JP3142877U - Work table drip-proof mechanism and wire saw - Google Patents

Abstract

A drip-proof structure is provided for a drive mechanism portion of a work table 2 that is movable in X, Y, and Z-axis directions and that is rotatable in a θ-axis direction so as not to prevent movement of the work table 2 in all directions.
The X table is movable in the X axis direction, the Y table is movable in the Y axis direction perpendicular to the X axis direction, and the Z table is movable in the Z axis direction perpendicular to the XY plane. A drip-proof mechanism for the work table 2 that is rotatable in the θ-axis direction with the Z axis as the rotation center, and the work table 2 is fixed, and is movable in the X-axis, Y-axis, and Z-axis directions and is in the θ-axis direction. A neck portion 85 that is freely rotatable, a table cover 95 through which the neck portion 85 penetrates, a lip seal 100 that drip-tightly seals the gap between the neck portion 85 and the table cover 95, and fixed to both side surfaces of the table cover 95. And a bellows-shaped drip-proof cover 110.
[Selection] Figure 1

Description

  The present invention relates to a drip-proof mechanism for a work table on which various workpieces (workpieces) are placed for processing (cutting, cutting, etc.) and a wire saw with a processing position correction function including the work table.

  Conventionally, as a method for cutting a ceramic green sheet for producing a substrate-like workpiece, for example, a laminated chip part or the like, main methods include (1) press cutting and (2) blade cutting.

(1) Press-cutting is a method in which a cutting blade having no shear angle is pressed against a laminated ceramic green sheet to make a cut.

(2) Blade cutting is a method of cutting a laminated ceramic green sheet with a rotary blade.

  In both cases, the table on which the ceramic green sheet is placed moves at a predetermined pitch in accordance with the chip size (size for cutting the ceramic green sheet) to define the cutting position. These methods are disadvantageous in terms of process lead time because the cuts are made one by one in order.

As a problem in cutting ceramic green sheets, part one is ceramic green sheets
(1) dimensional error of electrode pattern,
(2) Stacking error during stacking,
(3) The distortion error during crimping is included.

  Since these errors exist, in the case of fixed-size cutting (for example, the moving distance of the work table is set to a fixed size), it leads to the occurrence of defects such as the internal electrode pattern protruding from the cut-out chip parts. Accordingly, it is necessary to perform cutting while correcting the cutting position in consideration of these dimensional errors. Therefore, the use of a multi-slicer (having a plurality of rotary blades having a predetermined pitch) having a fixed pitch is required. It is difficult, and it is necessary to rely on a method by sequential processing, which is an obstacle to shortening the lead time of the above process.

  The problem in cutting ceramic green sheets, part 2, is the miniaturization of products. In other words, with the recent reduction in size and size of electronic devices, the dimensions of chip components used in the devices are less than 1005 (1.0 × 0.5 × 0.5 mm), and 0402 (0.4 × 0.2). × 0.2 mm) and is becoming smaller. Therefore, in the above-described press-cutting, the cutting surface is distorted and distorted due to narrow pitch cutting and processing load, and blade cutting causes problems such as chipping and breakage due to chipping. .

  On the other hand, the wire saw attaches abrasive grains to the wire (in some cases, free abrasive grains, which are a mixture of abrasive grains and cutting oil, are applied to the traveling wire, and there are fixed abrasive grains in which the abrasive grains are directly attached to the wire). Because of the method of cutting a workpiece such as a semiconductor ingot with the abrasive grains, it is expected that the processing load of push cutting and the problems caused by the high-speed rotary blade of blade cutting can be solved.

  Also, there is a multi-type wire saw that forms a wire row by spirally winding a wire between a plurality of work rollers that have been subjected to grooving according to the processing pitch, and processes the workpiece by running the wire. Are known. The advantage of the multi-type wire saw is that a narrow pitch can be cut and processed at a large number of points (for the number of wires in the wire array) at a time, and is widely used for cutting and grooving electronic components. This multi-type wire saw has the potential to reduce the lead time of the ceramic green sheet cutting process.

  However, as described above, the multi-type wire saw is mainly used for cutting a semiconductor ingot or the like in a ring cutting direction, and the cutting time extends to several hours. . When cutting a ceramic green sheet with a wire saw, the cutting time is expected to be 2 to 3 minutes. Therefore, when supplying and discharging a workpiece manually, the total lead time cannot be reduced as much as expected.

  In addition, the multi-type wire saw is suitable for cutting and processing at a predetermined pitch, but it is difficult to change the processing pitch in accordance with a workpiece having a dimensional error. Although it is possible to change the pitch by providing a plurality of independent work rollers, it is difficult when the processing pitch is small.

