CN107210206A - Shearing device and cutting-off method - Google Patents
Shearing device and cutting-off method Download PDFInfo
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- CN107210206A CN107210206A CN201680008290.1A CN201680008290A CN107210206A CN 107210206 A CN107210206 A CN 107210206A CN 201680008290 A CN201680008290 A CN 201680008290A CN 107210206 A CN107210206 A CN 107210206A
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- cut
- thing
- mark
- fixture
- hermetic sealing
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- 238000010008 shearing Methods 0.000 title claims description 73
- 238000000034 method Methods 0.000 title claims description 49
- 239000000758 substrate Substances 0.000 claims abstract description 267
- 238000007789 sealing Methods 0.000 claims abstract description 223
- 230000007246 mechanism Effects 0.000 claims description 112
- 230000011218 segmentation Effects 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 description 34
- 239000011347 resin Substances 0.000 description 34
- 238000001179 sorption measurement Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000007689 inspection Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000007115 recruitment Effects 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
Abstract
The cut-out for being formed with the 1st mark (17) with fixture (9) is installed on cut-out workbench (8).1st mark (17) is corresponding with the 2nd mark (4) for being formed at hermetic sealing substrate (1).Measurement the 1st in advance marks the position (the 1st coordinate position) of (17) and stored.Hermetic sealing substrate (1) is placed on cut-out fixture (9), the position (the 2nd coordinate position) of the mark of measurement the 2nd.Compare the 1st coordinate position and the 2nd coordinate position, calculate the bias of hermetic sealing substrate (1).Lift hermetic sealing substrate (1) from cut-out fixture (9), move hermetic sealing substrate (1) foundation bias, hermetic sealing substrate (1) is placed on cut-out fixture (9) again.Thus, can make the position of the cutting line of hermetic sealing substrate (1) alignd exactly with the position of the cutting groove of cut-out fixture (9), therefore can along be located at cutting groove on cutting line by hermetic sealing substrate (1) cut off.
Description
Technical field
Cut-off thing is cut off the present invention relates to manufacture and turns into shearing device and the cut-out side of multiple products of monolithic
Method.
Background technology
Substrate as follows is referred to as hermetic sealing substrate, i.e. in the substrate that will be made up of printed circuit board (PCB), lead frame etc.
Multiple regions of clathrate are virtually divided into, element (such as semiconductor of one or more shaped like chips is mounted with each region
Chip) after, the substrate for whole substrate obtain after resin seal.Using having used the shut-off mechanism of rotating knife etc. will be close
Substrate cutting is sealed, the component for being formed as monolithic in each area unit is exactly product.
All the time, the fate of hermetic sealing substrate is cut off using shearing device and using shut-off mechanisms such as rotating knifes
Domain.BGA (Ball Grid Array Package, BGA Package) product is for example cut off as follows.First, by
Hermetic sealing substrate is placed on cut-out workbench.Then, hermetic sealing substrate is directed at (contraposition).By alignment, set for drawing
Divide the position of the virtual cutting line in multiple regions.Then, make shut-off mechanism and be placed with the cut-out work of hermetic sealing substrate
Platform is relatively moved.Cutting water is ejected into the place of incision of hermetic sealing substrate, and has been sealed using shut-off mechanism along being set in
Cutting line on substrate cuts off hermetic sealing substrate.Manufacture is formed as the product of monolithic by cutting off hermetic sealing substrate.
In cut-out with being provided with cut-out fixture corresponding with product on workbench.Hermetic sealing substrate is loaded and adsorbed
On cut-out fixture.Cut-out fixture includes metallic plate and fixed resin sheet on a metal plate.Use is provided with resin sheet
In the jut for adsorbing and keeping multiple tableland shapes in multiple regions of hermetic sealing substrate respectively.Set respectively in multiple juts
There are the surface insertion resin sheet and the adsorption hole of metallic work table from jut.A plurality of cut-out is provided with to each other in jut
Groove, the cutting groove corresponds to the position for being used for dividing a plurality of cutting line in each region of hermetic sealing substrate.By making cut-out recruitment
Make platform and shut-off mechanism relative movement, hermetic sealing substrate is cut off along a plurality of cutting line and is formed as monolithic.
In the case of cut-out hermetic sealing substrate, make the cutting line of hermetic sealing substrate and on cut-out workbench
Cut-out is cut off with the aligned in position of the cutting groove of fixture.By making rotating knife be moved along cutting line, by hermetic sealing substrate
Cut-out.Cut off in the state of it be deviate from cut-out with the position of the cutting groove of fixture and the position of the cutting line of hermetic sealing substrate
During hermetic sealing substrate, rotating knife deviates the position of cutting groove and machines away a part for resin sheet sometimes.Because resin sheet is cut
Fall and produce substantial amounts of rubbish.It is cut off and when being leaked in adsorption hole when because of the periphery of jut, it is difficult to which absorption is close
Envelope substrate or the product for being formed as monolithic.In addition, the lifetime of cut-out fixture, when being replaced as frequently as cut-out fixture,
Shearing device increases with cost.Thus, make the position of the cutting line of hermetic sealing substrate and the cutting groove of cut-out fixture
Position accurate alignment and cut off be important.
As can accurately carry out the shearing device of position detection, it is proposed that a kind of shearing device, " (summary), including：
Conveying mechanism, its portion of automatically supplying lifts electronic circuit board and is upside down on cut-out workbench；And cutting portion, it will be positioned in
Cut-out cuts into each electronic circuit with the electronic circuit board on workbench, and conveying mechanism has what electronic circuit board was positioned
Positioning element " ([0009] section, Fig. 1, Fig. 2 referring for example to patent document 1).
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2005-353723 publications
The content of the invention
Problems to be solved by the invention
But, in shearing device 1 disclosed in patent document 1, produce following this problem.As patent document 1 Fig. 1 and
Shown in Fig. 2, conveying mechanism 24 has handle part 25, including robotic arm, XYZ mobile stations in front end.Handle part 25 is set to hold work
Part 6 and automatically supplied workbench 15 and be transferred on cut-out workbench 28.Handle part 25 is configured to include grip plate 25a, suction
Attached plate 25c, alignment pin (part for positioning element) 25d and spring 25e etc..Alignment pin 25d is determined workpiece 6 for one side
Position, while making handle part 25 hold workpiece 6.Positioning hole (positioning is formed with the position corresponding with alignment pin 25d of workpiece 6
A part for part) 6c.Positioning hole 6c is created as the diameter circular hole substantially uniform with alignment pin 25d diameter.
In this conveying mechanism 24, while the alignment pin 25d for being arranged at grip plate 25a to be inserted into the positioning of workpiece 6
Positioned in the 6c of hole, while making workpiece 6 be adsorbed in grip plate 25a by air adsorption.It is, therefore, necessary to be formed on workpiece 6
Positioning hole 6c everywhere.Due to forming positioning hole 6c everywhere on all workpiece 6 to be cut off, it thus be accordingly used in form positioning hole 6c's
Energy and expense become huge.Also following drawback is produced：If precision does not form alignment pin 25d and positioning hole 6c well, no
The positioning of workpiece 6 can be carried out.
The problem of present invention is used to solve above-mentioned, its object is to can make to have sealed base there is provided one kind in shearing device
Shearing device and cutting-off method that the position of the cutting line of plate is alignd exactly with the position of the cutting groove of cut-out fixture.
The solution used to solve the problem
In order to solve the above problems, shearing device of the invention is made by cutting off cut-off thing along a plurality of cutting line
Make what is used during multiple products, the shearing device includes：Cut-out fixture, it has multiple 1st marks and a plurality of cutting groove；Cut
Breaking mechanism, it will be positioned on cut-out fixture along a plurality of cutting line and the cut-off thing with multiple 2 marks is cut off；Conveying
Mechanism, it is used to convey cut-off thing；And travel mechanism, it is used to relatively move cut-out fixture and shut-off mechanism, its
It is characterised by, above-mentioned shearing device includes：Part is shot, it is used to shoot multiple 1st marks and multiple 2nd marks；And
Control unit, its cut-off thing for being used to make cut-out with fixture with being positioned in using conveying mechanism on cut-out fixture is aligned, control
Part processed compares the 1st positional information and the 2nd positional information, so as to calculate the position represented between cut-out fixture and cut-off thing
The bias of deviation, above-mentioned 1st positional information is included based on being measured and prestored using the view data for shooting component retrieval
Get up it is specific 1st mark positional information, above-mentioned 2nd positional information using shoot part measure the specific 2nd
The positional information of mark, conveying mechanism lifts cut-off thing from cut-out fixture, makes conveying mechanism and cut-out based on bias
Relatively moved, be moved to so that being cut off thing behind target location corresponding with bias with fixture, conveying mechanism will be cut off
Thing is placed in cut-out fixture again, and target location is moved to by making to be cut off thing, make the position of a plurality of cutting groove with it is a plurality of
The position contraposition of cutting line, shut-off mechanism cuts off the cut-off thing loaded again along a plurality of cutting line.
