TWI683388B - Electronic device mounting device and mounting method, and manufacturing method of packaged component - Google Patents

Abstract

[Problem] To provide a mounting device that mounts support substrates such as marks for position detection in each mounting area, and mounts electronic components with high accuracy and high efficiency. [Solution Means] The mounting device (1) of the embodiment includes: a stage portion (20) that moves a stage (21) on which a support substrate (W) having a plurality of mounting areas is placed, and has a plurality of mounting The first and second mounting heads (43) of the tool (43a, 43b) move the mounting portion (40), the first identification portion that identifies the overall position of the support substrate (W), and the identification is held by the mounting tool (43a) , 43b) the second identification part of the position of the electronic component; wherein, the movement of the stage (21) and the first and second mounting heads (43) is based on the position data of the support substrate (W) and the electronic component, Correction data of the stage and tools to arrange the rows of the mounting area on the mounting line set in the X direction, and to share the electronic components with the first and second mounting heads (43) in the multiple mounting areas Way control.

Description

Electronic device mounting device and mounting method, and manufacturing method of packaged component

The embodiment of the present invention relates to a mounting device and a mounting method of an electronic component, and a manufacturing method of a packaging component.

Conventionally, there has been known a semiconductor packaging process such as CSP (Chip Size Package) and BGA (Ball Grid Array) using an interposer (intermediate substrate). In addition, a process called wafer level package (LWP), which does not use an interposer substrate and does not divide into individual semiconductor chips and maintains the wafer state for packaging, is also known. WLP has the advantage that it does not use an interposer substrate, and can reduce the thickness of a semiconductor package and the manufacturing cost.

In WLP, in order to prevent the area of the surface of the semiconductor wafer on which the electrode pad is formed from protruding, it is known to form a redistribution layer including the I/O terminals of the semiconductor package on the semiconductor wafer, fan-in/wafer-level packaging (fan in-WLP: FI-WLP). In recent years, there has also been proposed a fan-out/wafer-level package (FO-WLP) that protrudes a region of a semiconductor wafer and forms a redistribution layer including I/O terminals of a semiconductor package. FO-WLP is also applicable to a multi-chip package (MCP) in which semiconductor chips such as RAM, flash memory, CPU, or a plurality of types of electronic components such as diodes and capacitors are mounted in one package. Attention.

Here, the MCP is a person who mounts plural types of electronic components in one package as described above. In this type of MCP, variations in the mounting positions of electronic components mounted on the same package affect each other's electrical characteristics. Therefore, high mounting accuracy is required for mounting of each electronic component. In the manufacturing process of the semiconductor package using the aforementioned interposer, since the alignment marks for position recognition are provided on each mounting area on the interposer, the alignment marks are recognized for each mounting area and the electronic components are The method of positioning and mounting the mounting area (hereinafter referred to as the area identification method) realizes mounting with high position accuracy.

In the FO-WLP process, first, a plurality of semiconductor wafers are mounted in rows and columns on a supporting substrate, and then the gaps between the semiconductor wafers are sealed with resin and the plurality of semiconductor wafers are integrated to form a The wafer formed by the semiconductor process is shaped like a wafer. On this pseudo-wafer, a redistribution layer for providing I/O terminals is formed. After the plural semiconductor wafers are resin-sealed and integrated, the support substrate is peeled off and removed. However, when you want to manufacture MCP with FO-WLP, because there is no image recognition pattern that can be used for position recognition on each mounting area of the mounted semiconductor wafer on the support substrate, it is suitable for the intermediary substrate. The area identification method is not practical.

When the area recognition is not performed, the overall position of the support substrate is recognized by recognizing an alignment mark indicating the outline position of the support substrate or the position of the entire substrate, and each mounting area on the support substrate depends on the overall position of the support substrate A method of mounting a semiconductor wafer (hereinafter, referred to as a global identification method). In addition, when the deviation of the mounting position of the semiconductor wafer of the MCP is, for example, considering the diameter of the standard electrode pad (20 μm) and the formation pitch (35 μm) of the semiconductor wafer, the terminals of the semiconductor wafer and the redistribution layer are formed On the premise of ensuring the contact area between the terminals and avoiding the contact between the adjacent terminals, it is desirable to suppress it to ±7 μm or less.

However, the mounting device required to mount the semiconductor wafer on the substrate with the alignment mark in each mounting area such as the intermediary substrate is subjected to the setting of the global recognition method. When used in the FO-WLP process, Mounting accuracy may cause mounting errors of more than ±7 μm, and supporting substrates that are not provided with alignment marks in each mounting area cannot mount semiconductor wafers with high accuracy. Therefore, in the process of applying the FO-WLP of the global recognition method, there is no mounting device that can mount a semiconductor wafer with a position accuracy of ±7 μm or less.

If only the mounting accuracy is improved, it is considered that the support substrate used in the FO-WLP process is provided with an alignment mark to correspond to each mounting area, and the area identification method is applied. However, the support substrate of FO-WLP is removed from the pseudo wafer after the pseudo wafer is formed, and cannot be used as a product. For this kind of equipment and engineering to support the formation of marks on the substrate, it will not only bring about an increase in equipment costs, equipment installation space, and the number of projects. In the mounting process, it is also necessary to identify the area mark every time the semiconductor wafer is mounted. The operation time of one semiconductor wafer has also increased. From this point of view, the application of the area identification method increases the manufacturing cost of the semiconductor package and detracts from the advantages of WLP.

In addition, in order to cope with mounting errors of semiconductor wafers, a technique of forming a redistribution layer in consideration of mounting errors of semiconductor wafers has been proposed. This technique is to measure the mounting error (position deviation from the ideal position) of each semiconductor wafer on the pseudo-wafer in advance before exposing the circuit pattern of the redistribution layer when the pseudo-wafer is exposed. When each semiconductor wafer is scanned, the position information of each circuit pattern included in the drawing data is corrected based on the mounting error of the semiconductor wafer to be exposed. This technique can also be applied to a single-chip package in which one semiconductor chip is incorporated into one semiconductor package. However, in the case of MCP, because the drawing data of the circuit pattern is created in units of packages, when the relative position deviation between the semiconductor chips in the same package is generated, it is impossible to correspond only by correcting the position information of the drawn circuit pattern.

Furthermore, the mounting device used in the FO-WLP process is required to shorten the mounting time of semiconductor wafers. That is, the formation process of the redistribution layer on the suspected wafer is usually carried out for one suspected wafer collectively. In contrast, the mounting process for the semiconductor wafers supporting the substrate is carried out separately for each semiconductor wafer. Considering such processing time, since the semiconductor wafer mounting process requires time compared to the redistribution layer forming process, it is required to shorten the semiconductor wafer mounting time. If only the mounting time is to be shortened, consider the application of mounting devices with multiple mounting heads. However, if only a plurality of mounting heads are applied, the effect of the movement error generated on each mounting head will further reduce the mounting accuracy of the semiconductor wafer. Therefore, in the mounting device used in the FO-WLP process, it is required to improve the mounting accuracy of electronic components such as semiconductor wafers and shorten the mounting time.

In addition, the FO-WLP process is a process that uses wafers on a wafer substrate called "wafer level", that is, on a support substrate. In contrast, recently, it has been proposed to use organic substrates such as glass/epoxy (FR-4) substrates used in the process of the printed circuit board (Printed Circuit Board) and glass substrates used in the manufacture of liquid crystal display panels as support substrates The process of substrate base called fan-out, panel and package (FO-PLP).

In the FO-WLP process, as it is called wafer level, a silicon wafer is used for the support substrate. This is because the equipment used for the formation process of the wiring layer of the silicon wafer can be used in the formation process of the redistribution layer. Similarly, the process of forming the wiring layer is also used in the process of the printed circuit board and the process of the liquid crystal display panel. Therefore, the equipment used for the process of the printed circuit board and the process of the liquid crystal display panel can be applied to the process of the FO-PLP.

When an organic substrate and a glass substrate are used as the support substrate, there is an advantage that the cost can be reduced compared to the case of using a silicon wafer. In addition, it has the advantage that the size of the support substrate can be larger than that of the silicon wafer. Because the larger the support substrate, the number of MCP and other semiconductor packages that can be produced at one time can be increased, and the productivity can be improved. Therefore, it is expected that requirements for mounting devices for electronic components suitable for such FO-PLP processes will arise.

Among them, in the manufacturing process of the printed circuit board, the current situation is that the size of the copper-clad laminate as the base material is 1020×1020 mm or 1020×1220 mm. When a substrate with a side exceeding 1000 mm is used as a support substrate, it is estimated that the convenience of processing is impaired. Therefore, in the FO-PLP process, it is predicted that the copper-clad laminate will be used as the support substrate to the extent of four divisions. On the other hand, in the manufacturing process of liquid crystal display panels, it is difficult to use more than 5 generations (approximately 1000×1200 mm or more), in particular, glass substrates (so-called (Mother glass) manufacturing equipment, so it is presumed that the 3rd to 4th generation (approximately 550×650mm to 680×880mm) manufacturing equipment that is not used due to the enlargement of the liquid crystal display panel should be used. Therefore, in the FO-PLP process, the size of the support substrate required for the mounting device of the electronic component is about 4 times larger than the size of the support substrate in the previous FO-WLP process, which is 300×300 mm. The size of about 600×600mm

When a semiconductor wafer is mounted on a support substrate having a size of 600×600 mm as described above, the stage on which the support substrate is placed becomes large, so the moving distance of the mounting head is increased. Therefore, the time required to transport the semiconductor wafer becomes longer, and it is expected that the mounting efficiency of the semiconductor wafer will decrease. Also, in the case of MCP, that is, in the case of multiple semiconductor wafers with different mounting types, the time required for mounting depends on the size of the semiconductor wafer and the type of adhesive used for mounting the semiconductor wafer, etc. Pressing time or pressing/heating time) are different, and the mounting efficiency of semiconductor wafers with long mounting time is affected. Therefore, the mounting efficiency of the entire package is reduced because of the long time required for mounting the semiconductor wafer. Therefore, it is presumed that the mounting device used in the FO-PLP process is required to improve the mounting accuracy of electronic components such as semiconductor wafers, and also to shorten the mounting time in response to the enlargement of the support substrate. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2008-041976 　　 [Patent Document 2] JP 2009-259917 　　 [Patent Document 3] International Publication No. 2007/072714 　　 [Patent Document 4] JP 2013-058520

[Problems to be solved by the invention]

The problem to be solved by the present invention is to provide a mounting device and mounting method for electronic components, and a method for manufacturing a packaged component to which the mounting method is applied. For the detection of positions not formed in each mounting area A support substrate with a pattern such as a mark, particularly a support substrate that is expected to be enlarged, can also be used to mount electronic components such as semiconductor wafers with high accuracy and high efficiency in each mounting area. [Means for solving the problem]

The electronic component mounting device of the embodiment is an electronic device mounting device for mounting electronic components on a support board, and includes a stage section including a plurality of mounting regions having a plurality of mounting regions for mounting the electronic components The stage for supporting the substrate, and a stage moving mechanism for moving the stage in the Y direction perpendicular to the X direction along one direction of the horizontal direction; the mounting portion including: each arranged along the X direction and The first and second mounting heads having a plurality of mounting tools that hold the electronic component, and the first and second mounting heads that hold the electronic component are set along the X direction by the plurality of mounting tools The mounting head moving mechanism that moves on the mounting line; the first identification section, which identifies the overall position of the support substrate placed on the stage; the second identification section, which maintains the identification at the first and second The position of the electronic component of the complex mounting tool of the head; the memory section stores: stage correction data for correcting the movement position error of the stage caused by the stage moving mechanism, and the movement of the mounting head Tool correction data of the movement position error of the first and second mounting heads on each of the plurality of mounting tools caused by the mechanism on the mounting line; the control unit based on the foregoing identification by the first identification unit Position data of the support substrate, the stage correction data memorized in the memory part, the position data of the electronic component held by the complex mounting tool recognized by the second identification part, and the memory memorized in the memory part Tool correction data to sequentially arrange the rows of the mounting area along the X direction of the supporting substrate on the mounting line, and at the same time to arrange the electronic components arranged in a plurality of the mounting areas of the mounting line The operations of the stage moving mechanism and the mounting head moving mechanism are controlled in such a manner that the first and second mounting heads share mounting.

An electronic component mounting method of an embodiment is an electronic component mounting method for mounting an electronic component on a support substrate, comprising: a stage for mounting a support substrate having a plurality of mounting areas for mounting the electronic component Moving position error, the process of storing the correction data of the stage that corrects the moving position error to the memory section; it will be installed on the first and second mounting heads arranged in the X direction along one direction of the horizontal direction, respectively, and maintain the electronic The moving position error of the plural mounting tool of the component is obtained on the mounting line set along the X direction, and the process of storing the tool correction data for correcting the moving position error in the memory section; placing the support on the stage A substrate, a process of simultaneously identifying the overall position of the support substrate placed on the stage; correcting the position of the stage based on the position data of the support substrate and the stage correction data obtained from the position identification process of the support substrate The process of moving the stage in such a manner that the row of the mounting area along the X direction of the complex mounting area is located on the mounting line in sequence; with the first and second mounting The complex mounting tool of the head interactively accepts the electronic component, identifies the position of the electronic component held in the complex mounting tool, and corrects the first based on the identified position data of the electronic component and the tool correction data And the plural mounting tool of the second mounting head, and moving the first and second mounting heads on the mounting line, by the plural mounting tool of the first and second mounting heads The electronic component is shared by the first and second mounting heads in the mounting area located in the mounting line.

A method of manufacturing a packaged component of an embodiment includes the steps of mounting electronic components in a plurality of mounting areas of a support substrate, and collectively sealing the electronic components mounted in the plurality of mounting areas to form a suspect wafer or The process of the pseudo-panel and the process of manufacturing the packaged component by forming a redistribution layer on the electronic component of the suspected wafer or the pseudo-panel. In the method for manufacturing a packaged component of the embodiment, the mounting process of the electronic component includes: acquiring a movement position error of the stage on which the support substrate is mounted, and storing stage correction data for correcting the movement position error in the memory section Engineering; the first and second mounting heads are respectively provided in the X direction along one direction of the horizontal direction, and the moving position error of the plurality of mounting tools that maintain the electronic components is set along the X direction. Obtained on the assembly line, the process of storing the correction data of the tool that corrects the movement position error into the memory section; placing the support substrate on the stage, and identifying the overall position of the support substrate placed on the stage Engineering; correcting the movement of the stage based on the positional data of the supporting substrate and the stage correction data obtained from the position identification process of the supporting substrate, while making the actual position along the X direction in the complex mounting area The row of the mounting area is the project of moving the stage in a manner of being located on the mounting line in sequence; the electronic mounting components are inter-received by the plural mounting tools of the first and second mounting heads, and the identification is kept in the plural The position of the electronic component of the mounting tool, and at the same time, based on the identified position data of the electronic component and the tool correction data, correct the movement of the plurality of mounting tools of the first and second mounting heads, and make the first The first and second mounting heads move on the mounting line, and the electronic components are moved by the plural mounting tools of the first and second mounting heads in the mounting area located on the mounting line with the first 1 and 2 install the head to share the installment project.