  Further, in order to change the machining pitch in accordance with a workpiece having a dimensional error, a process for comparing the dimensional error with a reference value is required. For example, the workpiece is imaged by an imaging device, and the result is compared with the reference value. A function is required.

  Although there are multi-type wire saws with an imaging device, the length of the lead time described above, the structural limitation that the wire train wound around the work roller is located directly above the workpiece, and contamination of the imaging device by free abrasive grains are also present. For reasons of prevention, the imaging device is detachable. When setting a new workpiece, the positional relationship between the wire and the workpiece is checked by the imaging device, and the imaging device is removed during the cutting process. In the sheet cutting process, it is difficult to obtain the effect of reducing the lead time.

  In other words, the current multi-type wire saw does not provide a method for correcting the dimensional error of the ceramic green sheet (there is a dimensional error for each sheet), and the current multi-type wire saw does not cut the ceramic green sheet. Is difficult to put into practical use.

  Therefore, the present applicant discloses in Patent Document 1 a method of changing the wire pitch by swinging a pair of work rollers in parallel.

JP-A-2005-14126

  When an imaging device is provided in a wire saw, it is conceivable that the imaging device is installed in a section away from the workpiece processing position so that it can cope with high throughput. For this purpose, the workpiece between the section provided with the imaging device and the processing section is considered. A conveyance function is required, and a table having a position correction function is required to perform processing position correction using the image processing result of the imaging apparatus. In the case of a wire saw, the table needs a drip-proof function to avoid the influence of cutting water used for processing.

  The drip-proof function of ordinary processing machines can be handled by using bellows. However, in the case of a table having a position correction function in the wire saw, the table moves in all the directions of the XYZθ axes, so that it is difficult to cope with the conventional drip-proof function.

  Known examples of devices having a drip-proof function are as follows.

Japanese Patent Laid-Open No. 61-25728 Japanese Utility Model Publication No. 62-19126 JP-A-61-76214 JP-A-2-298435 Japanese Utility Model Publication No. 6-45344 JP-A-8-224688

  Patent document 2 is provided with a cylindrical cover for drip-proofing the motor driving device of the machining feed device against the machining liquid in the electric discharge machining apparatus.

  In Patent Document 3, a surface other than a workpiece mounting reference surface of a workpiece mounting table mounted on an X and Y axis movement base of a wire cut electric discharge machine is covered with a waterproof cover. However, it is not assumed that the workpiece placement table moves up and down or rotates, and cannot be handled.

  In Patent Document 4, in a wire-cut electric discharge machining apparatus, a drip-proof wall is provided detachably by a magnet around a workpiece or on a workpiece mounting support.

  In Patent Document 5, an actuator for attaching a bellows on a table for drip-proofing and expanding and contracting the bellows is provided.

  In Patent Document 6, wiring for blade detection means in a precision cutting apparatus is provided in a spindle housing for drip-proofing.

  Patent Document 7 is an underwater processing apparatus having a structure in which water does not enter the processing nozzle until the processing nozzle reaches the workpiece and starts processing even in the water. .

  The present invention has been made in view of the above points, and a drive mechanism portion of a work table that is movable in the X-axis, Y-axis, and Z-axis directions and is rotatable in the θ-axis direction is provided in all directions of the work table. An object of the present invention is to provide a drip-proof mechanism for a work table that can have a drip-proof structure without interfering with the movement of the machine, and a wire saw equipped with the same.

  Other objects and novel features of the present invention will be clarified in embodiments described later.

In order to achieve the above object, the drip-proof mechanism of the work table according to the present invention includes an X table that is perpendicular to the X axis direction, a Y table that is perpendicular to the X axis direction, and a Z table that is perpendicular to the XY plane. A drip-proof mechanism for the work table that is movable in the Z-axis direction and is rotatable in the θ-axis direction around the Z-axis by the θ table,
A work table is fixed, a neck portion that is movable in the X-axis, Y-axis, and Z-axis directions and rotatable in the θ-axis direction;
A table cover through which the neck portion penetrates;
A lip seal that seals the gap between the neck portion and the table cover in a drip-proof manner and allows the neck portion to move in the Z-axis direction and rotate in the θ-axis direction;
A bellows-shaped drip-proof cover that is fixed to both side surfaces of the table cover and allows movement of the table cover in the X-axis and Y-axis directions in accordance with the movement of the neck portion is provided.

  In the drip-proof mechanism of the work table, the bellows-shaped drip-proof cover is attached to be extendable in either the X-axis or Y-axis direction, and is flexible in a direction orthogonal to the expansion / contraction direction on the XY plane. You may have.

  In the drip-proof mechanism of the work table, the amount of movement of the bellows-shaped drip-proof cover in the flexible direction may be an amount that does not exceed the flexibility limit of the bellows-type drip-proof cover.

