JP3999584B2 - Method for dividing ceramic chip capacitor sheet - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a dividing method for dividing a ceramic chip capacitor sheet into individual chip capacitors.
[0002]
[Prior art]
The ceramic chip capacitor sheet is constructed by alternately laminating a ceramic layer and an electrode layer having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice pattern, and laminating the ceramic layer on the uppermost layer. Has been. The structure of this ceramic chip capacitor sheet will be described with reference to FIGS. The ceramic chip capacitor sheet 2 shown in FIGS. 5 and 6 is formed on the surface of a rectangular carrier substrate 3 made of a glass plate with a tape 4 serving as a separation layer. That is, a raw ceramic is applied on the tape 4 adhered to the surface of the carrier substrate 3 to form a raw ceramic layer 21 having a thickness of about 5 μm, and an electrode metal such as barium is screened on the surface of the raw ceramic layer 21. The electrode layer 22 having a thickness of about 1 μm is formed by printing. The electrode layer 22 includes an electrode region 221 having a plurality of electrodes 221a partitioned in a lattice shape, and an alignment mark region 222 having an alignment mark 222a that surrounds the electrode region 221 and indicates the position of the electrode 221a. Yes. The raw ceramic layers 21 and the electrode layers 22 formed in this way are alternately laminated by about 200 layers, and the raw ceramic layer 21 is formed as the uppermost layer.
[0003]
In the ceramic chip capacitor sheet 2 configured as described above, the ceramic layer 21 is formed on the uppermost layer, and the position of the electrode cannot be confirmed from the surface. Therefore, when dividing into individual chip capacitors, The position of the electrode 221a cannot be confirmed. Therefore, when forming the electrode layer 22, by forming a V groove in the alignment mark region 222 formed by surrounding the electrode region 221, using a cutting blade having a V-shaped outer periphery, The alignment mark 222a exposed on the wall surface of the V groove is recognized. When forming the V-groove using the cutting blade, alignment marks 222b and 222b for the alignment mark area are formed on the surfaces of both ends of the alignment mark area 222, and the two alignment marks 222b and 222b are formed. Is detected, and a straight line connecting the two is cut.
[0004]
The ceramic chip capacitor sheet 2 described above is divided into individual chip capacitors through the following steps.
(1) The alignment mark region 222 provided on the ceramic chip capacitor sheet 2 is cut using a cutting blade having a V-shaped outer periphery to form a V groove having a width of 1 to 2 mm. Alignment mark exposing process to be exposed.
(2) An alignment step in which the alignment mark 222a exposed in the alignment mark exposing step is picked up and detected by the image pickup means, and the cutting region is set while relatively indexing and feeding the image pickup means and the ceramic chip capacitor sheet 2. .
(3) In the cutting area set by the alignment step, a single cutting blade or a multi-cutting blade in which a plurality of blades are assembled at intervals of individual chip capacitors is positioned, and the cutting blade and the ceramic chip capacitor sheet 2 are Dividing process that divides into individual chip capacitors by relatively cutting and feeding.
After execution of the dividing step described above, the tape 4 serving as a separation layer provided on the surface of the carrier substrate 3 is dissolved to separate the divided chip capacitors from the carrier substrate.
[0005]
[Problems to be solved by the invention]
Thus, the ceramic chip capacitor sheet 2 formed on the carrier substrate 3 has a V groove formed by the alignment mark exposing step and a region to be cut due to distortion caused by laminating the raw ceramic layers. May not be exactly right angles. That is, as shown in FIG. 7, the V groove 222c formed on the straight line connecting the alignment marks 222b and 222b for the alignment mark area provided in the alignment mark area 222 of the ceramic chip capacitor sheet 2 is perpendicular to the area to be cut. In some cases, an angle shift of about 5 degrees at most with respect to the indexing feed direction Y may occur. For this reason, when the image pickup means is indexed and fed in accordance with the interval of the region to be cut in the alignment step, the alignment mark 222a displayed in the V groove 222c at the image pickup position n1 as shown in FIG. Is positioned at the center of the imaging range SA of the imaging means, but as the imaging position is indexed and sent to n2 and n3, the alignment mark 222a shifts from the center of the imaging range SA of the imaging means, and the imaging position is n4 There is a problem in that the alignment mark 222a is not deviated from the imaging range SA and the alignment mark 222a exposed in the V-groove 222c is lost.