The shearing device of the present invention is on the basis of above-mentioned shearing device, it is characterised in that contained by shut-off mechanism
At least a portion of the part cut off or at least a portion of the part cut off from the help of shut-off mechanism supply is helped to pass through
Cutting groove corresponding with the positive cutting line cut off in a plurality of cutting line.
The shearing device of the present invention is on the basis of above-mentioned shearing device, it is characterised in that makes conveying mechanism and is cutting
Disconnected to be relatively moved with fixture, so that being cut off thing, at least one direction is moved to mesh in X direction, in Y-direction and θ directions
After cursor position, cut-off thing is placed in cut-out fixture by conveying mechanism again.
The present invention shearing device on the basis of above-mentioned shearing device, it is characterised in that during vertical view along the 1st direction with
And 2nd direction orthogonal with the 1st direction sets specific 1st mark of at least two respectively, along the 1st direction and with the 1st during vertical view
The 2nd orthogonal direction of direction sets specific 2nd mark of at least two respectively.
The shearing device of the present invention is on the basis of above-mentioned shearing device, it is characterised in that cut-off thing is to have sealed
Hermetic sealing substrate after substrate or segmentation.
The present invention shearing device on the basis of above-mentioned shearing device, it is characterised in that cut-off thing be with it is many
Individual product distinguishes the substrate that functional element is made in corresponding multiple regions.
The problem of in order to solve above-mentioned, cutting-off method of the invention includes following process：Prepare have a plurality of cutting groove and
The cut-out fixture of multiple 1st marks；Prepare the cut-off thing with a plurality of cutting line and multiple 2nd marks；Utilize conveyer
Cut-off thing is positioned on cut-out fixture by structure；And by relatively moving cut-out fixture and shut-off mechanism, using cutting
Breaking mechanism cuts off cut-off thing along a plurality of cutting line, it is characterised in that above-mentioned cutting-off method includes following process：Utilize shooting
Part shoots specific 1st mark in multiple 1st marks, obtains the 1st view data；Carried out based on the 1st view data at image
Reason, so as to obtain the 1st positional information of the positional information including the specific 1st mark；Multiple 2nd marks are shot using part is shot
Specific 2nd mark, obtains the 2nd view data in note；Image procossing is carried out based on the 2nd view data, obtaining is included specifically
2nd positional information of the positional information of the 2nd mark；Compare the 1st positional information and the 2nd positional information, so as to calculate expression cut-out
The bias deviateed with the position between fixture and cut-off thing；Conveying mechanism lifts cut-off thing from cut-out fixture；It is based on
Bias makes conveying mechanism be relatively moved with cut-out with fixture, is moved so that being cut off thing to target location corresponding with bias
It is dynamic；And cut-off thing is placed in cut-out fixture by conveying mechanism again, make to be cut off in the process of thing movement, by making
It is cut off thing to move to target location, aligns the position of a plurality of cutting groove and the position of a plurality of cutting line, by cut-off thing
In the process of cut-out, the cut-off thing loaded again is cut off.
The cutting-off method of the present invention is on the basis of above-mentioned cutting-off method, it is characterised in that cut off by cut-off thing
Process in, the help for making at least a portion for the part that the help contained by shut-off mechanism cuts off or being supplied from shut-off mechanism
At least a portion of the part of cut-out passes through cutting groove corresponding with the positive cutting line cut off in a plurality of cutting line.
The cutting-off method of the present invention is on the basis of above-mentioned cutting-off method, it is characterised in that make to be cut off thing movement
Process in, by making conveying mechanism be relatively moved with cut-out with fixture, make to be cut off thing in X direction, Y-direction and θ directions
Moved to target location in middle at least one direction.
The cutting-off method of the present invention is on the basis of above-mentioned cutting-off method, it is characterised in that above-mentioned cutting-off method includes
Following process：Along the 1st direction and 2nd direction orthogonal with the 1st direction during vertical view, set respectively it is multiple 1 mark in, extremely
Few 2 specific 1st marks；Along the 1st direction and 2nd direction orthogonal with the 1st direction during vertical view, multiple 2 are set respectively
Specific 2nd mark of in mark, at least two.
The cutting-off method of the present invention is on the basis of above-mentioned cutting-off method, it is characterised in that cut-off thing is to have sealed
Hermetic sealing substrate after substrate or segmentation.
The present invention cutting-off method on the basis of above-mentioned cutting-off method, it is characterised in that cut-off thing be with it is many
Individual product distinguishes the substrate that functional element is made in corresponding multiple regions.
The effect of invention
Using the present invention, in shearing device, including：Cut-out fixture, it has multiple 1st marks and a plurality of cut-out
Groove；Shut-off mechanism, it will be positioned in cut-out along a plurality of cutting line and be cut with fixture and with the multiple 2 cut-off things marked
It is disconnected；Conveying mechanism, it is used to convey cut-off thing；Travel mechanism, it is used to relatively move cut-out fixture and shut-off mechanism；
Part is shot, it is used to shoot multiple 1st marks and multiple 2nd marks；And control unit, its be used to making being cut off thing with
Cut-out is aligned with fixture.Compare the 1st positional information for being measured by shooting part and being prestored and surveyed by shooting part
The 2nd positional information obtained, so as to calculate the bias between cut-out fixture and cut-off thing.Conveying mechanism is made based on bias
Relatively moved, moved so that being cut off thing to target location with fixture with cut-out.Thus, located at shut-off mechanism rotating knife not
The position of the cutting groove of cut-out fixture can be deviateed, cut-off thing can be cut off exactly along cutting line.
Brief description of the drawings
Figure 1A is the overview of hermetic sealing substrate for representing to use in the embodiment 1 of the shearing device of the present invention, be from
The top view that substrate-side is observed.
Figure 1B is the overview of hermetic sealing substrate for representing to use in the embodiment 1 of the shearing device of the present invention, be from
The front view that substrate-side is observed.
Fig. 2A is the overview for representing the cut-out fixture corresponding with the hermetic sealing substrate shown in Figure 1A and Figure 1B, is to bow
View.
Fig. 2 B are the overviews for representing the cut-out fixture corresponding with the hermetic sealing substrate shown in Figure 1A and Figure 1B, be from
The general profile chart that line A-A is observed.
Fig. 3 A are the overviews that cut-out fixture is represented in the embodiment 2 of the shearing device of the present invention, are top views.
Fig. 3 B are the overviews that cut-out fixture is represented in the embodiment 2 of the shearing device of the present invention, are seen from line B-B
The general profile chart observed.
Fig. 4 is the top view for the summary that shearing device is represented in the embodiment 3 of the shearing device of the present invention.
Fig. 5 A are to represent that hermetic sealing substrate is positioned in into cut-out workbench using being arranged at cut-out with the 1st of fixture mark
On process general profile chart.
Fig. 5 B are to represent that hermetic sealing substrate is positioned in into cut-out workbench using being arranged at cut-out with the 1st of fixture mark
On process general profile chart.
Fig. 5 C are to represent that hermetic sealing substrate is positioned in into cut-out workbench using being arranged at cut-out with the 1st of fixture mark
On process general profile chart.
Fig. 5 D are to represent that hermetic sealing substrate is positioned in into cut-out workbench using being arranged at cut-out with the 1st of fixture mark
On process general profile chart.
Fig. 5 E are to represent that hermetic sealing substrate is positioned in into cut-out workbench using being arranged at cut-out with the 1st of fixture mark
On process general profile chart.
Fig. 6 A are to represent that cut-out is positioned in the state with deviation carries out bias with the hermetic sealing substrate on workbench
The overview for the state for correcting and being positioned on normal position, is the top view for representing the state that hermetic sealing substrate deviate from.
Fig. 6 B are to represent that cut-out is positioned in the state with deviation carries out bias with the hermetic sealing substrate on workbench
The overview for the state for correcting and being positioned on normal position, represents hermetic sealing substrate being positioned on normal position
The top view of state.
Fig. 7 A are the general surveys of large-scale hermetic sealing substrate for representing to use in the embodiment 4 of the shearing device of the present invention
Figure, is the top view observed from substrate-side.
Fig. 7 B are the general surveys of large-scale hermetic sealing substrate for representing to use in the embodiment 4 of the shearing device of the present invention
Figure, is represented the top view of the state after the large-scale quartering of hermetic sealing substrate.
Fig. 8 is that the state for representing segmentation substrate that the hermetic sealing substrate after segmentation is positioned on cut-out workbench is bowed
View.
Embodiment
As shown in Figure 2 A and 2 B, in shearing device, the cut-out fixture 9 corresponding with product is installed on cut-out and used
Workbench 8.Set on resin sheet 11 of the cut-out with fixture 9 by multiple alignment marks constitute the 1st mark 17A, 17B ...