  In the drip-proof mechanism of the work table, the table cover may be attached to be movable only in the Y-axis or X-axis direction orthogonal to the X table or Y table.

  A wire saw with a processing position correcting function according to the present invention is characterized by including a drip-proof mechanism for the work table.

  According to the drip-proof mechanism of the work table according to the present invention, the work table drive mechanism that is movable in the X-axis, Y-axis, and Z-axis directions and is rotatable in the θ-axis direction is used to move the work table in all directions. It is possible to prevent drip without interfering.

  That is, drip-proofing between the neck portion to which the work table for placing the workpiece is fixed and the table cover can be performed with a lip seal so as to allow the neck portion to move in the Zθ-axis direction. As a result, it is possible to prevent the cutting water used for processing from entering through the gap between the neck portion that is moved up and down and the table cover, and that the cutting water is applied to the drive mechanism portion covered with the table cover. Can be prevented.

  The drive mechanism portion that cannot be covered with the table cover is fixed to both side surfaces of the table cover, and allows the table cover to move in the X-axis and Y-axis directions along with the movement of the neck portion. It can be covered with a drip-proof cover. Cutting water or the like can be prevented from being applied to the drive mechanism portion covered with the bellows-shaped drip-proof cover.

  Hereinafter, as a best mode for carrying out the present invention, embodiments of a drip-proof mechanism for a work table and a wire saw will be described with reference to the drawings.

  1 and 2 show a drip-proof mechanism for a work table, and FIGS. 3 to 5 show an overall schematic configuration of a multi-type wire saw equipped with the work table drip-proof mechanism and having a machining position correcting function.

  First, the overall configuration of a multi-type wire saw with a machining position correction function will be described with reference to FIGS. A multi-type wire saw with a processing position correction function includes a wire saw body 1, a work table 2, an imaging device (camera) 3, and a loader 4.

  A wire supply reel 11 and a wire take-up reel 12 are rotatably provided on the front surface of the body frame 10 of the wire saw body 1, and one wire W made of a steel wire fed out from the wire supply reel 11 is the wire. After being wound a plurality of times between a pair of work rollers 21 and 22 facing each other in parallel via a tension control mechanism 13 for absorbing the looseness of W (wound in multiple lines), another tension is applied. It is wound around the winding-side wire reel 12 via the control mechanism 14. Here, the pair of work rollers 21 and 22 are rotatably supported by the roller swing mechanism 25 of FIG. 5 and the central axes of the rollers 21 and 22 can be tilted in the horizontal direction in the horizontal plane (the tilt angle is α). It is shown). These work rollers 21 and 22 are disposed in the processing chamber 5 on the front side of the main body frame. The wire saw body 1 is provided with an operation panel 6 for instructing and displaying various operations.

  As shown in the plan view of FIG. 6A and the perspective view of FIG. 6B, the pair of work rollers 21 and 22 are arranged in parallel with each other in a horizontal plane and are rotatable. Each has a plurality of wire grooves (grooves formed so as to make one round of the outer periphery) at a constant pitch interval, and the wire W passes from one wire groove through each work roller 21 and 22 sequentially. The other wire groove is sequentially wound spirally, and the winding interval of the wire W is made uniform. As a result, a wire row WL having a uniform wire arrangement interval (pitch) is formed between the two work rollers 21 and 22 in the horizontal position.

  Then, one of the pair of work rollers 21 and 22, for example, the work roller 21, is caused to repeat the forward rotation or the forward / reverse rotation by the drive motor, thereby causing the wire row WL to go straight or reciprocate. Do exercise.

  The worktable 2 is slidable in the X-axis direction (horizontal direction) in the horizontal plane, the Y-axis direction (depth direction) perpendicular to the X-axis direction, and the Z-axis direction (vertical direction) perpendicular to the XY plane, and rotates the Z-axis. The table is rotatable in the direction of the angle θ axis, which is the center. At the workpiece machining position P2 of the workpiece table 2, the workpiece table 2 on which the workpiece 30 is placed is lifted to move the workpiece 30 as a workpiece from below with a predetermined force. It is possible to cut into a plurality of strips (layers) at a desired pitch interval by pressing against the wire row WL to which abrasive grains that are linearly or reciprocally moved are adhered.

  As described above, when the work rollers 21 and 22 and the wires W and the wire rows WL formed by them have a wire pitch adjustment function, the cutting dimensions required for the work 30 change slightly for each work 30. Also, it becomes possible to maintain the machining accuracy.