The electronic device mounting device and mounting method according to the embodiment will be described below with reference to the drawings. The drawing is a schematic diagram, and the relationship between the thickness and the plane size, the ratio of the thickness of each part, etc. may be different from reality. In the description, the term indicating the up and down direction indicates the relative direction when the mounting surface of the electronic component of the support substrate described later is used as the upper side, and the term indicating the left and right direction if there is no specific description. The front view is used as the reference direction.

[Configuration of mounting device] FIG. 1 is a plan view showing the configuration of the mounting device of the electronic component of the embodiment, FIG. 2 is a front view of the mounting device shown in FIG. 1, and FIG. 3 is the mounting shown in FIG. The right side view of the device, and FIG. 4 is a block diagram showing the configuration of the mounting device shown in FIG. 1. In FIGS. 1 to 3, based on FIG. 1, the left-right direction in the mounting device 1 is X direction, the front-rear direction is Y direction, and the up-down direction is Z direction. The mounting device 1 shown in these figures includes a component supply unit 10 that supplies electronic components such as a semiconductor wafer t, a stage unit 20 that mounts a stage 21 that supports the substrate W, and a semiconductor wafer t that takes out the component supply unit 10 The transfer part 30, the semiconductor part t which receives the semiconductor wafer t taken out by the transfer part 30, and mounts it on the mounting part 40 of the support substrate W mounted on the stage 21, and the control part 50 which controls the operation of each part 10, 20, 30, 40 .

(Component supply part 10) The 　　 component supply part 10 is arrange|positioned at the front center of the base part 1a of the mounting apparatus 1. The component supply unit 10 supplies a semiconductor wafer t that is an electronic component mounted on the support substrate W. The component supply unit 10 includes a wafer ring 11 that holds the resin sheet S of the semiconductor wafer T that is divided into individual semiconductor wafers t, and the wafer ring 11 is detachably held by XY (not shown). When the wafer ring holder 12 is movable in the XY direction by the moving mechanism, and the semiconductor wafer t is taken out by the transfer section 30, the unshown top of the semiconductor ring t lifted from the lower side of the wafer ring 11 is taken out Up institutions. The jacking mechanism is fixedly installed at the take-out position of the semiconductor wafer t by the transfer unit 30. As the jacking mechanism, a mechanism having a publicly known configuration can be used, for example, the mechanism described in Japanese Patent Laid-Open No. 2010-056466.

The component supply unit 10 further includes a wafer ring 11 exchange device (not shown). The exchange device includes a storage portion (also referred to as a cassette provided with a plurality of components for accommodating the wafer ring 11 in the vertical direction) provided in front of the base portion 1a, and is guided between the wafer ring holder 12 and the storage portion The guide portion of the transferred wafer ring 11. The exchange device supplies the unused wafer ring 11 to the wafer ring holder 12, stores the wafer ring 11 after the extraction of the semiconductor wafer t is completed into the storage section, and supplies the new wafer ring 11 to the wafer ring Bracket 12. In addition, for the supply and storage of the wafer ring 11, a wafer ring holding device 32 included in the transfer unit 30 described later is used.

The electronic component mounted on the support substrate W is not limited to one type of semiconductor wafer t, but may be a plurality of types of semiconductor wafers, a semiconductor wafer, a diode, and a capacitor. The mounting device 1 of the embodiment is suitable for mounting a plurality of types of electronic components including semiconductor wafers, diodes, capacitors, etc. on a support substrate W to manufacture an MCP. As an example of the configuration of the MCP, there are a plurality of types of semiconductor wafers, a type of semiconductor wafer and diodes and capacitors, and a plurality of types of semiconductor wafers and diodes and capacitors.

(Platform part 20) The 　　 carrier part 20 is arranged at the rear center on the base portion 1a. The stage unit 20 includes a stage 21 on which the support substrate W having a plurality of mounting areas is placed, and an XY moving mechanism 22 as a stage moving device that moves the stage 21 in the XY direction. The XY moving mechanism 22 is such that each row along the X-direction mounting area of the support substrate W placed on the stage 21 is sequentially located in a certain mounting set on a straight line along the X-direction detailed later To move the stage 21 in line. The XY moving mechanism 22 has the largest support substrate W that can be placed on the stage 21, and can be slightly larger in the X direction than 1/2 the size of the support substrate W in the X direction (1/2X+α) The movement stroke of the range of movement in the Y direction is a movement stroke that can move in a range (Y+α) that is a little larger than the size of the support substrate W in the Y direction. The stage 21 can suction-hold the mounted support substrate W by a suction suction mechanism (not shown).

The support substrate W placed on the stage 21 is, for example, a substrate used for forming a pseudo-panel based on a pseudo-wafer when manufacturing a FO-PLP, and is a glass substrate or an organic substrate (glass/epoxy (FR-4) substrate, etc.), silicon substrate, metal substrate such as stainless steel, etc., but not limited to this. It is also possible to use a substrate for forming a pseudo-wafer suitable for manufacturing using FO-WLP. The pseudo-panel is the same as the pseudo-wafer used in the manufacture of FO-WLP. In order to arrange the electronic components such as individual semiconductor chips in a plane, the arranged electronic components are sealed with resin to form a single plate. By. Therefore, the shape of the support substrate W used for forming the pseudo-panel is not limited to a circle, but may be a quadrangle or other polygons, ellipses, etc., and the shape is not particularly limited. As the support substrate W, it is preferable to apply the substrate used when manufacturing the MCP in the FO-PLP process described above, that is, a substrate in which a plurality of electronic components such as semiconductor chips and capacitors are mounted in each mounting area.

The support substrate W has a plurality of mounting areas in which electronic components such as a semiconductor wafer t are mounted. However, the plurality of mounting areas is an area that is virtually set on the support substrate W, and marks, patterns, and the like indicating the respective mounting areas are not formed. The support substrate W may include an alignment mark for global recognition indicating the position of the entire substrate, but does not include an alignment mark for area recognition indicating the position of each mounting area. The global recognition method refers to a method of detecting the mounting of electronic components on the plurality of mounting areas on the substrate at the position of the substrate once when the electronic components are mounted on the plurality of mounting areas of the support substrate W, respectively. The area recognition method refers to a method of detecting the position of the mounting area of the electronic component each time the electronic component is mounted when the electronic component is mounted on each of the plurality of mounting areas on the support substrate W. In addition, the size of the support substrate W is preferably 300×300 mm or more. In this embodiment, a support substrate W of 600×600 mm is used as an example. That is, in the mounting device 1 of the present embodiment, the stage 21 has a size that can support the support substrate W of 600×600 mm.

(Transfer section 30) The 　　 transfer section 30 includes: a pair of left and right transfer sections 30A, 30B, an intermediate stage 31, and a wafer ring holding device 32, and the two transfer sections 30A, 30B are arranged in a state where the left and right are reversed . The two transfer parts 30A and 30B are arranged separately on the front and both sides of the base portion 1a so as to sandwich the component supply part 10, and have the same configuration except that the left and right are reversed. In the following, the configuration of the left transfer section 30A will be described, and the description of the configuration of the right transfer section 30B will be omitted.

The transfer unit 30A includes a Y-direction moving device 33 extending in the Y direction from the front end of the base portion 1a to the vicinity of the center in the front left side of the base portion 1a. In the Y-direction moving device 33, the Y-direction moving block 34 is supported movably in the Y-direction. The back surface on the upper end side of the Y direction moving block 34 is provided with a rectangular plate-shaped support 35 extending from the Y direction moving block 34 in the horizontal direction of the X direction, that is, to the right in the figure. The back side of the support 35 is provided with an X-direction moving body 36 that is supported by an X-direction moving device (not shown) so as to be movable in the X direction and has a roughly crank shape in plan view. A transfer head 37 is supported at the end of the X-direction moving body 36 shown in the right direction. In addition, a wafer recognition camera 38 is provided on a surface opposite to the surface supporting the transfer head 37 at the right end portion of the X-direction moving body 36 in the drawing.

In the transfer head 37, in the X direction, two suction nozzles (transfer nozzles) 37a and 37b on the left and right are installed so as to be movable in the vertical direction by the Z (up and down) direction moving devices 37c and 37d, respectively. The transfer head 37 is supported by the reversing mechanisms 37e and 37f so that the suction nozzles 37a and 37b can be reversed up and down individually. As a result, the suction nozzles 37a and 37b can be selectively switched to a state in which the suction surface of the semiconductor wafer t is suction-holded downward and a state in which the suction surface is upward. The wafer recognition camera 38 is used to recognize the position of the semiconductor wafer t held in the wafer ring 11 of the component supply section 10.

In addition, in the transfer unit 30A on the left side, the part number of the suction nozzle on the outer side (left side in the figure) is 37a, and the part number of the Z-direction moving device on the outer side is 37c, and the reversal on the outer side is reversed. The part number of the mechanism is set to 37e. However, the left and right transfer parts 30A and 30B are arranged in a state where the left and right are reversed. Here, on the right side of the transfer unit 30B, the right side of the drawing becomes outside, so the part number of the suction nozzle on the right side is 37a, and the part number of the Z direction moving device on the right side is 37c, and the The part number of the reverse mechanism on the right is 37e. Among them, the left transfer head 37 is a first transfer head, and the right transfer head 37 is a second transfer head.

The intermediate stage 31 is for temporarily placing the semiconductor wafer t taken out by the suction nozzles 37 a and 37 b of the left and right transfer heads 37, and is provided at a slightly central position of the base portion 1 a between the component supply section 10 and the stage section 20. The intermediate stage 31 matches the arrangement of the two suction nozzles 37a and 37b of the transfer heads 37 of the left and right transfer sections 30A and 30B, and includes four placement sections 31a to 31d.

The wafer ring holding device 32 is used when supplying and storing the wafer ring 11 to the wafer ring holder 12 of the component supply unit 10. The wafer ring holding device 32 is provided at the right-side end of the support 35 of the left-side transfer section 30A, which is the front side of the surface opposite to the side where the X-direction moving body 36 is provided. The wafer ring holding device 32 includes a rod-shaped support arm 32a provided in an X-direction moving device (not shown) such as an air cylinder so as to advance and retreat in the X direction, and a front end of the support arm 32a shown in the right direction To grip the clamping portion 32b of the wafer ring 11.

Such a transfer unit 30 sequentially takes out the semiconductor wafer t from the component supply unit 10 and transfers it to the mounting unit 40. When the semiconductor wafer t is mounted face-up on the transfer section 30 (the electrode face of the semiconductor wafer t is mounted on the substrate), the semiconductor wafer t taken out from the component supply section 10 is received by the intermediate stage 31 To the mounting part 40, when mounting the semiconductor wafer t face down (mounting the electrode face of the semiconductor wafer t face down to the substrate), the semiconductor wafer t taken out from the component supply part 10 is used to attract the nozzle 37a 37b is reversed upside down and the state in which the back surface of the semiconductor wafer t is reversed is transferred to the mounting portion 40.

(Mounting section 40) The mounting section 40 is provided with two mounting sections 40A, 40B having the same configuration as the pair of left and right transfer sections 30A, 30B. The two mounting portions 40A and 40B are arranged separately in a state where the left and right sides are reversed on the rear sides of the base portion 1 a so as to sandwich the mounting table portion 20. Hereinafter, regarding the pair of left and right mounting portions 40, only the configuration of the left mounting portion 40A will be described, and the description of the configuration of the right mounting portion 40B will be omitted.

The mounting portion 40A includes a support frame 41 extending in the Y direction from the rear end to the center of the base portion 1a in the rear left side of the base portion 1a in a side view. On the right side surface of the support frame 41, the head support 42 is supported by the Y direction moving device 41a so as to be movable in the Y direction. The head support 42 extends to the vicinity of the center of the base portion 1a toward the horizontal direction in the X direction, that is, the right direction in the drawing. In front of the head support 42, the mounting head 43 is provided by an X-direction moving device 42 a that can move in the X-direction.

The mounting head 43 includes two mounting tools 43a, 43b that are arranged in the X direction (left and right in the figure) and hold the semiconductor wafer t and are mounted on the support substrate W, and the two mounting tools 43a, 43b are separated The Z-direction moving devices 43c and 43d that move in the Z-direction. Among them, the Y-direction moving device 41a, the X-direction moving device 42a, and the Z-direction moving devices 43c, 43d constitute a mounting head transfer mechanism. Furthermore, the mounting unit 40 includes an imaging unit 44 for imaging the semiconductor wafer t held by the mounting tools 43a and 43b.

The mounting tools 43a and 43b are provided at the same arrangement interval as the suction nozzles 37a and 37b of the transfer head 37. In addition, the mounting tools 43a and 43b are formed by members that can see through the vertical direction by attracting and holding the semiconductor wafer t. Thereby, the semiconductor wafer t sucked and held by the mounting tools 43a, 43b can be viewed from the upper side of the mounting tools 43a, 43b. The mounting tools 43a and 43b are provided with a horizontal rotation device (not shown), and can rotate the semiconductor wafer t sucked and held in a horizontal plane. Furthermore, among the mounting tools 43a and 43b, the mounting tool 43b located on the inner side (the center side of the base portion 1a) is mounted with a substrate recognition camera 43f as a first recognition unit. The substrate recognition camera 43f is used to image the alignment mark (global mark) of the support substrate W placed on the stage 21.

In addition, like the transfer unit 30, the left and right mounting units 40A, 40B are also arranged in a state where the left and right are reversed in the mounting unit 40. Therefore, in the left and right mounting parts 40A and 40B, the part number of the mounting tool located on the respective outer sides (the mounting part 40A on the left side is the left side and the mounting part 40B on the right side is the right side) is set to 43a, The part number of the Z-direction moving device located outside is 43c. Among them, the left mounting head 43 is the first mounting head, and the right mounting head 43 is the second mounting head.