(the 1st mark 17 is suitably collectively referred to as below.Other inscapes are similarly.).1st mark 17A, 17B ... with being formed at
Hermetic sealing substrate 1 by multiple alignment marks constitute the 2nd mark 4A, 4B ... be arranged in correspondence with.In cut-out workbench 8
On, the coordinate position for forming the 1st mark 17 on resin sheet 11 is measured, the coordinate position on the basis of prestoring.
The coordinate of the 2nd mark 4 of hermetic sealing substrate 1 for comparing the coordinate position of the benchmark and being placed in cut-out workbench 8 and measuring
Position, so as to calculate the bias of hermetic sealing substrate 1.By correcting the bias, the 2nd mark 4 of hermetic sealing substrate 1 can be made
Position exactly with aligned in position of the cut-out with the 1st mark 17 of fixture 9.Thus, it can make to be set in a plurality of of hermetic sealing substrate 1
The position of cutting line exactly with the aligned in position for a plurality of cutting groove for being arranged at cut-out fixture 9.Thus, located at shut-off mechanism
Rotating knife do not deviate by cut-out fixture 9 cutting groove position, hermetic sealing substrate 1 can be cut off exactly along cutting line.
Embodiment 1
Reference picture 1A, Figure 1B, Fig. 2A and Fig. 2 B illustrate the embodiment 1 of the shearing device of the present invention.The application text of the present invention
What all accompanying drawings in part were provided to readily appreciate and suitably omitted or exaggerate and schematically describe.Constituted for identical
Key element, marks identical reference and description is omitted as appropriate.
As shown in FIG. 1A and 1B, hermetic sealing substrate 1 includes substrate 2, the installation being made up of printed circuit board (PCB), lead frame etc.
Multiple shaped like chips parts (not shown) in multiple regions (seeing below) that substrate 2 has and multiple regions are covered in the lump
Formed by sealing resin 3.Hermetic sealing substrate 1 is cut-off thing that is last cut-off and being formed as monolithic.
As shown in Figure 1A, many are formed with along the length direction and short side direction of substrate 2 on hermetic sealing substrate 1
2 mark 4A, 4B ... (mark use+represented in accompanying drawing).2nd mark 4 is arbitrarily set according to the size of product, quantity.Profit
With to mutatis mutandis camera the 2nd mark 4 of shooting (not shown), coordinate position is measured by image recognition.By measuring coordinate bit
Put, carry out the contraposition of hermetic sealing substrate 1.Contraposition is usually using the 2nd mark 4 formed at 4 angles of hermetic sealing substrate 1.In figure
In 1A, 8 the 2nd marks 4 for forming 4 angles in hermetic sealing substrate 1 regard the upper left side of hermetic sealing substrate 1 as basic point
Be denoted as respectively in the counterclockwise direction 4A, 4B ..., 4G, 4H.
The 2nd mark 4 respectively oppositely formed on the length direction and short side direction of hermetic sealing substrate 1 is linked, point
Do not set virtually along short side direction a plurality of 1st cutting line 5 extended and a plurality of 2nd cutting line 6 extended along its length.By
Multiple regions 7 that a plurality of 1st cutting line 5 and a plurality of 2nd cutting line 6 are surrounded by being formed as monolithic with distinguishing obtained product
Correspondence.In figure ia, 7 article of the 1st cutting line 5 for example is set along short side direction, 4 article of the 2nd cutting line 5 is set along its length.Cause
And, 3 regions 7 are formed with along short side direction, 6 regions 7 are formed with along its length, altogether in 18 regions of clathrate formation
7.According to the size for the product for wanting singualtion, quantity, arbitrarily setting is formed at the region 7 of hermetic sealing substrate 1.
As shown in Figure 2 A and 2 B, cut-out workbench 8 is to be used to cut off hermetic sealing substrate 1 and shape in shearing device
Workbench as monolithic.In cut-out with being provided with cut-out fixture 9 corresponding with product on workbench 8.Cut-out fixture 9 is wrapped
Include metallic plate 10 and fixed resin sheet 11 on a metal plate.Resin sheet 11 needs appropriate flexibility, to relax mechanical shock.
Preferably, resin sheet 11 is formed such as silicone resin, polyfurolresin.Multiple products share cut-out workbench 8,
Only cut-out is accordingly changed with fixture 9 with product.
Absorption respectively is provided with resin sheet 11 of the cut-out with fixture 9 and keeps multiple regions 7 on hermetic sealing substrate 1
The jut 12 of multiple tableland shapes.Cut-out fixture 9 is provided with surface insertion resin sheet 11 respectively from multiple juts 12
With multiple adsorption holes 13 of metallic plate 10.Multiple adsorption holes 13 are connected with being arranged at the space 14 of cut-out workbench 8 respectively.It is empty
Between 14 be arranged on outside attracting mechanism (not shown) be connected.
With with shown in Figure 1A and Figure 1B mark off a plurality of 1st cutting line 5 in multiple regions 7 of hermetic sealing substrate 1 and
The corresponding mode of a plurality of 2nd cutting line 6 is respectively arranged with a plurality of 1st cutting groove 15 and a plurality of 2nd to each other in jut 12
Cutting groove 16.Short side direction of a plurality of 1st cutting groove 15 along resin sheet 11 (cutting off with fixture 9) is formed, a plurality of 2nd cutting groove 16
Formed along the length direction of resin sheet 11 (cutting off with fixture 9).For being arranged on most being cut by the 1st of end for hermetic sealing substrate 1
Break the 5 and the 2nd cutting line 6, forms the space in the outside in the jut 12 of the most peripheral of resin sheet 11 and has and cutting groove
Identical is acted on.The depth of a plurality of 1st cutting groove 15 and a plurality of 2nd cutting groove 16 is (from the upper surface of jut 12 to groove
The distance of inner bottom surface) it is set as 0.5mm~1.0mm or so.
In addition, in embodiment 1, not in the formation of cut-out fixture 9 and the most by end for being set in hermetic sealing substrate 1
1 cutting line 5 and the corresponding cutting groove of the 2nd cutting line 6.The present invention is not limited to this, also can cut-out fixture 9 formation with
It is set in the 1st cutting line 5 and the corresponding cutting groove of the 2nd cutting line 6 for most leaning on end.In this case, with circular jut
The mode of 12 periphery further sets illusory jut.
As shown in Figure 2 A, be formed at hermetic sealing substrate 1 the 2nd mark 4 (reference picture 1A) position accordingly, in resin
On piece 11 along its length and short side direction be formed with it is multiple 1 mark 17A, 17B ... (the mark use+represented in accompanying drawing
Note).For example, the 2nd mark 4A at 4 angles with being arranged on hermetic sealing substrate 1,4B ..., 4G, 4H coordinate position accordingly,
Resin sheet 11 4 angles formed the 1st mark 17A, 17B ..., 17G, 17H.In addition, with being formed at the of hermetic sealing substrate 1
2 marks 4 accordingly, along its length and short side direction formation requirement the 1st mark 17.For example in fig. 2, one is entered
Step is formed with 2 the 1st marks 17 along its length.The shape between the 1st mark 17A formed along its length and the 1st mark 17H
Into there are 2 the 1st marks 17,2 the 1st marks 17 are formed between the 1st mark 17D and the 1st mark 17E.
Reference picture 1A, Figure 1B, Fig. 2A and Fig. 2 B are aligned to hermetic sealing substrate 1 is positioned in into cut-out with fixture 9
Action illustrate.In cut-out with workbench 8, cut-out fixture 9 is installed on cut-out workbench 8, the quilt of hermetic sealing substrate 1
It is positioned on cut-out fixture 9.Thus, the position letter for the 1st mark 17 that can be will be formed on the resin sheet 11 of cut-out fixture 9
Cease and be formed at hermetic sealing substrate 1 the 2nd mark 4 positional information as the positional information (coordinate on cut-out workbench 8
Position) measure.
First, hermetic sealing substrate 1 be not placed in the state of cut-out fixture 9, using to mutatis mutandis camera (not
Diagram) the 1st mark 17 formed on resin sheet 11 is shot, obtain view data.Image is carried out based on view data
Identification, so as to measure the coordinate position of the 1st mark 17.It regard the coordinate position of the 1st mark 17 measured as cut-out workbench 8
On the coordinate position of benchmark prestore.For example will be formed in resin sheet 11 8 the 1st of 4 angles mark 17A,
17B ..., 17G, 17H coordinate position prestores.
Then, hermetic sealing substrate 1 is placed in cut-out fixture 9 using conveying mechanism (not shown).Base will sealed
Plate 1 is placed in the state of cut-out fixture 9, and the 2nd mark 4 for being formed at hermetic sealing substrate 1 is shot, and obtains picture number
According to.Image recognition is carried out based on view data, so as to measure the coordinate position of the 2nd mark 4.For example to forming 8 at 4 angles
2nd mark 4A, 4B ..., 4G, 4H coordinate position measures.Compare above-mentioned the 2nd mark 4 measured coordinate position and
The coordinate position of the 1st mark 17 prestored.Thereby, it is possible to calculate the X-direction of hermetic sealing substrate 1, Y-direction and θ directions
Bias.