[0006]
The present invention has been made in view of the above-mentioned fact, and the main technical problem thereof is that the alignment mark is lost when imaging the alignment mark that is formed by forming a V groove in the alignment mark region of the ceramic chip capacitor sheet. An object of the present invention is to provide a method for dividing a ceramic chip capacitor sheet that can be detected without any problems.
[0007]
[Means for Solving the Problems]
In order to solve the above main technical problem, according to the present invention, a ceramic layer, an electrode region having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice shape, Electrode layers having alignment mark regions having alignment marks indicating the positions of the electrodes are alternately laminated, and ceramic chip capacitor sheets formed by laminating ceramic layers on the uppermost layer are individually divided in a lattice pattern. A dividing method for dividing into chip capacitors,
An alignment mark exposing step of forming a V-groove in the alignment mark region and exposing the alignment mark;
Alignment step of picking up an image of the alignment mark by the image pickup means and detecting a divided region while relatively indexing and feeding the image pickup means for picking up the alignment mark expressed by the alignment mark display step and the ceramic chip capacitor sheet When,
A division step of positioning a division tool in the division region detected by the alignment step, and dividing and dividing the division tool and the ceramic chip capacitor sheet into individual chip capacitors;
In the alignment step, the imaging unit and the ceramic chip capacitor sheet are relatively indexed and fed to image the alignment mark so that the alignment mark is positioned at a predetermined position in the imaging range of the imaging unit. Moving the means and the ceramic chip capacitor sheet in the cutting feed direction relatively,
A method of dividing a ceramic chip capacitor sheet is provided.
[0008]
It is desirable that the predetermined position of the imaging range where the alignment mark is positioned in the alignment step is set at the center position of the imaging range.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of a method for dividing a ceramic chip capacitor sheet according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 shows a cutting device as a dicing device for carrying out a method for dividing a ceramic chip capacitor sheet according to the present invention.
The cutting device 100 in the illustrated embodiment includes a device housing 120 having a substantially rectangular parallelepiped shape. In the apparatus housing 120, a chuck table 130 that holds a workpiece is disposed so as to be movable in a cutting feed direction indicated by an arrow X that is a cutting feed direction. The chuck table 130 includes a suction chuck support base 131, a rectangular suction chuck 132 mounted on the suction chuck support base 131, and three positioning pins disposed along two sides of the suction chuck 132. 133, and the ceramic chip capacitor sheet 2 formed on the carrier substrate 3 shown in FIG. 1 as a workpiece is placed on the placement surface which is the surface of the suction chuck 132. At this time, positioning is performed by bringing the two sides of the carrier substrate 3 into contact with the three positioning pins 133. When the ceramic chip capacitor sheet 2 is positioned at a predetermined position on the suction chuck 132 of the chuck table 130, it is held by a suction means (not shown). Further, the chuck table 130 is configured to be rotatable by a rotation mechanism (not shown).
[0010]
The cutting apparatus 100 in the illustrated embodiment includes two spindle units 140 and 150 as cutting means. The spindle units 140 and 150 are mounted on a moving base (not shown) and are adjusted to move in an indexing feed direction indicated by an arrow Y and a cutting feed direction indicated by an arrow Z, and the spindle housings 141 and 151 rotate. Rotating spindles 142 and 152 that are freely supported and rotated by a rotation driving mechanism (not shown), and cutting blades 143 and 153 mounted on the rotating spindles 142 and 152 are provided. One of the cutting blades 143 has a V-groove forming cutting edge, and the other cutting blade 153 has a cutting edge as a split tool.
