substrate 29 is placed. The plurality of products P are inspected by an inspection camera (not shown), and are selected as good and bad products. The good product is accommodated in the tray 30.

In addition, in this embodiment, the operation of the cutting device 19, conveyance of the sealed substrate 1, alignment of the sealed substrate 1, cutting of the sealed substrate 1, cutting of the finished substrate 29 A control unit CTL for performing operations such as inspection and control is provided in the substrate supply unit A. It is not limited to this, and a control unit CTL may be provided in another unit.

In this embodiment, the cutting device 19 having a single spindle configuration is described as a single cut table method. Not limited to this, the cutting table 8 of the present invention can be applied to a single-spin table system, a twin-spindle configuration cutting device, or a twin-spin-table cutting device or the like.

4 to 6B, the operation of placing the sealed substrate 1 on the jig 9 for cutting attached to the table 8 for cutting will be described. In Example 3, the case where the 1st mark 18 is formed in the metal plate 10 of the jig 9 for cutting in the table 8 for cutting is demonstrated.

5A, the cutting table 8 is arrange | positioned so that the long side direction may be along the X direction. Therefore, the short side direction is arranged to follow the Y direction (in FIG. 5A, from the inside of the paper surface toward the front). Hereinafter, the case where the long side direction of the cutting table 8 is arrange | positioned so that it may be along the X direction is demonstrated.

The cutting jig 9 is attached to the cutting table 8. First marks 18A, 18B, ..., 18G, 18H (see Fig. 3A) are formed at four corners of the metal plate 10 of the jig 9 for cutting. In Fig. 5A, the first marks 18D and 18E of them are shown.

Next, for example, the cutting table 8 is moved to a predetermined position in the Y direction by the moving mechanism 23 (see Fig. 4), and the alignment camera 25 is moved in the X direction. By this, the camera 25 is stopped on the specific first mark 18D in the cutting jig 9. The first mark 18D is picked up by the camera 25, and image data (first image data) is acquired. By recognizing the image based on the image data, the coordinate position (first position information) of the first mark 18D is measured and stored. Further, the camera 25 is moved in the + X direction, and similarly, the coordinate position of the first mark 18E is measured and stored. In this way, the first mark formed on the metal plate 10 of the jig 9 for cutting is moved by moving the table 8 for cutting in the Y direction and also moving the camera 25 in the X direction. The coordinate position in (18) can be measured and memorized. In response to the need, the coordinate positions of the first mark 18 are measured and stored as many times as necessary. These coordinate positions (first position information) are referred to as the coordinate positions of the reference for alignment in the cutting table 8. In this case, for example, the coordinate positions of the two first marks 18D and 18E along the X direction and the coordinates of the two first marks 18B and 18C along the Y direction (see FIG. 3A). Measure the location. The measured data of the coordinate positions of the first marks 18D, 18E, 18B, and 18C is sent to the control unit CTL (see FIG. 4) of the cutting device 19 and stored in advance.

Next, as shown in Fig. 5B, using the transport mechanism 22 (see Fig. 4), the sealed substrate 1 is placed on the cutting jig 9 for cutting. At this time, the sealed substrate 1 may be displaced from a predetermined position of the jig 9 for cutting.

Next, as shown in Fig. 5C, by moving the cutting table 8 in the Y direction, and also by moving the camera 25 in the X direction, for example, to the sealed substrate 1 The camera 25 is stopped on the formed specific second mark 4D. The second mark 4D is picked up by the camera 25 to obtain image data (second image data). The coordinate position (second position information) of the second mark 4D is measured by image recognition based on the image data. Similarly, the coordinate position of the 2nd mark 4E is measured. In this case, the coordinate positions of the two second marks 4D and 4E along the X direction and the coordinate positions of the two second marks 4B and 4C along the Y direction (see FIG. 1A) are measured. . Data of the coordinate position (second position information) of the measured second marks 4D, 4E, 4B, and 4C is sent to the control unit CTL.

In the control unit CTL, the coordinate positions of the first marks 18D, 18E, 18B, and 18C of the cutting jig 9 stored in advance and the second marks 4D of the measured sealed substrate 1 , 4E, 4B, 4C). By processing the data at these coordinate positions, the displacement in the X direction, the displacement in the Y direction, and the displacement in the θ direction can be calculated, respectively.