Then, above-mentioned bias is corrected based on counted bias.Specifically, first by conveying mechanism (not shown)
Hermetic sealing substrate 1 is lifted from cut-out fixture 9, hermetic sealing substrate 1 is held in conveying mechanism.Then, will not base sealed
Plate 1 is placed in cut-out fixture 9 and hermetic sealing substrate 1 is held in the state of conveying mechanism, make conveying mechanism in X direction, Y
Appropriate amount of at least one direction movement based on bias in direction and θ directions.By moving conveying mechanism, make to be cut
Disconnected thing is moved to target location corresponding with bias.Target location is that the position that bias is zero or bias are compared before movement
Position reduce and close to the position of null value.Then, hermetic sealing substrate 1 is placed in cut-out fixture again using conveying mechanism
9。
Can be made using the process of the above hermetic sealing substrate 1 the 2nd mark 4 position exactly with cut-out fixture 9 the 1st
The aligned in position of mark 17.Specifically, the position relationship between the 1st mark 17 and the 2nd mark 4 can be set as predetermined position
Put relation.Thus, it can make to be set in a plurality of 1st cutting line 5 of hermetic sealing substrate 1 and the position of a plurality of 2nd cutting line 6 with setting
Align exactly the position of a plurality of 1st cutting groove 15 and a plurality of 2nd cutting groove 16 that are placed in cut-out fixture 9.Thus, set
The position of the cutting groove of cut-out fixture 9 is not deviated by the rotating knife of shut-off mechanism, can cut off close exactly along cutting line
Seal substrate 1.
Can also according to conveying mechanism (not shown) and cut-out fixture 9 structure in conveying mechanism from cut-out fixture 9
Lift hermetic sealing substrate 1 and hermetic sealing substrate 1 be held in the state of conveying mechanism, make cut-out fixture 9 in X direction, Y side
To and θ directions in appropriate amount of at least one direction movement based on bias.Then, base will have been sealed using conveying mechanism
Plate 1 is placed in cut-out fixture 9 again.
Substantially it is to lift hermetic sealing substrate 1 from cut-out fixture 9 in conveying mechanism and be held in hermetic sealing substrate 1
In the state of conveying mechanism, make conveying mechanism and cut-out fixture 9 in X direction, at least one direction phase in Y-direction and θ directions
To the mobile appropriate amount based on bias.As needed, using cut-out is with the 1st mark 17 of fixture 9 or has sealed base
2nd mark 4 of plate 1, (or the 2nd cut with the 1st cutting groove 15 that is arranged at cut-out fixture 9 for the position for making rotating knife (not shown)
Fault trough 16) aligned in position.The position of rotating knife (not shown) can also be made and the 1st cutting line 5 of hermetic sealing substrate 1 is set in
The aligned in position of (or the 2nd cutting line 6).The correction of bias described above is similarly performed in other embodiments.
Conveying mechanism is expressed as " conveying mechanism 22 " in Fig. 4.Relatively move with conveying mechanism and cut-out fixture 9 and
Position between producing, conveying mechanism and cut-out fixture 9 precision (originally should position and actual position between
Bias) it is small enough to the degree that can be ignored in the case of compared with the bias of hermetic sealing substrate 1.For example, defeated to make
The precision for sending mechanism and cut-out fixture 9 to be in identical position relationship and the position in the case of movement has been repeated is enough
It is small to the degree that can be ignored in the case of compared with the bias of hermetic sealing substrate 1.
Using the present embodiment, cut-out fixture 9 corresponding with product is installed on cut-out workbench 8.In cut-out folder
Multiple 1st marks 17 corresponding with multiple 2nd marks 4 for being formed at hermetic sealing substrate 1 are set on the resin sheet 11 of tool 9.Cutting
It is disconnected with workbench 8, to be formed at the coordinate position of the 1st mark 17 of resin sheet 11 measure and as the coordinate bit of benchmark
Put and prestore.Then, the coordinate position of the 2nd mark 4 of the hermetic sealing substrate 1 for being placed in cut-out workbench 8 is entered
Row measurement.Compare the coordinate position of the 1st mark 17 and the coordinate position of the 2nd mark 4, so as to calculate hermetic sealing substrate 1
Bias.By correcting the bias, position and the 1st mark of cut-out fixture 9 of the 2nd mark 4 of hermetic sealing substrate 1 can be made
Align exactly 17 position.Thus, it can make to be set in the position of a plurality of cutting line of hermetic sealing substrate 1 and be arranged at cut-out and use
Align exactly the position of a plurality of cutting groove of fixture 9.Thus, the rotating knife located at shut-off mechanism does not deviate by cut-out fixture
The position of 9 cutting groove, hermetic sealing substrate 1 can be cut off exactly along cutting line.
Using the present embodiment, coordinate position to the 1st mark 17 that is formed at cut-out fixture 9 and it is formed at and has sealed base
The coordinate position of 2nd mark 4 of plate 1 is compared, so as to calculate the bias of hermetic sealing substrate 1.Thus, it is possible to also include
Hermetic sealing substrate 1 is by the dimensional discrepancy of hermetic sealing substrate 1 itself, warpage and cooling water of hermetic sealing substrate 1 etc. are influenceed and sent out
The bias that the ground such as flexible situation calculate the hermetic sealing substrate 1 for the state for being placed in cut-out fixture 9 is given birth to.Thus, no matter
Which kind of state hermetic sealing substrate 1 is, can improve to make to be set in the position of the cutting line of hermetic sealing substrate 1 and be arranged at cut-out and use
The precision of the aligned in position of the cutting groove of fixture 9.
Using the present embodiment, it can make to be set in the position of the cutting line of hermetic sealing substrate 1 and be arranged at cut-out fixture 9
Align exactly the position of cutting groove.Thus, the position of cutting groove is not deviated by located at the rotating knife of shut-off mechanism, can be along cut-out
Line cuts off hermetic sealing substrate 1.Thereby, it is possible to prevent resin sheet 11 from being fallen by rotating knife cuts.Thus, no longer from cut-out fixture 9
Produce rubbish, leaked in the adsorption hole 13 of cut-out fixture 9.Because rotating knife no longer cuts resin sheet 11, therefore cut-out
Life-span with fixture 9 is elongated, can reduce the utilization cost of shearing device.
Embodiment 2
Reference picture 3A and Fig. 3 B illustrate the embodiment 2 of the shearing device of the present invention.Embodiment 2 it is different from embodiment 1 it
It is in the alignment mark of cut-out fixture 9 (the 1st mark) is formed on metallic work table 10 without being formed in resin sheet
On 11.Structure in addition, action are same as Example 1, therefore omit the description.
As shown in Figure 3A, with can mode corresponding with the position for the 2nd mark 4 being arranged on hermetic sealing substrate 1, around tree
Fat piece 11 peripherally along its length and short side direction be formed with metallic plate 10 multiple 1st marks 18 (in accompanying drawing with+
The mark of expression).For example, with can be set in hermetic sealing substrate 14 angles the 2nd mark 4A, 4B ..., 4G, 4H (reference
The corresponding mode in position Figure 1A), be formed with 4 angles of metallic plate 10 the 1st mark 18A, 18B ..., 18G, 18H.This
Outside, can be with can be with being formed at the corresponding mode of the 2nd mark 4 of hermetic sealing substrate 1, along its length and short side direction is formed
There is the 1st mark 18 of requirement.In figure 3 a, represent with being formed at the 2nd all marks 4 of hermetic sealing substrate 1 (to join
According to Figure 1A) corresponding mode forms the situation of the 1st mark 18.
1st mark 18 same with the situation shown in Fig. 2A and Fig. 2 B, will be formed on the metallic plate 10 of cut-out fixture 9
Positional information and be formed at hermetic sealing substrate 1 the 2nd mark 4 positional information as the position on cut-out workbench 8
Information is measured.The coordinate position for forming the 1st mark 18 on metallic plate 10 is measured and as cut-out work
The coordinate position of benchmark on platform 8 is prestored.Compare the coordinate position of the benchmark and be placed in cut-out workbench 8 simultaneously
The coordinate position of 2nd mark 4 of the hermetic sealing substrate 1 measured, so as to calculate the bias of hermetic sealing substrate 1.Correct these inclined
From amount, so as to cut-out fixture 9 in X direction and Y-direction formation the 1st mark 18 position accordingly align it is close
Seal the position of the 2nd mark 4 of substrate 1.Thus, it can make to be set in the position of a plurality of cutting line of hermetic sealing substrate 1 with being arranged at
Align exactly the position of a plurality of cutting groove of cut-out fixture 9.Thus, the rotating knife located at shut-off mechanism does not deviate by cut-out
With the position of the cutting groove of fixture 9, hermetic sealing substrate 1 can be cut off exactly along cutting line.