[0011]
The cutting apparatus 100 in the illustrated embodiment images the alignment mark region 222 of the ceramic chip capacitor sheet 2 that is a workpiece held on the surface of the suction chuck 132 constituting the chuck table 130, or the cutting blade An imaging unit 160 for detecting a region to be cut by 143 and 153 is provided. The image pickup means 160 is composed of optical means such as a microscope and a CCD camera, and sends the picked up image signal to a control means described later. In addition, the cutting apparatus 100 includes a display unit 170 that displays an image captured by the imaging unit 160.
[0012]
The cutting apparatus 100 in the illustrated embodiment includes a cassette 181 that stocks the ceramic chip capacitor sheet 2 that is a workpiece, and a workpiece that carries the workpiece contained in the cassette 181 to the workpiece placement region 182. A workpiece unloading means 183, a workpiece conveying means 184 for conveying the workpiece unloaded by the workpiece unloading means 183 onto the chuck table 130, and a workpiece cut by the chuck table 130. A cleaning unit 185 for cleaning and spin-drying and a cleaning / conveying unit 186 for transporting the workpiece cut by the chuck table 130 to the cleaning unit 185 are provided. Further, the cutting apparatus 100 controls the chuck table 130, spindle units 140 and 150, the raising / lowering means of the cassette 181, the workpiece unloading means 183, the workpiece conveying means 184, the cleaning means 185, the cleaning conveying means 186, and the like. Control means 188 is provided. The control means 188 includes a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores a control program, and a readable / writable random access memory (RAM) that stores arithmetic results. It has. The control unit 188 detects an area to be cut by the cutting blades 143 and 153 based on the image signal (alignment mark) imaged by the imaging unit 160, and the detected alignment information is random access memory (RAM). Temporarily store in. The control unit 188 outputs a control signal to the spindle units 140 and 150 based on the alignment information stored in the random access memory (RAM).
[0013]
Next, the division processing of the ceramic chip capacitor sheet 2 by the cutting device 100 described above will be described.
First, the ceramic chip capacitor sheet 2 (provided on the carrier substrate 3) is accommodated in the cassette 181. The ceramic chip capacitor sheet 2 accommodated in a predetermined position of the cassette 181 is moved up and down by an elevating means (not shown) to be positioned at the carry-out position. Next, the workpiece unloading means 183 moves forward and backward to unload the ceramic chip capacitor sheet 2 positioned at the unloading position to the workpiece placement region 182. The ceramic chip capacitor sheet 2 carried out to the workpiece placement region 182 is conveyed to the placement surface of the suction chuck 132 constituting the chuck table 130 by the turning operation of the workpiece conveyance means 184, and as described above. After being positioned by contacting the two sides of the carrier substrate 3 with the three positioning pins 133, the carrier substrate 3 is sucked and held by the suction chuck 132. The chuck table 130 that sucks and holds the ceramic chip capacitor sheet 2 in this way is moved to a position immediately below the image pickup means 160.
[0014]
If the chuck table 130 is positioned immediately below the image pickup means 160, the alignment marks 222b and 222b for the two alignment mark areas respectively formed on the alignment mark areas 222 of the ceramic chip capacitor sheet 2 by the image pickup means 160 are displayed. Each coordinate value is detected and temporarily stored in a random access memory (RAM) of the control means 188. Next, with respect to the alignment mark region 222, the chuck table 130 is rotated and adjusted so that the coordinate values of the alignment marks 222b and 222b for the two alignment mark regions coincide with the cutting feed direction indicated by the arrow X in FIG. Then, a precise alignment operation is performed between one cutting blade 143 having a V-groove forming cutting edge and a cutting region connecting the two alignment mark regions alignment marks 222b and 222b. Thereafter, while the cutting blade 143 is rotated in a predetermined direction, the chuck table 130 that sucks and holds the ceramic chip capacitor sheet 2 is moved in a cutting feed direction indicated by an arrow X (a direction orthogonal to the rotation axis of the cutting blade 143). As a result, a V-groove 222c having a width of 1 to 2 mm is formed in the alignment mark region 222 as shown in FIG. The V groove 222c is formed in four alignment mark regions 222 formed by bending the electrode region 221 as shown in FIG. 2, so that the alignment mark 222a appears in each V groove 222c. (Alignment mark expression process).