The imaging unit 44 is provided with four wafer recognition cameras 44 a to 44 d as the second recognition unit corresponding to the four placement parts 31 a to 31 d at positions above the four placement parts 31 a to 31 d of the intermediate stage 31. The wafer recognition cameras 44a to 44d can image the semiconductor wafer t placed on the mounting portions 31a to 31d, and can also image and hold the mounting tool moved below the wafer recognition cameras 44a to 44d through the mounting tools 43a and 43b. 43a, 43b semiconductor wafer t. The chip recognition cameras 44a to 44d are supported by a pair of XY moving devices 44e and 44f in a group of 2 in a movable manner in the XY direction. The two sets of wafer recognition cameras (44a and 44b and 44c and 44d) are arranged at the same arrangement interval as the mounting tools 43a and 43b and the suction nozzles 37a and 37b. The pair of XY moving devices 44e and 44f are supported on the lower side of the beam portion of the camera support frame 44g that extends in the X direction and has a gate shape in front view. The camera support frame 44g is installed at the front end of the upper surface of the left and right support frames 41 of the mounting portion 40, and is bridged to the left and right support frames 41.

Such a mounting unit 40 accepts the semiconductor wafer t taken out from the component supply unit 10 by the transfer unit 30 and mounts the received semiconductor wafer t on the support substrate W placed on the stage 21. At this time, the mounting tools 43a, 43b of the left and right mounting heads 43 mount the semiconductor wafer t on a certain mounting line. This mounting line is a straight line that is virtually set along the X direction within the movement range of the stage 21 in the Y direction, and is managed by coordinates used for the movement of the stage 21 and the mounting tools 43a, 43b. In other words, the mounting line is a set of coordinate points located on the X axis on a certain Y axis. In the support substrate W, the mounting area is usually set in rows and columns along the XY direction. Therefore, when mounting the semiconductor wafer t on the support substrate W, the stage 21 is moved and controlled so that the row of the mounting area along the X direction of the semiconductor wafer t is to be mounted on the mounting line. The mounting tools 43a and 43b are controlled to move among the mounting areas on the mounting line so that the semiconductor wafer t is mounted on the predetermined mounting area.

The mounting heads 43 and 43 of the left and right mounting sections 40A and 40B are on the mounting line, respectively dividing the mounting area on the support substrate W in the X direction by two equal parts, that is, the left and right sides are divided by two, and the left side area is divided by The mounting head 43 on the left side and the area on the right side are shared by the mounting head 43 on the right side and the semiconductor wafer t is mounted in parallel. At this time, in order to prevent physical interference between the mounting heads 43, the minimum distance that the two mounting heads 43, 43 can approach is softly or mechanically restricted. The minimum distance that can be approached is called the "closest distance". In addition, the left and right mounting heads 43 and 43 are located at the closest distance, and the mounting tools located on the outer side are mutually located, that is, the left mounting tool 43a of the left mounting head 43 and the right mounting head 43 of the right side. The distance between the mounting tools 43a is called "proximity interval". If the size of the support substrate W in the X direction is less than twice the length of the proximity interval, it is difficult to mount the semiconductor wafer t by the mounting heads 43 on the left and right simultaneously in the entire X direction of the support substrate W of.

As shown in FIG. 5, there are four combinations of mounting tools 43 a and 43 b that are mounted simultaneously on the left and right mounting heads 43 and 43. The first example is a combination of mounting the semiconductor wafer t simultaneously with the right mounting tool 43b of the left mounting head 43 and the left mounting tool 43b of the right mounting head 43 as shown in FIG. 5(A). The second example is a combination of mounting the semiconductor wafer t simultaneously with the right mounting tool 43b of the left mounting head 43 and the right mounting tool 43a of the right mounting head 43 as shown in FIG. 5(B). The third example is a combination of mounting the semiconductor wafer t simultaneously with the left mounting tool 43a of the left mounting head 43 and the left mounting tool 43b of the right mounting head 43 as shown in FIG. 5(C). The fourth example, as shown in FIG. 5(D), is a combination in which the semiconductor wafer t is mounted simultaneously with the left mounting tool 43a of the left mounting head 43 and the right mounting tool 43a of the right mounting head 43.

Among them, the longest distance L between the mounting tools 43a and 43b to be mounted at the same time is performed by mounting tools 43a located outside the left and right mounting heads 43 as shown in FIG. 5(D). The combination of actual installation. Next, in this combination, the distance L between the mounting tools 43a in the state where the left and right mounting heads 43 are located at the closest distance is the above-mentioned "proximity interval". Therefore, when the length of the support substrate W in the X direction is less than twice the proximity interval, it is impossible to mount the semiconductor wafer t simultaneously in the entire area of the support substrate W in the X direction in the combination of FIG. 5(D). In addition, in this embodiment, the proximity interval is 150 mm. That is, the distance L between the mounting tools 43a and 43b shown in FIG. 5(D) is 150 mm.

In addition, as the operation program of the mounting head 43, the combination of the mounting tools 43a and 43b that are simultaneously mounted is limited to the combination of FIGS. 5(A) to (C), and when there is no combination of FIG. 5(D), " The "proximity interval" is as shown in FIG. 5(B), and the right mounting tool 43b of the left mounting head 43 and the right mounting head 43 of the left and right mounting heads 43 are at the closest distance. The distance between the mounting tool 43a, or the one shown in FIG. 5(C), the left mounting tool 43a and the right mounting head 43 of the left mounting head 43 at the closest distance to the left and right mounting head 43 The distance between the left mounting tool 43b.

(Control unit 50) The 　　 control unit 50 controls the operations of the component supply unit 10, the stage unit 20, the transfer unit 30, and the mounting unit 40 based on the control information stored in the memory unit 51, and includes electronic components including the semiconductor chip t The mounting substrates are mounted sequentially in each mounting area of the support substrate W. The memory unit 51 stores stage correction data for correcting the movement position error of the stage 21 obtained by the acquisition process of the movement position error of the stage 21 described later, and the movement position by the mounting tools 43a and 43b. The tool correction data of the movement position error of the mounting tools 43a and 43b obtained in the error acquisition process controls the movement of the stage 21 and the mounting part 40 based on the correction data. In addition, the memory section 51 also stores operation patterns for mounting the semiconductor wafer t on the support substrate W, the transfer section 30, the mounting section 40, and the like.

[Operation of Mounting Device (Mounting of Electronic Components)] Next, the mounting process of electronic components such as the semiconductor wafer t using the mounting device 1 will be described. When mounting electronic components such as a semiconductor wafer t in each mounting area of the support substrate W, only the global recognition method is applied, because the position recognition of the mounting area is not performed, and the positioning accuracy of the semiconductor wafer t in each mounting area, Depending on the recognition accuracy of the global mark of the support substrate W and the like, the machining accuracy of the XY movement mechanism 22 of the stage 21, and the X-direction movement device 42a, Y-direction movement device 41a, and Z direction movement of the mounting tools 43a, 43b The machining accuracy of the devices 43c, 43d, etc. However, a guide rail for guiding the movement of the stage 21 or the mounting tools 43a, 43b, etc., is completed with an accuracy of ±7 μm or less within a desired range, which is substantially impossible in metal processing. Even more so, it is more impossible to assemble a guide rail having a desired length to a metal frame or the like with a straightness of ±7 μm or less. Here, the movement position error of the stage 21 is measured, and data for correcting the movement of the stage 21 is acquired (corrected). Further, the movement position errors of the mounting tools 43a, 43b are measured on the mounting line, and data for correcting the movement of the mounting tools 43a, 43b is acquired (corrected).

[Acquisition process of the moving position error of the stage 21 (stage correction data) (correction process (1))] 　　Correcting the data of the moving position error of the stage 21, using the correction substrate 71 shown in FIGS. 6 and 7 To get. The correction substrate 71 is, for example, a substrate made of glass, which is provided in rows and columns at intervals between dot marks 72 for position recognition in advance. The dot marks 72 of the correction substrate 71 are provided at intervals of 3 mm within a range of 600 mm in height×600 mm in width, for example. The dot mark 72 is formed of a thin metal film or the like, and can be formed by film forming techniques such as etching and sputtering. The diameter of the dot mark is 0.2 mm, for example. Such a correction substrate 71 is correctly set on the stage 21. The setting method of the calibration substrate 71 is not particularly limited, but is implemented by the method shown below, for example. Among them, the correction substrate 71 has the same size as the support substrate W, and the range where the dot mark is provided is set to the same size as the range including all the mounting areas on the support substrate W.

(Setting of calibration substrate 71) The calibration substrate 71 as described above is set on the stage 21 by the operator's manual. The setting of the calibration substrate 71 is carried out by placing the calibration substrate 71 on the stage 21 and then performing parallel adjustment of the calibration substrate 71 (adjustment to align the arrangement direction of the dot marks 72 in the XY direction). The parallel adjustment is carried out using the substrate recognition camera 43f of the left mounting head 43 among the substrate recognition cameras 43f for supporting imaging of the global mark of the substrate W, for example. First, on the calibration substrate 71 placed on the stage 21, as shown in FIG. 6, the dot mark 72 located at the left front corner of the calibration substrate 71 becomes the center of the imaging field V of the substrate recognition camera 43f Adjust the position of the stage 21.

From this state, the stage 21 is moved to the left in the X direction at a low speed (a speed at which the dot mark 72 is gradually moved in the visual field V of the camera 22). At this time, the operator monitors the captured image of the substrate recognition camera 43f with a monitor, and stops the movement of the stage 21 if the position of the dot mark 72 captured by the substrate recognition camera 43f is shifted upward or downward relative to the imaging field of view V. To manually adjust the tilt of the correction substrate 71 in the direction without deviation. The imaging field of view V of FIG. 6 shows an example of a state where the position of the dot mark 72 appearing in the imaging field of view V gradually shifts downward as the stage 21 moves.

After adjusting the tilt of the correction substrate 71, the position of the stage 21 is adjusted so that the dot mark 72 at the corner on the front left becomes the center of the imaging field V of the substrate recognition camera 43f, and the stage 21 is moved to the left in the X direction at a low speed . The operator also monitors the position of the point mark 72 on the monitor for deviation. Next, if there is a deviation in position, the movement of the stage 21 is stopped, and the tilt of the correction substrate 71 is adjusted. Such an operation is repeated over the entire range of the movable range of the stage 21 in the X direction until the dot mark 71 is reflected on the monitor screen without exceeding the imaging field of view V. Such movement of the stage 21 by the operator is performed by the operation of the touch panel and the joystick.

(Acquisition of the moving position error (correction data) of the stage 21) Next, the position of the dot mark 72 of the correction substrate 71 set on the stage 21 is set by the above-described method using the substrate recognition camera 43f provided with the left and right mounting head 43 The identification is performed to obtain the movement position error of the stage 21 and correction data based on it. The dot mark 72 is recognized by moving the correction substrate 71 in a state where the left and right substrate recognition cameras 43f are stopped at predetermined positions, respectively. The imaging of the dot mark 72 on the calibration substrate 71 is, for example, as shown in FIG. 7, from the dot mark 72 located on the left end of the calibration substrate 71 (on the rear side of the base portion 1 a) toward the right in the X direction with the dot mark 72. Arrangement with a pitch of 3 mm starts the pitch movement, and turns back toward the front (located on the front side of the base portion 1a) in order while turning back. At this time, among the dot marks 72 on the correction substrate 71, the dot marks 72 provided in the left half-division area are imaged using the left substrate recognition camera 43f, and the dot marks 72 provided in the right half-division area are used on the right substrate The recognition camera 43f takes a picture.

Specifically, with the stage 21 positioned at the center of the XY movement mechanism 22 in the XY movement stroke (this position is referred to as the origin position.), the left substrate recognition camera 43f is positioned on the left side of the correction substrate 71 The center of the half-point dot mark group (the position shown by symbol 71A in FIG. 7), and the substrate recognition camera 43f on the right side are positioned at the center of the right half-point dot mark group on the correction substrate 71 (the position shown by symbol 71B in FIG. 7) ). From this state, while the left and right substrate recognition cameras 43f are kept stopped, the operator observes the monitor while operating the XY moving mechanism 22, and the upper left dot mark 72 of the dot mark group left half is the substrate recognition camera on the left The correction substrate 71 is moved so as to be at the center of the imaging field V of 43f. As a result, the upper left dot mark 72 of the right half of the dot mark group is located in the imaging field V of the substrate recognition camera 43f on the right. In the left and right dot mark groups, the upper left dot mark 72 becomes the first dot mark 72.

After the first dot mark 72 is positioned at the center of the imaging field V of the substrate recognition camera 43f, the detection operation of the dot mark 72 by the left and right substrate recognition cameras 43f is started. After that, the automatic control by the control unit 50 is performed first. The detection operation is started by the operator pressing (touching) the start button of the detection operation displayed on the touch panel. After the detection operation of the point marker 72 is started, the first point marker 72 is first imaged. The captured image of the first point mark 72 is processed by a well-known image recognition technique to detect a positional deviation of the point mark 72 relative to the center of the imaging field V of the substrate recognition camera 43f. The detected positional deviation is stored in the memory section 51 as information paired with the movement position (XY coordinates) of the stage 21. After the position recognition of the dot mark 72 is completed, the stage 21 is moved in order to position the next (second) dot mark 72 within the field of view of the camera according to the aforementioned moving order. In the example of FIG. 7, since the second dot mark 72 is located to the right of the first dot mark 72, the stage 21 is moved to the left in the X direction by 3 mm.

The movement of the stage 21 is performed based on the reading value of the linear encoder provided in the XY movement mechanism of the stage 21. The scale of the linear encoder is preferably a glass scale with a small thermal expansion coefficient as a thermal countermeasure. After the movement of the stage 21 is completed, as in the first point mark 72a, the position deviation of the second point mark 72 is detected and stored in the memory unit 51 as information paired with the XY coordinates of the stage 21 at this time. The imaging of the dot mark 72 is performed after stopping the stage 21 and waiting for only a time when the vibration generated when the stage 21 is stopped subsides. This operation is performed on all the dot marks 72 on the calibration substrate 71 to obtain movement position deviation data of the dot marks 72 corresponding to the respective positions, and is stored in the memory unit 51 as stage correction data.

(Acquisition of correction data accompanying thermal expansion of the support substrate W) 　　 In order to improve the bondability of the bonding die film used for the semiconductor wafer t, a heater may be provided on the stage 21 to heat the support substrate W. In this case, because the temperature of the support substrate W changes (rises) before and after being placed on the stage 21, the support substrate W thermally expands accordingly. If the support substrate W thermally expands, even if the stage 21 and the mounting head 55 are moved with high accuracy, the extension of the support substrate W may cause a deviation in the mounting position.