As a result of data processing the coordinate position of the first mark of the cutting jig 9 stored in advance and the coordinate position of the second mark of the measured sealed substrate 1, the control unit CTL seals the completed substrate. When it is judged that there is no misalignment of (1), the cutting table 8 is moved in the + Y direction as it is with the sealed substrate 1 placed. Using the spindle 26 (see FIG. 4), the sealed substrate 1 is cut along the cutting line.

As a result of the data processing, when the control unit CTL determines that the displacement of the sealed substrate 1 is occurring, the sealed substrate 1 is placed on the cutting jig 9 as shown in FIG. 5D. The conveyance mechanism 22 (refer FIG. 4) lifts the sealed board | substrate 1 from the cutting jig 9, maintaining the state at the time of being carried out. Based on the amount of displacement calculated by the control unit CTL, the conveyance mechanism 22 corrects the amount of displacement in the X, Y, and θ directions of the sealed substrate 1, thereby sealing the substrate 1 Is moved above the predetermined position of the jig 9 for cutting. Specifically, the conveyance mechanism 22 moves by an appropriate amount based on the amount of displacement according to at least one of the X direction, the Y direction, and the θ direction.

Next, as shown in Fig. 5E, the transport mechanism 22 cuts the sealed substrate 1 at a position where the amount of misalignment in the X, Y, and θ directions of the sealed substrate 1 is corrected. It is placed on the top of the jig 9 again. As a result, the sealed substrate 1 is accurately positioned at a predetermined position of the cutting jig 9. Therefore, the position of the cutting line of the sealed substrate 1 can be precisely aligned with the position of the cutting groove provided in the cutting jig 9. In the state where the cutting line of the sealed substrate 1 is precisely positioned in the cutting groove of the cutting jig 9, the sealed substrate 1 can be cut.

6A and 6B planarly show the operation of positioning the sealed substrate 1 shown in FIGS. 5A to 5E at a predetermined position of the cutting jig 9. As shown in Fig. 6A, in the state where the sealed substrate 1 is placed on the cutting table 8, the positions of the sealed substrate 1 are shifted in the X direction, the Y direction, and the θ direction, respectively. . In Fig. 6A, a region SUB surrounded by a dotted line is a region where the sealed substrate 1 on the cutting table 8 is placed. For example, a shift amount in the θ direction is first calculated from the coordinate positions of the second marks 4D and 4E of the sealed substrate 1. By correcting the amount of misalignment in the θ direction, the long side direction and the short side direction of the sealed substrate 1 can be arranged parallel to the long side direction and the short side direction of the cutting table 8. From this state, by correcting the amount of misalignment between the X direction and the Y direction, the sealed substrate 1 can be placed in a predetermined area SUB of the cutting table 8, as shown in Fig. 6B. have.

According to this embodiment, in the cutting device 19, the conveyance mechanism 22 was made movable in the X direction, the Y direction, and the Z direction, and was also rotatable in the θ direction. Thereby, even when the sealed substrate 1 was shifted from a predetermined position of the cutting jig 9, it was possible to correct the displacement amount of the sealed substrate 1 by the transport mechanism 22. The sealed substrate 1 is lifted again by the transport mechanism 22 while the sealed substrate 1 is displaced from a predetermined position of the cutting jig 9. From this state, the transport mechanism 22 is moved by the amount of displacement of the sealed substrate 1, and is stopped above the predetermined position of the cutting jig 9. Thereafter, the sealed substrate 1 is placed on the jig 9 for cutting. Since the sealed substrate 1 can be placed at a predetermined position of the cutting jig 9, the position of the cutting line of the sealed substrate 1 can be precisely aligned with the cutting groove of the cutting jig 9. . Without adding new components or new functions to the existing cutting device 19, the alignment of the sealed substrate 1 can be accurately performed. Without improving the cutting device 19 and without incurring a cost, the alignment of the sealed substrate 1 can be accurately performed. Therefore, while suppressing the cost of the cutting device 19, the precision and yield of cutting can be improved.

