JPWO2022158076A1 - - Google Patents
Info
- Publication number
- JPWO2022158076A1 JPWO2022158076A1 JP2022576985A JP2022576985A JPWO2022158076A1 JP WO2022158076 A1 JPWO2022158076 A1 JP WO2022158076A1 JP 2022576985 A JP2022576985 A JP 2022576985A JP 2022576985 A JP2022576985 A JP 2022576985A JP WO2022158076 A1 JPWO2022158076 A1 JP WO2022158076A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021006638 | 2021-01-19 | ||
| PCT/JP2021/039694 WO2022158076A1 (en) | 2021-01-19 | 2021-10-27 | Component mounting device and component mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022158076A1 true JPWO2022158076A1 (en) | 2022-07-28 |
Family
ID=82548750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022576985A Pending JPWO2022158076A1 (en) | 2021-01-19 | 2021-10-27 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022158076A1 (en) |
| WO (1) | WO2022158076A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3778676B2 (en) * | 1997-10-31 | 2006-05-24 | アデプトジャパン株式会社 | Component mounting device |
| JP4418014B2 (en) * | 2002-11-13 | 2010-02-17 | 富士機械製造株式会社 | Calibration method for electronic component mounting apparatus |
| JP4769232B2 (en) * | 2007-06-19 | 2011-09-07 | ヤマハ発動機株式会社 | Mounting machine and component adsorption device |
| JP6781677B2 (en) * | 2017-08-01 | 2020-11-04 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment and mounting method, and package component manufacturing method |
-
2021
- 2021-10-27 JP JP2022576985A patent/JPWO2022158076A1/ja active Pending
- 2021-10-27 WO PCT/JP2021/039694 patent/WO2022158076A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022158076A1 (en) | 2022-07-28 |