Here, the amount of thermal expansion of the support substrate W caused by heating of the heater is measured in advance and grasped in advance. When the semiconductor wafer t is mounted on the support substrate W, the coefficient (percentage) corresponding to the amount of thermal expansion grasped in advance is multiplied by the correction data And control the movement of the stage 21 is better. At this time, due to factors such as the shape and arrangement of the heater and the structure of the stage 21, the entire support substrate W does not necessarily thermally expand uniformly, and the distribution of thermal expansion may be grasped together. For example, the area on the support substrate W is divided into a plurality of grid-like areas such as 10 rows×10 columns, and the amount of thermal expansion (displacement due to thermal expansion at each measurement point) is measured for each divided area. Next, the coefficient of the correction data of the stage 21 may be multiplied in each area.

In addition, the amount of thermal expansion of the support substrate W is measured at each predetermined elapsed time from the time when the support substrate W is placed on the stage 21 until the thermal expansion of the support substrate W becomes saturated with respect to the temperature of the stage 21, and is obtained in advance The coefficient of the thermal expansion amount according to each predetermined elapsed time may be sufficient. At this time, the coefficient of the amount of thermal expansion according to the division of the support substrate W into plural regions may be obtained. Next, during the mounting of the semiconductor wafer t, at each elapsed time after the support substrate W is placed on the stage 21, the coefficient that causes the elapsed time is switched, and the coefficient is multiplied by the correction data to make the stage 21 mobile. Thereby, the semiconductor wafer t can be mounted on the support substrate W without waiting for the thermal expansion of the support substrate W to become saturated with respect to the temperature of the stage 21, and the semiconductor wafer t can be mounted with high efficiency, and High precision implementation.

(Correction of the moving position of the stage 21) When moving the stage 21, in the stage correction data obtained by the acquisition process of the movement position error of the stage 21, refer to the information provided by the left mounting head 43 The substrate correction camera 43f acquires the stage correction data and corrects the movement position of the stage 21. The control unit 50 controls the XY moving mechanism 22 so that the rows along the X-direction mounting area placed on the support substrate W of the stage 21 are sequentially positioned on the mounting line. At this time, the control unit 50 refers to the position information (XY coordinates) of the mounting area stored in the memory unit 51 and the above-mentioned stage correction data, and calculates the correction value required when the line of the mounting area is on the mounting line. Next, the movement position of the stage 21 when the line of the mounting area is positioned on the mounting line is corrected by only the points of the calculated correction value. When the stage 21 has a heater, it is preferable to multiply the coefficient based on the thermal expansion amount of the support substrate W by the correction data of the stage 21.

In addition, the stage correction data acquired by the substrate recognition camera 43f included in the right mounting head 43 is used to correct the movement position of the right mounting head 43. That is, because the substrate recognition camera 43f of the left and right mounting heads 43 picks up the dot marks 72 provided at a certain arrangement interval on the same correction substrate 71, as long as the stage 21 (correction substrate 71) moves in parallel, the camera 43f is recognized from the left and right substrates The position deviation of the point marks 72 recognized by the captured image should be consistent. However, when the stage 21 moves, there may be a slight backlash in the horizontal plane, that is, a yaw. In this case, even if the movement error of the stage 21 is corrected and moved using the stage correction data acquired by the left substrate recognition camera 43f, it is estimated that the actual mounting tools 43a and 43b of the right mounting head 43 are The mounting accuracy may also be insufficient. Here, the movement position of the right mounting head 43 is based on the difference between the stage correction data obtained by the left substrate recognition camera 43f and the stage correction data obtained by the right substrate recognition camera 43f Correction. With this, even when the stage 21 is swayed, the mounting accuracy of the left and right mounting heads 43 can be ensured.

[Acquisition process of the movement position error of the mounting tools 43a, 43b (the first tool correction data) (correction process (2))] 　　Correction data of the movement position error of the mounting tools 43a, 43b in the XY direction (the first tool The correction data) is obtained using the correction substrate 71 in the same way as the correction of the stage 21. Therefore, it may be performed continuously with the above-mentioned calibration process (1). The acquisition of the correction data is in a state where the stage 21 is stopped at the origin position, for example, and is located in a region with a predetermined width in the Y direction centered on the mounting line (FIG. 7 indicates a region with a slanted dashed line, hereinafter referred to as " The position of the position point mark 72 in the correction data acquisition area Dt".) is recognized while individually moving the substrate recognition camera 43f included in the left and right mounting heads 43. The substrate recognition camera 43f of each mounting head 43 corrects the entire range of the movable range of the mounting head 43 in the X direction with respect to the X direction, and corrects the dot mark in the data acquisition area Dt with respect to the Y direction within a set predetermined width 72 camera.

Specifically, first, the substrate recognition camera 43f of the left mounting head 43 is moved to the left end of the left mounting head 43 in the X-direction movable range, that is, behind the correction data acquisition area Dt, at that position The dot mark 72 is located in the center of the imaging field V of the substrate recognition camera 43f. In this state, the detection operation is started by the operator pressing (touching) the start button of the detection operation displayed on the touch panel.

After the detection operation is started, the substrate recognition camera 43f starts moving at a pitch at the arrangement interval of the dot marks 72 toward the right side in the X direction, and turns back in the movable range in the X direction while sequentially photographing and correcting the data in the correction data acquisition area Dt Point marker 72. Next, the substrate recognition camera 43f recognizes the position of the dot mark 72 in the same way as the above-mentioned stage correction data, acquires the first tool correction data as the correction data for correcting the movement positions of the mounting tools 43a, 43b, and stores it in the memory 51. The substrate recognition camera 43f of the right mounting head 43 also performs the same operation, acquires the first tool correction data of the mounting tools 43a and 43b of the right mounting head 43, and stores them in the memory unit 51. In addition, although the predetermined width of the correction data acquisition area Dt can be appropriately set according to the size of the electronic component mounted on the support substrate W, it may be set within a range of 30 mm to 100 mm. In addition, the electronic component may have a width of one minute.

The acquisition process of the stage correction data and the tool correction data described above is basically performed when the mounting device 1 is operated, and the movement of the stage 21 and the mounting head 43 may be controlled based on the measurement result. However, the stage 21 and the mounting head 43 may include a heater or the like incorporated in the semiconductor wafer t. In this case, the temperature of each part of the device may increase and the mechanical accuracy may decrease due to thermal expansion. In addition, as the mounting process of the semiconductor wafer t of the mounting device 1 progresses, the mechanical accuracy of each part of the device may decrease due to heat generation of the motor of the moving device that moves the mounting head 43 or the like. Taking into account such movement errors due to temperature rise, it is not limited to one time when the device is in operation, and it may be implemented periodically.

(Correction of the movement position of the mounting tools 43a, 43b) 　　 Describes the correction of the movement position when the left and right mounting heads 43 are moved. First, when moving the left mounting head 43 to the mounting position on the mounting line, refer to the first tool correction data obtained by the acquisition process of the movement position error of the mounting tools 43a, 43b. The tool correction data acquired by the substrate recognition camera 43f provided in the mounting head 43 corrects the movement positions of the mounted tools 43a and 43b. The control unit 50 controls the movement of the mounting head 43 in the X direction in order to mount the semiconductor wafer t held on the mounting tools 43a, 43b in the mounting area on the mounting line in order to mount in the predetermined mounting area The device 42a and the Y-direction moving device 41a. At this time, the control unit 50 refers to the position information (XY coordinates) of the mounting area stored in the memory unit 51 and the above-mentioned first tool correction data, and calculates so that the center of the semiconductor chip t coincides with the center of the mounting area The correction value required for positioning. Next, the movement positions of the mounting tools 43a, 43b when mounting the semiconductor wafer t in the mounting area are corrected by only the points of the calculated correction value.

Also, the situation of the right mounting head 43 is the same as that of the left mounting head 43, referring to the first tool correction data acquired by the substrate recognition camera 43f provided on the right mounting head 43, and correcting the mounting tools 43a and 43b move Place. In addition, in this embodiment, the relative positional relationship between the two mounting tools 43a, 43b and the substrate recognition camera 43f in each mounting head 43 is preferably assembled within a certain accuracy with a jig or the like. With this, the positioning accuracy of the semiconductor wafer t and the like can be further improved.

[Acquisition process of the movement position error of the mounting tools 43a, 43b (second tool correction data) (correction process (3))] 　　Correct the data of the movement position error of the mounting tools 43a, 43b in the Z direction (second tool Correction data), after the correction works (1) and (2), in the state where the stage correction data and the first tool correction data are applied, the support substrate W or the test support substrate Ws are scheduled on the mounting line The semiconductor wafer t or the test wafer ts mounted at a certain pitch is obtained by measuring the positional deviation from the target position of the mounted wafer.

Specifically, the supporting substrate Ws for a test is placed on the stage 21. The supporting substrate Ws for the test may be the supporting substrate W for manufacturing, but it is sufficient if the mounting area can be secured at least on the mounting line, which is similar to the correction data acquisition area Dt shown in FIG. 7 A large or small substrate is also acceptable. If the support substrate Ws is placed on the stage 21, the mounting interval preset along the mounting line is obtained as correction data in the same operation as the transfer process of the semiconductor wafer t and the mounting process of the semiconductor wafer t described later. For example, at a 1mm interval, the test wafers ts are mounted with adhesive. The adhesive may be attached to the support substrate Ws in advance. The implementation is carried out in the manner of global identification.

When the mounting of the test wafers ts is completed, the support substrate Ws is detached from the stage 21, and the mounting position deviation with respect to the target position of each wafer ts is measured by an inspection device (not shown). Relevant data obtained in this way and indicating the relationship between the target position on the mounting line and the mounting position deviation from the target position is stored in the storage unit 51 as the second tool correction data. This operation is performed individually for each mounting tool 43a, 43b of the left and right mounting head 43, and the second tool correction data is obtained for each mounting tool 43a, 43b.

In addition, when the set mounting interval is smaller than the dimension of the wafer t in the X direction, for example, when the mounting interval is 1 mm and the size of the wafer ts is 4×4 mm, the wafer ts cannot be continuously arranged on the mounting line. In this case, the position of the support substrate Ws may be shifted in the Y direction, and the wafer ts may be mounted along the mounting line in plural times. That is, first, the wafers ts are mounted along the mounting line at intervals larger than 4 mm. Thereafter, the position of the support substrate Ws is moved by a distance greater than 4 mm in the Y direction. At this position, the wafer ts is mounted along the mounting line by shifting by 1 mm position in the X direction from the previous time. Repeat this action until the installation interval is filled.

In addition, with respect to the test support substrate Ws to which the area mark is attached, the test wafers ts are mounted by the global recognition method, and the substrate recognition camera 43f may be used to recognize the positional deviation from the mounting position of the mounted wafers ts.

(Correction of movement position of mounting tools 43a, 43b) 　　 Describes the correction of the movement position of mounting tools 43a, 43b. When each mounting tool 43a, 43b is moved in the mounting area on the mounting line, the second tool correction data stored in the memory unit 51 is referred to, that is, the target position on the mounting line, which is the deviation from the mounting position relative to the target position, is referenced For the relevant data of the relationship, the correction value is calculated from the value of the deviation of the mounting position corresponding to the mounting area. Next, the correction is performed only by the point where the correction value of the movement position of the mounting head 43 when the mounting tools 43a and 43b are moved to the mounting area is calculated. In addition, in the second tool correction data, when there is no target position that matches the position of the mounting area, for example, the mounting position deviation of two target positions adjacent to the position of the mounting area can be determined by The polynomial may be interpolated to calculate the corrected value of the deviation of the mounted position corresponding to the position of the mounted area.

[Mounting Process of Electronic Components] After the above calibration processes (1) to (3), the mounting process of the electronic components such as the semiconductor wafer t to the support substrate W is carried out.

(1) Transferring process of the wafer ring 11 First, the unused wafer ring 11 is carried into the wafer ring holder 12 from an unillustrated storage unit, and the wafer ring 11 is fixed to the wafer ring holder 12. At this time, as shown in FIG. 8, the support arm 32 a of the wafer ring holding device 32 provided on the left transfer part 30A is moved to the right in the figure, and the holding part 32 b is moved to the holding position of the wafer ring 11 . In this state, it moves to the position indicated by the two-dot chain line, grasps the rear end portion of the wafer ring 11 in the storage section, and moves it to the position indicated by the solid line, whereby the wafer ring 11 is removed from the storage section Pull out to move the wafer ring 11 to the wafer ring holder 12. When the wafer ring 11 is positioned on the wafer ring holder 12, the grip of the wafer ring 11 by the chuck portion 32b is released, the support arm 32a is moved to the left in the figure, and the grip portion 32b is moved to the standby position. The wafer ring 11 located on the wafer ring holder 12 holds the resin sheet S in a stretched state by a stretching mechanism (not shown) included in the component supply unit 10.

(2) Setting process of support substrate W (2-1: Supply of support substrate W) The support substrate W held by the transport robot (not shown) is supplied to the stage 21. The transport robot (not shown) includes a transport arm that holds and holds the support substrate W, and allows the support substrate W to be transferred onto the stage 21 from the left side of the mounting device 1 through the space under the door of the support frame 41 of the left mounting portion 40A . After the support substrate W is supplied onto the stage 21, the transfer arm is retracted from the mounting device 1. The supply process of the support substrate W may be performed in parallel with the carry-in process (1) of the wafer ring 11, or may be performed individually.

(2-2: Detection of global mark) The global mark of the support substrate W placed on the stage 21 is detected, and the position of the support substrate W is recognized. For example, as shown in FIG. 9, among the four corners of the support substrate W, the global markers A, B, and C provided at the three corners are sequentially captured by the substrate recognition camera 43 provided on the left and right mounting heads 43 . Specifically, the global mounting mark 43 located on the left rear of the support substrate W (the upper left in FIG. 9) is positioned directly below the substrate recognition camera 43 f of the mounting head 43 on the left side, and The stage 21 moves relatively, and the global mark A is photographed. Next, the right mounting head 43 and the stage 21 are positioned so that the global mark B located on the right rear of the supporting substrate W (the upper right in FIG. 9) is located directly below the substrate recognition camera 43 f of the right mounting head 43. Relatively move, mark B in the global range. Finally, the right mounting head 43 and the stage are positioned so that the global mark C located on the front right of the supporting substrate W (the lower right in FIG. 9) is positioned directly below the substrate recognition camera 43f of the mounting head 43 on the right 21 Relative movement, mark C for the whole area of the camera. The positions of the three global markers A, B, and C are detected based on the captured image, and the positional deviation of the support substrate W in the XY direction and the θ direction are obtained based on the detected positions of the three global markers A, B, and C ( Horizontal rotation direction) position deviation. The positional deviation of the support substrate W can be obtained by various well-known methods, and is not particularly limited to this method.