  As shown in FIG. 6, the two work rollers 21 and 22 can be inclined in a parallel link shape in the horizontal plane, and the work rollers 21 and 22 are kept in a parallel arrangement in the horizontal plane, so that the wire rows WL run in the running direction. The wire pitch is maximum when set to be perpendicular to the workpiece (inclination angle α = 0 ° of the work roller), and the machining pitch dimension of the work 30 to be cut under this condition is also maximum (in FIG. 6, 2 dot chain line position). Further, when the central axis of the work rollers 21 and 22 is tilted by a tilt angle α (α> 0) in the horizontal direction in the horizontal plane by the roller swing mechanism 25 of FIG. 5 (the central axis of the work rollers is the wire row WL). When it is non-perpendicular to the traveling direction), the planar wire array changes from a two-dot chain line with an inclination angle α of 0 °, as shown by a solid line (the wire interval is narrowed, that is, the wire pitch is reduced). The machining pitch dimension of the workpiece 30 cut by the wire row under such a condition of the inclination angle α is cos α times that when the inclination angle is zero.

  The work table 2 is separated from the work processing position P2 that is directly below the pair of work rollers 21 and 22 (directly below the wire row WL), and the work set position P1 that is at a position that is off from directly below the pair of work rollers 21 and 22. Have The workpiece table 2 on which the workpiece 30 is placed at the workpiece setting position P1 can be moved to the workpiece machining position P2 immediately below the wire row WL by moving in the X-axis direction, and the workpiece transfer operation is possible. A workpiece transfer operation in the reverse direction is also performed to return the finished workpiece 30 from the workpiece machining position P2 to the workpiece set position P1. The movement of the work table 2 in the X-axis direction is relatively larger than the Y-axis direction, the Z-axis direction, and the angular displacement θ-axis direction.

The biggest difference from the conventional wire saw is that the work set position P1 is located far from the work processing position P2 (directly below the wire row WL). By having the work set position P1 at this position,
(1) When the workpiece 30 is replaced, the work rollers 21 and 22 and the wire row WL do not get in the way and workability can be improved.
(2) Since the loader 4 for automatically supplying and discharging the work 30 can be attached, the lead time can be shortened.
(3) Since the workpiece 30 can be imaged by the imaging device 3, the cutting position can be closed by image processing, and a more precise cutting position can be obtained.
There is an effect.

  As shown in FIGS. 3 and 5, the imaging device 3 can be used from a workpiece processing position P <b> 2 (directly below the wire row WL) in order to cope with high throughput and to prevent contamination by loose abrasive grains and cutting chips during processing. Installed at a distant workset position P1. In the present embodiment, four imaging devices 3 are prepared so that the four corners of the work 30 can be imaged, and are attached to the imaging device mounting bracket 7 in FIGS. 3 and 4. With these configurations, it is possible to introduce image processing to the machining correction of the workpiece 30, and it is possible to increase the accuracy of the machining dimensions without directly imaging the reference wire row WL.

  As shown in FIGS. 3 and 5, a loader 4 that automatically supplies and discharges the workpiece 30 at the workpiece setting position P1 is installed. The loader 4 is attached to the single-axis unit 45 that moves in the Y-axis direction and the single-axis unit 45. And a chuck 46. The chuck 46 has a vacuum suction function and grips and conveys the work 30 (substrate or the like). A single-axis unit that is movable in the Z-axis direction is added to the chuck 46. It has a function of conveying the workpiece 30 at the supply workpiece position to the workpiece setting position P1, and a function of conveying the workpiece 30 that has been processed and returned from the workpiece machining position P2 to the workpiece setting position P1 to the discharge workpiece position. It should be noted that the loader is a known one, and various other forms can be considered.

  By attaching such a loader 4 to the work set position P1, supply and discharge of the work 30 can be automated, which can cope with labor saving and lead time reduction.

  Now, at the workpiece machining position P2, when the workpiece 30 is machined (cut or grooved) by the wire row WL, the drive mechanism portion of the workpiece table 2 is covered in order to use slurry containing abrasive grains or grinding water. A drip-proof mechanism is provided. The drive mechanism and drip-proof mechanism of the work table 2 will be described with reference to FIGS.

  As shown in FIG. 2, a linear guide 51 is fixed to the front surface of the body frame 10 of the wire saw body 1, and the X table 50 is attached to the body frame 10 through the linear guide 51 so as to be slidable in the X-axis direction. The drive of the X table 50 is supported in the X-axis direction by a bearing on the main body frame 10 side, and is engaged via a ball screw 52 that is rotated by an X-axis drive motor (not shown) and a ball (steel ball). This is performed by the ball nut 53 to be engaged (screwed). Since the ball nut 53 is fixed to the X table 50, the ball nut 53 and the X table 50 move linearly in the X-axis direction as the ball screw 52 rotates.