According to this embodiment, it is possible to cut the sealed substrate 1 in a state where the position of the cutting line of the sealed substrate 1 is precisely positioned at the position of the cutting groove of the cutting jig 9. Therefore, it is possible to prevent the resin sheet 11 from being cut by the rotating blade. It is possible to prevent the generation of dust from the cutting jig 9 and the generation of a leak in the suction hole 13 of the cutting jig 9. Since the rotating blade does not cut the resin sheet 11, the life of the cutting jig 9 becomes long, and the operating cost of the cutting device 19 can be reduced. In addition, it is possible to improve the yield of the product and improve the quality of the product.

In addition, in this embodiment, the conveyance mechanism 22 corrects the amount of misalignment in the X, Y, and θ directions of the sealed substrate 1, and the jig 9 for cutting the sealed substrate 1 It was moved by moving above the predetermined position. Without being limited to this, the transport mechanism 22 corrects the amount of displacement in the X direction of the sealed substrate 1, and the table 8 for cutting corrects the amount of displacement in the Y direction and θ direction, and the sealed substrate (1) can be placed in a predetermined position on the jig 9 for cutting. In this case, the transport mechanism 22 may be configured to be movable only in the X direction.

Example 4

A fourth embodiment of the cutting device according to the present invention will be described with reference to Figs. 7A, 7B, and 8. In the fourth embodiment, a description will be given of a method of cutting and reorganizing a large-sized sealed substrate that cannot be mounted on the cutting table 8 of the conventional cutting device 19 described above.

As shown in Fig. 7A, for example, the large-sized sealed substrate 31 has a size of 600 x 500 mm. On the sealed substrate 31, a plurality of second marks 32 (marks indicated by + in the figure) are formed along the long and short sides of the substrate. In Fig. 7A, eight second marks 32 formed on four corners of the sealed substrate 31, starting from the upper left of the sealed substrate 31, are counterclockwise, respectively, 32A, 32B, ... , 32G, 32H. In addition to the four corners of the sealed substrate 31, a plurality of second marks 32 are formed in the long side direction and the short side direction. Although not shown, a plurality of regions formed in each of the four-divided portions (the four-divided portions by broken lines and two-dot chain lines) in the sealed substrate 31 includes a plurality of regions 7 shown in FIGS. 1A and 1B. ).

For example, since the size of the sealed substrate that can be mounted on the cutting table 8 of the cutting device 19 shown in FIG. 4 is at most 320 × 320 mm, for cutting the sealed substrate 31 It cannot be placed on the table 8. Therefore, it is not possible to cut the sealed substrate 31 using the cutting device 19 as it is. Thus, the sealed substrate 31 is divided into sizes that can be mounted on the cutting table 8. For example, in order to divide the sealed substrate 31 into four, the dividing line 33 along the short side direction and the dividing line 34 along the long side direction are set.

Next, as shown in Fig. 7B, the sealed substrate 31 is cut along the dividing line 33 and the dividing line 34 by means of dividing the large-sized sealed substrate 31. Thereby, the sealed substrate 31 is divided into four, and is divided into a sealed substrate 35 having a size of 300 x 250 mm. The divided sealing substrates 35A, 35B, 35C, and 35D have a size that can be mounted on the cutting table 8 of the cutting device 19. By dividing the sealed substrate 31, the warpage, internal stress, etc. originally held by the sealed substrate 31 are reduced. Therefore, the divided sealing substrates 35A, 35B, 35C, and 35D change in warpage, dimensions, and the like.

Next, as shown in Fig. 8, for example, one of the sealed substrates 35A in four divisions is placed on the cutting table 8 by the transport mechanism 22. The cutting jig 9 shown in FIGS. 3A and 3B is attached to the cutting table 8. Therefore, a number of first marks 18 are formed on the metal plate 10 of the jig 9 for cutting. Within the range of the predetermined area SUB of the cutting table 8, the sealed substrate 35A can be placed.

In the sealed substrate 35A, any one of the second marks 32I formed along the long side direction is 32I, and the second of any one of the second marks 32 formed along the short side direction. The mark of is called 32J.