In example 2, it is formed with the 1st mark 18 on metallic plate 10 of the cut-out with fixture 9.Compared with resin sheet 11,
Metallic plate 10 is easy to carry out the processing of the 1st mark, and the shape of machined surface is sharp.Thus, it is formed at the 1st mark 18 of metallic plate 10
Profile it is clearer than the 1st mark 17 for being formed at resin sheet 11.Thus, the contrast of the 1st mark 18 obtained by image recognition
Degree is made apparent from.Thus, cut-out is improved with the measurement accuracy of the coordinate position of the 1st mark 18 of fixture 9, and aligning accuracy is also carried
It is high.In addition, with effect similarly to Example 1, therefore omit the description.
Embodiment 3
4~Fig. 6 of reference picture B illustrate the embodiment 3 of the shearing device of the present invention.As shown in figure 4, shearing device 19 is by quilt
Cut-out thing is formed as the device of multiple products of monolithic.Shearing device 19 have substrate feeding assembly A, substrate cutting component B and
Check that component C comes respectively as inscape.Each inscape (each component A~C) is able to constitute relative to others and wanted
White, quiet clothes are unloaded and changed.
The substrate for supplying the hermetic sealing substrate 1 equivalent to cut-off thing is provided with substrate feeding assembly A to supply
Mechanism 20, the substrate-placing portion 21 for carrying out the handing-over of hermetic sealing substrate 1 and the conveying for conveying hermetic sealing substrate 1
Mechanism 22.Conveying mechanism 22 can in X direction, Y-direction and Z-direction movement, and can be rotated along θ directions.Hermetic sealing substrate 1 is worked as
After being positioned in substrate-placing portion 21, substrate cutting component B is transported to by conveying mechanism 22.
Shearing device 19 shown in Fig. 4 is the shearing device of single cutting bed mode.Thus, set in substrate cutting component B
There is 1 cut-out workbench 8.Cut-out can be moved with workbench 8 using travel mechanism 23 along the Y-direction of accompanying drawing, and can
Rotated using rotating mechanism 24 along θ directions.Cut-out be provided with workbench 8 cut-out fixture 9 (reference picture 2A, Fig. 2 B, figure
3A and Fig. 3 B), hermetic sealing substrate 1 is loaded and adsorbed on cut-out fixture 9.
It is provided with substrate cutting component B to mutatis mutandis camera 25.Camera 25 can be moved independently along X-direction.
By making camera 25 move in X direction, and cut-out is set to be moved with workbench 8 along Y-direction, to being formed at hermetic sealing substrate 1
The coordinate position of the 2nd mark 4 (reference picture 1A) measure.Thus, virtually set respectively hermetic sealing substrate 1 along short side
A plurality of 1st cutting line 5 of direction extension and a plurality of 2nd cutting line 6 (reference picture 1A) extended along its length.
Main shaft 26 is provided with as shut-off mechanism in substrate cutting component B.Shearing device 19 is provided with 1 main shaft 26
The shearing device of single-shaft configuration.Main shaft 26 can be moved independently along X-direction and Z-direction.Rotating knife is installed on main shaft 26
27.It is provided with to suppress to spray the cutting water of cutting water because of the frictional heat that the rotating knife 27 of high speed rotation is produced in main shaft 26
With nozzle (not shown).By relatively moving cut-out workbench 8 and main shaft 26, hermetic sealing substrate 1 is cut off.Rotating knife 27
Rotated in the face including comprising Y-direction and Z-direction, so that hermetic sealing substrate 1 be cut off.
Inspection component C is provided with inspection workbench 28.It is placed with inspection with workbench 28 by base will have been sealed
Plate 1 cuts off and is formed as the aggregate that multiple product P of monolithic are constituted, i.e. have been turned off substrate 29.Utilize the camera of inspection
It is (not shown) to check multiple product P, filter out certified products and non-certified products.Certified products are accommodated in pallet 30.
In addition, in the present embodiment, being provided with substrate feed unit A and carrying out the action of shearing device 19, sealed
Action, the control of the conveying of substrate 1, the contraposition of hermetic sealing substrate 1, the cut-out of hermetic sealing substrate 1, the inspection for having been turned off substrate 29 etc.
The control unit CTL of system.The present invention is not limited to this, can also be arranged on control unit CTL in other units.
In the present embodiment, the shearing device 19 of single cutting bed mode and single-shaft configuration is illustrated.The present invention is not limited to
This, single cutting bed mode and be the shearing devices of double main axle structures, double cutting bed modes and be double main axle structures cut-out dress
In putting etc. also can using the present invention cut-out workbench 8.
Reference picture 4~Fig. 6 B, illustrate to be positioned in hermetic sealing substrate 1 into the cut-out fixture 9 for being installed on cut-out workbench 8
The upper action aligned.In embodiment 3, illustrate to be formed on metallic plate 10 of the cut-out in cut-out workbench 8 with fixture 9
There is the situation of the 1st mark 18.
As shown in Figure 5A, cut-out workbench 8 is configured to length direction and extended in X direction.Thus, short side direction is with along Y
Mode (in fig. 5 from the inboard towards face front side of paper) configuration of direction extension.Hereinafter, the length of cut-out workbench 8 is illustrated
The situation that degree direction is configured in the way of extending in X direction.
In cut-out with being provided with cut-out fixture 9 on workbench 8.Formed in cut-out with 4 angles of the metallic plate 10 of fixture 9
Have the 1st mark 18A, 18B ..., 18G, 18H (reference picture 3A).The 1st mark 18D, 18E therein are represented in fig. 5.
Then, for example cut-out workbench 8 is made to be moved to the precalculated position of Y-direction using travel mechanism 23 (reference picture 4),
And make to move mutatis mutandis camera 25 in X direction so that camera 25 stop on cut-out fixture 9 specific
On 1 mark 18D.The 1st is shot using camera 25 and marks 18D, obtains view data (the 1st view data).Based on view data
Image recognition is carried out, so as to measure the 1st mark 18D coordinate position (the 1st positional information) and store.In addition, making photograph
Machine 25 is moved along +X direction, and same measurement the 1st marks 18E coordinate position and stored.By so making cut-out work
Platform 8 is moved along Y-direction, and camera 25 is moved in X direction, can be to being formed on the metallic plate 10 of cut-out fixture 9
The coordinate position of the 1st mark 18 measure and store.As needed, the seat of the 1st mark 18 of measurement requirement
Cursor position is simultaneously prestored.The contraposition that these coordinate positions (the 1st positional information) are set as on cut-out workbench 8
The coordinate position of benchmark.In this case, for example measure along the X direction 2 the 1st mark 18D, 18E coordinate position and
The coordinate position of 2 the 1st mark 18B, 18C (reference picture 3A) along the Y direction.By the measure the 1st mark 18D, 18E, 18B,
The data of 18C coordinate position are sent to the control unit CTL (reference picture 4) of shearing device 19, and prestore.
Then, as shown in Figure 5 B, hermetic sealing substrate 1 is placed on cut-out fixture 9 using conveying mechanism 22 (reference picture 4)
On.Now, hermetic sealing substrate 1 is loaded with deviateing the precalculated position of cut-out fixture 9 sometimes.
Then, as shown in Figure 5 C, cut-out is moved with workbench 8 along Y-direction, and camera 25 is moved in X direction,
It is formed at so that camera 25 is for example stopped on the specific 2nd mark 4D of hermetic sealing substrate 1.Shot using camera 25
2nd mark 4D, obtains view data (the 2nd view data).Image recognition is carried out based on view data, so as to measure the 2nd mark
4D coordinate position (the 2nd positional information).Equally, measurement the 2nd marks 4E coordinate position.In this case, measure along X side
To 2 the 2nd marks 4D, 4E coordinate position and the coordinate bit of along the Y direction 2 the 2nd mark 4B, 4C (reference picture 1A)
Put.The data of measure the 2nd mark 4D, 4E, 4B, 4C coordinate position (the 2nd positional information) are sent to control unit CTL.
In control unit CTL, to cut-out the 1st mark 18D, 18E, 18B, the 18C of fixture 9 prestored coordinate position
4D, 4E, 4B, 4C coordinate position is marked to be compared with the 2nd of the hermetic sealing substrate 1 measured the.To the number of these coordinate positions
According to data processing is carried out, so as to calculate the deviation of X-direction, the deviation of Y-direction and the deviation in θ directions respectively.
The coordinate position of the 1st mark of cut-out fixture 9 to prestoring is marked with the 2nd of the hermetic sealing substrate 1 measured
The coordinate position of note carries out data processing, as a result, be judged as the situation in the absence of the deviation of hermetic sealing substrate 1 in control unit CTL
Under, keep mounting cut-out is moved with workbench 8 along +Y direction to the state of hermetic sealing substrate 1.Use main shaft 26 (reference picture 4)
Hermetic sealing substrate 1 is cut off along cutting line.