  A linear guide 61 is fixed to the X table 50 in the Z-axis direction, and the Z table 60 is attached to the X table 50 via the linear guide 61 so as to be slidable in the Z-axis direction. The Z table 60 is driven by a bearing 64 fixed to the X table 50 side in the Z-axis direction, and is rotated by a Z-axis drive motor 65. A ball nut 63 is engaged with the ball screw 62 via a ball. Is done by. Since the ball nut 63 is fixed to the Z table 60, the ball nut 63 and the Z table 60 move linearly in the Z-axis direction as the ball screw 62 rotates.

  On the Z table 60, a linear guide (not shown) is fixed in the Y-axis direction, and the Y table 70 is attached to the Z table 60 through the linear guide so as to be slidable in the Y-axis direction. The Y table 70 is driven by a bearing 74 fixed on the Z table 60 side in the Y-axis direction, and is rotated by a Y-axis drive motor 75, and a ball nut 73 engaged with the ball screw 72 via a ball. Is done by. Since the ball nut 73 is fixed to the Y table 70, the ball nut 73 and the Y table 70 linearly move in the Y-axis direction as the ball screw 72 rotates.

  As shown also in FIG. 1, on the Y table 70, a θ table 80 that generates a rotational angular displacement in the θ-axis direction around the Z-axis as a rotation center {driving by a θ-axis drive motor (direct drive motor)} And a cylindrical neck portion 85 is fixed on the θ table 80. A work table 2 on which the work 30 is placed and fixed is fixed on the cylindrical neck portion 85. The work table 2 has a structure in which a large number of air suction holes 87 opened on the upper surface (work placement surface) are formed so that the work 30 can be vacuum-sucked. The air suction hole 87 is connected to a vacuum suction source (not shown).

  With the above driving mechanism, the neck portion 85 and the work table 2 that moves integrally therewith are movable in the X-axis, Y-axis, and Z-axis directions and rotatable in the θ-axis direction.

  As described above, when the workpiece 30 is processed with the wire row WL wound in a multifilament between the pair of workpiece rollers 21 and 22, a slurry or grinding fluid containing abrasive grains is used. It is necessary to prevent slurry or abrasive fluid containing abrasive grains from dripping. In particular, since the X-axis direction includes the movement between the workpiece setting position P1 and the workpiece machining position P2, the drip-proof structure of the drive mechanism with respect to the X-axis is long because the movement distance is long.

  As shown in FIG. 2, the case 90 is fixed to the front surface of the main body frame 10 so as to cover the lower side of the neck portion 85 immediately below the work table 2. However, the upper surface portion 91 of the case 90 is provided with a notch 92 that is long in the X-axis direction so that the neck portion 85 can be moved so that the work table 2 can move between the work setting position P1 and the work processing position P2. Similarly, the bottom portion 93 of the case 90 is also provided with a notch 94. Further, the bottom surface portion 93 of the case 90 projects from the main body frame 10 in a bowl shape so as to cover the linear guide 51 that guides the X table 50.

  As shown in FIGS. 1 and 2, a table cover 95 made in a box shape that is slightly larger than the work table 2 is disposed below the work table 2 (inside the case 90). A neck portion 85 passes through the table cover 95, and a slide ring 96 provided with a lip seal 100 inside is fixed to the table cover 95 in order to seal a gap between the table cover 95 and the neck portion 85. ing. In order to prevent the slide ring 96 and the lip seal 100 from rotating or moving up and down with the neck portion 85, a detent pin 98 erected on a fixed plate 97 fixed to the X table 50 is a long groove in the lower ring portion 96 a of the slide ring 96. 96b is engaged. The long groove 96b is formed in the radial direction of the lower ring portion 96a, and has a length that allows the table cover 95 that moves together with the neck portion 85 and the slide ring 96 to move in the Y axis direction in the XY axis direction (table cover 95). Is attached to the X table 50 movably only in the Y-axis direction. This is because the fixing plate 97 and the rotation prevention pin 98 are members fixed to the X table 50. The fixing plate 97 has a notch that avoids the neck portion 85.

  The lip seal 100 allows the gap between the neck portion 85 and the table cover 95 to be drip-proof sealed while allowing the neck portion 85 to move in the Z-axis direction and rotate in the θ-axis direction.

  The table cover 95 having the lip seal 100 achieves drip-proofing on the lower side of the work table 2, but as described above, the case 90 has the X axis in order to move the neck portion 85 in the X axis direction for a long distance. Since the long cutouts 92 and 94 are provided in the direction, it is necessary to prevent the slurry containing the abrasive grains and the grinding fluid from passing through the cutouts 92 and 94 from dropping. For this reason, bellows-shaped drip-proof covers 110 are arranged on the left and right of the table cover 95, and one end of each bellows-shaped drip-proof cover 110 is connected to the side surface 95a of the table cover 95 in the X-axis direction with a waterproof structure. ing. As shown in FIG. 5, the other end of each bellows-shaped drip-proof cover 110 may be connected and fixed to the left and right inner end surfaces of the case 90 in which the table cover 95 moves so that it can expand and contract in the X-axis direction. However, since the bellows-shaped drip-proof cover 110 only needs to be able to cover the range in which the slurry or abrasive fluid containing abrasive grains may drop from the notches 92, 94, the range in which the bellows-shaped drip-proof cover 110 is provided. Can be increased or decreased as appropriate.