An example of a method of detecting positional deviation is described below. In FIG. 9, the solid line indicates the support substrate W actually mounted on the stage 21. The two-dot chain line indicates the support substrate W placed on the stage 21 without positional deviation. The support substrate W described by the two-dot chain line is an ideal state, and the center of the support substrate W at this time coincides with the center position O(x0, y0) of the stage 21.

First, the positions of the three global markers A, B, and C provided on the support substrate W are detected using a well-known image recognition technique, and the inclination θ1 of AB relative to the X direction from the line connecting the global markers A and B and the connected global The line points of the marks B and C are the average value of the inclination θ2 of the BC with respect to the Y direction, and the inclination θ of the support substrate W (=(θ1+θ2)/2) is obtained. Next, the support substrate W is virtually rotated using the center position O of the stage 21 as the rotation center so that the inclination θ disappears. This state is indicated by broken lines in FIG. 9. The amount of movement (Δx1, Δy1) of the midpoints M1 (x1, y1) of the global markers A and C located diagonally at this time is obtained. The total value (Δx1+Δx2, Δy1+Δy2) of the calculated movement amount (Δx1, Δy1) and the difference (Δx2, Δy2) between the midpoint M2 (x2, y2) after movement and the coordinate O is used as the support substrate The positional deviation of W in the XY directions is obtained.

If the positional deviation of the support substrate W on the stage 21 is calculated, the positional deviation is corrected, and the stage 21 is moved so that the row of the mounting area where the semiconductor wafer t is first mounted on the support substrate W is positioned on the mounting line . Specifically, the stage 21 is moved to the position of the solid line shown in FIG. 10 so that the row of the mounting area located at the rearmost side of the support substrate W is on the mounting line. In addition, in FIG. 10, for convenience, the mounting line is indicated by a chain line. At this time, the movement of the stage 21 for placing the row of each mounting area on the mounting line is based on data correcting the positional deviation of the support substrate W obtained by the recognition of the global marks A, B, and C, and is stored in The stage correction data of the memory unit 51 is corrected. As in the present embodiment, when the XY moving mechanism 22 of the stage 21 does not have the θ stage (θ moving mechanism), the tilt of the support substrate W is adjusted by the θ adjustment mechanism provided in the mounting head 43 to adjust the mounted semiconductor wafer t To make corrections.

(3) Transfer process of semiconductor wafer t (3-1: position detection of semiconductor wafer t) 　　After the wafer ring 11 is held by the wafer ring holder 12, the semiconductor wafer t that was first taken out on the wafer ring 11 Located in the removal position. The extraction position is set at the center of the wafer ring holder 12 in the state shown in FIG. 10. The order of taking out the semiconductor wafer t on the wafer ring 11 is stored in the memory unit 51 in advance, and the control unit 50 controls the movement of the wafer ring holder 12 according to the order. Therefore, after the first semiconductor chip t is taken out, the wafer ring holder 12 moves the wafer rings 11 in pitch according to the order stored in the memory portion 51.

After the first semiconductor wafer t is located at the take-out position, in order to bring the semiconductor wafer t and the next taken-out semiconductor wafer t adjacent to the semiconductor wafer t in the X direction, the wafer recognition camera 38 of the left transfer section 30A is taken in The imaging field of view moves the Y-directional moving block 34 and the X-directional moving body 36. That is, the wafer recognition camera 38 has an imaging field of view of the size that two adjacent semiconductor chips t held on the wafer ring 11 are simultaneously taken in. The two alignment marks provided at the pair of corners of the semiconductor chips t are imaged by the wafer recognition camera 38. Based on the positions of the two alignment marks for each semiconductor wafer t imaged, the positions of the respective semiconductor wafers t are detected. When the position of the semiconductor wafer t taken out first deviates from the take-out position, the wafer ring holder 12 is moved to correct the position.

In addition, the detection of the positional deviation of the semiconductor wafer t at the extraction position is not particularly limited, and can be implemented according to various well-known methods. For example, from the captured images of two alignment marks provided at diagonal positions on the semiconductor wafer t, the position of each alignment mark is detected using a well-known image recognition technique. Obtain the inclination of the line connecting the two marks from the position of the obtained mark, compare the inclination with the inclination of the line between the connecting marks in the semiconductor chip t that has no positional deviation stored in the memory unit 51 in advance, and compare The difference is detected as the tilt deviation of the semiconductor wafer t. Also, the difference between the position of the midpoint between the actual alignment mark and the position of the midpoint between the alignment marks of the semiconductor wafer t with no positional deviation stored in the memory section 51 is taken as the positional deviation of the semiconductor wafer t in the XY direction Find out.

(3-2: Extraction of semiconductor wafer t) After identifying the positional deviation of the two semiconductor wafers t, the left suction nozzle 37a of the left transfer head 37 is moved to directly above the semiconductor wafer t at the extraction position. Next, the Z direction moving device 37c is driven to lower the suction nozzle 37a, and the suction surface of the suction nozzle 37a is brought into contact with the upper surface (electrode formation surface) of the semiconductor wafer t. After the suction nozzle 37a abuts on the semiconductor wafer t, the semiconductor wafer t is held by the suction nozzle 37a. The timing at which the suction nozzle 37a applies the suction force may be set to an appropriate time before, at the same time, or after the suction nozzle 37a comes into contact with the semiconductor wafer t.

After the left suction nozzle 37a is sucked and held until the semiconductor wafer t, the suction nozzle 37a is raised to the original height. At this time, in accordance with the rise of the suction nozzle 37a, a jacking mechanism (not shown) is activated to assist the peeling of the semiconductor wafer t from the resin sheet S. After the left suction nozzle 37a that sucks and holds the semiconductor wafer t rises to the original height, or in parallel with the ascent, the right suction nozzle 37b is positioned directly above the pickup position while the next semiconductor wafer t is positioned at the pickup position. The right suction nozzle 37b also takes out the semiconductor wafer t in the same manner as the left suction nozzle 37a.

The left and right suction nozzles 37a, 37b of the left transfer head 37 respectively hold and hold the semiconductor wafer t, and the left and right suction nozzles 37a of the left transfer head 37 are moved by the movement of the Y-direction moving block 34 and the X-direction moving body 36. As shown in FIG. 10, 37b is located on the mounting portions 31a and 31b of the intermediate stage 31. In this state, the left and right suction nozzles 37a, 37b are lowered, and the semiconductor wafer t held by the left and right suction nozzles 37a, 37b is placed on the mounting portions 31a, 31b.

In addition, in the above-mentioned extraction process, the semiconductor wafer t that should be extracted to the side of the semiconductor wafer t at the extraction position may not exist, that is, the semiconductor wafer t at the extraction position is a row of the semiconductor wafer t The case of the terminal semiconductor wafer t. In this case, the semiconductor wafer t located at the head of the next row becomes the semiconductor wafer t that should be taken out next. When the semiconductor wafer t is within a range where the imaging field of view of the wafer recognition camera 38 can be captured, two semiconductor wafers t are simultaneously imaged. On the other hand, if it is not within the range that can capture the imaging field of view, two semiconductor wafers t are imaged individually. In the case of individual imaging, the imaging of the next (second) semiconductor wafer t may be performed before the extraction of the first semiconductor wafer t at the extraction position, or after the extraction of the first semiconductor wafer t.

(3-3: Receipt of semiconductor wafer t) After the semiconductor wafer t is placed on the placement portions 31a, 31b of the intermediate stage 31, the mounting head 43 of the left mounting portion 40A moves to the intermediate stage 31, such as As shown in FIG. 11, the left and right mounting tools 43 a and 43 b are positioned above the placement portions 31 a and 31 b. After the left and right mounting tools 43a, 43b are positioned on the mounting portions 31a, 31b, the Z-direction moving devices 43c, 43d are driven to lower the mounting tools 43a, 43b, and the mounting tools 43a, 43b abut on the semiconductor wafer t, respectively. After the mounting tools 43a and 43b contact the semiconductor wafer t, the semiconductor wafer t is sucked and held by the mounting tools 43a and 43b. The timing of this suction and holding may be set to an appropriate time before the mounting tools 43a and 43b are brought into contact with the semiconductor wafer t, at the same time, or after the contact. After the mounting tools 43a and 43b hold and hold the semiconductor wafer t, the mounting tools 43a and 43b are raised to the original height by the Z-direction moving devices 43c and 43d. As a result, the two semiconductor wafers t are received by the mounting tools 43a and 43b at the same time.

Among them, in parallel with the receipt of the semiconductor wafer t described above, (3-1) and (3-2) of the process (3) performed by the transfer unit 30B on the right side are performed. At this time, the transfer head 37 on the right side performs the semiconductor from the outer suction nozzle 37a (because it is reversed from the left transfer head 37 to the left and right suction nozzle 37a) in the order of the inner suction nozzle 37b Extraction of wafer t. In addition, the transfer position 30 takes out the semiconductor wafer t from the component supply section 10 at a single position. Therefore, the removal of the semiconductor wafer t by the left transfer part 30A and the removal of the semiconductor wafer t by the right transfer part 30B are executed alternately.

(4) Mounting process of the semiconductor wafer t (4-1: position detection and movement of the semiconductor wafer t) After the mounting tools 43a and 43b receive the semiconductor wafer t, the imaging is arranged above the mounting parts 31a and 31b The wafer of the unit 44 recognizes the cameras 44a and 44b, and picks up and sucks the semiconductor wafer t held by the mounting tools 43a and 43b. This imaging is performed through a member that can see through the mounting tools 43a and 43b. Based on the captured images of the wafer recognition cameras 44a and 44b, the position of the semiconductor wafer t that is held by the mounting tools 43a and 43b is detected. This position detection can be carried out using a well-known image recognition technique as in (3-1) of the above-mentioned project (3). Based on the detected position of the semiconductor wafer t, the positional deviation of the semiconductor wafer t is obtained.

In addition, the position of the semiconductor wafer t may be detected on the mounting portions 31a and 31b. At this time, after the imaging of the semiconductor wafer t by the recognition cameras 44a and 44b, the mounting tools 43a and 43b attract and hold the semiconductor wafer t. After the imaging of the semiconductor wafer t by the recognition cameras 44a and 44b is completed, as shown in FIG. 12, the mounting tools 43a and 43b move toward the row of the mounting area of the support substrate W on the mounting line along the X direction .

(4-2: Mounting of semiconductor wafer t) In the mounting head 43, among the left and right mounting tools 43a and 43b, first, on the mounting area of the mounting semiconductor wafer t held by the left mounting tool 43a, in order to The semiconductor wafer t held by the left mounting tool 43a is positioned and moved. At this time, since the semiconductor wafer t held on the left mounting tool 43a is the semiconductor wafer t initially mounted on the support substrate W, in the row of the mounting area on the mounting line, the left mounting tool 43a is moved to Located on the leftmost mounting area.

The moving position at this time is corrected based on the first and second tool correction data stored in the memory section 51 and the positional deviation of the semiconductor wafer t calculated in the (4-1: position detection and movement of the semiconductor wafer t) process . In addition, when the tilt θ of the support substrate W is detected in the (2-2: detection of global mark) process, the tilt θ is also corrected by the mounting tool 43a. Thereafter, the mounting tool 43a is lowered and the semiconductor wafer t is mounted to the desired mounting area of the support substrate W.

The bonding of the semiconductor wafer t to the support substrate W is performed by an adhesive force such as an adhesive sheet and a die attach film (DAF) previously attached to the surface of the support substrate W or the lower surface of the semiconductor wafer t. The bonding of the semiconductor wafer t may be performed by providing a heater on the stage 21 in advance, and pressing the semiconductor wafer t against the heated support substrate W. The heater may be built in the mounting tool 43a. After only pressing the semiconductor wafer t for a predetermined time, the suction of the semiconductor wafer t is released, and the mounting tool 43a is raised to the original height.

After the mounting by the mounting tool 43a is completed, first, on the mounting area of the mounted semiconductor wafer t held by the right mounting tool 43b, in order to position the semiconductor wafer t held by the right mounting tool 43b, the mounting head is moved 43. After the semiconductor wafer t held on the right mounting tool 43b is positioned on the mounting area, the semiconductor wafer t is mounted on the mounting area by the same operation as the above-described left mounting tool 43a. The mounting head 43 on the left side after the mounting of the semiconductor wafer t by the left and right mounting tools 43 a and 43 b is moved to the intermediate stage 31.

Among them, in parallel with the mounting process of the semiconductor wafer t described above, (3-1) and (3-2) of the process (3) are performed by the transfer unit 30A on the left side. Therefore, when the mounting head 43 on the left side is moved onto the mounting portions 31a and 31b of the intermediate stage 31, the semiconductor wafer t mounted next is placed on the mounting portions 31a and 31b. Therefore, the mounting head 43 moved to the left on the intermediate stage 31 immediately receives the semiconductor wafer t from the mounting portions 31a and 31b, and then executes (4-1) and (4-2) of the process (4). Thereafter, this operation is repeated until the mounting of the semiconductor wafer t with respect to all the mounting areas on the support substrate W is completed.

Even in the middle of the mounting of the semiconductor wafer t by the mounting tools 43a, 43b of the left mounting head 43, the mounting portions 31c, 31d of the intermediate stage 31 are transferred to the mounting portions 31c, 31d of the intermediate stage 31 by the right transferring portion 30B. At the end of the transfer of the semiconductor wafer t, the mounting of the semiconductor wafer t by the mounting head 43 of the right mounting portion 40B is started. This operation is the same as (4-2) of the above-mentioned process (4) described in the example of the left mounting portion 40A. In addition, the mounting head 43 on the right side is the same. The mounting tool 43a from the outer side (because the mounting head 43 on the left side is inverted to the right and left is the right side) performs the semiconductor wafer t in the order of the mounting tool 43b on the inner side Actual installation. The mounting of the semiconductor wafer t by the mounting portion 40B on the right side is the same, and similar to the mounting portion 40A on the left side, it is repeated until the mounting of the semiconductor wafer t with respect to all mounting areas on the support substrate W is completed The action.

At this time, the mounting portion 40A on the left side and the mounting portion 40B on the right side divide the area on the support substrate W into two on the left and right (X direction), and share the respective areas to mount the semiconductor wafer t. Therefore, the mounting head 43 of the left mounting part 40A and the mounting head 43 of the right mounting part 40B can not only perform (4-1) and (4-2) of the above-mentioned process (4), but also Simultaneously in parallel. In addition, in the mounting of the semiconductor wafer t, the stage 21 is also moved. That is, when the left and right mounting heads 43 mount the semiconductor wafer t in the mounting area of the support substrate W, the mounting tools 43a outside the mounting heads 43 are respectively set at predetermined positions on the mounting line (hereinafter, referred to as "Installed position".) The movement position is controlled by the way of mounting.