The second mark 32A, 32I formed along the long side direction of the sealed substrate 35A by the camera 25 for alignment (see Fig. 4), and the second mark formed along the short side direction ( 32B, 32J). The coordinate positions of these measured second marks 32A, 32I and 32B, 32J are compared with the coordinate positions of the first marks 18A, 18H, and 18B, 18C that have been previously stored. Thereby, the amount of displacement of the sealed substrate 35A can be calculated. By correcting this shift amount, the position of the second mark 32 of the sealed substrate 35A can be aligned so as to correspond to the position of the first mark 18 of the cutting table 8. Therefore, the position of the cutting line provided in the cutting jig 9 can accurately match the position of the cutting line set in the sealed substrate 35A. Thereby, the divided sealing substrate 35A can be accurately cut along the cutting line without shifting the rotating blade from the position of the cutting groove of the cutting jig 9. Similarly, the divided sealing substrates 35B, 35C, and 35D are placed on the cutting table 8 and cut.

According to the present embodiment, by dividing the large-sized sealing substrate 31 that cannot be mounted on the cutting table 8 of the existing cutting device 19, it is divided using the existing cutting device 19. The sealed substrate 35 can be cut. This was made possible by adopting a positioning method for measuring coordinate positions using the alignment camera 25 rather than the conventional positioning method using a positioning pin. Precise alignment is achieved by comparing the coordinate position of the second mark 32 of the divided sealing substrate 35 with the previously stored coordinate position of the first mark 18 of the cutting table 8. You can. Therefore, by dividing a large sealed substrate which cannot be mounted on the cutting table 8, it becomes possible to cut using the existing cutting device 19.

According to this embodiment, the large sealed substrate 31 can be divided, and the divided sealed substrate 35 can be cut. By dividing the sealed substrate 31, the warpage and internal stress of the sealed substrate 31 are reduced, so that the divided sealed substrate 35 undergoes warpage, dimensions, and the like. Even when the dimension of the divided sealed substrate 35 changes, the coordinate position of the second mark 32 of the sealed substrate 35 is measured, so that the change in dimensions can be corrected. Therefore, it is possible to accurately position the divided sealing substrate 35 and the cutting table 8.

According to this embodiment, the normal sealed substrate 1 and the divided sealed substrate 35 can be cut using the same cutting device 19 and the same cutting table 8. Therefore, the positioning of the sealed substrate 1 and the divided sealed substrate 35 can be accurately performed without adding new components or new functions to the existing cutting device 19. Without improving the cutting device 19, and without incurring a cost, it is possible to precisely align the sealed substrate. Therefore, it is possible to cut the sealed substrate having various sizes while suppressing the cost of the cutting device 19.

In each embodiment, a case is shown in which a sealed substrate including a chip-shaped element (semiconductor chip, etc.) is cut as an object to be cut. Without being limited to this, the present invention can be applied to the case where the next to-be-cut object is cut into pieces to be cut into pieces other than the sealed substrate. First, it is a case in which a semiconductor wafer made of silicon, a compound semiconductor, and a functional element such as a circuit element and a microelectromechanical systems (MEMS) is made is reorganized. Second, products such as chip resistors, chip capacitors, chip-type sensors, and surface acoustic wave devices are manufactured by reorganizing ceramic substrates and glass substrates made of functional elements such as resistors, capacitors, sensors, and surface acoustic wave devices. Is the case. In these two cases, a semiconductor wafer, a ceramic substrate, or the like corresponds to a substrate on which functional elements corresponding to a plurality of regions are respectively made. Third, the resin molded article is reorganized to manufacture optical components such as lenses, optical modules, and light guide plates. Fourth, it is a case in which a resin molded article is reorganized to produce a general molded product. Fifth, it is a case of manufacturing a glass plate used as a cover for various electronic devices. In various cases including the above-mentioned five cases, the contents described so far can be applied.

In each example, a case where a to-be-cut object having a rectangular shape having a long side direction and a short side direction is cut is shown as the object to be cut. The present invention can be applied not only to this, but also in the case of cutting an object having a square shape or in the case of cutting an object having a substantially circular shape such as a semiconductor wafer.

In each example, the amount of misalignment was calculated by comparing the coordinate position of the second mark formed on the sealed substrate with the first mark formed on the jig 9 for cutting. Without being limited to this, patterns other than the second mark can be used as a plurality of alignment marks. Positioning can be performed using the actual circuit pattern formed on the semiconductor wafer, the pattern of the terminal for external connection on the sealed substrate, the projection electrode (bump, ball in BGA), or the like.