  Here, comparing the X-axis operation range with the Y-axis operation range, the X-axis is used for transporting the work table 2 and the Y-axis is used for correction. The amount of movement in the Y-axis direction is extremely small compared to the amount of movement. Therefore, although the bellows-shaped drip-proof cover 110 is assembled in the X-axis direction, the bellows-shaped drip-proof cover 110 is flexible enough to absorb the operation of the orthogonal Y-axis and has a drip-proof function for the Y-axis operation. However, the amount of movement of the bellows-shaped drip-proof cover 110 in the direction of flexibility is an amount that does not exceed the flexibility limit of the bellows-shaped drip-proof cover 110.

  With the above configuration, it is possible to have a drip-proof function for all the XYZθ axes that have been considered difficult in the past.

  Next, the overall operation of the present embodiment will be described with reference to a flow of a correction method for cutting a plate-like workpiece (substrate or the like) in FIG. 7 as an example. The correction targets are the Y axis, the angular displacement θ axis about the Z axis as the rotation center, and the wire pitch of the wire row WL.

  In step # 1 of FIG. 7, the plate-like dummy work 30DA is placed and fixed on the work table 2 located at the work setting position P1. In step # 2, the work table 2 is driven in the X-axis direction by moving the X table 50 of the work table driving mechanism in FIG. 2, and the work table 2 is moved to the work machining position P2. In step # 3, the dummy workpiece 30DA is cut with the Y axis (Y table 70), the θ axis (θ table 80) of the work table 2 and the wire pitch as the origin as a reference for correction (the origin state of the wire pitch). Is the angle α = 0 in FIG. 6). In step # 4, cutting of the dummy workpiece 30DA is stopped halfway, and the workpiece table 2 on which the dummy workpiece 30DA is placed and fixed by the X table 50 is moved to the workpiece setting position P1. In Step # 5, at least one of the four imaging devices 3 corresponding to the processing marks on the dummy workpiece 30DA is imaged in a state where the dummy workpiece 30DA is not divided. In step # 6, information on the machining trace of the dummy workpiece 30DA is stored as a Y value, a θ value, and a wire pitch value, and the state of the wire row WL in each axis origin state (that is, the position, angle, wire of the wire row WL) (Pitch) is saved as a reference state. The wire position storing step is performed by these steps # 1 to # 6.

  Next, in step # 7, the plate-like workpiece 30 is placed and fixed on the workpiece table 2 located at the workpiece setting position P1. In step # 8, the machining mark of the workpiece 30 is imaged by the imaging device 3, and the imaging result of the imaging device 3 is image-processed by the computing means to determine the planned machining dimension (even if the computing means is incorporated in the imaging device 3). It may be configured with an external computer.) A virtual cutting line is determined from the planned machining dimensions, and the Y value, θ value, and wire pitch value of the workpiece 30 are corrected so that the virtual cutting line and the previously determined reference state of the wire row WL become the most approximate state. The Y value and the θ value are corrected by the Y table 70 and the θ table 80 of the work table driving mechanism, and the wire pitch value is the inclination angle α in the horizontal direction with the central axes of the work rollers 21 and 22 in the horizontal plane as shown in FIG. This is done by inclining by (α> 0). Thereafter, in step # 9, the work table 2 is driven in the X-axis direction by the work conveyance axis, and the work table 2 on which the work 30 is placed is moved to the work machining position P2. In step # 10, the workpiece 30 at the workpiece machining position P2 is machined with the wire row WL by setting the Y value, θ value, and wire pitch value corrected in step # 8. After the processing of the workpiece 30 is completed, the processed workpiece 30 is moved to the workpiece setting position P1 by the workpiece conveyance axis of the workpiece table 2 in step # 11. In step # 12, the processed workpiece 30 is discharged from the workpiece setting position P1. A wire cutting step is performed by these steps # 7 to # 12.

  In addition, when cutting the plate-like workpiece 30 in a grid shape, the wire cutting step may be performed by rotating the workpiece 30 by 90 ° and changing the wire pitch as necessary.