This mounting position is set as shown in the symbols 71A and 71B of FIG. 7 with respect to the support substrate W placed on the stage 21 at the origin position in a regular positional relationship. In the present embodiment, the distance between the two mounting positions is set to "the distance between the mounting distance of the mounting area (the distance between the centers) P that is twice the distance (the distance between the multiples of 2P) (n times)" . The distance (2P×n) between the mounting positions is equal to or greater than the proximity interval, and the distance (2P×n) is set to be narrower in accordance with the arrangement state of the mounting area supporting the substrate W therein. It is important to set the distance between the mounting positions above the proximity interval and the value of (2P×n) closest to the proximity interval. In this case, since the mounting position of the mounting tool 43a on the outside of each mounting head 43 is set at a fixed position on the mounting line, the stage 21 travels in the mounting area on the mounting line supporting the substrate W In the middle, the movement control is performed so that the mounting area where the semiconductor wafer t is mounted by the outer mounting tool 43a is sequentially positioned at the mounting position. Of course, the movement control is performed by adding the stage correction data memorized in the memory unit 51.

More specifically, first, the stage 21 is in the row of the mounting area on the support substrate W on the mounting line, so that the semiconductor chip is first mounted by the mounting tool 43a outside the mounting head 43 on the left side The mounting area of t moves in the order of the mounting position on the left. After mounting the semiconductor wafer t in the mounting area at the mounting position on the left side, the mounting area beside the mounting area is mounted by the mounting tool 43b inside (right) of the mounting head 43 on the left side Semiconductor wafer t. The movement when mounting the semiconductor wafer t in the adjacent mounting area with the mounting tool inside is performed by the movement of the mounting head 43 as described above. At this time, the mounting area 43a where the semiconductor chip t is initially mounted by the mounting tool 43a on the outer side (right) of the mounting head 43 on the right side is located in the mounting position on the right side. The tool 43a mounts the semiconductor wafer t, and then the semiconductor chip t is mounted by the inside (right) mounting tool 43b.

When mounting the semiconductor wafer t by the mounting tool 43b inside (left) of the mounting head 43 on the right side, the stage 21 is in the row of the mounting area on the support substrate W on the mounting line, so that The mounting area where the second semiconductor wafer t is mounted is moved to the left mounting position by the left mounting tool 43a. In this case, the stage 21 places the mounting area of the mounted semiconductor wafer t in the mounting position in order by the mounting tools 43a on the left and right. During the mounting of a series of semiconductor wafers t (mounting of four semiconductor wafers t) of the mounting tools 43a, 43b of the left and right mounting heads 43, the support substrate W stops at a certain position. Before the mounting of the semiconductor wafer t (the mounting of the next four semiconductor wafers t), the support substrate W is moved by the stage 21 so that the next mounting area of the support substrate W is located at the mounting position. In addition, in the above-mentioned calibration process (1), when there is a deviation in the position recognition result of the dot mark by the substrate recognition camera 43f of the left and right mounting heads 43, it moves to correct the deviation points.

(5) The carrying-out and carrying-in process of the support substrate W is completed with respect to all the mounting areas of the support substrate W. After the mounting of the semiconductor wafer t is completed, the transfer unit 30 and the mounting unit 40 are temporarily stopped to perform the process from the semiconductor wafer t The loading and unloading of the stage 21 supporting the substrate W and the loading onto the stage 21 of the new supporting substrate W are completed. The transfer of the support substrate W from the stage 21 is performed by a transfer robot different from the transfer robot described in the above step (2). This transport robot enters the transport arm from the right side of the mounting device 1 through the space under the door of the support frame 41 of the right mounting part 40B, receives the support substrate W on the stage 21, and then passes through the door of the support frame 41 The space below will carry out the support substrate W. The unloaded support substrate W is transferred to the sealing process S2 described later. The new support substrate W is set on the stage 21 in the same way as the above-mentioned process (2).

(6) The exchange process of the wafer ring 11 is as described above. By repeatedly mounting the semiconductor wafer t on the support substrate W, when the semiconductor chip t on the wafer ring 11 is gone, the wafer ring 11 and the new wafer Ring 11 exchange. This exchange is performed using the wafer ring holding device 32 provided in the transfer unit 30A on the left side as in the above-mentioned process (1). That is, after the semiconductor wafer t on the wafer ring 11 is absent, the holding of the wafer ring 11 by the stretching mechanism (not shown) provided in the component supply unit 10 is released. After that, the wafer ring holding device 32 stores the wafer ring 11 from the wafer ring holder 12 into the storage portion (not shown) in the reverse operation of the process (1), and then the new The wafer ring 11 is supplied to the wafer ring holder 12 from the storage section.

As shown in FIG. 13, a plurality of semiconductor wafers t1 to t3 may be mounted in one mounting area MA. In this case, as described above, after the mounting of the first semiconductor wafer t1 is completed, the wafer ring 11 on which the second semiconductor wafer t2 is mounted is set in the component supply section 10, and the mounting completion is set on the stage 21 Support substrate W of one semiconductor wafer t1. Next, by performing the same operation as the above operation, the second semiconductor wafer t2 is sequentially mounted on each mounting area MA where the first semiconductor wafer t1 is mounted. In this way, after the second semiconductor wafer t2 is mounted to all mounted areas MA of the semiconductor wafer t1, the wafer ring 11 on which the third semiconductor wafer t3 is mounted is set in the component supply section 10, and then The stage 21 sets the support substrate W on which the semiconductor wafers t1 and t2 have been mounted, and the third semiconductor wafer t3 is mounted by the same operation. In this way, a plurality of semiconductor wafers t1 to t3 are mounted in each mounting area MA of the support substrate W.

When a plurality of semiconductor wafers t1 to t3 are mounted in one mounting area MA, after mounting the first semiconductor wafer t1 to all the supporting substrates W as described above, it is not limited to switching to the mounting of the second semiconductor wafer t2 method. For example, after the mounting of the first semiconductor wafer t1 on one support substrate W, the semiconductor wafer t supplied from the component supply unit 10 may be switched to the second semiconductor wafer t2. The same is true for the third semiconductor wafer t3. After the second semiconductor wafer t2 is mounted on one support substrate W, it may be switched to the third semiconductor wafer t3. That is, a plurality of types of semiconductor wafers t may be mounted in units of the support substrate W. At this time, since the support substrate W is not detached from the stage 21 until the mounting of all types of semiconductor wafers t is completed on one support substrate W, the mounting accuracy of a plurality of types of semiconductor wafers t can be further improved.

In the method of mounting the semiconductor wafers t of the above-mentioned various types to all the support substrates W, the support substrate W after the mounting of the semiconductor wafer t1 of the first type is temporarily removed from the stage 21, and the semiconductor of the second type is mounted The wafer t2 is placed on the stage 21 again. Therefore, when the first-type semiconductor wafer t1 is mounted and when the second-type semiconductor wafer t2 is mounted, the position of the support substrate W on the stage 21 varies, that is, the mounting position varies. Even if there is a case where the same position is accidentally formed on the stage 21, the deviation may still occur in general. Although the position of the support substrate W is recognized by global recognition, there may be a deviation in the recognition position of the support substrate W due to factors such as recognition errors. Therefore, it is presumed that only because of this part, the relative position accuracy between the first type and the second type is reduced. On the other hand, when the semiconductor wafer t1 of the first type and the semiconductor wafer t2 of the second type are continuously mounted without removing the support substrate W from the stage 21, it is possible to prevent positional deviations due to recognition errors. Therefore, the relative position accuracy between the first type and the second type can be improved.

The semiconductor wafer t mounted in the plural mounting regions of each support substrate W is not limited to one type. One support substrate W may be divided into a plurality of regions, and different types of semiconductor wafers t may be mounted in each region. For example, the semiconductor wafer ta of the A type may be mounted on the first region that bisects the support substrate W in the Y direction on one side, and the semiconductor wafer tb of the B type may be mounted on the second region of the remaining half. The A-type semiconductor package is manufactured from the first region where the A-type semiconductor wafer ta is mounted. The B-type semiconductor package is manufactured from the area where the B-type semiconductor wafer tb is mounted.

At this time, since the semiconductor wafer ta of the A type and the semiconductor wafer tb of the B type are different in circuit pattern of the rewiring layer formed in the post-process, the exposure pattern for rewiring formation is also different. Therefore, it is presumed that it is more and more difficult to correct the mounting errors of the semiconductor wafers ta and tb by the exposure process. When the mounting device and the mounting method of the embodiment are applied, it is possible to mount with high relative position accuracy between the semiconductor wafer ta of type A and the semiconductor wafer tb of type B. Therefore, it is also possible to collectively perform the exposure process for the area where the A-type semiconductor wafer ta is mounted and the exposure process for the area where the B-type semiconductor wafer tb is mounted, thereby improving the production efficiency.

When the A-type semiconductor wafer ta is mounted in the first area, and the B-type semiconductor wafer tb is mounted in the second area, the size of the A-type semiconductor wafer ta and the B-type semiconductor wafer tb may be different. When the mounting pitch of the product is different from that of the B type. In this case, when the semiconductor wafer ta of the A type is mounted, and the semiconductor wafer tb of the B type is mounted, by switching the feeding amount of the stage 21, it is possible to satisfactorily convert a plurality of types of semiconductor wafers ta, tb It is mounted on a plurality of areas of the support substrate W. Similarly, the combination of the C-type and D-type semiconductor wafers constituting the first multi-chip package in the first region of the support substrate W, and the E-type and F-type semiconductor chips constituting the second multi-chip package in the second region A combination of semiconductor wafers is also possible. In any of these mountings, each type of semiconductor wafer t may be mounted on a plurality of support substrates W, respectively, or a plurality of types of semiconductor wafers may be mounted on a support substrate W unit. The specific installation works are as described above.

In these cases as well, the identification of the global mark of the support substrate W may be performed once at first, and the support substrate W need not be identified again when the semiconductor wafer t is moved from the mounting area from the first area to the second area The global tag of it. In addition, when a heater or the like is provided on the stage 21 to heat the support substrate W, the correction data of the stage 21 may be switched between the first region where the semiconductor wafer t is first mounted and the second region where the semiconductor wafer t is mounted. As a result, during the mounting of the A-type semiconductor wafer ta in the first region, even when the thermal expansion of the portion corresponding to the second region of the support substrate W is increased, the semiconductor wafer t(tb) can The mounting accuracy is maintained at high precision.

When mounting a plurality of types of semiconductor wafers t in units of the support substrate W as described above, a wafer supply mechanism using a tape supplier as the component supply unit 10 may be equipped with a plurality of tape suppliers corresponding to the plurality of types. When the tape feeder is used, a dedicated wafer supply mechanism is provided on both sides of the transfer part 30A and the mounting part 40A on the left and the transfer part 30B and the mounting part 40B on the right, respectively, on both sides of the clamping part supply part 10 can. In this case, different types of semiconductor wafers t or different combinations of semiconductor wafers t can be supplied to the left and right transfer sections 30A, 30B and the mounting sections 40A, 40B. Therefore, it is effective when the above-mentioned support substrate W is divided into two regions to separately manufacture different semiconductor packages.

The support substrate W after completion of the mounting of the above-mentioned one type of semiconductor wafer t, or a plurality of types of semiconductor wafers t1, t2, t3, or semiconductor wafers ta, tb, etc. is sent to the post-processing shown below, thereby manufacturing a semiconductor package The kind of packaged parts. That is, the support substrate W after the completion of the mounting of the semiconductor wafer is sequentially sent to the sealing process and the redistribution layer forming process. In the sealing process, the gap between the semiconductor wafers mounted on the support substrate W is filled with resin, thereby forming a suspected panel or a pseudo-wafer. The suspected panel or pseudo-wafer is sent to the redistribution layer formation process. In the formation process of the redistribution layer, the semiconductor wafer process, the printed circuit board process, or the circuit formation process in the display panel process, that is, the coating process of the photosensitive material such as the photoresist material and the exposure of the photosensitive material And the development process, etching process, ion implantation process, photoresist stripping process, etc., through these processes to form a redistribution layer on the semiconductor wafer of the suspected panel or the pseudo-wafer. The suspected panel or pseudo-wafer forming the redistribution layer is sent to the dicing process, where the encapsulated component of the semiconductor package is manufactured by slicing the suspected panel or pseudo-wafer.

Therefore, as shown in FIG. 14, the method for manufacturing a packaged component of the embodiment includes: a mounting process S1 for mounting electronic components in a plurality of mounting areas of a support substrate W1, by mounting on the plurality of mounting areas Electronic components include sealing process S2 to form suspect wafers or pseudo-panels, rewiring process S3 to form a redistribution layer on the electronic components of suspect wafers or pseudo-panels, cutting the suspect panels or pseudo-wafers to manufacture packaged components Cutting engineering S4. The redistribution process S3 includes the above-described photosensitive material coating process S31, photosensitive material exposure and development process S32, etching process S33, ion implantation process S34, photoresist stripping process S35, and the like. The mounting process of the electronic component in the manufacturing method of the package component of the embodiment is implemented based on the mounting method of the electronic component of the embodiment. In the method of manufacturing a packaged component of the embodiment, the electronic component mounted on each mounting area of the support substrate W may be one semiconductor wafer t as described above, plural semiconductor wafers, or plural semiconductor wafers of the same variety. can. There is no particular restriction on the variety and quantity of electronic components.

In the mounting device 1 of the above-mentioned embodiment, by including two mounting heads 43 and 43 on the left and right of the two mounting tools 43a and 43b, respectively, in the plurality of mounting areas on the support substrate W, relative to the position The semiconductor wafer t is mounted on several mounting areas along the X-direction predetermined mounting line. At this time, the movement of the stage 21 by the XY moving mechanism 22 as the stage moving mechanism of the stage unit 20 is corrected using the stage acquired in advance and stored in the memory unit 51 to correct the movement position error of the stage 21 Correct the information. Moreover, the movement on the mounting line of each mounting tool 43a, 43b by the Y-direction moving device 41a and the X-direction moving device 42a, which are the mounting head moving mechanisms of the left and right mounting heads 43, is acquired in advance and stored in In the memory section 51, the first tool correction data as the tool correction data for correcting the movement position error of the left and right mounting tools 43a, 43b on each mounting line, and the mounting tool as the correction movement to the mounting position The second tool correction data of the tool correction data of the position error at the time of mounting performed by 43a and 43b is corrected.