[0015]
Next, the chuck table 130 is positioned directly below the imaging unit 160. And the alignment process which sets a cutting area | region is performed based on the alignment mark 222a exposed to the V groove 222c by the alignment mark exposure process mentioned above. That is, the position where the preset first alignment mark 222a is formed immediately below the image pickup means 160 is positioned, and is picked up and confirmed by the image pickup means 160, and its coordinate value is determined by the random access memory (RAM) of the control means 188. ) Temporarily. When the coordinate value of the first alignment mark 222a is stored in the random access memory (RAM) in this way, the image pickup means 160 is made to correspond to a predetermined interval between the areas to be cut in FIG. In the direction indicated by, the next alignment mark 222a is imaged and its coordinate value is detected. Then, the coordinate value detection operation of the alignment mark 222a is executed for all the alignment marks 222a exposed in the V groove 222c. At this time, if the V-groove 222c is not exactly perpendicular to the cutting feed direction, the V-groove 222c may be out of the imaging range of the imaging means 160 as described above, and the alignment mark 222a may be lost. . In order to solve such a problem, the following measures are taken in the alignment process in the present invention.
[0016]
The alignment control by this invention in an alignment process is demonstrated with reference to the flowchart shown in FIG.
The control unit 188 checks whether or not the alignment mark 222a displayed in the V groove 222c imaged by the imaging unit 160 in step S1 exists in the imaging range. If the alignment mark 222a does not exist in the imaging range in step S1, the control unit 188 determines that the alignment error has occurred, proceeds to step S2, outputs an alignment error signal to the display unit 170, and displays the alignment error on the display unit 170. Inform the operator. When the alignment mark 222a is present in the imaging range in step S1, the control unit 188 proceeds to step S3 and checks whether the alignment mark 222a is located at the center of the imaging range. In step S3, if the alignment mark 222a is positioned at the center of the imaging range SA as shown in FIG. 4A, the control unit 188 proceeds to step S4 to recognize the entire alignment mark 222a and determine its center of gravity ( G) is detected, and the coordinate value of the detected center of gravity (G) is temporarily stored in a random access memory (RAM) as a cutting area.
[0017]
If the alignment mark 222a is not located at the center of the imaging range SA as shown in FIG. 4B in step S3, the control unit 188 proceeds to step S5 and positions the alignment mark 222a at the center of the imaging range SA. Perform central positioning control. Specifically, the chuck table 130 is moved in the cutting feed direction indicated by the arrow X in FIG. That is, as shown in FIG. 4B, the alignment mark 222a is shifted in the left-right direction of the imaging range SA because the V-groove 222c is not formed at right angles to the cutting feed direction. Therefore, the alignment mark 222a can be positioned at the center of the imaging range SA by moving and adjusting the chuck table 130 holding the ceramic chip capacitor sheet 2 in the cutting feed direction indicated by the arrow X in FIG. In this way, when the center positioning control of the alignment mark 222a is executed, the control unit 188 proceeds to step S3 and checks whether the alignment mark 222a is positioned at the center of the imaging range. If the alignment mark 222a is not positioned at the center of the imaging range SA in step S3, the control unit 188 proceeds to step S5 and repeatedly executes steps S3 and S5. In step S3, if the alignment mark 222a is positioned at the center of the imaging range SA as shown in FIG. 4A, the control unit 188 proceeds to step S4 and detects the center of gravity (G) of the alignment mark 222a. Then, the detected coordinate value of the center of gravity (G) is temporarily stored in a random access memory (RAM) as a cutting area.