  Next, when a ceramic green sheet is cut as a specific example of the plate-like workpiece using FIG. 8, that is, a thick film ceramic green sheet patterned with an electrode is laminated and pressure-bonded to a predetermined chip component size (eg, 3216, A description will be given by taking as an example a process of cutting out to 1608, 1005, 0402, etc., each having a long side and a short side of 10-1 mm.

  In this case, as shown in FIG. 8, processing marks (position reference marks) 43 for image processing are attached to, for example, four corners on a rectangular ceramic green sheet 41 as a plate-like workpiece, and these are picked up by four imaging devices 3. Take an image.

  First, an image of machining traces machined in the origin state of each axis on a dummy workpiece is detected, and by detecting the position, the position to be machined first with the wire (matching the machining start point on the green sheet 41), the wire The wire pitch of the row WL (above the Y-axis direction) and the wire row angle (θ-axis direction) are detected and stored.

  Next, the processing mark 43 attached to the ceramic green sheet 41 as a workpiece is imaged, and the position to be processed on the green sheet 41 (the processing start point on the green sheet 41) is determined by detecting the position. . Then, the distance between the plurality of processing marks 43 is detected by image processing, the processing pitch is corrected, and the planned processing dimensions are determined. These image processes are performed by a calculation unit incorporated in the imaging apparatus 3 or configured by an external computer.

  Subsequently, the chip component group 42 formed on the ceramic green sheet 41 is cut out by calculating a difference between a planned processing dimension with reference to processing marks 43 provided at the four corners of the green sheet 41 and the wire pitch of the wire row WL. (Wire pitch correction amount) is calculated, the Y axis and θ axis are corrected, and the two work rollers 21 and 22 in FIG. 6 are tilted to a predetermined angle α in the right or left direction in the horizontal plane. The wire pitch of the wire wire WL in plan view is made to match (or approximate as much as possible) the above-mentioned planned processing dimension. A multi-type wire saw having a wire pitch corrected to the machining pitch is first cut along the horizontal cutting line HCL.

  In this case, the correction of the cutting position and the processing pitch is performed based on the position of the processing mark 43 and the distance between the processing marks, and the processing pitch is calculated by apportioning the dimensional error of the green sheet 41 and cutting is performed at an equal pitch. To do.

  When the ceramic green sheet is cut into chip parts, the vertical and horizontal dimensions of the chip parts are different as described above (1.0 × 0.5 mm, etc.). In this case, two countermeasures are prepared, the cutting along the horizontal cutting line HCL in FIG. 8 is performed by the first apparatus, and the cutting along the vertical cutting line VCL is performed by the second apparatus. You can do each.

  In addition to using two devices, there are the following measures.

(1) A wire is wound around two predetermined areas (pitch) of a work roller at two desired dimensions (pitch), and the work (ceramic green sheet) is moved in the axial direction of the work roller to cut in each dimension area. . That is, the horizontal direction cutting line HCL in FIG. 8 performs the cutting process in the region of the first pitch wire row corresponding thereto, and the vertical direction cutting line VCL is the region of the second pitch wire row corresponding thereto. Execute the disconnection process with. In this case, a rotation function (θ table) of 90 ° or more is added to the work table.

(2) Two work roller units having different wire pitches in the wire array are arranged, and the work is conveyed between the units to obtain a desired cutting dimension.

  Note that the abrasive grains of the wire saw are not loose abrasive grains when the substrate is targeted, and fixed abrasive grains are preferred because they generate less contaminants.

  According to this embodiment, the following effects can be obtained.

(1) The drive mechanism portion of the work table 2 that is movable in the X-axis, Y-axis, and Z-axis directions and is driven to rotate in the θ-axis direction does not hinder the movement of the work table 2 in all directions. It is possible to prevent drip.

(2) Specifically speaking, the drip-proof mechanism of the work table 2 for that purpose is provided with a neck portion 85 to which the work table 2 for mounting the work 30 is fixed and a drip-proof between the table cover 95 and the neck portion 85. The lip seal 100 is used so as to allow movement in the Zθ-axis direction. As a result, cutting water or the like used for machining can be prevented from entering from a gap between the neck portion 85 that moves up and down and the table cover 95, and the cutting water or the like is applied to the drive mechanism portion covered with the table cover 95. Can be prevented.

(3) The drive mechanism portion that cannot be covered by the table cover 95 (particularly in the X-axis direction with a long moving distance) is fixed to both side surfaces of the table cover 95, and the X of the table cover 95 accompanying the movement of the neck portion 85 It can be covered with a bellows-shaped drip-proof cover 110 that allows movement in the axial and Y-axis directions. Thereby, it is possible to prevent the cutting water or the like from being applied to the drive mechanism portion covered with the bellows-shaped drip-proof cover 110.