In each example, a jig 9 for cutting having a metal plate 10 and a resin sheet 11 fixed on the metal plate was attached to the table 8 for cutting. Without being limited to this, a jig 9 for cutting composed of one or a plurality of types of metals, in other words, a jig 9 for cutting made of metal can be used. The jig 9 for cutting which consists of 1 type or multiple types of resin, in other words, the jig 9 for cutting made of resin can be used. The main body of the cutting jig 9 may be moved directly by the moving mechanism 23 and the rotating mechanism 24 without using the cutting table 8.

In each example, a rotating blade was used as a cutting mechanism. Without being limited to this, a wire saw, band saw, laser light, water jet, blast, or the like may be used. In the case of using a wire saw and a band saw, a through hole as a space through which a blade (wire saw, band saw), which is a means contributing to cutting, passes is provided in the cutting jig. In the case of using laser light, water jet, or blast, a through hole as a space through which their means contributing to cutting passes is provided in the cutting jig. From these, the "cutting groove" in the present invention includes a slit-shaped through hole penetrating the "cutting jig". At least a part of means (rotating blade, wire saw, band saw, etc.) contributing to cutting included in the cutting mechanism passes through the "cutting groove". At least a part of the means (laser light, high-pressure injection water, abrasive grains, etc.) contributing to the cutting supplied from the cutting mechanism passes through the "cutting groove".

The present invention is not limited to each of the above-described embodiments, and can be employed by arbitrarily and appropriately combining, changing, or selecting as necessary, without departing from the spirit of the present invention.

1: Sealed substrate (cut material)
2: Substrate
3: sealing resin
4, 4A, 4B,… , 4G, 4H: 2nd mark
5: first cut line (cut line)
6: Second cutting line (cut line)
7: Area (product)
8: Cutting table
9: jig for cutting
10: metal plate
11: resin sheet
12: protrusion
13: adsorption hole
14: space
15: first cutting groove (cutting groove)
16: second cutting groove (cutting groove)
17, 17A, 17B,… , 17G, 17H: First mark
18, 18A, 18B,… , 18G, 18H: First mark
19: cutting device
20: substrate supply mechanism
21: substrate mounting unit
22: conveying mechanism
23: moving mechanism
24: rotating mechanism
25: Alignment camera (imaging means)
26: spindle (cutting mechanism)
27: rotating blade
28: inspection table
29: cut substrate
30: tray
31: large-sized sealed substrate
32, 32A, 32B,… , 32G, 32H, 32I, 32J: 2nd mark
33: dividing line
34: dividing line
35, 35A, 35B, 35C, 35D: Divided sealed substrate (cut material)
A: Board supply module
B: Substrate cutting module
C: Inspection module
P: Product
CTL: Control unit (control means)
SUB: Area where the sealed substrate is placed

Claims (12)