Carry out data processing, as a result, in the case where control unit CTL is judged as that hermetic sealing substrate 1 there occurs deviation, such as scheme
Shown in 5D, state when hermetic sealing substrate 1 is placed in cut-out fixture 9 is maintained, by conveying mechanism 22 (reference picture 4) from cutting off
Lift hermetic sealing substrate 1 with fixture 9.Based on by the counted biases of control unit CTL, conveying mechanism 22 corrects hermetic sealing substrate 1
X-direction, Y-direction and the bias in θ directions, hermetic sealing substrate 1 is moved to the top in the precalculated position of cut-out fixture 9
It is dynamic.Specifically, conveying mechanism 22 in X direction, in Y-direction and θ directions the movement of at least one direction based on the appropriate of bias
Amount.
Then, as shown in fig. 5e, the position of the bias of the X-direction of hermetic sealing substrate 1, Y-direction and θ directions is being corrected
Put, hermetic sealing substrate 1 is placed on cut-out fixture 9 by conveying mechanism 22 again.Thus, by hermetic sealing substrate 1 exactly
The precalculated position of cut-out fixture 9 is placed in the state of being aligned.Thus, the cutting line position of hermetic sealing substrate 1 can be made
Align exactly the position for putting the cutting groove with being arranged at cut-out fixture 9.It can be used in the cutting line of hermetic sealing substrate 1 with cut-out
The cutting groove of fixture 9 cuts off hermetic sealing substrate 1 in the state of aligning exactly.
Fig. 6 A and Fig. 6 B represent to make the predetermined of the hermetic sealing substrate 1 and cut-out fixture 9 shown in Fig. 5 A~Fig. 5 E with overlooking
The action of position contraposition.As shown in Figure 6A, by the state of hermetic sealing substrate 1 is placed on cut-out workbench 8, sealed
The position of substrate 1 is in X direction, Y-direction and θ directions deviate respectively.In fig. 6, the region SUB fenced up with dotted line
Recruitment is just turned off to make to be placed with the region of hermetic sealing substrate 1 on platform 8.For example first according to the 2nd of hermetic sealing substrate 1 the mark
4D, 4E coordinate position calculate the bias in θ directions.Correct the bias in θ directions, so as to length of the cut-out with workbench 8
Degree direction and short side direction abreast configure the length direction and short side direction of hermetic sealing substrate 1.Distinguish corrected X side from the state
To the bias with Y-direction, so as to which hermetic sealing substrate 1 is configured into the predetermined of cut-out workbench 8 as shown in Figure 6B
Region SUB.
Using the present embodiment, on shearing device 19, can make conveying mechanism 22 in X direction, Y-direction and Z-direction movement
And rotated along θ directions.Thus, in the case that hermetic sealing substrate 1 deviate from the precalculated position of cut-out fixture 9,
The bias of hermetic sealing substrate 1 can be corrected using conveying mechanism 22.Keep the making a reservation for fixture 9 of the deviation cut-out of hermetic sealing substrate 1
Lift hermetic sealing substrate 1 again using conveying mechanism 22 to the state of position.Conveying mechanism 22 is moved from the state to have sealed
The bias of substrate 1, is stopped in cut-out with the top in the precalculated position of fixture 9.Afterwards, hermetic sealing substrate 1 is placed on cut-out
With on fixture 9.Due to that hermetic sealing substrate 1 can be placed on to the precalculated position of cut-out fixture 9, therefore hermetic sealing substrate 1 can be made
The position of cutting line alignd exactly with the position of the cutting groove of cut-out fixture 9.Existing shearing device 19 is not added
New inscape, new function, with regard to can precision carry out the contraposition of hermetic sealing substrate 1 well.Do not improve shearing device 19 and
Expense is not produced, energy precision is carried out well to the contraposition of hermetic sealing substrate 1.Thus, it is possible to suppress the expense of shearing device 19,
And the precision of cut-out, yield rate can be improved.
Using the present embodiment, the position of the cutting line of hermetic sealing substrate 1 and the position of the cutting groove of cut-out fixture 9 can be made
Put in the state of contraposition exactly, hermetic sealing substrate 1 is cut off.Thus, it is possible to prevent resin sheet 11 from being fallen by rotating knife cuts.Energy
Enough prevent from producing rubbish from cut-out fixture 9, leaked in the adsorption hole 13 of cut-out fixture 9.Because rotating knife is no longer cut
Resin sheet 11 is cut, therefore cut-out is elongated with the life-span of fixture 9, can reduce the utilization cost of shearing device 19.Furthermore it is possible to carry
The yield rate of high product, improves the quality of product.
In addition, in the present embodiment, conveying mechanism 22 corrects the inclined of the X-direction of hermetic sealing substrate 1, Y-direction and θ directions
From amount, hermetic sealing substrate 1 is set to move and be positioned in the top in the precalculated position of cut-out fixture 9.The present invention is not limited to this, energy
Conveying mechanism 22 is corrected the bias of the X-direction of hermetic sealing substrate 1, cut-out workbench 8 is corrected Y-direction and θ side
To bias, hermetic sealing substrate 1 is positioned in the precalculated position of cut-out fixture 9.In such a case it is possible to be formed as making defeated
The structure for sending mechanism 22 to move in X direction.
Embodiment 4
Reference picture 7A, Fig. 7 B and Fig. 8 illustrate the embodiment 4 of the shearing device of the present invention.In example 4, explanation is
The cut-out that existing shearing device 19 described above can not be mounted in is cut off with the large-scale hermetic sealing substrate on workbench 8
And be formed as the method for monolithic.
As shown in Figure 7 A, for example, large-scale hermetic sealing substrate 31 has 600mm × 500mm size.In hermetic sealing substrate
On 31 many 2nd marks 32 (mark use+represented in accompanying drawing) are formed with along the length direction and short side direction of substrate.
In Fig. 7 A, the 8 of 4 angles of hermetic sealing substrate 31 are will be formed in the counterclockwise direction using the upper left side of hermetic sealing substrate 31 as basic point
Individual 2nd mark 32 be denoted as respectively 32A, 32B ..., 32G, 32H.At the position in addition to 4 angles of hermetic sealing substrate 31 also edge
Length direction and short side direction are formed with many 2nd marks 32.Although not shown, but formed on hermetic sealing substrate 31 by four
Multiple regions in each several part of the part (by dotted line and the part of the double dot dash line quartering) of decile have with Figure 1A and
The identical size of multiple regions 7 shown in Figure 1B.
For example, the cut-out for the shearing device 19 that can be mounted in shown in Fig. 4 with the size of the hermetic sealing substrate on workbench 8 most
Greatly 320mm × 320mm, therefore hermetic sealing substrate 31 can not be placed in cut-out workbench 8.Thus, if maintaining this state
It is constant, then shearing device 19 can not be used to cut off hermetic sealing substrate 31.Then, hermetic sealing substrate 31 is divided into and can be equipped on
The size of cut-out workbench 8.For example in order to by the quartering of hermetic sealing substrate 31, setting along the cut-off rule 33 of short side direction with
And cut-off rule 34 alongst.
Then, as shown in Figure 7 B, using the part that can split large-scale hermetic sealing substrate 31, along cut-off rule 33 and point
Secant 34 cuts off hermetic sealing substrate 31.Thus, hermetic sealing substrate 31, by the quartering, is divided into the big of 300mm × 250mm
Small hermetic sealing substrate 35.Hermetic sealing substrate 35A, 35B, 35C, the 35D split, which have, can be mounted in shearing device
19 size of the cut-out on workbench 8.By the way that hermetic sealing substrate 31 is split, the sticking up inherently of hermetic sealing substrate 31 is reduced
Song, internal stress etc..Thus, hermetic sealing substrate 35A, 35B, 35C, 35D warpage, size for being split etc. become
Change.
Then, as shown in figure 8, for example having been sealed 1 in the hermetic sealing substrate after the quartering using conveying mechanism 22
Substrate 35A is placed in cut-out workbench 8.In cut-out with the cut-out fixture being provided with workbench 8 shown in Fig. 3 A and Fig. 3 B
9.Thus, many 1st marks 18 are formed with metallic work table 10 of the cut-out with fixture 9.It is pre- with workbench 8 in cut-out
Determine in the range of the SUB of region, hermetic sealing substrate 35A can be loaded.
On hermetic sealing substrate 35A, the 2nd of any 1 in the 2nd mark 32 formed along its length the is denoted as
The 2nd of any 1 is denoted as 32J in 32I, the 2nd mark 32 that will be formed along short side direction.
Using to mutatis mutandis camera 25 (reference picture 4), the 2nd along the length direction formation of hermetic sealing substrate 35A is measured
Mark 32A, 32I and the 2nd mark 32B, the 32J formed along short side direction coordinate position.Compare these the 2nd marks measured
32A, 32I and 32B, 32J coordinate position and the 1st mark 18A, 18H and 18B, the 18C coordinate position prestored.Thus,
The bias of hermetic sealing substrate 35A can be calculated.Correct the bias, so as to with cut-out with the 1st of workbench 8 mark
The 18 corresponding mode in position makes the aligned in position of the 2nd mark 32 of hermetic sealing substrate 35A.Thus, it can make to be set in have sealed
Align exactly the position of cutting groove of the position of substrate 35A cutting line with being arranged at cut-out fixture 9.Thus, rotating knife
The position of the cutting groove of cut-out fixture 9 is not deviated by, and can be accurate by the 35A of hermetic sealing substrate split along cutting line
Ground is cut off.Hermetic sealing substrate 35B, 35C, 35D for being split are placed in cut-out workbench 8 respectively in the same way
Cut off.