(4) Since the work table 2 is movable in the XYZθ directions as described above and has a drip-proof mechanism, and the work table 2 has a work machining position P2 and a work set position P1, the work set position P1. In FIG. 2, image processing by the imaging device 3 can be performed on a plate-shaped workpiece having a dimensional error such as a ceramic green sheet, and processing (cutting or the like) position correction calculation can be performed. Further, at the workpiece machining position P2, the workpiece position and workpiece angle using the image processing result using the imaging device 3 are further used by additionally using the operation of inclining the pair of workpiece rollers 21 and 22 in a parallel link shape in the horizontal plane. By adjusting the wire pitch, a highly accurate machining position correction is possible, and a pitch-variable wire saw capable of simultaneously cutting or grooving a plurality of locations can be realized. As a result, effects such as reduction of lead time, improvement of cutting accuracy, and improvement of workability can be obtained.

  In the above embodiment, the pair of work rollers 21 and 22 swings in a horizontal plane (changes the angle α), and on the other hand, it is assumed that the work placement surface of the work table 2 is a horizontal plane. However, the pair of work rollers 21 and 22 may swing in a substantially horizontal plane. In this case, the work placement surface of the work table 2 is set in a plane parallel to the rotation axis of the pair of work rollers 21 and 22. What is necessary is just to comprise.

  The number of imaging devices is not limited to four, and an arbitrary number of one or more may be installed according to the material and shape of the workpiece.

  In this embodiment, the work table of the wire saw is taken as an example, but the drip-proof mechanism of the work table according to the present invention is not limited to this, and can be applied to the work table of various processing machines such as a polishing processing machine. Is possible.

  Further, the direction definition of each axis is not limited to the present embodiment.

  Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims.

1 is a perspective view showing an embodiment of a drip-proof mechanism for a work table and a wire saw according to the present invention, and particularly a main part of the drip-proof mechanism. It is a sectional side view of the drip-proof mechanism of the work table. It is a front view which shows the schematic apparatus structure of the wire saw with a process position correction function provided with the drip-proof mechanism of the said work table. Similarly, it is a right side view. It is also a plan view. In the wire saw, the center axis of the work roller is inclined in the horizontal direction in a horizontal plane, (A) is a plan view, and (B) is a perspective view. It is a flowchart for demonstrating the process flow in the case of processing a plate-shaped workpiece in the said wire saw. It is a ceramic green sheet as a plate-shaped workpiece processed by the wire saw, and is a plan view showing an example with a processing mark (position reference mark).

Explanation of symbols

1 Wire saw body 2 Work table
DESCRIPTION OF SYMBOLS 3 Imaging device 4 Loader 5 Processing chamber 6 Operation panel 10 Main body frame 11 Wire supply reel 12 Wire take-up reel 21, 22 Work roller 25 Roller swing mechanism 30 Work 30DA Dummy work 41 Ceramic green sheet 42 Chip component group 43 Processing mark 50 X table 60 Z table 70 Y table 80 θ table 85 Neck portion 90 Case 95 Table cover 96 Slide ring 100 Lip seal 110 Bellows-shaped drip-proof cover W Wire WL Wire row HCL Horizontal processing line
VCL Longitudinal machining line α Inclination angle

Claims (5)

The X table is movable in the X axis direction, the Y table is movable in the Y axis direction perpendicular to the X axis direction, the Z table is movable in the Z axis direction perpendicular to the XY plane, and the Z table is rotated around the Z axis. A drip-proof mechanism for the work table that is rotatable in the θ-axis direction,
A work table is fixed, a neck portion that is movable in the X-axis, Y-axis, and Z-axis directions and rotatable in the θ-axis direction;
A table cover through which the neck portion penetrates;
A lip seal that seals the gap between the neck portion and the table cover in a drip-proof manner and allows the neck portion to move in the Z-axis direction and rotate in the θ-axis direction;
A work table comprising a bellows-shaped drip-proof cover fixed to both side surfaces of the table cover and allowing movement of the table cover in the X-axis and Y-axis directions along with the movement of the neck portion. Drip-proof mechanism.   The work table according to claim 1, wherein the bellows-shaped drip-proof cover is attached so as to be extendable in either the X axis or the Y axis, and has flexibility in a direction orthogonal to the extension / contraction direction on the XY plane. Drip-proof mechanism.   The drip-proof mechanism for a work table according to claim 2, wherein the amount of movement of the bellows-shaped drip-proof cover in the direction of flexibility is an amount that does not exceed the flexibility limit of the bellows-type drip-proof cover.   4. The drip-proof mechanism for a work table according to claim 1, wherein the table cover is attached so as to be movable only in the Y-axis or X-axis direction orthogonal to the X table or Y table.   A wire saw with a processing position correcting function, comprising the work table drip-proof mechanism according to claim 1, 2, 3 or 4.

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