[0018]
The above-described alignment control shown in FIG. 3 is executed for all alignment marks 222a exposed in the V groove 222c. The ceramic chip shown in FIG. 2 is obtained by executing the above alignment control on the V grooves 222c formed in the four alignment mark regions 222 provided so as to bend and surround the electrode region 221 in the ceramic chip capacitor sheet 2. Alignment information regarding the X-axis street (cutting region) and the Y-axis street (cutting region) in the capacitor sheet 2 can be obtained.
[0019]
As described above, according to the alignment control of the present invention, each time the alignment mark 222a is detected, the chuck table 130 holding the ceramic chip capacitor sheet 2 is cut and fed so that the alignment mark 222a is positioned at the center of the imaging range SA. Since the movement is adjusted in the direction, when the imaging unit 160 is indexed and fed to image the next alignment mark 222a, the alignment mark 222a is not out of the imaging range SA and is not lost.
[0020]
When the alignment information related to the cutting area is obtained by the alignment control described above, the chuck table 130 is rotated to first position the X-axis street in the cutting feed direction indicated by the arrow X in FIG. Then, the other spindle unit 150 is moved in the direction of the arrow Y, which is the indexing direction, and a precise alignment operation between the cutting blade 153 and the center of gravity (G) position coordinate of the alignment mark 222a stored by the alignment control is performed. At this time, the chuck table 130 is positioned so that the straight line connecting the center of gravity (G) position coordinates of the two alignment marks 222a exposed in the V groove 222c facing each other is parallel to the cutting blade 153 at a predetermined interval. The rotation is adjusted. Thereafter, while rotating the cutting blade 153 in a predetermined direction, the chuck table 130 that sucks and holds the ceramic chip capacitor sheet 2 is moved in a direction indicated by an arrow X that is a cutting feed direction (a direction orthogonal to the rotation axis of the cutting blade 153). By moving, the ceramic chip capacitor sheet 2 held on the chuck table 130 is cut along the X-axis street (division step). That is, the cutting blade 153 is mounted on the spindle unit 150 that is moved and adjusted in the direction indicated by the arrow Y that is the indexing direction and the direction indicated by the arrow Z that is the cutting direction, and is rotationally driven. Is moved in the cutting feed direction along the lower side of the cutting blade 143, the ceramic chip capacitor sheet 2 held on the chuck table 130 is cut along a predetermined X-axis street by the cutting blade 153.
[0021]
When all of the X-axis streets are cut as described above, the chuck table 130 is rotated 90 degrees to position the Y-axis streets in the cutting feed direction indicated by the arrow X in FIG. Then, as described above, the other spindle unit 150 is moved in the direction of the arrow Y, which is the indexing direction, and the precise alignment operation between the cutting blade 153 and the center of gravity (G) position coordinate of the alignment mark 222a stored by the alignment control is performed. Is done. Thereafter, while the cutting blade 153 is rotated in a predetermined direction, the chuck table 130 holding the ceramic chip capacitor sheet 2 by suction is moved in the direction indicated by the arrow X which is the cutting feed direction, thereby being held on the chuck table 130. The ceramic chip capacitor sheet 2 is cut along the Y-axis street (division process).
[0022]
As described above, the ceramic chip capacitor sheet 2 is divided into individual chip capacitors by cutting along the X-axis street and the Y-axis street. The divided individual chip capacitors are not separated by the action of the tape 4, and the state of the ceramic chip capacitor sheet 2 supported by the carrier substrate 3 is maintained. After the division of the ceramic chip capacitor sheet 2 is completed in this way, the chuck table 130 holding the ceramic chip capacitor sheet 2 is first returned to the position where the ceramic chip capacitor sheet 2 is sucked and held. The suction holding of the sheet 2 is released. Next, the ceramic chip capacitor sheet 2 is transported to the cleaning means 185 by the cleaning transport means 186, where it is cleaned and dried. The ceramic chip capacitor sheet 2 cleaned in this way is carried out to the workpiece placement region 182 by the workpiece conveying means 184. Then, the ceramic chip capacitor sheet 2 is stored in a predetermined position of the cassette 181 by the workpiece unloading means 183.