As a result, the left and right mounting heads 43 can also be mounted on the support substrate W with two mounting tools 43a, 43b respectively when mounting the semiconductor wafer t at different positions on the mounting line with respect to the support substrate W. The mounting error of the semiconductor wafer t in each mounting area on the top is reduced. Furthermore, by mounting the semiconductor wafer t in the plurality of mounting areas of the support substrate W by using the left and right mounting heads 43 each having a plurality of (2) mounting tools 43a, 43b, the mounting time of one semiconductor wafer t can be achieved (Man-hours required for mounting one semiconductor wafer t as the mounting device 1) are reduced. Therefore, it is possible to achieve reduction in man-hours and improvement in mounting accuracy.

That is, in the mounting device 1 of the embodiment, the left and right mounting heads 43 respectively include a total of four mounting tools 43a, 43b, and are generally set along the arrangement direction (X direction) of the mounting tools 43a, 43b The semiconductor wafer t is mounted on a certain mounting line. Therefore, the mounting positions performed by the four mounting tools 43a, 43b are concentrated on a line, and while suppressing an increase in mounting time based on the time required for the movement of the mounting tools 43a, 43b, it can be used for simplification. The generation pattern of the movement position error of each mounting tool 43a, 43b generated during the movement of the mounting. Thereby, the movement position accuracy of each mounting tool 43a, 43b can be ensured by a simple correction method, the reduction in mounting efficiency can be suppressed, and the mounting accuracy of the semiconductor wafer t can be improved.

In addition, since the movement position error of the stage 21 is corrected by the stage correction data, the stage 21 can be moved with high accuracy by a predetermined amount of movement. With this, it is possible to improve the positioning accuracy when each row of the mounting area of the support substrate W is located on the mounting line. Furthermore, when acquiring the stage correction data, the positions of the dot marks 72 provided at equal intervals on one calibration substrate 71 are identified at respective fixed positions by the substrate recognition camera 43f provided on the left and right mounting heads 43. With this, it is possible to grasp the difference in the movement position error between different regions on the same stage 21, and the semiconductor chip t is carried out at different positions of the stage 21 (different positions on the mounting line) by the left and right mounting heads 43 It is also possible to ensure the mounting accuracy during mounting.

Therefore, it is possible to simultaneously achieve mounting accuracy of ±7 μm or less and man-hours of 0.4 seconds or less. As a result, with respect to the support substrate W in which the mark for position detection is not provided in each mounting area, electronic components including the semiconductor wafer t can be mounted with high accuracy so that the mutual interval becomes a predetermined interval. Furthermore, electronic components including the semiconductor wafer t on the support substrate W can be mounted with high productivity. In other words, by mounting the left and right mounting sections 40A and 40B simultaneously in parallel, the man-hours required for mounting the semiconductor wafer t can be shortened. At the same time, by mounting the semiconductor wafer t on a certain mounting line and The correction of the movement position of the stage correction data and tool correction data can simultaneously achieve the effect of improving the mounting accuracy and preventing the reduction of productivity.

For example, consider not moving the stage 21 on which the support substrate W is mounted, and sequentially moving the mounting tools 43a, 43b of the left and right mounting heads 43 in the mounting areas on the support substrate W, and mounting the tools 43a, 43b. The correction data for protecting the entire area on the support substrate W is prepared on the side. In this case, compared with the case where correction data is prepared on the substrate stage, enlarged correction data is required, and the time required for correction becomes longer. That is, the mounting tools 43a and 43b are different from the substrate stage 21, and the vertical movement mechanism is necessary to mount the semiconductor wafer t on the support substrate W. Therefore, when making correction data, in addition to the movement position error of the mounting head moving mechanism, the positional deviation in the XY direction due to the vertical movement of the mounting tools 43a and 43b must also be considered.

Here, when creating correction data on the mounting head side, when using the correction data of the stage 21 to obtain the correction data of the stage 21, at a distance shorter than 3 mm, for example, measuring the moving position error at short intervals such as every 1 mm pitch should be necessary. If the displacement of the moving position is measured at a pitch of 1 mm with respect to the movement range of 600 mm × 600 mm, measurement at 600 points × 600 points, or 360,000 points, is necessary, compared with the case of measuring at a pitch of 3 mm (3 mm pitch is 40,000 points). The measurement site becomes 9 times. Therefore, the measurement time also becomes 9 times. For example, in the mounting device 1 of the embodiment, if it takes about 4 to 5 hours to acquire the stage correction data, it takes 36 to 45 hours. This is not practical.

Therefore, the left and right mounting heads 43 are provided with a total of two mounting tools 43a, 43b, respectively, and are generally equipped with mounting a semiconductor wafer t on a certain mounting line, and at the same time, the movement position error of the stage 21 is adjusted by the stage It is known that the mounting device 1 of the embodiment in which the movement position errors of the mounting tools 43a and 43b are corrected with the tool correction data is corrected with the correction data, and it is known that the improvement of the mounting accuracy of the semiconductor wafer t and the semiconductor wafer can be achieved The shortening of man-hours required for the assembly of t achieves high productivity and is extremely effective.

Among them, when the left and right mounting heads 43 each include two mounting tools 43a and 43b, two semiconductor wafers t can be mounted in one reciprocation, and the configuration having only one mounting head 43 and the left and right mounting heads The structure of 43 each having one mounting tool can simply shorten the total moving distance of the mounting head 43. This is effective when the support substrate W is increased in size by 600×600 mm or more, and the man-hour shortening based on the reduction in the moving distance of the mounting head 43 is effective. Furthermore, in the mounting device 1 of the embodiment, since the mounting of the four mounting tools 43a, 43b in total of the left and right mounting heads 43 is performed, the row of the mounting area of the support substrate W is kept constant. Implementing in the state where the thread is moved can further reduce the moving distance of the mounting head 43.

Furthermore, even if the left and right mounting heads 43 each include two mounting tools 43a and 43b, the mounting position is regarded as a certain position, and each mounting area of the support substrate W is sequentially positioned at a certain mounting position, and When the mounting head 43 alternately mounts the semiconductor wafer t, while the semiconductor wafer is mounted by one mounting head, the other mounting head stands by. Among them, even if each mounting head has multiple mounting tools, the man-hours cannot be shortened sufficiently. Furthermore, the mounting positions of the left and right mounting heads 43 are individually set to the left and right, and the support substrate cannot be moved until the mounting of the semiconductor wafer by the left and right mounting heads 43 is completed. In this case, there is a possibility that the standby time of the mounting head may occur, which hinders the shortening of working hours.

In the mounting device 1 of the embodiment, the left and right mounting heads 43 are each provided with a total of four mounting tools 43a, 43b, and usually the semiconductor wafer t is mounted on a certain mounting line, and the left and right mounting heads 43 are adjusted at the same time It is possible to mount semiconductor wafers at the same time with the left and right mounting heads 43. In addition, after mounting the semiconductor wafer t with one mounting tool 43a of one mounting head 43, mounting of the semiconductor wafer t by the other mounting tool 43b is performed by moving the mounting head 43. Therefore, it is possible to shorten or reduce the standby time when the semiconductor wafer t is mounted with the left and right mounting heads 43. That is, the mounting of the semiconductor wafer t by the mounting tools 43a and 43b respectively provided in the left and right mounting heads 43 can be implemented more efficiently. As a result, the mounting of electronic components such as the semiconductor wafer t by a total of four mounting tools 43a, 43b can be efficiently implemented, and the man-hours of the entire mounting device 1 can be shortened again.

In the mounting device 1 of the above embodiment, as shown in FIG. 13, a plurality of types of semiconductor wafers t1, t2, t3, or the like, or a type or a plurality of types of semiconductor wafers t are mounted in one mounting area MA. Diodes or capacitors are effective. As mentioned above, when a plurality of types of electronic components are mounted in one mounting area, the relative position of the plurality of electronic components in one mounting area (package) may be misaligned. It is difficult to apply the mounting error technique that can be applied to a single chip package in which the mounting area (package) is integrated into one semiconductor chip. Therefore, it is necessary to improve the position accuracy of the plural electronic components during mounting. In view of this, since the mounting device 1 of the embodiment can improve the mounting accuracy of each electronic component including the semiconductor wafer t, even when a plurality of electronic components are mounted in one mounting area, it can be improved in one mounting The relative position accuracy of the complex electronic components in the area.

In addition, in the above-described embodiment, a description will be given of those in which the semiconductor wafer t is mounted on the support substrate W on a certain mounting line. The fixed mounting line may be set at the same position in the Y direction which is usually not changed in the mounting device 1, for example, it may be a position that can be set and changed in the Y direction according to conditions such as the size of the support substrate W . The mounting line set along the X direction may be maintained at a certain position at least from the start of mounting of the electronic component to be mounted to the end of mounting.

Moreover, in the above-mentioned embodiment, the stage correction data for correcting the movement error of the stage 21 may be acquired over the entire range of the movable range of the stage 21, at least in the mounting area where each mounting area on the support substrate W is mounted The position may be acquired within the range in which the stage 21 moves. The tool correction data for correcting the movement position error of the mounting tools 43a and 43b is also the same, and can be acquired in the entire range of the movable range of the mounting tools 43a and 43b, at least in the mounting areas on the support substrate W When the semiconductor wafer t is mounted, it may be acquired within the range of movement of the mounting tools 43a, 43b. Furthermore, the correction data of the stage and the correction data of the tool may use the actual measurement values of the movement position error of the stage 21 and the movement position errors of the mounted tools 43a and 43b, or may be the correction values that offset the movement position errors, etc. The actual measured value processor. It is mainly used to correct the data of the movement position error of the stage 21 and the mounting tools 43a and 43b.

In the mounting device 1 of the above embodiment, although the semiconductor wafer t is mounted on the support substrate W with the electrode forming surface (upper surface) facing upward, the example of face-up mounting is used as the main description, but it is not With this limitation, the face-down mounting of the semiconductor wafer t mounted on the support substrate W with the electrode formation side facing down can also be applied.

When the mounting device 1 of the embodiment is mounted face-down, the semiconductor wafer t taken out by the suction nozzles 37a and 37b of the transfer section 30 is not placed on the intermediate stage 31, but by the reversing mechanism 37e 37f reverses the suction nozzles 37a and 37b up and down. In this state, the suction nozzles 37a and 37b are moved on the intermediate stage 31, and the semiconductor wafer t is transferred from the suction nozzles 37a and 37b to the mounting tools 43a and 43b of the mounting unit 40.

The operation after the mounting tools 43a and 43b accept the semiconductor wafer t can be performed in the same manner as in the above-mentioned process (4). In addition, the wafer recognition cameras 44a to 44d can be used to detect the position of the semiconductor wafer t before mounting, but the camera that picks up and holds the semiconductor wafer t held by the mounting tools 43a and 43b from the lower side is arranged at The vicinity of the intermediate stage 31 may be arranged instead of the intermediate stage 31. why? In the face-down bonding, although the semiconductor wafer t is adsorbed and held on the mounting tools 43a and 43b with the electrode forming surface facing down, the alignment mark of the semiconductor wafer t is usually provided on the electrode forming surface, and the wafer recognition camera 44a ~44d The alignment mark of the semiconductor wafer t cannot be imaged.

Here, if a camera that picks up and holds the semiconductor wafer t held by the mounting tools 43a, 43b from below, an alignment mark that can directly pick up the semiconductor wafer t held by the mounting tools 43a, 43b can be directly picked up. When the wafer recognition cameras 44a to 44d are used, at the stage when the wafer recognition camera 38 detects the position of the alignment mark of the semiconductor wafer t, the positional relationship between the alignment mark and the outline position of the semiconductor wafer t is recognized in advance. Next, after the semiconductor wafer t is sucked and held by the mounting tools 43a and 43b, the semiconductor wafer t is imaged by the wafer recognition cameras 44a to 44d through the mounting tools 43a and 43b, and the outline of the semiconductor wafer t obtained from the captured image is used The position and the positional relationship between the alignment mark recognized in advance and the external shape position of the semiconductor wafer t may be detected by the position of the semiconductor wafer t that is held by the mounting tools 43a and 43b.

In the above-mentioned embodiment, although an example in which two mounting tools 43a and 43b are provided on the left and right mounting heads 43 is described, it is not limited to this, and the number of mounting tools may be three or more. However, as the number of mounting tools increases, the proximity gap becomes larger, so the size of the support substrate W for mounting the semiconductor wafer t is preferably set. In the support substrate W of 600×600 mm exemplified in the present embodiment, the number of mounting tools per one mounting head 43 is preferably 2 to 3.

Furthermore, in the above-mentioned embodiment, an example in which one mounting head 43 is disposed on the left side as the first mounting head and one mounting head 43 is disposed on the right side as the second mounting head is described, but it is not limited to this, and The plural mounting heads 43 may be arranged separately. That is, the first and second mounting heads do not necessarily need to be constituted by a single mounting head, but may be constituted by plural mounting heads. In this case, the plurality of mounting heads may be arranged in a row in the Y direction, and may be configured to be independently movable in the XYZθ directions. In this case, the support frame 41 supporting the Y-direction moving device 41a may be shared by a plurality of mounting heads, or may be provided separately for each mounting head.

Furthermore, in the above-mentioned embodiment, the support substrate W is not provided with a mark for position detection in each mounting area. Although it is described that it is removed during the manufacturing process of the package component, it is not limited to this. According to the mounting device and mounting method of the embodiment, for example, a mark for position detection is provided in each mounting area, that is, it is not necessary to rely on the mark for position detection with respect to the substrate used as a part of the package component It can also mount semiconductor wafers (electronic components) with high accuracy and high efficiency. [Example]

Next, examples of the present invention and evaluation results will be described.

(Example 1) Using the mounting device 1 of the above embodiment, the semiconductor wafer was actually mounted on the support substrate under the following conditions. The target mounting accuracy is within ±7μm, and the target working time is within 0.45 seconds. ＜Mounting conditions＞ 　　・Semiconductor wafer size: 4mm×4mm 　　・Mounting number (vertical×horizontal): 14 mounting heads per 7 mounting heads×7 (total 98) 　　 7 mounting tools per 1× 7 (49 total)×4 mounting tools・Mounting pitch (vertical×horizontal): 12mm×60mm per mounting head 　　 24mm×60mm per mounting tool 　　・Joining time: 0.1 second・Joining load: 5N (Newton)

FIG. 15 is a virtual representation of the mounting area set on the support substrate W. FIG. However, only the global mark is provided on the actual support substrate W, and the mounted area cannot be recognized. As shown in FIG. 15, on the support substrate W for measurement, 49 mountings are set at 7 positions in the X direction and 7 positions in the Y direction with respect to the mounting tools 43 a and 43 b of the left and right mounting heads 43, respectively. area. The left mounting tool 43a of the left mounting head 43 is marked with symbols A1 to A49, the right mounting tool 43b of the left mounting head 43 is marked with symbols B1 to B49, and the right mounting head 43 is left The mounting area of the mounting tool 43a is indicated by symbols C1 to C49, and the mounting area of the right mounting tool 43b of the right mounting head 43 is indicated by symbols D1 to D49.