Using the present embodiment, by the way that the cut-out of existing shearing device 19 will can not be equipped on large-scale on workbench 8
Hermetic sealing substrate 31 split, existing shearing device 19 can be used to cut off the hermetic sealing substrate 35 after segmentation.This can lead to
Cross to adopt and be achieved with the following method, i.e. using the alignment method for measuring mutatis mutandis camera 25 coordinate position, rather than in the past
Such alignment method for having used alignment pin.Pass through the coordinate position of the 2nd mark 32 to the hermetic sealing substrate 35 after segmentation
It is compared, can be aligned exactly with the coordinate position of the 1st mark 18 of workbench 8 with the cut-out prestored.Thus, lead to
The large-scale segmentation of hermetic sealing substrate of cut-out workbench 8 will can not be equipped on by crossing, and existing shearing device 19 can be used to enter
Row cut-out.
Using the present embodiment, large-scale hermetic sealing substrate 31 can be split and cut off the hermetic sealing substrate 35 after segmentation.
By the way that hermetic sealing substrate 31 is split, the hermetic sealing substrate after the warpage of hermetic sealing substrate 31, internal stress, therefore segmentation is reduced
35 warpage, size etc. change.In the case that even if the size of hermetic sealing substrate 35 after singulation there occurs change, by
In the coordinate position of measurement the 2nd mark 32 of hermetic sealing substrate 35, therefore it can also correct the change of size.Thus, it is possible to accurate
Ground split after hermetic sealing substrate 35 and cut-out workbench 8 contraposition.
Using the present embodiment, same shearing device 19 and same cut-out can be used to have been sealed with workbench 8 by common
Hermetic sealing substrate 35 after substrate 1 and segmentation is cut off.Thus, not on existing shearing device 19, additional new composition will
Plain, new function, the contraposition of the hermetic sealing substrate 35 after hermetic sealing substrate 1 and segmentation is carried out with regard to energy precision well.It is not right
Shearing device 19 is improved and does not produce expense, energy precision is carried out well to the contraposition of hermetic sealing substrate.Thus, it is possible to
Suppress the expense of shearing device 19, and the hermetic sealing substrate with all size can be cut off.
In embodiments, illustrate to regard the hermetic sealing substrate of the element (semiconductor chip etc.) with shaped like chips as quilt
The situation that cut-out thing is cut off.The present invention is not limited to this, using following cut-off thing as in addition to hermetic sealing substrate
Cut-off thing cut off and in the case of being formed as monolithic, also can be using the present invention.First, will partly it be led by silicon, compound
Body is formed, and making has circuit element, MEMS (Micro Electro Mechanical Systems, microelectromechanical systems)
Semiconductor crystal wafer (semiconductor wafer) etc. function element is formed as the situation of monolithic.Second, making there is into electricity
Ceramic substrate, glass substrate of the function element such as resistance, electric capacity, sensor, surface acoustic wave device etc. are formed as monolithic, manufacture chip
The situation of the products such as type resistance, chip-shaped electric capacity, chip-shaped sensor, surface acoustic wave device.In the case of above-mentioned 2 kinds, half
Semiconductor wafer and ceramic substrate etc. have the substrate with the corresponding function element of multiple regions difference equivalent to making.3rd, it will set
Resin-formed product is formed as monolithic and manufactures the situation of the optical elements such as lens, optical module, light guide plate.4th, by ester moulding
Product are formed as monolithic and manufacture the situation of common formed product.5th, the lid of manufacture as various electric equipments etc.
Glass plate situation.In the case of various including above-mentioned 5 kinds of situations, content described above can be applied.
In embodiments, illustrate using the cut-off thing of the rectangular shape with length direction and short side direction as
It is cut off the situation that thing is cut off.The present invention is not limited to this, cut off the cut-off thing with square shape
In the case of situation, the cut-off thing cut-out for the shape that semiconductor crystal wafer is of virtually to circle like that, can also apply more than
The content of explanation.
In embodiments, to being formed at the 2nd coordinate position marked of hermetic sealing substrate and being formed at cut-out fixture 9
The 1st mark be compared, so as to calculate bias.The present invention is not limited to this, can use the figure in addition to the 2nd marks
Case is used as multiple alignment marks.Can use be formed at it is outer on the actual circuit pattern of semiconductor crystal wafer, hermetic sealing substrate
Pattern, overshooting shape electrode (soldered ball on projection, BGA) of the terminal of portion's connection etc. are aligned.
In embodiments, in cut-out with being provided with workbench 8 including metallic plate 10 and fixed tree on a metal plate
The cut-out of fat piece 11 fixture 9.The present invention is not limited to this, can use the cut-out fixture being made up of one or more metals
9, in other words, metal cut-out fixture 9 can be used.The cut-out fixture formed by one or more resins can be used
9, in other words, resinous cut-out fixture 9 can be used.Travel mechanism 23 can also be utilized without using cut-out workbench 8
Cut-out is set directly to be moved with the main body of fixture 9 with rotating mechanism 24.
In embodiments, rotating knife has been used as shut-off mechanism.The present invention is not limited to this, can also use steel wire
Saw, band saw, laser, hydraulic jet and compressed air shotblasting machine etc..In the case of using fret saw and with saw, cut off as help
Part be that the through hole in the space that knife (fret saw and with saw) passes through is arranged at cut-out fixture.Using laser, water-jet
In the case of machine and compressed air shotblasting machine, the through hole in the space passed through as the above-mentioned part for helping to cut off is arranged at cut-out fixture.
Thus, " cutting groove " in the present invention includes the through hole of the slit-shaped run through for " cut-out fixture ".Contained by shut-off mechanism
Help cut off part (rotating knife, fret saw and with saw etc.) at least a portion pass through " cutting groove ".From shut-off mechanism supply
At least a portion of part (laser, the injection water of high pressure and abrasive particle etc.) for cutting off of help pass through " cutting groove ".
The present invention is not limited to above-mentioned each embodiment, can without departing from the spirit and scope of the invention, according to need
Want any and be combined as, change or select to use.
Description of reference numerals
1st, hermetic sealing substrate (cut-off thing)；2nd, substrate；3rd, sealing resin；4th, 4A, 4B ..., 4G, 4H, the 2nd mark；
5th, the 1st cutting line (cutting line)；5th, the 2nd cutting line (cutting line)；7th, region (product)；8th, cut-out workbench；9th, cut-out is used
Fixture；10th, metallic work table；11st, resin sheet；12nd, jut；13rd, adsorption hole；14th, space；15th, the 1st cutting groove (cut-out
Groove)；16th, the 2nd cutting groove (cutting groove)；17th, 17A, 17B ..., 17G, 17H, the 1st mark；18、18A、18B、……、18G、
18H, the 1st mark；19th, shearing device；20th, substrate feed mechanism；21st, substrate-placing portion；22nd, conveying mechanism；23rd, moving machine
Structure；24th, rotating mechanism；25th, to mutatis mutandis camera (shooting part)；26th, main shaft (shut-off mechanism)；27th, rotating knife；28th, examine
Look into and use workbench；29th, substrate is had been turned off；30th, pallet；31st, large-scale hermetic sealing substrate；32、32A、32B、……、32G、32H、
32I, 32J, the 2nd mark；33rd, cut-off rule；34th, cut-off rule；35th, 35A, 35B, 35C, 35D, the hermetic sealing substrate split
(cut-off thing)；A, substrate feeding assembly；B, substrate cutting component；C, inspection component；P, product；CTL, control unit (control unit
Part)；SUB, the region for being placed with hermetic sealing substrate.
Claims (12)
1. a kind of shearing device, it is used when manufacturing multiple products by cutting off cut-off thing along a plurality of cutting line
, the shearing device includes：
Cut-out fixture, it has multiple 1st marks and a plurality of cutting groove；
Shut-off mechanism, it will be positioned on the cut-out fixture and with the institute of multiple 2 marks along a plurality of cutting line
State cut-off thing cut-out；
Conveying mechanism, it is used to convey the cut-off thing；And
Travel mechanism, it is used to relatively move the cut-out fixture and the shut-off mechanism,
Characterized in that,
The shearing device includes：
Part is shot, it is used to shoot the multiple 1st mark and the multiple 2nd mark；And
Control unit, it is used to make the cut-out with fixture and is positioned in using the conveying mechanism on the cut-out fixture
The cut-off thing contraposition,
The control unit compares the 1st positional information and the 2nd positional information, thus calculate the expression cut-out fixture with it is described
The bias that the position being cut off between thing is deviateed, the 1st positional information is included based on utilizing the shooting component retrieval
The positional information for specific 1st mark that view data is measured and prestored, the 2nd positional information is using institute
The positional information for shooting specific 2nd mark that part is measured is stated,
The conveying mechanism lifts the cut-off thing from the cut-out fixture, makes the conveyer based on the bias
Structure and the cut-out are relatively moved with fixture, so that the cut-off thing is moved to target location corresponding with the bias
Afterwards, the cut-off thing is placed in the cut-out fixture by the conveying mechanism again,
By making the cut-off thing be moved to the target location, make the position of a plurality of cutting groove and a plurality of cut-out
The position contraposition of line,
The shut-off mechanism cuts off the cut-off thing loaded again along a plurality of cutting line.