A cutting jig having a plurality of first marks and a plurality of cutting grooves, and a cutting mechanism placed on the cutting jig to cut a cut object having a plurality of second marks along a plurality of cutting lines, A conveying mechanism for conveying the object to be cut, a moving mechanism for relatively moving the jig for cutting and the cutting mechanism, and manufacturing a plurality of products by cutting the object to be cut along the plurality of cutting lines As a cutting device used when
Imaging means for imaging the plurality of first marks and the plurality of second marks;
And control means for positioning the cutting object placed on the cutting jig and the cutting jig by the conveying mechanism,
With the first positional information consisting of the positional information of the specific first mark measured and stored in advance based on the image data acquired by the imaging means, and in the state where the object to be cut is placed and adsorbed on the jig for cutting. By comparing the second positional information consisting of the positional information of the specific second mark measured by the imaging means, the control means calculates a shift amount indicating the positional shift between the cutting jig and the object to be cut. and,
After the adsorption to the object to be cut is released, the conveying mechanism lifts the object to be cut from the jig for cutting and moves the conveying mechanism and the jig for cutting relative to the amount of displacement. After the object to be cut is moved to a target position corresponding to the amount of displacement, the transport mechanism places the object to be cut again on the jig for cutting and adsorbs it,
The position of the plurality of cutting grooves and the position of the plurality of cutting lines are aligned by moving the object to be cut to the target position,
It characterized in that the cutting mechanism is cut along the plurality of cutting lines, after the object to be cut is placed on the cutting jig again and adsorbed. Cutting device. According to claim 1,
At least a portion of the means contributing to cutting included in the cutting mechanism, or at least a portion of the means contributing to cutting supplied from the cutting mechanism, corresponds to the cutting line that is cut out of the plurality of cutting lines Cutting device characterized by passing through the groove. According to claim 2,
By moving the conveying mechanism and the cutting jig relatively, after moving the object to be moved to the target position in at least one of the X direction, the Y direction, and the θ direction, the conveying mechanism Cutting device, characterized in that to place the object to be cut again on the jig for cutting. The method according to any one of claims 1 to 3,
At least two specific first marks are set according to a first direction in plan view and a second direction orthogonal to the first direction,
The cutting device according to claim 2, wherein the specific second mark is set at least two according to a first direction in plan view and a second direction orthogonal to the first direction. The method according to any one of claims 1 to 3,
The object to be cut is a sealing device, characterized in that the sealed substrate or a divided sealed substrate. The method according to any one of claims 1 to 3,
The object to be cut is a cutting device, characterized in that the substrate is made of functional elements in a plurality of regions respectively corresponding to the plurality of products. A process for preparing a jig for cutting having a plurality of cutting grooves and a plurality of first marks, a process for preparing a cut object having a plurality of cutting lines and a plurality of second marks, and for cutting by a transport mechanism And a step of placing the object to be cut on the jig, and a step of cutting the object to be cut along the plurality of cutting lines by using the cutting mechanism by relatively moving the cutting jig and the cutting mechanism. And, as a method of manufacturing a plurality of products by cutting the object to be cut,
A step of capturing a specific first mark among the plurality of first marks by the imaging means to obtain first image data;
A step of acquiring first positional information consisting of positional information of the specific first mark by image processing based on the first image data;
A step of adsorbing the object to be cut placed on the jig for cutting,
A step of acquiring second image data by imaging a specific second mark among the plurality of second marks by the imaging means while the object to be cut is placed and adsorbed on the jig for cutting;
A step of acquiring second position information consisting of the positional information of the specific second mark by image processing based on the second image data;
A step of calculating a shift amount indicating a position shift between the cutting jig and the object to be cut by comparing the first position information and the second position information;
After the adsorption to the object to be cut is released, the conveying mechanism lifts the object to be cut from the jig for cutting,
A step of moving the object to be moved to a target position corresponding to the amount of displacement by relatively moving the conveying mechanism and the cutting jig based on the amount of displacement;
The conveying mechanism is provided with a step of placing the object to be cut again on the jig for cutting and adsorbing it.
In the moving step, the position of the plurality of cutting grooves and the position of the plurality of cutting lines are aligned by moving the object to be cut to the target position,
A method characterized by cutting the adsorbed object again placed on the jig for cutting in the cutting step following the process of placing the object to be cut again and adsorbing it. The method of claim 7,
In the cutting step, at least a portion of the means contributing to cutting included in the cutting mechanism, or at least a portion of the means contributing to cutting supplied from the cutting mechanism, is cut among the plurality of cutting lines. Method for passing through the cutting groove corresponding to the line. The method of claim 8,
In the step of moving the object to be cut, the object is cut at the target position in at least one of the X direction, the Y direction, and the θ direction by relatively moving the transport mechanism and the cutting jig. A method characterized by moving water. The method according to any one of claims 7 to 9,
A step of setting the specific first mark comprising at least two of the plurality of first marks according to a first direction in plan view and a second direction orthogonal to the first direction;
Comprising a step of setting the specific second mark comprising at least two of the plurality of second marks according to a first direction in plan view and a second direction orthogonal to the first direction How to feature. The method according to any one of claims 7 to 9,
The method, characterized in that the object to be cut is a sealed substrate or a divided sealed substrate. The method according to any one of claims 7 to 9,
The object to be cut is a method in which a functional element is made in a plurality of regions corresponding to a plurality of products, respectively.

Images