In addition to the left and right mounting heads 43, the mounting area of the left mounting tool 43a is shown with highlighted four corners (□), and the mounting area of the right mounting tool 43b is shown with blackened corners (■). In the left half of the support substrate W, the mounting area of the mounting tools 43a, 43b of the left mounting head 43 is set, and in the right half of the area, the mounting tools 43a, 43b of the right mounting head 43 are set.装区。 Loading area. The mounting areas of the left and right mounting tools 43a and 43b are set so as to be alternately arranged in the X direction. The interval of the mounting area is set to 12mm. That is, regarding the X direction, a total of 14 mounting areas are set at 12 mm intervals, and regarding the Y direction, 7 mounting areas are respectively set at 60 mm intervals.

As shown in FIG. 15, together with the left half area and the right half area, taking the mounted areas A1 and C1 on the upper left as a starting point, the trajectory of the turn back in the X direction indicated by the dotted arrow in the figure is The left and right mounting tools 43a and 43b are alternately mounted. The mounting tool 43a, 43b of each mounting head 43 sucks and holds the first semiconductor wafer t, and the mounting tool 43a on the left starts to descend toward the first mounting area A1, and the mounting tool 43b on the right ends The elapsed time until the final (49th) mounting of the semiconductor wafer t and the end of the rise to the original height (this is referred to as "mounting time") is 41.2 seconds. With this, the mounting position deviation of the 98 semiconductor wafers t mounted on the support substrate W is measured by the inspection device. The results are shown in Table 1.

In Table 1, the symbols of the mounting area of FIG. 15 are represented by English letters and numbers, respectively. That is, the English letters (A, B, C, D) corresponding to the mounting tools 43a, 43b are described as the columns of the table, and the numbers are described as the rows of the table. The amount of positional deviation in the X direction and Y direction of the semiconductor wafer t in each mounting area is shown for each mounting tool 43a, 43b. In addition, the unit is micrometer [μm]. Under the data of the mounting position deviation of the semiconductor wafer t of each mounting tool 43a, 43b, the average value, minimum value, maximum value, maximum value, and minimum value of the positional deviation of each mounting tool 43a, 43b are described respectively The width, σ value, and 3σ value are listed on the right side of the same value with the data of all the mounting position deviations as the target.

As shown in Table 1, the maximum value of the positional deviation of the semiconductor wafer t in the X direction is 3.1 μm of the mounting area number D1 caused by the right mounting tool 43b of the right mounting head 43, and the minimum value is the right mounting head 43 The left mounting tool 43a creates a mounting area number C35 of -3.3μm. The maximum value of the position deviation in the Y direction is 3.2 μm of the mounting area number B2 caused by the right mounting tool 43b of the left mounting head 43, and the minimum value is the right mounting tool 43b of the right mounting head 43 -2.8μm of mounting area number D43. It was confirmed that the mounting accuracy of 196 semiconductor wafers t was within ±7 μm of the target. Since the time required for mounting is 41.2 seconds, the time required for mounting one semiconductor wafer t is 41.2 seconds/98 pieces=0.42 seconds. Therefore, the working time is 0.42 seconds, and the number of productions per hour is about 8570 (=3600 seconds/0.42 seconds).

(Comparative Example 1) Except that the stage correction data and the tool correction data are not used, the semiconductor wafer t is mounted on each mounting area of the support substrate W under the same conditions as in Example 1. Table 2 shows the results of measuring the positional deviation of the 196 semiconductor wafers t mounted on the support substrate W using an inspection device.

As shown in Table 2, the maximum value of the positional deviation of the semiconductor wafer t in the X direction is 8.8 μm of the mounting area number B7 caused by the right mounting tool 43b of the left mounting head 43, and the minimum value is the right mounting head 43 The left mounting tool 43a causes the mounting area number C43 to be -27.0 μm. The maximum value of the position deviation in the Y direction is 23.7 μm of the mounting area number C23 caused by the left mounting tool 43a of the right mounting head 43, and the minimum value is the mounting caused by the left mounting tool 43a of the right mounting head 43 -22.7μm for area number C45. In Comparative Example 1, it was confirmed that the mounting accuracy of the semiconductor wafer t could not be satisfied within ±7 μm of the target.

In addition, although several embodiments of the present invention have been described, these embodiments are merely examples and are not intended to limit the scope of the present invention. These novel embodiments can also be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and also include the invention described in the patent application scope and the equivalent scope thereof.

1‧‧‧Mounted device 10‧‧‧Part supply section 11‧‧‧ Wafer ring 12‧‧‧Wafer ring holder 20‧‧‧Carrier section 21‧‧‧Carrier 22‧‧‧XY moving mechanism 30 , 30A, 30B ‧‧‧ transfer section 31‧‧‧ intermediate stage 37‧‧‧ transfer head 40, 40A, 40B‧‧‧ mounting section 41‧‧‧ support frame 41a‧‧‧Y direction moving device 42a ‧‧‧ X direction moving device 43‧‧‧ mounted head 43a, 43b ‧‧‧ mounted tool 43c, 43d ‧‧‧ Z direction moving device 43f ‧‧‧ substrate recognition camera 44‧‧‧ camera unit 44a, 44b, 44c, 44d ‧‧‧ Wafer recognition camera 50‧‧‧ Control unit 51‧‧‧Memory unit W‧‧‧Support substrate t‧‧‧Semiconductor wafer T‧‧‧Semiconductor wafer

[Fig. 1] A plan view showing the mounting device of the embodiment.　　 [Fig. 2] shows a front view of the mounting device of the embodiment.　　 [Fig. 3] shows a right side view of the mounting device of the embodiment.　　 [FIG. 4] A block diagram showing the configuration of the mounting device of the embodiment. [FIG. 5] A diagram showing a combination of mounting operations performed by the mounting tool of the mounting device of the embodiment. FIG. 6 is a diagram showing a preparation process of a calibration process of a substrate stage and a mounting tool in the mounting device of the embodiment. FIG. 7 is a diagram showing a calibration process of the substrate stage and the mounting tool in the mounting device of the embodiment. [FIG. 8] A plan view showing an example of the operating state of the mounting device of the embodiment, and showing the operating state of the wafer ring exchange. [FIG. 9] A diagram for explaining a method of correcting the movement position error of the substrate stage in the mounting device of the embodiment. [FIG. 10] A plan view showing an example of the operating state of the mounting device of the embodiment, and a view showing a state where the left and right transfer heads and the left and right mounting heads are located at different positions, respectively.　　 [FIG. 11] A front view showing the mounting device of the embodiment, and the parts supply part and the left and right transfer parts are not shown.　　 [FIG. 12] A front view showing the mounting device of the embodiment, and the parts supply part and the transfer part are omitted from the entire figure. [FIG. 13] A plan view showing an example of electronic components mounted in one mounting area using the mounting device of the embodiment. [FIG. 14] A flowchart showing the manufacturing process of the package component of the embodiment. FIG. 15 is a plan view of a support substrate on which a semiconductor wafer is mounted using the mounting device of Example 1 and Comparative Example 1. FIG.

1‧‧‧Installed device

1a‧‧‧Base

10‧‧‧Parts Supply Department

11‧‧‧ Wafer ring

12‧‧‧wafer ring holder

20‧‧‧Carriage Department

21‧‧‧ stage

22‧‧‧XY moving mechanism

30, 30A, 30B ‧‧‧ Transfer Department

31‧‧‧Intermediate stage

31a~31d‧‧‧Placement

32‧‧‧wafer ring holding device

32a‧‧‧support arm

32b‧‧‧Clamping Department

33‧‧‧ mobile device in Y direction

34‧‧‧Move block in Y direction

35‧‧‧Support

36‧‧‧Movement in X direction

37‧‧‧ Transfer head

37a, 37b ‧‧‧ adsorption nozzle

37c, 37d‧‧‧Mobile device

37e, 37f‧‧‧reverse mechanism

38‧‧‧ Wafer Identification Camera

40, 40A, 40B

41‧‧‧support framework

41a‧‧‧Y moving device

42‧‧‧Head support

42a‧‧‧ mobile device in X direction

43‧‧‧ Actual installation head

43a, 43b ‧‧‧ mounting tools

43c, 43d ‧‧‧ mobile device in Z direction

43f‧‧‧Substrate recognition camera

44‧‧‧Camera unit

44a, 44b, 44c, 44d ‧‧‧ chip recognition camera

44e, 44f‧‧‧A pair of XY mobile devices

44g‧‧‧camera support frame

50‧‧‧Control Department

s‧‧‧resin sheet

t‧‧‧Semiconductor chip

T‧‧‧Semiconductor wafer

W‧‧‧Support substrate

Claims (10)

An electronic component mounting device for mounting electronic components on a support substrate, comprising: a stage portion including: a stage on which the support substrate having a plurality of mounting areas for mounting the electronic component is mounted; A stage moving mechanism that moves the stage in the Y direction perpendicular to the X direction in the horizontal direction; the mounting portion including: a plurality of mounting tools arranged along the X direction and each having a plurality of mounting tools that hold the electronic components The first and second mounting heads, and the mounting head moving mechanism for moving the first and second mounting heads holding the electronic components on the mounting line set along the X direction by the plural mounting tools The first identification part, which identifies the entire position of the support substrate placed on the stage; the second identification part, which identifies the electronic of the plural mounting tools held in the first and second mounting heads; The position of the component; the memory section, which stores: stage correction data that corrects the movement position error of the stage caused by the stage moving mechanism, and corrects the first on the mounting line caused by the head moving mechanism And tool correction data for the movement position error of each of the plurality of mounting tools of the second mounting head; a control part based on the position data of the support substrate recognized by the first identification part and stored in the memory part Of the aforementioned carrier Material, the position data of the electronic component held in the complex mounting tool recognized by the second identification part, and the tool correction data stored in the memory part, so that the support substrate is positioned along the X direction The row of the mounting area is sequentially arranged on the mounting line, and at the same time, the electronic components arranged in the plurality of mounting areas of the mounting line are shared and mounted by the first and second mounting heads. Controls the movement of the stage moving mechanism and the mounting head moving mechanism; the stage has a size capable of mounting the support substrate, and the support substrate has a position in the X direction of the first and second mounting heads The dimension in the X direction of the outer space between the mounting tools is at least twice the distance between them. The mounting device according to claim 1, wherein the stage has a size capable of mounting the support substrate, and the support substrate has a dimension in the X direction of 300 mm or more. The mounting device according to claim 1 or claim 2, wherein the mounting portion mounts a plurality of the electronic components in one mounting area of the support substrate. The mounting device according to claim 1 or claim 2 further includes: a component supply unit that supplies the electronic component; and a transfer unit that includes: receiving the electronic component from the component supply unit and storing the electronic component Before the first or second mounting head The first and second transfer nozzles of the plural mounting tool are described. An electronic component mounting method for mounting electronic components on a supporting board, comprising: acquiring a moving position error of a stage on which a supporting substrate having a plurality of mounting areas for mounting the electronic component is mounted, and correcting the moving position error The process of memorizing the correction data of the stage to the memory section; it will be set on the first and second mounting heads arranged in the X direction along one direction of the horizontal direction respectively, and maintain the movement position error of the plural mounting tools of the aforementioned electronic components, Obtained on the mounting line set along the X direction, and the process of storing the correction data of the tool that corrects the movement position error into the memory section; placing the support substrate on the stage, and identifying the placement on the stage The project of the overall position of the support substrate; correcting the movement of the stage based on the position data of the support substrate and the stage correction data obtained from the position identification process of the support substrate, and at the same time making the complex mounting area The process of moving the stage along the X-direction of the mounting area along the mounting line in sequence; using the multiple mounting tools of the first and second mounting heads to interactively teach the The electronic component recognizes the position of the electronic component held in the complex mounting tool, and corrects the complex mounting of the first and second mounting heads based on the identified position data of the electronic component and the tool correction data The movement of the tool, so that the first and second mounting heads Moving online, the electronic components are shared by the first and second mounting heads in the mounting area located on the mounting line by the plural mounting tools of the first and second mounting heads engineering. The mounting method according to claim 5, wherein the support substrate has the X that is at least twice as large as the proximity interval between the mounting tools located on the outside of the first and second mounting heads in the X direction The size of the direction. The mounting method according to claim 5, wherein the support substrate has a dimension in the X direction of 300 mm or more. The mounting method according to any one of claim 5 to claim 7, wherein the mounting process includes a process of mounting a plurality of the electronic components in one mounting area of the support substrate. A method for manufacturing a packaged component, comprising: a process of mounting electronic components in a plurality of mounting areas of a support substrate, and collectively sealing the electronic components mounted in the plurality of mounting areas to form a suspect wafer or a pseudo panel And the manufacturing process of the packaging component by forming a redistribution layer on the electronic component of the suspected wafer or pseudo-panel; wherein the mounting process of the electronic component includes: obtaining a carrier on which the support substrate is placed The movement position error of the stage, and store the correction data of the stage to correct the movement position error Process; the first and second mounting heads respectively arranged in the X direction along one direction of the horizontal direction, and maintaining the movement position error of the complex mounting tool of the electronic component, set in the X direction along the actual Obtained on the assembly line, the process of storing the correction data of the tool that corrects the movement position error in the memory section; the process of placing the support substrate on the stage and identifying the overall position of the support substrate placed on the stage ; Correcting the movement of the stage based on the position data of the support substrate and the stage correction data obtained from the position identification process of the support substrate, and at the same time so that the mounting along the X direction in the plurality of mounting areas The row of the area is located in the order of the mounting line to move the stage; the multiple mounting tools of the first and second mounting heads are used to interactively receive the electronic components, and the identification is maintained in the complex number. The position of the electronic component to which the tool is mounted, and at the same time, based on the identified position data of the electronic component and the tool correction data, correct the movement of the plurality of mounting tools of the first and second mounting heads, and make the first And the second mounting head move on the mounting line, and the electronic component is moved by the plural mounting tools of the first and second mounting heads in the mounting area located on the mounting line with the first And the second installation head shares the installation work. The method for manufacturing a packaged component according to claim 9, wherein the mounting process of the electronic component includes one of the above-mentioned Installation of multiple electronic components in the installation area.

Images