[0023]
【The invention's effect】
According to the method for dividing a ceramic chip capacitor sheet according to the present invention, each time the alignment mark is imaged by relatively indexing and feeding the imaging means and the ceramic chip capacitor sheet in the alignment step, the alignment mark is a predetermined position in the imaging range by the imaging means. Since the image pickup means and the ceramic chip capacitor sheet are moved relative to each other in the cutting feed direction so as to be positioned at the position, the raw ceramic layer is laminated when the image pickup means is indexed and fed to image the next alignment mark. Even if the alignment mark region is not exactly perpendicular to the cutting feed direction due to distortion caused by the above, the alignment mark is not out of the imaging range and is not lost.
[Brief description of the drawings]
FIG. 1 is a perspective view of a dicing apparatus for performing a method for dividing a ceramic chip capacitor sheet according to the present invention.
FIG. 2 is a plan view of the ceramic chip capacitor sheet showing a state in which a V-groove is formed in the alignment mark region of the ceramic chip capacitor sheet in the alignment mark exposing step.
FIG. 3 is a flowchart showing alignment control in an alignment step of the method for dividing a ceramic chip capacitor sheet according to the present invention.
FIG. 4 is an enlarged view showing a state in which an alignment mark is imaged by an imaging means in an alignment step.
FIG. 5 is a perspective view showing a part of the ceramic chip capacitor sheet in a cutaway state.
6 is an AA cross-sectional enlarged view in FIG.
FIG. 7 is an explanatory view showing a state in which a V groove formed in an alignment mark region of a ceramic chip capacitor sheet is imaged in a conventional alignment process.
[Explanation of symbols]
2: Ceramic chip capacitor sheet 3: Carrier substrate 4: Tape 21: Raw ceramic layer 22: Electrode layer 221: Electrode region 221a: Electrode 222: Alignment mark region 222a: Alignment mark 222b: Alignment mark 222c for alignment mark region: V Groove 100: Dicing 120: Device housing 130: Chuck table 131: Suction chuck support 132: Suction chuck 133: Positioning pin 140: Spindle unit (for V-groove cutting)
143: V-groove forming cutting blade 150: Spindle unit (for cutting)
153: Cutting blade 160 for cutting: Imaging mechanism 170: Display means 181: Cassette 182: Workpiece placement area 183: Workpiece carry-out means 184: Workpiece conveyance means 185: Cleaning means 186: Cleaning conveyance means 188: Control means

Claims (2)

A ceramic layer, an electrode region having a plurality of electrodes formed on the surface of the ceramic layer and partitioned in a lattice shape, and an alignment mark region having an alignment mark that surrounds the electrode region and indicates the position of the electrode A method of dividing the ceramic chip capacitor sheet formed by alternately laminating the electrode layers and the ceramic layer on the uppermost layer into individual chip capacitors partitioned in a grid pattern,
An alignment mark exposing step of forming a V-groove in the alignment mark region and exposing the alignment mark;
Alignment step of picking up an image of the alignment mark by the image pickup means and detecting a divided region while relatively indexing and feeding the image pickup means for picking up the alignment mark expressed by the alignment mark display step and the ceramic chip capacitor sheet When,
A division step of positioning a division tool in the division region detected by the alignment step, and dividing and dividing the division tool and the ceramic chip capacitor sheet into individual chip capacitors;
In the alignment step, the imaging unit and the ceramic chip capacitor sheet are relatively indexed and fed to image the alignment mark so that the alignment mark is positioned at a predetermined position in the imaging range of the imaging unit. Moving the means and the ceramic chip capacitor sheet in the cutting feed direction relatively,
A method for dividing a ceramic chip capacitor sheet. The method for dividing a ceramic chip capacitor sheet according to claim 1, wherein a predetermined position of the imaging range where the alignment mark is positioned in the alignment step is set at a center position of the imaging range.

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