2. shearing device according to claim 1, it is characterised in that
At least a portion for the part that help contained by the shut-off mechanism is cut off or the side supplied from the shut-off mechanism
At least a portion of part of cut-out is helped by cutting described in corresponding with the positive cutting line cut off in a plurality of cutting line
Fault trough.
3. shearing device according to claim 2, it is characterised in that
The conveying mechanism and the cut-out is relatively moved with fixture so that the cut-off thing in X direction, Y-direction
And at least one direction is moved to behind the target location in θ directions, the conveying mechanism carries the cut-off thing again
It is placed in the cut-out fixture.
4. according to shearing device according to any one of claims 1 to 3, it is characterised in that
Set respectively the specific 1st described at least two along the 1st direction and 2nd direction orthogonal with the 1st direction during vertical view
Mark,
Set respectively the specific 2nd described at least two along the 1st direction and 2nd direction orthogonal with the 1st direction during vertical view
Mark.
5. according to shearing device according to any one of claims 1 to 3, it is characterised in that
The cut-off thing be hermetic sealing substrate or segmentation after hermetic sealing substrate.
6. according to shearing device according to any one of claims 1 to 3, it is characterised in that
The cut-off thing is the substrate that functional element is made in corresponding multiple regions are distinguished with the multiple product.
7. a kind of cutting-off method, including following process：
Prepare the cut-out fixture with a plurality of cutting groove and multiple 1st marks；
Prepare the cut-off thing with a plurality of cutting line and multiple 2nd marks；
The cut-off thing is positioned on the cut-out fixture using conveying mechanism；And
, will along a plurality of cutting line using the shut-off mechanism by relatively moving the cut-out fixture and shut-off mechanism
The cut-off thing cut-out,
Characterized in that,
The cutting-off method includes following process：
Specific 1st mark in the multiple 1st mark is shot using part is shot, the 1st view data is obtained；
Image procossing is carried out based on the 1st view data, so as to obtain the positional information including specific 1st mark
1st positional information；
Specific 2nd mark in the multiple 2nd mark is shot using the shooting part, the 2nd view data is obtained；
Image procossing is carried out based on the 2nd view data, the 2nd of the positional information for including specific 2nd mark is obtained
Positional information；
Compare the 1st positional information and the 2nd positional information, cut so as to calculate the expression cut-out fixture with described
The bias that position between disconnected thing is deviateed；
The conveying mechanism lifts the cut-off thing from the cut-out fixture；
The conveying mechanism is relatively moved with the cut-out with fixture based on the bias so that the cut-off thing to
Target location movement corresponding with the bias；And
The cut-off thing is placed in the cut-out fixture by the conveying mechanism again,
In the process for making the cut-off thing movement, by making the cut-off thing be moved to the target location, make
The position of a plurality of cutting groove and the position of a plurality of cutting line are aligned,
Described by the process of the cut-off thing cut-out, the cut-off thing loaded again is cut off.
8. cutting-off method according to claim 7, it is characterised in that
Described by the process of the cut-off thing cut-out, make the part that the help contained by the shut-off mechanism is cut off extremely
At least a portion for the part that a few part or the help supplied from the shut-off mechanism are cut off by with a plurality of cut-out
The positive corresponding cutting groove of cutting line cut off in line.
9. cutting-off method according to claim 8, it is characterised in that
In the process for making the cut-off thing movement, by making the conveying mechanism be relatively moved with the cut-out with fixture,
Making the cut-off thing, at least one direction is moved to the target location in X direction, in Y-direction and θ directions.
10. the cutting-off method according to any one of claim 7~9, it is characterised in that
The cutting-off method includes following process：
Along the 1st direction and 2nd direction orthogonal with the 1st direction during vertical view, set respectively in the multiple 1st mark
, specific 1st mark described at least two；
Along the 1st direction and 2nd direction orthogonal with the 1st direction during vertical view, set respectively in the multiple 2nd mark
, specific 2nd mark described at least two.
11. the cutting-off method according to any one of claim 7~9, it is characterised in that
The cut-off thing be hermetic sealing substrate or segmentation after hermetic sealing substrate.
12. the cutting-off method according to any one of claim 7~9, it is characterised in that
The cut-off thing is the substrate that functional element is made in corresponding multiple regions are distinguished with multiple products.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-021259 | 2015-02-05 | ||
| JP2015021259A JP6212507B2 (en) | 2015-02-05 | 2015-02-05 | Cutting apparatus and cutting method |
| PCT/JP2016/050202 WO2016125518A1 (en) | 2015-02-05 | 2016-01-06 | Cutting device and cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107210206A true CN107210206A (en) | 2017-09-26 |
| CN107210206B CN107210206B (en) | 2020-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680008290.1A Active CN107210206B (en) | 2015-02-05 | 2016-01-06 | Cutting device and method for manufacturing multiple products by cutting cut object |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6212507B2 (en) |
| KR (1) | KR102089098B1 (en) |
| CN (1) | CN107210206B (en) |
| TW (1) | TWI622090B (en) |
| WO (1) | WO2016125518A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112074357A (en) * | 2018-05-14 | 2020-12-11 | 株式会社富士 | Lead cutting unit and mounting machine provided with same |
| CN114609711A (en) * | 2022-03-09 | 2022-06-10 | 业成科技（成都）有限公司 | Manufacturing method of optical element, clamping device, display module and electronic equipment |
| CN115815474A (en) * | 2022-12-01 | 2023-03-21 | 广东新亚光电缆股份有限公司 | Low-voltage wire and intelligent processing system thereof |
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| JP6483541B2 (en) * | 2015-06-16 | 2019-03-13 | 株式会社ディスコ | Processing method of package substrate |
| JP2018133432A (en) * | 2017-02-15 | 2018-08-23 | 株式会社ディスコ | Cutting device |
| WO2021059937A1 (en) | 2019-09-27 | 2021-04-01 | 株式会社東京精密 | Dicing device and method |
| JP7377092B2 (en) * | 2019-12-16 | 2023-11-09 | Ｔｏｗａ株式会社 | Statistical data generation method, cutting device and system |
| JP2022007540A (en) * | 2020-06-26 | 2022-01-13 | キヤノントッキ株式会社 | Alignment device, film deposition apparatus, alignment method, electronic device manufacturing method, program and storage medium |
| JP7446169B2 (en) * | 2020-06-26 | 2024-03-08 | キヤノントッキ株式会社 | Substrate transfer device, substrate processing system, substrate transfer method, electronic device manufacturing method, program and storage medium |
| JP7440355B2 (en) * | 2020-06-26 | 2024-02-28 | キヤノントッキ株式会社 | Alignment equipment, film forming equipment, alignment method, electronic device manufacturing method, program and storage medium |
| JP7440356B2 (en) * | 2020-06-26 | 2024-02-28 | キヤノントッキ株式会社 | Alignment equipment, film forming equipment, alignment method, electronic device manufacturing method, program and storage medium |
| JP7438865B2 (en) * | 2020-06-26 | 2024-02-27 | キヤノントッキ株式会社 | Alignment equipment, film forming equipment, alignment method, electronic device manufacturing method, program and storage medium |
| JP7423161B2 (en) | 2020-06-30 | 2024-01-29 | 株式会社ディスコ | chuck table |
| JP2022152993A (en) * | 2021-03-29 | 2022-10-12 | Ｔｏｗａ株式会社 | Processing device and production method of finished product |
| KR102633129B1 (en) * | 2021-09-29 | 2024-02-06 | 한국생산기술연구원 | Alignment method between dies and wafers on bonding step |
| JP2024024364A (en) * | 2022-08-09 | 2024-02-22 | Ｔｏｗａ株式会社 | Cutting device and method for manufacturing cut product |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107210206B (en) | 2020-09-22 |
| TW201643951A (en) | 2016-12-16 |
| JP6212507B2 (en) | 2017-10-11 |
| TWI622090B (en) | 2018-04-21 |
| WO2016125518A1 (en) | 2016-08-11 |
| KR102089098B1 (en) | 2020-03-13 |
| KR20170110651A (en) | 2017-10-11 |
| JP2016143861A (en) | 2016-08-08 |
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